Laser assembly integrated with optical attenuation function

Abstract

The invention relates to a laser assembly integrated with an optical attenuation function, which comprises a Micro-Electrol-Memory System chip with a circular induction area in the center, namely an MEMS chip, the surface of the circular induction area of the MEMS chip is plated with a light reflecting film, a 45-degree included angle is formed between a light beam emitted by a laser and the circular induction area in the middle of the MEMS chip, and the included angle between the light beam emitted by the laser and the circular induction area in the middle of the MEMS chip is 45 degrees. Light emitted by the laser is reflected into the optical fiber for transmission through the light reflecting film at 90 degrees; the required voltage is applied to the surface electrode of the MEMS chip, the circular induction area of the MEMS chip generates angle displacement along with the magnitude of the applied voltage, the light reflecting film is synchronously adjusted, the angle between the light beam emitted by the laser and the circular induction area of the MEMS chip is converted to be larger than or smaller than 45 degrees, the angle of the reflected light is not equal to 90 degrees, and the angle of the light reflecting film is adjusted to be larger than or smaller than 45 degrees. The proportion of light emitted by the laser entering the optical fiber is reduced, and light attenuation is achieved.

Description

Technical Field

[0001] The present invention relates to a photoelectric control technology and a laser structure, and specifically to a laser component with an integrated optical attenuation function. Background Art

[0002] Optical communication technology has been widely used in sensor detection, communication transmission, data storage, biomedicine, aerospace and other fields due to its advantages of high speed, large capacity, anti-interference, low energy consumption and strong confidentiality. It is an important supporting technology for national informatization construction and national defense industry construction.

[0003] In existing network systems, lasers are the source of optical signals, and their power determines important technical indicators such as transmission distance and signal quality. The conventional approach is to match lasers with different optical power indicators according to the transmission distance in the network. When the network architecture requires software adjustment and control, hardware such as laser components need to be adjusted first, resulting in complex system changes and low efficiency.

[0004] Therefore, it is necessary to provide a laser component with integrated optical attenuation function to solve the above problems. Summary of the invention

[0005] An object of the present invention is to provide a laser component with integrated optical attenuation function.

[0006] The technical solution is as follows:

[0007] A laser component with integrated optical attenuation function, comprising a Micro-Electro-Mechanical Systems chip, i.e., a MEMS chip, with a circular sensing area in the center. The surface of the circular sensing area of ​​the MEMS chip is coated with a light reflection film. The light beam emitted by the laser forms an angle of 45° with the circular sensing area in the middle of the MEMS chip. The light emitted by the laser is reflected by the light reflection film at 90° and then transmitted into an optical fiber.

[0008] The required voltage is applied to the surface electrode of the MEMS chip, and the circular sensing area of ​​the MEMS chip undergoes angular displacement as the applied voltage increases. The light reflection film is adjusted synchronously, and the angle of the light beam emitted by the laser is converted to be greater than or less than 45° with the circular sensing area of ​​the MEMS chip, so that the angle of the reflected light is not equal to 90°, thereby reducing the proportion of light emitted by the laser entering the optical fiber and achieving light attenuation.

[0009] Furthermore, the wavelength of the light reflective film includes but is not limited to 1270 nm to 1610 nm.

[0010] Furthermore, a MEMS chip with a sensing area is mounted on a pad with gold-plated electrodes on different surfaces. One side of the pad is at a 45° angle to an adjacent side. The MEMS chip is mounted on the inclined surface with a 45° angle to ensure that the overall assembly can accurately form a 45° angle when aligned with the laser chip for assembly.

[0011] Furthermore, the material of the pad is aluminum nitride, aluminum oxide or glass insulating material, and the thermal expansion coefficient of the pad is close to the expansion coefficient of the MEMS chip to ensure that the pad and the MEMS chip will not be broken or damaged under different ambient temperatures.

[0012] Furthermore, the MEMS chip is mounted on the surface of the pad, and the control electrode is connected to one end of a gold-plated electrode on the surface of the pad via a gold wire.

[0013] Furthermore, the other end of the gold-plated electrode is connected to a pin on the metal shell through a gold wire.

[0014] Furthermore, the control electrodes of the MEMS chip extend to corresponding pins of the metal shell and are connected to an external control circuit for control.

[0015] Compared with the prior art, the present invention utilizes the microstructure adjustment of the MEMS chip, reflects the light path through the reflective surface on the surface of the sensing area, drives the sensing area to rotate through external adjustment voltage, changes the angle of the incident surface, and realizes the functions of light path offset and light power attenuation; the optical power of the laser component can be adjusted to meet the needs of different optical powers, and the cost is controllable. BRIEF DESCRIPTION OF THE DRAWINGS

[0016] Figure 1 It is a perspective view of the present invention.

[0017] Figure 2 The present invention is a laser display diagram.

[0018] Figure 3 This is a schematic diagram of a gold-plated pad with a MEMS chip on different surfaces.

[0019] Figure 4 This is a functional diagram of a MEMS chip.

[0020] Figure 5 It is the optical path adjustment control diagram. DETAILED DESCRIPTION

[0021] Example:

[0022] See also Figure 1-2 This embodiment shows a laser assembly 100 with integrated optical attenuation function, including a Micro-Electro-Mechanical Systems chip, i.e., a MEMS chip 1, with a circular sensing area in the center. Figure 3-4The surface of the circular sensing area of ​​the MEMS chip 1 is coated with a light reflection film 2. The light beam emitted by the laser forms an angle of 45° with the circular sensing area in the middle of the MEMS chip. The light emitted by the laser is reflected by the light reflection film 2 at 90° and then transmitted into the optical fiber.

[0023] The required voltage is applied to the surface electrode of the MEMS chip 1, and the circular sensing area of ​​the MEMS chip undergoes angular displacement as the voltage is applied, and the light reflection film is adjusted synchronously, so that the angle of the light beam emitted by the laser and the circular sensing area of ​​the MEMS chip is greater than or less than 45°, making the angle of the reflected light not equal to 90°, thereby reducing the proportion of light emitted by the laser entering the optical fiber, thereby achieving light attenuation.

[0024] The wavelength of the light reflecting film 2 includes but is not limited to 1270 nm to 1610 nm.

[0025] The MEMS chip 1 with a sensing area is mounted on a pad 3 with gold-plated electrodes on different surfaces. One side of the pad 3 is at a 45° angle to an adjacent side. The MEMS chip 1 is mounted on a 45° inclined surface to ensure that the overall assembly can accurately form a 45° angle with the laser chip when aligned and assembled.

[0026] The material of the pad 3 is aluminum nitride, aluminum oxide or glass insulating material, and the thermal expansion coefficient of the pad is close to the expansion coefficient of the MEMS chip to ensure that the pad 3 and the MEMS chip 1 will not be broken or damaged under different ambient temperatures.

[0027] The MEMS chip 1 is mounted on the surface of the pad 3, and the control electrode is connected to one end of the gold-plated electrode on the surface of the pad through a gold wire.

[0028] The other end of the gold-plated electrode is connected to the pin 4 on the metal shell through a gold wire.

[0029] The control electrode of the MEMS chip 1 extends to the corresponding pin 4 of the metal shell and is connected to an external control circuit for control.

[0030] The assembly steps of this embodiment:

[0031] 1) Fix the laser chip, optical isolator, TEC (semiconductor refrigerator) and other components on the TEC surface in sequence, and fix the MEMS micro-mirror on the 45° surface of the pad.

[0032] 3) The MEMS chip, TEC, laser chip and other components are electrically connected to the shell pins through gold wire.

[0033] 3) A bias current is provided to the laser chip through the pins of the tube shell to make it emit light. The optical alignment coupling is performed by adjusting the microlens at the front end of the laser chip and the collimating optical fiber on the side of the tube shell cavity. The divergent light emitted by the laser chip is collimated by the microlens, then passes through the isolator, is reflected by the MEMS chip, and is coupled into the optical fiber in the optical fiber collimator to achieve light transmission.

[0034] 4) After the optical coupling is completed, the microlens or the collimating optical fiber can be fixed separately by glue or laser welding.

[0035] 5) After the fixation is completed, the metal shell can be sealed by sealing welding to form an airtight cavity. The cavity can also be filled with an inert gas, such as nitrogen, to ensure that the internal components can work reliably for a long time.

[0036] 6) According to the requirements of different optical powers, different voltages are input to the pins of the corresponding MEMS chip control electrodes on the metal shell, so that the sensing area rotates to a corresponding angle, the optical path is offset, and the optical fiber collimator receives less light, which plays the role of light attenuation.

[0037] See also Figure 5 The present invention utilizes the microstructure adjustment of the MEMS chip, reflects the light path through the reflection surface on the surface of the sensing area, drives the sensing area to rotate through external adjustment voltage, changes the angle of the incident surface, and realizes the function of light path deviation and light power attenuation; the optical power of the laser component can be adjusted to meet the needs of different optical powers, and the cost is controllable.

[0038] The above are only some embodiments of the present invention. For those skilled in the art, several modifications and improvements can be made without departing from the creative concept of the present invention, which all belong to the protection scope of the present invention.

Claims

1. A laser component with integrated optical attenuation function, characterized in that: It includes a Micro-Electro-Mechanical Systems chip, i.e., a MEMS chip, with a circular sensing area in the center. The surface of the circular sensing area of ​​the MEMS chip is coated with a light reflection film. The light beam emitted by the laser forms an angle of 45° with the circular sensing area in the middle of the MEMS chip. The light emitted by the laser is reflected by the light reflection film at 90° and then transmitted into the optical fiber. The required voltage is applied to the surface electrode of the MEMS chip, and the circular sensing area of ​​the MEMS chip undergoes angular displacement as the applied voltage increases. The light reflection film is adjusted synchronously, and the angle of the light beam emitted by the laser is converted to be greater than or less than 45° with the circular sensing area of ​​the MEMS chip, so that the angle of the reflected light is not equal to 90°, thereby reducing the proportion of light emitted by the laser entering the optical fiber and achieving light attenuation.

2. A laser component with integrated optical attenuation function according to claim 1, characterized in that: The wavelength of the light reflective film includes but is not limited to 1270nm to 1610nm.

3. The laser component with integrated optical attenuation function according to claim 2, characterized in that: The MEMS chip with the sensing area is mounted on a pad with gold-plated electrodes on different surfaces. One side of the pad is at a 45° angle to an adjacent side. The MEMS chip is mounted on the inclined surface with a 45° angle to ensure that the overall assembly can accurately form a 45° angle with the laser chip when aligned and assembled.

4. The laser component with integrated optical attenuation function according to claim 3, characterized in that: The material of the pad is aluminum nitride, aluminum oxide or glass insulation material, and the thermal expansion coefficient of the pad is close to the expansion coefficient of the MEMS chip to ensure that the pad and the MEMS chip will not be broken or damaged under different ambient temperatures.

5. The laser component with integrated optical attenuation function according to claim 4, characterized in that: The MEMS chip is mounted on the surface of the pad, and the control electrode is connected to one end of the gold-plated electrode on the different surface of the pad through a gold wire.

6. The laser component with integrated optical attenuation function according to claim 5, characterized in that: The other end of the gold-plated electrode is connected to a pin on the metal shell through a gold wire.

7. The laser component with integrated optical attenuation function according to claim 6, characterized in that: The control electrodes of the MEMS chip extend to corresponding pins of the metal shell and are connected to an external control circuit for control.

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