Wafer slide holder

Abstract

The invention provides a wafer carrying rack, and relates to the technical field of wafer production. The wafer carrier comprises a wafer bearing assembly, a rolling driving assembly and a rolling upward pressing assembly. The bottom rolling supporting part is installed on the bottom side in the box frame, and the two sides in the box frame are provided with containing grooves for containing wafers. The fixed supporting part is installed on the side of the box frame, the rotating shaft and the fixed supporting part are rotationally arranged, the rotating shaft is fixedly sleeved with wheel discs in one-to-one correspondence with the containing grooves, and a rotating connecting part is arranged at the end of the rotating shaft. The rolling upper pressing assembly is installed on the box frame to limit the wafer. When the wafer in the box frame reciprocates up and down to be cleaned, the wafer area located in the containing groove can rotate without extra power while the wafer area reciprocates up and down on the box frame, and the wafer area located in the containing groove can be separated out along with rotation to be cleaned. The wafer in the box frame can be completely cleaned, and the wafer cleaning quality is improved.

Description

Technical Field

[0001] The present application relates to the field of wafer production technology, and in particular, to a wafer carrier. Background Art

[0002] Wafers are mainly processed in batches. Silicon ingots are ground, polished, and sliced ​​to form silicon wafers. Wafers need to be cleaned with cleaning equipment during the production process.

[0003] When the silicon wafers are placed in the cleaning equipment for cleaning, the batch of wafers must first be placed in the cassette, which will be submerged in the water in the inclined equipment tank. Then the cleaning equipment will drive the cassette and the wafers inside to reciprocate in the vertical direction to clean the wafers inside the cassette. Since the wafers are placed in the cassette in the vertical reciprocating cleaning process, the area where the wafers fit in the cassette tank is difficult to be cleaned, which affects the cleaning quality of the wafers. Summary of the invention

[0004] The present application aims to solve at least one of the technical problems existing in the prior art. To this end, the present application proposes a wafer carrier to solve the problem that the wafer is placed inside the cassette and during the vertical reciprocating cleaning process, the area where the wafer fits the placement groove inside the cassette is difficult to be cleaned.

[0005] A wafer carrier according to an embodiment of the present application includes: a wafer carrying component, a rolling drive component and a rolling upper pressure component.

[0006] The wafer bearing assembly includes a box frame and a bottom rolling support portion, wherein the bottom rolling support portion is installed on the bottom side of the box frame, and placement grooves for placing wafers are arranged on both sides of the box frame, and an arc groove connected to the placement groove is arranged on one side of the box frame;

[0007] The rolling drive assembly includes a floating plate, a rotating shaft, a fixed support part and a strip shell, wherein the fixed support part is installed on the side of the box frame, the rotating shaft and the fixed support part are rotatably arranged, and a wheel disk corresponding to the placement groove is fixedly sleeved on the outside of the rotating shaft, a rotating connection part is arranged at the end of the rotating shaft, and the bottom and top of the inclined strip shell are respectively connected to a lower rod and an upper rod, the floating plate is fixedly connected to the bottom end of the lower rod, and the lower rod and the upper rod are movably penetrated with the fixed support part in the vertical direction;

[0008] The rolling pressing assembly is installed on the cassette rack to limit the wafer.

[0009] Preferably, the bottom rolling support portion comprises a support plate and a lower roller, the support plate is fixed to the end of the box frame, and the end of the lower roller is rotatably connected to the support plate.

[0010] Preferably, the outer portion of the lower roller is provided with a first roller groove corresponding to the placement groove one by one.

[0011] Preferably, the fixed support part includes a seat frame, a side frame, an elastic support member and a second seat block, the seat frame and the side frame are slidably arranged in a vertical position, and the elastic support member connects the seat frame and the side frame, the top and bottom ends of the side frame are provided with limit rings, the second seat block is fixed on one side of the side frame, and the end of the rotating shaft is rotatably arranged with the second seat block.

[0012] Preferably, the rolling pressure assembly includes a support arm, an upper roller and a support block, the support block is fixed to the side of the box frame, the upper roller is rotatably arranged at the top of two support arms, the support block is rotatably installed with the support arm through a pin shaft, the bottom of the support arm is respectively provided with a downward pressure support area and a loosening support area which are engaged with the top of the side frame, a first avoidance groove is provided on the upper edge of one side of the box frame, and handles are provided on the outside of the two support arms.

[0013] Preferably, the outer portion of the upper roller is provided with a second roller groove corresponding one to one with the placement groove.

[0014] Preferably, the elastic support member includes a pin rod, a spring, a first seat block and a fixed block, the fixed block is fixed to the seat frame, the pin rod is fixed above the fixed block, the first seat block is connected to the side frame, the top end of the pin rod movably passes through the first seat block, the spring is sleeved on the outside of the pin rod, and a limiting cover is provided on the top end of the pin rod.

[0015] Preferably, the rotating connection part includes a connecting strip and a shaft rod, two ends of the connecting strip are respectively connected to one end of the rotating shaft and one end of the shaft rod, and the other end of the shaft rod moves inside the strip housing.

[0016] Preferably, the rolling drive assembly further comprises a top block, and the top block is arranged at the top end of the upper rod.

[0017] The wafer carrier also includes an outer cover protection component, which includes an outer cover shell. The outer cover shell is located outside the rolling drive component and connected to the side of the box frame. A flow port is provided on the side of the outer cover shell, and a second avoidance groove is provided above the outer cover shell to cooperate with the support arm.

[0018] Preferably, the outer cover protection assembly also includes a guide shell, a guide plate, a blade and a sleeve, the sleeve fixes the outside of the rotating shaft between adjacent wheel discs, a plurality of groups of blades are distributed in a ring array on the outside of the sleeve, the guide shell is located on the outside of the flow port and is fixed to the outer cover shell, the guide plate is installed inside the guide shell, and the guide plate is provided with inclined guide grooves corresponding to the sleeves one by one.

[0019] The beneficial effects of the present application are as follows: the present application obtains a wafer carrier through the above-mentioned design. When the cleaning equipment drives the box frame to move up and down to clean the wafer inside the box frame, the surface of the wafer exposed outside the placement groove can be directly contacted with the cleaning liquid inside the cleaning groove and cleaned. The box frame moves up and down to drive the rotating shaft and the wheel to rotate through the cooperation of the floating plate, the bar shell and other components, and finally drives the wafer inside the box frame to rotate. That is, while the wafer inside the box frame moves up and down to be cleaned, the wafer area located inside the placement groove can complete the rotation without additional power while the box frame moves up and down, and the wafer area located inside the placement groove will be cleaned by being released as the rotation rotates, so that the wafer inside the box frame can be completely cleaned, thereby improving the wafer cleaning quality.

[0020] Additional aspects and advantages of the present application will be given in part in the description below, and in part will become apparent from the description below, or will be learned through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings required for use in the embodiments of the present application will be briefly introduced below. It should be understood that the following drawings only show certain embodiments of the present application and therefore should not be regarded as limiting the scope. For ordinary technicians in this field, other related drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 is a schematic diagram of the structure of a wafer carrier according to an embodiment of the present application;

[0023] Figure 2 It is a schematic diagram of the structure of a wafer carrying assembly, a rolling drive assembly and a rolling upper pressing assembly according to an embodiment of the present application;

[0024] Figure 3 is a schematic diagram of the structure of a wafer carrier assembly according to an embodiment of the present application;

[0025] Figure 4 is a schematic diagram of the structure of a floating plate, a rotating shaft and a wheel disc according to an embodiment of the present application;

[0026] Figure 5 It is a schematic diagram of the structure of the rotating connection part, the fixed support part, the bar shell, the lower rod, the upper rod and the top block according to the embodiment of the present application;

[0027] Figure 6 is a schematic diagram of the structure of a fixed support portion according to an embodiment of the present application;

[0028] Figure 7 is a schematic diagram of the structure of an elastic support member according to an embodiment of the present application;

[0029] Figure 8 is a schematic diagram of the structure of a rolling pressing assembly according to an embodiment of the present application;

[0030] Fig. 9 is a schematic diagram of the structure of the rotating shaft, the wheel disc and the outer cover protection assembly according to an embodiment of the present application;

[0031] Fig.10 It is a schematic diagram of the structure of the rotating shaft, the wheel disc, the guide plate, the guide groove, the blade plate, and the sleeve according to an embodiment of the present application;

[0032] Fig.11 It is a schematic diagram of the blade and sleeve structure according to an embodiment of the present application.

[0033] Reference numerals:

[0034] 1-wafer bearing assembly; 11-cassette rack; 12-bottom rolling support; 121-support plate; 122-lower roller; 123-first roller slot; 13-placing slot; 14-arc slot; 15-first avoidance slot; 2-rolling drive assembly; 21-floating plate; 22-rotating shaft; 23-wheel disc; 24-rotating connection; 241-connecting strip; 242-axle; 25-fixed support; 251-seat frame; 252-side frame; 253-elastic support member; 2531-pin rod; 2532-spring; 2533-first seat block; 253 4-limiting cover; 2535-fixing block; 254-limiting ring; 255-second seat block; 26-bar shell; 27-lower rod; 28-upper rod; 29-top block; 3-rolling pressure assembly; 31-support arm; 32-upper roller; 33-second roller groove; 34-handle; 35-support block; 36-pin shaft; 37-downward pressure support area; 38-loose support area; 4-outer cover protection assembly; 41-outer cover shell; 42-second avoidance slot; 43-flow port; 44-guide shell; 45-guide plate; 46-guide groove; 47-blade; 48-sleeve. DETAILED DESCRIPTION

[0035] The technical solutions in the embodiments of the present application will be described below in conjunction with the drawings in the embodiments of the present application.

[0036] In order to make the purpose, technical solutions and advantages of the implementation methods of this application clearer, the technical solutions in the implementation methods of this application will be clearly and completely described below in conjunction with the drawings in the implementation methods of this application. Obviously, the described implementation methods are part of the implementation methods of this application, not all of the implementation methods. Based on the implementation methods in this application, all other implementation methods obtained by ordinary technicians in this field without creative work are within the scope of protection of this application.

[0037] Therefore, the following detailed description of the embodiments of the present application provided in the accompanying drawings is not intended to limit the scope of the present application for protection, but merely represents the selected embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without creative work are within the scope of protection of the present application.

[0038] A wafer carrier according to an embodiment of the present application is described below with reference to the accompanying drawings.

[0039] See also Figure 1-Figure 11 According to an embodiment of the present application, a wafer carrier includes: a wafer carrying component 1, a rolling drive component 2 and a rolling upper pressure component 3.

[0040] Among them, multiple groups of wafers are placed inside the wafer carrier assembly 1, and the internal wafers are limited by rolling the upper pressing assembly 3, and then the wafer carrier assembly 1 is transferred to the cleaning tank of the cleaning equipment, and the rack of the cleaning equipment fixes the wafer carrier assembly 1. When the cleaning equipment drives the wafer carrier assembly 1 to move up and down to clean the wafers inside the wafer carrier assembly 1, the wafers in the wafer carrier assembly 1 can be rotated through the cooperation of the rolling driving assembly 2, so that the entire wafer can be cleaned, thereby improving the cleaning quality of the wafer.

[0041] See also Figure 2-Figure 5 The wafer bearing assembly 1 includes a box frame 11 and a bottom rolling support part 12. The bottom rolling support part 12 is installed on the bottom side of the box frame 11. The box frame 11 is provided with placement grooves 13 for placing wafers on both sides. One side of the box frame 11 is provided with an arc groove 14 connected to the placement groove 13. The rolling drive assembly 2 includes a floating plate 21, a rotating shaft 22, a fixed support part 25 and a bar shell 26. The fixed support part 25 is installed on the side of the box frame 11. The rotating shaft 22 is rotatably arranged with the fixed support part 25, and a wheel 23 corresponding to the placement groove 13 is fixedly sleeved on the outside of the rotating shaft 22. A rotating connection part 24 is provided at the end of the rotating shaft 22. The bottom and top of the inclined bar shell 26 are respectively connected to a lower rod 27 and an upper rod 28. The floating plate 21 is fixedly connected to the bottom end of the lower rod 27. The lower rod 27 and the upper rod 28 are movably arranged to penetrate the fixed support part 25 in the vertical direction. The rolling upper pressure assembly 3 is installed on the box frame 11 to limit the wafer.

[0042] Multiple groups of wafers are sequentially placed in the placement groove 13 inside the cassette rack 11, and the internal wafers are limited by the rolling upper pressing assembly 3, and then the cassette rack 11 is transferred to the cleaning tank of the cleaning equipment, and the cassette rack 11 is fixed by the hanging bracket of the cleaning equipment. When the cleaning equipment drives the cassette rack 11 to move up and down to clean the wafers inside the cassette rack 11, the surface of the wafer exposed outside the placement groove 13 can directly contact with the cleaning liquid inside the cleaning tank and be cleaned. When the cassette rack 11 moves up and down, the floating plate 21 in the rolling driving assembly 2 also drives the bar shell 26 to move back and forth in the vertical direction relative to each other through the lower rod 27. Specifically, when the cassette rack 11 moves downward or upward, the floating plate 21 will form a displacement difference with the cassette rack 11 due to the resistance of water, and this displacement difference will rotate around the internal path of the bar shell 26 through one end of the rotating connection part 24, and the other end of the rotating connection part 24 will drive the rotating shaft 22 to rotate. The wheel 23 protrudes into the arc groove 14 near the side of the cassette rack 11, and the outer side of the wheel 23 contacts the outer side of the wafer. The rotating shaft 22 drives the outer wheel 23 to rotate, that is, drives the wafer inside the cassette rack 11 to rotate. While the wafer inside the cassette rack 11 is reciprocating up and down to be cleaned, the wafer area located inside the placement groove 13 can complete the rotation without additional power while the cassette rack 11 is reciprocating up and down, and the wafer area inside the placement groove 13 will be released and cleaned as it rotates, so that the wafer inside the cassette rack 11 can be completely cleaned, thereby improving the wafer cleaning quality.

[0043] For specific settings, see Figure 3 , the bottom rolling support part 12 includes a support plate 121 and a lower roller 122. The support plate 121 is integrally formed and fixed at the end of the box frame 11, and the end of the lower roller 122 is rotatably connected to the support plate 121. The outside of the lower roller 122 is provided with a first roller groove 123 corresponding to the placement groove 13. The lower roller 122 on one side of the support plate 121 is arranged in two groups, which are respectively used to support and drag the bottom two sides of the wafer inside the box frame 11, and cooperate with the wheel 23 to realize the smooth rotation of the wafer inside the box frame 11. The setting of the first roller groove 123 on the outside of the lower roller 122 is used to limit and cooperate with each wafer, so that the wafer placed in the placement groove 13 is not prone to deviation when rotating, that is, the stability of the wafer during rotation is improved.

[0044] In the above specific implementation, please refer to Figure 6 and Figure 8The fixed support part 25 includes a seat frame 251, a side frame 252, an elastic support member 253 and a second seat block 255. The seat frame 251 and the side frame 252 are slidably arranged in a vertical position, and the elastic support member 253 connects the seat frame 251 and the side frame 252. The top and bottom ends of the side frame 252 are both provided with a limit ring 254, the second seat block 255 is fixed to one side of the side frame 252, and the end of the rotating shaft 22 is rotatably arranged with the second seat block 255. The rolling upper pressing assembly 3 includes a support arm 31, an upper roller 32 and a support block 35. The support block 35 is fixed to the side of the box frame 11, and the upper roller 32 is rotatably set at the top of the two support arms 31. The support block 35 is rotatably installed with the support arm 31 through the pin shaft 36. The bottom of the support arm 31 is respectively provided with a downward support area 37 and a loosening support area 38 that engage with the top of the side frame 252. A first avoidance groove 15 is set on the upper edge of one side of the box frame 11, and a handle 34 is set on the outside of the two support arms 31.

[0045] When no wafer is placed in the cassette 11, the loose support area 38 of the support arm 31 in the rolling upper pressure assembly 3 is located at the top of the side frame 252, that is, the loose support area 38 at the bottom of the support arm 31 is close to the top of the side frame 252, and the elastic support member 253 is in a compressed state. When the wafer is placed in the cassette 11, the operator pulls the handle 34 to one side of the cassette 11, and the pulled handle 34 will drive the support arm 31 and the upper roller 32 to rotate around the pin 36 on one side of the support block 35 until the downward pressure support area 37 at the bottom of the support arm 31 moves to the top of the side frame 252, and the outer surface of the upper roller 32 just contacts the side of the area above the wafer, which is used to limit the wafer placed in the cassette 11 and improve the stability of the wafer when it rotates in the cassette 11.

[0046] When the loose support area 38 at the bottom of the support arm 31 is in contact with the top of the side frame 252, the wheel 23 outside the rotating shaft 22 will not contact the outer ring of the wafer inside the placement slot 13, that is, there is a certain small distance between the wheel 23 and the outer ring of the wafer. When the support arm 31 rotates to drive the upper roller 32 to contact the outer ring surface of the wafer, the elastic support member 253 at this time relaxes the elastic force to support the side frame 252 to move slightly upward, so that the top of the side frame 252 is stably pressed against the downward support area 37 at the bottom of the support arm 31. At the same time, a slight upward movement of the side frame 252 will also drive the second seat block 255 and the rotating shaft 22 to move upward. The upward moving rotating shaft 22 will drive the external wheel plate 23 to move upward, so that the outer ring of the wheel plate 23 can avoid rigid overpressure contact with the outer ring surface of the wafer protruding in the arc groove 14. At this time, when the second roller groove 33 cooperates with the roller 32 to drive the wafer to rotate, excessive squeezing of the wafer inside the box rack 11 can be avoided, that is, the wafer inside the box rack 11 also has a better protection effect when rotating.

[0047] Furthermore, the upper roller 32 is provided with a second roller groove 33 corresponding to the placement groove 13 on a one-to-one basis. The second roller groove 33 on the upper roller 32 is used to limit the wafer inside the box frame 11 to rotate more stably.

[0048] For details, please refer to Figure 7 The elastic support member 253 includes a pin rod 2531, a spring 2532, a first seat block 2533 and a fixed block 2535. The fixed block 2535 is integrally formed and fixed with the seat frame 251, and the pin rod 2531 is integrally formed and fixed above the fixed block 2535. The first seat block 2533 is connected to the side frame 252, and the top end of the pin rod 2531 movably passes through the first seat block 2533. The spring 2532 is sleeved outside the pin rod 2531, and a limit cover 2534 is provided at the top end of the pin rod 2531. The spring 2532 in the elastic support member 253 cooperates with the pin rod 2531 and the first seat block 2533 to elastically support the side frame 252.

[0049] For specific settings, see Figure 5 The rotating connection part 24 includes a connecting strip 241 and a shaft 242. The two ends of the connecting strip 241 are respectively connected to one end of the rotating shaft 22 and one end of the shaft 242, and the other end of the shaft 242 moves inside the strip housing 26. When the strip housing 26 and the shaft 242 move up and down, and at the same time, the shaft 242 drives the rotating shaft 22 to rotate through the connecting strip 241, that is, drives the wheel 23 outside the rotating shaft 22 to rotate.

[0050] For further information, see Figure 7 The rolling drive assembly 2 also includes a top block 29, which is arranged at the top of the upper rod 28. The top block 29 is fixed to the top of the upper rod 28 by screwing. The top block 29 is used to limit the upper rod 28 and the lower rod 27 to move stably along the axial direction inside the limiting ring 254.

[0051] The above-mentioned wafer carrier lacks a certain protective effect on the components in the rolling drive assembly 2 on one side of the box frame 11.

[0052] See also Figure 1 , Fig. 9 , Fig.10 and Fig.11The wafer carrier also includes an outer cover protection component 4, and the outer cover protection component 4 includes an outer cover shell 41. The outer cover shell 41 is located outside the rolling drive component 2 and connected to the side of the box frame 11. The outer cover shell 41 and the box frame 11 can be fixedly installed by screws. A flow port 43 is provided on the side of the outer cover shell 41, and a second avoidance slot 42 that penetrates and cooperates with the support arm 31 is provided above the outer cover shell 41. The outer cover protection component 4 also includes a guide shell 44, a guide plate 45, a blade 47 and a sleeve 48. The sleeve 48 fixes the outside of the rotating shaft 22 between adjacent wheel discs 23, and a plurality of groups of blades 47 are distributed in an annular array outside the sleeve 48. The guide shell 44 is located outside the flow port 43 and fixed to the outer cover shell 41. The guide plate 45 is installed inside the guide shell 44, and the guide plate 45 is provided with an inclined guide groove 46 corresponding to the sleeve 48.

[0053] The outer cover protection component 4 in the outer cover protection component 4 is arranged outside the rolling drive component 2, which can play a good protective role for the components in the rolling drive component 2. The flow port 43 on one side of the outer cover shell 41 is used to adjust the water pressure inside the outer cover shell 41, which can ensure that the floating plate 21 can stably reciprocate in the vertical direction. That is, when the floating plate 21 moves upward inside the outer cover shell 41, the water inside the outer cover shell 41 that is over-pressurized will be discharged through the flow port 43 on one side of the outer cover shell 41; when the floating plate 21 moves downward inside the outer cover shell 41, the water inside the cleaning tank will be replenished into the outer cover shell 41 through the flow port 43, thereby realizing the reciprocating movement of the floating plate 21 in the vertical direction.

[0054] When the cassette rack 11 drives the outer cover shell 41 to move upward, the water source inside the cleaning tank will enter the guide shell 44 through the opening at the top of the guide shell 44. The water source entering the guide shell 44 will flow along the guide groove 46 on the guide plate 45 to the blade 47 outside the impact sleeve 48, which can realize the auxiliary floating plate 21, the rotating connection part 24, the bar shell 26, the lower rod 27, the upper rod 28 and other structures to drive the rotating shaft 22 to rotate, that is, to play the role of assisting the rotation of the wheel 23. Finally, the wheel 23 is driven to rotate simultaneously by two methods, that is, the wheel 23 can stably drive the wafer inside the cassette rack 11 to rotate and adjust the wafer position, thereby improving the cleaning quality of the wafer inside the cassette rack 11.

[0055] The guide structure design of the guide plate 45 and the guide groove 46 can make the water source entering the guide shell 44 directly impact a blade 47 outside the sleeve 48 close to the guide plate 45 as much as possible, thereby increasing the force of the water source impacting the blade 47, so that the rotating shaft 22 can be rotated better, and then the wheel 23 can better drive the wafer inside the box rack 11 to rotate.

[0056] The above description is only an embodiment of the present application and is not intended to limit the scope of protection of the present application. For those skilled in the art, the present application may have various changes and variations. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present application should be included in the scope of protection of the present application. It should be noted that similar reference numerals and letters represent similar items in the following drawings, so once an item is defined in one drawing, it does not need to be further defined and explained in the subsequent drawings.

[0057] The above is only a specific implementation of the present application, but the protection scope of the present application is not limited thereto. Any technician familiar with the technical field can easily think of changes or substitutions within the technical scope disclosed in the present application, which should be included in the protection scope of the present application. Therefore, the protection scope of the present application should be based on the protection scope of the claims.

Claims

1. A wafer carrier, characterized in that: include: A wafer carrier assembly (1), the wafer carrier assembly (1) comprising a box frame (11) and a bottom rolling support portion (12), the bottom rolling support portion (12) being mounted on the bottom side of the box frame (11), both sides of the box frame (11) being provided with placement grooves (13) for placing wafers, and one side of the box frame (11) being provided with an arc groove (14) connected to the placement groove (13); A rolling drive assembly (2), the rolling drive assembly (2) comprising a floating plate (21), a rotating shaft (22), a fixed support portion (25) and a strip shell (26), the fixed support portion (25) being mounted on a side of a box frame (11), the rotating shaft (22) and the fixed support portion (25) being rotatably arranged, and a wheel disc (23) corresponding to the placement groove (13) is fixedly sleeved outside the rotating shaft (22), a rotating connection portion (24) is arranged at the end of the rotating shaft (22), the bottom and top of the inclined strip shell (26) are respectively connected to a lower rod (27) and an upper rod (28), the floating plate (21) is fixedly connected to the bottom end of the lower rod (27), and the lower rod (27) and the upper rod (28) are movably arranged to penetrate the fixed support portion (25) in a vertical direction; A rolling upper pressing assembly (3) is installed on the upper limit wafer of the box frame (11).

2. A wafer carrier according to claim 1, characterized in that: The bottom rolling support part (12) comprises a support plate (121) and a lower roller (122); the support plate (121) is fixed to the end of the box frame (11); and the end of the lower roller (122) is rotatably connected to the support plate (121).

3. A wafer carrier according to claim 2, characterized in that: The lower roller (122) is provided with first roller grooves (123) on the outside corresponding to the placement grooves (13).

4. The wafer carrier according to claim 1, characterized in that: The fixed support portion (25) comprises a seat frame (251), a side frame (252), an elastic support member (253) and a second seat block (255); the seat frame (251) and the side frame (252) are arranged to slide in a vertical position, and the elastic support member (253) connects the seat frame (251) and the side frame (252); the top and bottom ends of the side frame (252) are provided with limit rings (254); the second seat block (255) is fixed to one side of the side frame (252), and the end of the rotating shaft (22) is rotatably arranged with the second seat block (255).

5. The wafer carrier according to claim 4, characterized in that: The rolling pressure assembly (3) comprises a support arm (31), an upper roller (32) and a support block (35); the support block (35) is fixed to the side of the box frame (11); the upper roller (32) is rotatably arranged at the top of the two support arms (31); the support block (35) is rotatably installed with the support arm (31) through a pin shaft (36); a downward pressure support area (37) and a loosening support area (38) which are engaged with the top of the side frame (252) are respectively arranged at the bottom of the support arm (31); a first avoidance slot (15) through which the support arm (31) can move is arranged on the upper edge of one side of the box frame (11); and handles (34) are arranged on the outside of the two support arms (31).

6. The wafer carrier according to claim 5, characterized in that: The upper roller (32) is provided with second roller grooves (33) on the outside corresponding to the placement grooves (13).

7. The wafer carrier according to claim 4, characterized in that: The elastic support member (253) comprises a pin rod (2531), a spring (2532), a first seat block (2533) and a fixed block (2535); the fixed block (2535) is fixedly arranged on the seat frame (251); the pin rod (2531) is fixed above the fixed block (2535); the first seat block (2533) is connected to the side frame (252); the top end of the pin rod (2531) movably passes through the first seat block (2533); the spring (2532) is sleeved on the outside of the pin rod (2531); and a limit cover (2534) is arranged on the top end of the pin rod (2531).

8. The wafer carrier according to claim 1, characterized in that: The rotating connection part (24) comprises a connecting strip plate (241) and a shaft rod (242), wherein two ends of the connecting strip plate (241) are respectively connected to one end of the rotating shaft (22) and one end of the shaft rod (242), and the other end of the shaft rod (242) moves inside the strip housing (26).

9. The wafer carrier according to claim 1, characterized in that: The rolling drive assembly (2) further comprises a top block (29), wherein the top block (29) is arranged at the top end of the upper rod (28).

10. The wafer carrier according to claim 5, characterized in that: The invention also comprises an outer cover protection component (4), wherein the outer cover protection component (4) comprises an outer cover shell (41), wherein the outer cover shell (41) is located outside the rolling drive component (2) and connected to the side of the box frame (11), wherein a flow port (43) is arranged on the side of the outer cover shell (41), and a second avoidance slot (42) is arranged above the outer cover shell (41) and is intersected and matched with the support arm (31).

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