Optical module

Abstract

The invention discloses an optical module which comprises a circuit board, and the circuit board comprises a first metal surface layer, a second metal surface layer and a first metal intermediate layer. The first metal surface layer is provided with golden fingers, the golden fingers are provided with elastic sheets, the golden fingers comprise high-frequency signal golden fingers, and a gap is formed in one side of each golden finger. The first metal middle layer is located below the first metal surface layer, and a first insulation supporting layer is arranged between the first metal middle layer and the first metal surface layer. The first metal intermediate layer in the projection area of the high-frequency signal golden finger does not have the metal layer so as to form a hollow area. The first insulating supporting layer in a projection area on one side of the high-frequency signal golden finger is hollowed out to form a first groove. According to the invention, the hollow area and the first groove increase the impedance of the high-frequency signal golden finger, and reduce the impedance mutation of the high-frequency signal golden finger caused by the connection of the elastic sheet and the high-frequency signal golden finger, thereby guaranteeing the impedance continuity of the high-frequency signal golden finger, and guaranteeing the transmission quality of a high-frequency signal.

Description

Technical Field

[0001] The present application relates to the field of optical fiber communications, and in particular to an optical module. Background Art

[0002] The optical module is usually a plug-in optical module, that is, the gold finger of the optical module needs to be plugged into the spring of the cage to achieve the plug-in connection between the optical module and the host computer.

[0003] For low-frequency attribute gold fingers, the cage's shrapnel contacting the low-frequency attribute gold fingers will not affect the impedance of the low-frequency attribute gold fingers, but for high-frequency attribute gold fingers, the cage's shrapnel contacting the high-frequency attribute gold fingers will have a greater impact on the impedance of the high-frequency attribute gold fingers. After the shrapnel contacts the high-frequency attribute gold fingers, the thickness of the high-frequency attribute gold fingers at the contact point is increased, and the high-frequency attribute gold fingers and shrapnel produce residual piles, which causes a sudden change in impedance in the area between the contact point of the high-frequency attribute gold fingers and the end of the high-frequency attribute gold fingers, causing the high-frequency signal to be reflected after being transmitted to the high-frequency attribute gold fingers, affecting the transmission quality of the high-frequency signal. Summary of the invention

[0004] The present application provides an optical module, which reduces the impedance mutation of the high-frequency signal gold finger caused by the connection between the spring piece and the high-frequency signal gold finger, thereby ensuring the impedance continuity of the high-frequency signal gold finger.

[0005] An optical module, comprising:

[0006] Circuit boards;

[0007] Among them, the circuit board includes:

[0008] The first metal surface layer is located on the upper surface of the circuit board and is provided with a gold finger; the surface of the gold finger is used to connect the spring to achieve electrical connection; a gap is provided on one side of the gold finger, and the gold finger includes a high-frequency signal gold finger;

[0009] A second metal surface layer is located on the lower surface of the circuit board;

[0010] The first metal intermediate layer is located between the first metal surface layer and the second metal surface layer, and below the first metal surface layer, and a first insulating support layer is arranged between the first metal surface layer; there is no metal layer in the first metal intermediate layer in the projection area of ​​the high-frequency signal gold finger; the first insulating support layer in the projection area on one side of the high-frequency signal gold finger is hollowed out.

[0011] An optical module, comprising:

[0012] Circuit boards;

[0013] Among them, the circuit board includes:

[0014] The first metal surface layer is located on the upper surface of the circuit board and is provided with a gold finger; the surface of the gold finger is used to connect the spring to achieve electrical connection; the gold finger includes a high-frequency signal gold finger, a first groove is provided on one side of the high-frequency signal gold finger, and the bottom surface of the first groove is a metal layer; within the projection area of ​​the high-frequency signal gold finger, there is no metal layer between the high-frequency signal gold finger and the metal layer on the bottom surface of the first groove; the high-frequency signal gold finger is arranged on the surface of the first insulating support layer;

[0015] The second metal surface layer is located on the lower surface of the circuit board; the metal layer on the bottom surface of the first groove is located between the first metal surface layer and the second metal surface layer.

[0016] Beneficial effects: The present application provides an optical module, including a circuit board. The circuit board includes a first metal surface layer, a second metal surface layer and a first metal intermediate layer, the first metal intermediate layer is the first metal layer below the first metal surface layer, the first metal surface layer is located on the upper surface of the circuit board, the second metal surface layer is located on the lower surface of the circuit board, the upper surface of the circuit board and the lower surface of the circuit board are arranged relative to each other, the first metal intermediate layer is located between the first metal surface layer and the second metal surface layer, the first metal intermediate layer is located below the first metal surface layer, and a first insulating support layer is arranged between the first metal intermediate layer and the first metal surface layer. The first metal surface layer is provided with a gold finger, and the surface of the gold finger is used to connect the spring to achieve electrical connection; the gold finger includes a high-frequency signal gold finger. There is no metal layer in the first metal intermediate layer in the projection area of ​​the high-frequency signal gold finger to form a hollow area. The existence of the hollow area causes the metal layer to move downward, increase the dielectric thickness between the high-frequency signal gold finger and the reference ground, and thereby increase the impedance of the high-frequency signal gold finger. A gap is arranged on one side of the gold finger to expose the first insulating support layer between two adjacent gold fingers. The first insulating support layer in the projected area on one side of the high-frequency signal gold finger is hollowed out to form a first groove. The existence of the first groove increases the proportion of air in the medium between the high-frequency signal gold finger and the reference ground, reduces the dielectric constant of the medium between the high-frequency signal gold finger and the reference ground, and further increases the impedance of the high-frequency signal gold finger. In the present application, the hollowed-out area increases the thickness of the medium between the high-frequency signal gold finger and the reference ground, increases the impedance of the high-frequency signal gold finger, and reduces the impedance mutation of the high-frequency signal gold finger caused by the connection between the shrapnel and the high-frequency signal gold finger; the first groove reduces the dielectric constant of the medium between the high-frequency signal gold finger and the reference ground, further increases the impedance of the high-frequency signal gold finger, and further reduces the impedance mutation of the high-frequency signal gold finger caused by the connection between the shrapnel and the high-frequency signal gold finger, thereby ensuring the impedance continuity of the high-frequency signal gold finger and the transmission quality of the high-frequency signal. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0018] Figure 1 A partial architecture diagram of an optical communication system provided according to some embodiments;

[0019] Figure 2 A partial structural diagram of a host computer provided according to some embodiments;

[0020] Figure 3 A structural diagram of an optical module provided according to some embodiments;

[0021] Figure 4 is an exploded view of an optical module provided according to some embodiments;

[0022] Figure 5 A first assembly diagram of a spring and a circuit board provided according to some embodiments;

[0023] Figure 6 A cross-sectional view of a first assembly diagram of a spring and a circuit board provided according to some embodiments;

[0024] Figure 7 A second assembly diagram of a spring and a circuit board provided according to some embodiments;

[0025] Figure 8 A cross-sectional view of a second assembly diagram of a spring and a circuit board provided according to some embodiments;

[0026] Fig. 9 A cross-sectional view of a third assembly diagram of a spring and a circuit board according to some embodiments;

[0027] Fig.10 A structural diagram of a circuit board provided according to some embodiments;

[0028] Fig.11 is an exploded view of a circuit board provided according to some embodiments;

[0029] Fig.12 A structural diagram of a circuit board provided by some embodiments with the first metal surface layer removed;

[0030] Fig.13 A structural diagram of another circuit board with the first metal surface layer removed according to some embodiments;

[0031] Fig.14A schematic diagram of a reflection loss simulation result of a high-frequency signal gold finger provided according to some embodiments;

[0032] Fig.15 A schematic diagram of loss simulation results of high-frequency signal gold fingers provided according to some embodiments;

[0033] Fig.16 The figure is a schematic diagram of a TDR simulation structure of a high-frequency signal gold finger provided according to some embodiments. DETAILED DESCRIPTION

[0034] Optical communication technology establishes information transmission between information processing devices. Optical communication technology loads information onto light and uses the propagation of light to achieve information transmission. Light loaded with information is an optical signal. When optical signals propagate in information transmission equipment, they can reduce the loss of optical power and achieve high-speed, long-distance, and low-cost information transmission. Information that can be processed by information processing equipment exists in the form of electrical signals. Optical network terminals / gateways, routers, switches, mobile phones, computers, servers, tablets, and televisions are common information processing devices, and optical fibers and optical waveguides are common information transmission equipment.

[0035] The mutual conversion of optical signals and electrical signals between information processing equipment and information transmission equipment is realized through optical modules. For example, an optical fiber is connected to the optical signal input end and / or the optical signal output end of the optical module, and an optical network terminal is connected to the electrical signal input end and / or the electrical signal output end of the optical module; the first optical signal from the optical fiber is transmitted into the optical module, the optical module converts the first optical signal into a first electrical signal, and the optical module transmits the first electrical signal into the optical network terminal; the second electrical signal from the optical network terminal is transmitted into the optical module, the optical module converts the second electrical signal into a second optical signal, and the optical module transmits the second optical signal into the optical fiber. Since information processing devices can be connected to each other through an electrical signal network, at least one type of information processing device needs to be directly connected to the optical module, and it is not necessary for all types of information processing devices to be directly connected to the optical module. The information processing device directly connected to the optical module is called the host computer of the optical module.

[0036] Figure 1 FIG. 1 is a partial architecture diagram of an optical communication system according to some embodiments. Figure 1 As shown, the optical communication system is partially presented as a remote information processing device 1000 , a local information processing device 2000 , a host computer 100 , an optical module 200 , an optical fiber 101 and a network cable 103 .

[0037] One end of the optical fiber 101 extends toward the remote information processing device 1000, and the other end is connected to the optical interface of the optical module 200. The optical signal can be totally reflected in the optical fiber 101, and the propagation of the optical signal in the direction of total reflection can almost maintain the original optical power. The optical signal is totally reflected multiple times in the optical fiber 101, and the optical signal from the direction of the remote information processing device 1000 is transmitted into the optical module 200, or the light from the optical module 200 is propagated toward the remote information processing device 1000, so as to realize long-distance and low-power-loss information transmission.

[0038] The number of optical fibers 101 may be one or more (two or more); the optical fiber 101 and the optical module 200 may be connected in a pluggable movable manner or in a fixed manner.

[0039] The host computer 100 has an optical module interface 102, which is configured to access the optical module 200, so that the host computer 100 establishes a unidirectional / bidirectional electrical signal connection with the optical module 200; the host computer 100 is configured to provide data signals to the optical module 200, or receive data signals from the optical module 200, or monitor and control the working status of the optical module 200.

[0040] The host computer 100 has an external electrical interface, such as a Universal Serial Bus (USB) interface and a network cable interface 104, which can be connected to an electrical signal network. For example, the network cable interface 104 is configured to connect to the network cable 103, so that the host computer 100 and the network cable 103 establish a unidirectional / bidirectional electrical signal connection.

[0041] Optical Network Unit (ONU), Optical Line Terminal (OLT), Optical Network Equipment (ONT) and Data Center Server are common host computers.

[0042] One end of the network cable 103 is connected to the local information processing device 2000 , and the other end is connected to the host computer 100 . The network cable 103 establishes an electrical signal connection between the local information processing device 2000 and the host computer 100 .

[0043] For example, the third electrical signal emitted by the local information processing device 2000 is transmitted to the host computer 100 through the network cable 103. The host computer 100 generates a second electrical signal based on the third electrical signal. The second electrical signal from the host computer 100 is transmitted to the optical module 200. The optical module 200 converts the second electrical signal into a second optical signal. The optical module 200 transmits the second optical signal into the optical fiber 101. The second optical signal is transmitted to the remote information processing device 1000 in the optical fiber 101.

[0044] For example, a first optical signal from the direction of a remote information processing device 1000 propagates through the optical fiber 101, the first optical signal from the optical fiber 101 is transmitted into the optical module 200, the optical module 200 converts the first optical signal into a first electrical signal, the optical module 200 transmits the first electrical signal into the host computer 100, the host computer 100 generates a fourth electrical signal based on the first electrical signal, and the host computer 100 transmits the fourth electrical signal to the local information processing device 2000.

[0045] The optical module is a tool for realizing the mutual conversion between optical signals and electrical signals. During the conversion process between optical signals and electrical signals, the information does not change, but the encoding and decoding method of the information can change.

[0046] Figure 2 FIG. 1 is a partial structural diagram of a host computer according to some embodiments. In order to clearly show the connection relationship between the optical module 200 and the host computer 100, Figure 2 Only the structures related to the host computer 100 and the optical module 200 are shown. Figure 2 As shown, the host computer 100 also includes a PCB circuit board 105 arranged in the shell, a cage 106 arranged on the surface of the PCB circuit board 105, a heat sink 107 arranged on the cage 106, and an electrical connector (not shown in the figure) arranged inside the cage 106. The heat sink 107 has a protruding structure that increases the heat dissipation area, and the fin-shaped structure is a common protruding structure.

[0047] The optical module 200 is inserted into the cage 106 of the host computer 100, and the cage 106 fixes the optical module 200. The heat generated by the optical module 200 is transferred to the cage 106 and then diffused through the heat sink 107. After the optical module 200 is inserted into the cage 106, the electrical interface of the optical module 200 is connected to the electrical connector inside the cage 106.

[0048] Figure 3 is a structural diagram of an optical module according to some embodiments, Figure 4 FIG. 1 is an exploded view of an optical module according to some embodiments. Figure 3 and Figure 4 As shown, the optical module 200 includes a shell, a circuit board 300 disposed in the shell, a light emitting component 400 and a light receiving component 500. However, the present disclosure is not limited thereto. In some embodiments, the optical module 200 includes one of the light emitting component 400 and the light receiving component 500.

[0049] The housing comprises an upper housing 201 and a lower housing 202 . The upper housing 201 covers the lower housing 202 to form the housing having two openings 204 and 205 . The outer contour of the housing is generally a square body.

[0050] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and arranged perpendicular to the bottom plate 2021; the upper shell 201 includes a cover plate 2011, and the cover plate 2011 covers the two lower side plates 2022 of the lower shell 202 to form the above-mentioned shell.

[0051] In some embodiments, the lower shell 202 includes a bottom plate 2021 and two lower side plates 2022 located on both sides of the bottom plate 2021 and vertically arranged with the bottom plate 2021; the upper shell 201 includes a cover plate 2011 and two upper side plates located on both sides of the cover plate 2011 and vertically arranged with the cover plate 2011, and the two upper side plates are combined with the two lower side plates 2022 to realize that the upper shell 201 covers the lower shell 202.

[0052] The direction of the line connecting the two openings 204 and 205 may be consistent with the length direction of the optical module 200, or may be inconsistent with the length direction of the optical module 200. For example, the opening 204 is located at the end of the optical module 200 ( Figure 3 The opening 205 is also located at the end of the optical module 200 ( Figure 3 Alternatively, the opening 204 is located at the end of the optical module 200, and the opening 205 is located at the side of the optical module 200. The opening 204 is an electrical interface, and the gold finger of the circuit board 300 extends from the electrical interface and is inserted into the electrical connector of the host computer; the opening 205 is an optical port, which is configured to access the optical fiber 101 so that the optical fiber 101 is connected to the optical emitting component 400 and / or the optical receiving component 500 in the optical module 200.

[0053] The assembly method of combining the upper shell 201 and the lower shell 202 is adopted, which facilitates the installation of components such as the circuit board 300, the light emitting component 400, and the light receiving component 500 into the above-mentioned shell, and the upper shell 201 and the lower shell 202 can encapsulate and protect the shapes of these components. In addition, when assembling components such as the circuit board 300, the light emitting component 400 and the light receiving component 500, it is convenient to deploy the positioning components, heat dissipation components, and electromagnetic shielding components of these devices, which is conducive to the automated implementation of production.

[0054] In some embodiments, the upper shell 201 and the lower shell 202 are made of metal materials to facilitate electromagnetic shielding and heat dissipation.

[0055] In some embodiments, the optical module 200 further includes an unlocking component 600 located outside its housing. The unlocking component 600 is configured to achieve a fixed connection between the optical module 200 and the host computer, or to release the fixed connection between the optical module 200 and the host computer.

[0056] For example, the unlocking component 600 is located on the outside of the two lower side plates 2022 of the lower housing 202, and includes a snap-fit ​​component that matches the cage 106 of the host computer. When the optical module 200 is inserted into the cage 106, the snap-fit ​​component of the unlocking component 600 fixes the optical module 200 in the cage 106; when the unlocking component 600 is pulled, the snap-fit ​​component of the unlocking component 600 moves accordingly, thereby changing the connection relationship between the snap-fit ​​component and the host computer, so as to release the snap-fit ​​fixed connection between the optical module 200 and the host computer, so that the optical module 200 can be pulled out of the cage 106.

[0057] The circuit board 300 includes circuit traces, electronic components and chips, etc. The electronic components and chips are connected together according to the circuit design through the circuit traces to realize the functions of power supply, electrical signal transmission and grounding. The electronic components may include capacitors, resistors, triodes, metal-oxide-semiconductor field-effect transistors (MOSFET), etc. The chips may include microcontroller units (MCU), laser driver chips, transimpedance amplifiers (TIA), limiting amplifiers, clock and data recovery chips (CDR), power management chips, and digital signal processing (DSP) chips.

[0058] The circuit board 300 is generally a rigid circuit board. Due to its relatively hard material, the rigid circuit board can also realize the load-bearing function. For example, the rigid circuit board can stably carry the above-mentioned electronic components and chips; the rigid circuit board is also easy to insert into the electrical connector in the upper computer cage.

[0059] The circuit board 300 also includes a gold finger formed on the end surface thereof, and the gold finger is composed of a plurality of independent pins. The circuit board 300 is inserted into the cage 106, and the gold finger is connected to the electrical connector in the cage 106. The gold finger can be provided on the surface of only one side of the circuit board 300 (for example, Figure 4 The gold finger is configured to establish an electrical connection with the host computer to achieve power supply, grounding, I2C signal transmission, data signal transmission, etc.

[0060] Of course, flexible circuit boards are also used in some optical modules. Flexible circuit boards are generally used in conjunction with rigid circuit boards to supplement rigid circuit boards.

[0061] The light emitting component 400 and / or the light receiving component 500 are located on a side of the circuit board 300 away from the gold finger; in some embodiments, the light emitting component 400 and the light receiving component 500 are physically separated from the circuit board 300, and then electrically connected to the circuit board 300 through corresponding flexible circuit boards or electrical connectors; in some embodiments, the light emitting component and / or the light receiving component can be directly set on the circuit board 300, can be set on the surface of the circuit board, and can also be set on the side of the circuit board.

[0062] Figure 5 This is a first assembly diagram of a spring and a circuit board provided according to some embodiments. Figure 6 FIG. 1 is a cross-sectional view of a first assembly diagram of a spring and a circuit board according to some embodiments. Figure 5 and Figure 6 As shown, the cage 106 includes a spring piece 108 , which is disposed corresponding to the gold finger 303 of the optical module 200 . The spring piece 108 includes a first spring piece 181 and a second spring piece 182 . The two first spring pieces 181 are respectively located between the two second spring pieces 182 .

[0063] The circuit board 300 includes a first metal surface layer, a second metal surface layer and a metal intermediate layer group 305. The first metal surface layer is located on the upper surface of the circuit board 300, the second metal surface layer is located on the lower surface of the circuit board 300, and the metal intermediate layer group 305 is located between the first metal surface layer and the second metal surface layer. Any two adjacent metal layers of the circuit board 300 are connected by an insulating support layer, wherein the material of the insulating support layer is resin. The first metal surface layer is provided with gold fingers, which include a high-frequency signal gold finger 331 and a grounding gold finger 332, and the two high-frequency signal gold fingers 331 are located between the two grounding gold fingers 332. Among them, the upper surface of the circuit board 300 and the lower surface of the circuit board 300 are arranged relative to each other.

[0064] After the optical module 200 is inserted into the cage 106, the first spring 181 is connected to the high-frequency signal gold finger 331, and the second spring 182 is connected to the ground gold finger 332, so as to realize the connection between the spring 108 and the gold finger. After the first spring 181 is connected to the high-frequency signal gold finger 331, the thickness of the high-frequency signal gold finger 331 at the contact point is increased, and the high-frequency signal gold finger 331 and the first spring 181 generate a residual pile, thereby causing a sudden change in the impedance of the high-frequency signal gold finger 331, causing the electrical signal to be reflected after being transmitted to the high-frequency signal gold finger 331, affecting the transmission quality of the electrical signal.

[0065] In order to reduce the impedance mutation of the high-frequency signal golden finger 331 caused by the connection between the first spring piece 181 and the high-frequency signal golden finger 331, as shown in FIG. Figure 5As shown, in some embodiments, the circuit board 300 includes a hollow area 301. That is, the metal intermediate layer group 305 in the projection area of ​​the high-frequency signal gold finger 331 has no metal layer in at least one layer from the first layer from top to bottom, so as to form the hollow area 301. The existence of the hollow area 301 causes the metal layer to move downward, and the dielectric thickness between the high-frequency signal gold finger 331 and the reference ground (the metal layer is used as the reference ground) increases. According to the principle of impedance, the greater the dielectric thickness, the greater the impedance, thereby reducing the impedance mutation of the high-frequency signal gold finger 331.

[0066] In some embodiments, the metal intermediate layer group 305 includes a first metal intermediate layer 351 , and no metal layer exists in the first metal intermediate layer 351 in the projection area of ​​the high-frequency signal gold finger 331 to form a hollow area 301 .

[0067] In some embodiments, the metal intermediate layer group 305 further includes at least one metal intermediate layer, and at least one metal intermediate layer in the projection area of ​​the high-frequency signal gold finger 331, from top to bottom, at least one metal layer does not exist in sequence from the first layer, so as to form a hollowed-out area 301. Among them, from top to bottom, at least one metal layer does not exist in sequence from the first layer, which means that there are no metal layers in sequence from top to bottom. For example, there is no metal layer in the first layer, and there are metal layers in the second and subsequent layers; or, there is no metal in the first and second layers, and there are metal layers in the third and subsequent layers...

[0068] In order to further reduce the impedance mutation of the high-frequency signal gold finger 331, in some embodiments, the metal intermediate layer group 305 in the projection area of ​​the high-frequency signal gold finger 331 and the projection area of ​​one side of the high-frequency signal gold finger 331 has no metal layer in at least one layer from the first layer from top to bottom, so as to form a hollow area 301. The one side of the high-frequency signal gold finger 331 can be the area between the high-frequency signal gold finger 331 and the ground gold finger 332, or the area between two adjacent high-frequency signal gold fingers 331.

[0069] In some embodiments, the metal intermediate layer group 305 in the projection area of ​​the high-frequency signal gold finger 331 and the projection areas on both sides of the high-frequency signal gold finger 331 has no metal layer in at least one layer from the first layer from top to bottom to form a hollow area 301.

[0070] Figure 7 This is a second assembly diagram of a spring and a circuit board provided according to some embodiments. Figure 8 FIG. 1 is a cross-sectional view of a second assembly diagram of a spring and a circuit board according to some embodiments. Figure 7 and Figure 8As shown, in some embodiments, the circuit board 300 further includes a first groove 302, that is, the first insulating support layer in the projection area on one side of the high-frequency signal gold finger 331 is hollowed out to form the first groove 302, wherein the projection area on one side of the high-frequency signal gold finger 331 where the first groove 302 is located and the projection area on one side of the high-frequency signal gold finger 331 constituting the hollowed-out area 301 are the projection areas on the same side of the high-frequency signal gold finger 331. The existence of the first groove 302 increases the proportion of air in the medium between the high-frequency signal gold finger 331 and the reference ground, and the dielectric constant of the resin is greater than the dielectric constant of the air. According to the principle of impedance, the smaller the dielectric constant, the greater the impedance, thereby reducing the impedance mutation of the high-frequency signal gold finger 331.

[0071] The hollowed-out area increases the thickness of the medium between the high-frequency signal gold finger and the reference ground, thereby increasing the impedance of the high-frequency signal gold finger, so as to reduce the impedance mutation of the high-frequency signal gold finger caused by the connection between the spring and the high-frequency signal gold finger; the first groove reduces the dielectric constant of the medium between the high-frequency signal gold finger and the reference ground, thereby further increasing the impedance of the high-frequency signal gold finger, and further reducing the impedance mutation of the high-frequency signal gold finger caused by the connection between the spring and the high-frequency signal gold finger.

[0072] One side of the high-frequency signal gold finger 331 is the area between the high-frequency signal gold finger 331 and the ground gold finger 332, and the first insulating support layer in the projection area between the high-frequency signal gold finger 331 and the ground gold finger 332 is hollowed out to form a first groove 302. One side of the high-frequency signal gold finger 331 is the area between the two high-frequency signal gold fingers 331, and the first insulating support layer in the projection area between the two high-frequency signal gold fingers 331 is hollowed out to form a first groove 302.

[0073] In some embodiments, all insulating support layers above the first metal layer in the projection area on one side of the high-frequency signal gold finger 331 are hollowed out to form a first groove 302, that is, the projection area on one side of the high-frequency signal gold finger 331 is provided with a first groove 302, and the bottom surface of the first groove 302 is a metal layer, which is the first metal layer. All insulating support layers above the first metal layer in the projection area on one side of the high-frequency signal gold finger 331 are hollowed out, which increases the dielectric thickness between the high-frequency signal gold finger 331 and the reference ground, increases the impedance, and thus reduces the impedance mutation of the high-frequency signal gold finger 331. Among them, the metal layer on the bottom of the first groove 302 and the first metal layer in the projection area of ​​the high-frequency signal gold finger 331 are located on the same layer of the circuit board 300.

[0074] In some embodiments, the metal intermediate layer group 305 includes a first metal intermediate layer 351, and the first metal intermediate layer 351 in the projection area of ​​the high-frequency signal gold finger 331 and the projection area on one side of the high-frequency signal gold finger 331 does not have a metal layer to form a hollow area 301; the first insulating support layer 361 and the second insulating support layer 362 in the projection area on one side of the high-frequency signal gold finger 331 are hollowed out to form a first groove 302. The second insulating support layer 362 is connected to the first metal intermediate layer 351 and is located below the first metal intermediate layer 351.

[0075] In some embodiments, the metal intermediate layer group 305 further includes at least one metal intermediate layer, and at least one metal intermediate layer in the projection area of ​​the high-frequency signal gold finger 331 and the projection area on one side of the high-frequency signal gold finger 331, from top to bottom, at least one metal layer does not exist in order from the first layer, so as to form a hollow area 301, that is, in the projection area of ​​the high-frequency signal gold finger 331 and the projection area on one side of the high-frequency signal gold finger 331, there is no metal layer between the high-frequency signal gold finger 331 and the metal layer on the bottom of the first groove 302, so as to form a hollow area 301; in the projection area on one side of the high-frequency signal gold finger 331, all insulating support layers above the first metal layer are hollowed out to form a first groove 302, that is, the first grooves 302 are arranged on both sides of the high-frequency signal gold finger 331, and the metal layer on the bottom of the first groove 302 is the first metal layer. Among them, the first metal layer in the projection area of ​​the high-frequency signal gold finger and the first metal layer in the projection area on one side of the high-frequency signal gold finger are located on the same layer of the circuit board.

[0076] For example, the metal intermediate layer group 305 further includes a second metal intermediate layer 352, and there is no metal layer in the first metal intermediate layer 351 and the second metal intermediate layer 352 in the projection area of ​​the high-frequency signal gold finger 331 and the projection area on one side of the high-frequency signal gold finger 331, so as to form a hollow area 301; the first insulating support layer 361, the second insulating support layer 362 and the third insulating support layer 363 in the projection area on one side of the high-frequency signal gold finger 331 are hollowed out to form a first groove 302. Among them, the third insulating support layer 363 is connected to the second metal intermediate layer 352 and is located below the second metal intermediate layer 352.

[0077] By way of example, the metal intermediate layer group also includes a third metal intermediate layer 353, a fourth metal intermediate layer 354 and a fifth metal intermediate layer 355. The first metal intermediate layer 351, the second metal intermediate layer 352, the third metal intermediate layer 353 and the fourth metal intermediate layer 354 in the projection area of ​​the high-frequency signal gold finger 331 and the projection area on one side of the high-frequency signal gold finger 331 do not have a metal layer to form a hollow area 301, but the fifth metal intermediate layer 355 in the projection area of ​​the high-frequency signal gold finger 331 and the projection area on one side of the high-frequency signal gold finger 331 does have a metal layer; the first insulating support layer 361, the second insulating support layer 362, the third insulating support layer 363, the fourth insulating support layer 364 and the fifth insulating support layer 365 in the projection area on one side of the high-frequency signal gold finger 331 are hollowed out to form a first groove 302, that is, the bottom surface of the first groove 302 is the fifth metal intermediate layer 335. Among them, the fourth insulating support layer 364 is connected to the third metal intermediate layer 353 and is located below the third metal intermediate layer 353; the fifth insulating support layer 365 is connected to the fourth metal intermediate layer 354 and is located below the fourth metal intermediate layer 354. The fifth metal intermediate layer 335 is both the first metal layer in the projection area of ​​the high-frequency signal gold finger 331 and the first metal layer in the projection area on both sides of the high-frequency signal gold finger 331.

[0078] In some embodiments, the first insulating support layer in the projection area on both sides of the high-frequency signal gold finger 331 is hollowed out to form the first groove 302. That is, the first insulating support layer in the projection area between any two adjacent high-frequency signal gold fingers 331 and the projection area between the high-frequency signal gold finger 331 and the ground gold finger 332 are hollowed out to form the first groove 302.

[0079] In some embodiments, all insulating support layers above the first metal layer in the projection areas on both sides of the high-frequency signal gold finger 331 are hollowed out to form a first groove 302 .

[0080] The greater the thickness of the first groove 302, the greater the thickness of the medium between the high-frequency signal gold finger 331 and the reference ground, and the greater the impedance of the high-frequency signal gold finger 331. In order to further increase the impedance of the high-frequency signal gold finger 331, in some embodiments, the thickness of the first groove 302 is half the thickness of the circuit board 300. The thickness of the first groove 302 is half the thickness of the circuit board 300, which can not only further increase the impedance of the high-frequency signal gold finger 331, but also ensure the bending strength of the circuit board 300.

[0081] Fig. 9 FIG. 1 is a cross-sectional view of a third assembly diagram of a spring and a circuit board according to some embodiments. Fig. 9As shown, in some embodiments, the circuit board 300 further includes a second groove 304, that is, the insulating support layers other than the first insulating support layer above the first metal layer in the projection area of ​​the high-frequency signal gold finger 331 are partially hollowed out to form the second groove 304. The existence of the second groove 304 replaces all the resin with all the air in the medium between the high-frequency signal gold finger 331 and the reference ground. The dielectric constant of the resin is greater than the dielectric constant of the air. According to the principle of impedance, the smaller the dielectric constant, the greater the impedance, thereby reducing the impedance mutation of the high-frequency signal gold finger 331.

[0082] The hollowed-out area increases the thickness of the medium between the high-frequency signal gold finger and the reference ground, increases the impedance of the high-frequency signal gold finger, and reduces the impedance mutation of the high-frequency signal gold finger caused by the connection between the spring and the high-frequency signal gold finger; the first groove reduces the dielectric constant of the medium between the high-frequency signal gold finger and the reference ground, further increases the impedance of the high-frequency signal gold finger, and further reduces the impedance mutation of the high-frequency signal gold finger caused by the connection between the spring and the high-frequency signal gold finger; the second groove reduces the dielectric constant of the medium between the high-frequency signal gold finger and the reference ground, further increases the impedance of the high-frequency signal gold finger, and further reduces the impedance mutation of the high-frequency signal gold finger caused by the connection between the spring and the high-frequency signal gold finger.

[0083] In some embodiments, all insulating support layers except the first insulating support layer above the first metal layer in the projection area of ​​the high-frequency signal gold finger 331 are hollowed out to form a second groove 304, that is, there is no insulating support layer between the first insulating support layer in the projection area of ​​the high-frequency signal gold finger 331 and the metal layer (that is, the fifth metal intermediate layer 335) at the bottom of the first groove 302, but only a gap. All insulating support layers except the first insulating support layer above the first metal layer in the projection area of ​​the high-frequency signal gold finger 331 are hollowed out, which increases the specific gravity of air in the medium between the high-frequency signal gold finger 331 and the reference ground, reduces the dielectric constant, increases the impedance, and thus reduces the impedance mutation of the high-frequency signal gold finger 331.

[0084] In some embodiments, the metal intermediate layer group 305 includes a first metal intermediate layer 351, and there is no metal layer in the first metal intermediate layer 351 in the projection area of ​​the high-frequency signal gold finger 331 and the projection area on one side of the high-frequency signal gold finger 331 to form a hollow area 301; the first insulating support layer 361 and the second insulating support layer 362 in the projection area on one side of the high-frequency signal gold finger 331 are hollowed out to form a first groove 302; the second insulating support layer 362 in the projection area of ​​the high-frequency signal gold finger 331 is hollowed out to form a second groove 304.

[0085] In some embodiments, the metal intermediate layer group 305 further includes at least one metal intermediate layer, and at least one metal intermediate layer in the projection area of ​​the high-frequency signal gold finger 331 and the projection area on one side of the high-frequency signal gold finger 331, from top to bottom, at least one metal layer does not exist in sequence from the first layer to form a hollow area 301, that is, in the projection area of ​​the high-frequency signal gold finger 331 and the projection area on one side of the high-frequency signal gold finger 331, there is no metal layer between the high-frequency signal gold finger 331 and the metal layer on the bottom surface of the first groove 302 to form a hollow area 301; all insulating support layers above the first metal layer in the projection area on one side of the high-frequency signal gold finger 331 are hollowed out to form a first groove 302, that is, the first grooves 302 are arranged on both sides of the high-frequency signal gold finger 331, and the metal layer on the bottom surface of the first groove 302 is the first metal layer; all insulating support layers above the first metal layer in the projection area of ​​the high-frequency signal gold finger 331 except the first insulating support layer 361 are hollowed out to form a second groove 304.

[0086] By way of example, the metal intermediate layer group 305 also includes a second metal intermediate layer 352, and there is no metal layer in the first metal intermediate layer 351 and the second metal intermediate layer 352 in the projection area of ​​the high-frequency signal gold finger 331 and the projection area on one side of the high-frequency signal gold finger 331 to form a hollow area 301; the first insulating support layer 361, the second insulating support layer 362 and the third insulating support layer 363 in the projection area on one side of the high-frequency signal gold finger 331 are hollowed out to form a first groove 302; the second insulating support layer 362 and the third insulating support layer 363 in the projection area of ​​the high-frequency signal gold finger 331 are hollowed out to form a second groove 304.

[0087] For example, the metal intermediate layer group further includes a third metal intermediate layer 353, a fourth metal intermediate layer 354 and a fifth metal intermediate layer 355. The first metal intermediate layer 351, the second metal intermediate layer 352, the third metal intermediate layer 353 and the fourth metal intermediate layer 354 in the projection area of ​​the high-frequency signal gold finger 331 and the projection area on one side of the high-frequency signal gold finger 331 do not have a metal layer to form a hollow area 301, but the fifth metal intermediate layer 355 in the projection area of ​​the high-frequency signal gold finger 331 and the projection area on one side of the high-frequency signal gold finger 331 exists. In the metal layer; the first insulating support layer 361, the second insulating support layer 362, the third insulating support layer 363, the fourth insulating support layer 364 and the fifth insulating support layer 365 in the projection area on one side of the high-frequency signal gold finger 331 are hollowed out to form a first groove 302, that is, the bottom surface of the first groove 302 is the fifth metal intermediate layer 335; the second insulating support layer 362, the third insulating support layer 363, the fourth insulating support layer 364 and the fifth insulating support layer 365 in the projection area of ​​the high-frequency signal gold finger 331 are hollowed out to form a second groove 304.

[0088] Fig.10 A structural diagram of a circuit board provided according to some embodiments. Fig.11 An exploded view of a circuit board according to some embodiments. Fig.12 FIG. 1 is a structural diagram of a circuit board provided in accordance with some embodiments with the first metal surface layer removed. Fig.10 and Fig.11 As shown, in some embodiments, the two ends of the first groove 302 are respectively flush with the two ends of the projection area of ​​the first spring clip 181 on the high-frequency signal gold finger 331, so that the length of the first groove 302 is the projection length of the first spring clip 181 on the high-frequency signal gold finger 331. The length of the first groove 302 is the projection length of the first spring clip 181 on the high-frequency signal gold finger 331, so as to increase the impedance of the high-frequency signal gold finger 331 in the area between the contact point with the first spring clip 181 and the end of the high-frequency signal gold finger 331, thereby reducing the impedance mutation of the high-frequency signal gold finger 331 caused by the connection between the first spring clip 181 and the high-frequency signal gold finger 331, thereby ensuring the impedance continuity of the high-frequency signal gold finger and the transmission quality of the high-frequency signal.

[0089] One side or both sides of the high-frequency signal gold finger 331 can be hollowed out to form the first groove 302, then the first groove 302 includes at least one recessed portion, the larger the width of the recessed portion, the greater the proportion of air in the medium between the high-frequency signal gold finger 331 and the reference ground, and the greater the impedance of the area between the contact point between the high-frequency signal gold finger 331 and the first elastic sheet 181 to the end of the high-frequency signal gold finger 331. In order to increase the impedance of the area between the contact point between the high-frequency signal gold finger 331 and the first elastic sheet 181 to the end of the high-frequency signal gold finger 331, in some embodiments, the width of the recessed portion is the width of the gap between the gold fingers on both sides of the recessed portion.

[0090] For example, the first groove 302 includes a first recessed portion 321 , which is located between the high-frequency signal gold finger 331 and the ground gold finger 332 , and has a width equal to the width of the gap between the high-frequency signal gold finger 331 and the ground gold finger 332 .

[0091] For example, the first groove 302 includes a second recessed portion 322 , the second recessed portion 322 is located between two adjacent high-frequency signal gold fingers 331 , and the width of the second recessed portion 322 is the width of the gap between the two adjacent high-frequency signal gold fingers 331 .

[0092] For example, the first groove 302 includes a first recessed portion 321 and a second recessed portion 322 . The width of the first recessed portion 321 is the width of the gap between the high-frequency signal gold finger 331 and the ground gold finger 332 . The width of the second recessed portion 322 is the width of the gap between two adjacent high-frequency signal gold fingers 331 .

[0093] Fig.13 FIG. 1 is a structural diagram of another circuit board with the first metal surface layer removed according to some embodiments. Since the electric field lines of the high-frequency signal gold finger 331 are divergent to the surroundings, in order to further increase the impedance of the high-frequency signal gold finger 331, as shown in FIG. Fig.13 As shown, in some embodiments, the first insulating support layer in the projected area between the high-frequency signal gold finger 331 and the edge of the circuit board 300 is hollowed out to form a third groove 306, and the third groove 306 is located in the projected area of ​​the first spring clip 181 on the circuit board 300. The proportion of air in the medium between the high-frequency signal gold finger 331 and the reference ground is increasing, and the impedance of the area between the contact point of the high-frequency signal gold finger 331 and the first spring clip 181 to the end of the high-frequency signal gold finger 331 is increasing, thereby reducing the impedance mutation of the high-frequency signal gold finger 331 caused by the connection between the first spring clip 181 and the high-frequency signal gold finger 331.

[0094] In some embodiments, all insulating support layers above the first metal layer in the projection area between the high-frequency signal gold finger 331 and the edge of the circuit board 300 are hollowed out to form a third groove 306, that is, a third groove 306 is arranged between the high-frequency signal gold finger 331 and the edge of the circuit board 300, and the bottom surface of the third groove 306 is a metal layer, wherein the metal layer on the bottom surface of the third groove 306 and the first metal layer in the projection area on one side of the high-frequency signal gold finger 331 are located on the same layer of the circuit board 300.

[0095] In some embodiments, the third groove 306 extends outward so that the third groove 306 is connected to the first groove 302, increasing the proportion of air in the medium between the high-frequency signal gold finger 331 and the reference ground, and increasing the impedance of the area between the contact point of the high-frequency signal gold finger 331 and the first elastic piece 181 to the end of the high-frequency signal gold finger 331. For example, the first groove 302 includes a first recessed portion 321, and the third groove 306 is connected to the first recessed portion 321; the first groove 302 includes a third groove 306, and the third groove 306 is connected to the second recessed portion 322; the first groove 302 includes a first recessed portion 321 and a second recessed portion 322, and the third groove 306 is connected to the first recessed portion 321 and the second recessed portion 322 respectively.

[0096] The third groove 306 is located at the end of the high-frequency signal gold finger 331, far away from the head end of the high-frequency signal gold finger 331, that is, the third groove 306 is far away from the projection area of ​​the spring 108 on the circuit board 300, which not only increases the impedance of the area between the contact point of the high-frequency signal gold finger 331 and the first spring 181 to the head end of the high-frequency signal gold finger 331, but also increases the impedance of the area between the contact point of the high-frequency signal gold finger 331 and the first spring 181 to the end of the high-frequency signal gold finger 331, so that the impedance at the contact point of the high-frequency signal gold finger 331 is not matched. In order to avoid this problem, in some embodiments, the third groove 306 is located in the projection area of ​​the spring 108 on the circuit board 300. The third groove 306 is located in the projection area of ​​the spring 108 on the circuit board 300, which only increases the impedance of the area between the contact point of the high-frequency signal gold finger 331 and the first spring 181 to the end of the high-frequency signal gold finger 331, and improves the impedance matching at the contact point of the high-frequency signal gold finger 331.

[0097] The above is a description of the circuit board from the perspective of the formation of the circuit board, and the following is a description of the circuit board from the perspective of the final form of the circuit board. In order to solve the impedance mutation problem of the high-frequency signal gold finger 331, a first groove 302 is provided on one side of the high-frequency signal gold finger 331, and the bottom surface of the first groove 302 is a metal layer; the metal layer on the bottom surface of the first groove 302 is located between the first metal surface layer and the second metal surface layer; within the projection area of ​​the high-frequency signal gold finger 331, there is no metal layer between the high-frequency signal gold finger 331 and the metal layer on the bottom surface of the first groove 302; the high-frequency signal gold finger 331 is provided on the surface of the first insulating support layer.

[0098] like Figure 8 As shown, in the projection area of ​​the high-frequency signal gold finger 331 , at least one insulating support layer is arranged between the first insulating support layer 361 and the metal layer on the bottom surface of the first groove 302 .

[0099] like Fig. 9 As shown, in the projection area of ​​the high-frequency signal gold finger 331 , there is no insulating support layer between the first insulating support layer 361 and the metal layer at the bottom of the first groove 302 , but only a gap to form the second groove 304 .

[0100] like Fig.12 As shown, a third groove 306 is provided between the high-frequency signal gold finger 331 and the edge of the circuit board 300 , and the bottom surface of the third groove 306 is a metal layer.

[0101] Fig.14 FIG. 1 is a schematic diagram of the reflection loss simulation results of the high-frequency signal gold finger according to some embodiments. Fig.14As shown, the horizontal axis is frequency, the vertical axis is the first decibel, the first decibel is the ratio of the power of the reflected signal at the first port to the power of the incident signal at the first port, a1 is the reflection loss simulation result of the high-frequency signal gold finger after optimization, a2 is the reflection loss simulation result of the high-frequency signal gold finger before optimization, and the reflection loss of the high-frequency signal gold finger after optimization is greater than the reflection loss of the high-frequency signal gold finger before optimization.

[0102] Fig.15 FIG. 1 is a schematic diagram of the loss simulation results of the high-frequency signal gold finger according to some embodiments. Fig.15 As shown, the horizontal axis is frequency, the vertical axis is second decibel, the second decibel is the ratio of the power of the outgoing signal at the second port to the power of the incident signal at the first port, b1 is the loss simulation result of the high-frequency signal gold finger after optimization, and b2 is the reflection loss simulation result of the high-frequency signal gold finger before optimization. The loss of the high-frequency signal gold finger after optimization is less than the loss of the high-frequency signal gold finger before optimization.

[0103] Fig.16 FIG. 1 is a schematic diagram of a TDR simulation structure of a high-frequency signal gold finger provided according to some embodiments. Fig.16 As shown, the horizontal axis is time, the vertical axis is impedance, c1 is the TDR simulation result of the high-frequency signal gold finger after optimization, and c2 is the TDR loss simulation result of the high-frequency signal gold finger before optimization. The impedance of the high-frequency signal gold finger after optimization is greater than the impedance of the high-frequency signal gold finger before optimization, and is closer to 100Ω.

[0104] In some embodiments, the optical module includes a circuit board. The circuit board includes a first metal surface layer, a second metal surface layer and a first metal intermediate layer, the first metal intermediate layer is the first metal layer below the first metal surface layer, the first metal surface layer is located on the upper surface of the circuit board, the second metal surface layer is located on the lower surface of the circuit board, the upper surface of the circuit board and the lower surface of the circuit board are arranged oppositely, the first metal intermediate layer is located between the first metal surface layer and the second metal surface layer, the first metal intermediate layer is located below the first metal surface layer, and a first insulating support layer is arranged between the first metal intermediate layer and the first metal surface layer. The first metal surface layer is provided with a gold finger, and the surface of the gold finger is used to connect the spring to achieve electrical connection; the gold finger includes a high-frequency signal gold finger. There is no metal layer in the first metal intermediate layer in the projection area of ​​the high-frequency signal gold finger to form a hollow area. The existence of the hollow area causes the metal layer to move downward, increase the dielectric thickness between the high-frequency signal gold finger and the reference ground, and then increase the impedance of the high-frequency signal gold finger. A gap is arranged on one side of the gold finger to expose the first insulating support layer between two adjacent gold fingers. The first insulating support layer in the projection area on one side of the high-frequency signal gold finger is hollowed out to form a first groove. The existence of the first groove increases the proportion of air in the medium between the high-frequency signal gold finger and the reference ground, reduces the dielectric constant of the medium between the high-frequency signal gold finger and the reference ground, and further increases the impedance of the high-frequency signal gold finger. In some embodiments, the hollowed-out area increases the thickness of the medium between the high-frequency signal gold finger and the reference ground, increases the impedance of the high-frequency signal gold finger, and reduces the impedance mutation of the high-frequency signal gold finger caused by the connection between the spring and the high-frequency signal gold finger; the first groove reduces the dielectric constant of the medium between the high-frequency signal gold finger and the reference ground, further increases the impedance of the high-frequency signal gold finger, and further reduces the impedance mutation of the high-frequency signal gold finger caused by the connection between the spring and the high-frequency signal gold finger, thereby ensuring the impedance continuity of the high-frequency signal gold finger and ensuring the transmission quality of the high-frequency signal.

[0105] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present application.

Claims

1. An optical module, characterized in that: include: Circuit boards; Wherein, the circuit board comprises: The first metal surface layer is located on the upper surface of the circuit board and is provided with a gold finger; the surface of the gold finger is used to connect the spring to achieve electrical connection; a gap is provided on one side of the gold finger, and the gold finger includes a high-frequency signal gold finger; A second metal surface layer is located on the lower surface of the circuit board; The first metal intermediate layer is located between the first metal surface layer and the second metal surface layer, and is located below the first metal surface layer. A first insulating support layer is arranged between the first metal surface layer and the first metal surface layer; there is no metal layer in the first metal intermediate layer within the projection area of ​​the high-frequency signal gold finger; and the first insulating support layer within the projection area on one side of the high-frequency signal gold finger is hollowed out.

2. The optical module according to claim 1, characterized in that: The second insulating support layer in the projection area on one side of the high-frequency signal gold finger is hollowed out, and the second insulating support layer in the projection area of ​​the high-frequency signal gold finger is hollowed out, wherein the second insulating support layer is connected to the first metal intermediate layer and is located below the first metal intermediate layer.

3. The optical module according to claim 1, characterized in that: The first insulating support layer in the projection area between the high-frequency signal gold finger and the edge of the circuit board is hollowed out.

4. The optical module according to claim 1, characterized in that: Also includes at least one metal intermediate layer; The at least one metal intermediate layer is located between the first metal intermediate layer and the second metal surface layer, and is connected to the first metal intermediate layer through an insulating support layer; the at least one metal intermediate layer in the high-frequency signal gold finger projection area has no metal layer from top to bottom, starting from the first layer; all insulating support layers above the first metal layer in the projection area on one side of the high-frequency signal gold finger are hollowed out, wherein the first metal layer in the projection area of ​​the high-frequency signal gold finger and the first metal layer in the projection area on one side of the high-frequency signal gold finger are located on the same layer of the circuit board.

5. The optical module according to claim 1, characterized in that: The first insulating support layer in the projection area on the other side of the high-frequency signal gold finger is hollowed out.

6. The optical module according to claim 1, characterized in that: The first insulating support layer in the projection area on one side of the high-frequency signal gold finger is hollowed out to form a first groove, and two ends of the first groove are respectively flush with two ends of the projection area of ​​the spring on the high-frequency signal gold finger.

7. The optical module according to claim 1, characterized in that: The first insulating support layer in the projection area on one side of the high-frequency signal gold finger is hollowed out to form a first groove, and the first groove includes at least one recessed portion, and the width of the recessed portion is the width of the gap between the gold fingers on both sides of the recessed portion.

8. An optical module, characterized in that: include: Circuit boards; Wherein, the circuit board comprises: A first metal surface layer is located on the upper surface of the circuit board and is provided with a gold finger; the surface of the gold finger is used to connect the spring to achieve electrical connection; the gold finger includes a high-frequency signal gold finger, a first groove is provided on one side of the high-frequency signal gold finger, and the bottom surface of the first groove is a metal layer; within the projection area of ​​the high-frequency signal gold finger, there is no metal layer between the high-frequency signal gold finger and the metal layer on the bottom surface of the first groove; the high-frequency signal gold finger is arranged on the surface of the first insulating support layer; The second metal surface layer is located on the lower surface of the circuit board; the metal layer on the bottom surface of the first groove is located between the first metal surface layer and the second metal surface layer.

9. The optical module according to claim 8, characterized in that: In the high-frequency signal gold finger projection area, there is no insulating support layer between the first insulating support layer and the metal layer on the bottom surface of the first groove.

10. The optical module according to claim 8, characterized in that: A third groove is arranged between the high-frequency signal gold finger and the edge of the circuit board, and the bottom surface of the third groove is a metal layer.

Images