Separation device for thick film hybrid integrated circuit connected chips
By designing a thick film hybrid integrated circuit continuous-film chipping device including base, fixed block, slot, snapping block and slot, the problems of device damage, high cutting accuracy requirements, high equipment cost and low production efficiency in the prior art are solved, and a fast and lossless sharding process is achieved, and the stability of quality control is improved.
Patent Information
- Application Number
- CN202411488435.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-24
- Publication Date
- 2025-02-28
AI Technical Summary
In the process of continuous chipping of thick film hybrid circuits, the existing technology has problems such as device damage, high cutting accuracy requirements, high equipment costs, and low production efficiency, making it difficult to achieve fast and lossless sharding.
A thick film hybrid integrated circuit chip split device is designed, including a base, fixed block, slot, snap-in block and slot. By adjusting the position of the fixed block and the slot width of the snap-in block, effective breaking of circuit chips of different widths is achieved.
The device is simple in structure, convenient in operation, good versatility, low in preparation cost, and balanced in the circuit continuous sheets when breaking, avoiding the problems of device damage and high cutting accuracy requirements, and does not produce excess, does not require water to flush, and has stable quality control.
Smart Images
Figure CN119542249A_ABST
Abstract
Description
Technical Field
[0001] The invention relates to the field of thick film hybrid circuit manufacturing, in particular to a slicing device for connecting thick film hybrid integrated circuits. Background Art
[0002] Conventional thick film hybrid circuit monolithic assembly process is complex and has many processes. Due to the long processing time and low efficiency, it cannot adapt to the rapid and changing requirements of the market. Subsequently, the chip assembly process was developed, that is, production is carried out through multi-array combination chip. Its processing flow mainly includes laser scribing and partitioning of large-size ceramic substrates → screen printing film formation → laser fine-tuning of resistors → conductive glue / solder paste printing → component patching and sintering → device and substrate bonding interconnection → chip division into single pieces → bonding of single-piece substrate and metal shell base → bonding and interconnection of single-piece substrate and metal tube shell lead column → single circuit capping. Chip assembly saves the time of loading and unloading, process image recognition, especially the original single-piece screen printing, conductive glue / solder paste printing, component patching, device and substrate bonding interconnection are improved to multi-array printing, and the chip production efficiency is improved by dozens or even hundreds of times (related to the number of arrays). In addition, due to the large area of the chip substrate, high process stability and stable quality, the chip assembly process is better adapted to the rapid and changing requirements of the market.
[0003] The difficulty of connecting pieces lies in the problem of separating the pieces after completing the assembly and bonding of the connected pieces. How to separate the pieces quickly and without damage is a difficult problem in the industry. At present, the main technologies include bending, mechanical cutting, laser cutting and other methods. The bending method cannot meet the needs of separating the pieces after the assembly of the device. The use of this device can easily cause the device or the bonding wire to scrape against the wall of the tooling slot and cause damage.
[0004] The mechanical cutting method has high requirements for the position of the blade, the length accuracy, and the consistency of the hardness of each blade. Otherwise, it is easy to be cut without cutting. In addition, the splashing of excess materials during the cutting process can easily damage the device and the bonding wire. Moreover, the versatility of the cutting device is poor. For example, the cutting accuracy of the grinding wheel can meet the needs of the thick film hybrid circuit to be connected and divided into single pieces, but since deionized water is generally required for rinsing during cutting, the rinsing process will damage or contaminate the devices and bonding wires of the connected circuit. In addition, the grinding wheel cutting equipment is expensive, and the use of grinding wheels to cut ceramics has poor wear resistance, which will also result in excessive usage fees.
[0005] Laser cutting requires a lot of power to directly penetrate the cracks, so the laser cutting equipment is expensive, the energy cost is high, and the production efficiency is low. In addition, there must be no devices more than 1mm away from the cutting edge, otherwise it will cause problems such as laser thermal damage and dust pollution. Summary of the invention
[0006] The present invention aims to overcome the deficiencies in the prior art and provide a slicing device for connecting thick film hybrid integrated circuits.
[0007] This application provides the following technical solutions: A device for separating thick-film hybrid integrated circuit chips, characterized in that it includes a base, a pair of fixed blocks are arranged on the base, card slots corresponding to the strip-shaped circuit chips are arranged on the side walls on the corresponding sides of the two fixed blocks, at least one chip breaking block is arranged, and a slot distributed corresponding to the card slot is arranged on one side of the chip breaking block.
[0008] On the basis of the above technical solutions, there are also the following further technical solutions: The pair of fixing blocks are connected to the same side of the upper surface of the base, the spacing between the pair of fixing blocks is adjustable, and each fixing block is provided with a group of long holes, and bolts connected and matched with the base are arranged in the long holes.
[0009] A first arc guide surface is provided at one end of the fixing block.
[0010] A notch communicated with the slot is provided on the breaking block.
[0011] A pair of correspondingly distributed second arc guide surfaces are provided at one end of the breaking block.
[0012] The base is provided with scale lines corresponding to the distance between a pair of fixing blocks.
[0013] Advantages of the invention: The present invention has a simple structure, convenient operation, good versatility, low preparation cost, a large contact surface between the tooling and the circuit connecting piece when breaking the piece, and balanced force on the circuit connecting piece when breaking the piece, which will not cause the non-scoring part inside the large-sized unit to break. In addition, no milling cutter or grinding wheel cutting is used, no high-power laser penetration is used, the cutting area is small, the effective utilization area of the substrate is large, no excess material is generated, no water washing is required, and the quality control is stable. BRIEF DESCRIPTION OF THE DRAWINGS
[0014] Figure 1 It is a top view of the fixing block and the base when they are connected in the present invention; Figure 2 yes Figure 1 A three-dimensional schematic diagram of Figure 3 It is a schematic diagram of the present invention when used. DETAILED DESCRIPTION
[0015] like Figure 1-3 As shown, a slicing device for connecting thick-film hybrid integrated circuits comprises a cubic base 1, a pair of spaced fixed blocks 2 are connected to the same side of the upper surface of the base 1, and slots 3 corresponding to strip-shaped circuit connecting pieces 6 are provided on the side walls on the corresponding sides of the two fixed blocks 2.
[0016] The slot 3 is a through slot structure. The longitudinal height of the slot 3 is 0.1mm to 0.2mm greater than the thickness of the circuit connecting piece 6 substrate, and the depth on the horizontal plane is 0.2mm to 0.3mm. A first arc guide surface 2c is provided at one end of the fixing block 2, and the two first arc guide surfaces 2c are combined into a bell-shaped guide portion, which facilitates the insertion of the circuit connecting piece 6 from this side.
[0017] A pair of parallel long holes 2a are provided on the fixing block 2, and bolts are provided in the long holes 2a for connecting and cooperating with the base 1 (bolts are shown in the figure for the convenience of viewing), and the length direction of the long holes 2a is distributed along the width direction of the base 1. Due to the existence of the long holes, the spacing between the two card slots 3 can be adjusted, so that the circuit connecting pieces 6 of different widths can be inserted between the fixing blocks to fix their longitudinal positions.
[0018] The base 1 is provided with scale lines (not shown) corresponding to the distance between a pair of fixing blocks 2. Before use, according to the width of the circuit connecting piece, loosen the bolts to adjust the position of the fixing block so that the slot is aligned with the scale lines, and then tighten the bolts so that the cap at the top of the bolt locks the fixing block, thereby fixing the distance between the two slots.
[0019] Insert the circuit connecting piece 6 to be broken into the two slots from one side of the first arc guide surface 2 c , and then push the position to be broken to the outside of the base 1 .
[0020] A group of breaking blocks 4 are provided, and a slot 5 corresponding to the card slot 3 is provided on one side of each breaking block 4. The difference is that the width of the slot 5 on each breaking block 4 is different. Therefore, when the spacing between the card slots 3 is different, the breaking operation of the circuit connected pieces with different widths can be handled.
[0021] The breaking block 4 is provided with a notch 4a connected to the slot 5 so that after one end of the circuit connecting piece 6 is inserted into the slot 5, the protruding part of the circuit connecting piece 6 is also inserted into the notch, and it is also convenient to take out the broken single piece after breaking.
[0022] A pair of correspondingly distributed second arc guide surfaces 4b are provided at one end of the breaking block 4 on one side of the notch 4a, and the two second arc guide surfaces 4b form a trumpet-shaped guide portion on the same side of the slot 5 and the notch 4a. This allows the staff to hold the breaking block 4 and insert the slot 5 into the end of the circuit connecting piece 6 to be broken off, located outside the base 1, and slightly bend downward with the scribe line at the front end of the breaking block as the center, so that the scribe line breaks and the single piece is separated from the circuit connecting piece 6. Then use tweezers to clamp one end of the separated single piece, take out the single piece, and place it in a sheet box, and so on, to complete all single piece separation.
Claims
1. A slicing device for thick film hybrid integrated circuits, characterized in that: The invention comprises a base (1), a pair of fixing blocks (2) being arranged on the base (1), a card slot (3) corresponding to a strip-shaped circuit connecting piece (6) being arranged on the side walls on the corresponding sides of the two fixing blocks (2), at least one chip-breaking block (4) being arranged, and a slot (5) distributed corresponding to the card slot (3) being arranged on one side of the chip-breaking block (4).
2. A slicing device for connecting thick film hybrid integrated circuits according to claim 1, characterized in that: The pair of fixing blocks (2) are connected to the same side of the upper surface of the base (1); the spacing between the pair of fixing blocks (2) is adjustable; each fixing block (2) is provided with a group of elongated holes (2a); and bolts for connecting and cooperating with the base (1) are provided in the elongated holes (2a).
3. A slicing device for connecting thick film hybrid integrated circuits according to claim 1, characterized in that: A first arc guide surface (2c) is provided at one end of the fixing block (2).
4. A slicing device for connecting thick film hybrid integrated circuits according to claim 1, characterized in that: The breaking block (4) is provided with a notch (4a) which is in communication with the slot (5).
5. A slicing device for connecting thick film hybrid integrated circuits according to claim 1, characterized in that: A pair of correspondingly distributed second arc guide surfaces (4b) are provided at one end of the tablet breaking block (4).
6. A slicing device for connecting thick film hybrid integrated circuits according to claim 1, characterized in that: The base (1) is provided with scale lines corresponding to the distance between the pair of fixed blocks (2).