An automated production line for micro-nano composite structure chips

Abstract

The present invention belongs to the technical field of chip preparation equipment, and specifically is an automated production line for preparing micro-nano composite structure chips, including a reaction device, and a transfer device with a clamping component, a control module and a visual module are installed in the reaction device; the reaction device includes a reactor, and the reactor is evenly installed on the top of the reaction device; through the coordination between wet cleaning and dry cleaning, the chip cleaning measures are increased and the cleaning effect is improved; in addition, during the rising process after the chip wet cleaning is completed, it will undergo the above-mentioned dry cleaning again, and then, the cleaning solution on the chip is blown away by the jet component, and the chip is cleaned again by utilizing the effect of the cleaning solution being blown away, thereby improving the cleaning effect; moreover, the paint spraying component sprays the cleaning gas of a set temperature, which can also accelerate the drying of the chip and the volatilization of the cleaning solution, reduce the time spent on cleaning, and improve the efficiency of chip preparation.

Description

Technical Field

[0001] The invention belongs to the technical field of chip preparation equipment, in particular to an automated production line for preparing micro-nano composite structure chips. Background Art

[0002] At present, the preparation method of chips still remains in the high-energy consumption and high-cost subtractive manufacturing method, such as photolithography, etching, etc., and the preparation difficulty may be greatly increased according to the different micro-nanostructure morphology. For example, the preparation of silicon nanowires can be prepared by mature etching methods, but it is more difficult to prepare regular silicon nanowires on micron structures; and in the additive manufacturing method, such as 3D printing, magnetic induction and other methods, the structures prepared may encounter problems such as low resolution, limited structural morphology, and long preparation process time; and both manufacturing methods are not adaptable to medical soft materials, and it is difficult to prepare micro-nano composite structures based on biomaterials on demand;

[0003] The laboratory has provided a variety of methods for preparing polymer-based micro-nano composite structures, such as the self-emulsification method for preparing micro-nano porous structures, the self-assembly annealing method for preparing nanopores, and the solvent exchange method for preparing nanociliary structures. However, the current preparation methods and equipment will encounter the following problems when preparing chips in large quantities:

[0004] Polymers, photoresists and etching impurities make up the majority of the particles. Usually, the particles will adhere to the silicon surface, affecting the subsequent chip preparation effect and the quality of the finished product. Photoresist and other pollutants are different from polymer pollutants. They are mostly solvent impurities that affect the overall cleanliness of the chip. There are also metal pollutants and other impurities. Therefore, the impurities on the chip will produce different impurities according to the previous process. These impurities also require different cleaning methods to complete cleaning. Conventional cleaning equipment is too single, which not only affects chip cleaning, but may also affect the quality of chip preparation. Summary of the invention

[0005] In order to make up for the deficiencies of the prior art and solve the above-mentioned technical problems, the present invention proposes an automated production line for preparing micro-nano composite structure chips.

[0006] The technical solution adopted by the present invention to solve the technical problem is as follows: the present invention proposes an automated production line for preparing micro-nano composite structure chips, including a reaction device, and a transfer device with a clamping component, a control module and a visual module are installed in the reaction device; the reaction device includes:

[0007] The reactor is evenly installed on the top of the reaction equipment, and the reaction solution is stored in the reactor; a cleaning container is installed on the top of the reaction equipment, and the cleaning container uses an ultrasonic cleaning method to wet clean the chip; a frame-shaped reaction basket is clamped at the bottom of the transfer device, and chips are evenly installed in the reaction basket, and the chips are placed vertically; a support plate is provided on the top of the side wall of the cleaning container, and a jet plate is evenly slidably connected to the support plate, and the jet plate is connected to the electric telescopic device provided on the support plate; a jet assembly is installed on the jet plate, and the jet assembly uses air phase to dry clean the chip;

[0008] An extrusion block is arranged on one side of the support plate, and the cross section of the extrusion block is triangular; an extrusion rod is arranged in the reaction basket, and the extrusion rod is slidably connected to the reaction basket through a spring, vertical rods are evenly arranged in the reaction basket, and a mounting frame is arranged between adjacent vertical rods, and the chip is installed in the mounting frame; rotating shafts are arranged on both sides of the mounting frame, and one end of the rotating shaft rotates on the vertical rod, and one of the multiple rotating shafts close to the extrusion rod passes through the inner wall of the reaction basket and engages with the extrusion rod.

[0009] Preferably, a hydraulic cavity is provided in the vertical pole, and a suction nozzle is provided at the bottom of the vertical pole, and a filter cotton is provided at the bottom of the cleaning container, and the suction nozzle is inserted into the filter cotton; a hydraulic block is connected to the hydraulic cavity through a spring sliding connection, and a hydraulic rod is provided on the top of the hydraulic block, and one end of the hydraulic rod passes through the inner wall of the hydraulic cavity and is located above the reaction basket; nozzles are evenly provided on one side of the vertical pole, and the nozzles are tilted to point to the chip; a clamping block is connected to the bottom of the cleaning container through a spring sliding connection, and the clamping block with a triangular cross-section is engaged with the frame at the bottom of the reaction basket; when the reaction basket is in a clamping state, the bottom of the transfer device presses the hydraulic block down through the hydraulic rod to discharge the solution sucked into the hydraulic cavity; when the reaction basket is placed in the reactor, the hydraulic block is lifted up by the spring, and the hydraulic cavity sucks the solution through the suction nozzle.

[0010] Preferably, clamping rods are evenly arranged on the top of the reaction basket, and the tops of the clamping rods are interconnected; the parts where the tops of the clamping rods are interconnected match the clamping components of the transfer device, and a part of the multiple visual modules is arranged at the bottom of the jet plate; a lifting grid is arranged above the reaction basket, the lifting grid is slidably connected to the clamping rod, and one chip corresponds to the bottom of one grid, and one chip corresponds to one nozzle; the top of the hydraulic rod is connected to the bottom of the lifting grid, and the top of the lifting grid is fixedly connected to the lifting rod, and one end of the lifting rod is located above the clamping rod.

[0011] Preferably, a sponge board is provided on a side of the vertical rod away from the nozzle, and the sponge board is located between adjacent installation frames.

[0012] Preferably, sponge strips are provided on both sides of the installation frame; when the chip is dry-cleaned, the installation frame is rotated to a horizontal state, and the sponge strips are in a vertical state and surround the chip.

[0013] Preferably, a partition is provided in the cleaning container, and a reaction basket is provided between one side of the partition and the cleaning container, and a baffle is provided between the other side and the cleaning container; a water outlet is provided on one side of the baffle, and a water pumping port is provided on the other side, and a water tank is provided in the reaction equipment, the cleaning solution is stored in the water tank, and the water tank is connected to the water outlet and the water pumping port respectively through pipes.

[0014] Preferably, a U-shaped cleaning groove is opened on one side of the mounting frame, and a rotating rod is rotatably connected in the cleaning groove through a torsion spring, the number of the rotating rods is three, two rotating rods are vertically installed, and one rotating rod is horizontally installed, the horizontal rotating rod is connected to the vertical rotating rod, so that the horizontal rotating rod drives the vertical rotating rod to rotate; the sponge bar is installed on the surface of the rotating rod; when the sponge bar is immersed in the solution, it rotates and retracts into the cleaning groove; when the sponge bar is not immersed in the solution, it rotates and extends out of the cleaning groove; a rack is provided at the bottom of the cleaning container, and the rack passes through the mounting frame and engages with the horizontal rotating rod in the cleaning groove.

[0015] Preferably, the inner wall of the cleaning tank is arc-shaped, and the inner wall of the cleaning tank opening away from the chip scratches the sponge strip; a sealing block is provided on the surface of the rotating rod away from the sponge strip.

[0016] Preferably, a cleaning rod is installed at the bottom of the cleaning container, and the cleaning rod is located between adjacent mounting frames, one mounting frame corresponds to one cleaning rod; the outer ring surface of the cleaning rod is wavy, and the wavy surface of the cleaning rod contacts the mounting frame surface and the sponge plate.

[0017] Preferably, a No. 1 slide groove and a No. 2 slide groove are respectively provided on the support plate, the No. 1 slide groove is close to the top rod and passes through the extrusion block, and the No. 2 slide groove is close to the cleaning rod.

[0018] The beneficial effects of the present invention are as follows:

[0019] 1. The automated production line for preparing micro-nano composite structure chips described in the present invention increases chip cleaning measures and improves cleaning effects through the coordination between wet cleaning and dry cleaning; in addition, during the rising process after the chip wet cleaning is completed, it will undergo the above-mentioned dry cleaning again, and then the cleaning solution on the chip will be blown away by the jet component, and the chip will be cleaned again by utilizing the effect of the cleaning solution being blown away, thereby improving the cleaning effect; moreover, the spray paint component sprays cleaning gas of a set temperature, which can also accelerate the drying of the chip and the volatilization of the cleaning solution, reduce the time spent on cleaning, and improve the efficiency of chip preparation.

[0020] 2. In the automated production line for preparing micro-nano composite structure chips described in the present invention, during the resetting process, the rotation speed of the chip is controlled by the speed at which the extrusion rod extends to drive the rotation of the shaft, and the rotation speed of the shaft is controlled by the extension speed of the extrusion rod, that is, the movement speed of the extrusion rod on the lower inclined surface of the extrusion block. Therefore, the rotation and resetting speed of the chip can be controlled by controlling the descending speed of the extrusion rod. Through the rotation of the chip, the dirt and particles that are difficult to reach are removed, ensuring the cleanliness of the chip surface, thereby improving the quality of chip preparation; after the chip is reset, the extrusion rod contacts the surface of the support plate again, and the chip at this time remains in a vertical state and enters the cleaning solution. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] The present invention will be further described below in conjunction with the accompanying drawings.

[0022] Figure 1 is a stereogram of the present invention;

[0023] Figure 2 It is a cross-sectional view of the three-dimensional state of the cleaning container;

[0024] Figure 3 It is another cross-sectional view of the three-dimensional state of the cleaning container;

[0025] Figure 4 It is the state diagram when the extrusion rod does not contact the extrusion block;

[0026] Figure 5 This is a state diagram of the extrusion rod descending to the middle of an inclined surface of the extrusion block;

[0027] Figure 6 It is a state diagram of the extrusion rod descending to the connection point of the two inclined surfaces of the extrusion block;

[0028] Figure 7 is a side cross-sectional view of the extrusion rod not contacting the extrusion block;

[0029] Figure 8 is a cross-sectional view of the reaction basket when it is not immersed in the cleaning solution;

[0030] Fig. 9 It is a cross-sectional view of the three-dimensional state of the installation frame;

[0031] Fig.10 It is a state diagram when the rack drives the horizontally installed rotating rod to rotate;

[0032] In the figure: reaction equipment 1, transfer device 11, control module 12, visual module 13, reactor 14, cleaning container 15, reaction basket 16, support plate 2, jet plate 21, electric telescopic device 22, jet assembly 23, extrusion block 3, extrusion rod 31, vertical rod 32, mounting frame 33, rotating shaft 34, hydraulic chamber 35, suction nozzle 36, filter cotton 37, hydraulic block 38, hydraulic rod 39, nozzle 4, block 41, clamping rod 42, lifting grid 43, lifting rod 44, sponge plate 45, sponge strip 46, partition 5, baffle 51, water outlet 52, water suction port 53, water tank 54, cleaning tank 6, rotating rod 61, rack 62, sealing block 63, cleaning rod 64, No. 1 slide 65, No. 2 slide 66. DETAILED DESCRIPTION

[0033] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0034] Embodiment 1:

[0035] An automated production line for preparing micro-nano composite structure chips, as shown in the accompanying drawings of the specification Figure 1-Figure 10 As shown, it includes a reaction device 1, and a transfer device 11 with a clamping component, a control module 12 and a visual module 13 are installed in the reaction device 1, the control module 12 is used to control the operation of the reaction device 1, and the transfer device 11 is used to transfer chips; the visual module 13 is evenly installed on the transfer device 11, and the visual module 13 is used to detect chips and assist chip transfer; the transfer device 11 with the clamping component is a conventional manipulator component for transferring chips, and the visual module 13 is a conventional camera component for chip transfer and visual detection; the reaction device 1 includes:

[0036] A reactor 14, wherein the reactor 14 is evenly installed on the top of the reaction device 1, and a reaction solution is stored in the reactor 14; a cleaning container 15 is installed on the top of the reaction device 1, and the cleaning container 15 uses an ultrasonic cleaning method to wet-clean the chip; a frame-shaped reaction basket 16 is clamped at the bottom of the transfer device 11, and chips are evenly installed in the reaction basket 16, and the chips are placed vertically; a support plate 2 is provided on the top of the side wall of the cleaning container 15, and a jet plate 21 is evenly slidably connected to the support plate 2, and the jet plate 21 is connected to the electric telescopic device 22 provided on the support plate 2; a jet assembly 23 is installed on the jet plate 21, and the jet assembly 23 performs dry cleaning on the chip through air phase;

[0037] The reactor 14 is a conventional container for reacting the chip with the solution, and the reactor 14 stores different types of reaction solutions according to different purposes to be achieved; the cleaning container 15 is a conventional container with an ultrasonic device installed inside, and the chip is wet cleaned by an ultrasonic cleaning method; the jet component 23 is a conventional device for cleaning the chip, and the jet component 23 has the function of adjusting the jet temperature, which accelerates the drying of the chip while performing dry cleaning on the chip; the electric telescopic device 22 is a conventional electric device for telescoping;

[0038] An extrusion block 3, which is arranged on one side of the support plate 2, and the cross section of the extrusion block 3 is triangular; an extrusion rod 31 is arranged in the reaction basket 16, and the extrusion rod 31 is slidably connected to the reaction basket 16 through a spring, and vertical rods 32 are evenly arranged in the reaction basket 16, and a mounting frame 33 is arranged between adjacent vertical rods 32, and the chip is installed in the mounting frame 33; both sides of the mounting frame 33 are provided with a rotating shaft 34, and one end of the rotating shaft 34 rotates on the vertical rod 32, and one of the multiple rotating shafts 34 close to the extrusion rod 31 passes through the inner wall of the reaction basket 16 and meshes with the extrusion rod 31; the extrusion rod 31 is arranged horizontally, and when the extrusion rod 31 is stationary, one end of the extrusion rod 31 close to the extrusion block 3 extends out of the reaction basket 16, and the other end surface is flush with the surface of the reaction basket 16;

[0039] Specific workflow: the staff installs and fixes the chip in the installation frame 33 in a professional way, and then puts the reaction basket 16 on one side of the reaction device 1. The reaction device 1 gives an instruction to let the transfer device 11 with the visual module 13 move to the top of the reaction basket 16 with the assistance of real-time images. After the visual module 13 identifies the chip in the reaction basket 16, it gives an instruction to make the transfer device 11 grab the reaction basket 16 downward and move it to the first reactor 14. The shape of the reactor 14 is determined by the visual module 13, and the position is adjusted to put down the reaction basket 16; when the reaction time of chip preparation is up, the transfer device 11 moves to the reactor 14, identifies the reaction basket 16 by the visual module 13, and then takes out the reaction basket 16 and moves it to the cleaning container 15 for cleaning; then, the transfer device 11 puts the cleaned chip into the next reactor 14 to carry out the next step of the reaction, and the above method is followed until the chip is cleaned and dried after the reaction; after the reaction is completed, the chip basket is placed on the other side of the reaction device 1 to wait for sequential unloading;

[0040] The cleaning solution in the cleaning container 15 is disposable. After each chip cleaning, the cleaning solution needs to be replaced to ensure the chip cleaning effect, reduce impurity residues, and improve the quality of chip preparation. When the chip moves to the specified position above the cleaning container 15, the transfer device 11 drives the extrusion rod 31 to descend through the reaction basket 16. One end of the extrusion rod 31 extends out of the reaction basket 16 and contacts and slides down along the support plate 2 until the extrusion rod 31 contacts the extrusion block 3. Then, the extrusion rod 31 is guided by the inclined surface of the extrusion block 3 and slides into the reaction basket 16. Due to the rotation shaft 3 4 is meshed with the squeezing rod 31, so the squeezing rod 31 moves and drives the rotating shaft 34 to rotate; the rotating shafts 34 on both sides of the mounting frame 33 are connected to the inner wall of the reaction basket 16 with one rotating shaft 34, and the other rotating shaft 34 is connected to the vertical rod 32 with the axis of the rotating shaft 34 as the axis, so that the chip in the vertical state is turned to the horizontal state, and one side of the chip faces upward at this time, and an electric telescopic device 22 drives the jet plate 21 to move and extend into the reaction basket 16, and performs dry cleaning on one side of the chip at a close distance, and retracts after the cleaning is completed;

[0041] Subsequently, the reaction basket 16 continues to drive the extrusion rod 31 to move along the inclined surface of the extrusion block 3, and the extrusion rod 31 continues to retract into the reaction basket 16. The extrusion rod 31 drives the chip in the horizontal state to continue to rotate through the rotating shaft 34 and the mounting frame 33 until the other side of the chip faces upward, and another electric telescopic device 22 drives the next jet plate 21 to move, and uses the jet assembly 23 to dry clean the other side of the chip, and retracts after cleaning; through the above method, both sides of the chip are dry cleaned, the cleaning efficiency is improved, and thus the efficiency of chip preparation is improved; and the above method can also be used to perform different treatments according to chips with different cleaning needs, that is, switching between cleaning of one side alone or cleaning of both sides, thereby expanding the scope of application and improving the convenience of use;

[0042] After the chip is tilted by dry method, the reaction basket 16 continues to descend. Since the cross section of the extrusion block 3 is triangular, there are two inclined surfaces on the extrusion block 3, namely, an upper inclined surface and a lower inclined surface. After the extrusion rod 31 passes over the upper inclined surface of the extrusion block 3, it contacts the lower inclined surface and makes the extrusion rod 31 gradually extend under the influence of the spring, driving the shaft 34 and the mounting frame 33 to rotate and reset while driving the chip to rotate and reset; and during the reset process, the rotation speed of the chip is controlled by the speed at which the extrusion rod 31 extends to drive the shaft 34 to rotate, and the rotation speed of the shaft 34 is controlled by the extension speed of the extrusion rod 31, that is, the movement speed of the extrusion rod 31 on the lower inclined surface of the extrusion block 3. Therefore, the rotation reset speed of the chip can be controlled by controlling the descending speed of the extrusion rod 31. Through the rotation of the chip, the dirt and particles that are difficult to reach are removed to ensure the cleanliness of the chip surface, thereby improving the quality of chip preparation; after the chip is reset, the extrusion rod 31 contacts the surface of the support plate 2 again, and the chip at this time remains in a vertical state and enters the cleaning solution;

[0043] After the chip is immersed in the cleaning solution, the cleaning container 15 uses ultrasonic cleaning to wet clean the chip again, and the chip remains in a vertical state, so that impurities on both sides of the chip are not blocked and fall freely to the bottom of the cleaning container 15; and through the coordination between wet cleaning and dry cleaning, the chip cleaning measures are increased while the cleaning effect is improved; in addition, during the rising process of the chip after wet cleaning, it will undergo the above-mentioned dry cleaning again, and then the cleaning solution on the chip will be blown away by the jet component 23, and the chip will be cleaned again by using the effect of the cleaning solution being blown away, thereby improving the cleaning effect; and the paint spray component sprays cleaning gas at a set temperature, which can also speed up the drying of the chip and the volatilization of the cleaning solution, reduce the time spent on cleaning, and improve the efficiency of chip preparation.

[0044] Embodiment 2:

[0045] Based on the first embodiment, as shown in the accompanying drawings of the specification Figure 1-Figure 10 As shown, a hydraulic cavity 35 is provided in the vertical rod 32, and a suction nozzle 36 is provided at the bottom of the vertical rod 32, and a filter cotton 37 is provided at the bottom of the cleaning container 15, and the suction nozzle 36 is inserted into the filter cotton 37; a hydraulic block 38 is slidably connected to the hydraulic cavity 35 by a spring, and a hydraulic rod 39 is provided on the top of the hydraulic block 38, and one end of the hydraulic rod 39 passes through the inner wall of the hydraulic cavity 35 and is located above the reaction basket 16; nozzles 4 are evenly provided on one side of the vertical rod 32, and the nozzles 4 are tilted to point to the chip; a clamping block 41 is slidably connected to the bottom of the cleaning container 15 by a spring, and the clamping block 41 with a triangular cross section is engaged with the frame at the bottom of the reaction basket 16; when the reaction basket 16 is in a clamping state, the bottom of the transfer device 11 squeezes the hydraulic block 38 downward through the hydraulic rod 39 to discharge the solution sucked into the hydraulic cavity 35; when the reaction basket 16 is placed in the reactor 14, the hydraulic block 38 is lifted by the spring, and the hydraulic cavity 35 sucks the solution through the suction nozzle 36;

[0046] The top of the reaction basket 16 is evenly provided with clamping rods 42, and the tops of the clamping rods 42 are connected to each other; the mutually connected parts of the tops of the clamping rods 42 match the clamping components of the transfer device 11, and a part of the multiple visual modules 13 is arranged at the bottom of the jet plate 21; a lifting grid 43 is arranged above the reaction basket 16, and the lifting grid 43 is slidably connected to the clamping rod 42, and one grid corresponds to one chip below, and one chip corresponds to one nozzle 4; the top of the hydraulic rod 39 is connected to the bottom of the lifting grid 43, and the top of the lifting grid 43 is fixedly connected with a lifting rod 44, and one end of the lifting rod 44 is located above the clamping rod 42; the visual module 13 is divided into two parts according to the installation position, one part is located on the transfer device 11, used to assist the transfer device 11 to move the reaction basket 16, and the other part is located at the bottom of the jet plate 21, used to shoot the chip surface in a horizontal state at a close distance to form an image for detecting dust residue in the chip;

[0047] A sponge board 45 is provided on one side of the vertical rod 32 away from the nozzle 4, and the sponge board 45 is located between adjacent mounting frames 33;

[0048] Sponge strips 46 are provided on both sides of the mounting frame 33; when the chip is dry-cleaned, the mounting frame 33 is rotated to a horizontal state, and the sponge strips 46 are in a vertical state surrounding the chip;

[0049] Specific working process: when the reaction basket 16 is in the reactor 14, the bottom of the transfer device 11 drives the hydraulic block 38 to move by squeezing the hydraulic rod 39, so that the reaction solution in the hydraulic chamber 35 is sprayed to the chip surface through the nozzle 4, promoting the reaction between the chip and the new reaction solution, and improving the preparation effect of the chip; when the reaction basket 16 needs to leave the reactor 14, the transfer device 11 squeezes the hydraulic block 38 to the bottom of the hydraulic chamber 35 through the hydraulic rod 39, and then takes it away. At this time, the reaction solution in the hydraulic chamber 35 is squeezed and discharged by the hydraulic block 38, reducing the residue of the reaction solution and facilitating cleaning;

[0050] When the reaction basket 16 is in the cleaning container 15, the bottom of the reaction basket 16 contacts and passes over the block 41. After the block 41 is reset, its bottom is pressed on the bottom frame of the reaction basket 16, fixing the reaction basket 16 in the cleaning container 15 to prevent the hydraulic rod 39 and the hydraulic block 38 from rising and falling and causing the reaction basket 16 carrying the chip to vibrate violently; when the transfer device 11 releases the reaction basket 16 and rises, the hydraulic block 38 is affected by the spring and drives the hydraulic rod 39 to rise, and a negative pressure is formed inside the hydraulic chamber 35, and the cleaning solution is sucked through the suction nozzle 36; the transfer device 11 descends again and drives the hydraulic block 38 to descend, and the cleaning solution in the hydraulic chamber 35 is sprayed to the chip at a close distance through the nozzle 4, thereby improving the fluidity of the cleaning solution around the chip, thereby improving the cleaning effect;

[0051] Furthermore, when the chip is cleaned by ultrasonic wave, impurities on the surface will fall off. If they are not blown away in time, secondary pollution will be caused to the chip. Moreover, the suction nozzle 36 absorbs clean cleaning solution through the filter cotton 37, so that the chip can be continuously cleaned by the clean solution, thereby improving the cleaning effect.

[0052] Furthermore, when performing dry cleaning, the jet plate 21 extends between the interconnected portion at the top of the clamping rod 42 and the lifting grid 43. At this time, since the reaction basket 16 is in a transferred state, the transfer device 11 transfers the reaction basket 16 through the top of the clamping rod 42, and the lifting grid 43 is squeezed to the top of the reaction basket 16 by the lifting rod 44 at the bottom of the transfer device 11, thereby increasing the spacing between the clamping rod 42 and the lifting grid 43, and facilitating the insertion of the jet plate 21; and the jet plate 21 drives the jet assembly 23 and the visual module 13 to enter between the interconnected portion at the top of the clamping rod 42 and the lifting grid 43. While the jet assembly 23 is jetting and cleaning, the visual module 13 detects the residual impurities and solution residues in the chip through image detection technology, so that the staff can more accurately grasp the cleaning and preparation of the chip, so as to make timely adjustments and improve practicality; when the visual module 13 detects, the lifting grid 43 contacts the top of the reaction basket 16, and one grid corresponds to one chip below, which can avoid the lifting grid 43 from blocking the visual module 13;

[0053] Furthermore, when the chip is wet-cleaned, the lifting grid 43 is driven to rise and fall by the lifting rod 44, and then the lifting rods 39 are driven to rise and fall simultaneously, so that each chip is cleaned by a separate nozzle 4 at the same time, and the fluidity of the cleaning solution around the chip is improved, thereby improving the cleaning effect; and, by providing a sponge plate 45, after the nozzle 4 blows away the impurities on the chip, the impurities contact the sponge plate 45 with the flow of the solution, and the sponge plate 45 collects the impurities, so as to prevent the impurities on the first chip from being blown around the second chip, causing secondary pollution, thereby improving the cleaning effect of the chip, and further improving the quality of chip preparation;

[0054] When dry cleaning the chip, the mounting frame 33 rotates to a horizontal state, the sponge strip 46 is in a vertical state surrounding the chip, and adjacent mounting frames 33 contact each other, so that the U-shaped sponge strip 46 can cover the opening of the U-shaped sponge strip 46 by contacting each other, forming a state surrounding the chip; when the jet assembly 23 sprays, the impurities or solutions on the chip are blown away, and the impurities or solutions in the scattered state are blocked and collected by the sponge strip 46, avoiding mutual influence between multiple chips, reducing the possibility of secondary pollution, and improving the cleaning effect of the chip, thereby improving the effect of chip preparation.

[0055] Embodiment three:

[0056] Based on the second embodiment, as shown in the accompanying drawings of the specification Figure 2-Figure 10 As shown, a partition 5 is provided in the cleaning container 15, and a reaction basket 16 is provided between one side of the partition 5 and the cleaning container 15, and a baffle 51 is provided between the other side and the cleaning container 15; a water outlet 52 is provided on one side of the baffle 51, and a water pumping port 53 is provided on the other side, and a water tank 54 is provided in the reaction device 1, and a cleaning solution is stored in the water tank 54, and the water tank 54 is connected to the water outlet 52 and the water pumping port 53 respectively through pipelines; the water tank 54 is a conventional device for water supply, and the water tank 54 transports the cleaning solution inside to the water outlet 52 through the pipeline, and pumps the solution to the cleaning container 15 through the water pumping port 53, so as to achieve the effect of the solution flowing in the cleaning container 15;

[0057] A U-shaped cleaning slot 6 is provided on one side of the mounting frame 33, and a rotating rod 61 is rotatably connected in the cleaning slot 6 through a torsion spring. The number of the rotating rods 61 is three, two rotating rods 61 are vertically mounted, and one rotating rod 61 is horizontally mounted. The horizontal rotating rod 61 is connected to the vertical rotating rod 61, so that the horizontal rotating rod 61 drives the vertical rotating rod 61 to rotate; the sponge bar 46 is mounted on the surface of the rotating rod 61; when the sponge bar 46 is not immersed in the solution, it is rotated and retracted into the cleaning slot 6; when the sponge bar 46 is immersed in the solution, it is rotated and extended out of the cleaning slot 6; a rack 62 is provided at the bottom of the cleaning container 15, and the rack 62 passes through the mounting frame 33 and meshes with the horizontal rotating rod 61 in the cleaning slot 6; the rotating rods 61 all rotate in the cleaning slot 6, and the three rotating rods 61 can be connected by gears, such as a bevel gear is provided at one end of the two vertical rotating rods 61, and two bevel gears are provided on the horizontal rotating rod 61, and the bevel gears on the horizontal rotating rod 61 are meshed with the bevel gears on the vertical rotating rod 61;

[0058] The inner wall of the cleaning groove 6 is arc-shaped, and the inner wall of the opening of the cleaning groove 6 away from the chip scrapes the sponge strip 46; the surface of the rotating rod 61 away from the sponge strip 46 is provided with a sealing block 63;

[0059] Specific working process: the water tank 54 transports the cleaning solution inside to the water outlet 52 through the pipeline, and draws the solution to the cleaning container 15 through the water pumping port 53, so as to achieve the effect of the solution flowing in the cleaning container 15; when the flowing solution passes around the chip, the nozzle 4 is used to transport the impurities around the chip to the sponge plate 45, so as to improve the cleaning effect of the chip, thereby improving the quality of chip preparation; and, because of the baffle 51, the clean cleaning solution and the dirty cleaning solution do not contact each other, so as to ensure the cleanliness of the chip contacting the solution;

[0060] When the reaction basket 16 enters the cleaning container 15, the reaction basket 16 is located between the support plate 2 and the partition plate 5, one end of the squeezing rod 31 contacts the support plate 2, and the other end contacts the partition plate 5, so that the squeezing rod 31 is in a fixed state, so that the mounting frame 33 drives the chip to be fixed, and the solution flow is prevented from driving the chip and the mounting frame 33 to swing, which affects the operation of the nozzle 4 or the collection of impurities;

[0061] When the sponge strip 46 is away from the solution, the horizontal rotating rod 61 is separated from the rack 62, and the rotating rod 61 is affected by the torsion spring to rotate and reset. On the one hand, the rotating rod 61 drives the sponge strip 46 to rotate until it extends out of the cleaning tank 6; on the other hand, the rotating rod 61 drives the sealing block 63 to rotate into the cleaning tank 6. At this time, the sealing block 63 still fills the space between the rotating rod 61 and the opening of the cleaning tank 6 to achieve a sealing effect.

[0062] When the sponge strip 46 is immersed in the solution, the mounting frame 33 is fixed by the partition plate 5 and the support plate 2 to maintain a vertical state. After the bottom of the mounting frame 33 contacts the rack 62, the rack 62 contacts and engages with the horizontal rotating rod 61, and the rack 62 continues to move, driving the horizontal rotating rod 61 to rotate, and then drives the vertical rotating rod 61 to rotate until the sponge strip 46 rotates and retracts into the cleaning tank 6, and keeps it in a squeezed state, so as to avoid absorbing the solution and also avoid blocking the flow of impurities and the solution; at this time, the sealing block 63 rotates into the opening of the cleaning tank 6, and the sealing block 63 fills the opening of the cleaning tank 6 to achieve the function of sealing the cleaning tank 6, and avoids the rotating rod 61 and other parts from contacting the solution and causing an impact;

[0063] The rotating rod 61 drives the sponge bar 46 to be stored in the cleaning tank 6. The opening of the cleaning tank 6 scratches the sponge bar 46 against the inner wall away from the chip, and the sponge bar 46 is scratched and cleaned to remove impurities of the dry cleaning of the sponge bar 46. The impurities are taken away from the chip through the flow of the solution and the spraying of the nozzle 4, thereby improving the cleanliness of the sponge bar 46 and thus improving the cleaning ability of the sponge bar 46.

[0064] Embodiment 4:

[0065] Based on the third embodiment, as shown in the accompanying drawings of the specification Figure 2-Figure 8 As shown, a cleaning rod 64 is installed at the bottom of the cleaning container 15, and the cleaning rod 64 is located between adjacent mounting frames 33, and one mounting frame 33 corresponds to one cleaning rod 64; the outer ring surface of the cleaning rod 64 is wavy, and the wavy surface of the cleaning rod 64 contacts the surface of the mounting frame 33 and the sponge plate 45;

[0066] The support plate 2 is provided with a first chute 65 and a second chute 66, wherein the first chute 65 is close to the top rod and passes through the extrusion block 3, and the second chute 66 is close to the cleaning rod 64;

[0067] Specific working process: after the reaction basket 16 has worked for a specified time, the staff uses the transfer device 11 to put the empty reaction basket 16 into the cleaning container 15, aligns them in a manner that one installation frame 33 corresponds to one cleaning rod 64, and then drives the reaction basket 16 to rise and fall multiple times. The reaction basket 16 drives the installation frame 33, the sponge plate 45 and other parts to rub against the wavy surface of the cleaning rod, thereby completing the cleaning of the parts, facilitating the staff to clean the reaction basket 16 and improving the convenience of use; and, since the outer ring surface of the cleaning rod 64 is wavy, the parts on the reaction basket 16 can also pass through the water flow through the concave part of the wavy surface of the cleaning rod during the cleaning process, so that the water flow is used to flush while cleaning, thereby improving the cleaning efficiency;

[0068] Furthermore, by setting the No. 1 slide 65 and the No. 2 slide 66, when the chip needs to be cleaned, the squeezing rod 31 is aligned with the No. 1 slide 65 and then lowered to complete the cleaning of the chip. When the reaction basket 16 needs to be cleaned, the squeezing rod 31 is aligned with the No. 2 slide 66 and lowered, thereby facilitating the time required for the transfer device 11 to be aligned, thereby improving the cleaning efficiency and the efficiency of chip preparation.

Claims

1. An automated production line for preparing micro-nano composite structure chips, comprising a reaction device (1), wherein a transfer device (11) with a clamping component, a control module (12) and a visual module (13) are installed in the reaction device (1); characterized in that: The reaction device (1) comprises: A reactor (14), wherein the reactor (14) is evenly installed on the top of the reaction device (1), and a reaction solution is stored in the reactor (14); a cleaning container (15) is installed on the top of the reaction device (1), and the cleaning container (15) uses an ultrasonic cleaning method to wet-clean the chip; a frame-shaped reaction basket (16) is clamped at the bottom of the transfer device (11), and chips are evenly installed in the reaction basket (16), and the chips are placed vertically; a support plate (2) is provided on the top of the side wall of the cleaning container (15), and a jet plate (21) is evenly slidably connected to the support plate (2), and the jet plate (21) is connected to an electric telescopic device (22) provided on the support plate (2); a jet assembly (23) is installed on the jet plate (21), and the jet assembly (23) uses air to dry-clean the chip; An extrusion block (3) is arranged on one side of the support plate (2), and the cross section of the extrusion block (3) is triangular; an extrusion rod (31) is arranged in the reaction basket (16), and the extrusion rod (31) is slidably connected to the reaction basket (16) through a spring; vertical rods (32) are evenly arranged in the reaction basket (16), and a mounting frame (33) is arranged between adjacent vertical rods (32), and the chip is mounted in the mounting frame (33); rotating shafts (34) are arranged on both sides of the mounting frame (33), and one end of the rotating shaft (34) rotates on the vertical rod (32), and one of the multiple rotating shafts (34) close to the extrusion rod (31) passes through the inner wall of the reaction basket (16) and meshes with the extrusion rod (31).

2. The automated production line for micro-nano composite structure chips according to claim 1, characterized in that: A hydraulic cavity (35) is provided in the vertical rod (32), and a suction nozzle (36) is provided at the bottom of the vertical rod (32). A filter cotton (37) is provided at the bottom of the cleaning container (15), and the suction nozzle (36) is inserted into the filter cotton (37). A hydraulic block (38) is slidably connected in the hydraulic cavity (35) through a spring, and a hydraulic rod (39) is provided on the top of the hydraulic block (38). One end of the hydraulic rod (39) passes through the inner wall of the hydraulic cavity (35) and is located above the reaction basket (16). Nozzles (4) are evenly provided on one side of the vertical rod (32), and the nozzles (4) are inclined to indicate Towards the chip; the bottom of the cleaning container (15) is slidably connected with a block (41) through a spring, and the block (41) with a triangular cross section is engaged with the frame at the bottom of the reaction basket (16); when the reaction basket (16) is in a clamping state, the bottom of the transfer device (11) presses the hydraulic block (38) down through the hydraulic rod (39), and the solution sucked into the hydraulic cavity (35) is discharged; when the reaction basket (16) is placed in the reactor (14), the hydraulic block (38) is lifted up by the spring, and the hydraulic cavity (35) sucks the solution through the suction nozzle (36).

3. The automated production line for micro-nano composite structure chips according to claim 2, characterized in that: The top of the reaction basket (16) is evenly provided with clamping rods (42), and the tops of the clamping rods (42) are connected to each other; the mutually connected parts of the tops of the clamping rods (42) match the clamping components of the transfer device (11), and a part of the multiple visual modules (13) is arranged at the bottom of the jet plate (21); a lifting grid (43) is arranged above the reaction basket (16), and the lifting grid (43) is slidably connected to the clamping rod (42), and one chip corresponds to the bottom of one grid, and one chip corresponds to one nozzle (4); the top of the hydraulic rod (39) is connected to the bottom of the lifting grid (43), and the top of the lifting grid (43) is fixedly connected with a lifting rod (44), and one end of the lifting rod (44) is located above the clamping rod (42).

4. The automated production line for micro-nano composite structure chips according to claim 3, characterized in that: A sponge plate (45) is provided on the side of the vertical rod (32) away from the nozzle (4), and the sponge plate (45) is located between adjacent installation frames (33).

5. The automated production line for micro-nano composite structure chips according to claim 1, characterized in that: Sponge strips (46) are provided on both sides of the installation frame (33); when the chip is dry-cleaned, the installation frame (33) is rotated to a horizontal state, and the sponge strips (46) are in a vertical state surrounding the chip.

6. The automated production line for micro-nano composite structure chips according to claim 1, characterized in that: A partition (5) is provided in the cleaning container (15), and a reaction basket (16) is provided between one side of the partition (5) and the cleaning container (15), and a baffle (51) is provided between the other side of the partition (5) and the cleaning container (15); a water outlet (52) is provided on one side of the baffle (51), and a water pumping port (53) is provided on the other side; a water tank (54) is provided in the reaction device (1), and a cleaning solution is stored in the water tank (54), and the water tank (54) is connected to the water outlet (52) and the water pumping port (53) through pipelines.

7. The automated production line for micro-nano composite structure chips according to claim 5, characterized in that: A U-shaped cleaning groove (6) is provided on one side of the installation frame (33), and a rotating rod (61) is rotatably connected in the cleaning groove (6) through a torsion spring. The number of the rotating rods (61) is three, two of which are installed vertically, and one of which is installed horizontally. The horizontal rotating rod (61) is connected to the vertical rotating rod (61), so that the horizontal rotating rod (61) drives the vertical rotating rod (61) to rotate. The sponge bar (46) is installed on the surface of the rotating rod (61). When the sponge bar (46) is immersed in the solution, it rotates and retracts into the cleaning groove (6); when the sponge bar (46) is not immersed in the solution, it rotates and extends out of the cleaning groove (6). A rack (62) is provided at the bottom of the cleaning container (15), and the rack (62) passes through the installation frame (33) and meshes with the horizontal rotating rod (61) in the cleaning groove (6).

8. The automated production line for micro-nano composite structure chips according to claim 7, characterized in that: The inner wall of the cleaning groove (6) is arc-shaped, and the inner wall of the opening of the cleaning groove (6) away from the chip scratches the sponge strip (46); a sealing block (63) is provided on the surface of the rotating rod (61) away from the sponge strip (46).

9. The automated production line for micro-nano composite structure chips according to claim 4, characterized in that: A cleaning rod (64) is installed at the bottom of the cleaning container (15), and the cleaning rod (64) is located between adjacent mounting frames (33), and one mounting frame (33) corresponds to one cleaning rod (64); the outer ring surface of the cleaning rod (64) is wavy, and the wavy surface of the cleaning rod (64) contacts the surface of the mounting frame (33) and the sponge plate (45).

10. The automated production line for micro-nano composite structure chips according to claim 9, characterized in that: The support plate (2) is provided with a first slide groove (65) and a second slide groove (66), respectively. The first slide groove (65) is close to the top rod and passes through the extrusion block (3), and the second slide groove (66) is close to the cleaning rod (64).

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