Substrate processing apparatus and substrate processing method

Abstract

The present application provides a substrate processing apparatus and a substrate processing method, the substrate processing apparatus comprising: a cooling chamber for accommodating a substrate; and a cooling unit disposed inside the cooling chamber, the cooling unit including: a support member; two first plates connected to the support member to support the substrate, and spaced apart from each other in a height direction of the support member; and a second plate provided to move up and down between the two first plates.

Description

[0001] CROSS-REFERENCE TO RELATED APPLICATIONS

[0002] This application claims the benefit of priority from Korean Patent Application No. 10-2023-0109757 filed on August 22, 2023 in the Korean Intellectual Property Office, the disclosure of which is incorporated herein by reference in its entirety. Technical Field

[0003] The present disclosure relates to a substrate processing apparatus and a substrate processing method. Background Art

[0004] In the semiconductor manufacturing process, the photolithography process is a process for forming a desired pattern on a wafer. The photolithography process mainly includes a photosensitive liquid applying process, an exposure process, and a developing process. In addition, before or after the exposure process, a substrate baking process for heat-treating the substrate is performed.

[0005] In the baking process, the substrate is mounted on a heating plate, the substrate is heat-treated by operating a heater provided in the heating plate, and then the substrate is cooled.

[0006] According to the prior art, in order to cool the heated substrate, the substrate is mounted on a cooling plate. Since the substrate is mounted on the cooling plate with only the lower surface of the substrate in contact with the cooling plate, there is a problem that the substrate cannot be quickly cooled, for example, because the upper surface of the substrate is affected by external heat. Summary of the invention

[0007] Aspects of the present disclosure may provide a substrate processing apparatus and a substrate processing method capable of rapidly cooling a substrate to enhance cooling performance, thereby improving a substrate processing throughput and a substrate processing rate of the substrate processing apparatus.

[0008] According to aspects of the present disclosure, a substrate processing device may include: a cooling chamber for accommodating a substrate; and a cooling unit disposed inside the cooling chamber, the cooling unit including: a support; two first plates connected to the support to support the substrate and spaced apart from each other in a height direction of the support; and a second plate configured to move up and down between the two first plates.

[0009] According to another aspect of the present invention, a substrate processing method may include: placing a substrate on a first plate that cools the substrate; moving a second plate downward toward the substrate; using the second plate to cool the substrate together with the first plate; and after completely cooling the substrate, moving the second plate upward.

[0010] According to another aspect of the present disclosure, a substrate processing device may include: a baking chamber, which heats a substrate for heat treatment; a cooling chamber, which is arranged on one side of the baking chamber and accommodates the substrate heat-treated in the baking chamber; and a cooling unit, which is arranged inside the cooling chamber, and the cooling unit includes: a support; two first plates, which are connected to the support to support the substrate and are spaced apart from each other in the height direction of the support; and a second plate, which can move up and down between the two first plates and is arranged parallel to the two first plates, wherein the second plate has a protrusion, which protrudes downward from the lower surface of the second plate by a protrusion distance longer than the thickness of the substrate and extends in the circumferential direction of the second plate.

[0011] According to an exemplary embodiment of the present disclosure, a cooling unit and a substrate processing apparatus including the cooling unit are capable of simultaneously cooling the upper and lower surfaces of a substrate using the first plate and the second plate pre-cooled by the first plate, thereby increasing the cooling rate compared to a case where only the first plate is used to cool the substrate, and thus improving the substrate processing throughput and substrate processing performance of the substrate processing apparatus. BRIEF DESCRIPTION OF THE DRAWINGS

[0012] The above and other aspects, features and advantages of the present disclosure will be more clearly understood through the following detailed description in conjunction with the accompanying drawings, in which:

[0013] Figure 1 is a diagram of a substrate processing apparatus according to an exemplary embodiment of the present disclosure when viewed from above;

[0014] Figure 2 When viewed from the AA direction Figure 1 A diagram of a substrate processing apparatus;

[0015] Figure 3 When viewed from the BB direction Figure 1 A diagram of a substrate processing apparatus;

[0016] Figure 4 is a side view showing a cooling unit according to an exemplary embodiment of the present disclosure;

[0017] Figure 5 It is shown Figure 4 A partial side view of a cooling unit;

[0018] Figure 6 The second plate is shown downwardly toward the support Figure 4 A side view of a state in which a substrate on a first plate of a cooling unit is moved;

[0019] Figure 7 is to show that the second plate has moved to Figure 4A side view of a state of a cooling position of a cooling unit adjacent to a substrate;

[0020] Figure 8 shows a substrate cooled by a second plate and a first plate according to an exemplary embodiment of the present disclosure;

[0021] Fig. 9 shows a substrate cooled by a second plate and a first plate according to an exemplary embodiment of the present disclosure;

[0022] Fig. 10A shows a protrusion according to an exemplary embodiment of the present disclosure, and Fig. 10B shows a protrusion according to an exemplary embodiment of the present disclosure;

[0023] Fig.11 shows a substrate cooled by a second plate and a first plate according to an exemplary embodiment of the present disclosure;

[0024] Fig.12 shows a substrate cooled by a second plate and a first plate according to an exemplary embodiment of the present disclosure;

[0025] Fig.13 shows a substrate cooled by a second plate and a first plate according to an exemplary embodiment of the present disclosure;

[0026] Fig.14 shows a substrate cooled by a second plate and a first plate according to an exemplary embodiment of the present disclosure; and

[0027] Fig.15 is a flowchart illustrating a process in which a cooling unit cools a substrate according to an exemplary embodiment of the present disclosure. DETAILED DESCRIPTION

[0028] Hereinafter, preferred exemplary embodiments will be described in detail with reference to the accompanying drawings so that a person of ordinary skill in the art to which the present disclosure belongs can easily implement the present disclosure. However, when describing the preferred exemplary embodiments of the present disclosure in detail, if it is considered that the gist of the present disclosure is unnecessarily obscured, the detailed description of the known functions or configurations will be omitted. In addition, components performing similar functions and actions will be represented by the same reference numerals in all the accompanying drawings. In addition, in this specification, the terms "on...", "upper", "top", "below", "lower", "bottom", etc. are based on the accompanying drawings, and the terms "inside", "outside", etc. are based on the periphery of the corresponding components, and can be changed according to the direction in which the elements or components are actually set.

[0029] Furthermore, throughout the specification, “comprising” a certain component means that another component may be further included, rather than excluding another component, unless specifically stated otherwise.

[0030] Figure 1 is a diagram of a substrate processing apparatus viewed from above, Figure 2 When viewed from the AA direction Figure 1 A diagram of a substrate processing apparatus, and Figure 3 When viewed from the BB direction Figure 1 FIG. 1 is a diagram of a substrate processing apparatus.

[0031] refer to Figures 1 to 3 , the substrate processing device 1 may include a loading port 100, an index module 200, a buffer module 300, an application and development module 400, and a purge module 700. The loading port 100, the index module 200, the buffer module 300, the application and development module 400, and the interface module 600 may be arranged in a row order in one direction. The purge module 700 may be disposed in the interface module 600. Alternatively, the purge module 700 may be disposed in any of a variety of positions, such as at a position where an exposure device is connected behind the interface module 600, or at a side of the interface module 600.

[0032] Hereinafter, the direction in which the loading port 100, the indexing module 200, the buffer module 300, the coating and developing module 400, and the interface module 600 are arranged will be referred to as the first direction Y, the direction perpendicular to the first direction Y when viewed from above will be referred to as the second direction X, and the direction perpendicular to each of the first direction Y and the second direction X will be referred to as the third direction Z.

[0033] The substrate W can be moved in a state of being stored in the cassette 20. The cassette 20 may have a structure sealed from the outside. As an example, a front opening unified pod (FOUP) having a door at the front may be used as the cassette 20.

[0034] Hereinafter, the load port 100 , the index module 200 , the buffer module 300 , the coating and developing module 400 , the interface module 600 , and the cleaning module 700 will be described in detail.

[0035] The load port 100 may have a mounting table 120 on which the cassette 20 containing the substrate W is disposed. A plurality of mounting tables 120 may be provided, and the mounting tables 120 are arranged in a row in the second direction X. Figure 1 2 and 3. In the example shown in FIG. 2 , four mounting tables are provided, but the number of mounting tables may be changed.

[0036] The index module 200 may transfer the substrate W between the cassette 20 disposed on the mounting table 120 of the load port 100 and the buffer module 300 . The index module 200 may include a frame 210 , an index robot 220 , and a guide rail 230 .

[0037] The frame 210 may be provided in a rectangular parallelepiped shape, the interior of which is generally hollow, and disposed between the load port 100 and the buffer module 300. The frame 210 of the index module 200 may be provided at a height lower than that of the frame 310 of the buffer module 300.

[0038] The indexing robot 220 and the guide rail 230 may be arranged in the frame 210. The indexing robot 220 may be arranged in such a manner that the manipulator 221 that directly processes the substrate W may move and rotate in the first direction Y, the second direction X, and the third direction Z. The indexing robot 220 may include a manipulator 221, an arm 222, a support 223, and a holder 224. The manipulator 221 may be mounted to be fixed to the arm 222. The arm 222 may be arranged in a stretchable structure or a rotatable structure. The support 223 may be arranged in a manner that its length direction is oriented in the third direction Z. The arm 222 may be coupled to the support 223 in a manner that it may move along the support 223. The support 223 may be fixedly connected to the holder 224. The guide rail 230 may be arranged in a manner that its length direction is oriented in the second direction X. The holder 224 may be coupled to the guide rail 230 in a manner that it may move linearly along the guide rail 230. In addition, although not shown, the frame 210 may further include a door opener to open and close the door of the box 20 .

[0039] The buffer module 300 may include a frame 310, a first buffer 320, a second buffer 330, and a cooling chamber 340. The frame 310 may be configured in a rectangular parallelepiped shape, the interior of which is generally empty, and is disposed between the indexing module 200 and the coating and developing module 400. The first buffer 320, the second buffer 330, and the cooling chamber 340 may be located within the frame 310. The cooling chamber 340, the second buffer 330, and the first buffer 320 may be sequentially arranged in a third direction Z from below. The first buffer 320 may be located at a height corresponding to the coating module 401 of the coating and developing module 400, and the second buffer 330 and the cooling chamber 340 may be disposed at a height corresponding to the developing module 402 of the coating and developing module 400.

[0040] Each of the first buffer 320 and the second buffer 330 may temporarily store a plurality of substrates W. The first buffer 320 may include a housing 321 and a plurality of supports 322. In the first buffer 320, the supports 322 may be disposed in the housing 321 and spaced apart from each other along the third direction Z. The second buffer 330 may include a housing 331 and a plurality of supports 332. In the second buffer 330, the supports 332 may be disposed in the housing 331 and spaced apart from each other along the third direction Z. One substrate W may be disposed on each support 322 of the first buffer 320 and each support 332 of the second buffer 330. The housing 331 may have an opening in a direction in which the indexing robot 220 is disposed so that the indexing robot 220 may load or unload a substrate W onto or from the support 332 in the housing 331.

[0041] The first buffer 320 has a substantially similar structure to the second buffer 330. However, the housing 321 of the first buffer 320 may have an opening in a direction in which the indexing robot 220 is disposed and in a direction in which the coater robot 421 located in the coating module 401 is disposed. The number of the supports 322 disposed in the first buffer 320 and the number of the supports 332 disposed in the second buffer 330 may be the same or different. According to one example, the number of the supports 332 disposed in the second buffer 330 may be greater than the number of the supports 322 disposed in the first buffer 320.

[0042] The cooling chamber 340 can cool each substrate W. The cooling chamber 340 may include a housing 341 and a cooling plate 342. The cooling plate 342 may include a cooling device 343 for cooling the upper surface on which the substrate W is disposed and the substrate W. As the cooling device 343, any of various cooling methods, such as a coolant or a thermoelectric element, may be used. In addition, the cooling chamber 340 may be provided with a lifting pin assembly for positioning the substrate W on the cooling plate 342. The housing 341 may have an opening in the direction in which the indexing robot 220 is disposed and in the direction in which the developing robot is disposed in the developing module 402, so that the indexing robot 220 and the developing robot can load the substrate W onto the cooling plate 342 or unload the substrate W from the cooling plate 342. In addition, the cooling chamber 340 may be provided with a door for opening and closing the above-mentioned opening.

[0043] Although in the above exemplary embodiment, the configuration of the cooling chamber 340 is included in the buffer module 300 , the present disclosure is not limited thereto, and the configuration of the cooling chamber 340 may be omitted if necessary.

[0044] The coating module 401 may perform a process of applying a photosensitive liquid such as a photoresist onto the substrate W, and a heat treatment process before and after the resist coating process, such as heating and cooling the substrate W. The coating module 401 may include a coating chamber 410, a heat treatment chamber component 500, and a transfer chamber 420. The coating chamber 410, the transfer chamber 420, and the heat treatment chamber component 500 may be sequentially arranged in the second direction X. That is, based on the transfer chamber 420, the coating chamber 410 may be disposed on one side of the transfer chamber 420, and the heat treatment chamber component 500 may be disposed on the other side of the transfer chamber 420.

[0045] A plurality of coating chambers 410 may be disposed in the third direction Z. In addition, a plurality of coating chambers 410 may be disposed in the first direction Y, such as Figure 1 As shown, a coating chamber 410 may be arranged in the first direction Y.

[0046] The heat treatment chamber part 500 may include a baking chamber 510 and a cooling chamber 520, and a plurality of baking chambers 510 and a plurality of cooling chambers 520 may be arranged in the third direction Z. The transfer chamber 420 may be positioned to align with the first buffer 320 of the buffer module 300 in the first direction Y. The coater robot 421 and the guide rail 422 may be located in the transfer chamber 420. The transfer chamber 420 may have a substantially rectangular shape. The coater robot 421 may transfer the substrate W between the baking chamber 510, the cooling chamber 520, the coating chamber 410, and the first buffer 320 of the buffer module 300.

[0047] The guide rail 422 may be arranged in a manner that its length direction is parallel to the first direction Y. The guide rail 422 may guide the coater robot 421 to move linearly in the first direction Y. The coater robot 421 may include a manipulator 423, an arm 424, a support 425, and a retainer 426. The manipulator 423 may be mounted to be fixed to the arm 424. The arm 424 may be arranged in an extendable structure so that the manipulator 423 can move in a horizontal direction. The support 425 may be arranged in a manner that its length direction is oriented in a third direction Z. The arm 424 may be coupled to the support 425 in a manner that it can move linearly in the third direction Z along the support 425. The support 425 is fixedly coupled to the retainer 426, and the retainer 426 may be coupled to the guide rail 422 so as to be able to move along the guide rail 422.

[0048] All coating chambers 410 may have the same structure, but the types of processing solutions used may be different in the respective coating chambers 410. As the processing solution, a processing solution for forming a photoresist film or an anti-reflection film may be used.

[0049] The coating chamber 410 may coat the processing solution on the substrate W. The coating chamber 410 may be provided with a processing unit including a processing container 411 , a supporting part 412 , and a nozzle part 413 .

[0050] As an example, one processing unit is arranged in each coating chamber 410 along the first direction Y, but the present invention is not limited thereto, and two or more processing units may be provided in one coating chamber 410. All processing units may have the same structure. However, the types of processing solutions used in the respective processing units may be different.

[0051] The processing container 411 of the coating chamber 410 may have an upside open shape. The support member 412 may be located in the processing container 411 and support the substrate W. The support member 412 is provided rotatably. The nozzle member 413 may supply the processing solution to the substrate W disposed on the support member 412. The processing solution may be applied to the substrate W in a spin coating scheme. In addition, the coating chamber 410 may optionally be further provided with: a nozzle (not shown) that supplies a cleaning solution (such as deionized water (DIW)) to clean the surface of the substrate W on which the processing solution is applied, and a back-rinse nozzle (not shown) for cleaning the lower side of the substrate W.

[0052] In the baking chamber 510 , when the substrate W is seated by the coater robot 421 , the substrate W is heat-treated.

[0053] In the baking chamber 510, before applying the treatment solution, a pre-baking process may be performed to heat the substrate W to a predetermined temperature to remove organic matter or moisture from the surface of the substrate W, or after applying the treatment solution onto the substrate W, a soft baking process may be performed, etc. After each heating process, a cooling process for cooling the substrate W may be performed.

[0054] The baking chamber 510 includes a heating plate 511 and a first plate 512 , which will be described below.

[0055] In the cooling chamber 520, before the treatment solution is applied, a cooling process is performed to cool the substrate W. A cooling unit CU may be provided in the cooling chamber 520. The cooling unit CU includes a first plate 512 cooling the substrate W, and details about the substrate W will be described later.

[0056] The interface module 600 may connect the coating and developing module 400 to the external exposure device 800. The interface module 600 may include an interface frame 610, a first interface buffer 620, a second interface buffer 630, and a transfer robot 640. The transfer robot 640 may transfer the substrate W transferred to the first interface buffer 620 and the second interface buffer 630 to the exposure device 800 after completing the operation of the coating and developing module 400. The first interface buffer 620 may include a housing 621 and a support 622, and the transfer robot 640 and the coater robot 421 may load or unload the substrate W onto or from the support 622.

[0057] The substrate processing apparatus having such a configuration can perform a light processing process by spraying various types of processing solutions onto the substrate. Here, since the substrate is discharged from the chamber in a high temperature state before the processing solution is applied to the substrate or after the substrate is processed by applying the processing solution, etc., the substrate is cooled to continue the subsequent process. The above-mentioned cooling unit CU is used to cool such a substrate, and the configuration of the cooling unit CU and the substrate processing apparatus 1 according to various exemplary embodiments of the present disclosure will be described with reference to the accompanying drawings.

[0058] Figure 4 is a side view showing a cooling unit according to an exemplary embodiment of the present disclosure, and Figure 5 It is shown Figure 4 A partial side view of a cooling unit. Figure 6 The second plate is shown downwardly toward the support Figure 4 A side view of a state where a substrate is moved on the first plate of the cooling unit, and Figure 7 is to show that the second plate has moved to Figure 4 A side view of a state of a cooling position of a cooling unit adjacent to a substrate.

[0059] Reference Figures 4 to 7 , the cooling unit CU for cooling the substrate W heated in the baking process may include a first plate 512, a second plate 513, a support 514, and a driving member 515. The first plate 512 may be disposed on the support 514. More specifically, the first plate 512 may be disposed in such a manner that one end thereof is connected to the support 514, and the other end thereof extends in the first direction Y and protrudes outward from the support 514.

[0060] The first plate 512 may include a cooling device 512a for cooling the substrate W. As an example, the cooling device 512a may be formed by providing a cooling channel (not shown) inside the first plate 512, and connecting a coolant inlet (not shown) and a coolant outlet (not shown) to the cooling channel. In this case, the coolant supplied through the coolant inlet may exchange heat with the substrate W while passing through the cooling channel, and then be discharged through the coolant outlet, thereby cooling the substrate W. However, the present disclosure is not limited thereto, and any of various cooling methods such as a thermoelectric element or a phase change material may be used as the cooling device 512a.

[0061] The second plate 513 may be disposed below the first plate 512. The second plate 513 may be disposed to be movable back and forth in one direction below the first plate 512. Here, the one direction refers to the height direction of the support member 514, i.e., the third direction Z, and therefore, the second plate 513 may be movable up and down in the vertical direction below the first plate 512.

[0062] The driving component 515 can provide a driving force for the second plate 513 to move up and down. The driving component 515 can be arranged in the support 514 or on one side of the support 514, and the second plate 513 can be connected to the driving component 515. More specifically, one end of the second plate 513 can be connected to the driving component 515, and the other end of the second plate 513 can extend in the first direction Y and protrude to the outside of the support 514. Therefore, the second plate 513 can face the first plate 512 in a parallel state. The driving component 515 can be composed of, for example, an actuator using air pressure or hydraulic pressure or a linear motor operated by electromagnetic interaction. Through the driving component 515, the second plate 513 can move up and down.

[0063] A plurality of first plates 512 may be provided. The plurality of first plates 512 may be connected to the support member 514 in such a manner that they are spaced apart from each other at predetermined intervals in the length direction (i.e., the third direction Z) of the support member 514. In this case, a plurality of second plates 513 may also be provided, each second plate 513 being provided below each first plate 512. Therefore, the second plate 513 may be moved up and down between two adjacent first plates 512 among the plurality of first plates 512.

[0064] Meanwhile, the second plate 513 may not be disposed below the lowermost first plate 512 among the plurality of first plates 512. In addition, the substrate W may be temporarily stored on the uppermost first plate 512 before starting cooling or after cooling is completed.

[0065] In addition, a plurality of driving components 515 may be provided to correspond to the second plates 513. Each driving component 515 may be connected to one second plate 513 to provide driving force thereto. Therefore, the second plates 513 may be driven individually to move up and down simultaneously or at different times.

[0066] Before cooling the substrate W or moving the second plate 513 downward, the second plate 513 may be disposed below the upper first plate of two adjacent first plates 512 among the first plates 512. At this time, the second plate 513 may be disposed in a state where its upper surface is in contact with the lower surface of the first plate 512. Figure 4 As shown in the enlarged view of FIG. 5 , the second plate 513 may have a plurality of protrusions P protruding upward on its upper surface. In addition, the first plate 512 may have a plurality of grooves corresponding to the above-mentioned protrusions P on its lower surface. These protrusions P and grooves make it possible to increase the contact area between the first plate 512 and the second plate 513. As a result, the rate and performance of the first plate 512 cooling the second plate 513 can be improved.

[0067] When the substrate W is transported to the first plate 512, the second plate 513 may move downward toward the lower first plate of the adjacent two first plates 512. The second plate 513 may move to a position (hereinafter referred to as a cooling position) adjacent to the substrate W supported on the first plate 512 disposed below the second plate 513 as described above. Here, the cooling position may refer to a position where the lower surface of the second plate 513 is spaced apart from the upper surface of the substrate W by a predetermined distance, but is close enough to exchange heat with each other.

[0068] In the cooling position, since the second plate 513 is spaced apart from the substrate W by a predetermined distance, the lower surface of the second plate 513 and the upper surface of the substrate W may not contact each other. More specifically, when the second plate 513 is located at the cooling position, the lower surface of the second plate 513 may be spaced apart from the upper surface of the substrate W by a preset separation distance D2. The preset separation distance D2 is an optimal distance at which heat can be exchanged between the substrate W and the second plate 513, and may be shorter than the thickness D1 of the substrate W. The above separation distance D2 may be set, for example, by adjusting the rotation speed of a motor used in the driving part 515.

[0069] Figure 8 A substrate is shown being cooled by a first plate and a second plate according to an exemplary embodiment of the present disclosure.

[0070] Reference Figure 8, the second plate 5131 according to the exemplary embodiment of the present disclosure (hereinafter, the first exemplary embodiment) may be in the form of a thin plate. The second plate 5131 may have a cross-sectional shape corresponding to the first plate 512. For example, when viewed from above the cooling unit CU, in the case where the first plate 512 has a circular cross-section, the second plate 5131 may also have a circular cross-section. In addition, the second plate 5131 and the first plate 512 may have the same area or a similar area. At this time, the second plate 5131 and the first plate 512 may have a larger area than the substrate W so as to completely cover the substrate W. Therefore, when viewed from the side of the substrate W, the second plate 5131 and the first plate 512 may have a longer length than the substrate W.

[0071] The second plate 5131 may be made of a material having a high heat transfer rate. The material of the second plate 5131 may be, for example, aluminum, but is not limited thereto. The second plate 5131 made of a material having a high heat transfer rate may cool the substrate W by exchanging heat with the heated substrate W at a position adjacent to the upper surface of the substrate W.

[0072] Fig. 9 shows a substrate cooled by a second plate and a first plate according to an exemplary embodiment of the present disclosure, Fig. 10A shows a protrusion according to an exemplary embodiment of the present disclosure, and Fig. 10B A protrusion according to an exemplary embodiment of the present disclosure is shown.

[0073] Reference Fig. 9 10, the second plate 5132 according to an exemplary embodiment of the present disclosure (hereinafter, the second exemplary embodiment) may be in the form of a disk having a circular cross-section when viewed from above, similar to the second plate according to the first exemplary embodiment described above. At this time, the second plate 5132 may have a protrusion 5132a.

[0074] The protrusion 5132a may be formed to protrude downward from the lower surface of the second plate 5132. Based on the third direction Z, the protrusion distance T of the protrusion 5132a may be formed to be longer than the thickness of the substrate W. In addition, the protrusion 5132a may be provided at the outer end portion, that is, the edge portion, of the second plate 5132. At this time, as Fig. 10A As shown, the protrusion 5132a can be formed into a ring or annular shape by extending along the peripheral direction (e.g., circumferential direction) of the second plate 5132. As another example, Fig. 10B As shown, a plurality of protrusions 5132 a may be provided and arranged to be spaced apart from each other along the circumferential direction of the second plate 5132 .

[0075] The protrusions 5132 a may prevent the second plate 5132 and the protrusions 5132 a from directly contacting the substrate W because the protrusions 5132 a contact the upper surface of the lower first plate 512 when the second plate 5132 moves downward to the cooling position.

[0076] Fig.11 A substrate is shown being cooled by a first plate and a second plate according to an exemplary embodiment of the present disclosure.

[0077] Reference Fig.11 , the second plate 5133 according to an exemplary embodiment of the present disclosure (hereinafter, a third exemplary embodiment) may include a cooling auxiliary device 5133a.

[0078] The cooling auxiliary device 5133a may be disposed within the second plate 5133. In this case, the second plate 5133 may be in the form of a chamber having an internal space therein. As an example, the second plate 5133 may be in the form of a disk having a circular cross section when viewed from above, but is not limited thereto.

[0079] The cooling auxiliary device 5133a may be a working fluid contained inside the inner space of the second plate 5133. The working fluid may be evaporated by an external heat source, and the evaporated vapor may be condensed by moving to the other side where no heat is applied, thereby transferring heat within the chamber. As an example, steam may be used as the working fluid. The cooling auxiliary device 5133a as a working fluid evaporates by absorbing heat from the heated substrate W, and then cools and reliquefies. As a result, the cooling auxiliary device 5133a may improve the substrate cooling performance of the cooling unit CU by absorbing heat from the substrate W and discharging the absorbed heat to the outside of the second plate 5133.

[0080] Fig.12 A substrate is shown being cooled by a first plate and a second plate according to an exemplary embodiment of the present disclosure.

[0081] Refer to Figure 10 and Fig.12 According to an exemplary embodiment of the present disclosure (hereinafter, the fourth exemplary embodiment), the second plate 5134 may include a cooling auxiliary device 5134a. At this time, since the specific features of the cooling auxiliary device 5134a are the same or similar to those of the cooling auxiliary device 5133a according to the third exemplary embodiment described above, repeated description will be omitted.

[0082] The second plate 5134 may further include a protrusion 5134b. The protrusion 5134b may protrude downward from the lower surface of the second plate 5134 and may be provided at an outer end portion of the second plate 5134. Other specific features of the protrusion 5134b are the same or similar to those in the above-described second exemplary embodiment, and the protrusion 5134b makes it possible to prevent the second plate 5134 from directly contacting the substrate W in the cooling position.

[0083] Fig.13 A substrate is shown being cooled by a first plate and a second plate according to an exemplary embodiment of the present disclosure.

[0084] Reference Fig.13 , the second plate 5135 according to an exemplary embodiment of the present disclosure (hereinafter, the fifth exemplary embodiment) may include a cooling auxiliary device 5135a. The cooling auxiliary device 5135a may be disposed inside the second plate 5135. At this time, the second plate 5135 may be a disk-shaped chamber having an internal space therein.

[0085] The inner space of the second plate 5135 may have an inner groove 5135b. The inner groove 5135b may be formed to be recessed downward from the bottom surface of the inner space. In this case, a local portion of the lower surface of the second plate 5135 corresponding to the inner groove 5135b may protrude downward. At this time, the protruding portion of the second plate 5135 and the substrate W may be spaced apart from each other by a separation distance D3 shorter than the thickness D1 of the substrate W. However, the present disclosure is not limited thereto, and the lower surface of the second plate 5135 may be formed in a flat shape even though the inner groove 5135b is formed in the inner space.

[0086] A plurality of inner grooves 5135b may be provided. A plurality of protrusions 5134b may be arranged to be spaced apart from each other on the bottom surface of the inner space along the first direction Y. In this case, the protrusions 5134b are arranged at equal or similar intervals, but are not limited thereto.

[0087] The cooling auxiliary device 5135a is a working fluid, similar to the working fluid in the exemplary embodiment described above. As described above, the substrate W can be cooled by absorbing heat from the substrate W and discharging the absorbed heat to the outside by evaporation and liquefaction of the cooling auxiliary device 5135a. In this case, the working fluid can be evaporated by absorbing heat from the heated substrate W while passing through the inner groove 5135b. The evaporated fluid can be liquefied by moving upward in the inner space and releasing heat to the outside through the upper surface of the second plate 5135, and then the liquefied fluid moves downward again. In this way, the substrate W can be cooled by repeated evaporation and liquefaction of the working fluid.

[0088] Fig.14A substrate is shown being cooled by a first plate and a second plate according to an exemplary embodiment of the present disclosure.

[0089] Reference Fig.14 , the second plate 5136 according to an exemplary embodiment of the present disclosure (hereinafter, the sixth exemplary embodiment) may include a cooling auxiliary device 5136a and an inner groove 5136b. At this time, since the specific features of the cooling auxiliary device 5136a and the inner groove 5136b and the substrate cooling method are the same as those in the above exemplary embodiment, repeated description will be omitted.

[0090] The second plate 5136 may further include a protrusion 5136c. The protrusion 5136c may be formed to protrude downward from the lower surface of the second plate 5136 and may be provided at an outer end portion of the second plate 5136, similar to those in the second exemplary embodiment and the fourth exemplary embodiment. The protrusion 5136c may prevent the second plate 5136 from directly contacting the substrate W at the cooling position.

[0091] Meanwhile, although not shown in the drawings, each of the second plates 5131, 5132, 5133, 5134, 5135, and 5136 according to the above exemplary embodiment may further include a heat sink (not shown). The heat sink may be provided on the upper surface of each of the second plates 5131, 5132, 5133, 5134, 5135, and 5136. At this time, a plurality of heat sinks may be provided and uniformly arranged on the entire upper surface of each of the second plates 5131, 5132, 5133, 5134, 5135, and 5136.

[0092] In addition, each of the second plates 5131, 5132, 5133, 5134, 5135, and 5136 may further include a fan (not shown). The fan may be provided on each of the second plates 5131, 5132, 5133, 5134, 5135, and 5136 to form an air flow in the third direction Z. The fan may guide air between each of the second plates 5131, 5132, 5133, 5134, 5135, and 5136 and the substrate W to move above each of the second plates 5131, 5132, 5133, 5134, 5135, and 5136 to promote heat exchange between the substrate W and each of the second plates 5131, 5132, 5133, 5134, 5135, and 5136.

[0093] The heat sink and the fan enable heat absorbed from the substrate W by each of the second plates 5131 , 5132 , 5133 , 5134 , 5135 , and 5136 to be easily and efficiently released to the outside, thereby improving the cooling performance of the cooling unit CU.

[0094] Fig.15is a flowchart illustrating a process in which a cooling unit cools a substrate according to an exemplary embodiment of the present disclosure.

[0095] refer to Figures 5 to 14 and Fig.15 , the method in which the cooling unit CU cools the substrate W may be as follows.

[0096] First, the substrate W heat-treated in the baking chamber 510 may be transported to the cooling chamber 520 ( S100 ). The heated substrate W may be placed on the first plate 512 of the cooling unit CU by the coater robot 421 .

[0097] Before the substrate W is placed on the first plate 512, the second plate 513 may be disposed in contact with the lower surface of the first plate 512. At this time, the second plate 513 may be cooled to room temperature or a temperature lower than room temperature by the cooling device 512a of the first plate 512. The second plate 513 may be maintained at the cooling temperature by being disposed in contact with the first plate 512 until the second plate 513 starts to move downward.

[0098] Next, after the substrate W is placed and supported on the first plate 512, the second plate 513 may move downward (S200). The second plate 513 may move to approach the substrate W disposed on another first plate 512 disposed directly below the second plate 513. At this time, the second plate 513 may move to a cooling position.

[0099] Next, the heated substrate W may be cooled by the first plate 512 and the second plate 513 ( S300 ).

[0100] In step S200, when the second plate 513 is located at the cooling position, the substrate W may be disposed between the second plate 513 and the first plate 512. More specifically, when the second plate 513 is located at the cooling position, the substrate W may be disposed in such a manner that the upper surface of the substrate W faces the lower surface of the second plate 513 in a state where the lower surface of the substrate W is supported in contact with the first plate 512.

[0101] The heated substrate W may be cooled by the cooling device 512a of the first plate 512 supporting the substrate W. More specifically, the substrate W may be cooled by exchanging heat with the surface of the first plate 512 cooled by the cooling device 512a. At this time, the second plate 513 facing the substrate W is pre-cooled as described above, and has a lower temperature than the substrate W. Therefore, when the substrate W is cooled by the first plate 512, heat may be exchanged between the second plate 513 and the substrate W.

[0102] In this way, the heated substrate W exchanges heat with the first plate 512 through its lower surface and is cooled, and at the same time, the substrate W exchanges heat with the second plate 513 through its upper surface and is cooled, thereby shortening the time required for cooling compared to the case where only the first plate 512 is used.

[0103] Meanwhile, in the case where the second plate 5133 or 5134 includes the cooling auxiliary device 5133a or 5134a as in the third exemplary embodiment or the fourth exemplary embodiment described above, when the substrate W is cooled, the surface of the second plate 5133 or 5134 is continuously cooled and thereby maintained at a lower temperature than the substrate W. Therefore, the substrate W can continuously exchange heat not only with the first plate 512 but also with the second plate 5133 or 5134. As a result, the substrate W can be cooled more quickly.

[0104] Next, when the cooling of the substrate W is completed, the second plate 513 may be moved upward again (S400). When the substrate W is cooled to the target temperature, the second plate 513 may be moved toward the first plate 512 located above the second plate 513, and returned to its original position before the cooling starts. Here, the target temperature may be room temperature, i.e., 15°C to 25°C, preferably 18°C ​​to 23°C. The second plate 513 that has returned to its original position may be cooled again in contact with the lower surface of the first plate 512 until the next substrate W starts to be cooled.

[0105] Next, the completely cooled substrate W may be discharged from the cooling unit CU (S500). The substrate W cooled to the target temperature (e.g., room temperature) may be transported to the outside of the cooling chamber 520 by the transfer robot 640. By repeating this process, a plurality of substrates W may be sequentially and continuously cooled and then transported to a location for the next process.

[0106] The cooling unit CU and the substrate processing device 1 according to the exemplary embodiment of the present disclosure as described above are capable of using the second plate 513 pre-cooled by the first plate 512 and the first plate 512 to simultaneously cool the upper and lower surfaces of the substrate W, compared to the case where only the first plate 512 is used to cool the substrate W, thereby increasing the cooling rate, and as a result, improving the substrate processing throughput and substrate processing performance of the substrate processing device 1.

[0107] Furthermore, the configurations of the exemplary embodiments described above may be combined with each other as long as the technical contents do not contradict each other without departing from the technical idea of ​​the present disclosure, and the technical idea of ​​the present disclosure is also within the scope of the present disclosure.

[0108] Although the substrate processing apparatus according to the present disclosure has been described in the above exemplary embodiments as being applied to a light process, the present disclosure is not limited thereto. As long as the substrate processing apparatus according to the present disclosure can be used as a substrate cooling apparatus, it is obvious to those skilled in the art that the substrate processing apparatus according to the present disclosure can be applied to various processes, such as an etching process, a testing process, and a packaging process, which are also within the scope of the present disclosure.

Claims

1. A substrate processing device, comprising: a cooling chamber, accommodating the substrate; as well as A cooling unit is disposed inside the cooling chamber, the cooling unit comprising: a support; two first plates connected to the support to support the substrate and spaced apart from each other in a height direction of the support; and a second plate configured to move up and down between the two first plates.

2. The substrate processing apparatus according to claim 1, wherein: The first plate includes: a coolant inlet through which a coolant is introduced; a coolant outlet through which the coolant is discharged; and a cooling channel provided inside the first plate.

3. The substrate processing apparatus according to claim 1, wherein: The second plate contacts an upper first plate of the two first plates before cooling the substrate, and moves downward to a cooling position spaced apart from the substrate supported on a lower first plate of the two first plates while cooling the substrate.

4. The substrate processing apparatus according to claim 3, wherein: A lower surface of the second plate and an upper surface of the substrate are spaced apart from each other by a distance shorter than a thickness of the substrate.

5. The substrate processing apparatus according to claim 1, wherein: The second plate has a cross-sectional shape corresponding to that of the first plate, and has an area that completely covers the substrate.

6. The substrate processing apparatus according to claim 5, wherein: The second plate has a protrusion, and The protrusion is formed to protrude downward from a lower surface of the second plate.

7. The substrate processing apparatus according to claim 6, wherein: The protrusion has a protrusion distance longer than a thickness of the substrate.

8. The substrate processing apparatus according to claim 6, wherein: The protrusion is provided on an edge portion of the second plate and extends along a circumferential direction of the second plate.

9. The substrate processing apparatus according to claim 1, wherein: The two first plates and the second plate are arranged parallel to each other.

10. The substrate processing apparatus according to claim 1, wherein: The second plate has an inner space, and The inner space contains a working fluid.

11. A substrate processing method, comprising: placing a substrate on a first plate that cools the substrate; moving the second plate downwardly toward the substrate; cooling the substrate using the second plate together with the first plate; as well as After the substrate is completely cooled, the second plate is moved upward.

12. The substrate processing method according to claim 11, wherein: A plurality of first plates are provided, and the plurality of first plates are spaced apart from each other along one direction, and The second plate moves up and down between two adjacent first plates among the plurality of first plates.

13. The substrate processing method according to claim 12, wherein: When the substrate is placed on the first plate cooling the substrate, the second plate is cooled by contacting a lower surface of an upper first plate of the two first plates.

14. The substrate processing method according to claim 12, wherein: As the second plate moves downward toward the substrate, the second plate moves downward toward a lower first plate of the two first plates.

15. The substrate processing method according to claim 14, wherein: When the substrate is cooled by the second plate together with the first plate, the substrate is cooled in a state where the lower surface of the substrate is in contact with the first plate and the upper surface of the substrate is spaced apart from the second plate.

16. The substrate processing method according to claim 14, wherein: The second plate has a protrusion, and The protrusion protrudes downward from the lower surface of the second plate and has a protrusion distance longer than a thickness of the substrate.

17. The substrate processing method according to claim 16, wherein: When the substrate is cooled by the second plate together with the first plate, the substrate is cooled in a state in which the protrusion is in contact with the lower first plate and the substrate is spaced apart from the second plate.

18. The substrate processing method according to claim 13, wherein: When the second plate moves upward after completely cooling the substrate, when the substrate is cooled to a target temperature, the second plate moves to contact the lower surface of the upper first plate again.

19. A substrate processing device, comprising: a baking chamber to heat the substrate for thermal processing; a cooling chamber, disposed at one side of the baking chamber and accommodating the substrate heat-treated in the baking chamber; as well as a cooling unit disposed inside the cooling chamber, the cooling unit comprising: a support; two first plates connected to the support to support the substrate and spaced apart from each other in a height direction of the support; and a second plate capable of moving up and down between the two first plates and disposed in parallel with the two first plates, The second plate has a protrusion, which protrudes downward from a lower surface of the second plate by a protrusion distance longer than a thickness of the substrate and extends in a circumferential direction of the second plate.

20. The substrate processing apparatus according to claim 19, wherein: The first plate includes: a coolant inlet through which a coolant is introduced; a coolant outlet through which the coolant is discharged; and a cooling channel disposed inside the first plate, and The second plate has an inner space for accommodating a working fluid.

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