Camera assembly and electronic equipment

Abstract

The invention provides a camera assembly, which comprises a lens, a positioning seat and a circuit board, and is characterized in that the positioning seat supports the lens; the circuit board is provided with a photosensitive chip and a conductive wire, the circuit board is connected to the side, away from the lens, of the positioning seat, one end of the conductive wire is connected to the photosensitive chip, the other end, away from the photosensitive chip, of the conductive wire is connected to a bonding pad on the circuit board, the bonding pad is provided with a heat dissipation part, and the heat dissipation part is connected with the circuit board. And the heat dissipation part is exposed out of the positioning seat. Heat generated when the photosensitive chip works can be quickly transmitted to the heat dissipation part through the electric lead, heat on the heat dissipation part exchanges heat with air outside the lens, and the heat dissipation efficiency is greatly improved. The invention also provides an electronic device provided with the camera assembly.

Description

Technical Field

[0001] The present invention relates to the field of optical image devices, and in particular to a camera assembly and an electronic device provided with the camera assembly. Background Art

[0002] At present, fixed-focus cameras in some technologies generally include a lens, a positioning seat for supporting the lens, a circuit board and a heat sink, etc. The lens is provided with multiple lenses, and the lens is connected to the positioning seat by fixing glue. A photosensitive chip is provided on the circuit board, and the side of the positioning seat facing away from the lens is connected to the circuit board around the photosensitive chip by dispensing glue for sealing, and the heat sink (such as a graphite sheet, etc.) is attached to the side of the circuit board facing away from the photosensitive chip; when the fixed-focus camera is working, the photosensitive chip is the heat source, and the heat generated by the photosensitive chip is transferred to the inner cavity of the lens. Since the lens is sealed with glue and the barrel of the lens is a plastic part, the heat dissipation effect of the lens is poor, so that the temperature inside the lens will rise rapidly. The temperature increase will cause the photosensitive plastic lens inside the lens to deform and loosen, resulting in blurred resolution. At present, the fixed-focus camera uses a heat sink attached to the side of the circuit board away from the photosensitive chip. However, the heat sink and the photosensitive chip are separated by materials with low heat dissipation efficiency such as the circuit board and glue, which causes the heat dissipation speed of the photosensitive chip to be slow and inefficient. The heat generated by the photosensitive chip cannot be discharged in time, causing the internal temperature of the lens to continue to rise, resulting in thermal deformation of components such as the lens, resulting in changes in optical parameters and blurred resolution. Summary of the invention

[0003] The object of the present invention is to provide a camera assembly with high heat dissipation efficiency, and an electronic device provided with the camera assembly.

[0004] In order to solve the above technical problems, the present invention provides a camera assembly, which includes a lens, a positioning seat and a circuit board, wherein the positioning seat supports the lens; a photosensitive chip and a conductive wire are provided on the circuit board, the circuit board is connected to a side of the positioning seat away from the lens, one end of the conductive wire is connected to the photosensitive chip, and the other end of the conductive wire away from the photosensitive chip is connected to a soldering pad on the circuit board, the soldering pad is provided with a heat dissipation portion, and the heat dissipation portion is exposed outside the positioning seat.

[0005] The present invention also provides an electronic device, which includes a housing, a mainboard arranged in the housing, and a camera assembly, wherein the camera assembly includes a lens, a positioning seat and a circuit board, wherein the positioning seat supports the lens; a photosensitive chip and a conductive wire are provided on the circuit board, wherein the circuit board is connected to a side of the positioning seat away from the lens, one end of the conductive wire is connected to the photosensitive chip, and the other end of the conductive wire away from the photosensitive chip is connected to a soldering pad on the circuit board, wherein a heat dissipation portion is provided on the soldering pad, and the heat dissipation portion is exposed outside the positioning seat; the camera assembly is arranged in the housing, and the circuit board of the camera assembly is electrically connected to the mainboard.

[0006] The photosensitive chip of the camera assembly provided by the present invention is connected to the heat dissipation part through a conductive wire, and the heat dissipation part is exposed to the outer surface of the positioning seat, and the heat dissipation path from the photosensitive chip through the conductive wire to the heat dissipation part is entirely made of metal with high thermal conductivity. Therefore, the heat generated by the photosensitive chip during operation can be quickly transferred to the heat dissipation part through the conductive wire, and the heat on the heat dissipation part is heat exchanged with the external air of the lens, so that the heat dissipation efficiency of the photosensitive chip is greatly improved, thereby reducing the heat generated by the photosensitive chip from being transferred to the inner cavity of the lens, avoiding deformation of the lens inside the lens, and preventing the deflection force from decreasing. BRIEF DESCRIPTION OF THE DRAWINGS

[0007] In order to more clearly illustrate the technical solution of the embodiment of the present invention, the drawings required for use in the implementation mode will be briefly introduced below. Obviously, the drawings described below are some implementation modes of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without paying creative work.

[0008] Figure 1 is a schematic diagram of the three-dimensional structure of a camera assembly provided by the first embodiment of the present invention;

[0009] Figure 2 yes Figure 1 A cross-sectional view of the camera assembly along line II-II;

[0010] Figure 3 yes Figure 2 An exploded diagram of the camera assembly in FIG.

[0011] Figure 4 is a schematic diagram of the three-dimensional structure of a camera assembly provided by a second embodiment of the present invention;

[0012] Figure 5 yes Figure 4 A cross-sectional view of the camera assembly along line VV;

[0013] Figure 6 yes Figure 5 An exploded diagram of the camera assembly in FIG.

[0014] Figure 7 is a schematic diagram of the three-dimensional structure of a camera assembly provided in a third embodiment of the present invention;

[0015] Figure 8 yes Figure 7 A cross-sectional view of the camera assembly along line VIII-VIII;

[0016] Fig. 9 is a schematic diagram of the three-dimensional structure of a camera assembly provided in a fourth embodiment of the present invention;

[0017] Fig.10 yes Fig. 9 A cross-sectional view of the camera assembly along line XX;

[0018] Fig.11 is a schematic diagram of the three-dimensional structure of a camera assembly provided in a fifth embodiment of the present invention;

[0019] Fig.12 is a schematic diagram of the three-dimensional structure of a camera assembly provided by a sixth embodiment of the present invention;

[0020] Fig.13 It is a schematic diagram of the three-dimensional structure of an electronic device provided by one embodiment of the present invention.

[0021] Explanation of main reference numerals: 100, camera assembly; 20, lens; 21, lens barrel; 212, positioning portion; 214, barrel body; 23, lens; 231, first lens; 233, second lens; 235, third lens; 237, fourth lens; 251, first support ring; 253, second support ring; 255, third support ring; 257, fourth support ring; 30, optical filter; 40, positioning seat; 42, light-transmitting space; 43, fixing groove; 45, supporting step; 60, circuit board; 62, photosensitive chip; 64, conductive line; 65, solder pad; 652, outer edge; 66, heat dissipation portion; 662, heat dissipation surface; 663, connecting section; 665, heat dissipation section; 666, heat exchange surface; 70, connecting glue; 80, heat sink; 90, support frame; 91, through hole; 93, positioning groove; 95, positioning step. DETAILED DESCRIPTION

[0022] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the described embodiments are only part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without creative work are within the scope of protection of the present invention.

[0023] In addition, the following descriptions of the various embodiments are made with reference to the attached drawings to illustrate specific embodiments that the present application may be implemented in. Directional terms mentioned in the present application, such as "upper", "lower", "front", "back", "left", "right", "inner", "outer", "side", etc., are only with reference to the directions of the attached drawings. Therefore, the directional terms used are for better and clearer explanation and understanding of the present application, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, be constructed and operate in a specific orientation, and therefore cannot be understood as a limitation on the present application.

[0024] In the description of this application, it should be noted that, unless otherwise clearly specified and limited, the terms "installed", "connected", "connected", and "set on..." should be understood in a broad sense, for example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection; it can be a direct connection, or it can be indirectly connected through an intermediate medium, or it can be the internal communication of two components. For ordinary technicians in this field, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0025] See also Figures 1 to 3 The camera assembly 100 provided in the first embodiment of the present invention includes a lens 20, a positioning seat 40, a circuit board 60 and a heat sink 80. The positioning seat 40 is used to support the lens 20. The circuit board 60 is provided with a photosensitive chip 62 and a conductive wire 64. The circuit board 60 is connected to the side of the positioning seat 40 away from the lens 20. One end of the conductive wire 64 is connected to the photosensitive chip 62, and the other end of the conductive wire 64 away from the photosensitive chip 62 is connected to a pad 65 on the circuit board 60. The pad 65 is provided with a heat dissipation portion 66, and the heat dissipation portion 66 is exposed to the positioning seat 40. The opposite ends of the conductive wire 64 are respectively connected to the photosensitive chip 62 and the heat dissipation portion 66, and the heat dissipation portion 66 is exposed to the outer surface of the positioning seat 40; therefore, the camera assembly 100 adds a heat dissipation path from the photosensitive chip 62 through the conductive wire 64 to the heat dissipation portion 66 to the outside. When the camera assembly 100 is working, the heat generated by the photosensitive chip 62 can be quickly transferred to the heat dissipation part 66 through the conductive wire 64, and the heat on the heat dissipation part 66 can directly exchange heat with the cold air outside the lens 20 to achieve high-efficiency heat dissipation of the photosensitive chip 62. It can be understood that the conductive wire 64 and the heat dissipation part 66 are both made of metal materials with high thermal conductivity. Specifically, the conductive wire 64 and the heat dissipation part 66 can be respectively made of but not limited to aluminum, copper or silver.

[0026] The photosensitive chip 62 of the camera assembly 100 provided by the present invention is connected to the heat dissipation part 66 through the conductive wire 64, and the heat dissipation part 66 is exposed on the outer surface of the positioning seat 40; since the heat dissipation path from the photosensitive chip 62 through the conductive wire 64 to the heat dissipation part 66 all passes through the metal with high thermal conductivity, the heat generated by the photosensitive chip 62 during operation can be quickly conducted to the heat dissipation part 66 through the conductive wire 64, and the heat on the heat dissipation part 66 is heat exchanged with the external air of the lens 20, so that the heat dissipation efficiency of the photosensitive chip 62 is greatly improved, and the heat generated by the photosensitive chip 62 can be reduced. Transfer to the inner cavity of the lens 20 can avoid deformation of the lens in the lens 20 and prevent the deflection force from decreasing.

[0027] Optionally, a plurality of conductive wires 64 are provided on the circuit board 60, one end of each conductive wire 64 is connected to the photosensitive chip 62, and a heat dissipation portion 66 is provided at one end of the conductive wire 64 away from the photosensitive chip 62, and the heat dissipation portion 66 is exposed from the outer peripheral surface of the positioning seat 40. In this embodiment, two conductive wires 64 and two solder pads 65 are provided on the circuit board 60, the two conductive wires 64 are respectively located on opposite sides of the photosensitive chip 62, the two solder pads 65 are respectively located on opposite sides of the photosensitive chip 62, and the two solder pads 65 are respectively provided with heat dissipation portions 66, and the two heat dissipation portions 66 are respectively exposed from the outer peripheral surface of the positioning seat 40; one end of one of the conductive wires 64 is connected to the photosensitive chip 62, and the other end of the one of the conductive wires 64 is connected to an adjacent heat dissipation portion 66; one end of another conductive wire 64 is connected to the photosensitive chip 62, and the other end of the other conductive wire 64 is connected to an adjacent heat dissipation portion 66. In other embodiments, more than two conductive wires 64 and more than two soldering pads 65 are provided on the circuit board 60, and the more than two soldering pads 65 are distributed around the front side of the circuit board 60. A heat dissipation portion 66 is provided on each soldering pad 65, and each heat dissipation portion 66 is exposed from the outer peripheral surface of the positioning seat 40; one end of each conductive wire 64 is connected to the photosensitive chip 62, and the other end of the conductive wire 64 is connected to the corresponding heat dissipation portion 66.

[0028] Optionally, the pad 65 is close to the outer peripheral surface of the positioning seat 40, and the pad 65 extends along the axial direction of the lens 20 to form a heat dissipation portion 66. Specifically, at least one side edge of the pad 65 is coplanar with the outer peripheral surface of the positioning seat 40, and the side of the heat dissipation portion 66 facing away from the photosensitive chip 62 is coplanar with the outer peripheral surface of the positioning seat 40, so that the side of the heat dissipation portion 66 facing away from the photosensitive chip 62 is exposed to the outer peripheral surface of the positioning seat 40, so as to facilitate heat exchange between the heat dissipation portion 66 and the external cold air.

[0029] Specifically, the pad 65 includes at least one outer edge 652, and the outer edge 652 is exposed to the outer peripheral surface of the positioning seat 40; preferably, the outer edge 652 is coplanar with the outer peripheral surface of the positioning seat 40. The heat dissipation portion 66 includes at least one heat dissipation surface 662, and the heat dissipation surface 662 is exposed to the outer peripheral surface of the positioning seat 40; preferably, the heat dissipation surface 662 is coplanar with the outer peripheral surface of the positioning seat 40. In this embodiment, the outer edge 652, the heat dissipation surface 662 and the outer peripheral surface of the positioning seat 40 are coplanar. In other embodiments, the outer edge 652 is close to the outer peripheral surface of the positioning seat 40, that is, the outer edge 652 is located on the front side of the circuit board 60 and close to the outer peripheral surface of the circuit board 60; the heat dissipation surface 662 is close to the outer peripheral surface of the positioning seat 40, that is, the heat dissipation surface 662 is closer to or farther away from the photosensitive chip 62 than the outer peripheral surface of the positioning seat 40.

[0030] Specifically, the pad 65 can be but is not limited to a rectangular pad, a semicircular pad, a semi-elliptical pad or a polygonal pad, at least one side of the rectangular pad is exposed to the outer peripheral surface of the positioning seat 40, preferably, at least one side of the rectangular pad is coplanar with the outer peripheral surface of the positioning seat 40; the radial side of the semicircular pad is exposed to the outer peripheral surface of the positioning seat 40, preferably, the radial side of the semicircular pad is coplanar with the outer peripheral surface of the positioning seat 40; the radial side of the semi-elliptical disk is exposed to the outer peripheral surface of the positioning seat 40, preferably, the radial side of the semi-elliptical disk is coplanar with the outer peripheral surface of the positioning seat 40; or at least one side of the polygonal pad is exposed to the outer peripheral surface of the positioning seat 40, preferably, at least one side of the polygonal pad is coplanar with the outer peripheral surface of the positioning seat 40. The heat dissipation portion 66 can be but is not limited to a rectangular heat dissipation block, a semicircular heat dissipation block, a semi-elliptical heat dissipation block or a polygonal heat dissipation block, etc.; at least one side surface of the rectangular heat dissipation block is coplanar with the outer circumferential surface of the positioning seat 40, and the radial side surface of the semicircular heat dissipation block exposes the outer circumferential surface of the positioning seat 40, preferably, the radial side surface of the semicircular heat dissipation block is coplanar with the outer circumferential surface of the positioning seat 40; the radial side surface of the semi-elliptical heat dissipation block exposes the outer circumferential surface of the positioning seat 40, preferably, the side surface of the semi-elliptical heat dissipation block is coplanar with the outer circumferential surface of the positioning seat 40, or at least one side surface of the polygonal heat dissipation block exposes the outer circumferential surface of the positioning seat 40, preferably, at least one side surface of the polygonal heat dissipation block is coplanar with the outer circumferential surface of the positioning seat 40.

[0031] In other embodiments, the heat dissipation portion 66 may also be a solder block soldered on the solder pad 65 , and the solder block is exposed outside the outer peripheral surface of the positioning seat 40 .

[0032] Optionally, the positioning seat 40 is made by injection molding on the circuit board 60 using injection resin, so that the positioning seat 40 wraps the contact photosensitive chip 62; because the positioning seat 40 directly wraps the contact photosensitive chip 62, the heat generated by the photosensitive chip 62 during operation can be directly transferred to the positioning seat 40, and the heat on the positioning seat 40 is heat-exchanged with the external cold air through its outer peripheral surface. In this embodiment, the positioning seat 40 wraps around the contact photosensitive chip 62, specifically, the positioning seat 40 wraps around the outer peripheral surface and the front side of the contact photosensitive chip 62; the positioning seat 40 wraps the conductive wire 64, and the heat dissipation part 66 is positioned on the positioning seat 40; specifically, the positioning seat 40 wraps the outer peripheral surface of the heat dissipation part 66 except the heat dissipation surface 662 and the surface of the heat dissipation part 66 away from the circuit board 60. The positioning seat 40 is provided with a light-transmitting space 42 along the axial direction of the lens 20, one end of the light-transmitting space 42 extends to the front side of the photosensitive chip 62, and the other end of the light-transmitting space 42 passes through the positioning seat 40 away from the front side of the circuit board 60.

[0033] Optionally, the camera assembly 100 further includes an optical filter 30, which is positioned on the side of the positioning seat 40 away from the circuit board 60, and the middle of the photosensitive chip 62 faces the middle of the optical filter 30. Specifically, a fixing groove 43 is provided on the side of the positioning seat 40 away from the circuit board 60, the center line of the light-transmitting space 42 is collinear with the center line of the fixing groove 43, the fixing groove 43 is connected to the light-transmitting space 42, the opening area of ​​the fixing groove 43 is larger than the opening area of ​​the light-transmitting space 42, the optical filter 30 is positioned in the fixing groove 43, and the optical filter 30 faces the photosensitive chip 62. In this embodiment, the light-transmitting space 42 is a circular space, the fixing groove 43 is a circular groove, the axis of the circular space is collinear with the axis of the circular groove, and the diameter of the circular groove is larger than the diameter of the circular space, so that the positioning seat 40 forms a support step 45 between the light-transmitting space 42 and the fixing groove 43, and the support step 45 is used to support the optical filter 30. The optical filter 30 and the positioning seat 40 may be fixedly connected by, but not limited to, bonding or clamping. Specifically, the optical filter 30 and the supporting step 45 may be fixedly connected by, but not limited to, bonding or clamping. In other embodiments, the optical filter 30 and the positioning seat 40 may also be integrated by injection molding.

[0034] In this embodiment, the circuit board 60 is rectangular, the positioning seat 40 is a rectangular frame that cooperates with the circuit board 60, and solder pads 65 are respectively provided on opposite sides of the front of the circuit board 60, and each solder pad 65 is provided with a heat dissipation portion 66, and the heat dissipation surfaces 662 of the two heat dissipation portions 66 are respectively coplanar with the two opposite side surfaces of the rectangular frame. In other embodiments, a solder pad 65 is respectively provided near the four sides of the front of the circuit board 60, and each solder pad 65 is provided with a heat dissipation portion 66, and the heat dissipation surfaces 662 of the four heat dissipation portions 66 are respectively exposed to the four side surfaces of the rectangular frame. Preferably, the heat dissipation surfaces 662 of the four heat dissipation portions 66 are respectively coplanar with the four side surfaces of the rectangular frame.

[0035] In other embodiments, the circuit board 60 may also be, but not limited to, a circular plate, a polygonal plate, or an elliptical plate, etc.; the positioning seat 40 may also be a corresponding circular frame, a polygonal frame, or an elliptical frame, etc.

[0036] The heat sink 80 is attached to the side of the circuit board 60 away from the photosensitive chip 62, and the heat sink 80 faces the photosensitive chip 62. The shape of the heat sink 80 is similar to that of the photosensitive chip 62, and the front area of ​​the heat sink 80 facing the circuit board 60 is larger than the back area of ​​the photosensitive chip 62 facing the circuit board 60. The heat sink 80 can be, but is not limited to, a graphite sheet, a high thermal conductivity silicone pad, a thermal conductive silicone sheet, etc. The heat sink 80 can assist in heat dissipation of the photosensitive chip 62.

[0037] like Figure 2 and Figure 3 As shown, the lens 20 includes a lens barrel 21 and a plurality of lenses 23, and the plurality of lenses are positioned in the lens barrel 21 at intervals. Specifically, the lens barrel 21 includes a positioning portion 212 and a barrel body 214 connected to the positioning portion 212. The plurality of lenses 23 include a first lens 231, a second lens 233, a third lens 235, and a fourth lens 237. The first lens 231, the second lens 233, the third lens 235, and the fourth lens 237 are arranged at intervals from the object image to the image along the axis L, and the first lens 231, the second lens 233, the third lens 235, and the fourth lens 237 are coaxial. A first support ring 251 is sandwiched between the first lens 231 and the second lens 233, a second support ring 253 is sandwiched between the second lens 233 and the third lens 235, a third support ring 255 is sandwiched between the third lens 235 and the fourth lens 237, and a fourth support ring 257 is provided around the side of the fourth lens 237 away from the third lens 235. The lens 20 and the positioning seat 40 are fixedly connected by a connecting glue 70, and the connecting glue 70 can be but not limited to fixing glue, double-sided tape, etc. In this embodiment, the back side of the positioning portion 212 and the front side of the positioning seat 40 are fixed by the fixing glue.

[0038] When manufacturing the camera assembly 100, one end of the conductive wire 64 is connected to the photosensitive chip 62, and the other end of the conductive wire 64 is connected to the heat dissipation part 66. The photosensitive chip 62 is directly wrapped with resin on the circuit board 60 by using the chip injection molding process, so that the injection resin wraps the conductive wire 64, and the injection resin positions the heat dissipation part 66; the optical filter 30 is positioned in the fixing groove 43 of the positioning seat 40, and the lens 20 is connected to the surface of the positioning seat 40 away from the circuit board 60 by fixing glue, so that the lens 23, the optical filter 30 and the photosensitive chip 62 are co-centered. Then the heat sink 80 is attached to the back of the circuit board 60 away from the photosensitive chip 62.

[0039] The photosensitive chip 62 of the camera assembly 100 of the present application is connected to the heat dissipation part 66 through the conductive wire 64, and the heat dissipation part 66 has a heat dissipation surface 662 that can directly exchange heat with external cold air. The heat generated by the photosensitive chip 62 during operation is directly conducted to the heat dissipation part 66 by the conductive wire 64, and then dissipated outward through the heat dissipation surface 662; since the conductive wire 64 and the heat dissipation part 66 are both metal, the efficiency of heat conduction and heat dissipation is high, thereby greatly improving the heat dissipation efficiency of the photosensitive chip 62, and reducing the heat generated by the photosensitive chip 62 from being transferred to the lens 20, preventing the lens 23 from being deformed, and avoiding the reduction of resolution; secondly, since the positioning seat 40 directly wraps the photosensitive chip 62, the heat generated by the photosensitive chip 62 is conducted to the positioning seat 40, and the heat on the positioning seat 40 is heat-exchanged with the external cold air through its outer peripheral surface, which is helpful for the heat dissipation of the photosensitive chip 62. In addition, the heat generated by the photosensitive chip 62 during operation can be dissipated in time, which can reduce the internal impedance of the photosensitive chip 62 and reduce the energy consumption of the photosensitive chip 62. The camera assembly 100 of the present application can be used for but not limited to front-facing video or rear-facing video, etc. The heat generated by the photosensitive chip 62 during operation can be dissipated in a timely manner, which can effectively alleviate the deformation of the lens 23 caused by the increase in the temperature of the lens 20 and avoid the decrease in resolution, and can ensure that the front-facing view or rear-facing video is in clear focus for a long time and maintain normal resolution.

[0040] like Figure 4-Figure 6As shown, the structure of the camera assembly 100a in the second embodiment of the present application is similar to that of the camera assembly 100 in the first embodiment, except that: the camera assembly 100a in the second embodiment is based on the camera assembly 100 in the first embodiment and adds a support frame 90. Specifically, in the second embodiment, the camera assembly 100a also includes a support frame 90, which is arranged between the positioning seat 40 and the lens 20. The side of the support frame 90 away from the positioning seat 40 is provided with a positioning groove 93, and the optical filter 30 is positioned in the positioning groove 93, and the optical filter 30 is directly opposite to the photosensitive chip 62. The positioning seat 40a in the second embodiment is based on the positioning seat 40 in the first embodiment, and the fixing groove is omitted. The support frame 90 and the positioning seat 40a can be connected by, but not limited to, gluing, clamping, etc. In other embodiments, the support frame 90 and the positioning seat 40a can be made by integral molding. A through hole 91 is provided in the middle of the support frame 90 along the axis L, and a positioning groove 93 is provided on the front side of the support frame 90 away from the positioning seat 40a. The positioning groove 93 is connected to the through hole 91, and the opening area of ​​the positioning groove 93 is larger than the opening area of ​​the through hole 91. In this embodiment, the positioning groove 93 is a circular hole, the through hole 91 is a circular hole, and the light-transmitting space 42 is a circular space. When the support frame 90 is connected to the positioning seat 40a, the axis of the positioning groove 93, the axis of the through hole 91 and the axis of the light-transmitting space 42 are collinear, and the diameter of the positioning groove 93 is larger than the diameter of the through hole 91, so that the support frame 90 forms a positioning step 95 between the positioning groove 93 and the through hole 91, and the positioning step 95 is used to support the optical filter 30. The optical filter 30 and the support frame 90 can be fixedly connected by, but not limited to, gluing or clamping; specifically, the optical filter 30 and the positioning step 95 can be fixedly connected by, but not limited to, gluing or clamping. In other embodiments, the optical filter 30 and the support frame 90 may also be integrated into one body by injection molding.

[0041] The beneficial effects of the camera assembly 100a in the second embodiment are the same as the beneficial effects of the camera assembly 100 in the first embodiment, and are not described in detail here.

[0042] like Figure 7-Figure 8As shown, the structure of the camera assembly 100b in the third embodiment of the present application is similar to that of the camera assembly 100 in the first embodiment, except that the shape of the heat dissipation portion 66a of the camera assembly 100b in the third embodiment is different from the shape of the heat dissipation portion 66 of the camera assembly 100 in the first embodiment. Specifically, in the third embodiment, the cross section of the heat dissipation portion 66a is generally L-shaped, and the heat dissipation portion 66a includes a connecting section 663 and a heat dissipation section 665, the connecting section 663 is connected to the conductive wire 64, and the heat dissipation section 665 is exposed to the outer peripheral surface of the positioning seat 40. The connecting section 663 is attached to the pad 65, and the heat dissipation section 665 is arranged on the side of the connecting section 663 away from the photosensitive chip 62. In the direction parallel to the axis L, the thickness of the heat dissipation section 665 is greater than the thickness of the connecting section 663, and the heat dissipation section 665 has a heat exchange surface 666 away from the connecting section 663. The heat exchange surface 666 is exposed to the outer peripheral surface of the positioning seat 40, and preferably, the heat exchange surface 666 is coplanar with the outer peripheral surface of the positioning seat 40.

[0043] In the third embodiment, the photosensitive chip 62 of the camera assembly 100b is connected to the heat dissipation part 66a through the conductive wire 64, and the heat dissipation part 66a has a heat exchange surface 666 that can directly exchange heat with external cold air. The heat generated by the photosensitive chip 62 during operation is directly transferred to the heat dissipation part 66a through the conductive wire 64, and then dissipated to the outside through the heat exchange surface 666; since the area of ​​the heat exchange surface 666 is larger than the area of ​​the heat dissipation surface 662 in the first embodiment, the heat dissipation efficiency of the heat dissipation part 66 is higher, thereby further improving the heat dissipation efficiency of the photosensitive chip 62, and can reduce the heat generated by the photosensitive chip 62 from being transferred to the lens 20, prevent the lens 23 from being deformed, and avoid a decrease in resolution; secondly, since the positioning seat 40 directly wraps the photosensitive chip 62, the heat generated by the photosensitive chip 62 is transferred to the positioning seat 40, and the heat on the positioning seat 40 is heat-exchanged with the external cold air through its outer peripheral surface, which is helpful for the heat dissipation of the photosensitive chip 62. In addition, the heat generated by the photosensitive chip 62 during operation can be dissipated in time, which can reduce the internal impedance of the photosensitive chip 62 and reduce the energy consumption of the photosensitive chip 62.

[0044] like Figure 9-10As shown, the structure of the camera assembly 100c in the fourth embodiment of the present application is similar to that of the camera assembly 100 in the first embodiment, except that: the camera assembly 100c in the fourth embodiment is based on the camera assembly 100 in the first embodiment, and a support frame 90 is added, and the shape of the heat dissipation portion 66a in the fourth embodiment is different from the shape of the heat dissipation portion 66 in the first embodiment. Specifically, in the fourth embodiment, the camera assembly 100c also includes a support frame 90, which is arranged between the positioning seat 40 and the lens 20, and a positioning groove 93 is provided on the side of the support frame 90 away from the positioning seat 40, and the optical filter 30 is positioned in the positioning groove 93, and the center of the optical filter 30 is opposite to the center of the photosensitive chip 62. The positioning seat 40a in the fourth embodiment is based on the positioning seat 40 in the first embodiment, and the fixing groove is omitted. The support frame 90 and the positioning seat 40a can be connected by, but not limited to, gluing, clamping, etc. In other embodiments, the support frame 90 and the positioning seat 40a can be made by integral molding. A through hole 91 is provided in the middle of the support frame 90 along the axis L, and a positioning groove 93 is provided on the front side of the support frame 90 away from the positioning seat 40a. The positioning groove 93 is connected to the through hole 91, and the opening area of ​​the positioning groove 93 is larger than the opening area of ​​the through hole 91. In this embodiment, the positioning groove 93 is a circular hole, the through hole 91 is a circular hole, and the light-transmitting space 42 is a circular space. The axis of the positioning groove 93, the axis of the through hole 91 and the axis of the light-transmitting space 42 are collinear, and the diameter of the positioning groove 93 is larger than the diameter of the through hole 91, so that the support frame 90 forms a positioning step 95 between the positioning groove 93 and the through hole 91, and the positioning step 95 is used to support the optical filter 30. The optical filter 30 and the support frame 90 can be fixedly connected by, but not limited to, gluing or clamping; specifically, the optical filter 30 and the positioning step 95 can be fixedly connected by, but not limited to, gluing or clamping. In other embodiments, the optical filter 30 and the support frame 90 can also be integrated by injection molding.

[0045] In the fourth embodiment, the cross section of the heat dissipation portion 66a is generally L-shaped, and the heat dissipation portion 66a includes a connecting section 663 and a heat dissipation section 665. The connecting section 663 is connected to the conductive wire 64, and the heat dissipation section 665 is exposed to the outer peripheral surface of the positioning seat 40. The connecting section 663 is attached to the pad 65, and the heat dissipation section 665 is arranged on the side of the connecting section 663 away from the photosensitive chip 62. In the direction parallel to the axis L, the thickness of the heat dissipation section 665 is greater than the thickness of the connecting section 663, and the heat dissipation section 665 has a heat exchange surface 666 away from the connecting section 663. The heat exchange surface 666 is exposed to the outer peripheral surface of the positioning seat 40, and preferably, the heat exchange surface 666 is coplanar with the outer peripheral surface of the positioning seat 40. The area of ​​the heat exchange surface 666 is larger than that of the heat dissipation surface 662 in the first embodiment, so that the heat dissipation efficiency of the heat dissipation portion 66 is higher, thereby further improving the heat dissipation efficiency of the photosensitive chip 62.

[0046] The beneficial effects of the camera assembly 100c in the fourth embodiment are the same as the beneficial effects of the camera assembly 100 in the first embodiment, and are not described again herein.

[0047] like Fig.11 As shown, the structure of the camera assembly 100d in the fifth embodiment of the present application is similar to that of the camera assembly 100 in the first embodiment, except that the number of the heat dissipation parts 66 in the fifth embodiment is greater than that in the first embodiment. Specifically, a plurality of pads 65 are respectively arranged around the front of the circuit board 60, and a heat dissipation part 66 is arranged on each pad 65, and the heat dissipation surface of each heat dissipation part 66 is exposed to the outer peripheral surface of the positioning seat 40; preferably, the heat dissipation surface of the heat dissipation part 66 is coplanar with the outer peripheral surface of the positioning seat 40.

[0048] The beneficial effects of the camera assembly 100d in the fifth embodiment are the same as the beneficial effects of the camera assembly 100 in the first embodiment, and are not described in detail here.

[0049] like Fig.12 As shown, the structure of the camera assembly 100e in the sixth embodiment of the present application is similar to that of the camera assembly 100a in the second embodiment, except that the number of the heat dissipation parts 66 in the sixth embodiment is greater than that in the second embodiment. Specifically, in the sixth embodiment, a plurality of pads 65 are respectively disposed around the front of the circuit board 60, and a heat dissipation part 66 is disposed on each pad 65, and a heat dissipation surface of each heat dissipation part 66 is exposed to the outer peripheral surface of the positioning seat 40; preferably, the heat dissipation surface of the heat dissipation part 66 is coplanar with the outer peripheral surface of the positioning seat 40.

[0050] The beneficial effects of the camera assembly 100e in the sixth embodiment are the same as the beneficial effects of the camera assembly 100a in the second embodiment, and are not described again here.

[0051] like Fig.13As shown, the present invention also provides an electronic device, which includes a housing 400, a mainboard 500 disposed in the housing 400, a display screen 600 disposed on the front of the housing 400, and a camera assembly 100 in any of the above embodiments, wherein the camera assembly 100 is disposed in the housing 400, and the camera assembly 100 and the display screen 600 are electrically connected to the mainboard 500 respectively. In this embodiment, the electronic device is a mobile phone, and the camera assembly 100 is a front lens on the mobile phone. Since the heat generated by the photosensitive chip 62 of the camera assembly 100 is directly transferred to the heat dissipation part through the conductive wire, the heat dissipation part directly exchanges heat with the cold air, so that the heat dissipation efficiency of the heat dissipation part is higher, thereby further improving the heat dissipation efficiency of the photosensitive chip, reducing the heat generated by the photosensitive chip from being transferred to the lens, preventing the lens from being deformed, and avoiding the reduction of resolution; secondly, since the positioning seat directly wraps the photosensitive chip, the heat generated by the photosensitive chip is transferred to the positioning seat, and the heat on the positioning seat exchanges heat with the external cold air through its outer peripheral surface, which is helpful for the heat dissipation of the photosensitive chip.

[0052] In other embodiments, the camera assembly may also be a rear lens.

[0053] In other embodiments, the camera assembly may also be, but is not limited to, any electronic device that requires a lens, such as a tablet computer, a display screen, a smart TV, an electronic watch, a smart bracelet, etc.

[0054] The above is an implementation of the embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the principles of the embodiment of the present invention. These improvements and modifications are also considered to be within the scope of protection of the present invention.

Claims

1. A camera assembly, characterized in that: The camera assembly comprises: Lenses, a positioning seat, the positioning seat supporting the lens, and A circuit board, wherein a photosensitive chip and a conductive wire are provided on the circuit board, the circuit board is connected to a side of the positioning seat away from the lens, one end of the conductive wire is connected to the photosensitive chip, and the other end of the conductive wire away from the photosensitive chip is connected to a soldering pad on the circuit board, the soldering pad is provided with a heat dissipation portion, and the heat dissipation portion is exposed outside the positioning seat.

2. The camera assembly according to claim 1, characterized in that: The circuit board is provided with a plurality of soldering pads and a plurality of conductive wires, each of the soldering pads is provided with the heat dissipation portion, one end of each conductive wire is connected to the photosensitive chip, and one end of each conductive wire away from the photosensitive chip is connected to the corresponding soldering pad, and the plurality of heat dissipation portions are all exposed from the outer peripheral surface of the positioning seat.

3. The camera assembly according to claim 1, characterized in that: The soldering pad is close to the outer peripheral surface of the positioning seat, and the soldering pad extends along the axial direction of the lens to form the heat dissipation portion.

4. The camera assembly according to claim 3, characterized in that: The heat dissipation portion includes a connecting section and a heat dissipation section, the connecting section is attached to the pad, and the heat dissipation section is exposed outside the outer peripheral surface of the positioning seat.

5. The camera assembly according to claim 1, characterized in that: The positioning seat is made by injection molding of injection resin on the circuit board, so that the positioning seat wraps around and contacts the photosensitive chip.

6. The camera assembly according to claim 5, characterized in that: The positioning seat wraps around and contacts the photosensitive chip, the positioning seat wraps the conductive wire, and the heat dissipation part is positioned on the positioning seat.

7. The camera assembly according to claim 1, characterized in that: The camera assembly also includes an optical filter. A fixing groove is provided on a side of the positioning seat away from the circuit board. The optical filter is positioned in the fixing groove, and the optical filter faces the photosensitive chip.

8. The camera assembly according to claim 1, characterized in that: The camera assembly also includes a support frame and an optical filter. The support frame is arranged between the positioning seat and the lens. A positioning groove is provided on the side of the support frame away from the positioning seat. The optical filter is positioned in the positioning groove. The optical filter is facing the photosensitive chip.

9. The camera assembly according to claim 1, characterized in that: The camera assembly also includes a heat sink, which is attached to the side of the circuit board away from the photosensitive chip, and the heat sink is facing the photosensitive chip.

10. An electronic device, characterized in that: It comprises a shell, a main board arranged in the shell, and a camera assembly as described in any one of claims 1 to 9, wherein the camera assembly is arranged in the shell, and a circuit board of the camera assembly is electrically connected to the main board.

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