Method for improving burning and testing efficiency of PCBA
The ICT test start signal is directly connected to the PCBA through the burner, and the ICT test start signal is sent and tested, which solves the problems of complex operation, unstable signal and high cost in the existing technology, and realizes a more efficient and stable PCBA burning and testing process.
Patent Information
- Application Number
- CN202411507963.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-28
- Publication Date
- 2025-02-28
AI Technical Summary
The existing PCBA burning and testing methods have problems such as complex operation, unstable signal transmission and high testing costs.
The burner directly connects to the PCBA. The burner sends the ICT test start signal. The PCBA executes the ICT test program and records the results. The burner performs logic processing to determine whether the test passes or fails.
It reduces the cost and failure rate of ICT tests, simplifies operations, improves the stability of signal transmission, and avoids software and hardware changes of PCB.
Smart Images
Figure CN119535153A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the technical field of PCBA burning and testing, and in particular to a method for improving the burning and testing efficiency of PCBA. Background Art
[0002] In the manufacturing process of PCBA, ICT testing is an indispensable step to check whether the PCBA meets the design requirements. The existing PCBA ICT testing process is as follows: first, the PCBA is programmed, then the PCBA is taken out and connected to the ICT test equipment, then the ICT test signal is sent to the ICT test equipment through the ICT test signal sending device, then the ICT test is performed, and finally the PCBA is removed from the ICT test equipment. The existing testing process has the following problems in actual use:
[0003] 1. The existing ICT test signal sending method requires the use of a dedicated ICT test signal sending device, and the device needs to be manually connected during the operation, which is complicated. Moreover, different physical devices and multiple sets of contacts are required for burning and ICT testing at two different positions, and multiple processes and physical contacts are prone to high failure rates.
[0004] Second, the existing ICT test signal transmission method is easily affected by external interference during the signal transmission process, resulting in unstable signal transmission and affecting the test results;
[0005] 3. Existing ICT test signal transmission equipment is expensive, which increases enterprise costs;
[0006] 4. Not performing ICT testing directly after burning will cause changes in PCB hardware and software. Summary of the invention
[0007] In view of the shortcomings of the background technology, the present invention provides a method for improving the burning and testing efficiency of PCBA. The technical problem to be solved is that the existing burning and testing methods of PCBA have the problems of complex operation, unstable signal transmission and high testing cost.
[0008] To solve the above technical problems, the present invention provides the following technical solutions: A method for improving the burning and testing efficiency of PCBA, comprising the following steps:
[0009] S1: First connect the burner to the PCBA, then the burner burns the program to the PCBA, and after the program is burned successfully, execute step S2;
[0010] S2: The programmer sends an ICT test start signal to the PCBA;
[0011] S3: After receiving the ICT test start signal, the PCBA starts to execute the ICT test program to perform the ICT test and record the ICT test results;
[0012] S4: PCBA sends the ICT test result to the programmer;
[0013] S5: The programmer performs logic processing on the ICT test result to determine whether the ICT test of the PCBA passes or fails.
[0014] In some implementations, in step S1, the connection process between the programmer and the PCBA is as follows:
[0015] The programmer sends a check connection signal to the PCBA using a corresponding protocol according to the chip ID programmed on the PCBA. After receiving the check connection signal, the PCBA sends the chip ID and chip control right to the programmer. After receiving the chip ID and obtaining the chip control right, the programmer starts program programming.
[0016] In some implementations, in step S1, the method for determining whether the program burning is successful is as follows:
[0017] After the programmer burns a part of the program, the programmer and the PCBA calculate the sum of the part of the data by checksum, respectively, and obtain the calibration sum value and the test sum value. If the calibration sum value and the test sum value are the same, the part of the program is burned successfully.
[0018] And so on, until all programs are burned.
[0019] In some implementations, in step S2, the programmer sends a test start signal to the PCBA using a corresponding protocol according to the ID of the chip programmed on the PCBA.
[0020] In some implementations, in step S3, the ICT test program performs ICT testing by at least one of a vector test method, a non-vector test method, and a boundary scan method.
[0021] In some embodiments, the ICT test includes at least one of a short circuit test, a wrong component test, a missing component test, a performance test, an electrical function test of active parts, an open circuit test, a component straight test, and a component polarity test.
[0022] In some implementations, in step S5, the process by which the programmer determines whether the ICT test of the PCBA has passed or failed is as follows:
[0023] The programmer compares the test result with the standard test result to determine whether the ICT test passes or fails.
[0024] In a certain implementation manner, after the multiple PCBAs complete the ICT test, the burner feeds back the final test results of the multiple PCBAs to the operator.
[0025] In a certain implementation manner, the burner feeds back the final test results of the plurality of PCBAs to the operator by generating a system log.
[0026] In a certain implementation manner, the system log includes success rate information, function coverage information, exception coverage information, and boundary condition coverage information of the ICT test.
[0027] Compared with the prior art, the present invention has the following beneficial effects: when the method of the present invention is actually used, after the burner burns the program, the burner sends a test start signal to the PCBA to start the ICT test of the PCBA, firstly, an additional ICT test signal sending device is saved, and the ICT test cost of the PCBA is reduced; and since burning and ICT testing do not need to be performed at different positions, the failure rate is reduced, and there is no need to worry about the problem of software and hardware changes of the PCB; secondly, since the PCBA does not need to be connected to the ICT test signal sending device, some physical devices, contacts and manual connection steps are saved, and the operation is simple; finally, the ICT test signal is sent through the burning interface of the online burner, which effectively reduces external interference and improves the stability of signal transmission. BRIEF DESCRIPTION OF THE DRAWINGS
[0028] Figure 1 Flow chart of the method of the present invention in the embodiment. DETAILED DESCRIPTION
[0029] The illustrative embodiments of the present application include, but are not limited to, a method for improving the burning and testing efficiency of a PCBA.
[0030] Exemplary embodiments will be described in detail herein, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, the same numbers in different drawings represent the same or similar elements unless otherwise indicated. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present application. Instead, they are merely examples of devices and methods consistent with some aspects of the present application as detailed in the appended claims.
[0031] The terms used in this application are only for the purpose of describing specific embodiments and are not intended to limit this application. The singular forms of "a", "said" and "the" used in this application and the appended claims are also intended to include plural forms, unless the context clearly indicates other meanings. It should also be understood that the term "and / or" used in this article refers to and includes any or all possible combinations of one or more associated listed items. "Include" or "include" and similar words mean that the elements or objects appearing in front of "include" or "include" cover the elements or objects listed after "include" or "include" and their equivalents, and do not exclude other elements or objects. "Connect" or "connected" and similar words are not limited to physical or mechanical connections, and can include electrical connections, whether direct or indirect.
[0032] It should be understood that although the terms first, second, third, etc. may be used in the present application to describe various information, these information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other. For example, without departing from the scope of the present application, the first information may also be referred to as the second information, and similarly, the second information may also be referred to as the first information. Depending on the context, the word "if" as used herein may be interpreted as "at the time of" or "when" or "in response to determining".
[0033] like Figure 1 As shown, a method for improving the burning and testing efficiency of PCBA includes the following steps:
[0034] S1: First connect the burner to the PCBA, and then the burner burns the program to the PCBA. After the program is burned successfully, execute step S2.
[0035] Specifically, in this embodiment, in step S1, the connection process between the programmer and the PCBA is as follows:
[0036] The programmer uses the corresponding protocol to send a check connection signal to the PCBA according to the chip ID with programming on the PCBA. After receiving the check connection signal, the PCBA sends the chip ID and chip control right to the programmer. After receiving the chip ID and obtaining the chip control right, the programmer starts program programming.
[0037] In addition, in step S1, the method for determining whether the program burning is successful is as follows:
[0038] After the programmer burns a part of the program, the programmer and PCBA calculate the sum of the partial data through the checksum method to obtain the calibration sum value and the test sum value respectively. If the calibration sum value and the test sum value are the same, the partial program is burned successfully;
[0039] And so on, until all programs are burned.
[0040] S2: The programmer sends an ICT test start signal to the PCBA.
[0041] Specifically, in this embodiment, in step S2, the programmer sends a test start signal to the PCBA using a corresponding protocol according to the ID of the chip programmed on the PCBA.
[0042] S3: After receiving the ICT test start signal, the PCBA starts to execute the ICT test program to perform the ICT test and record the ICT test results.
[0043] Specifically, in this embodiment, in step S3, the ICT test program performs the ICT test by using at least one of a vector test mode, a non-vector test mode and a boundary scan mode.
[0044] For digital ICs, vector testing can be used, which is similar to truth table measurement, stimulating input vectors and measuring output vectors, and judging the quality of the device through actual logic function testing. For analog IC testing, the corresponding output is measured based on the actual IC function stimulation voltage and current.
[0045] For non-vector test methods, such as DeltaScan analog junction test technology and FrameScan capacitive coupling test technology, they are used to detect manufacturing defects such as missing components, reverse insertion, and wire detachment.
[0046] For boundary scan technology, the device pins are controlled and detected through the test access port (TAP), which solves the difficulty of not being able to increase test points and provides a simple and fast method to generate test patterns.
[0047] Specifically, in this embodiment, the ICT test includes at least one of a short circuit test, a wrong component test, a missing component test, a performance test, an electrical function test of active parts, an open circuit test, a component straight test, and a component polarity test.
[0048] S4: PCBA sends the ICT test results to the programmer.
[0049] S5: The programmer performs logic processing on the ICT test results to determine whether the PCBA ICT test has passed or failed.
[0050] Specifically, in this embodiment, in step S5, the process by which the programmer determines whether the ICT test of the PCBA passes or fails is as follows:
[0051] The programmer compares the test results with the standard test results to determine whether the ICT test has passed or failed.
[0052] In addition, in this embodiment, after the multiple PCBAs complete the ICT test, the burner feeds back the final test results of the multiple PCBAs to the operator.
[0053] More specifically, the burner feeds back the final test results of multiple PCBAs to the operator by generating a system log.
[0054] When displayed, the system log includes the success rate information, function coverage information, exception coverage information and boundary condition coverage information of the ICT test.
[0055] The success rate information refers to the proportion of circuit board failures that can be accurately detected by ICT testing. A high success rate means that the test process is accurate and reliable, and can promptly detect and solve potential problems on the circuit board;
[0056] Functional coverage refers to the degree to which test cases cover product functions. It is used to evaluate whether the test cases cover all key functions of the product to ensure that the product can work properly in various usage scenarios. The higher the functional coverage, the more complete the product's functions;
[0057] Exception coverage refers to the degree to which test cases cover abnormal situations. It is used to evaluate whether test cases can discover and handle abnormal situations that may occur during product use. High exception coverage means that the product has better stability and reliability and can cope with various unexpected situations;
[0058] Boundary condition coverage refers to the degree to which test cases cover boundary conditions. Boundary conditions refer to extreme or special values of input parameters or system states, which are often prone to cause system errors. Therefore, testing these boundary conditions is crucial to ensure the robustness and reliability of the system. High boundary condition coverage can improve the fault tolerance and robustness of the product.
[0059] In summary, when the method of the present invention is actually used, after the burner burns the program, the burner sends a test start signal to the PCBA to start the ICT test of the PCBA. Firstly, an additional ICT test signal sending device is omitted, thereby reducing the ICT test cost of the PCBA. Secondly, since the PCBA does not need to be connected to the ICT test signal sending device, the manual connection step is omitted, and the operation is simple. Finally, the ICT test signal is sent through the burning interface of the online burner, thereby effectively reducing external interference and improving the stability of signal transmission.
[0060] The above is based on the present invention as an inspiration. Through the above description, relevant staff can make various changes and modifications without departing from the technical idea of this invention. The technical scope of this invention is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.
Claims
1. A method for improving the burning and testing efficiency of PCBA, characterized in that: The steps include: S1: First connect the burner to the PCBA, then the burner burns the program to the PCBA, and after the program is burned successfully, execute step S2; S2: The programmer sends an ICT test start signal to the PCBA; S3: After receiving the ICT test start signal, the PCBA starts to execute the ICT test program to perform the ICT test and record the ICT test results; S4: PCBA sends the ICT test result to the programmer; S5: The programmer performs logic processing on the ICT test result to determine whether the ICT test of the PCBA passes or fails.
2. A method for improving the burning and testing efficiency of PCBA according to claim 1, characterized in that: In step S1, the connection process between the programmer and PCBA is as follows: The programmer sends a check connection signal to the PCBA using a corresponding protocol according to the chip ID programmed on the PCBA. After receiving the check connection signal, the PCBA sends the chip ID and chip control right to the programmer. After receiving the chip ID and obtaining the chip control right, the programmer starts program programming.
3. A method for improving the burning and testing efficiency of PCBA according to claim 1, characterized in that: In step S1, the method of determining whether the program burning is successful is as follows: After the programmer burns a part of the program, the programmer and the PCBA calculate the sum of the part of the data by checksum, respectively, and obtain the calibration sum value and the test sum value. If the calibration sum value and the test sum value are the same, the part of the program is burned successfully. And so on, until all programs are burned.
4. A method for improving the burning and testing efficiency of PCBA according to claim 1, characterized in that: In step S2, the programmer sends a test start signal to the PCBA using a corresponding protocol according to the ID of the chip programmed on the PCBA.
5. A method for improving the burning and testing efficiency of PCBA according to claim 1, characterized in that: In step S3, the ICT test program performs ICT testing by at least one of a vector test mode, a non-vector test mode and a boundary scan mode.
6. A method for improving the burning and testing efficiency of PCBA according to claim 1 or 5, characterized in that: The ICT test includes at least one of a short circuit test, a wrong component test, a missing component test, a performance test, an electrical function test of active parts, an open circuit test, a component straight test, and a component polarity test.
7. A method for improving the burning and testing efficiency of PCBA according to claim 1, characterized in that: In step S5, the process of the programmer judging whether the ICT test of the PCBA passes or fails is as follows: The programmer compares the test result with the standard test result to determine whether the ICT test passes or fails.
8. A method for improving the burning and testing efficiency of PCBA according to claim 1, characterized in that: After the multiple PCBAs complete the ICT test, the burner feeds back the final test results of the multiple PCBAs to the operator.
9. A method for improving the burning and testing efficiency of PCBA according to claim 8, characterized in that: The burner feeds back the final test results of multiple PCBAs to the operator by generating a system log.
10. A method for improving the burning and testing efficiency of PCBA according to claim 9, characterized in that: The system log includes the success rate information, function coverage information, exception coverage information and boundary condition coverage information of the ICT test.