Gluing and developing equipment and control method thereof

Abstract

The invention provides gluing and developing equipment and a control method thereof. The gluing and developing equipment comprises a wafer box module, a first interlayer process module, a first process module, a second interlayer process module and a cleaning process layer which are sequentially arranged in the horizontal direction, the first interlayer process module comprises a tackifying process unit for tackifying the wafer; n layers of partition plates are sequentially stacked in the first process module from bottom to top and used for forming N + 1 gluing process layers in the first process module, and N is a positive integer; a vertical layer penetrating unit is arranged in at least one layer of partition plate and is used for conveying wafers among different gluing process layers; the vertical layer penetrating unit is provided with a fixed part and a movable part; the fixing part and the partition plate are relatively fixed; the movable part is movably connected with the fixed part; and when the movable part is in contact with the wafer, the movable part is used for driving the wafer to pass through the at least one partition plate. The equipment is used for shortening the time occupied by wafer transmission so as to improve the productivity.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor processing, and in particular to a glue coating and developing device and a control method thereof. Background Art

[0002] In the existing semiconductor photolithography process, the coating equipment, photolithography equipment and development equipment complete the photoresist coating process, photolithography process and development process respectively. With the improvement of semiconductor processing technology, the mainstream market integrates the coating and development process on the same equipment, and at the same time requires the production capacity of the coating and development equipment to be greater than the production capacity of the photolithography equipment, and the production capacity of the coating and development equipment is determined by the bottleneck capacity of the process unit and the bottleneck of the robot.

[0003] In the prior art, the wafer needs to pass through different process layers of the glue coating and developing equipment in sequence to achieve a complete glue coating process. Each time the process layer is changed, the first through-wall unit is required to load the wafer and pass from the first process layer to the interlayer process module, and the interlayer robot transfers the wafer to the second through-wall unit, and the second through-wall unit loads the wafer and passes from the interlayer process module to the second process layer. The workload of the interlayer robot in transferring the wafer is large, and the time taken to transfer the wafer is long, which is not conducive to improving production capacity. Therefore, a new type of glue coating and developing equipment and its control method are urgently needed to improve the above problems. Summary of the invention

[0004] The object of the present invention is to provide a glue coating and developing device and a control method thereof, wherein the device is used to reduce the occupied time of transferring wafers to improve production capacity.

[0005] In the first aspect, the present invention provides a glue coating and developing device, comprising a film box module, a first interlayer process module, a first process module, a second interlayer process module and a cleaning process layer arranged in sequence along the horizontal direction; the first interlayer process module comprises a bonding process unit for performing bonding treatment on the wafer; the first process module is provided with N layers of partitions stacked in sequence from bottom to top, which are used to separate N+1 glue coating process layers in the first process module, N is a positive integer; at least one layer of the partition is provided with a vertical layer-crossing unit, which is used to transfer wafers between different glue coating process layers; the vertical layer-crossing unit is provided with a fixed part and a movable part; the fixed part is relatively fixed to the partition; the movable part is movably connected to the fixed part; when the movable part contacts the wafer, it is used to drive the wafer to pass through at least one layer of the partition.

[0006] The method of the present invention has the following beneficial effects: the present invention can transfer wafers between different glue coating process layers by providing a vertical layer-penetrating unit in at least one layer of the partition. The vertical layer-penetrating unit is provided with a fixed part and a movable part; the fixed part is relatively fixed to the partition; the movable part is movably connected to the fixed part; when the movable part contacts the wafer, it is used to drive the wafer to pass through at least one layer of the partition. The present invention can make the wafer pass through the partition directly without passing through the interlayer process module, which is beneficial to reducing the workload of the interlayer robot, reducing the occupied time of transferring the wafer, and is beneficial to improving production capacity.

[0007] Optionally, the contact surface between the movable part and the wafer is arranged horizontally; when the movable part drives the wafer to pass through the partition, the wafer moves in the vertical direction.

[0008] Optionally, the first process module includes a first glue coating process layer, a second glue coating process layer, and a third glue coating process layer. The first glue coating process layer, the second glue coating process layer, the third glue coating process layer and the cleaning process layer all include a heat treatment unit, and the heat treatment unit is used to bake the wafer when it is in a working state.

[0009] Optionally, the first interlayer process module includes a first interlayer robot; the first interlayer robot is used to send the wafers from the wafer box module into the adhesion process unit, or to send the wafers in the adhesion process unit into the first glue coating process layer; the number of the adhesion process units is at least M, and M is an integer greater than 1.

[0010] Optionally, it further includes a second process module, which is arranged between the first inter-layer process module and the second inter-layer process module, and the second process module and the first process module are arranged in duplex symmetry.

[0011] Optionally, a first through-the-wall cooling unit is provided between the first process module and the first interlayer process module; a second through-the-wall cooling unit and a first through-the-wall robot are provided between the second interlayer process module and the cleaning process layer; the first through-the-wall cooling unit is provided between the first interlayer process module and the first glue coating process layer; the second through-the-wall cooling unit and the first through-the-wall robot are both provided between the second interlayer process module and the cleaning process layer; the first through-the-wall cooling unit and the second through-the-wall cooling unit both include a first through-the-wall portion and a cooling portion; the first end of the first through-the-wall portion is fixed, and the second end of the first through-the-wall portion is movable relative to the first end, and is used for transferring wafers; the cooling portion is used for cooling and contacting with the surface of the wafer to cool the wafer.

[0012] Optionally, it also includes a through-wall optical detection unit, which includes a second through-wall part, a light source and a camera; the first end of the second through-wall part is fixed, and the second end of the second through-wall part is movable relative to the first end, and is used to transmit wafers; the light source is used to project light onto the surface of the wafer, and the camera is used to receive light reflected from the surface of the wafer; the through-wall optical detection unit is arranged between the third glue coating process layer and the first interlayer process module, and is used to transfer the wafer in the third glue coating process layer to the first interlayer process module, and perform optical inspection on the wafer at the same time.

[0013] Optionally, it also includes a through-wall edge exposure unit and a second through-wall robot; the through-wall edge exposure unit includes a third through-wall part and an exposure part; the first end of the third through-wall part is fixed, and the second end of the third through-wall part is movable relative to the first end, and is used to transfer wafers; the exposure part covers the edge of the wafer, and is used to expose the edge of the wafer for process; the through-wall edge exposure unit is arranged between the second glue coating process layer and the second interlayer process module, and is used to transfer the wafer in the second glue coating process layer to the second interlayer process module, and simultaneously expose the edge of the wafer; the second through-wall robot is used to transfer the wafer in the second interlayer process module to the cleaning process layer.

[0014] Optionally, the wafer box module is provided with a wafer box robot for loading and transferring a wafer transfer box, and the wafer transfer box is used to load wafers; the first interlayer process module is provided with a first interlayer robot for transferring wafers within the first interlayer process module; the second interlayer process module is provided with a second interlayer robot for transferring wafers within the second interlayer process module; the first gluing process layer, the second gluing process layer, the third gluing process layer and the cleaning process layer are all provided with intra-layer robots for transferring wafers within the layer so that the wafers can undergo process processing.

[0015] In the second aspect, the present invention provides a control method for a glue coating and developing device, comprising: S1, controlling a film box robot to place a film box taken out from a film box cache position onto a film box loading unit, and the film box loading unit opens a first wafer transfer box; controlling a wafer robot to transfer a wafer in the first wafer transfer box to a wafer placement position of a first interlayer process module; S2, controlling the first interlayer robot to first place the wafer into an adhesion enhancement process unit, and then taking the wafer out of the adhesion enhancement process unit and placing it into a first through-the-wall cooling unit; after loading the wafer into the first through-the-wall cooling unit, transferring the wafer into the first glue coating process layer, and an intra-layer robot in the first glue coating process layer carries the wafer for the first processing and then places it into a vertical through-layer unit, and the vertical through-layer unit delivers the wafer in the first glue coating process layer into a second glue coating process layer; S3, controlling an intra-layer robot in the second glue coating process layer to carry After the wafer is processed for the second time, it is placed in the through-wall edge exposure unit, and the through-wall edge exposure unit transfers the wafer to the second interlayer process module; S4, control the second interlayer robot to first carry the wafer for back side cleaning, and then transfer the wafer to the interface robot area, the interface robot carries the wafer through the refrigeration unit and then transfers it to the exposure machine, after the wafer in the exposure machine is processed, the wafer is transferred to the interface robot area; the interface robot places the wafer at the wafer placement position of the second interlayer process module, and the second interlayer robot places the wafer to the first through-wall robot; S5, the first through-wall robot transfers the wafer to the cleaning process layer, the in-layer robot in the cleaning process layer carries the wafer for front side cleaning, and places the wafer to the second through-wall cooling unit; the second through-wall cooling unit transfers the wafer back to the second interlayer process module.

[0016] Optionally, after the second through-the-wall cooling unit brings the wafer back to the second interlayer process module, it also includes: S6, controlling the second interlayer robot to place the wafer on the second through-the-wall cooling unit into the second through-the-wall robot, and the second through-the-wall robot transfers the wafer to the third glue coating process layer; the intra-layer robot in the third glue coating process layer carries the wafer for the third processing and then places it into the through-the-wall optical inspection unit, and the through-the-wall optical inspection unit transfers the wafer to the first interlayer process module; S7, controlling the first interlayer robot to place the wafer at the wafer placement position, and controlling the wafer robot to transfer the wafer at the wafer placement position to the second wafer transfer box in the wafer box module. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 A schematic diagram of a side cross-sectional structure of a glue coating and developing device provided by the present invention;

[0018] Figure 2 A schematic diagram of a top cross-sectional structure of a glue coating and developing device provided by the present invention;

[0019] Figure 3 A schematic structural diagram of a vertical layer-penetrating unit provided by the present invention;

[0020] Figure 4 A schematic structural diagram of a first through-the-wall cooling unit provided by the present invention;

[0021] Figure 5 A schematic structural diagram of a through-the-wall optical detection unit provided by the present invention;

[0022] Figure 6 A schematic structural diagram of a through-the-wall edge exposure unit provided by the present invention;

[0023] Figure 7 A schematic flow chart of a control method for a glue coating and developing device provided by the present invention.

[0024] Numbers in the figure:

[0025] 1. Film box module; 11. Film box manipulator; 12. Wafer manipulator; 13. Film box loading unit; 14. Wafer transfer box; 15. Cache position; 16. Overhead crane position; 17. Manual position; 2. First interlayer process module; 21. Adhesion enhancement process unit; 22. First interlayer manipulator; 301. First glue coating process layer; 302. Second glue coating process layer; 303. Third glue coating process layer; 31. First process module; 32. Second process module; 331. Manipulator in the first layer; 333. Manipulator in the third layer; 341. Liquid treatment unit; 342. Heat treatment unit; 351. First partition; 352. Second partition; 4. Second interlayer process module; 41. Backwash process unit; 42. Second Interlayer robot; 45, interface module; 5, cleaning process layer; 51, positive washing process unit; 52, cleaning robot; 53, interface robot; 6, through-wall edge exposure unit; 601, exposure part; 602, third through-wall part; 7, through-wall optical detection unit; 701, camera; 702, light source; 703, second through-wall part; 801, cooling part; 802, first through-wall part; 81, first through-wall cooling unit; 82, second through-wall cooling unit; 83, vertical through-layer unit; 831, fixed part; 832, movable part; 833, connecting piece; 834, robot finger; 835, suction cup; 836, sliding part; 91, first through-wall robot; 92, second through-wall robot. DETAILED DESCRIPTION

[0026] In order to make the purpose, technical solutions and advantages of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention. Unless otherwise defined, the technical terms or scientific terms used herein should be understood by people with general skills in the field to which the present invention belongs. "Including" and similar words used in this article mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects.

[0027] In view of the problems existing in the existing technology, such as Figure 1 and Figure 2 As shown, the present invention provides a glue coating and developing device, comprising a film box module 1, a first interlayer process module 2, a first process module 31, a second interlayer process module 4 and a cleaning process layer 5 arranged in sequence along a first horizontally set direction; the first interlayer process module 2 comprises a bonding process unit 21 for performing bonding treatment on the wafer; the first process module 31 is provided with a first partition 351 and a second partition 352 stacked in sequence from bottom to top, which are used to separate and form a first glue coating process layer 301, a second glue coating process layer 302 and a third glue coating process layer 303 in the first process module 31.

[0028] Specifically, a vertical layer-crossing unit 83 is provided in the first partition 351, which is used to transfer wafers between the first glue coating process layer 301 and the second glue coating process layer 302; the vertical layer-crossing unit 83 is provided with a fixed part 831 and a movable part 832; the fixed part 831 is relatively fixed to the partition; the movable part 832 is movably connected to the fixed part 831; when the movable part 832 contacts the wafer, it is used to drive the wafer to pass through the first partition 351.

[0029] In some embodiments, the first interlayer process module 2 includes a first interlayer robot 22; the first interlayer robot 22 is used to send the wafers in the cassette module 1 to the adhesion process unit 21, or to send the wafers in the adhesion process unit 21 to the first glue coating process layer 301; the number of the adhesion process units 21 is 2. In some other embodiments, the number of the adhesion process units 21 is greater than M, and M is an integer greater than 2. This embodiment can save the wall-penetrating robot for transferring wafers from the first glue coating process layer 301 to the first interlayer process module 2 and the wall-penetrating robot for transferring wafers from the first interlayer process module 2 to the second glue coating process layer 302 by setting the vertical layer-penetrating unit 83. At the same time, this embodiment allows the wafer to directly pass through the first partition 351 without the participation of the first interlayer robot 22, which is beneficial to reducing the workload of the first interlayer robot 22, reducing the occupied time of transferring wafers, and is beneficial to improving production capacity.

[0030] In some embodiments, a first through-the-wall cooling unit 81 is provided between the first process module 31 and the first interlayer process module 2; a second through-the-wall cooling unit 82 and a first through-the-wall robot 91 are provided between the second interlayer process module 4 and the cleaning process layer 5; the first through-the-wall cooling unit 81 is provided between the first interlayer process module 2 and the first glue coating process layer 301; the second through-the-wall cooling unit 82 and the first through-the-wall robot 91 are both provided between the second interlayer process module 4 and the cleaning process layer 5.

[0031] In other specific embodiments, the wafer box module 1 is provided with a wafer box robot 11 for loading and transferring a wafer transfer box 14, and the wafer transfer box 14 is used to load wafers; the second interlayer process module 4 is provided with a second interlayer robot 42 for transferring wafers within the second interlayer process module 4; the first glue coating process layer 301, the second glue coating process layer 302, the third glue coating process layer 303 and the cleaning process layer 5 are all provided with intra-layer robots for transferring wafers within the layer so that the wafers can undergo process processing.

[0032] like Figure 3 As shown, in some embodiments, the contact surface between the movable portion 832 and the wafer is horizontally arranged; when the movable portion 832 drives the wafer to pass through the first partition plate 351, the wafer moves in a vertical direction.

[0033] More specifically, the movable part 832 includes a connector 833, a finger, a suction cup 835 and a sliding part 836; the fixed part 831 is configured as a slide rail, and the sliding part 836 is slidably connected to the slide rail. The sliding part 836 is connected to the connector 833; the connector 833 is connected to a mechanical finger 834, and a suction cup 835 is provided on the surface of the mechanical finger 834, and the suction cup 835 is used to adsorb the wafer when it contacts the wafer. Exemplarily, mechanical fingers 834 are provided at both the upper and lower ends of the connector 833, and adjacent mechanical fingers 834 are arranged in parallel, and each mechanical finger 834 is connected to three suction cups 835.

[0034] In some further specific embodiments, the first glue coating process layer 301, the second glue coating process layer 302, and the third glue coating process layer 303 all include a liquid processing unit 341, and the liquid processing unit 341 is used to perform glue coating on the surface of the wafer; the cleaning process layer 5 includes a front washing process unit 51, which is used to clean the front side of the wafer; the second interlayer process module 4 includes a back washing process unit 41, which is used to clean the back side of the wafer.

[0035] It is worth noting that a buffer position 15, a crane position 16 and a manual position 17 are also provided in the cassette module 1; the crane position 16 is used to load the wafer cassette 14 taken from the crane; the manual position 17 is used to load the wafer cassette 14 transported by manpower; the cassette manipulator 11 is used to take the wafer cassette 14 from the crane position 16 or the manual position 17. The buffer position 15 is provided between the wafer manipulator 12 and the cassette loading unit 13, and is used to buffer and place the wafer cassette 14.

[0036] Please refer to Figure 1 and Figure 2 In some embodiments, the first glue coating process layer 301, the second glue coating process layer 302, the third glue coating process layer 303 and the cleaning process layer 5 all include a heat treatment unit 342, and the heat treatment unit 342 is used to bake the wafer when in working state.

[0037] Reference Figure 2 In some embodiments, a second process module 32 is further included, and the second process module 32 is arranged between the first interlayer process module 2 and the second interlayer process module 4, and the second process module 32 is arranged in duplex symmetry with the first process module 31. In this embodiment, the first process module 31 and the second process module 32 are arranged in duplex symmetry, so that each glue coating process layer is arranged symmetrically, so that the manipulator 333 in the third layer can simultaneously take or place the wafers in the first process module 31 and the second process module 32, and keep the wafers in the first process module 31 and the second process module 32 synchronously for process processing, which is conducive to simplifying operations and improving production capacity.

[0038] Please refer to Figure 1 and Figure 2 Specifically, the third-layer inner robot is arranged in the first process module 31, and the third-layer inner robot 333 is used to simultaneously transfer the wafers located in the third coating process layer 303 in the first process module 31 and the wafers located in the third coating process layer 303 in the second process module 32.

[0039] It is worth noting that the second interlayer process module 4 and the cleaning process layer 5 together form an interface module 45, and the interface module 45 is used to connect with the exposure machine. Specifically, the second interlayer robot 42 is used to send the wafer into the backwash process unit 41. The interface module 45 is provided with an interface robot, which is used to send the wafer after the backwash process into the exposure machine for exposure process; the interface robot is also used to place the wafer after the exposure process into the wafer placement position of the second interlayer process module 4.

[0040] Specifically, the interface module 45 is further provided with an interface robot 53, which is used to carry the wafer through the refrigeration unit and then transfer it to the exposure machine. The interface robot 53 is also used to place the wafer at the wafer placement position of the second interlayer process module 4.

[0041] like Figure 4 As shown, the first through-the-wall cooling unit 81 and the second through-the-wall cooling unit 82 both include a first through-the-wall portion 802 and a cooling portion 801; the first end of the first through-the-wall portion 802 is fixed, and the second end of the first through-the-wall portion 802 is movable relative to the first end for transferring wafers; the cooling portion 801 is used for cooling and contacting with the surface of the wafer to cool the wafer. The adhesion process unit 21 is used for coating an adhesion promoter on the surface of the wafer and heating the wafer coated with the adhesion promoter.

[0042] Please refer to Figure 1 Specifically, the first glue coating process layer 301 is provided with a first layer inner manipulator 331; the second glue coating process layer 302 is provided with a second layer inner manipulator; the third glue coating process layer 303 is provided with a third layer inner manipulator 333; the cleaning process layer 5 is provided with a cleaning manipulator 52; illustratively, the third layer inner manipulator 333 is provided between the third glue coating process layer 303 of the first process module 31 and the third glue coating process layer 303 of the second process module 32. In some other examples, the first process module 31 and the second process module 32 are both provided with N process layers, N is an arbitrary positive integer, and the Nth layer inner manipulator is provided between the Nth process layer of the first process module 31 and the Nth process layer of the second process module 32.

[0043] It is worth noting that the first through-the-wall cooling unit 81, the second through-the-wall cooling unit 82, the first through-the-wall part 802 and the vertical through-the-layer unit 83 can all be provided with different cooling parts 801 at the same time to meet the cooling needs of wafers at different positions, avoid transporting wafers separately for cooling wafers, and help improve production efficiency.

[0044] like Figure 5 As shown, specifically, it also includes a through-wall optical detection unit 7, which includes a second through-wall part 703, a light source 702 and a camera 701; the first end of the second through-wall part 703 is fixed, and the second end of the second through-wall part 703 is movable relative to the first end, and is used to transmit wafers; the light source 702 is used to project light onto the surface of the wafer, and the camera 701 is used to receive light reflected from the surface of the wafer; the through-wall optical detection unit 7 is arranged between the third glue coating process layer 303 and the first interlayer process module 2, and is used to transfer the wafer in the third glue coating process layer 303 to the first interlayer process module 2, and perform optical detection on the wafer at the same time.

[0045] Specifically, the through-the-wall optical inspection unit 7 is disposed between the third glue coating process layer 303 and the first interlayer process module 2, and is used to transfer the wafers in the third glue coating process layer 303 to the first interlayer process module 2, and perform optical inspection on the wafers at the same time.

[0046] like Figure 6 As shown, in some embodiments, it also includes a through-wall edge exposure unit 6 and a second through-wall robot 92; the through-wall edge exposure unit 6 includes a third through-wall part 602 and an exposure part 601; the first end of the third through-wall part 602 is fixed, and the second end of the third through-wall part 602 is movable relative to the first end, and is used to transfer wafers; the exposure part 601 covers the edge of the wafer, and is used to expose the edge of the wafer for process; the through-wall edge exposure unit 6 is arranged between the second glue coating process layer 302 and the second interlayer process module 4, and is used to transfer the wafer in the second glue coating process layer 302 to the second interlayer process module 4, and simultaneously expose the edge of the wafer; the second through-wall robot 92 is used to transfer the wafer in the second interlayer process module 4 to the cleaning process layer 5.

[0047] Specifically, the through-wall edge exposure unit 6 is arranged between the second glue coating process layer 302 and the second interlayer process module 4, and is used to transfer the wafer in the second glue coating process layer 302 to the second interlayer process module 4, and simultaneously expose the edge of the wafer; a third through-wall robot is also arranged between the second glue coating process layer 302 and the first interlayer process module 2, which is used to transfer the wafer in the first interlayer process module 2 to the second glue coating process layer 302.

[0048] like Figure 7 As shown, this embodiment provides a control method for a glue coating and developing device, including: S1, controlling a film box robot to place a film box taken out from a film box cache position onto a film box loading unit, and the film box loading unit opens a first wafer transfer box; controlling a wafer robot to transfer a wafer in the first wafer transfer box to a wafer placement position of a first interlayer process module; S2, controlling the first interlayer robot to first place the wafer into an adhesion enhancement process unit, and then taking the wafer out of the adhesion enhancement process unit and placing it into a first through-the-wall cooling unit; after loading the wafer into the first through-the-wall cooling unit, transferring the wafer into the first glue coating process layer, and an intra-layer robot in the first glue coating process layer carries the wafer for a first processing and then places it into a vertical through-layer unit, and the vertical through-layer unit delivers the wafer in the first glue coating process layer into a second glue coating process layer; S3, controlling an intra-layer robot in the second glue coating process layer to carry After the wafer is processed for the second time, it is placed in the through-wall edge exposure unit, and the through-wall edge exposure unit transfers the wafer to the second interlayer process module; S4, control the second interlayer robot to first carry the wafer for back side cleaning, and then transfer the wafer to the interface robot area, the interface robot carries the wafer through the refrigeration unit and then transfers it to the exposure machine, after the wafer in the exposure machine completes the process, the wafer is transferred to the interface robot area; the interface robot places the wafer at the wafer placement position of the second interlayer process module, and the second interlayer robot places the wafer on the first through-wall robot; S5, the first through-wall robot transfers the wafer to the cleaning process layer, the in-layer robot in the cleaning process layer carries the wafer for front side cleaning, and places the wafer on the second through-wall cooling unit; the second through-wall cooling unit transfers the wafer back to the second interlayer process module.

[0049] Specifically, after the second through-the-wall cooling unit brings the wafer back to the second interlayer process module, it also includes: S6, controlling the second interlayer robot to put the wafer on the second through-the-wall cooling unit into the second through-the-wall robot, and the second through-the-wall robot transfers the wafer to the third glue coating process layer; the intra-layer robot in the third glue coating process layer carries the wafer for the third processing and then puts it into the through-the-wall optical detection unit, and the through-the-wall optical detection unit transfers the wafer to the first interlayer process module. It is worth noting that the first processing, the second processing and the third processing all include heat treatment and liquid treatment of the wafer.

[0050] In some other specific embodiments, after the through-the-wall optical inspection unit transfers the wafer to the first interlayer process module, it also includes: S7, controlling the first interlayer robot to place the wafer to the wafer placement position, and controlling the wafer robot to transfer the wafer at the wafer placement position to the second wafer transfer box in the wafer box module.

[0051] Although the embodiments of the present invention are described in detail above, it is obvious to those skilled in the art that various modifications and variations can be made to these embodiments. However, it should be understood that such modifications and variations are within the scope and spirit of the present invention as described in the claims. Moreover, the present invention described herein may have other embodiments and may be implemented or realized in a variety of ways.

Claims

1. A coating and developing device, characterized in that: It includes a film box module, a first interlayer process module, a first process module, a second interlayer process module and a cleaning process layer which are arranged in sequence in the horizontal direction; The first interlayer process module includes an adhesion process unit for performing adhesion treatment on the wafer; The first process module is provided with N layers of partitions stacked in sequence from bottom to top, for separating and forming N+1 glue coating process layers in the first process module, where N is a positive integer; At least one of the partitions is provided with a vertical layer-crossing unit for transferring wafers between different glue coating process layers; The vertical layer-penetrating unit is provided with a fixed part and a movable part; the fixed part is relatively fixed to the partition; the movable part is movably connected to the fixed part; when the movable part contacts the wafer, it is used to drive the wafer to pass through at least one layer of the partition.

2. The device according to claim 1, characterized in that The contact surface between the movable part and the wafer is arranged horizontally; when the movable part drives the wafer to pass through the partition, the wafer moves in the vertical direction.

3. The device according to claim 1 or 2, characterized in that The first process module includes a first glue coating process layer, a second glue coating process layer, and a third glue coating process layer. The first glue coating process layer, the second glue coating process layer, the third glue coating process layer and the cleaning process layer all include a heat treatment unit. When the heat treatment unit is in a working state, it is used to bake the wafer.

4. The device according to claim 3, characterized in that The first interlayer process module includes a first interlayer robot; the first interlayer robot is used to send the wafers from the wafer box module into the adhesion process unit, or to send the wafers in the adhesion process unit into the first glue coating process layer; the number of the adhesion process units is at least M, and M is an integer greater than 1.

5. The device according to claim 1, characterized in that It also includes a second process module, which is arranged between the first inter-layer process module and the second inter-layer process module, and the second process module and the first process module are arranged in duplex symmetry.

6. The device according to claim 1, characterized in that A first through-the-wall cooling unit is provided between the first process module and the first interlayer process module; a second through-the-wall cooling unit and a first through-the-wall manipulator are provided between the second interlayer process module and the cleaning process layer; The first through-the-wall cooling unit is arranged between the first inter-layer process module and the first glue coating process layer; the second through-the-wall cooling unit and the first through-the-wall manipulator are both arranged between the second inter-layer process module and the cleaning process layer; The first through-the-wall cooling unit and the second through-the-wall cooling unit both include a first through-the-wall portion and a cooling portion; the first end of the first through-the-wall portion is fixed, and the second end of the first through-the-wall portion is movable relative to the first end for transferring wafers; the cooling portion is used for cooling and contacting the surface of the wafer to cool the wafer.

7. The device according to claim 3, characterized in that It also includes a through-wall optical detection unit, which includes a second through-wall portion, a light source, and a camera; the first end of the second through-wall portion is fixed, and the second end of the second through-wall portion is movable relative to the first end, and is used to transmit the wafer; the light source is used to project light onto the surface of the wafer, and the camera is used to receive light reflected by the surface of the wafer; The through-the-wall optical detection unit is arranged between the third glue coating process layer and the first interlayer process module, and is used to transfer the wafers in the third glue coating process layer to the first interlayer process module, and perform optical detection on the wafers at the same time.

8. The device according to claim 3, characterized in that It also includes a through-wall edge exposure unit and a second through-wall robot; the through-wall edge exposure unit includes a third through-wall portion and an exposure portion; the first end of the third through-wall portion is fixed, and the second end of the third through-wall portion is movable relative to the first end, and is used to transfer the wafer; the exposure portion covers the edge of the wafer, and is used to expose the edge of the wafer for process; The through-the-wall edge exposure unit is disposed between the second glue coating process layer and the second interlayer process module, and is used to transfer the wafer in the second glue coating process layer to the second interlayer process module, and simultaneously perform edge exposure processing on the wafer; The second through-the-wall robot is used to transfer the wafers in the second interlayer process module to the cleaning process layer.

9. The device according to claim 3, characterized in that The wafer box module is provided with a wafer box manipulator for loading and transferring a wafer transfer box, and the wafer transfer box is used to load wafers; A first interlayer robot is provided in the first interlayer process module, and is used to transfer wafers in the first interlayer process module; A second interlayer robot is provided in the second interlayer process module, and is used for transferring wafers in the second interlayer process module; Intra-layer robots are provided in the first glue coating process layer, the second glue coating process layer, the third glue coating process layer and the cleaning process layer for transferring wafers within the layer so that the wafers can be processed.

10. A control method for a coating and developing device, characterized in that: include: S1, control the cassette robot to place the cassette taken from the cassette buffer position onto the cassette loading unit, and the cassette loading unit opens the first wafer transfer box; Controlling the wafer robot to transfer the wafer in the first wafer transfer box to the wafer placement position of the first interlayer process module; S2, control the first inter-layer robot to first place the wafer into the adhesion process unit, then take out the wafer from the adhesion process unit and place it into the first through-the-wall cooling unit; after loading the wafer, the first through-the-wall cooling unit transfers the wafer into the first glue coating process layer, the intra-layer robot in the first glue coating process layer carries the wafer for the first processing and then places it into the vertical through-layer unit, and the vertical through-layer unit transfers the wafer in the first glue coating process layer into the second glue coating process layer; S3, controlling the intra-layer robot in the second glue coating process layer to carry the wafer to a through-the-wall edge exposure unit for a second processing, and then transferring the wafer to the second inter-layer process module by the through-the-wall edge exposure unit; S4, control the second interlayer robot to first carry the wafer to perform back cleaning, and then transfer the wafer to the interface robot area, the interface robot carries the wafer through the refrigeration unit and then transfers it to the exposure machine, after the wafer in the exposure machine is processed, the wafer is transferred to the interface robot area; the interface robot places the wafer at the wafer placement position of the second interlayer process module, and the second interlayer robot places the wafer to the first through-wall robot; S5, the first through-the-wall robot transfers the wafer to the cleaning process layer, the intra-layer robot in the cleaning process layer carries the wafer for front cleaning, and places the wafer into the second through-the-wall cooling unit; the second through-the-wall cooling unit transfers the wafer back to the second inter-layer process module.

11. The method according to claim 10, characterized in that After the second through-the-wall cooling unit brings the wafer back to the second interlayer process module, the method further includes: S6, control the second interlayer robot to place the wafer on the second through-wall cooling unit into the second through-wall robot, and the second through-wall robot transfers the wafer to the third glue coating process layer; the intra-layer robot in the third glue coating process layer carries the wafer for the third processing and then places it into the through-wall optical inspection unit, and the through-wall optical inspection unit transfers the wafer to the first interlayer process module; S7, controlling the first interlayer robot to place the wafer at the wafer placement position, and controlling the wafer robot to transfer the wafer at the wafer placement position to the second wafer transfer box in the wafer box module.

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