Crystal bar processing device, crystal bar processing method and equipment

Abstract

The invention provides a crystal bar processing device, a crystal bar processing method and equipment, and the crystal bar processing device comprises a clamping unit which can clamp and rotate a crystal bar; the first crystal orientation detection unit is arranged on one radial side of the crystal bar and is used for carrying out crystal orientation detection on the surface of the crystal bar; the V-shaped groove processing unit is arranged on one radial side of the crystal bar and is used for processing a V-shaped groove on the surface of the crystal bar; the second crystal orientation detection unit is arranged on one radial side of the crystal bar and is used for carrying out crystal orientation detection on the surface of the crystal bar; the control unit is used for controlling the crystal bar to rotate by a preset angle to the crystal orientation position of the to-be-machined V groove based on the crystal orientation detection result of the first crystal orientation detection unit; and based on the crystal orientation detection result of the second crystal orientation detection unit, the deviation state of the crystal orientation position of the to-be-machined V groove relative to the machining crystal orientation position of the target V groove is judged. According to the crystal bar machining device, the crystal bar machining method and the crystal bar machining equipment, V-groove machining errors can be avoided.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor processing technology, and in particular to a crystal rod processing device, a crystal rod processing method and equipment. Background Art

[0002] In the semiconductor industry, the crystal ingots produced by crystal pulling are rounded, cut and cut before silicon wafer processing. Rounding is to grind the outer surface of the crystal ingot to process the body of the crystal ingot with unequal diameters into a body of the crystal ingot with equal diameters.

[0003] In order to identify the specific crystallization direction on the crystal rod or wafer, the crystal rod is generally processed with a groove (V-Notch groove) after the crystal rod is oriented. Among them, the crystal rod orientation is determined by a crystal direction detection tool. After the crystal rod is oriented, the crystal rod is rotated by a predetermined angle to process the V-Notch groove. However, in this process, as the use time increases, due to factors such as the decrease in the rotation accuracy of the device and the decrease in the accuracy of the crystal direction detection tool, the processing direction of the V-Notch groove will deviate from the target value, which will cause the entire crystal rod to be scrapped. Summary of the invention

[0004] In order to solve at least one technical problem in the above-mentioned prior art, the embodiments of the present disclosure provide a crystal rod processing device, a crystal rod processing method and equipment.

[0005] The technical solutions provided by the embodiments of the present disclosure are as follows:

[0006] In a first aspect, an embodiment of the present disclosure provides a crystal rod processing device, comprising:

[0007] A clamping unit, configured to clamp and rotate the crystal rod;

[0008] A first crystal direction detection unit, disposed on one radial side of the crystal rod, and used for performing crystal direction detection on the surface of the crystal rod;

[0009] A V-groove processing unit is provided on one radial side of the crystal rod, and the V-groove processing unit is used to process a V-groove on the surface of the crystal rod;

[0010] A second crystal direction detection unit is provided on one radial side of the crystal rod, and the second crystal direction detection unit is used to perform crystal direction detection on the surface of the crystal rod;

[0011] A control unit is connected to the first crystal direction detection unit, the second crystal direction detection unit, the clamping unit and the V-groove processing unit respectively; wherein the control unit is used to:

[0012] Based on the crystal direction detection result of the first crystal direction detection unit, controlling the crystal rod to rotate by a preset angle to a crystal direction position of a V-groove to be processed;

[0013] Based on the crystal direction detection result of the second crystal direction detection unit, the deviation state of the crystal direction position of the to-be-processed V-groove relative to the target V-groove processing crystal direction position is determined.

[0014] Exemplarily, the V-groove processing unit and the second crystal direction detection unit are located on the same side of the crystal rod.

[0015] Exemplarily, the crystal rod has a first side and a second side which are opposite to each other in the radial direction; wherein the V-groove processing unit and the second crystal direction detection unit are located on the first side of the crystal rod, and the first crystal direction detection unit is located on the second side of the crystal rod.

[0016] Exemplarily, the V-groove processing unit has a processing portion for contacting the surface of the crystal rod to process the V-groove; the second crystal direction detection unit has a detection portion for detecting the crystal direction of the surface of the crystal rod; when the V-groove processing unit is in a target processing position and the second crystal direction detection unit is in a target detection position, the processing portion and the detection portion are on the same horizontal plane.

[0017] Exemplarily, the V-groove processing unit includes a V-groove grinding wheel and a first moving component. Driven by the first moving component, the V-groove grinding wheel can approach or move away from the surface of the crystal rod along the radial direction of the crystal rod.

[0018] Exemplarily, the second crystal direction detection unit includes a second crystal direction detector, and the second crystal direction detector is connected to the first moving component so that the second crystal direction detector and the V-groove grinding wheel can move synchronously.

[0019] Exemplarily, the first crystal direction detection unit includes a first crystal direction detector and a second movable component, the first crystal direction detector is connected to the second movable component, and the first crystal direction detector can approach or move away from the surface of the crystal rod along the radial direction of the crystal rod under the drive of the second movable component.

[0020] Exemplarily, the crystal rod processing device also includes an alarm unit connected to the control unit; wherein, the control unit is also used to control the alarm unit to send an alarm signal when it is determined that the actual deviation of the crystal direction position of the V-groove to be processed relative to the target V-groove processing crystal direction position is greater than a deviation threshold.

[0021] In a second aspect, the embodiments of the present disclosure further provide a crystal rod processing method, which is applied to the crystal rod processing device as described above, and the method includes:

[0022] Based on the crystal direction detection result of the first crystal direction detection unit, controlling the crystal rod to rotate by a preset angle to a crystal direction position of a V-groove to be processed;

[0023] Based on the crystal direction detection result of the second crystal direction detection unit, the deviation state of the crystal direction position of the to-be-processed V-groove relative to the target V-groove processing crystal direction position is determined.

[0024] In a third aspect, an embodiment of the present disclosure further provides an electronic device, comprising a memory, a processor, and one or more programs stored in the memory and executable on the processor, wherein when the one or more programs are executed by the processor, the electronic device executes the crystal rod processing method as described above.

[0025] The beneficial effects brought by the embodiments of the present disclosure are as follows:

[0026] In the crystal rod processing device, crystal rod processing method and equipment provided by the present disclosure, the crystal rod processing device includes a clamping unit, a first crystal direction detection unit, a V-groove processing unit, a second crystal direction detection unit and a control unit, wherein the clamping unit is used to clamp and rotate the crystal rod, the first crystal direction detection unit and the second crystal direction detection unit can perform crystal direction detection on the surface of the crystal rod, the V-groove processing unit can process a V-groove on the surface of the crystal rod, and the control unit is used to control the crystal rod to rotate by a preset angle to the crystal direction position of the V-groove to be processed based on the crystal direction detection result of the first crystal direction detection unit; and judge the deviation state of the crystal direction position of the V-groove to be processed relative to the target V-groove processing crystal direction position based on the crystal direction detection result of the second crystal direction detection unit.

[0027] In this way, the crystal direction of the crystal rod can be oriented by the first crystal direction detection unit, and then the crystal rod can be rotated to the processing position of the V-groove to be processed by rotating the crystal rod by a predetermined angle; after the crystal rod is rotated to the processing position of the V-groove to be processed, the crystal direction of the crystal rod can be secondary detected by the second crystal direction detection unit to verify the crystal direction of the crystal rod and determine the deviation state of the crystal direction position of the V-groove to be processed relative to the target V-groove processing crystal direction position, so as to avoid V-groove processing errors, avoid crystal rod waste, and improve the yield of processed products. BRIEF DESCRIPTION OF THE DRAWINGS

[0028] Figure 1 A schematic diagram showing the structure of a wafer processing device provided by an embodiment of the present disclosure;

[0029] Figure 2 A schematic diagram showing a first crystal direction detection unit in a wafer processing device provided by an embodiment of the present disclosure performing crystal direction detection;

[0030] Figure 3 A schematic diagram showing the first crystal direction detection unit in the wafer processing device provided by an embodiment of the present disclosure performing crystal direction verification. DETAILED DESCRIPTION

[0031] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0032] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. The "first", "second" and similar words used in the present disclosure do not indicate any order, quantity or importance, but are only used to distinguish different components. Similarly, similar words such as "one", "one" or "the" do not indicate quantity restrictions, but indicate that there is at least one. Similar words such as "include" or "comprise" mean that the elements or objects appearing before the word cover the elements or objects listed after the word and their equivalents, without excluding other elements or objects. Similar words such as "connect" or "connected" are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up", "down", "left", "right" and the like are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0033] The features such as "parallel", "perpendicular", and "same" used in the embodiments of the present disclosure include the features such as "parallel", "perpendicular", and "same" in a strict sense, as well as the cases where "approximately parallel", "approximately perpendicular", "approximately the same", etc. include certain tolerances, taking into account the tolerances associated with the measurement of specific quantities (e.g., the limitations of the measurement system), and represent the acceptable deviation range for a specific value determined by ordinary technicians in the field. For example, "approximately" can mean within one or more standard deviations, or within 3% or 5% of the value.

[0034] In addition, in this document, unless otherwise defined, the terms "substantially", "substantially", "approximately" and "about" are used to describe and explain small changes. When used with an event or situation, these terms can cover situations where the event or situation occurs exactly, and can also cover situations where the event or situation occurs approximately. For example, when used with a numerical value, these terms can include a range of variation of less than or equal to 10% of the numerical value, such as less than or equal to ±5%, less than or equal to ±4%, less than or equal to ±3%, less than or equal to ±2%, less than or equal to ±1%, less than or equal to ±0.5%, less than or equal to ±0.1%, less than or equal to ±0.05%. The term "substantially coplanar" can refer to two surfaces being arranged along the same plane in the micrometer range, for example, arranged along the same plane within 40μm, 30μm, 20μm, 10μm or 1μm.

[0035] like Figure 1 As shown, the embodiment of the present disclosure provides a crystal rod processing device, comprising:

[0036] A clamping unit 100 is configured to clamp and rotate the crystal rod 10;

[0037] A first crystal direction detection unit 200 is provided on one radial side of the crystal rod 10, and the first crystal direction detection unit 200 is used to perform crystal direction detection on the surface of the crystal rod 10;

[0038] A V-groove processing unit 300 is disposed on one radial side of the crystal rod 10 , and the V-groove processing unit 300 is used to process a V-groove on the surface of the crystal rod 10 ;

[0039] A second crystal direction detection unit 400 is provided on one radial side of the crystal rod 10, and the second crystal direction detection unit 400 is used to perform crystal direction detection on the surface of the crystal rod 10;

[0040] A control unit 500 is connected to the first crystal direction detection unit 200, the second crystal direction detection unit 400, the clamping unit 100 and the V-groove processing unit 300 respectively;

[0041] Wherein, the control unit 500 is used for:

[0042] Based on the crystal direction detection result of the first crystal direction detection unit 200, the crystal rod 10 is controlled to rotate by a preset angle to a crystal direction position of a V-groove to be processed;

[0043] Based on the crystal direction detection result of the second crystal direction detection unit 400, the deviation state of the crystal direction position of the to-be-processed V-groove relative to the target V-groove processing crystal direction position is determined.

[0044] In the above scheme, if Figure 2As shown, the crystal direction of the surface of the crystal rod 10 is oriented by the first crystal direction detection unit 200, and then the crystal rod 10 is rotated to a processing position of a V-groove to be processed by rotating the crystal rod 10 by a predetermined angle; when the crystal rod 10 is rotated to the position as shown in FIG. Figure 3 After the processing position of the V-groove to be processed is determined, the crystal orientation of the surface of the crystal rod 10 can be secondary detected by the second crystal orientation detection unit 400 to verify the crystal orientation of the crystal rod 10, and then determine the deviation state of the crystal orientation position of the V-groove to be processed relative to the target V-groove processing crystal orientation position, so as to avoid V-groove processing errors, avoid waste of crystal rod 10, and improve the yield of processed products.

[0045] In some exemplary embodiments, Figure 1 As shown, the clamping unit 100 may include a head clamping unit 110 for clamping the head of the crystal rod 10 and a tail clamping unit 120 for clamping the tail of the crystal rod 10 .

[0046] In some exemplary embodiments, Figure 1 As shown, the head clamping unit 110 may include a first clamping portion 111, a first rotating assembly 112 and a first driving assembly 113, wherein the first clamping portion 111 is used to clamp the head of the crystal rod 10, and the first rotating assembly 112 drives the first clamping portion 111 to rotate under the drive of the first driving assembly 113; the tail clamping unit 120 may include a second clamping portion 121, a second rotating assembly 122 and a second driving assembly 123, wherein the second clamping portion 121 is used to clamp the tail of the crystal rod 10, and the second rotating assembly 122 drives the second clamping portion 121 to rotate under the drive of the second driving assembly 123. For example, the first driving assembly 113 and the second driving assembly 123 may be any suitable structure such as a servo motor.

[0047] In some exemplary embodiments, Figures 1 to 3 As shown, the V-groove processing unit 300 and the second crystal direction detection unit 400 are located on the same side of the crystal ingot 10. In this way, since the crystal ingot 10 is rotated by a predetermined angle to the crystal direction position of the V-groove to be processed after being oriented by the first crystal direction detection unit 200, and the second crystal direction detection unit 400 is mainly used to verify the crystal direction of the crystal ingot 10 after being rotated by a predetermined angle, the second crystal direction detection unit 400 can be located on the same side as the V-groove processing unit 300 to perform crystal direction detection on the crystal ingot 10 before V-groove processing.

[0048] In some exemplary embodiments, as shown in the figure, the crystal rod 10 has a first side and a second side opposite to each other along its radial direction; wherein the V-groove processing unit 300 and the second crystal direction detection unit 400 are located on the first side of the crystal rod 10, and the first crystal direction detection unit 200 is located on the second side of the crystal rod 10.

[0049] For different crystal orientations (e.g. <100> Direction and <110> Direction) processing requirements are achieved through orientation <110> After the direction is set, the crystal rod 10 is rotated 360° or 315° and then <110> Direction or <100> In some embodiments, the first crystal direction detection unit 200 and the V-groove processing unit 300 can be respectively arranged on two opposite sides of the crystal rod 10 in the radial direction. However, it can be understood that the above is only an example, and the positional relationship between the first crystal direction detection unit 200, the second crystal direction detection unit 400 and the V-groove processing unit 300 is not limited thereto.

[0050] In some exemplary embodiments, the V-groove processing unit 300 has a processing portion for contacting the surface of the crystal rod 10 to process the V-groove. For example, the V-groove processing unit 300 may include a V-groove grinding wheel 310 and a first moving component 320. The V-groove grinding wheel 310 may approach or move away from the surface of the crystal rod 10 along the radial direction of the crystal rod 10 under the drive of the first moving component 320 to process the V-groove on the surface of the crystal rod 10. The V-groove grinding wheel 310 is mainly used to contact the surface of the crystal rod 10 to process the V-groove, so the processing portion may refer to the V-groove grinding wheel 310.

[0051] For example, the first moving assembly 320 may include a first driving member 321 , a first guide rail 322 , and a first moving platform 323 . The first moving platform 323 may be translated along the first guide rail 322 when driven by the first driving member 321 .

[0052] The second crystal orientation detection unit 400 has a detection portion for detecting the crystal orientation of the surface of the crystal rod 10. For example, the second crystal orientation detection unit 400 may be an X-ray single crystal orientation instrument.

[0053] The orientation principle of the X-ray single crystal orientation instrument is that the X-ray single crystal orientation instrument may include an X-ray generator and an X-ray receiving device, the X-ray generator emits X-rays, when the angle θ between the irradiated X-rays and the surface of the crystal rod 10 is exactly the diffraction angle, the X-ray intensity received by the X-ray receiving device is the maximum, so the crystal direction can be determined according to the X-ray intensity received by the X-ray receiving device. The detection part may refer to the X-ray generator and the X-ray receiving device.

[0054] The other necessary components of the X-ray single crystal orientation instrument should be understood by those skilled in the art and will not be elaborated here and should not be regarded as limitations of the present disclosure.

[0055] The V-groove grinding wheel 310 in the V-groove processing unit 300 can be close to or away from the crystal rod 10. When the V-groove grinding wheel 310 in the V-groove processing unit 300 processes the surface of the crystal rod 10, the position of the V-groove processing unit 300 is the target processing position; similarly, the second crystal direction detection unit 400 can also be constructed to be fixed or movable, and the position of the second crystal direction detection unit 400 when detecting the crystal direction of the crystal rod 10 is the target detection position.

[0056] When the V-groove processing unit 300 is at the target processing position and the second crystal direction detection unit 400 is at the target detection position, the processing part and the detection part are on the same horizontal plane. In this way, the surface of the crystal rod 10 detected by the second crystal direction detection unit 400 is exactly the area to be processed with the V-groove, which can truly reflect whether the area to be processed with the V-groove deviates from the area of ​​the target V-groove processing crystal direction.

[0057] In some embodiments, the ingot processing device further includes an alarm unit connected to the control unit 500; wherein the control unit 500 is further configured to control the alarm unit to send an alarm signal when it is determined that the actual deviation of the crystal direction position of the V-groove to be processed relative to the target V-groove processing crystal direction position is greater than a preset deviation threshold. The alarm signal may include a sound signal, a visual signal, a tactile signal, a communication signal, and an odor signal. The alarm method can avoid erroneous processing caused by factors such as rotation positioning and a decrease in the accuracy of the first crystal direction detection.

[0058] The control unit 500 may pre-store a target X-ray intensity value, which is the X-ray intensity value detected by the second crystal direction detection unit 400 when the crystal rod 10 is in the target V-groove processing crystal direction position. The actual deviation may be obtained based on the difference between the actual X-ray intensity value and the target X-ray intensity value. For example, when the difference between the actual X-ray intensity value detected by the second crystal direction detection unit 400 and the X-ray intensity value is greater than a threshold, it is determined that the actual deviation is greater than a preset deviation threshold.

[0059] In some exemplary embodiments, the control unit 500 may also be used to obtain a correction parameter for the rotation angle of the crystal rod 10 based on the actual deviation and the deviation threshold. In this way, the rotation angle of the crystal rod 10 may be corrected according to the correction parameter.

[0060] For example, before V-groove processing, a crystal direction review is performed to obtain the correction parameters, and the rotation angle of the crystal rod 10 is corrected. When V-groove processing is performed subsequently, the crystal rod 10 can be directly processed with a V-groove after being oriented by the first crystal direction detection unit 200 and rotated by a certain angle after correction. In this way, the number of crystal direction reviews can be reduced and production efficiency can be improved.

[0061] In some exemplary embodiments, Figure 1 As shown, the first crystal direction detection unit 200 includes a first crystal direction detector 210 and a second moving assembly 220, the first crystal direction detector 210 is connected to the second moving assembly 220, and the first crystal direction detector 210 can approach or move away from the surface of the crystal rod 10 along the radial direction of the crystal rod 10 under the drive of the second moving assembly 220. For example, the second moving assembly 220 may include a second driving member 221, a second guide rail 222, and a second moving stage 223, and the second moving stage 223 can translate along the second guide rail 222 under the drive of the second driving member 221.

[0062] In some embodiments, see Figure 1 As shown, the second crystal direction detection unit 400 includes a second crystal direction detector 410 , and the second crystal direction detector 410 is connected to the first moving assembly 320 , so that the second crystal direction detector 410 and the V-groove grinding wheel 310 can move synchronously.

[0063] This arrangement is compact and can ensure that the second crystal direction detection unit 400 maintains a relatively stable position relationship with the V-groove grinding wheel 310. Of course, it can be understood that in other embodiments, the second crystal direction detection unit 400 and the V-groove grinding wheel 310 can also move independently of each other.

[0064] In addition, the embodiment of the present disclosure further provides a crystal rod processing method, which is applied to the crystal rod processing device in the embodiment of the present disclosure, and the method comprises the following steps:

[0065] Step S01, based on the crystal direction detection result of the first crystal direction detection unit 200, controlling the crystal rod 10 to rotate by a preset angle to a crystal direction position of a V-groove to be processed;

[0066] Step S02: based on the crystal direction detection result of the second crystal direction detection unit 400, determine the deviation state of the crystal direction position of the to-be-processed V-groove relative to the target V-groove processing crystal direction position.

[0067] In the above scheme, the crystal direction of the surface of the crystal rod 10 is oriented by the first crystal direction detection unit 200, and then the crystal rod 10 is rotated by a predetermined angle to rotate the crystal rod 10 to the processing position of the V-groove to be processed. After the crystal rod 10 is rotated to the processing position of the V-groove to be processed, the crystal direction of the surface of the crystal rod 10 can be secondary detected by the second crystal direction detection unit 400 to verify the crystal direction of the crystal rod 10, and then determine the deviation state of the crystal direction position of the V-groove to be processed relative to the target V-groove processing crystal direction position. In this way, V-groove processing errors can be avoided, crystal rod 10 waste can be avoided, and the yield of processed products can be improved.

[0068] Exemplarily, after the above step S02, the method further includes:

[0069] Step S03: When it is determined that the actual deviation of the crystal direction position of the to-be-processed V-groove relative to the target V-groove processing crystal direction position is greater than a preset deviation threshold, the alarm unit is controlled to send out an alarm signal.

[0070] In this way, erroneous processing caused by factors such as rotation positioning and decreased first crystal direction detection accuracy can be avoided through the alarm method.

[0071] Step S04: Based on the actual deviation and the deviation threshold, a correction parameter of the rotation angle of the crystal rod 10 is obtained, and the rotation angle of the crystal rod 10 can be corrected according to the correction parameter.

[0072] For example, before V-groove processing, a crystal direction review is performed to obtain the correction parameters, and the rotation angle of the crystal rod 10 is corrected. When V-groove processing is performed subsequently, the crystal rod 10 can be directly processed with a V-groove after being oriented by the first crystal direction detection unit 200 and rotated by a certain angle after correction. In this way, the number of crystal direction reviews can be reduced and production efficiency can be improved.

[0073] In addition, an embodiment of the present disclosure also provides an electronic device, including a memory, a processor, and one or more programs stored in the memory and executable on the processor. When the one or more programs are executed by the processor, the electronic device executes the crystal rod processing method as described above.

[0074] Since the principle of solving the problem by the crystal rod processing method is similar to the principle of solving the problem by the above-mentioned crystal rod processing device, the embodiment of the crystal rod processing method provided in the embodiment of the present disclosure can refer to the embodiment of the above-mentioned crystal rod processing device provided in the embodiment of the present disclosure, and will not be repeated here.

[0075] In addition, the embodiment of the present disclosure further provides a device, including a memory and a processor, wherein the memory stores a computer program, and the processor implements the steps of the above method when executing the computer program. The above device can implement the above methods when its processor executes the computer program.

[0076] In one embodiment, the present disclosure further provides a computer-readable storage medium on which a computer program is stored. When the computer program is executed by a processor, the steps in the above-mentioned method embodiments are implemented.

[0077] The computer readable storage medium implements the steps in the above-mentioned method embodiments when the computer program stored in its memory is executed by the processor.

[0078] Those of ordinary skill in the art can understand that all or part of the processes in the above-mentioned embodiment methods can be completed by instructing the relevant hardware through a computer program, and the computer program can be stored in a non-volatile computer-readable storage medium. When the computer program is executed, it can include the processes of the embodiments of the above-mentioned methods. Among them, any reference to memory, storage, database or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory or optical memory, etc. Volatile memory can include random access memory (RAM) or external cache memory. As an illustration and not limitation, RAM can be in various forms, such as static random access memory (SRAM) or dynamic random access memory (DRAM).

[0079] There are a few points to note:

[0080] (1) The drawings of the embodiments of the present disclosure only relate to the structures related to the embodiments of the present disclosure, and other structures may refer to the general design.

[0081] (2) For the sake of clarity, in the drawings used to describe the embodiments of the present disclosure, the thickness of layers or regions is exaggerated or reduced, that is, these drawings are not drawn according to the actual scale. It is understood that when an element such as a layer, film, region or substrate is referred to as being "on" or "under" another element, the element may be "directly" "on" or "under" the other element or there may be intermediate elements.

[0082] (3) In the absence of conflict, the embodiments of the present disclosure and the features therein may be combined with each other to obtain new embodiments.

[0083] The above are only specific implementations of the present disclosure, but the protection scope of the present disclosure is not limited thereto, and the protection scope of the present disclosure shall be based on the protection scope of the claims.

Claims

1. A crystal rod processing device, characterized in that: include: A clamping unit, configured to clamp and rotate the crystal rod; A first crystal direction detection unit, disposed on one radial side of the crystal rod, and used for performing crystal direction detection on the surface of the crystal rod; A V-groove processing unit is provided on one radial side of the crystal rod, and the V-groove processing unit is used to process a V-groove on the surface of the crystal rod; A second crystal direction detection unit is provided on one radial side of the crystal rod, and the second crystal direction detection unit is used to perform crystal direction detection on the surface of the crystal rod; A control unit is connected to the first crystal direction detection unit, the second crystal direction detection unit, the clamping unit and the V-groove processing unit respectively; wherein the control unit is used to: Based on the crystal direction detection result of the first crystal direction detection unit, controlling the crystal rod to rotate by a preset angle to a crystal direction position of a V-groove to be processed; Based on the crystal direction detection result of the second crystal direction detection unit, the deviation state of the crystal direction position of the to-be-processed V-groove relative to the target V-groove processing crystal direction position is determined.

2. The crystal rod processing device according to claim 1, characterized in that: The V-groove processing unit and the second crystal direction detection unit are located on the same side of the crystal rod.

3. The crystal rod processing device according to claim 2, characterized in that: The crystal rod has a first side and a second side opposite to each other along its radial direction; wherein the V-groove processing unit and the second crystal direction detection unit are located on the first side of the crystal rod, and the first crystal direction detection unit is located on the second side of the crystal rod.

4. The crystal rod processing device according to claim 1, characterized in that: The V-groove processing unit has a processing portion for contacting the surface of the crystal rod to process the V-groove; the second crystal direction detection unit has a detection portion for detecting the crystal direction of the surface of the crystal rod; when the V-groove processing unit is in a target processing position and the second crystal direction detection unit is in a target detection position, the processing portion and the detection portion are on the same horizontal plane.

5. The crystal rod processing device according to claim 1, characterized in that: The V-groove processing unit includes a V-groove grinding wheel and a first moving component. Driven by the first moving component, the V-groove grinding wheel can approach or move away from the surface of the crystal rod along the radial direction of the crystal rod.

6. The crystal rod processing device according to claim 5, characterized in that: The second crystal direction detection unit includes a second crystal direction detector, and the second crystal direction detector is connected to the first moving component so that the second crystal direction detector and the V-groove grinding wheel can move synchronously.

7. The crystal rod processing device according to claim 1, characterized in that: The first crystal direction detection unit includes a first crystal direction detector and a second moving component. The first crystal direction detector is connected to the second moving component. The first crystal direction detector can approach or move away from the surface of the crystal rod along the radial direction of the crystal rod under the drive of the second moving component.

8. The crystal rod processing device according to claim 1, characterized in that: The crystal rod processing device also includes an alarm unit connected to the control unit; wherein the control unit is also used to control the alarm unit to send an alarm signal when it is determined that the actual deviation of the crystal direction position of the V-groove to be processed relative to the target V-groove processing crystal direction position is greater than a deviation threshold.

9. A method for processing a crystal rod, characterized in that: Applied to the crystal rod processing device according to any one of claims 1 to 8, the method comprises: Based on the crystal direction detection result of the first crystal direction detection unit, controlling the crystal rod to rotate by a preset angle to a crystal direction position of a V-groove to be processed; Based on the crystal direction detection result of the second crystal direction detection unit, the deviation state of the crystal direction position of the to-be-processed V-groove relative to the target V-groove processing crystal direction position is determined.

10. An electronic device, characterized in that: The electronic device comprises a memory, a processor, and one or more programs stored in the memory and executable on the processor. When the one or more programs are executed by the processor, the electronic device executes the crystal rod processing method as claimed in claim 9.

Images