Graphene heating sheet constant temperature control method, integrated circuit, system and manufacturing method

Abstract

The invention provides a graphene heating sheet constant temperature control method, an integrated circuit, a manufacturing method and a distributed graphene heating sheet temperature control system. The graphene heating sheet constant temperature control method comprises the steps that two power supply wires are connected to a power supply terminal of a main control circuit board and used for powering on a graphene coating layer of a graphene heating sheet; the temperature control IC is used for measuring the temperature value of the graphene coating layer and directly transmitting the measured temperature value to the constant-temperature micro circuit module; the temperature control IC switches on or off a driving power tube of the constant-temperature micro circuit module according to the temperature measurement value; whether the graphene coating layer is powered on or not is controlled by switching on or switching off the driving power tube; and according to the temperature measurement value, performing closed-loop control on constant-temperature work of the graphene coating layer by adaptively switching the power-on state of the graphene coating layer. According to the invention, the product control system concentration and software complexity are simplified, and the product stability and reliability are enhanced.

Description

[Technical field]

[0001] The present invention relates to the field of electric heating technology, and more specifically, to a constant temperature control method for a graphene heating sheet, an integrated circuit and a manufacturing method thereof, and a distributed graphene heating sheet temperature control system. [Background technology]

[0002] The heating sheet in the prior art includes metal alloy heating element, ceramic heating element, carbon fiber heating element or graphene heating element. The heating element is powered to generate heat, thereby continuously releasing heat, so that the human body or human body parts are maintained in a warm environment, playing the role of cold protection, physical therapy, etc. Among them, the graphene heating element generally uses PET as a thermoplastic polyester engineering plastic as a substrate. On the substrate, through process processing (such as methane in a high temperature environment, carbon atoms are separated, and carbon atoms are precipitated on the substrate to form an incomplete graphene layer), these incomplete graphene layers have resistance due to the gaps in the middle. After the power supply is loaded, the resistance generates heat and emits far infrared rays (heat). The electric heat conversion efficiency is high, the heating and temperature control speed is fast, and the service life is long.

[0003] The infrared radiation generated by the graphene heating sheet has good medical and physical therapy effects. Graphene materials can emit high-purity, high-intensity far-infrared life light waves, which have almost the same spectrum as the human body. They can effectively activate biological molecules such as nucleic acids and proteins in body cells, improve blood circulation, reduce inflammation, and relieve pain, and are particularly suitable for the field of physical therapy.

[0004] In the field of mass health massage consumer electronics products today, especially in the field of smart massage chairs and smart massage mattresses, which are still in the latent stage of the blue ocean market, the use of microprocessor (Microcontroller Unit, MCU) chips as product intelligent control technology has become the only choice for all electronic R&D engineers engaged in mass health products. However, with the substantial increase in product volume (or area) and the increase in the number of MCU software control objects, the pin resources and software system complexity on the MCU chip are overwhelmed, and sometimes even multi-core MCU system control architectures have to be considered. For example, in products such as smart massage chairs and smart massage mattresses, there is a need for constant temperature control of multi-zone graphene far-infrared heating pads.

[0005] Traditional small-volume massage products (such as eye masks, shoulder and neck massagers, etc.) have relatively simple functions and the MCU is very close to the controlled object (within 300mm in a straight line), so the MCU will not have a lot of chip pin resource pressure and high control software complexity, especially the electromagnetic compatibility in a strong electromagnetic interference environment. However, large-volume (large-area) health and massage products such as smart massage chairs and smart massage mattresses are completely different. If the traditional centralized control architecture is still used, then each additional graphene far-infrared hot compress area means adding 4 transmission wires to the product main control board, 2 of which are used for power supply and 2 for NTC temperature sensor (Negative Temperature Coefficient Sensor) measurement signal feedback.

[0006] If the product requirements of smart massage chairs and smart massage mattresses are defined as at least 3 graphene far-infrared heat-compression areas (in Chinese medicine meridian theory: upper, middle and lower), then at least 12 transmission wires are required, which is affordable for small-volume products (such as the difficulty of processing and labor costs of production line workers during mass production). However, for large-volume (large-area) products such as smart massage chairs and smart massage mattresses, it is necessary to consider how to simplify the complexity of the product system and reduce the comprehensive manufacturing costs during mass production at the beginning of product design, and at the same time, special emphasis is placed on how to ensure the product's MCU anti-electromagnetic interference capability in a strong electromagnetic interference environment.

[0007] For such large-volume products, how to find a core component, the heating element, that can both simplify the complexity of the product and enhance the stability and reliability of the product has become a technical problem that technical personnel in this field urgently need to solve. [Summary of the invention]

[0008] In view of this, the present invention provides a novel graphene-based heating sheet device and a manufacturing method thereof to solve the above problems. One of the purposes of the present invention is to optimize the structure of the far-infrared graphene heating sheet, which is the core health treatment component of large-volume (large-area) products such as smart massage chairs and smart massage mattresses, simplify the complexity of the product circuit board, and realize the independent temperature control component management of each area.

[0009] According to an embodiment of the present invention, a method for controlling the constant temperature of a graphene heating sheet is provided, comprising: connecting two power supply wires to the power supply terminals of a main control circuit board to energize a graphene coating layer (220) of the graphene heating sheet; measuring the temperature value of the graphene coating layer (220) and directly transmitting the temperature measurement value to a temperature control IC (360) of a constant temperature microcircuit module (300); the temperature control IC (360) turns on or off a driving power tube (350) of the constant temperature microcircuit module (300) according to the temperature measurement value; controlling whether the graphene coating layer (220) is energized by turning on or off the driving power tube (350); and controlling the constant temperature operation of the graphene coating layer (220) in a closed loop by adaptively switching the energized state of the graphene coating layer (220) according to the temperature measurement value.

[0010] Furthermore, it also includes: electrically connecting the copper foil circuit layer (210) to the graphene coating layer (220), wherein the copper foil circuit layer (210) is arranged between the insulating and heat-insulating base layer (200) of the graphene heating sheet and the graphene coating layer (220).

[0011] Furthermore, the method further comprises: electrically connecting the electric power output pad (380) of the constant temperature microcircuit module (300) to the electrode pad (211) of the copper foil circuit layer (210) through a copper rivet (370), riveting, and then soldering to fasten them together.

[0012] Furthermore, it also includes: when the driving power tube (350) is turned on, the power output pad (380) is energized via the two power supply wires; the electrode pad (211) is electrically connected via the copper rivet (370), and the copper foil circuit layer (210) is energized; and the graphene coating layer (220) is energized by electrically connecting the copper foil circuit layer (210).

[0013] Furthermore, it also includes: when the temperature measurement value of the graphene coating layer (220) is lower than the constant temperature target value, the driving power tube (350) is turned on to enable the graphene coating layer (220) to be powered on and generate heat and increase in temperature; when the temperature measurement value of the graphene coating layer (220) reaches the constant temperature target value, the driving power tube (350) is turned off to enable the graphene coating layer (220) to be powered off and cooled.

[0014] Furthermore, the constant temperature target value is a constant temperature target interval value.

[0015] Furthermore, it also includes: bonding a temperature sensor to the graphene coating layer (220) via an insulating thermally conductive adhesive to measure the temperature value of the graphene coating layer (220).

[0016] According to another embodiment of the present invention, a graphene heating sheet integrated circuit is provided, comprising: an insulating and heat-insulating base layer (200); a graphene coating layer (220) which generates heat and produces far-infrared energy waves when powered on; a copper foil circuit layer (210) located between the insulating and heat-insulating base layer (200) and the graphene coating layer (220) and used for electrically connecting the graphene coating layer (220); and a constant temperature microcircuit module (300) which is used for closed-loop controlling the constant temperature operation of the graphene coating layer (220) by adaptively switching the power-on state of the graphene coating layer (220) according to the temperature measurement value of the graphene coating layer (220).

[0017] Furthermore, the constant temperature microcircuit module (300) further comprises: a temperature control IC (360) for controlling the constant temperature operation of the graphene coating layer (220); a linear three-terminal voltage regulator IC (340) for providing a stable operating voltage for the temperature control IC (360); an electric power output pad (380); and two power supply wires (310, 320) for connecting to power supply terminals of a main control circuit board to supply power to the graphene coating layer (220) of the graphene heating sheet. The graphene coating layer (220) is electrically connected to the electrode pad (211) of the copper foil circuit layer (210) by a copper rivet (370), and the electrode pad (211) of the copper foil circuit layer (210) is electrically connected to the electrode pad (211) of the copper foil circuit layer (210) by riveting and then soldering.

[0018] Furthermore, the temperature sensing probe (330) is bonded to the graphene coating layer (220) via an insulating thermally conductive adhesive to measure the temperature value of the graphene coating layer (220).

[0019] Furthermore, the temperature sensor is a negative temperature coefficient resistance temperature sensor.

[0020] Furthermore, when the temperature measurement value of the graphene coating layer (220) is lower than the constant temperature target value, the driving power tube (350) is turned on to enable the graphene coating layer (220) to be powered on and generate heat and increase in temperature; when the temperature measurement value of the graphene coating layer (220) reaches the constant temperature target value, the driving power tube (350) is turned off to enable the graphene coating layer (220) to be powered off and cooled.

[0021] Furthermore, the constant temperature target value is a constant temperature target interval value.

[0022] Furthermore, the graphene heating sheet integrated circuit also includes a protective film layer located above the graphene coating layer (220).

[0023] According to another embodiment of the present invention, a method for manufacturing a graphene heating sheet integrated circuit is provided, comprising: providing an insulating and heat-insulating base layer (200); providing a copper foil circuit layer (210) for electrically connecting a graphene coating layer (220) on the insulating and heat-insulating base layer (200); laying the graphene coating layer (220) on the copper foil circuit layer (210); electrically connecting an electric power output pad (380) of a constant temperature microcircuit module (300) to an electrode pad (211) of the copper foil circuit layer (210) via a copper rivet (370), riveting, and then soldering to fasten them together; wherein the constant temperature microcircuit module (300) is used to switch the power-on state of the graphene coating layer (220) to control the constant temperature operation of the graphene coating layer (220) in a closed loop. Furthermore, it also includes: connecting two power supply wires (310, 320) of the constant temperature microcircuit module (300) to the power supply terminals of the main control circuit board to energize the graphene coating layer (220) of the graphene heating sheet.

[0024] Furthermore, the method further comprises: bonding a temperature sensing probe (330) of a temperature sensor to the graphene coating layer (220) via an insulating thermally conductive adhesive, so as to measure the temperature value of the graphene coating layer (220) and directly transmit the temperature measurement value to the constant temperature microcircuit module (300).

[0025] Furthermore, laying the graphene coating layer (220) on the copper foil circuit layer (210) further comprises: laying a plurality of graphene coating layer blocks on the copper foil circuit layer (210) in sequence to cover the copper foil strips of the copper foil circuit layer (210).

[0026] Furthermore, the copper foil circuit layer (210) is a hollow copper foil strip.

[0027] Furthermore, the method for manufacturing a graphene heating sheet integrated circuit also includes: providing a protective film layer above the graphene coating layer (220).

[0028] According to another embodiment of the present invention, there is provided a distributed temperature control system, comprising: at least one graphene heating sheet integrated circuit of the aforementioned embodiment; and a circuit main control board, including an MCU, wherein the heating sheet power supply terminal of the main control board is connected to two power supply wires of the graphene heating sheet integrated circuit, so as to energize the graphene coating layer (220) of the graphene heating sheet.

[0029] According to the embodiments of the present invention, the graphene-based heating sheet device and its manufacturing method simplify the product control system centralization and software complexity, reduce the mass production assembly labor cost, and enhance product stability and reliability. It is a valuable practical action for the New Product Introduction (NPI) front product development team (PDT) of enterprises in the field of big health electronic consumer product manufacturing.

Brief Description of the Drawings

[0030] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on the provided drawings without paying creative work.

[0031] Figure 1 Schematic diagram of an independent constant temperature hot compress component of a distributed temperature control system according to an embodiment of the present invention.

[0032] Figure 2 Schematic diagram of a thermostatically controlled microcircuit module according to an embodiment of the present invention.

[0033] Figure 3 Schematic diagram of a copper rivet and a power drive output pad of a thermostatically controlled microcircuit module according to an embodiment of the present invention.

[0034] Figure 4 Schematic diagram of the copper foil circuit layer electrode pad and the NTC temperature sensor according to an embodiment of the present invention.

[0035] Figure 5 Schematic diagram of each layer of a graphene heating sheet according to an embodiment of the present invention.

[0036] Figure 6 Schematic diagram of a power supply pad and a power output pad of a thermostatically controlled microcircuit module according to an embodiment of the present invention.

[0037] Figure 7 Schematic diagram of a temperature control IC and copper rivets of a constant temperature control microcircuit module according to an embodiment of the present invention.

[0038] 8(a)-(b) are schematic diagrams of independent temperature control components according to an embodiment of the present invention.

[0039] Fig. 9 10(a) to (l) are schematic diagrams of the steps of the method for manufacturing a graphene heating sheet integrated circuit according to an embodiment of the present invention.

[0040] Fig.11 Schematic diagram of a method 1100 for manufacturing a graphene heating sheet integrated circuit according to an embodiment of the present invention.

[0041] Fig.12 Schematic diagram of a distributed graphene heating sheet temperature control system 1200 according to an embodiment of the present invention. [Specific implementation method]

[0042] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0043] The exemplary embodiments and descriptions of the present invention are used to explain the present invention, but are not intended to limit the present invention. In addition, elements / components with the same or similar reference numerals used in the drawings and embodiments are used to represent the same or similar parts.

[0044] The terms "include", "including", "have", "contain", etc. used in this document are open-ended terms, which mean including but not limited to. The term "and / or" used in this document includes any or all combinations of the items mentioned.

[0045] It should also be noted that, in this article, relational terms such as first and second, etc. are used only to distinguish one entity from another entity, and do not necessarily require or imply any such actual relationship or order between these entities. Moreover, the terms "comprises", "comprising" or any other variations thereof are intended to cover non-exclusive inclusion, so that an article or device comprising a series of elements includes not only those elements, but also other elements not explicitly listed, or also includes elements inherent to such article or device. In the absence of further restrictions, an element defined by the sentence "comprising a ..." does not exclude the presence of other identical elements in the article or device comprising the element.

[0046] The present invention provides a novel application structure and manufacturing method of a heating sheet based on graphene. One of the purposes is to structurally integrate the far-infrared graphene heating sheet and the constant temperature control microcircuit module, which are the core health treatment components of large-volume (large-area) products such as smart massage chairs and smart massage mattresses, and abandon the solution in which the temperature sensor NTC measurement signal must be fed back to the product main control circuit board through two signal transmission lines and the MCU centrally performs software temperature closed-loop control in the traditional control architecture, so that the temperature signal transmission lines of each hot compress area of ​​the system are cancelled to zero, and each hot compress area can be independently controlled by constant temperature nearby, thereby simplifying the product system concentration and system software complexity, enhancing the anti-interference ability of the electronic system of multi-area far-infrared hot compress products in a strong electromagnetic field interference environment, and fundamentally realizing the stability and reliability of the product.

[0047] The present invention provides a new application structure of a graphene-based heating sheet, which can realize a distributed constant temperature control system solution for the heating sheet. Figure 1 , Figure 1 It is a schematic diagram of an independent constant temperature heating component 100 (for example, a graphene-based heating sheet) of a distributed temperature control system according to an embodiment of the present invention. The structure may include: an insulating and heat-insulating base layer 200, a copper foil circuit layer 210 for electrically connecting the graphene coating layer, a far-infrared heat radiation graphene coating layer 220, and a microcircuit module 300 for constant temperature control of the graphene heating sheet. The number of blocks and the shape and size of the graphene coating layer 220 can vary accordingly due to the power supply voltage and power size. In some embodiments, the size of the insulating and heat-insulating base layer 200 can be 260mm x130mm, and the size of the microcircuit module 300 can be 24mmx 17mm x1mm (board thickness). It should be noted that the specific size can vary according to the needs of different products, and the relaxed size is given here as an example, not as a limitation of the present invention.

[0048] Figure 5 Schematic diagram of each layer of the graphene heating sheet according to an embodiment of the present invention. On the insulating base layer 200, a copper foil circuit layer 210 is laid, followed by a far-infrared graphene coating layer 220, wherein the copper foil circuit layer 210 includes two electrode pads 211 for electrically connecting to the power output pad 380 of the constant temperature control microcircuit module 300 (see Figure 3). The graphene coating layer 220 is conductive. When it is energized, the entire coating layer will heat up and radiate far-infrared energy waves that have a good effect on the human body. The copper foil circuit layer 210 can be used to electrically connect the graphene coating layer 220, so that the graphene coating layer 220 is energized. The insulating thermal conductive base layer 200 carries the copper foil circuit layer 210 and the graphene coating layer 220, and has the function of insulation and heat insulation. Specifically, its insulation function can prevent the copper foil circuit layer 210 and the graphene coating layer 220 from short-circuiting within the layer, and its heat insulation function can prevent heat from being conducted downward.

[0049] Figure 2 Schematic diagram of a constant temperature control microcircuit module according to an embodiment of the present invention. The microcircuit module 300 may include: a temperature control IC (integrated circuit) 360, a linear three-terminal voltage regulator IC 340 that provides a stable working voltage for the temperature control IC 360, a matching power output drive power tube 350, and a power output pad 380 (see Figure 3 ), power supply wires 310 and 320, and a temperature sensor.

[0050] The temperature control IC 360 can be an MCU, or a dedicated constant temperature integrated circuit, or a linear integrated circuit containing a comparator and a trigger suitable for constant temperature control. The temperature control IC 360 can include an MCU and a dedicated temperature control chip and a linear IC with a circuit structure required for temperature control. In some embodiments, the temperature control IC 360 can use a domestic NE555 integrated circuit chip, which contains 2 comparators and 1 trigger, suitable for constant temperature control. The linear three-terminal voltage regulator IC 340 can be a linear three-terminal voltage regulator to provide a stable working voltage for the internal circuit of the constant temperature module. It can use the HT7550 chip. The electric power output drive power tube 350 is a power switch tube, and whether it is on or off can be determined by the temperature measurement value of the NTC temperature sensor. It can use AO3404. These components are all low-priced and can effectively reduce the cost of the constant temperature control microcircuit module 300.

[0051] The temperature sensor may be an NTC temperature sensor, for example, with a resistance of 10K, used for temperature measurement, and includes a temperature sensing probe 330 (see Figure 4 ). Figure 4 It is a schematic diagram of the copper foil circuit layer electrode pad and the NTC temperature sensor of an embodiment of the present invention. The temperature sensing probe 330 of the NTC temperature sensor for temperature measurement on the constant temperature control microcircuit module 300 can be tightly attached to the graphene coating layer 220 through an insulating thermal conductive adhesive.

[0052] The power supply wires 310 and 320 of the constant temperature control microcircuit module 300 can be connected to the heating plate power supply terminals of the product's main control circuit board over a long distance, such as the main control circuit board heating plate power supply terminals in the electrical control box of a smart massage mattress. For example, the transmission power of the power supply wires 310 and 320 can be 10W / 12V, and the wire length is at least 2M. In this way, the measurement signal of the NTC temperature sensor on the far-infrared thermal radiation graphene heating sheet no longer needs to be fed back to the MCU on the main control circuit board of the big health massage product through an additional transmission line for centralized software temperature closed-loop control. The new application structure of the far-infrared graphene heating sheet of the present invention can be used as an independent constant temperature hot compress component of a distributed temperature control system. Figure 2 For example, except for two power supply wires, the constant temperature microcircuit module 300 has no other connection with the main control circuit board MCU, such as the temperature control IC 360, the voltage regulator IC 340, the drive power tube 350, and the temperature sensor have no connection with the main control circuit board MCU, that is, the graphene heating sheet integrated circuit element is only connected to the power supply terminal of the main control circuit board through two power supply wires 310 and 320, thereby reducing the required signal lines from the traditional 4 to 2. The MCU of the main control circuit board can be responsible for the system management and control of large health products, such as product human-computer interaction, massage air bag inflation and deflation control, many solenoid valve gas circuit on-off control, air pump work stop control, graphene far-infrared multi-zone hot compress control, and many service mode controls.

[0053] See also Figure 3 , Figure 3 Schematic diagram of copper rivets and power drive output pads of a thermostatically controlled microcircuit module according to an embodiment of the present invention. The power output pad 380 of the thermostatically controlled microcircuit module 300 is connected to the electrode pad 211 of the copper foil circuit layer 210 through the copper rivet 370 (see Figure 4) are electrically connected, riveted, and then soldered together, so that the graphene heating sheet is integrated with the thermostatic control microcircuit module 300 to realize independent temperature control componentization. The electric power output pad 380 is a double-sided metallized hole pad. The electric power output pad 380 and the electrode pad 211 are riveted and soldered with copper rivets 370 to ensure that the insulation and heat insulation base layer 200, the copper foil circuit layer 210 and the thermostatic microcircuit module 300 are tightly integrated into one, thereby ensuring that the total impedance of the following line sequence tends to zero under high current conditions: electric power output pad 380-copper rivet 370-electrode pad 211-copper foil circuit layer 210-graphene coating layer 220. Among them, the electrode pad 211 is the power input pad of the copper foil circuit layer 210, and is electrically connected to the power output double-sided metallized hole pad 380 of the thermostatic microcircuit module 300 through the copper rivet 370. In some embodiments, the size of the power output pad 380 can be 7mm x 7mm (wherein the aperture is 3mm), the copper rivet 370 can be 3mm, and the size of the electrode pad 211 can be 7mm x 7mm (wherein the aperture is 3mm). It should be noted that the specific size can vary according to the requirements of different products, and the size is given here as an example, not as a limitation of the present invention.

[0054] Figure 6 Schematic diagram of the power supply pad and power output pad of the constant temperature control microcircuit module according to an embodiment of the present invention. The power supply pad 390 can be connected to the power supply wires 310 and 320, and the power output pad 380 can be connected to the electrode pad 211 on the copper foil circuit layer 210. Figure 7 Schematic diagram of a temperature control IC 360 and a copper rivet 370 of a constant temperature control microcircuit module according to an embodiment of the present invention.

[0055] FIG. 8( a ) is a schematic diagram of independent temperature control components according to an embodiment of the present invention. Figure 1The constant temperature microcircuit module 300 can be implemented by the integrated circuit U1 of Figure 8 (a), such as the integrated circuit of model NE555 (as shown in Figure 8 (b)). U1 may include two comparators and an RS trigger. When the temperature value of the graphene heating sheet 100 is lower than the target constant temperature value, the resistance value of the NTC 330 closely attached to it by the insulating thermal conductive adhesive will be greater than the resistance value at constant temperature (for example, the NTC constant temperature intermediate value), so that the series voltage divider values ​​of R2 and R1 corresponding to the second and sixth pins of U1 are synchronously lower than the internal comparator threshold value of each pin. Since the second pin is connected to the reverse input terminal of the internal comparator (marked as "A comparator"), the "A comparator" outputs a high level, so that the internal RS trigger is set to a high level output (that is, the third pin of U1), so that the Q1 field effect power tube is turned on, so that the graphene heating sheet starts to be powered on and heated. As the temperature gradually increases, the NTC The resistance value of 300 gradually decreases, and the voltage divider value of R2, R1 and NCT in series gradually increases. When the temperature of the graphene heating plate reaches the constant temperature target value, the voltage divider value of the 6th pin of U1 will be higher than the threshold value of the internal comparator (marked as "B comparator") of this pin. Since the 6th pin is connected to the same-direction input terminal of the "B comparator", the "B comparator" outputs a high level, so that the internal RS trigger is set to a low level (the 3rd pin of U1), so that the Q1 field effect power tube is turned off, and the temperature of the graphene heating plate begins to gradually drop. This cycle repeats so that the graphene heating plate remains in a constant temperature state. Since the 8th pin of the integrated circuit U1 is the chip power input pin, the voltage value of this pin must be highly accurate and stable so that the integrated circuit U1 chip can work accurately and stably. U2 is a linear three-terminal integrated voltage regulator with a fixed voltage output. As a dedicated integrated circuit for voltage regulation, it can convert the unfixed or unstable power supply line voltage into a high-precision stable voltage and provide it to the integrated circuit U1.

[0056] FIG8(b) is a schematic diagram of the internal functions of an independent temperature control component integrated circuit U1 according to an embodiment of the present invention. FIG8(b) is only an illustrative example and should not be regarded as a display of the implementation method of U1. In this example, pin 1 is a ground terminal, which is usually connected to the common ground of the circuit. Pin 2 is a trigger point, which can trigger U1 (e.g., NE555) to start its time cycle. The upper edge voltage of the trigger signal must be greater than 2 / 3VCC, and the lower edge voltage must be lower than 1 / 3VCC. Pin 3 is an output terminal. When the time cycle starts, the output of U1 moves to a high potential that is 1.7v less than the power supply voltage, and returns to a low potential of about 0v at the end of the cycle. The maximum output current at the high potential is about 200mA. Pin 4 is a reset terminal. If a low logic potential is sent to this pin, the timer will be reset and the output will return to a low potential. It can be connected to a positive power supply or ignored. Pin 5 is a control terminal, which allows an external voltage to change the trigger and threshold voltages. When the timer works in a stable or oscillating mode, this pin can be used to change or adjust the output frequency. Pin 6 is the threshold terminal, which can reset the latch and make the output low. This action is initiated when the voltage of this pin moves from below 1 / 3VCC voltage to above 2 / 3VCC. Pin 7 is the discharge terminal, which has the same current output capability as the main output pin. When the output is ON, it is LOW and has low impedance to ground. When the output is OFF, it is HIGH and has high impedance to ground. Pin 8 is the power supply voltage terminal, and the supply voltage range can be 4.5V to 16V.

[0057] The NTC temperature sensor can be a resistor whose resistance value changes with temperature. Using this characteristic, in some embodiments, the principle of constant temperature control is: the NTC temperature sensor is placed close to the graphene coating layer, and the temperature gradient difference between the coating layer and the NTC temperature sensor is as close to zero as possible, so that the NTC temperature sensor can truly reflect the temperature change of the graphene coating layer, which requires the adhesive to have good thermal conductivity. Since the NTC temperature sensor belongs to the constant temperature control circuit (its operating voltage is usually low, such as 3-5V), and the operating voltage of the graphene coating layer is usually high (such as 12V-24V, or even higher), if the adhesive does not have good insulation performance, it is bound to be cross-current. The NTC temperature sensor is usually connected to a micro-voltage input circuit. Once cross-current occurs, it will break down the constant temperature control closed-loop input circuit. After the probe 330 of the NTC temperature sensor is tightly attached to the graphene coating layer 220, since the NTC temperature sensor is a negative temperature coefficient resistance temperature sensor, when the graphene coating layer 220 is powered on, it will generate heat and the resistance of the NTC temperature sensor will decrease. If the graphene coating layer 220 is powered off, the temperature will gradually drop, and the resistance of the NTC temperature sensor will increase.

[0058] Figure 2The driving power tube 350 is a high-current power switch tube for the power output of the constant temperature microcircuit module 300. The power supply pad 390 can be connected to the power supply wires 310 and 320. In some embodiments, the power output path of the graphene heating sheet integrated circuit is: power supply wires 310 and 320-power supply pads 390-driving power tube 350-electric power output pads 380-copper rivets 370-electrode pads 211-copper foil circuit layer 210-graphene coating layer 220. The driving power tube 350 can be implemented by the Q1 field effect tube of Figure 8, and whether the graphene coating layer 220 is energized is controlled by turning on or off the driving power tube Q1. Specifically, the power supply wires 310 and 320 are connected to the power supply terminals of the main control circuit board to provide the graphene coating layer 220 with the power energy required for heating, and the low voltage is supplied by the PCB board of the product main control circuit board. When the driving power tube 350 is turned on, the power output pad 380 is energized, and the electrode pad 211 is electrically connected through the copper rivet 370, and the copper foil circuit layer 210 is energized successively, and then the graphene coating layer 220 is also energized by electrically connecting the copper foil circuit layer 210, so that the graphene coating layer 220 of the graphene heating sheet is energized and heated. It should be noted that the target constant temperature value in the embodiment can be a target constant temperature range, so that the graphene heating sheet can maintain operation within this target constant temperature range.

[0059] The NTC temperature sensor 330 includes a temperature sensing probe 330, which is tightly attached to the graphene coating layer 220 through an insulating thermally conductive adhesive. After the temperature value of the graphene coating layer 220 is measured by the temperature sensing probe 330, it can be directly input into the temperature control IC 360 of the constant temperature microcircuit module 300 for constant temperature closed-loop control, and there is no other path for control. Since the traditional method requires 4 wires, 2 of which are used to feedback the temperature measurement signal, and the embodiment of the present invention does not need to use these 2 feedback signal lines when performing constant temperature control, only 2 power supply wires are required to energize the graphene coating layer 220 to meet the needs of power-on heating. Therefore, the present invention can simplify the circuit, save signal lines, and realize independent temperature control components.

[0060] In addition, the temperature sensing probe 330 of the present invention transmits the temperature measurement value signal directly to the temperature control IC 360 of the constant temperature microcircuit module 300, thereby enhancing the anti-interference ability of the electronic system of the multi-zone far-infrared hot compress product in a strong electromagnetic field interference environment. In comparison, if the measurement signal of the NTC temperature sensor is transmitted to the traditional architecture of the product main control board MCU, and the main control board MCU must use the ADC port (analog / digital conversion input port) in order to well receive the temperature signal transmitted by the NTC temperature sensor, if the product is small in volume (that is, the straight-line distance between the NTC temperature sensor and the main control MCU is very close), then the induced electromotive force of the space electromagnetic wave on the NTC temperature sensor to MCU signal transmission line is still small, which is not enough to cover the temperature signal transmitted by the NTC temperature sensor. However, for large-volume products, since the straight-line distance between the NTC temperature sensor and the main control board MCU is far, the induced electromotive force value is very large, which will fully cover the temperature value measured by the NTC temperature sensor probe, so that the main control MCU cannot obtain the real temperature value of the graphene coating layer 220, and in this case, all the constant temperature control performed by the main control board MCU is wrong. In addition, if a large-volume product is in a strong electromagnetic field environment, the induced electromotive force voltage value is very high, and it is very likely to break through the gate of the field effect semiconductor device of the internal circuit of the temperature measurement access port of the main control board MCU (the gate is very fragile). When the NTC temperature sensors of each hot compress area are localized according to the embodiment of the present invention, the main control board MCU no longer has a long-distance signal line to transmit the temperature signal, and the induced electromotive force is completely eliminated.

[0061] According to an embodiment of the present invention, a graphene heating sheet integrated circuit is provided, which can tightly integrate a copper foil circuit layer, an insulating heat-insulating base layer and a constant temperature microcircuit module into one, and the graphene heating sheet and the constant temperature microcircuit module are electrically connected by copper rivets to form an integrated merging scene, thereby realizing independent temperature control componentization. The graphene heating sheet integrated circuit comprises: an insulating heat-insulating base layer (200); a graphene coating layer (220), which generates far-infrared energy waves when powered on; a copper foil circuit layer (210), which is located between the insulating heat-insulating base layer (200) and the graphene coating layer (220), and is used to electrically connect the graphene coating layer (220); and a constant temperature microcircuit module (300), which is used to close-loop control the constant temperature operation of the graphene coating layer (220) by adaptively switching the power-on state of the graphene coating layer (220) according to the temperature measurement value of the graphene coating layer (220). Preferably, the constant temperature microcircuit module (300) further comprises: a temperature control IC (360) for controlling the constant temperature operation of the graphene coating layer (220); a linear three-terminal voltage regulator IC (340) for providing a stable operating voltage for the temperature control IC (360); an electric power output pad (380); two power supply wires (310, 320) for connecting to the power supply terminals of the main control circuit board so as to energize the graphene coating layer (220) of the graphene heating sheet; a temperature sensor, comprising a temperature sensing probe (330) for measuring the temperature value of the graphene coating layer (220) and directly transmitting the temperature measurement value to the temperature control IC (360); and a driving power tube (350) for being turned on or off according to the temperature measurement value to control whether the graphene coating layer (220) is energized; wherein the on and off state of the driving power tube (350) is controlled by the temperature control IC (360) according to the temperature measurement value.

[0062] Preferably, the power output pad (380) is electrically connected to the electrode pad (211) of the copper foil circuit layer (210) by means of a copper rivet (370), riveted, and then soldered to secure them together.

[0063] Preferably, the temperature sensing probe (330) is bonded to the graphene coating layer (220) via an insulating thermally conductive adhesive so as to measure the temperature value of the graphene coating layer (220).

[0064] Preferably, the temperature sensor is a negative temperature coefficient resistance temperature sensor.

[0065] When performing constant temperature closed-loop control, when the temperature measurement value of the graphene coating layer (220) is lower than the constant temperature target value, the driving power tube (350) is turned on to enable the graphene coating layer (220) to be powered on and generate heat and increase in temperature; when the temperature measurement value of the graphene coating layer (220) reaches the constant temperature target value, the driving power tube (350) is turned off to enable the graphene coating layer (220) to be powered off and cooled.

[0066] Preferably, the graphene heating sheet integrated circuit may also include a protective film layer located above the graphene coating layer (220). As a protective film layer, the material is insulating, which can protect human skin from the pricking sensation of electric shock and protect the graphene material from being worn by external contacts.

[0067] Fig. 9 The method 900 for controlling the constant temperature of a graphene heating sheet according to an embodiment of the present invention includes:

[0068] S902: connecting two power supply wires to power supply terminals of a main control circuit board to energize the graphene coating layer (220) of the graphene heating sheet;

[0069] S904: measuring the temperature value of the graphene coating layer (220) and directly transmitting the temperature measurement value to the temperature control IC (360) of the constant temperature microcircuit module (300);

[0070] S906: the temperature control IC (360) turns on or off the driving power tube (350) of the constant temperature microcircuit module (300) according to the temperature measurement value;

[0071] S908: controlling whether the graphene coating layer (220) is powered on by turning on or off the driving power tube (350);

[0072] S910: According to the temperature measurement value, the graphene coating layer (220) is closed-loop controlled to operate at a constant temperature by adaptively switching the power-on state of the graphene coating layer (220).

[0073] Preferably, the graphene heating sheet constant temperature control method 900 further comprises electrically connecting the copper foil circuit layer (210) to the graphene coating layer (220), wherein the copper foil circuit layer (210) is disposed between the insulating and heat-insulating base layer (200) of the graphene heating sheet and the graphene coating layer (220). Preferably, the graphene heating sheet constant temperature control method 900 further comprises electrically connecting the electric power output pad (380) of the constant temperature microcircuit module (300) to the electrode pad (211) of the copper foil circuit layer (210) through a copper rivet (370), and then soldering and fastening them together by riveting.

[0074] Preferably, the graphene heating sheet constant temperature control method 900 also includes, when the driving power tube (350) is turned on, energizing the electric power output pad (380) via the two power supply wires; electrically connecting the electrode pad (211) through the copper rivet (370), energizing the copper foil circuit layer (210); and energizing the graphene coating layer (220) by electrically connecting the copper foil circuit layer (210).

[0075] Preferably, the graphene heating sheet constant temperature control method 900 also includes, when the temperature measurement value of the graphene coating layer (220) is lower than the constant temperature target value, the driving power tube (350) is turned on to enable the graphene coating layer (220) to be powered on and generate heat and increase its temperature; when the temperature measurement value of the graphene coating layer (220) reaches the constant temperature target value, the driving power tube (350) is turned off to enable the graphene coating layer (220) to be powered off and cooled.

[0076] Preferably, the constant temperature target value is a constant temperature target interval value.

[0077] Preferably, the graphene heating sheet constant temperature control method 900 further comprises a temperature sensor attached to the graphene coating layer (220) via an insulating thermally conductive adhesive for measuring the temperature value of the graphene coating layer (220).

[0078] Figure 10(a)-10(i) It is a structural schematic diagram of each step of a method for manufacturing a graphene heating sheet integrated circuit according to an embodiment of the present invention. Fig.11 FIG10 is a schematic diagram of a method 1100 for manufacturing a graphene heating sheet integrated circuit according to an embodiment of the present invention. In conjunction with FIG10 , the method includes:

[0079] S1102: Providing an insulating and heat-insulating base layer (200) (FIG. 10(a));

[0080] S1104: providing a copper foil circuit layer (210) for electrically connecting the graphene coating layer (220) on the insulating and heat-insulating base layer (200) ( FIG. 10( b ));

[0081] S1106: Laying the graphene coating layer (220) on the copper foil circuit layer (210) (FIG. 10(c), FIG. 10(d)), FIG. 10(e));

[0082] S1110: The power output pad (380) of the constant temperature microcircuit module (300) is electrically connected to the electrode pad (211) of the copper foil circuit layer (210) by means of a copper rivet (370), and then the pads are fastened together by rivet connection and soldering ( FIG. 10( g) ), FIG. 10( h ), and FIG. 10( i) );

[0083] Preferably, in one embodiment, the method may further include S1108: laying a protective film layer on top of the graphene coating layer (220) (FIG. 10(f)). The protective film layer can be used as a protective film layer, and the material is insulating, which can protect human skin from the pricking sensation of electric shock and also protect the graphene material from being worn by external contacts.

[0084] The constant temperature microcircuit module (300) is used to switch the power-on state of the graphene coating layer (220) to achieve closed-loop control of the constant temperature operation of the graphene coating layer (220).

[0085] After the above steps, a graphene heating sheet integrated circuit is formed in which the graphene heating sheet and the constant temperature micro-control circuit module are integrated into one. The assembled graphene heating sheet integrated circuit is shown in Figure 10(j), Figure 10(k) and Figure 10(l), wherein Figure 10(j) is a schematic diagram of a graphene heating sheet without a protective film layer, and Figure 10(k) is a schematic diagram of a graphene heating sheet with a protective film layer.

[0086] Preferably, the graphene heating sheet integrated circuit manufacturing method 1100 also includes connecting two power supply wires (310, 320) of the constant temperature microcircuit module (300) to the power supply terminals of the main control circuit board to energize the graphene coating layer (220) of the graphene heating sheet.

[0087] Preferably, the graphene heating sheet integrated circuit manufacturing method 1100 also includes bonding a temperature sensor probe (330) to the graphene coating layer (220) via an insulating thermally conductive adhesive, so as to measure the temperature value of the graphene coating layer (220) and directly transmit the temperature measurement value to the constant temperature microcircuit module (300).

[0088] Preferably, the graphene heating sheet integrated circuit manufacturing method 1100 further includes laying the graphene coating layer (220) on the copper foil circuit layer (210), and further includes: laying a plurality of graphene coating layer blocks on the copper foil circuit layer (210) in sequence to cover the copper foil strips of the copper foil circuit layer (210), such as Figure 10(c)-10(d) .

[0089] Preferably, the copper foil circuit layer (210) is a hollow copper foil strip, such as Figure 10(a)-10(e) The present invention also provides a distributed graphene heating sheet temperature control system (1200), as shown. Fig.12As shown, the graphene heating sheet temperature control system (1200) may include at least one graphene heating sheet integrated circuit (1201-1, 1201-2, 1201-3, ..., 1201-n) of any one of the above-mentioned embodiments and a circuit main control board (1202), wherein the circuit main control board includes an MCU, and the power supply terminal of the circuit main control board is connected to two power supply wires of the graphene heating sheet integrated circuit to energize the graphene coating layer (220) of the graphene heating sheet. By structurally integrating the far-infrared graphene heating sheet and the constant temperature control microcircuit module, independent graphene heating sheet integrated circuits are realized in each block, and the solution in the traditional control architecture that the NTC temperature sensor measurement signal must be fed back to the product main control circuit board through two signal transmission lines for centralized software temperature closed-loop control by the MCU is abandoned. As a result, the temperature signal transmission lines of each hot compress area of ​​the temperature control system are eliminated to zero, and each hot compress area in multiple areas can be independently controlled at the nearest constant temperature, thereby simplifying the product system concentration and system software complexity, enhancing the anti-interference ability of the electronic system of the multi-area far-infrared hot compress product in a strong electromagnetic field interference environment, and fundamentally realizing the stability and reliability of the product.

[0090] Based on the novel heating sheet structure of the present invention, the traditional control architecture abandons the practice that the NTC temperature measurement signal of each heating sheet area temperature sensor must be fed back to the product main control circuit board through two transmission lines, and the MCU performs centralized software temperature closed-loop control. The graphene heating sheet in each area is controlled at a constant temperature nearby, so that the required transmission lines can be reduced from 12 to 6, so that the NTC temperature measurement signal of each area does not need to travel an additional line of more than 2 meters. In large-volume products (for example, smart massage mattress products), the signal distance can be compressed to zero, thereby simplifying the product control system centralization and software complexity, reducing the cost of mass production assembly time, and enhancing product stability and reliability. According to another embodiment of the present invention, a method for making a graphene heating sheet is provided. The method may include: providing an insulating and heat-insulating base layer (200); providing a copper foil circuit layer (210) for electrically connecting to a graphene coating layer (220); providing a microcircuit module (300) for controlling the graphene heating sheet at a constant temperature; wherein the power output pad (380) of the microcircuit module (300) is electrically connected to the electrode pad (211) of the copper foil circuit layer (210) by a copper rivet (370), riveted, and then soldered together; and two power supply wires (310, 320) of the microcircuit module (300) are connected to the heating sheet power supply terminal of the main control circuit board. The method may also include: closely fitting a temperature sensor probe (330) of the temperature sensor in the microcircuit module (300) to the graphene coating layer (220) through an insulating thermally conductive adhesive for temperature measurement.

[0091] According to another embodiment of the present invention, a distributed temperature control system is provided, comprising: at least one new graphene heating sheet as described in the above embodiment, and a circuit main control board, which includes an MCU, wherein the heating sheet power supply terminal of the main control board is connected to the two power supply wires of the graphene heating sheet. By integrating the far-infrared graphene heating sheet and the constant temperature control microcircuit module in structure, the solution that the temperature sensor NTC measurement signal must be fed back to the product main control circuit board through two signal transmission lines in the traditional control architecture and the MCU is used to centrally perform software temperature closed-loop control is abandoned, so that the temperature signal transmission line of each hot compress area of ​​the temperature control system is canceled to zero, and each hot compress area in multiple areas can be independently controlled at a nearby temperature, thereby simplifying the product system concentration and system software complexity, enhancing the anti-interference ability of the multi-area far-infrared hot compress product electronic system in a strong electromagnetic field interference environment, and fundamentally realizing the stability and reliability of the product.

[0092] Example 1. A graphene heating sheet (100), comprising:

[0093] Insulation base layer (200);

[0094] A graphene coating layer (220);

[0095] A copper foil circuit layer (210) for electrically connecting the graphene coating layer (220); and

[0096] A microcircuit module (300) is used to control the graphene heating sheet (100) at a constant temperature.

[0097] Example 2. According to the graphene heating sheet described in Example 1, the microcircuit module (300) further includes:

[0098] Temperature control IC (360);

[0099] A linear three-terminal voltage regulator IC (340) is used to provide a stable operating voltage for the temperature control IC (360);

[0100] A driving power tube (350) for matching electric power output;

[0101] Electrical power output pad (380);

[0102] two power supply wires (310, 320); and

[0103] The temperature sensor comprises a temperature sensing probe (330) which is tightly attached to the graphene coating layer (220) via an insulating thermally conductive adhesive for temperature measurement.

[0104] Example 3. According to the graphene heating sheet described in Example 2, the two power supply wires (310, 320) are connected to the heating sheet power supply terminals of the main control circuit board.

[0105] Example 4. According to the graphene heating sheet described in Example 2 or Example 3, the electric power output pad (380) is electrically connected to the electrode pad (211) of the copper foil circuit layer (210) by a copper rivet (370), riveted, and then soldered to secure them together.

[0106] Example 5. A method for manufacturing a graphene heating sheet, comprising:

[0107] Providing an insulating and heat-insulating base layer (200);

[0108] Providing a copper foil circuit layer (210) for electrically connecting the graphene coating layer (220);

[0109] Providing a microcircuit module (300) for constant temperature control of the graphene heating sheet;

[0110] The electric power output pad (380) of the microcircuit module (300) is electrically connected to the electrode pad (211) of the copper foil circuit layer (210) by means of a copper rivet (370), and then is fastened together by means of rivets and soldering;

[0111] The two power supply wires (310, 320) of the microcircuit module (300) are connected to the heating plate power supply terminals of the main control circuit board.

[0112] Example 6. The method according to Example 5 further includes: tightly bonding the temperature sensing probe (330) of the temperature sensor in the microcircuit module (300) to the graphene coating layer (220) via an insulating thermally conductive adhesive for temperature measurement.

[0113] Example 7. A distributed temperature control system, comprising:

[0114] At least one graphene heating sheet according to any one of Examples 1 to 4; and

[0115] A circuit main control board includes an MCU, wherein a heating plate power supply terminal of the main control board is connected to two power supply wires of the graphene heating plate.

[0116] Those skilled in the art can clearly understand that, for the convenience and brevity of description, the specific working processes of the systems, devices and units described above can refer to the corresponding processes in the aforementioned method embodiments and will not be repeated here.

[0117] In the several embodiments provided in the present application, it should be understood that the disclosed systems, devices and methods can be implemented in other ways. For example, the various steps in the flowchart can be executed in an order different from the order shown, and the numbering of the steps in the method embodiment described above is only schematic and does not limit the execution order of the steps. In addition, the device embodiments described above are only schematic. For example, the division of the units is only a logical function division. There may be other division methods in actual implementation, such as multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the mutual coupling or direct coupling or communication connection shown or discussed can be an indirect coupling or communication connection through some interfaces, devices or units, which can be electrical, mechanical or other forms.

[0118] The units described as separate components may or may not be physically separated, and the components shown as units may or may not be physical units, that is, they may be located in one place or distributed on multiple network units. Some or all of the units may be selected according to actual needs to achieve the purpose of the solution of this embodiment.

[0119] In addition, each functional unit in each embodiment of the present invention may be integrated into one processing unit, or each unit may exist physically separately, or two or more units may be integrated into one unit. The above-mentioned integrated unit may be implemented in the form of hardware or in the form of software functional units.

[0120] If the integrated unit is implemented in the form of a software functional unit and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention is essentially or the part that contributes to the prior art or all or part of the technical solution can be embodied in the form of a software product. The computer software product is stored in a storage medium, including several instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk and other media that can store program codes.

[0121] The above description of the disclosed embodiments enables one skilled in the art to implement or use the present invention. Various modifications to these embodiments will be apparent to one skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention will not be limited to the embodiments shown herein, but rather to the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A constant temperature control method for a graphene heating sheet, characterized in that: include: Connecting two power supply wires to power supply terminals of a main control circuit board to energize the graphene coating layer (220) of the graphene heating sheet; Measuring the temperature value of the graphene coating layer (220) and directly transmitting the temperature measurement value to the temperature control IC (360) of the constant temperature microcircuit module (300); The temperature control IC (360) turns on or off the driving power tube (350) of the constant temperature microcircuit module (300) according to the temperature measurement value; Controlling whether the graphene coating layer (220) is powered on or off by turning the driving power tube (350) on or off; According to the temperature measurement value, the graphene coating layer (220) is closed-loop controlled to operate at a constant temperature by adaptively switching the power-on state of the graphene coating layer (220).

2. The method according to claim 1, characterized in that Also includes: The copper foil circuit layer (210) is electrically connected to the graphene coating layer (220), wherein the copper foil circuit layer (210) is arranged between the insulating and heat-insulating base layer (200) of the graphene heating sheet and the graphene coating layer (220).

3. The method according to claim 2, characterized in that Also includes: The electric power output pad (380) of the constant temperature microcircuit module (300) is electrically connected to the electrode pad (211) of the copper foil circuit layer (210) through a copper rivet (370) and then riveted and soldered to secure them together.

4. The method according to claim 3, characterized in that Also includes: When the driving power tube (350) is turned on, power is supplied to the electric power output pad (380) via the two power supply wires; The electrode pad (211) is electrically connected via the copper rivet (370), and the copper foil circuit layer (210) is energized; as well as By electrically connecting the copper foil circuit layer (210), the graphene coating layer (220) is energized.

5. The method according to claim 1, characterized in that Also includes: When the temperature measurement value of the graphene coating layer (220) is lower than the constant temperature target value, the driving power tube (350) is turned on to enable the graphene coating layer (220) to be powered on and generate heat and increase in temperature; when the temperature measurement value of the graphene coating layer (220) reaches the constant temperature target value, the driving power tube (350) is turned off to enable the graphene coating layer (220) to be powered off and cool down.

6. The method according to claim 5, characterized in that The constant temperature target value is a constant temperature target interval value.

7. The method according to claim 1, characterized in that Also includes: A temperature sensor is bonded to the graphene coating layer (220) via an insulating thermally conductive adhesive to measure the temperature value of the graphene coating layer (220).

8. A graphene heating sheet integrated circuit, characterized in that: include: Insulation base layer (200); The graphene coating layer (220) generates heat and generates far infrared energy waves when electricity is supplied; A copper foil circuit layer (210), located between the insulating and heat-insulating base layer (200) and the graphene coating layer (220), and used for electrically connecting the graphene coating layer (220); as well as A constant temperature microcircuit module (300) is used to control the constant temperature operation of the graphene coating layer (220) in a closed loop by adaptively switching the power-on state of the graphene coating layer (220) according to the temperature measurement value of the graphene coating layer (220).

9. The graphene heating sheet integrated circuit according to claim 8, characterized in that: The constant temperature microcircuit module (300) further comprises: A temperature control IC (360) for controlling the graphene coating layer (220) to operate at a constant temperature; A linear three-terminal voltage regulator IC (340) for providing a stable operating voltage for the temperature control IC (360); an electric power output pad (380); Two power supply wires (310, 320) are used to be connected to power supply terminals of a main control circuit board so as to energize the graphene coating layer (220) of the graphene heating sheet; A temperature sensor, comprising a temperature sensing probe (330), used for measuring the temperature value of the graphene coating layer (220) and directly transmitting the temperature measurement value to the temperature control IC (360); and A driving power tube (350) is used to be turned on or off according to the temperature measurement value to control whether the graphene coating layer (220) is powered on; The on / off state of the driving power tube (350) is controlled by the temperature control IC (360) according to the temperature measurement value.

10. The graphene heating sheet integrated circuit according to claim 9, characterized in that: The electric power output pad (380) is electrically connected to the electrode pad (211) of the copper foil circuit layer (210) through a copper rivet (370) and then fastened together by riveting and soldering.

11. The graphene heating sheet integrated circuit according to claim 9, characterized in that: The temperature sensing probe (330) is bonded to the graphene coating layer (220) via an insulating thermally conductive adhesive to measure the temperature value of the graphene coating layer (220).

12. The graphene heating sheet integrated circuit according to claim 9, characterized in that: The temperature sensor is a negative temperature coefficient resistance temperature sensor.

13. The graphene heating sheet integrated circuit according to claim 9, characterized in that: When the temperature measurement value of the graphene coating layer (220) is lower than the constant temperature target value, the driving power tube (350) is turned on to allow the graphene coating layer (220) to be energized and generate heat to increase temperature; When the temperature measurement value of the graphene coating layer (220) reaches the constant temperature target value, the driving power tube (350) is turned off to cut off the power supply of the graphene coating layer (220) and reduce the temperature.

14. The graphene heating sheet integrated circuit according to claim 13, characterized in that: The constant temperature target value is a constant temperature target interval value.

15. The graphene heating sheet integrated circuit according to claim 8, characterized in that: It also includes a protective film layer located above the graphene coating layer (220).

16. A method for manufacturing a graphene heating sheet integrated circuit, characterized in that: include: Providing an insulating and heat-insulating base layer (200); Providing a copper foil circuit layer (210) on the insulating and heat-insulating base layer (200) for electrically connecting the graphene coating layer (220); Laying the graphene coating layer (220) on the copper foil circuit layer (210); The electric power output pad (380) of the constant temperature microcircuit module (300) is electrically connected to the electrode pad (211) of the copper foil circuit layer (210) by means of a copper rivet (370), and then soldered and fastened together; The constant temperature microcircuit module (300) is used to switch the power-on state of the graphene coating layer (220) to achieve closed-loop control of the constant temperature operation of the graphene coating layer (220).

17. The method for manufacturing a graphene heating sheet integrated circuit according to claim 16, characterized in that: Also includes: The two power supply wires (310, 320) of the constant temperature microcircuit module (300) are connected to the power supply terminals of the main control circuit board to energize the graphene coating layer (220) of the graphene heating sheet.

18. The method for manufacturing a graphene heating sheet integrated circuit according to claim 16, characterized in that: Also includes: The temperature sensing probe (330) of the temperature sensor is bonded to the graphene coating layer (220) via an insulating heat-conductive adhesive to measure the temperature value of the graphene coating layer (220) and directly transmit the temperature measurement value to the constant temperature microcircuit module (300).

19. The method for manufacturing a graphene heating sheet integrated circuit according to claim 16, characterized in that: Laying the graphene coating layer (220) on the copper foil circuit layer (210) further comprises: laying a plurality of graphene coating layer blocks in sequence on the copper foil circuit layer (210) to cover the copper foil strips of the copper foil circuit layer (210).

20. The method for manufacturing a graphene heating sheet integrated circuit according to claim 16, characterized in that: The copper foil circuit layer (210) is a hollow copper foil strip.

21. The method for manufacturing a graphene heating sheet integrated circuit according to claim 16, characterized in that: Also includes: A protective film layer is provided above the graphene coating layer (220).

22. A distributed graphene heating sheet temperature control system (1200), characterized in that: Include: At least one graphene heating sheet integrated circuit (1201-n) according to any one of claims 8-15; and A circuit main control board (1202) includes an MCU, wherein a power supply terminal of the circuit main control board is connected to two power supply wires of the graphene heating sheet integrated circuit to energize the graphene coating layer (220) of the graphene heating sheet.

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