A method for silk screen printing on solder mask surface of integrated circuit board

Abstract

The present invention provides a method for silk-screening a solder mask surface of an integrated circuit board. The method comprises the following steps: obtaining basic information of a solder mask panel to be silk-screened, the basic information including components to be soldered, dimensions, component boundary boxes, and non-overlapping portions; constructing a virtual panel based on the dimensions, component boundary boxes, and non-overlapping portions; numbering the components to be soldered, and randomly filling the numbers outside corresponding component boundary boxes on the virtual panel; randomly selecting a number outside each component boundary box and combining them to form a plurality of silk-screening schemes; preliminarily screening the silk-screening schemes based on non-overlapping portions; obtaining a user's silk-screening requirement, optimizing the preliminarily screened silk-screening schemes based on the silk-screening requirement, and obtaining an optimal silk-screening scheme; the optimal silk-screening scheme can not only meet the user's silk-screening requirement, but also minimize overlap of numbers and non-overlapping portions as much as possible, thereby ensuring normal use of the integrated circuit board.

Description

Technical Field

[0001] The present invention relates to the technical field of integrated circuit board processing, in particular to a silk screen printing method for a solder resist surface of an integrated circuit board. Background Art

[0002] Integrated circuit boards, also known as PCBs, are an important component of electronic manufacturing. Components such as capacitors and resistors can be soldered on integrated circuit boards to form circuits. The assembled integrated circuit boards can be directly used as components in a power system after being packaged. In the manufacture of integrated circuit boards, solder mask layers and silk screen layers are added to their surfaces in sequence. The solder mask layer is used to prevent unnecessary parts from being soldered, while the silk screen layer is mainly used to add numbers and patterns on the circuit board to identify the components on the circuit board for the welding process and subsequent maintenance. Currently, when silk screen printing is performed on integrated circuit boards, most of them are performed in a conventional manner. However, due to changes in components, the silk screen printing scheme will be different, resulting in overlapping numbers with pads and vias on the circuit board, which in turn affects the manufacture of the circuit board. In addition, when silk screen printing is performed on current circuit boards, user needs are not taken into account. Some users hope that all numbers on the circuit board can be in the same direction to improve the aesthetics, while some users hope that the spacing between numbers on the circuit board can be larger to avoid numbers being too close together, resulting in errors in viewing numbers and affecting the selection and repair and maintenance of components. Summary of the Invention

[0003] In view of this, the present invention proposes a method for silk screen printing on the solder mask surface of an integrated circuit board, which can customize the silk screen printing scheme according to the silk screen printing needs of the user and avoid overlapping of numbers and important parts.

[0004] The technical solution of the present invention is achieved as follows:

[0005] A method for silk-screening a solder mask surface of an integrated circuit board comprises the following steps:

[0006] Step S1, obtaining basic information of the panel to be screen-printed with solder mask, wherein the basic information includes components to be soldered, dimensions, component boundary boxes, and parts that are not allowed to overlap;

[0007] Step S2: constructing a virtual panel based on the size, component bounding box, and the non-overlapping portion;

[0008] Step S3: number the components to be soldered and randomly fill the numbers outside the corresponding component boundary boxes on the virtual panel;

[0009] Step S4: randomly select a number outside the boundary box of each component and combine them to form several silk screen schemes;

[0010] Step S5: Preliminary screening of the screen printing schemes based on the non-overlapping parts;

[0011] Step S6: Obtain the user's silk screen printing requirements, optimize the silk screen printing solutions that have been initially screened based on the silk screen printing requirements, and obtain the optimal silk screen printing solution.

[0012] Preferably, the specific steps of step S1 are:

[0013] Step S11, obtaining the model of the panel to be screen-printed with solder mask, and matching it to obtain a standard circuit board from a circuit board database;

[0014] Step S12: Obtain a circuit layout design of a standard circuit board, and obtain basic information from the circuit layout design.

[0015] Preferably, the parts not allowed to overlap include pads, vias, traces, test points, debugging points, power supplies and grounding.

[0016] Preferably, the specific steps of step S2 are:

[0017] Step S21: construct a virtual panel based on the size information, and map the component boundary boxes and the parts that are not allowed to overlap onto the virtual panel;

[0018] Step S22: Obtain image information of the panel to be screen-printed with solder mask, and overlap the image information with the virtual panel;

[0019] Step S23: Adjust the positions of the component boundary boxes and the parts that are not allowed to overlap according to the overlapping effect.

[0020] Preferably, the specific steps of step S3 are:

[0021] Step S31, determining whether components to be welded of the same type form a clustering area;

[0022] Step S32: if a clustering area is formed, sequentially number the components to be welded of the type according to the arrangement of the clustering area;

[0023] Step S33: If the components to be welded of the same type do not form a clustered area, number the components to be welded in a clockwise or counterclockwise order;

[0024] Step S34: Randomly fill the numbers of the components to be welded outside the corresponding component boundary boxes on the virtual panel.

[0025] Preferably, the specific steps of step S4 are: randomly selecting one of the numbers outside the component boundary box, combining it with the numbers outside the other component boundary boxes, and performing multiple selections to obtain several silk screen printing schemes.

[0026] Preferably, the specific steps of step S5 are:

[0027] Step S51: Map the silk screen printing schemes onto the virtual panel in sequence;

[0028] Step S52: obtaining virtual panels whose numbers overlap with the non-overlapping part, and recording them as panels to be screened;

[0029] Step S53: determining the number of overlapping parts and numbers of each type of non-overlapping parts on the panel to be screened;

[0030] Step S54: When the number of overlapping parts that are not allowed to overlap and the number overlap is greater than a preset threshold, the corresponding panel to be screened is eliminated.

[0031] Preferably, the silk screen printing requirement includes the numbering direction being consistent, and the specific steps of step S6 are:

[0032] Step S61, obtaining each virtual panel after preliminary screening;

[0033] Step S62: Collect all serial numbers through image recognition and identify the orientation of the serial numbers;

[0034] Step S63 : Calculate the numbering orientation consistency rate of the virtual panels, and output the silk-screen printing scheme on the virtual panel with the highest numbering orientation consistency rate as the optimal silk-screen printing scheme.

[0035] Preferably, the silk screen printing requirement includes appropriate numbering intervals, and the specific steps of step S6 are:

[0036] Step S64, obtaining each virtual panel after preliminary screening;

[0037] Step S65: Collect all numbers through image recognition, and collect the intervals between any two numbers;

[0038] Step S66 , counting the proportion of intervals greater than a preset threshold, and outputting the silk-screen printing scheme on the virtual panel with the highest proportion as the optimal silk-screen printing scheme.

[0039] Compared with the prior art, the present invention has the following beneficial effects:

[0040] The present invention provides a silk screen printing method for an integrated circuit board solder mask panel, which is used for silk screen printing on an integrated circuit board after adding a solder mask layer. The method first obtains basic information of the solder mask panel to be silk screened, then constructs a virtual panel, numbers the components to be soldered in the virtual panel, and fills the numbers outside the component boundary box. At this time, there will be several identical numbers at different positions outside each component boundary box. Then, a random selection combination method is used to obtain several silk screen printing schemes for each virtual panel. Then, the silk screen printing schemes are preliminarily screened by not allowing overlapping parts. After deleting the overlapping silk screen printing schemes, the silk screen printing needs of the user are collected to optimize the silk screen printing scheme. This can not only prevent the key parts of the circuit board from being covered by numbers, but also meet the user's own attraction needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for use in the description of the embodiments. Obviously, the drawings described below are only preferred embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0042] Figure 1 This is a flow chart of a method for silk-screening a solder mask surface of an integrated circuit board according to the present invention;

[0043] Figure 2 This is a flow chart of step S1 of a method for silk-screening a solder mask surface of an integrated circuit board according to the present invention;

[0044] Figure 3 This is a flow chart of step S2 of a method for silk-screening a solder mask surface of an integrated circuit board according to the present invention;

[0045] Figure 4 This is a flow chart of step S3 of a method for silk-screening a solder mask surface of an integrated circuit board according to the present invention;

[0046] Figure 5 This is a flow chart of step S5 of a method for silk-screening a solder mask surface of an integrated circuit board according to the present invention;

[0047] Figure 6 This is a flow chart of step S6 of a method for screen printing a solder mask surface of an integrated circuit board according to the present invention when the screen printing requirement is that the numbering direction is consistent;

[0048] Figure 7 The flowchart of step S6 of the screen printing method for the solder mask surface of an integrated circuit board of the present invention is shown when the screen printing requirement is that the number interval is appropriate. DETAILED DESCRIPTION

[0049] In order to better understand the technical content of the present invention, a specific embodiment is provided below, and the present invention is further described in conjunction with the accompanying drawings.

[0050] See also Figures 1 to 7 The present invention provides a method for silk-screening a solder mask surface of an integrated circuit board, comprising the following steps:

[0051] Step S1, obtaining basic information of the panel to be screen-printed with solder mask, wherein the basic information includes components to be soldered, dimensions, component boundary boxes, and parts that are not allowed to overlap;

[0052] Step S2: constructing a virtual panel based on the size, component bounding box, and the non-overlapping portion;

[0053] Step S3: number the components to be soldered and randomly fill the numbers outside the corresponding component boundary boxes on the virtual panel;

[0054] Step S4: randomly select a number outside the boundary box of each component and combine them to form several silk screen schemes;

[0055] Step S5: Preliminary screening of the screen printing schemes based on the non-overlapping parts;

[0056] Step S6: Obtain the user's silk screen printing requirements, optimize the silk screen printing solutions that have been initially screened based on the silk screen printing requirements, and obtain the optimal silk screen printing solution.

[0057] A method for silk-screening a solder mask of an integrated circuit board of the present invention is used for silk-screening a circuit board with a solder mask layer added, firstly, basic information of the solder mask panel to be silk-screened is obtained, wherein the basic information includes the circuit layout information and size of the solder mask panel to be silk-screened, and the circuit layout information of the solder mask panel to be silk-screened mainly includes the components to be soldered, the component boundary box and the non-overlapping part thereon, wherein the components to be soldered will be soldered on the component boundary box during the later assembly, and the non-overlapping part needs to ensure the integrity at the initial stage to avoid overlap during silk-screening, after obtaining the size, a virtual panel of the same size can be constructed, and then the component boundary box and the non-overlapping part are mapped to the virtual panel, and the virtual panel at this time is equivalent to the solder mask panel to be silk-screened, and after the silk-screen layer is added to the virtual panel, the virtual panel is equivalent to the panel of the components to be soldered, and the silk-screen layer mainly includes numbers and some special patterns, and will be processed according to different components to be soldered. Different numbers and the numbering of the same type of components to be soldered need to be carried out in sequence. For example, resistors are R1, R2, etc. After numbering the soldered components according to the numbering rules, the numbers can be randomly filled in the outside of the corresponding component boundary boxes on the virtual panel. The sizes of the component boundary boxes are different. The component boundary boxes of resistors or capacitors are mostly small, while the component boundary boxes of some chips are larger. Therefore, the number and position of the numbers filled in the outside of different component boundary boxes are different. When the numbers outside each component boundary box are selected and combined, several silk screen schemes can be combined. Some silk screen schemes will have numbers that overlap with the parts that are not allowed to overlap. Therefore, the silk screen schemes can be preliminarily screened. After screening out the silk screen schemes with overlapping, the optimization is performed based on the user's silk screen requirements, and the optimal silk screen scheme is obtained. Finally, the silk screen solder mask panel can be silk screened based on the optimal silk screen scheme, which not only avoids overlap but also meets the user's silk screen requirements.

[0058] Preferably, the specific steps of step S1 are:

[0059] Step S11, obtaining the model of the panel to be screen-printed with solder mask, and matching it to obtain a standard circuit board from a circuit board database;

[0060] Step S12: Obtain a circuit layout design of a standard circuit board, and obtain basic information from the circuit layout design.

[0061] The layout design of integrated circuit boards and the design of components are mostly standard. When obtaining the basic information of the panel to be screen-printed with solder mask, the model of the panel to be screen-printed with solder mask can be obtained first. The model can be matched to the corresponding standard circuit board from the database, so that the size, component boundary box, type of components to be soldered and the non-overlapping parts on the circuit board can be obtained from the standard circuit board. The non-overlapping parts include pads, vias, traces, test points, debugging points, power supply and ground, etc. The pads are used to solder electronic components. The information on the silk screen layer should not overlap with the pads to avoid blocking or interfering with the soldering process. Holes are used to connect different layers of the PCB. The patterns on the silkscreen layer should avoid overlapping with vias to prevent affecting the electrical characteristics and welding quality. Traces are used to connect different components on the PCB. The information on the silkscreen layer should not overlap with the traces to avoid affecting the electrical performance or causing visual confusion. Test points are used for circuit testing and debugging. The information on the silkscreen layer should not block the test points to ensure that they are easily accessible during testing. Debug points are used for debugging and calibration of circuits. The information on the silkscreen layer should not block these points to ensure that they can be easily accessed during debugging. The power and ground markings usually need to be clearly visible and should not be blocked by other information on the silkscreen layer.

[0062] Preferably, the specific steps of step S2 are:

[0063] Step S21: construct a virtual panel based on the size information, and map the component boundary boxes and the parts that are not allowed to overlap onto the virtual panel;

[0064] Step S22: Obtain image information of the panel to be screen-printed with solder mask, and overlap the image information with the virtual panel;

[0065] Step S23: Adjust the positions of the component boundary boxes and the parts that are not allowed to overlap according to the overlapping effect.

[0066] After obtaining the basic information of the panel to be screen-printed with solder mask, a virtual panel is first constructed using the size information. Then, the component bounding box and the non-overlapping portion are mapped to the virtual panel. However, errors may occur during mapping, so the mapped virtual panel is overlapped with the image information of the panel to be screen-printed with solder mask. If the component bounding box and the non-overlapping portion are offset, the position can be adjusted in time to ensure that the layout on the virtual panel is consistent with the panel to be screen-printed with solder mask.

[0067] Preferably, the specific steps of step S3 are:

[0068] Step S31, determining whether components to be welded of the same type form a clustering area;

[0069] Step S32: if a clustering area is formed, sequentially number the components to be welded of the type according to the arrangement of the clustering area;

[0070] Step S33: If the components to be welded of the same type do not form a clustered area, number the components to be welded in a clockwise or counterclockwise order;

[0071] Step S34: Randomly fill the numbers of the components to be welded outside the corresponding component boundary boxes on the virtual panel.

[0072] For the same type of components to be soldered, their numbering needs to be carried out in sequence. On the circuit board, a certain type of components to be soldered may form a clustered area. For example, multiple resistors will be clustered together. In order to facilitate subsequent soldering and repair and maintenance, the numbers of the same type of components to be soldered in the clustered area should be similar. Therefore, after obtaining the arrangement of the components to be soldered in the clustered area, the components to be soldered of this type are numbered according to the arrangement. For example, if there are several resistors on the circuit board clustered in an area and arranged vertically, they can be numbered R1-R5 in a vertical ascending manner. The components to be soldered that do not form a clustered area can be numbered clockwise or counterclockwise.

[0073] After numbering is completed, you can fill the numbers outside the component boundary box. The larger the component boundary box, the more numbers that can be filled.

[0074] Preferably, the specific steps of step S4 are: randomly selecting one of the numbers outside the component boundary box, combining it with the numbers outside the other component boundary boxes, and performing multiple selections to obtain several silk screen printing schemes.

[0075] When determining the silk screen printing scheme, a random selection and combination method is adopted. The number outside the boundary box of each component will be selected and combined with other numbers. Since the same number outside the boundary box of each component will be in different positions, multiple silk screen printing schemes can be formed after the combination is completed.

[0076] Preferably, the specific steps of step S5 are:

[0077] Step S51: Map the silk screen printing schemes onto the virtual panel in sequence;

[0078] Step S52: obtaining virtual panels whose numbers overlap with the non-overlapping part, and recording them as panels to be screened;

[0079] Step S53: determining the number of overlapping parts and numbers of each type of non-overlapping parts on the panel to be screened;

[0080] Step S54: When the number of overlapping parts that are not allowed to overlap and the number overlap is greater than a preset threshold, the corresponding panel to be screened is eliminated.

[0081] There are many silk screen printing schemes, and not all of them can be put into use. In some silk screen printing schemes, the numbers will overlap on the parts that are not allowed to overlap. Therefore, after mapping the silk screen printing scheme to the virtual panel, if there is a virtual panel whose numbers overlap with the parts that are not allowed to overlap, the virtual panel will be output as the panel to be screened, and then the number of overlaps between each part that is not allowed to overlap and the number on the panel to be screened will be calculated. Each part that is not allowed to overlap will be set with a threshold value for the number of allowed overlaps. If the number of overlaps exceeds the preset threshold, the silk screen printing scheme is unqualified and needs to be eliminated. After preliminary screening, the number of silk screen printing schemes can be reduced and the workload of optimization can be reduced.

[0082] Preferably, the silk screen printing requirement includes the numbering direction being consistent, and the specific steps of step S6 are:

[0083] Step S61, obtaining each virtual panel after preliminary screening;

[0084] Step S62: Collect all serial numbers through image recognition and identify the orientation of the serial numbers;

[0085] Step S63 : Calculate the numbering orientation consistency rate of the virtual panels, and output the silk-screen printing scheme on the virtual panel with the highest numbering orientation consistency rate as the optimal silk-screen printing scheme.

[0086] When manufacturing circuit boards, some users require that the numbers on the circuit boards be oriented in a consistent direction to ensure their aesthetics. When silkscreen printing requires consistent numbering, the orientation of all numbers on the virtual panel is recognized through image recognition. The number orientation consistency rate is calculated based on whether they are oriented on the same side or on other sides. Ultimately, the silkscreen printing solution with the highest number orientation consistency rate can be output as the optimal silkscreen printing solution, ensuring that the numbers in the optimal silkscreen printing solution are basically oriented in a consistent direction.

[0087] Preferably, the silk screen printing requirement includes appropriate numbering intervals, and the specific steps of step S6 are:

[0088] Step S64, obtaining each virtual panel after preliminary screening;

[0089] Step S65: Collect all numbers through image recognition, and collect the intervals between any two numbers;

[0090] Step S66 , counting the proportion of intervals greater than a preset threshold, and outputting the silk-screen printing scheme on the virtual panel with the highest proportion as the optimal silk-screen printing scheme.

[0091] When some users manufacture circuit boards, in order to facilitate component soldering and reduce the difficulty of subsequent maintenance, they need to ensure that the intervals between numbers are appropriate to ensure that the numbers and types of components can be accurately located. Therefore, when the silk screen printing requirement is that the number intervals are appropriate, the intervals between each number can be collected, and the proportion of intervals greater than the preset threshold can be counted. The larger the proportion, the more numbers meet the interval threshold, so the silk screen printing solution with the highest proportion can be output.

[0092] After collecting the user's silk screen printing requirements, we can optimize the silk screen printing solutions after preliminary screening in different ways to obtain the silk screen printing solution that best meets the user's needs.

[0093] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. A method for screen printing on a solder mask surface of an integrated circuit board, characterized in that: The following steps are involved: Step S1, obtaining basic information of the panel to be screen-printed with solder mask, wherein the basic information includes components to be soldered, dimensions, component boundary boxes, and parts that are not allowed to overlap; Step S2: constructing a virtual panel based on the size, component bounding box, and the non-overlapping portion; Step S3: number the components to be soldered and randomly fill the numbers outside the corresponding component boundary boxes on the virtual panel; Step S4: randomly select a number outside the boundary box of each component and combine them to form several silk screen schemes; Step S5: Preliminary screening of the screen printing schemes based on the non-overlapping parts; Step S6: Obtain the user's silk screen printing requirements, optimize the silk screen printing solutions that have been initially screened based on the silk screen printing requirements, and obtain the optimal silk screen printing solution.

2. The method for screen printing on a solder mask surface of an integrated circuit board according to claim 1, wherein: The specific steps of step S1 are: Step S11, obtaining the model of the panel to be screen-printed with solder mask, and matching it to obtain a standard circuit board from a circuit board database; Step S12: Obtain a circuit layout design of a standard circuit board, and obtain basic information from the circuit layout design.

3. A method for screen printing on a solder mask surface of an integrated circuit board according to claim 1 or 2, characterized in that: The parts that are not allowed to overlap include pads, vias, traces, test points, debug points, power supplies and grounding.

4. The method for screen printing on a solder mask surface of an integrated circuit board according to claim 1, wherein: The specific steps of step S2 are: Step S21: construct a virtual panel based on the size information, and map the component boundary boxes and the parts that are not allowed to overlap onto the virtual panel; Step S22: Obtain image information of the panel to be screen-printed with solder mask, and overlap the image information with the virtual panel; Step S23: Adjust the positions of the component boundary boxes and the parts that are not allowed to overlap according to the overlapping effect.

5. The method for silk screen printing on a solder mask surface of an integrated circuit board according to claim 1, characterized in that: The specific steps of step S3 are: Step S31, determining whether components to be welded of the same type form a clustering area; Step S32: if a clustering area is formed, sequentially number the components to be welded of the type according to the arrangement of the clustering area; Step S33: If the components to be welded of the same type do not form a clustered area, number the components to be welded in a clockwise or counterclockwise order; Step S34: Randomly fill the numbers of the components to be welded outside the corresponding component boundary boxes on the virtual panel.

6. The method for silk screen printing on a solder mask surface of an integrated circuit board according to claim 1, characterized in that: The specific steps of step S4 are: randomly selecting one of the numbers outside the component boundary box, combining it with the numbers outside the other component boundary boxes, and performing multiple selections to obtain several silk screen printing schemes.

7. The method for silk screen printing on a solder mask surface of an integrated circuit board according to claim 1, characterized in that: The specific steps of step S5 are: Step S51: Map the silk screen printing schemes onto the virtual panel in sequence; Step S52: obtaining virtual panels whose numbers overlap with the non-overlapping part, and recording them as panels to be screened; Step S53: determining the number of overlapping parts and numbers of each type of non-overlapping parts on the panel to be screened; Step S54: When the number of overlapping parts that are not allowed to overlap and the number overlap is greater than a preset threshold, the corresponding panel to be screened is eliminated.

8. The method for silk screen printing on a solder mask surface of an integrated circuit board according to claim 1, characterized in that: The silk screen printing requirement includes the numbering direction being consistent. The specific steps of step S6 are: Step S61, obtaining each virtual panel after preliminary screening; Step S62: Collect all serial numbers through image recognition and identify the orientation of the serial numbers; Step S63 : Calculate the numbering orientation consistency rate of the virtual panels, and output the silk-screen printing scheme on the virtual panel with the highest numbering orientation consistency rate as the optimal silk-screen printing scheme.

9. The method for silk screen printing on a solder mask surface of an integrated circuit board according to claim 1, characterized in that: The silk screen printing requirement includes that the numbering interval is appropriate. The specific steps of step S6 are: Step S64, obtaining each virtual panel after preliminary screening; Step S65: Collect all numbers through image recognition, and collect the intervals between any two numbers; Step S66 , counting the proportion of intervals greater than a preset threshold, and outputting the silk-screen printing scheme on the virtual panel with the highest proportion as the optimal silk-screen printing scheme.

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