Megasonic semiconductor wafer cleaning equipment

Abstract

The invention relates to the technical field of wafer cleaning devices, and discloses a megasonic semiconductor wafer cleaning device, comprising a megasonic machine, a cleaning box and a semiconductor wafer, wherein the cleaning box is arranged outside the megasonic machine, and the semiconductor wafer is arranged above the cleaning box, and a rotating component and a shaking component for assisting the semiconductor wafer in cleaning are arranged above the cleaning box, and a fixing component for fixing semiconductor wafers of different sizes is arranged above the cleaning box. Through the arrangement of the rotating component and the shaking component, this composite motion mode can cover the wafer surface more comprehensively, and the transmission of the worm gear and the worm has a self-locking characteristic, which can effectively prevent reversal and jitter during the motion process and ensure the stability of the rotation. When faced with complex motion requirements, traditional devices will cause wafer damage or uneven cleaning due to unstable motion, thereby reducing mutual interference between different driving mechanisms and improving the reliability and compactness of the device.

Description

Technical Field

[0001] The invention relates to the field of wafer cleaning devices, in particular to a megasonic semiconductor wafer cleaning device. Background Art

[0002] The megasonic semiconductor wafer cleaning device is a special equipment used to clean semiconductor wafers. It uses the cavitation effect generated by megasonic waves in the cleaning fluid to remove pollutants on the wafer surface. When the megasonic waves propagate in the cleaning fluid, countless tiny cavitation bubbles will be generated. These cavitation bubbles will collapse violently in a very short time, generating local high temperature and high pressure, achieving the effect of stripping pollutants from the wafer surface.

[0003] The traditional megasonic semiconductor wafer cleaning devices on the market have many disadvantages and produce corresponding adverse effects. First, during the cleaning process, the wafer is usually placed statically or rotated in a single direction, which makes it difficult for the wafer surface to be exposed to the cleaning action in all directions, resulting in uneven cleaning. Contaminants are easily left at the edges, corners and surface microstructures, which seriously affects the thoroughness of cleaning. Due to the lack of a composite motion mode, the removal efficiency of contaminants with strong adhesion is low, and the synergistic effect of megasonic waves and cleaning liquid cannot be fully exerted. At the same time, the traditional device is relatively simple in motion control, and it is difficult to accurately control the cleaning parameters, such as the inability to finely adjust the motion amplitude and frequency, and it is difficult to adapt to the cleaning needs of different wafers. Moreover, its structure is often not compact enough and requires multiple independent driving mechanisms to achieve different movements, which not only increases the complexity of the device, but also easily reduces the reliability of the device due to mutual interference between the mechanisms. In addition, the wafer is damaged due to unstable motion during the cleaning process. For example, due to the lack of effective protection and adaptive structure, the edge of the wafer is easily damaged by uneven force during movement. These disadvantages have restricted the cleaning effect and application scope of the traditional megasonic semiconductor wafer cleaning device to varying degrees.

[0004] In terms of wafer fixing, most traditional devices design fixing fixtures for specific sizes and lack flexible adaptability to wafers of different sizes. Once the wafer size changes, it often takes a lot of time to replace the fixture. The fixing method often adopts a simple bilateral clamping or rigid fixing structure, which makes it difficult to achieve stable stress distribution. As a result, the wafer is easily displaced and shaken due to megasonic wave impact and cleaning liquid disturbance during the cleaning process, which not only reduces the cleaning effect, but also greatly increases the risk of damage to the wafer due to collision with other components. Moreover, the traditional fixing device lacks a buffer design for the fixing force, which can easily cause scratches on the wafer surface, local stress concentration and other damages due to over-tightening of the fixture, affecting the wafer quality.

[0005] Therefore, it is necessary to provide a megasonic semiconductor wafer cleaning device to solve the above problems. Summary of the invention

[0006] In view of the shortcomings of the prior art, the present invention aims to provide a megasonic semiconductor wafer cleaning device.

[0007] To achieve the above-mentioned purpose, the present invention provides the following technical solutions: a megasonic semiconductor wafer cleaning device, comprising a megasonic machine, a cleaning box and a semiconductor wafer, wherein the cleaning box is arranged on the outside of the megasonic machine, and the semiconductor wafer is arranged above the cleaning box, and a rotating component and a shaking component for assisting the cleaning of the semiconductor wafer are arranged above the cleaning box, and a fixing component for fixing semiconductor wafers of different sizes is arranged above the cleaning box.

[0008] Preferably, the rotating assembly includes a lifting device, which is fixedly connected to the outer wall of the cleaning box, the top of the lifting device is rotatably connected to an L-shaped connecting rod, the end of the L-shaped connecting rod away from the lifting device is fixedly connected to a dustproof shell, and the inner wall of the dustproof shell is fixedly connected to a first positioning block group.

[0009] Preferably, the rotating assembly also includes a worm, which is rotatably connected to the inside of the first positioning block group, the bottom of the worm is symmetrically fixedly connected to a limiting strip, the bottom of the worm is slidably connected to a limiting sliding plate, the bottom of the limiting sliding plate is fixedly connected to a fixing rod, and the top of the inner cavity of the dustproof shell is fixedly connected to a motor.

[0010] Preferably, the shaking assembly includes a second positioning rod group, the second positioning rod group is fixedly connected to the inner wall of the dustproof shell on the side away from the first positioning block group, the internal rotation of the second positioning rod group is connected to a worm gear, and the two ends of the worm gear are eccentrically fixedly connected to eccentric disks.

[0011] Preferably, the shaking assembly also includes a connecting rod group, which is rotatably connected to the outer walls of the two eccentric disks, and the bottom of the second positioning rod group is rotatably connected to a Y-shaped rotating rod, and the end of the Y-shaped rotating rod away from the second positioning rod group is rotatably connected to an arc block.

[0012] Preferably, the fixing assembly includes a U-shaped positioning rod, the U-shaped positioning rod is fixedly connected to the bottom of the fixing rod, the bottom of the U-shaped positioning rod is fixedly connected to a U-shaped tray, and the top of the U-shaped tray is symmetrically fixedly connected to a T-shaped limiting plate group.

[0013] Preferably, the fixing assembly further comprises a U-shaped clamping plate group, the U-shaped clamping plate group is slidably connected to the outer wall of the T-shaped limiting plate group, and a reset spring is fixedly connected between the U-shaped clamping plate group and the T-shaped limiting plate group.

[0014] Preferably, the limiting sliding plate is slidably connected to the outer side of the limiting strip, and the worm is fixedly connected to the output shaft of the motor.

[0015] Preferably, one end of the connecting rod group away from the eccentric disk is rotatably connected to the outer wall of the Y-shaped rotating rod, and the arc block is slidably connected to the outer wall of the limiting sliding disk.

[0016] Preferably, the worm is connected to the inside of the first positioning block group in a vertical rotation, and the worm wheel is connected to the inside of the second positioning rod group in a horizontal rotation.

[0017] Compared with the prior art, the megasonic semiconductor wafer cleaning device provided by the present invention has the following beneficial effects:

[0018] 1. Through the arrangement of the rotating component and the shaking component, the worm drives the limiting sliding disk to rotate through the limiting bar, and the worm drives the limiting sliding disk to rotate through the worm gear, the eccentric disk connecting rod group, the Y-shaped rotating rod, and the arc block while moving back and forth vertically, so that the semiconductor wafer between the U-shaped clamping plate group rotates inside the cleaning box and moves back and forth vertically. Compared with the traditional megasonic semiconductor wafer cleaning device, the semiconductor wafer rotates and moves back and forth vertically in the cleaning box, so that each point on the surface of the wafer can be fully exposed to the action of megasonic waves and cleaning liquid. Compared with the traditional cleaning method that only relies on static placement or single-direction rotation, this composite motion method can cover the wafer surface more comprehensively to ensure that there is no cleaning dead corner. For example, for contaminants in the edges, corners and surface microstructures of the wafer, this dynamic cleaning method can more effectively remove them, greatly improving the thoroughness of cleaning.

[0019] Secondly, the vertical reciprocating motion adds a new physical dimension. During the rotation process, the contaminants have a certain movement tendency on the wafer surface due to factors such as centrifugal force, and the vertical reciprocating motion will also disturb the contaminants in the vertical direction, so that the cleaning liquid can be better filled into each tiny area on the wafer surface. This dual motion makes it easier for the contaminants to detach from the wafer surface, especially for those contaminants with strong adhesion. This composite motion can better peel them off the wafer surface and then be taken away by the cleaning liquid, thereby improving the cleaning efficiency.

[0020] Secondly, compared with the simple movement mode of the traditional cleaning device, the connection and transmission relationship between the above-mentioned components can accurately control the parameters such as the amplitude, frequency and phase of the movement. For example, the eccentricity of the eccentric disk connecting rod group can be adjusted to control the amplitude of the vertical reciprocating movement, so as to achieve fine regulation of the cleaning process. In addition, the transmission between the worm gear and the worm has a self-locking characteristic, which can effectively prevent reversal and shaking during the movement and ensure the stability of the rotation. This stability is lacking in the traditional cleaning device. When faced with complex movement requirements, the traditional device will cause wafer damage or uneven cleaning due to unstable movement.

[0021] Through the above linkage structure, the integration of multiple motion modes can be realized in one device, which not only simplifies the overall structure of the device, but also reduces the mutual interference between different driving mechanisms and improves the reliability and compactness of the device.

[0022] 2. Through the setting of the fixing assembly, when fixing semiconductor wafers of different sizes, the staff can place the semiconductor wafers in the gap of the U-shaped clamping plate group, so that the U-shaped clamping plate group gradually stretches the reset spring during the sliding process along the T-shaped limit plate group, so that the stressed reset spring fixes the semiconductor wafer through the U-shaped clamping plate group, and at this time, the U-shaped tray and the U-shaped clamping plate group clamp the semiconductor wafer in a triangular shape;

[0023] Among them, the conventional megasonic semiconductor wafer cleaning device often designs fixtures for specific sizes when fixing wafers. When processing wafers of different sizes, the fixtures need to be replaced or complex adjustments need to be made. However, the structure of using a U-shaped clamping plate group sliding along a T-shaped limit plate group and cooperating with a reset spring can adapt to semiconductor wafers of various sizes. The wafer only needs to be placed in the gap of the U-shaped clamping plate group, and the clamping force and spacing can be automatically adjusted by the expansion and contraction of the reset spring, which greatly improves the compatibility of the device with wafers of different sizes and reduces the time and cost of frequent fixture replacement due to changes in wafer size.

[0024] Among them, the U-shaped tray and the U-shaped clamping plate group clamp the semiconductor wafer in a triangular shape. This triangular structure is highly stable in mechanics. Compared with the traditional double-sided clamping or simple fixing method, the triangular clamping can disperse the pressure more evenly and effectively prevent the wafer from being displaced or shaken due to external forces such as megasonic vibration and cleaning liquid impact during the cleaning process;

[0025] The presence of the return spring makes the U-shaped clamping plate group's fixing force on the semiconductor wafer gentler and more uniform. In traditional fixing methods, there is a problem of scratching the wafer surface or local stress concentration due to the clamp being too tight, affecting the wafer quality. The structure here avoids such damage through spring buffering, while ensuring the stable fixation of the wafer during the cleaning process. BRIEF DESCRIPTION OF THE DRAWINGS

[0026] Figure 1 It is a schematic diagram of the position relationship of the overall device of the present invention;

[0027] Figure 2 It is a cross-sectional view of the overall device of the present invention;

[0028] Figure 3 It is a schematic diagram of the positional relationship between the rotating component and the fixed component in the present invention;

[0029] Figure 4 For the present invention Figure 3A magnified view of the structure at center;

[0030] Figure 5 It is a schematic diagram of the positional relationship between the rotating component and the shaking component in the present invention;

[0031] Figure 6 It is a schematic diagram of the position relationship between the worm gear and the eccentric disk in the present invention;

[0032] Figure 7 It is a schematic diagram of the position relationship of the shaking components in the present invention;

[0033] Figure 8 For the present invention Figure 7 This is an enlarged view of the structure at B in the middle;

[0034] Fig. 9 It is a schematic diagram of the positional relationship between the rotating component and the fixed component in the present invention;

[0035] Fig.10 It is a schematic diagram of the position relationship of the fixed components in the present invention;

[0036] Fig.11 It is a schematic diagram of the positional relationship among the cleaning box, rotating assembly and fixed assembly in the present invention.

[0037] Reference numerals: 11, megasonic wave machine; 12, cleaning box; 13, semiconductor wafer;

[0038] The rotating assembly includes: 21, lifting device; 22, L-shaped connecting rod; 23, dust cover; 24, first positioning block group; 25, worm; 26, limit bar; 27, limit sliding plate; 28, fixing rod; 29, motor;

[0039] The shaking assembly includes: 31, a second positioning rod group; 32, a worm gear; 33, an eccentric disk; 34, a connecting rod group; 35, a Y-shaped rotating rod; 36, an arc block;

[0040] The fixing assembly includes: 41, a U-shaped positioning rod; 42, a U-shaped tray; 43, a T-shaped limiting plate group; 44, a U-shaped clamping plate group; 45, a reset spring. DETAILED DESCRIPTION

[0041] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not intended to limit the present invention.

[0042] In the description of the present invention, the terms "center", "lateral", "up", "down", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings. They are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, they should not be understood as limitations on the present invention.

[0043] The specific implementation of the present invention is described in detail below in conjunction with specific embodiments.

[0044] Implementation example Figures 1 to 11 As shown, a megasonic semiconductor wafer cleaning device provided by an embodiment of the present invention includes a megasonic machine 11, a cleaning box 12 and a semiconductor wafer 13. The cleaning box 12 is arranged on the outside of the megasonic machine 11, and the semiconductor wafer 13 is arranged above the cleaning box 12. A rotating component and a shaking component for assisting the cleaning of the semiconductor wafer 13 are arranged above the cleaning box 12. A fixing component for fixing semiconductor wafers 13 of different sizes is arranged above the cleaning box 12.

[0045] The rotating assembly includes a lifting device 21, which is fixedly connected to the outer wall of the cleaning box 12. The top of the lifting device 21 is rotatably connected to an L-shaped connecting rod 22. The end of the L-shaped connecting rod 22 away from the lifting device 21 is fixedly connected to a dustproof shell 23. The inner wall of the dustproof shell 23 is fixedly connected to a first positioning block group 24.

[0046] The rotating assembly also includes a worm 25, which is rotatably connected to the inside of the first positioning block group 24. The bottom of the worm 25 is symmetrically fixedly connected to a limit strip 26, and the bottom of the worm 25 is slidably connected to a limit slide plate 27. The bottom of the limit slide plate 27 is fixedly connected to a fixing rod 28, and the top of the inner cavity of the dustproof shell 23 is fixedly connected to a motor 29.

[0047] The shaking assembly includes a second positioning rod group 31, which is fixedly connected to the inner wall of the dustproof shell 23 away from the first positioning block group 24. The second positioning rod group 31 is internally rotatably connected to a worm gear 32, and the two ends of the worm gear 32 are eccentrically fixedly connected to an eccentric disk 33.

[0048] The shaking assembly also includes a connecting rod group 34, which is rotatably connected to the outer walls of the two eccentric disks 33. The bottom of the second positioning rod group 31 is rotatably connected to a Y-shaped rotating rod 35, and one end of the Y-shaped rotating rod 35 away from the second positioning rod group 31 is rotatably connected to an arc block 36.

[0049] The fixing assembly includes a U-shaped positioning rod 41, which is fixedly connected to the bottom of the fixing rod 28, a U-shaped tray 42 is fixedly connected to the bottom of the U-shaped positioning rod 41, and a T-shaped limiting plate group 43 is symmetrically fixedly connected to the top of the U-shaped tray 42.

[0050] The fixing assembly further includes a U-shaped clamping plate assembly 44 , which is slidably connected to the outer wall of the T-shaped limiting plate assembly 43 , and a reset spring 45 is fixedly connected between the U-shaped clamping plate assembly 44 and the T-shaped limiting plate assembly 43 .

[0051] The limiting sliding plate 27 is slidably connected to the outer side of the limiting bar 26 , and the worm 25 is fixedly connected to the output shaft of the motor 29 , so that the motor 29 can drive the worm 25 to rotate.

[0052] The end of the connecting rod group 34 away from the eccentric disk 33 is rotatably connected to the outer wall of the Y-shaped rotating rod 35, so that the Y-shaped rotating rod 35 can be driven to rotate by the connecting rod group 34 during the rotation of the eccentric disk 33, and the arc block 36 is slidably connected to the outer wall of the limiting sliding disk 27, so that the Y-shaped rotating rod 35 can move the limiting sliding disk 27 through the arc block 36.

[0053] The worm 25 is connected to the inside of the first positioning block group 24 in a vertical rotation manner, and the worm wheel 32 is connected to the inside of the second positioning rod group 31 in a horizontal rotation manner.

[0054] Working principle: In the initial state, the Y-shaped rotating rod 35 and the limiting sliding plate 27 are in a vertical state, the U-shaped clamping plate group 44 and the U-shaped tray 42 are in conflict, and the reset spring 45 is not stretched.

[0055] During operation, when the staff needs to clean the semiconductor wafer 13, the megasonic wave machine 11 is used to propagate the megasonic wave inside the cleaning box 12, and then the L-shaped connecting rod 22 needs to be controlled to rotate along the top of the lifting device 21, so that the L-shaped connecting rod 22 drives the dust cover 23 and the fixing rod 28 to rotate toward one side of the cleaning box 12, so that the fixing rod 28 drives the U-shaped positioning rod 41 and the U-shaped tray 42 to deviate from the top of the cleaning box 12;

[0056] Then the staff sequentially clamps the semiconductor wafer 13 between the U-shaped clamping plate group 44. When fixing semiconductor wafers 13 of different sizes, the semiconductor wafer 13 will slide away from the U-shaped tray 42 against the U-shaped clamping plate group 44 according to its own diameter;

[0057] When the U-shaped clamping plate group 44 slides away from the U-shaped tray 42, the U-shaped clamping plate group 44 will slide along the outer wall of the T-shaped limiting plate group 43, and at the same time, the T-shaped limiting plate group 43 will gradually stretch the reset spring 45, so that the stressed reset spring 45 can fix the semiconductor wafer 13 through the U-shaped clamping plate group 44, thereby achieving the purpose of adapting to semiconductor wafers 13 of various sizes. The wafer only needs to be placed in the gap of the U-shaped clamping plate group 44, and the clamping force and spacing can be automatically adjusted by relying on the expansion and contraction of the reset spring 45, which greatly improves the compatibility of the device with wafers of different sizes and reduces the time and cost of frequently replacing the fixture due to changes in wafer size.

[0058] The U-shaped tray 42 and the U-shaped clamping plate group 44 clamp the semiconductor wafer 13 in a triangular shape. This triangular structure is highly stable in mechanics. Compared with the traditional double-sided clamping or simple fixing method, the triangular clamping can disperse the pressure more evenly, effectively preventing the wafer from being displaced or shaken due to external forces such as megasonic vibration and cleaning liquid impact during the cleaning process.

[0059] The presence of the reset spring 45 makes the U-shaped clamping plate group 44 have a gentle and uniform fixing force on the semiconductor wafer 13. In the traditional fixing method, there is a problem of scratching the wafer surface or local stress concentration due to the clamp being too tight, which affects the quality of the wafer. The structure here avoids such damage through spring buffering, while ensuring the stable fixation of the wafer during the cleaning process.

[0060] After the semiconductor wafer 13 is fixed, the staff rotates the L-shaped connecting rod 22 in the opposite direction, so that the fixing rod 28 drives the U-shaped positioning rod 41 and the U-shaped tray 42 to return to the top of the cleaning box 12, and then the staff controls the lifting device 21 to drive the L-shaped connecting rod 22 and the dustproof shell 23 to descend, and at the same time energizes the motor 29;

[0061] When the motor 29 is started, the motor 29 drives the worm 25 fixedly connected thereto to rotate, so that the worm 25 rotates along the first positioning block group 24, and then the worm 25 drives the limiting sliding plate 27 to rotate through the limiting strip 26 at the bottom;

[0062] At the same time, during the rotation of the worm 25, the worm gear 32 will be driven to rotate along the second positioning rod group 31, and the worm gear 32 will drive the eccentric disks 33 at both ends to rotate synchronously, and when the eccentric disk 33 rotates, the eccentric disk 33 will drive the Y-shaped rotating rod 35 to reciprocate along the second positioning rod group 31 through the connecting rod group 34, and then the Y-shaped rotating rod 35 is away from the second positioning rod group 31. The end continues to move the limit sliding plate 27 through the arc block 36 to reciprocate vertically, so that each point on the surface of the semiconductor wafer 13 can be fully exposed to the action of megasonic waves and the cleaning liquid inside the cleaning box 12. Compared with the traditional cleaning method that only relies on static placement or single-direction rotation, this composite motion method can cover the wafer surface more comprehensively to ensure that there are no cleaning dead corners. For example, for contaminants in the edges, corners and surface microstructures of the wafer, this dynamic cleaning method can more effectively remove them, greatly improving the thoroughness of cleaning.

[0063] Secondly, due to factors such as centrifugal force, the contaminants have a certain tendency to move on the wafer surface, and the vertical reciprocating movement will also disturb the contaminants in the vertical direction, so that the cleaning liquid can be better filled into each tiny area on the wafer surface. This double movement makes it easier for the contaminants to separate from the wafer surface, especially for those contaminants with strong adhesion. This composite movement can better peel them off from the wafer surface and then be taken away by the cleaning liquid, thereby improving the cleaning efficiency.

[0064] Finally, the transmission between the worm gear 32 and the worm 25 has a self-locking characteristic, which can effectively prevent reversal and shaking during movement, ensure the stability of rotation, and at the same time realize the integration of multiple movement modes in one device, which not only simplifies the overall structure of the device, but also reduces the mutual interference between different driving mechanisms, thereby improving the reliability and compactness of the device.

[0065] For those skilled in the art, although several embodiments and examples of the present invention are described, these embodiments and examples are presented as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in various other ways, and various omissions, substitutions, and changes can be made without departing from the scope of the subject matter of the invention. These embodiments and their variations are included in the scope and subject matter of the invention, and are included in the invention described in the claims and the scope of their equivalents.

[0066] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A megasonic semiconductor wafer cleaning device, comprising a megasonic machine (11), a cleaning box (12) and a semiconductor wafer (13), wherein the cleaning box (12) is arranged outside the megasonic machine (11), and the semiconductor wafer (13) is arranged above the cleaning box (12), characterized in that: A rotating assembly and a shaking assembly for assisting the cleaning of semiconductor wafers (13) are arranged above the cleaning box (12); and a fixing assembly for fixing semiconductor wafers (13) of different sizes is arranged above the cleaning box (12); The rotating assembly comprises a lifting device (21), the lifting device (21) is fixedly connected to the outer wall of the cleaning box (12), the top of the lifting device (21) is rotatably connected to an L-shaped connecting rod (22), one end of the L-shaped connecting rod (22) away from the lifting device (21) is fixedly connected to a dustproof shell (23), and the inner wall of the dustproof shell (23) is fixedly connected to a first positioning block group (24); The rotating assembly further comprises a worm (25), the worm (25) being rotatably connected to the interior of the first positioning block group (24), the bottom of the worm (25) being symmetrically fixedly connected to a limit strip (26), the bottom of the worm (25) being slidably connected to a limit sliding plate (27), the bottom of the limit sliding plate (27) being fixedly connected to a fixing rod (28), and the top of the inner cavity of the dustproof housing (23) being fixedly connected to a motor (29); The shaking assembly comprises a second positioning rod group (31), the second positioning rod group (31) being fixedly connected to the inner wall of the dustproof housing (23) on a side away from the first positioning block group (24), the interior of the second positioning rod group (31) being rotatably connected to a worm gear (32), and both ends of the worm gear (32) being eccentrically fixedly connected to eccentric disks (33); The shaking assembly also includes a connecting rod group (34), the connecting rod group (34) is rotatably connected to the outer walls of the two eccentric disks (33), the bottom of the second positioning rod group (31) is rotatably connected to a Y-shaped rotating rod (35), and one end of the Y-shaped rotating rod (35) away from the second positioning rod group (31) is rotatably connected to an arc block (36).

2. The megasonic semiconductor wafer cleaning device according to claim 1, characterized in that: The fixing assembly comprises a U-shaped positioning rod (41), the U-shaped positioning rod (41) is fixedly connected to the bottom of the fixing rod (28), the bottom of the U-shaped positioning rod (41) is fixedly connected to a U-shaped tray (42), and the top of the U-shaped tray (42) is symmetrically fixedly connected to a T-shaped limiting plate group (43).

3. The megasonic semiconductor wafer cleaning device according to claim 2, characterized in that: The fixing assembly further comprises a U-shaped clamping plate group (44), the U-shaped clamping plate group (44) being slidably connected to the outer wall of the T-shaped limiting plate group (43), and a return spring (45) being fixedly connected between the U-shaped clamping plate group (44) and the T-shaped limiting plate group (43).

4. The megasonic semiconductor wafer cleaning device according to claim 1, characterized in that: The limiting sliding plate (27) is slidably connected to the outer side of the limiting strip (26), and the worm (25) is fixedly connected to the output shaft of the motor (29).

5. The megasonic semiconductor wafer cleaning device according to claim 1, characterized in that: One end of the connecting rod group (34) away from the eccentric disc (33) is rotatably connected to the outer wall of the Y-shaped rotating rod (35), and the arc block (36) is slidably connected to the outer wall of the limiting sliding disc (27).

6. The megasonic semiconductor wafer cleaning device according to claim 1, characterized in that: The worm (25) is connected to the inside of the first positioning block group (24) in a vertical rotation manner, and the worm wheel (32) is connected to the inside of the second positioning rod group (31) in a horizontal rotation manner.

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