Semiconductor butterfly valve and thin film deposition equipment thereof

Abstract

The invention discloses a semiconductor butterfly valve and thin film deposition equipment thereof, the semiconductor butterfly valve comprises a valve body and a valve plate, the valve body is provided with an assembly hole, and the valve plate is rotatably connected in the assembly hole; a plurality of grooves are further formed in the upper plate face and / or the lower plate face of the valve plate. According to the semiconductor butterfly valve and the thin film deposition equipment thereof, the groove or the groove is additionally formed in the valve plate and / or the valve body, and residual powder falling onto the butterfly valve is guided through the groove and the groove, so that the valve plate is prevented from being blocked by the residual powder, the maintenance period of the equipment is prolonged, the maintenance cost is reduced, and the process efficiency is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of thin film deposition equipment, and in particular to a semiconductor butterfly valve and thin film deposition equipment thereof. Background Art

[0002] The butterfly valve used in thin film deposition equipment is different from other butterfly valve equipment. In order to avoid dirt clogging and jamming the valve, a certain gap will be maintained between the valve plate and the valve body, but in order to ensure the pressure control effect, the gap cannot be too large. Generally, the gap between the valve plate and the valve body is between 0.025-0.1mm. During the use of thin film deposition equipment, a large amount of powder (mostly SiO) will be generated through the exhaust end; the residual gas reaction upstream of the butterfly valve adheres to the inner wall of the pipeline, and after accumulation, it is peeled off by the suction force; or the residual gas reacts and adheres to the pressure control butterfly valve, making the valve plate gap smaller and smaller, affecting the pressure control effect, and even the valve plate is stuck. To solve this problem, the existing equipment can only be maintained regularly, the butterfly valve is disassembled, and it is cleaned manually. The operation of stopping the vacuum pump and backfilling the equipment to normal pressure is extremely time-consuming, thus affecting the production efficiency of the equipment. Summary of the invention

[0003] The purpose of the present invention is to overcome the deficiencies of the prior art and provide a semiconductor butterfly valve and a thin film deposition device thereof to solve the technical problems that the prior butterfly valves are prone to residual powder or are prone to getting stuck.

[0004] To achieve the above object, the present invention adopts the following technical solutions:

[0005] In a first aspect, an embodiment of the present invention provides a semiconductor butterfly valve, which includes: a valve body and a valve plate, wherein the valve body is provided with an assembly hole, and the valve plate is rotatably connected to the assembly hole; wherein a plurality of grooves are also provided on the upper plate surface and / or the lower plate surface of the valve plate.

[0006] Wherein, the groove is a through groove extending along the radial direction of the valve plate.

[0007] Wherein, a plurality of the grooves are arranged radially from the center of the valve plate.

[0008] Wherein, the axial cross-section of the groove is triangular, rectangular, circular or wedge-shaped.

[0009] Among them, a plurality of the grooves are distributed at equal central angles with the center of the valve plate as the center.

[0010] Wherein, a plurality of grooves are also arranged on the hole wall of the assembly hole.

[0011] Wherein, the groove is extended along the axial direction of the assembly hole.

[0012] Wherein, a plurality of the grooves are evenly arranged on the hole wall of the assembly hole.

[0013] Among them, the semiconductor butterfly valve also includes a connecting seat connected to the valve body, a control drive unit connected to the connecting seat, and a rotating shaft is also connected to the valve plate. The rotating shaft passes through the valve body, and the lower end of the rotating shaft is connected to the control drive unit.

[0014] In a second aspect, an embodiment of the present invention provides a thin film deposition device, wherein the thin film deposition device comprises a semiconductor butterfly valve as described in any one of the above.

[0015] The semiconductor butterfly valve and thin film deposition equipment thereof of the present invention add grooves or recesses on the valve plate and / or valve body, and guide the residual powder that falls off the butterfly valve through the grooves and recesses to prevent the residual powder from clogging the valve plate, thereby extending the equipment maintenance cycle, reducing maintenance costs, and improving process efficiency.

[0016] The above description is only an overview of the technical solution of the present invention. In order to more clearly understand the technical means of the present invention, it can be implemented in accordance with the contents of the specification. In order to make the above and other purposes, features and advantages of the present invention more obvious and easy to understand, the following preferred embodiments are specifically cited and described in detail as follows. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] Figure 1 and Figure 2 Schematic diagram of the structure of a semiconductor butterfly valve from different viewing angles according to an embodiment of the present invention.

[0018] Figure 3 It is a schematic diagram of the side structure of a semiconductor butterfly valve according to an embodiment of the present invention.

[0019] Figure 4 for Figure 3 AA section view is shown.

[0020] Figure 5 and Figure 6 Schematic diagram of the structure of the valve body, valve plate and connecting seat of the semiconductor butterfly valve according to the embodiment of the present invention from different perspectives.

[0021] Figure 7 Schematic diagram of the valve plate structure of a semiconductor butterfly valve according to an embodiment of the present invention.

[0022] Figure 8 and Fig. 9 Schematic diagram of the valve body structure of a semiconductor butterfly valve according to an embodiment of the present invention.

[0023] Description of reference numerals:

[0024] Semiconductor butterfly valve 100, valve body 1, annular body 10, assembly hole 101, groove 11, connection hole 12, through hole 13, valve plate 2, circular plate body 20, groove 21, rotating shaft 3, connecting seat 4, control drive unit 5, driver 51. DETAILED DESCRIPTION

[0025] In order to make the purpose, technical solutions and advantages of the present invention more clearly understood, the present invention is further described in detail below in conjunction with the accompanying drawings and specific implementation methods.

[0026] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative work are within the scope of protection of the present invention.

[0027] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships described in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as limiting the present invention.

[0028] In addition, the terms "first" and "second" are used for descriptive purposes only and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features. Therefore, the features defined as "first" and "second" may explicitly or implicitly include one or more of the features. In the description of the present invention, the meaning of "plurality" is two or more, unless otherwise clearly and specifically defined.

[0029] In the present invention, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", "fixed" and the like should be understood in a broad sense, for example, it can be connected, detachably connected, or integrated; it can be mechanically connected or electrically connected; it can be directly connected or indirectly connected through an intermediate medium, it can be the internal connection of two elements or the interaction relationship between two elements. For those skilled in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] In the present invention, unless otherwise clearly specified and limited, a first feature being "above" or "below" a second feature may include that the first and second features are in direct contact, or may include that the first and second features are not in direct contact but are in contact through another feature between them. Moreover, a first feature being "above", "above" and "above" a second feature includes that the first feature is directly above and obliquely above the second feature, or simply indicates that the first feature is higher in level than the second feature. A first feature being "below", "below" and "below" a second feature includes that the first feature is directly below and obliquely below the second feature, or simply indicates that the first feature is lower in level than the second feature.

[0031] In the description of this specification, the description with reference to the terms "one embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials or characteristics described in conjunction with the embodiment or example are included in at least one embodiment or example of the present invention. In this specification, the schematic representation of the above terms should not be understood as necessarily referring to the same embodiment or example. Moreover, the specific features, structures, materials or characteristics described may be combined in any one or more embodiments or examples in a suitable manner.

[0032] The butterfly valve used in thin film deposition equipment is different from other butterfly valve equipment. In order to avoid dirt clogging and jamming the valve, a certain gap will be maintained between the valve plate and the valve body, but in order to ensure the pressure control effect, the gap cannot be too large. Generally, the gap between the valve plate and the valve body is between 0.025-0.1mm. During the use of thin film deposition equipment, a large amount of powder (mostly SiO) will be generated through the exhaust end; the residual gas reaction upstream of the butterfly valve adheres to the inner wall of the pipeline, and after accumulation, it is peeled off by the suction force; or the residual gas reacts and adheres to the pressure control butterfly valve, making the valve plate gap smaller and smaller, affecting the pressure control effect, and even the valve plate is stuck. To solve this problem, the existing equipment can only be maintained regularly, the butterfly valve is disassembled, and manually cleaned. The need to stop the vacuum pump and backfill the equipment to normal pressure is extremely time-consuming, affecting the production efficiency of the equipment. In order to solve the above problems, the present embodiment discloses a semiconductor butterfly valve 100.

[0033] See also Figures 1 to 9 In this embodiment, a semiconductor butterfly valve 100 is disclosed, which is applied to a semiconductor thin film deposition device. The semiconductor butterfly valve 100 includes: a valve body 1 and a valve plate 2. The valve body 1 is provided with an assembly hole 101, and the valve plate 2 is rotatably connected to the assembly hole 101; wherein, a plurality of grooves 21 are further provided on the upper plate surface and / or the lower plate surface of the valve plate 2. The valve plate 2 rotates relative to the valve body 1, thereby changing the opening of the channel of the butterfly valve, thereby adjusting the flow rate of the fluid.

[0034] In this embodiment, in order to prevent process powder from accumulating on the butterfly valve and causing blockage of the butterfly valve, a groove 21 is provided on one or both sides of the valve plate 2, and the powder is guided into the channel of the butterfly valve through the groove 21. On the one hand, the groove 21 can increase the amount of accumulated powder on the valve plate 2. On the other hand, the groove 21 can also direct the drainage of the accumulated powder so that it can be discharged together with the fluid controlled by the butterfly valve. This can significantly extend the maintenance cycle of the butterfly valve, thereby reducing maintenance costs and improving process efficiency.

[0035] Please refer again Figure 6 and Figure 7 The valve plate 2 includes a circular plate body 20, and the groove 21 is formed on the plate surface of the circular plate body 20. The groove 21 is a through groove extending along the radial direction of the valve plate 2. It is understandable that in other embodiments, the groove 21 may not pass through the through groove in the center of the valve plate 2. The purpose is to guide the powder accumulated on the surface of the valve plate 2 to prevent excessive accumulation from causing blockage between the valve plate 2 and the valve body 1, or even jamming.

[0036] In this embodiment, a plurality of grooves 21 are radially arranged from the center of the valve plate 2. Figure 7 As shown, a plurality of grooves 21 passing through the center of the valve plate 2 all intersect at the center of the circle.

[0037] The axial cross section of the groove 21 is triangular, rectangular, circular or wedge-shaped. It is understandable that in other embodiments, the axial cross section of the groove 21 can also be any other shape, and is not limited to the shape of this embodiment.

[0038] The groove 21 is configured to have a gradually increasing notch from the center of the circle to the edge of the valve plate 2, thereby reducing resistance to the powder and allowing it to flow more smoothly into the butterfly valve channel. The groove 21 is a straight groove in the length direction.

[0039] Furthermore, the grooves 21 are distributed at equal central angles with the center of the valve plate 2 as the center. Since the direction of powder accumulation on the surface of the valve plate 2 is uncertain, the grooves 21 are evenly opened on the surface of the valve plate 2 to better guide the powder flying from various places.

[0040] The groove 21 can be provided on only one of the surfaces of the valve plate 2, or on both surfaces of the valve plate 2. When the groove 21 is provided on both surfaces of the valve plate 2, the valve plate 2 of the butterfly valve can control the flow of the fluid in two opposite directions, that is, the butterfly valve can control the fluid in both positive and negative directions. At this time, the rotation direction of the valve plate 2 can be adjusted to the reverse direction, and the groove 21 on the side corresponding to the flow direction of the fluid can guide the accumulated powder.

[0041] Please refer again Figures 5 to 9 The valve body 1 includes an annular body 10, the assembly hole 101 is a through hole in the middle of the annular body 10, and a plurality of grooves 11 are provided on the hole wall of the assembly hole 101. The grooves 11 can cooperate with the grooves 21 on the valve plate 2 to improve the flow of powder and reduce the period of powder accumulation.

[0042] In this embodiment, the necessary valve body gap of 0.025-0.1 mm is still retained between the valve plate 2 and the assembly hole 101 of the valve body 1, and a groove 11 extending in a direction roughly the same as the fluid flow direction is provided on the hole wall of the assembly hole 101, which can reduce the risk of blockage or jamming of the valve plate 2 and the valve body 1 in the gap. At the same time, in cooperation with the groove 21 on the valve plate 2, the circulation of powder can be further improved, thereby extending the maintenance cycle of the butterfly valve.

[0043] It should be noted that the semiconductor butterfly valve 100 of this embodiment can also be provided with a groove 11 only on the hole wall of the assembly hole 101 of the valve body 1, and the groove 21 structure is not provided on the valve plate 2. At this time, only the groove 11 structure on the valve body 1 is used to provide a flow channel for the accumulated powder, and the gap may be reduced or avoided to be blocked by the powder.

[0044] In this embodiment, the assembly hole 101 is a cylindrical circular hole, and the groove 11 is extended along the axial direction of the assembly hole 101. That is, the groove 11 is substantially in the same direction as the fluid flow, and at this time, the guiding effect on the powder is the best.

[0045] Furthermore, a plurality of the grooves 11 are evenly formed on the wall of the assembly hole 101. That is, the grooves 11 are formed on the wall of the assembly hole 101 at equal intervals.

[0046] Similarly, the radial cross-section of the groove 11 can be circular, rectangular, trapezoidal or the like.

[0047] like Figure 5 As shown, the valve body 1 of the semiconductor butterfly valve 100 is connected to a fluid delivery pipeline, so the valve body 1 has opposite docking surfaces, and the docking surfaces are also provided with connecting holes 12, so that the valve body 1 is fixedly connected to the flange of the pipeline by screws or the like.

[0048] The semiconductor butterfly valve 100 also includes a connecting seat 4 connected to the valve body 1, and a control drive unit 5 connected to the connecting seat 4. The valve plate 2 is also connected to a rotating shaft 3, which passes through the valve body 1, and the lower end of the rotating shaft 3 is connected to the control drive unit 5.

[0049] The valve body 1 is provided with a through hole 13 , and the rotating shaft 3 passes through the through hole 13 and is fixedly connected to the driver 51 at its rear end.

[0050] The control drive unit 5 includes a controller and a driver 51. The driver 51 includes a rotation power unit such as a motor, and its output shaft is connected to the rotating shaft 3, and is used to control the rotation angle of the valve plate 2 according to the flow control needs, and control the rotation of the valve plate 2 to open or close the butterfly valve. The controller can also accept external control instructions or control the driver 51 according to the internal preset control logic.

[0051] This embodiment further provides a thin film deposition device, which includes the semiconductor butterfly valve 100 as described above. The semiconductor butterfly valve 100 is mainly used to control the on-off and flow opening of the pipeline of the film deposition device.

[0052] The semiconductor butterfly valve and thin film deposition equipment thereof of the present invention add grooves or recesses on the valve plate and / or valve body, and guide the residual powder that falls off the butterfly valve through the grooves and recesses to prevent the residual powder from clogging the valve plate, thereby extending the equipment maintenance cycle, reducing maintenance costs, and improving process efficiency.

[0053] The above examples are only used to further illustrate the technical content of the present invention, so that readers can understand it more easily, but they do not mean that the implementation of the present invention is limited to this. Any technical extension or re-creation made according to the present invention is protected by the present invention. The protection scope of the present invention shall be subject to the claims.

Claims

1. A semiconductor butterfly valve, characterized in that: include: A valve body and a valve plate, wherein the valve body is provided with an assembly hole, and the valve plate is rotatably connected to the assembly hole; wherein a plurality of grooves are also provided on the upper plate surface and / or the lower plate surface of the valve plate.

2. The semiconductor butterfly valve according to claim 1, characterized in that: The groove is a through groove extending along the radial direction of the valve plate.

3. The semiconductor butterfly valve according to claim 2, characterized in that: A plurality of the grooves are radially arranged around the center of the valve plate.

4. The semiconductor butterfly valve according to claim 2, characterized in that: The axial cross section of the groove is triangular, rectangular, circular or wedge-shaped.

5. The semiconductor butterfly valve according to claim 2, characterized in that: The plurality of grooves are distributed at equal central angles with the center of the valve plate as the center.

6. The semiconductor butterfly valve according to any one of claims 1 to 5, characterized in that: A plurality of grooves are also arranged on the hole wall of the assembly hole.

7. The semiconductor butterfly valve according to claim 6, characterized in that: The groove is extended along the axial direction of the assembly hole.

8. The semiconductor butterfly valve according to claim 6, characterized in that: A plurality of the grooves are evenly arranged on the hole wall of the assembly hole.

9. The semiconductor butterfly valve according to claim 6, characterized in that: The semiconductor butterfly valve also includes a connecting seat connected to the valve body, a control drive unit connected to the connecting seat, and a rotating shaft is also connected to the valve plate. The rotating shaft passes through the valve body, and the lower end of the rotating shaft is connected to the control drive unit.

10. A thin film deposition device, characterized in that: The thin film deposition device comprises the semiconductor butterfly valve according to any one of claims 1 to 9.

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