Non-contact cleaning module

Abstract

A cleaning module for cleaning a wafer includes a wafer holding device configured to support a wafer in a vertical orientation and including a pick-up cup and a gripper assembly. The pick-up cup includes a wall having an annular inner surface defining a processing region and having an angled portion that is symmetric about a central axis of the wafer holding device. The gripper assembly includes a first plate assembly, a second plate assembly, a plurality of gripping pins, and a plurality of loading pins. The clamping pin is configured to clamp the wafer during a cleaning process, and the loading pin is configured to clamp the wafer during a loading and unloading process. The cleaning module further includes a purge arm coupled to a nozzle mechanism configured to deliver liquid to the front side and the back side of the wafer.

Description

This application is a divisional application of the invention patent application with the application date of August 5, 2019, application number "201980050797.7", and invention name "Non-contact cleaning module". Technical Field

[0001] Embodiments of the present disclosure relate generally to apparatus and methods for cleaning processed wafers, and more particularly to non-contact cleaning systems and methods for processing wafers. Background Art

[0002] In various cases, before processing the wafer for use in an electrical device, the wafer is cleaned to remove any contamination from the wafer. In one or more embodiments, cleaning methods such as chemical polishing and / or brush scrubbing can be used to clean the wafer. However, these cleaning methods may cause particles to attach to the wafer again after the corresponding cleaning process. For example, the contact media (e.g., polishing balls and / or cleaning brushes) used for these cleaning processes may be a source of contamination. Particles may cause the wafer to be unable to support processing including analog, logic and / or advanced memory applications. Therefore, the yield of the processed wafer will be negatively affected.

[0003] Therefore, there is a need for improved cleaning processes that can be used to remove particles from cleaned wafers before the wafers undergo further processing. Summary of the invention

[0004] In one example, the cleaning module includes a wafer clamping device. The wafer clamping device is configured to support a wafer in a vertical orientation and includes a receiving cup and a clamping assembly. The receiving cup includes a wall having an annular inner surface. The annular inner surface defines a processing area and has an angled portion that is symmetrical about a central axis of the wafer clamping device. The clamping assembly includes a first plate assembly, a second plate assembly, a clamping pin, and a loading pin. The clamping pin belongs to the second plate assembly and the loading pin belongs to the first plate assembly. The clamping assembly is configured to be positioned in a loading position, a rinsing position, and a cleaning position. When in the cleaning position, the clamping assembly is disposed within the processing area. In addition, when the clamping assembly is in the loading position, the clamping pin is at a first distance from the center of the clamping assembly, and when the clamping assembly is in the cleaning position, the clamping pin is at a second distance from the central axis of the wafer clamping device. The first distance is greater than the second distance. In addition, when the clamping assembly is in the loading position and the cleaning position, the loading pins are each at a third distance from the central axis.

[0005] In one example, a method for cleaning a wafer in a cleaning module including a wafer clamping device includes: moving a first plate assembly of a gripper assembly away from a second plate assembly of the gripper assembly and toward an annular inner surface of a pick-up cup of the wafer clamping device to position the gripper assembly in a loading position. The wafer is received by a plurality of loading pins of the first plate assembly in a vertical orientation. In addition, moving the first plate assembly away from the second plate assembly positions a plurality of gripper pins of the second plate assembly at a first distance from a central axis of the wafer clamping device. In addition, the annular inner surface has an angled portion symmetrical about the central axis, and the annular inner surface defines a processing area. The method further includes moving the first plate assembly toward the second plate assembly and away from the annular inner surface to position the gripper assembly in a cleaning position. In addition, the plurality of gripper pins are positioned at a second distance from the central axis, and the wafer is gripped in response to moving the first plate assembly of the gripper assembly toward the second plate assembly. The first distance is greater than the second distance. In addition, the method includes rotating the gripper assembly, the pick-up cup, and the wafer simultaneously during the cleaning process. BRIEF DESCRIPTION OF THE DRAWINGS

[0006] In order to be able to understand the above-mentioned features of the present disclosure in detail, a more specific description of the present disclosure briefly summarized above may be made with reference to embodiments, some of which are shown in the accompanying drawings. However, it should be noted that the accompanying drawings only illustrate typical embodiments of the present disclosure and are therefore not to be considered as limiting its scope, as the present disclosure may allow other equally effective embodiments.

[0007] Figure 1 A schematic top view of a chemical mechanical polishing system according to one or more embodiments is shown.

[0008] Figure 2A is a schematic cross-sectional side view of a cleaning module according to one or more embodiments.

[0009] Figure 2B A schematic diagram of a cleaning module is shown according to one or more embodiments.

[0010] Figure 3A and Figure 3B is a schematic cross-sectional side view of a wafer holding apparatus according to one or more embodiments.

[0011] Figure 3C , Figure 3D ,and Figure 3E Various views of a clamp assembly are shown according to one or more embodiments.

[0012] Figure 3F and Figure 3G Various views of a clamp assembly are shown according to one or more embodiments.

[0013] Figure 4A , Figure 4B ,and Figure 5 Various nozzle mechanisms are shown according to one or more embodiments.

[0014] Figure 6 A schematic diagram of a purge arm is shown in accordance with one or more embodiments.

[0015] Fig. 7A Airflow within a cleaning module is shown according to one or more embodiments.

[0016] Figure 7B A partial schematic diagram of a drain hole according to one or more embodiments is shown.

[0017] Figure 8 A method for cleaning a wafer according to one or more embodiments is shown.

[0018] Fig. 9A , Fig. 9B , Fig. 9C ,and Fig.9D Various examples of wafer holder arrangements according to one or more embodiments are shown.

[0019] Fig.10 is a schematic cross-sectional side view of a cleaning module according to one or more embodiments.

[0020] Fig.11 is a schematic cross-sectional side view of a wafer holding apparatus according to one or more embodiments.

[0021] Fig. 12A and Fig. 12B Various views of a clamp assembly are shown according to one or more embodiments.

[0022] Fig.13 A method for cleaning a wafer according to one or more embodiments is shown.

[0023] Fig.14A , Fig. 14B ,and Fig. 14C Various examples of wafer holding devices according to one or more embodiments are shown.

[0024] To facilitate understanding, identical reference numerals have been used, where possible, to identify identical components that are common to the figures. It is contemplated that components disclosed in one embodiment may be beneficially utilized on other embodiments without specific recitation relating thereto. DETAILED DESCRIPTION

[0025] Embodiments of the present disclosure generally relate to an improved cleaning system and method for removing particles from processed wafers. In various cases, wafer cleaning is performed by chemical polishing and / or brush scrubbing. However, in this case, after either of the chemical polishing and / or brush scrubbing processes, the wafer may experience particle reattachment. Although the particles reattached to the wafer may be loosely attached to the wafer and have a relatively small size (e.g., about 50nm or less), due to defects caused by devices formed on the wafer, the particles may cause the wafer to be unable to be made into front-end logic and advanced memory devices. Therefore, the yield of the processed wafer will be negatively affected. Therefore, a new cleaning method capable of removing reattached particles is needed. For example, the following description describes a system and method for a non-contact cleaning method that can be used to remove any remaining particles on the wafer after a chemical polishing and / or brush scrubbing cleaning process.

[0026] Figure 1 is a top plan view illustrating one embodiment of a chemical mechanical planarization ("CMP") system 100. The CMP system 100 includes a factory interface 102, a cleaner 104, and a polishing module 106. A robot 111 is provided to transfer wafers 151 between the factory interface 102 and the polishing module 106. The robot 111 may also be configured to transfer wafers between the polishing module 106 and the cleaner 104. The factory interface 102 includes a robot 110 configured to transfer wafers (e.g., wafer 151) between one or more cassettes 114 and one or more transfer platforms 116. The robot 110 is further configured to receive wafers from the cleaner 104 and return the cleaned and polished wafers to the storage cassette 114.

[0027] The polishing system 100 includes a polishing module 106 that at least partially supports and houses a plurality of polishing stations 124a-124d and loading cups 123a-123b. Each polishing station 124 is adapted to polish a substrate retained in a carrier head that is configured to carry a wafer 151 within a carrier head assembly that translates along an overhead track 128. The carrier head assembly 119 is moved along the track 128 by a carrier motor attached to the support 108. The support 108 generally includes a structural assembly that is capable of guiding and facilitating control of the position of the carrier head assembly 119 along the overhead track 128. In addition, the polishing module 106 also includes a loading station 122 for loading and unloading substrates from the carrier head. Each polishing station 124 includes a platform 120 that rotates during wafer polishing. In addition, each polishing station 124 polishes a wafer (e.g., wafer 151) using a pad and a polishing liquid.

[0028] The controller 190, such as a programmable computer, is connected to the components of the polishing module 106 and is configured to operate the components of the polishing module 106. For example, the controller 190 may control loading, unloading, and polishing of the wafer 151 by the polishing module 106.

[0029] The controller 190 may include a central processing unit (CPU) 192, a memory 194, and support circuits 196 (e.g., input / output circuitry), a power supply, a clock circuit, a cache, etc. The memory 194 is connected to the CPU 192. The memory is a non-transitory computer-readable medium and may be one or more readily available memories, such as random access memory (RAM), read-only memory (ROM), a floppy disk, a hard disk, or other forms of digital storage. In addition, although shown as a single computer, the controller 190 may be a distributed system, for example, including multiple independently operating processors and memories. This architecture may be applicable to various polishing situations based on the programming of the controller 190 to control the order and timing of the positioning of the carrier head at the polishing station.

[0030] The polishing system 100 further includes at least one of the following: an ultrasonic cleaning module 161, a pre-cleaning module 162, a brush box cleaning module 164, a final cleaning module 166, and a drying tank 168. In addition, Figure 1 An input transport shuttle module may be included. In one embodiment, each of the ultrasonic cleaning module 161, the pre-cleaning module 162, the brush box cleaning module 164, the final cleaning module 166, and the drying tank 168 includes a pair of processing chambers, which are positioned side by side in the Y direction. The two final cleaning modules 166 each include a cleaning module as described in more detail herein. As shown, the cleaning module 166 can be used as a final cleaning step, for example, a final cleaning module. In other embodiments, one or more cleaning modules can be positioned between the cleaning module 166 and the drying tank 168. In addition, in one or more embodiments, one or more modules can be omitted.

[0031] Figure 2Ais a schematic illustration of a cross-sectional view of a non-contact cleaning module 200 according to one or more embodiments. The cleaning module 200 may receive a wafer to be cleaned, such as wafer 151, after the wafer has been cleaned in one or more of the ultrasonic cleaning module 161, the pre-cleaning module 162, the brush box cleaning module 164, and before the wafer is placed in a corresponding Marangoni drying tank (e.g., drying tank 168). Additionally, in various embodiments, the cleaning module 200 may be placed anywhere within a wafer cleaning cycle and / or edge / bevel cleaning process. The cleaning module 200 may be used to remove contamination from the wafer that, if not removed, may cause the corresponding wafer to fail quality standards and be discarded.

[0032] The cleaning module 200 includes a wafer holding device 203, a purge arm 230, a nozzle mechanism 240, an air chamber 280, an exhaust device 260, a spray bar 290, a drain device 284, and an air inlet 270. The cleaning module 200 may further include a sensing device 294.

[0033] The wafer clamping device 203 is configured to support (e.g., hold) the wafer 151 in a vertical orientation. For example, the wafer clamping device 203 is configured to support the wafer 151 in a vertical orientation perpendicular to the rotation axis 216. The wafer clamping device includes a receiving cup 210 and a clamp assembly 220. The receiving cup 210 may include a first receiving cup 211 and a second receiving cup 212. The first receiving cup 211 may be coupled to the second receiving cup 212. For example, the first receiving cup 211 may be coupled to the second receiving cup 212 via one or more screws. One or more of the first receiving cup 211 and the second receiving cup 212 may include one or more threaded portions configured to receive a threaded screw. Alternatively, the receiving cup 210 includes a single receiving cup. For example, the receiving cup 210 may be formed from a single continuous piece of material.

[0034] The catch cup 210 includes a wall 213 having an annular inner surface 214. The annular inner surface 214 defines a processing volume 297 within the wafer holding device 203. The annular inner surface 214 has an angled portion that is symmetrical about a central axis of the wafer holding device 203. For example, the wafer 151 can be cleaned within the processing volume 297. Additionally, the annular inner surface 214 has an angled portion that is symmetrical about an axis of rotation 216.

[0035] The gripper assembly 220 holds the wafer 151 while a cleaning fluid is applied to the wafer 151 for cleaning. Figure 3A and corresponding description describe the clamp assembly 220 in more detail.

[0036] The cleaning fluid may be applied to the front side of the wafer through the nozzle mechanism 240 and to the back side of the wafer via an opening 225 formed in a shaft 224 coupled to a fluid source 223 while rotating the gripper assembly 220 and the catch cup 210. The shaft 224 may include one or more tubes configured to deliver the cleaning fluid to the wafer 151.

[0037] The drive motor 222 may be coupled to the gripper assembly 220 via a shaft 224. The drive motor 222 rotates the gripper assembly 220 and the receiving cup 210 about the rotation axis 216. Additionally, the drive motor 222 may impart horizontal movement to the gripper assembly 220 along the rotation axis 216. The drive motor 222 may include a first motor and a second motor, the first motor being configured to control the rotation of the gripper assembly 220 and the receiving cup 210, and the second motor being configured to control the horizontal movement of the gripper assembly 220. The first motor may be referred to as a rotary motor, and the second motor may be referred to as a linear actuator. Additionally, the second motor may be one of a hydraulic, pneumatic, electromechanical, and magnetic motor. Horizontal movement is generally movement in an axial direction or movement in a direction parallel to the rotation axis 216. In one embodiment, horizontal movement corresponds to movement by Figure 3A Movement in the X direction is indicated by . Additionally, the horizontal movement of the gripper assembly 220 may be independent of the movement of the catcher cup 210. Furthermore, the gripper assembly 220 and the catcher cup 210 may be configured to rotate together (eg, simultaneously).

[0038] As discussed further below, the purge arm drive motor 234 may be coupled to the purge arm shaft and configured to move the purge arm 230 in an arcuate path that is parallel to the surface of the wafer 151. The purge arm 234 may include one or more tubes to deliver fluid to the nozzle mechanism 240.

[0039] The cover 202 can cover the opening formed in the wall (e.g., housing wall) 283 and provide access to the interior volume 295 of the cleaning module 200 for inserting and removing the wafer 151 from the cleaning module 200. When the cover 202 is in the closed position, the interior volume 295 of the cleaning module 200 can be referred to as an isolated environment. For example, when the cover 202 is closed, the interior volume 295 of the cleaning module 200 is isolated from the external environment so that fumes and liquids generated and / or used during cleaning the wafer 151 do not escape from the cleaning module 200 during the cleaning process. Any fumes and cleaning liquids used and / or generated during the cleaning process are removed from the cleaning module 200 in a controlled manner via the exhaust device 260 and / or the drain device 284.

[0040] The spray bar 290 may apply a pre-treatment fluid to the wafer 151 as the wafer 151 is inserted into the cleaning module 200 and / or rinse the wafer 151 with a rinse fluid as the wafer 151 is removed from the cleaning module 200. In one embodiment, the spray bar 290 may be used to apply fluid to the wafer 151 while the wafer 151 is in a loading or unloading position. Pre-treating and / or rinsing the wafer 151 may assist in removing undesirable particles from the surface of the wafer 151. For example, rinsing the wafer 151 as it is removed from the cleaning module 200 assists in removing loose particles from the surface of the wafer 151, and further assists in preventing the removed particles from reattaching to the surface of the wafer 151.

[0041] Drain 284 may be used to remove excess moisture from cleaning module 200. In one embodiment, drain 284 removes excess cleaning fluid from cleaning module 200 during a cleaning process.

[0042] Air may be provided to the air chamber 280 through the air inlet 270, and the air may be exhausted from the cleaning module 200 through the exhaust device 260. The air inlet 270 and the air chamber 280 are located at the front of the cleaning module 200, and the exhaust device 260 is located at the back of the cleaning module 200. In addition, the air chamber 280 and the exhaust device 260 may be used to control the air flow within the cleaning module 200 to prevent particles from reattaching to the surface of the wafer 151. The positions of the exhaust device 260 and the air inlet 270 may be reversed so that the exhaust device 260 is located at the front of the cleaning module 200 and the air inlet 270 is located at the back of the cleaning module 200.

[0043] An interior volume 295 of the cleaning module 200 can be defined between the catch cup 210 and the wall (e.g., housing wall) 283. Wafers (e.g., wafer 151) can be inserted into the interior volume 295 when loaded into the cleaning module 200 and removed from the interior volume 295 when removed from the cleaning module 200.

[0044] The sensing device 294 can detect the wafer 151 within the cleaning module 200. For example, the sensing device 294 can detect the wafer 151 within the internal volume 295. In addition, the sensing device 294 can detect the wafer 151 while the wafer 151 is being held by the gripper assembly 220. The sensing device 294 can detect when the wafer 151 is properly or improperly loaded into the gripper assembly 220. In addition, the sensing device 294 can detect when the wafer 151 falls out of or falls out of the gripper assembly 220. The sensing device 294 can further determine when the wafer 151 is inserted into and removed from the cleaning module 200.

[0045] In one or more embodiments, the controller 190 can control the functions of the cleaning module 200. For example, the controller 190 can control the functions of at least the gripper assembly 220, the spray bar 290, the purge arm 230, the nozzle mechanism 240, the exhaust device 260, and / or the sensing device 294.

[0046] Figure 2B 200 and 201. In some embodiments, the cleaning module 200 may be a plurality of cleaning modules, such as cleaning modules 200 and 201. FIG. 2A to FIG. 2B As shown, cleaning module 201 includes the same components as cleaning module 200 .

[0047] A cleaner (e.g., cleaner 104) may include one or more cleaning modules (e.g., one or more of cleaning modules 200 and 201). For example, cleaner 104 may include cleaning module 200, and cleaning module 201 may be omitted. Alternatively, cleaner 104 may include both cleaning modules 200 and 201. In addition, cleaner 104 may include more than two cleaning modules.

[0048] The cleaning modules 200 and 201 may include one or more inlet connections 292. The inlet connection 292 provides a path for providing a cleaning fluid within the cleaning modules 200 and 201 during the cleaning process. The cleaning fluid may be provided to the nozzle mechanism 240, a tube on a purge arm beside the nozzle mechanism 240, a fluid source 223, and / or a spray bar 290. Additionally, the cleaning modules 200 and 201 may include a power cable connection 293 configured to couple to a power cable external to the cleaning modules 200 and 201.

[0049] Figure 2B Additionally shown are a cover 202 of the cleaning module 200 and a cover 204 of the cleaning module 201. During a wafer loading process, the covers 202 and 204 are opened so that a wafer (e.g., wafer 151) can be inserted into each of the respective cleaning modules 200, 201. Additionally, during a wafer extraction process, the covers 202 and 204 are opened so that a wafer (e.g., wafer 151) can be extracted from each of the respective cleaning modules 200, 201. In one or more embodiments, during a cleaning cycle, the covers 202 and 204 are closed, thereby sealing the cleaning modules 200 and 201.

[0050] exist Figure 2B In the embodiment of the present invention, cleaning modules 200 and 201 are positioned so that wafer 151 can be in a vertical orientation during the cleaning process. However, in other embodiments, other orientations can be used. In addition, each of cleaning modules 200 and 201 can be configured to operate as a single module as specified by the cleaner (104) architecture.

[0051] Figure 3AAn example embodiment of a wafer clamping device 203 is shown. As shown, the wafer clamping device 203 includes a clamp assembly 220 and a receiving cup 210, which Figure 2A The gripper assembly 220 is positioned within the processing volume 297 during at least a cleaning cycle.

[0052] The gripper assembly 220 includes a first plate assembly 318, a second plate assembly 320, a loading pin 311, and a gripper pin 315. The gripper assembly 220 is coupled to a shaft 224 that can be driven by a drive motor 222 to rotate the first plate assembly 318 and the second plate assembly 320 during a cleaning cycle of a cleaning process. In addition, the shaft 224 can be driven to move the first plate assembly 318 and the second plate assembly 320 into and out of a loading position, an unloading position, a rinsing position, and a cleaning position. In addition, a cleaning fluid can flow through the shaft 224 so that the cleaning fluid can be applied to the back side of the wafer 151 via the hole 351 in the first plate assembly 318 during the cleaning process. In one embodiment, the shaft 224 can be a splined shaft that allows the gripper assembly 220 to be rotated when the shaft 224 is translated in the +X and -X directions.

[0053] The clamping pins 315 can clamp, or hold the wafer 151 during the cleaning process. The clamping pins 315 may include a shaped area configured to receive the wafer 151. For example, the clamping pins 315 may include a notched area shaped to receive the edge of the wafer 151. In addition, the clamping pins 315 may be housed within the second plate assembly 320. In addition or alternatively, the clamping pins 315 may be coupled to the second plate assembly 320. The clamping pins 315 may be arranged at about 120° from each other. Alternatively, the clamping pins 315 may be oriented to be less than 120° from each other, or greater than 120° from each other. In addition, the total number of clamping pins 315 may be one or more. Alternatively, the total number of clamping pins 315 is two or more. In addition, the total number of clamping pins 315 is three or more. The clamping pins 315 may pass through openings in the first plate assembly 318, and such clamping pins 315 are capable of clamping or holding the wafer 151 during the cleaning cycle. The clamping pins 315 may have minimal contact with the wafer 151 along the edge of the wafer 151 so that the clamping pins 315 do not hinder the cleaning process of the wafer 151 .

[0054] The loading pins 311 may clamp or hold the wafer 151 during the loading and / or unloading process. In addition, the loading pins 311 are coupled to the first plate assembly 318. As the gripper assembly 220 moves between the cleaning position and the loading or unloading position, the loading pins 311 move with the first plate assembly 318. The loading pins 311 may include a shaped area configured to receive the wafer 151. For example, the loading pins 311 may include a notched area shaped to receive the edge of the wafer 151. The loading pins 311 may be configured to have minimal contact with the wafer 151 along the edge of the wafer 151 so that the loading pins 311 do not hinder the cleaning process of the wafer 151. The loading pins 311 may be arranged at about 120° from each other. Alternatively, the loading pins 311 may be oriented to be less than 120° from each other or greater than 120° from each other. In addition, the total number of the loading pins 311 may be one or more, two or more, or three or more.

[0055] The number of the clamping pins 315 and the number of the loading pins 311 may be the same. Alternatively, the number of the clamping pins 315 may exceed the number of the loading pins 311. In addition, the number of the clamping pins 315 may be less than the number of the loading pins 311.

[0056] The first plate assembly 318 and the loading pins 311 can be used during the wafer loading process. In addition, the second plate assembly 320 and the gripper pins 315 can be positioned so that there is no interference with the wafer during the loading process. For example, the first plate assembly 318 can be moved relative to the second plate assembly 320, thereby positioning the first plate assembly 318 outside the first pick cup 211 and positioning the gripper pins 315 in the loading position. In addition, the distance between the gripper pins 315 and the center of the gripper assembly 220 is increased. In addition, the gripper pins 315 can be positioned behind the loading pins 311, thereby providing an unobstructed path for vertically loading and / or unloading the wafer 151 onto the loading pins 311.

[0057] The wall 213 of the catch cup 210 is shaped so that the wall interacts with the second plate assembly 320 and / or the one or more gripper pins 315. The wall 213 can be a portion of the catch cup 210 as described above, or the annular wall can be a portion of the first catch cup 211. The wall 213 includes at least one angled portion so that the wall can interact with the feature 312 of the second plate assembly 320. In addition, the wall 213 assists in directing moisture away from the wafer 151 and into the drain 284, thereby reducing reattachment of particles on the wafer 151 during the cleaning process. For example, as will be described in more detail below, when the gripper assembly 220 is in a wafer loading position, the feature 312 interacts with the wall 213 to allow the first plate assembly 318 to move relative to the second plate assembly 320.

[0058] Additionally, the access cup 210 may include an opening 331. The diameter of the opening 331 may be sufficient to allow the first plate assembly 318 to pass through, but not large enough to allow the second plate assembly 320 to pass through. For example, the diameter of the opening 331 may be larger than the first plate assembly 318 and smaller than the second plate assembly 320.

[0059] The catch cup 210 may include drain holes 262 positioned in an array along the edge of the catch cup 210 so that moisture flows into the drain device 284 when the wafer 151, the gripper assembly 220, and the catch cup 210 are rotated by the drive motor 222. In addition, the second catch cup 212 may include drain holes 262. Moisture flows through the drain holes 370 to the drain device 284 ( Figure 2A ) in which water is removed from the cleaning module 200 in the drain device 284.

[0060] like Figure 3A As shown in FIG. 1 , the gripper assembly 220 includes a first plate assembly 318 and a second plate assembly 320 that are configured to move relative to each other to assist in receiving the wafer 151 and placing the wafer 151 in a cleaning position. Specifically, Figure 3C and Figure 3D An embodiment of the gripper assembly 220 in a retracted position (e.g., cleaning position) 300a and an extended position 300b is shown, respectively. The gripper assembly 220 may be positioned in the retracted position 300a during a cleaning process. Additionally, during a wafer loading process and / or a wafer removal (unloading) process, the gripper assembly 220 may be positioned in an extended position (e.g., loading position) 300b. Additionally, the extended position 300b may correspond to a loading position of the gripper assembly 220 within the cleaning module 200. The loading / unloading position also serves as a rinsing position for the wafer 151. For example, when positioned in the loading / unloading position for rinsing, deionized water and / or other cleaning chemicals may be delivered from the top spray bar 290 onto the wafer 151. Additionally, when the gripper assembly 220 is in the loading position, the gripper assembly 220 is positioned a distance in the X direction from where the gripper assembly 220 is positioned in the cleaning position. In one embodiment, the coupling surface 301 of the first plate assembly 318 is coupled to and driven by the shaft 224 .

[0061] One or more spring mechanisms 330 may couple the first plate assembly 318 to the second plate assembly 320. The spring mechanisms 330 may include springs 331 and coupling members 333. The spring mechanisms 330 allow the first plate assembly 318 to move relative to the second plate assembly 320 when the feature (or component) 312 contacts the first take-off cup 211. For example, the second plate assembly 320 includes a feature 312 that is configured to interact with the wall 213 as the gripper assembly 220 moves in the positive X-direction (e.g., horizontally toward the first take-off cup 211). In one embodiment, each spring mechanism 330 may include one or more springs 331 that may move above or parallel to the coupling member 333.

[0062] The clamping pins 315 can be configured to move relative to at least one other pin. For example, the clamping pins 315 can include one or more components that move the clamping pins 315 away from one or more other pins. The clamping pins 315 can be configured to clamp a wafer (e.g., wafer 151) during a cleaning process. Additionally, the loading pins 311 can be configured to clamp or hold the wafer 151 during loading and unloading processes. In other embodiments, the clamping pins 315 can be moved to hold the wafer against the loading pins.

[0063] The clamp assembly 220 may also include a guide pin 317 configured to limit angular movement of the second plate assembly 320 relative to the first plate assembly 318 .

[0064] In one or more embodiments, each clamp pin 315 can be coupled to an assembly 380 that is configured to contact the housing of the first pick-up cup 211, which imparts translational motion to one or more clamp pins 315. For example, in response to the assembly 380 contacting the first pick-up cup 211, the clamp pins 315 pivot about the axis 302 and move toward the outer edge of the clamp assembly 220 when the gripper assembly 220 moves in the +X direction. Figure 3B An example embodiment is shown in which the assembly 380 has just contacted the first take cup 211 and is in the closed position. In one embodiment, as the gripper assembly 220 moves in the +X direction, the assembly 380 contacts the first take cup 211 and pivots about the axis 302. In response, translational motion is imparted to the gripper pin 315 coupled to the assembly 380. In one embodiment, the assembly 380 continues to pivot until the movement of the gripper assembly 220 in the +X direction stops. In one embodiment, after the movement of the gripper assembly 220 in the +X direction stops, the assembly 380 and the gripper pin 315 are positioned in the open position.

[0065] Additionally, the assembly 380 can be coupled to a spring assembly 381. The spring assembly 381 can further return the assembly 380 to the starting position, thereby moving the clamping pin 315 to the clamping position in response to the assembly 380 no longer contacting the housing of the first pickup cup 211. The spring assembly 381 can load the assembly 380 so that the assembly 380 returns to the starting position when the assembly 380 no longer contacts the housing of the first pickup cup 211. Additionally, the spring assembly 381 can be a leaf spring or any other spring design.

[0066] The loading pins 311 and the gripper pins 315 can be configured to hold the wafer 151 so that the wafer 151 does not contact the first plate assembly 318 of the gripper assembly 220. Additionally, the position of the wafer 151 relative to the first catch cup 211 can be adjusted during a cleaning cycle.

[0067] Figure 3F The embodiment of the clamp pin 315 and assembly 380 is shown in a closed position, with the end 380a not in contact with the first take cup 211 . Figure 3G The assembly 380 and the clamping pin 315 are shown in the open position. Figure 3G In the illustrated embodiment, end 380a of assembly 380 contacts first pick-up cup 211. Additionally, assembly 380 has been pivoted such that end 380b of assembly 380 has moved relative to end 380a. In one embodiment, end 380b has been rotated toward an upper surface of second plate assembly 320. Additionally, clamping pin 315 has also been moved such that it is tilted outwardly toward first pick-up cup 211.

[0068] Further references Figure 3C , the clamp assembly 220 further includes one or more holes 351. In one or more embodiments, a cleaning fluid may flow through the (one or more) holes 351 to the back side of the wafer 151. The cleaning fluid may be a rinse agent (e.g., DI water, ozone water) or a cleaning chemical. In addition, the cleaning fluid may be provided via the shaft 224 and then provided to the hole 351.

[0069] Figure 3E A schematic partial plan view of the gripper assembly 220 is shown. The hole(s) 351 flow the chemical reagent onto the back side of the wafer 151. The one or more holes 351 can be arranged in a substantially circular or linear pattern. Each hole 351 can be substantially the same size so that the cleaning fluid flows evenly across the back surface of the wafer 151. In addition, at least one hole 351 can have a different size than at least one other hole.

[0070] Figure 4A2 is a bottom view of nozzle mechanism 240 attached to purge arm 230. As shown, nozzle mechanism 240 includes nozzle 410, nozzle 420, and nozzle 430. Alternatively, one or more of nozzle 420 and nozzle 430 may be omitted. In addition, nozzle mechanism 240 may include more than three nozzles. Nozzle 410 may be disposed at a first angle relative to the surface of wafer 151 (e.g., Figure 4B The nozzle 420 may be disposed at a second angle relative to the surface of the wafer 151 (eg, Figure 4B The nozzle 430 may be disposed at a third angle (eg, Figure 4B Angle 412 may be different from at least one of angles 422 and 432. In addition, angles 422 and 432 may be substantially similar. In some configurations, nozzle 410 may be disposed at an angle (e.g., angle 412) relative to the surface of the wafer that is less than the angles (e.g., 422 and 432) at which nozzles 420 and 430 are disposed relative to the surface of the wafer. In some configurations, angle 412 may be about 30° to about 50° relative to the surface of the first plate assembly 318 or wafer 151, and angles 422 and 432 are about 80° to about 100° relative to the surface of the wafer 151 or the surface of the first plate assembly 318. In one embodiment, angle 412 is about 45° relative to the surface of the wafer 151 or the surface of the first plate assembly 318, and angles 422 and 432 are about 90° (or perpendicular) relative to the surface of the wafer 151 or the surface of the first plate assembly 318. In addition, other angles may be utilized. Additionally or alternatively, the angles 412, 422, and 432 may each be between about 80° and about 100°. Additionally, the position of each of the nozzles 410, 420, and / or 430 may be adjusted in a direction along the length of the purge arm 230 to target a specific radial position on the wafer. Furthermore, the angle and position of each nozzle may be selected so that the cleaning fluid output by each nozzle is used together to remove any contaminants from the surface of the wafer 151.

[0071] The nozzle mechanism 240 may be configured to output a cleaning medium onto the first surface of the wafer 151 via nozzles 410, 420, and 430. The cleaning medium may include a rinse agent and a cleaning chemical. In addition, the nozzle mechanism 240 is configured to output a first cleaning medium via nozzle 410, a second cleaning medium via nozzle 420, and a third cleaning medium via nozzle 430. In addition, one or more of the nozzles 410, 420, and 430 are configured to apply one or more rinse agents.

[0072] The nozzle mechanism 240 may include one or more non-contact cleaning technologies. Nozzles 410, 420, and 430 may output a medium that is any combination of a fluid, a gas, and particles. In addition, one or more of nozzles 410, 420, and 430 may be a high-energy nozzle for outputting a high-energy medium. The high-energy medium may be any combination of a liquid, a gas, and particles. In addition, the high-energy medium may be a high-energy cleaning chemical. One or more of nozzles 410, 420, and 430 may be an ultrasonic nozzle, a fluid jet nozzle, or a kinetic nozzle. For example, nozzle 410 is one of an ultrasonic nozzle, a jet nozzle, and a kinetic nozzle configured to deliver a mixture of gas and liquid. The ultrasonic nozzle includes one or more components that are configured to alternately apply compression and rarefaction to the cleaning fluid in an alternating manner according to a sine or other pattern to produce an ultrasonic actuated fluid. For example, the ultrasonic nozzle may be configured to alternately apply compression and rarefaction to produce an ultrasonic actuated fluid in a sine mode at a rate of 950kHz. Alternatively, other frequencies may be used.

[0073] Nozzle 420 is configured to apply a first chemical agent, and nozzle 430 is configured to apply a rinse agent. In addition, when nozzle 410 is an ultrasonic nozzle, nozzle 420 is configured to apply a first chemical agent, and nozzle 430 is configured to apply a second chemical agent. Alternatively, when nozzle 410 is an ultrasonic nozzle, nozzle 420 is configured to apply a first rinse agent, and nozzle 430 is configured to apply a second rinse agent. In addition, at least two nozzles are configured to apply the same rinse agent or chemical agent.

[0074] The cleaning fluid may be provided to the nozzle mechanism 240 via fluid connection 440. The number of connections may be based on the number of nozzles within the nozzle mechanism and / or the number of different types of chemical reagents and / or rinse agents utilized by the nozzle mechanism 240. For example, in the case where the nozzle mechanism 240 employs three nozzles configured to output two different cleaning fluids, two connections 440 may be utilized. In addition, the flow rates of different cleaning chemicals and / or rinse agents through different nozzles may be different. For example, the flow rate of the first of the cleaning chemicals or rinse agents from the nozzles 410, 420, and 430 may be different from the flow rate of the second of the cleaning chemicals or rinse agents from the nozzles 410, 420, and 430. Alternatively, the flow rate of the cleaning chemicals or rinse agents from at least one of the nozzles 410, 420, and 430 may vary during the cleaning process and / or the rinse process.

[0075] Although FIG. 4 shows three separate nozzles, in other embodiments, other numbers of nozzles may be utilized. For example, more than three nozzles may be utilized. In addition, less than three nozzles may be utilized.

[0076] Figure 54, not all connections 440 are connected to a common side of the nozzle mechanism 240, instead, a first connection 442 is connected to a first side of the nozzle mechanism 240 and a second connection 444 is connected to a second side of the nozzle mechanism, wherein the first side is different from the second side.

[0077] Now return to Figure 2A , the purge arm 230 is coupled to a purge arm shaft 232 and a purge arm drive motor 234. The purge arm shaft 232 and the purge arm drive motor 234 form a purge arm drive assembly 236. The purge arm drive assembly 236 is configured to move the nozzle mechanism 240 over the surface of the wafer 151 during the cleaning process so that the cleaning fluid output by the nozzle mechanism 240 is evenly distributed over the surface of the wafer 151. The purge arm drive assembly 236 can also be configured to axially move the purge arm 230 to set the distance between the nozzle mechanism 240 and the surface of the wafer 151.

[0078] Figure 6 6 shows a path 610 of the purge arm 230 and the nozzle mechanism 240 over the wafer 151 during a cleaning cycle according to one or more embodiments. Figure 6 , the wafer 151 is disposed above and retained by the gripper assembly 220. The path 610 may be an arcuate path parallel to the device side surface (front surface) of the wafer 151. Alternatively, paths of other shapes and / or lengths may be utilized. For example, the range of motion of the purge arm 230 may vary. Figure 6 , the nozzle mechanism 240 coupled to the end of the purge arm 230 passes through the center of the wafer in an arcuate path. The position of the purge arm 230 and / or the nozzle mechanism 240 may be adjusted to ensure that the nozzle mechanism 240 passes through the center of the rotating wafer 151 during processing. Additionally, at least one of the position of the purge arm 230 and the position of the nozzle mechanism 240 may be adjusted so that the nozzle mechanism 240 passes through a portion of the wafer 151 that is different from the center of the wafer 151. For example, the nozzle mechanism 240 may be moved relative to the purge arm 230 and / or the purge arm 230 may be moved relative to the purge arm shaft 232 to change the position of the nozzle mechanism 240 relative to the surface of the wafer 151. Additionally, the axial distance between the nozzle mechanism 240 and the surface of the wafer 151 may be varied to assist in the cleaning process.

[0079] During the cleaning process, the purge arm drive motor 234 moves the purge arm shaft 232 over the wafer 151, and thereby moves the purge arm 230 and the nozzle mechanism 240. The purge arm drive motor 234 can control the scanning rate of the nozzle mechanism 240. For example, the purge arm drive motor 234 can control the speed at which the nozzle mechanism scans along the path 610.

[0080] Figure 6 A spray bar 290 is further shown. The spray bar 290 can pre-treat the wafer 151 as the wafer is inserted into the cleaning module 200, and rinse the wafer 151 as the wafer is removed from the cleaning module 200. The spray bar 290 can include one or more nozzles configured to output one or more configured fluids. Alternatively, the spray bar 290 can include a tube with holes designed to maintain uniform flow across the spray bar 290. For example, as the wafer 151 passes through the spray bar 290 when the wafer 151 is transferred into and out of the cleaning module 200, the spray bar 290 applies the rinsing fluid to the wafer 151 to ensure that the wafer 151 remains wet during the transfer process, and as the wafer is removed from the cleaning module 200, particles do not reattach to the wafer 151.

[0081] Fig. 7A An example of an airflow pattern within the cleaning module 200 is shown. As shown by the airflow pattern, recirculation is minimized as the airflow flows out of the plenum 280 and out of the exhaust 260. In general, the shape of the annular inner surface 214 of the wall 213 and the outer surface of the catch cup 210 assists in reducing air recirculation and capturing fluid flowing off the wafer surface as the fluid rotates about the rotation axis 313. In one embodiment, the annular inner surface 214 of the wall 213 has an inverted shape so that the airflow within the processing volume 297 is along the outer edge of the gripper assembly 220 and into the exhaust 260. In addition, the outer surface of the catch cup 210 can be shaped so that the airflow within the interior volume 295 is around the outside of the catch cup 210 and into the exhaust 260. In addition, the shape of the outer surface of the catch cup 210 can force most of the airflow to travel around the outside of the catch cup 210 and into the exhaust 260.

[0082] One or more sides of the drain hole 262 may be angled such that the distance between the sides of the drain hole 262 is different. For example, the drain hole 262 may be tapered. The tapered drain hole may increase the rate of fluid pumping out of the area inside the receiving cup 210. Additionally, a labyrinth 264 may be formed between the receiving cup 210 and the housing of the cleaning module 200. The labyrinth 264 may be configured to at least partially restrict moisture from flowing back through the labyrinth 264 and into the interior volume 295.

[0083] The plenum 280 can be configured to control the airflow within the cleaning module 200 to minimize recirculation. For example, the plenum 280 can increase and / or decrease the amount of air flowing into the cleaning module 200 to minimize recirculation. Due to the configuration of the catch cup 210, the gripper assembly 220, the plenum 280, the exhaust device 260, the spray bar 290, the drain device 284, and the air inlet 279 disclosed herein, airflow recirculation can be minimized.

[0084] In one embodiment, during the cleaning process, a uniform airflow across the surface of the wafer 151 is generated by the exhaust device 260 and the plenum 280. In various embodiments, the exhaust device 260 is configured to provide a path for air to flow out of the cleaning module 200 to prevent particles from reattaching to the surface of the wafer 151. As described above, air can be provided to the plenum 280 through the air inlet 270 and exhausted from the cleaning module 200 through the exhaust device 260. The plenum 280 can be a showerhead type plenum. In addition, the geometry of the exhaust device 260 and / or the shape of the catch cup 210 (or the shape of the first catch cup 211 and / or the second catch cup 212) can be optimized to reduce recirculation within the cleaning module 200. Reducing recirculation at least minimizes reattachment of particles on the wafer 151 and any evaporated cleaning fluid. The geometry of the drain 260 and / or the shape of the catch cup 210 (or the shape of the first catch cup 211 and / or the second catch cup 212) can create a maze 264 behind the catch cup 210, thereby minimizing recirculation. Additionally, the drain 284 provides a path for removing cleaning fluid and rinsing fluid from the cleaning module 200, thereby minimizing recirculation within the cleaning module 200. The plenum 280 can be positioned along a wall 283 of the cleaning module 200 such that the plenum 280 is positioned adjacent the nozzle mechanism 240 and the wafer 151 is between the plenum 280 and the drain 260.

[0085] Figure 7B 351 and drain holes 262 according to one or more embodiments. Each drain hole 262 is fluidly coupled to a drain device 284. In addition, as the gripper assembly 220, the catch cup 210, and the wafer 151 rotate, fluid is forced through the drain holes 262 where it is removed from the cleaning module by the drain device 284.

[0086] Drain holes 262 can be located along the edge of the catch cup 210 (or the second catch cup 212) so that moisture flows into the drain holes 262 during the cleaning process. The drain holes 262 can assist in removing moisture from the cleaning module during a cleaning cycle to ensure that all particles removed from the surface of the wafer 151 during the cleaning process are removed from the cleaning module 200. In various embodiments, at least two drain holes 262 are utilized. In other embodiments, more than two drain holes 262 are utilized.

[0087] The drain holes 262 can be configured to reduce air and / or fluid recirculation within the cleaning module 200. For example, the size and / or orientation of the drain holes 262 can be configured to reduce air and / or fluid recirculation. The drain holes 262 can have an orientation that is inclined or angled with respect to the surface of the receiving cup 210 (or the second receiving cup 212).

[0088] In one embodiment, drain 284 and / or drain 260 may include one or more internal labyrinth seals that minimize the inflow of moisture into drain aperture (or port) 262 .

[0089] The drain 284 can be used to remove excess moisture and / or all fluid from the cleaning module 200 when the cleaning cycle is complete. In one embodiment, moisture flows through the drain holes 262 and into the drain 284. For example, as the wafer 151 rotates, the drain holes 262 are configured to ensure that moisture does not accumulate on the wafer 151 and is removed via the drain 284. In one embodiment, one or more O-rings or other sealing members can be positioned where the drain 284 meets the cleaning module 200.

[0090] Figure 7B Further shown is a drain hole 262 connected to the exhaust 260 and used to provide a path for air to flow within the processing volume 297, around the wafer 151, and into the exhaust 260. In one embodiment, the drain hole 261 assists in minimizing recirculation within the cleaning module.

[0091] Figure 8 A method 800 for cleaning a wafer (eg, wafer 151) is shown in accordance with one or more embodiments. At operation 810, as discussed further below, Fig. 9A , the cleaning module is placed in a wafer loading position. For example, the cover 202 is opened and the gripper assembly 220 of the cleaning module 200 is moved in a lateral direction (e.g., X direction) parallel to the rotation axis 216 toward the annular inner surface 214 of the wall 213 of the pick-up cup 210. Moving the gripper assembly 220 toward the wall 213 places the gripper assembly 220 in the loading position. In one embodiment, placing the gripper assembly 220 in the loading position includes moving the gripper assembly 220 toward the wall 213 via the shaft 224 and the drive motor 222 (e.g., operation 812). For example, the drive motor 222 drives the shaft 224 in a lateral direction, thereby moving the gripper assembly 220 toward the wall 213 so that the feature 312 of the second plate assembly 320 of the gripper assembly 220 contacts the annular inner surface 214 of the wall 213. When the feature 312 contacts the wall 213, movement of the second plate assembly 320 stops while the first plate assembly 318 continues to move such that at least a portion of the first plate assembly 318 is positioned within the interior volume 295. The first plate assembly 318 remains coupled to the second plate assembly 320 via the spring mechanism 330. For example, as the first plate assembly 318 moves in the positive X-direction and movement of the second plate assembly 320 stops, the spring mechanism 330 expands, thereby maintaining the coupling between the first plate assembly 318 and the second plate assembly 320.

[0092] Each assembly 380 is coupled to a corresponding one of the clamping pins 315, and as the assembly 380 contacts the wall 213, each clamping pin 315 tilts (or moves) away from each other movable pin. Fig. 9A As shown, as the assembly 380 contacts the wall 213, the assembly 380 pivots and the clamp pins 315 move in an outward direction, thereby tilting away from the center of the gripper assembly 220. Moving the clamp pins 315 includes moving the clamp pins 315 toward the outer edge of the gripper assembly 220 so that the clamp pins 315 are tilted away from other pins (e.g., the loading pins 311 and other of the clamp pins 315), and the separation distance between the clamp pins 315 increases.

[0093] The gripper assembly 220 is placed in the extended position 300b so that the wafer 151 can be received for cleaning and / or removed from the cleaning module 200 after the cleaning cycle has been completed. For example, the gripper assembly 220 can be driven by the drive motor 222 and the shaft 224 so that at least a portion of the first plate assembly 318 extends beyond the wall 213 of the catch cup 210 and into the interior volume 295 and is in the extended position 300b.

[0094] Fig. 9A An embodiment is shown in which the clamp assembly 220 is positioned in the device position. Fig. 9A 297, the gripper pins 315 have been moved outward and the first plate assembly 318 has been moved away from the second plate assembly 320. Additionally, at least the loading pins 311 rest outside the catch cup 210 and within the interior volume 295 so that the wafer 151 can be received from the robot onto the loading pins 311. In the loading position, the surface 301 of the first plate assembly 318 can be parallel to the outer edge of the wall 213, recessed from the wall 213 of the catch cup 210 within the processing volume 297, or outside the wall 213 of the catch cup 210 and within the interior volume 295. Alternatively, when in the loading position, the surface 301 is parallel to the outer edge of the wall 213 or within the processing volume 297 with the loading pins 311 resting outside the wall 213 and within the interior volume 295.

[0095] The controller 190 may provide instructions to the drive motor 222 to move along Figure 3A The rotation axis 313 of the embodiment moves the shaft member 224 in the lateral direction, thereby moving the gripper assembly 220 in the lateral direction. In addition, the controller 190 can receive a flag indicating that the cleaning module 200 is ready to receive a wafer for cleaning.

[0096] At operation 820 of method 800, a wafer is received for cleaning. For example, in one embodiment, robot 910 inserts wafer 151 into gripper assembly 220 for cleaning. Fig. 9AIn the embodiment shown in FIG. 1 , the robot 910 inserts the wafer 151 so that the wafer 151 is held by the loading pin 311 (e.g., placed in the groove of the loading pin). For example, the robot 910 is configured to place the wafer 151 into the loading pin 311 of the gripper assembly 220.

[0097] During entry into the cleaning module 200, one or more spray bars 290 may pre-treat the wafer 151 by applying one or more fluids to the wafer 151 as it is inserted into the cleaning module 200. In one embodiment, the wafer 151 may be received after it has been cleaned in one or more other cleaning modules (e.g., the ultrasonic cleaning module 161, the pre-cleaning module 162, or the brush box cleaning module 164).

[0098] After the wafer 151 has been fully inserted into the loading pins 311 , the robot 910 releases the wafer 151 and retracts from the cleaning module 200 .

[0099] Controller 190 may provide instructions to spray bar 290 to start the pre-treatment process. In addition, controller 190 may receive a flag indicating that wafer 151 has been inserted into cleaning module 200. For example, controller 190 may receive sensor data from sensing device 294 indicating that wafer 151 has been placed within cleaning module 200 and generate instructions for spray bar 290 to start the pre-treatment process.

[0100] At operation 830 of method 800, the cleaning module is placed in the cleaning position. For example, as shown in operation 832, the cleaning module 200 can be placed in the cleaning position by moving the gripper assembly 220 away from the wall 213. The drive motor 222 drives the shaft 224 to retract the gripper assembly 220 into the processing volume 297. For example, the drive motor 222 can drive the shaft 224 in a lateral or horizontal direction (e.g., X direction) along the rotation axis 216 to move the gripper assembly 220 away from the wall 213.

[0101] As the drive motor 222 moves the gripper assembly 220 away from the wall 213, the first plate assembly 318 is returned to contact with the second plate assembly 320 and the contact between the feature 312 and the wall 213 is ended. In addition, the assembly 380 pivots to the closed position and the clamping pins 315 move toward each other and clamp the wafer 151. The clamping pins 315 apply pressure to the wafer to hold the wafer 151. Each clamping pin 315 can be coupled to a spring mechanism that applies a force to clamp the wafer 151. The drive motor 222 can drive the shaft 224 until the second plate assembly 320 contacts the pick-up cup 210.

[0102] Additionally, as the clamp assembly 220 moves in the negative X-direction (e.g., horizontally away from the wall 213), the feature 312 moves away from the wall 213, and the spring mechanism 330 maintains clamping the second plate assembly 320 to the first plate assembly 318. When the feature 312 no longer contacts the wall 213, the first plate assembly 318 and the second plate assembly 320 may enter a state of contact with each other.

[0103] like Fig. 9C , the wafer 151 is held by the gripper pins 315 of the gripper assembly 220. In the illustrated embodiment, the gripper assembly 220 has been moved away from the wall 213 in the X direction (e.g., parallel to the rotation axis 216) such that the assembly 380 is moved away from the wall 213 and the gripper pins 315 grip the wafer 151. Additionally, the robot 910 has been retracted from the interior volume 295 of the cleaning module 200.

[0104] The controller 190 can be configured to provide instructions to the drive motor 222 to move the shaft 224 in a lateral direction away from the wall 213, thereby moving the gripper assembly 220 in a lateral direction and away from the wall 213. The controller 190 can initiate movement of the gripper assembly 220 based on sensor data received from the sensing device 294 indicating that the wafer 151 is being held by the gripper assembly 220 and that the robot 910 has been removed from the interior volume 295. Once the gripper assembly 220 has been placed in the retracted position 300a, a cleaning cycle can be initiated.

[0105] At operation 840, the wafer is cleaned. The wafer 151 and the gripper assembly 220 are placed in a cleaning position such that the wafer 151 and the gripper assembly 220 are completely seated within the processing volume 297. As shown by operation 842, performing a cleaning cycle includes positioning a purge arm over the wafer 151 and dispensing fluid onto the front and back surfaces of the wafer 151 via the nozzle mechanism 240 and the shaft 224. Additionally, as shown by operation 844, performing a cleaning cycle includes rotating the wafer 151. For example, the drive motor 222 may simultaneously rotate the wafer 151, the catch cup 210, and the gripper assembly 220. During the cleaning process, the position of the wafer 151 within the processing volume 297 may be changed. For example, the distance between the wafer 151 and the second catch cup 212 may be changed. The rate at which the fluid is applied to the front and back surfaces of the wafer 151 via the nozzle mechanism 240 and the shaft 224 may be changed. For example, the fluid may be applied to the front and back surfaces of the wafer 151 at the same rate or at different rates. Alternatively, the rate at which the fluid is applied to the front and back surfaces of the wafer 151 may be changed during a cleaning process or a rinsing process. For example, the rate at which the fluid is applied to the front surface of the wafer 151 via the nozzle mechanism may be increased or decreased during a cleaning or rinsing process. Additionally, the rate at which the fluid is applied to the back surface of the wafer 151 via the shaft 224 may be increased or decreased during a cleaning or rinsing process.

[0106] Cleaning the wafer 151 includes continuously rotating the pick-up cup 210 (e.g., the first pick-up cup 211 and the second pick-up cup 212), the gripper assembly 220, and the wafer 151 while applying a cleaning fluid to a first side (front surface) and a second side (back surface) of the wafer 151. Rotating the pick-up cup 210, the gripper assembly 220, and the wafer 151 while applying the cleaning fluid assists in minimizing and / or eliminating particles from reattaching to any surface of the wafer 151. The drive motor 222 can be configured to simultaneously rotate the pick-up cup 210, the gripper assembly 220, and the wafer 151. For example, the drive motor 222 can rotate the shaft 224 to rotate the pick-up cup 210, the gripper assembly 220, and the wafer 151. The wafer 151 is rotated at a speed in a range of about 500 RPM to about 1000 RPM so that the fluid is removed from the surface of the wafer 151. Alternatively, the wafer 151 can be rotated at a speed less than 500 RPM or greater than about 1000 RPM. Additionally, the rate at which the wafer 151 is rotated may be varied during the cleaning process.

[0107] A first cleaning fluid may be applied to the back surface of the wafer 151 (e.g., the surface of the wafer 151 facing the surface 301) via the fluid source 223, the shaft 224, and the one or more holes 351. Additionally, a second fluid may be applied to the front surface of the wafer 151 (e.g., the surface of the wafer 151 facing away from the surface 301) via the nozzle mechanism 240. The purge arm drive motor 234 may move the purge arm 230 so that the nozzle mechanism 240 moves over the front surface of the wafer 151 in an arcuate path. The nozzle mechanism 240 may be configured to apply the cleaning fluid to the front surface of the wafer 151 during the cleaning process. The fluid may include a cleaning chemical and / or a rinse agent. The cleaning fluid may be applied to the front and back surfaces of the wafer 151 substantially simultaneously. Additionally, the cleaning fluid may be applied to the front surface of the wafer 151 independently of the cleaning fluid being applied to the back surface of the wafer 151. For example, during one or more overlapping and non-overlapping time periods, the cleaning fluid may be applied to the front surface of the wafer 151 and the cleaning fluid may be applied to the back surface of the wafer 151. During the first non-overlapping time period, one or more cleaning fluids may be applied to the front surface of wafer 151, and during the second non-overlapping time period, one or more cleaning fluids may be applied to the back surface of wafer 151. The overlapping and non-overlapping time periods of the cleaning cycle may occur in any order. In addition, the number and / or order of overlapping and non-overlapping time periods may be changed between cleaning cycles. In addition, when in the cleaning position, at least the cleaning fluid is splashed back onto wafer 151 to reduce or eliminate.

[0108] Fig.9D An embodiment is shown with the wafer 151 in a cleaning position. The cleaning position includes positioning the holder assembly 220 within the processing volume 297. Additionally, once the wafer holder 210 has been placed in the cleaning position, a cleaning cycle may be initiated.

[0109] During at least one of the cleaning process, the loading process, and the unloading process, the air flow in the cleaning module 200 mitigates recirculation from occurring, thereby preventing particles from being re-attached to the surface of the wafer 151 .

[0110] The controller 190 may receive a flag indicating that the gripper assembly 220 is positioned in a cleaning position. The flag may be provided in the sensor data from the sensing device 294. In addition, the controller 190 may be configured to control the flow of the cleaning fluid through the shaft 224 and (one or more) holes 351, and the movement and control of the fluid through the nozzle mechanism 240. The controller 190 may provide instructions to the purge arm drive motor 234 to move the nozzle mechanism 240 across the surface of the wafer 151. In addition, the controller 190 may output instructions to the nozzle mechanism to distribute the cleaning fluid from one or more nozzles. In addition, the controller 190 may control the timing of the nozzles so that the cleaning fluid is output at different times. For example, one nozzle may be controlled to start dispensing the cleaning fluid before another nozzle. One or more nozzles may be configured to output the cleaning fluid while at least another nozzle does not output the cleaning fluid.

[0111] At operation 850, the cleaned wafer is removed from the cleaning module. Removing the wafer 151 from the cleaning module includes operation 852, moving the gripper assembly 220 toward the wall 213 to place the gripper assembly 220 in an unloading position. The unloading position may correspond to moving the first plate assembly 318 of the gripper assembly 220 at least partially into the interior volume 295 and placing the gripper pins 315 in a retracted and tilted position. For example, the loading position may include positioning the one or more pins 311 and the surface 301 of the first plate assembly 318 in the interior volume 295. In addition, removing the wafer from the cleaning module includes operation 854 of stopping dispensing of the cleaning fluid and operation 856 of stopping the rotation of the wafer. The pick cup 210, the gripper assembly 220, and the wafer 151 may be continuously rotated by the drive motor 222 until the wafer 151 is within the interior volume 295.

[0112] At the end of the cleaning cycle, the gripper assembly 220 is moved into the loading position by driving the motor 222 and the shaft 224. In addition, the nozzle mechanism 240 can stop spraying fluid, and the nozzle mechanism 240 and the purge arm 230 can be moved away from the wall 213 at the end of the cleaning cycle and before moving the gripper assembly 220. At the end of the cleaning cycle, the nozzle mechanism 240 and the purge arm 230 can be positioned so that they do not interfere with the movement of the gripper assembly 220 and the robot 910.

[0113] At the end of the cleaning cycle, dispensing of the cleaning fluid may be stopped. Additionally, dispensing of the cleaning fluid may be stopped before moving the gripper assembly 220 toward the wall 213. Alternatively, the fluid may continue to be disposed on the back surface of the wafer 151 while dispensing of the fluid to the top surface is stopped.

[0114] Additionally, when the gripper assembly 220 is moved, the gripper assembly 220 and the catch cup 210 may be rotated as described above to minimize reattachment of particles to the wafer 151. In one embodiment, rotating the gripper assembly 220 and the catch cup 210 while moving the gripper assembly 220 reduces splashing of the cleaning fluid back onto the wafer 151. Additionally, the rotation of the gripper assembly 220 and the catch cup 210 is stopped before the assembly 380 contacts the wall 213. Furthermore, the rotation of the gripper assembly 220 and the catch cup 210 may be stopped just before the assembly 380 contacts the wall 213.

[0115] Fig. 9A An example embodiment is shown where the gripper assembly 220 is positioned in an unloading position so that the robot 910 can remove the wafer 151 from the cleaning module 200. The robot 910 can enter the cleaning module through an opening not obstructed by the cover 202, pick up the cleaning wafer 151, and remove the cleaning wafer 151 from the cleaning module 200.

[0116] The controller 190 may provide instructions to the drive motor 222 to move the shaft 224 in a lateral direction toward the wall 213, thereby moving the gripper assembly in a lateral direction and toward the wall 213 to place the gripper assembly 220 in the unloading position so that the robot 910 can remove the cleaned wafer 151 from the cleaning module 200. In addition, once the wafer 151 is positioned in the interior volume 295, the controller 190 may provide instructions to the drive motor 222 to stop the rotation of the take cup 210 and the gripper assembly 220. The controller 190 may also provide instructions to the nozzle mechanism 240 and / or the fluid source 223 to stop dispensing the cleaning fluid. The controller 190 may receive sensor data from the sensing device 294 indicating that the wafer 151 has been placed in the unloading position, and initiate the unloading process in response to the sensor data.

[0117] Fig.10 1 is a cross-sectional view of a non-contact vertical cleaning module (e.g., cleaning module 1000) for a wafer processing system according to one or more embodiments. Cleaning module 1000 is configured to clean wafer 151 in a vertical orientation (e.g., perpendicular to rotation axis 1016). Cleaning module 1000 is similar to cleaning module 200. For example, both cleaning modules 200 and 1000 include nozzle mechanism 240, air chamber 280, exhaust device 260, spray bar 290, drain device 284, air inlet 270, drive motor 222, shaft 224, and fluid source 223. These components are described in more detail above. However, the wafer clamping device 1003 of cleaning module 1000 is different from the wafer clamping device 203 of cleaning module 200.

[0118] As with cleaning module 200, cleaning module 1000 may receive a wafer to be cleaned, such as wafer 151, after cleaning the wafer in one or more of ultrasonic cleaning module 161, pre-cleaning module 162, brush box cleaning module 164 and before placing the wafer in a corresponding Marangoni drying tank (e.g., drying tank 168). Cleaning module 1000 may be placed anywhere within a wafer cleaning cycle and / or edge / bevel cleaning process. Cleaning module 1000 may be used to remove contamination from the wafer (which, if not removed, may cause the wafer to fail to meet quality standards and be discarded).

[0119] The wafer holding device 1003 is configured to support the wafer 151 in a vertical orientation (e.g., an orientation perpendicular to the rotation axis 1016). The wafer holding device 1003 includes a receiving cup 1010 and a gripper assembly 1020. The receiving cup 1010 is configured similarly to the receiving cup 210. For example, the receiving cup 1010 may include a single piece of material as described with respect to the receiving cup 210. Alternatively, the receiving cup 1010 may include a first receiving cup 1011 and a second receiving cup 1012. Similar to the first receiving cup 211 and the second receiving cup 212, the first receiving cup 1011 and the second receiving cup 1012 may be coupled to each other.

[0120] The catch cup 1010 includes a wall 1013. The wall 1013 is configured similarly to the wall 213 as described above. The wall 1013 includes an annular inner surface 1014 that is configured similarly to the annular inner surface 214 as described above. The annular inner surface 1014 has an angled portion that is symmetrical about the central axis of the wafer holding device 1003. The catch cup 1010 is described in more detail below.

[0121] The drive motor 222 is coupled to the gripper assembly 1020. The drive motor 222 is described in more detail above. The drive motor 222 may include a first motor and a second motor, the first motor being configured to control rotation of the gripper assembly 1020 and the receiving cup 1010 about the rotation axis 1016, and the second motor being configured to control horizontal movement of the gripper assembly 1020. Horizontal movement is generally movement in an axial direction of the gripper assembly 1020, or movement in a direction parallel to the rotation axis 1016. Horizontal movement corresponds to movement in the X direction. In addition, the horizontal movement of the gripper assembly 1020 may be independent of the movement of the receiving cup 1010. Furthermore, the gripper assembly 1020 and the receiving cup 1010 may be configured to rotate together, for example, the gripper assembly 1020 and the receiving cup may rotate simultaneously.

[0122] As described above with respect to cleaning module 200, spray bar 290 can apply a pre-treatment fluid to wafer 151 as wafer 151 is inserted into cleaning module 1000, and / or rinse wafer 151 with a rinse fluid as wafer 151 is removed from cleaning module 1000. Spray bar 290 can be used to apply fluid to wafer 151 during periods when wafer 151 is not clamped and is being cleaned.

[0123] As described above with respect to cleaning module 200a, drain 284 may be used to remove excess moisture from cleaning module 1000. Drain 284 may remove excess cleaning fluid from cleaning module 1000 during a cleaning process.

[0124] As described with respect to the cleaning module 200, the plenum 280 may receive air to be circulated within the cleaning module 1000 from the air inlet 270. In addition, air may be exhausted from the cleaning module 1000 through the exhaust device 260. The air inlet 270 and the plenum 280 are located at the front of the cleaning module 200, and the exhaust device 260 is located at the back of the cleaning module 1000. Alternatively, the positions of the exhaust device 260 and the air inlet 270 may be reversed, such that the exhaust device 260 is located at the front of the cleaning module 1000, and the air inlet 270 is located at the back of the cleaning module 1000. In addition, the plenum 280 and the exhaust device may be configured to control the flow of air within the cleaning module 1000 to prevent particles from attaching to the surface of the wafer 151 again.

[0125] The cleaning module 1000 may further include a sensing device 294. The sensing device 294 is described in more detail above. The sensing device 294 may detect a wafer 151 within the cleaning module 1000. For example, the sensing device 294 may detect a wafer 151 within the interior volume 295. Additionally, the sensing device 294 may detect a wafer 151 while the wafer 151 is being held by the gripper assembly 1020. The sensing device 294 may detect when the wafer 151 is properly or improperly loaded into the gripper assembly 1020. Additionally, the sensing device 294 may detect when the wafer 151 falls off or falls out of the gripper assembly 1020.

[0126] Controller 190 may control functions of cleaning module 1000 similar to those of cleaning module 200. For example, controller 190 may control functions of at least drive motor 222, gripper assembly 1020, spray bar 290, purge arm 230, nozzle mechanism 240, air inlet 270, and / or exhaust device 260.

[0127] Fig.11 Shown in Fig.101003. An example of a wafer clamping device 1003 is shown in FIG. During a cleaning process, a clamper assembly 1020 is positioned within a processing volume 297. Additionally, the clamper assembly 1020 includes a first plate assembly 1022, a second plate assembly 1024, a loading pin 1030, and a clamping pin 1032. The first plate assembly 1022 is coupled to a shaft member 224, which is driven by a drive motor 222 to rotate the first plate assembly 1022, the second plate assembly 1024, and the pick-up cup 1010 during a cleaning cycle. Additionally, the drive motor 222 can move the shaft member 224 horizontally along the axis 1016 to move the clamper assembly 1020 into and out of a loading position and a cleaning position. Additionally, a cleaning fluid can flow through the shaft member 224 so that the cleaning fluid can be applied to the back side of the wafer 151 via the holes 1051 in the first plate assembly 1022 during a cleaning process. In one embodiment, the shaft 224 may be a splined shaft that allows the gripper assembly 1020 to be driven as the shaft 224 translates in the +X and -X directions.

[0128] The annular inner surface 1014 of the wall 1013 can be shaped to assist in directing moisture away from the wafer 151 and into the drain 284 during cleaning, and to reduce particles from reattaching to the wafer 151. For example, the annular inner surface 1014 can include a first angled portion and a second angled portion to assist in directing moisture away from the wafer 151 during cleaning. The first angled portion can be larger than the second angled portion. In addition, the angle of the second angled portion with respect to the surface 1101 of the first plate assembly 1022 can be larger than the angle of the first angled portion with respect to the surface 1101 of the first plate assembly 1022.

[0129] The receiving cup 1010 can be configured to include a first receiving cup 1011 and a second receiving cup 1012. The first receiving cup 1011 can be attached to the second receiving cup 1012. For example, the first receiving cup 1011 can be attached to the second receiving cup 1012 via one or more screws or similar attachment devices. The first receiving cup 1011 and or the second receiving cup 1012 can include one or more threaded portions configured to receive threaded screws. Alternatively, the receiving cup 1010 can be formed from a single piece of material.

[0130] The second receiving cup 1012 may include Figure 7B Drain holes 262 may be positioned in an array along the edge of the catch cup 1010 so that moisture flows into the drain 284 when the wafer 151, the gripper assembly 220, and the catch cup 1010 are rotated by the drive motor 222. Additionally, the drain holes 262 may be positioned in an array along the edge of the second catch cup 1012. Moisture flows through the drain holes 262 into the drain 284 where it is removed from the cleaning module 1000.

[0131] The first plate assembly 1022 and the second plate assembly 1024 are configured to move relative to each other to assist in receiving the wafer 151 and placing the wafer 151 in a cleaning position. Fig. 12A and Fig. 12B 1200a and 1200b. The embodiment of the gripper assembly 1020 in the retracted position 1200a and the extended position 1200b is shown respectively. During the cleaning process, the gripper assembly 1020 can be positioned in the retracted position 1200a. In addition, during the wafer loading process and / or the wafer removal (unloading) process, the gripper assembly 1020 can be positioned in the extended position 1200b. The extended position 1200b can correspond to the loading position of the gripper assembly 1020 in the cleaning module 1000. In addition, when in the loading position, the gripper assembly 1020 can be positioned to be a distance from the cleaning position in the X direction. The surface 1101 of the first plate assembly 1022 is coupled to the shaft member 224 and is driven by the shaft member 224.

[0132] The receiving cup 1010 includes one or more spring mechanisms 1230 coupled to the second plate assembly 1024. The spring mechanisms 1230 are used to retain the second plate assembly 1024 within a specific distance of the receiving cup 1010 and allow the second plate assembly 1024 to move relative to the receiving cup 1010. In embodiments where the receiving cup 1010 includes a first receiving cup 1011 and a second receiving cup 1012, the one or more spring mechanisms 1230 are disposed within the second receiving cup 1012.

[0133] The spring mechanism 1230 will generally include a spring 1231 and a coupling member 1233. The spring mechanism 1230 allows the second plate assembly 1023 to move relative to the pick-up cup 1010 (or the second pick-up cup 1012) when the first plate assembly 1022 is driven horizontally by the shaft 224. For example, as the first plate assembly 1022 moves into the extended (e.g., loading or unloading position) position 1200b, the spring mechanism 1230 expands, thereby moving the second plate assembly 1024 away from the pick-up cup 1010 (or the second pick-up cup 1012). Each spring mechanism 1230 may include one or more springs 1231 that move above or parallel to the coupling member 1233. Axial movement of the second plate assembly 1024 may be limited by the coupling member 1233.

[0134] One or more actuator pins 1242 may be disposed within the pick-up cup 1010 (or the second pick-up cup 1012). The actuator pins 1242 may be coupled to the spring assembly 1243. Alternatively, the actuator pins 1242 may be omitted and only the spring assembly 1243 may be used. Additionally, the number of actuator pins 1242 may be equal to the number of clamping pins 1032. For example, each actuator pin 1242 may be configured to interact with a corresponding one of the clamping pins 1032.

[0135] The gripper assembly 1020 may include a loading pin 1030 and a gripper pin 1032. The loading pin 1030 may be configured to receive and hold the wafer 151 during a loading process and to hold the wafer 151 during an unloading process. The loading pin 1030 may be fixed to the first plate assembly 1022.

[0136] The clamping pins 1032 may include one or more components 1240 configured to impart motion to the clamping pins 1032. For example, the clamping pins 1032 may be configured such that the distance between each clamping pin 1032 and the center of the clamper assembly 1020 is variable. Additionally, the clamping pins 1032 may be coupled to the second plate assembly 1024. For example, the second plate assembly 1024 may include a cavity in which the clamping pins 1032 are disposed. The clamping pins 1032 may clamp a wafer (e.g., wafer 151) during a cleaning process.

[0137] The gripper assembly 1020 may include one or more loading pins 1030 and one or more clamping pins 1032. For example, the gripper assembly 1020 may include at least three clamping pins 1032 and at least three loading pins 1030. The clamping pins 1032 may be arranged so that each pin is about 120° from another clamping pin. Alternatively, the clamping pins 315 may be arranged at other angles to each other. In addition, the loading pins 1030 may be arranged so that each pin is about 120° from another loading pin. Alternatively, the loading pins 1030 may be arranged at other angles to each other. In addition, the clamping pins 1032 may be arranged according to a first angle, and the loading pins 1030 may be arranged according to a second angle different from the first angle. The number of clamping pins 1032 may be greater than the number of loading pins 1030. Alternatively, the clamping pins 1032 are equal to or less than the number of loading pins 1030.

[0138] The clamp pin 1032 can move between a loading or stowing position and a clamping position. For example, as the assembly 1240 disengages from the actuator pin 1242 and engages the stop 1247, the clamp pin 1032 moves between the clamping position and the stowing position. Fig. 12A In the embodiment of FIG. 1 , the clamping pin 1032 is shown in the clamping position and Fig. 12B In the embodiment of FIG. 1 , the clamping pin 1032 is shown in the loading position.

[0139] The stopper 1247 can be part of the pick-up cup 1010. Alternatively, the stopper 1247 is attached to the pick-up cup 1010. Additionally, at least a portion of the stopper 1247 can be positioned within the cavity 1246. For example, the stopper 1247 can include a protrusion positioned within the cavity and interact with the assembly 1240 to control the movement of the clamp pin 1032. The distance between the protrusion of the stopper 1247 and the actuator pin 1242 can define the amount of movement of the clamp pin 1032. For example, as the distance between the protrusion of the stopper 1247 and the actuator pin 1242 is optimized, a greater amount of movement of the clamp pin 1032 is allowed. Additionally, although a single stopper 1247 is illustrated, the clamp assembly 1020 can include a stopper 1247 for each clamp pin 1032.

[0140] The clamping pin 1032 can move to the clamping position in response to the first plate assembly 1022 imparting motion to the second plate assembly 1024. For example, when the first plate assembly 1022 is driven into a retracted position (e.g., a cleaning position) 1200a or an extended position (e.g., a loading or unloading position) by the shaft 224. When the clamp assembly is placed into the cleaning position, the force applied by the first plate assembly 1022 to the second plate assembly 1024 can cause the spring mechanism 1230 to compress, thereby allowing the second plate assembly 1024 and the assembly (e.g., an actuation assembly) 1240 to move axially to contact the pin (e.g., an actuator pin) 1242, causing the clamping pin 1032 to pivot about the axis 1033 toward the center of rotation of the assembly.

[0141] 1012. The clamping force may be defined by the compression of the spring assembly 1243. Additionally, the compression of the spring assembly 1243 depends on the distance between the second plate assembly 1024 and the second take cup 1012. When the clamp assembly 1200 is placed into the extended position, the first plate assembly 1022 disengages from the second plate assembly 1024, allowing the spring mechanism 1230 to expand and move the second plate assembly 1024 and assembly 1240 away from the second take cup 1012. Assembly 1240 may disengage from the actuator pin 1242 and contact the stop 1247, causing the clamp pin 1032 to pivot about the axis 1033 away from the center of rotation of the clamp assembly 1200. Additionally, the axial movement of the second plate assembly 1024 may be limited by the coupling member 1233. The position of the clamp pins 1032 may correspond to the distance between the second plate assembly 1024 and the second pick-up cup 1012 and is defined by the engagement of the assembly 1240 with the pins 1242 and / or the stop 1247, and / or the placement of the assembly 1240 within the clamp pins 1032. When the clamp pins 1032 are in the clamping position, the distance between the clamp pins 1032 may be reduced compared to when the clamp pins 1032 are in the loading or unloading position.

[0142] Pins 1030 and 1032 may be configured to hold wafer 151 so that wafer 151 does not contact first plate assembly 1022. The distance between wafer 151 and first plate assembly 1022 is fixed.

[0143] The bellows 1250 is disposed around the second plate assembly 1024 and is configured to prevent moisture from entering any space between the second plate assembly 1024 and the receiving cup 1010 (or the second receiving cup 1012). The bellows 1250 may completely surround the second plate assembly 1024 or only partially surround the second plate assembly 1024. In addition, the bellows 1250 may expand and compress in response to movement of the second plate assembly 1024. Furthermore, the bellows may be coupled to the receiving cup 1010 (or the second receiving cup 1012).

[0144] The bellows 1252 can be coupled to the shaft 224 to prevent moisture from reaching the shaft 224 and / or flowing between the shaft 224 and the second plate assembly 1024 and / or the take-up cup 1010 (or the second take-up cup 1012). The bellows 1252 can completely or partially surround the shaft 224. In addition, the bellows 1252 can expand and compress in response to the movement of the shaft 224.

[0145] The cavity 1246 may be used to position a bellows 1254 in which the clamping pin 1032 is positioned. The bellows 1254 may assist in preventing moisture from flowing into the cavity and between the cavity and the second catch cup 1012.

[0146] The bending device may be disposed between the second receiving cup 1012 and the second plate assembly 1024. The bending device may be configured to apply a force to the second plate assembly 1024 to assist in moving the second plate assembly 1024 away from the receiving cup 1010 (or the second receiving cup 1012).

[0147] The clamp assembly 1020 may further include a guide pin 1035. The guide pin 1035 may be coupled to the second plate assembly 1024 and configured to guide the movement and alignment of the first plate assembly 1022 with the second plate assembly 1024. For example, as the first plate assembly 1022 moves closer to the second plate assembly 1024, the guide pin 1035 passes through the cavity 1270, thereby aligning the first plate assembly 1022 with the second plate assembly 1024. In addition, the guide pin 1035 may be configured to limit the angular movement of the second plate assembly 1024 relative to the first plate assembly 1022. The clamp assembly 1020 may include one or more guide pins 1035, or no guide pins.

[0148] Fig. 12BThe clamp assembly 1020 is shown in an extended (e.g., loading or unloading) position 1200b. As shown, in response to the second plate assembly 1024 moving away from the receiving cup 1010 (or the second receiving cup 1012), the clamp pin 1032 has moved to the loading position. For example, the spring mechanism 1230 can expand in response to the first plate assembly 1022 moving away from the second plate assembly 1024, thereby pushing the second plate assembly 1024 away from the receiving cup 1010 (or the second receiving cup 1012). In addition, the assembly 1240 disengages from the actuator pin 1242 and engages with the stop 1247 and moves the clamp pin 1032 into the loading position. In addition, the bellows 1250 and the bellows 1252 expand with the movement of the second plate assembly 1024 and the shaft member 224, respectively.

[0149] The cleaning fluid may flow through one or more holes 1051 to the back side of the wafer 151. The cleaning fluid may be a rinse agent (e.g., DI water or ozone water) or a cleaning chemical. In addition, the cleaning fluid may be provided via the shaft 224 and then provided to the one or more holes 1051. As shown, one or more holes 1051 may be used to flow the chemical reagent to the back side of the wafer 151. One or more holes 1051 may be formed in the first plate assembly 1022. The number of holes 1051 is one or more. In addition, one or more holes 1051 may be arranged in a substantially circular or linear pattern. In one embodiment, each of the one or more holes 1051 may be substantially the same size so that the cleaning fluid flows evenly across the back surface of the wafer 151. In other embodiments, at least one of the one or more holes 1051 may have a size different from at least one other hole.

[0150] Fig.13 A method 1300 for cleaning a wafer (e.g., wafer 151) is shown. At operation 1310, the cleaning module is placed in a wafer loading position. For example, the cover 202 is opened and the first plate assembly 1022 of the gripper assembly 1020 of the cleaning module 1000 is moved in a lateral direction (e.g., X direction) toward the wall 213 to place the gripper assembly 1020 in the loading position. Placing the gripper assembly 1020 in the loading position includes moving the first plate assembly 1022 toward the wall 213 via the shaft 224 and the drive motor 222 (operation 1312). For example, the drive motor 222 can drive the shaft 224 in the lateral direction to move the first plate assembly 1022 toward the wall 213 so that the first plate assembly 1022 is separated from the second plate assembly 1024. In addition, the spring mechanism 1230 expands in response to moving the first plate assembly 1022 away from the second pick cup 1012, thereby allowing the assembly 1240 to place the gripper pin 1032 in the loading position.

[0151] Each of the clamping pins 1032 is coupled to a respective assembly 1240 such that each clamping pin 1032 can be tilted (or moved) away from each other clamping pin 1032. For example, Fig.14A As shown, in response to the first plate assembly 1022 being separated from the second plate assembly 1024, the assembly 1240 engages the stop 1247, pivots about the axis 1033, and tilts the clamp pin 1030 away from the center of the clamp assembly 1020. Moving the clamp pin 1032 includes moving the clamp pin 1032 toward the outer edge of the clamp assembly 1020 so that the clamp pin 1032 is tilted away from the other clamp pins 1032 and the loading pin 1030, thereby increasing the separation distance between the clamp pins 1032 and the distance between the clamp pin 1032 and the loading pin 1030.

[0152] The gripper assembly 1020 can be placed in the extended position 1200b so that the wafer 151 can be received for cleaning and / or removed from the cleaning module 1000 after the cleaning cycle has been completed. For example, the gripper assembly 1020 can be driven by the drive motor 222 and the shaft 224 so that at least a portion of the first plate assembly 1022 extends beyond the catch cup 1010 (or the first catch cup 1011) and is in the extended position 1200b. For example, at least one of the surface 1101 and the loading pin 1030 extends beyond the catch cup 1010 and into the interior volume 295. Alternatively, the surface 1101 can be disposed within the processing volume 297 while the loading pin 1030 is positioned within the interior volume 295.

[0153] The controller 190 can provide instructions to the drive motor 222 to move the shaft 224 in the lateral direction, thereby moving the gripper assembly 1020 in the horizontal direction along the axis 1016. In addition, the controller 190 can receive a flag indicating that the cleaning module 1000 is ready to receive a wafer for cleaning. The flag can be received as sensor data received from the sensing device 294.

[0154] At operation 1320 of method 1300, a wafer is received for cleaning. For example, in one embodiment, robot 910 inserts wafer 151 into gripper assembly 1020 for cleaning. For example, as in Fig.14A In the embodiment shown in FIG. 1 , the robot 910 inserts the wafer 151 such that the wafer 151 is held by the loading pins 1030 (eg, seated in a groove of the loading pins 1030 ).

[0155] During entry into the cleaning module 1000, one or more spray bars 290 may pre-treat the wafer 151 by applying one or more fluids to the wafer 151 as it is inserted into the cleaning module 1000. The wafer 151 may be received after cleaning the wafer 151 in one or more other cleaning modules (e.g., the ultrasonic cleaning module 161, the pre-cleaning module 162, or the brush box cleaning module 164).

[0156] After the wafer 151 has been fully inserted into the loading pins 1030 , the robot 910 releases the wafer 151 and the robot 910 retracts from the cleaning module 1000 .

[0157] The controller 190 provides instructions to the spray bar 290 to start the pre-treatment process. In addition, the controller 190 may receive a flag indicating that the wafer 151 has been inserted into the cleaning module 1000. The flag may be received as sensor data from the sensing device 294.

[0158] At operation 1330 of method 1300, the cleaning module is placed in the cleaning position. For example, as shown in operation 1332, the cleaning module 1000 can be placed in the cleaning position by moving the first plate assembly 1022 away from the wall 1013 and toward the second plate assembly 1024. The drive motor 222 drives the shaft 224 to retract the first plate assembly 1022 of the gripper assembly 1020, thereby moving the first plate assembly 1022 away from the wall 1013 and toward the second plate assembly 1024. For example, the drive motor 222 can drive the shaft 224 in a lateral or horizontal direction (e.g., an X direction) to move the first plate assembly 1022 away from the wall 1013 and toward the second plate assembly 1024.

[0159] In addition, as the drive motor 222 moves the first plate assembly 1022 away from the wall 1013 and toward the second plate assembly 1024, the first plate assembly 1022 contacts the second plate assembly 1024, thereby compressing the spring mechanism 1230. In addition, as the first plate assembly 1022 imparts more force on the second plate assembly 1024 and the spring mechanism 1230 compresses, the assembly 1240 disengages from the stop 1247 and contacts a corresponding one of the actuator pins 1242, thereby placing the clamping pins 1032 in a clamping position. In response, the clamping pins 1032 apply a clamping force or pressure to the wafer 151. By changing the position of the second plate assembly 1024, the amount of clamping force applied by the clamping pins 1032 can be changed.

[0160] The controller 190 can be configured to provide instructions to the drive motor 222 to move the shaft 224 in a lateral direction away from the wall 1013 and toward the second plate assembly 1024, thereby moving the first plate assembly 1022 in a lateral direction toward the second plate assembly 1024 and away from the wall 1013. Once the clamp assembly 1020 has been placed in the retracted position 1200b, a cleaning cycle can be initiated. The controller 190 can receive sensor data from the sensing device 294 indicating that the clamp assembly 1020 is positioned in the retracted position 1200b (e.g., the cleaning position) and initiate a cleaning cycle.

[0161] At operation 1340, the wafer is cleaned. The wafer 151 and the gripper assembly 1020 are placed in a cleaning position such that the wafer 151 and the gripper assembly 1020 are completely seated within the processing volume 297. The wafer 151 can be cleaned by the cleaning module 1000. For example, as shown in operation 1342, performing a cleaning cycle can include dispensing a fluid onto a surface of the wafer 151. Additionally, as shown by operation 1344, performing a cleaning cycle can include rotating the wafer 151.

[0162] Additionally, during the cleaning process, the position of the wafer 151 within the processing volume 297 may be altered. For example, one or more of the distance between the second plate assembly 1024 and the catch cup 1010 (or the second catch cup 1012) and the amount by which the spring mechanism 1230 is compressed may be changed, thereby changing the position of the wafer 151 within the processing volume 297.

[0163] Cleaning the wafer 151 includes simultaneously rotating the pick-up cup 1010, the gripper assembly 1020, and the wafer 151 while applying a cleaning fluid to a first side (front surface) and a second side (back surface) of the wafer 151. Rotating the pick-up cup 1010, the gripper assembly 1020, and the wafer 151 while applying the cleaning fluid assists in minimizing and / or eliminating particles from reattaching to either surface of the wafer 151. For example, the drive motor 222 can be configured to rotate the pick-up cup 1010, the gripper assembly 1020, and the wafer 151. For example, the drive motor 222 can rotate the shaft 224 to rotate the pick-up cup 1010, the gripper assembly 1020, and the wafer 151. The wafer 151 is rotated at a speed in a range of about 500 RPM to about 1000 RPM so that the fluid is removed from the surface of the wafer 151. The wafer 151 can be rotated at a speed less than 500 RPM or greater than about 1000 RPM. Additionally, during the cleaning process, the rate at which the wafer 151 is rotated may be varied. Additionally, once the wafer holder 210 has been placed in the cleaning position, a cleaning cycle may be initiated.

[0164] A first cleaning fluid may be applied to the back surface (e.g., a surface adjacent to surface 1101) of wafer 151 via fluid source 223, shaft 224, and aperture 1051. Additionally, a second fluid may be applied to the front surface (e.g., a surface opposite to surface 1101) of wafer 151 via nozzle mechanism 240. Purge arm drive motor 234 moves purge arm 230 such that nozzle mechanism 240 moves over the front surface of wafer 151 in an arcuate path. Nozzle mechanism 240 may be configured to apply a cleaning fluid to the front surface of wafer 151 during a cleaning process. The fluid may include a cleaning chemical and / or a rinse agent. In one embodiment, the cleaning fluid may be applied to the front and back surfaces of wafer 151 substantially simultaneously. Additionally, the cleaning fluid may be applied to the front surface of wafer 151 independently of the cleaning fluid being applied to the back surface of wafer 151. For example, during one or more overlapping and non-overlapping time periods, the cleaning fluid may be applied to the back surface of wafer 151 and the cleaning fluid may be applied to the back surface of wafer 151. During the first non-overlapping time period, one or more cleaning fluids may be applied to the front surface of wafer 151, and during the second non-overlapping time period, one or more cleaning fluids may be applied to the back surface of wafer 151. The overlapping and non-overlapping time periods of the cleaning cycle may occur in any order. In addition, the number and / or order of overlapping and non-overlapping time periods may be changed between cleaning cycles. Although in the cleaning position, at least the cleaning fluid is reduced and in various embodiments eliminated from splashing back onto wafer 151.

[0165] During at least one of the cleaning process, the loading process, and the unloading process, the air flow in the cleaning module 200 mitigates recirculation from occurring, thereby preventing particles from being re-attached to the surface of the wafer 151 .

[0166] The controller 190 may receive a flag indicating that the gripper assembly 220 is positioned in a cleaning position. For example, the controller 190 may receive sensor data from the sensing device 294. In addition, the controller 190 may be configured to control the flow of the cleaning fluid through the shaft 224 and (one or more) holes 1051, as well as the movement and control of the fluid through the nozzle mechanism 240. The controller 190 may provide instructions to the purge arm drive motor 234 to move the nozzle mechanism 240 across the surface of the wafer 151. In addition, the controller 190 may output instructions to the nozzle mechanism to distribute the cleaning fluid from one or more nozzles. In addition, the controller 190 may control the timing of the nozzles so that the cleaning fluid is output at different times. For example, one nozzle may be controlled to start dispensing the cleaning fluid before another nozzle. One or more nozzles may be configured to output the cleaning fluid while at least another nozzle does not output the cleaning fluid.

[0167] At operation 1350, the cleaned wafer is removed from the cleaning module. Removing the wafer from the cleaning module 1000 includes moving the first plate assembly 1022 of the gripper assembly 1020 away from the second plate assembly 1024 of the gripper assembly 1020 (operation 1352). As the first plate assembly 1022 moves away from the second pick-up cup 1012, the spring mechanism 1230 expands, thereby imparting a force on the second plate assembly 1024. In response, the second plate assembly 1024 moves in the same direction as the first plate assembly 1022 moves, and the force applied to the assembly 1240 by the actuator pins 1242 decreases. Additionally, as the second plate assembly 1024 moves, the assembly 1240 engages the stopper 1247 and moves the gripper pins 1032 into the loading position, thereby releasing the grip of the gripper pins 1032 on the wafer 151 and unloading the wafer 151 onto the loading pins 1032.

[0168] Additionally, removing the wafer 151 from the cleaning module includes an operation 1354 of stopping dispensing of the cleaning fluid and an operation 1356 of stopping rotation of the wafer.

[0169] At the end of the cleaning cycle, the gripper assembly 1020 is moved into the loading position by driving the motor 222 and the shaft 224. In addition, the nozzle mechanism 240 can stop spraying fluid, and the nozzle mechanism 240 and the purge arm 230 can be moved away from the pick-up cup 1010 at the end of the cleaning cycle and before moving the first plate assembly 1022, thereby moving the nozzle mechanism 240 and the purge arm 230 away from the movement path of the first plate assembly 1022. For example, at the end of the cleaning cycle, the nozzle mechanism 240 and the purge arm 230 can be positioned so that they do not interfere with the movement of the gripper assembly 1020 and the robot 910.

[0170] The drive motor 222 and the shaft 224 can be configured to move the first plate assembly 1022 in a lateral direction toward the wall 1013, thereby causing the first plate assembly 1022 to separate from the second plate assembly 1024 and placing the clamping pins 1032 in the loading position. Additionally, the wafer 151 moves within the interior volume 295. Furthermore, the spray bar 290 can be engaged during the unloading process to apply fluid to the wafer 151.

[0171] At the end of the cleaning cycle, dispensing of the cleaning fluid via shaft 224 and nozzle mechanism 240 is stopped. Dispensing of the cleaning fluid is stopped before moving first plate assembly 1022 toward wall 1013. Fluid may continue to be disposed onto the back surface of wafer 151 while dispensing of fluid to the front surface is stopped.

[0172] Additionally, after the gripper assembly 1020 has been placed in the unloading position, the wafer 151 may be removed.

[0173] Fig.14AAn example is shown where the gripper assembly 1020 is positioned in an unloading position so that the robot 910 can remove the wafer 151 from the cleaning module 1000. In one embodiment, the robot 910 can enter the cleaning module through an opening not obstructed by the cover 202, pick up the cleaning wafer 151, and remove the cleaning wafer 151 from the cleaning module 200.

[0174] The controller 190 can provide instructions to the drive motor 222 to move the shaft 224 in a lateral direction toward the first take cup 211, thereby moving the first plate assembly 1022 in a lateral direction and toward the wall 1013 to place the gripper assembly 1020 in an unloading position so that the robot 910 can remove the cleaned wafer 151 from the cleaning module 1000. In addition, once the wafer 151 is positioned in the interior volume 295, the controller 190 can provide instructions to the drive motor 222 to stop the rotation of the take cup 1010 and the gripper assembly 1020. The controller 190 can also provide instructions to the nozzle mechanism 240 and / or the fluid source 223 to stop dispensing the cleaning fluid. In addition, the controller 190 can also provide instructions to the spray bar 290 to start dispensing the fluid. For example, controller 190 may instruct spray boom 290 to begin dispensing fluid to coincide with the end of a cleaning cycle when first plate assembly 1022 begins moving, when first plate assembly 1022 clears wall 1013, or at any other point during the unloading process.

[0175] While the foregoing is directed to embodiments of the present disclosure, other and further embodiments of the disclosure may be devised without departing from the basic scope thereof, and the scope thereof is to be determined by the following claims.

Claims

1. A cleaning module, comprising: A wafer holding device, the wafer holding device being configured to support a wafer in a vertical orientation, the wafer holding device comprising: a catch cup including a wall having an annular inner surface defining a treatment area; and A clamp assembly, the clamp assembly comprising: a first plate assembly comprising a plurality of loading pins, each of the plurality of loading pins configured to support an edge of a wafer oriented in a vertical orientation; and A second plate assembly, the second plate assembly comprising a plurality of clamping pins, each of the plurality of clamping pins being configured to: each of the plurality of gripper pins is configured to be positioned at a first distance from a central axis of the wafer gripping device based on the second plate assembly being positioned at a second distance from the first plate assembly, wherein each of the plurality of gripper pins is configured to contact an edge of the wafer and hold the wafer in a vertical orientation when each of the plurality of gripper pins is positioned at the first distance from the central axis; Based on the second plate assembly being positioned a fourth distance from the first plate assembly, each of the plurality of clamping pins is configured to be positioned a third distance from the central axis, wherein the third distance is greater than the first distance and the fourth distance is greater than the second distance. 2 . The cleaning module of claim 1 , wherein each of the plurality of clamping pins passes through a corresponding opening in the first plate assembly. 3 . The cleaning module of claim 1 , wherein the second plate assembly further comprises one or more features configured to contact the catch cup.

4. The cleaning module of claim 3, wherein the one or more features are configured to contact the catch cup and stop movement of the second plate assembly relative to movement of the first plate assembly.

5. The cleaning module of claim 3, wherein each of the plurality of clamping pins is coupled to a corresponding component configured to contact the catch cup.

6. The cleaning module of claim 1, wherein the first plate assembly is connected to the second plate assembly via one or more spring mechanisms.

7. The cleaning module of claim 1, wherein the second plate assembly is coupled to the catch cup via one or more spring mechanisms.

8. The cleaning module of claim 7, wherein the one or more spring mechanisms are configured to: compress based on the first plate assembly being the second distance from the second plate assembly; and The first plate assembly is extended based on the fourth distance between the first plate assembly and the second plate assembly.

9. The cleaning module of claim 1, wherein: The pick-up cup further comprises a plurality of actuator pins; and Each of the plurality of clamping pins is coupled to a corresponding actuator assembly, the actuator assembly being configured to: engaging a corresponding one of the plurality of actuator pins; as well as Disengage from a corresponding one of the plurality of actuator pins.

10. The cleaning module of claim 1, further comprising: A nozzle mechanism coupled to the purge arm, the nozzle mechanism comprising: a first nozzle oriented at a first angle to a surface of the first plate assembly and configured to provide a high energy fluid toward the wafer; as well as a second nozzle oriented at a second angle to the surface of the first plate assembly, wherein the second angle is different than the first angle and is configured to apply a second fluid to the wafer, and wherein the first nozzle is one of an ultrasonic nozzle and a jet nozzle configured to deliver a mixture of a gas and a liquid, and wherein the purge arm is configured to move the nozzle mechanism over at least a portion of the first plate assembly.

11. The cleaning module of claim 1 , further comprising a drive motor, wherein the drive motor is configured to: imparting horizontal movement to at least one of the first plate assembly and the second plate assembly; and The gripper assembly, the catch cup, and the vertically oriented wafer are simultaneously rotated about the central axis during a cleaning process.

12. The cleaning module of claim 1, wherein the pick-up cup comprises: one or more drain holes, wherein the catch cup is configured to direct moisture to the one or more drain holes as the catch cup rotates about the central axis, and wherein each of the one or more drain holes is fluidly coupled to an interior region of the cleaning module through a corresponding air labyrinth, the air labyrinth being shaped to mitigate the flow of moisture into the interior region.

13. A wafer clamping device, comprising: a catch cup including a wall having an annular inner surface defining a treatment area; A gripper assembly configured to support a wafer in a vertical orientation, the gripper assembly comprising: a first plate assembly; and A second plate assembly, the second plate assembly comprising a plurality of clamping pins, each of the plurality of clamping pins being configured to: each of the plurality of gripper pins is configured to be positioned at a first distance from a central axis of the wafer gripping device based on the second plate assembly being positioned at a second distance from the first plate assembly, wherein each of the plurality of gripper pins is configured to contact an edge of the wafer and hold the wafer in a vertical orientation when each of the plurality of gripper pins is positioned at the first distance from the central axis; each of the plurality of clamping pins is configured to be positioned at a third distance from the central axis based on the second plate assembly being positioned at a fourth distance from the first plate assembly, wherein the third distance is greater than the first distance and the fourth distance is greater than the second distance; and A drive motor is configured to impart horizontal motion to at least one of the first plate assembly and the second plate assembly to position the second plate assembly at the first distance and the second distance from the first plate assembly.

14. A method for cleaning a wafer in a cleaning module including a wafer holding device, the method comprising: Positioning a gripper assembly in a loading position, wherein positioning the gripper assembly in the loading position includes moving a first plate assembly of the gripper assembly away from a second plate assembly of the gripper assembly, and causing: The first plate assembly is positioned closer to an annular inner surface of a receiving cup of the wafer holding device, the annular inner surface having an angled portion that is symmetrical about a central axis of the wafer holding device, and The plurality of clamping pins of the second plate assembly are moved to a position a first distance from the central axis; Positioning the gripper assembly in a cleaning position, wherein positioning the gripper assembly in the cleaning position comprises moving the first plate assembly toward the second plate assembly and causing: the plurality of clamping pins being positioned at a second distance from the central axis so as to clamp an edge of the wafer disposed in a vertical orientation between the plurality of clamping pins, wherein the first distance is greater than the second distance; as well as The gripper assembly, the catch cup, and the vertically oriented wafer are simultaneously rotated about the central axis during a cleaning process.

15. The method of claim 14, further comprising simultaneously rotating the gripper assembly, the catch cup, and the wafer during axial movement of the wafer to the loading position or the cleaning position.

16. The method of claim 14, further comprising rotating the gripper assembly, the catch cup, and the wafer after the wafer is axially moved to the cleaning position.

17. The method of claim 14, further comprising stopping rotating said gripper assembly, said catch cup, and said wafer prior to axially moving said wafer to said loading position.

18. The method of claim 14, wherein each of the plurality of clamping pins is coupled to a corresponding actuation assembly, the corresponding actuation assembly engaging with a corresponding one of a plurality of actuator pins disposed within the receiving cup based on the clamp assembly being in a cleaning position.

19. The method of claim 18, wherein each of the plurality of actuation assemblies is disengaged from a corresponding one of the plurality of actuator pins based on the gripper assembly being in the stowed position.

20. The method of claim 14, further comprising: applying a first cleaning chemistry via a first nozzle of a nozzle mechanism coupled to a purge arm while rotating the gripper assembly, the catch cup, and the wafer, wherein the first cleaning chemistry is a high energy fluid and the first nozzle is oriented at a first angle to a surface of the first plate assembly; applying a second fluid through a second nozzle of the nozzle mechanism while rotating the gripper assembly, the pick-up cup, and the wafer, wherein the second nozzle is oriented at a second angle, the second angle being different than the first angle; as well as A third cleaning chemistry is applied to the backside of the wafer.

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