High-frequency piezoelectric array, operation method thereof and noise measurement system
By setting up a preamplifier in the support tube cavity of the high-frequency piezoelectric array and array element lining with shock absorption functions distributed on the outside, the influence of array element leads on the acoustic performance is solved, and a longer measurement distance and higher measurement accuracy are achieved.
Patent Information
- Application Number
- CN202411704312.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-26
- Publication Date
- 2025-03-04
- Estimated Expiration
- 2044-11-26
AI Technical Summary
The array leads of existing high-frequency piezoelectric arrays have a great impact on acoustic performance, which can easily cause circuit noise, reduce measurement distance and accuracy, and at the same time, the signal transmission line blocks the signal and increases signal crosstalk between arrays.
A high-frequency piezoelectric array is designed. By setting up multiple preamplifiers in the cavity of the support tube and distributing the array element lining with shock absorption function on the outside of the support tube, the array element is installed on the inner liner without contacting the outside of the support tube, thereby realizing vibration isolation and electrical isolation between the array element and the support tube.
It effectively weakens electromagnetic radiation interference and vibration conduction interference at the connection end of the array, and improves the measurement distance and measurement accuracy of high-frequency piezoelectric arrays.
Smart Images

Figure CN119555201A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the field of acoustic and vibration measurement, and in particular to a high-frequency piezoelectric array, an operating method thereof, and a noise measurement system. Background Art
[0002] Underwater noise measurement technology captures underwater sound wave signals through special equipment such as hydrophone arrays and converts them into electrical signals for analysis. This technology can optimize ship design, reduce noise pollution, and protect the marine ecological environment. It has broad application prospects.
[0003] The high-frequency piezoelectric array in sonar is a device that receives 10kHz to 100kHz sound waves. It has the characteristics of a large number of array elements, small array element spacing, and long array element leads. Common high-frequency piezoelectric arrays include two array structures: oil-filled and solid-state.
[0004] In the related art, high-frequency piezoelectric arrays use serial arrangement of array elements, and the array element signal lines are transmitted over long distances, and then amplified and collected in a centralized manner. However, due to the small static capacitance of a single array element, the array element leads have a greater impact on the acoustic performance, which can easily cause the output signal-to-noise ratio to decrease, cause circuit noise, and reduce the measurement distance of the array. In addition, since the signal transmission line passes through the surface of the array element, it blocks the signal, and the array element is affected by the electromagnetic radiation of the transmission line, which aggravates the signal crosstalk between array elements and reduces the array measurement accuracy. Summary of the invention
[0005] The present invention provides a high-frequency piezoelectric array, an operating method thereof and a noise measurement system, so as to solve the defects that the array element leads of the high-frequency piezoelectric array designed in the prior art have a great influence on the acoustic performance, are easy to cause circuit noise, and also block the signal, aggravate the signal crosstalk between the array elements, and lead to the reduction of the measurement distance and measurement accuracy of the array, thereby improving the measurement distance and measurement accuracy of the high-frequency piezoelectric array.
[0006] The present invention provides a high-frequency piezoelectric array, comprising: A support tube, wherein a signal line is arranged in a cavity of the support tube, a portion of the signal line extends out of the cavity, and the signal line is used to transmit different types of signals; A plurality of preamplifiers, the plurality of preamplifiers being disposed in the cavity of the support tube, the plurality of preamplifiers being used to receive array element signals and amplify the array element signals; A plurality of array element linings, wherein the plurality of array element linings are distributed on the outer side of the support tube; each array element lining is made of insulating material, and each array element lining has a shock absorbing function; A plurality of array elements are installed on the plurality of array element liners and are not in contact with the outer side of the support tube; different array elements are electrically connected to different preamplifiers; and the plurality of array elements are used to generate the array element signals.
[0007] According to a high-frequency piezoelectric array provided by the present invention, a plurality of openings are provided on the support tube, a lead of each array element is electrically connected to a target preamplifier through one of the plurality of openings, and the leads of each array element are isolated from each other; The target preamplifier is a preamplifier with the shortest distance from the one opening among the multiple preamplifiers.
[0008] According to a high-frequency piezoelectric array provided by the present invention, the plurality of array elements are installed on the inner liners of the plurality of branch array elements at equal intervals, and the operating frequency band of each array element is between 5kHz and 35kHz.
[0009] According to a high-frequency piezoelectric array provided by the present invention, the high-frequency piezoelectric array further includes: The protective cover is made of polyurethane material and is potted on the outside of the support tube.
[0010] According to a high-frequency piezoelectric array provided by the present invention, the support tube is made of aluminum alloy material.
[0011] The present invention also provides a noise measurement system, comprising: High frequency piezoelectric array; The electrical signal processing device is fixedly sealed to the high-frequency piezoelectric array through a metal flange; the electrical signal processing device is used to convert different types of signals transmitted by the high-frequency piezoelectric array into electrical signals and perform noise measurement based on the electrical signals.
[0012] The present invention also provides an operation method of a high-frequency piezoelectric array, comprising: An array element signal is generated by a plurality of array elements; wherein the plurality of array elements are mounted on a plurality of array element liners and do not contact the outer side of the support tube; the plurality of array element liners are distributed on the outer side of the support tube, and each array element liner has a shock absorbing function; The array element signal is amplified by a plurality of preamplifiers to obtain an amplified signal, and the amplified signal is transmitted through a signal line in the cavity of a support tube; wherein different array elements are electrically connected to different preamplifiers; a portion of the signal line extends out of the cavity; and the plurality of preamplifiers are disposed in the cavity of the support tube.
[0013] The present invention also provides an electronic device, comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein when the processor executes the computer program, an operating method of the high-frequency piezoelectric array as described above is implemented.
[0014] The present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, and when the computer program is executed by a processor, the operating method of the high-frequency piezoelectric array as described in any one of the above is implemented.
[0015] The present invention also provides a computer program product, including a computer program, wherein when the computer program is executed by a processor, the computer program implements any of the above-mentioned methods for operating the high-frequency piezoelectric array.
[0016] The high-frequency piezoelectric array, its operating method and noise measurement system provided by the present invention realize vibration isolation and electrical isolation between the array elements and the support tube, and reduce electromagnetic radiation interference and vibration conduction interference at the connection end of the array, by arranging multiple preamplifiers in the cavity of the support tube, distributing multiple array element linings on the outside of the support tube with a shock-absorbing function, and arranging multiple array elements on the array element linings without contacting the outside of the support tube. BRIEF DESCRIPTION OF THE DRAWINGS
[0017] In order to more clearly illustrate the technical solutions in the present invention or the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.
[0018] Figure 1 This is one of the structural schematic diagrams of the high-frequency piezoelectric array provided by the present invention.
[0019] Figure 2 It is a structural schematic diagram of the preamplifier provided by the present invention.
[0020] Figure 3 It is a structural schematic diagram of the array element lining provided by the present invention.
[0021] Figure 4 This is the second structural schematic diagram of the high-frequency piezoelectric array provided by the present invention.
[0022] Figure 5 It is a structural schematic diagram of the support tube provided by the present invention.
[0023] Figure 6 It is a schematic diagram of the structure in which the protective cover provided by the present invention is encapsulated on the outside of the support tube.
[0024] Figure 7It is a structural schematic diagram of the noise measurement system provided by the present invention.
[0025] Figure 8 It is a flow chart of the operation method of the high-frequency piezoelectric array provided by the present invention.
[0026] Fig. 9 It is a structural schematic diagram of the electronic device provided by the present invention.
[0027] Reference numerals: 100: high frequency piezoelectric array; 110: support tube; 120: preamplifier; 130: array element lining; 140: array element; 150: protective cover; 710: Electrical signal processing equipment. DETAILED DESCRIPTION
[0028] In order to make the purpose, technical solution and advantages of the present invention clearer, the technical solution of the present invention will be clearly and completely described below in conjunction with the drawings of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.
[0029] Combine the following Figure 1-Figure 8 Describe the high frequency piezoelectric array and its operation method and noise measurement system of the present invention Figure 1 Schematic diagram of the structure of the high-frequency piezoelectric array provided by the present invention. Figure 1 As shown, the high-frequency piezoelectric array 100 includes: a support tube 110 , a plurality of preamplifiers 120 , a plurality of array element liners 130 and a plurality of array elements 140 .
[0030] A signal line is arranged in the cavity of the support tube 110 , and a part of the signal line extends out of the cavity. The signal line is used to transmit different types of signals.
[0031] In this embodiment, the support tube 110 is made of aluminum alloy material, which can reduce the weight of the high-frequency piezoelectric array and improve the strength and corrosion resistance of the array.
[0032] In this embodiment, the support tube 110 may also be made of materials such as stainless steel, carbon fiber, and titanium alloy to adapt to a variety of different scene applications and requirements.
[0033] In this embodiment, the signal lines in the support tube 110 can be electrically connected to the array element 140 signal transmitting device and the external electronic device respectively by bundling or splitting, so as to transmit the amplified signal to the external electronic device, or transmit other signals sent by the external electronic device to the array element 140 signal transmitting device for corresponding processing.
[0034] In this embodiment, the preamplifier 120 inside the support tube 110 is electrically connected to an external electronic device through a signal line, so that the signal transmission is led out from the inside of the array, and the signal reception of the array element 140 is not blocked.
[0035] In this embodiment, different types of signals include but are not limited to electromagnetic waves, sound waves, and seismic shock waves. In different application fields, the types of signals sent by the high-frequency piezoelectric array to external electronic devices through signal lines are different, which are related to specific application scenarios and requirements.
[0036] For example, for underwater noise measurement signals, the signal line may transmit one or more of acoustic signals, synchronization signals, control signals, calibration signals, data transmission signals, power supply signals, and communication signals.
[0037] The plurality of preamplifiers 120 are disposed in the cavity of the support tube 110 . The plurality of preamplifiers 120 are used to receive signals from the array elements 140 and amplify the signals from the array elements 140 .
[0038] In this embodiment, the preamplifier includes functions such as signal amplification, impedance matching, noise reduction, signal shaping, sensor protection and signal-to-noise ratio improvement. In this embodiment, different preamplifiers 120 can process one or more array element 140 signals.
[0039] In this embodiment, one preamplifier 120 may process only an array element 140 signal generated by one array element 140 , or may simultaneously process array element 140 signals generated by a plurality of different array elements 140 .
[0040] exist Figure 2 In the illustrated embodiment, each preamplifier is designed to be 26 mm in length and 9 mm in width. A plurality of components are mounted on the bottom plate of the preamplifier, and the material of the preamplifier can be set according to user requirements.
[0041] A plurality of array element liners 130 are distributed on the outer side of the support tube 110 ; each array element liner 130 is made of insulating material, and each array element liner 130 has a shock absorbing function.
[0042] In this embodiment, one side of the array element 140 is attached to the outer wall of the support tube 110 , and the other side is in contact with the protective layer of the support tube 110 . An array element 140 can be embedded between every two array elements 140 , and the array element 140 does not directly contact the outer side of the support tube 110 .
[0043] For example, in Figure 3 In the embodiment shown, the array element lining is a combination, enveloping two circular tubes A and an inner circular tube B with different diameters, wherein the height h of the circular tube B is B Smaller than the height h of the round tube A A , the inner diameter of the bottom circle of the round tube B is r B Equal to the outer diameter r of the bottom circle of the circular tube A A , the circular tube B is sleeved on the outside of the circular tube A, that is, the inner wall of the circular tube B is in close contact with the outer wall of the circular tube A; specifically, h B =16mm (millimeter), the distance between the top of circular tube A and the top of inner circular tube B is 5mm, the outer diameter of circular tube B is 39mm, and the inner diameter of circular tube A is 27.5mm.
[0044] In this embodiment, the array element lining can be made of insulating material and has a vibration reduction function, so that the array element is electrically isolated from the support tube, thereby suppressing electromagnetic radiation interference and vibration conduction interference from the support tube.
[0045] The plurality of array elements 140 are mounted on the plurality of array element liners 130 and are not in contact with the outer side of the support tube 110 ; different array elements 140 are electrically connected to different preamplifiers 120 ; and the plurality of array elements 140 are used to generate array element 140 signals.
[0046] exist Figure 4 In the illustrated embodiment, one array element may be embedded between two adjacent array element liners, and the array element does not contact the outer side of the support tube.
[0047] In this embodiment, one preamplifier 120 is connected to only one array element 140 , and is used to perform method processing on an array element 140 signal transmitted by the array element 140 .
[0048] In this embodiment, each array element 140 is used to generate a type of array element 140 signal, and transmit the array element 140 signal to a front-end device electrically connected to the array element 140 for method processing.
[0049] The high-frequency piezoelectric array provided by the present invention achieves vibration isolation and electrical isolation between the array elements and the support tube, and reduces electromagnetic radiation interference and vibration conduction interference at the connection end of the array, by arranging multiple preamplifiers in the cavity of the support tube, distributing multiple array element linings on the outside of the support tube with a shock-absorbing function, and arranging multiple array elements on the array element linings without contacting the outside of the support tube.
[0050] Furthermore, the support tube is provided with a plurality of openings, and the lead of each array element is electrically connected to the target preamplifier through one of the plurality of openings, and the leads of each array element are isolated from each other; wherein the target preamplifier is the preamplifier with the shortest distance from an opening among the plurality of preamplifiers.
[0051] exist Figure 4 In the illustrated embodiment, the preamplifier (corresponding to the preamplifier board) is installed in the support tube, the array element leads are introduced into the tube nearby, the signal leads of each array element are isolated from each other, and the array element leads are connected to the preamplifier board nearby through the openings of the lining and the support tube, thereby maximizing the shortening of the array element lead length, reducing the interference of spatial electromagnetic interference on the leads and the crosstalk of the leads between array elements; after the array element signal is amplified, the output resistance of the amplification circuit is small, the signal is less interfered with during long-distance transmission, and the signal crosstalk between array elements is suppressed; and the amplified signal transmission line is led out from the inside of the support tube, eliminating the shielding of the array element signal by the cable.
[0052] exist Figure 5 In the illustrated embodiment, a plurality of evenly distributed openings are provided on the outer wall of the support tube (without a protective sleeve on the outer side).
[0053] Furthermore, a plurality of array elements are installed at equal intervals on a plurality of branch array element liners, and an operating frequency band of each array element is between 5kHz and 35kHz.
[0054] In this embodiment, the number of array elements on the array element lining can be set according to user needs. For example, the number of array elements can be a multiple of 2, or can also be 2. n times, n is a positive integer greater than 0.
[0055] In this embodiment, a signal conditioning method of amplifying signals generated by array elements with small spacing is adopted, which can reduce the influence of array element leads on acoustic performance.
[0056] exist Figure 1 In the illustrated embodiment, the high-frequency piezoelectric array 100 further includes a protective cover 150 , which is made of polyurethane material and is potted on the outside of the support tube 110 .
[0057] Figure 6 In the illustrated embodiment, the protective cover, the array element and the array element liner are integrally potted, which can achieve high sealing and corrosion resistance, and can increase the service life of the high-frequency piezoelectric array.
[0058] The noise measurement system provided by the present invention is described below. The noise measurement system described below and the high-frequency piezoelectric array described above can be referred to each other.
[0059] Figure 7 Schematic diagram of the noise measurement system provided by the present invention. Figure 7 As shown, the noise measurement system includes: a high-frequency piezoelectric array 100 and an electrical signal processing device 710, wherein the high-frequency piezoelectric array is fixedly sealed to the electrical signal processing device via a metal flange; the electrical signal processing device is used to convert different types of signals transmitted by the high-frequency piezoelectric array into electrical signals, and perform noise measurement based on the electrical signals.
[0060] In this embodiment, the high-frequency piezoelectric array 100 includes: a support tube 110 , a plurality of preamplifiers 120 , a plurality of array element liners 130 , a plurality of array elements 140 and a protective cover 150 .
[0061] In this embodiment, the connection relationship and functions between the support tube 110, the plurality of preamplifiers 120, the plurality of array element liners 130, the plurality of array elements 140 and the protective cover 150 are as described above. Figure 1-Figure 6 The corresponding embodiments are shown in detail, and this implementation will not be repeated here.
[0062] In this embodiment, the electrical signal processing device 710 may be a signal conditioning device, a data acquisition storage device, a data processing software, or other devices.
[0063] In this embodiment, in the noise measurement system, the array element signal is transmitted to the dry-end platform through the signal line. The dry-end platform is mainly used for signal conditioning, signal acquisition, data processing and time synchronization; wherein, the dry-end platform includes a signal conditioning device, a data acquisition storage device, a data processing software, a time synchronization device, a synchronous ranging signal transmitting device and a work cabin and other equipment, and these devices work together to ensure accurate processing and analysis of the signal.
[0064] The noise measurement system provided by the present invention realizes vibration isolation and electrical isolation between the array elements and the support tube, reduces electromagnetic radiation interference and vibration conduction interference at the connection end of the array, and improves the measurement accuracy and efficiency of the noise measurement system by configuring a high-frequency piezoelectric array as follows: multiple preamplifiers are arranged in the cavity of a support tube, multiple array element linings are distributed on the outside of the support tube with a shock-absorbing function, and multiple array elements are arranged on the array element linings without contacting the outside of the support tube.
[0065] The noise measurement system provided by the present invention is described below. The noise measurement system described below and the high-frequency piezoelectric array described above can be referred to each other.
[0066] Figure 8 is a schematic diagram of the operation method of the high-frequency piezoelectric array provided by the present invention, such as Figure 8 As shown, the operation method of the high-frequency piezoelectric array includes the following steps: Step 810: Generate an array element signal through multiple array elements; wherein the multiple array elements are installed on multiple array element liners and do not contact the outer side of the support tube; the multiple array element liners are distributed on the outer side of the support tube, and each array element liner has a shock absorbing function.
[0067] A plurality of array element linings are distributed on the outer side of the support tube; each array element lining is made of insulating material, and each array element lining has a shock absorbing function.
[0068] In this embodiment, one side of the array element is attached to the outer wall of the support tube, and the other side is in contact with the protective layer of the support tube. An array element can be embedded between every two array elements, and the array element does not directly contact the outer side of the support tube.
[0069] In this embodiment, the array element lining can be made of insulating material and has a vibration reduction function, so that the array element is electrically isolated from the support tube, thereby suppressing electromagnetic radiation interference and vibration conduction interference from the support tube.
[0070] Step 820, amplifying the array element signal through multiple preamplifiers to obtain amplified signals, and transmitting the amplified signals through signal lines in the cavity of the support tube; wherein different array elements are electrically connected to different preamplifiers; part of the signal line extends out of the cavity; and multiple preamplifiers are arranged in the cavity of the support tube.
[0071] In this step, a signal line is arranged in the cavity of the support tube, and a part of the signal line extends out of the cavity. The signal line is used to transmit different types of signals.
[0072] In this embodiment, the support tube is made of aluminum alloy material, which can reduce the weight of the high-frequency piezoelectric array and improve the strength and corrosion resistance of the array.
[0073] In this embodiment, the support tube can also be made of materials such as stainless steel, carbon fiber and titanium alloy to adapt to a variety of different scene applications and needs.
[0074] In this embodiment, the signal lines in the support tube can be electrically connected to the array element signal transmitting device and the external electronic device respectively by bundling or splitting, so as to transmit the amplified signal to the external electronic device, or transmit other signals sent by the external electronic device to the array element signal transmitting device for corresponding processing.
[0075] In this embodiment, the preamplifier inside the support tube is electrically connected to the external electronic device through a signal line, so that the signal transmission is led out from the inside of the array, and the array element signal reception is not blocked.
[0076] In this embodiment, for underwater noise measurement signals, the signal line may transmit one or more of an acoustic signal, a synchronization signal, a control signal, a calibration signal, a data transmission signal, a power supply signal, and a communication signal.
[0077] A plurality of preamplifiers are arranged in the cavity of the support tube, and the plurality of preamplifiers are used to receive array element signals and amplify the array element signals.
[0078] The plurality of array elements are mounted on the plurality of array element liners and are not in contact with the outer side of the support tube; different array elements are electrically connected to different preamplifiers; and the plurality of array elements are used to generate array element signals.
[0079] In this embodiment, one preamplifier is connected to only one array element and is used to perform method processing on an array element signal transmitted by the array element.
[0080] In this embodiment, each array element is used to generate one type of array element signal, and transmit the array element signal to a front-end device electrically connected to the array element for method processing.
[0081] In this embodiment, a plurality of openings are provided on the support tube, and the lead of each array element is electrically connected to the target preamplifier through one of the plurality of openings, and the leads of each array element are isolated from each other; wherein the target preamplifier is the preamplifier with the shortest distance from an opening among the plurality of preamplifiers, thereby maximally shortening the length of the array element leads, and reducing the interference of spatial electromagnetic interference on the leads and the crosstalk of the leads between array elements.
[0082] Furthermore, a plurality of array elements are installed at equal intervals on a plurality of branch array element liners, and an operating frequency band of each array element is between 5kHz and 35kHz.
[0083] In this embodiment, the number of array elements on the array element lining can be set according to user needs. For example, the number of array elements can be a multiple of 2, or can also be 2. n times, n is a positive integer greater than 0.
[0084] In this embodiment, a signal conditioning method of amplifying signals generated by array elements with small spacing is adopted, which can reduce the influence of array element leads on acoustic performance.
[0085] In this embodiment, the high-frequency piezoelectric array further includes: a protective cover, which is made of polyurethane material and is encapsulated on the outside of the support tube, which can obtain high sealing and high corrosion resistance, and can improve the service life of the high-frequency piezoelectric array. The operating method of the high-frequency piezoelectric array provided by the present invention generates array element signals through multiple array elements; wherein the multiple array elements are installed on an array element lining with a shock-absorbing function and do not contact the outer side of a support tube; the array element signals are amplified by multiple preamplifiers to obtain amplified signals, and the amplified signals are transmitted through signal lines in the cavity of the support tube; vibration isolation and electrical isolation between the array elements and the support tube are achieved, and electromagnetic radiation interference and vibration conduction interference at the array connection end are reduced.
[0086] Fig. 9 is a schematic diagram of the structure of the electronic device provided by the present invention, such as Fig. 9 As shown, the electronic device may include: a processor 910, a communication interface 920, a memory 930 and a communication bus 940, wherein the processor 910, the communication interface 920 and the memory 930 communicate with each other through the communication bus 940. The processor 910 may call the logic instructions in the memory 930 to execute the operation method of the high-frequency piezoelectric array, the method comprising: generating an array element signal through a plurality of array elements; wherein the plurality of array elements are mounted on a plurality of array element liners and do not contact the outer side of the support tube; the plurality of array element liners are distributed on the outer side of the support tube, and each array element liner has a shock absorbing function; amplifying the array element signal through a plurality of preamplifiers to obtain an amplified signal, and transmitting the amplified signal through a signal line in the cavity of the support tube; wherein different array elements are electrically connected to different preamplifiers; a part of the signal line extends out of the cavity; and a plurality of preamplifiers are arranged in the cavity of the support tube.
[0087] In addition, the logic instructions in the above-mentioned memory 930 can be implemented in the form of a software functional unit and can be stored in a computer-readable storage medium when it is sold or used as an independent product. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art or the part of the technical solution, can be embodied in the form of a software product, and the computer software product is stored in a storage medium, including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to perform all or part of the steps of the method described in each embodiment of the present invention. The aforementioned storage medium includes: U disk, mobile hard disk, read-only memory (ROM, Read-Only Memory), random access memory (RAM, Random Access Memory), disk or optical disk and other media that can store program codes.
[0088] On the other hand, the present invention also provides a computer program product, which includes a computer program. The computer program can be stored on a non-transitory computer-readable storage medium. When the computer program is executed by a processor, the computer can execute the operation method of the high-frequency piezoelectric array provided by the above methods, the method including: generating array element signals through multiple array elements; wherein the multiple array elements are installed on multiple array element linings and do not contact the outer side of the support tube; the multiple array element linings are distributed on the outer side of the support tube, and each array element lining has a shock absorbing function; the array element signal is amplified by multiple preamplifiers to obtain an amplified signal, and the amplified signal is transmitted through the signal line in the cavity of the support tube; wherein different array elements are electrically connected to different preamplifiers; part of the signal line extends out of the cavity; and multiple preamplifiers are arranged in the cavity of the support tube.
[0089] On the other hand, the present invention also provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, is implemented to execute the operation method of the high-frequency piezoelectric array provided by the above-mentioned methods, the method comprising: generating array element signals through multiple array elements; wherein the multiple array elements are mounted on multiple array element linings and are not in contact with the outer side of the support tube; the multiple array element linings are distributed on the outer side of the support tube, and each array element lining has a shock absorbing function; the array element signals are amplified by multiple preamplifiers to obtain amplified signals, and the amplified signals are transmitted through signal lines in the cavity of the support tube; wherein different array elements are electrically connected to different preamplifiers; a portion of the signal line extends out of the cavity; and multiple preamplifiers are arranged in the cavity of the support tube.
[0090] The device embodiments described above are merely illustrative, wherein the units described as separate components may or may not be physically separated, and the components displayed as units may or may not be physical units, that is, they may be located in one place, or they may be distributed on multiple network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this embodiment. Ordinary technicians in this field can understand and implement it without paying creative labor.
[0091] Through the description of the above implementation methods, those skilled in the art can clearly understand that each implementation method can be implemented by means of software plus a necessary general hardware platform, and of course, can also be implemented by hardware. Based on this understanding, the above technical solution is essentially or the part that contributes to the prior art can be embodied in the form of a software product, and the computer software product can be stored in a computer-readable storage medium, such as ROM / RAM, a disk, an optical disk, etc., including a number of instructions for a computer device (which can be a personal computer, a server, or a network device, etc.) to execute the methods described in each embodiment or some parts of the embodiments.
[0092] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, rather than to limit it. Although the present invention has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or make equivalent replacements for some of the technical features therein. However, these modifications or replacements do not deviate the essence of the corresponding technical solutions from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims
1. A high-frequency piezoelectric array, characterized in that: include: A support tube, wherein a signal line is arranged in a cavity of the support tube, a portion of the signal line extends out of the cavity, and the signal line is used to transmit different types of signals; A plurality of preamplifiers, the plurality of preamplifiers being disposed in the cavity of the support tube, the plurality of preamplifiers being used to receive array element signals and amplify the array element signals; A plurality of array element linings, wherein the plurality of array element linings are distributed on the outer side of the support tube; each array element lining is made of insulating material, and each array element lining has a shock absorbing function; A plurality of array elements are installed on the plurality of array element liners and are not in contact with the outer side of the support tube; different array elements are electrically connected to different preamplifiers; and the plurality of array elements are used to generate the array element signals.
2. The high-frequency piezoelectric array according to claim 1, characterized in that: The support tube is provided with a plurality of openings, and the lead wire of each array element is electrically connected to the target preamplifier through one of the plurality of openings, and the lead wires of each array element are isolated from each other; The target preamplifier is a preamplifier with the shortest distance from the one opening among the multiple preamplifiers.
3. The high-frequency piezoelectric array according to claim 1, characterized in that: The plurality of array elements are installed on the plurality of array element liners at equal intervals, and the operating frequency band of each array element is between 5 kHz and 35 kHz.
4. The high-frequency piezoelectric array according to claim 1, characterized in that: The high-frequency piezoelectric array further comprises: The protective cover is made of polyurethane material and is potted on the outside of the support tube.
5. The high-frequency piezoelectric array according to claim 1, characterized in that: The support tube is made of aluminum alloy material.
6. A noise measurement system, characterized in that: include: The high-frequency piezoelectric array according to any one of claims 1 to 5; The electrical signal processing device is fixedly sealed to the high-frequency piezoelectric array through a metal flange; the electrical signal processing device is used to convert different types of signals transmitted by the high-frequency piezoelectric array into electrical signals and perform noise measurement based on the electrical signals.
7. A method for operating a high-frequency piezoelectric array, characterized in that: include: An array element signal is generated by a plurality of array elements; wherein the plurality of array elements are mounted on a plurality of array element liners and do not contact the outer side of the support tube; the plurality of array element liners are distributed on the outer side of the support tube, and each array element liner has a shock absorbing function; The array element signal is amplified by a plurality of preamplifiers to obtain an amplified signal, and the amplified signal is transmitted through a signal line in the cavity of a support tube; wherein different array elements are electrically connected to different preamplifiers; a portion of the signal line extends out of the cavity; and the plurality of preamplifiers are disposed in the cavity of the support tube.
8. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein: When the processor executes the computer program, the operating method of the high-frequency piezoelectric array as claimed in claim 7 is implemented.
9. A non-transitory computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, the operating method of the high-frequency piezoelectric array as claimed in claim 7 is implemented.
10. A computer program product, comprising a computer program, characterized in that When the computer program is executed by a processor, the operating method of the high-frequency piezoelectric array as claimed in claim 7 is implemented.
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