Layered adjustment type storage carrying mechanism for photovoltaic silicon wafers

Abstract

The invention discloses a layered adjustable storage photovoltaic silicon wafer carrying mechanism which comprises a base forming the carrying mechanism and a support installed on the upper end face of the base, the support is of a U-shaped structure and is inversely buckled on the left side and the right side of the base, and the front side and the rear side of the base and the area above the support form an open intervention space. Meanwhile, a supporting mechanism is installed on the inner surface of the support and used for supporting the silicon wafer from the lower portion and automatically folding when the silicon wafer below the supported silicon wafer moves upwards. According to the carrying mechanism for the photovoltaic silicon wafers stored in the layered adjustment mode, the layered storage supporting mechanism is designed, although the carrying capacity can be reduced to a certain degree, the carrying stability of the silicon wafers can be remarkably improved, the moving resistance in the silicon wafer transportation process can be synchronously reduced, meanwhile, dust and impurities on the surfaces of the silicon wafers can be automatically cleaned, and the service life of the silicon wafers is prolonged. The processing quality of subsequent silicon wafers is effectively improved, and the burden of workers is reduced.

Description

Technical Field

[0001] The present invention relates to the field of photovoltaic silicon wafer processing technology, and in detail to a method or device specifically suitable for manufacturing or processing semiconductor or solid devices or their components, and specifically to a transport mechanism for photovoltaic silicon wafers with layered adjustable storage. Background Art

[0002] Photovoltaic silicon wafers are thin overall and have low rigidity. Therefore, during the processing and production process, a specific transport mechanism is required to transfer and transport between processing steps. For example, a silicon wafer transport device with announcement number CN102897488B in the prior art includes: a support frame with a track, the track is provided with a wheel groove; and a carrying trolley located on the support frame and provided with a silicone roller that rolls with the wheel groove. The silicon wafer transport device provided by this invention reduces the damage of silicon wafers during transportation, thereby reducing the production cost of silicon wafer manufacturers; Or a silicon wafer carrying tray and a transport water tank with the same with the announcement number CN115440636B. The silicon wafer carrying tray of the invention can stack several silicon wafers obliquely in a slot, and the silicon wafers rely on their own gravity to be close to the stopper and are clamped and fixed by two stoppers, which effectively prevents the silicon wafers from shaking left and right relative to the tray during transportation, and the silicon wafers from hitting the inner wall of the side and causing the edge of the silicon wafer to break; when the silicon wafers need to be taken out of the tray one by one, the side can be removed or opened to eliminate the restriction of the side on the silicon wafers, which can avoid the problem of the silicon wafers hitting the inner wall of the side wall when the inserter drives the silicon wafers to move from the slot one by one; The above-mentioned prior art has great technical innovations in improving the carrying capacity of the carrying mechanism and the anti-collision protection of silicon wafers, and has produced great positive effects on the production of silicon wafers. However, as stated in the above-mentioned prior art, although the stacked direct contact between silicon wafers will improve the carrying capacity, when dust and impurities exist between silicon wafers, it will affect the subsequent processing quality and increase the overall movement resistance of the carrying mechanism in the environment. Summary of the invention

[0003] The purpose of the present invention is to provide a transport mechanism for photovoltaic silicon wafers with layered adjustable storage, so as to solve the problem mentioned in the above background technology that although the direct contact between the stacked silicon wafers will improve the carrying capacity, when dust impurities exist between the silicon wafers, it will affect the subsequent processing quality and increase the overall movement resistance of the transport mechanism in the environment.

[0004] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a transport mechanism for photovoltaic silicon wafers with layered adjustable storage, comprising a base constituting the transport mechanism and a bracket installed on the upper end surface of the base, wherein the bracket is in a U-shaped structure and is inverted on the left and right sides of the base, and forms an open intervention space on the front and rear sides of the base and the area above the bracket, and a supporting mechanism is installed on the inner surface of the bracket, which is used to support silicon wafers from below and automatically fold when the silicon wafer below the supported silicon wafer moves up.

[0005] As a further feature, the support mechanism includes a support plate and a groove for accommodating the rotated support plate, wherein the groove is provided on opposite sides of the two brackets, and the bottom end of the support plate is rotatably installed in the groove via a pin shaft.

[0006] Furthermore, an elastic layer is provided on the left and right sides of the inner wall of the support plate respectively. The elastic layer is used to connect the support plate and the groove before the support plate rotates, and is deformed and accommodated in the groove after the support plate rotates. At the same time, the top height of the elastic layer in the initial state is higher than the top height of the adjacent support plate.

[0007] As a further feature, horizontally distributed suction cups are provided in the space formed by the support plate, the elastic layer connected to the inner wall of the support plate, and the groove enclosure, and the top of the suction cup is also located above the support plate.

[0008] Furthermore, the bottom end of the suction cup is connected to the sliding rod and communicated with the hollow structure in the sliding rod, and the sliding rod is connected to the negative pressure mechanism, and the negative pressure mechanism is used to draw the suction cup to negative pressure, wherein the sliding rod, which is distributed parallel to the support plate in the initial state, is installed on the bracket by a spring tilt sliding, wherein the bottom end of the sliding rod is connected to the traction frame, wherein the traction frame is connected to the traction mechanism arranged in the base, and is used to drive the traction frame to move, thereby driving the suction cup to separate from or approach the silicon wafer.

[0009] Furthermore, the traction mechanism includes a base plate, which is vertically slidably installed on the upper end surface of the base, and the edge of the base plate is connected to the bottom end of the traction frame through a pull rope wound on a roller, and the up and down movement of the base plate drives the traction frame to reciprocate along the axis direction of the slide rod through the pull rope.

[0010] Furthermore, the bottom plate is slidably mounted on the top of the base through a vertically distributed rod, and the bottom end of the rod is fixed to the upper end surface of the skateboard, wherein the skateboard is vertically slidably mounted in a cavity opened inside the base, and the lower end surface of the skateboard is connected to a pressure plate located below the base, and the upper end surface of the pressure plate is slidably connected to the base through a spring rod, and the lower end surface of the pressure plate is fitted with the side surface of a cam installed at the end of the output shaft, wherein the output shaft is connected to a driving motor installed on the lower end surface of the base.

[0011] As a further feature, the internal space of the cavity below the slide plate is connected to the internal space of the slide rod through the first air pipe.

[0012] Furthermore, the internal space of the cavity above the slide plate is connected to the air cavity opened in the bracket through the second air pipe, and the air cavity is connected to the blowing hole inside the groove connected to the output end. At the same time, the sliding rod located in the groove is a flat structure, and the airflow blown out of the blowing hole is blown toward the lower end surface of the silicon wafer through the guidance of the flat section and the support plate.

[0013] Compared with the prior art, the beneficial effects of the present invention are as follows: the transport mechanism for photovoltaic silicon wafers with layered adjustable storage is designed with a layered storage support mechanism, which, although it will reduce the carrying capacity to a certain extent, will significantly improve the carrying stability of the silicon wafers, and simultaneously reduce the movement resistance during the transportation of the silicon wafers, and can automatically clean the dust and impurities on the surface of the silicon wafers, effectively improve the subsequent processing quality of the silicon wafers, and reduce the burden on the staff, as shown in the following details: 1. The structural design of the support plate and the elastic layer, combined with the rotatable setting of the support plate itself, can utilize the buffering effect of the elastic layer combined with the rigid support of the support plate to effectively store silicon wafers in layers. At the same time, the rotatable setting of the support plate will ensure that the multi-directional removal of silicon wafers will not be affected. At the same time, combined with the unique structural design of the bracket, the movement resistance of the carrier mechanism is effectively reduced; 2. The suction cup structure is used in the groove, which can utilize the negative pressure adsorption effect to further improve the stability of the silicon wafer during transportation. The structural design of the traction frame, the pull rope and the bottom plate can utilize the movement of the slide plate to generate driving force and pull the suction cup to be stored or extended in the groove, respectively meeting the different needs of taking out and placing the silicon wafer; Furthermore, the structural design of the slide plate, the air pipe and the air cavity can, by utilizing the movement of the slide plate, link the air pressure in the lower half space of the air cavity with the air pressure state in the suction cup, and cooperate with the movement of the suction cup itself to produce negative pressure adsorption and positive pressure detachment effects respectively. At the same time, the use of the blowing hole and the guidance of the slide rod and the support plate can be utilized, and the slide plate can automatically clean the airflow on the lower surface of the silicon wafer during its movement, without the need for additional electrical control equipment, which is more energy-saving and environmentally friendly. BRIEF DESCRIPTION OF THE DRAWINGS

[0014] Figure 1 This is a schematic diagram of the overall structure of Embodiment 1 of the present invention; Figure 2 This is a schematic diagram of the support plate distribution structure of the present invention; Figure 3 This is a schematic diagram of the groove distribution structure of the present invention; Figure 4 This is a schematic diagram of the overall structure of Embodiment 2 of the present invention; Figure 5This is a schematic diagram of the bottom plate distribution structure of the present invention; Figure 6 This is a schematic diagram of the distribution structure of the slide plate of the present invention; Figure 7 This is a schematic diagram of the cam distribution structure of the present invention; Figure 8 This is a schematic diagram of the overall structure of Embodiment 3 of the present invention; Fig. 9 This is a schematic diagram of the trachea distribution structure of the present invention; Fig.10 This is a schematic diagram of the air cavity distribution structure of the present invention; Fig.11 It is a schematic diagram of the structure of the slide bar and the support plate guiding the airflow of the present invention.

[0015] In the figure: 1. base; 2. bracket; 3. support plate; 4. elastic layer; 5. groove; 6. pin shaft; 7. suction cup; 8. slide bar; 9. traction frame; 10. pull rope; 11. roller; 12. bottom plate; 13. slide plate; 14. cavity; 15. pressure plate; 16. cam; 17. output shaft; 18. first air pipe; 19. second air pipe; 20. air cavity; 21. blowing hole. DETAILED DESCRIPTION

[0016] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0017] See also Figure 1-Figure 11 , the present invention provides the following technical solutions: Embodiment 1: In this embodiment, in order to solve the problems existing in the prior art, the following is disclosed: Figure 1-Figure 2The scheme shown includes a base 1 constituting a transport mechanism and a bracket 2 installed on the upper end surface of the base 1. The bracket 2 is in a U-shaped structure and is inverted on the left and right sides of the base 1, so that the front and rear sides of the base 1 and the area above the bracket 2 form an open intervention space. At the same time, a support mechanism is installed on the inner surface of the bracket 2. The support mechanism is used to support silicon wafers from below and automatically fold when the silicon wafer below the supported silicon wafer moves up. The support mechanism includes a support plate 3 and a groove 5 for accommodating the rotated support plate 3, wherein the groove 5 is provided on the opposite sides of the two brackets 2, wherein the bottom end of the support plate 3 is rotatably installed in the groove 5 by a pin 6. Under normal conditions, silicon wafers are placed layer by layer on top of each support mechanism. The support plate 3 in the support mechanism is initially in an inclined distribution. When the top end is subjected to force, it will have a tendency to deflect in the direction away from the bracket 2 on which it is installed, so that the whole will maintain In the inclined distribution state, the silicon wafers are distributed layer by layer in the carrier mechanism, thereby reducing the resistance to movement in a pure water environment and avoiding damage caused by dust and debris and the mutual adhesion of silicon wafers. At the same time, when removing the silicon wafer, the clamp or suction cup 7 can be fixed from the lower end surface of the silicon wafer from bottom to top, and then the silicon wafer can be taken out from the carrier mechanism by translation. Since the front and rear areas of the bracket 2 are both open spaces, it not only reduces the overall load of the carrier mechanism, but also improves the operating range, and is very convenient to use. The silicon wafers can also be taken out from top to bottom, layer by layer in a vertical direction. After the top silicon wafer is taken out, the lower silicon wafers are moved up layer by layer. During the movement, the support plate 3 in contact with the silicon wafer will rotate around the pin shaft 6 accordingly until it fits in the groove 5, thereby avoiding blocking the use of the silicon wafer. At the same time, soft buffer materials can also be used on the contact surface between the support plate 3 and the silicon wafer.

[0018] In this embodiment, it is further disclosed that Figure 3 The scheme focuses on the use of the elastic layer 4. An elastic layer 4 is respectively arranged on the left and right sides of the inner wall of the support plate 3. The elastic layer 4 is used to connect the support plate 3 and the groove 5 before the support plate 3 rotates, and is deformed and stored in the groove 5 after the support plate 3 rotates. At the same time, the top height of the elastic layer 4 in the initial state is higher than the top height of the adjacent support plate 3. On the one hand, it is to prevent the silicon wafer from direct contact with the support plate 3 when placed vertically, and to avoid possible collision and scratching. On the other hand, the static friction between the elastic layer 4 and the silicon wafer is used to improve the stability of the silicon wafer placed in the carrier mechanism.

[0019] Embodiment 2: The solution disclosed in this embodiment further discloses how to further strengthen the connection stability between the silicon wafer and the carrier mechanism, such as Figure 4-Figure 5As shown, a horizontally distributed suction cup 7 is arranged in the space formed by the support plate 3, the elastic layer 4 connected to the inner wall of the support plate 3, and the groove 5 enclosure, and the top of the suction cup 7 is also located above the support plate 3, and the bottom end of the suction cup 7 is connected to the slide rod 8 and communicated with the hollow structure in the slide rod 8, and the slide rod 8 is connected to the negative pressure mechanism, and the negative pressure mechanism is used to draw the suction cup 7 to negative pressure, wherein the slide rod 8 parallel to the support plate 3 in the initial state is installed on the bracket 2 by a spring tilt sliding, wherein the bottom end of the slide rod 8 is connected to the traction frame 9, wherein the traction frame 9 is connected to the traction mechanism arranged in the base 1, and is used to drive the traction frame 9 to move so as to drive the suction cup 7 to leave or approach the silicon wafer, and the traction mechanism includes a bottom plate 12, wherein the bottom plate 12 is vertically slidably installed on the upper end surface of the base 1, wherein the bottom The edge of the plate 12 is connected to the bottom end of the traction frame 9 through a pull rope 10 wound on the roller 11, wherein the up and down movement of the bottom plate 12 drives the traction frame 9 to reciprocate along the axial direction of the slide bar 8 through the pull rope 10. The means adopted in this scheme is to add a plurality of movable suction cups 7, wherein the upper end surface of the bottom plate 12 can be used to place silicon wafers, or it can only be used as a traction mechanism and move up and down under the control of the electric drive device. When it moves downward, the rebound effect of the spring on the slide bar 8 will pull the slide bar 8 and the traction frame 9 in the direction close to the bracket 2, so that the suction cup 7 will move out of the groove 5 and contact the silicon wafer. Conversely, when the bottom plate 12 moves upward, the pull rope 10 will pull the traction frame 9 in the direction away from the bracket 2, so that the suction cup 7 can be recovered into the groove 5.

[0020] In this embodiment, the following scheme for driving the bottom plate 12 to move is further disclosed: Figure 6-Figure 7 As shown, the bottom plate 12 is slidably mounted on the top of the base 1 through a vertically distributed rod, and the bottom end of the rod is fixed to the upper end surface of the slide plate 13, wherein the slide plate 13 is vertically slidably mounted in a cavity 14 opened inside the base 1, and the lower end surface of the slide plate 13 is connected to a pressure plate 15 located below the base 1, and the upper end surface of the pressure plate 15 is slidably connected to the base 1 through a spring rod, and the lower end surface of the pressure plate 15 is fitted with the side surface of a cam 16 installed at the end of an output shaft 17, wherein the output shaft 17 is installed with the lower end surface of the base 1 The driving machine is connected to the driving machine. The driving machine installed on the lower end surface of the base 1 can be a device such as a motor that drives the output shaft 17 to rotate, or an electric control push rod directly connected to the lower end surface of the slide plate 13 can be used to replace the cam 16 and other mechanisms. The output shaft 17 drives the cam 16 to rotate, and the slide plate 13 is driven to reciprocate up and down through the rebound effect of the pressure plate 15 and the spring part on the pressure plate 15, thereby driving the bottom plate 12 to reciprocate to produce a driving effect. The reason for adopting the above-mentioned relatively complex solution is that the above-mentioned solution can also achieve the effect shown in the following embodiment three.

[0021] Example 3: For details, please refer to Figure 8-Figure 11As shown in the figure, the internal space of the cavity 14 below the slide 13 is connected with the internal space of the slide bar 8 through the first air pipe 18, and the internal space of the cavity 14 above the slide 13 is connected with the air cavity 20 opened in the bracket 2 through the second air pipe 19, and the air cavity 20 is connected with the blowing hole 21 inside the groove 5 connected to the output end. At the same time, the slide bar 8 located in the groove 5 is a flat structure, and the air flow blown out of the blowing hole 21 is blown to the lower end surface of the silicon wafer through the guidance of the flat section and the support plate 3. When the slide 13 moves downward, the cavity 14 below it is in a high-pressure state. At this time, the air flow enters the slide bar 8 and the suction cup 7 through the first air pipe 18, so the silicon wafer placed above it will be separated from the adsorption of the suction cup 7 Contact, thereby facilitating the separation of the silicon wafer and the carrier mechanism. After the silicon wafer is placed, the slide plate 13 can be controlled to move upward, and the internal space of the cavity 14 below it will be in a negative pressure state. At this time, the suction cup 7 will be in a negative pressure state while extending out of the groove 5 and complete the adsorption and fixation of the silicon wafer. At the same time, the internal space of the cavity 14 above the slide plate 13 will be in a high pressure state, so airflow will be generated and enter the air cavity 20 through the second air pipe 19, and finally flow along the blowing hole 21 and the inclined air duct formed by the slide rod 8 and the support plate 3, and act on the bottom of the silicon wafer, completing the auxiliary cleaning of the silicon wafer, and also avoiding dust residue on the surface during the transportation process before transportation, which is convenient for subsequent efficient processing.

[0022] Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present invention, and that the scope of the present invention is defined by the appended claims and their equivalents.

Claims

1. A transport mechanism for photovoltaic silicon wafers with layered adjustable storage, comprising a base (1) constituting the transport mechanism and a bracket (2) mounted on the upper end surface of the base (1), characterized in that: The support (2) is in a U-shaped structure and is inverted on the left and right sides of the base (1), so that the front and rear sides of the base (1) and the area above the support (2) form an open intervention space. At the same time, a support mechanism is installed on the inner surface of the support (2), which is used to support the silicon wafer from below and automatically fold when the silicon wafer below the supported silicon wafer moves upward.

2. The transport mechanism for photovoltaic silicon wafers with layered adjustable storage according to claim 1, characterized in that: The support mechanism comprises a support plate (3) and a groove (5) for accommodating the rotated support plate (3), wherein the groove (5) is provided on opposite surfaces of the two brackets (2), and the bottom end of the support plate (3) is rotatably mounted in the groove (5) via a pin shaft (6).

3. The transport mechanism for photovoltaic silicon wafers with layered adjustable storage according to claim 2, characterized in that: An elastic layer (4) is provided on the left and right sides of the inner wall of the support plate (3), respectively. The elastic layer (4) is used to connect the support plate (3) and the groove (5) before the support plate (3) rotates, and is deformed and accommodated in the groove (5) after the support plate (3) rotates. At the same time, the top height of the elastic layer (4) in the initial state is higher than the top height of the adjacent support plate (3).

4. The transport mechanism for photovoltaic silicon wafers with layered adjustable storage according to claim 3 is characterized in that: A horizontally distributed suction cup (7) is provided in the space formed by the support plate (3), the elastic layer (4) connected to the inner wall of the support plate (3), and the enclosure of the groove (5), and the top end of the suction cup (7) is also located above the support plate (3).

5. The transport mechanism for photovoltaic silicon wafers with layered adjustable storage according to claim 4, characterized in that: The bottom end of the suction cup (7) is connected to the slide bar (8) and communicates with the hollow structure in the slide bar (8), and the slide bar (8) is connected to the negative pressure mechanism, and the negative pressure mechanism is used to draw the suction cup (7) to a negative pressure, wherein the slide bar (8) which is parallel to the support plate (3) in the initial state is installed on the bracket (2) by means of a spring tilting slide, wherein the bottom end of the slide bar (8) is connected to the traction frame (9), wherein the traction frame (9) is connected to the traction mechanism arranged in the base (1), and is used to drive the traction frame (9) to move, thereby driving the suction cup (7) to leave or approach the silicon wafer.

6. The transport mechanism for photovoltaic silicon wafers with layered adjustable storage according to claim 5, characterized in that: The traction mechanism comprises a bottom plate (12), wherein the bottom plate (12) is vertically slidably mounted on the upper end surface of the base (1), wherein the edge of the bottom plate (12) is connected to the bottom end of the traction frame (9) via a pull rope (10) wound on a roller (11), wherein the up and down movement of the bottom plate (12) drives the traction frame (9) to reciprocate along the axis direction of the slide rod (8) via the pull rope (10).

7. The transport mechanism for photovoltaic silicon wafers with layered adjustable storage according to claim 6, characterized in that: The bottom plate (12) is slidably mounted on the top of the base (1) via a vertically distributed rod, and the bottom end of the rod is fixed to the upper end surface of the slide plate (13), wherein the slide plate (13) is vertically slidably mounted in a cavity (14) opened inside the base (1), and the lower end surface of the slide plate (13) is connected to a pressure plate (15) located below the base (1), the upper end surface of the pressure plate (15) is slidably connected to the base (1) via a spring rod, and the lower end surface of the pressure plate (15) is in contact with the side surface of a cam (16) mounted at the end of an output shaft (17), wherein the output shaft (17) is connected to a driving machine mounted on the lower end surface of the base (1).

8. The transport mechanism for photovoltaic silicon wafers with layered adjustable storage according to claim 7, characterized in that: The internal space of the cavity (14) below the slide plate (13) is connected to the internal space of the slide rod (8) via the first air pipe (18).

9. A transport mechanism for photovoltaic silicon wafers with layered adjustable storage according to claim 7 or 8, characterized in that: The internal space of the cavity (14) above the slide plate (13) is connected to the air cavity (20) opened in the bracket (2) through the second air pipe (19), and the air cavity (20) is connected to the blowing hole (21) inside the groove (5) at the output end. At the same time, the slide bar (8) located in the groove (5) is a flat plate structure, and the airflow blown out of the blowing hole (21) is blown toward the lower end surface of the silicon wafer through the guidance of the flat plate section and the support plate (3).

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