Intracranial probe with built-in miniature pressure and temperature sensor and packaging process

Abstract

The invention relates to the technical field of intracranial probes, and discloses an intracranial probe with a built-in miniature pressure and temperature sensor and a packaging technology.The intracranial probe comprises a metal sleeve, a semi-circular ball head, a plastic sleeve, a carrier plate, a pressure sensor chip, a sealing tape, a breather pipe and a temperature sensor chip, one end of the metal sleeve is fixedly connected with the semi-circular ball head, and the other end of the metal sleeve is fixedly connected with the plastic sleeve; the other end of the metal sleeve is fixedly connected with the plastic sleeve; a notch, a first through groove and a second through groove are sequentially formed in the carrier plate in the X direction, the notch is communicated with the first through groove, and protruding blocks are symmetrically arranged at the end, close to the second through groove, of the carrier plate in the Y direction; according to the intracranial probe with the built-in miniature pressure and temperature sensor and the packaging technology, the problems that the placing position of a pressure sensor chip of an existing intracranial probe is affected by a wire and deviates, and stress measurement data generated by rebounding of the wire and the like are inaccurate are solved.

Description

Technical Field

[0001] The invention relates to the technical field of intracranial probes, and in particular to an intracranial probe with built-in micro pressure and temperature sensors and a packaging process. Background Art

[0002] Intracranial Pressure (ICP) refers to the pressure exerted by the contents of the cranial cavity on the cranial cavity wall, and is usually maintained between 5 and 15 mmHg in adults. Abnormally high intracranial pressure is a common and important factor that causes a sharp deterioration of the condition in neurosurgery clinics. For patients with severe craniocerebral injury, monitoring of intracranial pressure is of extremely important clinical significance. Intracranial hypertension endangers the patient's cranial and brain function and may cause death. It is usually caused by a variety of diseases such as brain trauma, cerebral hemorrhage, brain tumors, and cerebral edema. Therefore, accurate monitoring of intracranial pressure is particularly critical for the diagnosis and treatment of critically ill neurological patients.

[0003] Intracranial pressure (ICP) monitoring involves placing a catheter or a micro pressure sensor chip probe into the patient's cranial cavity, and connecting the other end of the sensor to an intracranial pressure monitor. The monitor converts dynamic changes in pressure into electrical signals and displays them in the form of numerical values, pressure waveform curves, and alarms. Doctors can accurately analyze changes in the patient's intracranial pressure based on the intracranial pressure values ​​and waveforms displayed by the monitor, which is of great reference value for judging the patient's intracranial condition, guiding subsequent treatment, and evaluating prognosis.

[0004] Intracranial temperature (ICT) is also an important auxiliary indicator for monitoring intracranial conditions. When the patient's intracranial condition worsens or a postoperative infection occurs, the increase in intracranial temperature will be accompanied by an increase in intracranial pressure. Therefore, it is necessary to monitor both intracranial temperature and intracranial pressure simultaneously in order to more completely monitor the real-time changes in the intracranial condition.

[0005] The piezoresistive pressure sensor chip uses the Wheatstone bridge principle, and the resistance on the chip changes with the pressure. According to the structure of the pressure sensor chip, it is divided into absolute pressure type, gauge pressure type, and differential pressure type. The atmospheric gauge pressure type is a special classification of the differential pressure type. The back cavity of the pressure sensing surface is connected to the external atmospheric pressure, and the external atmospheric pressure is used as the reference pressure to measure the pressure on the front of the pressure sensing surface. According to the number of bridge arms of the pressure sensor chip, it is divided into half-bridge (two resistors that change with pressure) and full-bridge (four resistors that change with pressure). Among them, the pressure sensor chip currently commonly used in clinical intracranial pressure monitoring uses a Wheatstone half-bridge sensor.

[0006] After searching, the Chinese patent publication number is CN 112107306 A. The structure of the intracranial pressure probe uses hard glue to connect the two ends of the chip and make the chip suspended in the tube cavity. The wires need to be bent by a tiny jig. The chip needs to be placed precisely in the metal tube window, which makes dispensing and welding difficult.

[0007] The Chinese patent publication number is CN220588255U. This patent requires the assembly of the first and second shells. The double shell assembly method has the problem of loose bonding, and the glue used for bonding easily overflows from the tube wall, resulting in unclean tube walls or rough appearance. The airtightness may not be guaranteed, and there is a risk of falling off.

[0008] The Chinese patent publication number is CN221129864U. This patent uses an integral method of manufacturing a cylindrical frame and then placing the chip in the groove of the frame. This method has the problems of complex operation, high cost and low yield. Summary of the invention

[0009] The object of the present invention is to provide an intracranial probe with built-in micro pressure and temperature sensors and a packaging process to solve at least one of the above problems existing in the prior art.

[0010] In order to achieve the above object, the present invention adopts the following technical solutions: An intracranial probe with a built-in micro pressure and temperature sensor comprises a metal sleeve, a semi-spherical head, a plastic sleeve, a carrier plate, a pressure sensor chip, a sealing tape, a ventilation tube and a temperature sensor chip, wherein one end of the metal sleeve is fixedly connected to the semi-spherical head, and the other end of the metal sleeve is fixedly connected to the plastic sleeve; The carrier plate is provided with a notch, a first through slot and a second through slot in sequence along the X direction, the notch is connected to the first through slot, and one end of the carrier plate close to the second through slot is symmetrically provided with a protrusion along the Y direction; The pressure sensor chip is sealed and fixed at the upper end of the first through groove by a sealing soft glue, the sealing tape is pasted on the lower end of the first through groove so that the first through groove forms a sealed transition cavity, the ventilation pipe is located in the notch, one end of the ventilation pipe extends into the sealed transition cavity, the other end of the ventilation pipe extends into the plastic sleeve, and the temperature sensor chip is embedded in the second through groove; The end of the metal sleeve is symmetrically provided with docking grooves, the metal sleeve is sleeved outside the carrier board, the protrusion is embedded in the corresponding docking groove of the metal sleeve and remains fixed, the metal sleeve is provided with a sensing surface window, the sensing surface of the pressure sensor chip corresponds to the position of the sensing surface window, the pressure sensor chip and the sensing surface window are sealed and fixed by sealing hard glue, and the metal sleeve and the carrier board as well as the metal sleeve and the plastic sleeve are fixed by filling hard glue.

[0011] In the technical solution, the carrier is a plate-like structure, and a notch, a first through groove and a second through groove are formed on the carrier. The structure is simple and the molding is easy; the first through groove on the carrier not only has the function of locating the installation position of the pressure sensor chip to improve the accuracy of the installation position of the pressure sensor chip, but also can cooperate with the sealing tape so that the upper and lower ends of the first through groove are respectively closed by the pressure sensor chip and the sealing tape, thereby forming a sealed transition cavity, and then combined with the ventilation pipe, the pressure sensor chip can be connected with the atmosphere, so as to reduce the influence of atmospheric pressure factors on the sensing surface of the pressure sensor when measuring intracranial pressure, and realize more accurate pressure detection; the notch on the carrier has a fixed The role of the ventilation pipe installation position is to enable the ventilation pipe to stably achieve the connection between the sealed transition cavity and the outside; the second through groove on the carrier is used to install the temperature sensor chip to improve the accuracy of the temperature sensor chip installation position; in addition, the metal sleeve and the carrier have a simple molding structure, and the two are embedded and connected with the corresponding docking groove of the metal sleeve through the protrusion and remain fixed, which can achieve the initial fixation of the metal sleeve and the carrier, and then fill with hard glue to achieve a fixed connection between the two, thereby improving the accuracy of the installation position of the metal sleeve and the carrier, and then improving the accuracy of the correspondence between the sensing surface of the pressure sensor chip and the sensing surface window, so as to improve the accuracy of monitoring.

[0012] In summary, in the present technical solution, the only components that need to be processed are the carrier board and the metal sleeve, and the processing and molding are simple, and the processing cost is low; during assembly, the pressure sensor chip, temperature sensor chip, sealing tape and ventilation pipe can be installed on the carrier board as a whole first, which can ensure the accuracy of the installation position of the components on the carrier board; then the metal sleeve and the carrier board are matched and installed to ensure the accuracy of the installation position of the carrier board and the metal sleeve, making the overall assembly operation more convenient, with low assembly cost, and can improve the accuracy of the installation position of each component and improve the accuracy of monitoring.

[0013] Furthermore, since the thickness of the carrier plate is consistent at all locations, including the notch and the first through groove area, in order to allow the vent pipe to extend into the sealed transition cavity without exceeding the sealed transition cavity, the outer diameter of the vent pipe is less than or equal to the thickness of the carrier plate.

[0014] Furthermore, in order to improve the installation stability of the ventilation pipe and the carrier plate, the gap between the ventilation pipe and the notch is filled with soft glue.

[0015] Furthermore, in order to facilitate the lead-out of the wires, the wires of the pressure sensor chip and the wires of the temperature sensor chip are led out after passing through the metal sleeve and the plastic sleeve in sequence.

[0016] Furthermore, in order to provide a wire lead-out structure, the wires of the temperature sensor chip are located above the carrier, and the wires of the pressure sensor chip and the temperature sensor chip bypass the carrier and enter the plastic sleeve from the bottom of the carrier and are led out.

[0017] Furthermore, in order to provide another wire lead-out structure, the wires of the temperature sensor chip are located below the carrier, and the wires of the pressure sensor chip bypass the carrier and enter the plastic sleeve from below the carrier together with the wires of the temperature sensor chip and are led out.

[0018] Furthermore, the carrier board is a thin metal board, an FPC board, an FR4 board, a ceramic board, an aluminum substrate or a BT board; The metal sleeve is made of stainless steel, nickel-titanium alloy, pure titanium, titanium-based metal or cobalt-based metal; Specifically, the metal sleeve is made of relatively non-magnetic and biocompatible materials. Relatively non-magnetic materials do not contain magnetic metals such as iron. These materials can be titanium-based metals, cobalt-based metals, etc. These materials can directly contact the human body and will not cause allergies, carcinogenesis, or teratogenesis in patients. They can be well combined with bone tissue, epithelium, and connective tissue. The plastic sleeve is made of nylon tube, Teflon tube or PU tube; The semi-circular ball head is made of epoxy glue or UV glue, meets the medical biological relevance, and is non-toxic and harmless to the human body.

[0019] Furthermore, in order to provide a method for forming a semi-circular spherical head, the semi-circular spherical head is integrally formed at the distal end of the metal sleeve after being filled with hard glue and hardened.

[0020] Furthermore, in order to provide another method for forming a semi-circular spherical head, a prefabricated semi-circular spherical head is fixedly bonded to the distal end of the metal sleeve.

[0021] The present invention also provides a packaging process for an intracranial probe with a built-in micro pressure and temperature sensor, which includes the following steps: Solder a number of wires on the pads of the pressure sensor chip and the temperature sensor chip by laser welding or ultrasonic welding; Fix the pressure sensor chip at the upper end of the first through groove with a sealing soft glue, and embed the temperature sensor chip into the second through groove; Clamp the vent pipe at the notch, and extend one end of the vent pipe into the first through groove, fill the gap between the vent pipe and the notch with soft glue, and stick a sealing tape on the lower end of the first through groove so that the area between the pressure sensor chip and the sealing tape forms a sealed transition cavity; The metal sleeve is put on the outside of the carrier board, and the two protrusions on the carrier board are embedded in the corresponding docking grooves of the metal sleeve and kept fixed, and the pressure sensor chip and the sensing surface window are sealed and fixed by sealing hard glue; Insert one end of the plastic sleeve into the metal sleeve, pass the wire through the plastic sleeve, and then place the vent pipe in the plastic sleeve; Glue is dispensed or poured at the connection between the metal sleeve and the plastic sleeve until the metal sleeve and the carrier board as well as the metal sleeve and the plastic sleeve are fixed by filling hard glue. At the same time, the glue at the distal end of the metal sleeve is hardened to form a semi-spherical head or a prefabricated semi-spherical head is bonded by filling hard glue until the entire metal sleeve is completely sealed.

[0022] The beneficial effects of the present invention are as follows: in the present technical solution, the carrier plate is a plate-like structure, and a notch, a first through groove and a second through groove are formed on the carrier plate, which has a simple structure and is easy to form; the first through groove on the carrier plate not only has the function of locating the installation position of the pressure sensor chip to improve the accuracy of the installation position of the pressure sensor chip, but can also cooperate with the sealing tape so that the upper and lower ends of the first through groove are respectively closed by the pressure sensor chip and the sealing tape, thereby forming a sealed transition cavity, and then combined with the ventilation pipe, the pressure sensor chip can be connected with the atmosphere, thereby reducing the influence of atmospheric pressure factors on the pressure sensor sensing surface when measuring intracranial pressure, and realizing more accurate pressure detection; The notch has the function of locating the installation position of the ventilation pipe, so that the ventilation pipe can stably realize the connection between the sealed transition cavity and the outside; the second through groove on the carrier is used to install the temperature sensor chip to improve the accuracy of the installation position of the temperature sensor chip; in addition, the metal sleeve and the carrier have a simple molding structure, and the two are embedded and connected with the corresponding docking groove of the metal sleeve through the protrusion and remain fixed, which can realize the initial fixation of the metal sleeve and the carrier, and then fill with hard glue to realize the fixed connection between the two, thereby improving the accuracy of the installation position of the metal sleeve and the carrier, and then improving the accuracy of the correspondence between the sensing surface of the pressure sensor chip and the sensing surface window, so as to improve the accuracy of monitoring.

[0023] In summary, in the present technical solution, the only components that need to be processed are the carrier board and the metal sleeve, and the processing and molding are simple, and the processing cost is low; during assembly, the pressure sensor chip, temperature sensor chip, sealing tape and ventilation pipe can be installed on the carrier board as a whole first, which can ensure the accuracy of the installation position of the components on the carrier board; then the metal sleeve and the carrier board are matched and installed to ensure the accuracy of the installation position of the carrier board and the metal sleeve, making the overall assembly operation more convenient, with low assembly cost, and can improve the accuracy of the installation position of each component and improve the accuracy of monitoring. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic diagram of the planar structure of the carrier board in the present invention; Figure 2 It is a schematic diagram of the three-dimensional structure of the carrier board in the present invention; Figure 3 It is a schematic diagram of the structure of the metal sleeve in the present invention; Figure 4 It is a schematic diagram of the structure inside the metal sleeve in the present invention; Figure 5It is a structural schematic diagram of the present invention.

[0025] In the figure: metal sleeve 1; semicircular ball head 2; plastic sleeve 3; carrier board 4; pressure sensor chip 5; sealing tape 6; ventilation pipe 7; temperature sensor chip 8; notch 9; first through groove 10; second through groove 11; bump 12; sealing soft glue 13; sealing transition cavity 14; filling hard glue 15; sensing surface window 16; docking groove 17; sealing hard glue 18; wire 19. DETAILED DESCRIPTION

[0026] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the present invention will be briefly introduced below in combination with the drawings and the description of the embodiments or the prior art. Obviously, the following description of the structure of the drawings is only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work. It should be noted that the description of these embodiments is used to help understand the present invention, but does not constitute a limitation of the present invention.

[0027] Embodiment 1: like Figure 1-Figure 5 As shown, this embodiment provides an intracranial probe with a built-in miniature pressure and temperature sensor, including a metal sleeve 1, a semi-spherical head 2, a plastic sleeve 3, a carrier board 4, a pressure sensor chip 5, a sealing tape 6, a ventilation tube 7 and a temperature sensor chip 8, one end of the metal sleeve 1 is fixedly connected to the semi-spherical head 2, and the other end of the metal sleeve 1 is fixedly connected to the plastic sleeve 3; like Figure 1 , Figure 2 As shown, a notch 9, a first through slot 10 and a second through slot 11 are sequentially provided on the carrier plate 4 along the X direction, the notch 9 is connected to the first through slot 10, and a protrusion 12 is symmetrically provided at one end of the carrier plate 4 close to the second through slot 11 along the Y direction; like Figure 4 , Figure 5 As shown, the pressure sensor chip 5 is sealed and fixed to the upper end of the first through groove 10 by the sealing soft glue 13. Specifically, the sealing soft glue 13 can be a die-bonding soft glue, which plays the role of pasting and fixing the chip. The sealing tape 6 is pasted on the lower end of the first through groove 10 so that the first through groove 10 forms a sealed transition cavity 14. The vent pipe 7 is located in the notch 9, one end of the vent pipe 7 extends into the sealed transition cavity 14, and the other end of the vent pipe 7 extends into the plastic sleeve 3. The temperature sensor chip 8 is embedded in the second through groove 11 and fixed to the carrier board 4 by filling hard glue 15. The end of the metal sleeve 1 is symmetrically provided with a docking groove 17, the metal sleeve 1 is sleeved on the outside of the carrier board 4, the protrusion 12 is embedded in the corresponding docking groove 17 of the metal sleeve 1 and remains fixed, a sensing surface window 16 is provided on the metal sleeve 1, the sensing surface of the pressure sensor chip 5 corresponds to the position of the sensing surface window 16, the pressure sensor chip 5 and the sensing surface window 16 are sealed and fixed by a sealing hard glue 18, and the metal sleeve 1 and the carrier board 4 as well as the metal sleeve 1 and the plastic sleeve 3 are fixed by filling hard glue 15.

[0028] In the present technical solution, the carrier plate 4 is a plate-like structure, and a notch 9, a first through groove 10 and a second through groove 11 are cut and formed on the carrier plate 4. The structure is simple and easy to form; the first through groove 10 on the carrier plate 4 not only has the function of locating the installation position of the pressure sensor chip 5 to improve the accuracy of the installation position of the pressure sensor chip 5, but also can cooperate with the sealing tape 6, so that the upper and lower ends of the first through groove 10 are respectively closed by the pressure sensor chip 5 and the sealing tape 6, thereby forming a sealed transition cavity 14, and then combined with the ventilation tube 7 to realize the connection between the pressure sensor chip 5 and the atmosphere, thereby reducing the influence of the atmospheric pressure factor on the pressure sensor sensing surface when measuring intracranial pressure, and realizing more accurate pressure detection; the notch 9 on the carrier plate 4 has the function of locating the installation position of the ventilation tube 7, so that the ventilation tube 7 can The sealed transition cavity 14 is stably connected to the outside; the second through groove 11 on the carrier 4 is used to install the temperature sensor chip 8 (NTC or temperature-sensitive diode) to improve the accuracy of the installation position of the temperature sensor chip 8; in addition, the metal sleeve 1 and the carrier 4 have a simple molding structure, the docking groove 17 and the sensing surface window 16 on the metal sleeve 1 are also cut and formed, and the carrier 4 is embedded and fixed with the corresponding docking groove 17 of the metal sleeve 1 through the protrusion 12, which can achieve the initial fixation of the metal sleeve 1 and the carrier 4, and then fill the hard glue 15 to achieve the fixed connection between the two, thereby improving the accuracy of the installation position of the metal sleeve 1 and the carrier 4, and then improving the accuracy of the correspondence between the sensing surface of the pressure sensor chip 5 and the sensing surface window 16, so as to improve the accuracy of monitoring.

[0029] In summary, in this technical solution, the only parts that need to be processed are the carrier board 4 and the metal sleeve 1, and the processing and molding are simple and the processing cost is low; during assembly, the pressure sensor chip 5, the temperature sensor chip 8, the sealing tape 6 and the ventilation tube 7 can be installed on the carrier board 4 as a whole, which can ensure the accuracy of the installation position of the components on the carrier board 4; then the metal sleeve 1 and the carrier board 4 are matched and installed to ensure the accuracy of the installation position of the carrier board 4 and the metal sleeve 1, making the overall assembly operation more convenient, the assembly cost is low, and the accuracy of the installation position of each component can be improved, and the accuracy of monitoring can be improved. This technical solution solves the problem that the placement position of the pressure sensor chip of the existing intracranial probe is offset by the influence of the wire connected to the pressure sensor chip, and the stress generated by the rebound of the wire connected to the pressure sensor chip causes the measurement data of the detection sensor to fluctuate greatly, drift in time, and drift in temperature, resulting in inaccurate measurement data. It is easy to mount the pressure sensor chip 5 in this probe on the carrier board 4, and it is easier to embed the temperature sensor chip 8 into the carrier board 4, and it is more convenient to assemble.

[0030] Embodiment 2: This embodiment is optimized based on the above-mentioned embodiment 1.

[0031] Since the thickness of the carrier plate 4 is consistent at all places, including the notch 9 and the first through groove 10 area, in order to allow the vent pipe 7 to extend into the sealed transition cavity 14 and the vent pipe 7 does not exceed the sealed transition cavity 14, the outer diameter of the vent pipe 7 is less than or equal to the thickness of the carrier plate 4.

[0032] Embodiment three: This embodiment is optimized based on the above-mentioned embodiment 1.

[0033] In order to improve the installation stability of the vent pipe 7 and the carrier plate 4 , the gap between the vent pipe 7 and the notch 9 is filled with soft glue.

[0034] Embodiment 4: This embodiment is optimized based on the above-mentioned embodiment 1.

[0035] In order to facilitate the lead-out of the wires 19 , the wires 19 of the pressure sensor chip 5 and the wires 19 of the temperature sensor chip 8 are led out after passing through the metal sleeve 1 and the plastic sleeve 3 in sequence.

[0036] Embodiment five: This embodiment is optimized based on the above-mentioned embodiment 1.

[0037] In order to provide a wire 19 lead-out structure, the wire 19 of the temperature sensor chip 8 is located above the carrier 4, and the wires 19 of the pressure sensor chip 5 and the temperature sensor chip 8 bypass the carrier 4 and enter the plastic sleeve 3 from the bottom of the carrier 4 and are led out.

[0038] Embodiment six: This embodiment is optimized based on the above-mentioned embodiment 1.

[0039] In order to provide another wire 19 lead-out structure, the wire 19 of the temperature sensor chip 8 is located below the carrier 4, and the wire 19 of the pressure sensor chip 5 bypasses the carrier 4 and enters the plastic sleeve 3 from below the carrier 4 together with the wire 19 of the temperature sensor chip 8 and is led out.

[0040] Embodiment seven: This embodiment is optimized based on the above-mentioned embodiment 1.

[0041] The carrier board 4 is made of a thin metal board, an FPC board, an FR4 board, a ceramic board, an aluminum substrate or a BT board; The metal sleeve 1 is made of stainless steel, nickel-titanium alloy, pure titanium, titanium-based metal or cobalt-based metal; Specifically, the metal sleeve 1 is made of relatively non-magnetic and biocompatible materials. Relatively non-magnetic materials do not contain magnetic metals such as iron. These materials can be titanium-based metals, cobalt-based metals, etc. These materials can directly contact the human body and will not cause allergies, carcinogenesis, or teratogenesis in patients. They can be well combined with bone tissue, epithelium, and connective tissue. The plastic sleeve 3 is made of nylon tube, Teflon tube or PU tube; The semi-spherical head 2 is made of hard glue, which can be epoxy glue or UV glue, which meets the medical biological relevance and is non-toxic and harmless to the human body.

[0042] Embodiment eight: This embodiment is optimized based on the above-mentioned embodiment 1.

[0043] In order to provide a method for molding a semi-spherical head 2 , the semi-spherical head 2 is integrally molded at the distal end of the metal sleeve 1 after being filled with hard glue 15 and hardened.

[0044] Embodiment nine: This embodiment is optimized based on the above-mentioned embodiment 1.

[0045] In order to provide another method for forming the semi-spherical head 2 , the prefabricated semi-spherical head 2 is fixedly bonded to the distal end of the metal sleeve 1 .

[0046] Embodiment ten: The present invention also provides a packaging process for an intracranial probe with a built-in micro pressure and temperature sensor, which includes the following steps: By laser welding or ultrasonic welding, several wires 19 are welded on the pads of the pressure sensor chip 5 and the temperature sensor chip 8. Specifically, the pressure sensor chip 5 is welded with three wires 19, and the temperature sensor chip 8 is welded with two wires 19. By leading out the wires 19, the sensor signal is connected to the host for communication; The pressure sensor chip 5 is fixed to the upper end of the first through groove 10 by using a sealing soft glue 13, and the temperature sensor chip 8 is embedded in the second through groove 11. The wire 19 of the temperature sensor chip 8 can be above the carrier board 4 or below the carrier board 4; The vent pipe 7 is clamped at the notch 9, and one end of the vent pipe 7 is extended into the first through groove 10, and the gap between the vent pipe 7 and the notch 9 is filled with soft glue. After the sealing tape 6 is pasted at the lower end of the first through groove 10, the area between the pressure sensor chip 5 and the sealing tape 6 forms a sealed transition cavity 14. After sealing, the back cavity of the pressure sensor chip 5 is connected to the outside atmospheric pressure through the vent pipe 7; The metal sleeve 1 is sleeved on the outside of the carrier board 4, and the two protrusions 12 on the carrier board 4 are embedded and connected with the corresponding docking grooves 17 of the metal sleeve 1 and kept fixed, so that the metal sleeve 1 and the carrier board 4 form a tight combination, so that the sensing surface of the pressure sensor chip 5 is aligned with the position of the sensing surface window 16, ensuring that the position of the pressure sensor chip 5 does not shift, and the force is more uniform. The pressure sensor chip 5 and the sensing surface window 16 are sealed and fixed by a sealing hard glue 18; One end of the plastic sleeve 3 is extended into the metal sleeve 1, and the wire 19 is passed through the plastic sleeve 3 and the vent pipe 7 is also placed in the plastic sleeve 3. Specifically, the wire 19 is passed around the carrier board 4 to the bottom of the carrier board 4. The bent wire 19 is parallel to the vent pipe 7 to facilitate passing through the plastic sleeve 3. The wire 19 is insulated through the plastic sleeve 3 and is led to the interface circuit connected to the host. Glue is dispensed or poured at the connection between the metal sleeve 1 and the plastic sleeve 3 until the metal sleeve 1 and the carrier board 4 and the metal sleeve 1 and the plastic sleeve 3 are fixed by filling hard glue 15. At the same time, the distal end of the metal sleeve 1 is hardened after being filled with hard glue and formed into a semi-spherical head 2, or the prefabricated semi-spherical head 2 is bonded by filling hard glue 15 until the entire metal sleeve 1 is completely sealed, so that the entire part of the probe implanted in the skull is insulated and sealed as a whole. The filling hard glue 15 can be UV glue, epoxy glue or silicone glue, and the colloid outside the metal sleeve 1 forms a smooth surface without burrs.

[0047] Specifically, the hemispherical head 2 can be formed by hardening glue or bonding a hemispherical head end.

[0048] It should be noted that when clinicians use intracranial pressure sensors to monitor intracranial pressure, they usually need to drill a small hole of about 3 mm on the skull to place the intracranial pressure sensor. Therefore, the outer diameter of the intracranial probe with built-in micro pressure and temperature sensors of the present invention is less than 1.3 mm and the length is less than 4 mm. Preferably, the width of the carrier plate 4 is between 0.7-1.5 mm, the length is between 1.5-3 mm, and the thickness is between 0.08-0.25 mm. The diameter of the ventilation tube 7 is between 0.08-0.25 mm, and the length exceeds the end of the carrier plate 4, extends into the plastic sleeve 3, and ensures that the ventilation tube 7 is not blocked. The material of the ventilation tube 7 is not limited.

[0049] If necessary, the intracranial probe and wires with built-in micro pressure and temperature sensors to be implanted are embedded into the external ventricular drainage tube. When the external ventricular drainage tube containing the intracranial probe with built-in micro pressure and temperature sensors is implanted into the patient's ventricle, the cerebrospinal fluid can be drained while the intracranial pressure is monitored. At the same time, drainage of the cerebrospinal fluid can also reduce the intracranial pressure.

[0050] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc. made within the spirit and principles of the present invention should be included in the scope of protection of the present invention.

Claims

1. An intracranial probe with a built-in micro pressure and temperature sensor, characterized in that: It includes a metal sleeve, a semi-circular spherical head, a plastic sleeve, a carrier plate, a pressure sensor chip, a sealing tape, a vent pipe and a temperature sensor chip, wherein one end of the metal sleeve is fixedly connected to the semi-circular spherical head, and the other end of the metal sleeve is fixedly connected to the plastic sleeve; The carrier plate is provided with a notch, a first through slot and a second through slot in sequence along the X direction, the notch is connected to the first through slot, and one end of the carrier plate close to the second through slot is symmetrically provided with a protrusion along the Y direction; The pressure sensor chip is sealed and fixed at the upper end of the first through groove by a sealing soft glue, the sealing tape is pasted on the lower end of the first through groove so that the first through groove forms a sealed transition cavity, the ventilation pipe is located in the notch, one end of the ventilation pipe extends into the sealed transition cavity, the other end of the ventilation pipe extends into the plastic sleeve, and the temperature sensor chip is embedded in the second through groove; The end of the metal sleeve is symmetrically provided with docking grooves, the metal sleeve is sleeved outside the carrier board, the protrusion is embedded in the corresponding docking groove of the metal sleeve and remains fixed, the metal sleeve is provided with a sensing surface window, the sensing surface of the pressure sensor chip corresponds to the position of the sensing surface window, the pressure sensor chip and the sensing surface window are sealed and fixed by sealing hard glue, and the metal sleeve and the carrier board as well as the metal sleeve and the plastic sleeve are fixed by filling hard glue.

2. The intracranial probe with built-in micro pressure and temperature sensors according to claim 1, characterized in that: The outer diameter of the vent pipe is less than or equal to the thickness of the carrier plate.

3. The intracranial probe with built-in micro pressure and temperature sensors according to claim 1, characterized in that: The gap between the vent pipe and the notch is filled with soft glue.

4. The intracranial probe with built-in micro pressure and temperature sensors according to claim 1, characterized in that: The wires of the pressure sensor chip and the wires of the temperature sensor chip are led out after passing through the metal sleeve and the plastic sleeve in sequence.

5. The intracranial probe with built-in micro pressure and temperature sensors according to claim 1, characterized in that: The wires of the temperature sensor chip are located above the carrier board, and the wires of the pressure sensor chip and the temperature sensor chip bypass the carrier board and enter the plastic sleeve from the bottom of the carrier board and are led out.

6. The intracranial probe with built-in micro pressure and temperature sensors according to claim 1, characterized in that: The wires of the temperature sensor chip are located below the carrier board, and the wires of the pressure sensor chip bypass the carrier board and enter the plastic sleeve together with the wires of the temperature sensor chip from below the carrier board and are led out.

7. The intracranial probe with built-in micro pressure and temperature sensors according to claim 1, characterized in that: The carrier board is made of a thin metal plate, an FPC board, an FR4 board, a ceramic board, an aluminum substrate or a BT board; the metal sleeve is made of stainless steel, a nickel-titanium alloy, pure titanium, a titanium-based metal or a cobalt-based metal; the plastic sleeve is made of a nylon tube, a Teflon tube or a PU tube; the semicircular ball head is made of epoxy glue or UV glue.

8. The intracranial probe with built-in micro pressure and temperature sensors according to claim 1, characterized in that: The semi-circular spherical head is integrally formed at the distal end of the metal sleeve after being filled with hard glue and hardened.

9. The intracranial probe with built-in micro pressure and temperature sensors according to claim 1, characterized in that: The prefabricated semicircular spherical head is fixedly bonded to the distal end of the metal sleeve.

10. A packaging process for an intracranial probe with a built-in micro pressure and temperature sensor, characterized in that: The following steps are involved: Solder wires onto the pads of the pressure sensor chip and the temperature sensor chip; Fix the pressure sensor chip at the upper end of the first through groove with a sealing soft glue, and embed the temperature sensor chip into the second through groove; Clamp the vent pipe at the notch, and extend one end of the vent pipe into the first through groove, fill the gap between the vent pipe and the notch with glue, and stick a sealing tape on the lower end of the first through groove so that the area between the pressure sensor chip and the sealing tape forms a sealed transition cavity; The metal sleeve is put on the outside of the carrier board, and the two protrusions on the carrier board are embedded in the corresponding docking grooves of the metal sleeve and kept fixed, and the pressure sensor chip and the sensing surface window are sealed and fixed by sealing hard glue; Insert one end of the plastic sleeve into the metal sleeve, and place the wire and the vent tube in the plastic sleeve; Glue is dispensed or poured at the connection between the metal sleeve and the plastic sleeve until the metal sleeve and the carrier board as well as the metal sleeve and the plastic sleeve are fixed by filling hard glue. At the same time, the glue at the distal end of the metal sleeve is hardened to form a semi-spherical head or a prefabricated semi-spherical head is bonded by filling hard glue until the entire metal sleeve is completely sealed.

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