Heat exchanger for electronic component of server

Abstract

The disclosed heat exchanger is used for an electronic component of a server. The heat exchanger includes: i) a body configured to be positioned adjacent to the electronic component; ii) a heat pipe extending away from the body for conducting heat absorbed by the body from the electronic component; iii) a plurality of discoid fins positioned and spaced along the heat pipe, the plurality of discoid fins being coaxial with the heat pipe; and iv) a fan for driving air between the plurality of disc-shaped fins.

Description

Technical Field

[0001] The present technology relates generally to heat exchangers, and in particular, to a heat exchanger for electronic components of a server. Background Art

[0002] Heat exchangers for dissipating heat from heat-dissipating electronic components are known in the art, and conventional heat exchangers typically include a set of heat pipes coupled to a component that can be mated in good thermal contact with a heat exchanger plate (e.g., a heat sink). Such conventional heat exchangers are passive devices with a large thermal capacity and a large surface area relative to their volume. The heat pipes and heat exchanger plates are typically made of a metal with high thermal conductivity (e.g., aluminum or copper) and incorporate fins to increase the surface area. In addition, a fan is used to circulate air through the heat exchanger plates.

[0003] Generally, this traditional heat exchanger uses heat pipes to quickly transfer heat from the processor (locked in the bottom of the structure) to multiple board components for further heat dissipation. In addition, the solution can use multiple fans to increase airflow and thus increase heat exchange with the environment.

[0004] However, even with the most optimal heat exchanger architecture in terms of surface, using high quality materials in terms of electrical conductivity, it may still be very difficult to overcome heat dissipation beyond a certain limit. It may also be very difficult to repeatedly and indefinitely increase fan speed to increase air circulation.

[0005] Generally, there are several heat exchangers for cooling electronic components. For example, "CN 106371535 A" discloses a parallel type CPU cooling device, which includes a CPU, a semiconductor refrigeration slice, a heat conduction block, a plurality of first heat pipes, a plurality of second heat pipes and a cooling fan. The upper end of the CPU is provided with a first heat conduction adhesive layer, the cold end of the semiconductor refrigeration slice and the lower end of the heat conduction block are fixed to the first heat conduction adhesive layer, the semiconductor refrigeration slice and the heat conduction block are arranged in parallel, and the sum of the area of ​​the cold end of the semiconductor refrigeration slice and the area of ​​the end face of the lower end of the heat conduction block is equal to the area of ​​the upper surface of the first heat conduction adhesive layer. The end face of the hot end of the semiconductor refrigeration slice and the end face of the upper end of the heat conduction block are covered with a second heat conduction adhesive layer, the second heat conduction adhesive layer located above the semiconductor refrigeration slice is connected to the cooling fan through the first heat pipe, and the second heat conduction adhesive layer located above the heat conduction block is connected to the cooling fan through the second heat pipe. The semiconductor refrigeration slice is further used to perform cooling when heat is transmitted and dissipated through the heat conduction block, so as to reduce the temperature rise range during the operation of the CPU and thus improve the working efficiency of the CPU.

[0006] Accordingly, there is interest in developing an efficient heat exchanger for electronic components of a server. Summary of the invention

[0007] Embodiments of the present technology have been developed based on the developer's awareness of at least one technical problem associated with prior art solutions.

[0008] Developers of the present technology have realized that conventional heat exchangers may not function properly for heat generating electronic components that require heat dissipation above a certain level. In addition, plates associated with conventional heat exchangers having large dimensions have lower efficiency per unit surface area in terms of removing heat.

[0009] Thus, it can be said that in at least some embodiments of the present technology, the developers of the present technology have envisioned a heat exchanger for electronic components of a server. In at least some embodiments, the heat exchanger may have a plurality of disc-shaped fins positioned and spaced along a heat pipe extending away from the body. The plurality of disc-shaped fins may result in increased airflow and more efficient removal of heat generated by electronic components associated with the server as compared to conventional heat exchangers.

[0010] According to a first broad aspect of the present technology, a heat exchanger for an electronic component of a server is provided, the heat exchanger comprising: a main body configured to be positioned adjacent to the electronic component; a heat pipe extending away from the main body for conducting heat absorbed by the main body from the electronic component; a plurality of disc-shaped fins positioned and spaced along the heat pipe, the plurality of disc-shaped fins being coaxial with the heat pipe; and a fan for driving air between the plurality of disc-shaped fins.

[0011] In some embodiments of the heat exchanger, the inner diameter is between 3 mm and 6 mm and the outer diameter is between 15 mm and 26 mm.

[0012] In some embodiments of the heat exchanger, wherein the given disk-shaped fin from the plurality of disk-shaped fins has a diameter of 296 mm. 2 Up to 1005mm 2 The surface area between.

[0013] In some embodiments of the heat exchanger, the plurality of disc-shaped fins have a diameter of 207.2 m 2 To 703.5m 2 The combined surface area between .

[0014] In some embodiments of the heat exchanger, a distance between a pair of adjacent disc-shaped fins from the plurality of disc-shaped fins is between 1 mm and 30 mm.

[0015] In some embodiments of the heat exchanger, the plurality of disc-shaped fins along the heat pipe extend along corresponding parallel planes.

[0016] In some embodiments of the heat exchanger, wherein the heat pipe is a first heat pipe and the plurality of disc-shaped fins are a first plurality of disc-shaped fins, the heat exchanger further comprises: a second heat pipe extending away from the body for conducting heat absorbed by the body from the electronic component, the first heat pipe and the second heat pipe being substantially parallel; and a second plurality of disc-shaped fins positioned and spaced along the second heat pipe, the second plurality of disc-shaped fins being coaxial with the second heat pipe.

[0017] In some embodiments of the heat exchanger, a distance between a first disk-shaped fin from the first plurality of disk-shaped fins and a nearest disk-shaped fin from the second plurality of disk-shaped fins is between 1 mm and 30 mm.

[0018] In some embodiments of the heat exchanger, wherein the fan is configured to generate an airflow around the first heat pipe and the second heat pipe, the first heat pipe and the second heat pipe are arranged in a row of heat pipes facing a respective first portion of the airflow.

[0019] In some embodiments of the heat exchanger, wherein the heat exchanger further comprises another row of heat pipes, the row and the another row are arranged in a staggered configuration such that another heat pipe from the another row faces a second portion of the airflow transferred between the first heat pipe and the second heat pipe.

[0020] In some embodiments of the heat exchanger, the electronic component is at least one of a central processing unit (CPU) of a server and a graphics processing unit (GPU) of the server.

[0021] In some embodiments of the heat exchanger, the electronic component has an operating temperature of 77 degrees Celsius.

[0022] In some embodiments of the heat exchanger, the server is located in a server rack.

[0023] According to a second broad aspect of the present technology, a heat exchanger for an electronic component of a server is provided, the heat exchanger comprising: a main body configured to be positioned adjacent to the electronic component; a plurality of heat pipes extending away from the main body for conducting heat absorbed by the main body from the electronic component, the plurality of heat pipes being substantially parallel, each heat pipe from the plurality of heat pipes having a corresponding plurality of fins extending therefrom; a fan for generating an airflow around the plurality of parallel heat pipes, the plurality of heat pipes being arranged in a plurality of heat pipe rows facing the airflow, a first row and a second row among the rows being arranged in a staggered configuration such that the first row faces a first portion of the airflow and the second row faces a second portion of the airflow, the second portion being transferred between adjacent heat pipes from the first row.

[0024] In some embodiments of the heat exchanger, wherein the body has two opposing walls, the first row and the second row extend from a given one of the two opposing walls, and the third row and the fourth row among the rows extend from the other of the two opposing walls.

[0025] In some embodiments of the heat exchanger, a given row intra-pitch of a given row is the distance between a given fin of a given heat pipe in the given row and the nearest fin of an adjacent heat pipe in the given row, a first row intra-pitch of the first row is equal to a second row intra-pitch of the second row, a third row intra-pitch of the third row is equal to a fourth row intra-pitch of the fourth row, and the first row intra-pitch is different from the second row intra-pitch.

[0026] In some embodiments of the heat exchanger, the respective plurality of fins of each of the plurality of heat pipes comprises disc-shaped fins.

[0027] In some embodiments of the heat exchanger, the electronic component is at least one of a central processing unit (CPU) of the server and a graphics processing unit (GPU) of the server.

[0028] In some embodiments of the heat exchanger, the electronic component has an operating temperature of 77 degrees Celsius.

[0029] In the context of this specification, a "server" is a computer program running on appropriate hardware and capable of receiving requests (e.g., from an electronic device) via a network and executing those requests or causing those requests to be executed. The hardware may be a physical computer or a physical computer system, but neither is required with respect to the present technology. In this context, the use of the expression "at least one server" is not intended to mean that every task (e.g., received instructions or requests) or any particular task will be received, executed, or caused to be executed by the same server (i.e., the same software and / or hardware); it is intended to mean that any number of software elements or hardware devices may be involved in receiving / sending, executing, or causing to be executed any task or request, or the results of any task or request; and all such software and hardware may be one server or multiple servers, both of which are included in the expression "at least one server".

[0030] In the context of this specification, unless otherwise expressly provided, the words "first", "second", "third", etc. have been used as adjectives solely for the purpose of allowing the nouns they modify to be distinguished from each other, rather than for the purpose of describing any particular relationship between those nouns. Thus, for example, it should be understood that the use of the terms "first server" and "third server" is not intended to imply any particular order, type, chronology, hierarchy, or ranking (for example) between the servers, nor is their use (per se) intended to imply that any "second server" must exist in any given case. Furthermore, as discussed herein in other contexts, reference to a "first" element and a "second" element does not exclude that the two elements are the same actual real-world element. Thus, for example, in some examples, the "first" server and the "second" server may be the same software and / or hardware, in other cases they may be different software and / or hardware.

[0031] The embodiments of the present technology each have at least one of the above-mentioned objects and / or aspects, but not necessarily all of them. It should be understood that some aspects of the present technology resulting from achieving the above-mentioned objects may not meet this object and / or may meet other objects not specifically listed herein.

[0032] Additional and / or alternative features, aspects, and advantages of implementations of the present technology will become apparent from the following description, drawings, and appended claims. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Further features and advantages of the present technology will become apparent from the following detailed description taken in conjunction with the accompanying drawings, in which:

[0034] Figure 1 depicts a perspective view of a heat exchanger according to various non-limiting embodiments of the present disclosure;

[0035] Figure 2 illustrates a top view of a heat exchanger according to various non-limiting embodiments of the present disclosure;

[0036] Figure 3 another top view illustrating a heat exchanger according to various non-limiting embodiments of the present disclosure; and

[0037] Figure 4 An airflow diagram illustrating a heat exchanger according to various non-limiting embodiments.

[0038] It should be understood that throughout the drawings and corresponding descriptions, similar features are identified by similar reference numerals. In addition, it should also be understood that the drawings and subsequent descriptions are intended for illustrative purposes only and this technique does not provide limitations on the scope of the claims. DETAILED DESCRIPTION

[0039] The examples and conditional language listed herein are primarily intended to help the reader understand the principles of the present technology and are not intended to limit its scope to such specific listed examples and conditions. It will be appreciated that one skilled in the art may conceive of various arrangements that, although not explicitly described or shown herein, embody the principles of the present technology and are included in the spirit and scope of the present technology.

[0040] In addition, to aid understanding, the following description may describe relatively simplified implementations of the present technology. As will be appreciated by those skilled in the art, various implementations of the present technology may have greater complexity.

[0041] In some cases, it is believed that beneficial examples of modifications to the present technology may also be described. This is done merely to aid understanding, and as such does not define the scope of the present technology or describe the limits of the present technology. These modifications are not an exhaustive list, and those skilled in the art may make other modifications while still remaining within the scope of the present technology. In addition, where examples of modifications are not described, it should not be interpreted that no modifications are possible and / or that what is described is the only way to implement that element of the present technology.

[0042] Furthermore, all statements herein enumerating principles, aspects, and implementations of the present technology, as well as specific examples thereof, are intended to encompass both structural and functional equivalents thereof, whether currently known or developed in the future. Thus, for example, it will be appreciated by those skilled in the art that any block diagrams herein represent conceptual views of illustrative circuit systems that embody the principles of the present technology. Similarly, it will be appreciated that any flow charts, flow diagrams, state transition diagrams, pseudocodes, and the like represent various processes that can be substantially represented in a computer-readable medium and thus executed by a computer or processor, whether or not such a computer or processor is explicitly shown.

[0043] The functions of the various elements shown in the figure (including any functional blocks marked as "processors" or "graphics processing units") can be provided by using dedicated hardware and hardware capable of executing software associated with appropriate software. When provided by a processor, the functions may be provided by a single dedicated processor, by a single shared processor, or by multiple individual processors, some of which may be shared. In some embodiments of the present technology, the processor may be a general-purpose processor, such as a central processing unit (CPU) or a processor dedicated to a specific purpose, such as a graphics processing unit (GPU). In addition, the explicit use of the term "processor" or "controller" should not be interpreted as referring only to hardware capable of executing software, and may implicitly include, but is not limited to, digital signal processor (DSP) hardware, network processors, application-specific integrated circuits (ASICs), field programmable gate arrays (FPGAs), read-only memories (ROMs), random access memories (RAMs), and non-volatile storage devices for storing software. Other hardware (conventional and / or custom) may also be included.

[0044] With this basic knowledge in mind, we will now consider some non-limiting examples to illustrate various implementations of aspects of the present technology.

[0045] In order to make the heat exchanger more efficient, the area of ​​the fins associated with the heat exchanger needs to be changed to allow more air volume to be pumped through the heat exchanger. A typical heat exchanger with a plate-type architecture can allow a limited amount of air to pass through. This architecture is effective for normal electronic components with limited temperature limits of the CPU / GPU.

[0046] However, when high temperatures are involved (closer to the constant temperature limits more specific to server operation in a data center), typical heat exchange is less effective due to the lack of airflow that typical heat exchangers face. Accordingly, heat exchangers according to various non-limiting embodiments have higher air bandwidth.

[0047] In general, the heat balance associated with a heat exchanger can be expressed as:

[0048] q=α*(T1-T2)*SW (1)

[0049] where α can be the heat transfer coefficient (W / (m 2 *K)); for air from 10(W / (m 2 *K)) changes to 200(W / (m 2 *K)), ΔT=T1-T2 may be the difference between the air temperature and the air exchanger surface (eg, fins), and S may be the heat exchange surface (fin area) m 2 .

[0050] The efficiency of the heat exchanger can be improved by increasing the surface-air component ΔT and by reducing the inefficient area of ​​the component S. Thus, pressure losses can be reduced and airflow can be increased.

[0051] More specifically, according to various non-limiting embodiments of the heat exchanger, the heat pipe may be covered with disc-shaped fins opposite the plate. Each of the disc-shaped fins may be placed vertically on the heat pipe. This design may allow more airflow through the heat exchanger, thereby allowing more heat to be removed.

[0052] Figure 1 A perspective view of a heat exchanger 100 is depicted in accordance with various non-limiting embodiments of the present disclosure. As shown, the heat exchanger may include a body 102, a plurality of heat pipes 104-1, 104-2, 104-3 ... 104-10, and a plurality of fins 106. It should be noted that the heat exchanger 100 may include additional components. However, for the sake of simplicity, such components have been removed from the heat exchanger 100. Figure 1 Omit.

[0053] In certain non-limiting embodiments, the body 102 may be made of a good conductive material such as aluminum or copper and may have any suitable shape such as square, rectangular, or the like. The body 102 may be a thermally conductive body. The base of the body 102 may be attached to or adjacent to an electronic component (not illustrated) to absorb heat therefrom. It should be noted that the electronic component may be associated with a server (not illustrated). Some non-limiting examples of electronic components may include a CPU, GPU, DSP, and the like associated with a server and the server may be stacked in a server rack.

[0054] In certain non-limiting embodiments, the body 102 may be based on a liquid cooling block. For example, the body 102 may include a liquid inlet 108 and a liquid outlet 110 on a top surface of the body 102. Cooling liquid may flow in from the liquid inlet 108 and may flow out from the liquid outlet 110. The cooling liquid may be any suitable cooling liquid, such as water, a dielectric, or the like.

[0055] Furthermore, in certain non-limiting embodiments, a plurality of heat pipes 104-1, 104-2, 104-3 ... 104-10 may extend away from the body 102 for conducting heat absorbed from the electronic components by the body 102. The plurality of heat pipes 104-1, 104-2 ... 104-10 may be cylindrical and may be made of a good conductive material such as aluminum or copper.

[0056] The body 102 may have two opposing walls, some of the plurality of heat pipes 104-1, 104-2 ... 104-5 extend away from one of the two opposing walls of the body 102 and the plurality of heating pipes 104-6, 104-7 ... 104-10 extend away from the other of the two opposing walls of the body 102. Additionally, in certain non-limiting embodiments, the plurality of heat pipes 104-1, 104-2, 104-3 ... 104-10 may be parallel.

[0057] In certain non-limiting embodiments, the plurality of heat pipes 104-1, 104-2, 104-3 ... 104-10 may be arranged in rows. The rows may be arranged transverse to the airflow generated by the fan (discussed later in this disclosure). For example, the plurality of heat pipes 104-1, 104-3, and 104-5 may be arranged in a first row and the plurality of heat pipes 104-2 and 104-4 may be arranged in a second row. The first row and the second row may be arranged on one of the two opposing walls of the body 102 in a staggered configuration.

[0058] In a similar manner, the plurality of heat pipes 104-6, 104-8, and 104-10 may be arranged in a third row and the plurality of heat pipes 104-7 and 104-9 may be arranged in a fourth row. The third and fourth rows may be arranged on the other of the two opposing walls of the body 102 in a staggered configuration.

[0059] In some non-limiting embodiments, the plurality of heat pipes 104-1, 104-2, 104-3 ... 104-10 may be perpendicular relative to the top surface of the body 102. In other non-limiting embodiments, the plurality of heat pipes 104-1, 104-2, 104-3 ... 104-10 may be at any suitable angle relative to the body 102 between 0 and 90 degrees.

[0060] In certain non-limiting embodiments, a plurality of fins 106 may be disposed along each of the plurality of heat pipes 104-1, 104-2, 104-3 ... 104-10. The plurality of fins 106 may be positioned and spaced along the plurality of heat pipes 104-1, 104-2, 104-3 ... 104-10. In addition, the plurality of fins 106 may be coaxial with the associated plurality of heat pipes 104-1, 104-2, 104-3 ... 104-10.

[0061] Figure 2 A top view 200 of a heat exchanger 100 is illustrated in accordance with various non-limiting embodiments of the present disclosure. Figure 1 and 2, the plurality of fins 106 may be disc-shaped fins. In addition, each of the plurality of fins 106 may be a continuous surface. Each of a given fin in the plurality of fins 106 may have an inner diameter 202 and an outer diameter 204. Moreover, each of the plurality of heat pipes 104-1, 104-2, 104-3 ... 104-10 may have a radius 206. In certain non-limiting embodiments, the inner diameter 202 may be approximately equal to the radius 206.

[0062] For example, the inner diameter 202 may be between 3 mm and 6 mm and the outer diameter 204 may be between 15 mm and 26 mm. According to these dimensions, each of the plurality of fins 10 may have a diameter of 296 mm. 2 Up to 1005mm 2 Moreover, the combined surface area of ​​the plurality of fins 106 associated with each of the plurality of heat pipes 104-1, 104-2, 104-3, ... 104-10 may be between 207.2 m 2 To 703.5m 2 The combined surface area may be referred to as the total surface area of ​​the plurality of fins 106 associated with a given one of the plurality of heat pipes 104-1, 104-2, 104-3 ... 104-10. For example, if the number of fins in a given one of the plurality of heat pipes 104-1, 104-2, 104-3 ... 104-10 is equal to 10, then the combined surface area may be referred to as the total surface of the 10 fins.

[0063] In certain non-limiting embodiments, the distance (e.g., 216, 222) from the center of a given fin (e.g., 104-1) to the center of another fin (e.g., 104-2) is between 31 mm and 82 mm. Furthermore, the intra-row pitch (e.g., 218, 224) between a given fin (e.g., 104-4) and another fin (e.g., 104-5) can be equal to 1 mm to 30 mm.

[0064] In certain non-limiting embodiments, the distance between a given fin of a given heat pipe (e.g., 104-1) in a given row (e.g., the first row) and the nearest fin of an adjacent heat pipe (e.g., 104-3) in the given row (e.g., the first row) may be referred to as an intra-row pitch.

[0065] The first row inner pitch 208 of the first row may be equal to the second row inner pitch 210 of the second row. In this case, the airflow 303 may be effectively distributed between the first row and the second row, thereby bringing about an improved cooling efficiency of the heat exchanger 100. Moreover, the third row inner pitch 212 of the third row may be equal to the fourth row inner pitch 214 of the fourth row. In this case, the airflow 303 may be effectively distributed between the third row and the fourth row, thereby bringing about an improved cooling efficiency of the heat exchanger 100. In certain non-limiting embodiments, the first row inner pitch 208 may be different from the third row inner pitch 212. For example, the first row inner pitch 208 and the second row inner pitch 210 may be equal to 1mm to 30mm. Similarly, the third row inner pitch 212 and the fourth row inner pitch 214 may be equal to 1mm to 30mm.

[0066] It should be noted that the above-discussed dimensions of the heat exchanger 100 are merely representative examples and the dimensions of the heat exchanger 100 may be modified as desired without limiting the scope of the present disclosure.

[0067] In certain non-limiting embodiments, a plurality of fins 106 along an associated heat pipe (eg, 104 - 3 ) may extend along respective parallel planes.

[0068] Figure 3 A top view 300 of a heat exchanger 100 is illustrated in accordance with various non-limiting embodiments of the present disclosure. Figures 1 to 3 In certain non-limiting embodiments, the heat exchanger 100 may further include a fan 302. The fan 302 may be placed proximate to the plurality of heat pipes 104-1, 104-2, 104-3 ... 104-10 and the body 102. Upon consideration, the fan 302 may have associated arrangements that may assist in the functionality of the fan 302. Such arrangements may include electrical connections, fan brackets, fan guards positioned above the fan 302 to protect the fan 302 from contamination and damage during operation, or any other suitable arrangements known in the art. For the purpose of simplicity, such arrangements have been described in detail. Figure 3 Omit.

[0069] The fan 302 may be configured to drive air between the plurality of fins 106. In certain non-limiting embodiments, the fan 302 may be configured to generate an airflow 303 around a first heat pipe (e.g., 104-1) and a second heat pipe (e.g., 104-3). As previously discussed, the first heat pipe (e.g., 104-1) and the second heat pipe (e.g., 104-3) may be arranged in a first row of heat pipes (104-1, 104-3, and 104-5). The first heat pipe (e.g., 104-1) may face a respective first portion 304-1 of the airflow 303. Similarly, the second heat pipe (e.g., 104-3) in the first row of heat pipes (104-1, 104-3, and 104-5) may face the corresponding first portion 304-2 of the airflow 303 and the third heat pipe (e.g., 104-5) in the first row of heat pipes (104-1, 104-3, and 104-5) may face the corresponding first portion 304-3 of the airflow 303.

[0070] It should be noted that the fan 302 that pushes air through the heat exchanger 100 may have a height that may correspond to the height of the electronic components associated with the heat exchanger 100 .

[0071] In certain non-limiting embodiments, another heat pipe (e.g., 104-2) from the second row may face a corresponding second portion 306-1 of the airflow 303 transferred between the first heat pipe (e.g., 104-1) and the second heat pipe (e.g., 104-3). Similarly, another heat pipe (e.g., 104-4) from the second row may face a corresponding second portion 306-2 of the airflow 303 transferred between the second heat pipe (e.g., 104-3) and the third heat pipe (e.g., 104-5). It should be noted that the first portion 304-1, 304-2, and 304-3 associated with the airflow 303 may be associated with the first row of heat pipes (104-1, 104-3, and 104-5). The second portions 306-1 and 304-2 associated with the airflow 303 may be associated with the second row of heat pipes (104-2 and 104-4).

[0072] It can be said that the first row and the second row of rows can be arranged in a staggered configuration. In this case, the first row including heat pipes 104-1, 104-3, and 104-5 can face the first portion 304-1, 304-2, and 304-3 of the airflow 303, respectively, and the second row including heat pipes 104-2 and 104-4 can face the second portion 306-1 and 306-2 of the airflow 303, respectively. The second portion 306-1 and 306-2 of the airflow 303 can be transferred between adjacent heat pipes 104-1 and 104-3 from the first row and adjacent heat pipes 104-3 and 104-5.

[0073] In other words, the first portions 304-1, 304-2, and 304-3 of the airflow 303 can assist in removing heat between the plurality of fins 106 associated with the plurality of heat pipes associated with the first row (e.g., 104-1, 104-3, and 104-5). The second portions 306-1 and 306-2 of the airflow 303 can assist in removing heat between the plurality of fins 106 associated with the heat pipes associated with the second row (e.g., 104-2 and 104-4).

[0074] In a similar manner, the third and fourth rows of rows can be arranged in a staggered configuration. In this case, the heat pipes (e.g., 104-6) in the third row of heat pipes (104-6, 104-8, and 104-10) can face the corresponding third portion 308-1 of the airflow 303. Similarly, the heat pipes (e.g., 104-8) in the third row of heat pipes (104-6, 104-8, and 104-10) can face the corresponding third portion 308-2 of the airflow 303, and the heat pipes (e.g., 104-10) in the third row of pipes (104-6, 104-8, and 104-10) can face the corresponding third portion 308-3 of the airflow 303.

[0075] In certain non-limiting embodiments, a heat pipe from a fourth row (e.g., 104-7) may face a corresponding fourth portion 310-1 of the airflow 303 transferred between a heat pipe (e.g., 104-6) and another heat pipe (e.g., 104-8). Similarly, a heat pipe from a fourth row (e.g., 104-9) may face a corresponding fourth portion 310-2 of the airflow 303 transferred between a heat pipe (e.g., 104-8) and another heat pipe (e.g., 104-10). It should be noted that the third portions 308-1, 308-2, and 308-3 associated with the airflow 303 may be associated with the third row of heat pipes (104-6, 104-8, and 104-10). The fourth portions 310-1 and 310-2 associated with the airflow 303 may be associated with the fourth row of heat pipes (104-7 and 104-9).

[0076] In certain non-limiting embodiments, first portions 304-1, 304-2, and 304-3 of airflow 303 may correspond to third portions 308-1, 308-2, and 308-3 of airflow 303. Also, second portions 306-1 and 306-2 of airflow 303 may correspond to fourth portions 310-1 and 310-2 of airflow 303.

[0077] The third portions 308-1, 308-2, and 308-3 of the airflow 303 can assist in removing heat between the plurality of fins 106 associated with the plurality of heat pipes associated with the third row (e.g., 104-6, 104-8, and 104-10). The fourth portions 310-1 and 310-2 of the airflow 303 can assist in removing heat between the plurality of fins 106 associated with the heat pipes associated with the fourth row (e.g., 104-7 and 104-9).

[0078] By virtue of the design of the heat exchanger 100 as discussed above, certain operating parameters of the heat exchanger 100 can be improved. Table 1 depicts a comparison of operating parameters of a conventional heat exchanger and the heat exchanger 100 (according to at least some non-limiting embodiments of the present technology):

[0079] Table 1

[0080] Operation parameters Conventional heat exchanger Heat exchanger 100 Pressure loss(Pa) 390 248 <![CDATA[Airflow m 3 / hour]]> 210 398 <![CDATA[Surface area S, m 2 > 0.357 0.258 Power, W 400 700

[0081] As depicted in Table 1, the pressure loss of the heat exchanger 100 can be reduced, the airflow of the heat exchanger can be increased, the surface area of ​​the heat exchanger can be reduced, and the heat exchanger 100 can be capable of removing heat from an electronic component having a rated power of 700 W. In addition to the above benefits, the operating temperature of the electronic component located near the heat exchanger 100 can be equal to 77 degrees Celsius. It should be noted that not every benefit described above needs to be achieved in every non-limiting embodiment of the present technology.

[0082] Figure 4 4 illustrates an airflow diagram 400 of a heat exchanger 100 according to various non-limiting embodiments. As shown, a fan 302 can blow air toward the heat exchanger 100. By virtue of a plurality of disk-shaped fins 106 (e.g., Figure 1 ), increased airflow between the plurality of heat pipes 104-1, 104-2, 104-3 ... 104-10 is observed. The increased airflow can more efficiently remove heat generated by electronic components associated with the server compared to conventional heat exchangers. In addition to improving the heat removal capabilities of the heat exchanger 100, the plurality of fins 106 can have a substantially smaller area compared to conventional heat exchangers, making the heat exchanger 100 easy to use and install near / around electronic components associated with the server.

[0083] Furthermore, it should be noted that plates associated with conventional heat exchangers having large dimensions have lower efficiency per unit surface area in removing heat, given that most of the heat is removed near the heat pipes. Since the plurality of fins 106 have smaller dimensions and are located near the heat pipes (e.g., 104-1, 104-2 ... 104-10), the plurality of fins 106 may have better efficiency per unit surface area in removing heat than conventional plates associated with conventional heat exchangers.

[0084] It will also be understood that although the embodiments presented herein have been described with reference to specific features and structures, it is apparent that various modifications and combinations may be made without departing from such technology. Therefore, the specification and drawings are to be considered merely as illustrative of the discussed implementations or embodiments and their principles as defined by the appended claims, and are carefully considered to cover any and all modifications, variations, combinations or equivalents that fall within the scope of the present technology.

Claims

1. A heat exchanger for an electronic component of a server, the heat exchanger comprising: a body configured to be positioned adjacent to the electronic component; a heat pipe extending away from the body for conducting heat absorbed by the body from the electronic component; a plurality of disc-shaped fins positioned and spaced along the heat pipe, the plurality of disc-shaped fins being coaxial with the heat pipe; and A fan is used to drive air between the plurality of disc-shaped fins.

2. The heat exchanger of claim 1, wherein a given disk-shaped fin from the plurality of disk-shaped fins has an inner diameter and an outer diameter, and the heat pipe has another radius, the inner diameter being equal to the another radius.

3. The heat exchanger according to claim 2, wherein the inner diameter is between 3 mm and 6 mm and the outer diameter is between 15 mm and 26 mm.

4. The heat exchanger of claim 2, wherein the given disk-shaped fin from the plurality of disk-shaped fins has a diameter of 296 mm. 2 Up to 1005mm 2 The surface area between.

5. The heat exchanger according to claim 1, wherein the plurality of disc-shaped fins have a 2 To 703.5m 2 The combined surface area between . 6 . The heat exchanger according to claim 1 , wherein a distance between a pair of adjacent disc-shaped fins from the plurality of disc-shaped fins is between 1 mm and 30 mm.

7. The heat exchanger of claim 1, wherein the plurality of disc-shaped fins along the heat pipe extend along respective parallel planes.

8. The heat exchanger of claim 1, wherein the heat pipe is a first heat pipe and the plurality of disc-shaped fins is a first plurality of disc-shaped fins, the heat exchanger further comprising: a second heat pipe extending away from the body for conducting heat absorbed by the body from the electronic component, the first heat pipe and the second heat pipe being substantially parallel; and A second plurality of disc-shaped fins are positioned and spaced apart along the second heat pipe, the second plurality of disc-shaped fins being coaxial with the second heat pipe.

9. The heat exchanger of claim 8, wherein a distance between a first disk-shaped fin from the first plurality of disk-shaped fins and a nearest disk-shaped fin from the second plurality of disk-shaped fins is between 1 mm and 30 mm.

10. The heat exchanger of claim 8, wherein the fan is configured to generate an airflow around the first heat pipe and the second heat pipe, the first heat pipe and the second heat pipe being arranged in a row of heat pipes facing a respective first portion of the airflow.

11. The heat exchanger according to claim 9, wherein the heat exchanger further comprises another row of heat pipes, The row and the further row are arranged in a staggered configuration such that another heat pipe from the further row faces a second portion of the airflow passing between the first heat pipe and the second heat pipe.

12. The heat exchanger of claim 1, wherein the electronic component is at least one of a central processing unit (CPU) of the server and a graphics processing unit (GPU) of the server.

13. The heat exchanger of claim 1, wherein the electronic components have an operating temperature of 77 degrees Celsius.

14. The heat exchanger of claim 1, wherein the server is located in a server rack.

15. A heat exchanger for an electronic component of a server, the heat exchanger comprising: a body configured to be positioned adjacent to the electronic component; a plurality of heat pipes extending away from the body for conducting heat absorbed by the body from the electronic components, the plurality of heat pipes being substantially parallel, each heat pipe from the plurality of heat pipes having a corresponding plurality of fins extending therefrom; a fan for generating airflow around the plurality of parallel heat pipes, The plurality of heat pipes are arranged in a plurality of rows of heat pipes facing the air flow, A first row and a second row of the rows are arranged in a staggered configuration such that the first row faces a first portion of the airflow and the second row faces a second portion of the airflow that transfers between adjacent heat pipes from the first row.

16. The heat exchanger according to claim 15, wherein the body has two opposing walls, the first row and the second row extend from a given one of the two opposing walls, and the third row and the fourth row among the rows extend from the other one of the two opposing walls.

17. The heat exchanger of claim 16, wherein a given intra-row pitch of a given row is the distance between a given fin of a given heat pipe in the given row and the nearest fin of an adjacent heat pipe in the given row, A first intra-row pitch of the first row is equal to a second intra-row pitch of the second row, a third intra-row pitch of the third row is equal to a fourth intra-row pitch of the fourth row, and the first intra-row pitch is different from the third intra-row pitch.

18. The heat exchanger of claim 15, wherein the respective plurality of fins of each of the plurality of heat pipes comprises disc-shaped fins.

19. The heat exchanger of claim 15, wherein the electronic component is at least one of a central processing unit (CPU) of the server and a graphics processing unit (GPU) of the server.

20. The heat exchanger of claim 15, wherein the electronic components have an operating temperature of 77 degrees Celsius.

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