Method for manufacturing FPC with component

Abstract

A method of manufacturing a component-equipped FPC for manufacturing a component-equipped FPC in which a circuit component is soldered to the FPC, the method including: an FPC forming step of forming the FPC, in which the FPC integrally includes: an FPC main body; an FPC arm part which is branched from the FPC main body; a component mounting portion which is provided at an end portion of the FPC arm portion and on which a circuit component is mounted; and a bridge connecting the component mounting portion and the FPC main body. A component mounting step of mounting the circuit component on the component mounting portion via solder; and a mounting implementation step of heating the FPC to melt the solder and actually mounting the circuit component on the component mounting portion.

Description

Technical Field

[0001] The present disclosure relates to a method for manufacturing an FPC with components. Background Art

[0002] For example, Patent Document 1 discloses a technology for mounting chip components on a flexible substrate by placing the flexible substrate on a tray, placing the chip components on the flexible substrate, and mounting the chip components on the flexible substrate by reflow deposition.

[0003] One example of a technique for mounting chip components on a flexible substrate by reflow deposition is a technique in which a chip component is mounted on a flexible substrate by reflow deposition while placing a plate having an opening on the flexible substrate to expose the chip component through the opening and pressing the flexible substrate with the plate to prevent the flexible substrate from warping.

[0004] Related technologies

[0005] Patent Literature

[0006] [Patent Document 1] JPH06120653A Summary of the invention

[0007] Problems to be solved by the present invention

[0008] However, in the conventional method of mounting chip components on a flexible substrate, e.g. Fig.11 , 12 As shown, during reflow deposition, when the chip component 102 is mounted on the portion exposed from the opening 152a of the board 152, that is, on the portion 103A branching from the flexible substrate (FPC) 103, there is a problem that the portion 103A on which the chip component 102 is mounted may warp, thereby causing the chip component (circuit component) 102 to be installed in a misaligned state, that is, resulting in a mounting failure.

[0009] An object of the present disclosure is to provide a method of manufacturing an FPC with components, which enables circuit components to be mounted at predetermined positions branched from an FPC main body.

[0010] Solutions to the problem

[0011] According to one aspect of the present disclosure, a method for manufacturing an FPC with components is provided for manufacturing an FPC with components, in which a circuit component is welded and joined to the FPC, the method comprising: an FPC forming step: forming an FPC, wherein the FPC integrally comprises: an FPC body; an FPC arm, the FPC arm branching from the FPC body; a component mounting portion, the component mounting portion being arranged at the end of the FPC arm and for mounting the circuit component; and a bridge connecting the component mounting portion with the FPC body; a component mounting step: mounting the circuit component on the component mounting portion via solder; and an installation implementation step: heating the FPC to melt the solder and actually mounting the circuit component on the component mounting portion.

[0012] According to another aspect of the present disclosure, a method for manufacturing an FPC with components is provided for manufacturing an FPC with components, in which a circuit component is welded and joined to the FPC, the method comprising: an FPC forming step of forming an FPC, wherein the FPC integrally comprises: an FPC body; an FPC arm portion branching from the FPC body; a component mounting portion, the component mounting portion being disposed at an end of the FPC arm portion and for mounting the circuit component; and an extension portion extending from the periphery of the component mounting portion; a component mounting step of mounting the circuit component on the component mounting portion via solder; a board mounting step of mounting the board so that at least a portion of the extension portion is covered and the component mounting portion is exposed; and an installation implementation step of heating the FPC to melt the solder and actually mounting the circuit component on the component mounting portion.

[0013] Advantageous Effects of the Invention

[0014] According to the present disclosure, the circuit component can be mounted at a predetermined position branched from the FPC main body. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 : is a plan view showing the FPC with components manufactured by the FPC with components manufacturing method according to the first embodiment of the present disclosure.

[0016] Figure 2 It is a schematic diagram for explaining the steps of a method for manufacturing an FPC with components.

[0017] Figure 3 This is a diagram for explaining the manufacturing process of the FPC with components, and shows a state where the circuit components are mounted on the FPC.

[0018] Figure 4 It is shown in Figure 3A diagram of the process after the steps, showing a state where the board has been mounted on the FPC.

[0019] Figure 5 It is shown in Figure 4 A diagram of the process after the steps of , showing the state where the bridge on the FPC is cut off.

[0020] Figure 6 It is shown in Figure 5 , and is a plan view showing the completed FPC with components.

[0021] Figure 7 : is a plan view showing a modified example of the FPC with components manufactured by the FPC with components manufacturing method.

[0022] Figure 8 is a plan view showing an FPC with components according to a second embodiment of the present disclosure.

[0023] Fig. 9 It is a schematic diagram for explaining the steps of a method for manufacturing an FPC with components.

[0024] Fig.10 is a diagram for explaining a manufacturing process for manufacturing an FPC with components, showing a state in which a board is attached to the FPC.

[0025] Fig.11 1 is a diagram for explaining a problem to be solved by the present disclosure, and is a plan view showing a flexible substrate with a chip component manufactured by a conventional flexible substrate mounting method.

[0026] Fig.12 yes Fig.11 A cross-sectional view of a flexible substrate with a chip component is shown in FIG.

[0027] Reference Numbers List

[0028] 1.1A: FPC manufacturing method with components

[0029] 2: Circuit components

[0030] 3.3A: FPC

[0031] 10, 10A: FPC with components

[0032] 31: FPC body

[0033] 32: FPC arm

[0034] 33: Component installation

[0035] 34: Bridge

[0036] 35: Extension

[0037] 52: Board

[0038] S1, S1A: FPC formation steps

[0039] S2: Component installation steps

[0040] S3: Board Installation Steps

[0041] S4: Installation implementation steps

[0042] S5: Bridge cutting step DETAILED DESCRIPTION

[0043] (First embodiment)

[0044] Below, refer to Figures 1 to 6 A method 1 of manufacturing an FPC with components according to a first embodiment of the present disclosure will be described. Figure 1 : is a plan view showing the FPC with components 10 manufactured by the FPC with components manufacturing method 1 according to the first embodiment of the present disclosure.

[0045] like Figure 1 As shown, the FPC with components 10 manufactured by the FPC with components manufacturing method 1 includes a circuit component 2 and an FPC 3 (flexible printed circuit), and the circuit component 2 is soldered and bonded to the FPC 3. In this embodiment, arrows X, Y and Z are directions perpendicular to each other. Arrows X and Y indicate the plane direction in which the FPC 3 extends, and arrow Z indicates the direction in which the circuit component 2 is mounted relative to the FPC 3.

[0046] The circuit component 2 is solder-joined to a component mounting portion 33 (described later) of the FPC 3 and is electrically connected to a circuit formed in the FPC 3. In this case, the circuit component 2 is an element that performs various functions. Examples of the circuit component 2 include a connector, a capacitor, a relay, a resistor, a transistor, an IPS (Intelligent Power Switch), and an electronic control unit including a microcomputer. Figure 1 As shown, the circuit component 2 includes a circuit component body (not shown) and a plurality of connection parts 22 extending from both ends of the circuit component body (in the figure, only one of the plurality of connection parts 22 is shown, and the other connection parts are omitted). Hereinafter, one of the plurality of connection parts 22 may be referred to as a "first connection part", and the other connection parts may be referred to as a "second connection part".

[0047] In the present embodiment, the first connection portion 22 is formed of a rectangular plate-shaped conductive metal joint. The first connection portion 22 is provided so that a portion of the first connection portion 22 extends from a component mounting portion 33 provided on the FPC 3 described later.

[0048] like Figure 1 , Figure 3 As shown, the FPC 3 integrally includes: an FPC body 31 formed in a rectangular shape, an FPC arm 32 branching from the FPC body 31, a component mounting portion 33 arranged on the end of the FPC arm 32 and on which the first connecting portion 22 of the circuit component 2 is mounted, and a bridge 34 connecting the component mounting portion 33 to the FPC body 31.

[0049] like Figure 3 As shown, the FPC body 31 is formed in a rectangular shape. The FPC body 31 includes: a pair of first edges 31a, 31a, which form both ends of the FPC body 31 in the left-right direction X and extend in the front-back direction Y; and a second edge 31b, which is continuous with the pair of first edges 31a, 31a and extends in the left-right direction X.

[0050] like Figure 3 As shown, the FPC arm 32 includes: a plate-shaped FPC arm body 321 extending from the second edge 31b of the FPC body 31 toward the front side Y1; and a plate-shaped FPC extension 322 bent at a right angle at one end of the FPC arm body 321 away from the FPC body 31 and extending in the left-right direction X. One end 32L of the FPC arm 32 is continuous with the second edge 31b of the FPC body 31, and the other end 32R is continuous with the first peripheral edge 33a of the component mounting portion 33 described below.

[0051] like Figure 3 As shown, the component mounting portion 33 is formed in a rectangular shape. The component mounting portion 33 includes a first periphery 33a and a second periphery 33b extending in the front-rear direction Y, and a third periphery 33c and a fourth periphery 33d extending in the left-right direction X. In addition, the component mounting portion 33 is arranged on the side of the FPC extension 322 opposite to the FPC arm body 321 in the left-right direction X. Solder printing is applied to the upper surface of the component mounting portion 33. In the following, the solder is given a reference mark 4. In addition, the component mounting portion 33 is configured so that the first connection portion 22 of the circuit component 2 is electrically connected to the component mounting portion 33 via the solder 4. That is, the circuit component 2 is mounted on the component mounting portion 33.

[0052] The bridge 34 is formed as follows Figure 3 The bridge 34 is located between the FPC body 31 and the component mounting portion 33 and is provided continuously with both of them. The bridge 34 extends in the front-rear direction Y with one end thereof continuing to the second edge 31b of the FPC body 31 and the other end continuing to the third peripheral edge 33c of the component mounting portion 33.

[0053] Next, refer to Figure 4 The manufacturing equipment 5 used for manufacturing the FPC 10 with components will be described.

[0054] like Figure 3 and Figure 4 As shown, the manufacturing equipment 5 includes: a tray 51 on which the FPC 3 is placed; a reflow oven (not shown) that melts the solder 4 by heating; and a board 52 (such as Figure 4 As shown), the plate 52 covers and presses the FPC3.

[0055] like Figure 4 As shown, the tray 51 is configured so that the FPC 3 and the circuit components 2 can be placed thereon. The tray 51 is formed in a flat plate shape, and is configured to have an area larger than that of the FPC 10 with the components.

[0056] like Figure 4 As shown, the board 52 includes a board body 521 and a rectangular opening 522 provided in the board body 521, and the board body 521 has a size covering the FPC body 31 of the FPC 3 and a part of the FPC arm 32. The size of the opening 522 is such that the component mounting portion 33, the portion of the FPC arm 32 including the other end portion 32R, and the first connection portion 22 of the circuit component 2 are exposed.

[0057] Next, refer to Figures 2 to 6 A method of manufacturing the FPC with components 10 using the manufacturing apparatus 5 (FPC with components manufacturing method 1) will be described.

[0058] First, if Figure 2 , Figure 3 As shown, the FPC 3 is formed so as to integrally include an FPC body 31, an FPC arm 32 branching from the FPC body 31, a component mounting portion 33 provided on the FPC arm 32 and used to mount the circuit component 2, and a bridge 34 connecting the component mounting portion 33 and the FPC body 31 (FPC forming step S1). Then, solder is printed on the upper surface of the component mounting portion 33. Then, the FPC 3 is placed in the tray 51.

[0059] Next, if Figure 4 As shown, the first connection portion 22 of the circuit component 2 is mounted on the component mounting portion 33 (component mounting step S2). The first connection portion 22 is placed so that the portion on the rear side Y2 is on the component mounting portion 33, and the portion on the front side Y1 spans across the fourth peripheral edge 33d of the component mounting portion 33. In this way, the circuit component 2 is mounted on the component mounting portion 33 via the solder 4.

[0060] Next, if Figure 4As shown, the board 52 is placed on the FPC 3 (board mounting step S3). The board 52 is placed so that the board body 521 covers the FPC body 31 and a part of the FPC arm 32, and so that the part of the FPC arm 32 including the other end 32R, the component mounting portion 33, the first connection portion 22 of the circuit component 2, and the bridge 34 are exposed from the opening 522. Figure 4 As shown, the state in which the FPC 3 and the circuit component 2 are placed on the tray 51 and the board 52 is placed at a predetermined position on the FPC 3 may be referred to as “component set 6 .” If there is no risk of warping of the FPC body 31 , the board 52 may be omitted.

[0061] Next, the component group 6 is placed in a reflow furnace. Thus, the FPC 3 is heated, and the solder 4 is melted. In this case, the component mounting portion 33 is supported on the FPC body 31 via the bridge 34, and warping of the component mounting portion 33 is suppressed.

[0062] Thereafter, the first connection portion 22 of the circuit component 2 is electrically connected to the circuit formed in the component mounting portion 33 of the FPC 3 via the solder 4. Moreover, the second connection portion of the circuit component 2 is electrically connected to the circuit at a predetermined position. Thus, the circuit component 2 is mounted on the component mounting portion 33 (mounting implementation step S4). In this case, the warping of the component mounting portion 33 is suppressed, so that the circuit component 2 is positioned at a predetermined position on the component mounting portion 33.

[0063] Thereafter, the component group 6 is removed from the reflow oven and the board 52 is removed. Figure 5 As shown, the bridge 34 is cut at the boundary position L1 between the bridge 34 and the FPC main body 31 and at the boundary position L2 between the bridge 34 and the component mounting portion 33 (bridge cutting step S5). Figure 6 The FPC 10 with components is completed as shown.

[0064] According to the embodiment described above, the FPC with components manufacturing method 1 for manufacturing the FPC with components 10 in which the circuit component 2 is solder-joined to the FPC 3 includes: an FPC forming step S1 of forming the FPC 3, the FPC 3 integrally including the FPC body 31, the FPC arm 32 branching from the FPC body 31, the component mounting portion 33 provided on the end of the FPC arm 32 and on which the circuit component 2 is mounted, and the bridge 34 connecting the component mounting portion 33 with the FPC body 31. Therefore, when the FPC 3 is heated, the FPC 3 is heated in the reflow oven in a state where the component mounting portion 33 is supported on the FPC body 31 by the bridge 34, so that the warping of the component mounting portion 33 is suppressed. Therefore, the circuit component 2 can be mounted in a predetermined orientation at a predetermined position (component mounting portion 33) branching from the FPC body 31.

[0065] The board mounting step S3 is provided to place the board 52 so as to cover a part of the FPC body 31 and a part of the FPC arm portion 32 while exposing the component mounting portion 33. Therefore, warping of the FPC body 31 is suppressed.

[0066] A bridge cutting step S5 of cutting the bridge 34 is provided, and is performed after the mounting step S4. Therefore, it is possible to cut off unnecessary portions to produce a lightweight FPC 10 with components.

[0067] It should be noted that the present disclosure is not limited to the above-mentioned embodiments, and includes other structures that can achieve the purpose of the present disclosure, and the following modified examples are also included in the present disclosure.

[0068] In the above-described embodiment, in the component mounting step S2, the circuit component 2 is mounted on the component mounting portion 33 of the FPC 3, and thereafter, in the board mounting step S3, the board 52 is placed on the FPC 3, but the present disclosure is not limited thereto. The circuit component 2 may be placed on the component mounting portion 33 of the FPC 3 after the board 52 is placed on the FPC 3. In other words, the component mounting step S2 may be performed after the board mounting step S3.

[0069] Furthermore, in the above-described embodiment, in the bridge cutting step S5, the bridge 34 is cut at the boundary position L1 between the bridge 34 and the FPC body 31 and at the boundary position L2 between the bridge 34 and the component mounting portion 33, but the present disclosure is not limited thereto. Figure 7 As shown, the bridge 34 may be cut at the middle position L3 in the front-rear direction Y, or the bridge cutting step S5 may not be performed at all, so that the state in which the component mounting portion 33 is connected to the FPC body 31 (i.e., the state in which the bridge 34 exists) may be a completed state. Alternatively, a perforation may be pre-set at at least one of the positions L1 to L3.

[0070] (Second embodiment)

[0071] In the following, reference is made to Figures 8 to 10 A method 1A of manufacturing an FPC with components according to a second embodiment of the present disclosure will be described. Figure 8 : is a plan view showing an FPC 10A with components according to a second embodiment of the present disclosure. Fig. 9 It is a schematic diagram for explaining the steps of the method 1A for manufacturing the FPC with components. Fig.101 is a diagram for explaining a manufacturing process for manufacturing an FPC with components 10A, showing a state where a plate 52 is attached to an FPC 3A. The FPC with components manufacturing method 1A according to the second embodiment differs from the FPC with components manufacturing method 1 according to the first embodiment in the configuration of the FPC 3A (3). Hereinafter, in the second embodiment, constituent elements having the same configuration as the first embodiment are denoted by the same reference numerals, and detailed description thereof is omitted.

[0072] like Figure 8 As shown, an FPC with components 10A manufactured by a method 1A for manufacturing an FPC with components includes a circuit component 2 and an FPC 3A (flexible printed circuit) to which the circuit component 2 is solder-joined.

[0073] like Figure 8 As shown, FPC3A integrally includes: an FPC body 31, an FPC arm 32 branching from the FPC body 31, a component mounting portion 33 provided on the end of the FPC arm 32 and on which the first connection portion 22 of the circuit component 2 is mounted, and an extension portion 35 extending from the component mounting portion 33.

[0074] like Figure 8 and Fig.10 As shown, the extension portion 35 is configured to extend in a direction away from the FPC arm portion 32 at the distal end portion of the second peripheral edge 33b of the component mounting portion 33 (the end away from the FPC body 31 in the front-rear direction Y). The extension portion 35 refers to a portion extending from the second peripheral edge 33b of the component mounting portion 33.

[0075] Next, refer to Figures 8 to 10 A method of manufacturing the FPC with components 10A using the manufacturing apparatus 5 (FPC with components manufacturing method 1A) will be described.

[0076] First, if Figure 8 , Fig. 9 As shown, FPC 3A is formed to integrally include FPC body 31, FPC arm 32 branching from FPC body 31, component mounting portion 33 provided on the end of FPC arm 32 and on which circuit component 2 is mounted, and extension portion 35 extending from component mounting portion 33 (FPC forming step S1A). Then, solder is printed on the upper surface of component mounting portion 33.

[0077] Next, the FPC 3A is placed on the tray 51. Then, the first connection portion 22 of the circuit component 2 is placed on the component mounting portion 33 (component mounting step S2). The first connection portion 22 is placed so that the portion on the rear side Y2 is on the component mounting portion 33 and the portion on the front side Y1 spans the fourth peripheral edge 33d of the component mounting portion 33.

[0078] Next, if Fig.10 As shown, the board 52 is placed on the FPC 3A (board mounting step S3). The board 52 is placed so that the board body 521 covers the FPC body 31 and a part of the FPC arm 32, and so that the part of the FPC arm 32 including the other end 32R, the component mounting portion 33, the first connection portion 22 of the circuit component 2, and the base end of the extension portion 35 are exposed from the opening 522. Fig.10 As shown, the state in which the FPC 3A and the circuit component 2 are placed on the tray 51 and the board 52 is placed at a predetermined position on the FPC 3A can be referred to as a “component set 16 ”.

[0079] Next, the component group 16 is placed in a reflow furnace. Thus, the FPC 3A is heated, and the solder 4 is melted. In this case, the component mounting portion 33 is pressed by the plate 52 via the extending portion 35, and warping of the component mounting portion 33 is suppressed.

[0080] Thereafter, the first connection portion 22 of the circuit component 2 is electrically connected to the circuit formed on the component mounting portion 33 of the FPC 3A via the solder 4. In addition, the second connection portion of the circuit component 2 is electrically connected to the circuit at a predetermined position. As a result, the circuit component 2 is mounted on the component mounting portion 33 (mounting implementation step S4). In this case, the warping of the component mounting portion 33 is suppressed, so that the circuit component 2 is positioned at a predetermined position of the component mounting portion 33.

[0081] Thereafter, the component group 6 is removed from the reflow oven and the board 52 is removed. Figure 8 The FPC 10A with components is completed as shown.

[0082] According to the above-described embodiment, the FPC with components manufacturing method 1A for manufacturing the FPC with components 10 in which the circuit component 2 is solder-joined to the FPC 3A includes: an FPC forming step S1A of forming the FPC 3A, the FPC 3A integrally including the FPC body 31, the FPC arm 32 branching from the FPC body 31, the component mounting portion 33 provided on the end of the FPC arm 32 and on which the circuit component 2 is mounted, and the extension 35 extending from the periphery of the component mounting portion 33; and a board mounting step S3 of placing the board 52 so that at least a portion of the extension 35 is covered and the component mounting portion 33 is exposed. Therefore, when the FPC 3A is heated, the FPC 3A is heated in the reflow oven in a state where the extension 35 is pressed by the board 52, so that the warping of the component mounting portion 33 is suppressed. Therefore, the circuit component 2 can be mounted in a predetermined orientation at a predetermined position (component mounting portion 33) branching from the FPC body 31.

[0083] In the above embodiment, if Figure 8As shown, the first connection portion 22 of the circuit component 2 is placed so that the portion of the rear side Y2 is on the component mounting portion 33, and the portion of the front side Y1 crosses the fourth peripheral edge 33d of the component mounting portion 33. The extension portion 35 is configured to extend in a direction away from the FPC arm portion 32 in the left-right direction X at the terminal portion of the second peripheral edge 33b of the component mounting portion 33, but the present disclosure is not limited thereto. The first connection portion 22 of the circuit component 2 may be arranged so that a portion of the first connection portion 22 is mounted on the component mounting portion 33, and another portion of the first connection portion 22 is mounted across the second peripheral edge 33b of the component mounting portion 33. In this case, the extension portion may be configured to extend in a direction away from the FPC body 31 in the front-back direction Y at the fourth peripheral edge 33d of the component mounting portion 33.

[0084] In the above embodiment, in the board installation step S3, the board 52 is placed so that the base end of the extension 35 is exposed from the opening 522 of the board 52, but the present disclosure is not limited thereto. In the board installation step S3, the board 52 may be placed so that the entire extension 35 is covered by the board 52.

[0085] Although the best configuration, method, etc. for carrying out the present invention are disclosed in the above description, the present invention is not limited thereto. That is, although the present invention has been specifically shown and described mainly with respect to a specific embodiment, it should be understood that the present invention can be modified in various ways by those skilled in the art in terms of the shape, material, quantity, and other detailed configurations of the above-described embodiments without departing from the spirit and scope of the present invention. Therefore, since the description of the shape, material, etc. disclosed above is an illustrative example to facilitate understanding of the present invention and does not limit the present invention, the present invention will include descriptions with member names from which some or all of the restrictions on shape, material, etc. have been deleted.

Claims

1. A method for manufacturing an FPC with components, for manufacturing an FPC with components, in which a circuit component is welded and joined to the FPC, the method for manufacturing an FPC with components comprising: FPC forming step: forming an FPC, wherein the FPC integrally comprises: an FPC body; an FPC arm portion branching from the FPC body; a component mounting portion provided at an end of the FPC arm portion and for mounting the circuit component; and a bridge connecting the component mounting portion with the FPC body; A component mounting step of mounting the circuit component on the component mounting portion via solder; and The mounting implementation step is to heat the FPC to melt the solder and actually mount the circuit component on the component mounting portion.

2. The method for manufacturing an FPC with components according to claim 1, further comprising: A board mounting step of mounting a board so that a portion of the FPC main body and a portion of the FPC arm are covered and the component mounting portion is exposed.

3. The method for manufacturing an FPC with components according to claim 1, further comprising: Bridge cutting steps to cut off the bridge, Wherein, the bridge cutting step is performed after the installation implementation step.

4. The method for manufacturing an FPC with components according to claim 2, further comprising: Bridge cutting steps to cut off the bridge, Wherein, the bridge cutting step is performed after the installation implementation step.

5. A method for manufacturing an FPC with components, for manufacturing an FPC with components, in which a circuit component is welded and joined to the FPC, the method for manufacturing an FPC with components comprising: FPC forming step: forming an FPC, wherein the FPC integrally comprises: an FPC body; an FPC arm portion branching from the FPC body; a component mounting portion disposed at an end of the FPC arm portion and for mounting the circuit component; and an extension portion extending from a periphery of the component mounting portion; Component mounting step: mounting the circuit component on the component mounting portion via solder; a board mounting step of mounting the board so that at least a portion of the extension portion is covered and the component mounting portion is exposed; and The mounting implementation step is to heat the FPC to melt the solder and actually mount the circuit component on the component mounting portion.

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