Heat dissipation component and packaging structure

Abstract

The invention provides a heat dissipation component and a packaging structure, the heat dissipation component comprises a flat-plate-shaped main body, the flat-plate-shaped main body is provided with a cavity, the cavity is used for accommodating cooling liquid, one end of the cavity is an evaporation end, and the other end of the cavity is a cooling end. A plurality of microstructures are arranged on the inner wall of the cavity at least on the side, used for making contact with a structure to be cooled, of the heat dissipation component, and a first included angle is formed between the side, facing the cooling end, of each microstructure and the inner wall of the cavity. A second included angle is formed between the side, facing the evaporation end, of the microstructure and the inner wall of the cavity, the first included angle and the second included angle are both acute angles, and the first included angle is larger than the second included angle. According to the structure, the heat dissipation capacity of the heat dissipation component is improved, the heat dissipation performance of the packaging structure is improved, and efficient heat dissipation is achieved.

Description

Technical Field

[0001] The present invention relates to the field of integrated circuit packaging, and in particular to a heat dissipation component and a packaging structure. Background Art

[0002] The chip packaging process not only protects the packaged chip, but also needs to consider the heat dissipation generated by the chip when it is working. At present, whether it is conventional plastic packaging or heat dissipation cover packaging, heat dissipation performance is a key link.

[0003] Due to the limitations of plastic encapsulation in packaging molding, the improvement of heat dissipation of packaged products can only be achieved by selecting plastic encapsulation materials. The heat dissipation of heat dissipation cover packaging is mainly determined by the heat dissipation cover, including the material and structural design of the heat dissipation cover. At present, copper with ultra-high thermal conductivity is the preferred material for the heat dissipation cover. The protrusions in the structure increase the contact area between the heat dissipation cover and the air to improve the heat dissipation efficiency.

[0004] These packaging structures still have certain defects in heat dissipation performance. For some chips that need to work at high intensity, the heat dissipated by the chip is much greater than the heat that can be dissipated by the packaging method, which will cause heat accumulation, thereby causing the chip to heat up. High temperature will affect the chip's performance and service life, and may even directly damage the chip.

[0005] Therefore, how to achieve efficient heat dissipation of the packaging structure has become a technical problem that urgently needs to be solved. Summary of the invention

[0006] The technical problem to be solved by the present invention is to provide a heat dissipation component and a packaging structure, which can increase the heat dissipation capacity of the heat dissipation component, improve the heat dissipation performance of the packaging structure, and achieve efficient heat dissipation.

[0007] In order to solve the above problems, an embodiment of the present invention provides a heat dissipation component, which includes a flat plate-shaped body, the flat plate-shaped body having a cavity, the cavity being used to accommodate a coolant, one end of the cavity being an evaporation end, and the other end being a cooling end, and a plurality of microstructures are arranged on the inner wall of the cavity at least on the side of the heat dissipation component that is used to contact the structure to be dissipated. The side of the microstructure facing the cooling end has a first angle with the inner wall of the cavity, and the side of the microstructure facing the evaporation end has a second angle with the inner wall of the cavity, the first angle and the second angle are both acute angles, and the first angle is greater than the second angle.

[0008] In one embodiment, the side surface of the microstructure facing the cooling end is peak-shaped, and the first angle is the angle between the peak of the peak-shaped protrusion and the inner wall of the cavity.

[0009] In one embodiment, a third angle is formed between two sides of the peak-shaped protrusion and the inner wall of the cavity, and the third angle is less than or equal to the first angle and greater than the second angle.

[0010] In one embodiment, the side surface of the microstructure facing the evaporation end is peak-shaped and protrudes, and the second angle is the angle between the peak of the peak-shaped protrusion and the inner wall of the cavity.

[0011] In one embodiment, a fourth angle is formed between two sides of the peak-shaped protrusion and the inner wall of the cavity, and the fourth angle is less than or equal to the second angle.

[0012] In one embodiment, the side surface of the microstructure facing the cooling end and the side surface of the microstructure facing the evaporation end are both peak-shaped protrusions, wherein the top angle of the peak-shaped protrusion of the side surface of the microstructure facing the cooling end is smaller than the top angle of the peak-shaped protrusion of the side surface of the microstructure facing the evaporation end.

[0013] In one embodiment, the side surface of the microstructure facing the evaporation end is in a flat plate shape.

[0014] In one embodiment, the cross-sectional area of ​​the microstructure gradually decreases from the top surface of the microstructure to the contact point between the microstructure and the inner wall of the cavity.

[0015] In one embodiment, the top surface of the microstructure is inclined from the cooling end toward the evaporation end.

[0016] In one embodiment, in a first direction, a plurality of the microstructures are spaced apart and a distance between two adjacent microstructures is inversely proportional to a density of the coolant, wherein the first direction is a direction from the cooling end of the cavity to the evaporation end.

[0017] In one embodiment, in a second direction, two adjacent microstructures are staggered, wherein the second direction is perpendicular to the first direction.

[0018] In one embodiment, the microstructure is disposed on all side walls of the cavity.

[0019] In one embodiment, the cavity is a sealed vacuum cavity.

[0020] In one embodiment, the material of the flat plate-shaped body is copper.

[0021] An embodiment of the present invention further provides a packaging structure, which includes: a structure to be cooled; and a heat dissipation component as described above, wherein an evaporation end of the heat dissipation component is in contact with the structure to be cooled.

[0022] In the heat dissipation component provided by the embodiment of the present invention, the evaporation of the coolant is increased to dissipate heat, thereby greatly improving the heat dissipation efficiency of the heat dissipation component; and the angle between the side of the microstructure facing the cooling end and the inner wall of the cavity (i.e., the first angle) is greater than the angle between the side of the microstructure facing the evaporation end and the inner wall of the cavity (the second angle), which can directionally draw the coolant in the cavity from the cooling end back to the evaporation end, thereby enhancing the ability of the coolant to flow from the cooling end back to the evaporation end, so that the evaporation end can replenish the coolant in time, thereby greatly improving the heat dissipation capacity and heat dissipation efficiency of the heat dissipation component, and further improving the heat dissipation efficiency of the heat dissipation component.

[0023] The packaging structure provided by the embodiment of the present invention includes the heat dissipation component, in which the evaporation of the coolant is used to dissipate heat, thereby greatly improving the heat dissipation efficiency of the heat dissipation component; and the angle between the side of the microstructure of the heat dissipation component facing the cooling end and the inner wall of the cavity (i.e., the first angle) is greater than the angle between the side of the microstructure facing the evaporation end and the inner wall of the cavity (the second angle), which can directionally draw the coolant in the cavity from the cooling end back to the evaporation end, thereby enhancing the ability of the coolant to flow from the cooling end back to the evaporation end, so that the evaporation end can replenish the coolant in time, thereby greatly improving the heat dissipation capacity of the heat dissipation component, further improving the heat dissipation efficiency of the heat dissipation component, and thereby improving the heat dissipation performance of the packaging structure, which is beneficial to improving the performance and life of the packaging structure. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present invention, the following briefly introduces the drawings required for describing the embodiments. Obviously, the drawings described below are only some embodiments of the present invention, and for ordinary technicians in this field, other drawings can be obtained based on these drawings without creative work.

[0025] Figure 1 is an internal schematic diagram of a heat dissipation component provided by an embodiment of the present invention;

[0026] Figure 2 yes Figure 1 The enlarged schematic diagram in the middle C box;

[0027] Figure 3 is a schematic diagram of the vapor coolant condensing into liquid coolant and then dripping into the inner wall of the bottom of the cavity;

[0028] Figure 4 is a schematic diagram of the flow direction of liquid coolant on the inner wall of the bottom of the cavity;

[0029] Figure 5 is a schematic top view of a microstructure in a heat dissipation component provided by an embodiment of the present invention;

[0030] Figure 6 is along Figure 5 A cross-sectional view of line A-A1;

[0031] Figure 7 is along Figure 5 Cross-sectional view of line B-B1;

[0032] Figure 8 is a schematic top view of a microstructure in a heat dissipation component provided by another embodiment of the present invention;

[0033] Fig. 9 is a schematic diagram of the distribution of the inner wall of the bottom of the cavity in the heat dissipation component provided by one embodiment of the present invention;

[0034] Figure 10 to Figure 13 Schematic diagram of packaging structures provided by different embodiments of the present invention. DETAILED DESCRIPTION

[0035] The specific implementation of the heat dissipation component and packaging structure provided by the present invention will be described in detail below with reference to the accompanying drawings.

[0036] Figure 1 is an internal schematic diagram of a heat dissipation component 100 provided in one embodiment of the present invention, Figure 2 yes Figure 1 Please refer to the enlarged diagram in the C box. Figure 1 and Figure 2 The heat dissipation component 100 includes a flat plate-shaped body 110, and the flat plate-shaped body 110 has a cavity 120, and the cavity 120 is used to accommodate a cooling liquid 130 (refer to Figure 3 and Figure 4 ), one end of the cavity 120 is an evaporation end 121, and the other end is a cooling end 122, at least in the heat dissipation component 100 for the heat dissipation structure 200 (reference Fig.10 ) are provided with a plurality of microstructures 140 on the inner wall of the cavity 120, wherein a first angle ω1 is formed between the side of the microstructure 140 facing the cooling end 122 and the inner wall of the cavity 120, and a second angle ω2 is formed between the side of the microstructure 140 facing the evaporation end 121 and the inner wall of the cavity 120, the first angle ω1 and the second angle ω2 are both acute angles, and the first angle ω1 is greater than the second angle ω2.

[0037] In the heat dissipation component 100 provided in the embodiment of the present invention, the evaporation heat dissipation of the cooling liquid 130 is added, which greatly improves the heat dissipation efficiency of the heat dissipation component 100; and the angle between the side of the microstructure 140 facing the cooling end 122 and the inner wall of the cavity 120 (i.e., the first angle ω1) is greater than the angle between the side of the microstructure 140 facing the evaporation end 121 and the inner wall of the cavity 120 (the second angle ω2), which can directionally draw the cooling liquid 130 in the cavity 120 from the cooling end 122 back to the evaporation end 121, enhance the ability of the cooling liquid 130 to flow from the cooling end 122 back to the evaporation end 121, so that the evaporation end 121 can replenish the cooling liquid 130 in time, greatly improve the heat dissipation capacity and heat dissipation efficiency of the heat dissipation component 100, and further improve the heat dissipation efficiency of the heat dissipation component 100.

[0038] The evaporation end 121 of the heat dissipation component 100 and the heat dissipation structure 200 (refer to Fig.10 ), when the evaporation end 121 contacts the heat source and receives heat to reach the evaporation temperature of the coolant 130, the coolant 130 evaporates to form a vapor coolant, and carries the heat to move toward the cooling end 122; when arriving at the cooling end 122, the coolant 130 dissipates heat, and the vapor coolant condenses into a liquid coolant. The microstructure 140 has a directional traction ability for the flow direction of the liquid, and then the liquid coolant is directional traction flowed back to the evaporation end 121 to complete the cycle. For the circulation direction of the coolant 130, please refer to Figure 1 Indicated by the arrow.

[0039] like Figure 3 As shown, it is a schematic diagram of the vaporous coolant condensing into liquid coolant and then dripping into the bottom inner wall of the cavity 120. The angle between the side of the microstructure 140 facing the cooling end 122 and the inner wall of the cavity 120 (i.e., the first angle ω1) is greater than the angle between the side of the microstructure 140 facing the evaporation end 121 and the inner wall of the cavity 120 (i.e., the second angle ω2). After the coolant 130 is attached to the bottom inner wall of the cavity 120, on both sides of the microstructure 140, under the action of the liquid surface tension, the liquid curved surface has differences in two opposite directions, so that the extension length H1 of the liquid toward the cooling end 122 is smaller, and the extension length H2 of the liquid toward the evaporation end 121 is larger, which guides the liquid to flow toward the evaporation end 121, thereby realizing the unidirectional flow of the liquid from the cooling end 122 to the evaporation end 121. Figure 4As shown, it is a schematic diagram of the flow direction of the liquid coolant on the inner wall of the bottom of the cavity 120. Condensed coolant droplets continue to fall at the same position. Under the drainage effect of the microstructure 140, the coolant 130 only flows from the droplet falling position to the evaporation end 121. The heat dissipation component 100 provided by the embodiment of the present invention enhances the ability of the coolant 130 to flow back from the cooling end 122 to the evaporation end 121, so that the evaporation end 121 can replenish the coolant 130 in time, greatly improving the heat dissipation capacity of the heat dissipation component 100.

[0040] In some embodiments, the difference between the first angle ω1 and the second angle ω2 may be determined according to the density of the coolant 130. For example, the greater the density of the coolant 130, the greater the difference between the first angle ω1 and the second angle ω2.

[0041] Figure 5 is a schematic top view of a microstructure 140 in a heat dissipation component 100 provided in an embodiment of the present invention. Figure 6 is along Figure 5 The cross-sectional view of the A-A1 line, Figure 7 is along Figure 5 The cross-sectional view of the B-B1 line, where Figure 5 The shape of the microstructure 140 is schematically depicted by a dotted line. Figure 5 to Figure 7 In this embodiment, the side surface of the microstructure 140 facing the cooling end 122 is peak-shaped, and the first angle ω1 is the angle between the peak of the peak and the inner wall of the cavity 120. The peak of the peak protrusion protrudes toward the cooling end 122, and the two sides extend toward the evaporation end 121, which can further guide the liquid to flow toward the evaporation end 121. There is a third angle ω3 between the two sides of the peak protrusion and the inner wall of the cavity 120, and the third angle ω3 is less than or equal to the first angle ω1, and greater than the second angle ω2, so as to further ensure the unidirectional flow of the cooling liquid 130. Optionally, the peak of the peak protrusion may be in an arc shape.

[0042] Optionally, in one embodiment, the side surface of the microstructure 140 facing the evaporation end 121 is peak-shaped, and the second angle ω2 is the angle between the peak of the peak and the inner wall of the cavity 120. The peak of the peak protrusion protrudes toward the evaporation end 121, which can further guide the liquid to flow toward the evaporation end 121. There is a fourth angle ω4 between the two sides of the peak protrusion and the inner wall of the cavity 120, and the fourth angle ω4 is less than or equal to the second angle ω2, thereby ensuring that the fourth angle ω4 is less than the first angle ω1, so as to ensure the unidirectional flow of the cooling liquid 130 from the cooling end 122 to the evaporation end 121.

[0043] Optionally, in one embodiment, the side surface of the microstructure 140 facing the cooling end 122 and the side surface of the microstructure 140 facing the evaporation end 121 are both peak-shaped protrusions, wherein the top angle ω5 of the peak-shaped protrusion of the side surface of the microstructure 140 facing the cooling end 122 is smaller than the top angle ω6 of the peak-shaped protrusion of the side surface of the microstructure 140 facing the evaporation end 121, so as to further improve the directional drainage capability of the microstructure 140.

[0044] Alternatively, in another embodiment, see Figure 8 , which is a top view schematic diagram of a microstructure 140 in a heat dissipation component 100 provided in another embodiment of the present invention. Figure 8 The dotted line schematically illustrates the shape of the microstructure 140 . The side surface of the microstructure 140 facing the evaporation end 121 is in a flat plate shape. The flat plate structure can play a blocking role, further preventing the coolant 130 from flowing toward the cooling end 122 .

[0045] In one embodiment, the cross-sectional area of ​​the microstructure 140 gradually decreases from the top surface of the microstructure 140 to the contact point between the microstructure 140 and the inner wall of the cavity 120, that is, the area of ​​the top surface of the microstructure 140 is the largest, and the cross-sectional area of ​​the contact point between the microstructure 140 and the inner wall of the cavity 120 is the smallest, which can increase the contact area between the droplets of the coolant 130 and the microstructure 140 at the top of the microstructure 140, thereby guiding the coolant 130 to flow toward the bottom of the microstructure 140.

[0046] In one embodiment, the top surface of the microstructure 140 is inclined from the cooling end 122 toward the evaporation end 121. When droplets of the cooling liquid 130 fall on the top surface of the microstructure 140, the droplets can flow downward along the inclined direction, that is, flow toward one side of the evaporation end 121, further enhancing the ability of the cooling liquid 130 to flow back from the cooling end 122 to the evaporation end 121.

[0047] In one embodiment, in the first direction D1, a plurality of the microstructures 140 are spaced apart and the spacing between two adjacent microstructures 140 is inversely proportional to the density of the coolant 130, that is, the greater the density of the coolant 130, the worse its fluidity, and the spacing between two adjacent microstructures 140 needs to be reduced so that the coolant 130 can contact the microstructures 140 as soon as possible to achieve rapid drainage of the coolant 130. The first direction D1 is the direction from the cooling end 122 of the cavity 120 to the evaporation end 121.

[0048] In one embodiment, in the second direction D2, two adjacent microstructures 140 are staggered, wherein the second direction D2 is perpendicular to the first direction D1. Fig. 9 As shown in FIG. 1 , it is a schematic diagram of the distribution of the inner wall of the bottom of the cavity 120 in the heat dissipation component 100 provided by an embodiment of the present invention. In the second direction D2, the two adjacent microstructures 140 are staggered. After the coolant 130 passes through the directional drainage of the peak-shaped protrusion of one microstructure 140, it will flow toward the evaporation end 121 along the side of the peak-shaped protrusion. The other adjacent microstructure 140 is set in the flow direction, and the coolant 130 will continue to contact the peak-shaped protrusion of the other microstructure 140, and can continue to be directed and drained, thereby realizing the rapid drainage of the coolant 130. The flow direction of the coolant 130 is shown in FIG. Fig. 9 Indicated by the arrow.

[0049] In one embodiment, the microstructure 140 is provided on all side walls of the cavity 120. The microstructure 140 located on the top side wall and the side side wall of the cavity 120 can increase the contact area between the side wall and the vaporous coolant, which is beneficial to the condensation of the coolant 130, thereby improving the heat dissipation capacity of the heat dissipation component 100.

[0050] In one embodiment, the cavity 120 is a sealed vacuum cavity. The vacuum environment can reduce the evaporation temperature of the coolant 130, thereby accelerating the conduction of heat and further improving the heat dissipation performance of the heat dissipation component 100.

[0051] In one embodiment, the material of the flat body 110 is copper, which has ultra-high thermal conductivity and can accelerate the transfer of heat between the heat dissipation structure 200 and the heat dissipation component 100, thereby accelerating heat conduction and further improving the heat dissipation performance of the heat dissipation component 100.

[0052] When manufacturing the heat dissipation component 100, the microstructure 140 can be manufactured on the surface of a substrate, and then the substrate is bent to form the heat dissipation component 100; or, the substrate is manufactured into the shape of the heat dissipation component 100, and then the microstructure 140 is manufactured on the side wall of the cavity 120. The heat dissipation component 100 is then sealed and welded, and the cavity is vacuumed and the coolant 130 is injected during the sealing and welding.

[0053] The heat dissipation component 100 provided in the embodiment of the present invention enhances the ability of the coolant 130 to flow back from the cooling end 122 to the evaporation end 121 , so that the evaporation end 121 can replenish the coolant 130 in time, greatly improving the heat dissipation capacity of the heat dissipation component 100 .

[0054] Based on the same inventive concept, an embodiment of the present invention further provides a packaging structure, which includes: a structure to be dissipated 200 and the aforementioned heat dissipation component 100, wherein the evaporation end 121 of the heat dissipation component 100 contacts the structure to be dissipated 200. A cooling structure may be provided on the surface of the cooling end 122 of the heat dissipation component 100 to accelerate the cooling performance of the cooling end 122.

[0055] Figure 10 to Figure 13 is a schematic diagram of a packaging structure provided by different embodiments of the present invention. Fig.10 In this embodiment, the structure to be cooled 200 is a chip. After the evaporation end 121 of the heat dissipation component 100 is made into an appearance matching the chip, it is directly connected to the top of the chip for cooling the chip. Fig.11 In this embodiment, the structure to be cooled 200 is a chip. To protect the chip, a support foot 300 is added to the bottom of the heat dissipation component 100 to form a cover shape. The evaporation end 121 of the heat dissipation component 100 is connected to the top of the chip to dissipate heat from the chip. Fig.12 The structure to be radiated is encapsulated by a plastic encapsulation material, the plastic encapsulation material 210 covers the chip 220, and the evaporation end 121 of the heat dissipation component 100 is attached to the top surface of the plastic encapsulation material 210, thereby improving the heat dissipation efficiency of the plastic encapsulation material 210, maintaining the performance of the chip 220, and increasing the service life of the chip 220. Fig.13 The structure to be dissipated is a flip-chip heat dissipation cover package, the chip 220 is arranged in the flip-chip heat dissipation cover 230, and the evaporation end 121 of the heat dissipation component 100 is attached to the top surface of the heat dissipation cover 230, which improves the heat dissipation efficiency of the heat dissipation cover 230, maintains the performance of the chip 220, and improves the service life of the chip 220.

[0056] The packaging structure provided by the embodiment of the present invention includes the heat dissipation component 100, in which the evaporation heat dissipation of the cooling liquid 130 is added, thereby greatly improving the heat dissipation efficiency of the heat dissipation component 100; and the angle between the side of the microstructure 140 of the heat dissipation component 100 facing the cooling end 122 and the inner wall of the cavity 120 (i.e., the first angle ω1) is greater than the angle between the side of the microstructure 140 facing the evaporation end 121 and the inner wall of the cavity 120 (the second angle ω2), which can directionally draw the cooling liquid 130 in the cavity 120 from the cooling end 122 back to the evaporation end 121, thereby enhancing the ability of the cooling liquid 130 to flow from the cooling end 122 back to the evaporation end 121, so that the evaporation end 121 can replenish the cooling liquid 130 in time, thereby greatly improving the heat dissipation capacity of the heat dissipation component 100, further improving the heat dissipation efficiency of the heat dissipation component 100, and thereby improving the heat dissipation performance of the packaging structure, which is beneficial to improving the performance and life of the packaging structure.

[0057] It should be noted that the terms "including" and "having" and their variations involved in the document of the present invention are intended to cover non-exclusive inclusions. The terms "first", "second", etc. are used to distinguish similar objects, and are not necessarily used to describe a specific order or sequence, unless the context clearly indicates, and it should be understood that the data used in this way can be interchanged under appropriate circumstances. The term "one or more" depends at least in part on the context, and can be used to describe features, structures or characteristics in a singular sense, or can be used to describe features, structures or combinations of features in a plural sense. The term "based on" can be understood as not necessarily intended to express a set of exclusive factors, but can alternatively, also at least in part depending on the context, allow the presence of other factors that are not necessarily explicitly described. In addition, the embodiments of the present invention and the features in the embodiments can be combined with each other without conflict. In addition, in the above description, the description of well-known components and technologies is omitted to avoid unnecessary confusion of the concept of the present invention. In the above embodiments, each embodiment focuses on the differences from other embodiments, and the same / similar parts between the embodiments can be referred to each other.

[0058] The above is only a preferred embodiment of the present invention. It should be pointed out that ordinary technicians in this technical field can make several improvements and modifications without departing from the principle of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A heat dissipation component, characterized in that: The invention comprises a flat plate-shaped body, wherein the flat plate-shaped body has a cavity, wherein the cavity is used to contain a coolant, wherein one end of the cavity is an evaporation end, and the other end is a cooling end, and a plurality of microstructures are arranged on the inner wall of the cavity at least on the side of the heat dissipation component for contacting the structure to be dissipated, wherein a first angle is formed between the side of the microstructure facing the cooling end and the inner wall of the cavity, and a second angle is formed between the side of the microstructure facing the evaporation end and the inner wall of the cavity, wherein the first angle and the second angle are both acute angles, and the first angle is greater than the second angle.

2. The heat dissipation component according to claim 1, characterized in that The side surface of the microstructure facing the cooling end is peak-shaped and protrudes, and the first angle is the angle between the peak of the peak-shaped protrusion and the inner wall of the cavity.

3. The heat dissipation component according to claim 2, characterized in that: A third angle is formed between two sides of the peak-shaped protrusion and the inner wall of the cavity, and the third angle is less than or equal to the first angle and greater than the second angle.

4. The heat dissipation component according to claim 1, characterized in that The side surface of the microstructure facing the evaporation end is peak-shaped and protrudes, and the second angle is the angle between the peak of the peak-shaped protrusion and the inner wall of the cavity.

5. The heat dissipation component according to claim 4, characterized in that: A fourth angle is formed between two sides of the peak-shaped protrusion and the inner wall of the cavity, and the fourth angle is less than or equal to the second angle.

6. The heat dissipation component according to claim 1, characterized in that The side surface of the microstructure facing the cooling end and the side surface of the microstructure facing the evaporation end are both peak-shaped protrusions, wherein the top angle of the peak-shaped protrusion of the side surface of the microstructure facing the cooling end is smaller than the top angle of the peak-shaped protrusion of the side surface of the microstructure facing the evaporation end.

7. The heat dissipation component according to claim 1, characterized in that The side surface of the microstructure facing the evaporation end is in a flat plate shape.

8. The heat dissipation component according to claim 1, characterized in that From the top surface of the microstructure to the contact point between the microstructure and the inner wall of the cavity, the cross-sectional area of ​​the microstructure gradually decreases.

9. The heat dissipation component according to claim 1, characterized in that: The top surface of the microstructure is inclined from the cooling end toward the evaporation end.

10. The heat dissipation component according to claim 1, characterized in that In a first direction, a plurality of the microstructures are distributed at intervals, and the spacing between two adjacent microstructures is inversely proportional to the density of the coolant, wherein the first direction is the direction from the cooling end of the cavity to the evaporation end.

11. The heat dissipation component according to claim 10, characterized in that In a second direction, two adjacent microstructures are staggered, wherein the second direction is perpendicular to the first direction.

12. The heat dissipation component according to claim 1, characterized in that The microstructure is arranged on all side walls of the cavity.

13. The heat dissipation component according to claim 1, characterized in that The cavity is a sealed vacuum cavity.

14. The heat dissipation component according to claim 1, characterized in that The material of the flat plate-shaped body is copper.

15. A packaging structure, characterized in that: include: Structure to be cooled; The heat dissipation component according to any one of claims 1 to 14, wherein the evaporation end of the heat dissipation component is in contact with the structure to be cooled.

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