Liquid cooling unit, device and method

Abstract

The invention relates to the field of liquid cooling of electronic equipment, in particular to a liquid cooling unit, device and method. The liquid cooling unit specifically comprises a liquid cooling equipment node, a cooling liquid circulating system and a refrigerating system, and further comprises an insertion frame, the liquid cooling equipment node is installed in the insertion frame, the cooling liquid circulating system comprises a main liquid inlet pipe, branch liquid inlet pipes, a liquid return pipe, a liquid driving device and a liquid storage container, and one end of each branch liquid inlet pipe is connected with one end of the main liquid inlet pipe; one end of the liquid return pipe is connected with a liquid return opening in the lower end of the insertion frame, and the other end of the liquid return pipe is connected with the liquid storage container which is further connected with the main liquid inlet pipe; the liquid driving device is arranged on the main liquid inlet pipe or the liquid return pipe; the liquid storage container is connected with the refrigerating system; after temperature exchange is completed, the cooling liquid flows out through the node liquid return opening and converges at the bottom of the insertion frame, and the bottom of the insertion frame is of an expansion structure capable of storing liquid. The liquid cooling equipment is cooled, and the problems that the backflow speed of cooling liquid is too low, and the pipeline maintenance cost is too high are solved.

Description

Technical Field

[0001] The present invention relates to the field of liquid cooling of electronic equipment, and more specifically, to a liquid cooling unit, device and method. Background Art

[0002] Electronic devices, including some high-power consumption components, will generate a lot of heat during operation. If this heat cannot be dissipated in a timely and effective manner, it will cause the device to overheat, affect performance, or even damage the hardware. Therefore, liquid cooling technology is needed to dissipate the heat of electronic equipment. The current mainstream liquid cooling technology routes include cold plate type, immersion type, and spray type, and one or more liquid cooling technologies are used in liquid cooling cabinets to achieve heat dissipation of electronic equipment. At present, the mainstream liquid cooling cabinet adopts the inlet pipe and the return pipe to jointly transport and drain the coolant, which mainly has the following shortcomings: First, the cabinet is installed with multiple liquid cooling equipment nodes to cool multiple electronic devices, and the inlet and return pipes that need to be connected are numerous, the pipes are complex, and the space occupied is large; second, the method of using coolant to converge from many branch pipes to the main liquid pipe makes the main liquid pipe pressure very high, the maintenance cost of the main liquid pipe increases, and the flow rate of the main liquid pipe also decreases. Therefore, it is necessary to adjust the coolant drainage plan. Summary of the invention

[0003] The present invention aims to overcome at least one defect (shortcoming) of the above-mentioned prior art and provide a liquid cooling unit, device and method for improving the slow return flow rate of the cooling liquid and the high cost of the liquid cooling unit, device and method.

[0004] In a first aspect, a liquid cooling unit is provided, the liquid cooling unit comprising at least one liquid cooling device node, a coolant circulation system and a refrigeration system, characterized in that the liquid cooling unit further comprises an insertion frame, the liquid cooling device node is installed inside the insertion frame; the liquid cooling device node is provided with one or more node liquid inlets and node liquid return ports, the insertion frame is provided with an insertion frame liquid inlet and a liquid return port at the lower end of the insertion frame;

[0005] The cooling liquid circulation system comprises a main liquid inlet pipe, branch liquid inlet pipes, a liquid return pipe, a liquid drive device and a liquid storage container, wherein one of the liquid cooling device nodes corresponds to one or more branch liquid inlet pipes, and the liquid drive device and the liquid storage container are arranged outside the plug-in frame; the node liquid inlet is connected to one end of the corresponding branch liquid inlet pipe, and the other end of each branch liquid inlet pipe is connected to one end of the main liquid inlet pipe through the plug-in frame liquid inlet;

[0006] One end of the liquid return pipe is connected to the liquid return port at the lower end of the insert frame, and the other end of the liquid return pipe is connected to the liquid storage container, and the liquid storage container is also connected to the main liquid inlet pipe; the liquid drive device is arranged on the main liquid inlet pipe or the liquid return pipe; the liquid storage container is connected to the refrigeration system;

[0007] After the temperature of the liquid cooling device node is changed, the coolant flows out through the node liquid return port of the liquid cooling device node and is collected at the bottom of the plug-in frame, wherein the bottom of the plug-in frame is an expansion structure capable of storing liquid.

[0008] Specifically, the liquid cooling unit is used to perform liquid cooling on the liquid cooling device. By improving the pipeline design of the coolant circulation system, the coolant can directly flow out of the liquid cooling device node through the node return port, and then gather at the bottom of the frame under the action of gravity. This can achieve simultaneous liquid return of multiple liquid cooling device nodes without pipeline pressure, reducing the use and maintenance of the return pipe, and achieving the purpose of improving the slow return flow rate of the coolant and alleviating the high cost of pipeline maintenance.

[0009] Optionally, the liquid cooling device node includes a node shell and one or more liquid cooling devices arranged inside the node shell, and the one or more liquid cooling devices implement one or more liquid cooling methods of spray liquid cooling, immersion liquid cooling, and cold plate liquid cooling.

[0010] Specifically, the liquid cooling device node can implement a liquid cooling method that combines one or more technologies of spraying, immersion, and cold plate of mainstream liquid cooling technologies to achieve efficient and accurate heat dissipation of electronic equipment.

[0011] Optionally, when one or more of the liquid cooling devices implement a spray liquid cooling method, the node liquid return port is arranged at the lower end of the node shell.

[0012] Specifically, when the spray liquid cooling method is implemented, the node liquid return port is arranged at the lower end of the node shell, which can ensure that after the coolant sprays the liquid cooling equipment, it is collected at the bottom of the liquid cooling equipment node, and finally flows out through the node liquid return port arranged at the lower end of the node shell, thereby realizing the reflux of the coolant.

[0013] Optionally, when one or more of the liquid cooling devices implement immersion liquid cooling, the node liquid return port is arranged at a middle position of the node shell, and the middle position is higher than the upper surface of the liquid cooling device.

[0014] Specifically, when implementing the immersion liquid cooling method, the node liquid return port should be located in the middle of the node shell above the upper surface of the liquid cooling device, so that a liquid height higher than the liquid cooling device can be formed, and the liquid cooling device can be completely immersed in the coolant to achieve immersion heat dissipation.

[0015] Optionally, when one or more of the liquid cooling devices implements a cold plate liquid cooling mode, the branch liquid inlet pipe enters the liquid cooling device node through the node liquid inlet port and is closely attached to the liquid cooling device;

[0016] Alternatively, it includes a cold plate that fits the liquid cooling device, wherein the cold plate is connected to the branch liquid inlet pipe and is closely attached to the liquid cooling device.

[0017] Specifically, when implementing the cold plate liquid cooling method, there are two schemes: one is to perform liquid cooling through the branch liquid inlet pipe and the liquid cooling device, and the branch liquid inlet pipe is connected to the node return port of the liquid cooling device node to realize the reflux of the cooling liquid; the other is that the cooling liquid enters the cold plate through the branch liquid inlet pipe, and the lower surface of the cold plate is closely fitted with the upper surface of the liquid cooling device to realize liquid cooling of the liquid cooling device. The above two schemes can realize cold plate liquid cooling, and the scheme can be selected and installed as needed in actual liquid cooling work.

[0018] Optionally, when one or more of the liquid cooling devices implement spray liquid cooling and immersion liquid cooling, the node liquid return port is arranged at the middle position of the node shell and the middle position is higher than the upper surface of the liquid cooling device; or,

[0019] When one or more of the liquid cooling devices implement spray liquid cooling and cold plate liquid cooling, and the node liquid return port is arranged at the lower end of the node shell; the branch liquid inlet pipe enters the liquid cooling device node through the node liquid inlet port and is closely attached to the liquid cooling device; or, it includes a cold plate attached to the liquid cooling device, the cold plate is connected to the branch liquid inlet pipe and is closely attached to the liquid cooling device; or,

[0020] When one or more of the liquid cooling devices implement immersion liquid cooling and cold plate liquid cooling, the node liquid return port is arranged at the middle position of the node shell, and the middle position is higher than the upper surface of the liquid cooling device; the branch liquid inlet pipe enters the liquid cooling device node through the node liquid inlet port and is closely attached to the liquid cooling device; or, it includes a cold plate attached to the liquid cooling device, the cold plate is connected to the branch liquid inlet pipe and is closely attached to the liquid cooling device; or,

[0021] When one or more of the liquid cooling devices implement spray liquid cooling, immersion liquid cooling and cold plate liquid cooling, the node liquid return port is arranged at the middle position of the node shell, and the middle position is higher than the upper surface of the liquid cooling device; the branch liquid inlet pipe enters the liquid cooling device node through the node liquid inlet port and is closely attached to the liquid cooling device; or, it includes a cold plate attached to the liquid cooling device, and the cold plate is connected to the branch liquid inlet pipe and is closely attached to the liquid cooling device.

[0022] Specifically, the above scheme introduces a liquid cooling method that combines two or three technologies of spraying, immersion, and cold plate, all of which can achieve the best effect of combining multiple technologies with liquid cooling.

[0023] Optionally, the spray liquid cooling method is implemented by a first spray device and / or a second spray device arranged inside the liquid cooling device node;

[0024] The implementation method of the spray liquid cooling method is as follows:

[0025] Use the first spray device to spray all the liquid cooling devices in the liquid cooling device node in a one-to-many manner, and the first spray device is located at the top inside the liquid cooling device node; or,

[0026] Use the second spray device to spray each liquid cooling device in the liquid cooling device node in a one-to-one manner; or,

[0027] Simultaneously use the first spray device and the second spray device to spray the liquid cooling devices. Among them, use the first spray device to spray all the liquid cooling devices in the liquid cooling device node in a one-to-many manner, and the first spray device is located at the top inside the liquid cooling device node. Use the second spray device to spray one or more of the liquid cooling devices in the liquid cooling device node in a one-to-one manner;

[0028] Preferably, the cross-section of the second spray device is a U-shaped structure, and a first liquid cavity and a second liquid cavity are provided inside the second spray device. The first liquid cavity and the second liquid cavity are isolated by a clamping plate provided with jet holes. The bottom of the second spray device is in contact with the surface of the liquid cooling device, and a second liquid cavity liquid return port communicating with the inside of the liquid cooling device node is provided at the lower end of the second spray device.

[0029] Specifically, the liquid cooling device node further includes a first spray device and a second spray device, and the first spray device and / or the second spray device is used for spraying. The first spray device can realize large-range spraying of all the liquid cooling devices in the liquid cooling device node in a one-to-many manner; the second spray device can realize precise spraying of each liquid cooling device in a one-to-one manner, so that the coolant can more fully directly contact the liquid cooling device, improve the liquid cooling efficiency, and after the coolant completes the liquid cooling work, it directly enters the inside of the housing through the cold plate second liquid cavity liquid return port and then is discharged, saving a part of the pipeline use and reducing the liquid cooling cost.

[0030] In a second aspect, a liquid cooling device is provided, wherein the liquid cooling device includes a plurality of liquid cooling units and a cabinet for installing the liquid cooling units, and a cabinet through hole for the main liquid inlet pipe and the liquid return pipe to pass through is provided on the cabinet.

[0031] Specifically, the liquid cooling units can be used alone, or multiple liquid cooling units can be integrally installed and used in a liquid cooling device, maximizing the integration of the liquid cooling units. While saving the installation space, the design inside the liquid cooling units can be utilized to achieve the effect of simultaneously liquid cooling multiple liquid cooling devices by multiple liquid cooling methods.

[0032] Optionally, the liquid cooling unit is provided with a liquid return port at the top of the plug-in frame; the plurality of liquid cooling units are installed in the cabinet in a manner of being connected from top to bottom, and the cooling liquid is returned in a series manner, wherein:

[0033] The main liquid inlet pipe enters the cabinet through the cabinet through-hole, and then enters the plug-in frame of each liquid cooling unit through the liquid inlet of the plug-in frame of each liquid cooling unit;

[0034] The top liquid return port of the liquid cooling unit located at the top of the cabinet is in a sealed state, and the liquid return port at the lower end of the plug-in frame of the liquid cooling unit located at the bottom of the cabinet is connected to the liquid storage container through the liquid return pipe; except for the top liquid return port of the liquid cooling unit located at the top of the cabinet and the liquid return port at the lower end of the plug-in frame of the liquid cooling unit located at the bottom of the cabinet, the liquid return ports at the lower end of the plug-in frames of other liquid cooling units in the cabinet are connected to the top liquid return ports of the liquid cooling units located below and adjacent to the other liquid cooling units through their liquid return pipes;

[0035] or,

[0036] The plurality of liquid cooling units are installed in the cabinet in a manner of being connected from top to bottom or from left to right, and the cooling liquid is refluxed in parallel, wherein:

[0037] The main liquid inlet pipe enters the cabinet through the cabinet through-hole, and then enters the plug-in frame of each liquid cooling unit through the liquid inlet of the plug-in frame of each liquid cooling unit;

[0038] The liquid return port at the lower end of the insertion frame of each of the liquid cooling units is connected to the liquid storage container through the liquid return pipe.

[0039] Specifically, the two liquid cooling units are connected through a return liquid pipe, and the cooling liquid enters the liquid cooling unit from the main liquid inlet pipe, and then enters the liquid cooling device node through the branch liquid inlet pipe for liquid cooling; the cooling liquid is refluxed in series, reducing the use of return liquid pipes and reducing installation costs; the liquid cooling unit can also be connected from top to bottom or from left to right, and the cooling liquid is refluxed in parallel, realizing the diversification of the installation method of the liquid cooling unit.

[0040] In a third aspect, a liquid cooling method is provided for liquid cooling the liquid cooling unit described in the first aspect, the method comprising:

[0041] Acquire the property information of the liquid cooling unit that needs liquid cooling and the target temperature of the liquid cooling equipment in the liquid cooling unit after liquid cooling;

[0042] Selecting the liquid cooling method according to the attribute information and the target temperature, and using the corresponding liquid cooling method to liquid cool the liquid cooling device nodes in the liquid cooling unit;

[0043] Monitor the liquid cooling state of the liquid cooling unit in real time to adjust the liquid cooling work of the liquid cooling device node according to the monitoring result;

[0044] The attribute information of the liquid cooling unit includes the size of the frame in the liquid cooling unit, the number of liquid cooling device nodes in the liquid cooling unit and their liquid cooling attributes, the size of the node liquid inlet, the node liquid return port, the frame liquid inlet and the liquid return port at the lower end of the frame, and the size of the branch liquid inlet pipe, the main liquid inlet pipe and the liquid return pipe;

[0045] The liquid cooling methods include spraying liquid cooling, immersion liquid cooling, cold plate liquid cooling, and a combination of spraying, immersion, and cold plate liquid cooling.

[0046] Specifically, the method provides a strategy for using different liquid cooling methods to cool a liquid cooling unit, thereby achieving personalized liquid cooling of the liquid cooling unit.

[0047] A liquid cooling unit, device and method of the present invention improves the cooling liquid circulation system and abandons the traditional solution of using multiple return pipes to collect the cooling liquid, so that the cooling liquid of the liquid cooling device node can directly flow out through the return liquid port, and collect to the bottom of the plug-in frame, and flow out through the return liquid port at the lower end of the plug-in frame to return to the liquid storage container. The liquid cooling unit, device and method of the present invention are used for liquid cooling of electronic equipment, etc., and improve the problems of slow return flow rate of cooling liquid and high maintenance cost of pipelines, so as to achieve efficient liquid cooling; at the same time, different liquid cooling methods can be selected according to the needs and properties of different types of liquid cooling units to achieve personalized liquid cooling of various types of liquid cooling units. BRIEF DESCRIPTION OF THE DRAWINGS

[0048] Figure 1 A side view of the liquid cooling unit provided in this embodiment.

[0049] Figure 2 A schematic diagram of a liquid cooling device node for implementing spray liquid cooling provided in this embodiment.

[0050] Figure 3 A schematic diagram of a liquid cooling device node for implementing immersion liquid cooling provided in this embodiment.

[0051] Figure 4 A schematic diagram of a liquid cooling device node for implementing spray and immersion liquid cooling provided in this embodiment.

[0052] Figure 5 A schematic diagram of a liquid cooling device node for implementing spray and cold plate liquid cooling provided in this embodiment.

[0053] Figure 6 A schematic diagram of a liquid cooling device node for implementing immersion and cold plate liquid cooling provided in this embodiment.

[0054] Figure 7A schematic diagram of a liquid cooling device node for implementing spraying, immersion and cold plate liquid cooling provided in this embodiment.

[0055] Figure 8 This is a schematic diagram of the installation of multiple liquid cooling units in the liquid cooling device provided in this embodiment.

[0056] Fig. 9 A schematic diagram of a mixed installation of multiple liquid cooling units and liquid cooling device nodes in the liquid cooling device provided in this embodiment.

[0057] Fig.10 This is a structural diagram of the second spray device provided in this embodiment.

[0058] Fig.11 A schematic diagram of a liquid cooling device node for implementing air cooling and cold plate liquid cooling provided in this embodiment.

[0059] Fig.12 A flow chart of a liquid cooling method provided in this embodiment.

[0060] Icons: 1- liquid return port on top of the frame; 2- liquid inlet on the frame; 3- liquid return port on the bottom of the frame; 4- frame; 5- liquid storage container; 6- liquid drive device; 7- main liquid inlet pipe; 8- branch liquid inlet pipe; 9- liquid inlet of liquid cooling device node; 10- liquid return port of liquid cooling device node; 11- liquid cooling device node; 12- front door of the frame; 13- rear door of the frame; 14- inlet and outlet; 15- liquid return pipe; 16- Liquid return pipe; 51-node shell; 53-first spray device; 54-PCB board; 55-cold plate whose liquid return port of cold plate is connected to the liquid return pipe; 57-secondary liquid cooling device; 58-main liquid cooling device; 59-cold plate whose liquid return port of cold plate is not connected to the liquid return pipe; 61-jet hole; 62-liquid inlet of liquid chamber 1; 63-liquid return port of liquid chamber 2; 64-liquid chamber 1 of the second spray device; 65-liquid chamber 2 of the second spray device. DETAILED DESCRIPTION

[0061] The drawings of this application are only used for illustrative purposes and should not be construed as limiting the present application. In order to better illustrate the following embodiments, some parts of the drawings may be omitted, enlarged or reduced, and do not represent the size of the actual product; it is understandable to those skilled in the art that some well-known structures and their descriptions in the drawings may be omitted.

[0062] In order to enable those skilled in the art to better understand the solution of the present application, the technical solution in the embodiments of the present application will be clearly and completely described below in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all of the embodiments. Based on the embodiments in the present application, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present application.

[0063] It should be noted that the terms "first", "second", etc. in the specification and claims of the present application and the above-mentioned drawings are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence. It should be understood that the data used in this way can be interchangeable where appropriate, so that the embodiments of the present application described herein can be implemented in an order other than those illustrated or described herein. In addition, the terms "including" and "having" and any of their variations are intended to cover non-exclusive inclusions, for example, a process, method, system, product or device comprising a series of steps or units is not necessarily limited to those steps or units clearly listed, but may include other steps or units that are not clearly listed or inherent to these processes, methods, products or devices.

[0064] For example, this embodiment provides a liquid cooling unit. Figure 1 As shown, a side view of a liquid cooling unit is provided, and the liquid cooling unit includes a plug-in frame 4, a liquid cooling device node 11, and a coolant circulation system. The liquid cooling device node 11 is installed inside the plug-in frame 4. The liquid cooling device node 11 is mounted on the frame through a mounting structure provided inside the plug-in frame 4. Preferably, the mounting structure can be a card slot; it is understandable that the card slot of the plug-in frame 4 can be adapted to the specifications of the liquid cooling device node 11 including length, height and width so as to be smoothly installed. The installation method can be push-pull card slot installation, direct load-bearing card slot installation, etc., and there is no special requirement for the installation method.

[0065] Specifically, the plug-in frame is provided with a plug-in frame front door 12 and a plug-in frame rear door 13, which provide a passage for the installation of the liquid cooling device node 11 and facilitate the maintenance of the liquid cooling device node 11. The plug-in frame front door 12 and the plug-in frame rear door 13 should be in a closed state when the liquid cooling unit is working. It is understandable that when the plug-in frame front door 12 and the plug-in frame rear door 13 are in a closed state, the door frame gap should be sealed to prevent leakage;

[0066] The insert frame 4 is also provided with an insert frame liquid inlet 3 and a liquid return port 2 at the lower end of the insert frame. The insert frame liquid inlet 3 is a passage for the main inlet pipe 7 to enter the insert frame 4, wherein no special requirement is imposed on the position of the insert frame liquid inlet 3. Preferably, the insert frame liquid inlet 3 can be designed to be close to the insert frame front door 12 or the insert frame rear door 13, so as to be conveniently connected to the main liquid return pipe; the insert frame lower end liquid return port 2 needs to be arranged at the bottom of the insert frame 4, so as to facilitate the coolant collected at the bottom of the insert frame to flow out of the insert frame smoothly and enter the liquid return pipe 15; preferably, the insert frame lower end liquid return port 2 can also be designed to be close to the insert frame front door 12 or the insert frame rear door 13, so as to be conveniently connected to the liquid return pipe;

[0067] Specifically, the cooling liquid circulation system includes a main liquid inlet pipe 7, a branch liquid inlet pipe 8, a liquid return pipe 15, a liquid drive device 6 and a liquid storage container 5, wherein one of the liquid cooling device nodes 11 corresponds to one or more branch liquid inlet pipes 8. The node liquid inlet 9 is connected to one end of the corresponding branch liquid inlet pipe 8, and the other end of each branch liquid inlet pipe 8 is connected to one end of the main liquid inlet pipe 7 through the insert frame liquid inlet 3;

[0068] Specifically, the liquid cooling device node 11 is provided with one or more node liquid inlets 9 and node liquid return ports 10. It is understandable that the liquid cooling device node 11 can be liquid cooled by different liquid cooling methods, and the number and position of the node liquid inlets 9 and node liquid return ports 10 required by different liquid cooling methods will change accordingly, so a liquid cooling device node 11 needs to correspond to one or more node liquid inlets 9 and node liquid return ports 10 according to different liquid cooling methods; it is understandable that because a liquid cooling device node 11 corresponds to one or more node liquid inlets 9, thereby realizing multi-channel input of cooling liquid, the branch liquid inlet pipes 8 need to correspond to the number of node liquid inlets 9, and the corresponding branch liquid inlet pipes 8 and node liquid inlets 9 are connected one by one;

[0069] It is understandable that the other end of each branch liquid inlet pipe 8 is connected to one end of the main liquid inlet pipe 7 through the plug-in frame liquid inlet port 3, so that the cooling liquid is diverted to each branch liquid inlet pipe 8 through the main liquid inlet pipe 7, and then enters each liquid cooling device node 11.

[0070] Specifically, the cooling liquid driving device 6 and the liquid storage container 5 are arranged outside the insertion frame 4; it is understandable that a return liquid chamber and a new liquid chamber are provided inside the liquid storage container 5, and the return liquid chamber and the new liquid chamber are isolated by a temperature insulation board and are not connected to each other, and both the return liquid chamber and the new liquid chamber are provided with liquid ports (not shown in the figure); one end of the return liquid pipe 15 is connected to the return liquid port 2 at the lower end of the insertion frame, and the other end of the return liquid pipe 2 is connected to the return liquid chamber of the liquid storage container 5, and the new liquid chamber of the liquid storage container 5 is also connected to the main liquid inlet pipe 7.

[0071] Specifically, the liquid return chamber and the liquid inlet chamber of the liquid storage container 5 are respectively connected to the refrigeration system; it is understandable that the liquid return chamber of the liquid storage container 5 recovers the coolant that completes the liquid cooling work. Because the coolant has undergone the process of absorbing heat from the liquid cooling equipment, the temperature is higher than the initial state of the coolant. Therefore, the coolant in the liquid return chamber is input into the refrigeration system for cooling. The coolant cooled to the initial state is then returned to the new liquid chamber of the liquid storage container 5 through the pipeline to prepare for the next round of liquid cooling. It is understandable that the initial state of the coolant refers to the temperature at which the coolant can dissipate heat from the liquid cooling equipment with the highest efficiency. The temperature value of the initial state needs to be balanced and set according to the liquid cooling requirements of the liquid cooling equipment and the energy consumption of the liquid cooling unit. According to the above connection, the coolant forms a closed loop of circulation outside the plug-in frame 4;

[0072] It is understandable that the liquid driving device 6 is arranged on the main liquid inlet pipe 7 or the liquid return pipe 15 to provide power for the coolant and complete the circulation of the coolant in the liquid cooling unit.

[0073] It can be understood that the pipeline of the liquid cooling unit includes a main liquid inlet pipe 7 and a liquid return pipe 15, and the liquid port of the liquid cooling unit includes a plug-in frame liquid inlet 3, a plug-in frame top liquid return port 1, and a plug-in frame bottom liquid return port 2; preferably, the pipeline and liquid port of the liquid cooling unit can be set on the side of the plug-in frame front door 12 or the plug-in frame rear door 13; accordingly, the liquid port of the liquid cooling device node includes a node liquid inlet 9 and a node liquid return port 10, and the liquid port of the liquid cooling device node should also be designed near the plug-in frame front door or the plug-in frame rear door, so that each plug-in frame liquid port, each liquid cooling device node liquid port and each plug-in frame pipeline can be easily connected, so that the layout is clear and maintenance is convenient.

[0074] Specifically, the cooling liquid flows from the liquid storage container 5 into the main liquid inlet pipe 7, and then is branched from the main liquid inlet pipe 7 to each of the branch liquid inlet pipes 8, and enters the corresponding liquid cooling device node 11 through each of the branch liquid inlet pipes 8 for liquid cooling; the cooling liquid that completes the liquid cooling work flows out through the node return liquid port 10 of the liquid cooling device node 11 and gathers at the bottom of the insertion frame 4, and finally enters the return liquid pipe 15 through the return liquid port 2 at the lower end of the insertion frame, and flows into the liquid storage container 5 through the return liquid pipe 15.

[0075] Compared with the traditional cooling liquid circulation pipeline solution, the present invention reduces the usage of the return pipe 15, which can save the cost of pipeline materials and prevent complicated pipeline layout; furthermore, the cooling liquid is directly discharged from the node return port 10 of the liquid cooling device node 11 and collected at the bottom of the frame 4 to recover the cooling liquid, which can reduce the pressure of the return pipe and prevent the liquid cooling unit from malfunctioning due to excessive pressure in the return pipe 15, thereby improving the efficiency of the liquid cooling work.

[0076] Optionally, the liquid cooling device node 11 includes a node shell 51 and one or more liquid cooling devices arranged inside the node shell 51, and one or more of the liquid cooling devices realize one or more liquid cooling methods including spray liquid cooling, immersion liquid cooling, and cold plate liquid cooling based on the coolant input by the branch liquid inlet pipe 8.

[0077] Optionally, when one or more of the liquid cooling devices implements a spray liquid cooling method based on the coolant input by the branch liquid inlet pipe 8, the node liquid return port 10 is provided at the lower end of the node shell 51. Figure 2 , a schematic diagram of a liquid cooling device node for implementing spray liquid cooling in this embodiment is provided.

[0078] Exemplarily, the liquid cooling device includes a secondary liquid cooling device 57 and a primary liquid cooling device 58. The PCB board 54 is a basic component for supporting and connecting the liquid cooling device, which provides a mechanical foundation for the liquid cooling device and realizes electrical connection between devices through a series of conductive paths (usually copper foil).

[0079] Specifically, Figure 2 The secondary liquid cooling device 57 and the primary liquid cooling device 58 exchange heat through the cooling liquid sprayed by the first spray device 53 located at the top of the node shell 51. The cooling liquid enters the first spray device 53 of the liquid cooling device node 11 from the node liquid inlet 9 through the branch liquid inlet pipe 8; it can be understood that the first spray device 53 is provided with a spray chamber, and the lower surface of the spray chamber is provided with a plurality of spray holes, so that the cooling liquid can be sprayed downward;

[0080] It is understandable that the liquid inlet diameter of the first spray device 53 is much larger than the aperture of the spray hole, so that the flow rate of the coolant flowing into the first spray device is much greater than the speed of the coolant spraying, so the coolant can quickly fill the spray chamber, exert pressure on the coolant spraying downward, and provide power. The coolant spraying downward exchanges heat with the secondary liquid cooling device 57 and the main liquid cooling device 58, and then flows out at the node return liquid port 10.

[0081] The node liquid return port 10 is disposed at the lower end of the node shell 51 , so that the cooling liquid collected at the bottom of the liquid cooling device node 11 can all flow out smoothly from the node liquid return port 10 .

[0082] Optionally, when one or more of the liquid cooling devices implements immersion liquid cooling based on the coolant input by the branch liquid inlet pipe 8, the node liquid return port 10 is arranged at the middle position of the node shell 51, and the middle position is higher than the upper surface of the liquid cooling device. Figure 3 , a schematic diagram of a liquid cooling device node for implementing immersion liquid cooling in this embodiment is provided.

[0083] For example, Figure 3 The secondary liquid cooling device 57 and the main liquid cooling device 58 exchange heat by being immersed in the coolant. The coolant enters the liquid cooling device node through the node liquid inlet 9 via the branch liquid inlet pipe 8; the node liquid return port 10 is arranged at the middle position of the node shell 51, and the middle position is higher than the upper surface of the secondary liquid cooling device 57 and the main liquid cooling device 58, so that the coolant can be collected at the bottom of the liquid cooling device node before flowing out of the node liquid return port 10, and accumulate a liquid height higher than the secondary liquid cooling device 57 and the main liquid cooling device 58, so as to immerse the secondary liquid cooling device 57 and the main liquid cooling device 58 in liquid cooling.

[0084] Optionally, when one or more of the liquid cooling devices implements a cold plate liquid cooling method based on the coolant input by the branch liquid inlet pipe 8, the coolant cools the liquid cooling device through the branch liquid inlet pipe 8. The following two solutions are included:

[0085] First, the branch liquid inlet pipe 8 is arranged in a spiral pattern on the upper surface of the liquid cooling device, and the wall of the spiral branch liquid inlet pipe 8 is closely attached to the liquid cooling device, so as to increase the contact area between the branch liquid inlet pipe 8 and the liquid cooling device, thereby fully exchanging heat with the liquid cooling device; the other end of the branch liquid inlet pipe 8 is connected to the node liquid return port 10, and the coolant after liquid cooling flows out of the node shell 51 from the node liquid return port 10 through the branch liquid inlet pipe 8;

[0086] Second, the coolant enters the cold plate through the branch liquid inlet pipe 8. The interior of the cold plate is a cold plate cavity, which includes a cold plate liquid inlet and a cold plate liquid return port. The coolant enters the cold plate cavity through the cold plate liquid inlet and is discharged through the cold plate liquid return port after completing the heat exchange.

[0087] There are two ways to discharge the coolant: one is that the cold plate return port is connected to a return pipe and flows out of the node shell 51 through the return pipe; the other is that the cold plate return port is not connected to a return pipe and flows directly into the inside of the node shell 51 and flows out of the node shell 51 through the return port of the liquid cooling device node.

[0088] Optionally, when one or more of the liquid cooling devices implements spray liquid cooling and immersion liquid cooling based on the coolant input by the branch liquid inlet pipe, the node liquid return port 10 is arranged at the middle position of the node shell 51, and the middle position is higher than the upper surface of the liquid cooling device. Figure 4 , a schematic diagram of a liquid cooling device node for implementing spray and immersion liquid cooling in this embodiment is provided.

[0089] Specifically, Figure 4 The secondary liquid cooling device 57 and the main liquid cooling device 58 can exchange heat through the coolant sprayed by the first spray device 53 located on the top of the node shell 51, or can exchange heat by being immersed in the coolant. The first spray device 53 enters the first spray device 53 through the branch liquid inlet pipe 8; it is understandable that the first spray device 53 is provided with a spray chamber, and the lower surface of the spray chamber is provided with a plurality of spray holes directly above the corresponding secondary liquid cooling device 57 and the main liquid cooling device 58, so as to realize the downward spraying of the coolant; the flow rate design between the first spray device 53 is the same as the above-mentioned introduction to realize spray liquid cooling, and will not be repeated here. After the coolant sprayed downward exchanges heat with the liquid cooling device, it is collected at the bottom of the liquid cooling device node 11;

[0090] The node liquid return port 10 is arranged at the middle position of the node shell 51, and the middle position is higher than the upper surface of the secondary liquid cooling device 57 and the main liquid cooling device 58, so that the coolant can accumulate at the bottom of the liquid cooling device node to a liquid height higher than the secondary liquid cooling device 57 and the main liquid cooling device 58 before flowing out of the node liquid return port 10, thereby immersing the secondary liquid cooling device 57 and the main liquid cooling device 58 in liquid cooling.

[0091] Optionally, when one or more of the liquid-cooling devices realize spray liquid cooling and cold plate liquid cooling based on the coolant input by the branch liquid inlet pipe, the node liquid return port 10 is arranged at the lower end of the node shell 51; the coolant cools the liquid-cooling device through the branch liquid inlet pipe 8, and the other end of the branch liquid inlet pipe 8 is connected to the node liquid return port 10, and the coolant after completing the liquid cooling work flows out of the node shell 51 from the node liquid return port 10 through the branch liquid inlet pipe 8; or it includes a cold plate bonded to the liquid cooling device, the coolant enters the cold plate through the branch liquid inlet pipe 8, and the liquid cooling device is liquid-cooled, and the coolant that completes the liquid cooling work flows out of the cold plate and enters the node shell 51; Figure 5 , a schematic diagram of a liquid cooling device node for implementing spraying and cold plate liquid cooling in this embodiment is provided.

[0092] Specifically, Figure 5 The secondary liquid cooling device 57 exchanges heat with the coolant sprayed by the first spray device 53 located at the top of the node shell 51, and the main liquid cooling device 58 exchanges heat by cold plate liquid cooling. It is understandable that the cold plate liquid cooling adopted by the main liquid cooling device 58 is the same as the introduction of the two schemes for realizing cold plate liquid cooling mentioned above, and will not be repeated here. In terms of spraying, the coolant enters the first spray device 53 through the branch liquid inlet pipe 8; it is understandable that the first spray device is provided with a spray chamber, and the lower surface of the spray chamber is provided with a plurality of spray holes just above the corresponding secondary liquid cooling device 57, so that the coolant can be sprayed downward; the flow rate design between the first spray device 53 is the same as the introduction of the above-mentioned spray liquid cooling method, and will not be repeated here. The coolant sprayed downward exchanges heat after contacting the secondary liquid cooling device 57, and finally flows out at the node return port 10 of the liquid cooling device node 11. The node liquid return port 10 is provided at the lower end of the node shell 51, so that the coolant collected at the bottom of the liquid cooling device node 11 can all smoothly flow out from the node liquid return port 10. In the specific implementation process, the secondary liquid cooling device 57 can also be liquid cooled by a cold plate liquid cooling method at the same time, and the main liquid cooling device 58 can also be liquid cooled by a spray liquid cooling method at the same time, and the specific implementation method will not be repeated.

[0093] Optionally, when one or more of the liquid cooling devices implements immersion liquid cooling and cold plate liquid cooling based on the coolant input by the branch liquid inlet pipe 8, the node liquid return port 10 is arranged at the middle position of the node shell 51, and the middle position is higher than the upper surface of the liquid cooling device; the coolant cools the liquid cooling device through the branch liquid inlet pipe 8, and the other end of the branch liquid inlet pipe 8 is connected to the node liquid return port 10, and the coolant after liquid cooling flows out of the node shell 51 from the node liquid return port 10 through the branch liquid inlet pipe 8; or it includes a cold plate bonded to the liquid cooling device, and the coolant enters the cold plate through the branch liquid inlet pipe 8 to cool the liquid cooling device, and the coolant that completes the liquid cooling flows out of the cold plate and enters the node shell 51. It is understandable that the cold plate liquid cooling adopted by the liquid cooling device is the same as the introduction of the above-mentioned two schemes for realizing cold plate liquid cooling, and will not be repeated here. Figure 6 , a schematic diagram of a liquid cooling device node for implementing immersion and cold plate liquid cooling in this embodiment is provided.

[0094] For example, Figure 6 The main liquid cooling device 58 is in full contact with the lower surface of the cold plate 59 to exchange heat. The coolant that completes the liquid cooling work in the cold plate 59 flows out of the liquid cooling device node 11 through the cold plate return port 63 and gathers at its bottom. When the coolant collected at the bottom of the liquid cooling device node 11 is sufficient, the liquid level of the coolant is higher than the height of the liquid cooling device, so that the secondary liquid cooling device 57 and the main liquid cooling device 58 are immersed in heat exchange, and finally flow out at the node return port 10. It can be understood that the node return port 10 is arranged in the middle position of the node shell 51, and the middle position is higher than the upper surface of the liquid cooling device, so as to ensure that the liquid level of the collected coolant is higher than the height of the liquid cooling device, so as to achieve an immersion effect. In the specific implementation process, the secondary liquid cooling device 57 can also be liquid cooled by cold plate liquid cooling at the same time, and the specific implementation method will not be repeated.

[0095] Optionally, when one or more of the liquid cooling devices implements spray liquid cooling, immersion liquid cooling and cold plate liquid cooling based on the coolant input by the branch liquid inlet pipe, the node liquid return port 10 is arranged at the middle position of the node shell 51, and the middle position is higher than the upper surface of the liquid cooling device; the coolant cools the liquid cooling device through the branch liquid inlet pipe 8, and the other end of the branch liquid inlet pipe 8 is connected to the node liquid return port 10, and the coolant after liquid cooling flows out of the node shell 51 from the node liquid return port 10 through the branch liquid inlet pipe 8; or it includes a cold plate bonded to the liquid cooling device, and the coolant enters the cold plate through the branch liquid inlet pipe 8 to cool the liquid cooling device, and the coolant that completes the liquid cooling flows out of the cold plate and enters the node shell 51. It is understandable that the scheme for implementing cold plate liquid cooling is the same as the introduction of the above-mentioned two schemes for implementing cold plate liquid cooling, and will not be repeated here. Figure 7 , a schematic diagram of a liquid cooling device node for implementing spray liquid cooling, immersion liquid cooling and cold plate liquid cooling in this embodiment is provided.

[0096] Specifically, Figure 7 The secondary liquid cooling device 57 can exchange heat with the cooling liquid sprayed by the first spray device 53 located at the top of the shell, or can exchange heat by immersing in the cooling liquid; the main liquid cooling device 58 can exchange heat with the upper surface of the cold plate 55 in full contact, or can exchange heat by immersing in the cooling liquid. In the specific implementation process, the secondary liquid cooling device 57 can also be liquid-cooled by the cold plate liquid cooling method at the same time, and the main liquid cooling device 58 can also be liquid-cooled by the spray liquid cooling method at the same time, and the specific implementation method will not be repeated.

[0097] The spray liquid cooling is implemented in the same way as described above, and will not be described in detail here;

[0098] The immersion liquid cooling is implemented in the same manner as described above, and will not be described in detail here;

[0099] The cold plate liquid cooling is implemented in the same way as described above, and will not be described in detail here.

[0100] Specifically, the spray liquid cooling method is implemented by a first spray device and / or a second spray device disposed inside the liquid cooling device node;

[0101] The spray liquid cooling method is implemented as follows:

[0102] Using the first spraying device to spray all the liquid cooling devices in the liquid cooling device node in a one-to-many manner, the first spraying device being located at the top inside the liquid cooling device node; or,

[0103] Use the second spraying device to spray each of the liquid cooling devices in the liquid cooling device node in a one-to-one manner; or,

[0104] Simultaneously use the first spraying device and the second spraying device to spray the liquid cooling devices. Among them, use the first spraying device to spray all the liquid cooling devices in the liquid cooling device node in a one-to-many manner. The first spraying device is located at the top inside the liquid cooling device node, and use the second spraying device to spray one or more of the liquid cooling devices in the liquid cooling device node in a one-to-one manner;

[0105] Preferably, the cross-section of the second spraying device is a 冂-shaped structure, and a first liquid chamber and a second liquid chamber are provided inside the second spraying device. The first liquid chamber and the second liquid chamber are separated by a clamping plate provided with jet holes. The bottom of the second spraying device is in contact with the surface of the liquid cooling device, and a second liquid chamber return port communicating with the inside of the liquid cooling device node is provided at the lower end of the second spraying device.

[0106] As Fig.10 shown, a structural diagram of a second spraying device is provided. The second spraying device is provided with a first liquid chamber 64 and a second liquid chamber 65. The first liquid chamber 64 and the second liquid chamber 65 are separated by a clamping plate provided with jet holes 61. The first liquid chamber 64 is provided with a first liquid chamber inlet 62. The first liquid chamber inlet 62 is connected to the sub-inlet pipe 8. The second liquid chamber 65 is provided with a second liquid chamber return port 63, and the second spraying device is a 冂-shaped structure. Therefore, the second liquid chamber is an open structure without a bottom surface, which can make the sprayed coolant directly contact the liquid cooling device. After the coolant enters the first liquid chamber 64, it enters the second liquid chamber 65 through the jet holes 61, and then flows out from the second liquid chamber return port 63. It can be understood that the diameter of the inlet 62 of the first liquid chamber 64 is much larger than the diameter of the jet holes 61, so that the coolant can quickly fill the first liquid chamber 64, apply pressure to the downward jetting coolant, and provide power. It can be understood that the pressure of the coolant can be controlled by the inlet speed of the coolant. The downward jetting coolant is directly sprayed on the liquid cooling device 58 through the second liquid chamber 65, and fully exchanges heat with the liquid cooling device 58. It can be understood that the vertical distance between the clamping plate and the liquid cooling device 58 meets a preset height. Preferably, in order to make the spraying effect better, in this example, the preset height is set to 0.5 - 5 mm.

[0107] It can be understood that the number of the second liquid chamber return ports 63 is not specially required, and the position of the second liquid chamber return port 63 can be set at both the left and right lower ends of the second liquid chamber 65.

[0108] It is understandable that the second spray device can use the pressure of the coolant to spray and cool the liquid cooling device at a close distance, and the structure of the second liquid chamber can concentrate the coolant on one of the liquid cooling devices to achieve the effect of precise liquid cooling of a liquid cooling device.

[0109] It is understandable that the first spray device and the second spray device can also be used in combination to achieve a liquid cooling effect for the liquid cooling equipment.

[0110] like Figure 8 As shown, based on the implementation of a liquid cooling unit in the present application, the present application also provides a liquid cooling device, which includes two or more liquid cooling units and a cabinet for installing the liquid cooling units, and the cabinet is provided with a cabinet through hole for the main liquid inlet pipe and the liquid return pipe to pass through.

[0111] The liquid cooling unit is provided with a liquid return port 1 at the top of the plug-in frame; the two or more liquid cooling units are installed in the cabinet in a manner of being connected from top to bottom, and the cooling liquid is refluxed in series, wherein:

[0112] The main liquid inlet pipe 7 enters the cabinet through the cabinet through-hole, and then enters the plug-in frame 4 of each liquid cooling unit through the plug-in frame liquid inlet 3 of each liquid cooling unit; the cooling liquid flows into the branch liquid inlet pipe 8 of each liquid cooling unit through the main liquid inlet pipe 7, and then enters the interior of the liquid cooling device node 11 for liquid cooling;

[0113] The top liquid return port 1 of the liquid cooling unit located at the top of the cabinet is in a sealed state, and the liquid return port 2 at the lower end of the plug-in frame of the liquid cooling unit located at the bottom of the cabinet is connected to the liquid storage container 5 through the liquid return pipe 15; except for the top liquid return port 1 of the liquid cooling unit located at the top of the cabinet and the liquid return port 2 at the lower end of the plug-in frame of the liquid cooling unit located at the bottom of the cabinet, the liquid return ports 2 at the lower end of the plug-in frame of other liquid cooling units in the cabinet are connected to the top liquid return port 1 of the liquid cooling unit located below and adjacent to the other liquid cooling unit through their liquid return pipes 15;

[0114] For example, Figure 8 The liquid cooling device cabinet is provided with a mounting structure for mounting a liquid cooling unit. The mounting structure can be implemented by a card slot. When designing the card slot of the liquid cooling device cabinet and the liquid cooling unit, the card slot of the cabinet needs to correspond to the attribute specifications related to the liquid cooling unit one by one, so that the liquid cooling unit can be adapted and installed inside the cabinet. Multiple liquid cooling units are installed in the cabinet, so that multiple liquid cooling units can be used in one liquid cooling device, thereby improving the liquid cooling efficiency and the flexibility of the liquid cooling solution.

[0115] Specifically, the cabinet is provided with front and rear cabinet doors to facilitate the installation of the liquid cooling unit; the top of the cabinet is provided with a cable hole, which is the passage for the cables of the liquid cooling unit; the top and bottom of the cabinet are provided with through holes for the inlet and outlet pipes, which are the pipe passages for the liquid inlet pipe and the liquid return pipe; the cabinet can be provided with an accessory installation area in the middle area where the two liquid cooling units are installed, for installing other equipment required for the operation of the liquid cooling unit, such as control switches, PBU power supply systems, and cable management racks, so as to ensure the normal operation of the liquid cooling unit. No special requirements are made for other specifications and attributes of the cabinet.

[0116] Specifically, the bottom of the main liquid inlet pipe 7 is connected to the liquid storage container 5, and enters the cabinet through the cabinet through-hole; the main liquid inlet pipe 7 then enters the plug-in frame 4 of each liquid cooling unit through the plug-in frame liquid inlet 3 of each liquid cooling unit, and is connected to each branch liquid inlet pipe 8, and the branch liquid inlet pipe 8 is connected to the plug-in frame liquid inlet 3 of the liquid cooling device node 11 installed in the liquid cooling unit; the coolant flows into the branch liquid inlet pipe 8 of each liquid cooling unit through the main liquid inlet pipe 7, and then enters the interior of the liquid cooling device node 11 for liquid cooling (not shown in the figure);

[0117] Preferably, each liquid cooling unit is provided with two plug-in frame liquid inlets, so that the main liquid inlet pipe runs through the liquid cooling unit, that is: the main liquid inlet pipe 7 enters the interior of the liquid cooling unit at the top of the plug-in frame from the plug-in frame liquid inlet of the liquid cooling unit at the top of the plug-in frame, extends from the other plug-in frame liquid inlet of the liquid cooling unit at the top of the plug-in frame, continues to enter the interior of the liquid cooling unit at the middle of the plug-in frame from the plug-in frame liquid inlet of the liquid cooling unit in the middle of the plug-in frame, extends from the other plug-in frame liquid inlet of the liquid cooling unit in the middle of the plug-in frame, and finally enters the interior of the liquid cooling unit at the top of the plug-in frame from the plug-in frame liquid inlet of the liquid cooling unit at the top of the plug-in frame, extends from the other plug-in frame liquid inlet of the liquid cooling unit at the top of the plug-in frame to reach the top of the cabinet, wherein the top of the main liquid inlet pipe 7 is sealed. The above-mentioned liquid inlet pipe connection scheme can shorten the distance between each branch liquid inlet pipe 8 and the main liquid inlet pipe 7, thereby reducing the length of each branch liquid inlet pipe 8; there is no need for multiple main liquid inlet pipes 7 to input coolant to each liquid cooling unit one by one, which also reduces the length of the main liquid inlet pipe 7, thereby achieving the purpose of reducing the use of pipelines.

[0118] In terms of reflux, Figure 8 The first liquid cooling unit is located at the top of the cabinet, the second liquid cooling unit is located in the middle of the cabinet, and the third liquid cooling unit is located at the bottom of the cabinet;

[0119] The top liquid return port 1 of the first liquid cooling unit is in a sealed state; the liquid return port 2 at the lower end of its insert frame is connected to the top liquid return port 1 of the second liquid cooling unit through its liquid return pipe 15, wherein the second liquid cooling unit is located below and adjacent to the first liquid cooling unit;

[0120] The top liquid return port 1 of the second liquid cooling unit is connected to the liquid return port 2 of the lower end of the plug-in frame of the first liquid cooling unit through the liquid return pipe 15 of the first liquid cooling unit, and the liquid return port 2 of the lower end of the plug-in frame is connected to the top liquid return port 1 of the third liquid cooling unit through the liquid return pipe 15, wherein the first liquid cooling unit is located above and adjacent to the second liquid cooling unit, and the third liquid cooling unit is located below and adjacent to the second liquid cooling unit;

[0121] The liquid return port 2 at the lower end of the insertion frame of the third liquid cooling unit is connected to the liquid storage container 5 through its liquid return pipe 15, and its top liquid return port 1 is connected to the liquid return port 2 at the lower end of the insertion frame of the second liquid cooling unit through the liquid return pipe 15 of the second liquid cooling unit, wherein the second liquid cooling unit is located above and adjacent to the third liquid cooling unit.

[0122] It is understandable that if the liquid cooling device needs to install more liquid cooling units, each liquid cooling unit can be installed according to the corresponding installation method based on the position of the cabinet where it is located. The position of the cabinet includes the top, middle and bottom of the cabinet.

[0123] It can be understood that the cooling liquid enters each liquid cooling unit through the main liquid branch pipe 7 in the liquid storage container 5, and then enters the liquid cooling device node 11 through each branch liquid inlet pipe 8 to cool the liquid cooling device. The cooling liquid that has completed liquid cooling in the first liquid cooling unit flows out through the node return liquid port 10, and due to the action of gravity, it is collected at the bottom of the first liquid cooling unit, and is drained through its return liquid pipe 15 to enter the second liquid cooling unit, and again due to gravity, it is collected at the bottom of the second liquid cooling unit; similarly, the cooling liquid that has completed liquid cooling in the second liquid cooling unit flows out through the node return liquid port 10, and due to gravity, it is collected at the bottom of the second liquid cooling unit together with the cooling liquid flowing down from the first liquid cooling unit; and so on, when all the cooling liquid is collected in the liquid cooling unit at the bottom of the frame, it flows back to the liquid storage container 5 through its return liquid pipe 15, completing the recovery of the cooling liquid.

[0124] For example, in this embodiment, another installation method of the liquid cooling unit in the liquid cooling device is provided, that is, the installation method of the two or more liquid cooling units in the cabinet is connected from top to bottom or from left to right, and the cooling liquid refluxes in parallel:

[0125] It is understandable that the way in which the coolant enters each liquid cooling device node 11 and the way in which the main liquid inlet pipe is installed are the same as those described above and will not be described in detail here.

[0126] The liquid return port 2 at the lower end of the insert frame of each liquid cooling unit is connected to the liquid storage container 5 through the liquid return pipe 15 to complete the recovery of the cooling liquid.

[0127] like Fig. 9As shown, on the basis of installing the liquid cooling unit in the liquid cooling device in the present application, the present application also provides a mixed installation method of the liquid cooling unit and the liquid cooling device node 11 in the liquid cooling device, that is, the cabinet of the liquid cooling device can be installed with the liquid cooling unit and the liquid cooling device node 11 directly. It is understandable that the cabinet is provided with a mounting structure, and the mounting structure can be implemented by a card slot; it is understandable that the card slot specifications for installing the liquid cooling device node 11 and installing the liquid cooling unit are different, because the liquid cooling device node 11 can be installed inside the liquid cooling unit, so the volume of the liquid cooling unit is larger than that of the liquid cooling device node 11. In order to flexibly design the installation positions of the liquid cooling device node 11 and the liquid cooling unit in the cabinet, a slot assembly of relevant accessories and the liquid cooling unit should be provided, so as to realize the transition from installing the liquid cooling unit to installing the liquid cooling device node 11, so that each slot of the cabinet can be installed with the liquid cooling device node 11 or the liquid cooling unit; it is understandable that because the space specifications of the cabinet are limited, the number of slots provided in the cabinet is limited, and the number of installed liquid cooling device nodes or liquid cooling units is also limited.

[0128] For example, Fig. 9 A schematic diagram of a mixed connection installation of multiple liquid cooling units and liquid cooling device nodes in a liquid cooling device provided in this embodiment;

[0129] Specifically, the installation method of the mixed installation of the multiple liquid cooling units and the multiple liquid cooling device nodes is to connect them from top to bottom, and the cooling liquid refluxes in series:

[0130] In terms of liquid inlet, the bottom of the main liquid inlet pipe 7 is connected to the liquid storage container 5, and enters the cabinet through the cabinet through-hole; the main liquid inlet pipe 7 then enters the plug-in frame 4 of each liquid cooling unit through the plug-in frame liquid inlet 3 of each liquid cooling unit, and is connected to each branch liquid inlet pipe 8, and the branch liquid inlet pipe 8 is connected to the node liquid inlet 9 of the liquid cooling device node installed in the liquid cooling unit; or, it is directly connected to the branch liquid inlet pipe 8, and the branch liquid inlet pipe 8 is directly connected to the node liquid inlet 9 of the liquid cooling device node 11 installed in the cabinet;

[0131] The cooling liquid flows into the branch liquid inlet pipe 8 of each of the liquid cooling units through the main liquid inlet pipe 7, or flows into the branch liquid inlet pipe 8 of each liquid cooling device node 11 installed in the cabinet (not shown in the figure);

[0132] The preferred liquid inlet solution only requires adjustments to be made in the installation of each liquid cooling unit. The adjustment solution is the same as the main liquid inlet pipe connection method described in the above liquid cooling unit, and will not be repeated here.

[0133] In terms of liquid return, the present solution also includes a branch liquid return pipe 16 connected to the node liquid return port of each liquid cooling device node;

[0134] Specifically, if one or more liquid cooling device nodes 11 are installed at the top of the cabinet, a liquid cooling device node cluster is formed. The node liquid inlet 9 of each liquid cooling device node 11 is connected to the branch liquid inlet pipe 8; the node liquid return port 10 of each liquid cooling device node is connected to the branch liquid return pipe 16, and each branch liquid return pipe 16 is connected to the liquid return pipe 15; the coolant that completes the liquid cooling work is collected in the liquid return pipe 15 through each branch liquid return pipe 16;

[0135] If the liquid cooling device node 11 is installed at the lower adjacent position of the last liquid cooling device node 11 of the liquid cooling device node cluster, the installation scheme is a node-node scheme, which is: the return liquid pipe 16 of the lower liquid cooling device node 11 continues to be connected to the return liquid pipe 15, and the connection method is the same as the liquid cooling device node cluster installed above, which will not be repeated here;

[0136] If another liquid cooling device node 11 is not installed at the lower adjacent position of the last liquid cooling device node of the liquid cooling device node cluster, but a liquid cooling unit is installed, the installation scheme is a node-unit scheme, which is: the return liquid pipe 15 is connected to the top return liquid port 1 of the liquid cooling unit, so that the cooling liquid collected in the return liquid pipe 15 flows into the interior of the liquid cooling unit through the top return liquid port 1 of the liquid cooling unit.

[0137] If one or more liquid cooling device nodes 11 are installed in the middle of the cabinet, a liquid cooling device node cluster is formed. The connection method is the same as the liquid cooling device node cluster installed above, and will not be repeated here;

[0138] If the upper adjacent position of the first liquid cooling device node of the liquid cooling device node cluster, or the lower adjacent position of the last liquid cooling device node of the liquid cooling device node cluster, continues to install the liquid cooling device node 11, the node-node solution connection can be used;

[0139] If a liquid cooling unit is installed at the upper adjacent position of the first liquid cooling device node 11 of the liquid cooling device node cluster, the installation scheme is a unit-node scheme, which is: the liquid return pipe 15 is connected to the liquid return port 2 at the lower end of the plug-in frame of the liquid cooling unit, so that the cooling liquid collected at the bottom of the liquid cooling unit flows into the liquid return pipe 15 as an intermediate channel for returning to the liquid storage container 5;

[0140] If a liquid cooling unit is installed at a lower adjacent position of the last liquid cooling device node 11 of the liquid cooling device node cluster, and the liquid cooling unit is at the upper part and adjacent to the liquid cooling device node cluster, a node-unit solution can be used for connection.

[0141] If one or more liquid cooling device nodes 11 are installed at the bottom of the cabinet, a liquid cooling device node cluster is formed. The connection method is the same as the liquid cooling device node cluster installed above, and will not be repeated here; and no other liquid cooling unit or liquid cooling device node 11 is installed at the lower adjacent position of the last liquid cooling device node 11 of the liquid cooling device cluster, then the liquid return pipe 15 is connected to the liquid storage container 5 to complete the recovery of the coolant;

[0142] If a liquid cooling unit is installed at an upper adjacent position of the first liquid cooling device node 11 of the liquid cooling device node cluster, the unit-node solution can be used for connection;

[0143] If the liquid cooling device node cluster continues to be installed at an upper adjacent position of the first liquid cooling device node 11, a node-to-node solution may be used for connection.

[0144] Exemplarily, in this embodiment, the present application also provides another mixed installation method of the liquid cooling unit and the liquid cooling device node in the liquid cooling device, that is, multiple liquid cooling units are connected to multiple liquid cooling device nodes 11 from top to bottom or from left to right, and the cooling liquid refluxes in parallel:

[0145] It is understandable that the way in which the coolant enters each liquid cooling device node 11 or liquid cooling unit and the way in which the main liquid inlet pipe is installed are the same as those described above and will not be repeated here.

[0146] Specifically, the liquid return port 2 at the lower end of the plug-in frame of each liquid cooling unit is connected to the liquid storage container 5 through the liquid return pipe 15, and the node liquid return port 10 of each liquid cooling device node 11 is connected to the liquid storage container 5 through the liquid return pipe 15, thereby completing the recovery of the cooling liquid.

[0147] Exemplarily, this embodiment also provides a liquid cooling device node that implements air cooling and cold plate liquid cooling, such as Fig.11 This is a schematic diagram of a liquid cooling device node for implementing air-cooled temperature exchange and cold plate liquid cooling in this embodiment.

[0148] Specifically, the liquid cooling device nodes that adopt this liquid cooling method can only be installed directly in the cabinet. It is understandable that the cabinet front door, cabinet rear door, and the cabinet front door and cabinet rear door corresponding to the liquid cooling device node should be provided with ventilation holes on both sides, and the ventilation holes can be adaptively switched to meet the installation scenario of the air-cooled temperature exchange method; when implementing air-cooled temperature exchange, the cabinet needs to open the ventilation holes of the cabinet front door and cabinet rear door to form ventilation.

[0149] Fig.11The secondary liquid cooling device 57 exchanges heat with the air in the wind, and the primary liquid cooling device 58 can exchange heat with the cold plate in close contact, and can also exchange heat with the air in the wind; it is understandable that the scheme for implementing liquid cooling of the cold plate is the same as the introduction of liquid cooling of the cold plate above, and will not be repeated here. When implementing the air-cooled temperature exchange method, it is necessary to set one side of the cabinet as the air inlet area and the other side of the cabinet as the air dissipation area; for example, Fig.11 The front door of the cabinet is set as the air intake area, and the other side of the rear door of the cabinet is set as the air dissipation area; air is blown at the front door of the cabinet to allow air to enter the liquid cooling device node, and after heat exchange with the secondary liquid cooling device 57 and the main liquid cooling device 58, it is discharged from the rear door of the cabinet.

[0150] In this embodiment, a liquid cooling method is also provided for liquid cooling the liquid cooling unit described above, such as Fig.12 A flow chart of a liquid cooling method provided in this embodiment. The method comprises:

[0151] S101, obtaining property information of a liquid cooling unit that needs liquid cooling and a target temperature of a liquid cooling device in the liquid cooling unit after liquid cooling;

[0152] S102, selecting the liquid cooling method according to the attribute information and the target temperature, and using the selected liquid cooling method to liquid cool the liquid cooling device nodes in the liquid cooling unit;

[0153] S103, monitoring the liquid cooling state of the liquid cooling unit in real time, so as to adjust the liquid cooling work of the liquid cooling device node according to the monitoring result;

[0154] The attribute information of the liquid cooling unit includes the size of the frame in the liquid cooling unit, the number of liquid cooling device nodes in the liquid cooling unit and their liquid cooling attributes, the size of the node liquid inlet, the node liquid return port, the frame liquid inlet and the liquid return port at the lower end of the frame, and the size of the branch liquid inlet pipe, the main liquid inlet pipe and the liquid return pipe;

[0155] The liquid cooling method includes spray liquid cooling, immersion liquid cooling, cold plate liquid cooling, and a combination of spray, immersion, and cold plate liquid cooling. It is understandable that the size of the plug-in frame in the liquid cooling unit is determined according to the size of the liquid cooling device node that needs to be liquid cooled, so that the liquid cooling device node can be installed inside the plug-in frame; the number of liquid cooling device nodes in the liquid cooling unit and their liquid cooling properties are obtained, and the liquid cooling properties include the sensitivity of the liquid cooling device node to the coolant, the conventional liquid cooling method of the liquid cooling device node, etc., combined with the size of the node liquid inlet, node liquid return port, plug-in frame liquid inlet and plug-in frame lower end liquid return port and the size of the branch liquid inlet pipe, main liquid inlet pipe, and liquid return pipe, select the liquid cooling device node of the corresponding liquid cooling method to be installed in the plug-in frame. Because the liquid cooling method used is different, the required node liquid inlet and node liquid return port positions are different, and the required number of branch liquid inlet pipes is also different. It is necessary to select the corresponding liquid cooling method according to the properties of each liquid cooling unit.

[0156] It is understandable that the liquid cooling device node can perform liquid cooling for various types of liquid cooling devices, and various types of liquid cooling devices may include electronic chips, electronic components, servers, etc. It is understandable that the properties of each type of liquid cooling device, such as material and specification, are different, so the property information of the liquid cooling device node can also become reference information for selecting a liquid cooling method;

[0157] Specifically, the target temperature of the liquid cooling unit after liquid cooling is a defined temperature at which the liquid cooling equipment that needs liquid cooling inside the liquid cooling unit can operate normally or be used normally;

[0158] Understandably, because each type of liquid cooling equipment has different properties such as materials and specifications, the liquid cooling methods that can be adopted will also be different. For example, some servers are very sensitive to coolants and cannot be directly exposed to coolants, so liquid cooling methods including spraying and immersion are not applicable; if some electronic components have different appearance specifications and do not have a flat heat-conducting surface, liquid cooling methods including cold plates are not applicable; preferably, the liquid cooling methods commonly used in various types of liquid cooling equipment can also be used as reference materials. For example, some servers, due to their structural reasons, will use a cooling solution combined with air cooling for heat dissipation, so a liquid cooling solution combined with air cooling can be selected; for example, some electronic devices are better at heat dissipation by immersion, so a liquid cooling solution combined with immersion can be selected;

[0159] It is understandable that because different liquid cooling devices in the liquid cooling unit have different performance and tolerance, the target temperature after liquid cooling is different. In addition, different liquid cooling schemes have different amounts of heat absorbed by the liquid cooling device for a single liquid cooling. Therefore, different liquid cooling schemes take different amounts of time to achieve the target temperature.

[0160] Therefore, considering the material, specifications and other properties of the liquid cooling equipment, and the target temperature that the liquid cooling equipment needs to achieve after heat dissipation, combined with the characteristics of each liquid cooling solution, starting from the direction of minimum energy consumption and minimum usage time of the liquid cooling unit, a personalized liquid cooling solution is selected for the liquid cooling unit to achieve efficient heat dissipation.

[0161] Specifically, by monitoring the liquid cooling state of the liquid cooling unit in real time, the state of the liquid cooling at every moment can be controlled in real time; it is understandable that the monitoring can use a monitoring tool, which can be a temperature sensor, and the temperature sensor is close to the surface or inside of the liquid cooling device to ensure the accuracy of the measured temperature data.

[0162] It is understandable that after the liquid cooling device is placed inside the liquid cooling device node, the temperature sensor can obtain the temperature t0 of the initial state, and according to the target temperature t2 after liquid cooling required by the liquid cooling device as the condition for completing the liquid cooling work, the temperature t1 of the liquid cooling device at a certain time point during the liquid cooling process is monitored in real time. It is understandable that when:

[0163] t1=t2

[0164] The liquid cooling device reaches the target temperature and the liquid cooling work is completed.

[0165] It is understandable that after the coolant completes a liquid cooling cycle, the liquid cooling device still cannot reach the target temperature. At this time, the next round of liquid cooling of the coolant is required, so that the coolant cooled by the refrigeration system is cooled again until the target speed of the liquid cooling device is reached.

[0166] It is understandable that, because the temperature measurement and the flow of the coolant have a certain hysteresis, it is possible that after the liquid cooling work is completed, the final temperature of the liquid cooling equipment is lower than the target temperature, that is:

[0167] t1 <t2

[0168] It can be seen that the difference between t1 and t2 is small, and t1 can be ignored within the temperature range of safe operation or normal use of the liquid cooling device.

[0169] Obviously, the above embodiments of the present application are merely examples for clearly illustrating the technical solution of the present application, and are not intended to limit the specific implementation methods of the present application. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the claims of the present application shall be included in the protection scope of the claims of the present application.

Claims

1. A liquid cooling unit, comprising at least one liquid cooling device node, a coolant circulation system and a refrigeration system, characterized in that: The liquid cooling unit further comprises an insert frame, and the liquid cooling device node is installed inside the insert frame; the liquid cooling device node is provided with one or more node liquid inlet and node liquid return port, and the insert frame is provided with an insert frame liquid inlet and a liquid return port at the lower end of the insert frame; The cooling liquid circulation system comprises a main liquid inlet pipe, branch liquid inlet pipes, a liquid return pipe, a liquid drive device and a liquid storage container, wherein one of the liquid cooling device nodes corresponds to one or more branch liquid inlet pipes, and the liquid drive device and the liquid storage container are arranged outside the plug-in frame; the node liquid inlet is connected to one end of the corresponding branch liquid inlet pipe, and the other end of each branch liquid inlet pipe is connected to one end of the main liquid inlet pipe through the plug-in frame liquid inlet; One end of the liquid return pipe is connected to the liquid return port at the lower end of the insert frame, and the other end of the liquid return pipe is connected to the liquid storage container, and the liquid storage container is also connected to the main liquid inlet pipe; the liquid drive device is arranged on the main liquid inlet pipe or the liquid return pipe; the liquid storage container is connected to the refrigeration system; After the temperature of the liquid cooling device node is changed, the coolant flows out through the node liquid return port of the liquid cooling device node and is collected at the bottom of the plug-in frame, wherein the bottom of the plug-in frame is an expansion structure capable of storing liquid.

2. A liquid cooling unit according to claim 1, characterized in that: The liquid cooling device node includes a node shell and one or more liquid cooling devices arranged inside the node shell, and the one or more liquid cooling devices implement one or more liquid cooling methods of spray liquid cooling, immersion liquid cooling, and cold plate liquid cooling.

3. A liquid cooling unit according to claim 2, characterized in that: When one or more of the liquid cooling devices implement a spray liquid cooling method, the node liquid return port is arranged at the lower end of the node shell.

4. A liquid cooling unit according to claim 2, characterized in that: When one or more of the liquid cooling devices implement immersion liquid cooling based on the coolant input by the branch liquid inlet pipe, the node liquid return port is arranged at the middle position of the node shell, and the middle position is higher than the upper surface of the liquid cooling device.

5. A liquid cooling unit according to claim 2, characterized in that: When one or more of the liquid cooling devices implement a cold plate liquid cooling mode, the branch liquid inlet pipe enters the liquid cooling device node through the node liquid inlet port and is closely attached to the liquid cooling device; Alternatively, it includes a cold plate that fits the liquid cooling device, wherein the cold plate is connected to the branch liquid inlet pipe and is closely attached to the liquid cooling device.

6. A liquid cooling unit according to claim 2, characterized in that: When one or more of the liquid cooling devices implement spray liquid cooling and immersion liquid cooling, the node liquid return port is arranged at the middle position of the node shell and the middle position is higher than the upper surface of the liquid cooling device; or, When one or more of the liquid cooling devices implement spray liquid cooling and cold plate liquid cooling, the node liquid return port is arranged at the lower end of the node shell; the branch liquid inlet pipe enters the node of the liquid cooling device through the node liquid inlet port and is closely attached to the liquid cooling device; or, it includes a cold plate attached to the liquid cooling device, the cold plate is connected to the branch liquid inlet pipe and is closely attached to the liquid cooling device; or, When one or more of the liquid cooling devices implement immersion liquid cooling and cold plate liquid cooling methods, the node return liquid port is arranged at the middle position of the node housing, and the middle position is higher than the upper surface of the liquid cooling device; the sub-inlet pipe enters the liquid cooling device node through the node inlet and is closely attached to the liquid cooling device; or, it includes a cold plate attached to the liquid cooling device, the cold plate is connected to the sub-inlet pipe and is closely attached to the liquid cooling device; or, When one or more of the liquid cooling devices implement spray liquid cooling, immersion liquid cooling and cold plate liquid cooling methods, the node return liquid port is arranged at the middle position of the node housing, and the middle position is higher than the upper surface of the liquid cooling device; the sub-inlet pipe enters the liquid cooling device node through the node inlet and is closely attached to the liquid cooling device; or, it includes a cold plate attached to the liquid cooling device, the cold plate is connected to the sub-inlet pipe and is closely attached to the liquid cooling device.

7. A liquid cooling unit according to any one of claims 2 to 6, characterized in that: The spray liquid cooling method is realized by a first spray device and / or a second spray device arranged inside the liquid cooling device node; The implementation method of the spray liquid cooling method is: Use the first spray device to spray all the liquid cooling devices in the liquid cooling device node in a one-to-many manner, and the first spray device is located at the top inside the liquid cooling device node; Or, Use the second spray device to spray each liquid cooling device in the liquid cooling device node in a one-to-one manner; or, Use the first spray device and the second spray device to spray the liquid cooling device at the same time. Among them, use the first spray device to spray all the liquid cooling devices in the liquid cooling device node in a one-to-many manner, the first spray device is located at the top inside the liquid cooling device node, and use the second spray device to spray one or more liquid cooling devices in the liquid cooling device node in a one-to-one manner; Preferably, the cross-section of the second spray device is a U-shaped structure, and a first liquid cavity and a second liquid cavity are arranged inside the second spray device. The first liquid cavity and the second liquid cavity are separated by a card plate provided with jet holes. The bottom of the second spray device is in contact with the surface of the liquid cooling device, and a second liquid cavity return liquid port communicating with the inside of the liquid cooling device node is arranged at the lower end of the second spray device.

8. A liquid cooling device, characterized in that: The liquid cooling device includes a plurality of liquid cooling units and a cabinet for installing the liquid cooling units. The cabinet is provided with cabinet through holes for the main inlet pipe and the return pipe to pass through.

9. A liquid cooling device according to claim 8, characterized in that: The liquid cooling unit is provided with a return liquid port at the top of the insertion frame; the plurality of liquid cooling units are installed in the cabinet in a top-to-bottom connection manner, and the coolant flows back in series, where: The main inlet pipe enters the cabinet through the cabinet through hole and then enters the insertion frames of the respective liquid cooling units through the insertion frame inlet of each liquid cooling unit; The top liquid return port of the liquid cooling unit located at the top of the cabinet is in a sealed state, and the liquid return port at the lower end of the plug-in frame of the liquid cooling unit located at the bottom of the cabinet is connected to the liquid storage container through the liquid return pipe; except for the top liquid return port of the liquid cooling unit located at the top of the cabinet and the liquid return port at the lower end of the plug-in frame of the liquid cooling unit located at the bottom of the cabinet, the liquid return ports at the lower end of the plug-in frames of other liquid cooling units in the cabinet are connected to the top liquid return ports of the liquid cooling units located below and adjacent to the other liquid cooling units through their liquid return pipes; or, The plurality of liquid cooling units are installed in the cabinet in a manner of being connected from top to bottom or from left to right, and the cooling liquid is refluxed in parallel, wherein: The main liquid inlet pipe enters the cabinet through the cabinet through-hole, and then enters the plug-in frame of each liquid cooling unit through the liquid inlet of the plug-in frame of each liquid cooling unit; The liquid return port at the lower end of the insertion frame of each of the liquid cooling units is connected to the liquid storage container through the liquid return pipe.

10. A liquid cooling method, characterized in that: For liquid cooling the liquid cooling unit according to any one of claims 1 to 7, the method comprising: Acquire the property information of the liquid cooling unit that needs liquid cooling and the target temperature of the liquid cooling equipment in the liquid cooling unit after liquid cooling; Selecting the liquid cooling method according to the attribute information and the target temperature, and using the corresponding liquid cooling method to liquid cool the liquid cooling device nodes in the liquid cooling unit; Monitor the liquid cooling state of the liquid cooling unit in real time to adjust the liquid cooling work of the liquid cooling device node according to the monitoring result; The attribute information of the liquid cooling unit includes the size of the frame in the liquid cooling unit, the number of liquid cooling device nodes in the liquid cooling unit and their liquid cooling attributes, the size of the node liquid inlet, the node liquid return port, the frame liquid inlet and the liquid return port at the lower end of the frame, and the size of the branch liquid inlet pipe, the main liquid inlet pipe and the liquid return pipe; The liquid cooling method includes one or more of spray liquid cooling, immersion liquid cooling, cold plate liquid cooling and a combination of these.

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