Temperature control method and device and storage medium

Abstract

The invention relates to a temperature control method and device and a storage medium. The temperature control method comprises the steps that the current environment temperature of the environment where the electronic equipment is located at present is obtained, a current temperature control strategy corresponding to the current environment temperature is determined, and a corresponding relation exists between the environment temperature and the temperature control strategy; and performing temperature control on the electronic equipment according to the current temperature control strategy corresponding to the current environment temperature of the electronic equipment. According to the technical scheme, the corresponding temperature control strategy can be switched according to the current environment temperature, temperature control over the electronic equipment is achieved, and better experience is provided for a user.

Description

Technical Field

[0001] The present disclosure relates to the technical field of electronic equipment, and in particular to a temperature control method, device and storage medium. Background Art

[0002] With the development of science and technology, electronic devices tend to be miniaturized. Miniaturization increases the installation density of components inside electronic devices, which can easily cause serious heating of electronic devices, affecting the user's comfort experience and even thermal safety.

[0003] In the related art, electronic devices usually dynamically control the operating power of various components of the electronic devices according to the temperature of the device itself, so as to achieve the effect of controlling the temperature of the electronic device itself. Summary of the invention

[0004] In order to overcome the problems existing in the related art, the present disclosure provides a temperature control method, device and storage medium.

[0005] According to a first aspect of an embodiment of the present disclosure, a temperature control method is provided, comprising: obtaining a current ambient temperature of an environment in which an electronic device is currently located, and determining a current temperature control strategy corresponding to the current ambient temperature, wherein there is a corresponding relationship between the ambient temperature and the temperature control strategy; and performing temperature control on the electronic device according to the current temperature control strategy corresponding to the current ambient temperature of the electronic device.

[0006] In one implementation, the temperature control strategy includes a temperature control sub-strategy for controlling the temperature of one or more components in the electronic device.

[0007] In one embodiment, temperature controlling the electronic device according to the current temperature control strategy corresponding to the current ambient temperature of the electronic device includes: determining a current temperature control sub-strategy for temperature controlling components in the electronic device in the current temperature control strategy; and temperature controlling the components in the electronic device according to the current temperature control sub-strategy.

[0008] In one embodiment, determining the current temperature control sub-strategy for temperature control of the electronic device in the current temperature control strategy includes: determining the current temperature control sub-strategy for temperature control of components in the electronic device based on the current temperature control strategy and the current whole machine temperature of the electronic device, wherein there is a corresponding relationship between the whole machine temperature and the temperature control sub-strategy in the temperature control strategy.

[0009] In one embodiment, based on the current temperature control strategy and the current whole temperature of the electronic device, determining the current temperature control sub-strategy for temperature control of components in the electronic device includes: in response to the difference between the current ambient temperature corresponding to the current temperature control strategy and the current whole temperature of the electronic device being less than a first threshold, determining the first temperature control sub-strategy in the current temperature control strategy as the current temperature control sub-strategy for temperature control of components in the electronic device; in response to the difference between the current ambient temperature corresponding to the current temperature control strategy and the current whole temperature of the electronic device being greater than the first threshold, determining the second temperature control sub-strategy in the current temperature control strategy as the current temperature control sub-strategy for temperature control of components in the electronic device; wherein the temperature adjustment amplitude corresponding to the first temperature control sub-strategy is less than the temperature adjustment amplitude corresponding to the second temperature control sub-strategy; different temperature adjustment amplitudes are determined based on different adjustment strategies for the same component, and / or based on adjustment strategies for different components.

[0010] In one embodiment, the first temperature control sub-strategy and the second temperature control sub-strategy satisfy at least one of the following: the number of components included in the first temperature control sub-strategy is less than the number of components included in the second temperature control sub-strategy; the temperature adjustment amplitude of the same component in the first temperature control sub-strategy is less than the temperature adjustment amplitude in the second temperature control sub-strategy.

[0011] In one embodiment, based on the current temperature control strategy and the current whole temperature of the electronic device, a current temperature control sub-strategy for temperature control of components in the electronic device is determined, including: in response to the current ambient temperature being less than a second threshold, determining a third temperature control sub-strategy in the current temperature control strategy as the current temperature control sub-strategy for temperature control of components in the electronic device; in response to the current ambient temperature being greater than the second threshold, determining a fourth temperature control sub-strategy in the current temperature control strategy as the current temperature control sub-strategy for temperature control of components in the electronic device; wherein a temperature adjustment amplitude corresponding to the third temperature control sub-strategy is greater than a temperature adjustment amplitude corresponding to the fourth temperature control sub-strategy; wherein different temperature adjustment amplitudes are determined based on different adjustment strategies for the same component, and / or based on adjustment strategies for different components.

[0012] In one embodiment, the third temperature control sub-strategy and the fourth temperature control sub-strategy satisfy at least one of the following: the number of components included in the third temperature control sub-strategy is greater than the number of components included in the fourth temperature control sub-strategy; the temperature adjustment amplitude of the same component in the third temperature control sub-strategy is greater than the temperature adjustment amplitude in the fourth temperature control sub-strategy.

[0013] In one embodiment, there is a correspondence between the ambient temperature, the whole machine temperature, the temperature control strategy and the temperature control sub-strategy; the correspondence between the ambient temperature, the whole machine temperature, the temperature control strategy and the temperature control sub-strategy satisfies at least one of the following: there is a one-to-one correspondence between the ambient temperature and the temperature control strategy; each component corresponds to one or more temperature control sub-strategies; there is a one-to-one correspondence between the whole machine temperature and the temperature control strategy, and the same whole machine temperature corresponds to the temperature control sub-strategies of one or more components.

[0014] In one embodiment, the ambient temperature includes a first ambient temperature and a second ambient temperature, the first ambient temperature is lower than the second ambient temperature; the first ambient temperature corresponds to a first temperature control strategy, and the second ambient temperature corresponds to a second temperature control strategy; the number of temperature control sub-strategies included in the first temperature control strategy is greater than the number of temperature control sub-strategies included in the second temperature control strategy; each temperature control sub-strategy includes an adjustment strategy for one or more components, and different temperature control sub-strategies include at least one of the following: the same adjustment strategy for the same component, different adjustment strategies for the same component, and adjustment strategies for different components.

[0015] In one embodiment, the temperature control of components in the electronic device according to the current temperature control sub-strategy includes: determining the components included in the current temperature control sub-strategy and the component temperature adjustment strategies corresponding to the components; based on a predefined method, sending the component temperature adjustment strategies to their respective corresponding components to control the components to perform temperature control according to the component adjustment strategies; the predefined method includes at least one of the following: an instruction sending method, a secret code sending method, and a code sending method.

[0016] In one embodiment, after the temperature of the components in the electronic device is controlled according to the current temperature control sub-strategy, the method also includes: monitoring the current ambient temperature and / or the current whole machine temperature of the current environment of the electronic device; in response to monitoring changes in the current ambient temperature and / or the current whole machine temperature of the current environment of the electronic device, updating the current temperature control strategy and / or temperature control sub-strategy.

[0017] In one embodiment, the temperature control of components in the electronic device according to the current temperature control sub-strategy includes: determining whether the current temperature control sub-strategy is the same as the temperature control sub-strategy currently being used by the electronic device; in response to the current temperature control sub-strategy being the same as the temperature control sub-strategy currently being used by the electronic device, maintaining the temperature control sub-strategy currently being used to control the temperature of components in the electronic device; in response to the current temperature control sub-strategy being different from the temperature control sub-strategy currently being used by the electronic device, using the current temperature control sub-strategy to control the temperature of components in the electronic device.

[0018] In one embodiment, the adjustment strategy of the component includes adjusting at least one of the following: CPU frequency, GPU frequency, screen brightness, screen refresh rate, wireless network duty cycle, wireless network power, number of antennas, uplink and downlink rates, and amplifier power.

[0019] According to the second aspect of an embodiment of the present disclosure, a temperature control device is provided, comprising: a determination unit, used to obtain the current ambient temperature of the environment in which the electronic device is currently located, and determine a current temperature control strategy corresponding to the current ambient temperature, wherein there is a corresponding relationship between the ambient temperature and the temperature control strategy; and a processing unit, used to perform temperature control on the electronic device according to the current temperature control strategy corresponding to the current ambient temperature of the electronic device.

[0020] In one implementation, the temperature control strategy includes a temperature control sub-strategy for controlling the temperature of one or more components in the electronic device.

[0021] In one embodiment, the processing unit controls the temperature of the electronic device according to the current temperature control strategy corresponding to the current ambient temperature of the electronic device in the following manner: determining a current temperature control sub-strategy for temperature control of components in the electronic device in the current temperature control strategy; and controlling the temperature of components in the electronic device according to the current temperature control sub-strategy.

[0022] In one embodiment, the processing unit determines the current temperature control sub-strategy for temperature control of the electronic device in the current temperature control strategy in the following manner: based on the current temperature control strategy and the current whole machine temperature of the electronic device, determine the current temperature control sub-strategy for temperature control of components in the electronic device, wherein there is a corresponding relationship between the whole machine temperature and the temperature control sub-strategy in the temperature control strategy.

[0023] In one embodiment, the processing unit determines the current temperature control sub-strategy for temperature control of components in the electronic device based on the current temperature control strategy and the current whole temperature of the electronic device in the following manner: in response to the difference between the current ambient temperature corresponding to the current temperature control strategy and the current whole temperature of the electronic device being less than a first threshold, determining the first temperature control sub-strategy in the current temperature control strategy as the current temperature control sub-strategy for temperature control of components in the electronic device; in response to the difference between the current ambient temperature corresponding to the current temperature control strategy and the current whole temperature of the electronic device being greater than the first threshold, determining the second temperature control sub-strategy in the current temperature control strategy as the current temperature control sub-strategy for temperature control of components in the electronic device; wherein the temperature adjustment amplitude corresponding to the first temperature control sub-strategy is less than the temperature adjustment amplitude corresponding to the second temperature control sub-strategy; different temperature adjustment amplitudes are determined based on different adjustment strategies for the same component, and / or based on adjustment strategies for different components.

[0024] In one embodiment, the first temperature control sub-strategy and the second temperature control sub-strategy satisfy at least one of the following: the number of components included in the first temperature control sub-strategy is less than the number of components included in the second temperature control sub-strategy; the temperature adjustment amplitude of the same component in the first temperature control sub-strategy is less than the temperature adjustment amplitude in the second temperature control sub-strategy.

[0025] In one embodiment, the processing unit determines the current temperature control sub-strategy for temperature control of components in the electronic device based on the current temperature control strategy and the current temperature of the electronic device in the following manner: in response to the current ambient temperature being less than a second threshold, determining in the current temperature control strategy a third temperature control sub-strategy as the current temperature control sub-strategy for temperature control of components in the electronic device; in response to the current ambient temperature being greater than the second threshold, determining in the current temperature control strategy a fourth temperature control sub-strategy as the current temperature control sub-strategy for temperature control of components in the electronic device; wherein the temperature adjustment amplitude corresponding to the third temperature control sub-strategy is greater than the temperature adjustment amplitude corresponding to the fourth temperature control sub-strategy; wherein different temperature adjustment amplitudes are determined based on different adjustment strategies for the same component, and / or based on adjustment strategies for different components.

[0026] In one embodiment, the third temperature control sub-strategy and the fourth temperature control sub-strategy satisfy at least one of the following: the number of components included in the third temperature control sub-strategy is greater than the number of components included in the fourth temperature control sub-strategy; the temperature adjustment amplitude of the same component in the third temperature control sub-strategy is greater than the temperature adjustment amplitude in the fourth temperature control sub-strategy.

[0027] In one embodiment, there is a correspondence between the ambient temperature, the whole machine temperature, the temperature control strategy and the temperature control sub-strategy; the correspondence between the ambient temperature, the whole machine temperature, the temperature control strategy and the temperature control sub-strategy satisfies at least one of the following: there is a one-to-one correspondence between the ambient temperature and the temperature control strategy; each component corresponds to one or more temperature control sub-strategies; there is a one-to-one correspondence between the whole machine temperature and the temperature control strategy, and the same whole machine temperature corresponds to the temperature control sub-strategies of one or more components.

[0028] In one embodiment, the ambient temperature includes a first ambient temperature and a second ambient temperature, the first ambient temperature is lower than the second ambient temperature; the first ambient temperature corresponds to a first temperature control strategy, and the second ambient temperature corresponds to a second temperature control strategy; the number of temperature control sub-strategies included in the first temperature control strategy is greater than the number of temperature control sub-strategies included in the second temperature control strategy; each temperature control sub-strategy includes an adjustment strategy for one or more components, and different temperature control sub-strategies include at least one of the following: the same adjustment strategy for the same component, different adjustment strategies for the same component, and adjustment strategies for different components.

[0029] In one embodiment, the processing unit controls the temperature of components in the electronic device according to the current temperature control sub-strategy in the following manner: determining the components included in the current temperature control sub-strategy and the component temperature adjustment strategies corresponding to the components; based on a predefined method, sending the component temperature adjustment strategies to their respective corresponding components to control the components to perform temperature control according to the component adjustment strategies; the predefined method includes at least one of the following: an instruction sending method, a secret code sending method, and a code sending method.

[0030] In one embodiment, after the temperature of the components in the electronic device is controlled according to the current temperature control sub-strategy, the processing unit is also used to: monitor the current ambient temperature and / or the current whole machine temperature of the current environment of the electronic device; in response to monitoring changes in the current ambient temperature and / or the current whole machine temperature of the current environment of the electronic device, update the current temperature control strategy and / or temperature control sub-strategy.

[0031] In one embodiment, the processing unit controls the temperature of components in the electronic device according to the current temperature control sub-strategy in the following manner: determining whether the previous temperature control sub-strategy is the same as the temperature control sub-strategy currently being used by the electronic device; in response to the current temperature control sub-strategy being the same as the temperature control sub-strategy currently being used by the electronic device, maintaining the currently being used temperature control sub-strategy to control the temperature of components in the electronic device; in response to the current temperature control sub-strategy being different from the temperature control sub-strategy currently being used by the electronic device, using the current temperature control sub-strategy to control the temperature of components in the electronic device.

[0032] In one embodiment, the adjustment strategy of the component includes adjusting at least one of the following: CPU frequency, GPU frequency, screen brightness, screen refresh rate, wireless network duty cycle, wireless network power, number of antennas, uplink and downlink rates, and amplifier power.

[0033] According to a third aspect of an embodiment of the present disclosure, a temperature control device is provided, comprising: a processor; a memory for storing processor executable instructions; wherein the processor is configured to: call the instructions stored in the memory to execute the method described in the first aspect or any one of the embodiments of the first aspect.

[0034] According to a fourth aspect of an embodiment of the present disclosure, a storage medium is provided, in which instructions are stored. When the instructions in the storage medium are executed by a processor of an electronic device, the electronic device can execute the method described in the first aspect or any one of the embodiments of the first aspect.

[0035] The technical solution provided by the embodiments of the present disclosure may include the following beneficial effects: through the technical solution provided by the present disclosure, it is possible to switch the corresponding temperature control strategy to control the temperature of the electronic device according to the current ambient temperature of the electronic device, thereby achieving more detailed temperature control management of the electronic device, realizing the user's demand for a balance between the performance of the electronic device and the temperature rise experience, and providing the user with a better experience.

[0036] It is to be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the present disclosure and, together with the description, serve to explain the principles of the present disclosure.

[0038] Figure 1 The figure is a flow chart of a temperature control method according to an exemplary embodiment.

[0039] Figure 2 It is a schematic diagram of a temperature control strategy comparison table according to an exemplary embodiment.

[0040] Figure 3 The figure is a flow chart of a temperature control method according to an exemplary embodiment.

[0041] Figure 4 The figure is a flow chart of a method for determining a temperature control sub-strategy according to an exemplary embodiment.

[0042] Figure 5 The figure is a flow chart of a method for determining a temperature control sub-strategy according to an exemplary embodiment.

[0043] Figure 6 The figure is a flow chart of a method for determining a temperature control sub-strategy according to an exemplary embodiment.

[0044] Figure 7 is a schematic diagram showing a temperature control correspondence relationship according to an exemplary embodiment.

[0045] Figure 8 is a flow chart of a temperature control method according to an exemplary embodiment

[0046] Fig. 9 The figure is a flow chart of a method for periodically controlling temperature according to an exemplary embodiment.

[0047] Fig.10 is a flow chart of another temperature control method according to an exemplary embodiment.

[0048] Fig.11The present invention is a flow chart of a method for periodically monitoring the temperature of a whole machine according to an exemplary embodiment.

[0049] Fig.12 The figure is a flow chart of a temperature control method according to an exemplary embodiment.

[0050] Fig.13 is a block diagram of a temperature control device according to an exemplary embodiment.

[0051] Fig.14 is a block diagram of a temperature control device according to an exemplary embodiment. DETAILED DESCRIPTION

[0052] Here, exemplary embodiments will be described in detail, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present disclosure.

[0053] Here, exemplary embodiments will be described in detail, examples of which are shown in the accompanying drawings. When the following description refers to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The implementations described in the following exemplary embodiments do not represent all implementations consistent with the present disclosure.

[0054] In recent years, electronic devices have tended to be miniaturized, portable, and high-performance. Miniaturization has increased the density of components installed inside electronic devices, which can easily lead to serious heating of electronic devices, affecting the user's comfort experience and even thermal safety. For electronic devices in the same heating state, the final temperature of electronic devices in higher ambient temperatures will be higher, making the thermal problem of electronic devices more serious.

[0055] In the related art, in conventional temperature control systems, the operating power of various components of the electronic device is usually controlled according to the current temperature of the electronic device to achieve the effect of controlling the temperature of the electronic device itself, but there is a lack of control methods that directly sense the ambient temperature.

[0056] In view of this, the present disclosure provides a temperature control method, which can switch the corresponding temperature control strategy according to the current ambient temperature, and dynamically control the load of the electronic device in combination with the current heating state of the electronic device to achieve the effect of controlling the temperature of the electronic device, thereby satisfying the user's thermal experience in different environments.

[0057] The electronic device involved in the present disclosure may also be referred to as a terminal device, user equipment (UE), mobile station (MS), mobile terminal (MT), etc., which is a device that provides voice and / or data connectivity to users. For example, the electronic device may be a handheld device with wireless connection function, a vehicle-mounted device, etc. At present, some examples of electronic devices are: smart phones (Mobile Phone), pocket computers (Pocket Personal Computer, PPC), handheld computers, personal digital assistants (Personal Digital Assistant, PDA), laptop computers, tablet computers, wearable devices, or vehicle-mounted devices, etc. In addition, when it is a vehicle-to-everything (V2X) communication system, the electronic device may also be a vehicle-mounted device. It should be understood that the embodiments of the present disclosure do not limit the specific technology and specific device form adopted by the electronic device.

[0058] Figure 1 is a flow chart of a temperature control method according to an exemplary embodiment. Figure 1 As shown, the following steps are included.

[0059] In step S11, the current ambient temperature of the environment in which the electronic device is currently located is obtained, and a current temperature control strategy corresponding to the current ambient temperature is determined.

[0060] In step S12, the temperature of the electronic device is controlled according to the current temperature control strategy corresponding to the current ambient temperature of the electronic device.

[0061] In the disclosed embodiment, the current ambient temperature of the environment in which the electronic device is currently located is obtained through a temperature sensing tool, wherein the temperature sensing tool may be a temperature sensor configured for the electronic device, which is not limited here. Based on a pre-stored temperature control strategy comparison table, a current temperature control strategy corresponding to the current ambient temperature is determined, wherein the temperature control strategy comparison table is used to characterize the correspondence between the ambient temperature and the temperature control strategy. The temperature of the electronic device is controlled according to the determined current temperature control strategy.

[0062] Figure 2 is a schematic diagram of a temperature control strategy comparison table according to an exemplary embodiment. Figure 2 As shown, the vertical axis is the obtained ambient temperature, and the temperature gradually increases from bottom to top, with temperature value 1 corresponding to the lowest temperature and temperature value n corresponding to the highest temperature.

[0063] When the ambient temperature is lower than temperature value 1, the electronic device will execute the first set of strategies; when the ambient temperature is lower than temperature value 2 but higher than temperature value 1, the electronic device will execute the second set of strategies; when the ambient temperature is lower than temperature value 3 but higher than temperature value 2, the electronic device will execute the third set of strategies, and so on.

[0064] In the disclosed embodiments, the temperature of the electronic device can be controlled by switching the corresponding temperature control strategy according to the current ambient temperature of the electronic device, thereby achieving more detailed temperature control management of the electronic device, meeting the user's demand for a balance between the performance of the electronic device and the temperature rise experience, and providing the user with a better experience.

[0065] In the embodiment of the present disclosure, the temperature control strategy includes a temperature control sub-strategy for controlling the temperature of one or more components in the electronic device. Both the temperature control strategy and the temperature control sub-strategy are used to control the temperature of one or more components in the electronic device.

[0066] Figure 3 is a flow chart of a temperature control method according to an exemplary embodiment. Figure 3 As shown, the following steps are included.

[0067] In step S21, the current ambient temperature of the environment in which the electronic device is currently located is obtained, and a current temperature control strategy corresponding to the current ambient temperature is determined.

[0068] In step S22, a current temperature control sub-strategy for controlling the temperature of components in the electronic device is determined in the current temperature control strategy.

[0069] In step S23, the temperature of the components in the electronic device is controlled according to the current temperature control sub-strategy.

[0070] In the embodiment of the present disclosure, based on the current ambient temperature of the electronic device, a current temperature control strategy corresponding to the current ambient temperature is determined. The temperature control strategy includes multiple temperature control sub-strategies for temperature control of one or more components in the electronic device, and the current temperature control sub-strategy for temperature control of the components in the electronic device is determined in the current temperature control strategy. The temperature of the components in the electronic device is controlled based on the selected temperature control sub-strategy.

[0071] In the disclosed embodiment, a corresponding temperature control sub-strategy can be selected according to the current ambient temperature of the electronic device to control the temperature of each component in the electronic device, thereby achieving more detailed temperature control management of the electronic device.

[0072] In the disclosed embodiment, after determining the temperature control strategy corresponding to the current ambient temperature based on the current ambient temperature, the current temperature control sub-strategy for temperature control of components in the electronic device is determined through the current temperature control strategy and the current temperature of the electronic device.

[0073] Figure 4 is a flow chart of a method for determining a temperature control sub-strategy according to an exemplary embodiment. Figure 4 As shown, the following steps are included.

[0074] In step S31, the current ambient temperature of the environment in which the electronic device is currently located is obtained, and a current temperature control strategy corresponding to the current ambient temperature is determined.

[0075] In step S32, the current temperature of the electronic device is determined.

[0076] In step S33, based on the current temperature control strategy and the current temperature of the electronic device, a current temperature control sub-strategy for controlling the temperature of components in the electronic device is determined.

[0077] There is a corresponding relationship between the whole machine temperature and the temperature control sub-strategy in the temperature control strategy.

[0078] The whole device temperature of the electronic device may be the average temperature of the heating temperatures of various components of the electronic device.

[0079] In the disclosed embodiment, the current ambient temperature of the electronic device is obtained, the current temperature control strategy corresponding to the current ambient temperature is determined, and the current whole device temperature of the electronic device is determined. Based on the correspondence between the whole device temperature and the temperature control sub-strategy in the temperature control strategy, the current temperature control sub-strategy for temperature control of the components in the electronic device is determined.

[0080] In the disclosed embodiment, the current temperature control sub-strategy for temperature control of components in the electronic device is jointly determined by the current whole device temperature and the current ambient temperature of the electronic device to achieve temperature regulation of the electronic device. This greatly expands the number and types of temperature control strategies and makes the temperature control management of the electronic device more detailed.

[0081] In the disclosed embodiment, based on the difference between the current ambient temperature corresponding to the current temperature control strategy and the current temperature of the electronic device, a corresponding temperature control sub-strategy is selected in the current temperature control strategy to control the temperature of components in the electronic device.

[0082] Figure 5 is a flow chart of a method for determining a temperature control sub-strategy according to an exemplary embodiment. Figure 5 As shown, the following steps are included.

[0083] Steps S41 and S42 are consistent with steps S31 and S32 and will not be described in detail here.

[0084] In step S43, in response to the difference between the current ambient temperature corresponding to the current temperature control strategy and the current temperature of the electronic device being less than a first threshold, the first temperature control sub-strategy is determined in the current temperature control strategy as the current temperature control sub-strategy for temperature control of components in the electronic device.

[0085] In step S44, in response to the difference between the current ambient temperature corresponding to the current temperature control strategy and the current temperature of the electronic device being greater than the first threshold, the second temperature control sub-strategy is determined in the current temperature control strategy as the current temperature control sub-strategy for temperature control of components in the electronic device.

[0086] In the disclosed embodiment, the difference between the current ambient temperature corresponding to the current temperature control strategy and the current temperature of the electronic device is determined. If the difference is less than the first threshold, the first temperature control sub-strategy is determined in the current temperature control strategy as the current temperature control sub-strategy for temperature control of components in the electronic device. If the difference is greater than the first threshold, the second temperature control sub-strategy is determined in the current temperature control strategy as the current temperature control sub-strategy for temperature control of components in the electronic device. The temperature adjustment amplitude corresponding to the first temperature control sub-strategy is less than the temperature adjustment amplitude corresponding to the second temperature control sub-strategy.

[0087] For example, the first threshold value may be 5°C. When the difference between the ambient temperature of the electronic device and the temperature of the whole device is below 5°C, the user will not feel that the electronic device is heating up significantly, which will affect the user experience. That is, the components in the electronic device do not need to reduce power consumption too much to quickly cool down the electronic device. When the difference between the ambient temperature of the electronic device and the temperature of the whole device is higher than 5°C, the user will obviously feel that the electronic device is heating up. At this time, the components in the electronic device need to reduce power consumption more to quickly cool down the electronic device.

[0088] Among them, different temperature adjustment amplitudes are determined based on different adjustment strategies of the same component, and / or based on adjustment strategies of different components. Among them, the temperature control sub-strategy includes multiple adjustment strategies, and the adjustment strategy is a strategy for controlling various components of the electronic device, such as: central processing unit (CPU) strategy, graphics processing unit (GPU) strategy, screen strategy, wireless communication (WIFI) strategy, modem (MODEM) strategy, etc., which are not limited here.

[0089] Among them, the CPU strategy can be for controlling the operating speed of the central processing unit of the electronic device, the GPU strategy can be for controlling the operating speed of the graphics processor of the electronic device, the screen strategy can be for controlling the brightness and refresh rate of the screen of the electronic device, the WIFI strategy can be for controlling the transmission strategy of the wireless communication of the electronic device, etc., which are not limited here.

[0090] The embodiments of the present disclosure will be exemplarily described below. The difference between the current ambient temperature and the current temperature of the whole machine is less than the first threshold value, and the first temperature control sub-strategy is determined in the current temperature control strategy as the current temperature control sub-strategy for temperature control of components in the electronic device. Among them, the first temperature control sub-strategy includes three adjustment strategies: CPU strategy 1, GPU strategy 1, and screen strategy 1. And the difference between the current ambient temperature and the current temperature of the whole machine is greater than the first threshold value, and the second temperature control sub-strategy is determined in the current temperature control strategy as the current temperature control sub-strategy for temperature control of components in the electronic device. Among them, the second temperature control sub-strategy includes four adjustment strategies: CPU strategy 2, GPU strategy 1, screen strategy 1, and WIFI strategy 1.

[0091] Among them, GPU strategy 1 can be used to control the operation rate of the electronic device graphics processor from the original 800MB to 500MB, and GPU strategy 2 can be used to control the operation rate of the electronic device graphics processor to 500MB. Screen strategy 1 can be used to control the brightness of the electronic device screen from the original 500nit to 300nit, and the screen refresh rate from the original 120Hz to 90Hz. Screen strategy 2 can be used to control the brightness of the electronic device screen to 200nit, and the screen refresh rate to 60Hz, etc., which are not limited here.

[0092] From the above, it can be seen that the total power consumption reduced by each component corresponding to the first temperature control sub-strategy is less than the total power consumption reduced by each component corresponding to the second temperature control sub-strategy. That is, the temperature adjustment amplitude corresponding to the first temperature control sub-strategy is less than the temperature adjustment amplitude corresponding to the second temperature control sub-strategy. Different temperature adjustment amplitudes can be determined based on different adjustment strategies for the same component, or based on adjustment strategies for different components.

[0093] In the embodiment of the present disclosure, the first temperature control sub-strategy and the second temperature control sub-strategy satisfy at least one of the following conditions: the number of components included in the first temperature control sub-strategy is less than the number of components included in the second temperature control sub-strategy. The temperature adjustment amplitude of the same component in the first temperature control sub-strategy is less than the temperature adjustment amplitude in the second temperature control sub-strategy.

[0094] For example, the first temperature control sub-strategy includes three adjustment strategies: CPU strategy 1, GPU strategy 1, and screen strategy 1. The second temperature control sub-strategy includes four adjustment strategies: CPU strategy 2, GPU strategy 1, screen strategy 1, and WIFI strategy 1. It can be understood that the number of components included in the first temperature control sub-strategy is less than the number of components included in the second temperature control sub-strategy. If the power consumption of the same CPU component is reduced in the first temperature control sub-strategy less than the power consumption reduced in the second temperature control sub-strategy, then the temperature adjustment amplitude in the first temperature control sub-strategy will be less than the temperature adjustment amplitude in the second temperature control sub-strategy.

[0095] In the disclosed embodiment, in addition to selecting a corresponding temperature control sub-strategy in the current temperature control strategy based on the difference between the current ambient temperature corresponding to the current temperature control strategy and the current temperature of the electronic device, a corresponding temperature control sub-strategy can also be determined in the current temperature control strategy based on the current ambient temperature of the electronic device.

[0096] Figure 6 is a flow chart of a method for determining a temperature control sub-strategy according to an exemplary embodiment. Figure 6 As shown, the following steps are included.

[0097] Steps S51 and S52 are consistent with steps S31 and S32 and will not be described in detail here.

[0098] In step S53, in response to the current ambient temperature being less than the second threshold, a third temperature control sub-strategy is determined in the current temperature control strategy as the current temperature control sub-strategy for temperature control of components in the electronic device.

[0099] In step S54, in response to the current ambient temperature being greater than the second threshold, a fourth temperature control sub-strategy is determined in the current temperature control strategy as the current temperature control sub-strategy for performing temperature control on components in the electronic device.

[0100] In the disclosed embodiment, the current ambient temperature of the electronic device is monitored. If the current ambient temperature is less than the second threshold, the third temperature control sub-strategy is determined in the current temperature control strategy as the current temperature control sub-strategy for temperature control of the components in the electronic device. If the current ambient temperature is greater than the second threshold, the fourth temperature control sub-strategy is determined in the current temperature control strategy as the current temperature control sub-strategy for temperature control of the components in the electronic device. The temperature adjustment amplitude corresponding to the third temperature control sub-strategy is greater than the temperature adjustment amplitude corresponding to the fourth temperature control sub-strategy.

[0101] For example, the second threshold value may be 30°C. When the current ambient temperature of the electronic device is less than 30°C, as long as the electronic device opens a high-power application and runs for a period of time, the user will clearly feel that the electronic device is heating up, affecting the user experience. That is, the power consumption of each component in the electronic device needs to be reduced to enable the electronic device to cool down quickly. When the current ambient temperature of the electronic device is higher than 30°C, when the temperature of the entire electronic device is increased to 30°C, the user will not clearly feel that the electronic device is heating up, so there is no need to reduce the power consumption of each component in the electronic device to enable the electronic device to cool down quickly.

[0102] The different temperature adjustment amplitudes are determined based on different adjustment strategies for the same component and / or based on adjustment strategies for different components.

[0103] The embodiments of the present disclosure will be exemplarily described below. When the current ambient temperature is less than the second threshold value, the third temperature control sub-strategy is determined in the current temperature control strategy as the current temperature control sub-strategy for temperature control of components in the electronic device. Among them, the third temperature control sub-strategy includes four adjustment strategies: CPU strategy 2, GPU strategy 1, screen strategy 2, and WIFI strategy 1. When the current ambient temperature is greater than the second threshold value, the fourth temperature control sub-strategy is determined in the current temperature control strategy as the current temperature control sub-strategy for temperature control of components in the electronic device. Among them, the fourth temperature control sub-strategy includes three adjustment strategies: CPU strategy 1, GPU strategy 1, and screen strategy 1. The temperature adjustment amplitude corresponding to the third temperature control sub-strategy is greater than the temperature adjustment amplitude corresponding to the fourth temperature control sub-strategy. It can be seen that different temperature adjustment amplitudes can be determined based on different adjustment strategies for the same component, or based on adjustment strategies for different components.

[0104] In the disclosed embodiment, the third temperature control sub-strategy and the fourth temperature control sub-strategy satisfy at least one of the following conditions: the number of components included in the third temperature control sub-strategy is greater than the number of components included in the fourth temperature control sub-strategy. The temperature adjustment amplitude of the same component in the third temperature control sub-strategy is greater than the temperature adjustment amplitude in the fourth temperature control sub-strategy.

[0105] For example, the third temperature control sub-strategy includes four adjustment strategies: CPU strategy 2, GPU strategy 1, screen strategy 2, and WIFI strategy 1. The fourth temperature control sub-strategy includes three adjustment strategies: CPU strategy 1, GPU strategy 1, and screen strategy 1. It can be understood that the number of components included in the third temperature control sub-strategy is greater than the number of components included in the fourth temperature control sub-strategy. If the power consumption of the same CPU component is reduced in the third temperature control sub-strategy than in the fourth temperature control sub-strategy, then the temperature adjustment amplitude in the third temperature control sub-strategy will be greater than the temperature adjustment amplitude in the fourth temperature control sub-strategy.

[0106] In the disclosed embodiment, the correspondence between the ambient temperature, the whole machine temperature, the temperature control strategy, and the temperature control sub-strategy satisfies at least one of the following: there is a one-to-one correspondence between the ambient temperature and the temperature control strategy. Each component corresponds to one or more temperature control sub-strategies. There is a one-to-one correspondence between the whole machine temperature and the temperature control strategy, and the same whole machine temperature corresponds to the temperature control sub-strategies of one or more components.

[0107] Figure 7 is a schematic diagram showing a temperature control correspondence relationship according to an exemplary embodiment. Figure 7 As shown, the vertical axis is the multiple sets of temperature control strategies determined based on the current ambient temperature. From bottom to top, the higher the ambient temperature, the larger the number of the temperature control strategy, from the 1st set of temperature control strategies to the nth set of temperature control strategies. The horizontal axis is the whole machine temperature of the monitored electronic equipment. From left to right, the higher the whole machine temperature, from temperature interval a to temperature interval i.

[0108] In the disclosed embodiment, after obtaining the current ambient temperature of the electronic device, the current temperature control strategy corresponding to the current ambient temperature is determined based on the correspondence between the pre-stored ambient temperature and the temperature control strategy. The current whole machine temperature of the electronic device is determined, and based on the correspondence between the pre-stored temperature control strategy and the whole machine temperature, the temperature control sub-strategy corresponding to the current whole machine temperature is determined. The temperature control sub-strategy includes multiple adjustment strategies.

[0109] Furthermore, the first set of temperature control strategies includes multiple temperature control sub-strategies, namely temperature control sub-strategy 1, temperature control sub-strategy 2, temperature control sub-strategy 3 and temperature control sub-strategy 4. Temperature control sub-strategy 1 includes multiple temperature control strategy parameters, namely CPU strategy 1, GPU strategy 1, screen strategy 1, etc.; temperature control sub-strategy 2 includes CPU strategy 2, GPU strategy 1, screen strategy 2, etc.; temperature control sub-strategy 3 includes CPU strategy 2, GPU strategy 1, screen strategy 2, WIFI strategy 1, etc.; temperature control sub-strategy 4 includes CPU strategy 2, GPU strategy 1, screen strategy 2, WIFI strategy 2, etc., which are not limited here.

[0110] The embodiment of the present disclosure will hereinafter exemplarily illustrate the temperature control method involved in the above embodiment by determining the temperature control strategy corresponding to the current ambient temperature as the first set of temperature control strategies and determining that the current whole machine temperature is in the temperature range d.

[0111] In the disclosed embodiment, the current ambient temperature of the electronic device is obtained, and the temperature control strategy corresponding to the current ambient temperature is determined to be the first set of temperature control strategies. The current whole device temperature of the electronic device is monitored, and it is determined that the current whole device temperature is in the temperature interval d.

[0112] According to the corresponding relationship between the temperature control strategy and the temperature of the whole machine, the temperature control sub-strategy 4 corresponding to the temperature interval d is determined, and the temperature control sub-strategy 4 includes multiple adjustment strategies, namely: CPU strategy 2, GPU strategy 1, screen strategy 2, wifi strategy 2, etc. That is, the CPU component of the electronic device will execute CPU strategy 2, for example, it can control the operation rate of the central processing unit of the electronic device from 2.5G to 1.5G; the GPU component of the electronic device will execute GPU strategy 1, for example, it can control the operation rate of the graphics processor of the electronic device from the original 800MB to 500MB; the screen of the electronic device will execute screen strategy 2, for example, it can control the brightness of the electronic device screen to be reduced to 200nit, and the screen refresh rate to be reduced to 60Hz, which is not limited here.

[0113] In the disclosed embodiment, different ambient temperatures correspond to different temperature control strategies, and different temperature control strategies include different numbers of temperature control sub-strategies, and different temperature control sub-strategies include adjustment strategies for different components.

[0114] In the embodiment of the present disclosure, the ambient temperature includes a first ambient temperature and a second ambient temperature, and the first ambient temperature is lower than the second ambient temperature. The first ambient temperature corresponds to a first temperature control strategy, and the second ambient temperature corresponds to a second temperature control strategy. The number of temperature control sub-strategies included in the first temperature control strategy is greater than the number of temperature control sub-strategies included in the second temperature control strategy.

[0115] In the disclosed embodiment, when the first ambient temperature is lower than the second ambient temperature, the number of temperature control sub-strategies included in the first temperature control strategy is greater than the number of temperature control sub-strategies included in the second temperature control strategy. For example, the maximum temperature that the electronic device can withstand is 60°C, and there is one temperature control sub-strategy for every 10°C of the whole machine temperature. When the first ambient temperature is 10°C, the whole machine temperature is also 10°C, and the number of temperature control sub-strategies included in the first temperature control strategy is 5. When the first ambient temperature is 30°C, the whole machine temperature is also 30°C, and the number of temperature control sub-strategies included in the first temperature control strategy is 3. That is, the number of temperature control sub-strategies included in the first temperature control strategy is greater than the number of temperature control sub-strategies included in the second temperature control strategy.

[0116] Furthermore, each temperature control sub-strategy includes an adjustment strategy for one or more components, and different temperature control sub-strategies include at least one of the following: the same adjustment strategy for the same component, different adjustment strategies for the same component, and adjustment strategies for different components.

[0117] For example, temperature control sub-strategy 1 may include CPU strategy 1, GPU strategy 1, and screen strategy 1; temperature control sub-strategy 2 may include CPU strategy 2, GPU strategy 1, and screen strategy 2; temperature control sub-strategy 3 may include CPU strategy 2, GPU strategy 1, screen strategy 2, and WIFI strategy 1; temperature control sub-strategy 4 may include CPU strategy 2, GPU strategy 1, screen strategy 2, and WIFI strategy 2. That is, different temperature control sub-strategies may include the same adjustment strategy for the same component, different adjustment strategies for the same component, and adjustment strategies for different components.

[0118] In the disclosed embodiment, the component temperature adjustment strategies may be sent to the corresponding components respectively based on a predefined method, so as to control the components to perform temperature control according to the component adjustment strategies.

[0119] Figure 8 is a flow chart of a temperature control method according to an exemplary embodiment. Figure 8 As shown, the following steps are included.

[0120] Steps S61 and S62 are consistent with steps S21 and S22 and will not be repeated here.

[0121] In step S63, the components included in the current temperature control sub-strategy and the component temperature adjustment strategies corresponding to the components are determined.

[0122] In step S64, based on a predefined method, the component temperature adjustment strategies are sent to the corresponding components respectively, so as to control the components to perform temperature control according to the component adjustment strategies.

[0123] In the disclosed embodiment, the current ambient temperature of the environment in which the electronic device is currently located is obtained, and a current temperature control strategy corresponding to the current ambient temperature is determined. A current temperature control sub-strategy for temperature control of components in the electronic device is determined in the current temperature control strategy. The components included in the current temperature control sub-strategy and the component temperature adjustment strategy corresponding to the component are determined. Based on a predefined method, the component temperature adjustment strategy is sent to the corresponding components respectively to control the components to perform temperature control according to the component adjustment strategy.

[0124] The predefined methods include at least one of the following: an instruction sending method, a secret code sending method, and a code sending method. The instruction sending method is to send data to each component through a designated communication port for execution. The secret code sending method is to dial a designated type of number through a dialing keypad to start some hidden system programs. The code sending method is to send relevant codes to each component for execution.

[0125] In the disclosed embodiment, the current ambient temperature and / or the current whole machine temperature of the current environment of the electronic device can be monitored regularly, and the current ambient temperature value and / or the current whole machine temperature value of the electronic device can be updated, thereby updating the current temperature control strategy and / or temperature control sub-strategy to enhance the real-time performance of temperature control of the electronic device.

[0126] Fig. 9 is a flow chart of a method for periodic temperature control according to an exemplary embodiment. Fig. 9 As shown, the following steps are included.

[0127] In step S71, the current ambient temperature and / or the current temperature of the entire device of the current environment of the electronic device is periodically monitored.

[0128] In step S72, in response to monitoring changes in the current ambient temperature and / or the current temperature of the entire device of the current environment of the electronic device, the current temperature control strategy and / or the temperature control sub-strategy is updated.

[0129] In the disclosed embodiment, the current ambient temperature of the environment in which the electronic device is currently located is monitored regularly, and the current temperature control strategy corresponding to the current ambient temperature is updated. The whole temperature of the electronic device is also monitored regularly, and the corresponding temperature control sub-strategy is reselected based on the updated current temperature control strategy and the updated whole temperature. The regular monitoring can be performed every n seconds, which is not limited here.

[0130] In the disclosed embodiment, by regularly monitoring the current ambient temperature and / or the current whole device temperature of the electronic device, the current temperature control strategy and / or the temperature control sub-strategy are regularly updated, thereby greatly enhancing the real-time performance of the temperature control of the electronic device.

[0131] Fig.10 is a flow chart of another temperature control method according to an exemplary embodiment. Fig.10 As shown, the following steps are included.

[0132] In step S81 , it is determined whether the current temperature control sub-strategy is the same as the temperature control sub-strategy currently being used by the electronic device.

[0133] In step S82, in response to the current temperature control sub-strategy being the same as the temperature control sub-strategy currently being used by the electronic device, the currently being used temperature control sub-strategy is maintained to control the temperature of components in the electronic device.

[0134] In step S83, in response to the current temperature control sub-strategy being different from the temperature control sub-strategy currently being used by the electronic device, the current temperature control sub-strategy is used to control the temperature of components in the electronic device.

[0135] In the disclosed embodiment, after determining the current temperature control sub-strategy, it is determined whether it is the same as the temperature control sub-strategy currently being used by the electronic device. If they are the same, the currently used temperature control sub-strategy continues to be used to control the temperature of components in the electronic device; if they are not the same, the updated temperature control sub-strategy is used to control the temperature of the components in the electronic device.

[0136] In the disclosed embodiment, the adjustment strategy of the component includes adjusting at least one of the following: reducing the central processing unit frequency, the graphics processing unit frequency, the screen brightness, the screen refresh rate, the duty cycle of the wireless network, the power of the wireless network, the number of antennas, the uplink and downlink rates, and the amplifier (PA) power, which are not limited here.

[0137] Fig.11 is a flow chart of a method for periodically monitoring the temperature of a whole machine according to an exemplary embodiment. Fig.11 As shown, the following steps are included.

[0138] After determining the temperature strategy corresponding to the current ambient temperature, for example, the Xth set of temperature control strategies, the whole temperature of the electronic device is regularly monitored and updated. The temperature control sub-strategy corresponding to the whole temperature and the included temperature control strategy parameters are determined, and sent to each component corresponding to the temperature control strategy parameters for execution, for example, device 1 to device n, until the temperature of the electronic device no longer rises.

[0139] Fig.12 is a flow chart of a temperature control method according to an exemplary embodiment. Fig.12 As shown, the following steps are included.

[0140] In the embodiment of the present disclosure, the operating system of the electronic device includes a temperature control module, which is used to control the temperature of the electronic device. An interface is created in the temperature control module, which is used to send the acquired ambient temperature to the temperature control module.

[0141] In the disclosed embodiment, the current ambient temperature of the environment in which the electronic device is currently located is periodically sensed and reported through an interface. The regularly updated interface value is passed to the bottom layer of the system, which may be the bottom layer of the Linux system. The system determines the temperature policy corresponding to the current ambient temperature by searching the built-in policy comparison table.

[0142] Regularly monitor the temperature of the entire electronic device, determine the temperature control sub-strategy corresponding to the temperature of the entire device, and retrieve multiple temperature control strategy parameters included in the temperature control sub-strategy and send them to the upper-level system. The upper-level system selects the strategy segment to start executing based on the current temperature of the entire device. After the upper-level system determines the temperature control strategy parameters, it notifies each component in the electronic device to execute them in turn.

[0143] In the disclosed embodiment, when the electronic device is turned on and running, the ambient temperature and the temperature of the entire device of the electronic device are always monitored regularly. In the process of periodic monitoring of the electronic device, the temperature control strategy parameters finally determined each time may be completely different, or partially the same. The strategies executed by subsequent electronic device components may also be completely different, or partially the same.

[0144] In the disclosed embodiments, the temperature of the electronic device can be controlled by switching the corresponding temperature control strategy according to the current ambient temperature of the electronic device, thereby achieving more detailed temperature control management of the electronic device, meeting the user's demand for a balance between the performance of the electronic device and the temperature rise experience, and providing the user with a better experience.

[0145] Based on the same concept, an embodiment of the present disclosure also provides a temperature control device.

[0146] It is understandable that the temperature control device provided in the embodiment of the present disclosure includes hardware structures and / or software modules corresponding to the execution of each function in order to realize the above functions. In combination with the units and algorithm steps of each example disclosed in the embodiment of the present disclosure, the embodiment of the present disclosure can be implemented in the form of hardware or a combination of hardware and computer software. Whether a function is executed in the form of hardware or computer software driving hardware depends on the specific application and design constraints of the technical solution. Those skilled in the art can use different methods to implement the described functions for each specific application, but such implementation should not be considered to exceed the scope of the technical solution of the embodiment of the present disclosure.

[0147] Fig.13is a block diagram of a temperature control device 100 according to an exemplary embodiment. Fig.13 , the device includes a determining unit 101 and a processing unit 102.

[0148] The determination unit 101 is used to obtain the current ambient temperature of the environment in which the electronic device is currently located, and determine a current temperature control strategy corresponding to the current ambient temperature, wherein there is a corresponding relationship between the ambient temperature and the temperature control strategy.

[0149] The processing unit 102 is used to control the temperature of the electronic device according to a current temperature control strategy corresponding to the current ambient temperature of the electronic device.

[0150] In the disclosed embodiment, the temperature control strategy includes a temperature control sub-strategy for controlling the temperature of one or more components in the electronic device.

[0151] In the disclosed embodiment, the processing unit 102 performs temperature control on the electronic device according to the current temperature control strategy corresponding to the current ambient temperature of the electronic device in the following manner: determining a current temperature control sub-strategy for temperature control of components in the electronic device in the current temperature control strategy. Temperature control is performed on the components in the electronic device according to the current temperature control sub-strategy.

[0152] In the embodiment of the present disclosure, the processing unit 102 determines the current temperature control sub-strategy for temperature control of the electronic device in the current temperature control strategy in the following manner: based on the current temperature control strategy and the current whole machine temperature of the electronic device, determine the current temperature control sub-strategy for temperature control of components in the electronic device, wherein there is a corresponding relationship between the whole machine temperature and the temperature control sub-strategy in the temperature control strategy.

[0153] In the disclosed embodiment, the processing unit 102 determines the current temperature control sub-strategy for temperature control of components in the electronic device based on the current temperature control strategy and the current whole temperature of the electronic device in the following manner: in response to the difference between the current ambient temperature corresponding to the current temperature control strategy and the current whole temperature of the electronic device being less than a first threshold, the first temperature control sub-strategy is determined in the current temperature control strategy as the current temperature control sub-strategy for temperature control of components in the electronic device. In response to the difference between the current ambient temperature corresponding to the current temperature control strategy and the current whole temperature of the electronic device being greater than the first threshold, the second temperature control sub-strategy is determined in the current temperature control strategy as the current temperature control sub-strategy for temperature control of components in the electronic device. Among them, the temperature adjustment amplitude corresponding to the first temperature control sub-strategy is less than the temperature adjustment amplitude corresponding to the second temperature control sub-strategy. Different temperature adjustment amplitudes are determined based on different adjustment strategies for the same component, and / or based on adjustment strategies for different components.

[0154] In the embodiment of the present disclosure, the first temperature control sub-strategy and the second temperature control sub-strategy satisfy at least one of the following conditions: the number of components included in the first temperature control sub-strategy is less than the number of components included in the second temperature control sub-strategy. The temperature adjustment amplitude of the same component in the first temperature control sub-strategy is less than the temperature adjustment amplitude in the second temperature control sub-strategy.

[0155] In the disclosed embodiment, the processing unit 102 determines the current temperature control sub-strategy for temperature control of components in the electronic device based on the current temperature control strategy and the current temperature of the electronic device in the following manner: in response to the current ambient temperature being less than the second threshold, the third temperature control sub-strategy is determined in the current temperature control strategy as the current temperature control sub-strategy for temperature control of components in the electronic device. In response to the current ambient temperature being greater than the second threshold, the fourth temperature control sub-strategy is determined in the current temperature control strategy as the current temperature control sub-strategy for temperature control of components in the electronic device. The temperature adjustment amplitude corresponding to the third temperature control sub-strategy is greater than the temperature adjustment amplitude corresponding to the fourth temperature control sub-strategy. Different temperature adjustment amplitudes are determined based on different adjustment strategies for the same component and / or based on adjustment strategies for different components.

[0156] In the disclosed embodiment, the third temperature control sub-strategy and the fourth temperature control sub-strategy satisfy at least one of the following conditions: the number of components included in the third temperature control sub-strategy is greater than the number of components included in the fourth temperature control sub-strategy. The temperature adjustment amplitude of the same component in the third temperature control sub-strategy is greater than the temperature adjustment amplitude in the fourth temperature control sub-strategy.

[0157] In the disclosed embodiment, there is a corresponding relationship between the ambient temperature, the whole machine temperature, the temperature control strategy and the temperature control sub-strategy. The corresponding relationship between the ambient temperature, the whole machine temperature, the temperature control strategy and the temperature control sub-strategy satisfies at least one of the following: There is a one-to-one correspondence between the ambient temperature and the temperature control strategy. Each component corresponds to one or more temperature control sub-strategies. There is a one-to-one correspondence between the whole machine temperature and the temperature control strategy, and the same whole machine temperature corresponds to the temperature control sub-strategies of one or more components.

[0158] In the disclosed embodiment, the ambient temperature includes a first ambient temperature and a second ambient temperature, and the first ambient temperature is lower than the second ambient temperature. The first ambient temperature corresponds to a first temperature control strategy, and the second ambient temperature corresponds to a second temperature control strategy. The number of temperature control sub-strategies included in the first temperature control strategy is greater than the number of temperature control sub-strategies included in the second temperature control strategy. Each temperature control sub-strategy includes an adjustment strategy for one or more components, and different temperature control sub-strategies include at least one of the following: the same adjustment strategy for the same component, different adjustment strategies for the same component, and adjustment strategies for different components.

[0159] In the disclosed embodiment, the processing unit 102 controls the temperature of the components in the electronic device according to the current temperature control sub-strategy in the following manner: determine the components included in the current temperature control sub-strategy and the component temperature adjustment strategies corresponding to the components. Based on a predefined manner, the component temperature adjustment strategies are respectively sent to the corresponding components to control the components to perform temperature control according to the component adjustment strategies. The predefined manner includes at least one of the following: an instruction sending manner, a secret code sending manner, and a code sending manner.

[0160] In the embodiment of the present disclosure, after the temperature of the components in the electronic device is controlled according to the current temperature control sub-strategy, the processing unit is further used to: monitor the current ambient temperature of the environment in which the electronic device is currently located and / or the current temperature of the entire device. In response to monitoring that the current ambient temperature of the environment in which the electronic device is currently located and / or the current temperature of the entire device has changed, the current temperature control strategy and / or temperature control sub-strategy is updated.

[0161] In the embodiment of the present disclosure, the processing unit 102 controls the temperature of the components in the electronic device according to the current temperature control sub-strategy in the following manner: determine whether the current temperature control sub-strategy is the same as the temperature control sub-strategy currently being used by the electronic device. In response to the current temperature control sub-strategy being the same as the temperature control sub-strategy currently being used by the electronic device, the temperature control sub-strategy currently being used is maintained to control the temperature of the components in the electronic device. In response to the current temperature control sub-strategy being different from the temperature control sub-strategy currently being used by the electronic device, the current temperature control sub-strategy is used to control the temperature of the components in the electronic device.

[0162] In the disclosed embodiment, the adjustment strategy of the component includes adjusting at least one of the following: central processing unit frequency, graphics processing unit frequency, screen brightness, screen refresh rate, wireless network duty cycle, wireless network power, number of antennas, uplink and downlink rates, and amplifier power.

[0163] Regarding the device in the above embodiment, the specific manner in which each module performs operations has been described in detail in the embodiment of the method, and will not be elaborated here.

[0164] Fig.14 2 is a block diagram of a temperature control device 200 according to an exemplary embodiment. For example, the device 200 may be a mobile phone, a computer, a digital broadcast terminal, a messaging device, a game console, a tablet device, a medical device, a fitness device, a personal digital assistant, etc.

[0165] Reference Fig.14 , the device 200 may include one or more of the following components: a processing component 202 , a memory 204 , a power component 206 , a multimedia component 208 , an audio component 210 , an input / output (I / O) interface 212 , a sensor component 214 , and a communication component 216 .

[0166] The processing component 202 generally controls the overall operation of the device 200, such as operations associated with display, phone calls, data communications, camera operations, and recording operations. The processing component 202 may include one or more processors 220 to execute instructions to perform all or part of the steps of the above-described method. In addition, the processing component 202 may include one or more modules to facilitate interaction between the processing component 202 and other components. For example, the processing component 202 may include a multimedia module to facilitate interaction between the multimedia component 208 and the processing component 202.

[0167] The memory 204 is configured to store various types of data to support operations on the device 200. Examples of such data include instructions for any application or method operating on the device 200, contact data, phone book data, messages, pictures, videos, etc. The memory 204 can be implemented by any type of volatile or non-volatile storage device or a combination thereof, such as static random access memory (SRAM), electrically erasable programmable read-only memory (EEPROM), erasable programmable read-only memory (EPROM), programmable read-only memory (PROM), read-only memory (ROM), magnetic memory, flash memory, magnetic disk or optical disk.

[0168] The power component 206 provides power to the various components of the device 200. The power component 206 may include a power management system, one or more power supplies, and other components associated with generating, managing, and distributing power for the device 200.

[0169] The multimedia component 208 includes a screen that provides an output interface between the device 200 and the user. In some embodiments, the screen may include a liquid crystal display (LCD) and a touch panel (TP). If the screen includes a touch panel, the screen may be implemented as a touch screen to receive input signals from the user. The touch panel includes one or more touch sensors to sense touch, slide, and gestures on the touch panel. The touch sensor may not only sense the boundaries of the touch or slide action, but also detect the duration and pressure associated with the touch or slide operation. In some embodiments, the multimedia component 208 includes a front camera and / or a rear camera. When the device 200 is in an operating mode, such as a shooting mode or a video mode, the front camera and / or the rear camera may receive external multimedia data. Each front camera and rear camera may be a fixed optical lens system or have a focal length and optical zoom capability.

[0170] The audio component 210 is configured to output and / or input audio signals. For example, the audio component 210 includes a microphone (MIC), and when the device 200 is in an operation mode, such as a call mode, a recording mode, and a speech recognition mode, the microphone is configured to receive an external audio signal. The received audio signal can be further stored in the memory 204 or sent via the communication component 216. In some embodiments, the audio component 210 also includes a speaker for outputting audio signals.

[0171] I / O interface 212 provides an interface between processing component 202 and peripheral interface modules, such as keyboards, click wheels, buttons, etc. These buttons may include but are not limited to: a home button, a volume button, a start button, and a lock button.

[0172] The sensor assembly 214 includes one or more sensors for providing various aspects of the status assessment of the device 200. For example, the sensor assembly 214 can detect the open / closed state of the device 200, the relative positioning of components, such as the display and keypad of the device 200, the sensor assembly 214 can also detect the position change of the device 200 or a component of the device 200, the presence or absence of user contact with the device 200, the orientation or acceleration / deceleration of the device 200 and the temperature change of the device 200. The sensor assembly 214 can include a proximity sensor configured to detect the presence of a nearby object without any physical contact. The sensor assembly 214 can also include an optical sensor, such as a CMOS or CCD image sensor, for use in imaging applications. In some embodiments, the sensor assembly 214 can also include an accelerometer, a gyroscope sensor, a magnetic sensor, a pressure sensor or a temperature sensor.

[0173] The communication component 216 is configured to facilitate wired or wireless communication between the device 200 and other devices. The device 200 can access a wireless network based on a communication standard, such as WiFi, 2G or 3G, or a combination thereof. In an exemplary embodiment, the communication component 216 receives a broadcast signal or broadcast-related information from an external broadcast management system via a broadcast channel. In an exemplary embodiment, the communication component 216 also includes a near field communication (NFC) module to facilitate short-range communication. For example, the NFC module can be implemented based on radio frequency identification (RFID) technology, infrared data association (IrDA) technology, ultra-wideband (UWB) technology, Bluetooth (BT) technology and other technologies.

[0174] In an exemplary embodiment, the apparatus 200 may be implemented by one or more application-specific integrated circuits (ASICs), digital signal processors (DSPs), digital signal processing devices (DSPDs), programmable logic devices (PLDs), field programmable gate arrays (FPGAs), controllers, microcontrollers, microprocessors or other electronic components to perform the above method.

[0175] In an exemplary embodiment, a non-transitory computer-readable storage medium including instructions is also provided, such as a memory 204 including instructions, and the instructions can be executed by the processor 220 of the device 200 to perform the above method. For example, the non-transitory computer-readable storage medium can be a ROM, a random access memory (RAM), a CD-ROM, a magnetic tape, a floppy disk, an optical data storage device, etc.

[0176] It is to be understood that in the present disclosure, "plurality" refers to two or more than two, and other quantifiers are similar. "And / or" describes the association relationship of associated objects, indicating that three relationships may exist. For example, A and / or B can represent: A exists alone, A and B exist at the same time, and B exists alone. The character " / " generally indicates that the associated objects before and after are in an "or" relationship. The singular forms "a", "the" and "the" are also intended to include plural forms, unless the context clearly indicates other meanings.

[0177] It is further understood that the terms "first", "second", etc. are used to describe various information, but such information should not be limited to these terms. These terms are only used to distinguish the same type of information from each other, and do not indicate a specific order or degree of importance. In fact, the expressions "first", "second", etc. can be used interchangeably. For example, without departing from the scope of the present disclosure, the first information can also be referred to as the second information, and similarly, the second information can also be referred to as the first information.

[0178] It will be further understood that the terms “center”, “longitudinal”, “lateral”, “front”, “back”, “up”, “down”, “left”, “right”, “vertical”, “horizontal”, “top”, “bottom”, “inside”, “outside”, etc., indicating orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, are only for the convenience of describing the present embodiment and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation.

[0179] It can be further understood that, unless otherwise specified, “connection” includes a direct connection without other components between the two, and also includes an indirect connection with other components between the two.

[0180] It is further understood that, although the operations are described in a specific order in the drawings in the embodiments of the present disclosure, it should not be understood as requiring the operations to be performed in the specific order shown or in a serial order, or requiring the execution of all the operations shown to obtain the desired results. In certain environments, multitasking and parallel processing may be advantageous.

[0181] Those skilled in the art will readily appreciate other embodiments of the present disclosure after considering the specification and practicing the invention disclosed herein. This application is intended to cover any modifications, uses or adaptations of the present disclosure, which follow the general principles of the present disclosure and include common knowledge or customary technical means in the art that are not disclosed in the present disclosure.

[0182] It should be understood that the present disclosure is not limited to the precise structures that have been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the scope of the appended claims.

Claims

1. A temperature control method, characterized in that: include: Acquire the current ambient temperature of the environment in which the electronic device is currently located, and determine a current temperature control strategy corresponding to the current ambient temperature, wherein there is a corresponding relationship between the ambient temperature and the temperature control strategy; The temperature of the electronic device is controlled according to the current temperature control strategy corresponding to the current ambient temperature of the electronic device.

2. The method according to claim 1, characterized in that The temperature control strategy includes a temperature control sub-strategy for controlling the temperature of one or more components in the electronic device.

3. The method according to claim 2, characterized in that The electronic device is temperature controlled according to a current temperature control strategy corresponding to a current ambient temperature of the electronic device, including: Determining, in the current temperature control strategy, a current temperature control sub-strategy for temperature control of components in the electronic device; The temperature of the components in the electronic device is controlled according to the current temperature control sub-strategy.

4. The method according to claim 3, characterized in that: The determining, in the current temperature control strategy, a current temperature control sub-strategy for controlling the temperature of the electronic device includes: Based on the current temperature control strategy and the current whole machine temperature of the electronic device, a current temperature control sub-strategy for temperature control of components in the electronic device is determined, wherein there is a corresponding relationship between the whole machine temperature and the temperature control sub-strategies in the temperature control strategy.

5. The method according to claim 4, characterized in that Determining a current temperature control sub-strategy for controlling the temperature of components in the electronic device based on the current temperature control strategy and the current whole temperature of the electronic device includes: In response to a difference between a current ambient temperature corresponding to a current temperature control strategy and a current temperature of the electronic device being less than a first threshold, determining in the current temperature control strategy a first temperature control sub-strategy as a current temperature control sub-strategy for temperature control of components in the electronic device; In response to a difference between a current ambient temperature corresponding to a current temperature control strategy and a current temperature of the electronic device being greater than a first threshold, determining in the current temperature control strategy a second temperature control sub-strategy as a current temperature control sub-strategy for temperature control of components in the electronic device; The temperature adjustment amplitude corresponding to the first temperature control sub-strategy is smaller than the temperature adjustment amplitude corresponding to the second temperature control sub-strategy; Different temperature adjustment amplitudes are determined based on different adjustment strategies for the same component and / or based on adjustment strategies for different components.

6. The method according to claim 5, characterized in that The first temperature control sub-strategy and the second temperature control sub-strategy satisfy at least one of the following: The number of components included in the first temperature control sub-strategy is less than the number of components included in the second temperature control sub-strategy; The temperature adjustment amplitude of the same component in the first temperature control sub-strategy is smaller than the temperature adjustment amplitude in the second temperature control sub-strategy.

7. The method according to claim 4, characterized in that Determining a current temperature control sub-strategy for controlling the temperature of components in the electronic device based on the current temperature control strategy and the current whole temperature of the electronic device includes: In response to the current ambient temperature being less than a second threshold, determining in the current temperature control strategy a third temperature control sub-strategy as a current temperature control sub-strategy for temperature control of components in the electronic device; In response to the current ambient temperature being greater than a second threshold, determining in the current temperature control strategy a fourth temperature control sub-strategy as a current temperature control sub-strategy for temperature control of components in the electronic device; The temperature adjustment amplitude corresponding to the third temperature control sub-strategy is greater than the temperature adjustment amplitude corresponding to the fourth temperature control sub-strategy; The different temperature adjustment amplitudes are determined based on different adjustment strategies for the same component and / or based on adjustment strategies for different components.

8. The method according to claim 7, characterized in that The third temperature control sub-strategy and the fourth temperature control sub-strategy satisfy at least one of the following: The number of components included in the third temperature control sub-strategy is greater than the number of components included in the fourth temperature control sub-strategy; The temperature adjustment amplitude of the same component in the third temperature control sub-strategy is greater than the temperature adjustment amplitude in the fourth temperature control sub-strategy.

9. The method according to any one of claims 1 to 8, characterized in that There is a corresponding relationship between the ambient temperature, the whole machine temperature, the temperature control strategy and the temperature control sub-strategy; The corresponding relationship between the ambient temperature, the whole machine temperature, the temperature control strategy and the temperature control sub-strategy satisfies at least one of the following: There is a one-to-one correspondence between ambient temperature and temperature control strategy; Each component corresponds to one or more temperature control sub-strategies; There is a one-to-one correspondence between the whole machine temperature and the temperature control strategy. The same whole machine temperature corresponds to the temperature control sub-strategy of one or more components.

10. The method according to claim 9, characterized in that The ambient temperature includes a first ambient temperature and a second ambient temperature, the first ambient temperature being lower than the second ambient temperature; The first ambient temperature corresponds to a first temperature control strategy, and the second ambient temperature corresponds to a second temperature control strategy; The number of temperature control sub-strategies included in the first temperature control strategy is greater than the number of temperature control sub-strategies included in the second temperature control strategy; Each temperature control sub-strategy includes an adjustment strategy for one or more components, and different temperature control sub-strategies include at least one of the following: the same adjustment strategy for the same component, different adjustment strategies for the same component, and adjustment strategies for different components.

11. The method according to claim 3, characterized in that The step of controlling the temperature of the components in the electronic device according to the current temperature control sub-strategy includes: Determine the components included in the current temperature control sub-strategy and the component temperature adjustment strategies corresponding to the components; Based on a predefined method, the component temperature adjustment strategy is sent to the corresponding components respectively, so as to control the components to perform temperature control according to the component adjustment strategy; The predefined method includes at least one of the following: an instruction sending method, a code sending method, and a code sending method.

12. The method according to any one of claims 1 to 4, characterized in that: After controlling the temperature of the components in the electronic device according to the current temperature control sub-strategy, the method further includes: Monitoring the current ambient temperature and / or the current temperature of the entire device of the current environment of the electronic device; In response to monitoring changes in the current ambient temperature of the environment in which the electronic device is currently located and / or the current temperature of the entire device, the current temperature control strategy and / or the temperature control sub-strategy is updated.

13. The method according to claim 1, characterized in that The step of controlling the temperature of the components in the electronic device according to the current temperature control sub-strategy includes: Determining whether the current temperature control sub-strategy is the same as the temperature control sub-strategy currently being used by the electronic device; In response to the current temperature control sub-strategy being the same as the temperature control sub-strategy currently being used by the electronic device, maintaining the currently being used temperature control sub-strategy to perform temperature control on components in the electronic device; In response to the current temperature control sub-strategy being different from the temperature control sub-strategy currently being used by the electronic device, the current temperature control sub-strategy is used to control the temperature of components in the electronic device.

14. The method according to claim 2, characterized in that The adjustment strategy of the component includes adjusting at least one of the following: CPU frequency, GPU frequency, screen brightness, screen refresh rate, wireless network duty cycle, wireless network power, number of antennas, uplink and downlink rates, and amplifier power.

15. A temperature control device, characterized in that: include: A determination unit, configured to obtain a current ambient temperature of an environment in which the electronic device is currently located, and determine a current temperature control strategy corresponding to the current ambient temperature, wherein there is a corresponding relationship between the ambient temperature and the temperature control strategy; The processing unit is used to control the temperature of the electronic device according to a current temperature control strategy corresponding to the current ambient temperature of the electronic device.

16. The device according to claim 15, characterized in that The temperature control strategy includes a temperature control sub-strategy for controlling the temperature of one or more components in the electronic device.

17. The device according to claim 16, characterized in that The processing unit controls the temperature of the electronic device according to the current temperature control strategy corresponding to the current ambient temperature of the electronic device in the following manner: Determining, in the current temperature control strategy, a current temperature control sub-strategy for temperature control of components in the electronic device; The temperature of the components in the electronic device is controlled according to the current temperature control sub-strategy.

18. The device according to claim 17, characterized in that The processing unit determines a current temperature control sub-strategy for controlling the temperature of the electronic device in the current temperature control strategy in the following manner: Based on the current temperature control strategy and the current whole machine temperature of the electronic device, a current temperature control sub-strategy for temperature control of components in the electronic device is determined, wherein there is a corresponding relationship between the whole machine temperature and the temperature control sub-strategies in the temperature control strategy.

19. The device according to claim 18, characterized in that The processing unit determines a current temperature control sub-strategy for controlling the temperature of components in the electronic device based on the current temperature control strategy and the current temperature of the electronic device in the following manner: In response to a difference between a current ambient temperature corresponding to a current temperature control strategy and a current temperature of the electronic device being less than a first threshold, determining in the current temperature control strategy a first temperature control sub-strategy as a current temperature control sub-strategy for temperature control of components in the electronic device; In response to a difference between a current ambient temperature corresponding to a current temperature control strategy and a current temperature of the electronic device being greater than a first threshold, determining in the current temperature control strategy a second temperature control sub-strategy as a current temperature control sub-strategy for temperature control of components in the electronic device; The temperature adjustment amplitude corresponding to the first temperature control sub-strategy is smaller than the temperature adjustment amplitude corresponding to the second temperature control sub-strategy; Different temperature adjustment amplitudes are determined based on different adjustment strategies for the same component and / or based on adjustment strategies for different components.

20. The device according to claim 19, characterized in that The first temperature control sub-strategy and the second temperature control sub-strategy satisfy at least one of the following: The number of components included in the first temperature control sub-strategy is less than the number of components included in the second temperature control sub-strategy; The temperature adjustment amplitude of the same component in the first temperature control sub-strategy is smaller than the temperature adjustment amplitude in the second temperature control sub-strategy.

21. The device according to claim 18, characterized in that The processing unit determines a current temperature control sub-strategy for controlling the temperature of components in the electronic device based on the current temperature control strategy and the current temperature of the electronic device in the following manner: In response to the current ambient temperature being less than a second threshold, determining in the current temperature control strategy a third temperature control sub-strategy as a current temperature control sub-strategy for temperature control of components in the electronic device; In response to the current ambient temperature being greater than a second threshold, determining in the current temperature control strategy a fourth temperature control sub-strategy as a current temperature control sub-strategy for temperature control of components in the electronic device; The temperature adjustment amplitude corresponding to the third temperature control sub-strategy is greater than the temperature adjustment amplitude corresponding to the fourth temperature control sub-strategy; The different temperature adjustment amplitudes are determined based on different adjustment strategies for the same component and / or based on adjustment strategies for different components.

22. The device according to claim 21, characterized in that The third temperature control sub-strategy and the fourth temperature control sub-strategy satisfy at least one of the following: The number of components included in the third temperature control sub-strategy is greater than the number of components included in the fourth temperature control sub-strategy; The temperature adjustment amplitude of the same component in the third temperature control sub-strategy is greater than the temperature adjustment amplitude in the fourth temperature control sub-strategy.

23. The device according to any one of claims 15 to 22, characterized in that There is a corresponding relationship between the ambient temperature, the whole machine temperature, the temperature control strategy and the temperature control sub-strategy; The corresponding relationship between the ambient temperature, the whole machine temperature, the temperature control strategy and the temperature control sub-strategy satisfies at least one of the following: There is a one-to-one correspondence between ambient temperature and temperature control strategy; Each component corresponds to one or more temperature control sub-strategies; There is a one-to-one correspondence between the whole machine temperature and the temperature control strategy. The same whole machine temperature corresponds to the temperature control sub-strategy of one or more components.

24. The device according to claim 23, characterized in that The ambient temperature includes a first ambient temperature and a second ambient temperature, the first ambient temperature being lower than the second ambient temperature; The first ambient temperature corresponds to a first temperature control strategy, and the second ambient temperature corresponds to a second temperature control strategy; The number of temperature control sub-strategies included in the first temperature control strategy is greater than the number of temperature control sub-strategies included in the second temperature control strategy; Each temperature control sub-strategy includes an adjustment strategy for one or more components, and different temperature control sub-strategies include at least one of the following: the same adjustment strategy for the same component, different adjustment strategies for the same component, and adjustment strategies for different components.

25. The device according to claim 17, characterized in that The processing unit controls the temperature of the components in the electronic device according to the current temperature control sub-strategy in the following manner: Determine the components included in the current temperature control sub-strategy and the component temperature adjustment strategies corresponding to the components; Based on a predefined method, the component temperature adjustment strategy is sent to the corresponding components respectively, so as to control the components to perform temperature control according to the component adjustment strategy; The predefined method includes at least one of the following: an instruction sending method, a code sending method, and a code sending method.

26. The device according to any one of claims 15 to 18, characterized in that After the temperature of the components in the electronic device is controlled according to the current temperature control sub-strategy, the processing unit is further used to: Monitoring the current ambient temperature and / or the current temperature of the entire device of the current environment of the electronic device; In response to monitoring changes in the current ambient temperature of the environment in which the electronic device is currently located and / or the current temperature of the entire device, the current temperature control strategy and / or the temperature control sub-strategy is updated.

27. The device according to claim 15, characterized in that The processing unit controls the temperature of the components in the electronic device according to the current temperature control sub-strategy in the following manner: Determining whether the current temperature control sub-strategy is the same as the temperature control sub-strategy currently being used by the electronic device; In response to the current temperature control sub-strategy being the same as the temperature control sub-strategy currently being used by the electronic device, maintaining the currently being used temperature control sub-strategy to control the temperature of components in the electronic device; In response to the current temperature control sub-strategy being different from the temperature control sub-strategy currently being used by the electronic device, the current temperature control sub-strategy is used to control the temperature of components in the electronic device.

28. The device according to claim 16, characterized in that The adjustment strategy of the component includes adjusting at least one of the following: CPU frequency, GPU frequency, screen brightness, screen refresh rate, wireless network duty cycle, wireless network power, number of antennas, uplink and downlink rates, and amplifier power.

29. A temperature control device, characterized in that: include: processor; a memory for storing processor-executable instructions; Wherein, the processor is configured to: The method is configured to call the instructions stored in the memory to execute the method according to any one of claims 1 to 14.

30. A storage medium, characterized in that: The storage medium stores instructions, and when the instructions in the storage medium are executed by a processor of an electronic device, the electronic device is enabled to execute the method described in any one of claims 1 to 14.

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