Light-emitting module and vehicle lamp

Abstract

The invention discloses a light-emitting module and a vehicle lamp, which are characterized in that a metal reflecting layer is arranged between a light-emitting unit and a first adhesive layer, so that the contrast ratio can be improved, light channeling can be prevented, a heat transfer channel can be increased, and the reliability of a device can be improved. The light-emitting unit can be suitable for different light-emitting unit intervals (5-200 microns), the brightness cannot be greatly reduced while the contrast ratio is increased to be larger than or equal to 75: 1, meanwhile, the heat dissipation rate of the light-emitting unit is increased, and the product reliability is improved.

Description

Technical Field

[0001] The invention belongs to the technical field of LED packaging, and in particular relates to a light-emitting module and a vehicle lamp having the light-emitting module. Background Art

[0002] With the development of lighting technology, there is an urgent need to introduce light source devices with high dynamic contrast. Especially in the field of automotive intelligent lighting, higher brightness and better contrast are required for light sources.

[0003] In the prior art, a plurality of chips are packaged independently and then mounted on a PCB, and then the chips are isolated by filling with pure white wall glue to improve the contrast.

[0004] However, the above method has disadvantages: the pure white wall glue filling method will cause light to bleed between cells when the cell spacing is small (<200 μm), thus affecting the contrast.

[0005] The information disclosed in this background technology section is only intended to enhance the understanding of the overall background of the invention and should not be regarded as an acknowledgment or any form of suggestion that the information constitutes the prior art already known to a person skilled in the art. Summary of the invention

[0006] The object of the present invention is to provide a light-emitting module and a vehicle lamp, which can be adapted to different unit spacings, meet the requirement of improving contrast without significantly reducing brightness, and at the same time improve the heat dissipation rate of the unit and improve product reliability.

[0007] In order to achieve the above object, a technical solution provided by a specific embodiment of the present invention is as follows:

[0008] A light-emitting module, comprising:

[0009] A plurality of light emitting units arranged in an array, with adjacent light emitting units arranged at intervals;

[0010] A metal reflective layer is formed on the peripheral surface of each of the light-emitting units, and the metal reflective layer at least covers a portion of the peripheral surface of the light-emitting unit; and

[0011] The first adhesive layer is filled between adjacent light-emitting units.

[0012] In one or more embodiments of the present invention, the light-emitting unit includes an LED chip and a light conversion layer, and the light conversion layer covers the LED chip to form independent pixel points.

[0013] In one or more embodiments of the present invention, the thickness of the metal reflective layer decreases from the light conversion layer toward the LED chip.

[0014] In one or more embodiments of the present invention, the metal reflective layer includes a plurality of sub-metal layer segments sequentially arranged along a thickness direction of the light emitting unit.

[0015] In one or more embodiments of the present invention, the thickness of at least one of the sub-metal layer segments decreases from the light conversion layer toward the LED chip.

[0016] In one or more embodiments of the present invention, the sub-metal layer segments have a first surface facing away from the light emitting unit, and a protrusion and / or a depression is formed on the first surface of at least one of the sub-metal layer segments.

[0017] In one or more embodiments of the present invention, each of the sub-metal layer segments has a first end and a second end relative to each other, the thickness of the first end of each of the sub-metal layer segments is greater than the thickness of the second end of the sub-metal layer segment adjacent to the first end, and the thickness of the second end is less than the thickness of the first end of the sub-metal layer segment adjacent to the second end.

[0018] In one or more embodiments of the present invention, the metal reflective layer has a first surface facing away from the light emitting unit, and protrusions and / or depressions are formed on the first surface.

[0019] In one or more embodiments of the present invention, the first adhesive layer is a white thermosetting resin material; and / or,

[0020] The material of the metal reflective layer is a high temperature resistant metal material; and / or,

[0021] The reflectivity of the metal reflective layer in the visible light band is greater than 70%; and / or,

[0022] The metal reflective layer includes an Al layer or an Ag layer.

[0023] In one or more embodiments of the present invention, the light emitting module further includes a filling layer, and the filling layer is formed between the light emitting unit and the metal reflective layer.

[0024] In one or more embodiments of the present invention, the filling layer is an insulating material, including Al 2 O 3 layer or a second adhesive layer, wherein the second adhesive layer is a white thermosetting resin material; and / or,

[0025] The filling layer has a second surface facing away from the light emitting unit, the second surface is set to be a flat surface, and the metal reflective layer is formed on the second surface.

[0026] In one or more embodiments of the present invention, the interval between adjacent light emitting units ranges from 5 μm to 200 μm.

[0027] A vehicle lamp comprises the above-mentioned light-emitting module.

[0028] Compared with the prior art, the light-emitting module and the vehicle lamp of the present invention can be adapted to different light-emitting unit spacings (5 μm to 200 μm), thereby meeting the requirement of improving contrast without significantly reducing brightness, while increasing the heat dissipation rate of the light-emitting unit and improving product reliability.

[0029] In the light-emitting module and vehicle lamp of the present invention, the contrast ratio between the light-emitting units can be greater than or equal to 75:1, or even greater than or equal to 150:1.

[0030] In the light-emitting module and the vehicle lamp of the present invention, the metal reflective layer is arranged between the light-emitting unit and the first adhesive layer, which can not only improve the contrast and prevent light leakage, but also increase the heat transfer channel and improve the reliability of the device.

[0031] The light-emitting module and the vehicle lamp of the present invention have a filling layer, which can prevent metal material from entering the side where the LED chip electrode is located when the metal reflective layer is formed, thereby causing a short circuit. At the same time, the filling layer can provide a relatively flat surface for plating metal material, thereby improving contrast without significantly reducing brightness.

[0032] The light-emitting module and vehicle lamp of the present invention, by setting a plurality of sub-metal layer segments and setting the thickness or shape of the sub-metal layer segments or the metal reflective layer, greatly reduce the difficulty of the coating process while ensuring the improvement of contrast. At the same time, the uneven setting of the surface of the metal reflective layer or the surface of the sub-metal layer segments helps to increase the contact area, enhance the bonding performance of the first adhesive layer and the metal reflective layer in the area between adjacent light-emitting units, and improve its reliability. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments recorded in the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0034] Figure 1 is a cross-sectional schematic diagram of the light-emitting module in Embodiment 1 of the present invention;

[0035] Figure 2 is a cross-sectional schematic diagram of a light-emitting module in Embodiment 2 of the present invention;

[0036] Figure 3 is a cross-sectional schematic diagram of a light-emitting module in Embodiment 3 of the present invention;

[0037] Figure 4is a cross-sectional schematic diagram of a light-emitting module in Embodiment 4 of the present invention;

[0038] Figure 5 is a cross-sectional schematic diagram of a light-emitting module in Embodiment 5 of the present invention;

[0039] Figure 6 It is a cross-sectional schematic diagram of the light-emitting module in Example 6 of the present invention. DETAILED DESCRIPTION

[0040] In order to enable those skilled in the art to better understand the technical solutions in the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work should fall within the scope of protection of the present invention.

[0041] As mentioned in the background art, in order to achieve pixel-level packaging of multiple chips, pure white glue is used to fill the gaps between adjacent cells to improve packaging strength. However, pure white glue filling will cause light to cross between cells when the cell spacing is small (<200μm), affecting the contrast.

[0042] In order to improve the contrast as much as possible without greatly affecting the brightness, the present invention provides a light-emitting module and a headlight having the light-emitting module. By setting a metal reflective layer between the light-emitting unit and the first adhesive layer, the contrast can be improved to prevent light leakage, and the heat transfer channel can be increased to improve the reliability of the device. The light-emitting module and the headlight having the light-emitting module of the present invention can be used for different light-emitting unit spacings (5μm to 200μm), meet the contrast improvement to greater than or equal to 75:1, will not significantly reduce the brightness, and at the same time improve the heat dissipation rate of the light-emitting unit, improve product reliability.

[0043] The light-emitting module of the present invention comprises a light-emitting unit, a metal reflective layer and a first adhesive layer.

[0044] Several light-emitting units are arranged in an array, and adjacent light-emitting units are spaced apart from each other, with a spacing range of 5 μm-200 μm. Each light-emitting unit includes an LED chip and a light conversion layer, and the light conversion layer covers the LED chip and forms an independent pixel point.

[0045] The light conversion layer is preferably a fluorescent sheet, and the light conversion layer is arranged on the light emitting surface of the LED chip.

[0046] The metal reflective layer is formed on the circumference of each light-emitting unit. The metal reflective layer covers at least part of the circumference of the light-emitting unit 10. The material of the metal reflective layer is a high-reflectivity and high-temperature resistant metal material. The reflectivity of the metal reflective layer in the visible light band must be greater than 70%. Preferably, the metal reflective layer includes an Al layer or an Ag layer.

[0047] The metal reflective layer is arranged between the light-emitting unit and the first adhesive layer, which can not only improve the contrast and prevent light leakage, but also increase the heat transfer channel and improve the reliability of the device.

[0048] In one embodiment, the thickness of the metal reflective layer gradually decreases from the light conversion layer toward the LED chip.

[0049] In one embodiment, the metal reflective layer has a first surface facing away from the light emitting unit, and a protrusion or a depression is formed on the first surface.

[0050] In one embodiment, the metal reflective layer includes a plurality of sub-metal layer segments sequentially arranged along the thickness direction of the light emitting unit, and the thickness of at least one sub-metal layer segment gradually decreases from the light conversion layer toward the LED chip.

[0051] In one embodiment, the sub-metal layer segment has a first surface facing away from the light-emitting unit, and a protrusion or a depression is formed on the first surface of at least one sub-metal layer segment.

[0052] In one embodiment, each sub-metal layer segment has a first end and a second end relative to each other, the thickness of the first end of each sub-metal layer segment is greater than the thickness of the second end of the sub-metal layer segment adjacent to the first end, and the thickness of the second end is less than the thickness of the first end of the sub-metal layer segment adjacent to the second end.

[0053] By setting multiple sub-metal layer segments and setting the thickness or shape of the sub-metal layer segments or the metal reflective layer, the difficulty of the coating process is greatly reduced while ensuring the improvement of contrast. At the same time, the uneven setting of the surface of the metal reflective layer or the surface of the sub-metal layer segments helps to increase the contact area, enhance the bonding performance of the first glue layer and the metal reflective layer in the area between adjacent light-emitting units, and improve its reliability.

[0054] The first adhesive layer is filled between adjacent light-emitting units and surrounds the light-emitting units and the metal reflective layer. The first adhesive layer is preferably a white thermosetting resin material.

[0055] In one embodiment, a filling layer is further included, and the filling layer is formed between the light emitting unit and the metal reflective layer. The filling layer is an insulating material, including Al 2 O 3 The first adhesive layer or the second adhesive layer is a white thermosetting resin material.

[0056] The setting of the filling layer can prevent the metal material from entering the side where the LED chip electrode is located when the metal reflective layer is formed, causing a short circuit. At the same time, the setting of the filling layer can provide a relatively flat surface for metal plating, thereby improving the contrast without significantly reducing the brightness.

[0057] The present invention also provides a vehicle lamp, comprising the above-mentioned light-emitting module.

[0058] Example 1

[0059] like Figure 1 As shown, the light-emitting module in Embodiment 1 of the present invention includes a light-emitting unit 10 , a metal reflective layer 20 and a first adhesive layer 30 .

[0060] A plurality of light emitting units 10 are arranged in an array, and adjacent light emitting units 10 are arranged at intervals. Each light emitting unit 10 includes an LED chip 11 and a light conversion layer 12, and the light conversion layer 12 covers the LED chip 11 and forms an independent pixel point.

[0061] The LED chip is a horizontal chip or a vertical chip, preferably a flip chip. The light conversion layer 12 is a fluorescent sheet. The light conversion layer 12 is arranged on the light emitting surface of the LED chip.

[0062] The metal reflective layer 20 is formed on the circumference of each light emitting unit 10, and the metal reflective layer 20 covers the entire circumference of the light emitting unit 10. The thickness of the metal reflective layer 20 gradually decreases from the light conversion layer 12 toward the LED chip 11, reducing the possibility of the metal reflective layer entering the bottom of the LED chip and causing a short circuit.

[0063] The first adhesive layer 30 is filled between adjacent light emitting units 10 and surrounds the light emitting units 10 and the metal reflective layer 20. The first adhesive layer 30 is preferably a white thermosetting resin material.

[0064] Example 2

[0065] like Figure 2 As shown, the difference between the present embodiment 2 and the embodiment 1 is that in the present embodiment 2, the first surface 20a of the metal reflective layer 20 away from the light emitting unit 10 is set to be an uneven surface, on which protrusions or depressions are formed.

[0066] The uneven setting of the first surface 20a of the metal reflective layer 20 can help increase the contact area with the first adhesive layer 30, enhance the adhesion performance between the first adhesive layer 30 and the metal reflective layer 20 in the middle area of ​​adjacent light-emitting units 10, and improve packaging reliability.

[0067] Example 3

[0068] like Figure 3As shown, the difference between this embodiment 3 and embodiment 1 is that in this embodiment 3, the metal reflective layer 20 includes two sub-metal layer segments 21 arranged in sequence along the thickness direction of the light-emitting unit 10. The thickness of the two sub-metal layer segments 21 gradually decreases from the light conversion layer 12 to the LED chip 11.

[0069] Example 4

[0070] like Figure 4 As shown, the difference between this embodiment 4 and embodiment 3 is that in this embodiment 4, the two sub-metal layer segments 21 each include a first end a and a second end b, and the first end a of the first sub-metal layer segment is disposed adjacent to the second end b of the second sub-metal layer segment. The thickness of the first end a of the first sub-metal layer segment is greater than the thickness of the second end b of the second sub-metal layer segment.

[0071] Example 5

[0072] like Figure 5 As shown, the light-emitting module in Embodiment 5 of the present invention includes a light-emitting unit 10 , a metal reflective layer 20 , a first adhesive layer 30 and a filling layer 40 .

[0073] A plurality of light emitting units 10 are arranged in an array, and adjacent light emitting units 10 are arranged at intervals. Each light emitting unit 10 includes an LED chip 11 and a light conversion layer 12, and the light conversion layer 12 covers the LED chip 11 and forms an independent pixel point.

[0074] The LED chip is a horizontal chip or a vertical chip, preferably a flip chip. The light conversion layer 12 is a fluorescent sheet, and the light conversion layer 12 is arranged on the light emitting surface of the LED chip.

[0075] The metal reflective layer 20 is formed on the circumference of each light emitting unit 10, and the metal reflective layer 20 covers the entire circumference of the light emitting unit 10. The thickness of the metal reflective layer 20 gradually decreases from the light conversion layer 12 toward the LED chip 11.

[0076] The filling layer 40 is formed between the light emitting unit 10 and the metal reflective layer 20. The filling layer can be an insulating material, preferably Al 2 O 3 The filling layer 40 has a second surface 40a away from the light-emitting unit 10, the second surface 40a is set to be a flat surface, and the metal reflective layer 20 is formed on the second surface 40a. The filling layer 40 can prevent the metal reflective layer 20 from entering the bottom of the LED chip during the coating process to cause a short circuit problem.

[0077] The first adhesive layer 30 is filled between adjacent light emitting units 10 and surrounds the light emitting units 10, the filling layer 40 and the metal reflective layer 20. The first adhesive layer 30 is preferably a white thermosetting resin material.

[0078] In other embodiments, the filling layer 40 may be a second adhesive layer, and the second adhesive layer is a white thermosetting resin material.

[0079] Example 6

[0080] like Figure 6 As shown, the difference between the present embodiment 6 and the embodiment 5 is that in the present embodiment 6, the metal reflective layer 20 includes two sub-metal layer segments 21 sequentially arranged along the thickness direction of the light-emitting unit 10. The thickness of the two sub-metal layer segments 21 gradually decreases from the light conversion layer 12 to the LED chip 11. The metal reflective layer 20 is arranged as two sub-metal faults 21, which reduces the difficulty of the coating process while ensuring the improvement of the contrast, and enhances the bonding strength between the first adhesive layer 30 and the metal reflective layer 20.

[0081] The filling layer 40 can be made of insulating material, preferably Al 2 O 3 The first adhesive layer 30 can improve the bonding strength between the metal reflective layer 20 and the light emitting unit 10 and prevent the first adhesive layer 30 from flowing into the gap between the LED chip 11 and the metal reflective layer 20 .

[0082] Comparative Example 1

[0083] The light-emitting module of comparative example 1 includes a plurality of light-emitting units arranged in an array, and a white wall glue layer filled between adjacent light-emitting units.

[0084] The contrast and brightness tests were performed on the light emitting modules of Comparative Example 1 and Examples 1 to 6, and the obtained data are shown in Table 1. The number, size and spacing of the light emitting units in the light emitting modules are consistent.

[0085] Table 1

[0086] Contrast Brightness / nit Comparative Example 1 25:1 8.61E+07 Example 1 75:1 2.68E+07 Example 2 80:1 2.63E+07 Example 3 100:1 2.66E+07 Example 4 150:1 2.66E+07 Example 5 200:1 7.89E+07 Example 6 200:1 7.80E+07

[0087] It can be seen from Table 1 that the contrast ratios of the light-emitting modules in the embodiments of the present application are all greater than or equal to 75:1, and the contrast ratios of the light-emitting modules in Embodiments 4 to 6 even reach (150:1)-(200:1), which greatly exceeds the contrast ratio of Comparative Example 1. At the same time, the brightness of the light-emitting modules in the embodiments of the present application does not drop too much compared to Comparative Example 1, especially the light-emitting modules in Embodiments 5 and 6.

[0088] Compared with the prior art, the light-emitting module and the vehicle lamp of the present invention can be adapted to different light-emitting unit spacings (5 μm to 200 μm), thereby meeting the requirement of improving contrast without significantly reducing brightness, while increasing the heat dissipation rate of the light-emitting unit and improving product reliability.

[0089] In the light-emitting module and vehicle lamp of the present invention, the contrast ratio between the light-emitting units can be greater than or equal to 75:1, or even greater than or equal to 150:1.

[0090] In the light-emitting module and the vehicle lamp of the present invention, the metal reflective layer is arranged between the light-emitting unit and the first adhesive layer, which can not only improve the contrast and prevent light leakage, but also increase the heat transfer channel and improve the reliability of the device.

[0091] The light-emitting module and the vehicle lamp of the present invention have a filling layer, which can prevent metal material from entering the side where the LED chip electrode is located when the metal reflective layer is formed, thereby causing a short circuit. At the same time, the filling layer can provide a relatively flat surface for plating metal material, thereby improving contrast without significantly reducing brightness.

[0092] The light-emitting module and vehicle lamp of the present invention, by setting a plurality of sub-metal layer segments and setting the thickness or shape of the sub-metal layer segments or the metal reflective layer, greatly reduce the difficulty of the coating process while ensuring the improvement of contrast. At the same time, the uneven setting of the surface of the metal reflective layer or the surface of the sub-metal layer segments helps to increase the contact area, enhance the bonding performance of the first adhesive layer and the metal reflective layer in the area between adjacent light-emitting units, and improve its reliability.

[0093] It will be apparent to those skilled in the art that the invention is not limited to the details of the exemplary embodiments described above and that the invention can be implemented in other specific forms without departing from the spirit or essential features of the invention. Therefore, the embodiments should be considered exemplary and non-limiting in all respects, and the scope of the invention is defined by the appended claims rather than the foregoing description, and it is intended that all variations falling within the meaning and scope of the equivalent elements of the claims be included in the invention. Any reference numeral in a claim should not be considered as limiting the claim to which it relates.

[0094] In addition, it should be understood that although the present specification is described according to implementation modes, not every implementation mode contains only one independent technical solution. This description of the specification is only for the sake of clarity. Those skilled in the art should regard the specification as a whole. The technical solutions in each embodiment may also be appropriately combined to form other implementation modes that can be understood by those skilled in the art.

Claims

1. A light emitting module, characterized in that: include: A plurality of light emitting units (10) arranged in an array, with adjacent light emitting units being arranged at intervals; A metal reflective layer (20) is formed on the circumference of each of the light-emitting units, the metal reflective layer at least covering a portion of the circumference of the light-emitting unit; and The first adhesive layer (30) is filled between adjacent light-emitting units.

2. The light emitting module according to claim 1, characterized in that: The light-emitting unit comprises an LED chip (11) and a light conversion layer (12), wherein the light conversion layer covers the LED chip and forms an independent pixel point.

3. The light emitting module according to claim 2, characterized in that: The thickness of the metal reflective layer decreases from the light conversion layer toward the LED chip.

4. The light emitting module according to claim 2, characterized in that: The metal reflective layer comprises a plurality of sub-metal layer segments (21) arranged in sequence along the thickness direction of the light-emitting unit.

5. The light emitting module according to claim 4, characterized in that: The thickness of at least one of the sub-metal layer segments decreases from the light conversion layer toward the LED chip.

6. The light emitting module according to claim 4, characterized in that: Each of the sub-metal layer segments has a first end and a second end relative to each other, the thickness of the first end of each of the sub-metal layer segments being greater than the thickness of the second end of the sub-metal layer segment adjacent to the first end, and the thickness of the second end being less than the thickness of the first end of the sub-metal layer segment adjacent to the second end.

7. The light emitting module according to claim 1, characterized in that: The first adhesive layer is a white thermosetting resin material; and / or, The material of the metal reflective layer is a high temperature resistant metal material; and / or, The reflectivity of the metal reflective layer in the visible light band is greater than 70%; and / or, The metal reflective layer includes an Al layer or an Ag layer.

8. The light emitting module according to claim 1, characterized in that: It also includes a filling layer (40), which is formed between the light-emitting unit and the metal reflective layer.

9. The light emitting module according to claim 8, characterized in that: The filling layer is an insulating material, including an Al2O3 layer or a second adhesive layer, and the second adhesive layer is a white thermosetting resin material; and / or, The filling layer has a second surface (40a) facing away from the light-emitting unit, the second surface is set to be a flat surface, and the metal reflective layer is formed on the second surface.

10. The light emitting module according to claim 1, characterized in that: The interval between adjacent light emitting units ranges from 5 μm to 200 μm.

11. A vehicle lamp, characterized in that: It comprises a light-emitting module as described in any one of claims 1 to 10.

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