Baking device for wafer bonding equipment

Abstract

The present invention relates to the field of wafer bonding technology, and specifically to a baking device used in wafer bonding equipment, which mainly solves the technical problem of low efficiency of existing wafer baking devices. The device is provided with a baking box, and the front side wall of the baking box is provided with an operation window. The baking box is provided with a hot plate carrier box and a top support mechanism that can be independently lifted and lowered. The front side of the hot plate carrier box is open and docked with the front side wall of the baking box to form a baking cavity. A plurality of heating plates are provided in the hot plate carrier box. The heating plates of different layers can be aligned with the operation opening by lifting the hot plate carrier box. The manipulator cooperates with the top support mechanism to place the wafer on the corresponding heating plate, so that multiple wafers can be baked at the same time, which greatly improves the baking efficiency of the wafer. At the same time, the device adopts a method of direct contact between the heating plate and the wafer for baking, which is more conducive to ensuring the temperature uniformity during baking, and is also conducive to ensuring the thermal adaptability during annealing, avoiding wafer cracking caused by different thermal expansion coefficients of heterogeneous wafers.

Description

Technical Field

[0001] The invention relates to the technical field of wafer bonding, and in particular to a baking device used in wafer bonding equipment. Background Art

[0002] Wafer bonding is the process of tightly combining two mirror-polished homogeneous or heterogeneous wafers through chemical and physical effects to achieve vertical stacking and electrical interconnection in 3D integration and advanced packaging. Baking is an extremely important step in wafer bonding pretreatment. Its main function is to remove viscous gas molecules on the inner wall of the crystal micro-cavity and the surface of the wafer, further enhance the wafer vacuum, thereby enhancing the wafer bonding strength and reducing the wafer bonding void rate. Wafer baking needs to be performed in a vacuum environment.

[0003] Existing wafer baking devices are generally equipped with a vacuum operation chamber when in use. The vacuum operation chamber is connected to the baking chamber through a gate valve. A manipulator is provided in the vacuum operation chamber. The manipulator picks up the wafer and sends the wafer to the baking chamber through the gate valve. The manipulator then retracts the wafer and finally closes the gate valve for baking. However, since the manipulator also needs to dock with structures such as the visual alignment device and the bonding device, and is restricted by factors such as structural cost and space size, the vertical range of motion of the manipulator is relatively small. There is generally only one station in the baking chamber that docks with the manipulator, that is, the baking chamber can only bake a single wafer, and the baking efficiency is low. Summary of the invention

[0004] In order to overcome the technical defect of low efficiency of the existing wafer baking device, the present invention provides a baking device for use in a wafer bonding device.

[0005] The baking device for wafer bonding equipment provided by the present invention comprises:

[0006] frame;

[0007] A baking oven, which is fixed on the frame, wherein the front side wall of the baking oven is provided with an operation window for avoiding the manipulator, and the operation window is provided with an opening and closing valve;

[0008] A vacuum pumping mechanism, which is fixed on the frame and communicated with the inner cavity of the baking oven;

[0009] A hot plate carrier box is installed in the baking oven and can slide in the vertical direction, the front side of the hot plate carrier box is open and butts against the front side wall of the baking oven, and a plurality of horizontally arranged heating plates are fixed in the hot plate carrier box and the plurality of heating plates are spaced apart in the vertical direction;

[0010] A first lifting rod, which seals and penetrates the bottom wall of the baking box and is connected to the bottom wall of the hot plate carrier box, the first lifting rod is connected to a first driving member for driving the first lifting rod to move up and down, the first driving member drives the hot plate carrier box to move up and down through the first lifting rod so that each heating plate can be aligned with the operation window;

[0011] A top support mechanism, comprising a mounting frame installed in the baking oven and capable of sliding in a vertical direction, a plurality of top support assemblies being arranged on the mounting frame, the plurality of top support assemblies being arranged one-to-one correspondingly to the heating plates, a plurality of avoidance windows being provided on the rear side wall of the hot plate carrier box corresponding to the plurality of top support assemblies, the top support assembly comprising a mounting plate, a rear end of the mounting plate being fixedly connected to the mounting frame, a front end of the mounting plate extending into the hot plate carrier box through the corresponding avoidance window and being located below the corresponding heating plate, an ejector pin being fixed above the front end of the mounting plate, and a through hole being provided on the heating plate at a position corresponding to the ejector pin;

[0012] A second lifting rod, which seals and passes through the bottom wall of the baking oven and is located directly below the mounting frame, is connected to a second driving member for driving the second lifting rod to lift the supporting mechanism via the second lifting rod so that the ejector pin can pass through the corresponding through hole and lift the corresponding wafer.

[0013] Optionally, a fixing frame is provided in the baking oven and is located at the rear side of the mounting frame. Two groups of vertically arranged guide rails are fixed to the front side of the fixing frame. The mounting frame and the hot plate carrier box are slidably connected to the two groups of guide rails respectively.

[0014] Optionally, both the first lifting rod and the second lifting rod pass through the bottom wall of the baking oven through a sliding sealing assembly, and the sliding sealing assembly includes a bellows sleeved on the outside of the first lifting rod or the outside of the second lifting rod, and connecting plates are provided at both ends of the bellows. The connecting plate at the upper end of the bellows is sealingly connected to the lower surface of the bottom wall of the baking oven, and the connecting plate at the lower end of the bellows is sealingly connected to a flange, and the upper surface of the flange is provided with a mounting groove, and the bottom end of the first lifting rod or the bottom end of the second lifting rod is sleeved and fixed in the mounting groove.

[0015] Optionally, the sliding sealing assembly further includes an oil-free bushing, which is disposed in the bottom wall of the baking oven, and the first lifting rod or the second lifting rod is slidably sleeved in the oil-free bushing.

[0016] Optionally, the first driving member and the second driving member are both a motor screw pair, the motor screw pair includes a fixed plate located below the baking oven, the fixed plate is fixedly connected to the baking oven via a vertically arranged guide rod, the motor screw pair also includes a screw, the bottom end of the screw is rotatably connected to the fixed plate, the top end of the screw is connected to a servo motor for driving the screw to rotate, the housing of the servo motor is fixed to the lower surface of the bottom wall of the baking oven, a nut is threaded on the screw, the nut is fixedly connected to the flange and slidably sleeved on the guide rod.

[0017] Optionally, the opening and closing valve is a gate valve.

[0018] Optionally, a first heat reflection screen is provided on the inner side of the top wall, the inner side of the bottom wall, the inner side of the left wall, the inner side of the right wall and the inner side of the rear wall of the hot plate carrier box, and a second heat reflection screen is provided on the inner side of the front wall of the baking oven.

[0019] Optionally, vertical plates are fixed to the inner sides of the first heat reflection screens on the left and right sides, and the inner surfaces of the vertical plates are provided with multiple slots spaced apart along the vertical direction corresponding to the heating plates, and the left and right ends of the heating plates are snapped into the slots of the corresponding vertical plates.

[0020] Optionally, a cooling pipe is provided on the outside of the baking oven.

[0021] Optionally, the vacuum extraction mechanism is connected to the rear wall of the baking oven, the cooling pipe is provided on the outer side of the rear wall, the outer side of the left wall and the outer side of the right wall of the baking oven, and the top wall of the baking oven is provided with a vacuum gauge and an adapter for connecting a detection device.

[0022] The technical solution provided by the present invention has the following advantages compared with the prior art:

[0023] The baking device for wafer bonding equipment provided by the present invention is provided with a baking box, the front side wall of the baking box is provided with an operation window, the baking box is provided with a hot plate carrier box and a top support mechanism that can be independently lifted and lowered, the front side of the hot plate carrier box is open and docked with the front side wall of the baking box to form a baking cavity, and a plurality of heating plates are provided in the hot plate carrier box, and the heating plates of different layers can be aligned with the operation opening by lifting the hot plate carrier box, and the manipulator places the wafer on the corresponding heating plate through the operation window and the top support mechanism, so that multiple wafers can be baked at the same time, greatly improving the baking efficiency of the wafer. At the same time, the baking device adopts a method of direct contact between the heating plate and the wafer for baking, which is more conducive to ensuring the temperature uniformity during baking, and is also conducive to ensuring the thermal adaptability during annealing, and avoiding wafer cracking caused by different thermal expansion coefficients of heterogeneous wafers. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the invention and, together with the description, serve to explain the principles of the invention.

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings required for use in the embodiments or the description of the prior art will be briefly introduced below. Obviously, for ordinary technicians in this field, other drawings can be obtained based on these drawings without paying any creative work.

[0026] Figure 1 A three-dimensional diagram showing the overall structure of a baking device according to an embodiment of the present invention;

[0027] Figure 2 A cutaway perspective view of a baking oven and its inner structure along the front-to-back direction in an embodiment of the present invention;

[0028] Figure 3 A three-dimensional diagram showing the assembly structure of the hot plate carrier box and the top support mechanism in an embodiment of the present invention;

[0029] Figure 4 A three-dimensional diagram showing a top support mechanism according to an embodiment of the present invention;

[0030] Figure 5 A cutaway perspective view showing the assembly structure of the hot plate carrier box and the top support mechanism in the embodiment of the present invention along the left and right directions;

[0031] Figure 6 A three-dimensional cutaway view along the left-right direction of the lifting drive related structure in an embodiment of the present invention is shown.

[0032] In the figure:

[0033] 1. Rack; 2. Baking box; 21. Operation window; 22. Opening and closing valve; 23. Fixed frame; 24. Guide rail; 25. Second reflection screen; 26. Vacuum gauge; 27. Adapter; 3. Vacuum pumping mechanism; 4. Hot plate carrier box; 41. Heating plate; 42. Avoidance window; 43. First heat reflection screen; 44. Vertical plate; 441. Card slot; 5. First lifting rod; 51. First driving member; 6. Support mechanism; 61. Mounting frame; 62 , top support assembly; 621, mounting plate; 622, ejector pin; 7, second lifting rod; 71, second driving member; 8, sliding seal assembly; 81, bellows; 82, connecting plate; 83, flange; 831, mounting groove; 84, oil-free bushing; 9, motor screw pair; 91, fixing plate; 92, guide rod; 93, screw; 94, servo motor; 95, nut member; 951, lifting plate; 952, nut; 10, cooling pipe. DETAILED DESCRIPTION

[0034] In order to more clearly understand the above-mentioned objectives, features and advantages of the present invention, the scheme of the present invention will be further described below. It should be noted that the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict.

[0035] In the following description, many specific details are set forth to facilitate a full understanding of the present invention, but the present invention may also be implemented in other ways different from those described herein; it is obvious that the embodiments in the specification are only part of the embodiments of the present invention, rather than all of the embodiments.

[0036] Combine the following Figures 1 to 6 The specific embodiments of the present invention are described in detail.

[0037] The present embodiment provides a baking device for use in a wafer bonding device, comprising a frame 1, a baking box 2, a vacuum pumping mechanism 3, a hot plate carrier box 4, a first lifting rod 5, a supporting mechanism 6 and a second lifting rod 7.

[0038] Rack 1:

[0039] Specifically, the rack 1 is a box-type frame structure, and the baking oven 2 is fixed on the top of the box-type frame structure, which makes installation and maintenance more convenient.

[0040] Furthermore, a roller is added to the bottom end of the frame 1, and the roller is equipped with a brake structure to facilitate the movement of the entire device.

[0041] Oven 2:

[0042] The baking oven 2 is fixed on the frame 1 , and the front side wall of the baking oven 2 is provided with an operation window 21 for avoiding the robot, and the operation window 21 is provided with an opening and closing valve 22 .

[0043] It is easy to understand that the baking oven 2 is a closed structure, and a sealed cavity is formed therein.

[0044] It should be noted that when the wafer is placed, the on-off valve 22 is opened; when the baking operation is performed, the on-off valve 22 is closed. Specifically, the on-off valve 22 adopts a plug valve structure, which has a compact structure and reliable performance.

[0045] Vacuum extraction mechanism 3:

[0046] The vacuum pumping mechanism 3 is fixed on the frame 1 and communicated with the inner cavity of the baking oven 2 .

[0047] Specifically, the vacuuming mechanism 3 is connected to the rear wall of the baking oven 2 to form a vacuum environment in the sealed cavity.

[0048] Hot plate carrier box 4:

[0049] The hot plate carrier box 4 is installed in the baking oven 2 and can slide in the vertical direction. The front side of the hot plate carrier box 4 is open and docked with the front side wall of the baking oven 2. Multiple horizontally arranged heating plates 41 are fixed in the hot plate carrier box 4 and the multiple heating plates 41 are spaced apart in the vertical direction.

[0050] During operation, the hot plate carrier box 4 slides vertically to align different heating plates 41 with the operation window 21 in sequence, and then the robot places the wafer on the corresponding heating plate 41 through the operation window 21, thereby achieving the purpose of baking multiple wafers at the same time.

[0051] It should be noted that since the heat source during baking comes from the heating plate 41, that is, the effective space for baking the wafers is the inner cavity of the hot plate carrier box 4, the front side of the hot plate carrier box 4 is docked with the front side wall of the baking box 2 to form a closed cavity in the inner cavity of the hot plate carrier box 4, which is beneficial to reduce heat loss.

[0052] Specifically, the heating plate 41 adopts an electric heating method, and the temperature uniformity is good. The connecting cable of the heating plate 41 is led out through a ceramic tube, which is more conducive to reducing heat loss.

[0053] Specifically, a fixing frame 23 is provided in the baking oven 2 at the rear side of the hot plate carrier box 4, a vertically arranged guide rail 24 is fixed to the front side of the fixing frame 23, and the hot plate carrier box 4 is slidably connected to the guide rail 24, so that the hot plate carrier box 4 can slide in the vertical direction.

[0054] First lifting rod 5:

[0055] The first lifting rod 5 seals and penetrates the bottom wall of the baking oven 2 and is connected to the bottom wall of the hot plate carrier box 4. The first lifting rod 5 is connected to a first driving member 51 for driving the first lifting rod 5 to move up and down. The first driving member 51 drives the hot plate carrier box 4 to move up and down through the first lifting rod 5 so that each heating plate 41 can be aligned with the operating window 21.

[0056] Specifically, the first lifting rod 5 passes through the bottom wall of the baking oven 2 through the sliding sealing assembly 8. The sliding sealing assembly 8 includes a bellows 81 sleeved on the outside of the first lifting rod 5. Both ends of the bellows 81 are provided with connecting plates 82. The connecting plate 82 at the upper end of the bellows 81 is sealed and connected to the lower surface of the bottom wall of the baking oven 2. The connecting plate 82 at the lower end of the bellows 81 is sealed and connected to a flange 83. The upper surface of the flange 83 is provided with a mounting groove 831. The bottom end of the first lifting rod 5 is sleeved and fixed in the mounting groove 831. The bellows 81 can be compressed and deformed or stretched with the lifting and lowering of the first lifting rod 5, and cooperates with the flange 83 to always maintain the seal between the first lifting rod 5 and the bottom wall of the baking oven 2 during the movement of the first lifting rod 5. Compared with sliding sealing structures such as rubber sleeves, this sliding sealing method will not produce debris due to wear, thereby avoiding the contamination of the closed cavity by debris, ensuring the vacuum degree of the closed cavity, and then ensuring the quality of wafer bonding. At the same time, this sliding sealing method has a long service life and does not require frequent maintenance and replacement. More specifically, the connection plate 82 is sealed to the lower surface of the bottom wall of the baking oven 2 and the flange plate 83 via a sealing ring.

[0057] Furthermore, the sliding seal assembly 8 further includes an oil-free bushing 84, which is disposed in the bottom wall of the baking oven 2, and the first lifting rod 5 is slidably sleeved in the oil-free bushing 84. It is easy to understand that a through hole is provided in the bottom wall of the baking oven 2 corresponding to the position of the first lifting rod 5, and the oil-free bushing 84 is sleeved in the through hole, and the first lifting rod 5 is sleeved in the oil-free bushing 84. The oil-free bushing 84 can guide the first lifting rod 5, thereby ensuring the movement accuracy of the first lifting rod 5, and the oil-free bushing 84 does not require a medium such as lubricating oil, which can avoid contamination of the closed cavity and ensure the vacuum degree of the closed cavity.

[0058] Specifically, the first driving member 51 is a motor screw pair 9, which includes a fixed plate 91 located below the baking box 2, and the fixed plate 91 is fixedly connected to the baking box 2 through a vertically arranged guide rod 92. The motor screw pair 9 also includes a screw 93, the bottom end of the screw 93 is rotatably connected to the fixed plate 91, and the top end of the screw 93 is connected to a servo motor 94 for driving the rotation thereof. The housing of the servo motor 94 is fixed to the lower surface of the bottom wall of the baking box 2, and a nut member 95 is screwed on the screw 93, and the nut member 95 is fixedly connected to the flange 83 and slidably sleeved on the guide rod 92. The output shaft of the servo motor 94 rotates to drive the screw 93 to rotate, thereby driving the nut member 95 to move up and down, and then driving the first lifting rod 5 to lift, and finally realizing the lifting of the hot plate carrier box 4. In detail, the nut member 95 includes a lifting plate 951 and a nut 952 fixed in the lifting plate 951, the lifting plate 951 is slidably connected to the guide rod 92, and the nut 952 is screwed to the screw 93.

[0059] Top support mechanism 6:

[0060] The top support mechanism 6 includes a mounting frame 61 which is installed in the baking oven 2 and can slide in the vertical direction. A plurality of top support assemblies 62 are provided on the mounting frame 61. The plurality of top support assemblies 62 are arranged one-to-one corresponding to the heating plates 41. A plurality of avoidance windows 42 are provided on the rear side wall of the hot plate carrier box 4 corresponding to the plurality of top support assemblies 62. The top support assembly 62 includes a mounting plate 621. The rear end of the mounting plate 621 is fixedly connected to the mounting frame 61. The front end of the mounting plate 621 extends into the hot plate carrier box 4 through the corresponding avoidance window 42 and is located below the corresponding heating plate 41. A top pin 622 is fixed above the front end of the mounting plate 621, and a through hole is provided on the heating plate 41 at the position corresponding to the top pin 622.

[0061] During operation, when the robot carries the wafer through the operation window 21 and moves to the top of the corresponding heating plate 41, the mounting frame 61 rises and drives the ejector pin 622 to move upward, so that the ejector pin 622 passes through the through hole and lifts the wafer to leave the robot. At this time, the robot retracts, and then the mounting frame 61 descends and drives the ejector pin 622 to move downward, so that the ejector pin 622 is lower than the upper surface of the heating plate 41, so that the wafer is directly placed on the heating plate 41.

[0062] It is easy to understand that since the multiple support assemblies 62 are all arranged on the mounting frame 61, all the support assemblies 62 are lifted and lowered synchronously, that is, when a certain wafer needs to be lifted, other wafers on the heating plate 41 will also be lifted and then dropped back.

[0063] It should be noted that since the supporting mechanism 6 needs to produce vertical movement relative to the hot plate carrier box 4, the vertical dimension of the avoidance window 42 opened on the hot plate carrier box 4 should be larger than the vertical dimension of the mounting plate 621 so as to reserve room for movement of the mounting plate 621.

[0064] Specifically, in order to ensure the stability of the wafer support, at least three ejector pins 622 need to be provided on each mounting plate 621 , which is well known to those skilled in the art.

[0065] Specifically, the oven 2 is provided with a fixing frame 23 located at the rear side of the mounting frame 61, and a vertically arranged guide rail 24 is fixed to the front side of the fixing frame 23. The mounting frame 61 is slidably connected to the guide rail 24, so that the mounting frame 61 can slide in the vertical direction. It should be noted that the mounting frame 61 and the hot plate carrier box 4 are both slidably mounted through the fixing frame 23, and two sets of guide rails 24 need to be arranged at the front side of the fixing frame 23, and the two sets of guide rails 24 are respectively connected to the mounting frame 61 and the hot plate carrier box 4. The number of each set of guide rails 24 is not limited, but in order to ensure the stability of sliding, it is preferred to set each set of guide rails 24 to two or more.

[0066] Second lifting rod 7:

[0067] The second lifting rod 7 seals and passes through the bottom wall of the baking oven 2 and is located directly below the mounting frame 61. The second lifting rod 7 is connected to a second driving member 71 for driving the lifting and lowering thereof. The second driving member 71 lifts the supporting mechanism 6 through the second lifting rod 7 so that the ejector pin 622 can pass through the corresponding through hole and lift the corresponding wafer.

[0068] Specifically, the second lifting rod 7 and the first lifting rod 5 adopt the same sliding sealing structure, that is, the second lifting rod 7 also passes through the bottom wall of the baking oven 2 through the sliding sealing assembly 8.

[0069] More specifically, the second driving member 71 and the first driving member 51 adopt the same structure, that is, the second driving member 71 is also a motor screw pair 9 .

[0070] When the second lifting rod 7 is in the state of being lifted and lowered, the lifting and lowering of the support assembly 62 will be performed synchronously with the action of the first lifting rod 5 and the action of the second lifting rod 7.

[0071] In addition, in order to reduce the heat loss in the hot plate carrier box 4, the present embodiment further provides a first heat reflection screen on the inner side of the top wall, the inner side of the bottom wall, the inner side of the left wall, the inner side of the right wall and the inner side of the rear wall of the hot plate carrier box 4, and provides a second heat reflection screen on the inner side of the front wall of the baking oven 2. The five first heat reflection screens and one second heat reflection screen can cover all surfaces of the hot plate carrier box 4, reduce the heat loss by heat reflection, thereby avoiding uneven temperature caused by excessive local heat dissipation, and further improving the temperature uniformity during baking.

[0072] It should be noted that the first heat reflecting screen and the second heat reflecting screen can be separately provided to directly serve as the box walls, or they can be fixed on the original box walls as additional structures. For example, in the present embodiment, the first heat reflecting screens provided on the left and right walls of the hot plate carrying box 4 are both separately provided to directly serve as the box walls, while the first heat reflecting screens provided on the rear wall, top wall and bottom wall of the hot plate carrying box 4 and the second heat reflecting screen on the front wall of the baking oven 2 are both fixed on the original box walls as additional structures.

[0073] It should be noted that since the front end of the mounting plate 621 of the supporting mechanism 6 needs to penetrate the rear side wall of the hot plate carrier box 4 and extend into the hot plate carrier box 4, the first heat reflection screen located on the rear side wall of the hot plate carrier box 4 needs to be provided with a hollow area corresponding to the avoidance window 42 to avoid the installation and lifting of the mounting plate 621.

[0074] Specifically, the first heat reflection screen and the second heat reflection screen are formed by stacking multiple layers of heat reflection glass at intervals.

[0075] Furthermore, vertical plates 44 are fixed to the inner sides of the first heat reflection screens on the left and right sides, and the inner surfaces of the vertical plates 44 are provided with a plurality of slots 441 spaced apart in the vertical direction corresponding to the heating plate 41, and the left and right ends of the heating plate 41 are connected to the slots 441 of the corresponding vertical plates 44. After the first heat reflection screen is arranged on the inner side of the box wall of the hot plate carrier box 4, the fixing of the heating plate 41 becomes a technical problem due to the structural particularity of the first heat reflection screen. In this embodiment, vertical plates 44 are fixed to the inner sides of the first heat reflection screens on the left and right sides, and the heating plate 41 is fixed by the slots 441 arranged on the vertical plates 44, so that the structure is more reliable.

[0076] In addition, in this embodiment, a cooling pipe 10 is provided on the outside of the baking oven 2 , and the baking oven 2 is cooled by a circulating coolant filled in the cooling pipe 10 .

[0077] Specifically, cooling pipes 10 are provided on the outer side of the rear side wall, the outer side of the left side wall and the outer side of the right side wall of the baking oven 2, and the cooling effect is good; the top wall of the baking oven 2 is provided with a vacuum gauge 26 and an adapter 27 for connecting a detection device, the vacuum gauge 26 is used to detect the vacuum degree of the closed cavity, and the adapter 27 is used to connect the detection equipment to realize automatic control of baking.

[0078] The working process of the baking device used in the wafer bonding equipment of this embodiment is as follows:

[0079] S1. The baking oven 2 is connected to the vacuum operating chamber through the operating window 21, and the gate valve is opened;

[0080] S2. Control the first lifting rod 5 to move, driving the hot plate carrier box 4 to rise and fall until the target heating plate 41 is aligned with the operating window 21;

[0081] S3. The robot picks up the wafer and extends into the interior of the hot plate carrier box 4 through the operation window 21. At this time, the wafer is located directly above the heating plate 41 and supported on the robot;

[0082] S4. Control the movement of the second lifting rod 7 to drive the mounting frame 61 to rise and fall until the ejector pin 622 lifts the wafer and separates the wafer from the robot;

[0083] S5. The robot retracts and controls the second lifting rod 7 to move, driving the mounting frame 61 downward so that the wafer falls on the heating plate 41;

[0084] S6. Repeat steps S2 to S5 until all heating plates 41 of the hot plate carrier box 4 are loaded with wafers;

[0085] S7. Close the gate valve, turn on the heating plate 41 to heat up, and bake the wafer;

[0086] S8. After baking is completed, the gate valve is opened, the ejector pin 622 lifts up the wafer, the robot arm extends into the hot plate carrier box 4, the ejector pin 622 descends to make the wafer fall on the robot arm, and the robot arm retracts to take away the wafer.

[0087] The above is only a specific implementation of the present invention, which enables those skilled in the art to understand or implement the present invention. Although detailed descriptions are given with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the aforementioned embodiments, or replace some or all of the technical features therein by equivalents; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments, and they should all be covered by the protection scope of the claims.

Claims

1. A baking device for wafer bonding equipment, characterized in that: include: Rack(1); A baking oven (2) fixed on the frame (1), the front side wall of the baking oven (2) being provided with an operation window (21) for avoiding the manipulator, and the operation window (21) being provided with an opening and closing valve (22); A vacuum extraction mechanism (3) fixed on the frame (1) and connected to the inner cavity of the baking oven (2); A hot plate carrier box (4) is installed in the baking oven (2) and can slide in the vertical direction, the front side of the hot plate carrier box (4) is open and butted against the front side wall of the baking oven (2), the inner side of the top wall, the inner side of the bottom wall, the inner side of the left side wall, the inner side of the right side wall and the inner side of the rear side wall of the hot plate carrier box (4) are all provided with a first heat reflection screen, the inner side of the front side wall of the baking oven (2) is provided with a second heat reflection screen, and a plurality of horizontally arranged heating plates (41) are fixed in the hot plate carrier box (4), and the plurality of heating plates (41) are spaced apart in the vertical direction; A first lifting rod (5), which seals and penetrates the bottom wall of the baking box (2) and is connected to the bottom wall of the hot plate carrier box (4); the first lifting rod (5) is connected to a first driving member (51) for driving the first lifting rod (5) to move up and down; the first driving member (51) drives the hot plate carrier box (4) to move up and down through the first lifting rod (5) so that each heating plate (41) can be aligned with the operating window (21); A supporting mechanism (6), comprising a mounting frame (61) mounted in the baking oven (2) and capable of sliding in a vertical direction, a plurality of supporting assemblies (62) being arranged on the mounting frame (61), the plurality of supporting assemblies (62) being arranged one-to-one corresponding to the heating plates (41), a plurality of avoidance windows (42) being provided on the rear side wall of the hot plate carrier box (4) corresponding to the plurality of supporting assemblies (62), the supporting assemblies (62) comprising a mounting plate (621), a rear end of the mounting plate (621) being fixedly connected to the mounting frame (61), a front end of the mounting plate (621) extending into the hot plate carrier box (4) through the corresponding avoidance window (42) and being located below the corresponding heating plate (41), an ejector pin (622) being fixed above the front end of the mounting plate (621), and a through hole being provided on the heating plate (41) at a position corresponding to the ejector pin (622); A second lifting rod (7) is sealed and passes through the bottom wall of the baking oven (2) and is located directly below the mounting frame (61). The second lifting rod (7) is connected to a second driving member (71) for driving the lifting of the second lifting rod (7). The second driving member (71) lifts the supporting mechanism (6) via the second lifting rod (7) so that the ejector pin (622) can pass through the corresponding through hole and lift the corresponding wafer.

2. The baking device for wafer bonding equipment according to claim 1, characterized in that: The baking oven (2) is provided with a fixing frame (23) located at the rear side of the mounting frame (61), and two groups of vertically arranged guide rails (24) are fixed to the front side of the fixing frame (23), and the mounting frame (61) and the hot plate carrier box (4) are respectively slidably connected to the two groups of guide rails (24).

3. The baking device for wafer bonding equipment according to claim 1, characterized in that: The first lifting rod (5) and the second lifting rod (7) both pass through the bottom wall of the baking oven (2) through a sliding sealing assembly (8). The sliding sealing assembly (8) comprises a bellows (81) sleeved on the outside of the first lifting rod (5) or the outside of the second lifting rod (7). Both ends of the bellows (81) are provided with connecting plates (82). The connecting plate (82) at the upper end of the bellows (81) is sealingly connected to the lower surface of the bottom wall of the baking oven (2). The connecting plate (82) at the lower end of the bellows (81) is sealingly connected to a flange (83). The upper surface of the flange (83) is provided with a mounting groove (831). The bottom end of the first lifting rod (5) or the bottom end of the second lifting rod (7) is sleeved and fixed in the mounting groove (831).

4. The baking device for wafer bonding equipment according to claim 3, characterized in that: The sliding seal assembly (8) further comprises an oil-free bushing (84), wherein the oil-free bushing (84) is arranged in the bottom wall of the baking oven (2), and the first lifting rod (5) or the second lifting rod (7) is slidably sleeved in the oil-free bushing (84).

5. The baking device for wafer bonding equipment according to claim 3, characterized in that: The first driving member (51) and the second driving member (71) are both motor screw pairs (9), the motor screw pair (9) comprising a fixed plate (91) located below the baking oven (2), the fixed plate (91) being fixedly connected to the baking oven (2) via a vertically arranged guide rod (92), the motor screw pair (9) further comprising a screw rod (93), the bottom end of the screw rod (93) being rotatably connected to the fixed plate (91), the top end of the screw rod (93) being connected to a servo motor (94) for driving the screw rod (93) to rotate, the housing of the servo motor (94) being fixed to the lower surface of the bottom wall of the baking oven (2), a nut member (95) being screwed onto the screw rod (93), the nut member (95) being fixedly connected to the flange (83) and slidably sleeved on the guide rod (92).

6. The baking device for wafer bonding equipment according to claim 1, characterized in that: The on-off valve (22) is a gate valve.

7. The baking device for wafer bonding equipment according to claim 1, characterized in that: Vertical plates (44) are fixed to the inner sides of the first heat reflection screens located on the left and right sides, and the inner surfaces of the vertical plates (44) are provided with a plurality of slots (441) spaced apart in the vertical direction corresponding to the heating plates (41), and the left and right ends of the heating plates (41) are snap-connected in the slots (441) corresponding to the vertical plates (44).

8. The baking device used in wafer bonding equipment according to any one of claims 1 to 6, characterized in that: A cooling pipe (10) is provided on the outside of the baking oven (2).

9. The baking device for wafer bonding equipment according to claim 8, characterized in that: The vacuum extraction mechanism (3) is connected to the rear side wall of the baking oven (2); the cooling pipe (10) is provided on the outer side of the rear side wall, the outer side of the left side wall and the outer side of the right side wall of the baking oven (2); and the top wall of the baking oven (2) is provided with a vacuum gauge (26) and an adapter (27) for connecting a detection device.

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