Thermoelectric power generation module and thermoelectric power generation unit

Abstract

A thermoelectric power generation module (10) is provided with a first substrate (11) formed in a sheet shape, a second substrate (12) formed in a sheet shape, a plurality of thermoelectric conversion elements (21) disposed between the first substrate (11) and the second substrate (12), a plurality of first electrodes (22) disposed between the first substrate (11) and the thermoelectric conversion elements (21), and a plurality of second electrodes (23) disposed between the second substrate (12) and the thermoelectric conversion elements (21). And a bonding portion (A) that bonds the first substrate (11) and the second substrate (12), the thermoelectric conversion element (21), the plurality of first electrodes (22), and the plurality of second electrodes (23) being sealed by the bonding portion (A), and the bonding portion (A) bonding the first substrate (11) and the second substrate (12) with solder via the metal film (13) and the metal film (14).

Description

Technical Field

[0001] The present disclosure relates to a thermoelectric power generation module and a thermoelectric power generation unit. Background Art

[0002] Since thermoelectric power generation modules are used in factories and equipment that perform incineration or heat treatment, they are exposed to wind and rain, high humidity and high temperature, and dust. Therefore, for thermoelectric power generation modules that generate potential differences, water and dust become circuits and are prone to short circuits. Therefore, the outer periphery of the thermoelectric power generation module is sealed so that water and dust do not invade the interior. In addition, the thermoelectric power generation module repeatedly heats up and cools down from room temperature to about 300°C. Therefore, the sealing structure of the thermoelectric power generation module requires heat resistance and temperature cycle resistance.

[0003] A technology is known that includes a plurality of thermoelectric elements, an outer sealing frame surrounding the thermoelectric elements, a film sheet continuously covering the thermoelectric elements and the outer sealing frame, and an inner sealing frame surrounding a fastening unit (for example, see Patent Document 1).

[0004] Prior art literature

[0005] Patent Literature

[0006] Patent Document 1: (Japan) Patent No. 6405130 Summary of the invention

[0007] Problems to be solved by the invention

[0008] The technology described in Patent Document 1 solders different types of film sheets and sealing frames, so deformation or warping may occur due to differences in the thermal expansion coefficients of the materials. As a result, there is a possibility of reduced sealing and disconnection of the thermoelectric power generation module. In addition, since the outer sealing frame is close to the heat receiving plate and the cooling plate, there is a possibility of heat leakage due to conduction to the outer sealing frame. As a result, there is a possibility of reduced power generation output of the thermoelectric power generation module.

[0009] An object of the present disclosure is to suppress a decrease in sealing performance, reduce the possibility of wire breakage, and suppress a decrease in power generation output.

[0010] Technical solutions to solve problems

[0011] According to the present disclosure, a thermoelectric power generation module is provided, which comprises: a first substrate formed in a sheet shape; a second substrate formed in a sheet shape; a plurality of thermoelectric conversion elements, which are arranged between the first substrate and the second substrate; a plurality of first electrodes, which are arranged between the first substrate and the thermoelectric conversion elements; a plurality of second electrodes, which are arranged between the second substrate and the thermoelectric conversion elements; a joining portion, which joins the first substrate and the second substrate, the thermoelectric conversion elements, the plurality of first electrodes, and the plurality of second electrodes are sealed by the joining portion, and the joining portion joins the first substrate and the second substrate using solder via a metal film.

[0012] According to the present disclosure, a thermoelectric power generation module is provided, which comprises: a first substrate formed in a sheet shape; a second substrate formed in a sheet shape; a plurality of thermoelectric conversion elements, which are arranged between the first substrate and the second substrate; a plurality of first electrodes, which are arranged between the first substrate and the thermoelectric conversion elements; a plurality of second electrodes, which are arranged between the second substrate and the thermoelectric conversion elements; a joint portion, which joins the first substrate and the second substrate, the thermoelectric conversion elements, the plurality of first electrodes, and the plurality of second electrodes are sealed by the joint portion, and at least one of the first substrate and the second substrate is joined in a bent state through the joint portion, thereby increasing the joining area and thickness of the joint portion compared to the state in which the first substrate and the second substrate are joined without being bent.

[0013] According to the present disclosure, a thermoelectric power generation unit is provided, which comprises: the above-mentioned thermoelectric power generation module; a heat receiving plate, which is arranged on the first substrate side of the thermoelectric power generation module; a first heat transfer component, which is interposed between the thermoelectric power generation module and the heat receiving plate; a cooling plate, which is arranged on the second substrate side of the thermoelectric power generation module; and a second heat transfer component, which is interposed between the thermoelectric power generation module and the cooling plate.

[0014] Effects of the Invention

[0015] According to the present disclosure, it is possible to suppress a decrease in sealing performance, reduce the possibility of wire breakage, and suppress a decrease in power generation output. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a cross-sectional view schematically showing the thermoelectric power generation unit according to the first embodiment.

[0017] Figure 2 It is a cross-sectional view schematically showing the thermoelectric power module according to the first embodiment.

[0018] Figure 3 yes Figure 2 A partial enlarged view of the joint of the thermoelectric power generation module.

[0019] Figure 4 This is a plan view schematically showing a first substrate of the thermoelectric power module according to the first embodiment, and is a view viewed from above.

[0020] Figure 5 This is a partially enlarged view of a joining portion of a thermoelectric power module according to Modification 1 of the first embodiment.

[0021] Figure 6 This is a partially enlarged view of a joining portion of a thermoelectric power module according to Modification 2 of the first embodiment.

[0022] Figure 7 This is a partially enlarged view of a joining portion of a thermoelectric power module according to Modification 3 of the first embodiment.

[0023] Figure 8 This is a partially enlarged view of a joining portion of a thermoelectric power module according to Modification 4 of the first embodiment.

[0024] Fig. 9 This is a partially enlarged view of a joining portion of a thermoelectric power module according to Modification 5 of the first embodiment.

[0025] Fig.10 It is a cross-sectional view schematically showing a thermoelectric power module according to Modification 6 of the first embodiment.

[0026] Fig.11 It is a cross-sectional view schematically showing a thermoelectric power generation unit according to Modification 7 of the first embodiment.

[0027] Fig.12 It is a cross-sectional view schematically showing a thermoelectric power generation unit according to Modification 8 of the first embodiment.

[0028] Fig.13 It is a cross-sectional view schematically showing a thermoelectric power generation unit according to Modification 9 of the first embodiment.

[0029] Fig.14 It is a cross-sectional view schematically showing a thermoelectric power generation unit according to the second embodiment.

[0030] Fig.15 It is a cross-sectional view schematically showing a thermoelectric power module according to the second embodiment.

[0031] Fig.16 yes Fig.15 A partial enlarged view of the joint of the thermoelectric power generation module.

[0032] Fig.17 This is a partially enlarged view of a joining portion of a thermoelectric power module according to Modification 1 of the second embodiment.

[0033] Fig.18This is a partially enlarged view of a joining portion of a thermoelectric power module according to Modification 2 of the second embodiment.

[0034] Fig.19 This is a partially enlarged view of a joining portion of a thermoelectric power module according to Modification 3 of the second embodiment.

[0035] Fig. 20 It is a cross-sectional view schematically showing a thermoelectric power module according to Modification 4 of the second embodiment.

[0036] Fig.21 It is a cross-sectional view schematically showing a thermoelectric power generation unit according to Modification 5 of the second embodiment.

[0037] Fig. 22 It is a cross-sectional view schematically showing a thermoelectric power generation unit according to Modification 6 of the second embodiment.

[0038] Fig.23 It is a cross-sectional view schematically showing a thermoelectric power generation unit according to Modification 7 of the second embodiment. DETAILED DESCRIPTION

[0039] Hereinafter, the embodiments of the present disclosure will be described with reference to the drawings, but the present disclosure is not limited to the embodiments. The constituent elements of the multiple embodiments described below can be appropriately combined. In addition, some constituent elements may not be used.

[0040] In the embodiment, the positional relationship of each part is described using the terms "left", "right", "front", "rear", "upper", and "lower". These terms represent relative positions or directions based on the center of the thermoelectric power generation unit 1. The left-right direction, the front-back direction, and the up-down direction are orthogonal.

[0041] (First Embodiment)

[0042] [Thermoelectric power generation unit]

[0043] Figure 1 1 is a cross-sectional view schematically showing a thermoelectric power generation unit according to Embodiment 1. The thermoelectric power generation unit 1 includes a thermoelectric power generation module 10, a heat receiving plate 2 as a high temperature plate, a cooling plate 3 as a low temperature plate, a first heat transfer member 4, and a second heat transfer member 5.

[0044] The heat receiving plate 2 is disposed on the first substrate 11 side of the thermoelectric module 10. The heat receiving plate 2 receives heat from a heat source and transfers heat to the thermoelectric module 10 with little in-plane temperature distribution. The heat receiving plate 2 is made of a metal material with high thermal conductivity, such as copper or aluminum.

[0045] The heat receiving plate 2 is in contact with the first heat transfer member 4 disposed on the first substrate 11 and located on the lower surface side of the first electrode 22 through the surface. The heat receiving plate 2 is a rectangular plate-shaped member. The heat receiving plate 2 is formed of a material with high thermal conductivity. The heat receiving plate 2 is set in a device that becomes a heat source. The heat receiving plate 2 receives heat from the device that becomes a heat source. The heat of the heat receiving plate 2 is conducted to the thermoelectric power generation module 10 via a heat transfer member not shown.

[0046] The heat receiving plate 2 may also be subjected to surface treatment on the surface opposite to the surface facing the first substrate 11 of the thermoelectric power generation module 10, in other words, on the heat receiving surface on the heat source side. The heat receiving surface may also be subjected to surface treatment in a manner that the emissivity (in other words, the radiation rate) is different between the peripheral portion and the central portion. In an embodiment, the heat receiving surface is subjected to surface treatment in a manner that the radiation rate of the central portion is higher than that of the peripheral portion. Figure 1 In the figure, a surface treated portion to which surface treatment has been applied is schematically indicated by reference numeral 7.

[0047] The cooling plate 3 is disposed on the second substrate 12 side of the thermoelectric power generation module 10. The cooling plate 3 cools one side of the thermoelectric power generation module 10 to maintain the temperature difference and generate electricity efficiently. The cooling plate 3 is made of a metal material with high thermal conductivity, such as copper or aluminum.

[0048] The cooling plate 3 is in contact with the second heat transfer member 5 disposed on the second substrate 12 and located on the upper surface side of the second electrode 23 through the surface. The cooling plate 3 is disposed facing the heat receiving plate 2 in the up-down direction and is separated from the heat receiving plate 2. The cooling plate 3 is a rectangular plate-shaped member. The cooling plate 3 is formed of a material with high thermal conductivity. The cooling plate 3 receives heat from the thermoelectric power generation module 10. The heat of the cooling plate 3 is dissipated to the surroundings of the thermoelectric power generation unit 1 or is water-cooled.

[0049] The first heat transfer member 4 is disposed between the thermoelectric power generation module 10 and the heat receiving plate 2. The first heat transfer member 4 fills the air layer between the thermoelectric power generation module 10 and the heat receiving plate 2, reduces the contact thermal resistance, and improves the heat transfer performance. The first heat transfer member 4 is formed into a sheet shape by, for example, carbon or silicon.

[0050] The second heat transfer member 5 is disposed between the thermoelectric power generation module 10 and the cooling plate 3. The second heat transfer member 5 fills the air layer between the thermoelectric power generation module 10 and the cooling plate 3, reduces the contact thermal resistance, and improves the heat transfer performance. The second heat transfer member 5 is formed into a sheet shape by, for example, carbon or silicon.

[0051] The first heat transfer member 4 and the second heat transfer member 5 are not limited to sheet-shaped members, and the first heat transfer member 4 and the second heat transfer member 5 may be, for example, heat transfer grease.

[0052] The thermoelectric power generation unit 1 is fastened by the fastening member 6 in a state where the thermoelectric power generation module 10 is sandwiched in the up-and-down direction by the heat receiving plate 2 and the cooling plate 3 .

[0053] [Thermoelectric power generation module]

[0054] Figure 2 It is a cross-sectional view schematically showing the thermoelectric power module according to the first embodiment. Figure 3 yes Figure 2 A partial enlarged view of the joint of the thermoelectric power generation module. Figure 4 1 is a top view schematically showing a first substrate of a thermoelectric power generation module of the first embodiment, and is a view observed from above. The thermoelectric power generation module 10 is disposed between a heat receiving plate 2 and a cooling plate 3. The thermoelectric power generation module 10 generates electricity by the Seebeck effect because a temperature difference is given to both sides (upper and lower in the figure) by the heat receiving plate 2 and the cooling plate 3.

[0055] like Figure 2 , Figure 3 As shown, the thermoelectric power generation module 10 includes a first substrate 11, a second substrate 12, and a thermoelectric conversion element 21 disposed between the first substrate 11 and the second substrate 12. The configurations of the thermoelectric conversion element 21, the first electrode 22, and the second electrode 23 in the respective figures used in the following description are schematically shown.

[0056] The first substrate 11 and the second substrate 12 are respectively formed of an electrical insulating material. Figure 4 As shown, the first substrate 11 is composed of, for example, a sheet of polyimide. Although the second substrate 12 is not shown in the figure, it is similar to the first substrate 11, for example, composed of a sheet of polyimide. The first substrate 11 and the second substrate 12 are each flexible. In the embodiment, the first substrate 11 and the second substrate 12 are formed in a rectangular shape. The first substrate 11 and the second substrate 12 face each other with the thermoelectric conversion element 21 interposed therebetween. In the embodiment, the second substrate 12 is arranged above the first substrate 11.

[0057] In the embodiment, the first base material 11 and the first heat transfer member 4 , and the second base material 12 and the second heat transfer member 5 are not bonded to each other.

[0058] In the embodiment, the first base material 11 is bent so that the peripheral edge portion faces the second base material 12 , in other words, approaches the second base material 12 .

[0059] The metal film 13 and the metal film 14 are regions where the first substrate 11 and the second substrate 12 are bonded. The metal film 13 and the metal film 14 are configured in a frame shape by a metal thin film. When viewed in the up-down direction, the metal film 13 and the metal film 14 are configured to surround a plurality of pn element pairs arranged in a plane direction. The metal film 13 is configured at the peripheral portion of the upper surface of the first substrate 11. The metal film 14 is configured at the peripheral portion of the lower surface of the second substrate 12.

[0060] With the first and second base materials 11 and 12 thus constructed overlapped, the peripheral portion of the upper surface of the first base material 11 and the peripheral portion of the lower surface of the second base material 12 are bonded and sealed via the metal films 13 and 14 by solder or a resin adhesive.

[0061] The portion where the first substrate 11 and the second substrate 12 are bonded is referred to as a bonding portion A. In the embodiment, the portion where the metal film 13 and the metal film 14 are bonded is referred to as a bonding portion A. The bonding portion A is disposed at the periphery of the first substrate 11 and the second substrate 12. In the rectangular first substrate 11 and the second substrate 12, four sides are the bonding portion A.

[0062] The metal films 13 and 14 of the first substrate 11 and the second substrate 12 are bonded to each other by solder or resin adhesive at the bonding portion A. The material of the solder is, for example, Pb-Sn, Sn-Ag-Cu, Cu-Sn, Sn-Sb, Bi-Sn, Au-Sn, Zn-Sn, etc. The resin adhesive is formed of a resin material having high heat resistance to withstand the use environment of the thermoelectric power generation unit 1.

[0063] In the embodiment, the joint portion A is separated from the heat receiving plate 2 and is located on the cooling plate 3 side.

[0064] The dimensions of the peripheral portion of the thermoelectric power generation module 10, specifically, the dimensions of the joint A and its surrounding portion, may also be as follows. Figure 3 As shown, the length from the outer edge of the plurality of first electrodes 22 and the second electrode 23 disposed between the first substrate 11 and the second substrate 12 to the junction A is set to a1. The length of the junction A is set to a2. The length between the upper surface side of the first substrate 11 and the lower surface side of the second substrate 12 is set to b. At this time, a1, a2, and b may be set so that a1+a2>b.

[0065] One or more thermoelectric conversion elements 21 are disposed between the upper surface side of the first substrate 11 and the lower surface side of the second substrate 12. The plurality of thermoelectric conversion elements 21 are connected by a plurality of first electrodes 22 and second electrodes 23.

[0066] The thermoelectric conversion element 21 is formed of a thermoelectric material. Examples of the thermoelectric material forming the thermoelectric conversion element 21 include manganese silicide compounds (Mn-Si), magnesium silicide compounds (Mg-Si-Sn), skutterudite compounds (Co-Sb), half-Heusler compounds (Zr-Ni-Sn), and bismuth tellurium compounds (Bi-Te). The thermoelectric conversion element 21 may be composed of one compound selected from the group consisting of manganese silicide compounds, magnesium silicide compounds, skutterudite compounds, half-Heusler compounds, and bismuth tellurium compounds, or may be composed of a combination of at least two compounds.

[0067] Thermoelectric conversion element 21 includes p-type element 21P and n-type element 21N. A plurality of p-type elements 21P and n-type elements 21N are arranged in a predetermined plane. P-type elements 21P and n-type elements 21N are arranged alternately in the front-back direction. P-type elements 21P and n-type elements 21N are arranged alternately in the left-right direction.

[0068] The first electrode 22 and the second electrode 23 are formed of a conductive metal. The first electrode 22 is disposed between the first substrate 11 and the thermoelectric conversion element 21. The first electrode 22 is provided on the upper surface of the first substrate 11. A plurality of first electrodes 22 are provided in a predetermined plane parallel to the upper surface of the first substrate 11. The second electrode 23 is disposed between the second substrate 12 and the thermoelectric conversion element 21. The second electrode 23 is provided on the lower surface of the second substrate 12. A plurality of second electrodes 23 are provided in a predetermined plane parallel to the lower surface of the second substrate 12.

[0069] The first electrode 22 and the second electrode 23 are connected to a pair of adjacent p-type elements 21P and n-type elements 21N, respectively. The first electrode 22 and the second electrode 23 connect the plurality of thermoelectric conversion elements 21 in series. A series circuit in which the plurality of thermoelectric conversion elements 21 are connected in series is formed by the first electrode 22 and the second electrode 23. The p-type element 21P and the n-type element 21N are electrically connected via the first electrode 22 and the second electrode 23 to form a pn element pair. A plurality of pn element pairs are connected in series via the first electrode 22 and the second electrode 23 to form a series circuit including the plurality of thermoelectric conversion elements 21.

[0070] The thermoelectric power module 10 absorbs or releases heat by the Peltier effect by supplying current to the thermoelectric conversion element 21. The thermoelectric power module 10 generates electricity by the Seebeck effect by providing a temperature difference between the first substrate 11 and the second substrate 12.

[0071] The lower surface of the first electrode 22 disposed on the first substrate 11 is a heating surface of the thermoelectric power module 10 . The upper surface of the second electrode 23 disposed on the second substrate 12 is a cooling surface of the thermoelectric power module 10 .

[0072] From the thermoelectric power generation module 10 configured as described above, electric power of the circuit is taken out to the outside via end electrodes and lead wires (not shown).

[0073] The interior of the sealed thermoelectric power generation module 10 is preferably degassed and set to negative pressure, or filled with an inert gas such as nitrogen, argon, or dry air. The interior of the sealed thermoelectric power generation module 10 can also be filled with an inert liquid or varnish. The inert liquid is, for example, perfluoropolyether (PFPE), perfluorocarbon (PFC), hydrofluoroether (HFE), etc.

[0074] [Sealing method and function]

[0075] The first base material 11 and the second base material 12 are overlapped and then bonded together at a joint portion A, which is a peripheral portion, by solder or a resin adhesive. Thus, the first base material 11 and the second base material 12 are sealed at the joint portion A, which is a peripheral portion.

[0076] [Effect]

[0077] In the embodiment, the joint A joins the first substrate 11 and the second substrate 12 by solder or resin adhesive via the metal film 13 and the metal film 14. In the embodiment, since a sealing frame made of different materials is not used, thermal deformation, warping, etc. caused by the difference in thermal expansion coefficients do not occur, and durability can be maintained. According to the embodiment, the possibility of reduced sealing and the possibility of disconnection of the thermoelectric power generation module 10 can be reduced.

[0078] In the embodiment, the thickness of the sealing portion of the outer peripheral portion of the thermoelectric power generation module 10, that is, the joint A, in the vertical direction is thinner than the central portion of the thermoelectric power generation module 10 where the thermoelectric conversion element 21 is arranged, and a gap is generated between the joint A and the heat receiving plate 2. According to the embodiment, the joint A can be arranged separately from the heat receiving plate 2. Therefore, the embodiment can suppress heat leakage from the heat receiving plate 2 to the cooling plate 3 at the joint A. According to the embodiment, the possibility of a decrease in the power generation output of the thermoelectric power generation module 10 can be reduced.

[0079] The embodiment can join the first substrate 11 and the second substrate 12 by solder or resin adhesive without using sealing components such as sealing materials and frame components made of adhesives or resin materials. The embodiment does not cause deterioration of the sealing components due to changes over time. According to the embodiment, the sealing performance can be maintained for a long time in an environment exposed to wind and rain, high humidity and high temperature, and dust. In this way, the embodiment can improve heat resistance and temperature cycle resistance because it does not use adhesives and resin materials with low heat resistance temperatures.

[0080] The embodiment can restrict water and dust that may cause a short circuit from entering the interior of the thermoelectric power generation module 10 for a long time in an environment exposed to wind and rain, a high humidity and high temperature environment, and dust. The embodiment can perform thermoelectric power generation in a state of maintaining insulation for a long time in a high temperature environment. Thus, according to the embodiment, the occurrence of failures caused by the intrusion of moisture can be suppressed, and power generation can be performed stably.

[0081] As described above, according to the embodiment, it is possible to suppress a decrease in sealing performance, reduce the possibility of wire breakage, and suppress a decrease in power generation output.

[0082] In the embodiment, for example, when the thermoelectric power module 10 is manufactured by integral reflow molding, flux is likely to remain. According to the embodiment, steam is easily discharged by the remaining flux, so expansion of the electrode surface can be suppressed.

[0083] In the embodiment, the length from the outer edge of the first electrode 22 and the second electrode 23 to the bonding portion A is set to a1, the length of the bonding portion A is set to a2, and the length between the upper surface side of the first substrate 11 and the lower surface side of the second substrate 12 is set to b, and a1, a2, and b are set so as to satisfy a1+a2>b. According to the embodiment, it is possible to prevent the bonding portion A from falling due to its own weight and contacting the first substrate 11.

[0084] Hereinafter, Modifications 1 to 9 of the first embodiment will be described.

[0085] (Variant 1)

[0086] Figure 5 This is a partially enlarged view of a joint portion of a thermoelectric power module according to Modification 1 of the first embodiment. The structure of the joint portion A of Modification 1 is different from that of the first embodiment.

[0087] In Modification 1, the portion where the metal film 13 and the metal film 14 are bonded is referred to as a bonded portion A. The bonded portion A is separated from the heat receiving plate 2 and the cooling plate 3. In other words, the bonded portion A is located in the middle of the heat receiving plate 2 and the cooling plate 3 in the vertical direction (thickness direction).

[0088] The first substrate 11 is bent so that the peripheral portion faces the second substrate 12, in other words, approaches the second substrate 12. The second substrate 12 is bent so that the peripheral portion faces the first substrate 11, in other words, approaches the first substrate 11. The peripheral portion of the first substrate 11 and the peripheral portion of the second substrate 12 are formed so as to approach each other.

[0089] The length from the outer edge of the plurality of first electrodes 22 and the second electrode 23 disposed between the first substrate 11 and the second substrate 12 to the junction A is set to a1. The length of the junction A is set to a2. The length between the upper surface side of the first substrate 11 and the lower surface side of the second substrate 12 is set to b. At this time, a1, a2, and b may be set so that a1+a2>b.

[0090] According to the modification, the joint portion A can be arranged to be separated from the heat receiving plate 2 and the cooling plate 3. In the modification, heat leakage from the heat receiving plate 2 to the cooling plate 3 can be suppressed at the joint portion A.

[0091] In the modified example, the length from the outer edge of the first electrode 22 and the second electrode 23 to the bonding portion A is set to a1, the length of the bonding portion A is set to a2, and the length between the upper surface side of the first substrate 11 and the lower surface side of the second substrate 12 is set to b, and a1, a2, and b are set so as to satisfy a1+a2>b. According to the modified example, it is possible to prevent the bonding portion A from falling due to its own weight and contacting the first substrate 11.

[0092] (Variant 2)

[0093] Figure 6 This is a partially enlarged view of a joint portion of a thermoelectric power module according to Modification 2 of the first embodiment. The structure of the joint portion A of Modification 2 is different from that of the first embodiment.

[0094] In Modification 2, the portion where the metal film 13 and the metal film 14 are bonded is referred to as a bonded portion A. The bonded portion A is separated from the cooling plate 3 and is located on the heat receiving plate 2 side.

[0095] The second base material 12 is bent so that the peripheral edge portion faces the first base material 11 , in other words, approaches the first base material 11 .

[0096] According to the modification, the joint portion A can be arranged to be separated from the cooling plate 3. In the modification, heat leakage from the heat receiving plate 2 to the cooling plate 3 can be suppressed at the joint portion A.

[0097] (Variant 3)

[0098] Figure 7 This is a partial enlarged view of a joint portion of a thermoelectric power module according to Modification 3 of the first embodiment. The structure of the joint portion A of Modification 3 is different from that of the first embodiment.

[0099] In Modification 3, the portion where the metal film 15 and the metal film 111 are bonded is referred to as a bonding portion A. The bonding portion A is separated from the heat receiving plate 2 and is located on the cooling plate 3 side.

[0100] The first substrate 11 has a metal film 111 disposed on the entire lower surface. The first substrate 11 is bent so that the peripheral portion faces the second substrate 12, in other words, approaches the second substrate 12. The front end 11a of the first substrate 11 and the front end 111a of the metal film 111 are sandwiched by the front end 12a, the bent portion 12b, and the front end 12c of the second substrate 12.

[0101] The second substrate 12 includes a metal film 15. The metal film 15 is configured similarly to the metal film 14 of the first embodiment. The peripheral edge of the second substrate 12 is folded back at the bent portion 12b. The front end portion 12a and the front end portion 12c of the second substrate 12 are separated in the vertical direction. The front end portion 11a of the first substrate 11 and the front end portion 111a of the metal film 111 are sandwiched between the front end portion 12a and the front end portion 12c of the second substrate 12. In other words, the second substrate 12 sandwiches the front end portion 11a of the first substrate 11 and the front end portion 111a of the metal film 111 by the front end portion 12a, the bent portion 12b, and the front end portion 12c.

[0102] At the joint portion A, the front end portion 12c of the second base material 12, the metal film 15, the front end portion 111a of the metal film 111, the front end portion 11a of the first base material 11, and the front end portion 12a of the second base material 12 are joined in an overlapping state from the bottom in the vertical direction. The front end portion 12a of the second base material 12 and the front end portion 11a of the first base material 11 are joined by solder or a resin adhesive. The front end portion 111a of the metal film 111 and the metal film 15 are joined by solder or a resin adhesive.

[0103] According to the modification, the bonding area and thickness of the bonding portion A can be increased compared to the state where the first substrate 11 and the second substrate 12 are bonded without being bent. Thus, the modification can suppress warping even in the case of a single-sided heater because of the thickness of the bonding portion A.

[0104] According to the modification, the joint portion A can be arranged to be separated from the cooling plate 3. In the modification, heat leakage from the heat receiving plate 2 to the cooling plate 3 can be suppressed at the joint portion A.

[0105] (Variant 4)

[0106] Figure 8 This is a partially enlarged view of a joint portion of a thermoelectric power module according to Modification 4 of the first embodiment. The structure of the joint portion A of Modification 4 is different from that of the first embodiment.

[0107] In Modification 4, the portion where the metal film 16 and the metal film 121 are bonded is referred to as a bonding portion A, which is separated from the cooling plate 3 and is located on the heat receiving plate 2 side.

[0108] The first substrate 11 includes a metal film 16. The metal film 16 is configured similarly to the metal film 13 of the first embodiment. The peripheral edge of the first substrate 11 is folded back at the bent portion 11b. The front end portion 11a and the front end portion 11c of the first substrate 11 are separated in the up-down direction. The front end portion 12a of the second substrate 12 and the front end portion 121a of the metal film 121 are sandwiched between the front end portion 11a and the front end portion 11c of the first substrate 11. In other words, the first substrate 11 sandwiches the front end portion 12a of the second substrate 12 and the front end portion 121a of the metal film 121 by the front end portion 11a, the bent portion 11b, and the front end portion 11c.

[0109] The second substrate 12 has a metal film 121 disposed on the entire upper surface. The second substrate 12 is bent so that the peripheral edge portion faces the first substrate 11, in other words, approaches the first substrate 11. The front end 12a of the second substrate 12 and the front end 121a of the metal film 121 are sandwiched by the front end 11a, the bent portion 11b, and the front end 11c of the first substrate 11.

[0110] At the joint portion A, the front end portion 11a of the first substrate 11, the front end portion 12a of the second substrate 12, the front end portion 121a of the metal film 121, the metal film 16, and the front end portion 11c of the first substrate 11 are joined in an overlapping state from the bottom in the vertical direction. The front end portion 11a of the first substrate 11 and the front end portion 12a of the second substrate 12 are joined by solder or resin adhesive. The front end portion 121a of the metal film 121 and the metal film 16 are joined by solder or resin adhesive.

[0111] According to the modification, the bonding area and thickness of the bonding portion A can be increased compared to the state where the first substrate 11 and the second substrate 12 are bonded without being bent. Thus, the modification can suppress warping even in the case of a single-sided heater because of the thickness of the bonding portion A.

[0112] According to the modification, the joint portion A can be arranged to be separated from the cooling plate 3. In the modification, heat leakage from the heat receiving plate 2 to the cooling plate 3 can be suppressed at the joint portion A.

[0113] (Variant 5)

[0114] Fig. 9 This is a partially enlarged view of a joint portion of a thermoelectric power module according to Modification 5 of the first embodiment. The structure of the joint portion A of Modification 5 is different from that of the first embodiment.

[0115] The first substrate 11 has a metal film 111 disposed on the entire lower surface. The peripheral edge of the first substrate 11 is folded back at the bent portion 11b. The front end portion 11a and the front end portion 11c of the first substrate 11 are separated in the vertical direction. The front end portion 111a of the metal film 111 disposed at the front end portion 11c of the first substrate 11 is bonded to the front end portion 121a of the metal film 121 disposed at the front end portion 12c of the second substrate 12.

[0116] The second substrate 12 has a metal film 121 disposed on the entire upper surface. The peripheral edge of the second substrate 12 is folded back at the bent portion 12b. The front end portion 12a and the front end portion 12c of the second substrate 12 are separated in the vertical direction. The front end portion 121a of the metal film 121 disposed at the front end portion 12c of the second substrate 12 is bonded to the front end portion 111a of the metal film 111 disposed at the front end portion 11c of the first substrate 11.

[0117] In the fifth modification, in the joint portion A where the metal film 111 and the metal film 121 are joined, the metal film 111 arranged at the front end 11a of the first substrate 11, the front end 11a of the first substrate 11, the front end 11c of the first substrate 11, the front end 11a of the metal film 111 arranged at the front end 11c of the first substrate 11, the front end 121a of the metal film 121 arranged at the front end 12c of the second substrate 12, the front end 12c of the second substrate 12, the front end 12a of the second substrate 12, and the metal film 121 arranged at the front end 12a of the second substrate 12 are arranged from the bottom in the vertical direction. The front end 111a of the metal film 111 arranged at the front end 11c of the first substrate 11 and the front end 121a of the metal film 121 arranged at the front end 12c of the second substrate 12 are joined by solder or a resin adhesive.

[0118] According to the modification, the bonding area and thickness of the bonding portion A can be increased compared to a state in which the first base material 11 and the second base material 12 are bonded together without being bent.

[0119] (Variant 6)

[0120] Fig.10 1 is a cross-sectional view schematically showing a thermoelectric power module of Modification 6 of Embodiment 1. Modification 6 is different from the first embodiment in the structure of the first base material 11 and the second base material 12.

[0121] The first base material 11 and the second base material 12 are formed by bending a sheet-like base material 10S. In the modified example, the lower side of the bent portion 10Sa is the first base material 11, and the upper side is the second base material 12.

[0122] In Modification 6, the portion where the metal film 13 and the metal film 14 are bonded is called a bonding portion A. The bonding portion A is arranged at the peripheral portion of the substrate 10S except for the bent portion 10Sa. In the rectangular substrate 10S, three sides are the bonding portion A and one side is the bent portion 10Sa.

[0123] The embodiment can reduce the area of ​​the joint portion A. The embodiment can improve the sealing performance.

[0124] (Variant 7)

[0125] Fig.11 1 is a cross-sectional view schematically showing a thermoelectric power generation unit of a modification example 7 of the first embodiment. Modification example 7 is different from the first embodiment in that it includes a support member 3S. In modification example 7, the thermoelectric power generation module 10 is configured in the same manner as in the first embodiment. In modification example 7, the joint A is separated from the heat receiving plate 2 and is located on the cooling plate 3 side.

[0126] The support member 3S is disposed on the lower surface of the cooling plate 3. The support member 3S supports the joint A on the cooling plate 3. The support member 3S may support the joint A by, for example, clamping the joint A in a slit provided in the support member 3S, or may support the joint A by adhering the joint A to the support member 3S with an adhesive. There is no limitation on the method by which the support member 3S supports the joint A.

[0127] According to the modification, it is possible to suppress the joining portion A from falling due to its own weight. The modification can support the position of the joining portion A in the up-and-down direction.

[0128] (Variant 8)

[0129] Fig.12 1 is a cross-sectional view schematically showing a thermoelectric power generation unit of Modification 8 of the first embodiment. Modification 8 is different from Modification 2 in that it includes a support member 2S. In Modification 8, the thermoelectric power generation module 10 is configured in the same manner as in Modification 2. In Modification 8, the joint A is separated from the cooling plate 3 and is located on the heat receiving plate 2 side.

[0130] The support member 2S is disposed on the upper surface of the heat receiving plate 2. The support member 2S supports the joint A on the heat receiving plate 2. The support member 2S may support the joint A by, for example, clamping the joint A in a slit provided in the support member 2S, or by adhering the joint A to the support member 2S with an adhesive. There is no limitation on the method by which the support member 2S supports the joint A.

[0131] According to the modification, the joint portion A can be arranged to be separated from the cooling plate 3. In the modification, heat leakage from the heat receiving plate 2 to the cooling plate 3 can be suppressed at the joint portion A.

[0132] (Variant 9)

[0133] Fig.13 1 is a cross-sectional view schematically showing a thermoelectric power generation unit of Modification 9 of the first embodiment. Modification 9 is different from Modification 1 in that it includes a support member 2S and a support member 3S. In Modification 9, the thermoelectric power generation module 10 is configured in the same manner as Modification 1. The joint A is located between the heat receiving plate 2 and the cooling plate 3 and is separated from the heat receiving plate 2 and the cooling plate 3.

[0134] The support member 2S is arranged on the upper surface of the heat receiving plate 2. The support member 3S is arranged on the lower surface of the cooling plate 3. The support member 2S and the support member 3S together clamp and support the joint portion A in the up-down direction. In other words, the support member 2S and the support member 3S support the joint portion A to the heat receiving plate 2 and the cooling plate 3. There is no limitation on the method by which the support member 2S and the support member 3S support the joint portion A.

[0135] According to the modification, it is possible to suppress the joining portion A from falling due to its own weight. The modification can support the position of the joining portion A in the up-and-down direction.

[0136] (Other Modifications of the First Embodiment)

[0137] The above-mentioned modification examples 7, 8, and 9 of the first embodiment are described as the case where the joint portion A is supported by at least one of the supporting member 2S and the supporting member 3S, but the method of supporting the joint portion A is not limited thereto. The joint portion A may also bond at least one of the first substrate 11 and the second substrate 12 to at least one of the heat receiving plate 2 and the cooling plate 3 by an adhesive.

[0138] In the above-mentioned modification examples 3, 4, and 5 of the first embodiment, the structure of folding back at least one of the first substrate 11 and the second substrate 12 to form the joint A is described, but the shape of the folded back first substrate 11 and second substrate 12 is not limited thereto. For example, the first substrate 11 may be folded back in a direction away from the second substrate 12. The second substrate 12 may be folded back in a direction away from the first substrate 11.

[0139] The above-mentioned modification of the first embodiment may be combined with a plurality of modifications. Fig.10 In the modification example 6 shown, the joint A may also be Figure 3 The first embodiment shown, Figure 5 The modification example 1 shown, Figure 7 Modification 3 shown, or Fig. 9 The shape of the modified example 5 shown. For example, in Fig.12 In the modification 8 shown, the thermoelectric power generation module 10 may also be Figure 7 The thermoelectric power generation module 10 of the third modification shown, or Fig.10 A thermoelectric power generation module 10 according to a sixth modification is shown.

[0140] (Second Embodiment)

[0141] [Thermoelectric power generation unit]

[0142] Fig.14 2 is a cross-sectional view schematically showing a thermoelectric power generation unit according to the second embodiment. In the thermoelectric power generation unit 1, the description of the same structure as the first embodiment is omitted. The thermoelectric power generation unit 1 includes a thermoelectric power generation module 10, a heat receiving plate 2 as a high temperature plate, a cooling plate 3 as a low temperature plate, a first heat transfer component 4, and a second heat transfer component 5.

[0143] [Thermoelectric power generation module]

[0144] Fig.15 It is a cross-sectional view schematically showing a thermoelectric power module according to the second embodiment. Fig.16 yes Fig.15 A partial enlarged view of the joint portion of the thermoelectric power generation module of the second embodiment. A top view schematically showing the first substrate of the thermoelectric power generation module of the first embodiment Figure 4 same.

[0145] The peripheral edge of the first substrate 11 is folded back at the bent portion 11b. The front end portion 11a and the front end portion 11c of the first substrate 11 are separated in the vertical direction. The front end portion 12a of the second substrate 12 is sandwiched between the front end portion 11a and the front end portion 11c of the first substrate 11. In other words, the first substrate 11 sandwiches the front end portion 12a of the second substrate 12 by the front end portion 11a, the bent portion 11b, and the front end portion 11c.

[0146] The second base 12 is bent so that its peripheral edge faces the first base 11, in other words, approaches the first base 11. The front end 12a of the second base 12 is sandwiched by the front end 11a, the bent portion 11b, and the front end 11c of the first base 11.

[0147] The portion where the front end portion 11a, the bent portion 11b, and the front end portion 11c of the first base material 11 and the front end portion 11 of the second base material 12 are joined is referred to as a joining portion A. At the joining portion A, the front end portion 11a of the first base material 11, the front end portion 12a of the second base material 12, and the front end portion 11c of the first base material 11 are joined in an overlapping state from the bottom in the vertical direction. The front end portion 11a of the first base material 11, the front end portion 12a of the second base material 12, and the front end portion 11c of the first base material 11 are joined by a resin adhesive.

[0148] The portion where the first substrate 11 and the second substrate 12 are joined is called a joint portion A. When viewed in the up-down direction, the joint portion A surrounds the plurality of pn element pairs arranged in a plane direction and is arranged in a frame shape. The joint portion A is arranged at the periphery of the first substrate 11 and the second substrate 12. In the rectangular first substrate 11 and the second substrate 12, four sides are the joint portion A.

[0149] In the embodiment, the joint portion A is separated from the cooling plate 3 and is located on the heat receiving plate 2 side.

[0150] [Sealing method and function]

[0151] The first base material 11 and the second base material 12 are overlapped and then bonded together at a joint portion A, which is a peripheral portion, using a resin adhesive. Thus, the first base material 11 and the second base material 12 are sealed at the joint portion A, which is a peripheral portion.

[0152] [Effect]

[0153] In the embodiment, the joint portion A joins at least one of the first substrate 11 and the second substrate 12 in a bent state, thereby increasing the joining area and thickness of the joint portion A compared to the state where the first substrate 11 and the second substrate 12 are joined without being bent. In the embodiment, since a sealing frame made of different materials is not used, thermal deformation, warping, etc. caused by a difference in thermal expansion coefficients are not easily generated, and durability can be easily maintained. According to the embodiment, the possibility of reduced sealing performance and the possibility of disconnection of the thermoelectric power generation module 10 can be reduced.

[0154] In the embodiment, the thickness of the sealing portion of the outer peripheral portion of the thermoelectric power generation module 10, that is, the joint A, in the vertical direction is thinner than the central portion of the thermoelectric power generation module 10 where the thermoelectric conversion element 21 is arranged, and a gap is generated between the joint A and the cooling plate 3. According to the embodiment, the joint A can be arranged separately from the cooling plate 3. Therefore, the embodiment can suppress heat leakage from the heat receiving plate 2 to the cooling plate 3 at the joint A. According to the embodiment, the possibility of a decrease in the power generation output of the thermoelectric power generation module 10 can be reduced.

[0155] The embodiment can bond the first substrate 11 and the second substrate 12 by a resin adhesive without using a sealing member such as a sealing material and a frame member made of an adhesive or a resin material. The embodiment does not cause degradation of the sealing member due to changes over time. According to the embodiment, the sealing performance can be maintained for a long time in an environment exposed to wind and rain, a high humidity and high temperature environment, and dust. In this way, the embodiment can improve heat resistance and temperature cycle resistance because it does not use an adhesive and a resin material with a low heat resistance temperature.

[0156] The embodiment can restrict water and dust that may cause a short circuit from entering the interior of the thermoelectric power generation module 10 for a long time in an environment exposed to wind and rain, a high humidity and high temperature environment, and dust. The embodiment can perform thermoelectric power generation in a state of maintaining insulation for a long time in a high temperature environment. Thus, according to the embodiment, the occurrence of failures caused by the intrusion of moisture can be suppressed, and power generation can be performed stably.

[0157] As described above, according to the embodiment, it is possible to suppress a decrease in sealing performance, reduce the possibility of wire breakage, and suppress a decrease in power generation output.

[0158] Embodiment For example, when the thermoelectric power module 10 is manufactured by integral reflow molding, flux is likely to remain. According to the embodiment, steam is easily discharged by the remaining flux, so expansion of the electrode surface can be suppressed.

[0159] Compared with the state where the first substrate 11 and the second substrate 12 are joined without being bent, the embodiment can increase the joining area and thickness of the joining portion A. Thus, the embodiment can suppress warping even in the case of a one-sided heater because of the thickness of the joining portion A.

[0160] Hereinafter, Modifications 1 to 7 of the second embodiment will be described.

[0161] (Variant 1)

[0162] Fig.17 This is a partially enlarged view of a joint portion of a thermoelectric power module according to Modification 1 of the second embodiment. The structure of the joint portion A of Modification 1 is different from that of the second embodiment.

[0163] In Modification 1, the joint portion A is separated from the heat receiving plate 2 and is located on the cooling plate 3 side.

[0164] The first substrate 11 is bent so that the peripheral edge portion faces the second substrate 12, in other words, approaches the second substrate 12. The front end 11a of the first substrate 11 is sandwiched by the front end 12a, the bent portion 12b, and the front end 12c of the second substrate 12.

[0165] The peripheral edge of the second substrate 12 is folded back at the bent portion 12b. The front end portion 12a and the front end portion 12c of the second substrate 12 are separated in the vertical direction. The front end portion 11a of the first substrate 11 is sandwiched between the front end portion 12a and the front end portion 12c of the second substrate 12. In other words, the second substrate 21 sandwiches the front end portion 11a of the first substrate 11 by the front end portion 21a, the bent portion 21b, and the front end portion 21c.

[0166] The portion where the front end portion 12a, the bent portion 12b, and the front end portion 12c of the second base material 12 and the front end portion 11a of the first base material 11 are joined is referred to as a joining portion A. At the joining portion A, the front end portion 12c of the second base material 12, the front end portion 11a of the first base material 11, and the front end portion 12a of the second base material 12 are joined in an overlapping state from the bottom in the vertical direction. The front end portion 12a of the second base material 12, the front end portion 11a of the first base material 11, and the front end portion 12c of the second base material 12 are joined by a resin adhesive.

[0167] The bonding portion A is disposed at the peripheral edge of the first substrate 11 and the second substrate 12. In the rectangular first substrate 11 and the second substrate 12, the bonding portion A is formed on four sides.

[0168] The dimensions of the peripheral portion of the thermoelectric power generation module 10, specifically, the dimensions of the junction A and its surrounding portion may also be as follows. The length from the outer edge of the plurality of first electrodes 22 and the second electrode 23 disposed between the first substrate 11 and the second substrate 12 to the junction A is set to a1. The length of the junction A is set to a2. The length between the upper surface side of the first substrate 11 and the lower surface side of the second substrate 12 is set to b. At this time, a1, a2, and b may be set in a manner such that a1+a2>b.

[0169] According to the modification, the joint portion A can be arranged to be separated from the heat receiving plate 2. In the modification, heat leakage from the heat receiving plate 2 to the cooling plate 3 can be suppressed at the joint portion A.

[0170] In the modified example, a1 is set as the length from the outer edge of the first electrode 22 and the second electrode 23 to the bonding portion A, a2 is set as the length of the bonding portion A, b is set as the length between the upper surface side of the first substrate 11 and the lower surface side of the second substrate 12, and a1, a2, and b are set so as to satisfy a1+a2>b. According to the modified example, it is possible to prevent the bonding portion A from lowering due to its own weight and contacting the first substrate 11.

[0171] (Variant 2)

[0172] Fig.18 This is a partially enlarged view of a joint portion of a thermoelectric power module according to Modification 1 of the second embodiment. The structure of the joint portion A of Modification 2 is different from that of the second embodiment.

[0173] In Modification 2, the joint portion A is separated from the heat receiving plate 2 and the cooling plate 3. In other words, the joint portion A is located in the middle of the heat receiving plate 2 and the cooling plate 3 in the vertical direction (thickness direction).

[0174] The first substrate 11 is bent so that the peripheral edge portion faces the second substrate 12, in other words, approaches the second substrate 12. The front end 11a of the first substrate 11 is sandwiched by the front end 12a, the bent portion 12b, and the front end 12c of the second substrate 12.

[0175] The second base material 12 is bent so that the peripheral edge portion faces the first base material 11, in other words, approaches the first base material 11. The peripheral edge portion of the first base material 11 and the peripheral edge portion of the second base material 12 are formed so as to approach each other.

[0176] The peripheral edge of the second substrate 12 is folded back at the bent portion 12b. The front end portion 12a and the front end portion 12c of the second substrate 12 are separated in the vertical direction. The front end portion 11a of the first substrate 11 is sandwiched between the front end portion 12a and the front end portion 12c of the second substrate 12. In other words, the second substrate 21 sandwiches the front end portion 11a of the first substrate 11 by the front end portion 21a, the bent portion 21b, and the front end portion 21c.

[0177] The portion where the front end portion 12a, the bent portion 12b, and the front end portion 12c of the second base material 12 and the front end portion 11a of the first base material 11 are joined is referred to as a joining portion A. At the joining portion A, the front end portion 12c of the second base material 12, the front end portion 11a of the first base material 11, and the front end portion 12a of the second base material 12 are joined in an overlapping state from the bottom in the vertical direction. The front end portion 12a of the second base material 12, the front end portion 11a of the first base material 11, and the front end portion 12c of the second base material 12 are joined by a resin adhesive.

[0178] The bonding portion A is disposed at the peripheral edge of the first substrate 11 and the second substrate 12. In the rectangular first substrate 11 and the second substrate 12, the bonding portion A is formed on four sides.

[0179] The length from the outer edge of the plurality of first electrodes 22 and the second electrode 23 disposed between the first substrate 11 and the second substrate 12 to the junction A is set to a1. The length of the junction A is set to a2. The length between the upper surface side of the first substrate 11 and the lower surface side of the second substrate 12 is set to b. At this time, a1, a2, and b may be set so that a1+a2>b.

[0180] According to the modification, the joint portion A can be arranged to be separated from the heat receiving plate 2 and the cooling plate 3. In the modification, heat leakage from the heat receiving plate 2 to the cooling plate 3 can be suppressed at the joint portion A.

[0181] In the modified example, the length from the outer edge of the first electrode 22 and the second electrode 23 to the bonding portion A is set to a1, the length of the bonding portion A is set to a2, and the length between the upper surface side of the first substrate 11 and the lower surface side of the second substrate 12 is set to b, and a1, a2, and b are set so as to satisfy a1+a2>b. According to the modified example, it is possible to prevent the bonding portion A from falling due to its own weight and contacting the first substrate 11.

[0182] (Variant 3)

[0183] Fig.19 This is a partially enlarged view of a joint portion of a thermoelectric power module according to Modification 3 of the second embodiment. The structure of the joint portion A of Modification 3 is different from that of the second embodiment.

[0184] The peripheral edge of the first base material 11 is folded back at the bent portion 11 b. The front end portion 11 a and the front end portion 11 c of the first base material 11 are separated from each other in the vertical direction. The front end portion 11 c of the first base material 11 is bonded to the front end portion 12 c of the second base material 12 .

[0185] The peripheral edge of the second base material 12 is folded back at the bent portion 12b. The front end portion 12a and the front end portion 12c of the second base material 12 are separated in the vertical direction. The front end portion 12c of the second base material 12 is joined to the front end portion 11c of the first base material 11.

[0186] In the joint portion A, the front end 11a of the first substrate 11, the front end 11c of the first substrate 11, the front end 12c of the second substrate 12, and the front end 12a of the second substrate 12 are arranged from the bottom in the vertical direction. The front end 11c of the first substrate 11 and the front end 12c of the second substrate 12 are joined by a resin adhesive.

[0187] According to the modification, the bonding area and thickness of the bonding portion A can be increased compared to a state in which the first base material 11 and the second base material 12 are bonded together without being bent.

[0188] (Variant 4)

[0189] Fig. 20 2 is a cross-sectional view schematically showing a thermoelectric power module according to a fourth modification of the second embodiment. The structure of the joint A of the fourth modification is different from that of the second embodiment.

[0190] The first base material 11 and the second base material 12 are formed by bending a sheet-like base material 10S. In the modified example, the lower side of the bent portion 10Sa is the first base material 11, and the upper side is the second base material 12.

[0191] The bonding portion A is arranged at the peripheral portion of the base material 10S except for the bent portion 10Sa. In the rectangular base material 10S, three sides are the bonding portions A, and one side is the bent portion 10Sa.

[0192] The embodiment can reduce the area of ​​the joint portion A. The embodiment can improve the sealing performance.

[0193] (Variant 5)

[0194] Fig.21 1 is a cross-sectional view schematically showing a thermoelectric power generation unit of a fifth modification of the second embodiment. The fifth modification is different from the second embodiment in that it includes a support member 2S. In the fifth modification, the thermoelectric power generation module 10 is configured in the same manner as in the second embodiment. In the fifth modification, the joint A is separated from the cooling plate 3 and is located on the heat receiving plate 2 side.

[0195] The support member 2S is disposed on the upper surface of the heat receiving plate 2. The support member 2S supports the joint A on the heat receiving plate 2. The support member 2S may, for example, support the joint A by clamping it in a slit provided in the support member 2S, or may support the joint A by adhering it to the support member 2S with an adhesive. There is no limitation on the method by which the support member 2S supports the joint A.

[0196] According to the modification, the joint portion A can be arranged to be separated from the cooling plate 3. In the modification, heat leakage from the heat receiving plate 2 to the cooling plate 3 can be suppressed at the joint portion A.

[0197] (Variant 6)

[0198] Fig. 22 1 is a cross-sectional view schematically showing a thermoelectric power generation unit of a modification example 6 of the second embodiment. Modification example 6 is different from modification example 1 of the second embodiment in that it includes a support member 3S. In modification example 6, the thermoelectric power generation module 10 is configured in the same manner as in modification example 2. In modification example 6, the joint A is separated from the heat receiving plate 2 and is located on the cooling plate 3 side.

[0199] The support member 3S is disposed on the lower surface of the cooling plate 3. The support member 3S supports the joint A on the cooling plate 3. The support member 3S may, for example, support the joint A by clamping it in a slit provided in the support member 3S, or may support the joint A by adhering it to the support member 3S with an adhesive. There is no limitation on the method by which the support member 3S supports the joint A.

[0200] According to the modification, it is possible to suppress the joining portion A from falling due to its own weight. The modification can support the position of the joining portion A in the up-and-down direction.

[0201] (Variant 7)

[0202] Fig.232 is a cross-sectional view schematically showing a thermoelectric power generation unit of a modification example 7 of the second embodiment. Modification example 7 is different from modification example 2 of the second embodiment in that it includes a support member 2S and a support member 3S. In modification example 7, the thermoelectric power generation module 10 is configured in the same manner as in modification example 2. The joint A is located between the heat receiving plate 2 and the cooling plate 3, and is separated from the heat receiving plate 2 and the cooling plate 3.

[0203] The support member 2S is arranged on the upper surface of the heat receiving plate 2. The support member 3S is arranged on the lower surface of the cooling plate 3. The support member 2S and the support member 3S together clamp and support the joint portion A in the up-down direction. In other words, the support member 2S and the support member 3S support the joint portion A to the heat receiving plate 2 and the cooling plate 3. There is no limitation on the method by which the support member 2S and the support member 3S support the joint portion A.

[0204] According to the modification, it is possible to suppress the joining portion A from falling due to its own weight. The modification can support the position of the joining portion A in the up-and-down direction.

[0205] (Other Modifications of the Second Embodiment)

[0206] The above-mentioned modification examples 5, 6, and 7 of the second embodiment are described as the case where the joint portion A is supported by at least one of the supporting member 2S and the supporting member 3S, but the method of supporting the joint portion A is not limited thereto. The joint portion A may also bond at least one of the first substrate 11 and the second substrate 12 to at least one of the heat receiving plate 2 and the cooling plate 3 by an adhesive.

[0207] In the above-mentioned modification of the second embodiment, the structure of forming the joint portion A by folding back at least one of the first substrate 11 and the second substrate 12 is described, but the shape of the folded back first substrate 11 and second substrate 12 is not limited to this. For example, the first substrate 11 may be folded back in a direction away from the second substrate 12. The second substrate 12 may also be folded back in a direction away from the first substrate 11.

[0208] Description of Reference Numerals

[0209] 1 thermoelectric power generation unit; 2 heat receiving plate; 3 cooling plate; 4 first heat transfer component; 5 second heat transfer component; 6 fastening component; 7 surface treatment part; 10 thermoelectric power generation module; 11 first substrate; 12 second substrate; 13 metal film; 14 metal film; 21 thermoelectric conversion element; 21P p-type element; 21N n-type element; 22 first electrode; 23 second electrode; A bonding part

Claims

1. A thermoelectric power generation module, characterized in that: have: A first substrate formed into a sheet shape; a second substrate formed into a sheet shape; a plurality of thermoelectric conversion elements disposed between the first substrate and the second substrate; A plurality of first electrodes, which are arranged between the first substrate and the thermoelectric conversion element; A plurality of second electrodes disposed between the second substrate and the thermoelectric conversion element; a bonding portion bonding the first substrate and the second substrate, The thermoelectric conversion element, the plurality of first electrodes, and the plurality of second electrodes are sealed by a joint portion. The bonding portion bonds the first base material and the second base material with solder via a metal film.

2. A thermoelectric power generation module, characterized in that: have: A first substrate formed into a sheet shape; a second substrate formed into a sheet shape; a plurality of thermoelectric conversion elements disposed between the first substrate and the second substrate; A plurality of first electrodes, which are arranged between the first substrate and the thermoelectric conversion element; A plurality of second electrodes, which are arranged between the second substrate and the thermoelectric conversion element; a bonding portion bonding the first substrate and the second substrate, The thermoelectric conversion element, the plurality of first electrodes, and the plurality of second electrodes are sealed by a joint portion. The joining portion joins at least one of the first base material and the second base material in a bent state.

3. The thermoelectric power generation module according to claim 1 or 2, characterized in that: If the length from the outer edge of the plurality of first electrodes and the second electrodes arranged between the first substrate and the second substrate to the joining portion is set to a1, the length of the joining portion is set to a2, and the length between the upper surface side of the first substrate and the lower surface side of the second substrate is set to b, then a1+a2>b.

4. A thermoelectric power generation unit, characterized in that: have: The thermoelectric power generation module according to claim 1; a heat receiving plate disposed on the first substrate side of the thermoelectric power generation module; A first heat transfer component, which is interposed between the thermoelectric power generation module and the heat receiving plate; a cooling plate disposed on the second substrate side of the thermoelectric power generation module; A second heat transfer component is interposed between the thermoelectric power generation module and the cooling plate.

5. A thermoelectric power generation unit, characterized in that: have: The thermoelectric power generation module according to claim 2; a heat receiving plate disposed on the first substrate side of the thermoelectric power generation module; A first heat transfer component, which is interposed between the thermoelectric power generation module and the heat receiving plate; a cooling plate disposed on the second substrate side of the thermoelectric power generation module; A second heat transfer component is interposed between the thermoelectric power generation module and the cooling plate.

6. The thermoelectric power generation unit according to claim 4 or 5, characterized in that: The joint portion is located between the heat receiving plate and the cooling plate, and is separated from the heat receiving plate and the cooling plate.

7. The thermoelectric power generation unit according to claim 4 or 5, characterized in that: A supporting member that supports the joining portion to the heat receiving plate and the cooling plate is further provided.

8. The thermoelectric power generation unit according to claim 4 or 5, characterized in that: The joining portion is separated from the heat receiving plate.

9. The thermoelectric power generation unit according to claim 4 or 5, characterized in that: A supporting member is provided for supporting the joining portion on the cooling plate.

10. The thermoelectric power generation unit according to claim 4 or 5, characterized in that: The joint portion is separated from the cooling plate.

11. The thermoelectric power generation unit according to claim 4 or 5, characterized in that: A supporting member is provided for supporting the joining portion on the heat receiving plate.

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