Method and system for improving corrosion resistance of bonding copper wire in plastic package integrated circuit

Abstract

The invention relates to the technical field of corrosion prevention, and discloses a method and system for improving the corrosion resistance of a bonding copper wire in a plastic package integrated circuit, and the method comprises the steps: recognizing a bonding position of a bonding copper wire product in the plastic package integrated circuit through a ray detection method, and carrying out the pretreatment of the copper wire at the bonding position; an initial corrosion inhibitor of the pretreated copper wire is selected through an alternating current impedance analysis method, the corrosion inhibitor concentration of the initial corrosion inhibitor is determined, and the initial corrosion inhibitor is converted into a target corrosion inhibitor according to the corrosion inhibitor concentration; the dipping time and dipping temperature of the pretreated copper wire in the target corrosion inhibitor are selected, and after the pretreated copper wire is dipped in the target corrosion inhibitor, the self-assembled film copper wire of the pretreated copper wire is prepared through the target corrosion inhibitor; constructing a first polarization curve of the pretreated copper wire and a second polarization curve of the self-assembled film copper wire, and detecting the anti-corrosion improvement degree of the self-assembled film copper wire; and determining a lifting result by using the target corrosion inhibitor. According to the invention, the environmental pollution degree caused by improper use of the corrosion inhibitor can be reduced.

Description

Technical Field

[0001] The present invention relates to the field of anti-corrosion technology, and in particular to a method and system for improving the anti-corrosion performance of bonding copper wires in plastic-sealed integrated circuits. Background Art

[0002] Bonding copper wire is a wire that can strengthen circuit connections and provide better conductivity. It is often used to encapsulate semiconductor chips and other electronic components. The purpose of extending the service life of bonding copper wire products can be achieved by improving their anti-corrosion properties to protect them from rust in plastic-encapsulated integrated circuits.

[0003] At present, corrosion inhibitors can be used to treat the copper surface to improve the oxidation resistance of bonding copper wire products. However, when this method is currently implemented, in some cases, the corrosion inhibitor will remain on the surface of the finished bonding copper wire products, thereby affecting the quality of the bonding copper wire products. Therefore, it is necessary to carefully consider the amount and quality of the corrosion inhibitor. Therefore, a solution is urgently needed to carefully consider the amount and quality of the corrosion inhibitor to reduce the environmental pollution caused by the use of inappropriate corrosion inhibitors. Summary of the invention

[0004] In order to solve the above problems, the present invention provides a method and system for improving the corrosion resistance of bonding copper wires in plastic-encapsulated integrated circuits, which can reduce the environmental pollution caused by the use of inappropriate corrosion inhibitors.

[0005] In a first aspect, the present invention provides a method for improving the corrosion resistance of bonding copper wires in a plastic-encapsulated integrated circuit, comprising:

[0006] Obtain a plastic-encapsulated integrated circuit, identify the bonding position of a bonding copper wire product in the plastic-encapsulated integrated circuit by using a ray detection method, and pre-treat the copper wire at the bonding position to obtain a pre-treated copper wire;

[0007] Selecting the initial corrosion inhibitor of the pretreated copper wire by AC impedance analysis, determining the corrosion inhibitor concentration of the initial corrosion inhibitor by using corrosion inhibitor samples of the initial corrosion inhibitor at different concentrations, and converting the initial corrosion inhibitor into a target corrosion inhibitor by using the corrosion inhibitor concentration;

[0008] Selecting an immersion time and an immersion temperature of the pretreated copper wire in the target corrosion inhibitor, and based on the immersion time and the immersion temperature, immersing the pretreated copper wire in the target corrosion inhibitor, and then using the target corrosion inhibitor to prepare a self-assembled film copper wire of the pretreated copper wire;

[0009] Based on preset electrochemical parameters, a first polarization curve of the pretreated copper wire is constructed, based on the electrochemical parameters, a second polarization curve of the self-assembled film copper wire is constructed, and the first polarization curve and the second polarization curve are used to detect the corrosion protection improvement degree of the self-assembled film copper wire;

[0010] According to the degree of improvement in corrosion resistance, the target corrosion inhibitor is used to determine the result of improving the corrosion resistance of the bonding copper wire product in the plastic-encapsulated integrated circuit.

[0011] In a possible implementation of the first aspect, the identifying the bonding position of the bonding copper wire product in the plastic-encapsulated integrated circuit by using a ray detection method includes:

[0012] Obtaining the X-ray machine, film, darkroom and film viewing lamp used in the X-ray detection method;

[0013] After placing the plastic-encapsulated integrated circuit between the radiation machine and the film, irradiating the plastic-encapsulated integrated circuit with radiation;

[0014] After the plastic-encapsulated integrated circuit is irradiated with radiation, collecting a radiation negative of the plastic-encapsulated integrated circuit from the film;

[0015] placing the radiographic film into the darkroom;

[0016] In the darkroom, developing the radiographic film to obtain a developed film;

[0017] Placing the developed film under the film viewing light;

[0018] Under the film viewing light, identifying the coordinates of pixels with consistent grayscale in the developed film;

[0019] Calculating the coordinate distance between each pixel point coordinate in the pixel point coordinates, and when the coordinate distance is less than a preset distance, aggregating the pixel point coordinates to obtain aggregated coordinates;

[0020] generating an aggregation plane of the aggregation coordinates;

[0021] Determining whether the aggregation plane has plane discontinuity;

[0022] When no plane discontinuity occurs in the aggregation plane;

[0023] Starting from the plane edge of the aggregation plane, constructing a circumscribed circular window in the aggregation plane;

[0024] Until the circumscribed circular window covers the aggregation plane, a fitting curve between the coordinates of the pixel points in the aggregation plane is generated by using a preset least square fitting method based on the coordinate center of the pixel point coordinates in the circumscribed circular window;

[0025] When the curve lengths between each of the fitting curves are consistent, the pixel coordinates corresponding to the fitting curve on the aggregation plane are used as the bonding position.

[0026] In a possible implementation manner of the first aspect, pre-treating the copper wire at the bonding position to obtain the pre-treated copper wire includes:

[0027] Obtain preset heating tools, cleaning tools, cleaning agents, copper chemical polishing liquids and chemical solutions;

[0028] Using the heating tool to heat and soften the plastic package shell of the plastic package integrated circuit to obtain a softened shell; after removing the softened shell using a cleaning tool, extracting the copper wire at the bonding position;

[0029] Using the cleaning agent to clean the dirt and grease on the surface of the copper wire to obtain a cleaned copper wire;

[0030] Polishing the surface of the cleaned copper wire using the copper material chemical polishing liquid to obtain a polished copper wire;

[0031] The polished copper wire is placed in the chemical solution, and the polished copper wire is pretreated in the chemical solution to obtain the pretreated copper wire.

[0032] In a possible implementation of the first aspect, the selecting the initial corrosion inhibitor for the pretreated copper wire by AC impedance analysis method includes:

[0033] Constructing a corrosion inhibitor sample of the pretreated copper wire;

[0034] After applying a sinusoidal AC signal to the corrosion inhibitor sample using the AC impedance analysis method, measuring a signal response of the corrosion inhibitor sample to the sinusoidal AC signal;

[0035] The initial corrosion inhibitor is selected from the corrosion inhibitor sample using the signal response.

[0036] In a possible implementation of the first aspect, determining the corrosion inhibitor concentration of the initial corrosion inhibitor by using corrosion inhibitor samples of the initial corrosion inhibitor at different concentrations includes:

[0037] Obtaining a preset equivalent circuit element;

[0038] placing the equivalent circuit elements in corrosion inhibitor samples at different concentrations respectively;

[0039] Performing electrochemical operation on the equivalent circuit element in the corrosion inhibitor sample to obtain electrochemical reaction parameters;

[0040] Performing parameter fitting processing on the electrochemical reaction parameters to obtain fitting parameters;

[0041] Based on the fitting parameters, distinguishing the electrochemical characteristics of corrosion inhibitor samples at different concentrations;

[0042] The corrosion inhibitor concentration of the initial corrosion inhibitor is confirmed from the initial corrosion inhibitors of different concentrations using the electrochemical characteristic difference.

[0043] In a possible implementation of the first aspect, the selecting the immersion time and immersion temperature of the pretreated copper wire in the target corrosion inhibitor includes:

[0044] Establishing the experimental time and experimental temperature of the target corrosion inhibitor;

[0045] Based on the experimental time and the experimental temperature, after immersing the pretreated copper wire into the target corrosion inhibitor, extracting the immersed copper wire from the target corrosion inhibitor;

[0046] The corrosion rate of the impregnated copper wire was calculated using the following formula:

[0047]

[0048] Where y represents the corrosion rate, S represents the surface area of ​​the pretreated copper wire exposed to the target corrosion inhibitor, m 2 Indicates the mass of the pretreated copper wire before it is immersed in the target corrosion inhibitor, m 1 It represents the mass of the pretreated copper wire after it is immersed in the target corrosion inhibitor, x 1 Indicates the experimental time;

[0049] The regression model between the corrosion rate, the experimental time and the experimental temperature is constructed using the following formula:

[0050] y=β 0 +β 1 x 1 +β 2 x 2

[0051] Where y = β 0 +β 1 x 1 +β 2 x 2 represents the regression model, y represents the corrosion rate, x represents 1 represents the experimental time, x 2 represents the experimental temperature, β 0 , β 1 , β 2 represents the regression coefficient;

[0052] The regression model is used to determine the immersion time and immersion temperature in the target corrosion inhibitor from the experimental time and the experimental temperature.

[0053] In a possible implementation of the first aspect, the method of preparing the self-assembled copper wire of the pretreated copper wire by using the target corrosion inhibitor includes:

[0054] immersing the pretreated copper wire in the target corrosion inhibitor;

[0055] In the target corrosion inhibitor, a chemical reaction between the anode and cathode of the pretreated copper wire is blocked;

[0056] After blocking the chemical reaction between the anode and cathode of the pretreated copper wire, subjecting the monomolecular layer of the pretreated copper wire to carbon chain interaction;

[0057] When the monomolecular layer of the pretreated copper wire is stabilized by carbon chain interaction, the self-assembled film copper wire of the pretreated copper wire is determined.

[0058] In a possible implementation manner of the first aspect, constructing a first polarization curve of the pretreated copper wire based on preset electrochemical parameters includes:

[0059] Obtain a preset electrolyte solution and a potentiostat;

[0060] After inserting the pretreated copper wire into the electrolyte solution, connecting the pretreated copper wire to the potentiostat;

[0061] Detecting the copper wire current of the pretreated copper wire at a preset electrode potential on the potentiostat;

[0062] The first polarization curve of the pretreated copper wire is constructed with the electrode potential as the abscissa and the copper wire current as the ordinate.

[0063] In a possible implementation of the first aspect, the detecting the corrosion protection improvement degree of the self-assembled film copper wire by using the first polarization curve and the second polarization curve includes:

[0064] acquiring a first potential in the first polarization curve and a second potential in the second polarization curve;

[0065] calculating an absolute value of a potential difference between the first potential and the second potential;

[0066] When the absolute value of the potential difference is greater than the preset absolute value of the potential difference, calculating the corrosion inhibition efficiency of the self-assembled film copper wire;

[0067] According to the corrosion inhibition efficiency, calculating the self-assembled film coverage of the self-assembled film copper wire;

[0068] The coverage of the self-assembled film is taken as the corrosion protection improvement degree.

[0069] In a second aspect, the present invention provides a system for improving the corrosion resistance of bonding copper wires in plastic-encapsulated integrated circuits, the system comprising:

[0070] A position identification module is used to obtain a plastic-encapsulated integrated circuit, identify the bonding position of a bonding copper wire product in the plastic-encapsulated integrated circuit by using a ray detection method, and pre-treat the copper wire at the bonding position to obtain a pre-treated copper wire;

[0071] A corrosion inhibitor selection module, for selecting an initial corrosion inhibitor for the pretreated copper wire by an AC impedance analysis method, determining the corrosion inhibitor concentration of the initial corrosion inhibitor by using corrosion inhibitor samples of the initial corrosion inhibitor at different concentrations, and converting the initial corrosion inhibitor into a target corrosion inhibitor by using the corrosion inhibitor concentration;

[0072] A variable control module, for selecting an immersion time and an immersion temperature of the pretreated copper wire in the target corrosion inhibitor, and after immersing the pretreated copper wire in the target corrosion inhibitor based on the immersion time and the immersion temperature, using the target corrosion inhibitor to prepare a self-assembled film copper wire of the pretreated copper wire;

[0073] A curve construction module, for constructing a first polarization curve of the pretreated copper wire based on preset electrochemical parameters, constructing a second polarization curve of the self-assembled film copper wire based on the electrochemical parameters, and detecting the corrosion protection improvement degree of the self-assembled film copper wire using the first polarization curve and the second polarization curve;

[0074] A result analysis module is used to determine the corrosion resistance improvement result of the bonding copper wire product in the plastic-encapsulated integrated circuit using the target corrosion inhibitor according to the corrosion resistance improvement degree.

[0075] Compared with the prior art, the technical principle and beneficial effects of this solution are:

[0076] The embodiment of the present invention uses a ray detection method to identify the bonding position of the bonding copper wire product in the plastic-encapsulated integrated circuit, so as to more accurately analyze and simulate the specific parameters of the object to be studied, thereby facilitating subsequent operations. Furthermore, the embodiment of the present invention pre-treats the copper wire at the bonding position to obtain a pre-treated copper wire, which is used to remove the oxide layer, stains and other impurities on the surface of the copper wire, thereby reducing the impact on subsequent processing or testing. The embodiment of the present invention selects the initial corrosion inhibitor of the pre-treated copper wire through an AC impedance analysis method, which is used to protect metal materials, extend the service life of equipment, ensure the safety of the production process, and reduce water treatment costs. At the same time, the treatment effect is improved, bringing economic benefits to the enterprise. Furthermore, the embodiment of the present invention determines the corrosion inhibitor concentration of the initial corrosion inhibitor by using corrosion inhibitor samples of the initial corrosion inhibitor at different concentrations, so as to infer the situation affecting the state variables in the electrode process from the number of time constants contained in the impedance spectrum and the size of their values. It is also possible to obtain information about the solution resistance, double-layer capacitance and charge transfer resistance between the reference electrode and the working electrode in different frequency ranges in the impedance spectrum of a single time constant. Information, the embodiment of the present invention selects the immersion time and immersion temperature of the pretreated copper wire in the target corrosion inhibitor to control all variables that can cause copper wire corrosion changes except the anti-corrosion performance of the corrosion inhibitor, thereby reducing the influence of other factors on the experimental results. Further, the embodiment of the present invention prepares the self-assembled film copper wire of the pretreated copper wire by using the target corrosion inhibitor to improve the corrosion resistance of the metal material, extend its service life, and reduce maintenance costs. By forming a protective film on the metal surface, the contact between the metal and the corrosive medium can be prevented or slowed down, thereby reducing the occurrence of corrosion reactions. The embodiment of the present invention constructs a first polarization curve of the pretreated copper wire and a second polarization curve of the self-assembled film copper wire based on preset electrochemical parameters, so as to more intuitively observe the relationship and change trend between the two variables, and then obtain a comparison result to achieve the experimental purpose. Further, the embodiment of the present invention detects the anti-corrosion improvement of the self-assembled film copper wire by using the first polarization curve and the second polarization curve, so as to more intuitively observe the change trend of the experimental results after the addition of the corrosion inhibitor, thereby judging whether the experimental results are expected results. Therefore, the method and system for improving the corrosion resistance of bonding copper wires in plastic-encapsulated integrated circuits provided in the embodiments of the present invention can reduce the environmental pollution caused by the use of inappropriate corrosion inhibitors. BRIEF DESCRIPTION OF THE DRAWINGS

[0077] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0078] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative labor.

[0079] Figure 1 A schematic flow chart of a method for improving the corrosion resistance of bonding copper wires in a plastic-encapsulated integrated circuit provided by an embodiment of the present invention;

[0080] Figure 2 A schematic diagram of a module of a system for improving the corrosion resistance of bonding copper wires in a plastic-encapsulated integrated circuit provided by an embodiment of the present invention. DETAILED DESCRIPTION

[0081] It should be understood that the specific embodiments described herein are only used to explain the present invention, and are not used to limit the present invention.

[0082] The embodiment of the present invention provides a method for improving the corrosion resistance of bonding copper wires in plastic-encapsulated integrated circuits. The execution subject of the method for improving the corrosion resistance of bonding copper wires in plastic-encapsulated integrated circuits includes but is not limited to at least one of the electronic devices that can be configured to execute the method provided by the embodiment of the present invention, such as a server and a terminal. In other words, the method for improving the corrosion resistance of bonding copper wires in plastic-encapsulated integrated circuits can be executed by software or hardware installed in a terminal device or a server device, and the software can be a blockchain platform. The server includes but is not limited to: a single server, a server cluster, a cloud server or a cloud server cluster, etc. The server can be an independent server, or it can be a cloud server that provides cloud services, cloud databases, cloud computing, cloud functions, cloud storage, network services, cloud communications, middleware services, domain name services, security services, content delivery networks (Content Delivery Network, CDN), and basic cloud computing services such as big data and artificial intelligence platforms.

[0083] See also Figure 1 FIG. 1 is a flow chart of a method for improving the corrosion resistance of bonding copper wires in a plastic-encapsulated integrated circuit according to an embodiment of the present invention. Figure 1 The methods described in the article for improving the corrosion resistance of copper bonding wires in plastic packaged integrated circuits include:

[0084] S1. Obtain a plastic-encapsulated integrated circuit, identify the bonding position of a bonding copper wire product in the plastic-encapsulated integrated circuit by using a ray detection method, and pre-treat the copper wire at the bonding position to obtain a pre-treated copper wire.

[0085] The embodiment of the present invention uses a ray detection method to identify the bonding position of the bonding copper wire product in the plastic-encapsulated integrated circuit, so as to more accurately analyze and simulate the specific parameters of the object to be studied, thereby facilitating subsequent operations.

[0086] Among them, the X-ray detection method refers to a non-destructive testing technology, which mainly uses the attenuation characteristics of X-rays and gamma rays when penetrating objects to detect defects and discontinuities inside the material. Its basic principle is that when the rays pass through the object being inspected, if there are defects or structural differences inside the object, the intensity of the rays will change. This change will appear as different degrees of grayscale differences on the X-ray film or digital image, thereby making the defects visible.

[0087] In one embodiment of the present invention, the method of using a radiation detection method to identify the bonding position of the bonding copper wire product in the plastic-encapsulated integrated circuit includes: obtaining a radiation machine, a film, a darkroom, and a film viewing light in the radiation detection method; placing the plastic-encapsulated integrated circuit between the radiation machine and the film, and then irradiating the plastic-encapsulated integrated circuit with radiation; after irradiating the plastic-encapsulated integrated circuit with radiation, collecting a radiation film of the plastic-encapsulated integrated circuit from the film; placing the radiation film into the darkroom; in the darkroom, developing the radiation film to obtain a developed film; placing the developed film under the film viewing light; identifying the coordinates of pixel points with consistent grayscale in the developed film under the film viewing light; calculating the coordinates of each pixel point in the pixel coordinates The coordinate distance between pixel point coordinates, when the coordinate distance is less than a preset distance, the pixel point coordinates are aggregated to obtain aggregated coordinates; an aggregate plane of the aggregated coordinates is generated; it is determined whether the aggregate plane has plane incoherence; when the aggregate plane does not have plane incoherence; starting from the plane edge of the aggregate plane, a circumscribed circular window is constructed in the aggregate plane; until the circumscribed circular window covers the aggregate plane, a fitting curve between the pixel point coordinates in the aggregate plane is generated based on the coordinate center of the pixel point coordinates in the circumscribed circular window using a preset least squares fitting method; when the curve lengths between each fitting curve in the fitting curve are consistent, the pixel point coordinates corresponding to the fitting curve on the aggregate plane are used as the bonding position.

[0088] Optionally, the purpose of aggregating the pixel point coordinates to obtain the aggregated coordinates is to aggregate the pixel point coordinates whose coordinate distance is less than a preset distance into pixel point coordinates on the same aggregated plane. Furthermore, the process of judging whether the aggregated plane has planar incoherence refers to the process of judging whether the edges between every two aggregated planes are continuous. Furthermore, starting from the planar edge of the aggregated plane, the process of constructing a circumscribed circular window in the aggregated plane refers to pre-setting a circle of a fixed size, starting from the planar edge of the aggregated plane, and covering the circle of the fixed size on the aggregated plane, that is, the aggregated plane contains multiple circumscribed circular windows. It should be noted that the bonding position is the location of the regularly distributed copper wires, and the above-mentioned fitting curves when the curve lengths between each fitting curve in the fitting curve are consistent are copper wires of consistent length.

[0089] Furthermore, the embodiment of the present invention pre-treats the copper wire at the bonding position to obtain a pre-treated copper wire, which is used to remove the oxide layer, stains and other impurities on the surface of the copper wire to reduce the impact on subsequent processing or testing.

[0090] In one embodiment of the present invention, the copper wire at the bonding position is pretreated to obtain the pretreated copper wire, including: obtaining a preset heating tool, a cleaning tool, a cleaning agent, a copper material chemical polishing liquid and a chemical liquid; using the heating tool to heat and soften the plastic package shell of the plastic packaged integrated circuit to obtain a softened shell; after removing the softened shell using a cleaning tool, the copper wire is extracted from the bonding position; using the cleaning agent to clean dirt and grease on the surface of the copper wire to obtain a cleaned copper wire; using the copper material chemical polishing liquid to polish the surface of the cleaned copper wire to obtain a polished copper wire; placing the polished copper wire in the chemical liquid, and pretreating the polished copper wire in the chemical liquid to obtain a pretreated copper wire.

[0091] Among them, the copper wire at the bonding position refers to the lead between the chip and the frame, which can realize the important role of the chip interacting with the external current and signal. The least squares fitting method refers to a mathematical optimization technology that finds the best function match for the data by minimizing the sum of squares of errors.

[0092] S2. Selecting the initial corrosion inhibitor of the pretreated copper wire by AC impedance analysis, determining the corrosion inhibitor concentration of the initial corrosion inhibitor using corrosion inhibitor samples of the initial corrosion inhibitor at different concentrations, and converting the initial corrosion inhibitor into a target corrosion inhibitor using the corrosion inhibitor concentration.

[0093] The embodiment of the present invention selects the initial corrosion inhibitor of the pretreated copper wire through the AC impedance analysis method to protect metal materials, extend the service life of equipment, ensure the safety of the production process, and reduce water treatment costs while improving the treatment effect, bringing economic benefits to the enterprise.

[0094] Among them, the AC impedance analysis method refers to controlling the current passing through the electrochemical system or the system's potential to change sinusoidally over time under small amplitude conditions, while measuring the corresponding system potential or current changes over time, or directly measuring the system's AC impedance, and then analyzing the reaction mechanism of the electrochemical system and calculating the relevant parameters of the system.

[0095] In one embodiment of the present invention, the initial corrosion inhibitor of the pretreated copper wire is selected by AC impedance analysis, comprising: constructing a corrosion inhibitor sample of the pretreated copper wire; after applying a sinusoidal AC signal to the corrosion inhibitor sample by the AC impedance analysis method, measuring the signal response of the corrosion inhibitor sample to the sinusoidal AC signal; and selecting the initial corrosion inhibitor from the corrosion inhibitor sample by using the signal response.

[0096] Furthermore, the embodiment of the present invention determines the corrosion inhibitor concentration of the initial corrosion inhibitor by utilizing corrosion inhibitor samples at different concentrations of the initial corrosion inhibitor, so as to infer the conditions affecting the state variables in the electrode process from the number of time constants contained in the impedance spectrum and the magnitude of their values. It is also possible to obtain information about the solution resistance, double layer capacitance and charge transfer resistance between the reference electrode and the working electrode in different frequency ranges from the measured impedance spectrum of a single time constant.

[0097] The impedance spectrum fitting parameters refer to characteristic parameters used to describe the dynamic response of the electrochemical system in electrochemical impedance spectrum analysis.

[0098] In one embodiment of the present invention, the corrosion inhibitor concentration of the initial corrosion inhibitor is determined by using corrosion inhibitor samples at different concentrations of the initial corrosion inhibitor, including: obtaining a preset equivalent circuit element; placing the equivalent circuit element in corrosion inhibitor samples at different concentrations, respectively; performing electrochemical operations on the equivalent circuit element in the corrosion inhibitor sample to obtain electrochemical reaction parameters; performing parameter fitting processing on the electrochemical reaction parameters to obtain fitting parameters; based on the fitting parameters, distinguishing the difference in electrochemical properties between corrosion inhibitor samples at different concentrations; and confirming the corrosion inhibitor concentration of the initial corrosion inhibitor from the initial corrosion inhibitors of different concentrations using the difference in electrochemical properties.

[0099] Among them, equivalent circuit elements refer to electrical characteristics and digital models based on actual circuits, which are used to replace complex structures in actual circuits or simplified models in processes in circuit analysis. Electrochemical properties refer to the properties of substances in electrochemical processes, such as conductivity, and the mutual conversion between designed electrical energy and chemical energy.

[0100] S3, selecting the immersion time and immersion temperature of the pretreated copper wire in the target corrosion inhibitor, and based on the immersion time and the immersion temperature, immersing the pretreated copper wire in the target corrosion inhibitor, and then using the target corrosion inhibitor to prepare a self-assembled film copper wire of the pretreated copper wire.

[0101] The embodiment of the present invention selects the immersion time and immersion temperature of the pretreated copper wire in the target corrosion inhibitor to control all variables that can cause corrosion changes of the copper wire except the anti-corrosion performance of the corrosion inhibitor, thereby reducing the influence of other factors on the experimental results.

[0102] In one embodiment of the present invention, the immersion time and immersion temperature of the pretreated copper wire in the target corrosion inhibitor are selected, including: constructing the experimental time and experimental temperature of the target corrosion inhibitor; based on the experimental time and the experimental temperature, after immersing the pretreated copper wire into the target corrosion inhibitor, extracting the immersed copper wire from the target corrosion inhibitor; and calculating the corrosion rate of the immersed copper wire using the following formula:

[0103]

[0104] Where y represents the corrosion rate, S represents the surface area of ​​the pretreated copper wire exposed to the target corrosion inhibitor, m 2 Indicates the mass of the pretreated copper wire before it is immersed in the target corrosion inhibitor, m 1 It represents the mass of the pretreated copper wire after it is immersed in the target corrosion inhibitor, x 1 Indicates the experimental time;

[0105] The regression model between the corrosion rate, the experimental time and the experimental temperature is constructed using the following formula:

[0106] y=β 0 +β 1 x 1 +β 2 x 2

[0107] Where y = β 0 +β 1 x 1 +β 2 x 2 represents the regression model, y represents the corrosion rate, x represents 1 represents the experimental time, x 2 represents the experimental temperature, β 0 , β 1 , β 2 represents the regression coefficient;

[0108] The regression model is used to determine the immersion time and immersion temperature in the target corrosion inhibitor from the experimental time and the experimental temperature.

[0109] Furthermore, the embodiment of the present invention uses the target corrosion inhibitor to prepare the self-assembled film copper wire of the pretreated copper wire, so as to improve the corrosion resistance of the metal material, extend its service life, and reduce maintenance costs. By forming a protective film on the metal surface, the contact between the metal and the corrosive medium can be prevented or slowed down, thereby reducing the occurrence of corrosion reactions.

[0110] The self-assembled membrane refers to a monolayer formed on a solid surface through non-covalent interactions between molecules. This membrane has a highly ordered and tightly arranged structure, and its thickness is usually between a few tenths of a nanometer and several nanometers.

[0111] In one embodiment of the present invention, the use of the target corrosion inhibitor to prepare the self-assembled film copper wire of the pretreated copper wire includes: immersing the pretreated copper wire in the target corrosion inhibitor; in the target corrosion inhibitor, blocking the chemical reaction between the anode and the cathode of the pretreated copper wire; after blocking the chemical reaction between the anode and the cathode of the pretreated copper wire, subjecting the monomolecular layer of the pretreated copper wire to carbon chain interaction; when the carbon chain interaction of the monomolecular layer of the pretreated copper wire is stable, determining the self-assembled film copper wire of the pretreated copper wire.

[0112] Carbon chain interactions refer to the long chain structures formed by carbon atoms connected to each other through single bonds, double bonds or triple bonds in organic compounds. These carbon chains are the basic skeletons of most organic compounds. The length and structure of the carbon chain determine the physical and chemical properties of organic compounds and their functions in organisms.

[0113] S4. Based on preset electrochemical parameters, construct a first polarization curve of the pretreated copper wire, based on the electrochemical parameters, construct a second polarization curve of the self-assembled film copper wire, and use the first polarization curve and the second polarization curve to detect the corrosion protection improvement of the self-assembled film copper wire.

[0114] The embodiment of the present invention constructs a first polarization curve of the pretreated copper wire and a second polarization curve of the self-assembled film copper wire based on preset electrochemical parameters, so as to more intuitively observe the relationship and change trend between the two variables, and then obtain a comparison result to achieve the experimental purpose.

[0115] The electrochemical parameters refer to important physical quantities that describe the kinetics and thermodynamic properties of electrochemical reactions, and play a key role in electrochemical research and industrial applications.

[0116] The first polarization curve and the second polarization curve refer to a curve representing the relationship between electrode potential and polarization current or polarization current density, which is of great significance in the study of metal corrosion, battery reaction, electroplating and the like.

[0117] In one embodiment of the present invention, constructing the first polarization curve of the pretreated copper wire based on preset electrochemical parameters includes: obtaining a preset electrolyte solution and a constant potential instrument; after inserting the pretreated copper wire into the electrolyte solution, connecting the pretreated copper wire to the constant potential instrument; detecting the copper wire current of the pretreated copper wire at a preset electrode potential on the constant potential instrument; and constructing the first polarization curve of the pretreated copper wire with the electrode potential as the horizontal coordinate and the copper wire current as the vertical coordinate.

[0118] Furthermore, the embodiment of the present invention uses the first polarization curve and the second polarization curve to detect the corrosion protection improvement of the self-assembled film copper wire, so as to more intuitively observe the changing trend of the experimental results after the corrosion inhibitor is added, thereby judging whether the experimental results are expected results.

[0119] In one embodiment of the present invention, the use of the first polarization curve and the second polarization curve to detect the corrosion protection improvement of the self-assembled film copper wire includes: obtaining a first potential in the first polarization curve and a second potential in the second polarization curve; calculating the absolute value of the potential difference between the first potential and the second potential; when the absolute value of the potential difference is greater than a preset absolute value of the difference, calculating the corrosion inhibition efficiency of the self-assembled film copper wire using the following formula;

[0120] According to the corrosion inhibition efficiency, the self-assembled film coverage of the self-assembled film copper wire is calculated using the following formula;

[0121] The coverage of the self-assembled film is taken as the corrosion protection improvement degree.

[0122] Among them, the potential electrode refers to a device for measuring the electrode potential, which can be any type of electrode, such as a metal electrode, a semiconductor electrode, etc. The working principle of the potential electrode is to determine the redox properties of the solution by measuring the potential difference between the electrode and the solution (i.e., the electrode potential). The polarization current refers to the current caused by the change in the polarity of the molecules inside the dielectric during the polarization process. The polarization current density refers to a physical quantity that measures the charge separation process of a medium under the action of an electric field. It reflects the charge movement generated inside the medium due to the action of the electric field. This movement forms an electric current. The corrosion current density is the polarization current density.

[0123] S5. According to the corrosion resistance improvement degree, the target corrosion inhibitor is used to determine the corrosion resistance improvement result of the bonding copper wire product in the plastic-encapsulated integrated circuit.

[0124] It can be seen that the embodiment of the present invention uses the ray detection method to identify the bonding position of the bonding copper wire product in the plastic-encapsulated integrated circuit, so as to more accurately analyze and simulate the specific parameters of the object to be studied, and provide convenience for subsequent operations. Furthermore, the embodiment of the present invention obtains the pretreated copper wire by pretreating the copper wire at the bonding position, so as to remove the oxide layer, stains and other impurities on the surface of the copper wire, and reduce the impact for subsequent processing or testing. The embodiment of the present invention selects the initial corrosion inhibitor of the pretreated copper wire by the AC impedance analysis method, so as to protect metal materials, extend the service life of equipment, ensure the safety of the production process, and reduce the cost of water treatment. At the same time, it improves the treatment effect and brings economic benefits to the enterprise. Furthermore, the embodiment of the present invention determines the corrosion inhibitor concentration of the initial corrosion inhibitor by using the corrosion inhibitor samples of the initial corrosion inhibitor at different concentrations, so as to infer the situation affecting the state variables in the electrode process from the number of time constants contained in the impedance spectrum and the size of their values. It can also obtain the solution resistance, double layer capacitance and charge transfer between the reference electrode and the working electrode in different frequency ranges in the impedance spectrum of the measured single time constant. The information of the resistance of the transmission is obtained. In the embodiment of the present invention, the immersion time and immersion temperature of the pretreated copper wire in the target corrosion inhibitor are selected to control all variables that can cause the corrosion of the copper wire except the anti-corrosion performance of the corrosion inhibitor, thereby reducing the influence of other factors on the experimental results. Further, in the embodiment of the present invention, the self-assembled film copper wire of the pretreated copper wire is prepared by using the target corrosion inhibitor to improve the corrosion resistance of the metal material, extend its service life, and reduce the maintenance cost. By forming a protective film on the metal surface, the contact between the metal and the corrosive medium can be prevented or slowed down, thereby reducing the occurrence of corrosion reactions. In the embodiment of the present invention, based on preset electrochemical parameters, a first polarization curve of the pretreated copper wire is constructed, and a second polarization curve of the self-assembled film copper wire is constructed, so that the relationship and change trend between the two variables can be more intuitively observed, and then a comparison result is obtained to achieve the experimental purpose. Further, in the embodiment of the present invention, the anti-corrosion improvement degree of the self-assembled film copper wire is detected by using the first polarization curve and the second polarization curve, so as to more intuitively observe the change trend of the experimental results after the addition of the corrosion inhibitor, thereby judging whether the experimental results are expected results. Therefore, the method and system for improving the corrosion resistance of bonding copper wires in plastic-encapsulated integrated circuits provided in the embodiments of the present invention can reduce the environmental pollution caused by the use of inappropriate corrosion inhibitors.

[0125] like Figure 2 As shown, it is a functional module diagram of the system for improving the corrosion resistance of bonding copper wire in plastic-encapsulated integrated circuits of the present invention.

[0126] The system 200 for improving the corrosion resistance of bonding copper wire in plastic-encapsulated integrated circuits of the present invention can be installed in electronic devices. According to the functions to be implemented, the system for improving the corrosion resistance of bonding copper wire in plastic-encapsulated integrated circuits can include a position identification module 201, a corrosion inhibitor selection module 202, a variable control module 203, a curve construction module 204 and a result analysis module 205. The module of the present invention can also be called a unit, which refers to a series of computer program segments that can be executed by an electronic device processor and can complete fixed functions, which are stored in the memory of the electronic device.

[0127] In the embodiment of the present invention, the functions of each module / unit are as follows:

[0128] The position identification module 201 is used to obtain a plastic-encapsulated integrated circuit, identify the bonding position of the bonding copper wire product in the plastic-encapsulated integrated circuit by using a ray detection method, and pre-treat the copper wire at the bonding position to obtain a pre-treated copper wire;

[0129] The corrosion inhibitor selection module 202 is used to select the initial corrosion inhibitor of the pretreated copper wire by AC impedance analysis, determine the corrosion inhibitor concentration of the initial corrosion inhibitor by using corrosion inhibitor samples of the initial corrosion inhibitor at different concentrations, and convert the initial corrosion inhibitor into a target corrosion inhibitor by using the corrosion inhibitor concentration;

[0130] The variable control module 203 is used to select the immersion time and immersion temperature of the pretreated copper wire in the target corrosion inhibitor, and after immersing the pretreated copper wire in the target corrosion inhibitor based on the immersion time and the immersion temperature, use the target corrosion inhibitor to prepare a self-assembled film copper wire of the pretreated copper wire;

[0131] The curve construction module 204 is used to construct a first polarization curve of the pretreated copper wire based on preset electrochemical parameters, construct a second polarization curve of the self-assembled film copper wire based on the electrochemical parameters, and use the first polarization curve and the second polarization curve to detect the corrosion protection improvement of the self-assembled film copper wire;

[0132] The result analysis module 205 is used to determine the corrosion resistance improvement result of the bonding copper wire product in the plastic-encapsulated integrated circuit by using the target corrosion inhibitor according to the corrosion resistance improvement degree.

[0133] In detail, the modules in the system 200 for improving the corrosion resistance of bonding copper wires in plastic-encapsulated integrated circuits in the embodiment of the present invention are used in the same manner as described above. Figure 1 The same technical means as described in the method for improving the corrosion resistance of bonding copper wire in plastic-encapsulated integrated circuits can produce the same technical effects, so they will not be repeated here.

[0134] In addition, each functional module in each embodiment of the present invention may be integrated into one processing unit, each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of hardware plus software functional modules.

[0135] It is obvious to those skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and that the present invention can be implemented in other specific forms without departing from the spirit or essential characteristics of the present invention.

[0136] Therefore, no matter from which point of view, the embodiments should be regarded as illustrative and non-restrictive, and the scope of the present invention is limited by the appended claims rather than the above description, so it is intended that all changes falling within the meaning and scope of the equivalent elements of the claims are included in the present invention. Any attached figure mark in the claims should not be regarded as limiting the claims involved.

[0137] It should be noted that, in this article, relational terms such as "first" and "second" are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "include", "comprise" or any other variants thereof are intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such process, method, article or device. In the absence of further restrictions, the elements defined by the sentence "comprise a ..." do not exclude the existence of other identical elements in the process, method, article or device including the elements.

[0138] The above description is only a specific embodiment of the present invention, so that those skilled in the art can understand or implement the present invention. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but should conform to the widest scope consistent with the principles and novel features invented herein.

Claims

1. A method for improving the corrosion resistance of bonding copper wires in plastic-sealed integrated circuits, characterized in that: The method comprises: Obtain a plastic-encapsulated integrated circuit, identify the bonding position of a bonding copper wire product in the plastic-encapsulated integrated circuit by using a ray detection method, and pre-treat the copper wire at the bonding position to obtain a pre-treated copper wire; Selecting the initial corrosion inhibitor of the pretreated copper wire by AC impedance analysis, determining the corrosion inhibitor concentration of the initial corrosion inhibitor by using corrosion inhibitor samples of the initial corrosion inhibitor at different concentrations, and converting the initial corrosion inhibitor into a target corrosion inhibitor by using the corrosion inhibitor concentration; Selecting an immersion time and an immersion temperature of the pretreated copper wire in the target corrosion inhibitor, and based on the immersion time and the immersion temperature, immersing the pretreated copper wire in the target corrosion inhibitor, and then using the target corrosion inhibitor to prepare a self-assembled film copper wire of the pretreated copper wire; Based on preset electrochemical parameters, a first polarization curve of the pretreated copper wire is constructed, based on the electrochemical parameters, a second polarization curve of the self-assembled film copper wire is constructed, and the first polarization curve and the second polarization curve are used to detect the corrosion protection improvement degree of the self-assembled film copper wire; According to the degree of improvement in corrosion resistance, the target corrosion inhibitor is used to determine the result of improving the corrosion resistance of the bonding copper wire product in the plastic-encapsulated integrated circuit.

2. The method according to claim 1, characterized in that The method of using a ray detection method to identify the bonding position of the bonding copper wire product in the plastic-encapsulated integrated circuit includes: Obtaining the X-ray machine, film, darkroom and film viewing lamp used in the X-ray detection method; After placing the plastic-encapsulated integrated circuit between the radiation machine and the film, irradiating the plastic-encapsulated integrated circuit with radiation; After the plastic-encapsulated integrated circuit is irradiated with radiation, collecting a radiation negative of the plastic-encapsulated integrated circuit from the film; placing the radiographic film into the darkroom; In the darkroom, developing the radiographic film to obtain a developed film; Placing the developed film under the film viewing light; Under the film viewing light, identifying the coordinates of pixels with consistent grayscale in the developed film; Calculating the coordinate distance between each pixel point coordinate in the pixel point coordinates, and when the coordinate distance is less than a preset distance, aggregating the pixel point coordinates to obtain aggregated coordinates; generating an aggregation plane of the aggregation coordinates; Determining whether the aggregation plane has plane discontinuity; When no plane discontinuity occurs in the aggregation plane; Starting from the plane edge of the aggregation plane, constructing a circumscribed circular window in the aggregation plane; Until the circumscribed circular window covers the aggregation plane, a fitting curve between the coordinates of the pixel points in the aggregation plane is generated by using a preset least square fitting method based on the coordinate center of the pixel point coordinates in the circumscribed circular window; When the curve lengths between each of the fitting curves are consistent, the pixel coordinates corresponding to the fitting curve on the aggregation plane are used as the bonding position.

3. The method according to claim 1, characterized in that The pre-treating the copper wire at the bonding position to obtain the pre-treated copper wire comprises: Obtain preset heating tools, cleaning tools, cleaning agents, copper chemical polishing liquids and chemical solutions; Using the heating tool to heat and soften the plastic-encapsulated shell of the plastic-encapsulated integrated circuit to obtain a softened shell; After removing the softened shell using a cleaning tool, extracting the copper wire in the bonding location; Using the cleaning agent to clean the dirt and grease on the surface of the copper wire to obtain a cleaned copper wire; Polishing the surface of the cleaned copper wire using the copper material chemical polishing liquid to obtain a polished copper wire; The polished copper wire is placed in the chemical solution, and the polished copper wire is pretreated in the chemical solution to obtain the pretreated copper wire.

4. The method according to claim 1, characterized in that The method of selecting the initial corrosion inhibitor for the pretreated copper wire by AC impedance analysis includes: Constructing a corrosion inhibitor sample of the pretreated copper wire; After applying a sinusoidal AC signal to the corrosion inhibitor sample using the AC impedance analysis method, measuring a signal response of the corrosion inhibitor sample to the sinusoidal AC signal; The initial corrosion inhibitor is selected from the corrosion inhibitor sample using the signal response.

5. The method according to claim 1, characterized in that The method of using the corrosion inhibitor samples of the initial corrosion inhibitor at different concentrations to determine the corrosion inhibitor concentration of the initial corrosion inhibitor comprises: Obtaining a preset equivalent circuit element; placing the equivalent circuit element in corrosion inhibitor samples at different concentrations; Performing electrochemical operation on the equivalent circuit element in the corrosion inhibitor sample to obtain electrochemical reaction parameters; Performing parameter fitting processing on the electrochemical reaction parameters to obtain fitting parameters; Based on the fitting parameters, distinguishing the electrochemical characteristics of corrosion inhibitor samples at different concentrations; The corrosion inhibitor concentration of the initial corrosion inhibitor is confirmed from the initial corrosion inhibitors of different concentrations using the electrochemical characteristic difference.

6. The method according to claim 1, characterized in that The step of selecting the immersion time and temperature of the pretreated copper wire in the target corrosion inhibitor comprises: Establishing the experimental time and experimental temperature of the target corrosion inhibitor; Based on the experimental time and the experimental temperature, after immersing the pretreated copper wire into the target corrosion inhibitor, extracting the immersed copper wire from the target corrosion inhibitor; The corrosion rate of the impregnated copper wire was calculated using the following formula: Where y represents the corrosion rate, S represents the surface area of ​​the pretreated copper wire exposed to the target corrosion inhibitor, m 2 Indicates the mass of the pretreated copper wire before it is immersed in the target corrosion inhibitor, m 1 represents the mass of the pretreated copper wire after it is immersed in the target corrosion inhibitor, and x1 represents the experimental time; The regression model between the corrosion rate, the experimental time and the experimental temperature is constructed using the following formula: y=β0+β1+β2x2 Among them, y = β0 + β1x1 + β2x2 represents the regression model, y represents the corrosion rate, x1 represents the experimental time, x2 represents the experimental temperature, β0, β1, β2 represent the regression coefficients; The regression model is used to determine the immersion time and immersion temperature in the target corrosion inhibitor from the experimental time and the experimental temperature.

7. The method according to claim 1, characterized in that The method of preparing the self-assembled copper wire of the pretreated copper wire by using the target corrosion inhibitor comprises: immersing the pretreated copper wire in the target corrosion inhibitor; In the target corrosion inhibitor, a chemical reaction between the anode and cathode of the pretreated copper wire is blocked; After blocking the chemical reaction between the anode and cathode of the pretreated copper wire, subjecting the monomolecular layer of the pretreated copper wire to carbon chain interaction; When the monomolecular layer of the pretreated copper wire is stabilized by carbon chain interaction, the self-assembled film copper wire of the pretreated copper wire is determined.

8. The method according to claim 1, characterized in that The step of constructing a first polarization curve of the pretreated copper wire based on preset electrochemical parameters comprises: Obtain a preset electrolyte solution and a potentiostat; After inserting the pretreated copper wire into the electrolyte solution, connecting the pretreated copper wire to the potentiostat; Detecting the copper wire current of the pretreated copper wire at a preset electrode potential on the potentiostat; The first polarization curve of the pretreated copper wire is constructed with the electrode potential as the abscissa and the copper wire current as the ordinate.

9. The method according to claim 1, characterized in that: The method of detecting the corrosion protection improvement degree of the self-assembled film copper wire by using the first polarization curve and the second polarization curve comprises: acquiring a first potential in the first polarization curve and a second potential in the second polarization curve; calculating an absolute value of a potential difference between the first potential and the second potential; When the absolute value of the potential difference is greater than the preset absolute value of the potential difference, calculating the corrosion inhibition efficiency of the self-assembled film copper wire; According to the corrosion inhibition efficiency, the self-assembled film coverage of the self-assembled film copper wire is calculated: The coverage of the self-assembled film is taken as the corrosion protection improvement degree.

10. A system for improving the corrosion resistance of bonding copper wires in plastic-encapsulated integrated circuits, characterized in that: The system comprises: A position identification module is used to obtain a plastic-encapsulated integrated circuit, identify the bonding position of a bonding copper wire product in the plastic-encapsulated integrated circuit by using a ray detection method, and pre-treat the copper wire at the bonding position to obtain a pre-treated copper wire; A corrosion inhibitor selection module, for selecting an initial corrosion inhibitor for the pretreated copper wire by an AC impedance analysis method, determining the corrosion inhibitor concentration of the initial corrosion inhibitor by using corrosion inhibitor samples of the initial corrosion inhibitor at different concentrations, and converting the initial corrosion inhibitor into a target corrosion inhibitor by using the corrosion inhibitor concentration; A variable control module, for selecting an immersion time and an immersion temperature of the pretreated copper wire in the target corrosion inhibitor, and after immersing the pretreated copper wire in the target corrosion inhibitor based on the immersion time and the immersion temperature, using the target corrosion inhibitor to prepare a self-assembled film copper wire of the pretreated copper wire; A curve construction module, for constructing a first polarization curve of the pretreated copper wire based on preset electrochemical parameters, constructing a second polarization curve of the self-assembled film copper wire based on the electrochemical parameters, and detecting the corrosion protection improvement degree of the self-assembled film copper wire using the first polarization curve and the second polarization curve; A result analysis module is used to determine the corrosion resistance improvement result of the bonding copper wire product in the plastic-encapsulated integrated circuit using the target corrosion inhibitor according to the corrosion resistance improvement degree.

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