Bonding device used in wafer bonding equipment

Abstract

The present invention relates to the field of wafer bonding technology, and specifically to a bonding device used in wafer bonding equipment, which mainly solves the technical problems of low opening and closing operation efficiency, low cooling efficiency and easy wafer damage in the existing bonding device. The device includes a frame, a cavity shell, a cover assembly, a bonding assembly and a cooling assembly; the cover plate is opened or closed by an opening and closing drive member, and when replacing the tooling and cleaning the cavity, there is no need to disassemble the parts of the bonding cavity, and the opening and closing operation efficiency is high; an inverted barrel-shaped lower bonding table is provided on the outer side of the lower heating plate, and a deformation portion is provided on the side wall of the lower bonding table and a first graphite pad is provided between the top end plate and the lower heating plate, which can compensate for the increase in thickness through the first graphite pad and the deformation portion to avoid damage to the wafer; an upper cooling plate is provided above the upper heating plate, and a lower cooling plate is provided below the lower heating plate, which can actively and directly cool the heating plate without affecting the heating performance of the heating plate, and the cooling efficiency is high.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer bonding, and in particular to a bonding device used in wafer bonding equipment. Background Art

[0002] Wafer bonding is the process of tightly bonding two mirror-polished homogeneous or heterogeneous wafers together through chemical and physical effects to achieve vertical stacking and electrical interconnection in 3D integration and advanced packaging. Wafer bonding equipment generally integrates pre-processing devices such as baking, visual alignment, pre-bonding, and bonding devices. Among them, the bonding device is used to finally tightly bond the two wafers that are preliminarily connected together after pre-processing.

[0003] When in use, the bonding device is generally equipped with a vacuum operating chamber. The vacuum operating chamber is connected to the bonding chamber through a gate valve. A robot is provided in the vacuum operating chamber. The robot picks up the wafer and sends the wafer into the bonding chamber through the gate valve. The robot then retracts the wafer and finally closes the gate valve to complete the bonding of the wafer by connecting the upper and lower heating plates.

[0004] The existing bonding device has the following defects: First, the bonding cavity needs to be opened when replacing the tooling and cleaning the cavity, and the existing bonding device needs to disassemble some parts of the bonding cavity before it can be opened. After the operation is completed, the disassembled parts need to be reinstalled. The opening and closing operation efficiency is low and frequent disassembly is likely to affect the life of the device; second, the bonding cavity needs to be cooled after bonding is completed, and in order to avoid the influence of the cooling structure on the heating performance of the heating plate, the existing bonding device only sets a cooling mechanism on the cavity wall of the bonding cavity. The heating plate can only be forced to cool indirectly, and the cooling efficiency is low; third, the upper and lower heating plates are easily expanded due to heat during the bonding process, resulting in an increase in thickness. The existing bonding structure cannot make corresponding adjustments to the increase in thickness, which easily causes the wafer to be subjected to excessive pressure during the bonding process, thereby causing damage to the wafer. Summary of the invention

[0005] In order to overcome the technical defects of the existing bonding device, such as low opening and closing operation efficiency, low cooling efficiency and easy wafer damage, the present invention provides a bonding device for use in a wafer bonding device.

[0006] The bonding device provided by the present invention for use in a wafer bonding device comprises:

[0007] frame;

[0008] A chamber shell, which is fixed on the frame and has an open top, and a side wall of the chamber shell is provided with an operation window for avoiding the movement of the manipulator, and the operation window is installed with an opening and closing valve;

[0009] A cover assembly, comprising a cover plate, the cover plate being connected to an opening and closing driving member, the opening and closing driving member driving the cover plate to move so that the cover plate has a closed state in which it is sealed and covered on the top of the cavity shell and an open state in which it is detached from the top of the cavity shell;

[0010] A bonding assembly, comprising an inverted barrel-shaped lower bonding stage, the bottom open end of the lower bonding stage is sealed and fixed to the bottom of the cavity shell so that the lower bonding stage, the cavity shell and the cover plate form a closed bonding cavity, the bonding assembly also comprises an upper heating plate and a lower heating plate, the upper heating plate is suspended in the bonding cavity by a lifting shaft that seals and penetrates the cover plate, the lifting shaft is connected to a first lifting drive member installed above the cover plate, the lower heating plate is supported on the inner side of the lower bonding stage by a plurality of support columns fixed to the bottom of the cavity shell, the lower heating plate and the lower bonding stage are connected to each other. The top end plate is in contact with the first graphite pad, the side wall of the lower bonding platform is provided with a deformation portion for axial buffering, the top edge of the lower bonding platform is uniformly provided with a plurality of notch grooves along the circumferential direction, the bonding assembly further comprises an ejector pin structure, the ejector pin structure comprises a lifting ring located outside the lower bonding platform and coaxially arranged, the lifting ring is connected with a second lifting driving member, the housing of the second lifting driving member is fixed below the cavity shell and the output shaft seal passes through the bottom of the cavity shell, the inner ring of the lifting ring is provided with a needle body, the needle body corresponds to the notch groove one by one and is placed in the corresponding notch groove;

[0011] A cooling assembly, comprising an upper cooling plate and a lower cooling plate, wherein the upper cooling plate is suspended in a bonding cavity by a first water pipe that is sealed and passes through the cover plate, the upper cooling plate is an annular plate and is slidably sleeved on the lifting shaft, the first water pipe is connected to a third lifting drive component installed above the cover plate, the lower cooling plate is a porous plate and is slidably sleeved on all support columns, the lower cooling plate is connected to a second water pipe that passes through the bottom of the cavity shell, and a fourth lifting drive component for driving the lower cooling plate to rise and fall is installed at the bottom of the cavity shell.

[0012] Optionally, a mounting plate is provided above the cover plate, the mounting plate is parallel to the cover plate and a mounting space is left between them, the cover plate and the mounting plate are fixedly connected via a connecting column, the first lifting drive member is located above the mounting plate, and the third lifting drive member is located in the mounting space.

[0013] Optionally, the opening and closing drive member includes a fixed seat arranged on the frame, the mounting plate is movably connected to the fixed seat and is connected to a linear telescopic pair installed on the frame, and the linear telescopic pair drives the mounting plate to rotate to achieve state switching of the cover.

[0014] Optionally, the frame is provided with a fixing column, and the cover is provided with a buffer extending outwardly from below the cover, and the buffer cooperates with the fixing column to perform buffering before the cover is switched to a closed state.

[0015] Optionally, the support column is a height-adjustable adjustment rod.

[0016] Optionally, the top edge of the cavity shell protrudes outward to form a flange, and the flange has a plurality of first through holes evenly distributed along the axial direction. The cover plate is provided with a second through hole corresponding to the first through hole, and the cover plate is leveled by a bolt pair inserted in the first through hole and the second through hole when in a closed state.

[0017] Optionally, a pressure block is provided under the lifting shaft, and the pressure block is a T-shaped structure formed by a connecting shaft and a pressure plate. The connecting shaft is screwed to the middle part of the bottom surface of the lifting shaft, and a support ring is sleeved on the connecting shaft and the outer diameter of the support ring is larger than the diameter of the lifting shaft. The support ring is clamped between the lifting shaft and the pressure plate, and the upper heating plate is hoisted on the support ring by vertically arranged bolts. The upper heating plate and the pressure plate are in contact through a gasket to transmit pressure, and the lower surface of the pressure plate is set to be a spherical surface.

[0018] Optionally, a second graphite pad is provided on the upper surface of the upper heating plate and the lower surface of the lower heating plate, and the second graphite pad located on the lower surface of the lower heating plate is adapted to the shape of the lower cooling plate.

[0019] Optionally, the upper heating plate includes a plate body, a third graphite pad and a pasting plate are detachably fixed to the lower surface of the plate body in sequence, and a fourth graphite pad is provided on the lower surface of the pasting plate.

[0020] Optionally, the cooling assembly further includes a cooling pipe provided on the outer side wall of the cavity shell.

[0021] The technical solution provided by the present invention has the following advantages compared with the prior art:

[0022] 1) In the bonding device provided by the present invention, the cover plate is opened or closed by an opening and closing driving member. When replacing the tooling or cleaning the cavity, it is only necessary to switch the cover plate from the closed state to the open state by the opening and closing driving member, without disassembling the parts of the bonding cavity. The opening and closing operation is efficient and the service life of the device can be guaranteed.

[0023] 2) The bonding device provided by the present invention has an inverted barrel-shaped lower bonding stage on the outer side of the lower heating plate, a deformation portion for axial buffering is provided on the side wall of the lower bonding stage, and a first graphite pad is provided between the top end plate of the lower bonding stage and the lower heating plate. When the upper and lower heating plates are heated and expanded during the bonding process, resulting in an increase in thickness, the first graphite pad can cooperate with the deformation portion to compensate for the increase in thickness, thereby preventing the wafer from being damaged due to excessive pressure during the bonding process;

[0024] 3) In the bonding device provided by the present invention, an upper cooling plate is provided above the upper heating plate, and a lower cooling plate is provided below the lower heating plate. Both the upper cooling plate and the lower cooling plate can be raised and lowered to contact with the corresponding heating plate for cooling, and can also be raised and lowered to separate from the corresponding heating plate to avoid affecting the heating performance of the heating plate. In this way, the heating plate can be actively and directly cooled without affecting the heating performance of the heating plate, and the cooling efficiency is high. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0026] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0027] Figure 1 A schematic diagram showing the overall structure of a bonding device according to an embodiment of the present invention;

[0028] Figure 2 A cross-sectional view showing a bonding device according to an embodiment of the present invention;

[0029] Figure 3 express Figure 2 A partial enlarged view of the middle A;

[0030] Figure 4 A schematic diagram showing a cover assembly and ancillary structures in an embodiment of the present invention;

[0031] Figure 5 A schematic diagram showing the structure of a bonding assembly in an embodiment of the present invention;

[0032] Figure 6 An exploded view showing an upper heating plate and related structures in an embodiment of the present invention;

[0033] Figure 7 An exploded view of the lower heating plate and related structures in an embodiment of the present invention is shown.

[0034] In the figure:

[0035] 1. Frame; 11. Fixed column; 12. Roller; 2. Cavity shell; 21. Operation window; 22. Flange; 221. First through hole; 23. Bottom plate; 3. Cover assembly; 31. Cover plate; 311. Second through hole; 32. Opening and closing drive member; 321. Fixed seat; 322. Linear telescopic pair; 33. Mounting plate; 34. Mounting space; 35. Connecting column; 36. Buffer; 4. Bonding assembly; 41. Upper heating plate; 411. Plate body; 412. Third graphite pad; 413. Paste plate; 414. Fourth graphite pad; 42. Lower heating plate; 43. Lifting shaft; 431. Press block; 4311. Connecting shaft; 4312. Press plate ; 432, support ring; 433, bolt; 434, gasket; 435, annular block; 436, pressure ring; 44, first lifting drive member; 45, support column; 46, lower bonding table; 461, deformation portion; 462, notch groove; 47, first graphite pad; 48, ejector pin structure; 481, lifting ring; 482, second lifting drive member; 483, needle body; 49, second graphite pad; 5, cooling assembly; 51, upper cooling plate; 52, lower cooling plate; 521, cooling substrate; 522, cooling cover plate; 5211, water storage tank; 53, first water pipe; 54, third lifting drive member; 55, fourth lifting drive member; 56, cooling pipe. DETAILED DESCRIPTION

[0036] In order to more clearly understand the above-mentioned objectives, features and advantages of the present invention, the scheme of the present invention will be further described below. It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

[0037] In the description, it should be noted that the terms "first" and "second" are only used for descriptive purposes and should not be understood as indicating or implying relative importance. It should be noted that, unless otherwise clearly specified and limited, the terms "installation" and "connection" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be an indirect connection through an intermediate medium, or it can be internal communication between two elements. For ordinary technicians in this field, the specific meanings of the above terms can be understood according to specific circumstances.

[0038] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein; it is obvious that the embodiments in the specification are only part of the embodiments of the present invention, rather than all of the embodiments.

[0039] Combine the following Figures 1 to 7 The specific embodiments of the present invention are described in detail.

[0040] This embodiment provides a bonding device used in a wafer bonding device, including a frame 1, a chamber shell 2, a cover assembly 3, a bonding assembly 4 and a cooling assembly 5.

[0041] The frame 1 is the fixed part of the whole device, and mainly plays the role of supporting other components.

[0042] Furthermore, rollers 12 may be provided at the bottom of the frame 1 to facilitate movement of the device.

[0043] The chamber shell 2 is fixed on the frame 1 and has an open top. The side wall of the chamber shell 2 is provided with an operation window 21 for avoiding the movement of the robot arm. The operation window 21 is installed with an opening and closing valve.

[0044] Specifically, the on-off valve of this embodiment is a gate valve, which is easy to operate and has good sealing performance.

[0045] It should be noted that the bottom of the cavity shell 2 is closed, and the bottom of the cavity shell 2 can be integrally formed with the main body of the cavity shell 2, or can be sealed and connected using a split structure. For example, in this embodiment, in order to facilitate the installation of the internal parts of the cavity shell 2, an installation opening is opened in the middle of the bottom of the cavity shell 2, and a bottom plate 23 is detachably connected below the installation opening.

[0046] The cover assembly 3 includes a cover plate 31, which is connected to an opening and closing drive member 32. The opening and closing drive member 32 drives the cover plate 31 to move so that the cover plate 31 has a closed state in which it is sealed and covered on the top of the cavity shell 2, and an open state in which it is detached from the top of the cavity shell 2.

[0047] It is easy to understand that a sealing ring can be provided between the cover plate 31 and the chamber shell 2 to ensure sealing.

[0048] Specifically, in this embodiment, a mounting plate 33 is provided above the cover plate 31, the mounting plate 33 is parallel to the cover plate 31 and a mounting space 34 is left between them, and the cover plate 31 and the mounting plate 33 are fixedly connected by a connecting column 35. The mounting space 34 and the top of the mounting plate 33 can be used to install other components, which is more suitable for the scene where more components need to be installed above the cover plate 31.

[0049] Specifically, the opening and closing driving member 32 of this embodiment includes a fixing seat 321 provided on the frame 1, the mounting plate 33 is movably connected to the fixing seat 321 and is connected to a linear telescopic pair 322 installed on the frame 1, and the linear telescopic pair 322 drives the mounting plate 33 to rotate to achieve the state switching of the cover plate 31. More specifically, the linear telescopic pair 322 of this embodiment adopts a cylinder with a locking function, which can be locked when the cover plate 31 is in a closed state to ensure the safety of the equipment operation.

[0050] Furthermore, a fixing column 11 is provided on the frame 1, and the cover plate 31 is provided with a buffer 36 extending outward from below it. The buffer 36 cooperates with the fixing column 11 to provide buffering before the cover plate 31 switches to a closed state, thereby avoiding collision between the cover plate 31 and the cavity shell 2 to cause structural damage.

[0051] The bonding assembly 4 includes an inverted barrel-shaped lower bonding stage 46, the bottom open end of the lower bonding stage 46 is sealed and fixed to the bottom of the cavity shell 2 so that the lower bonding stage 46, the cavity shell 2 and the cover plate 31 form a closed bonding cavity. The bonding assembly 4 also includes an upper heating plate 41 and a lower heating plate 42. The upper heating plate 41 is suspended in the bonding cavity by a lifting shaft 43 that seals and penetrates the cover plate 31. The lifting shaft 43 is connected to a first lifting drive member 44 installed above the cover plate 31. The lower heating plate 42 is supported on the inner side of the lower bonding stage 46 by a plurality of support columns 45 fixed to the bottom of the cavity shell 2. The lower heating plate 42 is connected to the top end plate of the lower bonding stage 46. The lower bonding platform 46 contacts the first graphite pad 47, and the side wall of the lower bonding platform 46 is provided with a deformation portion 461 for axial buffering. The top edge of the lower bonding platform 46 is evenly distributed with a plurality of notch grooves 462 along the circumferential direction. The bonding assembly 4 also includes a pin structure 48, and the pin structure 48 includes a lifting ring 481 located on the outer side of the lower bonding platform 46 and coaxially arranged. The lifting ring 481 is connected to a second lifting drive member 482. The shell of the second lifting drive member 482 is fixed below the cavity shell 2 and the output shaft seal passes through the bottom of the cavity shell 2. The inner ring of the lifting ring 481 is provided with a needle body 483, and the needle body 483 corresponds to the notch groove 462 one by one and is placed in the corresponding notch groove 462. During operation, the robot sends the wafer into the bonding chamber from the operation window 21, and the second lifting drive 482 drives the lifting ring 481 to rise, so that the needle 483 supports the wafer, and then the robot withdraws from the bonding chamber, and the opening and closing valve is closed. Then the second lifting drive 482 drives the lifting ring 481 to descend so that the wafer falls on the upper surface of the lower bonding table 46, and finally the first lifting drive 44 drives the upper heating plate 41 to descend to press the wafer, and the wafer completes bonding under the combined action of pressure and heat.

[0052] Specifically, the first lifting drive member 44 of the present embodiment is an electric cylinder, the housing of which is fixed above the mounting plate 33 , the output shaft of which passes through the mounting plate 33 and the lower end of which is fixedly connected to the lifting shaft 43 .

[0053] It should be noted that the first graphite pad 47 has two functions: first, the first graphite pad 47 itself has toughness, so that the distance between the lower heating plate 42 and the lower bonding platform 46 has a certain adjustment range, and then cooperates with the deformation part 461 to compensate for the dimensional change of the upper heating plate 41 or the lower heating plate 42 in the thickness direction when heated, thereby avoiding the upper heating plate 41 from exerting excessive pressure on the wafer after it descends a set distance; second, the first graphite pad 47 has good thermal conductivity, and can evenly transfer the heat of the lower heating plate 42 to the entire surface of the first graphite pad 47, thereby making the heat distribution of the lower bonding platform 46 more uniform.

[0054] Specifically, the deformation portion 461 of the present embodiment is configured as a rectangular bellows segment. The force required for the deformation of the rectangular bellows segment should be smaller than the maximum pressure that the wafer can withstand. Thus, the rectangular bellows segment will be deformed before the pressure on the wafer reaches the maximum. This can prevent the wafer from being damaged due to excessive pressure.

[0055] It is easy to understand that the bonding chamber needs to be connected to a vacuum pumping assembly and a vacuum gauge for detecting the vacuum degree to meet the vacuum degree requirement of the bonding chamber, which is well known to those skilled in the art.

[0056] Specifically, the support columns 45 of this embodiment are height-adjustable adjustment rods. When installing, the lower heating plate 42 can be leveled by adjusting the height of each support column 45 .

[0057] Furthermore, in this embodiment, a flange 22 is formed on the top edge of the chamber shell 2, and the flange 22 is uniformly distributed with a plurality of first through holes 221 along the axial direction. The cover plate 31 is provided with a second through hole 311 corresponding to the first through hole 221. When the cover plate 31 is in a closed state, it is leveled by a bolt pair inserted in the first through hole 221 and the second through hole 311. Since the chamber shell 2 is fixed on the frame 1, the levelness of the top surface of the chamber shell 2 is guaranteed by the structural accuracy. Therefore, when the cover plate 31 is in a closed state, the levelness of the local position of the cover plate 31 can be adjusted by screwing the nut of the bolt pair, and the overall levelness of the cover plate 31 can be adjusted by a plurality of bolt pairs. Since the upper heating plate 41 is installed on the cover plate 31, the levelness of the upper heating plate 41 is also adjusted when the cover plate 31 is leveled, so as to cooperate with the leveling of the lower heating plate 42, so that the upper heating plate 41 and the lower heating plate 42 can be basically parallel, thereby ensuring uniform pressure during wafer bonding.

[0058] Furthermore, in this embodiment, a pressure block 431 is provided below the lifting shaft 43. The pressure block 431 is a T-shaped structure formed by a connecting shaft 4311 and a pressure plate 4312. The connecting shaft 4311 is screwed to the middle of the bottom surface of the lifting shaft 43. A support ring 432 is sleeved on the connecting shaft 4311 and the outer diameter of the support ring 432 is larger than the diameter of the lifting shaft 43. The support ring 432 is clamped between the lifting shaft 43 and the pressure plate 4312. The upper heating plate 41 is hoisted on the support ring 432 by vertically arranged bolts 433. The upper heating plate 41 and the pressure plate 4312 are in contact through a gasket 434 to transmit pressure, and the lower surface of the pressure plate 4312 is set to be a spherical surface. During operation, the wafer is placed on the lower bonding table 46. When the upper heating plate 41 contacts the wafer, if there is a slight tilt, it can be fine-tuned through the cooperation between the spherical surface and the pad 434 until the upper heating plate 41 is attached to the wafer in a parallel posture, further ensuring uniform pressure during wafer bonding.

[0059] Specifically, in this embodiment, an annular block 435 is provided between the support ring 432 and the upper heating plate 41, a pressure ring 436 is provided above the support ring 432, and bolts 433 pass through the pressure ring 436, the support ring 432, the annular block 435 and the upper heating plate 41 from top to bottom in sequence. The annular block 435 makes the upper heating plate 41 indirectly contact with the support ring 432, which can improve the stability of the lower heating plate 42 when bonding. The pressure transmitted to the support ring 432 by the bolts 433 is more uniform through the pressure ring 436, avoiding local deformation. It should be understood that when the upper heating plate 41 is fine-tuned with the cooperation of the spherical surface and the pad 434, the adjustment range is very small, which can be ensured by the assembly gap between the structures.

[0060] Specifically, the upper heating plate 41 of the present embodiment includes a plate body 411, and the lower surface of the plate body 411 is detachably fixed with a third graphite pad 412 and a pasting plate 413 in sequence, and the lower surface of the pasting plate 413 is provided with a fourth graphite pad 414. Since the structure of the upper heating plate 41 is relatively complex and the cost is relatively high, if the upper heating plate 41 is directly used to contact the wafer for bonding, the upper heating plate 41 is very likely to be damaged by collision, so the present embodiment adds a pasting plate 413 below the upper heating plate 41, and adds a third graphite pad 412 between the pasting plate 413 and the upper heating plate 41, so that the pasting plate 413 and the third graphite pad 412 can protect the upper heating plate 41 and ensure the service life of the upper heating plate 41, and the pasting plate 413 can be replaced when it is damaged. Similarly, the lower bonding stage 46 can also protect the lower heating plate 42, and the lower bonding stage 46 can be replaced when it is damaged. More specifically, the third graphite pad 412, the pasting plate 413 and the fourth graphite pad 414 can be fixed by means of buckles located on the side walls or other common methods.

[0061] Specifically, the second lifting drive member 482 of this embodiment is a cylinder.

[0062] Among them, the cooling assembly 5 includes an upper cooling plate 51 and a lower cooling plate 52. The upper cooling plate 51 is suspended on the inner side of the cavity shell 2 through a first water pipe 53 that seals and penetrates the cover plate 31. The upper cooling plate 51 is an annular plate and is slidably sleeved on the lifting shaft 43. The first water pipe 53 is connected to a third lifting drive member 54 installed above the cover plate 31. The lower cooling plate 52 is a porous plate and is slidably sleeved on all support columns 45. The lower cooling plate 52 is connected to a second water pipe that penetrates the bottom of the cavity shell 2. The bottom of the cavity shell 2 is installed with a fourth lifting drive member 55 for driving the lower cooling plate 52 to rise and fall.

[0063] Specifically, the third lifting drive member 54 is a cylinder, the cylinder body of which is located in the installation space 34 and fixed on the cover plate 31, and the piston rod of the cylinder is fixedly connected to the first water pipe 53; the fourth lifting drive member 55 is also a cylinder, the cylinder body of which is fixed under the cavity shell 2, and the piston rod of the cylinder passes through the bottom of the cavity shell 2 and is used to lift the lower cooling plate 52.

[0064] Specifically, the lower cooling plate 52 includes a cooling base plate 521 and a cooling cover plate 522. A water storage tank 5211 is provided on the surface of the cooling base plate 521. The cooling cover plate 522 is fixed on the surface of the cooling base plate 521 to close the water storage tank 5211 to form a circulating water channel.

[0065] It is easy to understand that both the first water pipe 53 and the second water pipe need to be provided with two, one as a water inlet pipe and the other as a water outlet pipe. The circulating cooling water enters the upper cooling plate 51 or the lower cooling plate 52 from the water inlet pipe and is then discharged from the water outlet pipe. In this way, the heat of the upper heating plate 41 or the lower heating plate 42 is taken away by the circulating cooling water, thereby achieving cooling.

[0066] It should be noted that the second water pipe is not shown in the drawings, and its arrangement is the same as the first water pipe 53 . However, since the lower cooling plate 52 is outside the bonding cavity, the second water pipe does not need to be sealed and penetrate the bottom of the cavity shell 2 .

[0067] Furthermore, in this embodiment, a second graphite pad 49 is provided on the upper surface of the upper heating plate 41 and the lower surface of the lower heating plate 42, and the second graphite pad 49 located on the lower surface of the lower heating plate 42 is adapted to the shape of the lower cooling plate 52. The main function of the second graphite pad 49 is to utilize its good thermal conductivity to facilitate heat conduction from the upper heating plate 41 to the upper cooling plate 51 or from the lower heating plate 42 to the lower cooling plate 52, thereby achieving uniform and rapid heat dissipation. Specifically, the second graphite pad 49 can be fixed by a buckle located on the side wall or other common methods.

[0068] Furthermore, the cooling assembly 5 of this embodiment also includes a cooling pipe 56 provided on the outer wall of the cavity shell 2. The cooling pipe 56 can cool the bonding cavity to improve the cooling efficiency.

[0069] It should be noted that the lower bonding table 46, the cavity shell 2 and the cover plate 31 form a closed bonding cavity, so the lifting shaft 43, the first water pipe 53 and the output shaft of the second lifting drive member 482 and other components located in the bonding cavity all need to be subjected to sliding sealing treatment to ensure the sealing; however, the second water pipe, the output shaft of the fourth lifting drive member 55 and other components located outside the bonding cavity do not need to be sealed, and an ordinary sliding structure can be used.

[0070] The working process of the bonding device used in the wafer bonding equipment of this embodiment is as follows:

[0071] S1. Evacuate the bonding chamber to make its vacuum degree meet the requirements;

[0072] S2. The robot picks up the wafer and delivers the wafer to the bonding chamber through the operation window 21. The needle body 483 rises so that the wafer is lifted up to leave the robot. The robot exits the bonding chamber, and the needle body 483 falls so that the wafer falls on the lower bonding stage 46.

[0073] S3. The upper heating plate 41 descends to bond the wafer;

[0074] S4. Bonding is completed, and the upper heating plate 41 is reset;

[0075] S5 . The upper cooling plate 51 descends to contact the upper heating plate 41 to cool the upper heating plate 41 , and at the same time, the lower cooling plate 52 ascends to contact the lower heating plate 42 to cool the lower heating plate 42 .

[0076] The above is only a specific implementation of the present invention, which enables those skilled in the art to understand or implement the present invention. Although detailed descriptions are given with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments, and they should all be covered by the protection scope of the claims.

Claims

1. A bonding device for use in a wafer bonding device, characterized in that: include: Rack(1); A chamber shell (2) is fixed on the frame (1) and has an open top, the side wall of the chamber shell (2) is provided with an operating window (21) for avoiding the movement of the manipulator, and the operating window (21) is installed with an opening and closing valve; A cover assembly (3), comprising a cover plate (31), the cover plate (31) being connected to an opening and closing driving member (32), the opening and closing driving member (32) driving the cover plate (31) to move so that the cover plate (31) has a closed state in which it is sealed and covered on the top of the cavity shell (2), and an open state in which it is detached from the top of the cavity shell (2); A bonding assembly (4), comprising an inverted barrel-shaped lower bonding platform (46), the bottom open end of the lower bonding platform (46) being sealed and fixed to the bottom of the cavity shell (2) so that the lower bonding platform (46), the cavity shell (2) and the cover plate (31) form a closed bonding cavity, the bonding assembly (4) further comprising an upper heating plate (41) and a lower heating plate (42), the upper heating plate (41) being suspended in the bonding cavity by a lifting shaft (43) sealingly penetrating the cover plate (31), the lifting shaft (43) being connected to a first lifting drive member (44) installed above the cover plate (31), the lower heating plate (42) being supported on the inner side of the lower bonding platform (46) by a plurality of support columns (45) fixed to the bottom of the cavity shell (2), the support columns (45) being height-adjustable adjustment rods, the lower heating plate (42) and the lower The top end plate of the bonding platform (46) is in contact with the bottom end plate through a first graphite pad (47), the side wall of the lower bonding platform (46) is provided with a deformation portion (461) for axial buffering, the top edge of the lower bonding platform (46) is evenly distributed with a plurality of notch grooves (462) along the circumferential direction, the bonding assembly (4) further comprises an ejector pin structure (48), the ejector pin structure (48) comprises a lifting ring (481) located outside the lower bonding platform (46) and coaxially arranged, the lifting ring (481) is connected to a second lifting drive member (482), the shell of the second lifting drive member (482) is fixed below the cavity shell (2) and the output shaft seal passes through the bottom of the cavity shell (2), the inner ring of the lifting ring (481) is provided with a needle body (483), the needle body (483) corresponds to the notch groove (462) one by one and is placed in the corresponding notch groove (462); A cooling assembly (5), comprising an upper cooling plate (51) and a lower cooling plate (52), wherein the upper cooling plate (51) is suspended in a bonding cavity by means of a first water pipe (53) which is sealed and passes through the cover plate (31), the upper cooling plate (51) is a ring plate and is slidably sleeved on the lifting shaft (43), the first water pipe (53) is connected to a third lifting drive member (54) which is installed above the cover plate (31), the lower cooling plate (52) is a porous plate and is slidably sleeved on all support columns (45), the lower cooling plate (52) is connected to a second water pipe which passes through the bottom of the cavity shell (2), and the bottom of the cavity shell (2) is installed with a fourth lifting drive member (55) for driving the lower cooling plate (52) to rise and fall.

2. The bonding device used in wafer bonding equipment according to claim 1, characterized in that: A mounting plate (33) is provided above the cover plate (31); the mounting plate (33) is parallel to the cover plate (31) and a mounting space (34) is left between them; the cover plate (31) and the mounting plate (33) are fixedly connected via a connecting column (35); the first lifting drive member (44) is located above the mounting plate (33); and the third lifting drive member (54) is located in the mounting space (34).

3. The bonding device used in wafer bonding equipment according to claim 2, characterized in that: The opening and closing driving member (32) comprises a fixing seat (321) arranged on the frame (1); the mounting plate (33) is movably connected to the fixing seat (321) and is connected to a linear telescopic pair (322) mounted on the frame (1); the linear telescopic pair (322) drives the mounting plate (33) to rotate to achieve state switching of the cover plate (31).

4. The bonding device used in wafer bonding equipment according to claim 1, characterized in that: The frame (1) is provided with a fixing column (11), and the cover plate (31) is provided with a buffer (36) extending outwardly below the cover plate (31), and the buffer (36) cooperates with the fixing column (11) to perform buffering before the cover plate (31) is switched to a closed state.

5. The bonding device used in wafer bonding equipment according to claim 1, characterized in that: The top edge of the chamber shell (2) protrudes outward to form a flange (22), and the flange (22) has a plurality of first through holes (221) evenly distributed along the axial direction. The cover plate (31) is provided with second through holes (311) corresponding to the first through holes (221). When the cover plate (31) is in a closed state, it is leveled by means of a pair of bolts inserted into the first through holes (221) and the second through holes (311).

6. The bonding device used in wafer bonding equipment according to claim 5, characterized in that: A pressure block (431) is provided below the lifting shaft (43). The pressure block (431) is a T-shaped structure formed by a connecting shaft (4311) and a pressure plate (4312). The connecting shaft (4311) is screwed to the middle of the bottom surface of the lifting shaft (43). A support ring (432) is sleeved on the connecting shaft (4311) and the outer diameter of the support ring (432) is larger than the diameter of the lifting shaft (43). The support ring (432) is clamped between the lifting shaft (43) and the pressure plate (4312). The upper heating plate (41) is hoisted on the support ring (432) by means of vertically arranged bolts (433). The upper heating plate (41) and the pressure plate (4312) are in contact with each other via a pad (434) to transmit pressure, and the lower surface of the pressure plate (4312) is set as a spherical surface.

7. The bonding device used in wafer bonding equipment according to claim 1, characterized in that: The upper surface of the upper heating plate (41) and the lower surface of the lower heating plate (42) are both provided with a second graphite pad (49), and the second graphite pad (49) located on the lower surface of the lower heating plate (42) is adapted to the shape of the lower cooling plate (52).

8. The bonding device used in wafer bonding equipment according to claim 7, characterized in that: The upper heating plate (41) comprises a plate body (411), a third graphite pad (412) and a pasting plate (413) being detachably fixed in sequence on the lower surface of the plate body (411), and a fourth graphite pad (414) being provided on the lower surface of the pasting plate (413).

9. The bonding device used in wafer bonding equipment according to claim 1, characterized in that: The cooling assembly (5) further comprises a cooling pipe (56) provided on the outer side wall of the cavity shell (2).

Images