Processing method and system of diamond red copper composite material

Abstract

The invention discloses a processing method and system of a diamond red copper composite material, the processing method of the diamond red copper composite material is applied to the processing system of the diamond red copper composite material, and the processing system of the diamond red copper composite material comprises a cutting device, a cooling liquid introducing device and a cooling container. One side of the cooling container communicates with a cooling liquid introducing device, an opening is formed in the other side of the cooling container and used for allowing cooling liquid to flow out, the cooling liquid is contained in the machining container, and the machining method of the diamond red copper composite material comprises the steps that the diamond red copper composite material to be machined is immersed in the cooling liquid in the cooling container; the cooling liquid introducing device is controlled to introduce cooling liquid into the cooling container, and the top liquid level of the cooling liquid is kept to be higher than the top surface of the to-be-machined diamond red copper composite material by a preset height; and the cutting device is controlled to cut the to-be-machined diamond red copper composite material. The processing yield of the diamond red copper composite material can be improved.

Description

Technical Field

[0001] The present application relates to the field of laser technology, and in particular to a processing method and system for a diamond-copper composite material. Background Art

[0002] Semiconductor lasers have the advantages of small size, light weight, high electro-optical conversion efficiency, high reliability and long life, and have important applications in industrial processing, biomedicine and national defense. At present, the main common materials processed in the market are carbon steel, stainless steel, aluminum plate, copper and brass. Diamond is a graphite material, and copper is a thermal and electrical conductive material. There are certain requirements for processing accuracy to ensure that the cutting accuracy is controlled within 0.02mm. Thermal deformation effects will occur during ordinary processing. Traditional wire cutting cannot achieve the cutting of anisotropic graphics and cannot achieve the processing requirements of narrow gaps. At present, the processing of this material has obvious overburning and carbonization phenomena, resulting in edge burning and surface damage in the processing of this material, which reduces the processing yield of diamond copper composite materials. Summary of the invention

[0003] The embodiment of the present application provides a method for processing a diamond-copper composite material, which can improve the processing yield of the diamond-copper composite material.

[0004] In a first aspect, the processing method of the diamond copper composite material provided by the present application is applied to a processing system of the diamond copper composite material, wherein the processing system of the diamond copper composite material comprises a cutting device, a coolant introduction device and a cooling container, wherein one side of the cooling container is connected to the coolant introduction device, and the other side of the cooling container is provided with an opening, wherein the opening is used to flow out the coolant, and the processing container contains the coolant, and the processing method of the diamond copper composite material comprises:

[0005] Immersing the diamond-copper composite material to be processed in the coolant in the cooling container;

[0006] Controlling the coolant introduction device to introduce coolant into the cooling container, and maintaining the top liquid level of the coolant higher than the top surface of the diamond-copper composite material to be processed by a preset height;

[0007] The cutting device is controlled to cut the diamond copper composite material to be processed.

[0008] Optionally, the cutting device comprises a cutting head and a laser, the cutting head is connected to the laser, and the cutting device is controlled to cut the diamond copper composite material to be processed, comprising:

[0009] Automatically focus the cutting head and align it with the diamond copper composite material to be processed;

[0010] Controlling the laser to emit laser to the cutting head, so that the cutting head aligns and focuses the laser and then irradiates it on the diamond-copper composite material to be processed to form a cutting spot;

[0011] The cutting head is moved to cut the diamond-copper composite material to be processed.

[0012] Optionally, the processing system of the diamond-copper composite material includes a coolant spraying device, and the coolant spraying device is used to spray coolant. The processing method of the diamond-copper composite material includes:

[0013] The coolant spraying device is controlled to spray coolant toward the cutting position of the cutting head on the diamond-copper composite material to be processed.

[0014] Optionally, the processing system of the diamond-copper composite material comprises a gas introduction device, and the gas introduction device is used to introduce gas. The processing method of the diamond-copper composite material comprises:

[0015] The gas introduction device is controlled to introduce a preset gas into the cutting position of the cutting head on the diamond-copper composite material to be processed.

[0016] Optionally, the thickness of the diamond-copper composite material to be processed is 0.5 mm-2 mm, and the preset height is 0.5 mm-2 mm.

[0017] Optionally, the laser is a single-mode fiber laser, the fiber core diameter of the laser is 14um-34um, and the diameter of the cutting spot formed by the cutting head on the diamond-copper composite material to be processed is 0.04mm.

[0018] Optionally, the preset gas is a mixed gas of 90% oxygen and 10% nitrogen, the gas pressure of the preset gas is 8bar-12bar, and the cutting process parameters of the cutting head include a cutting power of 2000W-3000W, a frequency of 200Hz-500Hz, a duty cycle of 40%-50% and a focus of -1mm to -2mm.

[0019] Optionally, the coolant is water or a mixture of ethylene glycol and water.

[0020] In a second aspect, the present application provides a diamond-copper composite material processing system, the diamond-copper composite material processing system comprising a cutting device and a cooling container, one side of the cooling container is connected to a coolant introduction device, and the other side of the cooling container is provided with an opening, the opening is used to flow out the coolant, the processing container is filled with coolant, and the coolant in the cooling container is used to immerse the diamond-copper composite material to be processed; the coolant introduction device is used to introduce coolant into the cooling container, and keep the top liquid level of the coolant higher than the top surface of the diamond-copper composite material to be processed by a preset height; the cutting device is used to cut the diamond-copper composite material to be processed.

[0021] In the present application, compared with the related art, the processing method of the diamond copper composite material of the present application is applied to the processing system of the diamond copper composite material, the processing system of the diamond copper composite material includes a cutting device, a coolant introduction device and a cooling container, one side of the cooling container is connected to the coolant introduction device, the other side of the cooling container is provided with an opening, the opening is used to flow out the coolant, the processing container contains the coolant, and the processing method of the diamond copper composite material includes: immersing the diamond copper composite material to be processed in the coolant in the cooling container; controlling the coolant introduction device to introduce the coolant into the cooling container, keeping the top liquid level of the coolant higher than the top surface of the diamond copper composite material to be processed by a preset height; controlling the cutting device to cut the diamond copper composite material to be processed. The present application can improve the processing yield of the diamond copper composite material. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings required for use in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For those skilled in the art, other drawings can be obtained based on these drawings without creative work.

[0023] Figure 1 It is a structural schematic diagram of an embodiment of a processing system of a diamond-copper composite material provided in an embodiment of the present application;

[0024] Figure 2 It is a schematic flow chart of an embodiment of a method for processing a diamond-copper composite material provided in an embodiment of the present application. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be described clearly and completely below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present application.

[0026] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate positions or positional relationships based on the positions or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application. In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present application, the meaning of "multiple" is two or more, unless otherwise clearly and specifically defined.

[0027] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection, an electrical connection, or mutual communication; it can be a direct connection, or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0028] See also Figure 1 The processing system of the diamond copper composite material provided in the present application includes a cutting device, a coolant introduction device and a cooling container, one side of the cooling container is connected to the coolant introduction device, and the other side of the cooling container is provided with an opening, the opening is used to flow out the coolant, the processing container is filled with coolant, and the coolant in the cooling container is used to immerse the diamond copper composite material to be processed; the coolant introduction device is used to introduce coolant into the cooling container, and keep the top liquid level of the coolant higher than the top surface of the diamond copper composite material to be processed by a preset height; the cutting device is used to cut the diamond copper composite material to be processed.

[0029] In the embodiment of the present application, the cutting device includes a cutting head and a laser, and the cutting head is connected to the laser. The cutting head includes a collimating component and a focusing component, the focusing focal length of the collimating component is 80 mm, and the focusing focal length of the focusing component is 125 mm. The cutting head is used to automatically focus the cutting head and align it with the diamond copper composite material to be processed; the laser is used to emit laser to the cutting head so that the cutting head collimates and focuses the laser and then irradiates it on the diamond copper composite material to be processed to form a cutting spot; the cutting head is moved to cut the diamond copper composite material to be processed.

[0030] In an embodiment of the present application, a processing system for the diamond-copper composite material includes a coolant spraying device, which is used to spray coolant. The coolant spraying device is used to spray coolant onto the cutting position of the diamond-copper composite material to be processed by the cutting head.

[0031] In an embodiment of the present application, the processing system of the diamond-copper composite material includes a gas introduction device, which is used to introduce gas. The gas introduction device is used to introduce preset gas into the cutting position of the diamond-copper composite material to be processed by the cutting head.

[0032] In the embodiment of the present application, the laser is a single-mode fiber laser, the fiber core diameter of the laser is 14um-34um, and the diameter of the cutting spot formed by the cutting head on the diamond copper composite material to be processed is 0.04mm. The output mode of the laser is modulation mode.

[0033] Specifically, the focusing focal length of the collimating component of the cutting head is 80mm, the focusing focal length of the focusing component of the cutting head is 125mm, and the laser uses a C2000W (20um) fiber core laser. The calculated cutting spot is about 0.04mm. The advantage of using a small spot to cut copper is that it can improve the cutting section effect and reduce the range of the heat-affected zone.

[0034] In an embodiment of the present application, the processing system of the diamond copper composite material includes a coolant spraying device and a gas introduction device, wherein the coolant spraying device is used to spray coolant, and the gas introduction device is used to introduce gas. The use of gas assistance can effectively reduce the thermal effects during laser cutting. The gas can take away heat from the cutting area, reduce the surface temperature of the material, and reduce heat input. At the same time, the gas can also clear the slag and oxides generated in the cutting area, and improve the cutting speed and quality. For compound materials, the use of a cooling system can effectively reduce the thermal effects. The cooling system can spray water or other cooling into the cutting area to quickly cool the heat and prevent the material from overheating and deformation. At the same time, the cooling system can also reduce the content of tiny particles in the cutting exhaust gas, and also protect the health of the operator.

[0035] In the embodiment of the present application, the thickness of the diamond copper composite material to be processed is 0.5 mm-2 mm.

[0036] In the embodiment of the present application, the preset gas is a mixed gas of 90% oxygen and 10% nitrogen, the gas pressure of the preset gas is 8 bar-12 bar, and the cutting process parameters of the cutting head include a cutting power of 2000W-3000W, a frequency of 200Hz-500Hz, a duty cycle of 40%-50%, and a focus of -1mm to -2mm. In other embodiments, the preset gas may also be argon.

[0037] In the embodiment of the present application, the preset height is 0.5mm-2mm.

[0038] In the embodiment of the present application, the coolant is water or a mixture of ethylene glycol and water.

[0039] See also Figure 1 and Figure 2 The processing method of the diamond copper composite material provided in the present application includes:

[0040] 201. Immerse the diamond-copper composite material to be processed in the coolant in the cooling container.

[0041] In the embodiment of the present application, the thickness of the diamond copper composite material to be processed is 0.5 mm-2 mm.

[0042] 202. Control the coolant introduction device to introduce coolant into the cooling container, and keep the top liquid level of the coolant higher than the top surface of the diamond-copper composite material to be processed by a preset height.

[0043] In the embodiment of the present application, the preset height is 0.5mm-2mm.

[0044] Specifically, the coolant introduction device is controlled to introduce coolant into the cooling container, and the top liquid level of the coolant is kept higher than the top surface of the diamond copper composite material to be processed by a preset height, while the coolant spraying device is controlled to spray coolant to the cutting head at the cutting position of the diamond copper composite material to be processed, and the gas introduction device is controlled to introduce a preset gas to the cutting head at the cutting position of the diamond copper composite material to be processed. In the embodiment of the present application, the preset gas is a mixed gas of 90% oxygen and 10% nitrogen, and the gas pressure of the preset gas is 8bar-12bar.

[0045] 203. Control the cutting device to cut the diamond copper composite material to be processed.

[0046] Specifically, controlling the cutting device to cut the diamond copper composite material to be processed includes: automatically focusing the cutting head and aligning it with the diamond copper composite material to be processed; controlling the laser to emit laser to the cutting head, so that the cutting head aligns and focuses the laser and then irradiates it on the diamond copper composite material to be processed to form a cutting spot; and moving the cutting head to cut the diamond copper composite material to be processed.

[0047] In a specific embodiment, the processing method of the diamond copper composite material includes:

[0048] (1) Immerse the diamond-copper composite material to be processed in a coolant in a cooling container. The diamond-copper composite material to be processed is copper with diamond material coated on the surface, and the thickness of the diamond-copper composite material to be processed is 0.5 mm to 2 mm.

[0049] (2) Install the 2000S (20um) laser on the cutting head with a collimation component with a focal length of 80mm and a focusing component with a focal length of 125mm, and align the light output with the diamond copper composite material to be processed. Make a cooling fixture that goes into the water outlet channel, place the diamond copper composite material to be cut on it, and clamp it with the fixture for cutting.

[0050] (3) Control the coolant introduction device to introduce coolant into the cooling container, and keep the top liquid level of the coolant 0.5 mm to 2 mm higher than the top surface of the diamond-copper composite material to be processed.

[0051] (4) Controlling the laser to emit the laser to the cutting head, so that the cutting head aligns and focuses the laser and then irradiates it on the diamond-copper composite material to be processed to form a cutting spot; moving the cutting head to cut the diamond-copper composite material to be processed.

[0052] In the embodiment of the present application, the coolant is water or a mixture of ethylene glycol and water.

[0053] In the embodiment of the present application, the laser is a single-mode fiber laser, the fiber core diameter is 14um-34um, and the spot size after focusing is about 0.04mm; the laser output mode is a modulation mode, and the cutting process parameters include power 2000W-3000W, frequency 200Hz-500Hz, duty cycle 40%-50%, focus between -1mm and -2mm, and the preset gas high pressure is 8bar-12bar.

[0054] (5) While cutting the diamond-copper composite material to be processed, the coolant spraying device is controlled to spray coolant toward the cutting position of the cutting head at the cutting position of the diamond-copper composite material to be processed; and the gas introduction device is controlled to introduce a mixed gas composed of 90% oxygen and 10% nitrogen into the cutting position of the cutting head at the cutting position of the diamond-copper composite material to be processed.

[0055] The coolant spraying device is installed on the side of the cutting head to spray water along the cutting direction of the nozzle for cooling. It can effectively reduce the overburning phenomenon of the cutting surface. In the actual proofing cutting, the cross section of the auxiliary gas oxygen cutting is black, and there will be a certain burning edge phenomenon on the surface of the material. Using a mixed gas composed of 90% oxygen and 10% nitrogen to assist laser cutting will improve the surface of the material.

[0056] Compared with the related art, the processing method of the diamond copper composite material of the present application is applied to the processing system of the diamond copper composite material, the processing system of the diamond copper composite material includes a cutting device, a coolant introduction device and a cooling container, one side of the cooling container is connected to the coolant introduction device, the other side of the cooling container is provided with an opening, the opening is used to flow out the coolant, the processing container contains the coolant, and the processing method of the diamond copper composite material includes: immersing the diamond copper composite material to be processed in the coolant in the cooling container; controlling the coolant introduction device to introduce the coolant into the cooling container, keeping the top liquid level of the coolant higher than the top surface of the diamond copper composite material to be processed by a preset height; controlling the cutting device to cut the diamond copper composite material to be processed. The present application can improve the processing yield of the diamond copper composite material.

[0057] This application has the following beneficial effects:

[0058] (1) Improve the microstructure of the material. By controlling the heat input during the cutting process, the recrystallization process inside the diamond and copper compounds can be promoted, thereby improving the microstructure of the material and improving its mechanical properties and corrosion resistance.

[0059] (2) Reduce residual stress. Local heating during the cutting process can cause the residual stress inside the material to be redistributed, and sometimes even partially release these stresses, thereby reducing the stress concentration problem in subsequent processing or use.

[0060] (3) Improve processing accuracy. In some cases, moderate thermal deformation can be used to compensate for the dimensional shrinkage caused by cold working, thereby improving the processing accuracy of the final product to a certain extent.

[0061] (4) Improve surface quality. Appropriate heat treatment can improve the surface finish of copper compounds, reduce scratches and cracks generated during the cutting process, and improve the appearance quality of the product.

[0062] (5) Enhance the toughness of the material. In some cases, heat treatment can increase the toughness of copper compounds, making them better resistant to fracture when subjected to impact or vibration.

[0063] The above is a detailed introduction to the processing method of a diamond copper composite material provided by the present application. Specific examples are used in this article to illustrate the principle and implementation method of the present application. The description of the above embodiments is only used to help understand the method and its core idea of ​​the present application. At the same time, for technicians in this field, according to the idea of ​​the present application, there will be changes in the specific implementation method and application scope. In summary, the content of this specification should not be understood as a limitation on the present application.

[0064] It should be noted that when the above embodiments of the present application are applied to specific products or technologies, the relevant data of the user is involved, and the user's permission or consent is required, and the collection, use and processing of the relevant data must comply with relevant laws, regulations and standards.

Claims

1. A method for processing a diamond copper composite material, characterized in that: A processing system for diamond copper composite material, the processing system for diamond copper composite material comprising a cutting device, a coolant introduction device and a cooling container, one side of the cooling container is connected to the coolant introduction device, the other side of the cooling container is provided with an opening, the opening is used to flow out the coolant, the processing container contains the coolant, and the processing method of the diamond copper composite material comprises: Immersing the diamond-copper composite material to be processed in the coolant in the cooling container; Controlling the coolant introduction device to introduce coolant into the cooling container, and maintaining the top liquid level of the coolant higher than the top surface of the diamond-copper composite material to be processed by a preset height; The cutting device is controlled to cut the diamond copper composite material to be processed.

2. The method for processing the diamond copper composite material according to claim 1, characterized in that: The cutting device comprises a cutting head and a laser, wherein the cutting head is connected to the laser, and the cutting device is controlled to cut the diamond copper composite material to be processed, comprising: Automatically focus the cutting head and align it with the diamond copper composite material to be processed; Controlling the laser to emit laser to the cutting head, so that the cutting head aligns and focuses the laser and then irradiates it on the diamond-copper composite material to be processed to form a cutting spot; The cutting head is moved to cut the diamond-copper composite material to be processed.

3. The processing method of the diamond copper composite material according to claim 2, characterized in that: The processing system of the diamond copper composite material includes a coolant spraying device, and the coolant spraying device is used to spray coolant. The processing method of the diamond copper composite material includes: The coolant spraying device is controlled to spray coolant toward the cutting position of the cutting head on the diamond-copper composite material to be processed.

4. The method for processing the diamond copper composite material according to claim 3, characterized in that: The processing system of the diamond-copper composite material comprises a gas introduction device, and the gas introduction device is used to introduce gas. The processing method of the diamond-copper composite material comprises: The gas introduction device is controlled to introduce a preset gas into the cutting position of the cutting head on the diamond-copper composite material to be processed.

5. The method for processing the diamond copper composite material according to claim 4, characterized in that: The thickness of the diamond-copper composite material to be processed is 0.5 mm-2 mm, and the preset height is 0.5 mm-2 mm.

6. The method for processing the diamond copper composite material according to claim 5, characterized in that: The laser is a single-mode fiber laser, the fiber core diameter of the laser is 14um-34um, and the diameter of the cutting spot formed by the cutting head on the diamond copper composite material to be processed is 0.04mm.

7. The method for processing the diamond copper composite material according to claim 6, characterized in that: The preset gas is a mixed gas of 90% oxygen and 10% nitrogen, the gas pressure of the preset gas is 8bar-12bar, and the cutting process parameters of the cutting head include a cutting power of 2000W-3000W, a frequency of 200Hz-500Hz, a duty cycle of 40%-50% and a focus of -1mm to -2mm.

8. The method for processing the diamond copper composite material according to claim 7, characterized in that: The preset height is 0.5mm-2mm.

9. The method for processing the diamond copper composite material according to claim 8, characterized in that: The coolant is water or a mixture of ethylene glycol and water.

10. A processing system for a diamond copper composite material, characterized in that: The processing system of the diamond copper composite material comprises a cutting device and a cooling container. One side of the cooling container is connected to a coolant introduction device, and the other side of the cooling container is provided with an opening, and the opening is used to flow out the coolant. The processing container contains coolant, and the coolant in the cooling container is used to immerse the diamond copper composite material to be processed; the coolant introduction device is used to introduce coolant into the cooling container, and keep the top liquid level of the coolant higher than the top surface of the diamond copper composite material to be processed by a preset height; the cutting device is used to cut the diamond copper composite material to be processed.

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