Microelectronic chip packaging device and packaging process

Abstract

The invention relates to a microelectronic chip packaging device and a packaging process, and relates to the technical field of microelectronic chip packaging, the microelectronic chip packaging device comprises a film sticking machine, a clamping mechanism is arranged on the film sticking machine, a packaging machine is installed outside the film sticking machine, and a mechanical arm is installed on the packaging machine. According to the microelectronic chip packaging device and process, when the microelectronic chip frame is packaged, a stripping layer is removed firstly, the stripping layer is directly pasted on the back of the microelectronic chip frame and then fixed to the bottom of the heating disc, and a glue film outside the microelectronic chip frame is softened through the heating base, so that the microelectronic chip frame is in full contact with the glue film; and then the baked microelectronic chip frame is transferred to a machining base through a mechanical arm, grinding and leveling treatment is carried out on the microelectronic chip frame, and redundant bonding layers are removed.

Description

Technical Field

[0001] The present application relates to the technical field of microelectronic chip packaging, and in particular to a microelectronic chip packaging device and packaging process. Background Art

[0002] ‌‌Microelectronic chip packaging refers to installing the chip in a housing to protect the chip, enhance its electrothermal performance, and achieve connection with external circuits. The packaging process includes fixing and sealing the chip in a protective shell and connecting it to other electronic components through pins. Its main function is to protect the chip from external environmental influences such as temperature changes, humidity, dust and static electricity, and ensure that the chip can operate stably under various working conditions‌‌.

[0003] As shown in announcement number CN113698890A, the invention uses a polyimide film substrate coated with a polyimide resin adhesive and a specific preparation method to obtain a support film with good performance, which can prevent the welding resin from penetrating into the shielding area to form burrs during the plastic sealing process. It has good temperature resistance and no residual glue after being removed at high temperature, thereby improving the welding wire yield.

[0004] However, when packaging microelectronic chips, due to the reduction of the bonding area on the back of the high-density frame, frequent physical friction during long-term material transportation, high-temperature environment and high-power plasma cleaning process, it is very easy to cause deformation of the frame structure, partial detachment or damage and leakage of the film, which will ultimately directly lead to a decrease in product yield and reliability. Summary of the invention

[0005] The purpose of the present application is to provide a microelectronic chip packaging device.

[0006] The present application provides a microelectronic chip packaging device, which adopts the following technical solution: A microelectronic chip packaging device comprises a film laminating machine, the film laminating machine is provided with a clamping mechanism, a packaging machine is installed outside the film laminating machine, and a mechanical arm is installed on the packaging machine; The clamping mechanism includes a fixed shell, a connecting rod, a torsion spring, a clamping plate and a gasket. The film laminating machine is installed with a fixed shell, one end of the fixed shell is connected with a connecting rod, the outer wall of the connecting rod is sleeved with a torsion spring, one end of the connecting rod is connected with a clamping plate, and the outer wall of the clamping plate is fixed with a gasket.

[0007] By adopting the above technical solution, when the microelectronic chip frame is fixed to the bottom of the heating plate by the clamping plate, as the microelectronic chip frame is installed, the clamping plates on both sides of the heating plate will be squeezed outward. At this time, the torsion spring will provide a pulling force, and at the same time, the friction between the microelectronic chip frame and the clamping plate will be increased through the gasket, so that it is not easy to fall off the heating plate.

[0008] Optionally, the film laminating machine includes a shell, a heating seat, a push rod and a heating plate, the heating seat is installed inside the shell, the push rod is installed inside the shell, and the heating plate is fixed to one end of the push rod.

[0009] By adopting the above technical solution, the ultra-thin rigid jig is installed on the heating seat, and then the microelectronic chip frame is installed on the heating plate, and then the film is pressed up and down onto the ultra-thin rigid jig by the heating plate, and then the microelectronic chip frame is transferred to the packaging machine for packaging.

[0010] Optionally, a grinding mechanism is arranged on the outside of the film laminating machine, and the grinding mechanism includes a body, a support frame, a cover plate, a processing seat, a telescopic rod, a motor and a grinding disc. The body is installed on the outside of the outer shell, the body is fixed with a support frame, the support frame is fixed with a cover plate, the body is provided with a processing seat, the bottom wall of the cover plate is installed with a telescopic rod, one end of the telescopic rod is installed with a motor, and the output end of the motor is installed with a grinding disc.

[0011] Optionally, the grinding mechanism is provided with a fixing component, the fixing component includes a slide groove, a mounting block, a cylinder and a fixed plate, the body is provided with a slide groove, the body is provided with a mounting block, the outer wall of the mounting block is provided with a cylinder, the output end of the cylinder is provided with a fixing plate, and the fixing plate can slide in the slide groove.

[0012] By adopting the above technical solution, when the microelectronic chip frame is being ground and leveled, the telescopic rod is extended downward, and then the motor equipped with the grinding disc is moved downward. When the grinding disc is about to contact the microelectronic chip frame, the telescopic rod stops extending, and the motor is started, and the motor drives the grinding disc to rotate. At the same time, the telescopic rod is controlled to move slowly downward until the grinding disc contacts the microelectronic chip frame and stops extending and retracting. Then the microelectronic chip frame can be ground and leveled to remove the excess adhesive layer.

[0013] Optionally, the robot arm includes a base, a clamping arm and a clamping block; the base is installed on the packaging machine, the clamping arm is provided on the base, and the clamping block is provided on the clamping arm.

[0014] By adopting the above technical solution, the frame after grinding and leveling is transferred to the film laminating machine through a robotic arm, the ultra-thin rigid fixture is installed on the heating seat before transportation, and then the microelectronic chip frame is installed on the heating plate, and then the film is pressed up and down onto the ultra-thin rigid fixture by the heating plate, and then the microelectronic chip frame is transferred to the packaging machine for packaging.

[0015] Optionally, the robotic arm is provided with a buffer assembly, which includes an installation groove, a connecting hole, a limiting groove, a spring, a connecting column and a buffer block. The outer wall of the clamping block is provided with an installation groove, the inner wall of the installation groove is provided with a connecting hole, the inner wall of the installation groove is provided with a limiting groove, a spring is installed inside the limiting groove, a connecting column is installed inside the connecting hole, and a buffer block is fixed to one end of the connecting column.

[0016] By adopting the above technical solution, when a mechanical arm is used to transfer the microelectronic chip frame, the clamping arm rotates on the base and clamps the microelectronic chip frame through the clamping block. At this time, the buffer block will first contact the microelectronic chip frame, and as the clamping block is tightened, the buffer block will shrink into the installation slot. At the same time, the spring will provide an outward force to clamp the microelectronic chip frame, while avoiding film wrinkles, foreign matter attachment or scratches caused by physical friction of the microelectronic chip frame during the transfer process, which may lead to the reduction of coplanarity between the pins and the pads and the inability to bond and bond. The buffer block is made of soft material, which makes it difficult for the film layer to fall off during the transfer of the microelectronic chip frame.

[0017] Optionally, the polishing mechanism is provided with a cleaning assembly, which includes a fixed groove, a fan, an air supply pipe, an air outlet pipe and a protective net. A fixed groove is opened on the outer wall of the body, a fan is installed inside the fixed groove, an air supply pipe is connected through the inner wall of the fixed groove, an air outlet pipe is fixed to one end of the air supply pipe, and a protective net is installed on the inner wall of the fixed groove.

[0018] Optionally, the slide grooves are opened symmetrically with respect to the central axis of the machine body, and the mounting blocks are distributed on the machine body at equal intervals.

[0019] Optionally, one end of the torsion spring is connected to the heating plate, and the other end of the torsion spring is connected to the clamping plate.

[0020] By adopting the above technical solution, when the microelectronic chip frame is ground and leveled to remove the excess adhesive layer, the fan is started to blow air to the surface of the microelectronic chip frame through the air supply duct and the air outlet duct. At this time, the flowing air will blow away the dust generated by grinding on the surface of the microelectronic chip frame, thereby preventing the dust from affecting the effect of the grinding disc in removing the adhesive layer.

[0021] A microelectronic chip packaging process comprises the following steps: S1. First remove a layer of peeling layer and directly stick the film on the back of the frame. Fix the frame on the heating plate through the clamping mechanism. Then press the heating plate down to contact the heating seat through the push rod, and then apply pressure to level it. Use the softening characteristic of the adhesive layer under high temperature to make the frame and the film fully contact. S2, remove the remaining peeling layer from the baked frame, place the frame side on the processing seat, and grind and level it with a grinding disc to remove the excess adhesive layer; S3. The frame after grinding and leveling is transferred to the film laminating machine again by a robot arm. The ultra-thin rigid fixture is installed on the heating seat before transportation, and then the microelectronic chip frame is installed on the heating plate. The film is then pressed up and down on the ultra-thin rigid fixture by the heating plate, and then the microelectronic chip frame is transferred to the packaging machine for packaging.

[0022] In summary, the present application includes at least one of the following beneficial technical effects: 1. When packaging the microelectronic chip frame, first remove a peeling layer and directly attach the film to the back of the microelectronic chip frame, then fix it to the bottom of the heating plate through a clamp, soften the adhesive film on the outside of the microelectronic chip frame through the heating seat, so that the microelectronic chip frame is in full contact with the adhesive film, and then transfer the baked microelectronic chip frame to the processing seat through a mechanical arm, grind and level the microelectronic chip frame, remove the excess adhesive layer, and then transfer it to the film attaching machine again through a mechanical arm, install the ultra-thin rigid fixture on the heating seat before transportation, and then install the microelectronic chip frame on the heating plate, and then press the film up and down on the ultra-thin rigid fixture through the heating plate, and then transfer the microelectronic chip frame to the packaging machine for packaging; 2. When the microelectronic chip frame is fixed to the bottom of the heating plate through the clamping plate, the clamping plates on both sides of the heating plate will be squeezed outward as the microelectronic chip frame is installed. At this time, the torsion spring will provide a pulling force, and at the same time, the friction between the microelectronic chip frame and the clamping plate will be increased through the gasket, so that it is not easy to fall off the heating plate; 3. When the mechanical arm is used to transfer the microelectronic chip frame, the clamping arm rotates on the base and clamps the microelectronic chip frame through the clamping block. At this time, the buffer block will first contact the microelectronic chip frame, and as the clamping block is tightened, the buffer block will shrink into the installation slot. At the same time, the spring will provide an outward force to clamp the microelectronic chip frame, while avoiding the film wrinkles, foreign matter or scratches caused by the physical friction of the microelectronic chip frame during the transfer process, which may lead to the reduction of coplanarity between the pins and the pads and make it impossible to bond and bond. The buffer block is made of soft material, which makes it difficult for the film layer to fall off during the transfer of the microelectronic chip frame. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 It is a schematic diagram of the overall structure of an embodiment of the present application; Figure 2 is a schematic diagram of a clamping mechanism according to an embodiment of the present application; Figure 3 is a schematic diagram of a grinding mechanism according to an embodiment of the present application; Figure 4 is a schematic diagram of a fixing component of an embodiment of the present application; Figure 5 is a schematic diagram of a packaging machine according to an embodiment of the present application; Figure 6 is a schematic diagram of a buffer component according to an embodiment of the present application; Figure 7 It is a schematic diagram of a cleaning component according to an embodiment of the present application.

[0024] Explanation of reference numerals: 1. laminating machine; 11. housing; 12. heating seat; 13. push rod; 14. heating plate; 2. clamping mechanism; 21. fixing shell; 22. connecting rod; 23. torsion spring; 24. clamping plate; 25. gasket; 3. grinding mechanism; 31. machine body; 32. support frame; 33. cover plate; 34. processing seat; 35. telescopic rod; 36. motor; 37. grinding plate; 4. fixing assembly; 41. sliding slot; 42, mounting block; 43, cylinder; 44, fixing plate; 5, packaging machine; 6, mechanical arm; 61, base; 62, clamping arm; 63, clamping block; 7, buffer assembly; 71, mounting slot; 72, connecting hole; 73, limiting slot; 74, spring; 75, connecting column; 76, buffer block; 8, cleaning assembly; 81, fixing slot; 82, fan; 83, air supply pipe; 84, air outlet pipe; 85, protective net. DETAILED DESCRIPTION

[0025] The following is combined with Figure 1 - Attachment Figure 7 , further details of this application are given.

[0026] Embodiment: A microelectronic chip packaging device comprises a film laminating machine 1, on which a clamping mechanism 2 is provided, and a packaging machine 5 is installed outside the film laminating machine 1, on which a mechanical arm 6 is installed; The clamping mechanism 2 includes a fixed shell 21, a connecting rod 22, a torsion spring 23, a clamping plate 24 and a gasket 25. The fixed shell 21 is symmetrically installed on the heating plate 14. The two groups of fixed shells 21 are respectively penetrated and connected with the connecting rod 22. The outer wall of the connecting rod 22 is sleeved with a torsion spring 23. The end of the connecting rod 22 is penetrated and connected with a clamping plate 24. The outer wall of the clamping plate 24 is fixed with a gasket 25. When the microelectronic chip frame is fixed to the bottom of the heating plate 14 through the clamping plate 24, as the microelectronic chip frame is installed on the bottom wall of the heating plate 14, the clamping plates 24 on both sides of the heating plate 14 will be squeezed outward by the microelectronic chip frame, and the torsion spring 23 will provide a pulling force. At the same time, the friction between the microelectronic chip frame and the clamping plate 24 is increased through the gasket 25, so that it is not easy to fall off on the heating plate 14.

[0027] The film laminating machine 1 includes a shell 11, a heating seat 12, a push rod 13 and a heating plate 14. The heating seat 12 is installed inside the shell 11, and the push rod 13 is installed inside the shell 11. The heating plate 14 is fixed at one end of the push rod 13. Then, the ultra-thin rigid jig is installed on the heating seat 12 by snap-fitting, and then the microelectronic chip frame is installed on the heating plate 14 through the clamp 24. Then, the film is pressed up and down onto the ultra-thin rigid jig through the heating plate 14, and then the microelectronic chip frame is transferred to the packaging machine 5 through the robot arm 6 for packaging.

[0028] The outside of the film laminating machine 1 is provided with a grinding mechanism 3, which includes a body 31, a support frame 32, a cover plate 33, a processing seat 34, a telescopic rod 35, a motor 36 and a grinding disc 37. The outside of the film laminating machine 1 is provided with a body 31, a support frame 32 is fixed on the body 31, a cover plate 33 is fixed on the support frame 32, a processing seat 34 is provided on the body 31, a telescopic rod 35 is installed on the bottom wall of the cover plate 33, a motor 36 is installed at one end of the telescopic rod 35, and a grinding disc 37 is installed at the output end of the motor 36, and then, When grinding and leveling the microelectronic chip frame, the telescopic rod 35 is extended downward, and then the motor 36 equipped with the grinding disc 37 is moved downward. When the grinding disc 37 is about to contact the microelectronic chip frame, the telescopic rod 35 stops extending, and the motor 36 is started. The motor 36 drives the grinding disc 37 to rotate. At the same time, the telescopic rod 35 is controlled to move slowly downward until the grinding disc 37 contacts the microelectronic chip frame and stops extending and retracting. Then the microelectronic chip frame can be ground and leveled to remove the excess adhesive layer.

[0029] A fixing component 4 is provided on the grinding mechanism 3, and the fixing component 4 includes a slide groove 41, a mounting block 42, a cylinder 43 and a fixing plate 44. The slide groove 41 is opened on the body 31, and the mounting block 42 is provided on the body 31. The outer wall of the mounting block 42 is provided with a cylinder 43, and the output end of the cylinder 43 is provided with a fixing plate 44, and the fixing plate 44 can slide in the slide groove 41. When the microelectronic chip frame is ground and leveled, the baked microelectronic chip frame is transferred to the processing seat 34 through the robot arm 6. At this time, the cylinder 43 on the mounting block 42 will push the fixing plate 44 along the slide groove 41, thereby fixing the microelectronic chip frame on the processing seat 34.

[0030] The robot arm 6 includes a base 61, a clamping arm 62 and a clamping block 63. The base 61 is installed on the packaging machine 5, and the clamping arm 62 is provided on the base 61. The clamping arm 62 is provided on the clamping block 63. Then, when packaging, the microelectronic chip frame is transferred by the robot arm 6, and the frame after grinding and leveling is transferred to the film laminating machine 1 through the robot arm 6. Before transportation, the ultra-thin rigid fixture is installed on the heating seat 12, and then the microelectronic chip frame is installed on the heating plate 14, and then the film is pressed up and down by the heating plate 14 onto the ultra-thin rigid fixture, and then the microelectronic chip frame is transferred to the packaging machine 5 for packaging.

[0031] The mechanical arm 6 is provided with a buffer assembly 7, which includes a mounting groove 71, a connecting hole 72, a limiting groove 73, a spring 74, a connecting column 75 and a buffer block 76. The outer wall of the clamping block 63 is provided with a mounting groove 71, the inner wall of the mounting groove 71 is provided with a connecting hole 72, the inner wall of the mounting groove 71 is provided with a limiting groove 73, the inner part of the limiting groove 73 is provided with a spring 74, the inner part of the connecting hole 72 is provided with a connecting column 75, and one end of the connecting column 75 is fixed with a buffer block 76. Then, when the mechanical arm 6 is used to transport the microelectronic chip frame, the clamping arm 62 rotates on the base 61 and clamps the microelectronic chip frame through the clamping block 63. At this time, the buffer block 76 will first contact the microelectronic chip frame, and as the clamping block 63 is tightened, the buffer block 76 will shrink into the mounting groove 71, and at the same time, the spring 74 will provide an outward force to clamp the microelectronic chip frame while avoiding film wrinkles, foreign matter attachment or scratches caused by physical friction of the microelectronic chip frame during the transfer process, which may lead to the reduction of coplanarity between the pin and the pad and the inability to bond and bond. The buffer block 76 is made of soft material, so that the film layer is not easy to fall off during the transfer of the microelectronic chip frame. After the robot arm 6 places the microelectronic chip frame on the bottom wall of the heating plate 14, the robot arm 6 will release the fixation of the microelectronic chip frame. At this time, the spring 74 will push out the buffer block 76 to continue to fix the microelectronic chip frame to ensure that the microelectronic chip frame is completely installed on the bottom wall of the heating plate 14.

[0032] A cleaning component 8 is provided on the grinding mechanism 3, and the cleaning component 8 includes a fixed groove 81, a fan 82, an air supply pipe 83, an air outlet pipe 84 and a protective net 85. The outer wall of the body 31 is provided with a fixed groove 81, and the fan 82 is installed inside the fixed groove 81. The inner wall of the fixed groove 81 is penetrated by an air supply pipe 83, and an air outlet pipe 84 is fixed at one end of the air supply pipe 83. The inner wall of the fixed groove 81 is installed with a protective net 85. When the microelectronic chip frame is ground and leveled to remove the excess adhesive layer, the fan 82 is started to blow air to the surface of the microelectronic chip frame through the air supply pipe 83 and the air outlet pipe 84. At this time, the flowing air will blow away the dust generated on the surface of the microelectronic chip frame due to grinding, thereby preventing the dust from affecting the effect of the grinding disc 37 in removing the adhesive layer.

[0033] The microelectronic chip packaging process comprises the following steps: S1, first remove a layer of peeling layer and directly stick the film on the back of the frame, fix the frame on the heating plate 14 through the clamping mechanism, and then press the heating plate 14 downward through the push rod 13 to contact with the heating seat 12, and then apply pressure to level it, and make full contact between the frame and the film by using the characteristic that the adhesive layer softens at high temperature; S2, remove the remaining peeling layer from the baked frame, place the frame side on the processing seat 34 and grind and level it with the grinding disc 37 to remove the excess adhesive layer; S3. The frame after grinding and leveling is transferred to the film laminating machine 1 again through the robot arm 6. Before transfer, the ultra-thin rigid fixture is installed on the heating seat 12, and then the microelectronic chip frame is installed on the heating plate 14. Then, the film is pressed up and down onto the ultra-thin rigid fixture by the heating plate 14, and then the microelectronic chip frame is transferred to the packaging machine 5 for packaging.

[0034] The implementation principle of the embodiment of the present application is as follows: when packaging the microelectronic chip, first remove a peeling layer and directly stick it on the back of the microelectronic chip frame, and then fix the microelectronic chip frame to the bottom of the heating plate 14 through the clamping plate 24. At this time, the heating plate 14 is pressed downward by the push rod 13 so that the adhesive film on the outside of the microelectronic chip frame contacts the heated heating seat 12. At this time, the adhesive film on the outside of the microelectronic chip frame is softened by the heating seat 12, so that the microelectronic chip frame is fully in contact with the adhesive film, and then the baked microelectronic chip frame is transferred to the processing seat 34 through the mechanical arm 6. At this time, the cylinder 43 on the mounting block 42 will push the fixing plate 44 along the slide groove 41, thereby fixing the outside of the microelectronic chip frame on the processing seat 34, and then the telescopic rod 35 extends downward, thereby moving the motor 36 equipped with the grinding disc 37 downward. When the grinding disc 37 is about to contact the microelectronic chip frame, the telescopic rod 3 5 stops extending, and the motor 36 is started at this time. The motor 36 drives the grinding disc 37 to rotate. At the same time, the telescopic rod 35 is controlled to move slowly downward until the grinding disc 37 contacts the microelectronic chip frame and stops extending. Then, the microelectronic chip frame can be ground and leveled to remove the excess adhesive layer. Then, it is transferred to the film laminating machine 1 again through the mechanical arm 6. Before transportation, the ultra-thin rigid fixture is installed on the heating seat 12, and then the microelectronic chip frame is installed on the heating plate 14. Then, the film is pressed up and down on the ultra-thin rigid fixture by the heating plate 14, and then the microelectronic chip frame is transferred to the packaging machine 5 for packaging. The packaging machine 5 will place the chip on the pre-prepared packaging substrate. After completing the alignment of the chip and the substrate, the packaging machine will firmly bond the chip to the substrate by hot pressing, ultrasonic welding, etc. Finally, the packaging machine will also perform back packaging to protect the chip and its wiring points. This step may include injecting epoxy resin or using other packaging materials to ensure the integrity and durability of the package.

[0035] The embodiments of this specific implementation are all preferred embodiments of the present application, and are not intended to limit the protection scope of the present application. The same components are represented by the same figure marks. Therefore, any equivalent changes made based on the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A microelectronic chip packaging device, comprising a film laminating machine (1), the film laminating machine (1) being provided with a clamping mechanism (2), a packaging machine (5) being installed outside the film laminating machine (1), and a mechanical arm (6) being installed on the packaging machine (5), characterized in that ； The clamping mechanism (2) comprises a fixed shell (21), a connecting rod (22), a torsion spring (23), a clamping plate (24) and a gasket (25). The fixed shell (21) is installed on the film laminating machine (1). One end of the fixed shell (21) is connected to the connecting rod (22). The outer wall of the connecting rod (22) is sleeved with a torsion spring (23). One end of the connecting rod (22) is connected to the clamping plate (24). The outer wall of the clamping plate (24) is fixed with a gasket (25).

2. A microelectronic chip packaging device according to claim 1, characterized in that: The film laminating machine (1) comprises a housing (11), a heating seat (12), a push rod (13) and a heating plate (14); the heating seat (12) is installed inside the housing (11); the push rod (13) is installed inside the housing (11); and the heating plate (14) is fixed to one end of the push rod (13).

3. The microelectronic chip packaging device according to claim 1, characterized in that: The film laminating machine (1) is provided with a grinding mechanism (3) on the outside. The grinding mechanism (3) comprises a machine body (31), a support frame (32), a cover plate (33), a processing seat (34), a telescopic rod (35), a motor (36) and a grinding disc (37). The film laminating machine (1) is provided with a machine body (31) on the outside. The machine body (31) is fixed with a support frame (32). The support frame (32) is fixed with a cover plate (33). The machine body (31) is provided with a processing seat (34). The bottom wall of the cover plate (33) is installed with a telescopic rod (35). One end of the telescopic rod (35) is installed with a motor (36). The output end of the motor (36) is installed with a grinding disc (37).

4. A microelectronic chip packaging device according to claim 3, characterized in that: The grinding mechanism (3) is provided with a fixing assembly (4), the fixing assembly (4) comprising a slide groove (41), a mounting block (42), a cylinder (43) and a fixing plate (44); the machine body (31) is provided with a slide groove (41), the machine body (31) is provided with a mounting block (42), the outer wall of the mounting block (42) is provided with a cylinder (43), the output end of the cylinder (43) is provided with a fixing plate (44), and the fixing plate (44) can slide in the slide groove (41).

5. The microelectronic chip packaging device according to claim 4, characterized in that: The mechanical arm (6) comprises a base (61), a clamping arm (62) and a clamping block (63); the packaging machine (5) is mounted with the base (61); the base (61) is provided with the clamping arm (62); and the clamping block (63) is provided with the clamping arm (62).

6. The microelectronic chip packaging device according to claim 5, characterized in that: The mechanical arm (6) is provided with a buffer assembly (7), the buffer assembly (7) comprising a mounting groove (71), a connecting hole (72), a limiting groove (73), a spring (74), a connecting column (75) and a buffer block (76), the outer wall of the clamping block (63) is provided with a mounting groove (71), the inner wall of the mounting groove (71) is provided with a connecting hole (72), the inner wall of the mounting groove (71) is provided with a limiting groove (73), the inner part of the limiting groove (73) is provided with a spring (74), the inner part of the connecting hole (72) is provided with a connecting column (75), and one end of the connecting column (75) is fixed with a buffer block (76).

7. The microelectronic chip packaging device according to claim 3, characterized in that: The grinding mechanism (3) is provided with a cleaning assembly (8), the cleaning assembly (8) comprising a fixed groove (81), a fan (82), an air supply pipe (83), an air outlet pipe (84) and a protective net (85); the outer wall of the machine body (31) is provided with a fixed groove (81), the fan (82) is installed inside the fixed groove (81), the inner wall of the fixed groove (81) is connected with an air supply pipe (83), one end of the air supply pipe (83) is fixed with an air outlet pipe (84), and the inner wall of the fixed groove (81) is provided with a protective net (85).

8. The microelectronic chip packaging device according to claim 4, characterized in that: The slide grooves (41) are symmetrically opened about the central axis of the machine body (31), and the mounting blocks (42) are evenly spaced on the machine body (31).

9. The microelectronic chip packaging device according to claim 1, characterized in that: One end of the torsion spring (23) is connected to the heating plate (14), and the other end of the torsion spring (23) is connected to the clamping plate (24).

10. A microelectronic chip packaging process, using a microelectronic chip packaging device according to any one of claims 1 to 9, characterized in that: The following steps are involved: S1, first remove a layer of peeling layer and directly stick the film on the back of the frame, fix the frame on the heating plate (14) through a clamping mechanism after bonding, and then press the heating plate (14) downward through a push rod (13) to contact with the heating seat (12), and then apply pressure to level it, and use the characteristic of the adhesive layer becoming soft under high temperature to make the frame and the film fully contact; S2, remove the remaining peeling layer from the baked frame, place the frame side on the processing seat (34), and grind and level it with a grinding disc (37) to remove the excess adhesive layer; S3, the frame after grinding and leveling is transferred to the film laminating machine (1) again through the robot arm (6), and the ultra-thin rigid fixture is installed on the heating seat (12) before transportation, and then the microelectronic chip frame is installed on the heating plate (14), and then the film is pressed up and down onto the ultra-thin rigid fixture by the heating plate (14), and then the microelectronic chip frame is transferred to the packaging machine (5) for packaging.

Images