Plastic surface selective copper plating control system and method based on laser induction

Abstract

The invention relates to a plastic surface selective copper plating control system and method based on laser induction, and relates to the technical field of plastic copper plating, and the method comprises the following steps: S1, setting a working procedure parameter highest threshold value and a working procedure parameter lowest threshold value; s2, inputting a workpiece in an upstream process; s3, the operation state of the machining line is detected; s4, machining conditions of the machining line are detected; s5, the workpiece enters a machining line to be machined; and S6, the machining line outputs the workpiece, and the workpiece enters a downstream process. The plastic surface selective copper plating device has the effects of improving the plastic surface selective copper plating quality and improving the plastic surface selective copper plating efficiency.

Description

Technical Field

[0001] The invention relates to the technical field of plastic copper plating, and in particular to a plastic surface selective copper plating control system and method based on laser induction. Background Art

[0002] The technology of coating a metal layer on the plastic surface to form a path for conducting electrical signals has been widely used in many fields such as automobiles, industry, computers and communications. In the manufacturing process of these plastic products, selectively forming a metal layer on the plastic surface is a crucial step.

[0003] A Chinese patent with authorization announcement number CN101634018A in the related art provides a selective chemical plating method for a plastic substrate, which includes the following steps: first, pre-treating the substrate; then coating a nano-metal slurry on the pre-treated substrate, and drying the nano-metal slurry after coating on the substrate; then laser etching the obtained substrate, and the laser-etched substrate is sequentially cleaned and chemically plated to finally obtain a plated part.

[0004] In the process of realizing the present application, the inventors found that there are at least the following problems in the technology: in the process of selective chemical plating of plastic substrates, in order to reduce the influence of solution components on the quality of selective copper plating on the plastic surface, the staff is required to periodically suspend the plastic surface selective copper plating production line so as to replenish the solution in time to adjust the solution components. Such frequent interruptions make it difficult to improve the efficiency of selective copper plating on the plastic surface. Summary of the invention

[0005] In order to improve the quality and efficiency of selective copper plating on plastic surfaces, the present application provides a control system and method for selective copper plating on plastic surfaces based on laser induction.

[0006] The present application provides a method for controlling selective copper plating on a plastic surface based on laser induction, which adopts the following technical solution: A method for controlling selective copper plating on a plastic surface based on laser induction comprises the following steps: S1. Setting the highest threshold value and the lowest threshold value of process parameters; S2, upstream process inputs workpiece; S3, detect the operating status of the processing line; S4, check the processing conditions of the processing line; S5, the workpiece enters the processing line for processing; S6. The processing line outputs the workpiece, and the workpiece enters the downstream process.

[0007] By adopting the above technical solution, two parallel processing lines are set up for each process. When one of the processing lines is used for normal processing of the workpiece, the other processing line is debugged and optimized. The two processing lines are used as a backup. When the staff intervenes in one of the processing lines to perform maintenance operations such as fluid replenishment and adjustment, the other processing line takes over the workpiece processing task, so that the workpiece can be processed continuously and the efficiency of selective copper plating on the plastic surface is improved. When the workpiece enters the process processing, the operating status of the processing line is first detected, and the processing conditions of the processing line are detected according to the operating status of the processing line. The processing line that meets the requirements is selected to process the workpiece. At the same time, the staff debugs the other processing line. The alternating use and debugging of the two processing lines not only facilitates the staff to maintain the production line, but also reduces production interruptions. While improving the quality of selective copper plating on the plastic surface, the efficiency of selective copper plating on the plastic surface is also improved.

[0008] Preferably, step S5 comprises the following steps: S51, the workpiece enters the first production line for processing, the second production line is debugged, and step S6 is performed; S52, the workpiece enters the second production line for processing, the first production line is debugged, and step S6 is performed; S53, an error is reported, and the first and second production lines are shut down.

[0009] By adopting the above technical solution, the production mode of each process is divided into three types. When an error occurs, the first production line and the second production line are shut down, and the staff intervenes to troubleshoot the problem, thereby improving the stability of the operation of the plastic surface selective copper plating production line.

[0010] Preferably, step S4 comprises the following steps: S41, if the first production line meets the processing conditions, proceed to step S51; if the first production line does not meet the processing conditions, proceed to step S42; S42, if the second production line meets the processing conditions, proceed to step S52; if the second production line does not meet the processing conditions, proceed to step S53; S43, if the second production line meets the processing conditions, proceed to step S52; if the second production line does not meet the processing conditions, proceed to step S44; S44. If the first production line meets the processing conditions, proceed to step S51; if the first production line does not meet the processing conditions, proceed to step S53.

[0011] By adopting the above technical solution, when the second production line is not running and the first production line meets the processing conditions, the workpiece enters the first production line for processing; if the first production line does not meet the processing conditions and the second production line meets the processing conditions, the workpiece enters the second production line for processing; when both the first production line and the second production line do not meet the processing conditions, an error is reported; when the second production line is running and the second production line meets the processing conditions, the workpiece enters the second production line for processing; if the second production line does not meet the processing conditions and the first production line meets the processing conditions, the workpiece enters the first production line for processing; when both the first production line and the second production line do not meet the processing conditions, an error is reported.

[0012] Preferably, the step S3 includes the following steps: if the second production line is not running, proceed to step S41; if the second production line is running, proceed to step S43.

[0013] By adopting the above technical solution, when both the first production line and the second production line are not in operation, the workpiece has priority to enter the first production line; when the first production line is in operation and the second production line is not in operation, the workpiece has priority to enter the first production line; when the first production line is not in operation and the second production line is in operation, the workpiece has priority to enter the second production line; when both the first production line and the second production line are in operation, the workpiece has priority to enter the second production line.

[0014] Preferably, the step S41 includes the following steps: if the process parameters of the first processing line are not lower than the maximum threshold value of the process parameters, the first processing line does not meet the processing conditions, and step S42 is performed; if the process parameters of the first processing line are not higher than the minimum threshold value of the process parameters, the first processing line does not meet the processing conditions, and step S42 is performed; if the process parameters of the first processing line are lower than the maximum threshold value of the process parameters, and the process parameters of the first processing line are higher than the minimum threshold value of the process parameters, the first processing line meets the processing conditions, and step S51 is performed.

[0015] By adopting the above technical solution, by comparing the process parameters of the first processing line with the maximum process parameter threshold and the minimum process parameter threshold, it is determined whether the first processing line meets the processing conditions.

[0016] Preferably, the step S42 includes the following steps: if the process parameters of the second processing line are not lower than the maximum threshold value of the process parameters, the second processing line does not meet the processing conditions, and step S53 is performed; if the process parameters of the second processing line are not higher than the minimum threshold value of the process parameters, the second processing line does not meet the processing conditions, and step S53 is performed; if the process parameters of the second processing line are lower than the maximum threshold value of the process parameters, and the process parameters of the second processing line are higher than the minimum threshold value of the process parameters, the second processing line meets the processing conditions, and step S52 is performed.

[0017] By adopting the above technical solution, the process parameters of the second processing line are compared with the maximum process parameter threshold and the minimum process parameter threshold respectively, so as to determine whether the second processing line meets the processing conditions.

[0018] Preferably, the step S43 includes the following steps: if the process parameters of the second processing line are not lower than the maximum threshold value of the process parameters, the second processing line does not meet the processing conditions, and step S44 is performed; if the process parameters of the second processing line are not higher than the minimum threshold value of the process parameters, the second processing line does not meet the processing conditions, and step S44 is performed; if the process parameters of the second processing line are lower than the maximum threshold value of the process parameters, and the process parameters of the second processing line are higher than the minimum threshold value of the process parameters, the second processing line meets the processing conditions, and step S52 is performed.

[0019] By adopting the above technical solution, the process parameters of the second processing line are compared with the maximum process parameter threshold and the minimum process parameter threshold respectively, so as to determine whether the second processing line meets the processing conditions.

[0020] Preferably, the step S44 includes the following steps: if the process parameters of the first processing line are not lower than the maximum threshold value of the process parameters, the first processing line does not meet the processing conditions, and step S53 is performed; if the process parameters of the first processing line are not higher than the minimum threshold value of the process parameters, the first processing line does not meet the processing conditions, and step S53 is performed; if the process parameters of the first processing line are lower than the maximum threshold value of the process parameters, and the process parameters of the first processing line are higher than the minimum threshold value of the process parameters, the first processing line meets the processing conditions, and step S51 is performed.

[0021] By adopting the above technical solution, by comparing the process parameters of the first processing line with the maximum process parameter threshold and the minimum process parameter threshold respectively, it is determined whether the first processing line meets the processing conditions.

[0022] The present application provides a laser-induced plastic surface selective copper plating control system using the following technical solutions: A plastic surface selective copper plating control system based on laser induction comprises a pre-treatment module, a coating module, a drying module, a laser etching module, a cleaning module and a chemical plating module, wherein the pre-treatment module comprises a first pre-treatment submodule and a second pre-treatment submodule, the coating module comprises a first coating submodule and a second coating submodule, the drying module comprises a first drying submodule and a second drying submodule, the laser etching module comprises a first etching submodule and a second etching submodule, the cleaning module comprises a first cleaning submodule and a second cleaning submodule, and the chemical plating module comprises a first copper plating submodule and a second copper plating submodule.

[0023] By adopting the above technical scheme, the first pre-treatment submodule corresponds to controlling the first pre-treatment processing line, the second pre-treatment submodule corresponds to controlling the second pre-treatment processing line, the first coating submodule corresponds to controlling the first coating processing line, the second coating submodule corresponds to controlling the second coating processing line, the first drying submodule corresponds to controlling the first drying processing line, the second drying submodule corresponds to controlling the second drying processing line, the first etching submodule corresponds to controlling the first laser etching processing line, the second etching submodule corresponds to controlling the second laser etching processing line, the first cleaning submodule corresponds to controlling the first cleaning processing line, the second cleaning submodule corresponds to controlling the second cleaning processing line, the first copper plating submodule corresponds to controlling the first chemical plating processing line, and the second copper plating submodule corresponds to controlling the second chemical plating processing line.

[0024] In summary, the present application includes at least one of the following beneficial technical effects: 1. When the workpiece enters the processing process, select a processing line that meets the requirements to process the workpiece, and the other processing line is debugged. The alternating use and debugging of the two processing lines not only facilitates the maintenance of the production line, but also reduces production interruptions. While improving the quality of selective copper plating on the plastic surface, it also improves the efficiency of selective copper plating on the plastic surface; 2. Set the priority of processing line selection according to the operating status of the processing line, reduce the energy consumption of starting and stopping the processing line, shorten the switching time of the processing line, and improve the processing efficiency of the workpiece; 3. Set up two parallel processing lines for each process. When one processing line is used for normal processing of the workpiece, the other processing line is debugged and optimized. The two processing lines are used as a backup to enable continuous processing of the workpiece and improve the efficiency of selective copper plating on the plastic surface. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1 It is a flow chart of a method for controlling selective copper plating on a plastic surface based on laser induction in an embodiment of the present application.

[0026] Figure 2 This is a flow chart showing the priority selection of the first processing line in an embodiment of the present application.

[0027] Figure 3 This is a flow chart showing the preferred selection of the second processing line in an embodiment of the present application.

[0028] Figure 4 It is a schematic diagram of a plastic surface selective copper plating control system based on laser induction in an embodiment of the present application.

[0029] Explanation of the accompanying drawings: 1. Pretreatment module; 11. Pretreatment first submodule; 12. Pretreatment second submodule; 2. Coating module; 21. Coating first submodule; 22. Coating second submodule; 3. Drying module; 31. Drying first submodule; 32. Drying second submodule; 4. Laser etching module; 41. Etching first submodule; 42. Etching second submodule; 5. Cleaning module; 51. Cleaning first submodule; 52. Cleaning second submodule; 6. Chemical plating module; 61. Copper plating first submodule; 62. Copper plating second submodule. DETAILED DESCRIPTION

[0030] The following is combined with Figure 1-4 This application is described in further detail.

[0031] The present application embodiment discloses a laser-induced selective copper plating control system for plastic surfaces. Figure 4 , including a pre-treatment module 1, a coating module 2, a drying module 3, a laser etching module 4, a cleaning module 5 and a chemical plating module 6. The pre-treatment module 1 includes a first pre-treatment submodule 11 and a second pre-treatment submodule 12, the first pre-treatment submodule 11 corresponds to controlling the first pre-treatment processing line, and the second pre-treatment submodule 12 corresponds to controlling the second pre-treatment processing line. The coating module 2 includes a first coating submodule 21 and a second coating submodule 22, the first coating submodule 21 corresponds to controlling the first coating processing line, and the second coating submodule 22 corresponds to controlling the second coating processing line. The drying module 3 includes a first drying submodule 31 and a second drying submodule 32, the first drying submodule 31 corresponds to controlling the first drying processing line, and the second drying submodule 32 corresponds to controlling the second drying processing line. The laser etching module 4 includes a first etching submodule 41 and a second etching submodule 42, the first etching submodule 41 corresponds to controlling the first laser etching processing line, and the second etching submodule 42 corresponds to controlling the second laser etching processing line. The cleaning module 5 includes a first cleaning submodule 51 and a second cleaning submodule 52. The first cleaning submodule 51 controls the cleaning of the first processing line, and the second cleaning submodule 52 controls the cleaning of the second processing line. The chemical plating module 6 includes a first copper plating submodule 61 and a second copper plating submodule 62. The first copper plating submodule 61 controls the first chemical plating processing line, and the second copper plating submodule 62 controls the second chemical plating processing line.

[0032] The present application embodiment discloses a method for controlling selective copper plating on a plastic surface based on laser induction. Figures 1 to 3 , including the following steps: S1. Set the highest threshold value and the lowest threshold value of the process parameters.

[0033] S2. The upstream process inputs the workpiece.

[0034] S3, detecting the operating status of the processing line. If the second production line is not running, proceed to step S41; if the second production line is running, proceed to step S43.

[0035] S4, detecting the processing conditions of the processing line. Step S4 includes the following steps.

[0036] S41. If the process parameters of the first processing line are not lower than the maximum threshold value of the process parameters, the first processing line does not meet the processing conditions, and step S42 is performed; if the process parameters of the first processing line are not higher than the minimum threshold value of the process parameters, the first processing line does not meet the processing conditions, and step S42 is performed; if the process parameters of the first processing line are lower than the maximum threshold value of the process parameters, and the process parameters of the first processing line are higher than the minimum threshold value of the process parameters, the first processing line meets the processing conditions, and step S51 is performed.

[0037] S42. If the process parameters of the second processing line are not lower than the maximum threshold value of the process parameters, the second processing line does not meet the processing conditions, and step S53 is performed; if the process parameters of the second processing line are not higher than the minimum threshold value of the process parameters, the second processing line does not meet the processing conditions, and step S53 is performed; if the process parameters of the second processing line are lower than the maximum threshold value of the process parameters, and the process parameters of the second processing line are higher than the minimum threshold value of the process parameters, the second processing line meets the processing conditions, and step S52 is performed.

[0038] S43. If the process parameters of the second processing line are not lower than the maximum threshold value of the process parameters, the second processing line does not meet the processing conditions, and step S44 is performed; if the process parameters of the second processing line are not higher than the minimum threshold value of the process parameters, the second processing line does not meet the processing conditions, and step S44 is performed; if the process parameters of the second processing line are lower than the maximum threshold value of the process parameters, and the process parameters of the second processing line are higher than the minimum threshold value of the process parameters, the second processing line meets the processing conditions, and step S52 is performed.

[0039] S44. If the process parameters of the first processing line are not lower than the maximum threshold value of the process parameters, the first processing line does not meet the processing conditions, and step S53 is performed; if the process parameters of the first processing line are not higher than the minimum threshold value of the process parameters, the first processing line does not meet the processing conditions, and step S53 is performed; if the process parameters of the first processing line are lower than the maximum threshold value of the process parameters, and the process parameters of the first processing line are higher than the minimum threshold value of the process parameters, the first processing line meets the processing conditions, and step S51 is performed.

[0040] S5, the workpiece enters the processing line for processing. Step S5 includes the following steps.

[0041] S51, the workpiece enters the first production line for processing, the second production line is debugged, and step S6 is performed; S52, the workpiece enters the second production line for processing, the first production line is debugged, and step S6 is performed; S53, error reported, the first and second production lines stopped. Staff intervened to troubleshoot the problem, improving the stability of the plastic surface selective copper plating production line.

[0042] S6. The processing line outputs the workpiece, and the workpiece enters the downstream process.

[0043] The implementation principle of a laser-induced selective copper plating control method for plastic surface in the embodiment of the present application is as follows: two parallel processing lines are set for each process, one of which is used for normal processing of the workpiece, and the other is debugged and optimized. The two processing lines are used as a standby and a backup. When the staff intervenes in one of the processing lines for maintenance operations such as fluid replenishment and adjustment, the other processing line takes over the workpiece processing task, so that the workpiece is processed continuously, and the efficiency of selective copper plating on the plastic surface is improved. When both the first production line and the second production line are not in operation, the workpiece is preferentially selected to enter the first production line; when the first production line is in operation and the second production line is not in operation, the workpiece is preferentially selected to enter the first production line; when the first production line is not in operation and the second production line is in operation, the workpiece is preferentially selected to enter the second production line; when the first production line and the second production line are in operation, the workpiece is preferentially selected to enter the second production line. The priority of the processing line selection is set according to the operation status of the processing line, the energy consumption of the processing line start-stop is reduced, the switching time of the processing line is shortened, and the processing efficiency of the workpiece is improved. It is not only convenient for the staff to maintain the production line, but also reduces the situation of production interruption. While improving the quality of selective copper plating on the plastic surface, it also improves the efficiency of selective copper plating on the plastic surface.

[0044] The above are all preferred embodiments of the present application, and the protection scope of the present application is not limited thereto. Therefore, any equivalent changes made according to the structure, shape, and principle of the present application should be included in the protection scope of the present application.

Claims

1. A method for controlling selective copper plating on plastic surface based on laser induction, characterized in that: The following steps are involved: S1. Setting the highest threshold value and the lowest threshold value of process parameters; S2, upstream process inputs workpiece; S3, detect the operating status of the processing line; S4, check the processing conditions of the processing line; S5, the workpiece enters the processing line for processing; S6. The processing line outputs the workpiece, and the workpiece enters the downstream process.

2. The method for controlling selective copper plating on plastic surface based on laser induction according to claim 1, characterized in that: The step S5 comprises the following steps: S51, the workpiece enters the first production line for processing, the second production line is debugged, and step S6 is performed; S52, the workpiece enters the second production line for processing, the first production line is debugged, and step S6 is performed; S53, an error is reported, and the first and second production lines are shut down.

3. The method for controlling selective copper plating on plastic surface based on laser induction according to claim 2, characterized in that: The step S4 comprises the following steps: S41, if the first production line meets the processing conditions, proceed to step S51; if the first production line does not meet the processing conditions, proceed to step S42; S42, if the second production line meets the processing conditions, proceed to step S52; if the second production line does not meet the processing conditions, proceed to step S53; S43, if the second production line meets the processing conditions, proceed to step S52; if the second production line does not meet the processing conditions, proceed to step S44; S44. If the first production line meets the processing conditions, proceed to step S51; if the first production line does not meet the processing conditions, proceed to step S53.

4. The method for controlling selective copper plating on plastic surface based on laser induction according to claim 3, characterized in that: The step S3 includes the following steps: if the second production line is not running, proceed to step S41; if the second production line is running, proceed to step S43.

5. The method for controlling selective copper plating on plastic surface based on laser induction according to claim 3, characterized in that: The step S41 includes the following steps: if the process parameters of the first processing line are not lower than the highest threshold value of the process parameters, the first processing line does not meet the processing conditions, and step S42 is performed; if the process parameters of the first processing line are not higher than the lowest threshold value of the process parameters, the first processing line does not meet the processing conditions, and step S42 is performed; if the process parameters of the first processing line are lower than the highest threshold value of the process parameters, and the process parameters of the first processing line are higher than the lowest threshold value of the process parameters, the first processing line meets the processing conditions, and step S51 is performed.

6. The method for controlling selective copper plating on plastic surface based on laser induction according to claim 3, characterized in that: The step S42 includes the following steps: if the process parameters of the second processing line are not lower than the highest threshold value of the process parameters, the second processing line does not meet the processing conditions, and step S53 is performed; if the process parameters of the second processing line are not higher than the lowest threshold value of the process parameters, the second processing line does not meet the processing conditions, and step S53 is performed; if the process parameters of the second processing line are lower than the highest threshold value of the process parameters, and the process parameters of the second processing line are higher than the lowest threshold value of the process parameters, the second processing line meets the processing conditions, and step S52 is performed.

7. The method for controlling selective copper plating on plastic surface based on laser induction according to claim 3, characterized in that: The step S43 includes the following steps: if the process parameters of the second processing line are not lower than the highest threshold value of the process parameters, the second processing line does not meet the processing conditions, and step S44 is performed; if the process parameters of the second processing line are not higher than the lowest threshold value of the process parameters, the second processing line does not meet the processing conditions, and step S44 is performed; if the process parameters of the second processing line are lower than the highest threshold value of the process parameters, and the process parameters of the second processing line are higher than the lowest threshold value of the process parameters, the second processing line meets the processing conditions, and step S52 is performed.

8. The method for controlling selective copper plating on plastic surface based on laser induction according to claim 3, characterized in that: The step S44 includes the following steps: if the process parameters of the first processing line are not lower than the highest threshold value of the process parameters, the first processing line does not meet the processing conditions, and step S53 is performed; if the process parameters of the first processing line are not higher than the lowest threshold value of the process parameters, the first processing line does not meet the processing conditions, and step S53 is performed; if the process parameters of the first processing line are lower than the highest threshold value of the process parameters, and the process parameters of the first processing line are higher than the lowest threshold value of the process parameters, the first processing line meets the processing conditions, and step S51 is performed.

9. A laser-induced selective copper plating control system for plastic surfaces, characterized in that: The invention comprises a pre-treatment module, a coating module, a drying module, a laser etching module, a cleaning module and a chemical plating module, wherein the pre-treatment module comprises a first pre-treatment submodule and a second pre-treatment submodule, the coating module comprises a first coating submodule and a second coating submodule, the drying module comprises a first drying submodule and a second drying submodule, the laser etching module comprises a first etching submodule and a second etching submodule, the cleaning module comprises a first cleaning submodule and a second cleaning submodule, and the chemical plating module comprises a first copper plating submodule and a second copper plating submodule.

Images