Indium antimonide chip cleaning device and cleaning method

Abstract

The invention relates to an indium antimonide chip cleaning device and method, and is applied to the field of indium antimonide chip cleaning, the indium antimonide chip cleaning device comprises a shell, a rotating column is rotatably connected in the shell, a driving unit for driving the rotating column to rotate is arranged on the shell, a plurality of placing rings are arranged on the outer edge of the rotating column, and the placing rings are arranged on the outer edge of the rotating column. A plurality of cleaning units for placing chips are respectively arranged on the plurality of placing rings, and a spraying unit for spraying a cleaning agent is arranged on the shell. The automatic cleaning device has the technical effects that the driving unit is started, the rotating column is driven to rotate, the rotating column drives the placing ring and the cleaning unit to rotate synchronously, the spraying unit is started, and a cleaning agent is sprayed to the chip in the cleaning unit, so that the effect of automatically cleaning the indium antimonide chip is achieved, time and labor are saved, the labor cost is reduced, and the cleaning efficiency of the chip is improved.

Description

Technical Field

[0001] The present application relates to the technical field of indium antimonide chip cleaning, and in particular to an indium antimonide chip cleaning device and a cleaning method. Background Art

[0002] Indium antimonide detectors have a broad spectrum of infrared detection wavelengths and high detection stability in low-temperature environments. Therefore, the cleanliness of the Indium antimonide chip after cleaning has a great impact on the subsequent chip packaging and final detection performance, and directly determines the detection efficiency of the finished detector.

[0003] The mainstream chip cleaning method in the industry is that the operator first polishes and waxes the chips one by one, uses solvent to acid-etch the oxide layer on the chip surface, then removes the protective glue remaining on the chip surface, and rinses the chip to remove the residual cleaning agent.

[0004] In the existing chip cleaning process, the manual waxing of the chip is time-consuming and labor-intensive, and the use of solvent acid to etch the oxide layer on the chip surface also requires precise manual control, resulting in the subsequent cleaning process being unable to thoroughly clean the organic matter on the chip surface, resulting in low cleaning efficiency. Summary of the invention

[0005] In order to help solve the problem in the related art that in the cleaning process of indium antimonide chips, manual waxing of the chips is time-consuming and labor-intensive, and the use of solvent acid etching on the oxide layer on the chip surface also requires precise manual control, resulting in the subsequent cleaning process being unable to thoroughly clean the organic matter on the chip surface and the problem of low cleaning efficiency, an indium antimonide chip cleaning device is provided in the present application, which adopts the following technical solution: it includes a shell, a rotating column is rotatably connected to the shell, a driving unit for driving the rotating column to rotate is provided on the shell, a plurality of placement rings are provided on the outer edge of the rotating column, a plurality of cleaning units for placing chips are respectively provided on the plurality of placement rings, and a spray unit for spraying a cleaning agent is provided on the shell.

[0006] In a specific implementation scheme, the cleaning unit includes a placement seat arranged on a placement ring, a placement groove matching the chip is opened on the surface of the placement seat facing away from the placement ring, the chip is mounted in the placement groove, and a plurality of leakage holes are opened on the groove wall of the placement groove.

[0007] In a specific possible implementation manner, the bottom of the placement groove is inclined.

[0008] In a specific possible implementation manner, a taking groove is provided on the groove wall of the placement groove.

[0009] In a specific possible implementation scheme, the spray unit includes a liquid inlet pipe and a liquid outlet pipe arranged on the shell and connected to the shell, the liquid outlet end of the liquid inlet pipe is connected to a plurality of cleaning pipes, and the liquid outlet ends of the plurality of cleaning pipes are all connected to the shell.

[0010] In a specific embodiment, based on the cleaning method of the above-mentioned indium antimonide chip cleaning device, the cleaning method includes:

[0011] Place the chips into the cleaning unit one by one;

[0012] Start the driving unit to drive the rotating column and the placing ring to rotate synchronously;

[0013] Start the spray unit to spray the chips in the cleaning unit with the first cleaning liquid for cleaning the residual wax on the chip surface, and the cleaning time is 5 to 10 minutes;

[0014] After the first cleaning liquid is sprayed, the spray unit is started to spray the chips in the cleaning unit with the second cleaning liquid used to clean the residual protective glue on the chip surface. The cleaning time is 3 to 5 minutes.

[0015] After the second cleaning liquid is sprayed, the spray unit is started to spray the chip in the cleaning unit with the third cleaning liquid for cleaning the residual organic solvent on the chip surface, and the cleaning time is 3 to 5 minutes;

[0016] After the third cleaning solution is sprayed, the spray unit is started to spray the chip in the cleaning unit with the fourth cleaning solution for cleaning the residual heavy metal ions on the chip surface. The cleaning time is 3 to 5 minutes.

[0017] After the fourth cleaning liquid is sprayed, the spray unit is started to spray the chips in the cleaning unit with the fifth cleaning liquid used to clean the residual cleaning liquid on the chip surface, and the cleaning time is 10 to 20 minutes;

[0018] After the fifth cleaning liquid is sprayed, the chip after being rinsed with the fifth cleaning liquid is dried to complete the cleaning of the chip.

[0019] In a specific implementation manner, the first cleaning solution comprises 60-80% petroleum ether, 10-20% ethanol and 10-20% water by volume, wherein the purity of the petroleum ether is ≥99%, and the concentration of ethanol is ≥99.5%.

[0020] In a specific implementation manner, the second cleaning solution comprises 60-80% acetone, 10-20% ethanol and 10-20% water by volume, wherein the acetone purity is ≥99% and the ethanol concentration is ≥99.5%.

[0021] In a specific embodiment, the third cleaning solution comprises 30-40% ethylene glycol, 40-60% ethanol and 10-20% water by volume, wherein the ethylene glycol purity is ≥99% and the ethanol concentration is ≥99.5%.

[0022] In a specific embodiment, the fourth cleaning solution comprises 0.5-2% sodium alginate, 0.05-0.1% phosphoric acid and 98-99.5% water by mass percentage, wherein the sodium alginate powder is CR99% and the phosphoric acid concentration is ≥99%.

[0023] To sum up, the present application has at least the following beneficial technical effects: starting the driving unit to drive the rotating column to rotate, the rotating column drives the placement ring and the cleaning unit to rotate synchronously, starting the spray unit, and spraying the cleaning agent onto the chip in the cleaning unit, thereby achieving the effect of automatic cleaning of the indium antimonide chip, saving time and effort, reducing labor costs, and improving the cleaning efficiency of the chip. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the overall structure of Example 1 of the present application.

[0025] Figure 2 It is a structural schematic diagram used to reflect the placement slot in Example 1 of the present application.

[0026] Figure 3 It is a structural schematic diagram used to reflect the cleaning tube in Example 1 of the present application.

[0027] Figure numerals: 1. Shell; 2. Rotating column; 3. Placement ring; 4. Placement seat; 5. Placement groove; 6. Pick-up groove; 7. Liquid inlet pipe; 8. Liquid outlet pipe; 9. Cleaning pipe; 10. Cover plate; 11. First handle; 12. Second handle; 13. Opening and closing door; 14. Sealing gasket; 15. Leakage hole. DETAILED DESCRIPTION

[0028] The following is combined with Figure 1-3 This application is described in further detail.

[0029] The embodiment of the present application discloses an indium antimonide chip cleaning device.

[0030] Embodiment 1

[0031] Reference Figure 1 and Figure 2The indium antimonide chip cleaning device includes a cylindrical shell 1, which is made of an anti-corrosion material and the inner edge of the shell 1 is treated with an anti-corrosion treatment, thereby reducing the corrosion effect of the cleaning agent on the shell 1 and improving the service life of the shell 1. A rotating column 2 is rotatably connected in the shell 1, and a driving unit for driving the rotating column 2 to rotate is provided on the shell 1. In the embodiment of the present application, the driving unit can be connected to an external motor outside the shell 1, and the rotating column 2 is provided at the output end of the motor. The rotation speed of the rotating column 2 is 3 to 5 rpm.

[0032] Reference Figure 1 and Figure 2 , the outer edge of the rotating column 2 is detachably connected with a plurality of placement rings 3, and a plurality of cleaning units for placing chips are respectively provided on the plurality of placement rings 3, and a spray unit for spraying cleaning agent is provided on the housing 1. In the embodiment of the present application, the number of placement rings 3 is set to three, and can also be set to multiple according to actual conditions. A mounting ring is fixedly connected at the center of the three placement rings 3, and a plurality of mounting bolts are respectively penetrated on the three mounting rings. A plurality of threaded grooves matching the size of the mounting bolts are opened on the rotating column 2, and a plurality of mounting bolts are respectively threadedly connected in the threaded grooves, thereby realizing the detachable connection between the placement ring 3 and the rotating column 2.

[0033] Therefore, the driving unit is started to drive the rotating column 2 to rotate, and the rotating column 2 drives the placement ring 3 and the cleaning unit to rotate synchronously, and the spray unit is started to spray the cleaning agent onto the chip in the cleaning unit, thereby achieving the effect of automatic cleaning of the indium antimonide chip, saving time and effort, reducing labor costs, and improving the cleaning efficiency of the chip.

[0034] Reference Figure 1 and Figure 2 A cover plate 10 is detachably connected to the top of the shell 1, and a first handle 11 is installed on the surface of the cover plate 10 facing away from the bottom. The first handle 11 is convenient for taking the cover plate 10. An opening and closing door 13 is hinged on the outer edge of the shell 1, and a second handle 12 is installed on the surface of the opening and closing door 13 facing away from the cleaning unit. The second handle 12 is convenient for opening and closing the opening and closing door 13. The operator can take a single chip through the opening and closing door 13, or take the entire placement ring 3 after removing the cover plate 10, which is more flexible.

[0035] Reference Figure 1 and Figure 2 An annular sealing gasket 14 matching the size of the opening and closing door 13 is fixedly connected to the surface of the shell 1 facing the opening and closing door 13. The sealing gasket 14 plays a sealing role, reducing the possibility of leakage of the cleaning liquid when the cleaning liquid is sprayed in the shell 1, thereby improving the safety of the indium antimonide chip cleaning device during operation.

[0036] Reference Figure 1 and Figure 2The spray unit includes a liquid inlet pipe 7 and a liquid outlet pipe 8 which are arranged on the shell 1 and communicated with the shell 1. The liquid outlet end of the liquid inlet pipe 7 is connected to a plurality of cleaning pipes 9, and the liquid outlet ends of the plurality of cleaning pipes 9 are all communicated with the shell 1. In the embodiment of the present application, the number of cleaning pipes 9 corresponds to three placement rings 3 and is set to three respectively. The middle parts of the three cleaning pipes 9 are all communicated with the liquid inlet pipe 7, and both ends of the three cleaning pipes 9 are liquid outlet ends and are all communicated with the shell 1. The two ends of the three cleaning pipes 9 are respectively located above the three placement rings 3, and the cleaning liquid in the cleaning pipe 9 is sprayed on the cleaning unit on the placement ring 3 at a certain angle, thereby improving the cleaning efficiency of the chip in the cleaning unit.

[0037] Reference Figure 1 and Figure 3 In the embodiment of the present application, the number of cleaning units on the placement ring 3 can be multiple, and the multiple cleaning units are arranged in an array along the circumference of the placement ring 3. The cleaning unit includes a placement seat 4 bolted to the placement ring 3. The placement seat 4 and the housing 1 can be made of polypropylene or polytetrafluoroethylene. A placement groove 5 matching the chip size is provided on the surface of the placement seat 4 away from the placement ring 3. The chip is mounted in the placement groove 5. The placement groove 5 limits the position of the chip, reduces the possibility of the chip shaking in the placement seat 4, and improves the stability of chip placement.

[0038] Reference Figure 1 and Figure 3 A plurality of leakage holes 15 are provided on the wall of the placement groove 5, and the bottom of the placement groove 5 is inclined, so that the cleaning liquid in the placement groove 5 can be discharged from the leakage holes 15, thereby reducing the accumulation of the cleaning liquid in the placement groove 5. A taking groove 6 is provided on the wall of the placement groove 5, and the taking groove 6 facilitates the operator to take and place the chip from the placement groove 5.

[0039] The implementation principle of the embodiment of the present application is: start the motor to drive the rotating column 2 at the output end of the motor to rotate, and the rotating column 2 drives the placement ring 3 and the placement seat 4 to rotate synchronously; the cleaning liquid is injected into the shell 1 after passing through the liquid inlet pipe 7 and the cleaning pipe 9 in turn, and the cleaning agent is sprayed on the chip in the placement seat 4, thereby achieving the effect of automatic cleaning of the indium antimonide chip, saving time and labor, reducing labor costs and improving the cleaning efficiency of the chip.

[0040] Embodiment 2

[0041] The present application also discloses a cleaning method based on the above-mentioned indium antimonide chip cleaning device, and the cleaning method comprises:

[0042] S10, placing the chips in the placement slots 5 on the placement seat 4 in sequence;

[0043] S20, installing the placement ring 3 with the indium antimonide chip installed on the rotating column 2;

[0044] S30, installing the cover plate 10 on the top of the housing 1 and closing the opening and closing door 13;

[0045] S40, starting the motor to drive the rotating column 2 at the output end of the motor to rotate, and the rotating column 2 drives the placement ring 3 and the placement seat 4 to rotate synchronously;

[0046] S50, injecting a first cleaning liquid through the liquid inlet pipe 7 to clean the chip in the placement tank 5, the cleaning time is 5 to 10 minutes, the first cleaning liquid includes 60 to 80% petroleum ether, 10 to 20% ethanol and 10 to 20% water by volume, wherein the purity of petroleum ether is ≥ 99%, and the concentration of ethanol is ≥ 99.5%, so as to remove the residual wax on the surface of the chip, and the residual first cleaning liquid can be discharged from the housing 1 through the liquid outlet pipe 8;

[0047] S60, after the first cleaning liquid is sprayed, the second cleaning liquid is injected to clean the chip in the placement tank 5, and the cleaning time is 3 to 5 minutes. The second cleaning liquid includes 60 to 80% acetone, 10 to 20% ethanol and 10 to 20% water by volume, wherein the acetone purity is ≥ 99%, and the ethanol concentration is ≥ 99.5%, so as to remove the residual protective glue on the surface of the chip, and the residual second cleaning liquid can be discharged from the housing 1 through the liquid outlet pipe 8;

[0048] S70, after the second cleaning liquid is sprayed, a third cleaning liquid is injected to clean the chip in the placement tank 5, and the cleaning time is 3 to 5 minutes. The third cleaning liquid includes 30 to 40% ethylene glycol, 40 to 60% ethanol and 10 to 20% water by volume, wherein the purity of ethylene glycol is ≥99%, and the concentration of ethanol is ≥99.5%, so as to remove the residual organic solvent on the surface of the chip, and the residual third cleaning liquid can be discharged from the housing 1 through the liquid outlet pipe 8;

[0049] S80, after the third cleaning liquid is sprayed, the fourth cleaning liquid is injected to clean the chip in the placement tank 5, and the cleaning time is 3 to 5 minutes. The fourth cleaning liquid includes 0.5-2% sodium alginate, 0.05-0.1% phosphoric acid and 98-99.5% water by mass percentage, wherein the sodium alginate powder is CR99%, CR is a kind of analytical pure reagent, the purity is slightly lower than the premium pure and the impurity content is slightly higher than the premium pure, and the phosphoric acid concentration is ≥99%, so as to remove the residual heavy metal ions on the chip surface, and the residual fourth cleaning liquid can be discharged from the housing 1 through the liquid outlet pipe 8;

[0050] S90, after the fourth cleaning liquid is sprayed, the fifth cleaning liquid is injected to clean the chip in the placement tank 5, the fifth cleaning liquid uses pure water, the pure water flushing time is 10 to 20 minutes, and the water flow rate is 10 to 30 L / min, so as to remove the residual cleaning liquid on the surface of the chip, and the remaining waste water in the shell 1 can be discharged from the shell 1 through the liquid outlet pipe 8;

[0051] S100, after the fifth cleaning liquid is sprayed, the chip after being rinsed with the fifth cleaning liquid is left to stand and dry, so as to obtain a finished indium antimonide chip after cleaning and drying.

[0052] In view of the problems in the related art that indium antimonide chips used in detectors need to be cleaned one by one, the chip surface is easily contaminated, and a large amount of liquid residue containing metal ions remains on the surface, the present application provides a simple batch cleaning solution for indium antimonide chips without adding acidic or oxidizing substances, while reducing the safety hazards caused by the manual use of acidic solvents and reducing production costs, thereby improving the cleaning efficiency of indium antimonide chips and improving the detection efficiency of finished detectors.

[0053] This specific embodiment is merely an explanation of the present invention and is not a limitation of the present invention. After reading this specification, those skilled in the art may make non-creative modifications to the present embodiment as needed. However, as long as they are within the scope of the claims of the present invention, they are protected by the patent law.

Claims

1. An indium antimonide chip cleaning device, characterized in that: The invention comprises a shell (1), a rotating column (2) is rotatably connected inside the shell (1), a driving unit for driving the rotating column (2) to rotate is provided on the shell (1), a plurality of placement rings (3) are provided on the outer edge of the rotating column (2), a plurality of cleaning units for placing chips are respectively provided on the plurality of placement rings (3), and a spray unit for spraying a cleaning agent is provided on the shell (1).

2. The indium antimonide chip cleaning device according to claim 1, characterized in that: The cleaning unit comprises a placement seat (4) arranged on a placement ring (3); a placement groove (5) matching the chip is provided on a surface of the placement seat (4) facing away from the placement ring (3); the chip is mounted in the placement groove (5); and a plurality of liquid leakage holes (15) are provided on the groove wall of the placement groove (5).

3. The indium antimonide chip cleaning device according to claim 2, characterized in that: The bottom of the placement groove (5) is arranged in an inclined manner.

4. The indium antimonide chip cleaning device according to claim 2, characterized in that: A taking groove (6) is provided on the groove wall of the placement groove (5).

5. The indium antimonide chip cleaning device according to claim 1, characterized in that: The spray unit comprises a liquid inlet pipe (7) and a liquid outlet pipe (8) which are arranged on the shell (1) and communicate with the shell (1); the liquid outlet end of the liquid inlet pipe (7) is connected to a plurality of cleaning pipes (9); and the liquid outlet ends of the plurality of cleaning pipes (9) are all communicated with the shell (1).

6. A cleaning method based on the indium antimonide chip cleaning device according to claim 1, characterized in that: The cleaning method comprises: Place the chips into the cleaning unit one by one; Starting the driving unit to drive the rotating column (2) and the placing ring (3) to rotate synchronously; Start the spray unit to spray the chips in the cleaning unit with the first cleaning liquid for cleaning the residual wax on the chip surface, and the cleaning time is 5 to 10 minutes; After the first cleaning liquid is sprayed, the spray unit is started to spray the chips in the cleaning unit with the second cleaning liquid used to clean the residual protective glue on the chip surface. The cleaning time is 3 to 5 minutes. After the second cleaning liquid is sprayed, the spray unit is started to spray the chip in the cleaning unit with the third cleaning liquid for cleaning the residual organic solvent on the chip surface, and the cleaning time is 3 to 5 minutes; After the third cleaning solution is sprayed, the spray unit is started to spray the chip in the cleaning unit with the fourth cleaning solution for cleaning the residual heavy metal ions on the chip surface. The cleaning time is 3 to 5 minutes. After the fourth cleaning liquid is sprayed, the spray unit is started to spray the chips in the cleaning unit with the fifth cleaning liquid used to clean the residual cleaning liquid on the chip surface, and the cleaning time is 10 to 20 minutes; After the fifth cleaning liquid is sprayed, the chip after being rinsed with the fifth cleaning liquid is dried to complete the cleaning of the chip.

7. The cleaning method of the indium antimonide chip cleaning device according to claim 6, characterized in that: The first cleaning solution comprises 60-80% petroleum ether, 10-20% ethanol and 10-20% water by volume, wherein the purity of the petroleum ether is ≥99% and the concentration of the ethanol is ≥99.5%.

8. The cleaning method of the indium antimonide chip cleaning device according to claim 6, characterized in that: The second cleaning solution comprises 60-80% acetone, 10-20% ethanol and 10-20% water by volume, wherein the purity of acetone is ≥99% and the concentration of ethanol is ≥99.5%.

9. The cleaning method of the indium antimonide chip cleaning device according to claim 6, characterized in that: The third cleaning solution comprises 30-40% ethylene glycol, 40-60% ethanol and 10-20% water by volume, wherein the ethylene glycol purity is ≥99% and the ethanol concentration is ≥99.5%.

10. The cleaning method of the indium antimonide chip cleaning device according to claim 6, characterized in that: The fourth cleaning solution comprises 0.5-2% sodium alginate, 0.05-0.1% phosphoric acid and 98-99.5% water by mass percentage, wherein the sodium alginate powder is CR99% and the phosphoric acid concentration is ≥99%.

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