Liquid supply apparatus, article manufacturing method, and control method

Abstract

Provided are a liquid supply apparatus, an article manufacturing method, and a control method, which are advantageous in terms of throughput of the liquid supply apparatus that supplies liquid onto a substrate. A liquid supply device for supplying a liquid onto a substrate includes: a head including a discharge element for discharging the liquid as droplets; a control unit that controls a process of supplying the liquid droplets onto the substrate by causing the discharge element to discharge the liquid droplets while moving the substrate in one direction with respect to the head; and a measurement unit that measures the adhesion state of the liquid droplet on the substrate, in which the control unit controls the movement of the substrate such that the substrate is moved without being stopped even after the processing is completed, and the measurement unit measures the adhesion state of the liquid droplet on the substrate. The substrate is stopped at a measurement position at which the adhesion state can be measured by the measurement unit.

Description

Technical Field

[0001] The present invention relates to a liquid supply device, an article manufacturing method, and a control method. Background Art

[0002] In recent years, when manufacturing various functional elements (in Japanese: 機能素子), attempts have been made to form a pattern (patterning) on a substrate using a liquid supply device that supplies (imparts) a liquid, which is a material for the functional element, as droplets onto the substrate by an inkjet method. Patterning using such a liquid supply device enables on-demand patterning, and thus has advantages such as high material utilization efficiency, being a non-vacuum process so that the manufacturing device is relatively small, and being able to coat a large area at high speed. For example, a liquid supply device can be used to manufacture display devices such as flat panel displays.

[0003] In addition, various display methods in display devices have been proposed. In recent years, in particular, the development of display devices using organic EL elements has been actively progressing. Since the organic EL materials used for manufacturing organic EL elements are expensive, a liquid supply device with high material utilization efficiency and capable of coating a large area at high speed is sometimes used. In addition, recently, a color conversion section containing a quantum dot material and a display device having a quantum dot as a light-emitting element have attracted attention. For example, in order to manufacture a color conversion section containing a quantum dot material, a liquid supply device that ejects a liquid such as ink as droplets from ejection holes (nozzles) is sometimes used.

[0004] In a liquid supply device, ejection failure sometimes occurs. For example, due to evaporation of an ink solvent or the like, the ink becomes viscous or air bubbles are mixed into the ejection holes, resulting in the inability to eject droplets from the ejection holes, a change in the ejection amount or ejection speed from the ejection holes, or an ejection angle deviation. If such an ejection abnormality occurs, it is difficult to supply droplets to the substrate with high precision, which may lead to a decrease in the quality of the display device manufactured by the liquid supply device. Patent Documents 1 to 2 disclose the following techniques: measuring the landing position of the ink ejected onto a workpiece and controlling the ejection of the ink based on the measurement result.

[0005] Prior Art Documents

[0006] Patent Documents

[0007] Patent Document 1: Japanese Patent No. 5495528

[0008] Patent Document 2: Japanese Unexamined Patent Application Publication No. 2011-5758 Summary of the Invention

[0009] Problems to be Solved by the Invention

[0010] In a liquid supply device, improvement in throughput is sought, and it is desired to efficiently measure the adhesion state (for example, landing position) of a droplet on a substrate.

[0011] Therefore, an object of the present invention is to provide a technique that is advantageous in terms of throughput of a liquid supply device that supplies liquid onto a substrate.

[0012] Solutions for solving problems

[0013] In order to achieve the above-mentioned purpose, as one aspect of the present invention, a liquid supply device is a liquid supply device for supplying liquid onto a substrate, and is characterized in that it comprises: a nozzle having a spraying element for spraying the liquid in the form of droplets; a control unit, which controls a process of supplying the droplets onto the substrate by causing the spraying element to spray the droplets while moving the substrate in one direction relative to the nozzle; and a measuring unit, which measures the adhesion state of the droplets on the substrate, wherein the control unit controls the movement of the substrate in the following manner: even after the process is completed, the substrate is moved without stopping the substrate, and the substrate is stopped at a measurement position where the adhesion state can be measured by the measuring unit.

[0014] In order to achieve the above-mentioned purpose, in a control method of a liquid supply device which is one aspect of the present invention, the liquid supply device supplies the liquid onto a substrate, the liquid supply device has a nozzle, and the nozzle has a nozzle element for ejecting the liquid in the form of droplets, and the control method is characterized in that it includes: a supply process for supplying the droplets onto the substrate by ejecting the droplets from the nozzle element while moving the substrate in one direction relative to the nozzle; and a measuring process for measuring the adhesion state of the droplets on the substrate after the supply process, wherein the substrate is moved without stopping after the supply process is completed, and the substrate is stopped at a measurement position where the adhesion state can be measured by the measurement process.

[0015] Further objects and other aspects of the present invention will become more apparent from the preferred embodiments described below with reference to the accompanying drawings.

[0016] Effects of the Invention

[0017] According to the present invention, for example, it is possible to provide a technique that is advantageous in terms of throughput of a liquid supply device that supplies liquid onto a substrate. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 It is a diagram showing a configuration example of the liquid supply device according to the first embodiment.

[0019] Figure 2This is a flowchart showing the operation sequence of the liquid supply device.

[0020] Figure 3 It is a schematic diagram showing a structural example of a substrate.

[0021] Figure 4 It is a diagram for explaining the movement of the substrate in the liquid supply device.

[0022] Figure 5 This is a diagram showing an example of the speed arrangement of the substrate from the start of the first supply process until the substrate is arranged at the measurement position.

[0023] Figure 6 This is a diagram showing a state before the first supply process is started in the first embodiment.

[0024] Figure 7 This is a diagram showing a state where the substrate is stopped at the measurement position after the first supply process is completed in the first embodiment.

[0025] Figure 8 This is a diagram showing an example of the adhesion state of ink droplets supplied to the evaluation area by a plurality of supply processes in the first embodiment.

[0026] Fig. 9 This is a diagram showing a state where the substrate is stopped at the measurement position after the first supply process is completed in the first embodiment.

[0027] Fig.10 This is a diagram showing a state where the substrate is stopped at the measurement position after the first supply process is completed in the first embodiment.

[0028] Fig.11 It is a diagram showing a configuration example of a liquid supply device according to a second embodiment.

[0029] Fig.12 This is a diagram showing a state before starting the supply process in the second embodiment.

[0030] Fig.13 This is a diagram showing a state in which the substrate is stopped at the measurement position after the supply process of moving the substrate in the +Y direction relative to the discharge head in the second embodiment is completed.

[0031] Fig.14 This is a diagram showing a state in which the substrate is stopped at the measurement position after the supply process of moving the substrate in the -Y direction relative to the discharge head in the second embodiment is completed.

[0032] Fig.15 This is a diagram showing an example of the adhesion state of ink droplets that are gradually supplied to the evaluation area through a plurality of supply processes in the third embodiment. DETAILED DESCRIPTION

[0033] The following detailed description of the embodiments is given with reference to the accompanying drawings. In addition, the following embodiments do not limit the technical solutions involved in the claims. A plurality of features are described in the embodiments, but these plurality of features are not necessarily all necessary for the invention. In addition, a plurality of features may be combined arbitrarily. In addition, in the accompanying drawings, the same or similar structures are marked with the same reference numerals, and repeated descriptions are omitted.

[0034] In this specification and the accompanying drawings, directions are shown using an XYZ coordinate system, in which a surface parallel to the surface on which the substrate is configured is an XY plane. Directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are set as the X-direction, Y-direction, and Z-direction, respectively, and rotations around the X-axis, around the Y-axis, and around the Z-axis are set as θX, θY, and θZ, respectively. Control and drive (movement) related to the X-axis, Y-axis, and Z-axis respectively represent control or drive (movement) related to the direction parallel to the X-axis, the direction parallel to the Y-axis, and the direction parallel to the Z-axis. In addition, control or drive related to the θX axis, θY axis, and θZ axis respectively represent control or drive related to rotation around an axis parallel to the X-axis, rotation around an axis parallel to the Y-axis, and rotation around an axis parallel to the Z-axis.

[0035] <First Embodiment>

[0036] Reference Figure 1 The basic structure and operating principle of the liquid supply device 1 (liquid ejection device, inkjet device) of the first embodiment of the present invention will be described. The liquid supply device 1 is a device that supplies (imparts) a liquid as a material of a functional unit onto a substrate to form a pattern, and functions as a substrate processing device that processes substrates such as display panels and semiconductors. For example, the liquid supply device 1 can be used to manufacture display devices such as flat panel displays and OLED (Organic Light Emitting Diode) devices. In addition, the liquid supplied to the substrate is used to form a pattern or a film on the substrate, and is sometimes referred to as "ink" below. There is no particular limitation on the composition of the ink. For example, a liquid containing a solvent and a solute for forming an organic film can be used as ink.

[0037] The liquid supply device 1 of the present embodiment may include: a substrate stage 3 that holds and moves the substrate 2; a jet head 5 that has a jet element 51 that jets ink droplets 4; a measuring unit 8 that measures the adhesion state of the ink droplets 4 on the substrate 2; and a control unit 11. The liquid supply device 1 performs the following supply process: the ink droplets 4 are supplied (arranged) onto the substrate 2 by causing the jet head 5 (the jet element 51) to jet the ink droplets 4 while moving the substrate 2 in one direction (the Y direction in the present embodiment) relative to the jet head 5. The supply process is performed once or multiple times on the substrate 2. As a result, a plurality of ink droplets 4 can be supplied onto the substrate 2 in a desired distribution.

[0038] The substrate stage 3 is configured to hold and move a substrate 2 such as a display panel. The substrate stage 3 can also be understood as a substrate driving mechanism that drives the substrate 2. The substrate 2 can be appropriately selected from a glass substrate or a plastic substrate, etc., depending on the target product to be manufactured. The substrate 2 is typically a plate-shaped member, but as long as it can function as a base, it is not limited to a specific shape, for example, it can also be a deformable film, or a circular substrate. The substrate 2 is provided with a pixel area 201 for supplying ink to arrange a large number of display pixels, and an evaluation area 202 to which ink is experimentally supplied in order to evaluate (measure) the adhesion state of the ink. The pixel area 201 is an area (first area) in the substrate 2 where a pattern as a functional unit is to be formed. The evaluation area 202 is an area (second area) adjacent to the pixel area 201 in the moving direction of the substrate 2 during the supply process.

[0039] The ejection head 5 is configured to eject ink droplets 4 toward the substrate 2. The ejection head 5 has a plurality of ejection elements 51 (ejection units) that eject ink droplets 4 respectively, and the ejection of the ink droplets 4 in each ejection element 51 is independently controlled by the control unit 11. Each ejection element 51 may include, for example, a liquid chamber and a piezoelectric element, wherein the liquid chamber has an ejection hole, and the piezoelectric element applies pressure to the liquid chamber according to a drive signal from the control unit 11, so that the ink droplets 4 are ejected from the ejection hole. By arranging such ejection elements 51 along the X direction and the Y direction, the ink droplets 4 can be supplied to the pixel area 201 of the substrate 2 in a desired distribution. Here, the liquid supply device 1 may further include an ink tank 7 that stores ink and an ink supply system 6 that supplies ink from the ink tank 7 to the ejection head 5. In Figure 1 In the example, the ink tank 7 is disposed inside the liquid supply device 1, but is not limited thereto and may be disposed outside the liquid supply device 1. In addition, the liquid supply device 1 may also include a recovery unit 9 for performing a cleaning process on the ejection nozzle 5 to recover the ejection characteristics.

[0040] The measuring unit 8 is provided on the side of the ejection head 5 in the moving direction of the substrate 2 (substrate mounting table 3) in the supply process, and measures the adhesion state (landing state) of the ink droplets 4 on the substrate 2. The measuring unit 8 has, for example, an imaging unit for photographing the ink droplets 4 on the substrate 2, and measures at least one of the presence, position, and size of the ink droplets 4 on the substrate 2 as the adhesion state of the ink droplets 4 based on the image obtained by the imaging unit. In the case of the present embodiment, in the supply process, the ink droplets 4 are supplied not only to the pixel area 201 of the substrate 2, but also to the evaluation area 202, and the measuring unit 8 measures the adhesion state of the ink droplets 4 on the evaluation area 202 (on the second area) for each ejection element 51. Then, based on the adhesion state of the ink droplets 4 on the evaluation area 202 measured by the measuring unit 8, the control unit 11 evaluates the substrate 2 supplied with the ink droplets 4 by the ejection head 5 and / or detects abnormalities of each ejection element 51 in the ejection head 5. Furthermore, in the present embodiment, the evaluation area 202 is provided on the substrate 2 , but the present invention is not limited thereto, and the evaluation area 202 may be provided on the substrate mounting table 3 (for example, at a position outside the substrate 2 ).

[0041] Here, a placement error may occur when the substrate 2 is mounted on the substrate stage 3. In addition, since the substrate 2 undergoes various manufacturing processes, the substrate 2 may be distorted in shape in the XY direction. Therefore, the liquid supply device 1 may also include an alignment mirror (not shown) for measuring the position and skewness of the substrate 2. In addition, the substrate 2 held by the substrate stage 3 has a thickness deviation. If the ink droplets 4 are ejected from the ejection nozzle 5 while the substrate stage 3 is moved, the attachment position (landing position) of the ink droplets 4 on the substrate 2 may deviate due to the thickness deviation of the substrate 2. Therefore, the liquid supply device 1 may also include a height sensor (not shown) for measuring the position (height) of the substrate 2 in the Z direction.

[0042] The control unit 11 is composed of a computer (information processing device) having a processor such as a CPU (Central Processing Unit) and a storage unit such as a memory, and controls each unit of the liquid supply device 1 to uniformly control the patterning on the substrate 2. The control unit 11 of this embodiment can control the ejection of ink droplets 4 from each ejection element 51 of the ejection nozzle 5, the measurement of the adhesion state of the ink droplets 4 on the substrate 2 by the measuring unit 8, and the movement of the substrate 2 (substrate mounting table 3). In addition, the control unit 11 can also be composed of, for example, a PLD (Programmable Logic Device) such as FPGA (Field Programmable Gate Array), or an ASIC (Application Specific Integrated Circuit), or a general-purpose computer in which a program is programmed, or a combination of all or part of them.

[0043] Next, refer to Figure 2 The operation sequence of the liquid supply device 1 will be described. Figure 2 It is a flowchart showing the operation sequence of the liquid supply device 1 . Figure 2 The flowchart can be executed by the control unit 11.

[0044] In step S101, the control unit 11 controls the substrate conveying device (not shown) to carry the substrate 2 into the liquid supply device 1. Specifically, the control unit 11 controls the substrate conveying device (not shown) to carry the substrate 2 onto the substrate mounting table 3, so that the substrate mounting table 3 holds the substrate 2. Next, in step S102, the control unit 11 performs a recovery determination on each ejection element 51 of the ejection nozzle 5. In the recovery determination, it is determined whether an ejection abnormality has occurred in each ejection element 51 of the ejection nozzle 5, that is, it is determined whether a recovery process is required for each ejection element 51. When there is an ejection element 51 that is determined to have an ejection abnormality in the recovery determination, the process proceeds to step S103, and the control unit 11 performs a recovery process on each ejection element 51 of the ejection nozzle 5. The recovery process can include, for example, a process of restoring the ejection characteristics of the ejection nozzle 5 by performing a cleaning process on the ejection nozzle 5 by the recovery unit 9.

[0045] In step S104, the control unit 11 uses an alignment mirror (not shown) to measure the position and skew amount of the substrate 2 (alignment measurement). When the alignment measurement is performed on the entire surface of the substrate 2, the substrate stage 3 is used to move the substrate 2 relative to the alignment mirror. Next, in step S105, the control unit 11 uses a height sensor (not shown) to measure the height of the substrate 2. When the height measurement is performed on the entire surface of the substrate 2, the substrate stage 3 is used to move the substrate 2 relative to the height sensor. In addition, the order of the alignment measurement in step S104 and the height measurement in step S105 may also be reversed. The information related to the position, skew amount, and height of the substrate 2 obtained by the alignment measurement and the height measurement is stored in, for example, a memory in the control unit 11.

[0046] In step S106, the control unit 11 generates ejection control information based on information indicating the target supply distribution of the ink droplets 4 in the pixel area 201 and the evaluation area 202 of the substrate 2, in addition to the information obtained by the alignment measurement and the height measurement. The ejection control information is the movement configuration (profile) of the substrate 2 (substrate mounting table 3) in the supply process and the information for specifying the ejection timing of the ink droplets 4 ejected from the ejection nozzle 5 (each ejection element 51). The movement configuration of the substrate 2 can include, for example, the position configuration, speed configuration, acceleration configuration, etc. of the substrate 2. In addition, the target supply distribution can be generated based on pixel data, which includes information such as the pixel configuration formed on the substrate and the size of the pixels.

[0047] In step S107, the control unit 11 performs recovery determination on each ejection element 51 of the ejection head 5. If there is an ejection element 51 that is determined to be ejecting abnormally in the recovery determination, the process proceeds to step S108, and the control unit 11 performs recovery processing on each ejection element 51 of the ejection head 5. Steps S107 to S108 are the same steps as the above-mentioned steps S102 to S103.

[0048] In step S109, the control unit 11 performs a supply process on the substrate 2. As described above, the supply process is a process of supplying ink droplets 4 onto the substrate 2 by causing each ejection element 51 to eject ink droplets 4 while moving the substrate 2 in one direction relative to the ejection nozzle 5, and the supply process is performed based on the ejection control information generated in step S106. Through such a supply process, a large number of functional units (pixels) obtained by respectively supplying ink droplets 4 can be formed on the substrate 2. Figure 3 2 is a schematic diagram showing a structural example of the substrate 2. Figure 3As shown, a pixel area 201 to which ink droplets 4 are supplied to form a large number of functional units 102 (patterns) and an evaluation area 202 to which ink droplets 4 are experimentally supplied in order to evaluate (measure) the adhesion state of the ink droplets 4 are provided on the surface 101 of the substrate. The evaluation area 202 is arranged adjacent to the pixel area 201 in the moving direction (Y direction) of the substrate 2 during the supply process. In addition, Figure 3 This is a schematic diagram and therefore only 7×5 functional units 102 are shown, but in practice a much larger number of functional units can be formed.

[0049] In step S110, the control unit 11 causes the measuring unit 8 to measure the adhesion state of the ink droplets 4 in the evaluation area 202 of the substrate 2 after the supply process (measurement process). Next, in step S111, the control unit 11 evaluates the supply process based on the measurement result of the measuring unit 8 in step S110. The evaluation of the supply process can include the evaluation of the substrate 2 to which the ink droplets 4 are supplied through the ejection nozzle 5 and / or the detection of abnormalities of each ejection element 51 in the ejection nozzle 5. The subsequent recovery determination (step S107) can also be performed based on the evaluation result in this step S111.

[0050] In step S112, the control unit 11 determines whether the predetermined number of supply processes have been completed for the substrate 2. If the predetermined number of supply processes have not been completed, the process returns to step S107. If the predetermined number of supply processes have been completed, the process proceeds to step S113. In step S113, the control unit 11 controls a substrate transport device (not shown) to remove the substrate 2 from the liquid supply device 1 (on the substrate mounting table 3).

[0051] In addition, in the liquid supply device 1, it is sought to improve the throughput and it is desired to efficiently measure the adhesion state of the ink droplets 4 in the evaluation area 202 of the substrate 2. Specifically, if the time required from the end of the supply process (S109) to the start of the measurement (S110) of the adhesion state of the ink droplets 4 in the evaluation area 202 can be shortened, it can be advantageous in terms of the throughput of the liquid supply device 1. Therefore, the liquid supply device 1 of the present embodiment controls the movement of the substrate 2 in the following manner: even after the supply process is completed, the substrate 2 (substrate mounting table 3) is moved without stopping the substrate 2 (substrate mounting table 3), and the substrate 2 is stopped at a measurement position where the adhesion state of the ink droplets 4 in the evaluation area 202 can be measured by the measuring unit 8.

[0052] Figure 4It is a figure used to illustrate the movement of the substrate 2 (substrate mounting table 3) in the liquid supply device 1 of the present embodiment. Below, an example of performing multiple supply processes (S109) on the substrate 2 is described, but the substrate 2 may also be subjected to only one supply process. The multiple supply processes may include a first supply process for moving the substrate 2 in the +Y direction (first direction) relative to the ejection nozzle 5 and a second supply process for moving the substrate 2 in the -Y direction (second direction opposite to the first direction) relative to the ejection nozzle 5. The first supply process may also be understood as the nth supply process, and the second supply process may also be understood as the (n+1)th supply process performed following the first supply process. In addition, between the first supply process and the second supply process, the following measurement process is performed: the adhesion state of the ink droplets 4 in the evaluation area 202 of the substrate 2 after the first supply process is measured by the measuring unit 8 (S110).

[0053] Figure 4 (a) shows a situation in which the first supply process is being performed. In the first supply process, while the substrate 2 is moved in the +Y direction (first direction) relative to the ejection nozzle 5 by the substrate stage 3, each ejection element 51 ejects ink droplets 4 to supply the ink droplets 4 to the pixel area 201 and the evaluation area 202 in the substrate 2. After the first supply process is completed, the measurement process is performed. Figure 4 (b) shows a situation in which the measurement process is being performed. In the measurement process, the substrate 2 (substrate stage 3) is arranged at a measurement position where the adhesion state of the ink droplets 4 on the evaluation area 202 of the substrate 2 can be measured by the measurement unit 8, and the measurement unit 8 measures the adhesion state of the ink droplets 4 in the evaluation area 202. The measurement position can also be understood as stopping the substrate 2 (substrate stage 3) within the measurement range (photographing field of view) of the measurement unit 8 to configure the target stop position of the ink droplets 4 on the evaluation area 202. The measurement position can be determined based on the ejection control information (target supply distribution) generated in the above-mentioned step S106.

[0054] Here, in the liquid supply device 1 of the present embodiment, the substrate 2 (substrate stage 3) is continuously moved in the +Y direction (first direction) without stopping the substrate 2 (substrate stage 3) even after the first supply process is completed, and the substrate 2 is stopped at the measurement position for the measurement process. That is, the substrate 2 (substrate stage 3) is moved without stopping from the start of the first supply process until the substrate 2 is arranged at the measurement position. The measurement position can be set on a line (straight line) obtained by linearly extending the movement path (moving direction) of the substrate 2 in the first supply process. Thus, the adhesion state of the ink droplets 4 supplied to the evaluation area 202 can be efficiently measured after the first supply process is completed, which can be advantageous in terms of throughput.

[0055] Figure 5 FIG. 2 shows an example of the speed configuration of the substrate 2 (substrate mounting table 3) from the start of the first supply process until the substrate 2 is arranged at the measurement position. Figure 5 In FIG. 1 , the horizontal axis represents the position of the substrate 2 in the Y direction, and the vertical axis represents the moving speed of the substrate 2. Figure 5 In the example (a), the supply of ink droplets 4 to the evaluation area 202 is performed during the uniform movement of the substrate 2. After the supply of ink droplets to the evaluation area 202 is completed, the substrate 2 is decelerated and the substrate 2 is placed at the measurement position. Figure 5 In the example of (b), the supply of the ink droplets 4 to the evaluation area 202 is performed during the deceleration period of the substrate 2, and the substrate 2 is arranged at the measurement position.

[0056] In addition, the measurement results in the measurement process can be used to evaluate the first supply process in the above-mentioned step S111. The evaluation of the first supply process can include the evaluation of the substrate 2 to which the ink droplets 4 are supplied through the ejection head 5 and / or the detection of abnormalities of each ejection element 51 in the ejection head 5. The evaluation of the first supply process can be fed back to the second supply process or to the subsequent supply process for the substrate.

[0057] When the measurement process ends, the second supply process starts. Figure 4 (c) shows a situation where the second supply process is being performed. In the second supply process, while the substrate 2 is moved in the -Y direction (second direction) relative to the ejection nozzle 5 by the substrate stage 3, each ejection element 51 ejects ink droplets 4 to supply the ink droplets 4 to the pixel area 201 and the evaluation area 202 in the substrate 2. In addition, in the case where the ink droplets 4 of the desired volume are supplied to the pixel area 201 with the desired distribution only by the first supply process, the second supply process can also be omitted.

[0058] Next, refer to Figure 6-7 The details of the first supply process and the measurement process will be described. Figure 6-7 The figure schematically shows the discharge head 5 , the measurement range 81 of the measurement unit 8 , the substrate 2 (the pixel region 201 , the evaluation region 202 ), and the substrate stage 3 when the liquid supply device 1 is viewed from above (in the +Z direction).

[0059] Figure 6 The state before starting the first supply process in the liquid supply device 1 of this embodiment is shown. A plurality of ejection elements 51 (ejection holes) are provided in the ejection nozzle head 5. In the first supply process, a part of the plurality of ejection elements 51 can be selected as a specific ejection element 51a that ejects ink droplets 4 onto the substrate 2.

[0060] The liquid supply device 1 supplies ink droplets 4 onto the substrate 2 through a specific ejection element 51a selected from a plurality of ejection elements 51 in the ejection head 5 while moving the substrate 2 (substrate mounting table 3) relative to the ejection head 5. The specific ejection element 51a can be selected and controlled to supply the ink droplets 4 to a target supply position on the substrate 2. The target supply position refers to a position in the pixel area 201 and the evaluation area 202 of the substrate 2 to which the ink droplets 4 are to be supplied. In the pixel area 201, the target supply position can be set in each functional unit 102.

[0061] The specific ejection element 51a to be used for the first supply process and the droplet ejection timing of each specific ejection element 51a for supplying the ink droplets 4 to the target supply position on the substrate 2 are specified based on the ejection control information generated in the above-mentioned step S106. In addition, as described above, in the present embodiment, the ejection of the ink droplets 4 from each specific ejection element 51a to the evaluation area 202 of the substrate 2 can also be performed during the uniform speed movement or deceleration period of the substrate 2 (substrate mounting table 3). As a result, the degree of freedom in setting the droplet ejection timing of each specific ejection element 51a can be increased.

[0062] Figure 7 The state in which the substrate 2 (substrate stage 3) is stopped at the measurement position after the first supply process in the liquid supply device 1 of the present embodiment is shown. In the liquid supply device 1 of the present embodiment, as described above, even after the first supply process is completed, the substrate 2 (substrate stage 3) is continued to move in the +Y direction (first direction) without stopping the substrate 2 (substrate stage 3), and the substrate 2 is stopped at the measurement position for the measurement process. Thus, compared with the case in which the substrate 2 is temporarily stopped at the end of the first supply process and then moved to the measurement position, the adhesion state of the ink droplets 4 in the evaluation area 202 can be efficiently measured. In addition, as Figure 7 As shown in FIG. 1 , the measurement process is performed in a state where the substrate 2 is stopped at the measurement position. Then, based on the measurement result in the measurement process, the first supply process is evaluated.

[0063] Next, the evaluation of the supply process will be described. Figure 7 , the adhesion state of the ink droplets 4 supplied to the evaluation area 202 of the substrate 2 through a single supply process (first supply process) is shown, but the adhesion state of the ink droplets 4 supplied to the evaluation area 202 of the substrate 2 through multiple supply processes is described here. Figure 8 FIG. 2 shows an example of the adhesion state of the ink droplets 4 supplied to the evaluation area 202 through multiple supply processes. Figure 8As shown, the multiple supply processes can be controlled so that the positions of the ink droplets 4 respectively supplied to the evaluation area 202 by the multiple supply processes are different from each other in the moving direction (Y direction) of the substrate 2.

[0064] Figure 8 (a) shows the evaluation area 202 of the substrate 2 after the p-th supply process. In the p-th supply process, control is performed to supply the ink droplets 4 to the first target supply position P1 of the evaluation area 202 in the moving direction (Y direction) of the substrate 2. Moreover, after the p-th supply process is completed, the substrate 2 is also allowed to continue to move without stopping the substrate 2, and the substrate 2 is stopped in a manner that the ink droplets 4a supplied to the first target supply position P1 of the evaluation area 202 converge within the measurement range 81 of the measurement unit 8. In this case, the position of the substrate 2 (substrate mounting table 3) that can make the ink droplets 4a supplied to the first target supply position P1 of the evaluation area 202 converge within the measurement range 81 of the measurement unit 8 is set as the "measurement position". The control unit 11 can evaluate the p-th supply process based on its measurement result by causing the measurement unit 8 to measure the adhesion state of the ink droplets 4 at the first target supply position P1 in this state. In addition, the evaluation of the p-th supply process may be fed back to the subsequent supply process, or may be simply stored in the storage unit of the control unit 11 .

[0065] Figure 8 (b) shows the evaluation area 202 of the substrate 2 after the qth (q>p) supply process. In the qth supply process, control is performed to supply the ink droplets 4 to the second target supply position P2 of the evaluation area 202 in the moving direction (Y direction) of the substrate 2. Moreover, after the qth supply process is completed, the substrate 2 is also allowed to continue to move without stopping the substrate 2, and the substrate 2 is stopped in a manner that the ink droplets 4b supplied to the second target supply position P2 of the evaluation area 202 converge within the measurement range 81 of the measurement unit 8. In this case, the position of the substrate 2 (substrate mounting table 3) that can make the ink droplets 4b supplied to the second target supply position P2 of the evaluation area 202 converge within the measurement range 81 of the measurement unit 8 is set as the "measurement position". The control unit 11 can evaluate the qth supply process based on its measurement result by causing the measurement unit 8 to measure the adhesion state of the ink droplets 4 at the second target supply position P2 in this state. In addition, the evaluation of the q-th supply process may be fed back to the subsequent supply process, or may be simply stored in the storage unit of the control unit 11 .

[0066] Figure 8(c) shows the evaluation area 202 of the substrate 2 after the r-th (r>q) supply process. In the r-th supply process, control is performed to supply the ink droplets 4 to the third target supply position P3 of the evaluation area 202 in the moving direction (Y direction) of the substrate 2. Moreover, after the r-th supply process is completed, the substrate 2 is also allowed to continue to move without stopping the substrate 2, and the substrate 2 is stopped in a manner that the ink droplets 4c supplied to the third target supply position P3 of the evaluation area 202 converge within the measurement range 81 of the measurement unit 8. In this case, the position of the substrate 2 (substrate mounting table 3) that can make the ink droplets 4c supplied to the third target supply position P3 of the evaluation area 202 converge within the measurement range 81 of the measurement unit 8 is set as the "measurement position". The control unit 11 can evaluate the r-th supply process based on its measurement result by causing the measurement unit 8 to measure the adhesion state of the ink droplets 4 at the third target supply position P3 in this state. In addition, the evaluation of the r-th supply process may be fed back to the subsequent supply process, or may be simply stored in the storage unit of the control unit 11 .

[0067] Like this, in Figure 8 In the example, the target supply position of the evaluation area 202 is changed in each supply process. Moreover, the measurement position at which the substrate 2 is stopped in order to measure the adhesion state of the ink droplets 4 by the measuring unit 8 is changed according to the target supply position of the evaluation area 202 in each supply process. According to this example, the adhesion state (at least one of the presence, position and size of the ink droplets 4) can be measured for each ink droplet 4 supplied to the evaluation area 202, so the supply process can be evaluated with high accuracy. In addition, it is also possible to measure again the adhesion state of the ink droplets 4 supplied to the evaluation area 202 in the past supply process, for example, to measure again the adhesion state of the ink droplets 4 supplied to the evaluation area 202 in the pth supply process after the rth supply process.

[0068] Next, refer to Figure 9-10 As described above, the evaluation of the supply process may include the evaluation of the substrate 2 to which the ink droplets 4 are supplied by the ejection head 5 and / or the detection of abnormalities in the ejection elements 51 in the ejection head 5 .

[0069] Fig. 9 and Figure 7Similarly, the state in which the substrate 2 (substrate mounting table 3) is stopped at the measurement position after the first supply process is completed is shown. It is assumed that the result of the measurement unit 8 measuring the adhesion state of the ink droplets 4 in the evaluation area 202 in this state is that the ink droplets 4 corresponding to one specific ejection element 51ax in the specific ejection element 51a are not measured. In this case, the control unit 11 can detect the specific ejection element 51ax as an ejection element 51 with an ejection abnormality (no ejection) of the ink droplets 4 based on the measurement result of the measurement unit 8. In addition, the control unit 11 can estimate that the ink droplets 4 are not supplied at the target supply position (functional unit 102x) of the pixel area 201 where the ink droplets 4 are to be supplied using the specific ejection element 51ax in which the ejection abnormality is detected. In other words, it can be considered that there is a substrate 2 at the target supply position (functional unit 102x) where the ink droplets 4 are not supplied in the pixel area 201, and the evaluation of the substrate 2 after the supply process is performed.

[0070] Here, sometimes the size of the ink droplet 4 on the evaluation area 202 measured by the measuring unit 8 is smaller than the threshold value. In this case, the control unit 11 can also detect the specific ejection element 51a corresponding to the ink droplet 4 as an ejection element 51 having an ejection abnormality (insufficient ejection amount) of the ink droplet 4. In addition, the control unit 11 can evaluate the substrate 2 after the supply process by considering that there is a substrate 2 at the target supply position (functional unit 102) where the supply amount of the ink droplet 4 is less than the specified amount in the pixel area 201.

[0071] Fig.10 and Figure 7 Similarly, the state in which the substrate 2 (substrate mounting table 3) is stopped at the measurement position after the first supply process is completed is shown. It is assumed that the result of the measurement unit 8 measuring the adhesion state of the ink droplets 4 on the evaluation area 202 in this state is that the offset dX between the adhesion position of the ink droplets 4 corresponding to one specific ejection element 51ay in the specific ejection element 51a and the target supply position is greater than the specified value. In this case, the control unit 11 can detect the specific ejection element 51ay as an ejection element 51 with an ejection abnormality (ejection misalignment, ejection angle offset) of the ink droplets 4 based on the measurement result of the measurement unit 8. In addition, the control unit 11 can estimate that the ink droplets 4 supplied using the specific ejection element 51ay in which the ejection abnormality is detected are attached in a manner that is offset relative to the target supply position (functional unit 102y) of the pixel area 201. In other words, it can be considered that the substrate 2 with an offset in the adhesion position of the ink droplets 4 in the pixel area 201 is evaluated for the substrate 2 after the supply process.

[0072] The evaluation result of the supply process can be stored in the storage unit of the control unit 11. In the case where the supply process is performed multiple times, the evaluation result of the supply process can also be stored in the storage unit for each supply process. For the substrate 2 evaluated as not supplying the ink droplets 4 at the target supply position in the pixel area 201, the supply of the ink droplets 4 of the entire substrate can also be determined as poor, and the substrate 2 can be disposed of by discarding or the like. In addition, the ejection element 51 detected with ejection abnormality can also be set as an unusable ejection element so that it is not used in the subsequent supply process.

[0073] As described above, the liquid supply device 1 of this embodiment moves the substrate 2 without stopping the substrate 2 even after the supply process is completed, and stops the substrate 2 at a measurement position where the adhesion state of the ink droplets 4 in the evaluation area 202 can be measured by the measuring unit 8. Thus, the adhesion state of the ink droplets 4 in the evaluation area 202 can be efficiently measured by the measuring unit 8 after the supply process is completed, which is advantageous in terms of throughput.

[0074] <Second Embodiment>

[0075] A second embodiment of the present invention is described. In this embodiment, an example is described in which a plurality of measuring parts 8 are provided in a liquid supply device 1 and a plurality of evaluation areas 202 are provided in a substrate 2. In addition, this embodiment is basically inherited from the first embodiment, and therefore, the first embodiment can be followed except for the matters mentioned below. The matters different from the first embodiment are described below.

[0076] Fig.11 : is a diagram showing a structural example of the liquid supply device 1 of the present embodiment. The substrate 2 includes a plurality of evaluation areas 202a to 202b configured to clamp the pixel area 201 in the moving direction (Y direction) of the substrate 2 during the supply process. In addition, the liquid supply device 1 of the present embodiment has a plurality of measuring parts 8a to 8b configured to clamp the ejection nozzle 5 in the moving direction (Y direction) of the substrate 2 during the supply process. The measuring part 8a can be used to measure the adhesion state of the ink droplets 4 supplied to the evaluation area 202a in the supply process of moving the substrate 2 in the +Y direction relative to the ejection nozzle 5. The measuring part 8b can be used to measure the adhesion state of the ink droplets 4 supplied to the evaluation area 202b in the supply process of moving the substrate 2 in the -Y direction relative to the ejection nozzle 5. The supply process of moving the substrate 2 in the +Y direction relative to the ejection nozzle 5 and the supply process of moving the substrate 2 in the -Y direction relative to the ejection nozzle 5 can be implemented alternately. In addition, the evaluation areas 202 a to 202 b are not limited to being arranged on the substrate 2 , but may be arranged on the substrate mounting table 3 .

[0077] Fig.12The state before starting the supply process in the liquid supply device 1 of this embodiment is shown. A plurality of discharge elements 51 (discharge holes) are provided in the discharge head 5. During the supply process, a part of the plurality of discharge elements 51 can be selected as a specific discharge element 51a for discharging ink droplets 4 onto the substrate 2.

[0078] First, the liquid supply device 1 supplies ink droplets 4 onto the substrate 2 through a specific ejection element 51a selected from a plurality of ejection elements 51 in the ejection head 5 while moving the substrate 2 (substrate mounting table 3) in the +Y direction (first direction) relative to the ejection head 5. The specific ejection element 51a can be selected and controlled to supply the ink droplets 4 to a target supply position on the substrate 2. The target supply position refers to a position in the pixel area 201 and the evaluation areas 202a to 202b of the substrate 2 to which the ink droplets 4 are to be supplied. In the pixel area 201, the target supply position can be set within each functional unit 102.

[0079] Fig.13 The state in which the substrate 2 is stopped at the measurement position after the supply process of moving the substrate 2 in the +Y direction relative to the ejection nozzle 5 is completed is shown. In the present embodiment, the substrate 2 (substrate mounting table 3) is continued to move in the +Y direction (first direction) without stopping the substrate 2 (substrate mounting table 3) even after the supply process is completed, and the substrate 2 is stopped at the measurement position in which the evaluation area 202a is measured by the measuring unit 8a. That is, the substrate 2 is stopped at the measurement position in which the ink droplets 4 supplied to the evaluation area 202a are arranged within the measurement range 81a of the measuring unit 8a. Thus, compared with the case in which the substrate 2 is temporarily stopped at the end of the supply process, the adhesion state of the ink droplets 4 in the evaluation area 202a can be efficiently measured. In addition, as Fig.13 As shown in FIG. 1 , the evaluation area 202a is subjected to measurement processing in a state where the substrate 2 is stopped at the measurement position. Then, based on the measurement result in the measurement processing, the supply processing is evaluated.

[0080] Next, the liquid supply device 1 supplies ink droplets 4 onto the substrate 2 through a specific ejection element 51a selected from a plurality of ejection elements 51 in the ejection head 5 while moving the substrate 2 (substrate mounting table 3) in the -Y direction (second direction) relative to the ejection head 5. The specific ejection element 51a can be selected and controlled to supply the ink droplets 4 to a target supply position on the substrate 2.

[0081] Fig.14The state in which the substrate 2 is stopped at the measurement position after the supply process of moving the substrate 2 in the -Y direction relative to the ejection nozzle 5 is completed is shown. In the present embodiment, the substrate 2 (substrate mounting table 3) is continued to move in the -Y direction (second direction) without stopping the substrate 2 (substrate mounting table 3) even after the supply process is completed, and the substrate 2 is stopped at the measurement position in which the evaluation area 202b is measured by the measuring unit 8b. That is, the substrate 2 is stopped at the measurement position in which the ink droplets 4 supplied to the evaluation area 202b are arranged within the measurement range 81b of the measuring unit 8b. Thus, compared with the case in which the substrate 2 is temporarily stopped at the end of the supply process, the adhesion state of the ink droplets 4 in the evaluation area 202b can be efficiently measured. In addition, as Fig.14 As shown in FIG. 1 , the evaluation area 202b is subjected to measurement processing in a state where the substrate 2 is stopped at the measurement position. Then, based on the measurement result in the measurement processing, the supply processing is evaluated.

[0082] Furthermore, the liquid supply device 1 may supply the ink droplets 4 onto the substrate 2 through a specific ejection element 51a selected from a plurality of ejection elements 51 in the ejection head 5 while moving the substrate 2 (substrate mounting table 3) in the +Y direction relative to the ejection head 5. The supply process and the measurement process in this case use Fig.13 As mentioned above, the description here is omitted.

[0083] Here, in the case of the present embodiment, it is also possible to perform measurement processing on only one of the evaluation areas 202a to 202b using only one of the measurement units 8a to 8b. In this case, the ink droplets 4 supplied in the supply processing of moving the substrate 2 in the +Y direction relative to the ejection nozzle 5 and the ink droplets 4 supplied in the supply processing of moving the substrate 2 in the -Y direction relative to the ejection nozzle 5 are attached to the evaluation area to be measured. Therefore, in the measurement processing using any one of the measurement units 8a to 8b, the adhesion state of the ink droplets 4 supplied to the evaluation area through multiple supply processings with different moving directions of the substrate 2 can be measured at the same time. In other words, the evaluation of multiple supply processings with different moving directions of the substrate 2 can be performed at the same time.

[0084] As described above, in the present embodiment, for each of the multiple supply processes in which the moving directions of the substrate 2 are different from each other, the substrate 2 is moved without being stopped after the supply process is completed, and the substrate 2 is stopped at the measurement position. In the present embodiment, as in the first embodiment, the adhesion state of the ink droplets 4 in the evaluation area 202 can be efficiently measured by the measuring unit 8, so that it can be advantageous in terms of throughput.

[0085] <Third Embodiment>

[0086] A third embodiment of the present invention will be described. This embodiment is basically a successor to the first embodiment, and can be implemented in accordance with the first embodiment except for the following matters. In addition, this embodiment can also be applied to the second embodiment.

[0087] Fig.15 FIG. 2 shows an example of the adhesion state of ink droplets 4 which are gradually supplied to the evaluation area 202 through multiple supply processes. Fig.15 As shown, multiple supply processes can be controlled so that the positions of the ink droplets 4 respectively supplied to the evaluation area 202 through the multiple supply processes overlap with each other.

[0088] Fig.15 (a) shows the evaluation area 202 of the substrate 2 after the p-th supply process. In the p-th supply process, control is performed to supply ink droplets 4 to the target supply position of the evaluation area 202. Moreover, after the p-th supply process is completed, the substrate 2 is also continued to move without stopping the substrate 2, and the substrate 2 is stopped in a manner that the ink droplets 4a supplied to the target supply position of the evaluation area 202 converge within the measurement range 81 of the measurement unit 8. In this case, the position of the substrate 2 (substrate mounting table 3) that can make the ink droplets 4 supplied to the target supply position of the evaluation area 202 converge within the measurement range 81 of the measurement unit 8 is set as the "measurement position". The control unit 11 can evaluate the p-th supply process based on its measurement results by causing the measurement unit 8 to measure the adhesion state of the ink droplets 4 in the evaluation area 202 in this state. In addition, the evaluation of the p-th supply process can be fed back to the subsequent supply process, or it can be simply stored in the storage unit of the control unit 11.

[0089] Fig.15 (b) shows the evaluation area 202 of the substrate 2 after the qth (q>p) supply process. In the qth supply process, control is performed to supply the ink droplets 4 to the target supply position of the evaluation area 202 that is the same as the pth supply process. Moreover, after the qth supply process is completed, the substrate 2 is also allowed to continue to move without stopping the substrate 2, and the substrate 2 is stopped in a manner that the ink droplets 4 supplied to the target supply position of the evaluation area 202 converge within the measurement range 81 of the measurement unit 8. The control unit 11 can evaluate the qth supply process based on its measurement results by causing the measurement unit 8 to measure the adhesion state of the ink droplets 4 in the evaluation area 202 in this state. In addition, the evaluation of the qth supply process can be fed back to the subsequent supply process, or it can be simply stored in the storage unit of the control unit 11.

[0090] Fig.15(c) shows the evaluation area 202 of the substrate 2 after the r-th (r>q) supply process. In the r-th supply process, control is performed to supply the ink droplets 4 to the target supply position of the evaluation area 202 that is the same as the p-th and q-th supply processes. Moreover, after the r-th supply process is completed, the substrate 2 is also continued to move without stopping the substrate 2, and the substrate 2 is stopped in a manner that the ink droplets 4 supplied to the target supply position of the evaluation area 202 converge within the measurement range 81 of the measurement unit 8. The control unit 11 can evaluate the r-th supply process based on its measurement results by causing the measurement unit 8 to measure the adhesion state of the ink droplets 4 in the evaluation area 202 in this state. In addition, the evaluation of the r-th supply process can be fed back to the subsequent supply process, or it can be simply stored in the storage unit of the control unit 11.

[0091] Here, in the case of the present embodiment, in the qth supply process and the rth supply process, the ink droplet 4 is supplied to the target supply position of the evaluation area 202 which is the same as that of the pth supply process. Therefore, in the measurement process performed after the qth supply process and the measurement process performed after the rth supply process, the same "measurement position" as that of the measurement process performed after the pth supply process is used. In addition, the ink droplet 4 supplied to the evaluation area 202 after the qth supply process is only larger in size than the ink droplet 4 supplied to the evaluation area 202 after the pth supply process. Similarly, the ink droplet 4 supplied to the evaluation area 202 after the rth supply process is only larger in size than the ink droplet 4 supplied to the evaluation area 202 after the qth supply process. Therefore, in the present embodiment, it is difficult to accurately measure the offset between the attachment position of the ink droplet 4 and the target supply position as the attachment state of the ink droplet 4 by the measuring unit 8, but it is effective from the perspective of reducing the area of ​​the evaluation area 202.

[0092] <Implementation Method of Article Manufacturing Method>

[0093] The article manufacturing method in the embodiment of the present invention is preferred for manufacturing articles such as panels for displays such as organic EL, micro devices such as semiconductor devices, and components with fine structures. The article manufacturing method of this embodiment includes the following steps: a supply step, using the above-mentioned liquid supply device (liquid supply method) to supply liquid to the substrate; a processing step, processing the substrate supplied with liquid through the supply step; and manufacturing the article based on the substrate processed through the processing step. In addition, the related article manufacturing method includes other well-known steps (baking, cooling, cleaning, oxidation, film formation, evaporation, doping, flattening, etching, resist stripping, cutting, bonding, packaging, etc.). Compared with previous methods, the article manufacturing method of this embodiment is advantageous in at least one aspect of the performance, quality, productivity, and production cost of the article.

[0094] The present invention is not limited to the above-described embodiments, and various changes and modifications can be made without departing from the spirit and scope of the invention. Therefore, claims are appended to disclose the scope of the invention.

[0095] Description of Reference Numerals

[0096] 1: liquid supply device; 2: substrate; 201: pixel area; 202: evaluation area; 3: substrate mounting table; 5: ejection nozzle; 51: ejection element; 8: measurement unit; 11: control unit.

Claims

1. A liquid supply device for supplying liquid onto a substrate, wherein the liquid supply device comprises: a spray head having a spray element for spraying the liquid in the form of droplets; a control unit that controls a process of supplying the liquid droplets onto the substrate by causing the discharge element to discharge the liquid droplets while moving the substrate in one direction relative to the discharge head; and a measuring unit that measures the adhesion state of the droplets on the substrate, in, The control unit controls the movement of the substrate so as to move the substrate without stopping the substrate even after the process is completed, and to stop the substrate at a measurement position where the adhesion state can be measured by the measurement unit.

2. The liquid supply device according to claim 1, characterized in that: The substrate includes a first region where a pattern is to be formed and a second region adjacent to the first region in the one direction, In the process, the liquid droplets are supplied to the first region and the second region respectively, The measurement position is a position of the substrate at which the adhesion state of the droplet on the second area can be measured by the measurement unit.

3. The liquid supply device according to claim 2, characterized in that: performing the above treatment on the substrate multiple times, The control unit controls the plurality of processes so that positions of the droplets supplied to the second region in the plurality of processes are different from each other in the one direction.

4. The liquid supply device according to claim 3, characterized in that: The control unit changes the measurement position between the plurality of processes according to the position of the droplet supplied onto the second area in each of the processes.

5. The liquid supply device according to claim 2, characterized in that: performing the above treatment on the substrate multiple times, The control unit controls the plurality of processes so that positions of the droplets respectively supplied to the second region through the plurality of processes overlap with each other.

6. The liquid supply device according to claim 2, characterized in that: The supply of the liquid droplets to the second region in the process is performed during a period of constant speed movement or a period of deceleration of the substrate.

7. The liquid supply device according to claim 1, characterized in that: The control unit causes the measurement unit to measure the adhesion state while stopping the substrate at the measurement position.

8. The liquid supply device according to claim 7, characterized in that: The control unit evaluates the substrate to which the droplets are supplied through the process based on the adhesion state measured by the measurement unit.

9. The liquid supply device according to claim 7, characterized in that: The control unit detects an abnormality of the discharge element based on the adhesion state measured by the measurement unit when the process is completed.

10. The liquid supply device according to claim 1, characterized in that: As the processing, a first processing and a second processing are performed, wherein the first processing is a processing for moving the substrate in a first direction relative to the nozzle, and the second processing is a processing for moving the substrate in a second direction opposite to the first direction relative to the nozzle. The control unit stops the substrate at the measurement position by moving the substrate without stopping the substrate even after the first process is completed, and starts the second process after causing the measurement unit to measure the adhesion state of the droplets on the substrate after the first process.

11. The liquid supply device according to claim 1, characterized in that: The measuring unit measures at least one of the presence, position, and size of the droplet on the substrate as the adhesion state.

12. The liquid supply device according to claim 1, characterized in that: The nozzle has a plurality of ejection elements. The measuring unit measures the adhesion state of the liquid droplets on the substrate after the processing for each of the ejection elements.

13. The liquid supply device according to claim 1, characterized in that: The measuring part is arranged on the side of the nozzle in the one direction.

14. A method for manufacturing an article, characterized in that: include: a supplying step of supplying liquid onto the substrate using the liquid supplying device according to any one of claims 1 to 13; a processing step of processing the substrate to which the liquid has been supplied in the supplying step; as well as The manufacturing step manufactures an article based on the substrate processed in the processing step.

15. A control method for a liquid supply device, wherein the liquid supply device supplies the liquid onto a substrate, the liquid supply device comprising a nozzle, the nozzle having a nozzle element for ejecting the liquid in the form of droplets, the control method comprising: a supplying step of supplying the liquid droplets onto the substrate by causing the discharge element to discharge the liquid droplets while moving the substrate in one direction relative to the discharge head; as well as a measuring step of measuring the adhesion state of the droplets on the substrate after the supplying step, Here, even after the supply step is completed, the substrate is moved without being stopped, and the substrate is stopped at a measurement position where the adhesion state can be measured in the measurement step.

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