Fluorine-containing cooling liquid, application thereof and liquid cooling system

Abstract

The invention provides a fluorine-containing cooling liquid, application thereof and a liquid cooling system, the fluorine-containing cooling liquid comprises a fluorine-containing compound, and the fluorine-containing compound comprises one or more of compounds as shown in a formula 1, a formula 2 and a formula 3; # imgabs 0 #, # imgabs 1 # and # imgabs 2 #; wherein R11, R22 and R33 are respectively and independently selected from methyl; r < 12 >, R < 21 >, R < 31 >, R < 32 > and R < 34 > are independently selected from perfluoroalkyl groups; r13, R23 and R35 are independently selected from-CnF2n-groups and do not contain unsaturated bonds, and n is larger than or equal to 1. The fluorine-containing cooling liquid provided by the invention has high heat dissipation efficiency, the compounds shown in the formula 1, the formula 2 and the formula 3 are not decomposed when heated at high temperature, the stability of the compounds is good, and the problem of corrosion to equipment needing heat dissipation cannot occur.

Description

Technical Field

[0001] The present invention relates to the technical field of refrigerants, and in particular to a fluorine-containing cooling liquid and an application thereof, and a liquid cooling system. Background Art

[0002] (Insulate-Gate Bipolar Transistor—IGBT) Insulated-gate bipolar transistor module IGBT is a core component for energy conversion and transmission, and is widely used in the electronics industry; however, when IGBT is in high-frequency operation, the temperature rise caused by loss will have a drastic impact on its reliability, working characteristics, component life, etc., so it is essential to use external devices to assist in heat dissipation. The cooling technologies of IGBT mainly include air cooling, liquid cooling, heat pipe cooling and phase change boiling cooling. Traditional forced air cooling can no longer meet the heat dissipation requirements of the equipment. The heat dissipation capacity of liquid cooling is 15 to 30 times that of forced air cooling, and is more suitable for use in the heat dissipation system of high-power IGBT.

[0003] Boiling cooling radiators (also called evaporative radiators) have extremely high cooling efficiency due to the use of the potential of phase change. The equivalent thermal conductivity is about 380 times that of solid copper of the same geometric size. Usually, the heat is transferred by the buoyancy caused by the mass transfer of temperature difference in a closed container. Its principle is similar to that of a heat pipe, but it uses gravity instead of capillary action to achieve circulation. So far, the working fluid of boiling cooling is mostly fluoride, which is suitable for occasions that require a limited heating body area to emit a large thermal power and require light weight, such as in subway locomotives and aerospace equipment.

[0004] Boiling cooling radiators can be used in the cooling system of high-power IGBTs to dissipate heat for IGBTs. Most existing boiling cooling radiators use fluorine-containing coolants, which have the advantages of insulation, good compatibility, and high stability, avoiding the risk of circuit failure caused by water. Currently, the fluorine-containing coolants used in evaporative cooling technology and used more frequently include hydrofluoroether products such as nonafluoroisobutyl ether and nonafluorobutyl ether. Among them, nonafluoroisobutyl ether and nonafluorobutyl ether are prone to decomposition when the internal temperature of the component reaches above 175°C, producing substances such as 2,3,3,3-tetrafluoro-2-(trifluoromethyl) propionyl fluoride (CAS: 677-84-9), which will have a corrosion risk to the radiator. Summary of the invention

[0005] In view of the problem that the existing fluorine-containing coolants such as nonafluoroisobutyl ether and nonafluorobutyl ether are prone to decomposition when the temperature reaches above 175°C, posing a risk of corrosion to the radiator, the present application provides a fluorine-containing coolant and its application, and a liquid cooling system.

[0006] In one aspect, the present invention provides a fluorine-containing coolant, comprising a fluorine-containing compound, wherein the fluorine-containing compound comprises one or more of the compounds represented by Formula 1, Formula 2, and Formula 3; , , ; Among them, R 11 , R 22 , R 33 Each independently selected from methyl; R 12 , R 21 , R 31 , R 32 , R 34 Each independently selected from perfluoroalkyl groups; R 13 , R 23 , R 35 Each independently selected from -C n F 2n -group, and does not contain unsaturated bonds, n≥1.

[0007] Preferably, R 12 , R 21 , R 31 , R 32 , R 34 Each independently selected from C1~C5 perfluoroalkyl; R 13 , R 23 , R 35 Each independently selected from -C n F 2n -group, does not contain unsaturated bonds, and n is 1~5.

[0008] Preferably, R 12 Selected from perfluoromethyl, R 13 Selected from -CF2- groups.

[0009] Preferably, R 23 is selected from the group -CF2-CF2-; R 22 Selected from methyl.

[0010] Preferably, R 31 , R 32 , R 34 Each independently selected from perfluoromethyl; R 35 is selected from the group -CF2-; R 33 Selected from methyl.

[0011] Preferably, in the fluorine-containing coolant, the mass percentage of the fluorine-containing compound is ≥99%, the fluorine ion content is <10 ppm, and the water content is <50 ppm.

[0012] In a second aspect, the present application provides an application of the above-mentioned fluorine-containing coolant in the preparation of a liquid cooling medium, wherein the liquid cooling medium is an immersion cooling medium or a pipeline cooling medium, and the liquid cooling medium is used in the fields of data centers, electronics, aerospace, automobiles, trains, photovoltaics or chemical industry.

[0013] In a third aspect, the present application provides a liquid cooling system, including a radiator, wherein the radiator contains the liquid cooling medium described above.

[0014] Preferably, the radiator comprises a boiling cooling radiator, and the radiator is used in the IGBT field.

[0015] The fluorine-containing coolant provided in the present application contains compounds represented by Formula 1, Formula 2, and Formula 3. The saturated vapor pressure of the compound represented by Formula 1 is slightly higher, and the saturated vapor pressure of the compounds represented by Formula 2 and Formula 3 is lower, and has high heat dissipation efficiency. The compounds represented by Formula 1, Formula 2, and Formula 3 do not decompose when heated at high temperatures, and the compounds have good stability and will not cause corrosion to equipment that requires heat dissipation. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The present application provides a saturated vapor pressure-temperature curve diagram of a fluorine-containing coolant - Examples 1-3 and Comparative Examples 1-2; Figure 2 is the GC-MS spectrum of Comparative Example 1 at 175°C; Figure 3 It is a structural schematic diagram of an existing boiling cooling radiator.

[0017] 1. Fan; 2. Condenser; 3. Fluoride chamber; 4. Liquid fluoride; 5. Heat sink; 6. Boiling chamber; 7. Device. DETAILED DESCRIPTION

[0018] In order to make the purpose, technical solution and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0019] In order to illustrate the technical solution of the present invention, specific embodiments are provided below for illustration.

[0020] In a first aspect, the present application provides a fluorine-containing coolant, comprising one or more of the compounds represented by Formula 1, Formula 2, and Formula 3; , , ; Among them, R 11 , R 22 , R33 Each independently selected from methyl; R 12 , R 21 , R 31 , R 32 , R 34 Each independently selected from perfluoroalkyl groups; R 13 , R 23 , R 35 Each independently selected from -C n F 2n -group, and does not contain unsaturated bonds, n≥1.

[0021] Specifically, the alkyl group includes a straight-chain alkyl group and a branched alkyl group, such as a methyl group, an ethyl group, a propyl group, etc., and a branched alkyl group such as an isopropyl group, an isobutyl group, -CH2-CH(CH3)-CH(CH2CH2CH3)-CH3, etc. A perfluoroalkyl group refers to an alkyl group in which all hydrogen atoms are replaced by fluorine atoms, such as a perfluoromethyl group, a perfluoroethyl group, a perfluorobutyl group, etc.

[0022] -C n F 2n -group, and does not contain unsaturated bonds, n≥1, and its structure is in the alkylene (-C n H 2n ) based on a structure in which all hydrogen atoms are replaced by fluorine atoms, wherein the alkylene group does not contain an unsaturated bond; -C n F 2n The -group can be a straight chain or contain a branched structure, such as -CF2-, -CF2-CF2-, -CF2-CF2-CF2-, -CF2-CF2-CF2-CF2-CF2-, -CF2-CF2-CF(CF3)-CF(CF3)-CF2-, etc.

[0023] The fluorine-containing coolant provided by the present application includes a fluorine-containing compound, and the fluorine-containing compound includes one or more of the compounds shown in Formula 1, Formula 2, and Formula 3. In the compounds shown in Formula 1, Formula 2, and Formula 3, the ether bond (-O-) connects a methyl group (-CH3) and a perfluorinated alkyl group, while the ether bond of nonafluoroisobutyl ether connects an ethyl group (-C2H5) and a perfluorinated alkyl group; since the methyl group is smaller and simpler than the ethyl group, this may help reduce stress and unstable interactions in the molecule, thereby improving the stability of the compounds shown in Formulas 1, 2, and 3, and the hydrofluoroether of the methyl ether structure is more stable than the hydrofluoroether of the ethyl ether structure. In the compounds shown in Formulas 1, 2, and 3, the high electronegativity of the fluorine atom can protect the adjacent carbon atoms and reduce their reactivity to electrophilic reagents. The fluorine atom more effectively protects the ether bond, making it more difficult to be chemically attacked, improving the high temperature stability of the compounds shown in Formulas 1, 2, and 3, and not being easily decomposed at high temperatures.

[0024] The fluorine-containing coolant provided in the present application contains compounds represented by Formula 1, Formula 2, and Formula 3. The saturated vapor pressure of the compound represented by Formula 1 is slightly higher, and the saturated vapor pressure of the compounds represented by Formula 2 and Formula 3 is lower, and has high heat dissipation efficiency. The compounds represented by Formula 1, Formula 2, and Formula 3 do not decompose when heated at high temperatures, and the compounds have good stability and will not cause corrosion to equipment that requires heat dissipation.

[0025] The compounds shown in Formula 1, Formula 2 and Formula 3 contain C n F 2n+1 -OC n F 2n -、-C n F 2n -OC n F 2n First, the fluorine atom has a large electronegativity, which will change the distribution of the surrounding electron cloud. This change enhances the mutual attraction between molecules. The fluorine atom more effectively protects the ether bond, making it more difficult to be chemically attacked, and increasing the stability of the compound. n F 2n+1 -OC n F 2n -、-C n F 2n -OC n F 2n The group occupies a certain spatial position in the molecule, and the steric hindrance effect prevents other chemical substances from contacting the chemical bonds or atoms inside the molecule and thus preventing them from reacting, thereby enhancing the stability of the compound.

[0026] In some embodiments, R 12 , R 21 , R 31 , R 32 , R 34 Each independently selected from C1~C5 perfluoroalkyl; R 13 , R 23 , R 35 Each independently selected from -C n F 2n -group, does not contain unsaturated bonds, and n is 1~5.

[0027] Specifically, for R 12 , R 21 , R 31 , R 32 , R 34 , R 13 , R 23 , R 35By limiting the number of carbon atoms and the chain length, the resulting fluorine-containing coolant has higher stability and is not easily decomposed at high temperatures.

[0028] In some embodiments, R 12 Selected from perfluoromethyl, R 13 Selected from -CF2- groups.

[0029] Specifically, R in Formula 1 11 Selected from methyl, R 12 Selected from perfluoromethyl, R 13 Selected from -CF2- group; the obtained compound is defined as compound 1, which is perfluoro-3-oxabutyl methyl ether, and the ether bond (-O-) is connected to a methyl group (-CH3) and a -CF2- group, compared with nonafluoroisobutyl ethyl ether, which is connected to an ethyl group (-C2H5) and a perfluorinated alkyl group. Since the methyl group is smaller and simpler than the ethyl group, this may help reduce stress and unstable interactions in the molecule, thereby improving the stability of perfluoro-3-oxabutyl methyl ether. The hydrofluoroether of the methyl ether structure is more stable than the hydrofluoroether of the ethyl ether structure. The high electronegativity of the fluorine atom can protect the adjacent carbon atoms and reduce their reactivity to electrophilic reagents. In perfluoro-3-oxabutyl methyl ether, the fluorine atom more effectively protects the ether bond, making it more difficult to be chemically attacked.

[0030] Compound 1 contains a CF3-O-CF2- group. The steric hindrance effect prevents other chemical substances from contacting the chemical bonds or atoms inside the molecule and thus preventing reactions. This enhances the stability of the compound represented by compound 1 and makes it difficult to decompose at high temperatures.

[0031] In some embodiments, R 23 is selected from the group -CF2-CF2-; R 22 Selected from methyl.

[0032] Specifically, R in Formula 2 21 Selected from methyl, R 23 is selected from the group -CF2-CF2-, R 22The compound obtained is defined as compound 2, which is perfluoro-3,5-dioxahexyl methyl ether. The ether bond (-O-) is connected to a methyl group (-CH3) and a -CF2-CF2- group. Compared with nonafluoroisobutyl ether, the ether bond is connected to an ethyl group (-C2H5) and a perfluorinated alkyl group. Since the methyl group is smaller and simpler than the ethyl group, this may help reduce stress and unstable interactions in the molecule, thereby improving the stability of perfluoro-3,5-dioxahexyl methyl ether. The high electronegativity of the fluorine atom can protect the adjacent carbon atoms and reduce their reactivity to electrophilic reagents. In perfluoro-3,5-dioxahexyl methyl ether, the fluorine atom more effectively protects the ether bond, making it more difficult to be chemically attacked.

[0033] Compound 2, perfluoro-3,5-dioxahexyl methyl ether, has a lower vapor pressure and a more stable chemical structure while meeting the evaporation heat dissipation effect, greatly reducing the risk of damage to equipment or devices that require heat dissipation. Compound 2 contains a CF3-O-CF2-O-CF2- group, and the steric hindrance effect prevents other chemicals from contacting the chemical bonds or atoms inside the molecule and thus preventing them from reacting, thereby enhancing the stability of the compound shown in Compound 2, which is not easily decomposed at high temperatures.

[0034] In some embodiments, R 31 , R 32 , R 34 Each independently selected from perfluoromethyl; R 35 Selected from -CF2- groups.

[0035] Specifically, R in Formula 3 31 , R 32 , R 34 Each independently selected from perfluoromethyl, R 35 is selected from the group -CF2-, R 33 The compound obtained is defined as compound 3, which is 1,1,1,2,3,4,4-heptafluoro-3-methoxy-4-trifluoromethoxy-2-trifluoromethylbutane, and the ether bond (-O-) is connected to an R 33 The methyl group (-CH3) and the perfluorinated alkyl group are connected to the ether bond of nonafluoroisobutyl ether by an ethyl group (-C2H5) and a perfluorinated alkyl group. Since the methyl group is smaller and simpler than the ethyl group, this may help reduce the stress and unstable interactions in the molecule, thereby improving the stability of compound 3. The high electronegativity of the fluorine atom can protect the adjacent carbon atoms and reduce their reactivity to electrophilic reagents. In compound 3, the fluorine atom more effectively protects the ether bond, making it more difficult to be chemically attacked.

[0036] Compound 3 contains the CF3-O-CF2-O-CF2- group. The steric hindrance effect prevents other chemical substances from contacting the chemical bonds or atoms inside the molecule and thus making it impossible for a reaction to occur. This enhances the stability of the compound represented by compound 3 and makes it difficult to decompose at high temperatures.

[0037] In some embodiments, in the fluorine-containing coolant, the mass percentage of the fluorine-containing compound is ≥99%, the fluorine ion content is <10 ppm, and the water content is <50 ppm.

[0038] Specifically, the fluorine-containing coolant contains not only fluorine-containing compounds, but also other impurities, such as water. In the fluorine-containing coolant provided in the present application, the mass percentage of fluorine-containing compounds is greater than 99%. The fluorine-containing compound content is high and does not decompose at high temperatures. It can improve the heat dissipation efficiency without corroding the equipment that needs heat dissipation.

[0039] The fluorine-containing coolant may contain only the compound shown in Formula 1, or only the compound shown in Formula 2, or only the compound shown in Formula 3, or the compounds shown in Formula 1 and Formula 2, Formula 2 and Formula 3, or Formula 1 and Formula 3; or the fluorine-containing coolant may contain the compounds shown in Formula 1, Formula 2, and Formula 3. Different types or added contents may be selected according to different requirements.

[0040] In a second aspect, the present application provides an application of the above-mentioned fluorine-containing coolant in the preparation of a liquid cooling medium, wherein the liquid cooling medium is an immersion cooling medium or a pipeline cooling medium, and the liquid cooling medium is used in the fields of data centers, electronics, aerospace, automobiles, trains, photovoltaics or chemical industry.

[0041] The liquid cooling medium prepared by the fluorine-containing coolant provided in the present application is an immersion cooling medium or a pipeline cooling medium, which has a wide range of applications and can be used in data center fields, electronics fields, aerospace fields, automotive fields, train fields, photovoltaic fields or chemical fields, as long as it is used for cooling.

[0042] In a third aspect, the present application provides a liquid cooling system, including a radiator, wherein the radiator contains the liquid cooling medium described above.

[0043] The liquid cooling system includes a radiator, the above-mentioned liquid cooling medium is added to the radiator, the liquid cooling medium contains the fluorine-containing coolant provided by the present application, the fluorine-containing coolant contains the compounds shown in Formula 1, Formula 2, and Formula 3, the saturated vapor pressure of the compound shown in Formula 1 is slightly higher, the saturated vapor pressure of the compounds shown in Formula 2 and Formula 3 is lower, and has high heat dissipation efficiency, and the compounds shown in Formula 1, Formula 2, and Formula 3 do not decompose when heated at high temperatures, the compounds have good stability, and will not cause corrosion problems to equipment that needs heat dissipation. In actual use, different compounds can be selected for cooling according to the saturated vapor pressure of the compounds shown in Formula 1, Formula 2, and Formula 3.

[0044] In some embodiments, the heat sink comprises a boiling cooling heat sink, and the heat sink is used in the field of IGBT.

[0045] like Figure 3 As shown, it is a schematic diagram of the structure of a boiling cooling radiator. The working principle of the boiling cooling radiator is as follows: the boiling chamber 6 contains liquid fluoride 4, which contacts the heat sink 5. The liquid fluoride 4 absorbs the heat of the heat sink 5. The liquid fluoride 4 absorbs the heat and vaporizes. The vaporized fluoride enters the fluoride chamber 3. The fluoride in the fluoride chamber 3 exchanges heat with the cold air brought by the condenser. The vaporized fluoride cools down and re-condenses into liquid and drips down by gravity. The dripping fluoride liquid re-enters the fluoride chamber 3. The heat absorbed by the condenser 2 is then taken out by the top fan 1. The heat sink 5 is connected to the device 1 and is mainly used to dissipate heat from the device 1.

[0046] The working fluid used in the boiling cooling radiator contains the fluorine-containing coolant provided in the present application, which contains the compounds shown in Formula 1, Formula 2, and Formula 3. The saturated vapor pressure of the compound shown in Formula 1 is slightly higher, and the saturated vapor pressure of the compounds shown in Formula 2 and Formula 3 is lower, and it has high heat dissipation efficiency. The compounds shown in Formula 1, Formula 2, and Formula 3 do not decompose when heated at high temperatures, and the compounds have good stability and will not cause corrosion to equipment that requires heat dissipation.

[0047] The boiling cooling radiator can be applied to the IGBT field to cool the IGBT.

[0048] The present invention is further described below by way of examples.

[0049] Example 1 Compound 1 is used as a coolant for a boiling cooling radiator, wherein the boiling cooling radiator is used in the field of IGBT.

[0050] .

[0051] Example 2 Compound 2 is used as a coolant for a boiling cooling radiator, wherein the boiling cooling radiator is used in the field of IGBT.

[0052] .

[0053] Example 3 A coolant of a boiling cooling radiator of compound 3 is used. Among them, the boiling cooling radiator is used in the field of IGBT.

[0054] .

[0055] Comparative Example 1 Nonafluoroisobutyl ether is used as a coolant for a boiling cooling radiator, which is used in the field of IGBT.

[0056] Comparative Example 2 3-methoxy-2-trifluoromethyldecafluoropentane is used as a coolant for a boiling cooling radiator, wherein the boiling cooling radiator is used in the field of IGBT.

[0057] The coolants in the above embodiments and comparative examples were tested as follows.

[0058] 1) Perform vaporization heat test at room temperature.

[0059] 2) Test the thermal conductivity at sea level atmospheric pressure (101.325kPa) and 25℃.

[0060] 3) Electronic surface-fluid thermal resistance test: The pool boiling heat transfer coefficient and 4cm 2 The pool boiling heat transfer coefficient is obtained using the Cooper (1984) correlation for nucleate boiling at sea level atmospheric pressure (101.325 kPa) with a roughness of 1 micron and a heat flux of 100 kW / m 2 .

[0061] 4) Steam-condenser surface thermal resistance test: The thermal resistance of the vapor-condenser surface is determined by the condensation heat transfer coefficient and the 0.2m 2 The condensation heat transfer coefficient was obtained using the Dhir and Lienhard (1971) correlation for external condensation on the tube bundle at sea level atmospheric pressure and with a temperature difference of 8 K between the bulk fluid and the condenser surface.

[0062] The test results of 1), 2), 3) and 4) above are shown in Table 1.

[0063] 5) Vapor pressure-temperature curve test The vapor pressure data is obtained by experimental testing. The test method simulates the actual working conditions and the gas-liquid space ratio is obtained. The specific measures are as follows: 200 ml of the product is added to a 1L stainless steel autoclave, the pressure in the autoclave is discharged to balance the normal pressure with the atmospheric pressure, the temperature is raised from 25°C to 200°C, the pressure change in the autoclave is recorded, and the vapor pressure-temperature curve is obtained as follows: Figure 1 shown.

[0064] Fluoride ion concentration change test of coolant in the temperature range of 25~200℃ 1200g of sample was divided into 6 groups, each group was 200g, and added into 1L autoclave and heated to 25℃, 60℃, 100℃, 150℃, 175℃, 200℃ respectively. After heating at each temperature point for 1 hour, the concentration of fluoride ions in the liquid in the autoclave was tested. The testing instrument was an ion selective electrode. The specific test results are shown in Table 2.

[0065] Table 1 It can be seen from the test results in Table 1 that Comparative Examples 1-2 are currently commonly used hydrofluoroether coolants. The heat of vaporization of fluorine-containing compound Examples 1-3 provided in the present application is similar to that of Comparative Examples 1-2, and the thermal conductivity of the liquid at 25°C is also similar; the electronic surface-fluid thermal resistance data and the steam-condenser surface thermal resistance data of Examples 1-3 and Comparative Examples 1-2 tested are relatively similar, indicating that the compounds represented by Formula 1, Formula 2, and Formula 3 provided in the present application are used for cooling and heat dissipation, and have good heat dissipation effects, just like the currently commonly used hydrofluoroether coolants.

[0066] Figure 1 is the vapor pressure temperature curve of the coolant tested in Examples 1-3 and Comparative Examples 1-2, through Figure 1 It can be seen that the vapor pressure of Example 1 is higher, and the vapor pressures of Examples 2 and 3 are lower, indicating that the compounds provided in the present application conform to Formula 1, Formula 2, and Formula 3, the compounds shown in Formula 2 and Formula 3 have lower saturated vapor pressures, and the saturated vapor pressure of the compound shown in Formula 1 is slightly higher, all of which have heat dissipation effects and can be used as coolants.

[0067] Table 2 It can be seen from Table 2 that at high temperatures, the concentration of fluoride ions in Examples 1, 2, and 3 changes little, and basically does not change significantly. The nonafluoroisobutyl ether used in Comparative Example 1 will decompose, indicating that the fluorine-containing coolant provided in the present application conforms to the compounds shown in Formula 1, Formula 2, and Formula 3, has the effect of not decomposing when heated at high temperatures, and has good compound stability, and will not cause corrosion to equipment that requires heat dissipation.

[0068] Figure 2 This is the GC-MS spectrum of nonafluoroisobutyl ether of comparative example 1 at 175°C. It can be seen from Table 2 that the fluoride ion concentration of comparative example 1 at 175°C changes by an order of magnitude. Figure 2 It can be seen that perfluoroisobutyryl fluoride is produced at 175°C (acyl fluoride will produce hydrogen fluoride when it meets water, existing as free fluoride ions). Therefore, it can be judged that Comparative Example 1 has poor thermal stability above 175°C and decomposes at high temperatures.

[0069] The above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit them. Although the present invention has been described in detail with reference to the above embodiments, it should be understood by those skilled in the art that the technical solutions described in the above embodiments can still be modified, or some of the technical features can be replaced by equivalents. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention, and should be included in the protection scope of the present invention.

Claims

1. A fluorine-containing coolant, characterized in that: Including fluorine-containing compounds, wherein the fluorine-containing compounds include one or more compounds represented by Formula 1, Formula 2, and Formula 3; 、 、 ； Among them, R 11 , R 22 , R 33 Each independently selected from methyl; R 12 , R 21 , R 31 , R 32 , R 34 Each independently selected from perfluoroalkyl groups; R 13 , R 23 , R 35 Each independently selected from -C n F 2n -group, and does not contain unsaturated bonds, n≥1.

2. The fluorine-containing coolant according to claim 1, characterized in that: R 12 , R 21 , R 31 , R 32 , R 34 Each independently selected from C1~C5 perfluoroalkyl; R 13 , R 23 , R 35 Each independently selected from -C n F 2n -group, does not contain unsaturated bonds, and n is 1~5.

3. The fluorine-containing coolant according to claim 1, characterized in that: R 12 Selected from perfluoromethyl, R 13 Selected from -CF2- groups.

4. The fluorine-containing coolant according to claim 1, characterized in that: R 23 is selected from the group -CF2-CF2-; R 22 Selected from methyl.

5. The fluorine-containing coolant according to claim 1, characterized in that: R 31 , R 32 , R 34 Each independently selected from perfluoromethyl; R 35 is selected from the group -CF2-; R 33 Selected from methyl.

6. The fluorine-containing coolant according to claim 1, characterized in that: In the fluorine-containing coolant, the mass percentage of the fluorine-containing compound is ≥99%, the fluorine ion content is <10ppm, and the water content is <50ppm.

7. Use of the fluorine-containing coolant according to any one of claims 1 to 6 in the preparation of a liquid cooling medium, wherein the liquid cooling medium is an immersion cooling medium or a pipeline cooling medium, and the liquid cooling medium is used in the fields of data centers, electronics, aerospace, automobiles, trains, photovoltaics or chemical industry.

8. A liquid cooling system, characterized in that: It comprises a radiator, wherein the radiator contains the liquid cooling medium as claimed in claim 7.

9. The liquid cooling system according to claim 8, characterized in that: The radiator comprises a boiling cooling radiator, and the radiator is used in the field of IGBT.

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