Electroplating carrier group, electroplating device and electroplating method of solar cell

Abstract

The invention relates to an electroplating carrier set, an electroplating device and an electroplating method of a solar cell. The electroplating carrier set comprises a first carrier plate which comprises a first plate body, a plurality of bases and a plurality of probes, the first plate body is provided with a bearing part used for bearing a battery piece, the bases movably penetrate through the first plate body in the thickness direction of the first plate body, one end of each probe is connected with the corresponding base on one side of the first plate body, and the other end of each probe is connected with the corresponding probe; the other end of the probe extends towards the bearing part; the second carrier plate comprises a second plate body and a plurality of driving parts arranged on one side of the second plate body, the plurality of driving parts are arranged corresponding to the plurality of bases of the first carrier plate, and the driving parts are used for being connected with the ends, away from the probes, of the corresponding bases and used for driving the corresponding bases to move in the thickness direction of the first plate body. Therefore, the probe can press the battery piece on the bearing part along the thickness direction of the first plate body. The problem that in the prior art, the solar cell loading speed is low can be solved.

Description

Technical Field

[0001] The present application relates to the technical field of solar cell manufacturing, and in particular to an electroplating carrier set, an electroplating device, and an electroplating method for solar cells. Background Art

[0002] Crystalline silicon solar cells use the photovoltaic effect to convert light energy into electrical energy. Electrodes are formed on the surface of crystalline silicon solar cells to conduct the carriers generated by the conversion. At present, screen printing is usually used to print silver paste on the surface of the cell and then sinter it to form electrodes. Due to the high cost of silver paste, in order to reduce the cost of solar cells, electroplated metal electrodes are used to replace screen-printed silver paste electrodes, thereby using cheaper metals such as nickel and copper to partially or completely replace silver to reduce costs.

[0003] However, the current carriers for solar cell electroplating have problems such as low automation and slow speed of loading solar cell sheets. Summary of the invention

[0004] Based on this, it is necessary to provide a plating carrier group, a plating device and a solar cell electroplating method to address the problems of low automation and slow loading speed of solar cell sheets in the current carriers for solar cell electroplating.

[0005] In a first aspect, the present application provides an electroplating carrier set, comprising:

[0006] A first carrier, comprising a first plate body, a plurality of bases and a plurality of probes, wherein the first plate body has a carrying portion for carrying a battery cell, a plurality of bases are movably arranged in the first plate body along a thickness direction of the first plate body, and a plurality of bases are arranged around the carrying portion, one end of the probe is connected to the corresponding base at one side of the first plate body, and the other end of the probe extends toward the carrying portion;

[0007] The second carrier includes a second plate body and a plurality of driving components arranged on one side of the second plate body. The plurality of driving components are arranged corresponding to the plurality of bases of the first carrier plate. The driving components are used to be connected to one end of the corresponding base away from the probe, and to drive the corresponding base to move along the thickness direction of the first plate body, so that the probe can press the battery cell on the carrying part along the thickness direction of the first plate body.

[0008] In some embodiments, the first carrier plate further includes a plurality of first through holes penetrating the first plate body and corresponding to the plurality of bases;

[0009] The base is threadedly connected to the side wall of the corresponding first through hole.

[0010] In some embodiments, the first carrier plate further includes a plurality of first through holes penetrating the first plate body and corresponding to the plurality of bases;

[0011] The base is slidably connected to the side wall of the first through hole along the thickness direction of the first plate body.

[0012] In some embodiments, the electroplating carrier set further includes a third carrier plate, the third carrier plate including a third plate body and at least one receiving groove disposed on a side surface of the third plate body;

[0013] The electroplating carrier set has a first state and a second state;

[0014] When the electroplating carrier set is in the first state, the first carrier is disposed on the second carrier, and the driving component is detachably connected to the corresponding base;

[0015] When the electroplating carrier set is in the second state, the first carrier is disposed on the third carrier, the third carrier and the first carrier seal the receiving groove, and at least one end of the base away from the probe is received in the receiving groove.

[0016] In some embodiments, along the thickness direction of the first plate body, at least a portion of the first plate body is accommodated in the accommodating groove.

[0017] In some embodiments, a side wall of the receiving groove may abut against a side wall of the first carrier plate to seal the receiving groove.

[0018] In some embodiments, a side wall of the receiving groove abuts against an edge of a side surface of the first plate body on which the probe is disposed, so as to seal the receiving groove.

[0019] In some embodiments, the third carrier further includes a plurality of conductive pads and wires connecting the corresponding conductive pads, the conductive pads are arranged on the bottom wall of the receiving groove, and the conductive pads are arranged corresponding to the base;

[0020] When the electroplating carrier set is in the second state, the conductive pad abuts against the corresponding base, and the conductive pad is electrically connected to the corresponding probe through the base.

[0021] In a second aspect, the present application provides an electroplating device, which includes at least one electroplating carrier group as described in any one of the above.

[0022] In a third aspect, the present application provides a method for electroplating a solar cell, comprising:

[0023] Provide at least one first carrier, the first carrier comprising a first plate body, a plurality of bases and a plurality of probes, the first plate body having a carrying portion for carrying a battery cell, a plurality of bases movably penetrating the first plate body along a thickness direction of the first plate body, and a plurality of bases arranged around the carrying portion, one end of the probe being connected to the corresponding base at one side of the first plate body, and the other end of the probe extending toward the carrying portion;

[0024] Providing at least one second carrier, the second carrier comprising a second plate body, and a plurality of driving components disposed on one side of the second plate body, wherein the plurality of driving components are disposed corresponding to the plurality of bases of the first carrier;

[0025] Providing at least one third carrier plate, the third carrier plate comprising a third plate body and at least one receiving groove disposed on a side surface of the third plate body;

[0026] Providing at least one battery cell;

[0027] The first carrier plate is arranged on the second carrier plate, so that the driving component is detachably connected to an end of the corresponding base away from the probe;

[0028] Disposing the battery cell on the carrying portion of the first carrying board;

[0029] The driving component drives the corresponding base to move along the thickness direction of the first plate, so that the probe can press the battery cell on the carrying part along the thickness direction of the first plate;

[0030] Separating the driving component from the corresponding base, and separating the first carrier plate from the second carrier plate;

[0031] The first carrier plate is disposed on the third carrier plate, so that the third carrier plate and the first carrier plate can seal the receiving groove, and at least one end of the base away from the probe can be received in the receiving groove;

[0032] Placing the third carrier, the first carrier and the battery cell in an electroplating tank;

[0033] After the probe is powered on, an electroplating process is performed.

[0034] In the embodiment of the present application, by setting the first carrier and the second carrier, the battery cell can be placed on the surface of the carrier. When the first carrier is set on the second carrier, the driving component is detachably connected to the corresponding base, and the driving component drives the corresponding base to move along the thickness direction of the first plate body, so that the probe can press the battery cell on the carrier along the thickness direction of the first plate body. By setting the driving component on the second carrier, the probe can be automatically raised and lowered, so that the probe can quickly press the battery cell, and the first carrier fixes the battery cell, which greatly improves the speed of loading the battery cell. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to more clearly illustrate the technical solutions in the embodiments or exemplary embodiments of the present application, the drawings required for use in the description of the embodiments or exemplary embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0036] FIG. 1 is a schematic diagram of a first carrier plate in an electroplating carrier set provided in some embodiments of the present application.

[0037] FIG. 2 is a schematic diagram of a second carrier plate in an electroplating carrier assembly provided in some embodiments of the present application.

[0038] FIG. 3 is a three-dimensional schematic diagram of a first state of an electroplating carrier assembly provided in some embodiments of the present application.

[0039] FIG. 4 is a cross-sectional schematic diagram of a first state of an electroplating carrier assembly provided in some embodiments of the present application.

[0040] FIG. 5 is a first schematic diagram of a third carrier plate in an electroplating carrier set provided in some embodiments of the present application.

[0041] FIG. 6 is a second schematic diagram of a third carrier plate in an electroplating carrier set provided in some embodiments of the present application.

[0042] FIG. 7 is a three-dimensional schematic diagram of a second state of an electroplating carrier assembly provided in some embodiments of the present application.

[0043] FIG8 is a cross-sectional schematic diagram of a second state of an electroplating carrier assembly provided in some embodiments of the present application.

[0044] FIG. 9 is a schematic diagram of the process steps of a solar cell electroplating method provided in some embodiments of the present application.

[0045] FIG. 10 is a schematic diagram of a second intermediate process of a solar cell electroplating method provided in some embodiments of the present application.

[0046] FIG. 11 is a schematic diagram of a third intermediate process of a solar cell electroplating method provided in some embodiments of the present application.

[0047] FIG. 12 is a schematic diagram of a fourth intermediate process of a solar cell electroplating method provided in some embodiments of the present application.

[0048] Figure numerals: first carrier board 10; second carrier board 20; first board body 11; multiple bases 12; multiple probes 13; carrying part 14; second board body 21; driving component 22; battery cell 50; first through hole 15; third carrier board 30; third board body 31; receiving groove 32; first state Z10; second state Z20; conductive pad 33; wire 34. DETAILED DESCRIPTION

[0049] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0050] In the description of the present application, it should be understood that if the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. appear, the orientation or position relationship indicated by these terms is based on the orientation or position relationship shown in the accompanying drawings, which is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0051] In addition, if the terms "first" or "second" appear, these terms are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of this application, if the term "plurality" appears, the meaning of "plurality" is at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0052] In this application, unless otherwise clearly specified and limited, if the terms "installed", "connected", "connected", "fixed" and the like appear, these terms should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integrated connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to the specific circumstances.

[0053] In the present application, unless otherwise clearly specified and limited, if there is a description that a first feature is "above" or "below" a second feature, etc., or similar descriptions appear, it may mean that the first and second features are in direct contact, or that the first and second features are in indirect contact through an intermediate medium. Moreover, the first feature being "above", "above" and "above" the second feature may mean that the first feature is directly above or obliquely above the second feature, or simply means that the first feature is higher in level than the second feature. The first feature being "below", "below" and "below" the second feature may mean that the first feature is directly below or obliquely below the second feature, or simply means that the first feature is lower in level than the second feature.

[0054] It should be noted that if an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. If an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. If any, the terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used in this application are for illustrative purposes only and do not represent the only implementation method.

[0055] Refer to Figures 1 to 8. Figure 1 is a schematic diagram of a first carrier in a plating carrier set provided in some embodiments of the present application. Figure 2 is a schematic diagram of a second carrier in a plating carrier set provided in some embodiments of the present application. Figure 3 is a three-dimensional schematic diagram of a first state of a plating carrier set provided in some embodiments of the present application. Figure 4 is a cross-sectional schematic diagram of a first state of a plating carrier set provided in some embodiments of the present application.

[0056] FIG. 5 is a first schematic diagram of a third carrier in an electroplating carrier set provided in some embodiments of the present application. FIG. 6 is a second schematic diagram of a third carrier in an electroplating carrier set provided in some embodiments of the present application. FIG. 7 is a three-dimensional schematic diagram of a second state of an electroplating carrier set provided in some embodiments of the present application. FIG. 8 is a cross-sectional schematic diagram of a second state of an electroplating carrier set provided in some embodiments of the present application.

[0057] In the first aspect, the present application provides an electroplating carrier set, which includes a first carrier 10 and a second carrier 20. The first carrier 10 includes a first plate body 11, a plurality of bases 12 and a plurality of probes 13. The first plate body 11 has a carrying portion 14 for carrying a battery cell 50. The plurality of bases 12 are movably arranged in the first plate body 11 along the thickness direction of the first plate body 11, and the plurality of bases 12 are arranged around the carrying portion 14. One end of the probe 13 is connected to the corresponding base 12 on one side of the first plate body 11, and the other end of the probe 13 extends toward the carrying portion 14. The second carrier 20 includes a second plate body 21, and a plurality of driving components 22 arranged on one side of the second plate body 21. The plurality of driving components 22 are arranged corresponding to the plurality of bases 12 of the first carrier 10. The driving components 22 are used to connect to one end of the corresponding base 12 away from the probe 13, and are used to drive the corresponding base 12 to move along the thickness direction of the first plate body 11, so that the probe 13 can press the battery cell 50 on the carrying portion 14 along the thickness direction of the first plate body 11.

[0058] For example, the first board 11 has a carrying portion 14 for carrying the battery cell 50 , that is, the battery cell 50 can be placed on the surface of the carrying portion 14 .

[0059] For example, the base 12 and the probe 13 may be an integral structure, or the base 12 and the probe 13 may be two different structures.

[0060] For example, a plurality of bases 12 are movably disposed in the first plate body 11 along the thickness direction of the first plate body 11 , and the bases 12 may be rod-shaped, for example, the bases 12 are threaded rods, screws, or sliding rod structures.

[0061] For example, multiple driving components 22 are arranged corresponding to multiple bases 12 of the first carrier 10, for example, the number of driving components 22 is the same as the number of first carriers 10; for example, when the electroplating carrier group is in the first state Z10, the first carrier 10 is arranged on the second carrier 20, and the driving components 22 are detachably connected to the corresponding bases 12.

[0062] For example, the driving component 22 may include a motor. When the driving component 22 is detachably connected to the corresponding base 12, the rotation of the motor can drive the driving component 22, and the driving component 22 in turn drives the screw-like base 12 to rotate, so that the driving component 22 drives the corresponding base 12 to move along the thickness direction of the first plate body 11, so that the probe 13 can press the battery cell 50 on the supporting part 14 along the thickness direction of the first plate body 11.

[0063] In the embodiment of the present application, by setting the first carrier 10 and the second carrier 20, the battery cell 50 can be placed on the surface of the carrier 14. When the first carrier 10 is set on the second carrier 20, the driving component 22 is detachably connected to the corresponding base 12, and the driving component 22 drives the corresponding base 12 to move along the thickness direction of the first plate 11, so that the probe 13 can press the battery cell 50 on the carrier 14 along the thickness direction of the first plate 11. Through the setting of the driving component 22 on the second carrier 20, the probe can be automatically raised and lowered, so that the probe 13 can quickly press the battery cell 50, and the first carrier 10 fixes the battery cell 50, which greatly improves the speed of loading the battery cell 50.

[0064] In some embodiments, the first carrier board 10 further includes a plurality of first through holes 15 penetrating the first board body 11 and corresponding to the plurality of bases 12 ; the bases 12 are threadedly connected to the side walls of the corresponding first through holes 15 .

[0065] For example, multiple bases 12 are movably arranged in the first plate body 11 along the thickness direction of the first plate body 11. The base 12 can be rod-shaped, and the base 12 can be a screw or a screw structure. The inner wall of the first through hole 15 has an internal thread, and the base 12 has an external thread, so that the base 12 is threadedly connected to the side wall of the corresponding first through hole 15. The driving component 22 may include a motor. When the driving component 22 is detachably connected to the corresponding base 12, the rotation of the motor can drive the driving component 22, and the driving component 22 drives the screw-like base 12 to rotate, so that the driving component 22 drives the corresponding base 12 to move along the thickness direction of the first plate body 11, so that the probe 13 can press the battery cell 50 on the bearing part 14 along the thickness direction of the first plate body 11.

[0066] In some embodiments, the first carrier board 10 further includes a plurality of first through holes 15 penetrating the first board body 11 and corresponding to the plurality of bases 12 ; along the thickness direction of the first board body 11 , the bases 12 are slidably connected to the side walls of the first through holes 15 .

[0067] For example, along the thickness direction of the first plate body 11, the base 12 is slidably connected to the side wall of the first through hole 15, the base 12 may be a rod-shaped structure, for example, the base 12 is a sliding rod, and the driving component 22 may include an electric lifting component or an electric stretching component (the driving component 22 may be any electric lifting component or electric stretching component in the prior art, which will not be repeated here). When the driving component 22 is detachably connected to the corresponding base 12, the electric lifting component or the electric stretching component can drive the base 12 to slide and rise in the first through hole 15, so that the base 12 moves along the thickness direction of the first plate body 11, and the probe 13 can press the battery cell 50 on the bearing part 14 along the thickness direction of the first plate body 11.

[0068] In some embodiments, as shown in Figures 3 to 8, the electroplating carrier group also includes a third carrier 30, the third carrier 30 includes a third plate body 31, and at least one receiving groove 32 arranged on a side surface of the third plate body 31; the electroplating carrier group has a first state Z10 and a second state Z20; when the electroplating carrier group is in the first state Z10, the first carrier 10 is arranged on the second carrier 20, and the driving component 22 is detachably connected to the corresponding base 12; when the electroplating carrier group is in the second state Z20, the first carrier 10 is arranged on the third carrier 30, and the third carrier 30 and the first carrier 10 seal the receiving groove 32, and at least one end of the base 12 away from the probe 13 is accommodated in the receiving groove 32.

[0069] For example, the first carrier 10 and the second carrier 20 realize the automatic lifting of the probe 13, which improves the speed of loading the battery cells, but the carrier still has the problem of a small number of recyclable uses and easy corrosion by the electroplating solution. For example, during electroplating, the base 12 or the back of the base 12 is easily corroded by the electroplating solution, so that the base 12 cannot be well connected with the driving component 22, and the driving component 22 is difficult to accurately drive the automatic lifting of the probe 13. Based on this, the inventors have found that further providing a third carrier 30 can solve this problem.

[0070] 3 and 4 , when the electroplating carrier assembly is in the first state Z10, the first carrier 10 is disposed on the second carrier 20, and a side surface of the first plate 11 on which the probe 13 is disposed and a side surface of the second plate 21 on which the driving component 22 is disposed face the same direction.

[0071] 7 and 8 , when the electroplating carrier assembly is in the second state Z20, the first carrier 10 is disposed on the third carrier 30, and a side surface of the first plate body 11 on which the probe 13 is disposed and a side surface of the third plate body 31 on which the receiving groove 32 is disposed face the same direction.

[0072] For example, as shown in Figures 3 and 4, when the electroplating carrier group is in the first state Z10, the first carrier 10 is arranged on the second carrier 20, and the driving component 22 is detachably connected to the corresponding base 12. The driving component 22 can drive the base 12 to move along the thickness direction of the first plate body 11, and the probe 13 can press the battery cell 50 on the supporting part 14 along the thickness direction of the first plate body 11, thereby realizing the automatic lifting and lowering of the probe 13 and improving the speed of loading the battery cells.

[0073] For example, as shown in Figures 5 to 7, the third carrier 30 includes at least one receiving groove 32 arranged on a side surface of the third plate body 31. When the electroplating carrier assembly is in the second state Z20, the first carrier 10 is arranged on the third carrier 30, and the third carrier 30 and the first carrier 10 seal the receiving groove 32, and at least one end of the base 12 away from the probe 13 is accommodated in the receiving groove 32.

[0074] For example, as shown in FIG5 , in some embodiments, the third carrier 30 includes a plurality of receiving grooves 32 disposed on a surface of one side of the third plate body 31, for example, the number of the receiving grooves 32 is the same as the number of the base 12, and the position of the receiving groove 32 corresponds to the position of the base 12. When the electroplating carrier set is in the second state Z20, the first carrier 10 is disposed on the third carrier 30, and the base 12 is just accommodated by the corresponding receiving groove 32, and the third carrier 30 and the first carrier 10 seal the receiving groove 32, for example, the first plate body 11 and the third plate body 31 seal the receiving groove 32 by contact and compression. When electroplating is performed, even if most of the third carrier 30 is immersed in the electroplating solution, the electroplating solution cannot enter the receiving groove 32, thereby protecting the base 12 or the back of the base 12, so that the first carrier 10 can be reused more times, so that after repeated electroplating, the base 12 can also be well connected with the driving component 22, and the driving component 22 can maintain accurate automatic lifting and lowering of the probe 13, greatly improving the number of times the carrier set can be recycled.

[0075] For example, as shown in Figures 5 to 7, in some embodiments, the third carrier 30 includes a large receiving groove 32 arranged on one side surface of the third plate body 31, and the size of the receiving groove 32 can just accommodate the first plate body 11. At this time, along the thickness direction of the first plate body 11, at least a portion of the first plate body 11 is accommodated in the receiving groove 32, and the side wall of the receiving groove 32 can seal the receiving groove 32 with the first plate body 11. During electroplating, even if most parts of the third carrier 30 are immersed in the plating solution, the plating solution cannot enter the receiving groove 32, thereby protecting the base 12 or the back of the base 12, so that the first carrier 10 can be reused more times, so that after repeated electroplating, the base 12 can also be well connected with the driving component 22, and the driving component 22 can maintain accurate driving of the probe 13 for automatic lifting and lowering, greatly improving the number of times the carrier group can be recycled.

[0076] In some embodiments, as shown in FIGS. 3 to 8 , along the thickness direction of the first plate body 11 , at least a portion of the first plate body 11 is received in the receiving groove 32 .

[0077] For example, the third carrier 30 includes a large receiving groove 32 arranged on one side surface of the third plate body 31. Along the thickness direction of the first plate body 11, at least a portion of the first plate body 11 is received in the receiving groove 32. The side wall of the receiving groove 32 can seal the receiving groove 32 with the first plate body 11. When electroplating is performed, the plating liquid cannot enter the receiving groove 32, so that the back side of the first carrier 10 is protected and will not be corroded by the plating liquid. After repeated electroplating, the first carrier 10 can also be recycled, which greatly increases the number of times the carrier group can be recycled.

[0078] In some embodiments, as shown in FIG. 7 and FIG. 8 , the sidewall of the receiving groove 32 may abut against the sidewall of the first carrier plate 10 to seal the receiving groove 32 .

[0079] For example, the sidewall of the receiving groove 32 may abut against the sidewall of the first carrier plate 10 to squeeze and seal the receiving groove 32 .

[0080] For example, the side wall of the receiving groove 32 may be made of a plastic elastic material such as rubber, so that the receiving groove 32 can be squeezed and sealed.

[0081] In some embodiments, as shown in FIG. 7 and FIG. 8 , the side wall of the receiving groove 32 abuts against the edge of a side surface of the first plate body 11 on which the probe 13 is disposed (not shown in the figure) to seal the receiving groove 32 .

[0082] For example, the side wall of the receiving groove 32 abuts against the edge of a side surface of the first plate body 11 on which the probe 13 is disposed, and squeezes and seals the receiving groove 32 .

[0083] In some embodiments, as shown in FIG. 6 (the wire 34 is not shown in FIG. 5 ), the third carrier 30 further includes a plurality of conductive pads 33, and wires 34 connected to the corresponding conductive pads 33, the conductive pads 33 are disposed on the bottom wall of the accommodating groove 32, and the conductive pads 33 are disposed corresponding to the base 12; when the electroplating carrier assembly is in the second state Z20, the conductive pads 33 abut against the corresponding base 12, and the conductive pads 33 are electrically connected to the corresponding probes 13 through the base 12.

[0084] For example, during electroplating, the battery cell 50 needs to be connected to an external power source, so a conductive wire 34, a conductive pad 33, a base 12 and a probe 13 are provided to electrically connect the battery cell 50 to form an electrical connection loop during electroplating.

[0085] By way of example, the conductor 34 may be an electric wire or a conductive layer.

[0086] For example, when the cell 50 is placed on the carrier 14 and the first carrier 10 is placed on the third carrier 30 , the probe 13 can fix the cell 50 , and the wire 34 can be electrically connected to the cell 50 through the conductive pad 33 , the base 12 and the probe 13 .

[0087] For example, in some embodiments, the conductive pad 33 may have a protrusion or a depression, and the side of the base 12 away from the probe 13 may have a depression or a protrusion, for example, the protrusion on the conductive pad 33 matches the depression on the base 12, for example, the depression on the conductive pad 33 matches the protrusion on the base 12, so as to increase the contact area between the conductive pad 33 and the base 12 and reduce the contact impedance.

[0088] In a second aspect, the present application provides an electroplating device, the electroplating device comprising at least one electroplating carrier set according to any one of the above items.

[0089] For example, the first carrier 10 is placed on the third carrier 30 , and the third carrier 30 is placed in an electroplating tank. The electroplating tank contains an electroplating solution, and at least a portion of the third carrier 30 is exposed outside the electroplating solution.

[0090] For example, in some embodiments, the carrier assembly can be used to mount the battery cell 50, for example, one end of the third carrier 30 and the first carrier 10 is inserted into the plating solution toward the bottom wall of the plating tank, at least a portion of the other end of the third carrier 30 is exposed outside the plating solution and is powered by an external power source through a wire 34.

[0091] Please refer to Figures 9 to 12 and Figure 4. Figure 9 is a schematic diagram of the process steps of a method for electroplating a solar cell provided in some embodiments of the present application. Figure 4 is also a schematic diagram of the first intermediate process of a method for electroplating a solar cell provided in some embodiments of the present application. Figure 10 is a schematic diagram of the second intermediate process of a method for electroplating a solar cell provided in some embodiments of the present application. Figure 11 is a schematic diagram of the third intermediate process of a method for electroplating a solar cell provided in some embodiments of the present application. Figure 12 is a schematic diagram of the fourth intermediate process of a method for electroplating a solar cell provided in some embodiments of the present application.

[0092] In a third aspect, as shown in FIG9 , the present application further provides a method for electroplating a solar cell. The method for electroplating a solar cell may adopt any of the above-mentioned carrier groups or electroplating devices. The method for electroplating a solar cell includes: step S100, step S200, step S300, step S400, step S500, step S600, step S700, step S800, step S900, step S1000 and step S1100.

[0093] Step S100, as shown in Figure 1, provides at least one first carrier board 10, the first carrier board 10 includes a first board body 11, a plurality of bases 12 and a plurality of probes 13, the first board body 11 has a carrying portion 14 for carrying the battery cell 50, the plurality of bases 12 are movably arranged through the first board body 11 along the thickness direction of the first board body 11, and the plurality of bases 12 are arranged around the carrying portion 14, one end of the probe 13 is connected to the corresponding base 12 on one side of the first board body 11, and the other end of the probe 13 extends toward the carrying portion 14.

[0094] In step S200 , as shown in FIG. 2 , at least one second carrier 20 is provided. The second carrier 20 includes a second plate body 21 and a plurality of driving components 22 disposed on one side of the second plate body 21 . The plurality of driving components 22 are disposed corresponding to the plurality of bases 12 of the first carrier 10 .

[0095] In step S300 , as shown in FIG. 5 or FIG. 6 , at least one third carrier board 30 is provided. The third carrier board 30 includes a third board body 31 and at least one receiving groove 32 disposed on a side surface of the third board body 31 .

[0096] Step S400 , providing at least one battery cell 50 .

[0097] Step S500 , as shown in FIG. 4 , the first carrier 10 is disposed on the second carrier 20 , so that the driving component 22 is detachably connected to an end of the corresponding base 12 away from the probe 13 .

[0098] In step S600 , as shown in FIG. 10 , the battery cell 50 is disposed on the carrying portion 14 of the first carrier 10 .

[0099] Step S700 , as shown in FIG. 11 , the driving component 22 drives the corresponding base 12 to move along the thickness direction of the first plate 11 , so that the probe 13 can press the battery cell 50 on the carrying portion 14 along the thickness direction of the first plate 11 .

[0100] In step S800 , the driving component 22 is separated from the corresponding base 12 , and the first carrier plate 10 is separated from the second carrier plate 20 .

[0101] Step S900 , as shown in FIG. 12 , dispose the first carrier 10 on the third carrier 30 so that the third carrier 30 and the first carrier 10 can seal the receiving groove 32 , and at least one end of the base 12 away from the probe 13 can be received in the receiving groove 32 .

[0102] Step S1000 , placing the third carrier plate 30 , the first carrier plate 10 and the battery cell 50 in an electroplating tank.

[0103] Step S1100 , after the probe 13 is powered on, an electroplating process is performed.

[0104] The technical features of the above-described embodiments may be arbitrarily combined. To make the description concise, not all possible combinations of the technical features in the above-described embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0105] The above-described embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be construed as limiting the scope of the patent application. It should be pointed out that, for a person of ordinary skill in the art, several variations and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the patent application shall be subject to the attached claims.

Claims

1. An electroplating carrier set, characterized in that: include: A first carrier, comprising a first plate body, a plurality of bases and a plurality of probes, wherein the first plate body has a carrying portion for carrying a battery cell, a plurality of bases are movably arranged in the first plate body along a thickness direction of the first plate body, and a plurality of bases are arranged around the carrying portion, one end of the probe is connected to the corresponding base at one side of the first plate body, and the other end of the probe extends toward the carrying portion; The second carrier includes a second plate body and a plurality of driving components arranged on one side of the second plate body. The plurality of driving components are arranged corresponding to the plurality of bases of the first carrier plate. The driving components are used to be connected to one end of the corresponding base away from the probe, and to drive the corresponding base to move along the thickness direction of the first plate body, so that the probe can press the battery cell on the carrying part along the thickness direction of the first plate body.

2. The electroplating carrier assembly according to claim 1, characterized in that: The first carrier plate further includes a plurality of first through holes penetrating the first plate body and corresponding to the plurality of bases; The base is threadedly connected to the side wall of the corresponding first through hole.

3. The electroplating carrier assembly according to claim 1, characterized in that: The first carrier plate further includes a plurality of first through holes penetrating the first plate body and corresponding to the plurality of bases; The base is slidably connected to the side wall of the first through hole along the thickness direction of the first plate body.

4. The electroplating carrier assembly according to claim 1, characterized in that: The electroplating carrier set further includes a third carrier plate, the third carrier plate including a third plate body and at least one receiving groove disposed on a side surface of the third plate body; The electroplating carrier set has a first state and a second state; When the electroplating carrier set is in the first state, the first carrier is disposed on the second carrier, and the driving component is detachably connected to the corresponding base; When the electroplating carrier set is in the second state, the first carrier is disposed on the third carrier, the third carrier and the first carrier seal the receiving groove, and at least one end of the base away from the probe is received in the receiving groove.

5. The electroplating carrier assembly according to claim 4, characterized in that: Along the thickness direction of the first plate body, at least a portion of the first plate body is accommodated in the accommodation groove.

6. The electroplating carrier assembly according to claim 5, characterized in that: The side wall of the receiving groove may abut against the side wall of the first carrier plate to seal the receiving groove.

7. The electroplating carrier assembly according to claim 5, characterized in that: The side wall of the receiving groove abuts against the edge of a side surface of the first plate body on which the probe is arranged, so as to seal the receiving groove.

8. The electroplating carrier assembly according to claim 4, characterized in that: The third carrier board further includes a plurality of conductive pads and wires connected to the corresponding conductive pads, wherein the conductive pads are arranged on the bottom wall of the receiving groove, and the conductive pads are arranged corresponding to the base; When the electroplating carrier set is in the second state, the conductive pad abuts against the corresponding base, and the conductive pad is electrically connected to the corresponding probe through the base.

9. An electroplating device, characterized in that: The electroplating device comprises at least one electroplating carrier set as described in any one of claims 1-8.

10. A method for electroplating a solar cell, characterized in that: include: Provide at least one first carrier, the first carrier comprising a first plate body, a plurality of bases and a plurality of probes, the first plate body having a carrying portion for carrying a battery cell, a plurality of bases movably penetrating the first plate body along a thickness direction of the first plate body, and a plurality of bases arranged around the carrying portion, one end of the probe being connected to the corresponding base at one side of the first plate body, and the other end of the probe extending toward the carrying portion; Providing at least one second carrier, the second carrier comprising a second plate body, and a plurality of driving components disposed on one side of the second plate body, wherein the plurality of driving components are disposed corresponding to the plurality of bases of the first carrier; Providing at least one third carrier plate, the third carrier plate comprising a third plate body and at least one receiving groove disposed on a side surface of the third plate body; Providing at least one battery cell; The first carrier plate is arranged on the second carrier plate, so that the driving component is detachably connected to an end of the corresponding base away from the probe; Disposing the battery cell on the carrying portion of the first carrying board; The driving component drives the corresponding base to move along the thickness direction of the first plate, so that the probe can press the battery cell on the carrying part along the thickness direction of the first plate; Separating the driving component from the corresponding base, and separating the first carrier plate from the second carrier plate; The first carrier plate is disposed on the third carrier plate, so that the third carrier plate and the first carrier plate can seal the receiving groove, and at least one end of the base away from the probe can be received in the receiving groove; Placing the third carrier, the first carrier and the battery cell in an electroplating tank; After the probe is powered on, an electroplating process is performed.

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