Method for detecting compactness and uniformity of crystal grains of coarsened layer of copper foil

By using special test paper and weights on the surface of the copper foil for dragging inspection, the problem of difficult to detect the grain density of the copper foil roughened layer in the prior art is solved, and intuitive judgment of the firmness of the copper teeth on the surface of the copper foil and effective monitoring of high-grade electrolytic copper foil is achieved.

CN119534306APending Publication Date: 2025-02-28JIUJIANG TELFORD ELECTRONICS MATERIAL CO LTD
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Patent Information

Application Number
CN202411453997.6
Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
Filing Date
2024-10-17
Publication Date
2025-02-28

AI Technical Summary

Technical Problem

The prior art is difficult to effectively detect the grain density uniformity of the copper foil roughened layer, resulting in the risk of copper teeth falling off and components short circuits.

Method used

Monitor the grain density of the coarse layer of the copper foil by selecting a flat copper foil sample, dragging it at a specific angle and method using special test strips and weights, and then checking the test strips for cracks under appropriate light.

Benefits of technology

This method can intuitively judge the firmness of the copper teeth on the surface of the copper foil, effectively monitor the grain density of the roughened layer of the high-end electrolytic copper foil, reduce the detection cost, and have good application prospects.

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Abstract

The invention relates to a method for detecting compact uniformity of crystal grains of a copper foil coarsening layer, which comprises the following steps of: (1) selecting a flat and wrinkle-free copper foil, and cutting the copper foil into a sample copper foil; (2) flatly laying a sample copper foil on a working table, placing special test paper on the surface of the sample copper foil, then placing a weight right above the special test paper, dragging the special test paper at an oblique angle of 30 degrees, and then dragging the special test paper back and forth according to a U shape at a constant speed; and (3) taking down the special test paper, and detecting whether copper teeth of the sample copper foil are fractured and fall off or not under the illuminance of 400-500Lux. According to the method, the firmness of the copper teeth of the roughened layer on the surface of the copper foil can be visually judged, the grain compactness of the roughened layer on the rough surface of the high-grade electrolytic copper foil is effectively monitored, the detection cost is reduced, and the detection method can be popularized and used in the aspect of detection of copper foil and products in similar industries and has a good application prospect.
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Description

Technical Field

[0001] The invention belongs to the technical field of copper foil preparation, and in particular relates to a method for detecting the grain density uniformity of a copper foil roughening layer. Background Art

[0002] Electrolytic copper foil is mainly used in copper clad laminates (CCL) and printed circuit boards (PCB). The main function of PCB is to provide connection circuits between various components. With the rapid development of the PCB industry, the requirements for the surface of electrolytic copper foil are higher. The poor grain density of the roughened layer leads to the loss of copper teeth, which in turn creates the risk of short circuits between components. Therefore, copper foil manufacturers are not only required to produce copper foil with stable roughness, but also to ensure that the copper teeth of the roughened layer are firm and not easy to fall off. Especially in the manufacture of thin CCL, this performance requirement for copper foil is more prominent. Summary of the invention

[0003] The technical problem to be solved by the present invention is to provide a method for detecting the uniformity of grain density of the roughened layer of copper foil. The method can intuitively determine the firmness of the copper teeth of the roughened layer on the surface of the copper foil, and effectively monitor the grain density of the roughened layer on the matte surface of the high-grade electrolytic copper foil. This not only reduces the detection cost, but also the detection method can be promoted and used in the detection of copper foil and similar industry products, and has good application prospects.

[0004] The present invention provides a method for detecting the grain density uniformity of a copper foil roughening layer, comprising the following steps:

[0005] (1) Select a flat and wrinkle-free copper foil and cut it into a sample copper foil;

[0006] (2) Lay the sample copper foil flat on the work surface, and place a special test paper on the surface of the sample copper foil. Then place a weight directly above the special test paper, drag the special test paper at an angle of 30°, and then drag it back and forth in a "U" shape at a constant speed;

[0007] (3) Remove the special test paper and detect whether the copper foil of the sample is broken or fallen off at a light intensity between 400-500 Lux (to facilitate the stable light during the test process).

[0008] Preferably, the surface roughness of the workbench in step (2) is Ra=0.006 μm, Rz=0.05 μm, so that the weights can move back and forth in a uniform U-shape and are not prone to tipping over.

[0009] Preferably, the surface roughness of the special test paper in step (2) is Rz>35 μm, the diameter is 110 mm, and the main component is 100% α-cellulose cotton, so as to increase the friction force.

[0010] Preferably, the weight in step (2) is 400 g and the force-bearing area is 550 mm2, which is convenient for moderate force pressure.

[0011] Beneficial Effects

[0012] The present invention can visually determine the firmness of the copper teeth of the roughened layer on the surface of the copper foil, and effectively monitor the grain density of the roughened layer on the matte surface of the high-grade electrolytic copper foil, which not only reduces the detection cost, but also the detection method can be promoted and used in the detection of copper foil and similar industry products, and has good application prospects. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 Flow chart of the method of the present invention.

[0014] Figure 2 The figures are different levels of copper powder adhesion of the test paper of the present invention and the test results of electron microscope. DETAILED DESCRIPTION

[0015] The present invention will be further described below in conjunction with specific embodiments. It should be understood that these embodiments are only used to illustrate the present invention and are not intended to limit the scope of the present invention. In addition, it should be understood that after reading the content taught by the present invention, those skilled in the art can make various changes or modifications to the present invention, and these equivalent forms fall within the scope limited by the appended claims of the application equally.

[0016] Example 1

[0017] like Figure 1 As shown, the present invention provides a method for detecting the grain density uniformity of a copper foil roughening layer, comprising the following steps:

[0018] (1) First, a flat and wrinkle-free copper foil is selected and cut into a 1360 mm*30 mm copper foil sample by a knife engraving method; (2) The copper foil sample is laid flat on a flat work surface with Ra=0.006 μm and Rz=0.05 μm with the rough surface facing upward;

[0019] (3) Place a φ110 mm test paper with a surface roughness Rz>35 μm on the surface of the copper foil of the sample, then place a 400 g weight with a force bearing area of ​​550 mm2 directly on the test paper, drag the test paper by hand at an angle of 30°, and then drag it back and forth at a constant speed in a "U" shape for 2720 mm;

[0020] (4) Remove the test paper and visually check whether the copper teeth of the test paper are broken or fallen off at a light intensity of 300-500 Lux. This method effectively monitors the grain density of the roughened layer of the matte surface of high-grade electrolytic copper foil, which not only reduces the detection cost, but also can be promoted and used in the detection of copper foil and similar industry products. Furthermore, the amount of copper powder attached to the test paper can be analyzed by electron microscopy, such as Figure 2 As shown, the more copper powder there is in the test paper, the more serious the agglomeration of the coarsened layer structure is, and the copper teeth are prone to breakage.

Claims

1. A method for detecting the uniformity of grain density of a copper foil roughening layer, comprising the following steps: (1) Select a flat and wrinkle-free copper foil and cut it into a sample copper foil; (2) Lay the sample copper foil flat on the work surface, and place a special test paper on the surface of the sample copper foil. Then place a weight directly above the special test paper, drag the special test paper at an angle of 30°, and then drag it back and forth in a "U" shape at a constant speed; (3) Remove the special test paper and detect whether the copper foil of the sample is broken or fallen off under a light intensity between 400-500 Lux.

2. The method according to claim 1, characterized in that: The surface roughness of the workbench in step (2) is Ra=0.006 μm, Rz=0.05 μm.

3. The method according to claim 1, characterized in that: The special test paper in step (2) has a surface roughness Rz>35 μm, a diameter of 110 mm, and a main component of 100% α-cellulose cotton.

4. The method according to claim 1, characterized in that: The weight in step (2) is 400 g.