Camera module and electronic equipment

Abstract

The invention discloses a camera module and electronic equipment. The camera module comprises the components of a base which is provided with an opening; the lens is arranged on one side of the seat body; the circuit board group comprises a first board body, an elastic part and a second board body, the elastic part is connected between the first board body and the second board body in the direction perpendicular to the base body to the lens, and the second board body is connected with the base body; the sensor chip is arranged on one side, facing the seat body, of the first plate body; the first conductive group comprises a first conductive piece and a first induction piece, one of the first conductive piece and the first induction piece is arranged on the first plate body, the other one of the first conductive piece and the first induction piece is arranged on the second plate body, the first conductive piece and the first induction piece are arranged in parallel and at an interval, and a potential difference exists between the first conductive piece and the first induction piece; when one of the first conductive piece and the first induction piece arranged on the first plate body moves relative to the other one of the first conductive piece and the first induction piece arranged on the second plate body along with the first plate body, the capacitance value of the first induction piece changes.

Description

Technical Field

[0001] The present application belongs to the technical field of electronic devices, and specifically relates to a camera module and electronic equipment. Background Art

[0002] When using electronic devices with camera functions to take photos or videos, the photos or videos taken by the electronic devices may appear blurry or shaky due to external vibrations, affecting the quality of the photos or videos.

[0003] In order to solve the above problems, in the related art, a position sensor is added to the camera module of the electronic device, and the circuit is improved. Anti-shake control is performed according to the detection data of the position sensor to compensate for the image blur caused by vibration, thereby achieving the purpose of improving image quality.

[0004] This setting not only requires adding a position sensor and additional pins to the camera module, but also makes the driving circuit and chip of the camera module more complicated, which will increase the size of the camera module and increase the production cost of the camera module. Summary of the invention

[0005] The present application aims to provide a camera module and an electronic device, which solves one of the problems in the related art that an anti-shake function is provided to the electronic device by adding a position sensor and improving the circuit in the camera module, which results in an increase in the size of the camera module and an increase in the production cost of the camera module.

[0006] In order to solve the above technical problems, this application is implemented as follows:

[0007] In a first aspect, an embodiment of the present application proposes a camera module, comprising: a base, the base is provided with an opening; a lens, which is arranged on one side of the base; a circuit board group, which is located on the side of the base away from the lens, the circuit board group comprising a first plate, an elastic part and a second plate, along a direction perpendicular to the base to the lens, the elastic part is connected between the first plate and the second plate, and the second plate is connected to the base; a sensor chip, which is arranged on the side of the first plate facing the base, and the opening is located between the lens and the sensor chip; a first conductive group, the first conductive group comprising a first conductive member and a first inductive member, one of the first conductive member and the first inductive member is arranged on the first plate, and the other is arranged on the second plate, the first conductive member and the first inductive member are arranged in parallel and at intervals, and there is a potential difference between the first conductive member and the first inductive member; when one of the first conductive member and the first inductive member arranged on the first plate moves with the first plate relative to the other of the first conductive member and the first inductive member arranged on the second plate, the capacitance value of the first inductive member changes, and the capacitance value of the first inductive member is used to adjust the displacement of the sensor chip relative to the lens, so that the camera module can be anti-shake.

[0008] In a second aspect, an embodiment of the present application proposes an electronic device, comprising: a housing; and a camera module as in the first aspect, wherein the camera module is disposed in the housing.

[0009] In an embodiment of the present application, the camera module includes a base, a lens, a circuit board group, a sensor chip and a first conductive group.

[0010] The lens is arranged on one side of the seat. The circuit board assembly includes a first plate, an elastic part and a second plate, and the second plate is connected to the seat. The seat serves as a mounting carrier for the lens and the circuit board assembly, and has the function of mounting and fixing the lens and the circuit board assembly, and can ensure the matching size of the lens and the circuit board assembly.

[0011] The elastic part is connected between the first plate and the second plate along a direction perpendicular to the base to the lens, the sensor chip is arranged on the side of the first plate facing the base, and the opening is located between the lens and the sensor chip. The elastic part is elastic, that is, the elastic part can be extended and retracted. Since the second plate is connected to the base and the first plate is not connected to the base, the elastic part can adjust the distance between the first plate and the second plate, the matching size of the first plate and the base, and the matching size of the sensor chip and the lens by retracting the elastic part. In this way, when the camera module shakes, the sensor chip and the first plate can be displaced under the drive of the motor to resist the shaking, so that the camera module has an anti-shake function, thereby improving the performance of the electronic device.

[0012] The first conductive group includes a first conductive member and a first inductive member. One of the first conductive member and the first inductive member is disposed on the first plate, and the other is disposed on the second plate. That is, the first conductive member is disposed on the first plate, and the first inductive member is disposed on the second plate. Or the first conductive member is disposed on the second plate, and the first inductive member is disposed on the first plate. That is, the first plate and the second plate serve as mounting carriers for the first conductive member and the first inductive member, respectively.

[0013] Among them, the first conductive member and the first inductive member are arranged in parallel and at intervals. That is, the first conductive member and the first inductive member are arranged oppositely, and the first conductive member and the first inductive member are arranged in parallel, and the first conductive member and the first inductive member are arranged at intervals. When the camera module is in working state, there is a potential difference between the first conductive member and the first inductive member. There is an electric field distribution between the first conductive member and the first inductive member. The end face of the first conductive member facing the first inductive member is the first end face, and the end face of the first inductive member facing the first conductive member is the second end face, and the first end face and the second end face are respectively charged with equal amounts of different charges. When the camera module shakes, one of the first conductive member and the first inductive member disposed on the first plate body moves with the first plate body relative to the other of the first conductive member and the first inductive member disposed on the second plate body, and the area of ​​the region where the first end face and the second end face are disposed relatively changes, and the capacitance value of the first inductive member changes. The displacement of the sensor chip can be determined by the change value of the capacitance, thereby forming a feedback value for adjusting the displacement of the sensor chip relative to the lens, and realizing closed-loop control of the anti-shake of the camera module.

[0014] It can be seen from this that the present application makes reasonable use of the existing assembly positions of the base, lens and circuit board group without the need to add additional position sensors. By limiting the matching structure of the circuit board group, the sensor chip and the first conductive group, the first conductive member and the first inductive member of the first conductive group are constructed into a parallel plate capacitor. By using the principle of parallel plate capacitors, the displacement of the sensor chip relative to the lens can be adaptively adjusted, so that the camera module has an anti-shake function. Compared with the related art of adding a position sensor to the camera module, this setting simplifies the structure of the camera module while ensuring that the camera module has an anti-shake function, does not increase the external dimensions of the camera module, does not increase the complexity of the drive circuit, and is conducive to reducing the production cost of the camera module. Additional aspects and advantages of the present application will be partially given in the following description, and partially will become apparent from the following description, or will be understood through the practice of the present application. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] The above and / or additional aspects and advantages of the present application will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which:

[0016] Figure 1 is a partial structural schematic diagram of a camera module according to an embodiment of the present application;

[0017] Figure 2 is a schematic structural diagram of a circuit board assembly, a sensor chip, a flexible circuit board, and a connector from a first perspective of the first embodiment of the present application;

[0018] Figure 3is a structural schematic diagram of a circuit board group, a sensor chip, a flexible circuit board and a connector from a first perspective of a second embodiment of the present application;

[0019] Figure 4 for Figure 3 A partial enlarged view of the circuit board group, sensor chip, flexible circuit board and connector at point A shown;

[0020] Figure 5 is a structural schematic diagram of a circuit board assembly, a sensor chip, a flexible circuit board, and a connector according to a second embodiment of the present application from a second viewing angle;

[0021] Figure 6 for Figure 5 A partial enlarged view of the circuit board assembly, sensor chip, flexible circuit board and connector at point B shown;

[0022] Figure 7 is a schematic structural diagram of a soldering pad A, a soldering pad B and a circuit board assembly according to a second embodiment of the present application;

[0023] Figure 8 is a structural schematic diagram of a circuit board assembly, a flexible circuit board, and a connector from a third perspective according to a second embodiment of the present application;

[0024] Fig. 9 is a schematic structural diagram of a sensor chip, a pad A1, a pad A2, a pad B1, and a pad B2 according to a second embodiment of the present application;

[0025] Fig.10 is a structural schematic diagram of a circuit board assembly, a sensor chip, a flexible circuit board, and a connector from a fourth perspective according to a second embodiment of the present application;

[0026] Fig.11 for Fig.10 A partial enlarged view of the circuit board assembly, sensor chip, flexible circuit board and connector at C shown;

[0027] Fig.12 is a schematic structural diagram of two metal plates in one embodiment of the present application;

[0028] Fig.13 It is a schematic diagram of the structure of a moving electrode plate and a fixed electrode plate of an embodiment of the present application.

[0029] Reference numerals:

[0030] Figures 1 to 13 The corresponding relationship between the reference numerals and component names in the figure is:

[0031] 10 camera module, 100 seat, 110 opening, 200 lens, 300 circuit board group, 310 first board, 320 elastic part, 322 connecting section, 324 hanging wire, 330 second board, 400 sensor chip, 410 corner, 420 connecting edge, 430 first edge, 440 second edge, 500 first conductive group, 510 first conductive member, 520 first induction member, 600 second conductive group, 610 second conductive member, 620 second induction member, 700 coil, 800 magnetic member, 900 filter, 1000 connector, 1100 flexible circuit board, 1200 metal plate, 1300 moving electrode plate, 1400 fixed electrode plate, 1500 pad A, 1600 pad B, 1700 pad A1, 1800 pad A2, 1900 pad B1, 2000 pad B2. DETAILED DESCRIPTION

[0032] The embodiments of the present application will be described in detail below, and examples of the embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals throughout represent the same or similar elements or elements having the same or similar functions. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain the present application, and should not be construed as limitations on the present application. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in the field without making creative work are within the scope of protection of the present application.

[0033] The term "first" or "second" in the specification and claims of this application may include one or more of the features explicitly or implicitly. In the description of this application, unless otherwise specified, "plurality" means two or more. In addition, "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally means that the objects connected before and after are in an "or" relationship.

[0034] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0035] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", and "connected" should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0036] The following is combined with Figures 1 to 13 The camera module 10 and the electronic device provided in the embodiments of the present application are described.

[0037] like Figure 3 , Figure 4 , Figure 5 , Figure 6 , Fig.10 and Fig.11 As shown, according to some embodiments of the present application, the camera module 10 includes: a base 100, the base 100 is provided with an opening 110; a lens 200, which is arranged on one side of the base 100; a circuit board group 300, which is located on the side of the base 100 away from the lens 200, and the circuit board group 300 includes a first plate 310, an elastic part 320 and a second plate 330, along a direction perpendicular to the base 100 to the lens 200, the elastic part 320 is connected between the first plate 310 and the second plate 330, and the second plate 330 is connected to the base 100; a sensor chip 400, which is arranged on the side of the first plate 310 facing the base 100, and the opening 110 is located between the lens 200 and the sensor chip 400; a first conductive group 500, the first conductive group 500 includes a first conductive The electrical component 510 and the first sensing component 520, one of the first conductive component 510 and the first sensing component 520 is disposed on the first plate body 310, and the other is disposed on the second plate body 330, the first conductive component 510 and the first sensing component 520 are arranged in parallel and at intervals, and there is a potential difference between the first conductive component 510 and the first sensing component 520; when one of the first conductive component 510 and the first sensing component 520 disposed on the first plate body 310 moves with the first plate body 310 relative to the other of the first conductive component 510 and the first sensing component 520 disposed on the second plate body 330, the capacitance value of the first sensing component 520 changes, and the capacitance value of the first sensing component 520 is used to adjust the displacement of the sensor chip 400 relative to the lens 200, so that the camera module 10 can be anti-shake.

[0038] In the embodiment of the present application, the camera module 10 includes a base 100 , a lens 200 , a circuit board group 300 , a sensor chip 400 and a first conductive group 500 .

[0039] The lens 200 is disposed on one side of the base 100. The circuit board assembly 300 includes a first plate 310, an elastic portion 320, and a second plate 330, and the second plate 330 is connected to the base 100. The base 100 serves as a mounting carrier for the lens 200 and the circuit board assembly 300, and has the function of mounting and fixing the lens 200 and the circuit board assembly 300, and can ensure the matching size of the lens 200 and the circuit board assembly 300.

[0040] Along the perpendicular direction from the base 100 to the lens 200, the elastic part 320 is connected between the first plate 310 and the second plate 330, the sensor chip 400 is arranged on the side of the first plate 310 facing the base 100, and the opening 110 is located between the lens 200 and the sensor chip 400. The elastic part 320 is elastic, that is, the elastic part 320 can be extended and retracted. Since the second plate 330 is connected to the base 100 and the first plate 310 is not connected to the base 100, the elastic part 320 can adjust the spacing between the first plate 310 and the second plate 330, the matching size of the first plate 310 and the base 100, and the matching size of the sensor chip 400 and the lens 200. In this way, when the camera module 10 shakes, the sensor chip 400 and the first plate 310 can be displaced under the drive of the motor to abut against the shaking, so that the camera module 10 has an anti-shake function, thereby improving the performance of the electronic device.

[0041] The first conductive group 500 includes a first conductive member 510 and a first inductive member 520. One of the first conductive member 510 and the first inductive member 520 is disposed on the first plate 310, and the other is disposed on the second plate 330. That is, the first conductive member 510 is disposed on the first plate 310, and the first inductive member 520 is disposed on the second plate 330. Alternatively, the first conductive member 510 is disposed on the second plate 330, and the first inductive member 520 is disposed on the first plate 310. That is, the first plate 310 and the second plate 330 serve as mounting carriers for the first conductive member 510 and the first inductive member 520, respectively.

[0042] Among them, the first conductive member 510 and the first inductive member 520 are arranged in parallel and at intervals. That is, the first conductive member 510 and the first inductive member 520 are arranged opposite to each other, and the first conductive member 510 and the first inductive member 520 are arranged in parallel, and the first conductive member 510 and the first inductive member 520 are arranged at intervals. When the camera module 10 is in a working state, there is a potential difference between the first conductive member 510 and the first inductive member 520. There is an electric field distribution between the first conductive member 510 and the first inductive member 520. The end face of the first conductive member 510 facing the first inductive member 520 is the first end face, and the end face of the first inductive member 520 facing the first conductive member 510 is the second end face, and the first end face and the second end face are respectively charged with equal amounts of opposite charges. When the camera module 10 shakes, one of the first conductive member 510 and the first inductive member 520 disposed on the first plate 310 moves with the first plate 310 relative to the other of the first conductive member 510 and the first inductive member 520 disposed on the second plate 330, and the area of ​​the region where the first end face and the second end face are relatively arranged changes, and the capacitance value of the first inductive member 520 changes. The displacement of the sensor chip 400 can be determined by the change in capacitance, thereby forming a feedback value for adjusting the displacement of the sensor chip 400 relative to the lens 200, thereby realizing closed-loop control of the anti-shake of the camera module 10.

[0043] It is understandable that the lens 200 is disposed on the base 100, the location of the lens 200 is fixed, and the lens 200 does not move relative to the base 100. The first board 310 of the circuit board assembly 300 can move relative to the base 100, the first board 310 of the circuit board assembly 300 can move relative to the lens 200, and the sensor chip 400 can move relative to the lens 200.

[0044] It can be understood that, along the direction from the first end face to the second end face, the area of ​​the overlapping region between the orthographic projection of the first end face on the second end face and the second end face is the area of ​​the region where the first end face and the second end face are arranged oppositely.

[0045] It can be understood that the elastic portion 320 is disposed around the first plate body 310 , and the second plate body 330 is disposed around the elastic portion 320 .

[0046] The first conductive element 510 and the first inductive element 520 are configured as a parallel plate capacitor to detect the displacement of the sensor chip 400 , thereby enabling closed-loop signal control.

[0047] The principle of the parallel plate capacitor detecting the position information of the sensor chip 400 is as follows: the parallel plate capacitor includes two parallel metal plates 1200 , which are separated by an insulating medium. The two metal plates 1200 can be understood as a first conductive member 510 and a first inductive member 520 .

[0048] like Fig.12 As shown, when the edge effect is ignored, the capacitance C, the dielectric constant ε of the insulating medium, the effective area S of the two metal plates 1200 and the distance d between the two metal plates 1200 satisfy: C = (ε×S) / d. Along the arrangement direction of the two metal plates 1200, one metal plate 1200 is projected on the other metal plate 1200, and the area of ​​the overlapping area of ​​the two metal plates 1200 is the effective area S of the two metal plates 1200.

[0049] When the value of one of the three parameters d, S and ε changes, C will change.

[0050] like Fig.13 As shown, when one of the two metal plates 1200 moves relative to the other, the effective area S of the two metal plates 1200 changes, thereby changing the capacitance C. The moving metal plate 1200 is denoted as the moving plate 1300 , and the metal plate 1200 at a fixed position is denoted as the fixed plate 1400 .

[0051] When the moving electrode plate 1300 is translated by Δx relative to the fixed electrode plate 1400 along the electrode length a, the capacitance C = (ε×(a-Δx)×b) / d = (ε×a×b) / d-(ε×Δx×b) / d = C0-ΔC, which is recorded as Formula 1. The width of the electrode plate is recorded as b.

[0052] Wherein, C0 = (ε×a×b) / d, C0 is the initial value of the capacitance.

[0053] The change in capacitance due to the displacement of the moving electrode 1300 is △C=C-C0=-((ε×b) / d)×△x=-C0×(△x / a), which is recorded as Formula 2.

[0054] It can be seen from this that the magnitude of the displacement Δx can be determined by the change in capacitance.

[0055] In some embodiments, the first conductive element 510 and the first sensing element 520 are arranged along a direction perpendicular to the base 100 to the lens 200 .

[0056] In this embodiment, the positional relationship between the first conductive element 510 and the first inductive element 520 is further defined.

[0057] The first conductive member 510 and the first inductive member 520 are arranged along a direction perpendicular to the base 100 to the lens 200. That is, along the direction perpendicular to the base 100 to the lens 200, the first conductive member 510 and the first inductive member 520 are arranged in parallel and spaced apart.

[0058] In some other embodiments, the first conductive member 510 and the first inductive member 520 are arranged along the direction from the base 100 to the lens 200. That is, along the direction from the base 100 to the lens 200, the first conductive member 510 and the first inductive member 520 are arranged in parallel and spaced apart.

[0059] In some embodiments, Figure 3 , Figure 5 and Fig.10 As shown, there are multiple first conductive groups 500 , and the multiple first conductive groups 500 are arranged at intervals along the circumference of the sensor chip 400 .

[0060] In this embodiment, the number and arrangement positions of the first conductive groups 500 are further defined.

[0061] There are multiple first conductive groups 500, and the multiple first conductive groups 500 are arranged at intervals along the circumference of the sensor chip 400. This arrangement provides effective and reliable structural support for detecting the displacement of the sensor chip 400 in the X, Y and Z directions. It can improve the detection accuracy of the product and is conducive to improving the anti-shake accuracy of the camera module 10.

[0062] Any two of the X direction, the Y direction, and the Z direction are perpendicular to each other.

[0063] In some embodiments, Figure 3 As shown, the sensor chip 400 has a plurality of corners 410 , and the portion of the outer edge of the sensor chip 400 between any two adjacent corners 410 is a connecting edge 420 ; each connecting edge 420 is disposed opposite to at least one first conductive group 500 .

[0064] In this embodiment, the matching structure of the sensor chip 400 and the plurality of first conductive groups 500 is further defined.

[0065] The plurality of first conductive groups 500 are arranged at intervals along the circumference of the sensor chip 400. The sensor chip 400 has a plurality of corners 410, and the portion of the outer edge of the sensor chip 400 between any two adjacent corners 410 is a connecting edge 420. Each connecting edge 420 is disposed opposite to at least one first conductive group 500.

[0066] like Figure 7 As shown, along the X direction, when the camera module 10 shakes, the sensor chip 400 and the first plate 310 are displaced under the drive of the motor to resist the shaking, and the second plate 330 of the circuit board assembly 300 is fixedly connected to the base 100, and the position of the second plate 330 remains unchanged. Figure 7 The arrow in indicates the movement direction of the sensor chip 400.

[0067] The first conductive member 510 or the first inductive member 520 connected to the first board 310 is recorded as pad A1500, and the first inductive member 520 or the first conductive member 510 connected to the second board 330 is recorded as pad B1600. The position of pad A1500 changes, and the position of pad B1600 remains relatively fixed. Relative movement occurs between pad A1500 and pad B1600, so that the capacitance value changes. Formula 2 can be used to calculate the displacement value of the sensor chip 400, thereby forming a feedback value to achieve closed-loop control of anti-shake.

[0068] When the camera module 10 shakes along the Y direction, the calculation method of the displacement value of the sensor chip 400 is similar to that of the X direction shake, which is not repeated here.

[0069] When the camera module 10 shakes along the Z direction, the calculation method of the displacement value of the sensor chip 400 is similar to that of the X direction shake, which is not repeated here.

[0070] like Figure 8 and Fig. 9 As shown, each connecting edge 420 is arranged opposite to at least one first conductive group 500, that is, a plurality of first conductive groups 500 are arranged in an array around the sensor chip 400. Therefore, when the camera module 10 is tilted and shaken, the capacitance changes between the multiple pads arranged laterally are inconsistent. For example, the capacitance change between the pad A11700 and the pad B11900 close to the outside is 10 units, and the capacitance change between the pad A21800 and the pad B22000 inside is 5 units. The corresponding tilt angle can be calculated by the capacitance change ratio of the array pads (e.g., 10 units / 5 units). Among them, Figure 8 and Fig. 9 The arrow shown indicates the direction of movement of the sensor chip 400 . Figure 8 and Fig. 9 In the figure, the dotted line represents pad B11900 and pad B22000, and the solid line represents pad A11700 and pad A21800.

[0071] In some embodiments, Figure 2 , Figure 3 , Figure 5 and Fig.10As shown, the elastic portion 320 includes: a plurality of connecting segments 322, the plurality of connecting segments 322 are arranged at intervals along the circumference of the sensor chip 400, each connecting segment 322 connects the first plate body 310 and the second plate body 330; a plurality of suspension wires 324, at least one suspension wire 324 is connected between any two adjacent connecting segments 322, and the first plate body 310 and the second plate body 330 are arranged at intervals from the suspension wires 324; one of the first conductive member 510 and the first sensing member 520 is arranged on a side of the first plate body 310 facing the suspension wire 324, and the other is arranged on a side of the second plate body 330 facing the suspension wire 324.

[0072] In this embodiment, the matching structure of the elastic portion 320 , the first plate body 310 , the second plate body 330 , the first conductive member 510 and the first inductive member 520 is further defined.

[0073] The elastic portion 320 includes a plurality of connecting segments 322 and a plurality of suspension wires 324 .

[0074] At least one of the plurality of connecting segments 322 is an elastic segment. Each suspension wire 324 is an elastic wire.

[0075] Optionally, the plurality of connecting segments 322 and the plurality of suspension wires 324 are integrally formed.

[0076] The plurality of connecting segments 322 are arranged at intervals along the circumference of the sensor chip 400, each connecting segment 322 connects the first plate 310 and the second plate 330, and at least one suspension wire 324 is connected between any two adjacent connecting segments 322. The plurality of connecting segments 322 and the plurality of suspension wires 324 cooperate to meet the use requirements of the elastic part 320 connecting the first plate 310 and the second plate 330, and also meet the use requirements of the first plate 310 moving relative to the second plate 330.

[0077] The first plate 310 and the second plate 330 are both spaced apart from the suspension wire 324. That is, the first plate 310, two adjacent connecting segments 322 and the suspension wire 324 enclose a first hollow area. The second plate 330, two adjacent connecting segments 322 and the suspension wire 324 enclose a second hollow area.

[0078] One of the first conductive member 510 and the first inductive member 520 is disposed on the side of the first plate 310 facing the suspension wire 324, and the other is disposed on the side of the second plate 330 facing the suspension wire 324. That is, the first conductive member 510 is disposed on the side of the first plate 310 facing the suspension wire 324, and the first inductive member 520 is disposed on the side of the second plate 330 facing the suspension wire 324. Alternatively, the first inductive member 520 is disposed on the side of the first plate 310 facing the suspension wire 324, and the first conductive member 510 is disposed on the side of the second plate 330 facing the suspension wire 324. That is, one of the first conductive member 510 and the first inductive member 520 is located in the first hollow area, and the other of the first conductive member 510 and the first inductive member 520 is located in the second hollow area.

[0079] The first hollow area and the second hollow area are used for installing the first conductive group 500. A space is provided for installing the first conductive group 500. In this way, the first conductive member 510 and the first sensing member 520 of the first conductive group 500 are arranged in parallel and at intervals, and the space of the circuit board group 300 in the direction from the lens 200 to the base 100 is not occupied.

[0080] At the same time, the setting of the first hollow area and the second hollow area also has the effect of reducing the structural strength of the circuit board group 300 at this location, making the elastic part 320 easier to deform, and the first plate body 310 and the sensor chip 400 can shift relative to the second plate body 330 under slight shaking, which is beneficial to improving the anti-shake accuracy of the camera module 10.

[0081] In some embodiments, when a plurality of suspension wires 324 are connected between two adjacent connection segments 322 , the plurality of suspension wires 324 are arranged at intervals along a direction from the first plate body 310 to the second plate body 330 .

[0082] In this embodiment, the matching structure of the plurality of connecting segments 322 and the plurality of suspension wires 324 is further defined.

[0083] When a plurality of suspension wires 324 are connected between two adjacent connecting sections 322, the plurality of suspension wires 324 are arranged at intervals along the direction from the first plate 310 to the second plate 330. That is, the first plate 310, the two adjacent connecting sections 322 and the suspension wires 324 enclose a first hollow area. The second plate 330, the two adjacent connecting sections 322 and the suspension wires 324 enclose a second hollow area. The two adjacent connecting sections 322 and the two adjacent suspension wires 324 enclose a third hollow area. This arrangement takes into account the easy deformation of the elastic part 320 and improves the strength of the part of the elastic part 320 located between the two adjacent connecting sections 322.

[0084] In some embodiments, Figure 1 and Figure 2As shown, the camera module 10 also includes: a second conductive group 600, the second conductive group 600 includes: a second conductive member 610; a second sensing member 620, one of the second conductive member 610 and the second sensing member 620 is arranged on the side of the base 100 facing the circuit board group 300, and the other is arranged on the side of the first plate 310 facing the base 100, along the lens 200 to the base 100, the second conductive member 610 and the second sensing member 620 are arranged in parallel and spaced apart, and there is a potential difference between the second conductive member 610 and the second sensing member 620; when one of the second conductive member 610 and the second sensing member 620 arranged on the first plate 310 moves with the first plate 310 relative to the other of the second conductive member 610 and the second sensing member 620 arranged on the base 100, the capacitance value of the second sensing member 620 changes, and the capacitance value of the second sensing member 620 is used to adjust the displacement of the sensor chip 400 relative to the lens 200.

[0085] In some embodiments, the camera module 10 further includes a second conductive group 600 .

[0086] The second conductive group 600 includes a second conductive element 610 and a second inductive element 620 .

[0087] One of the second conductive member 610 and the second inductive member 620 is disposed on the side of the base 100 facing the circuit board assembly 300, and the other is disposed on the side of the first plate 310 facing the base 100. That is, the second conductive member 610 is disposed on the side of the base 100 facing the circuit board assembly 300, and the second inductive member 620 is disposed on the side of the first plate 310 facing the base 100. Alternatively, the second inductive member 620 is disposed on the side of the base 100 facing the circuit board assembly 300, and the second conductive member 610 is disposed on the side of the first plate 310 facing the base 100. That is, the base 100 and the first plate 310 serve as mounting carriers for the second conductive member 610 and the second inductive member 620, respectively.

[0088] The second conductive member 610 and the second inductive member 620 are arranged in parallel and spaced apart. That is, the second conductive member 610 and the second inductive member 620 are arranged opposite to each other, and the second conductive member 610 and the second inductive member 620 are arranged in parallel, and the second conductive member 610 and the second inductive member 620 are spaced apart. When the camera module 10 is in working state, there is a potential difference between the second conductive member 610 and the second inductive member 620. There is an electric field distribution between the second conductive member 610 and the second inductive member 620. The end face of the second conductive member 610 facing the second inductive member 620 is the third end face, and the end face of the second inductive member 620 facing the second conductive member 610 is the fourth end face, and the third end face and the fourth end face are respectively charged with equal amounts of opposite charges. When the camera module 10 shakes, one of the second conductive member 610 and the second inductive member 620 disposed on the first plate body 310 moves with the first plate body 310 relative to the other of the second conductive member 610 and the second inductive member 620 disposed on the base body 100, the area of ​​the region where the third end face and the fourth end face are relatively arranged changes, and the capacitance value of the second inductive member 620 changes. The displacement of the sensor chip 400 can be determined by the change in capacitance, thereby forming a feedback value for adjusting the displacement of the sensor chip 400 relative to the lens 200, and realizing closed-loop control of the anti-shake of the camera module 10. In this way, when the camera module 10 shakes, the sensor chip 400 and the first plate body 310 can be displaced under the drive of the motor to resist the shake, so that the camera module 10 has an anti-shake function, thereby improving the performance of the electronic device.

[0089] Optionally, the second conductive member 610 includes a metal member.

[0090] Optionally, the second sensing element 620 includes a metal element.

[0091] The working principle of the second conductive group 600 is the same as that of the first conductive group 500 , and will not be described again.

[0092] In some embodiments, Figure 2 As shown, there are multiple second conductive groups 600 , and multiple second conductive elements 610 are arranged at intervals along the circumference of the sensor chip 400 .

[0093] In this embodiment, the number and arrangement positions of the second conductive groups 600 are further defined.

[0094] There are multiple second conductive groups 600, and multiple second conductive members 610 are arranged at intervals along the circumference of the sensor chip 400. This arrangement provides effective and reliable structural support for detecting the displacement of the sensor chip 400 in the X, Y and Z directions. It can improve the detection accuracy of the product and is conducive to improving the anti-shake accuracy of the camera module 10.

[0095] Any two of the X direction, the Y direction, and the Z direction are perpendicular to each other.

[0096] In some embodiments, Figure 2 As shown, the outer edge of the sensor chip 400 has a first edge 430 and a second edge 440 that are arranged opposite to each other; a portion of the second conductive groups 600 among the plurality of second conductive groups 600 is located between the first edge 430 and the elastic portion 320, and another portion of the second conductive groups 600 among the plurality of second conductive groups 600 is located between the second edge 440 and the elastic portion 320.

[0097] In this embodiment, the matching structure of the plurality of second conductive groups 600 and the sensor chip 400 is further defined.

[0098] The outer edge of the sensor chip 400 includes a first side 430 and a second side 440 , and the first side 430 and the second side 440 are opposite to each other and spaced apart.

[0099] Some of the second conductive groups 600 are located between the first side 430 and the elastic part 320, and another part of the second conductive groups 600 are located between the second side 440 and the elastic part 320. This arrangement provides structural support for detecting displacement of the sensor chip 400 in multiple directions.

[0100] In some embodiments, Figure 1 As shown, the camera module 10 further includes: a coil 700 disposed on the first plate 310; a magnetic member 800 disposed on the base 100, and the coil 700 and the magnetic member 800 cooperate to drive the first plate 310 to move relative to the base 100.

[0101] In this embodiment, the structure of the camera module 10 is further defined.

[0102] The camera module 10 further includes a coil 700 and a magnetic member 800 .

[0103] The coil 700 is disposed on the first plate 310, and the magnetic member 800 is disposed on the base 100. When the coil 700 is powered on, a first magnetic field is generated around the coil 700, and a second magnetic field exists around the magnetic member 800. Under the interaction of the first magnetic field and the second magnetic field, the coil 700 is subjected to a driving thrust, and the movement of the coil 700 can drive the first plate 310 and the sensor chip 400 to move relative to the base 100. The cooperation of the coil 700 and the magnetic member 800 provides power support for the movement of the first plate 310 and the sensor chip 400.

[0104] In some embodiments, Figure 1As shown, the camera module 10 also includes: a filter 900, which is arranged at the opening 110; a connector 1000, which is located on one side of the circuit board group 300; and a flexible circuit board 1100, which is connected between the second board body 330 and the connector 1000.

[0105] In this embodiment, the structure of the camera module 10 is further defined.

[0106] The camera module 10 further includes a filter 900 , a connector 1000 and a flexible circuit board 1100 .

[0107] The filter 900 is disposed at the opening 110 , and the filter 900 has the function of filtering light of a specific wavelength to improve the imaging quality.

[0108] For example, filter 900 may absorb infrared light.

[0109] The flexible circuit board 1100 is connected between the second board body 330 and the connector 1000 . The connector 1000 is used to electrically connect with other components of the electronic device. The flexible circuit board 1100 can adjust the distance between the circuit board set 300 and the connector 1000 .

[0110] According to some other embodiments of the present application, the electronic device includes: a housing; and a camera module 10 as in any of the above embodiments, wherein the camera module 10 is disposed in the housing.

[0111] The electronic device provided in the present application includes the camera module 10 of any of the above embodiments, and therefore has all the beneficial effects of the above camera module 10, which will not be described one by one here.

[0112] Optionally, the electronic device can be a mobile terminal such as a mobile phone, a wearable device, a tablet computer, a laptop computer, a mobile computer, an augmented reality device (also known as an AR (Augmented Reality) device), a virtual reality device (also known as a VR (Virtual Reality) device) and a handheld game console, etc.

[0113] Optionally, the camera module 10 is disposed in a shell, and the shell serves as an installation carrier of the camera module 10 and has the function of installing and fixing the camera module 10 .

[0114] Optionally, the camera module 10 includes a lens 200 , a base 100 , a connector 1000 , a circuit board group 300 , a sensor chip 400 , a first conductive group 500 , a second conductive group 600 , a coil 700 , a magnetic member 800 , a filter 900 and a flexible circuit board 1100 .

[0115] Optionally, the sensor chip 400 is mounted on the first board 310 by bonding. The circuit board assembly 300 includes a first board 310, a second board 330 and an elastic part 320, and the elastic part 320 includes a suspension wire 324, which is an elastic wire. Driven by the motor, the sensor chip 400 can be displaced within a plane range to achieve anti-shake of the camera module 10.

[0116] A plurality of first pads are arranged in an array on the first plate 310, the first conductive member 510 includes a first pad, or the first inductive member 520 includes a first pad. At the same time, a second pad is also arranged on the seat 100, the first inductive member 520 includes a second pad, or the first conductive member 510 includes a second pad. A parallel plate capacitor is formed between the first pad and the second pad. Formula 2 can be used to calculate the displacement value of the sensor chip 400, thereby forming a feedback value to achieve closed-loop control of anti-shake.

[0117] The second solder pad can be set on the base 100 by LDS (Laser-Direct-structuring) technology, or by HD CMI (High-Density Chip Molding Integration) technology, or by plastic-metal composite structure technology.

[0118] Two second conductive groups 600 are arranged on the circuit board group 300. The second conductive group 600 includes a second conductive member 610 and a second inductive member 620, one of which is arranged on the first plate body 310, and the other of which is arranged on the second plate body 330. In the second conductive group 600, the second conductive member 610 and the second inductive member 620 constitute a parallel plate capacitor. The displacement value of the sensor chip 400 can be calculated by the change of capacitance. When the camera module 10 shakes, the sensor chip 400 and the first plate body 310 can be displaced under the drive of the motor to resist the shake. At this time, the position of the second conductive member 610 or the second inductive member 620 arranged on the first plate body 310 changes, and the position of the second inductive member 620 or the second conductive member 610 arranged on the first plate body 310 remains relatively fixed, and the second conductive member 610 and the second inductive member 620 move relative to each other, so that the capacitance value changes.

[0119] The second conductive group 600 may be provided on the circuit board group 300 by a side plating process.

[0120] The anti-shake capability of the camera module 10 is improved through closed-loop control, and the effects of hysteresis, linearity, posture difference, inertial vibration, etc. on imaging quality and imaging speed are reduced, thereby improving the imaging speed and imaging quality of the camera module 10.

[0121] Optionally, the first board 310 and the second board 330 are both printed circuit boards.

[0122] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "illustrative embodiments", "examples", "specific examples", or "some examples" means that the specific features, structures, materials, or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present application. In this specification, the schematic representation of the above terms does not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0123] Although the embodiments of the present application have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and spirit of the present application, and that the scope of the present application is defined by the claims and their equivalents.

Claims

1. A camera module, characterized in that: include: A seat body, wherein the seat body is provided with an opening; A lens is disposed on one side of the seat; A circuit board group is located on a side of the base away from the lens, the circuit board group includes a first plate, an elastic part and a second plate, and is perpendicular to the base to the lens, the elastic part is connected between the first plate and the second plate, and the second plate is connected to the base; A sensor chip is disposed on a side of the first plate body facing the base body, and the opening is located between the lens and the sensor chip; a first conductive group, the first conductive group comprising a first conductive member and a first inductive member, one of the first conductive member and the first inductive member being disposed on the first plate, and the other being disposed on the second plate, the first conductive member and the first inductive member being arranged in parallel and spaced apart, and having a potential difference between the first conductive member and the first inductive member; When one of the first conductive member and the first sensing member that is disposed on the first plate body shifts along with the first plate body relative to the other of the first conductive member and the first sensing member that is disposed on the second plate body, the capacitance value of the first sensing member changes. The capacitance value of the first sensing member is used to adjust the displacement of the sensor chip relative to the lens so that the camera module can be anti-shake.

2. The camera module according to claim 1, characterized in that: The first conductive element and the first inductive element are arranged along a direction perpendicular to the base to the lens.

3. The camera module according to claim 1 or 2, characterized in that: There are multiple first conductive groups, and the multiple first conductive groups are arranged at intervals along the circumference of the sensor chip.

4. The camera module according to claim 3, characterized in that: The sensor chip has a plurality of corners, and a portion of the outer edge of the sensor chip located between any two adjacent corners is a connecting edge; Each of the connecting edges is disposed opposite to at least one of the first conductive groups.

5. The camera module according to claim 1 or 2, characterized in that: The elastic portion comprises: A plurality of connecting segments, wherein the plurality of connecting segments are arranged at intervals along the circumference of the sensor chip, and each of the connecting segments connects the first plate body and the second plate body; A plurality of suspension wires, at least one of the suspension wires is connected between any two adjacent connecting sections, and the first plate body and the second plate body are both spaced apart from the suspension wires; One of the first conductive element and the first inductive element is disposed on a side of the first plate body facing the suspension wire, and the other is disposed on a side of the second plate body facing the suspension wire.

6. The camera module according to claim 5, characterized in that: When a plurality of the suspension wires are connected between two adjacent connecting sections, the plurality of the suspension wires are arranged at intervals along a direction from the first plate body to the second plate body.

7. The camera module according to claim 1 or 2, characterized in that: Also includes: A second conductive group, the second conductive group comprising: a second conductive member; A second induction member, one of the second conductive member and the second induction member is disposed on a side of the base body facing the circuit board assembly, and the other is disposed on a side of the first board body facing the base body, and along the lens to the base body, the second conductive member and the second induction member are arranged in parallel and spaced apart, and there is a potential difference between the second conductive member and the second induction member; When one of the second conductive member and the second sensing member disposed on the first plate body moves along with the first plate body relative to the other of the second conductive member and the second sensing member disposed on the base body, the capacitance value of the second sensing member changes, and the capacitance value of the second sensing member is used to adjust the displacement of the sensor chip relative to the lens.

8. The camera module according to claim 7, characterized in that: There are multiple second conductive groups, and the multiple second conductive members are arranged at intervals along the circumference of the sensor chip.

9. The camera module according to claim 8, characterized in that: The outer edge of the sensor chip has a first side and a second side that are arranged opposite to each other; A portion of the second conductive groups among the plurality of second conductive groups is located between the first side and the elastic portion, and another portion of the second conductive groups among the plurality of second conductive groups is located between the second side and the elastic portion.

10. The camera module according to claim 1 or 2, characterized in that: Also includes: A coil, disposed on the first plate; The magnetic component is arranged on the base, and the coil and the magnetic component cooperate to drive the first plate to move relative to the base.

11. The camera module according to claim 1 or 2, characterized in that: Also includes: A filter, disposed at the opening; A connector located at one side of the circuit board assembly; A flexible circuit board is connected between the second board body and the connector.

12. An electronic device, characterized in that: include: case; and The camera module according to any one of claims 1 to 11, wherein the camera module is arranged on the housing.

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