A memory expansion module and a PCIE module

Abstract

The specification provides a memory expansion module and a PCIE module, and relates to the technical field of electronics. The memory expansion module comprises: a first printed circuit board, a memory expansion chip and a heat sink covering the memory expansion chip are arranged on the first printed circuit board, and a gold finger for plugging a PCIE interface is arranged on one side of the first printed circuit board; a second printed circuit board, at least two memory slots are arranged on the second printed circuit board, the memory slots are arranged on the two side surfaces of the second printed circuit board, and memories are arranged on the memory slots in a plug-pull manner; a rotating mechanism is fixed to the first printed circuit board and the second printed circuit board, and the second printed circuit board is arranged in a rotating manner relative to the first printed circuit board through the rotating mechanism; and an electrical connection mechanism is arranged between the first printed circuit board and the second printed circuit board, and the memory expansion chip and the memory slots are electrically connected. Through the above structure, the maintenance efficiency of the expanded memory in the electronic equipment can be improved.

Description

TECHNICAL FIELD

[0001] The present specification relates to the field of electronic technology, and in particular to a memory expansion module and a PCIE module. BACKGROUND

[0002] With the rapid development of cloud computing, big data, artificial intelligence and other technologies, the amount of data processing is gradually increasing, and the expansion demand for the capacity and bandwidth of the memory in electronic devices is also increasing. In this case, the PCIE (Peripheral Component Interconnect Express) protocol is one of the ways to realize memory expansion.

[0003] In the above implementation, a plurality of memories are inserted on the memory expansion module, the management of the plurality of memories is realized through an expansion control chip, and a heat sink needs to be provided for the expansion control chip for heat dissipation. Due to space limitations, the overall size of the memory expansion module needs to be consistent with the size of the PCIE card, so the plurality of memories need to be inserted on the memory expansion module, which makes the insertion and removal of the plurality of memories on the memory expansion module blocked by the expansion control chip and the heat sink. When maintaining the memory on the memory expansion module, the memory expansion module needs to be removed and the heat sink needs to be removed before the memory can be inserted and removed, which reduces the maintenance efficiency of the memory expansion module. SUMMARY

[0004] To overcome the problems in the related art, the present specification provides a memory expansion module and a PCIE module.

[0005] According to a first aspect of an embodiment of the present specification, a memory expansion module is provided, comprising:

[0006] A first printed circuit board, the first printed circuit board is provided with a memory expansion chip and a heat sink covering the memory expansion chip, and a gold finger for inserting a PCIE interface is provided on one side of the first printed circuit board;

[0007] A second printed circuit board, the second printed circuit board is provided with at least two memory slots, the memory slots are provided on the two side surfaces of the second printed circuit board, and memories are removably provided on the memory slots;

[0008] A rotating mechanism fixed to the first printed circuit board and the second printed circuit board, the second printed circuit board is rotatably provided relative to the first printed circuit board through the rotating mechanism;

[0009] An electrical connection mechanism is provided between the first printed circuit board and the second printed circuit board, and the memory expansion chip and the memory slot are electrically connected.

[0010] Optionally, the electrical connection mechanism is a flexible circuit board;

[0011] The first printed circuit board, the flexible printed circuit board, and the second printed circuit board are integrally formed, and a signal line electrically connecting the memory expansion chip and the memory slot is provided on the flexible printed circuit board.

[0012] Optionally, the electrical connection mechanism includes:

[0013] a first socket, provided on the first printed circuit board;

[0014] a second socket, provided on the second printed circuit board;

[0015] The plug cables are plugged into the first socket and the second socket respectively.

[0016] Optionally, the rotation mechanism includes:

[0017] a fixing portion, provided on the first printed circuit board;

[0018] The rotating part is provided on the second printed circuit board and is rotatably connected to the fixed part via a rotating shaft.

[0019] Optionally, the fixing portion includes:

[0020] a first fixing piece extending along the first printed circuit board and fixedly connected to the first printed circuit board;

[0021] a supporting plate connected to the first fixing plate and extending toward a side away from the first printed circuit board;

[0022] a connecting piece extending from an edge of the supporting piece away from the center of the first printed circuit board toward a side away from the first printed circuit board;

[0023] The rotating part includes:

[0024] a second fixing piece extending along the second printed circuit board and fixedly connected to the second printed circuit board;

[0025] The rotating shaft sleeve is connected to the edge of the second fixing plate close to the first printed circuit board. The rotating shaft is sleeved into the rotating shaft sleeve and penetrates the connecting plate.

[0026] Optionally, the rotating mechanism further includes:

[0027] The locking portion is provided between the fixed portion and the rotating portion, wherein when the locking portion is in a locked state, the rotation between the fixed portion and the rotating portion is locked, and when the locking portion is in an unlocked state, the rotating portion rotates relative to the fixed portion.

[0028] Optionally, the locking portion includes:

[0029] a protrusion provided on one of the fixed portion and the rotating portion;

[0030] A groove is provided on the other of the fixing portion and the rotating portion, and the protrusion slides into the groove to cooperate and lock.

[0031] Optionally, the locking portion includes:

[0032] a locking hole, provided in one of the fixed portion and the rotating portion;

[0033] A captive screw is fixed to the other of the fixed portion and the rotating portion, and the captive screw is inserted into the locking hole to cooperate with the locking.

[0034] Optionally, the locking portion includes:

[0035] a sliding groove, provided on the fixing portion, wherein the sliding groove extends to an opening at an edge of the fixing portion;

[0036] a locking groove, provided on the fixing portion and located at an end of the sliding groove, wherein the locking groove extends out of the sliding groove on at least one side of the sliding groove;

[0037] an elastic locking piece, disposed on the rotating portion and extending along an edge of the rotating portion toward the outside of the fixed portion, the elastic locking piece corresponding to the opening and biased toward a side of the locking slot extending out of the sliding slot;

[0038] When the elastic locking piece is pressed into the sliding groove and reaches the locking groove, part of the elastic locking piece is accommodated in the side of the locking groove extending out of the sliding groove, and the locking portion is placed in a locked state; when the elastic locking piece is pushed out of the side of the locking groove extending out of the sliding groove and slides out of the opening of the sliding groove along the sliding groove, the locking portion is placed in an unlocked state.

[0039] According to a second aspect of the embodiments of this specification, a PCIE expansion module is provided, comprising at least one memory expansion module as described in any one of the above.

[0040] The technical solutions provided by the embodiments of this specification may have the following beneficial effects:

[0041] In the embodiments of the present specification, a second printed circuit board is rotatably arranged relative to the first printed circuit board through a rotation mechanism. When maintaining the memory arranged on the second printed circuit board, the second printed circuit board is rotated so that it is offset by a certain angle from the first printed circuit board, so that the memory can be conveniently removed from the memory slot, thereby improving the maintenance efficiency of the memory expansion module.

[0042] It should be understood that the foregoing general description and the following detailed description are exemplary and explanatory only and are not restrictive of the present disclosure. BRIEF DESCRIPTION OF THE DRAWINGS

[0043] The accompanying drawings, which are incorporated in and constitute a part of this specification, illustrate embodiments consistent with the specification and, together with the description, serve to explain the principles of the specification.

[0044] Figure 1 This is a schematic diagram of the structure of a memory expansion module involved in this application;

[0045] Figure 2 This is a schematic diagram of the structure of a memory expansion module involved in this application, wherein the second printed circuit board forms a certain angle with the first printed circuit board to maintain the memory;

[0046] Figure 3 is a structural diagram of a memory expansion module involved in this application, wherein the second printed circuit board is arranged perpendicular to the first printed circuit board;

[0047] Figure 4 This is a schematic diagram of a process for preparing a first printed circuit board, a second printed circuit board, and a flexible circuit board in a memory expansion module according to an embodiment of the present application;

[0048] Figure 5 2 is a schematic structural diagram of a memory expansion module according to another embodiment of the present application, wherein the electrical connection mechanism is formed by a socket and a cable;

[0049] Figure 6 : is a structural diagram of a rotating mechanism in a memory expansion module involved in an embodiment of the present application, wherein: Figure 6 (A) The rotating mechanism is in the locked state. Figure 6 (B) The rotating mechanism is in the unlocked state;

[0050] Figure 7 is a structural schematic diagram of a rotation mechanism in a memory expansion module involved in another embodiment of the present application;

[0051] Figure 8 : is a structural diagram of a rotating mechanism in a memory expansion module involved in another embodiment of the present application, wherein: Figure 8(A) The rotating mechanism is in the locked state. Figure 8 (B) The rotating mechanism is in the unlocked state;

[0052] Figure 9 This is a structural diagram of a PCIE module involved in this application. DETAILED DESCRIPTION

[0053] Exemplary embodiments will be described in detail herein, with examples illustrated in the accompanying drawings. In the following description, when referring to the drawings, identical numerals in different figures represent identical or similar elements unless otherwise indicated. The embodiments described in the following exemplary embodiments are not intended to represent all embodiments consistent with this specification. Rather, they are merely examples of apparatus and methods consistent with certain aspects of this specification, as detailed in the appended claims.

[0054] The terms used in this specification are for the purpose of describing specific embodiments only and are not intended to limit this specification. As used in this specification and the appended claims, the singular forms "a," "an," "the," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It should also be understood that the term "and / or" as used herein refers to and encompasses any and all possible combinations of one or more of the associated listed items.

[0055] It should be understood that although the terms first, second, third, etc. may be used in this specification to describe various information, such information should not be limited to these terms. These terms are merely used to distinguish information of the same type from one another. For example, first information may also be referred to as second information, and similarly, second information may also be referred to as first information without departing from the scope of this specification. Depending on the context, the term "if" as used herein may be interpreted as "when," "when," or "in response to determining."

[0056] This application provides a memory expansion module 100, such as Figure 1 Shown, including:

[0057] A first printed circuit board 1 is provided with a memory expansion chip 10 and a heat sink 11 covering the memory expansion chip 10. A gold finger 12 for plugging into a PCIE interface is provided on one side of the first printed circuit board 1. The first printed circuit board 1 can be electrically connected to a PCIE interface provided on a motherboard or a PCIE interface on a PCIE expansion module (Riser) through the gold finger 12 to achieve a physical connection for processor memory expansion on the motherboard;

[0058] A second printed circuit board 2, wherein the second printed circuit board 2 is provided with at least two memory slots 20, the memory slots 20 being provided on both side surfaces 2A and 2B of the second printed circuit board 2, and a memory 21 being pluggable and disposed on the memory slots 20. Since the shape and size of the memory expansion module 100 need to be consistent with the PCIE module on the electronic device, the sizes of the first printed circuit board 1 and the second printed circuit board 2, as well as the various components provided thereon, need to meet the size of the PCIE module;

[0059] The rotating mechanism 3 is fixed to the first printed circuit board 1 and the second printed circuit board 2. The second printed circuit board 2 can be rotated relative to the first printed circuit board 1 through the rotating mechanism 3. The rotating mechanism 3 can be formed of a rigid material. The rotating mechanism 3 can make the first printed circuit board 1 and the second printed circuit board 2 be arranged nearly orthogonally during the operation of the electronic device, thereby limiting the size of the second printed circuit board 2 and the memory slot 20 and memory 21 provided thereon as much as possible. Moreover, since the rotating mechanism 3 is made of a rigid material, it can provide a higher connection between the first printed circuit board 1 and the second printed circuit board 2. Reliability: The rotation mechanism 3 can form a locked state and an unlocked state. In the locked state, the first printed circuit board 1 and the second printed circuit board 2 can maintain a stable connection state, which is used to provide a fixed connection during the operation of the electronic device. In the unlocked state, the first printed circuit board 1 and the second printed circuit board 2 can rotate (or separate) to facilitate the staggered separation of the memory 21 and the heat sink 11 to maintain the memory 21 set on the second printed circuit board 2. In other words, the rotation of the second printed circuit board 2 relative to the first printed circuit board 1 achieved by the rotation mechanism 3 can be a rotation after the two are separated, or a rotation between the two in a non-separated manner;

[0060] An electrical connection mechanism 4 is provided between the first printed circuit board 1 and the second printed circuit board 2, electrically connecting the memory expansion chip 10 and the memory slot 20. The electrical connection mechanism 4 can be an electrical connection via a connector and a cable, or can be a bendable electrical connection formed by pressing a flexible circuit board and a rigid circuit board together. The arrangement can be based on actual needs and is not limited thereto. The pins of the memory expansion chip 10 on the first printed circuit board 1 are inserted into vias or other structures provided on the first printed circuit board 1, and the pins of the memory slot 20 on the second printed circuit board 2 are inserted into vias or other structures provided on the second printed circuit board 2. In addition, since the two side surfaces 2A and 2B of the second printed circuit board 2 need to be respectively plugged into the memory slots 20, if the thickness of the second printed circuit board 2 is insufficient to accommodate the pins of the memory slots 20 on both sides, the memory slots 20 on both sides can be staggered so that the pins of the memory slots 20 on both sides can maximize the thickness of the second printed circuit board 2 to deploy their internal circuits.

[0061] by Figures 2 to 3 Observing the order, when installing the memory expansion module 100 into the electronic device, the heat sink 11 can be installed on the first printed circuit board 1 first, and then the memory 21 can be installed in the memory slot 20 on the second printed circuit board 2 away from the first printed circuit board 1. After that, the rotating mechanism 3 is driven to rotate to rotate the second printed circuit board 2 by a certain angle, staggering the memory slot 20 of the second printed circuit board 2 and the heat sink 11 on the first printed circuit board 1, so that the memory 21 can be inserted into the memory slot 20 on the side closer to the first printed circuit board 1. Finally, the rotating mechanism 3 is operated to rotate back and switch to the locked state, completing the installation of the memory expansion module 100.

[0062] by Figure 3 to Figure 2 Observing the sequence, when removing memory 21 from second PCB 2, the operator can first operate rotation mechanism 3 to offset the second PCB 2 and first PCB 1 by a certain angle, unlocking rotation mechanism 3. This allows memory 21 closer to the first PCB 1 to clear the heat sink 11, allowing the memory 21 to be removed and replaced. Afterwards, the operator can operate rotation mechanism 3 again to return it to the locked state, quickly completing maintenance on the memory expansion module 100 and avoiding the need to remove the heat sink 11 during maintenance on the memory 21. This improves the maintenance efficiency of the memory expansion module 100.

[0063] Optional, such as Figure 2 、 3 As shown, the electrical connection mechanism 4 is a flexible circuit board 40;

[0064] The first printed circuit board 1 , the flexible printed circuit board 40 and the second printed circuit board 2 are integrally formed. The flexible printed circuit board 40 is provided with a signal line electrically connecting the memory expansion chip 10 and the memory slot 20 .

[0065] Since the memory expansion module 100 includes two printed circuit boards, a first printed circuit board 1 and a second printed circuit board 2 , the electrical components provided on the two printed circuit boards need to be electrically connected via an electrical connection mechanism 4 .

[0066] In order to improve the reliability of the electrical connection and reduce the number of operations required to achieve the electrical connection between the first printed circuit board 1 and the second printed circuit board 2, the printed circuit boards in the memory expansion module 100 can be prepared by integrating a flexible printed circuit board with a rigid printed circuit board. That is, the first printed circuit board 1 and the second printed circuit board 2 are rigid printed circuit boards, and the flexible printed circuit board 40 is used to achieve the electrical connection between them.

[0067] Possible implementation methods, such as Figure 4 As shown, it includes but is not limited to using a flexible circuit board 40 as a core board, pre-forming a signal line on the flexible circuit board 40, and the signal line is used to subsequently electrically connect the memory expansion chip 10 set on the first printed circuit board 1 and the memory slot 20 on the second printed circuit board 2.

[0068] Rigid printed circuit boards are laminated on both sides of the flexible circuit board 40, and the required signal lines are formed on the rigid printed circuit boards. Thereafter, the middle portion of the rigid printed circuit board is etched away to expose the flexible circuit board 40, the first printed circuit board 1, and the second printed circuit board 2.

[0069] When installing the memory expansion module 100, the rotation mechanism 3 and the flexible circuit board 40 can be used to achieve the arrangement between the first printed circuit board 1 and the second printed circuit board 2. When the rotation mechanism 3 is required, the flexible circuit board 40 located between the first printed circuit board 1 and the second printed circuit board 2 can provide bendability to achieve electrical connection between the first printed circuit board 1 and the second printed circuit board 2 and meet the size requirements of the memory expansion module 100 similar to a PCIE plug-in card.

[0070] Optionally, the electrical connection mechanism 4, such as Figure 5 Shown, including:

[0071] A first socket 41 is provided on the first printed circuit board 1;

[0072] A second socket 42 is provided on the second printed circuit board 2;

[0073] The plug cable 43 is plugged into the first socket 41 and the second socket 42 respectively.

[0074] In some cases, the electrical connection mechanism 4 can also connect the memory expansion chip 10 through the first socket 41 provided on the first printed circuit board 1, and connect the memory slot 20 through the second socket 42 provided on the second printed circuit board 2. The plug cable 43 is connected to the first socket 41 and the second socket 42, connecting the memory expansion chip 10 and the memory slot 20, thereby realizing the electrical connection between the memory expansion chip 10 and the expanded memory 21.

[0075] Optionally, the rotating mechanism 3, as shown, comprises: Figure 6 The fixed part 30 is provided on the first printed circuit board 1.

[0076] The rotating part 31 is provided on the second printed circuit board 2 and is rotationally connected to the fixed part 30 through the rotating shaft 32.

[0077] The fixed part 30 is mainly used to provide support for the rotating part 31 to ensure reliable rotation of the rotating part 31. A through hole for the rotating shaft 32 can be provided between the fixed part 30 and the rotating part 31, and the rotating shaft 32 can be inserted into the through hole by riveting or screwing, etc.

[0078] As shown in (A), the fixed part 30 and the rotating part 31 of the rotating mechanism 3 are closed, and the first printed circuit board 1 and the second printed circuit board 2 are at a near-perpendicular angle. Figure 6 As shown in (B), the fixed part 30 and the rotating part 31 of the rotating mechanism 3 are rotated by a certain angle, and the first printed circuit board 1 and the second printed circuit board 2 are arranged at an acute angle. Figure 6 In the case where the fixed part 30 is inserted into the PCIE slot of the PCIE expansion module or the mainboard, its movement is limited. At this time, under the action of the rotating shaft 32, the worker can drive the rotating part 31 to rotate relative to the fixed part 30, so that the second printed circuit board 2 can rotate relative to the first printed circuit board 1, thereby realizing the interference removal of the installation and disassembly between the memory 21 and the heat sink 11.

[0079] Of course, the form of the rotating shaft 32 is not limited to the separate arrangement of the first printed circuit board 1 and the second printed circuit board 2. The rotating shaft 32 can also be integrally formed on the first printed circuit board 1 or the second printed circuit board 2 by stamping, etc., and a through hole is formed on the other printed circuit board to cooperate with the rotation. According to actual needs, it can be set, and no limitation is made.

[0080] For the locked state and the unlocked state of the rotating mechanism 3, it can be realized by the structure of the fixed part 30 and the rotating part 31 itself, or other structures can be separately provided to realize it. According to actual needs, it can be set, and no limitation is made.

[0081] ​

[0082] Specifically, the fixing portion 30, such as Figure 6 Shown, including:

[0083] A first fixing piece 30A extends along the first printed circuit board 1 and is fixedly connected to the first printed circuit board 1. The first fixing piece 30A is substantially strip-shaped and has a through hole for fixing to the first printed circuit board 1.

[0084] A support piece 30B is connected to the first fixing piece 30A and extends toward a side away from the first printed circuit board 1. The support piece 30B is substantially perpendicular to the first fixing piece 30A, and the size of the support piece 30B is limited by the size of the PCIE card.

[0085] A connecting piece 30C extends from an edge of the supporting piece 30B away from the center of the first printed circuit board 1 to a side away from the first printed circuit board 1. The connecting piece 30C may be understood to extend toward the second printed circuit board 2 to connect to the rotating portion 31.

[0086] The rotating part 31 includes:

[0087] A second fixing piece 31A extends along the second printed circuit board 2 and is fixedly connected to the second printed circuit board 2. The second fixing piece 31A is substantially strip-shaped and has a through hole for fixing to the second printed circuit board 2.

[0088] The shaft sleeve 31B is connected to the edge of the second fixing piece 31A close to the first printed circuit board 1 , and the shaft 32 is inserted into the shaft sleeve 31B and penetrates the second fixing piece 31A.

[0089] By forming a second fixing piece 31A and a rotating shaft sleeve 31B on the rotating portion 31, the rotating portion 31 can more reliably fix the rotating shaft 32 and can be connected to the connecting piece 30C of the fixed portion 30 by riveting or screwing. After installation, the rotating shaft 32 can be used to achieve rotation of the second printed circuit board 2 relative to the first printed circuit board 1.

[0090] Optionally, the rotating mechanism 3, such as Figure 6 As shown, it also includes:

[0091] The locking portion 33 is provided between the fixed portion 30 and the rotating portion 31 , wherein when the locking portion 33 is in a locked state, the rotation between the fixed portion 30 and the rotating portion 31 is locked; and when the locking portion 33 is in an unlocked state, the rotating portion 31 rotates relative to the fixed portion 30 .

[0092] By locking the fixing portion 30 and the rotating portion 31 through the locking portion 33 , the rotating mechanism 3 can be prevented from being loosened due to vibration or the like, thereby improving the stability of the memory expansion module.

[0093] Specifically, the locking portion 33, such as Figure 6 Shown, including:

[0094] a protrusion 33A provided on one of the fixed portion 30 and the rotating portion 31;

[0095] A groove 33B is provided in the other of the fixing portion 30 and the rotating portion 31 , and the protrusion 33A slides into the groove 33B to be locked.

[0096] exist Figure 6 In the embodiment, the protrusion 33A is formed on the rotating portion 31 and can be formed by stamping on the elastic arm 33C of the second fixing plate 31A toward the first printed circuit board 1. The groove 33B is formed on the connecting plate 30C of the fixing portion 30. In a top view, the groove 33B formed on the connecting plate 30C can accommodate the protrusion 33A.

[0097] The projection 33A may be arc-shaped when viewed from above, providing a certain guiding effect. When the projection 33A abuts the edge of the connecting piece 30C, the locking portion 33 slides along the arc of the projection 33A to the top of the arc due to the guiding effect of the projection 33A, and is elastically compressed. When the projection 33A slides into the groove 33B, the compression is released, and the projection 33A can abut the edge of the groove 33B to provide a certain locking force, thereby achieving locking.

[0098] That is, the locking portion 33 can be directly formed on the fixing portion 30 and the rotating portion 31 without adding additional components, so that the size of the memory expansion module 100 can be more easily limited.

[0099] Specifically, the locking portion 33, such as Figure 7 Shown, including:

[0100] The locking hole 33C is provided in one of the fixing portion 30 and the rotating portion 31. Figure 7 The rotating part 31 is provided in the middle;

[0101] A captive screw 33D is fixed to the other of the fixed portion 30 and the rotating portion 31. The captive screw 33D is inserted into the locking hole 33C to lock the fixed portion 30. Figure 7 The fixing portion 30 is provided in the middle.

[0102] The locking force is controlled by the depth of the captive screw 33D inserted into the locking hole 33C, thereby further improving the locking reliability of the memory expansion module 100 .

[0103] Optionally, the locking portion 33, such as Figure 8 Shown, including:

[0104] a sliding groove 33E provided on the fixing portion 30 , wherein the sliding groove 33E extends to an opening 33F at an edge of the fixing portion 30 ;

[0105] a locking groove 33G disposed on the fixing portion 30 and located at the end of the sliding groove 33F, with the locking groove 33G extending out of the sliding groove 33E on at least one side of the sliding groove 33E;

[0106] An elastic locking piece 33H is provided on the rotating portion 31 and extends along the edge of the rotating portion 31 toward the outside of the fixed portion 30. The elastic locking piece 33H corresponds to the opening 33F and extends toward the side of the locking groove 33G extending out of the sliding groove 33E.

[0107] Among them, such as Figure 8 As shown in (A), when the elastic locking piece 33H is pressed into the sliding groove 33E and reaches the locking groove 33G, part of the elastic locking piece 33H is accommodated in the side of the locking groove 33G extending out of the sliding groove 33E, and the locking portion 33 is placed in a locked state; Figure 8 As shown in (B), when the elastic locking piece 33H is pushed out of the locking groove 33G and extends out of one side of the sliding groove 33E and slides out of the opening 33F of the sliding groove 33E along the sliding groove 33E, the locking portion 33 is placed in the unlocked state.

[0108] It should be noted that the locking portion 33 may also be implemented in other ways, which is not limited thereto.

[0109] Furthermore, the aforementioned rotation mechanism 3 can be arranged in a group, formed on both sides of the first printed circuit board 1 and the second printed circuit board 2, or can be arranged only on one side of the first printed circuit board 1 and the second printed circuit board 2, while not being arranged on the other side. Alternatively, the aforementioned rotation mechanism 3 can be implemented on one side of the first printed circuit board 1 and the second printed circuit board 2, while other mechanisms supporting the first printed circuit board 1 and the second printed circuit board 2 can be implemented on the other side. Through these different deployment methods, the relative rotation function of the second printed circuit board 2 relative to the first printed circuit board 1 (or combined with the locking and unlocking functions) can be achieved.

[0110] Correspondingly, the present application also provides a PCIE expansion module 200, such as Figure 9 As shown, it includes at least one memory expansion module 100 as described in any one of the above items.

[0111] In addition, the electronic device including the PCIE expansion module 200 can be a personal computer, a server, a switch, a router, etc., and can be deployed according to actual needs without any restrictions.

[0112] A plurality of PCIE slots 201 may be provided on a PCIE expansion module 200. One or more of the plurality of PCIE slots 201 may be plugged with a memory expansion module 100. The PCIE slots 201 not plugged with a memory expansion module 100 may be plugged with other gold fingers that comply with the PCIE protocol. The specific implementation may be set as required without limitation.

[0113] The technical solutions provided by the embodiments of this specification may have the following beneficial effects:

[0114] In the embodiments of the present specification, a second printed circuit board is rotatably arranged relative to the first printed circuit board through a rotation mechanism. When maintaining the memory arranged on the second printed circuit board, the second printed circuit board is rotated so that it is offset by a certain angle from the first printed circuit board, so that the memory can be conveniently removed from the memory slot, thereby improving the maintenance efficiency of the memory expansion module.

[0115] The implementation process of the functions and effects of each module in the above-mentioned device is specifically described in the implementation process of the corresponding steps in the above-mentioned method, and will not be repeated here.

[0116] For the device embodiments, since they basically correspond to the method embodiments, the relevant parts can be referred to the partial description of the method embodiments. The device embodiments described above are merely illustrative, wherein the modules described as separate components may or may not be physically separated, and the components displayed as modules may or may not be physical modules, that is, they may be located in one place, or they may be distributed on multiple network modules. Some or all of the modules may be selected according to actual needs to achieve the purpose of the scheme of this specification. A person of ordinary skill in the art can understand and implement it without paying any creative work.

[0117] Other embodiments of the present invention will readily occur to those skilled in the art upon consideration of the present invention and practice of the invention claimed herein. This specification is intended to cover any variations, uses, or adaptations of the present invention that follow the general principles of this specification and include common knowledge or customary techniques in the art not claimed herein. The description and examples are to be considered as exemplary only, with the true scope and spirit of the present invention being indicated by the following claims.

[0118] It should be understood that the present description is not limited to the exact structure that has been described above and shown in the drawings, and that various modifications and changes may be made without departing from the scope thereof. The scope of the present description is limited only by the appended claims.

[0119] The above description is only a preferred embodiment of this specification and is not intended to limit this specification. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principles of this specification should be included in the scope of protection of this specification.

Claims

1. A memory expansion module, characterized in that: include: A first printed circuit board, wherein a memory expansion chip and a heat sink covering the memory expansion chip are provided on the first printed circuit board, and a gold finger for plugging into a PCIE interface for high-speed interconnection of peripheral components is provided on one side of the first printed circuit board; a second printed circuit board, wherein at least two memory slots are provided on the second printed circuit board, the memory slots being provided on both side surfaces of the second printed circuit board, and memories being pluggable and arranged on the memory slots; a rotation mechanism fixed to the first printed circuit board and the second printed circuit board, wherein the second printed circuit board is rotated relative to the first printed circuit board by the rotation mechanism, and the rotation mechanism enables the first printed circuit board and the second printed circuit board to be orthogonally arranged during operation of the electronic device; an electrical connection mechanism, disposed between the first printed circuit board and the second printed circuit board, electrically connecting the memory expansion chip and the memory slot; The rotating mechanism comprises: a fixing portion, provided on the first printed circuit board; a rotating portion, disposed on the second printed circuit board and rotatably connected to the fixed portion via a rotating shaft; The locking portion is arranged between the fixed portion and the rotating portion, wherein when the locking portion is in a locked state, the rotation between the fixed portion and the rotating portion is locked; when the locking portion is in an unlocked state, the rotating portion rotates relative to the fixed portion. In the unlocked state, the first printed circuit board and the second printed circuit board are rotatable or separable to stagger the memory and the heat sink.

2. The memory expansion module according to claim 1, wherein: The electrical connection mechanism is a flexible circuit board; The first printed circuit board, the flexible printed circuit board, and the second printed circuit board are integrally formed, and a signal line electrically connecting the memory expansion chip and the memory slot is provided on the flexible printed circuit board.

3. The memory expansion module according to claim 1, wherein: The electrical connection mechanism comprises: a first socket, provided on the first printed circuit board; a second socket, provided on the second printed circuit board; The plug cables are plugged into the first socket and the second socket respectively.

4. The memory expansion module according to claim 1, wherein: The fixing portion includes: a first fixing piece extending along the first printed circuit board and fixedly connected to the first printed circuit board; a supporting plate connected to the first fixing plate and extending toward a side away from the first printed circuit board; a connecting piece extending from an edge of the supporting piece away from the center of the first printed circuit board toward a side away from the first printed circuit board; The rotating part includes: a second fixing piece extending along the second printed circuit board and fixedly connected to the second printed circuit board; The rotating shaft sleeve is connected to the edge of the second fixing plate close to the first printed circuit board. The rotating shaft is sleeved into the rotating shaft sleeve and penetrates the connecting plate.

5. The memory expansion module according to claim 1, wherein: The locking portion comprises: a protrusion provided on one of the fixed portion and the rotating portion; A groove is provided on the other of the fixing portion and the rotating portion, and the protrusion slides into the groove to cooperate and lock.

6. The memory expansion module according to claim 1, wherein: The locking portion comprises: a locking hole, provided in one of the fixed portion and the rotating portion; A captive screw is fixed to the other of the fixed portion and the rotating portion, and the captive screw is inserted into the locking hole to cooperate with the locking.

7. The memory expansion module according to claim 1, wherein: The locking portion comprises: a sliding groove, provided on the fixing portion, wherein the sliding groove extends to an opening at an edge of the fixing portion; a locking groove, provided on the fixing portion and located at an end of the sliding groove, wherein the locking groove extends out of the sliding groove on at least one side of the sliding groove; an elastic locking piece, disposed on the rotating portion and extending along an edge of the rotating portion toward the outside of the fixed portion, the elastic locking piece corresponding to the opening and biased toward a side of the locking slot extending out of the sliding slot; When the elastic locking piece is pressed into the sliding groove and reaches the locking groove, part of the elastic locking piece is accommodated in the side of the locking groove extending out of the sliding groove, and the locking portion is placed in a locked state; when the elastic locking piece is pushed out of the side of the locking groove extending out of the sliding groove and slides out of the opening of the sliding groove along the sliding groove, the locking portion is placed in an unlocked state.

8. A PCIE expansion module, characterized in that: The device comprises at least one memory expansion module according to any one of claims 1 to 7.

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