Rear cover plate of electronic equipment

Abstract

The electronic equipment rear cover plate comprises a first panel and a second panel, a membrane attached to the first panel and the second panel is arranged between the first panel and the second panel, and a cooling medium is injected into the membrane. The diaphragm is arranged between the first panel and the second panel, the cooling medium is arranged in the diaphragm, and when heat in the equipment is conducted to the diaphragm, the cooling medium in the diaphragm absorbs the heat to achieve the purposes of cooling and heat insulation, so that the problem that the electronic equipment is hot is solved, and the experience feeling of a user is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic equipment, and in particular to a rear cover plate of an electronic equipment. Background Art

[0002] Heating of electronic devices is a common problem. For example, heating and hotness of electronic devices such as mobile phones and computers are common problems encountered during use. There are many reasons for heating, including hardware, software and environmental factors. In terms of hardware, such as processors and batteries, when the processor runs a large number of tasks, a large amount of heat will be generated, and the battery will also generate a certain amount of heat during the charging and discharging process. In terms of software, when the device runs multiple programs at the same time, the memory and storage will read and write data at a high speed, thereby generating a large amount of heat, causing the device to heat up. Summary of the invention

[0003] In order to solve the technical problems existing in the background technology, the present invention proposes a rear cover plate of an electronic device.

[0004] The present invention provides a rear cover of an electronic device, comprising: a first panel and a second panel, wherein:

[0005] A diaphragm is provided between the first panel and the second panel and is fitted with the two panels, and a cooling medium is injected into the diaphragm.

[0006] Preferably, the cooling medium is paraffin.

[0007] Preferably, a heat dissipation wire made of a heat-conducting material is provided in the cooling medium.

[0008] Preferably, the first panel and / or the second panel is made of a transparent material, and the surface of the film has textures and / or colors.

[0009] Preferably, the material of the membrane is PET.

[0010] Preferably, the diaphragm comprises an upper diaphragm and a lower diaphragm, and the upper diaphragm and the lower diaphragm cooperate with each other to encapsulate the cooling medium therebetween.

[0011] Preferably, a heat sink distributed on the periphery of the diaphragm is provided between the first panel and the second panel, and one end of the heat sink is exposed to the outside and is flush with the side surfaces of the first panel and the second panel.

[0012] Preferably, a through cavity is provided inside the heat sink.

[0013] Preferably, the heat sink passes through the cooling medium inside the diaphragm, and both ends of the heat sink are exposed to the outside, and the through cavity passes through the end surfaces at both ends.

[0014] Preferably, the first panel and the second panel are made of the same or different materials.

[0015] In the present invention, the rear cover is designed to have a structure of a first panel and a second panel, a diaphragm is arranged between the first panel and the second panel, and a cooling medium is arranged inside the diaphragm. When the heat inside the device is conducted to the diaphragm, the heat is absorbed by the cooling medium inside the diaphragm to achieve the purpose of cooling and heat insulation, thereby solving the problem of overheating of electronic devices (such as mobile phones, computers, etc.) and improving the user experience. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 The present invention is a schematic structural diagram of a rear cover plate of an electronic device. DETAILED DESCRIPTION

[0017] Reference Figure 1 The present invention provides a rear cover of an electronic device, comprising: a first panel 1 and a second panel 2;

[0018] A diaphragm 3 is provided between the first panel 1 and the second panel 2, and a cooling medium is injected into the diaphragm 3, and the cooling medium is paraffin. When the heat inside the device is transferred from the first panel 1 or the second panel 2 to the diaphragm 3, when the temperature of the diaphragm 3 does not exceed a specific temperature, the paraffin encapsulated in the diaphragm 3 is in a solidified state. When the temperature reaches a certain temperature, the paraffin encapsulated in the diaphragm 3 melts and takes away the heat, thereby achieving the effect of cooling and heat insulation. The specific preparation method is as follows:

[0019] 1. Processing a first panel 1 and a second panel 2 respectively;

[0020] 2. Attach the film 3 to the first panel 1 or the second panel 2, and then attach the first panel 1 to the second panel 2 with the film 3 placed between them.

[0021] As can be seen from the above, the present invention arranges a diaphragm 3 between the first panel 1 and the second panel 2, and arranges a cooling medium inside the diaphragm 3. When the back cover is heated, the heat is conducted to the diaphragm 3, and the heat is absorbed by the cooling medium inside the diaphragm 3 to achieve the purpose of cooling and heat insulation, thereby solving the problem of heating of the back cover of electronic equipment such as the back cover of a mobile phone and improving the user experience.

[0022] Furthermore, a heat dissipation wire made of a heat-conducting material is provided in the cooling medium to increase the uniformity of heating of the cooling medium.

[0023] Furthermore, in this embodiment, the first panel 1 and / or the second panel 2 are made of transparent material, the material of the membrane 3 is PET, and the surface of the membrane 3 has texture and / or color to achieve the diversification of the color and texture of the rear cover.

[0024] In this embodiment, the diaphragm 3 includes an upper diaphragm and a lower diaphragm, and the upper diaphragm and the lower diaphragm cooperate with each other to encapsulate the cooling medium therebetween. The specific preparation method of the diaphragm 3 is as follows:

[0025] S1. Form a cavity inside the membrane 3 body 1 by laminating two sheets, and reserve a liquid injection hole and a vent hole during the laminating process. The specific method is as follows:

[0026] S11, printing: select two membrane sheets 3, and print a support frame and a support column on one side of one of the membrane sheets 3;

[0027] S12, glue dispensing: filling adhesive inside the support frame and on the surface of the support column, wherein the adhesive is UV glue;

[0028] S13, laminating: laying another diaphragm 3 flat on the first diaphragm 3, so as to bond it to the first diaphragm 3, and reserving a clamping cavity, a liquid injection hole and a vent hole;

[0029] S14, cutting: cutting off the excess parts after UV curing;

[0030] S2, inject cooling medium into the clamp cavity through the injection port;

[0031] S3. Apply glue to the injection port and exhaust hole, and use UV curing to achieve the purpose of sealing.

[0032] The injection port and the exhaust hole in this embodiment are respectively located at the two ends of the clamping cavity, one end is used to inject liquid, and the other end is used to exhaust the internal air until the interior is full.

[0033] In this embodiment, a heat sink 4 is provided between the first panel 1 and the second panel 2, and one end of the heat sink 4 is exposed and flush with the sides of the first panel 1 and the second panel 2, so that heat can be dissipated through the exposed end of the heat sink 4, thereby further improving the heat dissipation and cooling effect of the rear cover.

[0034] Furthermore, a through cavity is provided inside the heat sink 4 so that external airflow can enter the heat sink 4, thereby further increasing the heat dissipation effect.

[0035] Furthermore, the heat sink 4 passes through the cooling medium inside the diaphragm 3, and both ends are exposed to the outside. The through cavity runs through the end faces at both ends, so that the cooling medium inside the diaphragm 3 can form heat exchange with the external airflow, thereby further increasing the heat dissipation and cooling effect on the rear cover of the equipment.

[0036] In addition, in this embodiment, the materials of the first panel 1 and the second panel 2 are the same or different, such as the first panel 1 and the second panel 2 are both glass panels, or glass fiber panels, or PMMA panels, or PC panels. Alternatively, the first panel 1 is a glass panel, and the material of the second panel 2 is a glass fiber panel, or a PMMA panel, or a PC panel.

[0037] The above description is only a preferred specific implementation manner of the present invention, but the protection scope of the present invention is not limited thereto. Any technician familiar with the technical field can make equivalent replacements or changes according to the technical scheme and inventive concept of the present invention within the technical scope disclosed by the present invention, which should be covered by the protection scope of the present invention.

Claims

1. A rear cover of an electronic device, characterized in that: include: A first panel (1) and a second panel (2), wherein: A membrane (3) is provided between the first panel (1) and the second panel (2) and is bonded to the two panels. A cooling medium is injected into the membrane (3).

2. The electronic device rear cover according to claim 1, characterized in that: The cooling medium is paraffin.

3. The electronic device rear cover according to claim 1, characterized in that: A heat dissipation wire made of a heat-conducting material is arranged in the cooling medium.

4. The electronic device rear cover according to claim 1, characterized in that: The first panel (1) and / or the second panel (2) are made of transparent material, and the surface of the film (3) has textures and / or colors.

5. The electronic device rear cover according to claim 1, characterized in that: The material of the diaphragm (3) is PET.

6. The electronic device rear cover according to claim 1, characterized in that: The diaphragm (3) comprises an upper diaphragm and a lower diaphragm, and the upper diaphragm and the lower diaphragm cooperate with each other to encapsulate the cooling medium between the two.

7. The electronic device rear cover according to claim 1, characterized in that: A heat sink (4) is provided between the first panel (1) and the second panel (2) on the periphery of the diaphragm (3); one end of the heat sink (4) is exposed to the outside and is flush with the side surfaces of the first panel (1) and the second panel (2).

8. The electronic device rear cover according to claim 7, characterized in that: A through cavity is provided inside the heat sink (4).

9. The electronic device rear cover according to claim 8, characterized in that: The heat sink (4) passes through the cooling medium inside the diaphragm (3), and both ends of the heat sink (4) are exposed to the outside, and the through cavity passes through the end surfaces at both ends.

10. An electronic device rear cover according to any one of claims 1 to 9, characterized in that: The materials of the first panel (1) and the second panel (2) are the same or different.

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