Wafer handling apparatus and method

Abstract

The application discloses a wafer conveying device and method, and particularly relates to the technical field of wafer conveying, which comprises a protective cover, a plurality of work station frames are fixedly installed on the outer side of the protective cover, a conveying device is fixedly installed in the protective cover, the conveying device comprises a indexing mechanism, a positioning mechanism is fixedly installed at the end of the indexing mechanism, and a correction mechanism is arranged on the outer side of the positioning mechanism; the indexing mechanism comprises an indexing outer cylinder, the indexing outer cylinder is fixedly installed in the middle part of the inner lower wall of the protective cover, a vertical sliding frame is movably installed at the top of the indexing outer cylinder, and a first rotating shaft is rotatably installed in the middle part of the top end of the vertical sliding frame; the wafer conveying efficiency is improved by setting the conveying device, the wafer conveying efficiency is improved, the plurality of wafers can be positioned, adsorbed, conveyed and placed between the plurality of work station frames, the plurality of wafers can be positionally corrected, the wafers can be accurately placed on the machining table in the subsequent process, and the use effect of the whole wafer conveying device is improved.

Description

Technical Field

[0001] This invention relates to the field of wafer handling technology, specifically to a wafer handling device and method. Background Technology

[0002] A wafer is a thin circular piece used in semiconductor manufacturing to produce integrated circuits. It is usually made of single-crystal silicon. The diameter of a wafer can range from a few inches to twelve inches, and its thickness is usually between a few hundred micrometers and one millimeter. Wafers undergo a series of complex processes, such as photolithography, etching and ion implantation, to ultimately form the required circuit structure.

[0003] During wafer processing, wafers need to be handled. Traditional wafer handling methods mostly use Bernoulli chucks for non-contact adsorption and handling. However, the adsorption and handling process lacks positioning, and subsequent placement on the processing table requires auxiliary positioning to accurately place the wafer, which is quite cumbersome. Furthermore, each handling operation can only handle one wafer at a time, resulting in low efficiency. Therefore, we propose a wafer handling device and method to solve the above problems. Summary of the Invention

[0004] The purpose of this invention is to provide a wafer handling apparatus and method to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: a wafer handling device, comprising a protective cover, a plurality of workstation frames fixedly installed on the outer side of the protective cover, a handling device fixedly installed in the protective cover, the handling device comprising a rotation mechanism, a positioning mechanism fixedly installed at the end of the rotation mechanism, and a correction mechanism provided on the outer side of the positioning mechanism;

[0006] The indexing mechanism includes an indexing outer cylinder, which is fixedly installed in the middle of the inner lower wall of the protective cover. A longitudinal sliding frame is movably installed on the top of the indexing outer cylinder. A first rotating shaft is rotatably installed at the top center of the longitudinal sliding frame. A first indexing arm is fixedly installed on the top of the first rotating shaft. A second rotating shaft is rotatably installed at the end of the first indexing arm away from the first rotating shaft. A large sprocket is provided on the inner side of the end of the first indexing arm near the first rotating shaft. The large sprocket is movably sleeved on the outside of the first rotating shaft. A first sleeve is fixedly installed at the bottom center of the large sprocket. The bottom end of the first sleeve extends out of the bottom end of the first indexing arm and is fixedly installed at the top center of the longitudinal sliding frame. The first rotating shaft movably passes through the first sleeve. A small sprocket is fixedly installed at the bottom of the second rotating shaft. A first chain is meshed with the outer sides of the large sprocket and the small sprocket.

[0007] A second indexing arm is fixedly mounted on the top end of the second pivot. A third pivot is rotatably mounted on the end of the second indexing arm away from the second pivot. A first sprocket is provided on the inner side of the end of the second indexing arm near the second pivot. The first sprocket is movably sleeved on the outer side of the second pivot. A second sleeve is fixedly mounted on the middle of the bottom end of the first sprocket. The bottom end of the second sleeve extends out of the bottom end of the second indexing arm and is fixedly mounted on the top end of the first indexing arm. The second pivot moves through the second sleeve. A second sprocket is fixedly mounted on the bottom of the third pivot. A second chain is meshed with the outer sides of the first sprocket and the second sprocket. A third indexing arm is fixedly mounted on the top end of the third pivot.

[0008] As a preferred embodiment of the present invention, the number of teeth on the large sprocket is twice the number of teeth on the small sprocket, and the number of teeth on the first sprocket and the second sprocket is the same.

[0009] As a preferred embodiment of the present invention, a first bearing is fixedly mounted on the top inner side of the indexing outer cylinder, a rotating sleeve is fixedly mounted on the middle part of the first bearing, the longitudinal sliding frame is slidably engaged in the middle part of the rotating sleeve, a fourth shaft is rotatably mounted on the top side of the indexing outer cylinder away from the rotating sleeve, a first transmission wheel is fixedly mounted on the top of the rotating sleeve, a second transmission wheel is fixedly mounted on the top of the fourth shaft, a transmission belt is movably sleeved on the outer sides of the first and second transmission wheels, a lifting cylinder is fixedly mounted on the lower inner wall of the indexing outer cylinder, a second bearing is fixedly mounted on the driving end of the lifting cylinder, and the second bearing is fixedly engaged in the middle part of the bottom end of the longitudinal sliding frame.

[0010] As a preferred embodiment of the present invention, the positioning mechanism includes a longitudinal sliding frame, a plurality of longitudinal sliding seats are equidistantly distributed in the longitudinal sliding frame, a connecting shaft is fixedly mounted in the middle of each longitudinal sliding seat, a Bernoulli suction cup body is fixedly mounted at one end of each connecting shaft, a U-shaped sliding frame is fixedly mounted on the side of the longitudinal sliding frame away from the Bernoulli suction cup body, the positioning mechanism is vertically mounted at the end of the third indexing arm through the bottom of the U-shaped sliding frame, an equidistant adjustment plate is slidably mounted on the inner side of the U-shaped sliding frame, an equidistant adjustment groove corresponding to the connecting shaft is opened on the equidistant adjustment plate, and the connecting shaft is slidably engaged in the corresponding equidistant adjustment groove.

[0011] As a preferred embodiment of the present invention, a telescopic rod is fixedly installed in the middle of the side of the U-shaped sliding frame away from the longitudinal sliding outer frame, and a drive frame is fixedly installed at the drive end of the telescopic rod. The drive frame is fixedly installed in the middle of the equidistant adjustment plate.

[0012] In a preferred embodiment of the present invention, the correction mechanism includes an L-shaped bracket and a U-shaped rotating frame. The L-shaped bracket is fixedly installed on the top of the longitudinal sliding outer frame. Two U-shaped rotating frames are symmetrically distributed and fixedly installed on the top of the longitudinal sliding outer frame and the U-shaped sliding frame. The U-shaped rotating frames and the L-shaped bracket are vertically distributed. A translational slide cylinder is movably mounted on the top of the L-shaped bracket. A first positioning rod is vertically mounted on one end of the translational slide cylinder. The first positioning rod is slidably engaged with the side of the plurality of Bernoulli suction cup bodies near the longitudinal sliding outer frame. A threaded connection is installed on the end of the translational slide cylinder away from the first positioning rod. A translation screw is provided, with a rotating seat rotatably mounted at the end of the translation screw away from the translation slide cylinder. The rotating seat is fixedly mounted at the top of the longitudinal sliding frame. A rotating shaft is rotatably mounted at the end of the U-shaped rotating frame away from the U-shaped slide frame. A positioning frame is fixedly mounted at the bottom of each rotating shaft. A second positioning rod is vertically mounted at the end of each positioning frame away from the rotating shaft. A transmission gear is fixedly mounted in the middle of each rotating shaft. A transmission rack is meshed with the outer side of each transmission gear. An auxiliary frame is vertically mounted at the end of each transmission rack away from the transmission gear. The auxiliary frame is fixedly mounted on the outer side of the translation slide cylinder.

[0013] As a preferred embodiment of the present invention, a first motor is fixedly installed on the top inner side of the longitudinal sliding frame, and the drive end of the first motor and the bottom end of the first rotating shaft are fixedly installed.

[0014] As a preferred embodiment of the present invention, a second motor is fixedly installed on the side of the top of the indexing outer cylinder away from the rotating sleeve, and the drive end of the second motor and the bottom end of the fourth shaft are fixedly installed.

[0015] As a preferred embodiment of the present invention, a third motor is fixedly installed at the top of the U-shaped sliding frame, and the driving end of the third motor and the end of the translation screw are fixedly installed.

[0016] A method of using a wafer handling device includes the following steps:

[0017] Step 1: By controlling the second motor to drive the fourth shaft to rotate, in conjunction with the transmission of the first transmission wheel, the second transmission wheel and the transmission belt, the rotating sleeve and the longitudinal sliding frame are controlled to rotate, thereby controlling the first indexing arm, the second indexing arm and the third indexing arm to rotate synchronously, and the third indexing arm is rotated to the position of the loading station frame.

[0018] Step 2: Control the first motor to drive the first rotating shaft to rotate, thereby controlling the first indexing arm to rotate at a certain angle around the first rotating shaft. In conjunction with the limiting and fixing of the large sprocket and the meshing drive of the first chain, and the fact that the number of teeth of the large sprocket is twice that of the small sprocket, drive the second rotating shaft to rotate in the opposite direction, thereby synchronously controlling the second indexing arm to rotate in the opposite direction at twice the angle around the second rotating shaft. This allows the end of the second indexing arm away from the first indexing arm to move in a straight line along the diameter path.

[0019] When the second indexing arm rotates synchronously and at the same angle in the opposite direction around the second axis, it works in conjunction with the limiting and fixing of the first sprocket and the meshing drive of the second sprocket. The first and second sprockets have the same number of teeth, driving the third axis to rotate in the opposite direction. This controls the third indexing arm to rotate synchronously and at the same angle around the third axis, so that the third indexing arm always moves in a straight line along the diameter path, which makes it easier for the third indexing arm to be inserted into the wafer rack in one of the workstation frames in a straight line.

[0020] During this period, the lifting cylinder is controlled to drive the longitudinal sliding frame to rise and fall in the rotating sleeve, thereby controlling the first indexing arm, the second indexing arm and the third indexing arm to rise and fall, flexibly adjusting the height of the positioning mechanism, so that the positioning mechanism can adsorb and position wafers of different heights.

[0021] Step 3: In the positioning mechanism, multiple Bernoulli chuck bodies are placed on the lower surface of the corresponding wafers. By using multiple Bernoulli chuck bodies, multiple wafers can be automatically adsorbed and positioned at one time.

[0022] Step 4: Control the first motor to drive the first rotating shaft to rotate in the opposite direction, so that the third rotary arm can be linearly disengaged from the wafer rack in the workstation frame.

[0023] Step 5: Control the third motor to drive the translation screw to rotate, thereby controlling the translation slide and the first positioning rod to move closer to the wafer. At the same time, drive the auxiliary frame and the transmission rack to move, thereby synchronously driving the transmission racks on both sides, the positioning frame, and the second positioning rod to rotate in opposite directions and contact the rest of the wafer. In conjunction with the movement of the first positioning rod, the wafer is positioned and corrected.

[0024] Step Six: Subsequently, control the first, second, and third indexing arms to synchronously index and rotate them. The third indexing arm is then indexed to the next workstation frame position. Afterward, the wafers with multiple positions corrected are inserted into another workstation frame for processing, realizing the automatic and stable handling and placement of multiple wafers.

[0025] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0026] 1. By setting up a handling device, multiple wafers of different heights can be adsorbed, positioned, handled, and placed between multiple workstation frames, thereby improving the wafer handling efficiency. It can also perform position correction on multiple wafers, making it easier to accurately place the wafers on the processing table later, thus improving the overall effectiveness of the wafer handling device.

[0027] 2. By setting up a positioning mechanism, the spacing between multiple Bernoulli chuck bodies can be flexibly adjusted at equal intervals, making it convenient to use multiple Bernoulli chuck bodies to adsorb and position multiple wafers placed at different intervals, thereby improving the flexibility of the entire device. Attached Figure Description

[0028] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is a schematic diagram of the structure of the present invention.

[0030] Figure 2 This is a schematic diagram showing the structural connection between the protective cover and the handling equipment in this invention.

[0031] Figure 3 This is a schematic diagram of the structural connection of the handling equipment in this invention.

[0032] Figure 4 This is a schematic diagram of the structural connection of the rotation mechanism in this invention.

[0033] Figure 5 For the present invention Figure 4 Enlarged view of point A in the middle.

[0034] Figure 6 For the present invention Figure 4 Enlarged view of point B in the middle.

[0035] Figure 7 This is a schematic diagram of the partial structural connection of the rotation mechanism in this invention.

[0036] Figure 8 This is a schematic diagram of the positioning mechanism in this invention.

[0037] Figure 9 This is a schematic diagram of the correction mechanism in this invention.

[0038] Figure 10 For the present invention Figure 9 Enlarged view of point C in the middle.

[0039] In the diagram: 1. Protective cover; 11. Workstation frame; 2. Handling equipment; 3. Indexing mechanism; 4. Positioning mechanism; 5. Correction mechanism; 31. Indexing outer cylinder; 32. Longitudinal sliding frame; 321. First rotating shaft; 322. First motor; 33. First indexing arm; 331. Second rotating shaft; 332. Large sprocket; 3321. First sleeve; 333. Small sprocket; 334. First chain; 34. Second indexing arm; 341. Third rotating shaft; 342. First sprocket; 3421. Second sleeve; 343. Second sprocket; 344. Second chain; 35. Third indexing arm; 36. First bearing; 361. Rotating sleeve; 37. Fourth shaft; 371. First transmission wheel 372. Second transmission wheel; 373. Transmission belt; 38. Lifting cylinder; 381. Second bearing; 39. Second motor; 41. Longitudinal sliding frame; 42. Longitudinal sliding seat; 43. Connecting shaft; 44. Bernoulli suction cup body; 45. U-shaped sliding frame; 46. Equidistant adjustment plate; 401. Equidistant adjustment groove; 47. Telescopic rod; 471. Drive frame; 51. L-shaped bracket; 52. U-shaped rotating frame; 53. Translation slide cylinder; 531. Translation screw; 532. Rotating seat; 533. Third motor; 54. First positioning rod; 55. Rotating shaft; 551. Positioning frame; 56. Second positioning rod; 57. Transmission gear; 571. Transmission rack; 572. Auxiliary frame. Detailed Implementation

[0040] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0041] Example: Figure 1-10 As shown, the present invention provides a wafer handling device, including a protective cover 1, a plurality of workstation frames 11 fixedly installed on the outer side of the protective cover 1, a handling device 2 fixedly installed in the protective cover 1, the handling device 2 including a shifting mechanism 3, a positioning mechanism 4 fixedly installed at the end of the shifting mechanism 3, and a correction mechanism 5 provided on the outer side of the positioning mechanism 4.

[0042] The indexing mechanism 3 includes an indexing outer cylinder 31, which is fixedly installed in the middle of the inner lower wall of the protective cover 1. A longitudinal sliding frame 32 is movably installed on the top of the indexing outer cylinder 31. The longitudinal sliding frame 32 is convenient to rotate and rise and fall in the indexing outer cylinder 31. A first rotating shaft 321 is rotatably installed in the middle of the top of the longitudinal sliding frame 32. A first motor 322 is fixedly installed on the top of the inner side of the longitudinal sliding frame 32. The drive end of the first motor 322 and the bottom end of the first rotating shaft 321 are fixedly installed.

[0043] A first indexing arm 33 is fixedly mounted on the top of the first rotating shaft 321. A second rotating shaft 331 is rotatably mounted on the end of the first indexing arm 33 away from the first rotating shaft 321. A large sprocket 332 is provided on the inner side of the end of the first indexing arm 33 closest to the first rotating shaft 321. The large sprocket 332 is movably sleeved on the outer side of the first rotating shaft 321. A first sleeve 3321 is fixedly mounted on the middle of the bottom end of the large sprocket 332. The bottom end of the first sleeve 3321 extends out of the bottom end of the first indexing arm 33 and is fixedly mounted on the top middle of the longitudinal sliding frame 32 to fix the large sprocket 332. The first rotating shaft 321 movably passes through the first sleeve 3321. A small sprocket 333 is fixedly mounted on the bottom of the second rotating shaft 331. The number of teeth of the large sprocket 332 is twice the number of teeth of the small sprocket 333. A first chain 334 is meshed with the outer sides of a large sprocket 332 and a small sprocket 333. A second indexing arm 34 is fixedly installed at the top of a second rotating shaft 331. In use, the first motor 322 is activated to drive the first rotating shaft 321 to rotate, thereby controlling the first indexing arm 33 to rotate at a certain angle around the first rotating shaft 321. With the limiting and fixing of the large sprocket 332 and the meshing drive of the first chain 334, and the number of teeth of the large sprocket 332 being twice that of the small sprocket 333, the second rotating shaft 331 is driven to rotate in the opposite direction. This synchronously controls the second indexing arm 34 to rotate in the opposite direction at twice the angle around the second rotating shaft 331, so that the end of the second indexing arm 34 away from the first indexing arm 33 moves in a straight line along the diameter path.

[0044] A third shaft 341 is rotatably mounted on the end of the second indexing arm 34 away from the second shaft 331. A first sprocket 342 is provided on the inner side of the end of the second indexing arm 34 near the second shaft 331. The first sprocket 342 is movably sleeved on the outer side of the second shaft 331. A second sleeve 3421 is fixedly mounted on the middle of the bottom end of the first sprocket 342. The bottom end of the second sleeve 3421 extends out of the bottom end of the second indexing arm 34 and is fixedly mounted on the top end of the first indexing arm 331 to fix the first sprocket 342. The second shaft 331 movably passes through the second sleeve 3421. A second sprocket 343 is fixedly mounted on the bottom of the third shaft 341. A second chain 344 is meshed with the outer sides of the first sprocket 342 and the second sprocket 343. The first sprocket 342 and the second sprocket 343 have the same number of teeth. A third indexing arm 35 is fixedly installed at the top. When the second indexing arm 34 rotates synchronously and at the same angle in the opposite direction around the second rotating shaft 331, it cooperates with the limiting fixation of the first sprocket 342 and the meshing drive of the second sprocket 343. The first sprocket 342 and the second sprocket 343 have the same number of teeth, driving the third rotating shaft 341 to rotate in the opposite direction. This controls the third indexing arm 35 to rotate synchronously and at the same angle around the third rotating shaft 341. As a result, the third indexing arm 35 keeps moving in a straight line along the diameter path, which facilitates the straight insertion of the third indexing arm 35 into the wafer rack in one of the workstation frames 11, and also facilitates the straight detachment of the third indexing arm 35 from the wafer rack in the workstation frame 11. It also facilitates the automatic, straight, and stable transport of the wafer by the third indexing arm 35 to another workstation frame 11 for processing.

[0045] A first bearing 36 is fixedly mounted on the top inner side of the indexing outer cylinder 31. A rotating sleeve 361 is fixedly mounted in the middle of the first bearing 36. A longitudinal sliding frame 32 is slidably engaged in the middle of the rotating sleeve 361. A fourth shaft 37 is rotatably mounted on the top side of the indexing outer cylinder 31 away from the rotating sleeve 361. A first transmission wheel 371 is fixedly mounted on the top of the rotating sleeve 361. A second transmission wheel 372 is fixedly mounted on the top of the fourth shaft 37. A transmission belt 373 is movably sleeved on the outer sides of the first transmission wheel 371 and the second transmission wheel 372. A second motor 39 is fixedly installed on the side of the top of the 31 away from the rotating sleeve 361. The drive end of the second motor 39 is fixedly installed on the bottom end of the fourth shaft 37. By controlling the second motor 39 to drive the fourth shaft 37 to rotate, and in conjunction with the transmission of the first transmission wheel 371, the second transmission wheel 372 and the transmission belt 373, the rotating sleeve 361 and the longitudinal slide frame 32 are controlled to rotate, thereby controlling the first indexing arm 33, the second indexing arm 34 and the third indexing arm 35 to rotate synchronously, and the third indexing arm 35 is rotated to another workstation frame 11 position;

[0046] A lifting cylinder 38 is fixedly installed on the lower inner wall of the indexing outer cylinder 31. A second bearing 381 is fixedly installed on the drive end of the lifting cylinder 38. The second bearing 381 is fixedly snapped into the middle of the bottom end of the longitudinal slide frame 32. By controlling the opening of the lifting cylinder 38, the longitudinal slide frame 32 is driven to rise and fall in the rotating sleeve 361, thereby controlling the first indexing arm 33, the second indexing arm 34 and the third indexing arm 35 to rise and fall, flexibly adjusting the height of the positioning mechanism 4, so that the subsequent positioning mechanism 4 can adsorb, position, transport and place wafers of different heights.

[0047] The positioning mechanism 4 includes a longitudinal sliding frame 41, in which multiple longitudinal sliding seats 42 are equidistantly distributed and slidably mounted. A connecting shaft 43 is fixedly mounted in the middle of each longitudinal sliding seat 42, and a Bernoulli chuck body 44 is fixedly mounted at one end of each connecting shaft 43. By using multiple Bernoulli chuck bodies 44, multiple wafers can be automatically adsorbed and positioned for transport at one time, thereby improving the wafer transport efficiency.

[0048] A U-shaped slide frame 45 is fixedly installed on the side of the longitudinal sliding frame 41 away from the Bernoulli suction cup body 44. The positioning mechanism 4 is vertically installed at the end of the third indexing arm 35 through the bottom of the U-shaped slide frame 45. An equidistant adjustment plate 46 is horizontally slidably engaged on the inner side of the U-shaped slide frame 45. An equidistant adjustment groove 401 corresponding to the connecting shaft 43 is opened on the equidistant adjustment plate 46. The connecting shaft 43 is slidably engaged in the corresponding equidistant adjustment groove 401. A telescopic rod 47 is fixedly installed in the middle of the side of the U-shaped slide frame 45 away from the longitudinal sliding frame 41. A drive frame 471 is fixedly installed at the drive end of the telescopic rod 47. The drive frame 471 is fixedly installed in the middle of the equidistant adjustment plate 46. In use, the telescopic rod is opened by controlling the telescopic rod. The lever 47 drives the drive frame 471 to control the horizontal movement of the equidistant adjustment plate 46, which, in conjunction with the connecting shaft 43, slides and engages in the corresponding equidistant adjustment slot 401, thereby controlling the multiple Bernoulli suction cup bodies 44 to separate at equal distances. Conversely, controlling the opening telescopic lever 47 drives the drive frame 471 to control the equidistant adjustment plate 46 to move horizontally in the opposite direction, which, in conjunction with the connecting shaft 43, slides and engages in the corresponding equidistant adjustment slot 401, thereby controlling the multiple Bernoulli suction cup bodies 44 to approach at equal distances. This allows for flexible and equidistant adjustment of the spacing between the multiple Bernoulli suction cup bodies 44, facilitating the adsorption and positioning of multiple wafers placed at different distances using multiple Bernoulli suction cup bodies 44, thus improving the flexibility of the entire device.

[0049] The correction mechanism 5 includes an L-shaped bracket 51 and a U-shaped rotating frame 52. The L-shaped bracket 51 is fixedly installed on the top of the longitudinal sliding outer frame 41. Two U-shaped rotating frames 52 are symmetrically distributed and fixedly installed on the top of the longitudinal sliding outer frame 41 and the U-shaped sliding frame 45. The U-shaped rotating frames 52 and the L-shaped bracket 51 are vertically distributed. A translational slide cylinder 53 is movably attached to the top of the L-shaped bracket 51. A first positioning rod 54 is vertically installed at one end of the translational slide cylinder 53. The first positioning rod 54 is slidably engaged with the side of the multiple Bernoulli suction cup bodies 44 near the longitudinal sliding outer frame 41. A translational screw 531 is threadedly installed at the end of the translational slide cylinder 53 away from the first positioning rod 54. A rotating seat 532 is rotatably mounted on the end of the translation screw 531 away from the translation slide cylinder 53. The rotating seat 532 is fixedly mounted on the top of the longitudinal sliding frame 41. A third motor 533 is fixedly mounted on the top of the U-shaped slide frame 45. The driving end of the third motor 533 is fixedly mounted on the end of the translation screw 531. The third motor 533 is turned on to drive the translation screw 531 to rotate, thereby controlling the translation slide cylinder 53 and the first positioning rod 54 to move towards the side closer to the wafer. Conversely, the third motor 533 is turned on to drive the translation screw 531 to rotate in the opposite direction, thereby controlling the translation slide cylinder 53 and the first positioning rod 54 to move away from the wafer.

[0050] A rotating shaft 55 is rotatably mounted on the end of the U-shaped rotating frame 52 away from the U-shaped sliding frame 45. A positioning frame 551 is fixedly mounted on the bottom of each rotating shaft 55. A second positioning rod 56 is vertically mounted on the end of each positioning frame 551 away from the rotating shaft 55. A transmission gear 57 is fixedly mounted in the middle of each rotating shaft 55. A transmission rack 571 is meshed with the outer side of each transmission gear 57. An auxiliary frame 572 is vertically mounted on the end of each transmission rack 571 away from the transmission gear 57. The auxiliary frame 572 is fixedly mounted on the outer side of the translation slide cylinder 53. When the translation slide cylinder 53 is controlled to move towards the side closer to the wafer, the drive... The auxiliary frame 572 and the transmission rack 571 move, thereby synchronously driving the two sides of the transmission rack 571, the positioning frame 551, and the second positioning rod 56 to rotate in opposite directions and contact the rest of the wafer. In conjunction with the movement of the first positioning rod 54, the wafer is positioned and corrected, which facilitates the precise placement of the wafer on the processing table and improves the overall efficiency of the wafer handling device. Conversely, when the control translation slide 53 moves to the side away from the wafer, the auxiliary frame 572 and the transmission rack 571 are driven to move in the opposite direction, thereby synchronously driving the two sides of the transmission rack 571, the positioning frame 551, and the second positioning rod 56 to rotate and fold in opposite directions.

[0051] A method of using a wafer handling device includes the following steps:

[0052] Step 1: By controlling the second motor 39 to drive the fourth shaft 37 to rotate, and cooperating with the transmission of the first transmission wheel 371, the second transmission wheel 372 and the transmission belt 373, the rotating sleeve 361 and the longitudinal sliding frame 32 are controlled to rotate, thereby controlling the first indexing arm 33, the second indexing arm 34 and the third indexing arm 35 to rotate synchronously, and the third indexing arm 35 is indexed to the position of the loading station frame 11;

[0053] Step 2: Control the first motor 322 to drive the first rotating shaft 321 to rotate, thereby controlling the first indexing arm 33 to rotate around the first rotating shaft 321 at a certain angle. This is coordinated with the limiting and fixing of the large sprocket 332 and the meshing drive of the first chain 334. The large sprocket 332 has twice the number of teeth as the small sprocket 333. This drives the second rotating shaft 331 to rotate in the opposite direction, thereby synchronously controlling the second indexing arm 34 to rotate in the opposite direction around the second rotating shaft 331 at twice the angle. This allows the end of the second indexing arm 34 away from the first indexing arm 33 to move linearly along the diameter path.

[0054] When the second indexing arm 34 rotates synchronously and at the same angle in the opposite direction around the second rotating shaft 331, it cooperates with the limiting and fixing of the first sprocket 342 and the meshing drive of the second sprocket 343. The first sprocket 342 and the second sprocket 343 have the same number of teeth, driving the third rotating shaft 341 to rotate in the opposite direction, thereby controlling the third indexing arm 35 to rotate synchronously and at the same angle around the third rotating shaft 341. This allows the third indexing arm 35 to maintain a straight movement along the diameter path, making it easier for the third indexing arm 35 to be inserted linearly into the wafer rack in one of the workstation frames 11.

[0055] During this period, the lifting cylinder 38 is controlled to drive the longitudinal sliding frame 32 to rise and fall in the rotating sleeve 361, thereby controlling the first indexing arm 33, the second indexing arm 34 and the third indexing arm 35 to rise and fall, flexibly adjusting the height of the positioning mechanism 4, so that the positioning mechanism 4 can adsorb and position wafers of different heights.

[0056] Step 3: In the positioning mechanism 4, multiple Bernoulli chuck bodies 44 are placed on the lower surface of the corresponding wafers. By using multiple Bernoulli chuck bodies 44, multiple wafers can be automatically adsorbed and positioned at one time.

[0057] Step 4: Control the first motor 322 to drive the first rotating shaft 321 to rotate in the opposite direction, so that the third rotating arm 35 can be linearly disengaged from the wafer rack in the workstation frame 11.

[0058] Step 5: Control the third motor 533 to drive the translation screw 531 to rotate, thereby controlling the translation slide 53 and the first positioning rod 54 to move closer to the wafer. At the same time, drive the auxiliary frame 572 and the transmission rack 571 to move, thereby synchronously driving the two transmission racks 571, the positioning frame 551 and the second positioning rod 56 to rotate in opposite directions and contact the rest of the wafer. In conjunction with the movement of the first positioning rod 54, the wafer is positioned and corrected.

[0059] Step 6: Subsequently, control the first indexing arm 33, the second indexing arm 34 and the third indexing arm 35 to index synchronously, and index the third indexing arm 35 to the position of the next work station frame 11. Then, insert the wafers after multiple position corrections into another work station frame 11 for processing, so as to realize the automatic and stable handling and placement of multiple wafers.

[0060] Although embodiments of the invention have been shown and described, it will be understood by those skilled in the art that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of the invention, the scope of which is defined by the appended claims and their equivalents.

Claims

1. A wafer handling device, comprising a protective cover (1), characterized in that: Multiple workstation frames (11) are fixedly installed on the outside of the protective cover (1). A handling device (2) is fixedly installed in the protective cover (1). The handling device (2) includes a rotation mechanism (3). A positioning mechanism (4) is fixedly installed at the end of the rotation mechanism (3). A correction mechanism (5) is provided on the outside of the positioning mechanism (4). The indexing mechanism (3) includes an indexing outer cylinder (31), which is fixedly installed in the middle of the inner lower wall of the protective cover (1). A longitudinal sliding frame (32) is movably installed on the top of the indexing outer cylinder (31). A first rotating shaft (321) is rotatably installed at the middle of the top of the longitudinal sliding frame (32). A first indexing arm (33) is fixedly installed on the top of the first rotating shaft (321). A second rotating shaft (331) is rotatably installed at the end of the first indexing arm (33) away from the first rotating shaft (321). A large sprocket (3) is provided on the inner side of the end of the first indexing arm (33) near the first rotating shaft (321). 32) The large sprocket (332) is movably sleeved on the outside of the first rotating shaft (321). The bottom center of the large sprocket (332) is fixedly installed with a first sleeve (3321). The bottom end of the first sleeve (3321) extends out of the bottom end of the first indexing arm (33) and is fixedly installed at the top center of the longitudinal sliding frame (32). The first rotating shaft (321) movably passes through the first sleeve (3321). The bottom of the second rotating shaft (331) is fixedly installed with a small sprocket (333). The outer sides of the large sprocket (332) and the small sprocket (333) are meshed with a first chain (334). A second indexing arm (34) is fixedly mounted on the top end of the second rotating shaft (331). A third rotating shaft (341) is rotatably mounted on the end of the second indexing arm (34) away from the second rotating shaft (331). A first sprocket (342) is provided on the inner side of the end of the second indexing arm (34) near the second rotating shaft (331). The first sprocket (342) is movably sleeved on the outer side of the second rotating shaft (331). A second sleeve (3421) is fixedly mounted on the middle of the bottom end of the first sprocket (342). The bottom end of the second sleeve (3421) extends out to the bottom end of the second indexing arm (34) and is fixedly installed on the top end of the first indexing arm (33). The second rotating shaft (331) movably passes through the second sleeve (3421). The bottom of the third rotating shaft (341) is fixedly installed with a second sprocket (343). The outer sides of the first sprocket (342) and the second sprocket (343) are meshed with a second chain (344). The top end of the third rotating shaft (341) is fixedly installed with a third indexing arm (35). The inner top of the indexing outer cylinder (31) is fixedly fitted with a first bearing (36), and a rotating sleeve (361) is fixedly fitted in the middle of the first bearing (36). The longitudinal sliding frame (32) is slidably fitted in the middle of the rotating sleeve (361). A fourth shaft (37) is rotatably installed on the top side of the indexing outer cylinder (31) away from the rotating sleeve (361). A first transmission wheel (371) is fixedly installed on the top of the rotating sleeve (361), and a second transmission wheel (372) is fixedly installed on the top of the fourth shaft (37). A transmission belt (373) is movably fitted on the outer side of the first transmission wheel (371) and the second transmission wheel (372). A lifting cylinder (38) is fixedly installed on the lower inner wall of the indexing outer cylinder (31). A second bearing (381) is fixedly installed on the driving end of the lifting cylinder (38), and the second bearing (381) is fixedly fitted in the middle of the bottom end of the longitudinal sliding frame (32). The positioning mechanism (4) includes a longitudinal sliding frame (41), in which a plurality of longitudinal sliding seats (42) are equidistantly distributed. A connecting shaft (43) is fixedly mounted in the middle of each longitudinal sliding seat (42). A Bernoulli suction cup body (44) is fixedly mounted at one end of each connecting shaft (43). A U-shaped sliding frame (45) is fixedly mounted on the side of the longitudinal sliding frame (41) away from the Bernoulli suction cup body (44). The positioning mechanism (4) is vertically mounted at the end of the third rotary arm (35) through the bottom of the U-shaped sliding frame (45). An equidistant adjustment plate (46) is horizontally slidably mounted on the inner side of the U-shaped sliding frame (45). An equidistant adjustment groove (401) corresponding to the connecting shaft (43) is opened on the equidistant adjustment plate (46). The connecting shaft (43) is slidably engaged in the corresponding equidistant adjustment groove (401). The correction mechanism (5) includes an L-shaped bracket (51) and a U-shaped rotating frame (52). The L-shaped bracket (51) is fixedly installed on the top of the longitudinal sliding outer frame (41). The U-shaped rotating frame (52) has two symmetrically distributed parts. The two U-shaped rotating frames (52) are fixedly installed on the top of the longitudinal sliding outer frame (41) and the U-shaped sliding frame (45). The U-shaped rotating frame (52) and the L-shaped bracket (51) are vertically distributed. The top of the L-shaped bracket (51) is movably fitted with a translational slide cylinder (53). One end of the translational slide cylinder (53) is vertically fitted with a first positioning rod (54). The first positioning rod (54) is slidably engaged with the side of the multiple Bernoulli suction cup bodies (44) near the longitudinal sliding outer frame (41). The end of the translational slide cylinder (53) away from the first positioning rod (54) is threaded with a translational screw (531). 1) A rotating seat (532) is rotatably installed at the end away from the translation slide (53). The rotating seat (532) is fixedly installed at the top of the longitudinal sliding frame (41). A rotating shaft (55) is rotatably installed at the end of the U-shaped rotating frame (52) away from the U-shaped slide (45). A positioning frame (551) is fixedly installed at the bottom of the rotating shaft (55). A second positioning rod (56) is vertically installed at the end of the positioning frame (551) away from the rotating shaft (55). A transmission gear (57) is fixedly installed in the middle of the rotating shaft (55). A transmission rack (571) is meshed with the outer side of the transmission gear (57). An auxiliary frame (572) is vertically installed at the end of the transmission rack (571) away from the transmission gear (57). The auxiliary frame (572) is fixedly installed on the outer side of the translation slide (53).

2. The wafer handling device according to claim 1, characterized in that: The number of teeth of the large sprocket (332) is twice the number of teeth of the small sprocket (333), and the number of teeth of the first sprocket (342) and the second sprocket (343) is the same.

3. The wafer handling device according to claim 2, characterized in that: A telescopic rod (47) is fixedly installed on the middle of the side of the U-shaped sliding frame (45) away from the longitudinal sliding outer frame (41). A drive frame (471) is fixedly installed on the drive end of the telescopic rod (47). The drive frame (471) is fixedly installed in the middle of the equidistant adjustment plate (46).

4. A wafer handling device according to claim 3, characterized in that: The first motor (322) is fixedly installed on the top inner side of the longitudinal sliding frame (32), and the drive end of the first motor (322) and the bottom end of the first rotating shaft (321) are fixedly installed.

5. A wafer handling device according to claim 4, characterized in that: A second motor (39) is fixedly installed on the side of the top of the indexing outer cylinder (31) away from the rotating sleeve (361), and the drive end of the second motor (39) and the bottom end of the fourth shaft (37) are fixedly installed.

6. A wafer handling device according to claim 5, characterized in that: A third motor (533) is fixedly installed at the top of the U-shaped sliding frame (45), and the driving end of the third motor (533) and the end of the translation screw (531) are fixedly installed.

7. A method of using the wafer handling apparatus according to any one of claims 6, characterized in that, Includes the following steps: Step 1: By controlling the second motor (39) to drive the fourth shaft (37) to rotate, and cooperating with the transmission of the first transmission wheel (371), the second transmission wheel (372) and the transmission belt (373), the rotating sleeve (361) and the longitudinal sliding frame (32) are controlled to rotate, thereby controlling the first indexing arm (33), the second indexing arm (34) and the third indexing arm (35) to rotate synchronously, and the third indexing arm (35) is rotated to the position of the loading station frame (11); Step 2: Control the first motor (322) to drive the first rotating shaft (321) to rotate, thereby controlling the first indexing arm (33) to rotate at a certain angle around the first rotating shaft (321). With the limiting and fixing of the large sprocket (332) and the meshing drive of the first chain (334), and the number of teeth of the large sprocket (332) being twice the number of teeth of the small sprocket (333), drive the second rotating shaft (331) to rotate in the opposite direction, thereby synchronously controlling the second indexing arm (34) to rotate in the opposite direction at twice the angle around the second rotating shaft (331), so that the end of the second indexing arm (34) away from the first indexing arm (33) moves in a straight line along the diameter path. When the second indexing arm (34) rotates synchronously and at the same angle in the opposite direction around the second rotating shaft (331), it cooperates with the limiting and fixing of the first sprocket (342) and the meshing drive of the second sprocket (343). The first sprocket (342) and the second sprocket (343) have the same number of teeth, driving the third rotating shaft (341) to rotate in the opposite direction, thereby controlling the third indexing arm (35) to rotate synchronously and at the same angle around the third rotating shaft (341), so that the third indexing arm (35) always maintains a straight movement along the diameter path, which facilitates the straight insertion of the third indexing arm (35) into the wafer rack in one of the workstation frames (11); During this period, the lifting cylinder (38) is controlled to drive the longitudinal slide frame (32) to rise and fall in the rotating sleeve (361), thereby controlling the first indexing arm (33), the second indexing arm (34) and the third indexing arm (35) to rise and fall, flexibly adjusting the height of the positioning mechanism (4), so that the positioning mechanism (4) can adsorb and position wafers of different heights. Step 3: In the positioning mechanism (4), multiple Bernoulli chuck bodies (44) are placed on the lower surface of the corresponding wafers. Multiple wafers can be automatically adsorbed and positioned at one time by using multiple Bernoulli chuck bodies (44). Step 4: Control the first motor (322) to drive the first rotating shaft (321) to rotate in the opposite direction, so that the third rotating arm (35) can be straight away from the wafer rack in the work station frame (11); Step 5: Control the third motor (533) to drive the translation screw (531) to rotate, thereby controlling the translation slide (53) and the first positioning rod (54) to move closer to the wafer. At the same time, drive the auxiliary frame (572) and the transmission rack (571) to move, thereby synchronously driving the two transmission racks (571), the positioning frame (551), and the second positioning rod (56) to rotate in opposite directions and contact the rest of the wafer. In conjunction with the movement of the first positioning rod (54), the wafer is positioned and corrected. Step 6: Then, control the first indexing arm (33), the second indexing arm (34) and the third indexing arm (35) to be indexed synchronously again, and index the third indexing arm (35) to the position of the next work station frame (11). Then, insert the wafers after multiple position corrections into another work station frame (11) for processing, so as to realize the automatic and stable handling and placement of multiple wafers.

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