Heat dissipation device and server

Abstract

The invention discloses a heat dissipation device and a server, and relates to the technical field of server heat dissipation. The heat dissipation device comprises a heating device, a heat conduction piece and a heat dissipation structure, the heating device is provided with a heating piece, a first fixing structure and a second fixing structure, and the heat conduction piece is provided with a first heat transfer contact face used for making contact with the heating piece of the heating device; the heat conducting piece is fixedly arranged on the first fixing structure; the heat dissipation structure is provided with a second heat transfer contact surface used for being in contact with the heat conduction piece, and the heat dissipation structure is used for dissipating heat transferred by the heat conduction piece; the heat dissipation structure is fixedly arranged on the second fixing structure. In the actual use process of the heat dissipation device provided by the invention, when devices in the heating equipment need to be replaced or maintained, only the heat dissipation structure needs to be disassembled, and the heat conduction piece does not need to be disassembled, so that the influence on the heating piece in the heat dissipation device disassembling process can be effectively avoided. In addition, the heat conduction piece and the heat dissipation structure are designed in a split mode, and the heat dissipation structure can adapt to various different heating devices provided with heating pieces.

Description

Technical Field

[0001] The present invention relates to the technical field of server heat dissipation, and in particular to a heat dissipation device. In addition, the present invention also relates to a server comprising the heat dissipation device. Background Art

[0002] The radiator is one of the most commonly used components in the server. In a complete server, there are various radiators, such as CPU (Central Processing Unit) radiator, VR (Voltage regulator) radiator, GPU (graphics processing unit) radiator, etc. Heat-generating components that generate heat and power basically need the help of radiators to dissipate heat.

[0003] At present, the contact between the heat sink and the heat-generating components often requires the addition of thermal conductive adhesive. The better the thermal conductivity of the thermal conductive adhesive, the stronger its viscosity will be when the temperature returns to normal temperature, resulting in the need for greater external force when removing the heat sink. When a heat sink corresponds to multiple heat-generating components, the required disassembly force is even greater. The huge force pulling the heat sink and the heat-generating component can easily cause micro-strain in the heat-generating component and the board, affecting the product performance of the heat-generating component.

[0004] In summary, how to avoid the impact on the heat generating components during the disassembly process of the radiator is a technical problem that needs to be urgently solved by those skilled in the art. Summary of the invention

[0005] The object of the present invention is to provide a heat dissipation device, which is arranged as a split structure, including a heat conductive part and a heat dissipation structure, wherein the heat conductive part is used to contact the heat generating part, and the heat dissipation structure and the heat conductive part are independent of each other. When it is necessary to replace the components in the heat generating device, it is only necessary to disassemble the heat dissipation structure, and there is no need to disassemble the heat conductive part, thereby effectively avoiding the influence on the heat generating part during the disassembly of the heat dissipation device.

[0006] In addition, another object of the present invention is to provide a server including the above-mentioned heat dissipation device.

[0007] In order to solve the above technical problems, the present invention provides a heat dissipation device, comprising:

[0008] A heating device is provided with a heating element, a first fixing structure and a second fixing structure;

[0009] A heat conducting member is provided with a first heat transfer contact surface for contacting the heat generating member; the heat conducting member is fixedly mounted on the first fixing structure;

[0010] The heat dissipation structure is a structure relatively independent of the heat conducting member, the heat dissipation structure is provided with a second heat transfer contact surface, and the heat dissipation structure is used to dissipate the heat transferred by the heat conducting member; the heat dissipation structure is fixedly arranged on the second fixed structure;

[0011] When the heat conducting member is fixed to the first fixing structure and the heat dissipating structure is fixed to the second fixing structure, the second heat transfer contact surface contacts the heat conducting member.

[0012] On the one hand, the heat conducting member is provided with a third heat transfer contact surface for contacting the second heat transfer contact surface, the third heat transfer contact surface is provided with a plurality of heat transfer protrusions, and the second heat transfer contact surface is provided with heat transfer recesses for cooperating with the heat transfer protrusions.

[0013] On the other hand, the heat transfer protrusion is a sawtooth protrusion, a wavy protrusion, or a rectangular protrusion.

[0014] On the other hand, the heat conducting member comprises:

[0015] Main body;

[0016] A boss protrudes from the main body, and the top end surface of the boss is provided with the first heat transfer contact surface;

[0017] A fixing part is arranged on the main body, and the fixing part is arranged on at least one side of the boss, and the fixing part is used to be fixedly installed on the heat generating device.

[0018] On the other hand, the boss includes a third fixed structure and a sliding structure connected to the main body; the sliding structure is movably arranged on the third fixed structure through a moving assembly, and the sliding structure is movably arranged along at least one direction;

[0019] The third heat transfer contact surface is arranged on a side of the sliding structure away from the third fixed structure.

[0020] On the other hand, a pressure detection member is provided between the second heat transfer contact surface and the heat conductive member, and the pressure detection member is used to detect the contact pressure between the second heat transfer contact surface and the heat conductive member;

[0021] And / or, the first heat transfer contact surface is provided with a thermally conductive coating for improving thermal conductivity, and the thermally conductive coating is used to contact the heat generating element.

[0022] On the other hand, the heat generating device comprises a structural body and the heat generating element, wherein the heat generating element is mounted on the structural body;

[0023] The first fixing structure is arranged at the periphery of the position for installing the heat generating element in the structural body;

[0024] The second fixing structure is arranged on the outer peripheral edge of the structural body.

[0025] On the other hand, one of the structural body and the heat dissipation structure is provided with a positioning boss, and the other of the structural body and the heat dissipation structure is provided with a positioning hole for cooperating with the positioning boss;

[0026] At least one clamping assembly is provided on one side of the structural body facing the heat dissipation structure, and the clamping assembly includes a mounting seat fixedly provided on the structural body, and an elastic clamping buckle provided on the mounting seat and rotatable between a first angle position and a second angle position; a clamping groove matched with the elastic clamping buckle is provided on the portion of the positioning boss extending out of the heat dissipation structure; when the elastic clamping buckle is rotated to the first angle position, the elastic clamping buckle is clamped in the clamping groove; when the elastic clamping buckle is rotated to the second angle position, the elastic clamping buckle is released from the clamping groove;

[0027] The heat dissipation device is provided with a first temperature detection element and a heat dissipation fan for detecting the surface temperature thereof, the heat dissipation structure is a heat dissipation fin, and the heat dissipation fin is provided with a flow rate detection element for detecting the flow rate of the gas flowing through the heat dissipation structure;

[0028] The structural body is provided with a mounting groove for mounting the heating element, the thickness of the heating element is lower than the depth of the mounting groove, and when the first heat transfer contact surface of the heat conductive element contacts the heating element, the heat conductive element is at least partially located in the mounting groove;

[0029] The heat dissipation structure includes a heat dissipation body and an adjustment part. The adjustment part is arranged on the side of the heat dissipation body facing the heat conductive element. The second heat transfer contact surface is arranged on the side of the adjustment part facing the heat conductive element. The adjustment part is adjustable at the installation position of the heat dissipation body to adapt to the heat generating element at different installation positions.

[0030] On the other hand, the structural body is provided with a display, an alarm and a controller for displaying the temperature of the heating element. The first temperature detection element is used to obtain the temperature information of the heating element and transmit the temperature information to the controller. When the temperature information is outside the preset temperature range, the controller controls the alarm to issue a warning message. The display is arranged on the outside of the structural body.

[0031] A server comprises any one of the heat dissipation devices described above.

[0032] It can be seen from the above technical scheme that the heat dissipation device provided by the present invention includes a heating device, a heat conductive member and a heat dissipation structure. The heating device is provided with a heating member, a first fixed structure and a second fixed structure. The heat conductive member is provided with a first heat transfer contact surface for contacting the heating member; the heat conductive member is used to be fixed on the first fixed structure; the heat dissipation structure is provided with a second heat transfer contact surface for contacting the heat conductive member, and the heat dissipation structure is used to dissipate the heat transferred by the heat conductive member; the heat dissipation structure is used to be fixed on the second fixed structure; when the heat conductive member is fixed on the first fixed structure and the heat dissipation structure is fixed on the second fixed structure, the second heat transfer contact surface is in contact with the heat conductive member.

[0033] When using the heat dissipation device provided by the present invention, first, the heat conductor needs to be installed to the position where the first heat transfer contact surface contacts the heating element; then the heat dissipation structure is installed so that the second heat transfer contact surface of the heat dissipation structure contacts the heat conductor; the heat generated by the heating element is transferred from the heat conductor to the heat dissipation structure, and the heat dissipation structure dissipates the heat.

[0034] The beneficial effects of the present invention include:

[0035] 1. When it is necessary to replace or repair the components in the heating device, only the heat dissipation structure needs to be disassembled. Since the heat dissipation structure and the heat-conducting component are independently arranged, there is no need to disassemble the heat-conducting component, which can effectively avoid the influence of the heat dissipation device on the heating component during the disassembly process.

[0036] 2. Since the heat conductor and the heat dissipation structure are split designs, in actual use, when the installation position of the heating element changes, the heat conductor only needs to adjust the installation position according to the position change of the heating element. It can adapt to a variety of different heating devices equipped with heating elements, expanding the use range of the heat dissipation device.

[0037] In addition, the present invention also provides a server comprising the above heat dissipation device. BRIEF DESCRIPTION OF THE DRAWINGS

[0038] In order to more clearly illustrate the embodiments of the present invention, the following briefly introduces the drawings required for use in the embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0039] Figure 1 An exploded schematic diagram of a heat conducting member and a heat dissipation structure in a heat dissipation device provided in an embodiment of the present invention;

[0040] Figure 2 It is a structural schematic diagram of a heating device equipped with a heat-conducting member;

[0041] Figure 3A schematic diagram of the structure of a heat-conducting member and a heat-dissipating structure in a heat-dissipating device provided in an embodiment of the present invention;

[0042] Figure 4 is a partial cross-sectional schematic diagram of the contact position between the third heat transfer contact surface and the second heat transfer contact surface;

[0043] Figure 5 It is a partial structural schematic diagram of the main body of the heating device;

[0044] Figure 6 It is a partial structural schematic diagram of a structural main body with a snap-on assembly installed;

[0045] Figure 7 A partial structural schematic diagram of the heat dissipation device provided by the present invention;

[0046] Figure 8 A schematic diagram of the installation position of components in the heat dissipation device provided by the present invention;

[0047] Fig. 9 It is an exploded schematic diagram of the heat dissipation device when the heat dissipation structure is a cold plate.

[0048] Figures 1 to 9 middle:

[0049] 1-Heat conduction parts;

[0050] 11-main body, 111-third heat transfer contact surface, 112-serrated convex portion; 12-boss, 121-first heat transfer contact surface; 13-fixing portion;

[0051] 2- Heat dissipation structure;

[0052] 21- second heat transfer contact surface; 211- heat transfer recess; 22- cold plate;

[0053] 3-Heating equipment;

[0054] 31-structural body, 311-positioning boss, 3111-slot, 312-mounting seat, 313-elastic buckle, 314-mounting slot;

[0055] 32-device. DETAILED DESCRIPTION

[0056] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0057] The core of the present invention is to provide a heat dissipation device, including a heat-generating device 3, a heat-conducting member 1 and a heat-dissipating structure 2, wherein the heat-generating device 3 is provided with a heat-generating member, a first fixed structure and a second fixed structure; the heat-conducting member 1 is provided with a first heat transfer contact surface 121 for contacting the heat-generating member of the heat-generating device 3; the heat-conducting member 1 is used to be fixed on the first fixed structure; the heat-dissipating structure 2 is a structure relatively independent of the heat-conducting member 1, the heat-dissipating structure 2 is provided with a second heat transfer contact surface 21 for contacting the heat-conducting member 1, and the heat-dissipating structure 2 is used to realize the dissipation of the heat transferred by the heat-conducting member 1; the heat-dissipating structure 2 is used to be fixed on the second fixed structure; when the heat-conducting member 1 is fixed on the first fixed structure and the heat-dissipating structure 2 is fixed on the second fixed structure, the second heat transfer contact surface 21 is in contact with the heat-conducting member 1.

[0058] It should be noted that the heat dissipation structure 2 in this specific embodiment can be as follows: Figure 1 The heat dissipation fin structure shown in FIG. 1 may also be as shown in FIG. Fig. 9 The cold plate 22 shown may contain a liquid cooling heat dissipation structure 2, which is determined according to actual conditions. When the heat dissipation structure 2 is a cold plate 22, a second heat transfer contact surface 21 for contacting the heat conduction member 1 needs to be provided on the side of the cold plate 22 facing the heat conduction member 1, and the installation method of the cold plate 22 on the heat generating device 3 is the same as the installation method of the heat dissipation fins.

[0059] When using the heat dissipation device provided in this specific embodiment, first, the heat conductive component 1 needs to be installed to the position where the first heat transfer contact surface 121 contacts the heating element; then the heat dissipation structure 2 is installed so that the second heat transfer contact surface 21 of the heat dissipation structure 2 contacts the heat conductive component 1; the heat generated by the heating element transfers the heat conductive component 1 to the heat dissipation structure 2, and the heat dissipation structure 2 dissipates the heat.

[0060] The beneficial effects of this specific embodiment include: when it is necessary to replace or repair the device 32 in the heating device 3, it is only necessary to disassemble the heat dissipation structure 2. Since the heat dissipation structure 2 and the heat conductive member 1 are independently arranged, it is not necessary to disassemble the heat conductive member 1, which can effectively avoid the influence on the heating member during the disassembly of the heat dissipation device. Since the heat conductive member 1 and the heat dissipation structure 2 are split designs, in actual use, when the installation position of the heating member changes, the heat conductive member 1 only needs to adjust the installation position according to the position change of the heating member, which can adapt to a variety of different heating devices 3 with heating members installed, expanding the use range of the heat dissipation device.

[0061] On the basis of the above embodiment, the heat dissipation structure 2 can include a heat dissipation portion for contacting the heat conductor 1 and a mounting portion for fixedly mounting on the heat generating device 3, and the mounting portion can be detachably mounted on the heat dissipation portion, and the heat dissipation portion is provided with at least two different fixed mounting positions for fixing the mounting portion.

[0062] Specifically, the fixed installation position can be set as different installation positions in the installation slot, and the installation slot is set in the heat dissipation part. The installation part can be slidably set in the installation slot, and the installation part can be fixed to any position in the installation slot. In actual use, the heat conductor 1 is first installed to the position in contact with the heating element, and then the heat dissipation structure 2 is installed. In the process of installing the heat dissipation structure 2, since the position for fixed connection with the heat dissipation structure 2 in different heating devices 3 may change, it is necessary to first adjust the position of the installation part in the heat dissipation part according to the position for fixed connection with the heat dissipation structure 2 in the heating device 3. After the adjustment is appropriate, the installation part is fixed relative to the heat dissipation part, and then the heat dissipation structure 2 is installed to the heating structure, and the installation part is fixedly connected to the heating structure.

[0063] In this specific embodiment, the heat dissipation structure 2 is configured with a split heat dissipation portion and a mounting portion. During actual use, when the fixed connection positions of different heat-generating devices 3 change, the heat dissipation device in this specific embodiment can adjust the position of the mounting portion relative to the heat dissipation structure 2 so that the heat dissipation device can be suitable for different heat-generating devices 3, thereby expanding the scope of use of the heat dissipation device.

[0064] Based on the above embodiment, a third heat transfer contact surface 111 for contacting the second heat transfer contact surface 21 can be provided on the heat conductive member 1, the third heat transfer contact surface 111 is provided with a plurality of heat transfer protrusions, and the second heat transfer contact surface 21 is provided with heat transfer recesses 211 for cooperating with the heat transfer protrusions.

[0065] Specifically, the heat transfer protrusion can be configured as a sawtooth protrusion 112 or a wave-shaped protrusion or a rectangular protrusion.

[0066] Combination Figure 3 , Figure 4 As shown, the heat transfer protrusion can be set as a sawtooth protrusion 112, and the heat transfer concave portion 211 can be set as a sawtooth concave portion for matching with the sawtooth protrusion 112. When the second heat transfer contact surface 21 contacts the third heat transfer contact surface 111, as shown in FIG. Figure 4 As shown, the contact area between the second heat transfer contact surface 21 and the third heat transfer contact surface 111 can be effectively increased, thereby increasing the heat conduction area, improving the heat transfer efficiency, and further improving the heat dissipation efficiency.

[0067] It should be noted that when the same heating device 3 is provided with multiple heating elements, the third heat transfer contact surfaces 111 of the heating elements corresponding to different heat conducting elements 1 can be set to different shapes, which are determined according to actual conditions and will not be elaborated here.

[0068] In a specific embodiment, the heat conducting member 1 may include a main body 11, a boss 12 and a fixing portion 13, wherein the boss 12 is protruding from the main body 11, and a first heat transfer contact surface 121 is provided on the top end surface of the boss 12; the fixing portion 13 is provided on the main body 11, and the fixing portion 13 is provided on at least one side of the boss 12, and the fixing portion 13 is used for being fixedly installed on the heat generating device 3.

[0069] like Figure 3 As shown, the boss 12 faces the side away from the heat dissipation structure 2. During actual installation, a mounting groove 314 is generally provided in the heat dissipation structure 2, and the heating element is installed in the mounting groove 314. The boss 12 is at least partially located in the mounting groove 314, so that the first heat transfer contact surface 121 of the boss 12 contacts the heating element. Specifically, the first heat transfer contact surface 121 can be set as a plane, or the first heat transfer contact surface 121 can be set as a surface that matches the surface of the heating element, which is determined according to actual conditions and will not be elaborated here.

[0070] According to the requirement of heat conduction, thermal conductive glue or other heat conductive media may be provided between the first heat transfer contact surface 121 and the heat generating element, which is determined according to the actual situation and will not be elaborated here.

[0071] In this specific embodiment, the fixing portion 13 is as follows Figure 3 As shown, the fixing portion 13 is provided on both sides of the boss 12 , and a through hole is provided. The locking member passes through the through hole and is locked to the heat-generating device 3 , so as to fix the heat-conducting member 1 .

[0072] In this specific embodiment, the boss 12 is provided to achieve contact between the heat conductive component 1 and the heating element in the installation groove 314, which is beneficial to achieve surface-to-surface contact between the heat conductive component 1 and the heating element. In addition, the fixing portion 13 is fixed to the heating device 3 by a locking member, which can achieve fixed installation of the heat conductive component 1 and facilitate the installation process.

[0073] On the basis of the above embodiments, in actual use, when the third heat transfer contact surface 111 of the heat conductor 1 contacts the second heat transfer contact surface 21 of the heat dissipation structure 2 through the heat transfer protrusion and the heat transfer recess 211, the relative installation position of the third heat transfer contact surface 111 and the second heat transfer contact surface 21 must meet the matching requirements of the heat transfer protrusion and the heat transfer recess 211. When the installation position of the heat conductor 1 changes or shifts, it will affect the matching of the heat transfer protrusion and the heat transfer recess 211. Therefore, in this specific embodiment, the boss 12 includes a third fixed structure connected to the main body 11 and a sliding structure; the sliding structure is movably arranged on the third fixed structure through a moving component, and the sliding structure is movably arranged in at least one direction; the third heat transfer contact surface 111 is arranged on the side of the sliding structure away from the third fixed structure.

[0074] During actual use, when the installation position of the heat conductor 1 changes, since the sliding structure is movably arranged on the third fixed structure, when the heat dissipation structure 2 is installed, the heat transfer protrusion and the heat transfer recess 211 can be matched by moving the sliding structure to avoid misalignment of the relative position of the heat transfer protrusion and the heat transfer recess 211.

[0075] The moving component in this specific embodiment may be a module that is movable in both the first direction and the second direction, or may be a slide rail structure, which is determined based on actual conditions and will not be elaborated herein.

[0076] In this specific embodiment, a movable sliding structure is provided on the boss 12, and the third heat transfer contact surface 111 is provided on the sliding structure. During actual use, when the installation position of the heat conductive element 1 changes, or the installation position of the heat conductive element 1 shifts, the heat transfer protrusion and the heat transfer recess 211 can be matched by moving the sliding structure, thereby avoiding the relative position misalignment of the heat transfer protrusion and the heat transfer recess 211, so as to adapt to the situation where the heat generating element is installed in different positions, thereby further expanding the application scope of the heat dissipation device.

[0077] On the basis of the above embodiment, a pressure detection member may be provided between the second heat transfer contact surface 21 and the heat conducting member 1 , and the pressure detection member is used to detect the contact pressure between the second heat transfer contact surface 21 and the heat conducting member 1 .

[0078] During the actual assembly process, when installing the heat dissipation structure 2, the pressure between the second heat transfer contact surface 21 and the third heat transfer contact surface 111 of the heat conductive component 1 can be detected in real time through the pressure detection component, so as to avoid the situation where a gap is set between the heat dissipation structure 2 and the heat conductive component 1 or the contact pressure between the heat dissipation structure 2 and the heat conductive component 1 is too large, so as to maintain a suitable contact pressure between the heat dissipation structure 2 and the heat conductive component 1.

[0079] On the other hand, pressure detection components may be provided at different positions of the second heat transfer contact surface 21. During the assembly process, the pressure information detected by the pressure detection components at different positions may be used to determine whether the heat dissipation structure 2 is installed crookedly.

[0080] Based on the above embodiment, a thermal conductive coating for improving thermal conductivity may be provided on the first heat transfer contact surface 121, and the thermal conductive coating is used to contact the heating element. The specific material of the thermal conductive coating needs to be determined according to actual conditions.

[0081] On the basis of the above embodiment, the heating device 3 may include a structural body 31 and a heating element, wherein the heating element is installed on the structural body 31; a first fixing structure is arranged on the periphery of a position in the structural body 31 for installing the heating element; and a second fixing structure is arranged on the peripheral edge of the structural body 31.

[0082] It should be noted that the heat dissipation device mentioned in this specific embodiment can be a CPU heat sink or a GPU heat sink, or other heat sinks used to dissipate heat for heat generating components, which is determined based on actual conditions.

[0083] During the actual installation of the heat dissipation device provided in this specific embodiment, the heat dissipation structure 2 needs to cover the heat-conducting member 1 and other devices 32 in contact with the heating element during installation; Figure 8 , Fig. 9 As shown, a device 32 is provided on one side of the structural body 31 where the heating element is installed. When the device 32 needs to be repaired or replaced, the heat dissipation structure 2 needs to be disassembled. In this specific embodiment, the heat dissipation structure 2 and the heat conductive element 1 are independently provided. Therefore, the heat dissipation element will not be affected during the disassembly of the heat dissipation structure 2.

[0084] On the basis of the above embodiment, a positioning boss 311 may be provided on one of the structural body 31 and the heat dissipation structure 2 , and a positioning hole for cooperating with the positioning boss 311 may be provided on the other of the structural body 31 and the heat dissipation structure 2 .

[0085] like Figure 5 As shown, the positioning boss 311 is disposed at a position close to the edge of the structural body 31. Figure 7 As shown, during the assembly process, the positioning boss 311 is inserted into the positioning hole of the heat dissipation structure 2 to fix the installation position of the heat dissipation structure 2.

[0086] In addition, at least one snap-fit ​​assembly can be arranged on the side of the structural body 31 facing the heat dissipation structure 2, and the snap-fit ​​assembly includes a mounting seat 312 fixed to the structural body 31, and an elastic snap 313 rotatably arranged on the mounting seat 312 between a first angle position and a second angle position; the portion of the positioning boss 311 extending out of the heat dissipation structure 2 is provided with a snap-fitting groove 3111 cooperating with the elastic snap-fitting 313; when the elastic snap-fitting 313 is rotated to the first angle position, the elastic snap-fitting 313 is snap-fitted into the snap-fitting groove 3111; when the elastic snap-fitting 313 is rotated to the second angle position, the elastic snap-fitting 313 is released from the snap-fitting groove 3111.

[0087] Combination Figure 6 , Figure 7 As shown, the elastic buckle 313 is a bent steel wire, the structural body 31 is provided with a mounting seat 312, and the two ends of the elastic buckle 313 in the length direction are rotatably arranged on the structural body 31. During actual assembly, the positioning boss 311 is inserted into the positioning hole of the heat dissipation structure 2, and the slot 3111 at the end of the positioning boss 311 extends out of the heat dissipation structure 2. The elastic buckle 313 is rotated to make the elastic buckle 313 locked in the slot 3111, so that the heat dissipation structure 2 can be fixedly installed on the structural body 31. Figure 7As shown, an avoidance groove is provided in the heat dissipation structure 2, and a positioning hole is provided in the avoidance groove. Therefore, when the elastic buckle 313 is engaged with the slot 3111, the elastic buckle 313 is located in the avoidance groove and does not protrude from the surface of the heat dissipation structure 2.

[0088] In this specific embodiment, the heat dissipation structure 2 and the heat generating device 3 are fixed by the elastic buckle 313 and the slot 3111, which facilitates the installation process and avoids the use of tools, thereby achieving tool-free disassembly and assembly.

[0089] Based on the above embodiment, a first temperature detection element for detecting the surface temperature of the heat dissipation device can be provided. The heat dissipation structure 2 is a heat dissipation fin, and the heat dissipation fin is provided with a flow rate detection element for detecting the flow rate of the gas flowing through the heat dissipation structure 2.

[0090] During actual use, the heat dissipation device also includes a heat dissipation fan, which can detect the temperature information of the heating element in real time through the first temperature detection element. When the temperature information of the heating element is within the preset temperature range, the heat dissipation fan can be controlled to maintain the current speed. When the temperature information of the heating element is higher than the maximum value of the preset temperature range, the speed of the heat dissipation fan can be controlled to increase; when the temperature information of the heating element is lower than the minimum value of the preset temperature range, the speed of the heat dissipation fan can be controlled to decrease.

[0091] On the other hand, the flow velocity information detected by the flow velocity detection component can be combined to determine whether there is foreign matter that affects the heat dissipation of the heat dissipation structure 2. According to the different speeds of the heat dissipation fan, the flow velocity of the gas flowing through the heat dissipation structure 2 will also change accordingly. When the flow velocity information detected by the flow velocity detection component is within the preset flow velocity range corresponding to the current speed of the heat dissipation fan, the current state is maintained; when the flow velocity information detected by the flow velocity detection component is lower than the minimum value of the preset flow velocity range corresponding to the current speed of the heat dissipation fan, it means that there is foreign matter blocking the gas from flowing normally through the heat dissipation structure 2, and the heat dissipation structure 2 needs to be disassembled for inspection.

[0092] When the heat dissipation structure 2 is a cold plate 22, a liquid cooling pipeline is arranged inside the heat dissipation structure 2, and the liquid cooling pipeline is provided with a control valve for controlling the flow rate of the coolant inside it. The temperature information of the heating element can be detected in real time through the first temperature detection element. When the temperature information of the heating element is within the preset temperature range, the control valve can be controlled to maintain the current opening. When the temperature information of the heating element is higher than the maximum value of the preset temperature range, the opening of the control valve can be controlled to increase; when the temperature information of the heating element is lower than the minimum value of the preset temperature range, the opening of the switch valve can be controlled to decrease.

[0093] In this specific embodiment, by setting up a first temperature detection component, the temperature information of the heating element can be detected in real time, which is convenient for adjusting the rotation speed of the cooling fan according to the temperature information of the heating element, realizing real-time control of the temperature of the heating element, meeting the heat dissipation requirements of the heating element while saving energy as much as possible; in addition, the flow rate detection component can detect the gas flow rate flowing through the heat dissipation structure 2, avoiding the influence of foreign matter on the flow rate of the gas flowing through the heat dissipation structure 2, which is conducive to timely detection of problems.

[0094] On the other hand, a display, an alarm and a controller for displaying the temperature of the heating element can be provided on the structural body 31. The first temperature detection element is used to obtain the temperature information of the heating element and transmit the temperature information to the controller. When the temperature information is outside the preset temperature range, the controller controls the alarm to issue a warning message. The display is provided on the outside of the structural body 31.

[0095] When using the heat dissipation device provided in this specific embodiment, the first temperature detection component sends the acquired temperature information to the controller, and the controller controls the display to display the temperature information. When the temperature information is outside the preset temperature range, the controller controls the alarm to issue a warning message, so that the staff can obtain the temperature conditions of the heating component in time so as to take timely measures.

[0096] When it is necessary to install a heating element on the structural body 31, a mounting groove 314 for mounting the heating element can be provided on the structural body 31. The thickness of the heating element is lower than the depth of the mounting groove 314. When the first heat transfer contact surface 121 of the heat conductive element 1 contacts the heating element, the heat conductive element 1 is at least partially located in the mounting groove 314.

[0097] On the basis of the above-mentioned embodiment, when the third heat transfer contact surface 111 of the heat conductor 1 contacts the second heat transfer contact surface 21 of the heat dissipation structure 2 through the heat transfer protrusion and the heat transfer recess 211, the relative installation position of the third heat transfer contact surface 111 and the second heat transfer contact surface 21 must meet the matching requirements of the heat transfer protrusion and the heat transfer recess 211. When the installation position of the heat conductor 1 changes or shifts, it will affect the matching of the heat transfer protrusion and the heat transfer recess 211. Therefore, in this specific embodiment, the heat dissipation structure 2 includes a heat dissipation body and an adjustment part, the adjustment part is arranged on the side of the heat dissipation body facing the heat conductor 1, and the second heat transfer contact surface 21 is arranged on the side of the adjustment part facing the heat conductor 1. The adjustment part is adjustable at the installation position of the heat dissipation body to adapt to the heat-generating parts at different installation positions.

[0098] During actual use, when the installation position of the heat conductor 1 changes, since the adjustment part is adjustable at the installation position of the heat dissipation body, when the heat dissipation structure 2 is installed, the heat transfer protrusion and the heat transfer recess 211 can be matched by moving the adjustment part to avoid misalignment of the relative position of the heat transfer protrusion and the heat transfer recess 211.

[0099] The adjustment part in this specific embodiment can be installed on the heat dissipation body through a movable component, wherein the movable component can be a module movable in the first direction and the second direction, or a slide rail structure, which is determined according to actual conditions and will not be elaborated here.

[0100] In this specific embodiment, a movable adjustment portion is provided on the heat dissipation structure 2, and the second heat transfer contact surface 21 is provided on the adjustment portion. During actual use, when the installation position of the heat conductor 1 changes, or the installation position of the heat conductor 1 shifts, the heat transfer protrusion and the heat transfer recess 211 can be matched by moving the adjustment portion, avoiding the relative position misalignment of the heat transfer protrusion and the heat transfer recess 211, so as to adapt to the situation where the heat generating element is installed in different positions, thereby further expanding the application scope of the heat dissipation device.

[0101] In addition to the heat dissipation device disclosed in the above embodiment, the present invention also provides a server including the above heat dissipation device. The heat dissipation structure 2 in the server for dissipating heat for the heat generating element can be a heat dissipation fin or a cold plate 22, or other structures that meet the requirements. The specific structure is determined according to actual conditions and will not be elaborated here.

[0102] It should also be noted that, in this specification, relational terms such as first and second, etc. are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "include" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, an element defined by the statement "comprises a ..." does not exclude the presence of other identical elements in the process, method, article or device including the element.

[0103] The heat dissipation device and server provided by the present invention are introduced in detail above. The various embodiments in the specification are described in a progressive manner, and each embodiment focuses on the differences from other embodiments. The same and similar parts between the various embodiments can be referenced to each other. For the system disclosed in the embodiment, since it corresponds to the method disclosed in the embodiment, the description is relatively simple, and the relevant parts can be referred to the method part description. It should be pointed out that for ordinary technicians in this technical field, without departing from the principle of the present invention, several improvements and modifications can be made to the present invention, and these improvements and modifications also fall within the scope of protection of the present invention.

Claims

1. A heat dissipation device, characterized in that: include: A heating device (3) is provided with a heating element, a first fixing structure and a second fixing structure; A heat conducting element (1) is provided with a first heat transfer contact surface (121) for contacting the heat generating element; the heat conducting element (1) is fixedly mounted on the first fixing structure; The heat dissipation structure (2) is a structure relatively independent from the heat conducting member (1), the heat dissipation structure is provided with a second heat transfer contact surface (21), and the heat dissipation structure (2) is used to dissipate the heat transferred by the heat conducting member (1); the heat dissipation structure (2) is fixedly mounted on the second fixed structure; When the heat conducting component (1) is fixed to the first fixing structure and the heat dissipation structure (2) is fixed to the second fixing structure, the second heat transfer contact surface (21) is in contact with the heat conducting component (1).

2. The heat dissipation device according to claim 1, characterized in that: The heat conducting member (1) is provided with a third heat transfer contact surface (111) for contacting the second heat transfer contact surface (21), the third heat transfer contact surface (111) is provided with a plurality of heat transfer protrusions, and the second heat transfer contact surface (21) is provided with a heat transfer recess (211) for cooperating with the heat transfer protrusions.

3. The heat dissipation device according to claim 2, characterized in that: The heat transfer convex portion is a sawtooth convex portion (112), or a wave-shaped convex portion, or a rectangular convex portion.

4. The heat dissipation device according to claim 2 or 3, characterized in that: The heat conducting member (1) comprises: Main body (11); A boss (12) protruding from the main body (11), the top end surface of the boss (12) being provided with the first heat transfer contact surface (121); A fixing portion (13) is arranged on the main body (11); at least one side of the boss (12) is provided with the fixing portion (13); the fixing portion (13) is used for being fixedly mounted on the heat generating device (3).

5. The heat dissipation device according to claim 4, characterized in that: The boss (12) comprises a third fixed structure connected to the main body (11) and a sliding structure; the sliding structure is movably arranged on the third fixed structure via a moving assembly, and the sliding structure is movably arranged along at least one direction; The third heat transfer contact surface (111) is provided on a side of the sliding structure facing away from the third fixed structure.

6. The heat dissipation device according to claim 1, characterized in that: A pressure detection component is provided between the second heat transfer contact surface (21) and the heat conductive component (1), and the pressure detection component is used to detect the contact pressure between the second heat transfer contact surface (21) and the heat conductive component (1); And / or, the first heat transfer contact surface (121) is provided with a heat-conducting coating for improving thermal conductivity, and the heat-conducting coating is used to contact the heat-generating element.

7. The heat dissipation device according to claim 1, characterized in that: The heating device (3) comprises a structural body (31) and the heating element, wherein the heating element is mounted on the structural body (31); The first fixing structure is arranged on the periphery of a position in the structural body (31) for installing the heating element; The second fixing structure is arranged on the outer peripheral edge of the structural body (31).

8. The heat dissipation device according to claim 7, characterized in that: One of the structural body (31) and the heat dissipation structure (2) is provided with a positioning convex column (311), and the other of the structural body (31) and the heat dissipation structure (2) is provided with a positioning hole for cooperating with the positioning convex column (311); At least one clamping assembly is provided on a side of the structural body (31) facing the heat dissipation structure (2), the clamping assembly comprising a mounting seat (312) fixedly provided on the structural body (31), and an elastic clamp (313) provided on the mounting seat (312) and rotatable between a first angle position and a second angle position; a portion of the positioning boss (311) extending out of the heat dissipation structure (2) is provided with a clamping groove (3111) cooperating with the elastic clamp (313); when the elastic clamp (313) is rotated to the first angle position, the elastic clamp (313) is clamped in the clamping groove (3111); when the elastic clamp (313) is rotated to the second angle position, the elastic clamp (313) is released from the clamping groove (3111); The heat dissipation device is provided with a first temperature detection element for detecting the surface temperature thereof and a heat dissipation fan, the heat dissipation structure (2) is a heat dissipation fin, and the heat dissipation fin is provided with a flow rate detection element for detecting the flow rate of gas flowing through the heat dissipation structure (2); The structural body (31) is provided with a mounting groove (314) for mounting the heating element, the thickness of the heating element is lower than the depth of the mounting groove (314), and when the first heat transfer contact surface (121) of the heat conductive element (1) contacts the heating element, the heat conductive element (1) is at least partially located in the mounting groove (314); The heat dissipation structure (2) comprises a heat dissipation body and an adjustment portion, wherein the adjustment portion is arranged on a side of the heat dissipation body facing the heat conductive element (1), and a second heat transfer contact surface (21) is arranged on the side of the adjustment portion facing the heat conductive element (1). The adjustment portion is adjustable at the installation position of the heat dissipation body to accommodate the heat generating element at different installation positions.

9. The heat dissipation device according to claim 8, characterized in that: The structural body (31) is provided with a display for displaying the temperature of the heating element, an alarm and a controller; the first temperature detection element is used to obtain temperature information of the heating element and transmit the temperature information to the controller; when the temperature information is outside a preset temperature range, the controller controls the alarm to issue a warning message; the display is arranged on the outside of the structural body (31).

10. A server, characterized in that: A heat dissipation device comprising any one of claims 1 to 9.

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