Combiner, radio frequency system and communication equipment

Abstract

The invention relates to a combiner, a radio frequency system and communication equipment, and the combiner comprises a first frequency division unit which is used for carrying out the frequency division processing of an electromagnetic wave signal received by a common end, so as to output a first frequency band signal through a first output end; the second frequency division unit is used for performing frequency division processing on the electromagnetic wave signal received by the common end so as to output a second frequency band signal through a second output end; the first stop band unit is connected with the first frequency division unit and is used for generating a zero point of a stop band in the frequency range of the second frequency band signal; the second stop band unit is connected with the second frequency division unit and is used for generating a zero point of a stop band in the frequency range of the first frequency band signal; wherein the first frequency division unit, the second frequency division unit, the first stop-band unit and the second stop-band unit respectively comprise a plurality of components, the components are capacitors or inductors, a plurality of discrete capacitors and inductors can be adopted, and compared with an LTCC combiner in the related technology, the hardware cost of the combiner can be greatly reduced.

Description

Technical Field

[0001] The present application relates to the field of antenna technology, and in particular to a combiner, a radio frequency system and a communication device. Background Art

[0002] With the development of technology, communication devices with communication functions (such as mobile phones, tablets, etc.) are becoming more and more popular and more and more powerful. For example, the communication application scope of carrier aggregation (CA) of multiple frequency bands is becoming wider and wider.

[0003] However, the multi-band CA combination requirement requires a combiner to perform frequency division processing. Generally, a combiner is a LTCC combiner made using a low temperature co-fired ceramic (LTCC) process, which has a relatively high cost. Summary of the invention

[0004] The embodiments of the present application provide a combiner, a radio frequency system and a communication device, which can reduce the cost of the combiner.

[0005] In a first aspect, an embodiment of the present application provides a combiner, wherein the combiner is configured with a common end, a first output end, and a second output end, wherein the combiner comprises:

[0006] a first frequency division unit, connected to the common terminal and the first output terminal respectively, and configured to perform frequency division processing on the electromagnetic wave signal received by the common terminal, so as to output a first frequency band signal via the first output terminal;

[0007] a second frequency division unit, connected to the common terminal and the second output terminal respectively, and configured to perform frequency division processing on the electromagnetic wave signal received by the common terminal, so as to output a second frequency band signal via the second output terminal;

[0008] a first stopband unit, wherein a first end of the first stopband unit is connected to the first frequency dividing unit, and the other end of the first stopband unit is grounded, and is used to generate a stopband zero point within the frequency range of the second frequency band signal;

[0009] A second stopband unit, wherein a first end of the second stopband unit is connected to the second frequency division unit, and the other end of the second stopband unit is grounded, and is used to generate a stopband zero point within the frequency range of the first frequency band signal; wherein the first frequency division unit, the second frequency division unit, the first stopband unit, and the second stopband unit respectively include multiple components, and the components are capacitors or inductors.

[0010] In a second aspect, an embodiment of the present application provides a radio frequency system, including:

[0011] The aforementioned combiner, wherein the common end of the combiner is used to connect to an antenna;

[0012] A first filter circuit connected to the first output terminal of the combiner;

[0013] a first low-noise amplifier circuit, connected to the first frequency division circuit, and configured to perform low-noise amplification processing on the received signal in the first frequency band;

[0014] A second filter circuit connected to the first output terminal of the combiner;

[0015] The second low-noise amplifier circuit is connected to the second frequency division circuit and is used for performing low-noise amplification processing on the received signal in the second frequency band.

[0016] In a second aspect, an embodiment of the present application provides a communication device, including:

[0017] antenna;

[0018] In the aforementioned radio frequency system, the common end of the combiner is connected to the antenna;

[0019] The radio frequency transceiver is connected to the output ends of the first low-noise amplifier circuit and the second low-noise amplifier circuit respectively.

[0020] The above-mentioned combiner, radio frequency system and communication equipment, wherein the combiner is configured with a common end, a first output end, and a second output end, and the combiner includes a first frequency division unit, a second frequency division unit, a first stopband unit and a second stopband unit. The first frequency division unit can perform frequency division processing on the electromagnetic wave signal received at the common end to output a first frequency band signal through the first output end, and the second frequency division unit can perform frequency division processing on the electromagnetic wave signal received at the common end to output a second frequency band signal through the second output end. The first stopband unit and the first frequency division unit are used to generate a stopband zero point within the frequency range of the second frequency band signal, and the second stopband unit is connected to the second frequency division unit to generate a stopband zero point within the frequency range of the first frequency band signal. In an embodiment of the present application, the first frequency division unit, the second frequency division unit, the first stopband unit and the second stopband unit may respectively include multiple components, each of which may be a capacitor or an inductor. In this way, the combiner provided by the implementation of the present application may adopt multiple discrete capacitor elements and inductor elements, which can realize the function of the combiner. Compared with the LTCC combiner in the related art, the hardware cost of the combiner can be greatly reduced; in addition, the present application can generate a zero point in the stopband of the corresponding frequency band signal by setting the first stopband unit and the second stopband unit, which can enhance the out-of-band suppression capability of the two frequency division units and enhance the isolation between the two frequency division units. BRIEF DESCRIPTION OF THE DRAWINGS

[0021] In order to more clearly illustrate the embodiments of the present application or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present application. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0022] Figure 1 is a communication principle diagram of carrier aggregation in one embodiment;

[0023] Figure 2 The first is a circuit schematic diagram of a combiner in one embodiment;

[0024] Figure 3 The second is a circuit schematic diagram of a combiner in one embodiment;

[0025] Figure 4 The third is a circuit schematic diagram of a combiner in one embodiment;

[0026] Figure 5 The fourth is a circuit schematic diagram of a combiner in one embodiment;

[0027] Figure 6 In one embodiment, Figure 3 The S-curve simulation diagram of the combiner shown;

[0028] Figure 7 In one embodiment, Figure 5 The S-curve simulation diagram of the combiner shown;

[0029] Figure 8a For Figure 3 The overall structural diagram of the microstrip line combiner of the combiner shown;

[0030] Figure 8b For Figure 8a A schematic diagram of the structure of the first metal layer of the microstrip line combiner shown;

[0031] Figure 8c For Figure 8a A schematic diagram of the structure of the second metal layer of the microstrip line combiner shown;

[0032] Figure 9a For Figure 5 The overall structural diagram of the microstrip line combiner of the combiner shown;

[0033] Figure 9b For Figure 9a A schematic diagram of the structure of the first metal layer of the microstrip line combiner shown;

[0034] Fig.9c For Figure 9aA schematic diagram of the structure of the second metal layer of the microstrip line combiner shown;

[0035] Fig.10 is a schematic block diagram of a radio frequency system in one embodiment;

[0036] Fig.11 is a schematic block diagram of a radio frequency system in another embodiment;

[0037] Fig.12 is a schematic block diagram of a radio frequency system in yet another embodiment;

[0038] Fig.13 is a schematic diagram of an impedance variation curve of a combiner on a Smith chart in one embodiment;

[0039] Fig.14 FIG. 4 is a block diagram of the internal structure of an electronic device in one embodiment. DETAILED DESCRIPTION

[0040] In order to make the above-mentioned purposes, features and advantages of the present application more obvious and easy to understand, the specific implementation methods of the present application are described in detail below in conjunction with the accompanying drawings. In the following description, many specific details are set forth to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without violating the connotation of the present application, so the present application is not limited by the specific embodiments disclosed below.

[0041] In the description of the present application, it should be understood that the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the features. In the description of the present application, "plurality" means at least two, such as two, three, etc., unless otherwise clearly and specifically defined.

[0042] In this application, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements, unless otherwise clearly defined. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0043] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be a central element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be a central element at the same time. The terms "vertical", "horizontal", "upper", "lower", "left", "right" and similar expressions used herein are for illustrative purposes only and are not intended to be the only implementation method.

[0044] The antenna device involved in the embodiment of the present application can be applied to a communication device with a wireless communication function, and the electronic device can be a handheld device, a vehicle-mounted device, a wearable device, a computing device, or other processing devices connected to a wireless modem, as well as various forms of user equipment (UE) (e.g., a mobile phone), a mobile station (MS), etc. For the convenience of description, the above-mentioned devices are collectively referred to as electronic devices.

[0045] like Figure 1 As shown, the communication device 10 can support carrier aggregation CA technology with multiple different frequency band combinations. Carrier aggregation simply means aggregating multiple carriers of different LTE frequencies (or the same) into a wider spectrum, and at the same time, some discontinuous spectrum fragments can be aggregated together to achieve the effect of increasing bandwidth. Exemplarily, five-carrier aggregation is to aggregate five carriers (which can be the same or different) together. Carrier aggregation can improve the data rate and network performance in the uplink, downlink, or uplink and downlink, and can also achieve frequency division duplex (FDD) and time division duplex (TDD) as well as the aggregation of licensed and unlicensed carrier spectrum. In an FDD communication link, transmission and reception use independent frequency bands. In a TDD communication link, the separation of uplink and downlink is achieved by allocating different time slots in the same frequency band. Among them, downlink carrier aggregation refers to a transmission method in which a base station 20 sends a carrier aggregation signal to the communication device 10. After receiving the downlink carrier aggregation signal, based on the combiner involved in this embodiment, the communication device 10 can extract the downlink carrier aggregation signal to achieve reception and processing of the signals of each component carrier frequency band. As of now, each user can be allocated a maximum of five subcarriers per 100MHz bandwidth, which means that each subcarrier can have a bandwidth of up to 20MHz. These five subcarriers are transmitted by the base station, received by the antenna at the same time, and synthesized through the CA data pipe 11, such as Figure 1 shown.

[0046] Generally speaking, common downlink CA combination frequency bands are: B1+B3, B1+B7, B2+B7, B1+B3+B5, B1+B3+B7, B1+B3+B40, B1+B3+B41, etc., but not limited to these CA combination frequency bands.

[0047] like Figure 2 As shown, an embodiment of the present application provides a combiner. The combiner is configured with a common terminal Port1 for connecting to an antenna, and a first output terminal Port2 and a second output terminal Port3 connected to a radio frequency device. Among them, the combiner can be used to perform frequency division processing on the electromagnetic wave signal from the antenna received by the common terminal Port1, so as to output a first frequency band signal through the first output terminal Port2 and a second frequency band signal through the second output terminal Port3 respectively. It should be noted that the frequency ranges of the first frequency band signal and the second frequency band signal are different, so as to realize frequency division processing of multi-band signals.

[0048] It should be noted that in the embodiment of the present application, the first output port Port2 and the second output port Port3 configured in the combiner can also be used as input ports, that is, the first output port Port2 and the second output port Port3 of the combiner can respectively receive electromagnetic wave signals of two frequency bands, and then combine the electromagnetic wave signals of the two frequency bands to output them to the antenna through the common port Port1.

[0049] Specifically, the combiner 100 includes: a first frequency division unit 110 , a second frequency division unit 120 , a first stopband unit 130 and a second stopband unit 140 .

[0050] The first frequency division unit 110 is connected to the common end Port1 and the first output end Port2 respectively, and is used to perform frequency division processing on the electromagnetic wave signal received by the common end Port1, so as to output the first frequency band signal through the first output end Port2. The first end of the first stop band unit 130 is connected to the first frequency division unit 110, and the other end of the first stop band unit 130 is grounded, and is used to generate a zero point of the stop band within the frequency range of the second frequency band signal. Among them, the zero point can be understood as the corresponding trough point in the S (2,1) curve or the S (3,1) curve in the S parameter curve. It can be understood that the first frequency division unit 110 and the first stop band unit 130 can be understood as a first filtering unit, which is used to allow the first frequency band signal to pass through and prevent the second frequency band signal from passing through. That is, the first path formed by the first frequency division unit 110 and the first stop band unit 130 can be understood as a direct pass path of the first frequency band signal, which is in a high impedance state for the second frequency band signal. That is, the first path is in a direct pass state for the first frequency band signal and in a high impedance state for other signals other than the first frequency band signal. Therefore, when the first frequency division unit 110 receives the carrier aggregation signal, it can filter out other signals except the first frequency band signal in combination with the first stopband unit 130, and only allow the first frequency band signal to pass through and be output through the first output port Port2.

[0051] The second frequency division unit 120 is connected to the common end Port1 and the second output end Port3, respectively, and is used to perform frequency division processing on the electromagnetic wave signal received by the common end Port1, so as to output the second frequency band signal through the second output end Port3. The second stop band unit 140, the first end of the second stop band unit 140 is connected to the second frequency division unit 120, and the other end of the second stop band unit 140 is grounded, and is used to generate a zero point of the stop band within the frequency range of the first frequency band signal. It can be understood that the second frequency division unit 120 and the second stop band unit 140 can be understood as a second filtering unit, which is used to allow the second frequency band signal to pass through and prevent the first frequency band signal from passing through. That is, the second path formed by the second frequency division unit 120 and the second stop band unit 140 can be understood as a direct pass path of the second frequency band signal, which is in a high impedance state for the first frequency band signal. That is, the second path is in a direct pass state for the second frequency band signal, and is in a high impedance state for other signals other than the second frequency band signal. Therefore, when the second frequency division unit 120 receives the carrier aggregation signal, it can filter out other signals except the second frequency band signal in combination with the second stopband unit 140, and only allow the second frequency band signal to pass through and be output through the second output port Port3.

[0052] In the implementation of the present application, the first frequency division unit 110, the second frequency division unit 120, the first stopband unit 130, and the second stopband unit 140 respectively include multiple components, each of which may be a capacitor or an inductor. It can be understood that the first frequency division unit 110 may be a combination unit of multiple capacitor elements or multiple inductor elements, and the second frequency division unit 120 may be a combination unit of multiple capacitor elements or multiple inductor elements, but the component units of the first frequency division unit 110 and the second frequency division unit 120 are not the same. The first stopband unit 130 and the second stopband unit 140 may be a combination unit of a capacitor element and an inductor element, respectively, wherein the combination form of the first stopband unit 130 and the second stopband unit 140 may be the same or different, but the first stopband unit 130 and the second stopband unit 140 respectively include different element parameters of the capacitor element and the inductor element. Among them, the element parameter can be understood as the capacitance value of the capacitor element, and the inductance value of the inductor element.

[0053] In the embodiment of the present application, the first frequency division unit 110, the second frequency division unit 120, the first stopband unit 130 and the second stopband unit 140 may respectively include multiple components, each of which may be a capacitor or an inductor. In this way, the combiner provided by the implementation of the present application may adopt multiple discrete capacitor elements and inductor elements, which can realize the function of the combiner. Compared with the LTCC combiner in the related art, the hardware cost of the combiner can be greatly reduced; in addition, the present application can generate a zero point in the stopband of the corresponding frequency band signal by setting the first stopband unit 130 and the second stopband unit 140, which can enhance the out-of-band suppression capability of the two filter units and enhance the isolation between the two filter units.

[0054] In one of the embodiments, the frequency of the first frequency band signal is less than the frequency of the second frequency band signal. Exemplarily, the first frequency band signal may be a low frequency band signal, and the second frequency band signal may be at least one of a medium frequency band, a high frequency band, and an ultra-high frequency band signal. Optionally, the first frequency band signal may be a low, medium, or high frequency band signal, and the second frequency band signal may be an ultra-high frequency band signal. The frequency range of the low frequency band signal is 700 to 960 MHz, the frequency range of the medium and high frequency band signal is 1700 to 2700 MHz, and the frequency range of the ultra-high frequency band signal is 3300 to 3800 MHz.

[0055] like Figure 3 As shown, specifically, the first frequency division unit 110 includes a first inductor L1 and a second inductor L2, wherein the first end of the first inductor L1 is connected to the common end Port1, and the second end of the first inductor L1 is connected to the first output end Port2 via the second inductor L2. The first inductor L1 and the second inductor L2 are connected in series between the common end Port1 and the first output end Port2 of the combiner. The first frequency division unit 110 can divide the first frequency band signal with a relatively low frequency in the electromagnetic wave signal based on the first inductor L1 and the second inductor L2. The second frequency division unit 120 includes a first capacitor C1 and a second capacitor C2, wherein the first end of the first capacitor C1 is connected to the common end Port1, and the second end of the first capacitor C1 is connected to the second output end Port3 via the second capacitor C2. The first capacitor C1 and the second capacitor C2 are connected in series between the common end Port1 and the second output end Port3 of the combiner. The second frequency division unit 120 can divide the second frequency band signal with a relatively high frequency in the electromagnetic wave signal based on the first capacitor C1 and the second capacitor C2.

[0056] The setting of the inductance value of each inductor in the first frequency division unit 110 and the setting of the capacitance value of each capacitor in the second frequency division unit 120 can be adaptively adjusted according to the frequency of the first frequency band signal and the second frequency band signal. In the embodiment of the present application, the combination mode of the first frequency band signal and the second frequency band signal is not limited, nor is it limited to the above examples.

[0057] In an embodiment, the first frequency division unit 110 may include multiple inductance elements, and the second frequency division unit 120 may include multiple capacitance elements. In this way, the combiner provided by the implementation of the present application may adopt multiple discrete capacitance elements and inductance elements, which can realize the frequency division function of the combiner. Compared with the LTCC combiner in the related art, the hardware cost of the combiner can be greatly reduced.

[0058] like Figure 3 As shown, in one embodiment, the first stopband unit includes a first stopband branch 131, the first stopband branch 131 includes a third inductor L3 and a third capacitor C3 connected in series, the first end of the first stopband branch 131 is connected to the first frequency division unit 110, and the second end of the first stopband branch 131 is grounded. The first end of the first stopband branch 131 can be connected to the first end of the first inductor L1, the second end of the first inductor L1, or the second end of the second inductor L2 in the first frequency division unit 110, and the second end of the second stopband branch is grounded.

[0059] The first stop-band branch 131 includes a third inductor L3 and a third capacitor C3 connected in series, wherein the first end of the third inductor L3 can be connected to the first frequency division unit 110 as the first end of the first stop-band branch 131, the first end of the third inductor L3 is connected to the second end of the third capacitor C3, and the second end of the third capacitor C3 can be used as the second end of the first stop-band branch 131 and is grounded.

[0060] Optionally, the positions of the third inductor L3 and the third capacitor C3 can be interchanged, that is, the first end of the third capacitor C3 can be used as the first end of the first stopband branch 131 , and the second end of the third inductor L3 can be used as the second end of the first stopband branch 131 .

[0061] The second stopband unit includes a second stopband branch 141, the second stopband branch 141 includes a fourth inductor L4 and a fourth capacitor C4 connected in series, a first end of the second stopband branch 141 is connected to the second frequency division unit 120, and a second end of the second stopband branch 141 is grounded. The first end of the second stopband branch 141 can be connected to the first end of the first capacitor C1, the second end of the first capacitor C1, or the second end of the second capacitor C2 in the second frequency division unit 120, and the second end of the second stopband branch 141 is grounded.

[0062] The second stop-band branch 141 includes a fourth inductor L4 and a fourth capacitor C4 connected in series, wherein the first end of the fourth inductor L4 can be connected to the second frequency division unit 120 as the first end of the second stop-band branch 141, the first end of the fourth inductor L4 is connected to the second end of the fourth capacitor C4, and the second end of the fourth capacitor C4 can be used as the second end of the second stop-band branch 141 and is grounded.

[0063] Optionally, the positions of the fourth inductor L4 and the fourth capacitor C4 can be interchanged, that is, the first end of the fourth capacitor C4 can be used as the first end of the second stopband branch 141 , and the second end of the fourth inductor L4 can be used as the second end of the second stopband branch 141 .

[0064] In the embodiment of the present application, the capacitance value C1 of the capacitor and the inductance value L1 of the inductor in the first stop-band branch 131 and the second stop-band branch 141 need to satisfy the following relationship:

[0065] jωL1+(1 / jωC1)=0 (Formula 1)

[0066] For example, if the first frequency dividing unit 110 needs to generate a zero point at f0=2 GHz, the component parameters of the third inductor L3 and the third capacitor C3 in the first stopband unit 130 need to satisfy the following formula:

[0067] j*2π*f0* L1+1 / j*2π*f0* C1=0 (Formula 2)

[0068] Correspondingly, if the second frequency dividing unit 120 needs to generate a zero point at f1=800 MHz, the inductance value L2 of the fourth inductor L4 and the capacitance value C2 of the fourth capacitor C4 in the second stopband unit 140 need to satisfy the following formula:

[0069] j*2π*f1* L2+1 / j*2π* f1* C2=0 (Formula 3)

[0070] In this embodiment, the capacitance value of the capacitor and the inductance value of the inductor in the first stop-band branch 131 and the second stop-band branch 141 can be reasonably set according to the frequency division requirements of the combiner, so that the first filter unit generates a zero point at a certain frequency of the second frequency band signal, and the second filter unit generates a zero point at a certain frequency of the first frequency band signal. The out-of-band suppression capability of each filter unit can be enhanced by low-cost capacitor and inductor elements, and the isolation between the first filter unit and the second filter unit can be enhanced, thereby improving the frequency division performance of the combiner.

[0071] like Figure 4As shown, optionally, the first stopband unit may also include a plurality of first stopband branches 131, wherein the first ends of the first stopband branches 131 are respectively connected to different connection nodes of the first frequency division unit 110. Each first stopband branch 131 may generate a zero point of the stopband within the frequency range of the second frequency band signal, and the positions of the zero points generated by the first stopband branches 131 are different. Exemplarily, the first stopband unit 130 may also include two first stopband branches 131, wherein the first end of one of the first stopband branches 131 may be connected to the second end of the first inductor L1, and the first end of the other first stopband branch 131 may be connected to the second end of the second inductor L2.

[0072] In this embodiment, by setting two first stop-band branches 131 and reasonably setting the component parameters of the inductance and capacitance in the two first stop-band branches 131, two zero points can be generated within the frequency range of the second frequency band signal, which can further enhance the out-of-band suppression capability of each filtering unit, enhance the isolation between the first filtering unit and the second filtering unit, and thereby improve the frequency division performance of the combiner.

[0073] like Figure 5 As shown, optionally, the second stopband unit may also include a plurality of second stopband branches 141, wherein the first ends of the second stopband branches 141 are respectively connected to different connection nodes of the second frequency division unit 120. Each second stopband branch 141 may generate a zero point of the stopband within the frequency range of the first frequency band signal, and the positions of the zero points generated by the second stopband branches 141 are different. Exemplarily, the second stopband unit 140 may also include two second stopband branches 141, wherein the first end of one second stopband branch 141 may be connected to the first end of the first capacitor C1, wherein the first end of the other second stopband branch 141 may be connected to the first end of the second capacitor C2.

[0074] In this embodiment, by setting two second stop-band branches 141 and reasonably setting the component parameters of the inductance and capacitance in the two second stop-band branches 141, two zero points of the stop-band can be generated within the frequency range of the first frequency band signal, which can further enhance the out-of-band suppression capability of each filtering unit, enhance the isolation between the first filtering unit and the second filtering unit, and thereby improve the frequency division performance of the combiner.

[0075] In one of the embodiments, the first frequency band signal includes an electromagnetic wave signal in a low frequency band, and the second frequency band signal includes an electromagnetic wave signal in a medium frequency and a high frequency band. In an embodiment of the present application, when the first frequency band signal includes an electromagnetic wave signal in a low frequency band, its first frequency band signal may include sub-band signals such as B8. When the second frequency band signal includes an electromagnetic wave signal in a medium and high frequency band, its second frequency band signal may include sub-band signals such as B3, B40, and B41. The combiner provided in the implementation of the present application can be used to support the frequency division processing of electromagnetic wave signals in low frequency bands and electromagnetic wave signals in medium and high frequency bands. It should be noted that in an embodiment of the present application, the sub-bands included in the first frequency band signal and the second frequency band signal are not limited to the above examples.

[0076] Please continue to refer to Figure 3 , the first frequency division unit 110 includes a first inductor L1 and a second inductor L2, wherein the first inductor L1 and the second inductor L2 are connected in series and connected between the common terminal Port1 and the first output terminal Port2 of the combiner. The first stopband unit may include a first stopband branch 131, and the first stopband branch 131 includes a third inductor L3 and a third capacitor C3, wherein the first end of the third inductor L3 is connected to the first inductor L1 and the second inductor L2 respectively, and the second end of the third inductor L3 is grounded via the third capacitor C3. Optionally, the positions of the third inductor L3 and the third capacitor C3 can also be interchanged. Among them, by setting the component parameters of each capacitor and inductor and the connection relationship between each component in the first frequency division unit 110 and the first stopband unit, a first path can be formed in the combiner, which only allows the low-frequency band signal to pass through, and is in a high-impedance state for the medium and high frequency band signals other than the low-frequency band signal, so as to prevent the medium and high frequency band signals from passing through, and then the low-frequency band signal can be output through the first output terminal Port2.

[0077] The second frequency division unit 120 includes a first capacitor C1 and a second capacitor C2, wherein the first capacitor C1 and the second capacitor C2 are connected in series and connected between the common terminal Port1 and the second output terminal Port3 of the combiner. The second stopband unit may include a second stopband branch 141, and the second stopband branch 141 includes a fourth inductor L4 and a fourth capacitor C4, wherein the first end of the fourth inductor L4 is connected to the first capacitor C1 and the second capacitor C2 respectively, and the second end of the fourth inductor L4 is grounded via the fourth capacitor C4. Optionally, the positions of the fourth inductor L4 and the fourth capacitor C4 can also be interchanged. Among them, by setting the component parameters of each capacitor and inductor and the connection relationship between each component in the second frequency division unit 120 and the second stopband unit 140, a second path can be formed in the combiner, which only allows the passage of medium and high frequency band signals, and is in a high impedance state for low frequency band signals other than the medium and high frequency band signals to prevent the passage of low frequency band signals, and then the medium and high frequency band signals can be output through the first output terminal Port2.

[0078] In this embodiment, the combiner can use four capacitor elements (C1, C2, C3, C4) and four inductor elements (L1, L2, L3, L4), which can replace the LTCC combiner in traditional technology to achieve frequency division processing of low-frequency and medium-high frequency band signals. Figure 6 for Figure 3 The schematic diagram of the combiner is shown in the figure. Figure 6 As shown, from the simulation data, the insertion loss of the combiner provided in the embodiment of the present application is within 0.6dB, and the isolation is greater than 20dB, which meets the system index requirements. Therefore, the combiner provided in the embodiment of the present application can greatly reduce the hardware cost of the combiner while having the same performance as the LTCC combiner.

[0079] In one of the embodiments, the first frequency band signal includes electromagnetic wave signals in low, medium and high frequency bands, and the second frequency band signal includes electromagnetic wave signals in ultra-high frequency bands. In an embodiment of the present application, when the first frequency band signal includes electromagnetic wave signals in low, medium and high frequency bands, its first frequency band signal may include sub-band signals such as B3, B5, and B8. When the second frequency band signal includes electromagnetic wave signals in an ultra-high frequency band, its second frequency band signal may include sub-band signals such as B78. The combiner provided in the implementation of the present application can be used to support frequency division processing of electromagnetic wave signals in low, medium and high frequency bands and electromagnetic wave signals in an ultra-high frequency band. It should be noted that in an embodiment of the present application, the sub-band signals of the first frequency band signal and the second frequency band signal include but are not limited to the above examples.

[0080] Please continue to refer to Figure 5 , the first frequency division unit 110 includes a first inductor L1 and a second inductor L2, wherein the first inductor L1 and the second inductor L2 are connected in series, and are connected between the common terminal Port1 and the first output terminal Port2 of the combiner. The first stopband unit may include a first stopband branch 131, and the first stopband branch 131 includes a third inductor L3 and a third capacitor C3, wherein the first end of the third inductor L3 is connected to the first inductor L1 and the second inductor L2 respectively, and the second end of the third inductor L3 is grounded via the third capacitor C3. Optionally, the positions of the third inductor L3 and the third capacitor C3 can also be interchanged. Among them, by setting the component parameters of each capacitor and inductor in the first frequency division unit 110 and the first stopband unit 130, a third path can be formed in the combiner, which only allows the passage of low, medium and high frequency band signals, and is in a high impedance state for ultra-high frequency band signals other than the medium and high frequency band signals, so as to prevent the passage of the ultra-high frequency band signals, and then the low, medium and high frequency band signals can be output through the first output terminal Port2.

[0081] The second frequency division unit 120 includes a first capacitor C1 and a second capacitor C2, wherein the first capacitor C1 and the second capacitor C2 are connected in series and connected between the common terminal Port1 and the second output terminal Port3 of the combiner. The second stopband unit may include two second stopband branches 141, each second stopband branch 141 includes a fourth inductor L4 and a fourth capacitor C4, wherein the first end of a second stopband branch 141 is respectively connected to the first end of the first capacitor C1 and the common terminal Port1; the first end of another second stopband branch 141 is respectively connected to the second end of the first capacitor C1 and the first end of the second capacitor C2. Optionally, the positions of the fourth inductor L4 and the fourth capacitor C4 can also be interchanged. Among them, by setting the component parameters of each capacitor and inductor and the connection relationship between each component in the second frequency division unit 120 and the second stopband unit, a fourth path can be formed in the combiner, which only allows the passage of ultra-high frequency band signals, and presents a high impedance state to low, medium and high frequency band signals other than the ultra-high frequency band signals, so as to prevent the passage of low, medium and high frequency band signals, and then the ultra-high frequency band signals can be output through the second output terminal Port3.

[0082] In this embodiment, the combiner can use five capacitors (C1, C2, C3, C4, C5) and five inductors (L1, L2, L3, L4, L5), which can replace the LTCC combiner in the traditional technology to achieve frequency division processing of ultra-high frequency and low, medium and high frequency band signals. Figure 7 for Figure 5 The principle simulation diagram of the combiner is shown in FIG. Figure 7 As shown in the figure, from the simulation data, the insertion loss of the combiner provided in the embodiment of the present application is within 1dB, and the isolation is greater than 20dB, which meets the system index requirements. Therefore, the combiner provided in the embodiment of the present application can greatly reduce the hardware cost of the combiner while having the same performance as the LTCC combiner. In addition, Figure 7 As shown, from the simulation data, in the combiner provided in the embodiment of the present application, the first filter unit can generate a zero point at a higher frequency (the S(2,1) curve has a concave point), and the second filter unit generates two zero points at a lower frequency (the S(3,1) curve has two concave points), which can further enhance the out-of-band suppression capability of each filter unit, enhance the isolation between the first filter unit and the second filter unit, and thus improve the frequency division performance of the combiner.

[0083] In one embodiment, each inductor included in the combiner in the implementation of the present application is a chip inductor, and can also be a microstrip line inductor. In the embodiment of the present application, each inductor in the combiner can adopt a microstrip line inductor, and its microstrip line inductor has the same performance as the chip inductor, belongs to normal routing, and can further reduce the cost compared with the chip inductor. At the same time, the microstrip line inductor has more advantages in power capacity, heat dissipation, coupling, etc.

[0084] Optionally, each inductor included in the combiner in the implementation of the present application may also be a binding wire inductor, and the binding wire may be a gold wire, an aluminum wire or a copper wire, which can reduce the insertion loss of the combiner.

[0085] In one embodiment, Figure 8a for Figure 3 The overall structure diagram of the microstrip line combiner of the combiner is shown in FIG. Figure 8b It is a schematic diagram of the structure of the first metal layer of the microstrip line combiner. Figure 8c Schematic diagram of the structure of the second metal layer of the microstrip line combiner. The combiner includes: a first metal layer 101 and a second metal layer 102, wherein the second metal layer 102 is located on the first metal layer 101. The first metal layer 101 and the second metal layer 102 can be different metal layers of the same PCB board, or metal layers on different PCB boards. In the implementation of the present application, there is no limitation on the first metal layer 101 and the second metal layer 102. The first metal layer 101 can be used as the bottom metal layer of the combiner, and the second metal layer 102 can be used as the top metal layer of the combiner. The common end Port1, the first output end Port2, and the second output end Port3 of the combiner are arranged on the second metal layer 102.

[0086] Specifically, the first metal layer 101 is provided with a first sub-microstrip winding L1-1 and a second sub-microstrip winding L2-1, and the second metal layer 102 is provided with a third sub-microstrip winding L1-2 and a fourth sub-microstrip winding L2-2. The first sub-microstrip winding L1-1 and the third sub-microstrip winding L1-2 are connected to form a first inductor L1, and the second sub-microstrip winding L2-1 and the fourth sub-microstrip winding L2-2 are connected to form a second inductor L2. The capacitor of the second frequency division unit (for example, the first capacitor C1 and the second capacitor C2), the first stopband unit 130 and the capacitor in the second stopband unit (for example, the third capacitor C3 and the fourth capacitor C4) are arranged in the second metal layer 102. The inductor in the first stopband unit is arranged in the first metal layer 101 and the second metal layer 102, and the inductor in the second stopband unit is at least partially arranged in the second metal layer 102. The second metal layer 102 is further provided with a transmission line and a ground line, wherein the transmission line is used to connect various components (such as inductors and capacitors), and the ground line can connect the capacitors in the first stop-band unit and the second stop-band unit to the ground layer.

[0087] In the implementation of the present application, by setting a first metal layer 101 and a second metal layer 102, a plurality of sub-microstrip windings are set on each metal layer to form a microstrip line inductor. In this way, the cost can be reduced compared to the chip inductor. At the same time, the microstrip line inductor has more advantages in power capacity, heat dissipation, coupling and other aspects.

[0088] like Figure 8b-8cAs shown, the first metal layer 101 is further provided with a fifth sub-microstrip winding L3-1 and a sixth sub-microstrip winding L4-1, and the second metal layer 102 is further provided with a seventh sub-microstrip winding L3-2 and an eighth sub-microstrip winding L4-2, wherein the fifth sub-microstrip winding L3-1 and the seventh sub-microstrip winding L3-2 are connected to form a third inductor L3, and the sixth sub-microstrip winding L4-1 and the eighth sub-microstrip winding L4-2 are connected to form a fourth inductor L4.

[0089] In one embodiment, Figure 9a for Figure 5 The overall structure diagram of the microstrip line combiner of the combiner is shown in FIG. Figure 9b is a schematic structural diagram of the first metal layer 101 of the microstrip line combiner, Fig.9c 1 is a schematic diagram of the structure of the second metal layer 102 of the microstrip line combiner. Specifically, the first metal layer 101 is provided with a first sub-microstrip winding L1-1, a second sub-microstrip winding L2-

[0090] 1, the second metal layer 102 is provided with a third sub-microstrip winding L1-2 and a fourth sub-microstrip winding L2-2; wherein the first sub-microstrip winding L1-1 and the third sub-microstrip winding L1-2 are connected to form a first inductor L1, and the second sub-microstrip winding L2-1 and the fourth sub-microstrip winding L2-2 are connected to form a second inductor L2. The capacitors of the second frequency division unit (for example, the first capacitor C1 and the second capacitor C2), the capacitors in the first stopband unit 130 and the second stopband unit 140 (for example, the third capacitor C3 and the two fourth capacitors C4) are provided in the second metal layer 102. Among them, the first metal layer 101 is also provided with a ninth sub-microstrip winding L3-1, and the second metal layer 102 is also provided with a tenth sub-microstrip winding L3-2, an eleventh sub-microstrip winding L41 and a twelfth sub-microstrip winding L42, wherein the ninth sub-microstrip winding L3-1 and the tenth sub-microstrip winding L3-2 are connected to form the third inductor L3 of the first stopband unit, and the eleventh sub-microstrip winding L41 and the twelfth sub-microstrip winding L42 are respectively used to form the fourth inductor L4 in the two second stopband branches 141.

[0091] In the implementation of the present application, by setting a first metal layer 101 and a second metal layer 102, a plurality of sub-microstrip windings are set on each metal layer to form a microstrip line inductor. In this way, the cost can be reduced compared to the chip inductor. At the same time, the microstrip line inductor has more advantages in power capacity, heat dissipation, coupling and other aspects.

[0092] like Fig.10As shown, an embodiment of the present application further provides a radio frequency system, including the combiner 100 in any of the foregoing embodiments, the first filter circuit 200, the first low noise amplifier circuit 300, the second filter circuit 400, the second low noise amplifier circuit 500 and the radio frequency transceiver 600. The common end of the combiner 100 is used to connect the antenna, and the combiner 100 can perform frequency division processing on the electromagnetic wave signal received by the antenna to separate the first frequency band signal and the second frequency band signal, wherein the first output end of the combiner 100 can output the first frequency band signal, and the second output end of the combiner 100 can output the second frequency band signal.

[0093] The first filtering circuit 200 is connected to the first output end of the combiner 100, and can filter the received first frequency band signal to output at least one corresponding first sub-frequency band signal. The first sub-frequency band signal is a signal of a specific frequency band in the first frequency band signal. For example, when the first frequency band signal is a low-frequency band signal, its first sub-frequency band signal can be a signal of a frequency band such as B5 or B8. Optionally, the first filtering circuit 200 may include at least one first filter. If there are multiple first filters, the passbands of the first filters are different, that is, the frequency bands of the first sub-frequency band signals output by the first filters are different.

[0094] The first low noise amplifier circuit 300 is connected to the first filter circuit 200 and is used to perform low noise amplification processing on the received first frequency band signal. The first low noise amplifier circuit 300 may include at least one first low noise amplifier, and the first low noise amplifier may perform low noise amplification processing on the received signal and output the amplified signal to the RF transceiver 600, thereby realizing the reception processing of the first frequency band signal.

[0095] Optionally, the first low noise amplifier circuit 300 may be an LNABank device or an LFEM device. The specific form of the first low noise amplifier circuit 300 is not limited in the embodiment of the present application.

[0096] The second filtering circuit 400 is connected to the second output port Port3 of the combiner 100, and can filter the received second frequency band signal to output at least one corresponding second sub-frequency band signal. The second sub-frequency band signal is a signal of a specific frequency band in the second frequency band signal. For example, when the first frequency band signal is a medium-high frequency band signal, its second sub-frequency band signal can be a signal of a frequency band such as B40 or B41. Optionally, the second filtering circuit 400 may include at least one second filter. If there are multiple second filters, the passbands of the second filters are different, that is, the frequency bands of the second sub-frequency band signals output by the second filters are different.

[0097] The second low noise amplifier circuit 500 is connected to the second filter circuit 400 and is used to perform low noise amplification processing on the received second frequency band signal. The second low noise amplifier circuit 500 may include at least one second low noise amplifier, and the second low noise amplifier may perform low noise amplification processing on the received signal, and output the amplified signal to the RF transceiver 600, thereby realizing the reception processing of the second frequency band signal.

[0098] Optionally, the second low noise amplifier circuit 500 may be an LNABank device or an LFEM device. In the embodiment of the present application, the specific form of the first low noise amplifier circuit 300 is not limited.

[0099] In an embodiment of the present application, a radio frequency system may include a combiner 100, a first filter circuit 200, a first low-noise amplifier circuit 300, a second filter circuit 400, and a second low-noise amplifier circuit 500 in any of the aforementioned embodiments, wherein the combiner 100 may include a first frequency division unit, a second frequency division unit, a first stopband unit, and a second stopband unit, which may respectively include a plurality of components, each of which may be a capacitor or an inductor. Thus, the combiner 100 provided in the implementation of the present application may adopt a plurality of discrete capacitor elements and inductor elements, which may realize the function of the combiner 100, and may greatly reduce the hardware cost of the combiner 100 relative to the LTCC combiner in the related art; in addition, the present application may generate a stopband zero by setting a first stopband unit and a second stopband unit, thereby enhancing the out-of-band suppression capability of the two filter units and enhancing the isolation between the two filter units. In addition, the port impedance of the combiner 100 in the RF system in the embodiment of the present application can be directly matched with the port impedance of the first filter circuit, and can also be directly matched with the port impedance of the second filter circuit. Compared with the RF system in the related art, the first matching network set between the LTCC combiner and the first filter power supply and the second matching network set between the LTCC combiner and the second filter power supply can be omitted, which reduces the cost of the matching network, saves the debugging workload, and improves the debugging efficiency.

[0100] For ease of explanation, Figure 3 The combiner 100 shown is applied to a radio frequency system as an example for explanation, wherein the combiner 100 can realize frequency division processing of low frequency band signals and mid-high frequency end signals. For example, the radio frequency system can support CA combination frequency bands of the first frequency band signal and the second frequency band signal, including but not limited to B8+B3, B8+B40, B5+B41, etc.

[0101] like Fig.11As shown, if the RF system needs to support B8+B41 downlink CA, the electromagnetic wave signal received by the antenna ANT is processed by the combiner 100 for frequency division and filtering to output the low frequency band signal LB and the medium and high frequency band signal MHB respectively, and then enter the B8 filter and the B41 filter in the first filter circuit 200 respectively, and enter the first low noise amplifier LB1 LNA in the first low noise amplifier circuit 300 and the second low noise amplifier MHB4 LNA in the second low noise amplifier circuit 500 respectively in two ways, and finally enter the RF transceiver 600 for demodulation. In this embodiment, the working frequency band of the combiner 100 includes a low frequency band and a medium and high frequency band. Among them, the low frequency band LB is 700-960MHz; the medium and high frequency band MHB is: 1700-2700MHz. The working principle of the combiner 100 is: when the LB signal received by the antenna ANT end enters the common end of the combiner 100, the LB signal takes the first path, that is, the LB path, and the first path is in a straight-through state for the LB signal and in a high-impedance state for the MHB signal; when the MHB signal received by the antenna ANT end enters the common end of the combiner 100, the MHB signal takes the second path, that is, the MHB path, and the second path is in a straight-through state for the MHB signal and in a high-impedance state for the LB signal, so as to achieve isolation of the LB signal and the MHB signal.

[0102] The combiner 100 in the embodiment of the present application uses multiple discrete capacitor elements and resistor elements, and the port impedance of the combiner 100 can be designed according to the port impedance of the filter, so that the use of a matching network between the combiner 100 and the filter can be avoided, thereby further reducing costs and improving debugging efficiency.

[0103] For ease of explanation, Figure 5 The combiner 100 shown is applied to a radio frequency system as an example for explanation, wherein the combiner 100 can realize frequency division processing of low, medium and high frequency band signals and ultra-high frequency band signals. For example, the radio frequency system can support CA combination frequency bands of the first frequency band signal and the second frequency band signal, including but not limited to B3+B78, B5+B78, B8+B78, etc.

[0104] like Fig.12As shown, if the RF system needs to support B5+B78 downlink CA, the electromagnetic wave signal received by the antenna ANT is processed by the combiner 100 for frequency division and filtering to output low, medium and high frequency band signals LMHB and ultra-high frequency band signals UHB respectively, and then enter the B5 filter and B78 filter in the first filter circuit 200 respectively, and enter the first low noise amplifier LB1 LNA in the first low noise amplifier circuit 300 and the second low noise amplifier UHB LNA in the second low noise amplifier circuit 500 respectively in two ways, and finally enter the RF transceiver 600 for demodulation. In this embodiment, the working frequency band of the combiner 100 includes low, medium and high frequency band signals and ultra-high frequency band. Among them, the low, medium and high frequency band LMHB is 700~2700MHz; the ultra-high frequency band UHB is: 3300~3800MHz. The working principle of the combiner 100 is: when the LMHB signal received by the antenna ANT end enters the common end of the combiner 100, the LMHB signal takes the third path, that is, the LMHB path, and the first path is in a straight-through state for the LMHB signal and in a high-impedance state for the UHB signal; when the UHB signal received by the antenna ANT end enters the common end of the combiner 100, the UHB signal takes the fourth path, that is, the UHB path, and the second path is in a straight-through state for the UHB signal and in a high-impedance state for the LMHB signal, so as to achieve isolation of the LMHB signal from the UHB signal.

[0105] After theoretical research and simulation verification, the impedance change curve of the combiner 100 provided in the embodiment of the present application can be expressed on the Smith chart as follows: Fig.13 From the curve shown in the Smith chart, the frequency distribution of MHB and UHB is near 1, that is, the port impedance of the combiner 100 is completely matched with the port impedance of each filter, and no additional impedance matching network is required to reach 1. Therefore, the combiner 100 in the embodiment of the present application uses a plurality of discrete capacitor elements and resistor elements, and the port impedance of the combiner 100 can be designed according to the port impedance of the filter, so that the matching network between the combiner 100 and the filter can be avoided, thereby further reducing costs and improving debugging efficiency.

[0106] The embodiment of the present application further provides a communication device, comprising: an antenna and a radio frequency system as in any of the aforementioned embodiments; wherein the common end of the combiner is connected to the antenna.

[0107] In an embodiment of the present application, the communication device may include a combiner, a first filter circuit, a first low-noise amplifier circuit, a second filter circuit, a second low-noise amplifier circuit, a radio frequency transceiver and an antenna in any of the aforementioned embodiments. Among them, the combiner may include a first frequency division unit, a second frequency division unit, a first stopband unit and a second stopband unit, which may respectively include a plurality of components, each of which may be a capacitor or an inductor. In this way, the combiner provided by the implementation of the present application may adopt a plurality of discrete capacitor elements and inductor elements, which may realize the function of the combiner, and can greatly reduce the hardware cost of the combiner compared to the LTCC combiner in the related art; in addition, the present application can generate a zero point of the stopband by setting the first stopband unit and the second stopband unit, so that the out-of-band suppression capability of the two filter units can be enhanced, and the isolation between the two filter units can be enhanced. In addition, the port impedance of the combiner in the RF system in the embodiment of the present application can be directly matched with the port impedance of the first filter circuit, and can also be directly matched with the port impedance of the second filter circuit. Compared with the RF system in the related art, the first matching network set between the LTCC combiner and the first filter power supply and the second matching network set between the LTCC combiner and the second filter power supply can be omitted, which reduces the cost of the matching network, saves the debugging workload, and improves the debugging efficiency.

[0108] like Fig.14 As shown, further, the communication device is taken as a mobile phone 10 as an example for explanation, specifically, as Fig.14 As shown, the mobile phone 10 may include a memory 21 (which optionally includes one or more computer-readable storage media), a processing circuit 22, an input / output (I / O) subsystem 24, and at least one radio frequency system 25 as in any of the above embodiments. These components may communicate via one or more communication buses or signal lines 29. Those skilled in the art will appreciate that Fig.14 The illustrated mobile phone 10 does not constitute a limitation of the mobile phone, and may include more or fewer components than shown, or combine certain components, or arrange the components differently. Fig.14 The various components shown in the EMBODIMENTS 2000 are implemented in hardware, software, or a combination of hardware and software, including one or more signal processing and / or application specific integrated circuits.

[0109] The memory 21 optionally includes a high-speed random access memory, and optionally also includes a non-volatile memory, such as one or more disk storage devices, flash memory devices, or other non-volatile solid-state memory devices. Exemplarily, the software components stored in the memory 21 include an operating system 211, a communication module (or an instruction set) 212, a global positioning system (GPS) module (or an instruction set) 213, etc.

[0110] The processing circuit 22 may be used to control the operation of the mobile phone 10. The processing circuit 22 may be based on one or more microprocessors, microcontrollers, digital signal processors, baseband processors, power management units, audio codec chips, application specific integrated circuits, and the like.

[0111] Among them, the I / O subsystem 24 couples input / output peripherals on the mobile phone 10, such as a keypad and other input control devices, to the peripheral device interface 23. The I / O subsystem 24 optionally includes a touch screen, buttons, a tone generator, an accelerometer (motion sensor), an ambient light sensor and other sensors, a light emitting diode and other status indicators, a data terminal, etc. Exemplarily, a user can control the operation of the mobile phone 10 by supplying commands via the I / O subsystem 24, and can use the output resources of the I / O subsystem 24 to receive status information and other outputs from the mobile phone 10. For example, a user can press button 241 to start or turn off the mobile phone.

[0112] The above embodiments only express several implementation methods of the present application, and the descriptions thereof are relatively specific and detailed, but they cannot be understood as limiting the scope of the present application. It should be pointed out that, for a person of ordinary skill in the art, several modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the attached claims.

Claims

1. A combiner, characterized in that: The combiner is configured with a common end, a first output end, and a second output end, wherein the combiner comprises: a first frequency division unit, connected to the common terminal and the first output terminal respectively, and configured to perform frequency division processing on the electromagnetic wave signal received by the common terminal, so as to output a first frequency band signal via the first output terminal; a second frequency division unit, connected to the common terminal and the second output terminal respectively, and configured to perform frequency division processing on the electromagnetic wave signal received by the common terminal, so as to output a second frequency band signal via the second output terminal; a first stopband unit, wherein a first end of the first stopband unit is connected to the first frequency dividing unit, and the other end of the first stopband unit is grounded, and is used to generate a stopband zero point within the frequency range of the second frequency band signal; A second stopband unit, wherein a first end of the second stopband unit is connected to the second frequency division unit, and the other end of the second stopband unit is grounded, and is used to generate a stopband zero point within the frequency range of the first frequency band signal; wherein the first frequency division unit, the second frequency division unit, the first stopband unit, and the second stopband unit respectively include multiple components, and the components are capacitors or inductors.

2. The combiner according to claim 1, characterized in that: The frequency of the first frequency band signal is lower than the frequency of the second frequency band signal; wherein, The first frequency dividing unit includes a first inductor and a second inductor, wherein the first end of the first inductor is connected to the common end, and the second end of the first inductor is connected to the first output end via the second inductor; The second frequency dividing unit includes a first capacitor and a second capacitor, wherein a first end of the first capacitor is connected to the common end, and a second end of the first capacitor is connected to the second output end via the second capacitor.

3. The combiner according to claim 2, characterized in that: The first stopband unit includes a first stopband branch, the first stopband branch includes a third inductor and a third capacitor connected in series, a first end of the first stopband branch is connected to the first frequency division unit, and a second end of the first stopband branch is grounded; The second stopband unit includes a second stopband branch, the second stopband branch includes a fourth inductor and a fourth capacitor connected in series, a first end of the second stopband branch is connected to the second frequency division unit, and a second end of the second stopband branch is grounded.

4. The combiner according to claim 3, characterized in that: The first stopband unit includes a plurality of first stopband branches, wherein the first ends of the first stopband branches are respectively connected to different connection nodes of the first frequency division unit; The second stopband unit includes a plurality of second stopband branches, wherein the first end of each of the second stopband branches is connected to a different connection node with the second frequency division unit.

5. The combiner according to claim 4, characterized in that: The first stopband unit comprises a first stopband branch, wherein a first end of the first stopband branch is respectively connected to a second end of the first inductor and a first end of the second inductor; The second stopband unit includes a second stopband branch, wherein a first end of the second stopband branch is respectively connected to the second end of the first capacitor and the first end of the second capacitor.

6. The combiner according to claim 5, characterized in that: The first frequency band signal includes an electromagnetic wave signal in a low frequency band, and the second frequency band signal includes an electromagnetic wave signal in a medium and high frequency band.

7. The combiner according to claim 4, characterized in that: The second stopband unit includes two second stopband branches, wherein the first end of one second stopband branch is respectively connected to the first end of the first capacitor and the common end; the first end of the other second stopband branch is respectively connected to the second end of the first capacitor and the first end of the second capacitor.

8. The combiner according to claim 7, characterized in that: The first frequency band signal includes electromagnetic wave signals in low, medium and high frequency bands, and the second frequency band signal includes electromagnetic wave signals in ultra-high frequency bands.

9. The combiner according to claim 2, characterized in that: The combiner comprises: A first metal layer, wherein the first metal layer is provided with a first sub-microstrip winding and a second sub-microstrip winding; The second metal layer is located on the first metal layer, wherein the second metal layer is configured with the common terminal, the first output terminal, and the second output terminal, and the second metal layer is provided with the first capacitor, the second capacitor, the third sub-microstrip winding, and the fourth sub-microstrip winding; wherein the first sub-microstrip winding and the third sub-microstrip winding are connected to form the first inductor, and the second sub-microstrip winding and the fourth sub-microstrip winding are connected to form the second inductor; wherein, The first stop-band unit and the capacitor in the first stop-band unit are arranged in the second metal layer; The inductor in the first stop-band unit is arranged in the first metal layer and the second metal layer, and the inductor in the second stop-band unit is at least partially arranged in the second metal layer.

10. The combiner according to claim 9, characterized in that: The first stopband unit includes a third inductor and a third capacitor, and the second stopband unit includes a fourth inductor and a fourth capacitor; wherein, The first metal layer is also provided with a fifth sub-microstrip winding and a sixth sub-microstrip winding, and the second metal layer is also provided with a seventh sub-microstrip winding and an eighth sub-microstrip winding, wherein the fifth sub-microstrip winding and the seventh sub-microstrip winding are connected to form the third inductor, and the sixth sub-microstrip winding and the eighth sub-microstrip winding are connected to form the fourth inductor.

11. The combiner according to claim 9, characterized in that: The first stopband unit includes a third inductor and a third capacitor, the second stopband unit includes two second stopband branches, each of the second stopband branches includes a fourth inductor and a fourth capacitor; wherein, The first metal layer is also provided with a ninth sub-microstrip winding, and the second metal layer is also provided with a tenth sub-microstrip winding, an eleventh sub-microstrip winding and a twelfth sub-microstrip winding, wherein the ninth sub-microstrip winding and the tenth sub-microstrip winding are connected to form the third inductor, and the eleventh sub-microstrip winding and the twelfth sub-microstrip winding are respectively used to form the fourth resistor in the two second stopband branches.

12. The combiner according to claim 1, characterized in that: The inductor in the combiner is a microstrip line inductor.

13. A radio frequency system, characterized in that: include: The combiner according to any one of claims 1 to 12, wherein the common end of the combiner is used to connect an antenna; A first filter circuit connected to the first output terminal of the combiner; a first low-noise amplifier circuit, connected to the first filter circuit, and configured to perform low-noise amplification processing on the received signal in the first frequency band; A second filter circuit connected to the first output terminal of the combiner; a second low-noise amplifier circuit, connected to the second filter circuit, and configured to perform low-noise amplification processing on the received signal in the second frequency band; The radio frequency transceiver is connected to the first low-noise amplifier circuit and the second low-noise amplifier circuit respectively.

14. A communication device, characterized in that: include: antenna; According to the radio frequency system of claim 13, the common end of the combiner is connected to the antenna.

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