Full-automatic tin soldering equipment

Abstract

The invention relates to the technical field of welding automation, and provides full-automatic tin soldering equipment which comprises a chip transfer part, a feeding conveying belt part, a tin soldering part and the like. The right side of the chip transfer part is provided with a feeding conveying belt part fixed to the surface of the large bottom plate. The left side of the chip transfer part is provided with a soldering flux part fixed on the surface of the large bottom plate; the rear side of the chip transfer part is provided with a feeding carrying part fixed to the surface of the large bottom plate. A station switching component fixed on the surface of the large bottom plate is arranged on the front side of the chip transfer component; the left side of the tin soldering component is provided with a discharging conveying belt component fixed to the surface of the large bottom plate. By using the structure of the chip transfer component and the rotating shaft plate, a plurality of chips can be subjected to tin soldering at a time, the whole process comprises chip feeding and discharging, chip soaking in soldering flux, tin soldering and the like, the working efficiency can be greatly improved, the production cost is reduced, the stability of tin soldering quality is ensured, and the production cost is reduced. And the production and process requirements are met.

Description

Technical Field

[0001] The invention relates to full-automatic soldering equipment, belonging to the technical field of welding automation. Background Art

[0002] With the development of the times and the progress of society, more and more electronic products are used. Mobile phones, computers, televisions, refrigerators, etc. all need the support of chips. More products will be installed with chips for operation and control. The chips are small in size and have large content storage capacity. Solder is an important industrial raw material for connecting electronic components in welding circuits. It is a solder with a low melting point, mainly referring to solder made of tin-based alloys; after the chip pins are installed, in order to ensure good conductivity, the pins generally need to be soldered. A Chinese invention patent with patent number CN202011175573.X discloses a soldering device, which includes an equipment body, a tin furnace and a solder clamping device, which solves the problem that the existing soldering equipment cannot meet the action requirements of soldering at more angles of the product; a Chinese utility model patent with patent number CN201922322315.9 discloses an automatic soldering device, which finds different soldering points by moving the fixture assembly and the robot arm on the rack, and drives the soldering assembly and the tinning assembly to move toward the soldering point of the product to be processed through the driving assembly, so as to complete the automatic soldering operation of the product to be processed.

[0003] However, the inventor of the patent of this invention found that the prior art has the following problems: the traditional operation method is to manually hold a solder gun and tin wire for spot welding, which is not only slow, inefficient and has high labor costs, but also prone to errors due to the small solder spots, resulting in a low product qualification rate, which cannot meet customer and market needs in a timely manner and is time-consuming and labor-intensive; therefore, improvements are needed. Summary of the invention

[0004] In order to solve the above technical problems, the present invention provides a fully automatic soldering equipment, which can automatically solder multiple chip pins at one time with high efficiency and stable quality.

[0005] The present invention is achieved through the following technical solutions.

[0006] The present invention provides a fully automatic soldering equipment, comprising a large base plate, a chip transfer component, a feeding conveyor belt component, a flux component, a feeding and handling component, a hot air component, a solder component, a discharge conveyor belt component and a station switching component; a chip transfer component is fixedly connected to the middle of the right side of the large base plate surface; a feeding conveyor belt component fixed to the surface of the large base plate is arranged on the right side of the chip transfer component; a flux component fixed to the surface of the large base plate is arranged on the left side of the chip transfer component; a feeding and handling component fixed to the surface of the large base plate is arranged on the rear side of the chip transfer component; a station switching component fixed to the surface of the large base plate is arranged on the front side of the chip transfer component; a hot air component fixed to the surface of the large base plate is arranged on the left side of the flux component; a solder component fixed to the surface of the large base plate is arranged on the left side of the hot air component; a discharge conveyor belt component fixed to the surface of the large base plate is arranged on the left side of the solder component; the soldering components comprise a tin furnace pad, a tin furnace, an upper tin block cylinder mounting plate, an upper tin block cylinder, an upper tin block Connecting plate, upper tin block, vertical cylinder mounting plate, vertical cylinder, tin slag removal cylinder, tin slag shifting block connecting plate and tin slag shifting block; the bottom surface of the tin furnace pad block is fixed to the surface of the large base plate; the upper surface of the tin furnace pad block is fixedly connected to the tin furnace; one side of the tin furnace pad block is provided with an upper tin block cylinder mounting plate fixed to the surface of the large base plate; the side of the upper tin block cylinder mounting plate is fixedly connected to the upper tin block cylinder; the end of the telescopic shaft of the upper tin block cylinder is fixedly connected to the upper tin block connecting plate; the end face of the upper tin block connecting plate is fixedly connected to the upper tin block; the other side of the tin furnace pad is provided with a vertical cylinder mounting plate fixed to the surface of the large base plate; the side of the vertical cylinder mounting plate is fixedly connected to the vertical cylinder; the end of the telescopic shaft of the vertical cylinder is fixedly connected to the tin slag removal cylinder through a connecting plate; the end of the telescopic shaft of the tin slag removal cylinder is fixedly connected to the tin slag shifting block connecting plate through a connecting rod; the side of the tin slag shifting block connecting plate is fixedly connected to the tin slag shifting block; the middle surface of the upper tin block is provided with weight reduction holes; the end of the surface of the upper tin block is provided with an array of upper tin grooves.

[0007] The chip transfer component includes a rotating cylinder, a connecting support plate, a first limit block, a second limit block, a concave support block, a chip positioning base plate, a chip positioning side plate, a chip positioning clamp and a guide shaft; the bottom surface of the rotating cylinder is fixed to the surface of the large base plate; the surface of the rotating part of the rotating cylinder is fixedly connected to the connecting support plate; the surface of the connecting support plate is fixedly connected to the concave support block; the surface of the concave support block is fixedly connected to the chip positioning base plate; one side surface of the chip positioning base plate is fixedly connected to the chip positioning side plate; the other side surface of the chip positioning base plate is fixedly connected to the guide shaft in an array; the guide shaft is slidably connected to the chip positioning clamp through a linear bearing.

[0008] The chip transfer component also includes a chip clamping cylinder fixing plate, a chip clamping cylinder, an arc-shaped connecting plate, a second elastic damper mounting plate, a second elastic damper, a first elastic damper mounting plate and a first elastic damper; the chip clamping cylinder fixing plate is fixedly connected to the side of the concave support block through a connecting block; the chip clamping cylinder is threadedly connected to the threaded hole of the chip clamping cylinder fixing plate, and the end of the telescopic shaft of the chip clamping cylinder is fixedly connected to the side of the chip positioning clamping plate through a floating joint; the bottom surface of the arc-shaped connecting plate is fixed to the surface of the fixed part of the rotating cylinder; one side of the surface of the arc-shaped connecting plate is fixedly connected to the second elastic damper mounting plate; the second elastic damper mounting plate is threadedly connected to the internal threaded hole of the second elastic damper mounting plate; the other side of the surface of the arc-shaped connecting plate is fixedly connected to the first elastic damper mounting plate; the first elastic damper is threadedly connected to the internal threaded hole of the first elastic damper mounting plate.

[0009] The chip positioning base plate includes a chip positioning groove, a vacuum suction hole and a guide shaft connecting threaded hole; the surface of the chip positioning base plate is provided with chip positioning grooves evenly spaced; a vacuum suction hole is provided in the middle of the bottom surface of the chip positioning groove; guide shaft connecting threaded holes are provided on both sides of the side of the chip positioning base plate; the chip positioning clamp includes a chip positioning vertical groove and a linear bearing mounting hole; an array of chip positioning vertical grooves is provided on the side of the chip positioning clamp; and arrays of linear bearing mounting holes are provided at both ends of the side of the chip positioning clamp.

[0010] The feeding conveyor belt component includes a feeding conveyor belt assembly, an L-shaped fixing plate, a guide plate and a limit plate; the two side surfaces of the feeding conveyor belt assembly are fixedly connected with L-shaped fixing plates; the bottom surface of the L-shaped fixing plate is fixed to the surface of the large bottom plate; the upper surface of the feeding conveyor belt assembly is fixedly connected with a guide plate; one end of the guide plate is provided with a limit plate symmetrically fixed on the surface of the feeding conveyor belt assembly; a guide transverse groove is provided in the middle of the bottom surface of the guide plate; one end of the guide plate is provided with a guide bell mouth; the surface of the guide plate on both sides of the guide bell mouth is provided with an array of waist-shaped countersunk holes; the limit plate includes an L-shaped notch, a circular avoidance hole, a sensor mounting hole, a sensor fixing hole and a guide notch; the surface of one end of the limit plate is provided with an L-shaped notch, and the surface of the other end is provided with a guide notch; the side of the limit plate is provided with a sensor mounting hole; the surface of the limit plate is provided with a sensor fixing hole that passes through the sensor mounting hole.

[0011] The loading and handling components include a module mounting and fixing frame, a loading and handling module, a loading and handling motor, an L-shaped connecting plate, a loading and handling cylinder, a vertical linear rail, a connecting plate, a loading and handling vacuum suction mounting tube and a loading and handling vacuum suction; the bottom surface of the module mounting and fixing frame is fixed to the surface of the large bottom plate; the upper side of the module mounting and fixing frame is fixedly connected with the loading and handling module; one end of the loading and handling module is fixedly connected with the loading and handling motor; the loading and handling module is slidably connected to the L-shaped connecting plate through a slider; the side of the L-shaped connecting plate is fixedly connected with the loading and handling cylinder; the surface of the sliding part of the loading and handling cylinder is fixedly connected to the bottom surface of the vertical linear rail through a connecting block; the vertical linear rail is slidably connected to the connecting plate through a small slider; the bottom surface of the connecting plate is fixedly connected with the loading and handling vacuum suction mounting tube; the upper surface of the loading and handling vacuum suction mounting tube is threadedly connected with the loading and handling vacuum suction.

[0012] The workstation switching component includes a workstation switching module, a workstation switching module motor, a vertical module fixing component, a vertical module, a vertical module motor, a rotating axis support frame, a rotating axis motor and a rotating axis plate; the bottom surface of the workstation switching module is fixed to the surface of the large base plate; the end of the workstation switching module is fixedly connected to the workstation switching module motor; the workstation switching module is slidably connected to the vertical module fixing component through a slider; the side of the vertical module fixing component is fixedly connected to the vertical module; the end of the vertical module is fixedly connected to the vertical module motor; the vertical module is slidably connected to the rotating axis support frame through a slider; one end of the rotating axis support frame is fixedly connected to the rotating axis motor; the rotating axis plate is rotatably connected to the rotating axis support frame through a bearing.

[0013] The workstation switching component also includes a chip limiting plate, a first vacuum suction, a titanium rod mounting plate and a titanium rod; the first vacuum suction is connected to the threaded array on the side of the rotating axis plate; the chip limiting plate is fixedly connected to the other side of the rotating axis plate; the end face of the rotating axis plate is fixedly connected to the titanium rod mounting plate; the titanium rod is clamped in the middle of the titanium rod mounting plate; a circular protrusion is provided on the side of the rotating axis plate, which is located on the same axis as the first vacuum suction; a second vacuum suction hole is provided in the middle of the surface of the circular protrusion; the chip limiting plate on one side of the circular protrusion is provided with an array of square through grooves.

[0014] The flux component includes a flux slot mounting base, a flux slot, a flux lifting cylinder, a cylinder connecting plate, an intermediate plate, a flux mounting plate, a blowing assembly mounting base, a blowing plate, a quick connector and a heating rod mounting hole; the bottom surface of the flux slot mounting base is fixed to the surface of the large base plate; the upper surface of the flux slot mounting base is fixedly connected with the flux slot; a heating rod mounting hole is provided on the side of the bottom of the flux slot; one side of the end of the flux slot is provided with a flux lifting cylinder fixed to the surface of the flux slot mounting base; the end of the telescopic shaft of the flux lifting cylinder is fixedly connected with the cylinder connecting plate; the lower surface of the end of the cylinder connecting plate is fixedly connected with the intermediate plate; the bottom surface of the intermediate plate is fixedly connected with the flux mounting plate; the blowing assembly mounting bases fixed to the surface of the large base plate are symmetrically provided on both sides of the flux slot mounting base; the side of the blowing assembly mounting base is rotatably connected with the blowing plate through a pin shaft; the surface of the blowing plate is threadedly connected with a quick connector; the surface of the flux mounting plate is provided with an array of flux mounting slots; and the middle of the flux mounting plate is provided with an array of square through holes.

[0015] The beneficial effect of the present invention is that by using the chip transfer component and the structure of the rotating shaft plate, multiple chips can be soldered at one time, and the entire process including chip loading and unloading, chip wetting flux and solder, etc. adopts an automated process, which can greatly improve work efficiency, reduce production costs, ensure the stability of solder quality, and meet production and process needs. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is the overall structure diagram of the present invention; Figure 2 yes Figure 1 Structure diagram of the chip transfer component; Figure 3 yes Figure 2 The structure diagram of the chip positioning base plate; Figure 4 yes Figure 2 Structure diagram of the chip positioning splint; Figure 5 yes Figure 1 The structural diagram of the middle feeding conveyor belt components; Figure 6 yes Figure 5 Structure diagram of middle guide plate; Figure 7 yes Figure 5 Structural diagram of the middle limit plate; Figure 8 yes Figure 1 Structural diagram of the loading and handling components; Fig. 9 yes Figure 1 Structure diagram of the middle station switching component; Fig.10 yes Fig. 9 Partial structural diagram of the middle rotating shaft plate; Fig.11 yes Figure 1 Structure diagram of the solder flux components; Fig.12 yes Fig.11 Structure diagram of the medium flux mounting board; Fig.13 yes Figure 1 Structure diagram of soldering parts; Fig.14 yes Fig.13 Structure diagram of the tin block in the middle and upper part.

[0017] In the figure: 1, large base plate; 2, chip transfer component; 21, rotating cylinder; 22, connecting support plate; 23, first limit block; 24, second limit block; 25, concave support block; 26, chip positioning base plate; 261, chip positioning sink groove; 262, vacuum suction hole; 263, guide shaft connecting threaded hole; 27, chip positioning side plate; 28, chip positioning clamping plate; 281, chip positioning vertical groove; 282, linear bearing mounting hole; 29, guide shaft; 210, chip clamping cylinder fixing plate; 211, chip clamping cylinder; 212, arc connecting plate; 213, second elastic damper mounting plate; 214, second elastic damper; 21 5. First elastic damper mounting plate; 216. First elastic damper; 3. Feeding conveyor belt component; 31. Feeding conveyor belt assembly; 32. L-shaped fixing plate; 33. Guide plate; 331. Guide transverse groove; 332. Guide bell mouth; 333. Waist countersunk hole; 34. Limiting plate; 341. L-shaped notch; 342. Circular avoidance hole; 343. Sensor mounting hole; 344. Sensor fixing hole; 345. Guide notch; 4. Solder flux component; 41. Solder flux tank mounting base; 42. Solder flux tank; 43. Solder flux lifting cylinder; 44. Cylinder connecting plate; 45. Intermediate plate; 46. Solder flux mounting plate; 461. Solder flux mounting plate Slot; 462, square through hole; 47, blowing assembly mounting base; 48, blowing plate; 49, quick connector; 410, heating rod mounting hole; 5, loading and handling components; 51, module mounting bracket; 52, loading and handling module; 53, loading and handling motor; 54, L-shaped connecting plate; 55, loading and handling cylinder; 56, vertical straight rail; 57, connecting plate; 58, loading vacuum suction mounting cylinder; 59, loading vacuum suction; 6, hot air components; 7, soldering components; 71, tin furnace pad; 72, tin furnace; 73, tin block cylinder mounting plate; 74, tin block cylinder; 75, tin block connecting plate; 76, tin block; 761, tin tank; 7 62. Weight reduction hole; 77. Vertical cylinder mounting plate; 78. Vertical cylinder; 79. Tin slag removal cylinder; 710. Tin slag shifting block connecting plate; 711. Tin slag shifting block; 8. Unloading conveyor belt component; 9. Station switching component; 91. Station switching module; 92. Station switching module motor; 93. Vertical module fixing component; 94. Vertical module; 95. Vertical module motor; 96. Rotating axis support frame; 97. Rotating axis motor; 98. Rotating axis plate; 981. Circular protrusion; 982. Second vacuum suction hole; 99. Chip limit plate; 991. Square through groove; 910. First vacuum suction; 911. Titanium rod mounting plate; 912. Titanium rod. DETAILED DESCRIPTION

[0018] The technical solution of the present invention is further described below, but the scope of protection claimed is not limited to the description.

[0019] The first embodiment of the present invention relates to Figure 1-14 The fully automatic soldering equipment shown in the figure comprises a large base plate 1, a chip transfer component 2, a feeding conveyor belt component 3, a flux component 4, a feeding and transporting component 5, a hot air component 6, a solder component 7, a discharge conveyor belt component 8 and a station switching component 9; a chip transfer component 2 is fixedly connected to the middle of the right side of the surface of the large base plate 1; a feeding conveyor belt component 3 fixed to the surface of the large base plate 1 is provided on the right side of the chip transfer component 2; a flux component 4 fixed to the surface of the large base plate 1 is provided on the left side of the chip transfer component 2; a feeding and transporting component 5 fixed to the surface of the large base plate 1 is provided on the rear side of the chip transfer component 2; a station switching component 9 fixed to the surface of the large base plate 1 is provided on the front side of the chip transfer component 2; a hot air component 6 fixed to the surface of the large base plate 1 is provided on the left side of the flux component 4; a The solder component 7 is provided with a discharge conveyor belt component 8 fixed on the surface of the large base plate 1 on the left side of the solder component 7; the large base plate 1 is the overall supporting plane; the chip transfer component 2 is mainly used to arrange multiple chips neatly for one-time transportation; the loading conveyor belt component 3 is mainly used to position the chips transported by other equipment in sequence and in an orderly manner, waiting for loading; the flux component 4 is mainly used to wet the solder part of the chip with flux; the loading and transporting component 5 is used to transport the chip from the loading conveyor belt component 3 to the chip transfer component 2; the hot air component 6 is mainly used to maintain a certain temperature for the chip wetted with flux; the solder component 7 is used to tin the chip; the discharge conveyor belt component 8 is used to transport the tinned chip to a designated box; the station switching component 9 is mainly used to transport rows of chips between various stations.

[0020] The soldering component 7 includes a tin furnace pad 71, a tin furnace 72, an upper tin block cylinder mounting plate 73, an upper tin block cylinder 74, an upper tin block connecting plate 75, an upper tin block 76, a vertical cylinder mounting plate 77, a vertical cylinder 78, a tin slag removal cylinder 79, a tin slag shifting block connecting plate 710 and a tin slag shifting block 711; the bottom surface of the tin furnace pad 71 is fixed to the surface of the large base plate 1; the upper surface of the tin furnace pad 71 is fixedly connected to the tin furnace 72; one side of the tin furnace pad 71 is provided with an upper tin block cylinder mounting plate 73 fixed to the surface of the large base plate 1; the side of the upper tin block cylinder mounting plate 73 is fixedly connected to the upper Tin block cylinder 74; the end of the telescopic shaft of the upper tin block cylinder 74 is fixedly connected to the upper tin block connecting plate 75; the end face of the upper tin block connecting plate 75 is fixedly connected to the upper tin block 76; the other side of the tin furnace pad 71 is provided with a vertical cylinder mounting plate 77 fixed to the surface of the large bottom plate 1; the side of the vertical cylinder mounting plate 77 is fixedly connected to the vertical cylinder 78; the end of the telescopic shaft of the vertical cylinder 78 is fixedly connected to the tin slag removal cylinder 79 through a connecting plate; the end of the telescopic shaft of the tin slag removal cylinder 79 is fixedly connected to the tin slag shifting block connecting plate 710 through a connecting rod; the side of the tin slag shifting block connecting plate 710 The upper tin block 76 is fixedly connected with a tin slag shifting block 711; the middle surface of the upper tin block 76 is provided with a weight-reducing hole 762; the end of the surface of the upper tin block 76 is provided with an array of upper tin grooves 761; the tin furnace pad 71 is used to install and fix the tin furnace 72; the tin furnace 72 is a container for holding and heating the solder liquid; the upper tin block cylinder mounting plate 73 is used to fix and install the upper tin block cylinder 74; the upper tin block cylinder 74 provides power for the lifting of the upper tin block 76; the upper tin block connecting plate 75 is used to connect the upper tin block cylinder 74 and the upper tin block 76; the upper tin block 76 can ensure that the height of the solder liquid lifted each time is consistent; vertical The cylinder mounting plate 77 is used to fix and install the vertical cylinder 78; the vertical cylinder 78 provides power for the up and down movement of the tin slag removal cylinder 79; the tin slag removal cylinder 79 is used to provide power for the horizontal movement of the tin slag shifting block 711; the tin slag shifting block connecting plate 710 is used to fix the tin slag shifting block 711; the tin slag shifting block 711 is used to shift the tin slag on the surface of the solder solution in the tin furnace 72; the upper tin trough 761 is a single container for holding solder liquid; the weight reduction hole 762 can reduce the overall weight of the upper tin block 76, and at the same time, it is also a channel for the solder liquid to flow out during the lifting process of the upper tin block 76.

[0021] The second embodiment of the present invention is basically the same as the first embodiment, mainly in that the solution of the chip transfer component is optimized. The chip transfer component 2 includes a rotating cylinder 21, a connecting support plate 22, a first limit block 23, a second limit block 24, a concave support block 25, a chip positioning base plate 26, a chip positioning side plate 27, a chip positioning clamping plate 28 and a guide shaft 29; the bottom surface of the rotating cylinder 21 is fixed to the surface of the large base plate 1; the surface of the rotating part of the rotating cylinder 21 is fixedly connected to the connecting support plate 22; the surface of the connecting support plate 22 is fixedly connected to the concave support block 25; the surface of the concave support block 25 is fixedly connected to the chip positioning base plate 26; one side of the chip positioning base plate 26 is fixedly connected to the chip positioning side plate 27; the other side of the chip positioning base plate 26 is fixedly connected to the guide shaft 29; the guide shaft 2 9 is slidably connected with the chip positioning clamping plate 28 through a linear bearing; the rotary cylinder 21 provides power for the rotation of the chip positioning base plate 26; the connecting support plate 22 is the supporting base plate of the chip positioning base plate 26; the first limit block 23 and the second limit block 24 are mainly used to limit the rotation of the chip positioning base plate 26 by 90°; the concave support block 25 is used to install and fix the chip positioning base plate 26; the chip positioning base plate 26 is used to position the chip, and at the same time, the chip can be sucked by vacuum; the chip positioning side plate 27 is used to limit one side of the chip; the chip positioning clamping plate 28 is used to limit the other side of the chip; the guide shaft 29 is used to guide the movement of the chip positioning clamping plate 28.

[0022] The chip transfer component 2 also includes a chip clamping cylinder fixing plate 210, a chip clamping cylinder 211, an arc-shaped connecting plate 212, a second elastic damper mounting plate 213, a second elastic damper 214, a first elastic damper mounting plate 215 and a first elastic damper 216; the chip clamping cylinder fixing plate 210 is fixedly connected to the side of the concave support block 25 through a connecting block; the chip clamping cylinder 211 is threadedly connected to the threaded hole of the chip clamping cylinder fixing plate 210, and the end of the telescopic shaft of the chip clamping cylinder 211 is fixedly connected to the side of the chip positioning clamping plate 28 through a floating joint; the bottom surface of the arc-shaped connecting plate 212 is fixed to the surface of the fixed part of the rotating cylinder 21; one side of the surface of the arc-shaped connecting plate 212 is fixedly connected with the second elastic damper mounting plate 213; the internal threaded hole of the second elastic damper mounting plate 213 is threadedly connected with the second elastic damper 21 4; The other side of the surface of the arc-shaped connecting plate 212 is fixedly connected with a first elastic damper mounting plate 215; the internal threaded hole of the first elastic damper mounting plate 215 is threadedly connected with a first elastic damper 216; the chip clamping cylinder fixing plate 210 is used to fix and install the chip clamping cylinder 211; the chip clamping cylinder 211 is used to provide power for the movement guide of the chip positioning clamping plate 28; the arc-shaped connecting plate 212 is used to fix and install the second elastic damper mounting plate 213 and the first elastic damper mounting plate 215; the second elastic damper mounting plate 213 is used to fix the second elastic damper 214; the second elastic damper 214 can buffer the collision of the second limit block 24; the first elastic damper mounting plate 215 is used to fix the first elastic damper 216; the first elastic damper 216 can buffer the collision of the first limit block 23.

[0023] The chip positioning base plate 26 includes a chip positioning groove 261, a vacuum suction hole 262 and a guide shaft connecting threaded hole 263; the surface of the chip positioning base plate 26 is provided with chip positioning grooves 261 arranged evenly at intervals; a vacuum suction hole 262 is provided in the middle of the bottom surface of the chip positioning groove 261; guide shaft connecting threaded holes 263 are provided on both sides of the side of the chip positioning base plate 26; the chip positioning clamp plate 28 includes a chip positioning vertical groove 281 and a linear bearing mounting hole 282; an array of chip positioning vertical grooves 281 are provided on the side of the chip positioning clamp plate 28; an array of linear bearing mounting holes 282 are provided at both ends of the side of the chip positioning clamp plate 28; the chip positioning groove 261 supports and limits the chip; the vacuum suction hole 262 is a channel for generating vacuum suction at the bottom of the chip; the guide shaft connecting threaded hole 263 is used for threaded connection of the end of the guide shaft; the chip positioning vertical groove 281 is used to limit the side of the chip; the linear bearing mounting hole 282 is used to install the linear bearing.

[0024] The feeding conveyor belt component 3 includes a feeding conveyor belt assembly 31, an L-shaped fixing plate 32, a guide plate 33 and a limit plate 34; the two sides of the feeding conveyor belt assembly 31 are fixedly connected with the L-shaped fixing plate 32; the bottom surface of the L-shaped fixing plate 32 is fixed to the surface of the large bottom plate 1; the upper surface of the feeding conveyor belt assembly 31 is fixedly connected with the guide plate 33; one end of the guide plate 33 is provided with a limit plate 34 symmetrically fixed to the surface of the feeding conveyor belt assembly 31; a guide transverse groove 331 is provided in the middle of the bottom surface of the guide plate 33; one end of the guide plate 33 is provided with a guide The guide plate 33 on both sides of the guide bell mouth 332 is provided with an array of waist-shaped countersunk holes 333; the limiting plate 34 includes an L-shaped notch 341, a circular avoidance hole 342, a sensor mounting hole 343, a sensor fixing hole 344 and a guide notch 345; an L-shaped notch 341 is provided on one end surface of the limiting plate 34, and a guide notch 345 is provided on the other end surface; a sensor mounting hole 343 is provided on the side of the limiting plate 34; a sensor penetrating the sensor mounting hole 343 is provided on the surface of the limiting plate 34 The fixing hole 344; the feeding conveyor belt assembly 31 is used to provide power and a platform for the sequential movement of the chips; the L-shaped fixing plate 32 is used to install and fix the feeding conveyor belt assembly 31; the guide plate 33 is used to guide the movement of the chips on the conveyor belt; the limit plate 34 is used to limit the chips transported by the conveyor belt; the guide transverse groove 331 is a channel for guiding the chips to move forward; the guide bell mouth 332 can gradually move and gather the chips scattered on the starting section of the conveyor belt into the guide transverse groove 331; the waist-shaped countersunk hole 333 is a redundant design for the lateral movement of the guide plate 33; the L-shaped notch 341 is an avoidance design for the feeding vacuum suction 59 to absorb the chip; the circular avoidance hole 342 can ensure that the side of the chip is flush with the side of the L-shaped notch 341; the sensor installation hole 343 is used to install a sensor for detecting whether there is a chip in place; the sensor fixing hole 344 is mainly used to install a stop screw to fix the sensor tightly; the guide notch 345 is mainly to prevent the chip from being hung when it moves from the end of the guide plate 33.

[0025] The material handling component 5 includes a module mounting bracket 51, a material handling module 52, a material handling motor 53, an L-shaped connecting plate 54, a material handling cylinder 55, a vertical linear rail 56, a connecting plate 57, a material handling vacuum suction mounting tube 58 and a material handling vacuum suction 59; the bottom surface of the module mounting bracket 51 is fixed to the surface of the large bottom plate 1; the material handling module 52 is fixedly connected to the upper side of the module mounting bracket 51; one end of the material handling module 52 is fixedly connected to the material handling motor 53; the material handling module 52 is slidably connected to the L-shaped connecting plate 54 through a slider; the side of the L-shaped connecting plate 54 is fixedly connected to the material handling cylinder 55; the sliding part surface of the material handling cylinder 55 is fixedly connected to the bottom surface of the vertical linear rail 56 through a connecting block; the vertical linear rail 56 is slidably connected to the connecting plate 57 through a small slider; the bottom of the connecting plate 57 A loading vacuum suction mounting cylinder 58 is fixedly connected to the surface; a loading vacuum suction 59 is threadedly connected to the upper surface of the loading vacuum suction mounting cylinder 58; the module mounting bracket 51 is used to fix and install the loading and handling module 52; the loading and handling module 52 can convert the rotational motion of the ball screw itself into the linear movement of the slider; the loading and handling motor 53 is used to provide rotational power to the ball screw in the loading and handling module 52; the L-shaped connecting plate 54 is used to install and fix the loading and handling cylinder 55; the loading and handling cylinder 55 provides power for the up and down movement of the vertical linear rail 56; the vertical linear rail 56 is used to guide the movement of the connecting plate 57; the connecting plate 57 is used to install and fix the loading vacuum suction mounting cylinder 58; the loading vacuum suction mounting cylinder 58 is used to install and fix the loading vacuum suction 59; the loading vacuum suction 59 can generate a vacuum to absorb the chip.

[0026] The station switching component 9 includes a station switching module 91, a station switching module motor 92, a vertical module fixing component 93, a vertical module 94, a vertical module motor 95, a rotating shaft support frame 96, a rotating shaft motor 97 and a rotating shaft plate 98; the bottom surface of the station switching module 91 is fixed to the surface of the large bottom plate 1; the end of the station switching module 91 is fixedly connected with the station switching module motor 92; the station switching module 91 is slidably connected to the vertical module fixing component 93 through a slider; the side of the vertical module fixing component 93 is fixedly connected with the vertical module 94; the end of the vertical module 94 is fixedly connected with the vertical module motor 95; the vertical module 94 is slidably connected to the rotating shaft support frame 96 through a slider; one end of the rotating shaft support frame 96 is fixedly connected with the rotating shaft motor 97; The shaft plate 98 is rotatably connected to the rotating shaft support frame 96 through bearings; the workstation switching module 91 can convert the rotational motion of its own internal ball screw into horizontal linear movement of the slider; the workstation switching module motor 92 is used to provide rotational power to the ball screw in the workstation switching module 91; the vertical module fixing assembly 93 is used to fix the vertical module 94; the vertical module 94 can convert the rotational motion of its own internal ball screw into vertical linear movement of the slider; the vertical module motor 95 can provide rotational power to the ball screw in the vertical module 94; the rotating shaft support frame 96 has a rotational support function for the rotating shaft plate 98; the rotating shaft motor 97 provides rotational power to the rotating shaft plate 98; the rotating shaft plate 98 is used to vacuum suck up the chips placed in an entire row on the chip positioning base plate 26.

[0027] The station switching component 9 also includes a chip limiting plate 99, a first vacuum suction 910, a titanium rod mounting plate 911 and a titanium rod 912; the first vacuum suction 910 is connected to the threaded array on the side of the rotating shaft plate 98; the chip limiting plate 99 is fixedly connected to the other side of the rotating shaft plate 98; the end face of the rotating shaft plate 98 is fixedly connected to the titanium rod mounting plate 911; the titanium rod 912 is clamped in the middle of the titanium rod mounting plate 911; a circular protrusion 981 is provided on the side of the rotating shaft plate 98, which is located on the same axis as the first vacuum suction 910; a second vacuum suction hole 982 is provided in the middle of the surface of the circular protrusion 981; the circular protrusion 981 is provided with a second vacuum suction hole 982; the circular protrusion 9 The chip limiting plate 99 on one side of 81 is provided with an array of square through grooves 991; the chip limiting plate 99 is used to limit the side of the chip adsorbed on the rotating shaft plate 98; the first vacuum suction 910 is used to generate vacuum suction; the titanium rod mounting plate 911 is used to fix and install the titanium rod 912; the function of the titanium rod 912 is to prevent the surface of the metal pin from oxidizing during the soldering process, which will lead to a decrease in welding quality; the circular protrusion 981 is mainly to ensure full contact with the chip surface; the second vacuum suction hole 982 is a channel for generating vacuum suction; the square through groove 991 can limit the side of the chip.

[0028] The third embodiment of the present invention is basically the same as the first embodiment, mainly in further optimization. The flux component 4 includes a flux tank mounting base 41, a flux tank 42, a flux lifting cylinder 43, a cylinder connecting plate 44, an intermediate plate 45, a flux mounting plate 46, a blowing assembly mounting base 47, a blowing plate 48, a quick connector 49 and a heating rod mounting hole 410; the bottom surface of the flux tank mounting base 41 is fixed to the surface of the large base plate 1; the upper surface of the flux tank mounting base 41 is fixedly connected with the flux tank 42; the bottom side of the flux tank 42 is provided with a heating rod mounting hole 410; the flux tank 4 A flux lifting cylinder 43 fixed to the surface of the flux tank mounting base 41 is provided at one end of the flux lifting cylinder 43; a cylinder connecting plate 44 is fixedly connected to the end of the telescopic shaft of the flux lifting cylinder 43; an intermediate plate 45 is fixedly connected to the lower surface of the end of the cylinder connecting plate 44; a flux mounting plate 46 is fixedly connected to the bottom surface of the intermediate plate 45; a blowing assembly mounting base 47 fixed to the surface of the large bottom plate 1 is symmetrically provided on both sides of the flux tank mounting base 41; a blowing plate 48 is rotatably connected to the side of the blowing assembly mounting base 47 through a pin shaft ; The surface of the blowing plate 48 is threadedly connected with a quick connector 49; the surface of the flux mounting plate 46 is provided with an array of flux mounting grooves 461; the middle of the flux mounting plate 46 is provided with an array of square through holes 462; the flux groove mounting base 41 is used to fix and install the flux groove 42; the flux groove 42 is a container for holding the flux solution; the flux lifting cylinder 43 is used to provide power for lifting the flux mounting plate 46; the cylinder connecting plate 44 is used to fix and install the intermediate plate 45; the intermediate plate 45 is used to fix the connecting Connect the flux mounting plate 46; the flux mounting plate 46 is used to place a fixed flux block; the blowing assembly mounting base 47 is used to support the blowing plate 48; the blowing plate 48 can generate hot air to accelerate the melting of the flux block; the quick connector 49 is used to connect the hot air duct; the heating rod mounting hole 410 is used to install the heating rod to heat the flux slot 42; the flux mounting slot 461 is used to position and place the flux block; the square through hole 462 is the channel for the melted flux solution to flow to the flux slot 42.

[0029] Based on this, a typical working process of the present invention is as follows: When the present invention is implemented, Figure 1-14As shown, the chips transported from the adjacent equipment or workstation are placed on the conveyor belt of the loading conveyor belt assembly 31. Driven by the conveyor belt, the chips pass through the contraction of the guide horn 332 and enter the guide transverse groove 331 in turn, then enter the channel formed by the two limit plates 34, and finally stop moving under the limit of the L-shaped notch 341, waiting to be transported. At this time, the circular avoidance hole 342 can avoid the pins of the chip, so that the side of the chip is close to the side of the L-shaped notch 341; the loading and transporting cylinder 55 drives the connecting plate 57 to move downward along the vertical straight rail 56, so that the bottom surface of the loading vacuum suction mounting cylinder 58 is attached to the upper surface of the chip, and the loading vacuum suction 59 generates vacuum suction to suck up the chip located at the L-shaped notch 341, and the loading and transporting cylinder 55 retracts; the loading and transporting motor 53 drives the slider on the loading and transporting module 52 to move forward The chip moves to the first chip positioning groove 261 on the chip positioning base plate 26, the loading and transporting cylinder 55 extends out, and the loading vacuum suction 59 is closed, so that the chip is placed in the chip positioning groove 261. At this time, the chip positioning vertical groove 281 will avoid the chip pins, and then, the chips are placed in the remaining 5 chip positioning grooves 261 in turn; at this time, the chip clamping cylinder 211 pushes the chip positioning clamping plate 28 to move forward along the guide shaft 29 to position and clamp the chip from both sides, and then, the vacuum suction action installed in a row on the bottom surface of the chip positioning base plate 26 generates vacuum suction force to suck the chip from the bottom surface of the chip through the vacuum suction hole 262, and the rotating cylinder 21 drives the connecting support plate 22 to rotate, and the first limit block 23 stops under the limit of the first elastic damper 216. At this time, the chip positioning base plate 26 is just rotated 90°.

[0030] The vertical module motor 95 drives the rotating shaft support frame 96 to move downward, and the rotating shaft motor 97 drives the rotating shaft plate 98 to rotate to a vertical position. At this time, the circular protrusion 981 is just located on the upper surface of the chip after rotating 90°. Then, the chip clamping cylinder 211 retracts, driving the chip positioning clamping plate 28 to open, and the vacuum suction force of the vacuum suction hole 262 disappears. The first vacuum suction 910 acts to generate vacuum suction in the second vacuum suction hole 982, and all the chips are sucked onto the surface of the circular protrusion 981; the station switching module motor 92 drives the station switching module 91 to move the rotating shaft plate 98 forward to the top of the flux groove 42. At this time, the heating rod in the heating rod mounting hole 410 and the heating rod from the blowing plate 48 The blown hot air is heating and melting the flux placed in the flux mounting groove 461. After the flux lifting cylinder 43 drives the flux mounting plate 46 to lift up, the vertical module motor 95 drives the rotating shaft plate 98 to move downward, and the rotating shaft motor 97 drives the rotating shaft plate 98 to deflect a certain angle, so that the pins on one side of the chip are all immersed in the melted part of the flux block surface. Then the rotating shaft motor 97 drives the rotating shaft plate 98 to deflect symmetrically in the opposite direction to wet the pins on the other side of the chip with flux; the workstation switching module motor 92 drives the rotating shaft plate 98 to move forward to the position of the hot air component 6, and under the blowing of the hot air, the flux that has just been immersed on the chip pins is further melted.

[0031] The station switching module motor 92 drives the rotating shaft plate 98 to continue to move forward to the top of the tin furnace 72. At this time, the telescopic rod of the vertical cylinder 78 extends to lift the slag removal cylinder 79, and the telescopic shaft of the slag removal cylinder 79 extends, and the telescopic rod of the vertical cylinder 78 retracts. The telescopic shaft of the slag removal cylinder 79 retracts to drive the slag picker block 711 to scrape the oxidized and solidified slag on the surface of the solder liquid in the tin furnace 72 to ensure the purity of the solder liquid. Finally, the slag is collected in a box next to the tin furnace 72. At this time, the upper tin block cylinder 74 drives the upper tin block 76 to lift upward, and the upper tin tank 761 will be filled with solder liquid without slag. At the same time, it can also meet the requirement that the height of the chip immersed in the solder liquid is consistent each time, and the solder quality will not be unstable due to the reduction of the solder solution in the tin furnace 72. The vertical module motor 95 drives the rotating shaft plate 98 to move downward, so that the chip pins sucked on the circular protrusion 981 can be immersed in the corresponding upper tin tank 761. At this time, the end of the titanium rod 912 is just immersed in the solder liquid in the tin furnace 72, which can reduce the oxidation of the solder liquid surface. After the chip pins are soldered, the vertical module motor 95 drives the rotating shaft plate 98 to move upward. Then, the workstation switching module motor 92 drives the rotating shaft support frame 96 to continue to move forward to above the unloading conveyor belt component 8. The vertical module motor 95 drives the rotating shaft plate 98 to move downward, and the first vacuum suction 910 is closed. The chip falls onto the unloading conveyor belt component 8, and as the conveyor belt moves to the other end, the chip finally falls into the collection box. At this point, the fully automatic process of chip pin tinning is completed.

Claims

1. A fully automatic soldering equipment, characterized in that: The invention comprises a large base plate (1), a chip transfer component (2), a material loading conveyor belt component (3), a soldering flux component (4), a material loading and transporting component (5), a hot air component (6), a soldering tin component (7), a material unloading conveyor belt component (8) and a workstation switching component (9); the chip transfer component (2) is fixedly connected to the middle of the right side of the surface of the large base plate (1); the right side of the chip transfer component (2) is provided with a material loading conveyor belt component (3) fixed to the surface of the large base plate (1); the left side of the chip transfer component (2) is provided with a soldering flux component (4) fixed to the surface of the large base plate (1); the rear side of the chip transfer component (2) is provided with a material loading and transporting component fixed to the surface of the large base plate (1) The chip transfer component (2) is provided with a station switching component (9) fixed on the surface of the large base plate (1) on the front side; the solder flux component (4) is provided with a hot air component (6) fixed on the surface of the large base plate (1) on the left side; the hot air component (6) is provided with a solder component (7) fixed on the surface of the large base plate (1) on the left side; the solder component (7) is provided with a discharge conveyor belt component (8) fixed on the surface of the large base plate (1) on the left side; the solder component (7) comprises a tin furnace pad (71), a tin furnace (72), an upper tin block cylinder mounting plate (73), an upper tin block cylinder (74), an upper tin block connecting plate (75), an upper tin block (76), and a vertical cylinder mounting plate (77), a vertical cylinder (78), a tin slag removing cylinder (79), a tin slag shifting block connecting plate (710) and a tin slag shifting block (711); the bottom surface of the tin furnace pad (71) is fixed to the surface of the large bottom plate (1); the upper surface of the tin furnace pad (71) is fixedly connected to the tin furnace (72); one side of the tin furnace pad (71) is provided with an upper tin block cylinder mounting plate (73) fixed to the surface of the large bottom plate (1); the side of the upper tin block cylinder mounting plate (73) is fixedly connected to the upper tin block cylinder (74); the end of the telescopic shaft of the upper tin block cylinder (74) is fixedly connected to the upper tin block connecting plate (75); the end surface of the upper tin block connecting plate (75) is fixedly connected to the upper tin block (76) ; A vertical cylinder mounting plate (77) fixed to the surface of the large base plate (1) is provided on the other side of the tin furnace pad (71); a vertical cylinder (78) is fixedly connected to the side of the vertical cylinder mounting plate (77); a tin slag removal cylinder (79) is fixedly connected to the end of the telescopic shaft of the vertical cylinder (78) via a connecting plate; a tin slag removal cylinder (79) is fixedly connected to the end of the telescopic shaft via a connecting rod; a tin slag removal block (711) is fixedly connected to the side of the tin slag removal block connecting plate (710); a weight reduction hole (762) is provided on the middle surface of the upper tin block (76); an array of upper tin grooves (761) are provided at the end of the surface of the upper tin block (76).

2. The fully automatic soldering equipment according to claim 1, characterized in that: The chip transfer component (2) comprises a rotary cylinder (21), a connecting support plate (22), a first limiting block (23), a second limiting block (24), a concave supporting block (25), a chip positioning base plate (26), a chip positioning side plate (27), a chip positioning clamping plate (28) and a guide shaft (29); the bottom surface of the rotary cylinder (21) is fixed to the surface of the large base plate (1); the surface of the rotating part of the rotary cylinder (21) is fixedly connected to the connecting support plate (22); the surface of the connecting support plate (22) is fixedly connected to the concave supporting block (25); the surface of the concave supporting block (25) is fixedly connected to the chip positioning base plate (26); one side surface of the chip positioning base plate (26) is fixedly connected to the chip positioning side plate (27); the other side surface of the chip positioning base plate (26) is fixedly connected to the guide shaft (29); the guide shaft (29) is slidably connected to the chip positioning clamping plate (28) via a linear bearing.

3. The fully automatic soldering equipment according to claim 2, characterized in that: The chip transfer component (2) further comprises a chip clamping cylinder fixing plate (210), a chip clamping cylinder (211), an arc-shaped connecting plate (212), a second elastic damper mounting plate (213), a second elastic damper (214), a first elastic damper mounting plate (215) and a first elastic damper (216); the chip clamping cylinder fixing plate (210) is fixedly connected to the side of the concave support block (25) via a connecting block; the chip clamping cylinder (211) is threadedly connected to the threaded hole of the chip clamping cylinder fixing plate (210), and the end of the telescopic shaft of the chip clamping cylinder (211) is threadedly connected to the threaded hole of the chip clamping cylinder fixing plate (210), and the end of the telescopic shaft of the chip clamping cylinder (211) is threadedly connected to the threaded hole of the chip clamping cylinder The movable joint is fixedly connected to the side of the chip positioning clamping plate (28); the bottom surface of the arc-shaped connecting plate (212) is fixed to the surface of the fixed part of the rotating cylinder (21); a second elastic damper mounting plate (213) is fixedly connected to one side of the surface of the arc-shaped connecting plate (212); the second elastic damper mounting plate (213) has an internal threaded hole threadedly connected to the second elastic damper (214); the other side of the surface of the arc-shaped connecting plate (212) is fixedly connected to the first elastic damper mounting plate (215); the first elastic damper (216) is threadedly connected to the internal threaded hole of the first elastic damper mounting plate (215).

4. The fully automatic soldering equipment according to claim 2, characterized in that: The chip positioning base plate (26) comprises a chip positioning groove (261), a vacuum suction hole (262) and a guide shaft connecting threaded hole (263); the surface of the chip positioning base plate (26) is provided with chip positioning grooves (261) arranged evenly at intervals; a vacuum suction hole (262) is provided in the middle of the bottom surface of the chip positioning groove (261); guide shaft connecting threaded holes (263) are provided on both sides of the side of the chip positioning base plate (26); the chip positioning clamping plate (28) comprises a chip positioning vertical groove (281) and a linear bearing mounting hole (282); an array of chip positioning vertical grooves (281) are provided on the side of the chip positioning clamping plate (28); and arrays of linear bearing mounting holes (282) are provided at both ends of the side of the chip positioning clamping plate (28).

5. The fully automatic soldering equipment according to claim 1, characterized in that: The feeding conveyor belt component (3) comprises a feeding conveyor belt assembly (31), an L-shaped fixing plate (32), a guide plate (33) and a limit plate (34); the two side surfaces of the feeding conveyor belt assembly (31) are fixedly connected to the L-shaped fixing plate (32); the bottom surface of the L-shaped fixing plate (32) is fixed to the surface of the large bottom plate (1); the upper surface of the feeding conveyor belt assembly (31) is fixedly connected to the guide plate (33); one end of the guide plate (33) is provided with a limit plate (34) symmetrically fixed to the surface of the feeding conveyor belt assembly (31); a guide transverse groove (331) is provided in the middle of the bottom surface of the guide plate (33); one end of the guide plate (33) is provided with a guide horn An opening (332); an array of waist-shaped countersunk holes (333) are provided on the surfaces of the guide plates (33) on both sides of the guide bell mouth (332); the limiting plate (34) comprises an L-shaped notch (341), a circular avoidance hole (342), a sensor mounting hole (343), a sensor fixing hole (344) and a guiding notch (345); an L-shaped notch (341) is provided on the surface of one end of the limiting plate (34), and a guiding notch (345) is provided on the surface of the other end; a sensor mounting hole (343) is provided on the side of the limiting plate (34); and a sensor fixing hole (344) penetrating the sensor mounting hole (343) is provided on the surface of the limiting plate (34).

6. The fully automatic soldering equipment according to claim 1, characterized in that: The material loading and transporting component (5) comprises a module mounting and fixing frame (51), a material loading and transporting module (52), a material loading and transporting motor (53), an L-shaped connecting plate (54), a material loading and transporting cylinder (55), a vertical linear rail (56), a connecting plate (57), a material loading and transporting vacuum suction mounting cylinder (58) and a material loading and transporting vacuum suction (59); the bottom surface of the module mounting and fixing frame (51) is fixed to the surface of the large bottom plate (1); the upper side surface of the module mounting and fixing frame (51) is fixedly connected to the material loading and transporting module (52); one end of the material loading and transporting module (52) is fixedly connected to the material loading and transporting cylinder (55); The material handling motor (53) is provided. The material handling module (52) is slidably connected to the L-shaped connecting plate (54) via a slider. The side of the L-shaped connecting plate (54) is fixedly connected to a material handling cylinder (55). The sliding surface of the material handling cylinder (55) is fixedly connected to the bottom surface of the vertical linear rail (56) via a connecting block. The vertical linear rail (56) is slidably connected to the connecting plate (57) via a small slider. The bottom surface of the connecting plate (57) is fixedly connected to a material handling vacuum suction mounting cylinder (58). The upper surface of the material handling vacuum suction mounting cylinder (58) is threadedly connected to a material handling vacuum suction (59).

7. The fully automatic soldering equipment according to claim 1, characterized in that: The workstation switching component (9) comprises a workstation switching module (91), a workstation switching module motor (92), a vertical module fixing component (93), a vertical module (94), a vertical module motor (95), a rotating shaft support frame (96), a rotating shaft motor (97) and a rotating shaft plate (98); the bottom surface of the workstation switching module (91) is fixed to the surface of the large bottom plate (1); the end of the workstation switching module (91) is fixedly connected to the workstation switching module motor (92); the workstation switching module ( 91) is slidably connected to the vertical module fixing component (93) through a slider; the vertical module fixing component (93) is fixedly connected to the side of the vertical module (94); the end of the vertical module (94) is fixedly connected to the vertical module motor (95); the vertical module (94) is slidably connected to the rotating shaft support frame (96) through the slider; one end of the rotating shaft support frame (96) is fixedly connected to the rotating shaft motor (97); the rotating shaft plate (98) is rotatably connected to the rotating shaft support frame (96) through a bearing.

8. The fully automatic soldering equipment according to claim 7, characterized in that: The station switching component (9) further comprises a chip limiting plate (99), a first vacuum suction (910), a titanium rod mounting plate (911) and a titanium rod (912); the first vacuum suction (910) is connected to the side of the rotating shaft plate (98) by a threaded array; the chip limiting plate (99) is fixedly connected to the other side of the rotating shaft plate (98); the end surface of the rotating shaft plate (98) is fixedly connected to the titanium rod mounting plate (911); the titanium rod (912) is clamped in the middle of the titanium rod mounting plate (911); a circular protrusion (981) located on the same axis as the first vacuum suction (910) is provided on the side of the rotating shaft plate (98); a second vacuum suction hole (982) is provided in the middle of the surface of the circular protrusion (981); and an array of square through grooves (991) are provided on the chip limiting plate (99) on one side of the circular protrusion (981).

9. The fully automatic soldering equipment according to claim 1, characterized in that: The flux component (4) comprises a flux slot mounting base (41), a flux slot (42), a flux lifting cylinder (43), a cylinder connecting plate (44), an intermediate plate (45), a flux mounting plate (46), a blowing assembly mounting base (47), a blowing plate (48), a quick connector (49) and a heating rod mounting hole (410); the bottom surface of the flux slot mounting base (41) is fixed to the surface of the large base plate (1); the flux slot (42) is fixedly connected to the upper surface of the flux slot mounting base (41); the heating rod mounting hole (410) is provided on the side surface of the bottom of the flux slot (42); a flux lifting cylinder (410) is fixed to the surface of the flux slot mounting base (41) on one side of the end of the flux slot (42); 3); the end of the telescopic shaft of the flux lifting cylinder (43) is fixedly connected to a cylinder connecting plate (44); the lower surface of the end of the cylinder connecting plate (44) is fixedly connected to an intermediate plate (45); the bottom surface of the intermediate plate (45) is fixedly connected to a flux mounting plate (46); the two sides of the flux slot mounting base (41) are symmetrically provided with a blowing assembly mounting base (47) fixed to the surface of the large bottom plate (1); the side of the blowing assembly mounting base (47) is rotatably connected to a blowing plate (48) through a pin shaft; the surface of the blowing plate (48) is threadedly connected to a quick connector (49); the surface of the flux mounting plate (46) is provided with an array of flux mounting grooves (461); the middle of the flux mounting plate (46) is provided with an array of square through holes (462).

Images