BMS assembly and manufacturing process thereof

Abstract

The BMS assembly comprises a high-voltage board, a low-voltage board, a first FPC board and a second FPC board, the high-voltage board integrates an information acquisition circuit and an electric device control circuit, and a master control circuit for controlling the information acquisition circuit and the electric device control circuit is integrated on the low-voltage board; the high-voltage board is provided with a first connection point area electrically connected with the first FPC board, the first connection point area comprises connection points of the information acquisition circuit and the electric device control circuit, the high-voltage board and the low-voltage board are in transition connection through the second FPC board, and the low-voltage board and the first FPC board are provided with connection points for external electrical connection. According to the invention, the high-voltage circuit and the low-voltage circuit are separately arranged, so that the problem of overlapping between the circuits can be avoided, miniaturization and standardization of the BMS assembly can be realized, and then automatic processing and assembling of the BMS can be realized.

Description

Technical Field

[0001] The present invention relates to the technical field of new energy vehicles, and in particular to a BMS component and a manufacturing process thereof. Background Art

[0002] The battery management system (BMS) is one of the core components of new energy electric vehicles. It is responsible for monitoring, controlling and managing the operating status of battery cells or modules to ensure the safe, reliable and efficient use of batteries. The main functions of BMS include battery status estimation (such as power, temperature, internal resistance, etc.), charge and discharge control (such as current limiting, voltage limiting, balancing, etc.), fault diagnosis and protection (such as overcharging, overdischarging, short circuit, overtemperature, etc.), data acquisition and storage (such as historical data, fault records, etc.), communication and information interaction (such as data transmission and command reception with vehicle management systems, charging piles, cloud services, etc.), etc., so that the performance and reliability of BMS directly affect the range, life, safety and intelligence of electric vehicles. The existing BMS puts high-voltage lines and low-voltage lines together. This design leads to complex line distribution and multiple layers of overlap between lines. Therefore, the BMS is large in size and difficult to process, and it is impossible to realize the automatic processing of BMS. Summary of the invention

[0003] The embodiment of the present invention provides a BMS component and a manufacturing process thereof to solve the problem of high processing difficulty caused by complex circuits in the prior art.

[0004] In order to achieve the above purpose, the embodiment of the present invention provides the following technical solutions: A BMS component includes a high-voltage board, a low-voltage board, a first FPC board and a second FPC board, wherein the high-voltage board integrates an information acquisition circuit and an electric device control circuit, and the low-voltage board integrates a general control circuit that controls the information acquisition circuit and the electric device control circuit; the high-voltage board is provided with a first connection point area electrically connected to the first FPC board, the first connection point area includes connection points between the information acquisition circuit and the electric device control circuit, the high-voltage board and the low-voltage board are transitionally connected via the second FPC board, and the low-voltage board and the first FPC board are both provided with connection points for external electrical connection.

[0005] Furthermore, the high-voltage board is provided with a second connection point area electrically connected to the second FPC board, and the low-voltage board is provided with a third connection point area electrically connected to the second FPC board.

[0006] Furthermore, the high-voltage board and the low-voltage board are respectively fixed on two side surfaces of the bracket.

[0007] A manufacturing process for producing the BMS component comprises the following steps: S1. According to the designed circuit, a high voltage board, a low voltage board, a first FPC board, and a second FPC board are respectively manufactured; S2, performing hot pressing adhesive treatment on the connection between the high-voltage board and the first FPC board, the connection between the high-voltage board and the second FPC board, and the connection between the low-voltage board and the first FPC board; S3, the connection between the high voltage board and the first FPC board, the connection between the high voltage board and the second FPC board, and the connection between the low voltage board and the first FPC board are all hotbar welded to obtain a semi-finished product; S4. Perform BMS performance test and X-Ray test on the semi-finished products, and select qualified semi-finished products that pass both tests; S5. After cleaning the qualified semi-finished products, UV coating is performed on the connection area between the high-voltage board and the first FPC board, the connection area between the high-voltage board and the second FPC board, and the connection area between the low-voltage board and the first FPC board in the qualified semi-finished products. After the UV coating on the qualified semi-finished products is checked and cured, a qualified finished product is obtained.

[0008] Furthermore, in S5, the qualified finished product is installed on the bracket, wherein the high-voltage board and the low-voltage board are installed on both sides of the bracket respectively.

[0009] Furthermore, the hot pressing time of the hot pressing adhesive in S2 is not less than 30 seconds, the hot pressing temperature is not less than 200°, and the hot pressing pressure is not less than 1 bar.

[0010] Furthermore, the hotbar welding in S3 includes an upper pressure head and a lower pressure head, which are arranged opposite to each other and clamp the material, and the clamping pressure is not less than 1 bar; the initial temperature of the upper pressure head is not less than 150°, and the temperature is subsequently increased at least twice, and the final temperature is not less than 350°; the welding temperature of the lower pressure head is not less than 200°.

[0011] Furthermore, in S1, the flow code is bound to the low-voltage board, the first FPC board, the second FPC board, the high-voltage board, and the electrical components respectively; then the assembled high-voltage board, the low-voltage board, the first FPC board, and the second FPC board are photographed and traced by visual photography.

[0012] The embodiments of the present invention have the following advantages: A BMS component provided by the present invention integrates high-voltage circuits such as a main circuit, a pre-charging circuit, and a heating circuit on a high-voltage board, and integrates low-voltage circuits such as a control circuit for each electrical component and a signal acquisition circuit on a low-voltage board. The high-voltage circuit and the low-voltage circuit are set separately, and then connected with the high-voltage circuit through an FPC circuit board, which can avoid the problem of overlapping between circuits, and makes the circuits flattened into a layer of circuits for easy processing, thereby realizing the miniaturization and standardization of BMS components, and further realizing the automated processing and assembly of BMS. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] In order to more clearly illustrate the implementation methods of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for the implementation methods or the description of the prior art. Obviously, the drawings in the following description are only exemplary, and for ordinary technicians in this field, other implementation drawings can be derived from the provided drawings without creative work.

[0014] The structures, proportions, sizes, etc. illustrated in this specification are only used to match the contents disclosed in the specification so as to facilitate understanding and reading by persons familiar with the technology. They are not used to limit the conditions under which the present invention can be implemented, and therefore have no substantial technical significance. Any structural modification, change in proportion or adjustment of size shall still fall within the scope of the technical contents disclosed in the present invention without affecting the effects and purposes that can be achieved by the present invention.

[0015] Figure 1 A product structure diagram of a BMS component provided in Example 1 of the present invention; Figure 2 for Figure 1 Exploded diagram of Figure 3 A circuit diagram of a BMS component provided in Example 1 of the present invention; Figure 4 A process flow chart of a BMS component manufacturing process provided in Example 2 of the present invention; Figure 5 A schematic diagram of a BMS component manufacturing process provided in Example 2 of the present invention.

[0016] In the figure: 1. High-voltage board; 2. First connection point area; 3. Second connection point area; 4. Third connection point area; 5. Low-voltage board; 6. Bracket; 7. Connection point; 8. First FPC board; 9. Second FPC board; 10. BMS component; 11. Main positive circuit; 12. Pre-charge circuit; 13. Heating circuit; 14. Main negative circuit; 15. Fast charge circuit. DETAILED DESCRIPTION

[0017] The following is a description of the implementation of the present invention by specific embodiments. People familiar with the art can easily understand other advantages and effects of the present invention from the contents disclosed in this specification. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0018] Example 1

[0019] like Figure 1-2 As shown, a BMS assembly includes a high voltage board 1, a low voltage board 5, a first FPC board 8 and a second FPC board 9, wherein: The high-voltage board 1 integrates the signal acquisition circuits of the main positive circuit 11, the main negative circuit 14, the pre-charging circuit 12, the heating circuit 13 and other circuits and the control circuits of the electrical components in these circuits. The former collects electrical signals such as voltage signals and current signals of these circuits, and the latter is used to output control signals for electrical components such as relays, fuses, and shunts in these circuits. The high-voltage board 1 is provided with a first connection point area 2 electrically connected to the first FPC board 8. The first connection point area 2 includes a connection point 7 between the information acquisition circuit and the electrical component control circuit. The first FPC board 8 is provided with a connector for the electrical components in the aforementioned circuits. Specifically, the first FPC board 8 is laid on the top or bottom of the electrical component, and a connector is provided at the position where the first FPC board 8 is connected to the electrical component. The first FPC board 8 has the characteristics of ultra-thin, safe, and low cost, which can reduce the overall volume and manufacturing cost of the BMS component 10.

[0020] The low-voltage board 5 integrates a master control circuit for controlling the information acquisition circuit and the electrical device control circuit. The master control circuit is used to receive electrical signals of various circuits uploaded by the information acquisition circuit, and can output signal data to the outside, and can also output control signals for electrical devices in various circuits to the outside. The high-voltage board 1 and the low-voltage board 5 are connected via a second FPC board 9. Specifically, the high-voltage board 1 is provided with a second connection point area 3 electrically connected to the second FPC board 9, and the first connection point area 2 and the second connection point area 3 are respectively arranged on the two sides of the high-voltage board 1. This design facilitates the separation of the space requirements of the high-voltage board 1 for different connection ends. In this embodiment, the high-voltage board 1 is a rectangular board, the first connection point area 2 is arranged on the top side of the high-voltage board 1, and the second connection point area 3 is arranged on the left side or the right side of the high-voltage board 1. The low-voltage board 5 is provided with a third connection point area 4 electrically connected to the second FPC board 9. When the high-voltage board 1 and the low-voltage board 5 are arranged side by side, the second point area on the high-voltage board 1 and the third connection point area 4 on the low-voltage board 5 are both located on the same side, so that the shortest second FPC board 9 is achieved. In addition, the second FPC board 9 has a soft characteristic, which can realize the change of the shape of the BMS component 10, thereby greatly reducing the volume of the BMS component 10, so that the BMS component 10 can meet the space requirements of different shapes.

[0021] The low-voltage board 5 is provided with a connection point 7 for external electrical connection. The low-voltage board 5 may be provided with a connection structure integrating all external connection points 7, such as connectors, external connection terminals and other electrical interfaces. The external connection point 7 and the third connection point area 4 are respectively arranged on both sides of the low-voltage board 5. This design facilitates the separation of the space requirements of the low-voltage board 5 for different connection ends. In this embodiment, the low-voltage board 5 is a rectangular board of the same size as the high-voltage board 1. Since the two connection point areas are respectively arranged on both sides of the low-voltage board 5, the circuit distance in the low-voltage board 5 is shortest and the volume of the low-voltage board 5 is minimized.

[0022] Figure 3 The present invention is a circuit diagram of the BMS component applied to the BDU, in which the BMS component 10 is a control component and a collection component, and the circuit includes a main positive circuit 11, a pre-charging circuit 12, a fast charging circuit 15, a heating circuit 13, a main negative circuit 14, a signal collection circuit, and a control circuit, wherein the main positive circuit 11 is provided with a main positive relay and a fuse, the pre-charging circuit 12 is provided with a pre-charging relay and a pre-charging resistor, the fast charging circuit 15 is provided with a fast charging relay, the heating circuit 13 is provided with a heating relay and a heating fuse, the main negative circuit 14 is provided with a main negative relay and a shunt, and the signal collection circuit respectively collects the positive and negative signals of the main positive circuit 11, the pre-charging circuit 12, the fast charging circuit 15, the heating circuit 13, and the main negative circuit 14, and the control circuit is respectively connected to the positive and negative electrodes of the main positive relay, the positive fuse, the pre-charging relay, the fast charging relay, the heating relay, the main negative relay, and the shunt.

[0023] The high-voltage board 1 and the low-voltage board 5 are respectively fixed on the two surfaces of the bracket 6, and the bracket 6 is provided with a connection structure for external fixed connection. The bracket 6 of this embodiment is a rectangular frame slightly larger than the high-voltage board 1 and the low-voltage board 5. The side surfaces of the bracket 6 are respectively provided with fixing positions connected to the high-voltage board 1 and the low-voltage board 5, and screw holes, welding points, etc. can be set on the fixing positions.

[0024] Example 2 like Figure 4-5 As shown, a BMS component manufacturing process includes the following steps:

[0025] S1. According to the designed circuit, a high-voltage board, a low-voltage board, a first FPC board, and a second FPC board are respectively manufactured. In this step, the bare high-voltage board is placed in a high-voltage board carrier, and electrical components can be installed manually, or a high-voltage component mold can be additionally configured. The high-voltage component mold is provided with embedding grooves for the placement positions of each high-voltage electrical component, which are used to position the high-voltage electrical components. Then the high-voltage component mold and the high-voltage board carrier are closed to achieve one-time installation of all high-voltage electrical components on the bare high-voltage board, and finally obtain the high-voltage board. Since the bottom of the high-voltage board carrier is a hollow design, it will expose the part of the pins of the electrical components that pass through the mounting holes on the bare high-voltage board, which is convenient for centralized welding of intelligent equipment, and since the size and shape of the embedding grooves on the high-voltage component mold correspond one-to-one with the electrical components, it can prevent the problem of manual installation errors.

[0026] Similarly, the bare low-voltage board is fixed on the low-voltage board carrier. The low-voltage electrical components can be installed manually, or a low-voltage component mold can be additionally configured. The low-voltage component mold is provided with a groove that matches the low-voltage electrical components for positioning the low-voltage electrical components. The low-voltage component mold is buckled and fixed to the low-voltage board carrier, so that the low-voltage electrical components can be installed on the bare low-voltage board at one time, and finally a low-voltage board is obtained. The bottom of the low-voltage board carrier is a hollow design, which can expose the installation holes on the bare low-voltage board, which is convenient for centralized welding and fixing of intelligent equipment.

[0027] In the S1, open and log in the MES software, click label printing, generate the semi-finished product flow code, tear off the flow code and put it into the barcode box with the front side facing up, use the master-slave label binding function, the system can automatically bind the flow code with the low-voltage board bare board or low-voltage board, the first FPC board, the second FPC board, the high-voltage board bare board or high-voltage board, and electrical components respectively; after the binding is completed, cover the carrier cover, buckle the cover, and then use visual photography to take pictures of the assembled high-voltage board 1, low-voltage board 5, first FPC board 8, and second FPC board 9 for tracing. After the photography is completed, the conveying track is started, and the carrier flows to the board outlet to wait for the board to be discharged.

[0028] S2. The connection between the high-pressure board 1 and the first FPC board 8, the connection between the high-pressure board 1 and the second FPC board 9, and the connection between the low-pressure board 5 and the first FPC board 8 are all subjected to hot-pressing adhesive treatment. First, apply adhesive to the area that needs hot-pressing adhesive treatment. In this technology, thermoplastic polypropylene adhesive (TSA) is used for the adhesive. The hot-pressing time of the hot-pressing adhesive in S2 is not less than 30s, the hot-pressing temperature is not less than 200°, and the hot-pressing pressure is not less than 1 bar. The lower pressure end of the adhesive heating device presses the high-pressure board 1 or the low-pressure board 5 from the bottom to the top, and the upper pressure end of the adhesive heating device presses the first FPC board 8 or the second FPC board 9 from the top to the bottom. The lower pressure end assists in heating and is fixed, and the upper pressure end continues to increase until the hot-pressing pressure is met. This technology is preferably used when the hot-pressing pressure is between 1.5bar and 2.5bar.

[0029] S3, the connection between the high-voltage board 1 and the first FPC board 8, the connection between the high-voltage board 1 and the second FPC board 9, and the connection between the low-voltage board 5 and the first FPC board 8 are all hotbar welded to obtain a semi-finished product. The hotbar welding in S3 includes an upper pressure head and a lower pressure head of a welding machine, which are arranged opposite to each other and clamp the material, and the clamping pressure is not less than 1 bar, preferably 1.5 bar ± 0.1 bar. The upper pressure head presses the first FPC board 8 or the second FPC board 9 from top to bottom, and the initial temperature of the upper pressure head is not less than 150°, and the temperature is increased at least twice subsequently, and the heating time each time does not exceed 6s, and the duration after heating does not exceed 10s, and the final temperature is not less than 350°. The lower pressure head is used for auxiliary heating, which supports the high-voltage board 1 or the low-voltage board 5 from bottom to top, and the welding temperature of the lower pressure head is not less than 200°. The use of adhesive and welding double fixation ensures the stability of the connection between the high-voltage board 1, the low-voltage board 5 and the FPC board.

[0030] S4. Perform BMS performance test and X-Ray test on the semi-finished products, and select qualified semi-finished products that pass both tests. If one of the tests fails, the system automatically removes the unqualified semi-finished products, or the system alarms the staff to remove the unqualified semi-finished products.

[0031] The BMS performance test includes the following test items. If any one of them fails, the BMS performance test of the semi-finished product fails: A. Withstand voltage test: Test for no less than 3s under the condition of DC 800V, initial leakage current ≤1mA, leakage current ≤10mA after endurance, insulation resistance ≥10MΩ, pre-charge resistance is 100Ω (±5%), X capacitor is 100uF (±5%), Y capacitor is 0.1uF (±10%), and the following indicators of BMU are tested: B+&P+: MAX, 8mV @20A, that is, the maximum value measured under 20A test conditions does not exceed 8m, B+ represents the positive electrode of the battery pack, and P+ represents the positive electrode of the heating module, which is used to measure the withstand voltage between the positive electrode of the battery pack and the positive electrode of the heater.

[0032] B+&FC: MAX, 8mV @20A, that is, the maximum value measured under 20A test conditions does not exceed 8m, and B+ represents the positive electrode of the battery pack.

[0033] FC+&SY+: MAX, 8mV @20A, that is, the maximum value measured under 20A test conditions does not exceed 8m.

[0034] B-&P-: MAX, 8mV @20A, that is, the maximum value measured under 20A test conditions does not exceed 8m, B- represents the negative electrode of the battery pack, and P- represents the negative electrode of the heating module, which is used to measure the withstand voltage between the negative electrode of the battery pack and the negative electrode of the heater.

[0035] B-&FC-: MAX, 8mV @20A, that is, the maximum value measured under 20A test conditions does not exceed 8m, B- represents the negative electrode of the battery pack.

[0036] The X-Ray test includes the following test items. If any one of them fails, the X-Ray test of the semi-finished product fails: 1. No leaking soldering / no soldering: The system searches for connection holes in the semi-finished product photos based on the connection hole features of the high-voltage board 1, low-voltage board 5 and other PCB boards. If there are connection holes, they are judged as NG points based on abnormal grayscale (an extreme case of false soldering, which is relatively rare).

[0037] 2. There should be no cold solder joints: There is no good connection between the solder joints (pads). The system judges based on the grayscale value of the solder joints in the semi-finished product photos. If the grayscale value of the solder joint is lower than the grayscale threshold, the solder joint is considered a cold solder joint, that is, the measured soldering area < the designed pad area.

[0038] 3. The tin overflow cannot affect the appearance and assembly function, and cannot violate the minimum electrical clearance: the system judges the solder joint features in the semi-finished product photo. If there is a heavy gray area on the edge of the solder joint, it is judged as tin overflow; if there is no heavy gray area, it is regarded as tin slag and solder balls.

[0039] 4. There must be no bridging tinning: The system determines whether the size of the solder joint exceeds the length threshold based on the characteristics of the solder joint in the semi-finished product photo, or if there are two solder joints connected, it is judged as bridging tinning.

[0040] 5. Tin deficiency is not allowed: The system considers the grayscale value of the solder joint in the semi-finished product photo as insufficient tin if the grayscale value is lower than the grayscale threshold.

[0041] 6. Tin beads / foreign objects must not be larger than 0.1mm: The system determines them as tin beads / foreign objects based on their grayscale and appearance. Specifically, the high-density abnormal points "greater than a certain set value" in a fixed area are identified as tin beads / foreign objects.

[0042] 7. Cavities / bubbles less than 25%: The system determines and automatically circles bubbles based on the grayscale value of the bubble characteristics, and can adjust parameters such as the total bubble rate and the maximum bubble ratio.

[0043] S5. Perform plasma cleaning on qualified semi-finished products. Plasma cleaning mainly removes pollutants and impurities on the surface of the material, including organic matter and the oxide layer on the metal surface, which is used to improve the bonding strength of UV glue in subsequent processes.

[0044] After cleaning the qualified semi-finished products, the connection area between the high-voltage board 1 and the first FPC board 8, the connection area between the high-voltage board 1 and the second FPC board 9, and the connection area between the low-voltage board 5 and the first FPC board 8 in the qualified semi-finished products are all subjected to UV coating treatment. UV coating plays a technical role in circuit insulation, strengthening fixation, and preventing water vapor. UV coating includes two main stages: coating and curing. In the coating stage, the coating roller or spray gun evenly coats the UV glue or paint on the surface of the area to be treated; in the curing stage, the UV light source (such as mercury lamp, deuterium lamp, etc.) irradiates the coating surface to trigger the curing reaction of the photosensitive substance and complete the curing of the coating.

[0045] Then check whether the UV glue is attached to the high-voltage board 1, the low-voltage board 5, the first FPC board 8, and the second FPC board 9. Use a cotton swab to poke the coated UV glue to check the curing condition. If it can be poked, it is not cured. Also check whether the coating is uniform and there are no abnormalities, whether there are bubbles at the gold finger, and the diameter of the bubbles in the remaining coating areas does not exceed 0.5mm, and the number does not exceed 2. After passing the inspection, qualified products are obtained. After passing the inspection, use the visual camera function to take pictures of the front and back of the qualified products after UV curing and upload them to MES, paste the flow code on the carrier of the high-voltage board 1, low-voltage board 5, and FPC board at the specified position of the product, and use the MES system to process qualified products through the station.

[0046] Finally, the qualified finished product is installed on the bracket 6 by a number of screws or bolts, wherein the high-voltage board 1 and the low-voltage board 5 are respectively installed on both sides of the bracket 6, the first FPC board 8 is located on the top of the bracket 6, and the second FPC board 9 is located on one side of the bracket 6 to obtain an assembly, that is, a highly integrated BMS component 10 that separates high voltage and low voltage.

[0047] Although the present invention has been described in detail above by general description and specific embodiments, it is obvious to those skilled in the art that some modifications or improvements can be made to the present invention. Therefore, these modifications or improvements made without departing from the spirit of the present invention all belong to the scope of protection claimed by the present invention.

Claims

1. A BMS component, characterized in that: It includes a high-voltage board, a low-voltage board, a first FPC board and a second FPC board, wherein the high-voltage board integrates an information acquisition circuit and an electric device control circuit, and the low-voltage board integrates a master control circuit for controlling the information acquisition circuit and the electric device control circuit; The high-voltage board is provided with a first connection point area electrically connected to the first FPC board, the first connection point area includes connection points between the information acquisition circuit and the electrical device control circuit, the high-voltage board and the low-voltage board are transitionally connected through a second FPC board, and the low-voltage board and the first FPC board are both provided with connection points for external electrical connection.

2. A BMS component according to claim 1, characterized in that: The high voltage board is provided with a second connection point area electrically connected to the second FPC board, and the low voltage board is provided with a third connection point area electrically connected to the second FPC board.

3. A BMS component according to claim 1, characterized in that: The high-voltage board and the low-voltage board are respectively fixed on two side surfaces of the bracket.

4. A manufacturing process of a BMS component, characterized in that: The following steps are involved: S1. According to the designed circuit, a high voltage board, a low voltage board, a first FPC board, and a second FPC board are respectively manufactured; S2, performing hot pressing adhesive treatment on the connection between the high voltage board and the first FPC board, the connection between the high voltage board and the second FPC board, and the connection between the low voltage board and the second FPC board; S3, the connection between the high voltage board and the first FPC board, the connection between the high voltage board and the second FPC board, and the connection between the low voltage board and the second FPC board are all hotbar welded to obtain a semi-finished product; S4. Perform BMS performance test and X-Ray test on the semi-finished products, and select qualified semi-finished products that pass both tests; S5. After cleaning the qualified semi-finished products, UV coating is performed on the connection area between the high-voltage board and the first FPC board, the connection area between the high-voltage board and the second FPC board, and the connection area between the low-voltage board and the second FPC board in the qualified semi-finished products. After the UV coating on the qualified semi-finished products is checked and cured, a qualified finished product is obtained.

5. The manufacturing process of a BMS component according to claim 4, characterized in that: In S5, the qualified finished product is installed on the bracket, wherein the high-voltage board and the low-voltage board are installed on both sides of the bracket respectively.

6. The manufacturing process of a BMS component according to claim 4, characterized in that: The hot pressing time of the hot pressing adhesive in S2 is not less than 30 seconds, the hot pressing temperature is not less than 200°, and the hot pressing pressure is not less than 1 bar.

7. The manufacturing process of a BMS component according to claim 4, characterized in that: The hotbar welding in S3 includes an upper pressure head and a lower pressure head, which are arranged opposite to each other and clamp the material, and the clamping pressure is not less than 1 bar; The initial temperature of the upper pressure head is not less than 150°, and the temperature is subsequently increased at least twice, and the final temperature is not less than 350°; The welding temperature of the lower pressure head shall not be lower than 200°.

8. The manufacturing process of a BMS component according to claim 4, characterized in that: In the S1, the transcoding is respectively bound to the low-voltage board, the first FPC board, the second FPC board, the high-voltage board, and the electrical components; Then visual photography is used to trace the assembled high-voltage board, low-voltage board, first FPC board, and second FPC board.

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