Packaging structure and processing method thereof

Abstract

The invention discloses a packaging structure and a processing method thereof. The packaging structure comprises an electronic component; the packaging part is used for wrapping the other surfaces, except the first surface, of the electronic component; and the heat dissipation layer is arranged on the first surface and is in contact with the first surface. According to the packaging structure provided by the embodiment of the invention, the heat dissipation layer is arranged on the packaging piece, and no air gap exists between the heat dissipation layer and the electronic element, so that the heat dissipation effect can be improved, the size of the packaging structure can be miniaturized, and the packaging structure is convenient to integrate and assemble.

Description

Technical Field

[0001] The invention belongs to the technical field of electronic component packaging, and particularly relates to a packaging structure and a processing method thereof. Background Art

[0002] In modern high-performance electronic devices, the heat dissipation problem of semiconductor devices is becoming increasingly prominent. As a special heat dissipation device, semiconductor radiators can improve the heat dissipation of semiconductors, prevent them from being damaged due to overheating, and ensure that semiconductor devices can work stably. Existing semiconductor radiators are usually metal cover structures. During assembly, the semiconductor device is mounted on a substrate, and the metal cover is placed on top of the semiconductor device and then connected to the substrate. This results in an air gap between the radiator and the semiconductor device, and the air gap affects the heat dissipation efficiency of the semiconductor device. In addition, since the metal cover structure is relatively thick and its cover is located above the semiconductor device, the overall volume is increased, which is not conducive to the miniaturization and high-integration assembly of electronic components. Summary of the invention

[0003] The purpose of the embodiments of the present invention is to provide a packaging structure and a processing method thereof, so as to solve the problem that the heat sink in the existing packaging structure is relatively thick, which is not conducive to the miniaturization and highly integrated assembly of electronic components, and there is an air gap between the heat sink and the electronic components, which affects the heat dissipation efficiency.

[0004] A first embodiment of the present invention provides a packaging structure, including:

[0005] Electronic components;

[0006] A packaging component, used for covering other surfaces of the electronic component except the first surface;

[0007] The heat dissipation layer is disposed on the first surface and contacts the first surface.

[0008] Preferably, the heat dissipation layer is a metal foil attached to the first surface.

[0009] Preferably, the heat dissipation layer is a metal plating layer formed on the first surface.

[0010] Preferably, the packaging structure further includes:

[0011] A backplane layer, the backplane layer being arranged between the electronic component and the heat dissipation layer;

[0012] An adhesive layer, the adhesive layer being disposed between the back plate layer and the electronic component to connect the back plate layer and the electronic component;

[0013] The back plate layer and the adhesive layer are provided with a plurality of through holes, and the heat dissipation layer is in contact with the first surface of the electronic component through the through holes.

[0014] Preferably, a heat dissipation fin is provided on a side of the heat dissipation layer away from the electronic component.

[0015] A second aspect of the present invention provides a method for processing a packaging structure, comprising:

[0016] Providing a package encapsulating an electronic component, wherein the package covers other surfaces of the electronic component except the first surface;

[0017] A heat dissipation layer is formed on the package, and the heat dissipation layer is in contact with the first surface.

[0018] Preferably, providing a package encapsulating an electronic component comprises:

[0019] Forming a package covering the electronic component by an epoxy molding compound molding process;

[0020] One end of the package is ground to expose the first surface of the electronic component.

[0021] Preferably, before forming the heat dissipation layer on the package, the method further comprises:

[0022] forming an adhesive layer and a backplane layer on the package in sequence;

[0023] A plurality of through holes are formed on the back plate layer and the adhesive layer, wherein the heat dissipation layer contacts the first surface of the electronic component through the through holes.

[0024] Preferably, forming a plurality of through holes on the back plate layer and the adhesive layer comprises:

[0025] The through holes are punched in the back plate layer and the adhesive layer by laser.

[0026] Preferably, the heat dissipation layer is a metal foil; and forming the heat dissipation layer on the package comprises:

[0027] The metal foil is attached to the package.

[0028] Preferably, the heat dissipation layer is a metal plating layer, and forming the heat dissipation layer on the package comprises:

[0029] The metal plating layer is formed on the package by sputtering.

[0030] Preferably, a heat dissipation fin is provided on a side of the heat dissipation layer away from the electronic component, and after the heat dissipation layer is formed on the package, the method further comprises:

[0031] The heat dissipation fins are formed on the heat dissipation layer by a mask electroplating process.

[0032] According to the packaging structure of the embodiment of the present invention, by providing a heat dissipation layer on the packaging component, and without an air gap between the heat dissipation layer and the electronic components, not only the heat dissipation effect can be improved, but also the volume of the packaging structure can be miniaturized, which is convenient for integrated assembly. BRIEF DESCRIPTION OF THE DRAWINGS

[0033] Figure 1 is a structural schematic diagram of a packaging structure according to an embodiment of the present invention;

[0034] Figure 2 is another structural schematic diagram of a packaging structure according to an embodiment of the present invention;

[0035] Figure 3 is another structural schematic diagram of a packaging structure according to an embodiment of the present invention;

[0036] Figure 4 A schematic diagram of a structure in which a packaging member of a packaging structure according to an embodiment of the present invention encapsulates an electronic component;

[0037] Figure 5 It is another structural schematic diagram of a packaging structure encapsulating an electronic component according to an embodiment of the present invention;

[0038] Figure 6 It is another structural schematic diagram of a packaging structure encapsulating an electronic component according to an embodiment of the present invention;

[0039] Figure 7 4 is a flow chart of a method for processing a packaging structure according to an embodiment of the present invention.

[0040] Reference numerals

[0041] Packaging structure 100;

[0042] Electronic component 10; first surface 11; polyimide protection film 12; pad 13; conductive bump 14; redistribution layer 15; solder ball 16; polyimide adhesive layer 17;

[0043] Package 20;

[0044] Heat dissipation layer 30; heat dissipation fins 31;

[0045] Back plate layer 40; through hole 41;

[0046] Adhesive layer 50 . DETAILED DESCRIPTION

[0047] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0048] The terms "first", "second", etc. in the specification and claims of the present invention are used to distinguish similar objects, and are not used to describe a specific order or sequence. It should be understood that the terms used in this way are interchangeable under appropriate circumstances, so that the embodiments of the present invention can be implemented in an order other than those illustrated or described herein. In addition, the term "and / or" in the specification and claims means at least one of the connected objects, and the character " / " generally indicates that the objects associated with each other are in an "or" relationship.

[0049] The following is combined with Figures 1 to 6 , the packaging structure 100 provided by the embodiment of the present invention is described in detail through specific embodiments and application scenarios.

[0050] like Figure 1 As shown, the packaging structure 100 according to the embodiment of the present invention includes an electronic component 10 , a packaging member 20 and a heat dissipation layer 30 .

[0051] Specifically, the package 20 is used to cover other surfaces of the electronic component 10 except the first surface 11 , and the heat dissipation layer 30 is disposed on the first surface 11 and in contact with the first surface 11 .

[0052] That is to say, compared with the heat dissipation cover structure in the prior art, the heat dissipation layer 30 is thinner in thickness, and there is no air gap between the heat dissipation layer 30 and the electronic component 10. The heat dissipation layer 30 directly transfers the heat dissipated by the electronic component 10 to the outside air, which can not only improve the heat dissipation effect, but also miniaturize the overall volume of the packaging structure 100, thereby facilitating high-integration assembly.

[0053] It should be noted that if Figures 1 to 3 In the illustrated embodiment, the electronic component 10 may be a silicon wafer, and the packaging structure 100 may further include: a solder pad 13, a conductive bump 14, a redistribution layer 15, a solder ball 16, a polyimide bonding layer 17, and a polyimide protective film 12. The silicon wafer is covered by a package 20, the upper surface of the silicon wafer is a first surface 11, the lower surface of the silicon wafer is connected to the solder pad 13, and the redistribution layer 15 located on the outer side of the bottom surface of the package 20 is connected to the solder pad 13 through the conductive bump 14. A plurality of solder balls 16 are arranged on the surface of the redistribution layer 15, wherein the silicon wafer and the solder pad 13 and the conductive bump 14 are bonded by a polyimide bonding layer 17, and a polyimide protective film 12 is provided on the outer side of the bottom surface of the package 20 to cover the redistribution layer 15.

[0054] Therefore, according to the packaging structure 100 of the embodiment of the present invention, by setting the heat dissipation layer 30 on the packaging part 20, and there is no air gap between the heat dissipation layer 30 and the electronic component 10, not only the heat dissipation effect can be improved, but also the volume of the packaging structure 100 can be miniaturized, which is convenient for integrated assembly.

[0055] Alternatively, if Figure 1 As shown, in some embodiments of the present invention, the heat dissipation layer 30 is a metal foil attached to the first surface 11. The metal foil can be copper foil. The copper foil has a small thickness, small volume, light weight, high density, and good thermal conductivity. It can effectively absorb the heat of the electronic component 10 and then disperse it on its entire surface and transfer the heat to the outside air, thereby reducing the temperature of the electronic component 10.

[0056] Alternatively, if Figure 1 and Figure 2 As shown, in some other embodiments of the present invention, the heat dissipation layer 30 is a metal plating layer formed on the first surface 11. The metal plating layer may be a copper plating layer, which has a good heat dissipation effect.

[0057] According to an embodiment of the present invention, the package structure 100 may further include a backplane layer 40 and an adhesive layer 50 .

[0058] Specifically, if Figure 2 and Figure 6 As shown, the backplane layer 40 is arranged between the electronic component 10 and the heat dissipation layer 30, and the adhesive layer 50 is arranged between the backplane layer 40 and the electronic component 10 to connect the backplane layer 40 and the electronic component 10. A plurality of through holes 41 are provided on the backplane layer 40 and the adhesive layer 50, and the heat dissipation layer 30 contacts the first surface 11 of the electronic component 10 through the through holes 41.

[0059] That is to say, the backplane layer 40 is disposed on the electronic component 10 to realize the packaging of the electronic component 10. In order to enable the heat dissipation layer 30 to contact the electronic component 10, a through hole 41 is processed on the backplane layer 40 and the adhesive layer 50. In the process of forming the heat dissipation layer 30 through a plating process, the plated metal will enter the through hole 41 and contact the first surface 11, so that the heat of the first surface 11 can be transferred to the outside air during use to achieve heat dissipation.

[0060] According to one embodiment of the present invention, Figure 3 As shown, a heat dissipation fin 31 is provided on the side of the heat dissipation layer 30 away from the electronic component 10 . The heat dissipation fin 31 is provided above the heat dissipation layer 30 , which can further improve the heat dissipation effect.

[0061] like Figure 7 As shown, a processing method of a package structure 100 according to an embodiment of the second aspect of the present invention includes:

[0062] Step S100, providing a package 20 encapsulating an electronic component 10, wherein the package 20 covers other surfaces of the electronic component 10 except the first surface 11;

[0063] Step S200 , forming a heat dissipation layer 30 on the package 20 , wherein the heat dissipation layer 30 is in contact with the first surface 11 .

[0064] Specifically, after the electronic component 10 is covered by the package 20, the first surface 11 is retained, and the heat dissipation layer 30 is in direct contact with the first surface 11, so that the heat generated by the electronic component 10 is directly transferred to the air. This packaging structure processing method only requires setting the heat dissipation layer 30 on the original package 20, and the processing technology is simple and easy to operate.

[0065] Further, providing a package 20 encapsulating the electronic component 10 includes:

[0066] The package 20 covering the electronic component 10 is formed by an epoxy molding compound molding process;

[0067] One end of the packaging member 20 is ground to expose the first surface 11 of the electronic component 10 .

[0068] Specifically, if Figure 4 As shown, transfer molding can be used to extrude epoxy plastic into a mold cavity and embed the electronic component 10 therein, and after cross-linking and curing in the mold cavity, a package 20 with a certain structural shape is formed, and then the package 20 is processed by a grinding process so that it leaks out of the first surface 11, so as to facilitate the setting of a heat dissipation layer 30 on the first surface 11.

[0069] Optionally, before forming the heat dissipation layer 30 on the package 20, the method further includes:

[0070] An adhesive layer 50 and a backplane layer 40 are sequentially formed on the package 20;

[0071] A plurality of through holes 41 are formed on the back plate layer 40 and the adhesive layer 50 , wherein the heat dissipation layer 30 is in contact with the first surface 11 of the electronic component 10 through the through holes 41 .

[0072] That is to say, Figure 5 As shown, the adhesive layer 50 is coated on the first surface 11, and the back plate layer 40 is covered on the package 20. The back plate layer 40 is connected to the package 20 through the adhesive layer 50. In order to expose the first surface 11, as shown in FIG. Figure 6 As shown, a plurality of through holes 41 are processed in the back plate layer 40 and the adhesive layer 50 .

[0073] Preferably, forming a plurality of through holes 41 on the back plate layer 40 and the adhesive layer 50 comprises: punching the through holes 41 on the back plate layer 40 and the adhesive layer 50 by laser, and the laser punching has high precision.

[0074] Further, the heat dissipation layer 30 is a metal foil; forming the heat dissipation layer 30 on the package 20 includes: attaching the metal foil on the package 20 .

[0075] According to one embodiment of the present invention, a package 20 covering an electronic component 10 is formed by an epoxy molding process, and one end of the package 20 is ground to expose the first surface 11 of the electronic component 10, such as Figure 4 Then the metal foil is directly attached to the first surface 11, and the metal foil generally used is copper foil, such as Figure 1 As shown, the operation is simple.

[0076] Optionally, the heat dissipation layer 30 is a metal plating layer, and forming the heat dissipation layer 30 on the package 20 includes: forming the metal plating layer on the package 20 by sputtering.

[0077] According to another embodiment of the present invention, a package 20 covering an electronic component 10 is formed by an epoxy molding process, and one end of the package 20 is ground to expose the first surface 11 of the electronic component 10, such as Figure 4 Then, a metal layer is plated on the package 20 by a sputtering coating process in a vacuum, wherein the metal coating can be a copper coating, such as Figure 1 As shown, the copper plating layer has a strong bonding force with the first surface 11 and the structure is stable.

[0078] According to another embodiment of the present invention, first, the package 20 covering the electronic component 10 and leaking out the first surface 11 of the electronic component 10 is formed by an epoxy molding compound molding process. Then, Figure 5 As shown, the adhesive layer 50 is coated on the first surface 11, and the backplane layer 40 is covered on the package 20, and the backplane layer 40 is connected to the package 20 through the adhesive layer 50. Figure 6 As shown, in order to expose the first surface 11, a plurality of through holes 41 are processed in the back plate layer 40 and the adhesive layer 50. Finally, as shown in FIG. Figure 2 As shown, a sputtering coating process is used in a vacuum to coat a metal coating on the package 20. The metal coating can be a copper coating. During the copper plating process, the copper contacts the first surface through the through hole and adheres to the surface of the back plate layer 40 to form a heat dissipation layer.

[0079] Furthermore, a mask is arranged on the heat dissipation layer 30, and a heat dissipation fin 31 is processed on the side of the heat dissipation layer 30 away from the electronic component 10 by using a sputtering coating process, such as Figure 3As shown, the heat dissipation fins 31 can further improve the heat dissipation.

[0080] The embodiments of the present invention are described above in conjunction with the accompanying drawings, but the present invention is not limited to the above-mentioned specific implementation modes, which are merely illustrative rather than restrictive. Under the guidance of the present invention, ordinary technicians in this field can also make many forms without departing from the scope of protection of the present invention and the claims, all of which are within the protection of the present invention.

Claims

1. A packaging structure, characterized in that: include: Electronic components; A packaging component, used for covering other surfaces of the electronic component except the first surface; The heat dissipation layer is disposed on the first surface and contacts the first surface.

2. The packaging structure according to claim 1, characterized in that: The heat dissipation layer is a metal foil and is attached to the first surface.

3. The packaging structure according to claim 1, characterized in that: The heat dissipation layer is a metal plating layer formed on the first surface.

4. The packaging structure according to claim 3, characterized in that: Also includes: A backplane layer, the backplane layer being arranged between the electronic component and the heat dissipation layer; An adhesive layer, the adhesive layer being disposed between the back plate layer and the electronic component to connect the back plate layer and the electronic component; The back plate layer and the adhesive layer are provided with a plurality of through holes, and the heat dissipation layer is in contact with the first surface of the electronic component through the through holes.

5. The packaging structure according to claim 3, characterized in that: A heat dissipation fin is arranged on a side of the heat dissipation layer away from the electronic component.

6. A method for processing a packaging structure, characterized in that: include: Providing a package encapsulating an electronic component, wherein the package covers other surfaces of the electronic component except the first surface; A heat dissipation layer is formed on the package, and the heat dissipation layer is in contact with the first surface.

7. The processing method according to claim 6, characterized in that: Packages containing electronic components include: Forming a package covering the electronic component by an epoxy molding compound molding process; One end of the package is ground to expose the first surface of the electronic component.

8. The processing method according to claim 6, characterized in that: Before forming the heat dissipation layer on the package, the method further includes: forming an adhesive layer and a backplane layer on the package in sequence; A plurality of through holes are formed on the back plate layer and the adhesive layer, wherein the heat dissipation layer contacts the first surface of the electronic component through the through holes.

9. The processing method according to claim 8, characterized in that: The plurality of through holes formed on the back plate layer and the adhesive layer include: The through holes are punched in the back plate layer and the adhesive layer by laser.

10. The processing method according to claim 6, characterized in that: The heat dissipation layer is a metal foil; forming the heat dissipation layer on the package comprises: The metal foil is attached to the package.

11. The processing method according to claim 6, characterized in that: The heat dissipation layer is a metal plating layer, and forming the heat dissipation layer on the package comprises: The metal plating layer is formed on the package by sputtering.

12. The processing method according to claim 11, characterized in that: The heat dissipation layer is provided with heat dissipation fins, and after the heat dissipation layer is formed on the package, the following further comprises: The heat dissipation fins are formed on a side of the heat dissipation layer away from the electronic components by a mask electroplating process.

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