Performance analysis method of high-temperature extreme working condition conducted emission inspection probe

Abstract

The invention discloses a performance analysis method for a high-temperature extreme working condition conducted emission detection probe, and the method comprises the following steps: S1, constructing an electromagnetic field simulation model in a working scene of the conducted emission detection probe, and calculating the electromagnetic loss power of each part in the working scene of the conducted emission detection probe; s2, constructing a temperature field simulation model in the working scene of the conducted emission detection probe, and obtaining temperature distribution of each component in the working scene of the conducted emission detection probe; s3, constructing a mechanical field simulation model in a working scene of the conducted emission detection probe, and obtaining a structural thermal deformation result of each component; and S4, constructing an electromagnetic field simulation model of the working scene of the conducted emission detection probe under the thermal deformation condition, and calculating the performance index of the conducted emission detection probe. Through three-dimensional electromagnetic field, thermal and mechanical field simulation analysis software, the performance change of the conduction detection probe under the high-temperature extreme working condition can be more accurately obtained, and data support is provided for optimization of the high-temperature conduction emission detection probe.

Description

Technical Field

[0001] The present invention relates to the field of conducted emission electromagnetic interference detection of complex electronic systems, and specifically to a performance analysis method for conducting emission inspection probes under high temperature extreme working conditions by modeling the multi-physical field coupling effects of conducted emission inspection probes that measure conducted interference currents on transmission cables of complex electronic systems under extreme working conditions such as high temperature. Background Art

[0002] With the continuous progress of electronic technologies such as chips and electronic packaging, the integration of electronic systems is getting higher and higher, and their structural composition is becoming more and more complex. In order to ensure the delay of integrated circuit signal transmission, the size of complex electronic systems is constantly shrinking, but the circuit integration is higher and its working spectrum density is significantly increased. However, an important challenge facing complex electronic systems is the intensification of electromagnetic compatibility issues of equipment. The intensification of working spectrum density makes the signal transmission of equipment, especially the signal integrity and power integrity problems between complex electronic systems increasingly serious, especially the system interference caused by interference is becoming more serious. In the signal transmission of complex electronic systems, a large number of cables are used for power distribution and signal transmission, and electromagnetic interference can form interference current in the cables through coupling and transmit to sensitive devices. When the interference energy is too high, it will have an adverse effect on the normal operation of sensitive equipment. Among many electromagnetic compatibility issues, cables are often the main source of interference. Therefore, in order to verify the electromagnetic compatibility of complex electronic systems and to accurately obtain the conducted interference current of electromagnetic interference in cables in complex electronic systems, it is necessary to use conducted emission detection probes for measurement. However, in actual working conditions, cables often work in unconventional temperature environments or even extreme high temperature environments, so the conductive detection probe must inevitably be placed in this environment, and its test accuracy is easily affected. In the actual working environment, each physical property of the current probe will be affected, and there will be a certain coupling effect between the electromagnetic, thermal, and mechanical properties. However, current research rarely considers the performance changes of conductive emission probes under high temperature extreme exposure, so it is difficult to provide a reference for the forward design and optimization of high temperature conductive emission detection probes. Summary of the invention

[0003] The purpose of the present invention is to overcome the shortcomings of the prior art and provide a performance analysis method for a conduction emission test probe under high temperature extreme working conditions. Through three-dimensional electromagnetic field, thermal and mechanical field simulation analysis software, the performance changes of the conduction detection probe under high temperature extreme working conditions can be obtained more accurately, providing data support for the optimization of the high temperature conduction emission detection probe.

[0004] The object of the present invention is achieved through the following technical solution: A performance analysis method for a high temperature extreme working condition conducted emission test probe comprises the following steps:

[0005] S1. Construct an electromagnetic field simulation model for the working scenario of the conducted emission detection probe, and obtain the voltage and current of each component in the working scenario of the conducted emission detection probe according to the electromagnetic field simulation model, and calculate the electromagnetic loss power of each component in the working scenario of the conducted emission detection probe;

[0006] The step S1 comprises:

[0007] S101. Given the components of the conducted emission detection probe working scenario: Assume that the working scenario is to use the conducted emission detection probe to test the cable under test, where the conducted emission detection probe includes a magnetic core, a winding coil, and a filling medium; then the conducted emission detection probe working scenario includes four components, namely, the magnetic core, the winding coil, the filling medium, and the cable under test;

[0008] S102. Construct a three-dimensional model of each component in the working scene of the conducted emission detection probe;

[0009] S103. Add material parameters for each component and the changes of material parameters with temperature:

[0010] The material parameters mainly include magnetic permeability μ, dielectric constant ε and electrical conductivity σ;

[0011] The material parameters that vary with temperature include:

[0012] For each component, the material parameters include magnetic permeability μ, dielectric constant ε and electrical conductivity σ;

[0013] The material parameters that vary with temperature include:

[0014] The magnetic permeability varies with temperature. For each component, the magnetic permeability μ at room temperature is first given, and then the magnetic permeabilities μ1, μ2, ..., μ at different N high temperature extreme conditions are given. N , where N represents the total number of temperatures of the high temperature limit condition; the magnetic permeability at different temperatures is linearly interpolated to obtain the magnetic permeability versus temperature curve, so that the magnetic permeability changes with temperature;

[0015] Change of conductivity with temperature: For each component, the conductivity at the reference temperature t1 is recorded as σ, and the conductivity change coefficient at different N high temperature extreme conditions is given. The conductivity change with temperature is obtained by multiplying the conductivity σ at the reference temperature t1 by the conductivity change coefficient;

[0016] Dielectric constant changes with temperature: For each component, the dielectric constant at room temperature t1 is given as ε, and the dielectric constants at different N high temperature extreme conditions are given as ε1, ε2...ε N, linear interpolation of dielectric constants at different temperatures is performed to obtain the dielectric constant vs. temperature curve as the core permeability, and the dielectric constant of the medium changes with temperature;

[0017] In order to simplify the modeling, for the magnetic core, the change of magnetic permeability is mainly considered. For the winding coil and the tested cable, their materials are copper, and only the change of conductivity is considered. Assuming that the temperature under one high temperature limit is t2, then:

[0018]

[0019] For filling media, the change of dielectric constant is mainly considered.

[0020] S104. Set the system input and load: set the measured current on the measured cable to I1, and set the output end of the winding coil to a 50Ω resistor R as the load;

[0021] S105. Set the size conditions of the simulation electromagnetic field grid: Set the operating frequency f, according to the formula Calculate the skin depth d of the metal and set the internal mesh size of the winding coil and the cable under test to no more than d / 2;

[0022] S106. According to the settings of steps S102 to S105, an electromagnetic field simulation model of the conducted emission detection probe working scenario is constructed in the simulation software, and the parasitic capacitance C, the winding coil inductance L, and the induced voltage U across the winding coil output load R of the conducted emission detection probe at room temperature are obtained by simulation. The transmission impedance Z at the working frequency f and the resonant frequency are calculated by the formula Z=U / I1.

[0023] Among them, parasitic capacitance C refers to the sum of distributed capacitance existing on the winding coil under normal temperature conditions; resonant frequency refers to the operating frequency that causes parasitic capacitance C and winding coil inductance L to resonate, that is, when the operating frequency f is equal to the resonant frequency, the transmission impedance will suddenly change, causing the probe to fail to work normally;

[0024] S107. Obtain the voltage and current of each component of the conducted emission detection probe from the simulation software, and obtain the electromagnetic loss power of each component according to the power formula W=U·I.

[0025] S2. Combined with the electromagnetic loss power of each component in the working scenario of the conducted emission detection probe, a temperature field simulation model in the working scenario of the conducted emission detection probe is constructed, and the temperature distribution of each component in the working scenario of the conducted emission detection probe is obtained according to the temperature field simulation model;

[0026] The step S2 comprises:

[0027] S201. Set material parameters: add thermal analysis parameters of each component in the working scene of the conduction emission detection probe, including: material heat transfer coefficient and specific heat capacity;

[0028] S202. Setting thermal simulation environment conditions: setting the ambient temperature of the conducted emission detection probe to any one of the N high temperature limit conditions, and using the electromagnetic loss obtained in step S1 as the input load in the temperature field simulation;

[0029] S203. Set the size conditions of the temperature field grid of the temperature field simulation software, that is, set the maximum temperature grid size x1, where x1 is a custom preset size, and make it as uniform and regular as possible under the resource conditions of the simulation software to ensure good convergence and accuracy;

[0030] S204. According to the settings of steps S201 to S203, a temperature field simulation model of the conducted emission detection probe in the working scenario is constructed using temperature field simulation software, and temperature simulation is performed to obtain accurate temperature distribution of the conducted emission detection probe.

[0031] S3. Combined with the temperature distribution of each component in the working scene of the conducted emission detection probe, a mechanical field simulation model of the working scene of the conducted emission detection probe is constructed, and according to the mechanical field simulation model, the structural thermal deformation results of each component in the working scene of the conducted emission detection probe are obtained;

[0032] The step S3 comprises:

[0033] S301. Set material parameters: add material parameters related to structural analysis for each component, including thermal expansion coefficient, elastic modulus and Poisson's ratio;

[0034] S302. Add simulation settings of mechanical field simulation software: use the heat distribution obtained in step S2 as the initial condition for mechanical field analysis;

[0035] S303. Set the size conditions of the mechanical field grid of the mechanical field simulation software, that is, set the maximum grid size of the mechanical field to x2, where x2 is a custom preset size, and make it as uniform and regular as possible under the resource conditions of the simulation software to ensure good convergence and accuracy

[0036] S304. According to the settings of steps S301 to S303, a mechanical field simulation model of the working scene of the conducted emission detection probe is constructed by mechanical field simulation software, and the conducted emission detection probe is simulated to obtain accurate thermal deformation results;

[0037] S305. Output the thermal deformation results of the conducted emission detection probe structure in the form of a three-dimensional model.

[0038] S4. Combined with the structural thermal deformation results of each component in the working scenario of the conducted emission detection probe, an electromagnetic field simulation model of the working scenario of the conducted emission detection probe under thermal deformation conditions is constructed. According to the electromagnetic field simulation model, the equivalent circuit parameters are obtained, and the performance indicators of the conducted emission inspection probe are calculated.

[0039] The step S4 comprises:

[0040] S401. Add simulation settings: use the three-dimensional model of the thermal deformation results of the conducted emission detection probe as the simulation model, and the temperature distribution as the initial condition for electromagnetic field analysis;

[0041] S402. The parasitic capacitance C′ and the winding coil inductance L′ of the conducted emission detection probe are obtained by simulation under the influence of the high temperature t2 and the thermal deformation of the structure, and the induced voltage U′ across the winding coil output load R is obtained by simulation;

[0042] Among them, the parasitic capacitance C′ is the sum of the distributed capacitance existing on the winding coil under the influence of high temperature t2 and structural thermal deformation;

[0043] S403. Calculate the performance indicators of the conducted emission test probe:

[0044] Calculate the transmission impedance Z′=U′ / I1 of the conducted emission detection probe under the influence of high temperature t2 and structural thermal deformation, and the resonant frequency is

[0045] S404. Calculate the absolute value of the difference between Z′ and the transmission impedance Z under normal temperature conditions. The smaller the absolute value of the difference, the better the stability of the conducted emission detection probe; and when the operating frequency is set at high temperature t2, it is lower than the resonant frequency, thereby avoiding the influence of resonance on normal operation. In this application, the performance of the conducted emission detection probe is mainly reflected in the transmission impedance and the resonant frequency. By analyzing the change of the transmission impedance under extreme high temperature conditions, the test results of the conducted emission inspection probe can be made more accurate under extreme high temperature conditions; by analyzing the resonant frequency, the operating frequency can be made lower than the resonant frequency to avoid the influence on normal operation.

[0046] At high temperature t2, the performance of the conducted emission detection probe at different frequencies can also be evaluated by setting different operating frequencies;

[0047] Under the N different high temperature extreme working conditions, for any high temperature, the transmission impedance and resonant frequency analysis can be performed according to steps S2 to S4.

[0048] The beneficial effects of the present invention are as follows: during the operation of the conduction emission detection probe, heat is generated and the conduction emission detection probe is in an extreme high temperature working condition. At this time, the material properties of the components will change with the change of temperature, and due to the high temperature, the components will inevitably undergo thermal deformation, which changes the spacing between the components, thereby causing the parasitic parameters between the components to be affected by the dual influence of temperature and structural deformation. The performance of the probe is affected. The present invention uses three-dimensional electromagnetic field, thermal and mechanical field simulation analysis software to more accurately obtain the performance changes of the conduction detection probe under extreme high temperature conditions, providing data support for the optimization of high-temperature conduction emission detection probes. BRIEF DESCRIPTION OF THE DRAWINGS

[0049] Figure 1 is a flow chart of the method of the present invention;

[0050] Figure 2 It is a simulation flow chart of multi-physical field coupling effect of the conducted emission detection probe under high temperature extreme working conditions of the present invention;

[0051] Figure 3 It is a schematic diagram of the simulation model of the conducted emission detection probe;

[0052] Figure 4 This is the encrypted grid diagram of the simulation model of the conducted emission detection probe within the skin depth;

[0053] Figure 5 It is the magnetic density distribution diagram of the magnetic core of the conducted emission detection probe;

[0054] Figure 6 This is the temperature distribution diagram of the simulation model of the conducted emission detection probe under extreme high temperature conditions;

[0055] Figure 7 This is the mechanical field mesh diagram of the conducted emission detection probe model;

[0056] Figure 8 This is the result diagram of the structural thermal deformation of the simulation model of the conducted emission detection probe;

[0057] Fig. 9 This is the transmission impedance frequency response curve of the conducted emission detection probe. DETAILED DESCRIPTION

[0058] The technical solution of the present invention is further described in detail below in conjunction with the accompanying drawings, but the protection scope of the present invention is not limited to the following.

[0059] Through the three-dimensional electromagnetic field, thermal and mechanical field simulation analysis software, the performance changes of the conductive detection probe under high temperature extreme conditions can be obtained more accurately. Based on the multi-physical field coupling effect modeling and simulation method, it can provide more accurate data support for analyzing the measurement accuracy fluctuation of the conductive emission detection probe under high temperature extreme conditions, the forward design and optimization of the high temperature conductive emission detection probe: First, the electromagnetic simulation model of the conductive emission detection probe is established through the electromagnetic field simulation software. By simulating the electromagnetic field changes in space, the current distribution and magnetic field distribution on different parts of the conductive emission detection probe are calculated, and then the distribution parameter changes of the conductive emission detection probe are obtained to obtain its transmission impedance, cutoff frequency and other performance indicators. Because the temperature change and mechanical deformation of the conductive emission detection probe cannot be calculated in the electromagnetic field simulation, it is coupled with other physical fields for simulation. By calculating the electromagnetic loss of the conductive emission detection probe under normal temperature conditions, the model electromagnetic loss is used as the input load in the temperature field simulation, and the temperature and fluid state of the conductive emission detection probe are set in the temperature field simulation to simulate the actual high temperature extreme working environment of the probe. Finally, through temperature field simulation, the temperature distribution of the conduction emission detection probe is simulated and calculated and fed back to the electromagnetic field simulation, and the electromagnetic loss and performance changes of the conduction emission detection probe model at this temperature are recalculated. After repeated coupling several times, a more accurate temperature distribution of the conduction emission detection probe model will be obtained. In the mechanical field software, the corresponding contact form and constraint conditions are set, and the obtained model temperature distribution is used as the initial condition of the heat source. The structural deformation of the probe structure under the temperature condition and electromagnetic action is simulated and calculated, and the magnetic field distribution of the deformed model is recalculated. Through the extracted parasitic parameters, the field-path collaborative calculation is performed to obtain the transmission impedance of the conduction emission detection probe, thereby realizing the modeling and simulation of the multi-physical field coupling effect of the conduction emission detection probe in the electromagnetic environment of extreme working conditions such as high temperature. Specifically:

[0060] like Figure 1 As shown, a performance analysis method for a high temperature extreme working condition conducted emission test probe comprises the following steps:

[0061] S1. Construct an electromagnetic field simulation model for the working scenario of the conducted emission detection probe, and obtain the voltage and current of each component in the working scenario of the conducted emission detection probe according to the electromagnetic field simulation model, and calculate the electromagnetic loss power of each component in the working scenario of the conducted emission detection probe;

[0062] According to the coupling relationship analysis of the conducted emission detection probe, the multi-physical field coupling effect simulation process of the conducted emission detection probe is established, such as Figure 2 A conducted emission detection probe mainly includes three parts during operation: winding, magnetic core, and tested cable. Figure 3As shown. Import the current probe CAD model into the Maxwell electromagnetic simulation module in the workbench. It is necessary to assign material properties to each component. Since the cable and winding models do not contain an insulation layer, the model material can be set to copper. The cable is considered to be made of multiple turns of copper wire tightly wound, while the winding is considered to be made of a single turn of wire. The insulating medium is polyvinyl chloride, and the core is made of Ferrite ferrite material.

[0063] In order to ensure that the emission conduction detection probe can have good measurement accuracy in a high temperature environment, it is first necessary to simulate and model the electromagnetic performance of the conduction emission detection probe under multi-physical field coupling. First, since the conduction emission monitoring probe mainly detects the magnetic field changes generated by the cable, it generates induced voltage and current in the winding through the law of electromagnetic induction. Because the model needs to be bidirectionally coupled with the icepak temperature field simulation software for subsequent simulation. Therefore, it is necessary to define the temperature characteristics of the material.

[0064] The material properties of copper (mainly conductivity) will change with temperature, thereby changing the size of the distributed resistance, which in turn affects the temperature distribution of the conduction emission detection probe, causing the distributed parameters on the conduction emission detection probe structure to change in different areas due to the temperature distribution, and ultimately affecting the transmission impedance and other performance of the conduction emission detection probe. The core material properties play a key role in affecting the transmission impedance of the current probe. Therefore, it is necessary to accurately define the temperature characteristics of the core material. Taking the core magnetic permeability as an example, the core magnetic permeability temperature variation coefficient can be obtained by dividing the magnetic permeability at different temperatures with the magnetic permeability at room temperature. The core magnetic permeability at room temperature is used as the initial parameter in the simulation, and the temperature coefficient is multiplied by the magnetic permeability at room temperature to obtain the magnetic permeability under high temperature extreme conditions. In addition, it is also necessary to set the dielectric constant and loss angle of filling insulating dielectric materials such as polyvinyl chloride under room temperature and high temperature extreme conditions as they change with temperature.

[0065] Due to the skin effect and proximity effect, the AC current will be mainly distributed on the surface of the winding model. The current magnitude decays exponentially from the surface to the center of the coil. Therefore, if the winding resistance is to be accurately calculated, the mesh within the skin depth of the coil must be encrypted to ensure that there are at least 2 layers of mesh on the coil surface to ensure the accuracy of resistance calculation. The cross-section mesh of a single-turn coil is as follows: Figure 4 As shown. After the solution is completed, the output voltage on the 50Ω load is obtained. The output voltage of the conducted emission detection probe at room temperature and 10MHz is 1.49mV, the measured current is 1.12mA, the electromagnetic loss is 0.0009W for the cable, and 0.00636W for the winding coil. The transmission impedance of the conducted emission detection probe is 1.33Ω, the distributed capacitance is 2.658pF, the distributed inductance is 12uH, and the resonant frequency is 28.2MHz. At this time, the magnetic flux density on the magnetic core is evenly distributed, so the measurement is more accurate. The magnetic flux density distribution of the magnetic core of the conducted emission detection probe is as follows: Figure 5 shown.

[0066] S2. Combined with the electromagnetic loss power of each component in the working scenario of the conducted emission detection probe, a temperature field simulation model in the working scenario of the conducted emission detection probe is constructed, and the temperature distribution of each component in the working scenario of the conducted emission detection probe is obtained according to the temperature field simulation model;

[0067] This requires bidirectional coupling simulation of Maxwell and icepak temperature field software to import electromagnetic loss into icepak. After importing electromagnetic loss, icepak completes the corresponding temperature field calculation and feeds back the temperature field results to Maxwell after each iteration converges. After repeated coupling feedback, when the results converge, a more accurate temperature distribution of the current probe in a high temperature environment is obtained, such as Figure 6 shown.

[0068] S3. Combined with the temperature distribution of each component in the working scene of the conducted emission detection probe, a mechanical field simulation model of the working scene of the conducted emission detection probe is constructed, and according to the mechanical field simulation model, the structural thermal deformation results of each component in the working scene of the conducted emission detection probe are obtained;

[0069] After completing the temperature field simulation, it is necessary to perform structural field simulation on the current probe, apply the temperature distribution of the conduction emission detection probe to the mechanical field simulation software Mechanical as the initial condition of the simulation, set the corresponding constraints and boundary conditions for the conduction emission detection probe, and divide the mechanical field grid as follows: Figure 7 , the thermal deformation results of the current probe under extreme high temperature conditions are solved through mechanical field simulation, such as Figure 8 shown.

[0070] S4. Combined with the structural thermal deformation results of each component in the working scenario of the conducted emission detection probe, an electromagnetic field simulation model of the working scenario of the conducted emission detection probe under thermal deformation conditions is constructed. According to the electromagnetic field simulation model, the equivalent circuit parameters are obtained, and the performance indicators of the conducted emission inspection probe are calculated.

[0071] In order to accurately analyze the impact of temperature and structural deformation on the performance of the conducted emission detection probe, the thermal deformation model of the probe is exported, and the electromagnetic field simulation calculation is performed again on the model. Through field-circuit collaborative simulation, the influence of parasitic parameters can be considered in the electromagnetic field simulation calculation process to obtain more accurate electromagnetic simulation results. After re-simulating the electromagnetic field, the results in the Maxwell software show that the output voltage of the conducted emission detection probe is 4.437mV at 80°C, and the measured current is still 1.12mA. At this time, the transmission impedance is 3.96Ω, and the transmission impedance changes by 2.77 times. The distributed capacitance changes to 1.858pF due to the influence of temperature, and the distributed inductance is 26uH, and the resonant frequency is 22.90MHz. The conducted emission detection probe model is simulated at different operating frequencies, and its output voltage frequency response curve before the resonant frequency is as follows: Fig. 9 shown.

[0072] The present invention can provide relatively accurate data support for analyzing the fluctuation of measurement accuracy of conducted emission detection probes under extreme high temperature conditions, and for the forward design and optimization of high temperature conducted emission detection probes. It can realize error calibration of measurement results of conducted emission detection probes in non-standard electromagnetic measurement environments, overcome the problem of large measurement errors caused by performance fluctuations of traditional conducted emission detection probes in actual working environments, and support future engineering applications.

[0073] The above description shows and describes a preferred embodiment of the present invention, but as mentioned above, it should be understood that the present invention is not limited to the form disclosed herein, and should not be regarded as excluding other embodiments, but can be used in various other combinations, modifications and environments, and can be modified within the scope of the invention concept described herein through the above teachings or the technology or knowledge of the relevant field. And the changes and modifications made by those skilled in the art do not depart from the spirit and scope of the present invention, and should be within the scope of protection of the claims attached to the present invention.

Claims

1. A performance analysis method for a high temperature extreme working condition conducted emission test probe, characterized in that: The following steps are involved: S1. Construct an electromagnetic field simulation model for the working scenario of the conducted emission detection probe, and obtain the voltage and current of each component in the working scenario of the conducted emission detection probe according to the electromagnetic field simulation model, and calculate the electromagnetic loss power of each component in the working scenario of the conducted emission detection probe; S2. Combined with the electromagnetic loss power of each component in the working scenario of the conducted emission detection probe, a temperature field simulation model in the working scenario of the conducted emission detection probe is constructed, and the temperature distribution of each component in the working scenario of the conducted emission detection probe is obtained according to the temperature field simulation model; S3. Combined with the temperature distribution of each component in the working scene of the conducted emission detection probe, a mechanical field simulation model of the working scene of the conducted emission detection probe is constructed, and according to the mechanical field simulation model, the structural thermal deformation results of each component in the working scene of the conducted emission detection probe are obtained; S4. Combined with the structural thermal deformation results of each component in the working scenario of the conducted emission detection probe, an electromagnetic field simulation model of the working scenario of the conducted emission detection probe under thermal deformation conditions is constructed. According to the electromagnetic field simulation model, the equivalent circuit parameters are obtained, and the performance indicators of the conducted emission inspection probe are calculated.

2. The performance analysis method of a high temperature extreme working condition conducted emission inspection probe according to claim 1 is characterized in that: The step S1 comprises: S101. Given components of a conducted emission detection probe in a working scenario: Assume that the working scenario is to use a conducted emission detection probe to test a cable under test, wherein the conducted emission detection probe comprises a magnetic core and a winding coil wound on the magnetic core, and the magnetic core and the winding coil are encapsulated by a filling material; The working scene of the conducted emission detection probe contains four components, namely the magnetic core, winding coil, filling medium and the cable under test; S102. Construct a three-dimensional model of each component in the working scene of the conducted emission detection probe; S103. Add material parameters for each component and the changes of material parameters with temperature: For each component, the material parameters include magnetic permeability μ, dielectric constant ε and electrical conductivity σ; The material parameters that vary with temperature include: The magnetic permeability varies with temperature. For each component, the magnetic permeability μ at room temperature is first given, and then the magnetic permeability μ1, μ2, ... μ at different N high temperature extreme conditions are given. N , where N represents the total number of temperatures of the high temperature limit condition; the magnetic permeability at different temperatures is linearly interpolated to obtain the magnetic permeability versus temperature curve, so that the magnetic permeability changes with temperature; Change of conductivity with temperature: For each component, the conductivity at the reference temperature t1 is recorded as σ, and the conductivity change coefficient at different N high temperature extreme conditions is given. The conductivity change with temperature is obtained by multiplying the conductivity σ at the reference temperature t1 by the conductivity change coefficient; Dielectric constant changes with temperature: For each component, the dielectric constant at room temperature t1 is given as ε, and the dielectric constants at different N high temperature extreme conditions are given as ε1, ε2...ε N , linear interpolation of dielectric constants at different temperatures is performed to obtain the dielectric constant vs. temperature curve as the core permeability, and the dielectric constant of the medium changes with temperature; S104. Set the system input and load: set the measured current on the measured cable to I1, and set the output end of the winding coil to a 50Ω resistor R as the load; S105. Set the size conditions of the simulation electromagnetic field grid: Set the operating frequency f, according to the formula Calculate the skin depth d of the metal and set the internal mesh size of the winding coil and the cable under test to no more than d / 2; S106. According to the settings of steps S102 to S105, an electromagnetic field simulation model of the conducted emission detection probe working scenario is constructed in the simulation software, and the parasitic capacitance C, the winding coil inductance L, and the induced voltage U across the winding coil output load R of the conducted emission detection probe at room temperature are obtained by simulation. The transmission impedance Z at the working frequency f and the resonant frequency are calculated by the formula Z=U / I1. Among them, parasitic capacitance C refers to the sum of distributed capacitance existing on the winding coil under normal temperature conditions; resonant frequency refers to the operating frequency that causes parasitic capacitance C and winding coil inductance L to resonate, that is, when the operating frequency f is equal to the resonant frequency, the transmission impedance will suddenly change, causing the probe to fail to work normally; S107. Obtain the voltage and current of each component of the conducted emission detection probe from the simulation software, and obtain the electromagnetic loss power of each component according to the power formula W=U·I.

3. The performance analysis method of a high temperature extreme working condition conducted emission inspection probe according to claim 2 is characterized by: The step S2 comprises: S201. Set material parameters: add thermal analysis parameters of each component in the working scene of the conduction emission detection probe, including: material heat transfer coefficient and specific heat capacity; S202. Setting the thermal simulation environment conditions of the temperature field simulation software: setting the ambient temperature of the conducted emission detection probe to any high temperature t2 among the temperatures of N high temperature extreme conditions, and using the electromagnetic loss obtained in step S1 as the input load in the temperature field simulation; S203. Setting the size conditions of the temperature field grid of the temperature field simulation software, that is, setting the maximum temperature grid size; S204. According to the settings of steps S201 to S203, a temperature field simulation model of the conducted emission detection probe in the working scenario is constructed using temperature field simulation software, and temperature simulation is performed to obtain accurate temperature distribution of the conducted emission detection probe.

4. The performance analysis method of a high temperature extreme working condition conducted emission inspection probe according to claim 1 is characterized in that: The step S3 comprises: S301. Set material parameters: add material parameters related to structural analysis for each component, including thermal expansion coefficient, elastic modulus and Poisson's ratio; S302. Add simulation settings of mechanical field simulation software: use the heat distribution obtained in step S2 as the initial condition for mechanical field analysis; S303. Setting the size conditions of the mechanical field grid of the mechanical field simulation software, ie, setting the maximum grid size of the mechanical field; S304. According to the settings of steps S301 to S303, a mechanical field simulation model of the working scene of the conducted emission detection probe is constructed by mechanical field simulation software, and the conducted emission detection probe is simulated to obtain accurate thermal deformation results; S305. Output the thermal deformation results of the conducted emission detection probe structure in the form of a three-dimensional model.

5. The performance analysis method of a high temperature extreme working condition conducted emission inspection probe according to claim 1 is characterized in that: The step S4 comprises: S401. Add simulation settings: use the three-dimensional model of the thermal deformation results of the conducted emission detection probe as the simulation model, and the temperature distribution as the initial condition for electromagnetic field analysis; S402. The parasitic capacitance C′ and the winding coil inductance L′ of the conducted emission detection probe are obtained by simulation under the influence of the high temperature t2 and the thermal deformation of the structure, and the induced voltage U′ across the winding coil output load R is obtained by simulation; Among them, the parasitic capacitance C′ is the sum of the distributed capacitance existing on the winding coil under the influence of high temperature t2 and structural thermal deformation; S403. Calculate the performance indicators of the conducted emission test probe: Calculate the transmission impedance Z′=U′ / I1 of the conducted emission detection probe under the influence of high temperature t2 and structural thermal deformation, and the resonant frequency is S404. Calculate the absolute value of the difference between Z′ and the transmission impedance Z at normal temperature. The smaller the absolute value of the difference, the better the stability of the conducted emission detection probe. When setting the operating frequency at high temperature t2, the operating frequency needs to be lower than the resonant frequency to avoid the influence of resonance on normal operation.

Images