DFN double-side pin-free flat packaging structure convenient to detect

Abstract

The invention relates to the technical field of chip packaging, and discloses a DFN double-side pin-free flat package convenient to detect, which comprises a package, a plurality of plane pins are arranged on two sides of the front surface of the package in an array manner, a hot bonding pad is arranged on the front surface of the package, a detection structure is arranged on the front surface of the package in a sliding manner, the detection structure comprises a movable plate, and the movable plate is arranged on the movable plate. According to the detection structure provided by the invention, the detection structure can be used for mutually connecting the plane pins through the matching between the connecting sheet and the contact, and meanwhile, the area of the detection contact is increased; when a user uses a detection pen of the detection device to carry out electrical detection on a pin, the user can rapidly align a detection position without aligning the pin little by little, so that the detection efficiency is improved; when dirt or surface corrosion is found on the pin during packaging detection or later use, the contact piece can be controlled to rub the surface of the pin by quickly moving the movable plate in a reciprocating manner, so that the dirt and the corrosion are cleaned.

Description

Technical Field

[0001] The invention relates to the technical field of chip packaging, in particular to a DFN double-sided leadless flat packaging structure which is easy to detect. Background Art

[0002] In the patent application with application announcement number CN102931150A, it includes a lead frame, a chip and a packaging colloid. The lead frame includes a chip seat and a plurality of pins. The chip seat has a top surface and a bottom surface, and the chip seat includes a chip bonding portion and a peripheral portion. The peripheral portion is connected to and surrounds the chip bonding portion. The top surface of the chip seat is recessed outside the chip bonding portion to form a peripheral portion. The pins are arranged around the chip seat and are electrically separated from the chip seat. Each pin has an upper surface and a lower surface, and each pin includes a cantilever portion and an external connection portion. The lower surface of each pin is recessed outside the external connection portion to form a cantilever portion. The cantilever portion extends from the external connection portion to the peripheral portion and partially overlaps with the peripheral portion. The chip is arranged on the chip bonding portion and is electrically connected to the cantilever portion via a plurality of welding wires. The packaging colloid covers the chip, the welding wire and the lead frame, and has the advantages that: the present invention shortens the length of the welding wire without changing the size of the chip seat, so the bottom surface of the chip seat can maintain the required area to maintain the required heat dissipation effect.

[0003] In the prior art including the above-mentioned patents, the pinless package needs to undergo a series of tests after production, such as preliminary appearance test and subsequent electrical test and waterproof test. When performing electrical test, the pins on the packaging device body are relatively small, and the detection pen used on the device for electrical test is relatively large, making manual alignment test difficult and time-consuming. In addition, if the preliminary appearance test finds that the pins are dirty or rusted, failure to clean them in time will also affect the subsequent electrical test. Summary of the invention

[0004] The problem to be solved by the present invention is that the contact area of ​​the leadless package is smaller than that of the extended pin package during electrical testing, and it is inconvenient to align and difficult to manually test.

[0005] In order to solve the above technical problems, the technical solution of the present invention is: a DFN double-sided leadless flat package structure that is easy to detect, comprising a package, a plurality of planar pins are arranged in an array on both sides of the front of the package, a thermal pad is arranged on the front of the package, and a detection structure is slidably arranged on the front of the package;

[0006] The detection structure comprises a movable plate, a contact point is arranged on the front of the movable plate, a connecting piece is arranged on one side of the movable plate, and the connecting piece is electrically connected to the contact point.

[0007] Preferably, a contact sheet is fixedly provided on the back side of the connecting sheet, and the back side of the contact sheet is in close contact with the front side of the planar pin.

[0008] Preferably, sliders are fixedly provided on the top and bottom of the movable plate, and anti-slip textures are provided on the tops of the sliders.

[0009] Preferably, both sides of the bottom of the slider are provided with locking beads, and the shape of the locking beads is semicircular.

[0010] Preferably, slide grooves are provided on both sides of the top and bottom of the package, and a plurality of bead grooves are provided on the top of the slide grooves.

[0011] Preferably, the slide groove is matched with the slide block, and the bead groove is matched with the card bead.

[0012] Compared with the prior art, the technical solution of the present invention has the following advantages:

[0013] (1) A detection structure is provided on the package. The detection structure can connect the plane pins to each other through the cooperation between the connecting piece and the contact point, while increasing the area of ​​the detection contact point, so that the user can quickly align the detection position when using the detection pen of the detection device to perform electrical detection on the pins without having to align the pins little by little, thereby improving the detection efficiency. The detection structure is installed on the package in a sliding connection type. During installation or use, the user can freely choose whether to remove the detection structure according to actual needs. If it needs to be removed, pinch the slider to one side and slide it directly to remove it;

[0014] (2) A contact sheet is provided on the back of the connecting sheet on the detection structure. The contact sheet and the surface of the pin are in contact with each other. When the package is not in use or is transported, the contact sheet and the pin can be overlapped to protect the surface of the pin from scratches or dirt. If dirt or surface rust is found on the pin during package inspection or later use, the movable plate can be moved back and forth quickly to control the contact sheet to rub the surface of the pin to clean the dirt and rust. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 It is a schematic diagram of the overall structure of the present invention;

[0016] Figure 2 This is a schematic diagram of the planar pin structure of the present invention;

[0017] Figure 3 It is a schematic diagram of the contact structure of the present invention;

[0018] Figure 4 It is a schematic diagram of the detection structure of the present invention;

[0019] Figure 5 It is a schematic diagram of the structure of the movable plate of the present invention;

[0020] Figure 6 It is a rear view schematic diagram of the movable plate structure of the present invention;

[0021] Figure 7 It is a schematic side view of the movable plate structure of the present invention;

[0022] Figure 8 It is a schematic diagram of the structure of the thermal pad of the present invention;

[0023] Fig. 9 It is an enlarged schematic diagram of the structure at location A of the present invention.

[0024] In the figure: 1. thermal pad; 2. package; 3. detection structure; 301. connecting piece; 302. slider; 303. contact; 304. movable plate; 305. card bead; 306. contact piece; 4. slide groove; 5. flat pin; 6. bead groove. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solution and advantages of the embodiments of the present disclosure clearer, the technical solution of the embodiments of the present disclosure will be clearly and completely described below in conjunction with the drawings of the embodiments of the present disclosure. Obviously, the described embodiments are part of the embodiments of the present disclosure, not all of the embodiments. Based on the described embodiments of the present disclosure, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present disclosure.

[0026] Unless otherwise defined, the technical terms or scientific terms used in the present disclosure should be understood by people with ordinary skills in the field to which the present disclosure belongs. "Include" or "comprise" and other similar words used in the present disclosure mean that the elements or objects appearing before the word include the elements or objects listed after the word and their equivalents, without excluding other elements or objects. "Connect" or "connected" and other similar words are not limited to physical or mechanical connections, but may also include electrical connections, whether direct or indirect. "Up", "down", "left", "right", etc. are only used to indicate relative positional relationships. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0027] like Figures 1 to 9 As shown, the present invention provides a DFN double-sided leadless flat package structure that is easy to detect, including a package 2, a plurality of planar pins 5 are arranged in an array on both sides of the front of the package 2, a thermal pad 1 is arranged on the front of the package 2, and a detection structure 3 is slidably arranged on the front of the package 2;

[0028] The detection structure 3 includes a movable plate 304 , a contact 303 is disposed on the front of the movable plate 304 , and a connecting piece 301 is disposed on one side of the movable plate 304 , and the connecting piece 301 is electrically connected to the contact 303 .

[0029] A contact sheet 306 is fixedly provided on the back side of the connecting sheet 301 , and the back side of the contact sheet 306 is in close contact with the front side of the planar pin 5 .

[0030] Slide blocks 302 are fixedly provided at the top and bottom of the movable plate 304 , and anti-slip textures are provided at the top of the slide blocks 302 .

[0031] Both sides of the bottom of the slider 302 are provided with locking beads 305, and the shape of the locking beads 305 is semicircular.

[0032] Slide grooves 4 are provided on both sides of the top and bottom of the package 2 , and a plurality of bead grooves 6 are provided on the top of the slide grooves 4 .

[0033] The slide groove 4 is matched with the slider 302 , and the bead groove 6 is matched with the locking bead 305 .

[0034] The working principle and use process of the present invention are as follows: when it is necessary to detect the flat pin 5 of the package 2, the back of the package 2 is facing upwards, and then the sliders 302 at the top and bottom of the movable plate 304 are pinched by hand and pushed to one side. The slider 302 drives the connecting piece 301 to move to one side, so that the connecting piece 301 completely overlaps with the flat pin 5. After overlapping, the contact piece 306 on the back of the connecting piece 301 will be tightly attached to the flat pin 5. Then the user can use the detection pen of the measuring instrument to touch the contact 303 to quickly check the electrical connectivity of the package 2. A quick inspection is performed to check whether it meets the electrical inspection standards. If it is found that the surface of the planar pin 5 is rusted or dirty during the inspection, the movable plate 304 can be quickly moved. The movable plate 304 will rub and clean the surface of the planar pin 5 through the contact piece 306 to remove the dirt. When transporting the package 2, the movable plate 304 can also be slid closed to prevent dirt from contaminating the surface of the planar pin 5. When the package 2 is subsequently installed on the machine for use, the movable plate 304 can be slid to be removed from the package 2 to avoid affecting the normal use of the package 2.

[0035] The above embodiments are only exemplary embodiments of the present invention and are not intended to limit the present invention. The protection scope of the present invention is defined by the claims. Those skilled in the art may make various modifications or equivalent substitutions to the present invention within the essence and protection scope of the present invention, and such modifications or equivalent substitutions shall also be deemed to fall within the protection scope of the present invention.

Claims

1. A DFN double-sided leadless flat package structure that is easy to detect, comprising a package (2), characterized in that: A plurality of planar pins (5) are arranged in an array on both sides of the front side of the package (2), a thermal pad (1) is arranged on the front side of the package (2), and a detection structure (3) is slidably arranged on the front side of the package (2); The detection structure (3) comprises a movable plate (304), a contact point (303) is arranged on the front side of the movable plate (304), a connecting piece (301) is arranged on one side of the movable plate (304), and the connecting piece (301) is electrically connected to the contact point (303).

2. The DFN double-sided leadless flat package structure that is easy to detect according to claim 1, characterized in that: A contact sheet (306) is fixedly provided on the back side of the connecting sheet (301), and the back side of the contact sheet (306) is in close contact with the front side of the planar pin (5).

3. The DFN double-sided leadless flat package structure that is easy to detect according to claim 1, characterized in that: Slide blocks (302) are fixedly provided at the top and bottom of the movable plate (304), and anti-slip patterns are provided at the top of the slide blocks (302).

4. The DFN double-sided leadless flat package structure that is easy to detect according to claim 3, characterized in that: Both sides of the bottom of the slider (302) are provided with locking beads (305), and the shape of the locking beads (305) is semicircular.

5. The DFN double-sided leadless flat package structure that is easy to detect according to claim 1, characterized in that: Both sides of the top and bottom of the package (2) are provided with slide grooves (4), and the top of the slide groove (4) is provided with a plurality of bead grooves (6).

6. The DFN double-sided leadless flat package structure that is easy to detect according to claim 5, characterized in that: The slide groove (4) is matched with the slide block (302), and the bead groove (6) is matched with the locking bead (305).

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