A method for processing step groove of circuit board

Abstract

A method for processing a step groove of a circuit board, which relates to the technical field of circuit board production, includes the following steps: applying a resist film: covering a layer of resist film on the surface of the circuit board, and the size is not less than the circuit board; a quick press: pressing the resist film and the circuit board together; cutting the resist film: using a laser to cut the resist film around the circuit pattern in the step groove, and the size of the laser-cut circuit pattern is 2 mil larger than the overall size of the circuit pattern in the step groove; applying a covering film: covering a layer of covering film on the surface of the resist film, and the size of the covering film is the same as that of the resist film; a second quick press: pressing the covering film and the circuit board together; cutting the covering film: using a laser to cut the resist film along the shape of the step groove, and the size of the covering film after laser cutting is 4 mil smaller than the size of the step groove; tearing off the film: tearing off the resist film and the covering film outside the step groove. This method can ensure that there is no gap between the resist film and the step groove, and avoid PP overflowing into the step groove and affecting the subsequent surface treatment effect.

Description

Technical Field

[0001] The invention relates to the technical field of circuit board production, and in particular to a method for processing a step groove of a circuit board. Background Art

[0002] In the manufacture of printed circuit boards, step grooves are usually designed on their surfaces, and there are often circuit patterns in the step grooves. In order to ensure that the circuit patterns in the step grooves do not leak plating during the surface treatment process, it is necessary to prevent the PP glue from flowing onto the circuit patterns in the step grooves during the lamination process. In order to ensure that there are no glue traces in the circuit patterns in the step grooves, it is necessary to paste a resist film in the step grooves during the processing of the step grooves, and at the same time, perform window processing on the PP located at the resist film. The conventional practice is to paste a resist film on the circuit board, and then process the resist film according to the size and shape of the step grooves, and finally tear off the resist film that does not need to be retained on the circuit board, and the remaining resist film is covered in the step grooves. However, due to the small gap between the circuit patterns in the step grooves, the large height difference between the copper surface and the substrate, the surface tension of the resist film, etc., the resist film is difficult to completely match the substrate at the edge of the circuit, thus forming a gap. During the lamination process, the PP glue overflows along the above gap into the step grooves or the circuits in the step grooves, which will affect the effect of the surface treatment during the subsequent surface treatment. Summary of the invention

[0003] In view of the deficiencies of the above-mentioned related prior arts, the present application provides a circuit board step groove processing method, which ensures that there is no gap between the adhesive resistance film and the step groove, avoids PP glue overflowing into the step groove and affecting the subsequent surface treatment effect, and has strong practicality.

[0004] In order to achieve the above object, the present invention adopts the following technologies:

[0005] A method for processing a step groove of a circuit board comprises the following steps:

[0006] S1. Applying adhesive film: Use a circuit board laminating device to cover the surface of the circuit board with a layer of adhesive film, and the size of the film should not be smaller than the circuit board;

[0007] S2, one-step quick pressing: pressing the resist film and the circuit board together;

[0008] S3, cutting the resist film: using laser to cut the resist film around the circuit pattern in the step groove, and the size of the circuit pattern cut by the laser is 2 mil larger than the overall size of the circuit pattern in the step groove;

[0009] S4, pasting covering film: using a circuit board laminating device to cover a layer of covering film on the surface of the resist film, and the size of the covering film is the same as that of the resist film;

[0010] S5, secondary fast pressing: pressing the cover film and the circuit board together;

[0011] S6. Cutting the cover film: using laser to cut the resist film along the shape of the step groove, and the size of the cover film after laser cutting is 4 mil smaller than the size of the step groove;

[0012] S7, tearing off the film: tear off the adhesive blocking film and covering film outside the step groove.

[0013] Furthermore, the circuit board laminating device used in S1 and S4 includes:

[0014] There are two support plates, which are symmetrically arranged, and a plurality of conveying rollers are arranged between the support plates along their length direction for conveying circuit boards;

[0015] The limiting mechanism includes two clamping plates disposed between the support plates and moving toward each other, and is used to limit the positions of both sides of the circuit board. A stopper is provided between the clamping plates and is movable in the vertical direction, and is used to abut against one end of the circuit board.

[0016] The laminating mechanism comprises a lifting frame which is arranged above the supporting plate and moves in the vertical direction, guide rollers which rotate around their own axes are arranged at both ends of the lifting frame, the guide rollers which are away from the block are used to convey the adhesive-blocking film or the covering film, the guide rollers which are close to the block are used to transfer the excess side edge of the adhesive-blocking film or the covering film, and the block is located between the two guide rollers, the adhesive-blocking film or the covering film between the guide roller away from the block and the block is in a horizontal state, a pressing plate and a pressing roller which moves in the length direction of the supporting plate are arranged between the guide rollers, and the pressing plate is located between the pressing roller and the block, the pressing plate is in an inverted L-shape, and the lowest point of the pressing roller is flush with the bottom of the horizontal section of the pressing plate, the pressing roller is used to cover the adhesive-blocking film or the covering film on the circuit board, the pressing plate is used to limit one end of the circuit board and make the adhesive-blocking film or the covering film contact with the circuit board, and perforations are arranged at both ends of the vertical section of the pressing plate for passing through the excess side edge of the adhesive-blocking film or the covering film.

[0017] Furthermore, the steps of laminating the circuit board using the circuit board laminating device in S1 and S4 both include:

[0018] S01, transferring the circuit board to the conveying roller, making the stopper abut against one end of the circuit board, and the clamping plate limit the two sides of the circuit board;

[0019] S02, the lifting frame moves downward, the lower end of the pressing plate abuts against the upper end of the stopper, and the stopper and the pressing plate move downward synchronously, the horizontal section of the pressing plate and the pressing roller abut against the surface of the circuit board, the adhesive film or the covering film contacts the surface of the circuit board, and the vertical section of the pressing plate abuts against the end of the circuit board;

[0020] S03, driving the pressing roller to move from one end of the lifting frame where the pressing plate is provided to the other end, so as to attach the adhesive barrier film or the covering film to the surface of the circuit board;

[0021] S04, cutting the resist film or the cover film to separate the resist film or the cover film covering the surface of the circuit board from other parts;

[0022] S05, moving the lifting frame upward, resetting the pressure roller, and moving the adhesive film or the covering film for a certain distance;

[0023] S06, conveying the laminated circuit board away through conveying rollers.

[0024] Furthermore, the thickness of the adhesive barrier film is 27.5um or 50um.

[0025] Furthermore, the thickness of the covering film is 50um-75um.

[0026] Furthermore, the temperature of the first rapid pressing in S2 is 150°C-180°C and the pressure is 120kg / cm 2 -150kg / cm 2 , time is 120s-150s.

[0027] Furthermore, the temperature of the secondary rapid pressing in S5 is 140°C-150°C and the pressure is 100kg / cm 2 -120kg / cm 2 , time is 80s-120s.

[0028] The beneficial effects of the present invention are as follows: by covering the step groove with a resist film and processing the resist film into the same shape as the step groove by laser, the resist film can be matched with the substrate, and covered with a layer of covering film, a composite film is formed between the resist film and the covering film, and the filling property of the AD glue of the covering film is utilized to fill the gap that may exist between the resist film and the circuit in the step groove, so as to prevent PP glue from overflowing into the step groove in the subsequent pressing process, thereby avoiding affecting the effect of subsequent surface treatment. BRIEF DESCRIPTION OF THE DRAWINGS

[0029] The drawings described herein are for illustrative purposes only of selected embodiments and not all possible implementations, and are not intended to limit the scope of the present invention.

[0030] Figure 1 This is a flow chart of the processing method of an embodiment of the present application.

[0031] Figure 2 It is a three-dimensional schematic diagram of the overall structure of the coating device according to an embodiment of the present application.

[0032] Figure 3 It is a three-dimensional schematic diagram of the limiting mechanism of an embodiment of the present application.

[0033] Figure 4 It is a three-dimensional schematic diagram of the laminating mechanism according to an embodiment of the present application.

[0034] Figure 5 for Figure 4 An enlarged schematic diagram of point A.

[0035] Figure 6 for Figure 4 An enlarged schematic diagram of point B.

[0036] Figure 7 This is a schematic diagram of the installation of the lifting frame and the supporting frame according to an embodiment of the present application.

[0037] Description of reference numerals: 100—support plate, 200—limiting mechanism, 300—laminating mechanism, 101—conveying roller, 201—clamping plate, 202—stopper, 203—top plate, 204—first vertical rod, 205—U-shaped frame, 206—first spring, 207—side plate, 208—rack, 209—driving gear, 210—transmission shaft, 211—convex plate, 212—support rod, 30 1—lifting frame, 302—guide roller, 303—pressing plate, 304—pressing roller, 305—connecting plate, 306—cross bar, 307—support frame, 308—mounting plate, 309—second vertical bar, 310—support plate, 311—second spring, 312—rotating shaft, 313—moving block, 314—guide rod, 315—connecting rod, 316—push plate, 317—winding roller, 318—perforation. DETAILED DESCRIPTION

[0038] To make the objectives, technical solutions and advantages of the embodiments of the present invention more clear, the implementation modes of the present invention are described in detail below with reference to the accompanying drawings. However, the embodiments described in the present invention are only part of the embodiments of the present invention, rather than all the embodiments.

[0039] like Figure 1 As shown, one aspect of the embodiments of the present application provides a method for processing a step groove of a circuit board, comprising the following steps:

[0040] S1. Applying adhesive film: Use a circuit board laminating device to cover the surface of the circuit board with a layer of adhesive film, and the size should not be smaller than the circuit board to ensure that the circuit board can be completely covered;

[0041] S2, one-step quick pressing: pressing the resist film and the circuit board together;

[0042] S3, cutting the resist film: using laser to cut the resist film around the circuit pattern in the step groove, and the size of the circuit pattern cut by the laser is 2 mil larger than the overall size of the circuit pattern in the step groove;

[0043] S4, pasting covering film: using a circuit board laminating device to cover a layer of covering film on the surface of the resist film, and the size of the covering film is the same as that of the resist film;

[0044] S5, secondary fast pressing: pressing the cover film and the circuit board together;

[0045] S6. Cutting the cover film: using laser to cut the resist film along the shape of the step groove, and the size of the cover film after laser cutting is 4 mil smaller than the size of the step groove;

[0046] S7, tearing off the film: tear off the adhesive blocking film and covering film outside the step groove.

[0047] Specifically, the thickness of the resist film is 27.5um or 50um.

[0048] Specifically, the thickness of the covering film is 50um-75um.

[0049] Specifically, the temperature of the first rapid pressing in S2 is 150℃-180℃, and the pressure is 120kg / cm 2 -150kg / cm 2 , the time is 120s-150s, to ensure that the adhesive film can stably fit the circuit board.

[0050] Specifically, the temperature of the secondary rapid pressing in S5 is 140°C-150°C, and the pressure is 100kg / cm 2 -120kg / cm 2 , the time is 80s-120s, to ensure that the covering film can stably fit with the adhesive film and fill the gap.

[0051] Another aspect of the embodiment of the present application provides a circuit board coating device, wherein both S1 and S4 use the circuit board coating device to perform coating treatment on the circuit board, such as Figure 2-Figure 7 As shown, the circuit board laminating device includes: a support plate 100, a limiting mechanism 200, a laminating mechanism 300 and other components.

[0052] There are two support plates 100, which are symmetrically arranged. A plurality of conveying rollers 101 are provided between the support plates 100 along their length direction for conveying the circuit board; the limiting mechanism 200 includes two clamping plates 201 which are symmetrically arranged and move toward each other. The two clamping plates 201 are both located between the two support plates 100 and are used to limit the two sides of the circuit board. A stopper 202 which is arranged to move in the vertical direction is provided between the clamping plates 201 and is used to abut against one end of the circuit board to prevent the circuit board from moving under the action of the conveying rollers 101; the coating mechanism 300 includes a lifting frame 301 which is arranged above the support plate 100 and is moved in the vertical direction. Guide rollers 302 which rotate around their own axes are provided at both ends of the lifting frame 301. The guide roller 302 away from the stopper 202 is used to convey the adhesive film or the covering film. The guide roller 302 close to the stopper 202 is used to transfer the excess side edge of the adhesive film or the covering film. The stopper 202 is located between the two guide rollers 302 to ensure that the adhesive film or the covering film can be smoothly covered on the circuit board. A pressing plate 303 and a pressing roller 304 movable along the length direction of the support plate 100 are provided, and the pressing plate 303 is located between the pressing roller 304 and the stopper 202, the pressing plate 303 is in an inverted L shape, and the lowest point of the pressing roller 304 is flush with the bottom of the horizontal section of the pressing plate 303, the pressing roller 304 is used to cover the adhesive film or the covering film on the circuit board, the pressing plate 303 is used to limit one end of the circuit board and make the adhesive film or the covering film contact with the circuit board, and both ends of the vertical section of the pressing plate 303 are provided with through holes 318, and The through hole 318 is connected to the bottom of the horizontal section of the pressing plate 303, and is used to pass through the excess side edge of the adhesive resistance film or the covering film, so that after the excess side edge passes through the through hole 318, the adhesive resistance film or the covering film is pulled tightly against the bottom of the horizontal section of the pressing plate 303 under the stress of the adhesive resistance film or the covering film itself, and the adhesive resistance film or the covering film located between the guide roller 302 away from the stop block 202 and the stop block 202 is in a horizontal state, ensuring that the adhesive resistance film or the covering film is in contact with the surface of the circuit board when the pressing plate 303 moves downward.

[0053] Specifically, in S1 and S4, the circuit board is coated by using a circuit board coating device, including the steps of:

[0054] S01, transferring the circuit board to the conveying roller 101, making the stopper 202 abut against one end of the circuit board, and the clamping plate 201 limits the two sides of the circuit board;

[0055] S02, the lifting frame 301 moves downward, the lower end of the pressing plate 303 abuts against the upper end of the stopper 202, and the stopper 202 and the pressing plate 303 move downward synchronously, the horizontal section of the pressing plate 303 and the pressing roller 304 abut against the surface of the circuit board, the adhesive film or the covering film contacts the surface of the circuit board, and the vertical section of the pressing plate 303 abuts against the end of the circuit board;

[0056] S03, driving the pressing roller 304 to move from one end of the lifting frame 301 where the pressing plate 303 is provided to the other end, so as to attach the adhesive resistance film or the covering film to the surface of the circuit board;

[0057] S04, cutting the resist film or the cover film to separate the resist film or the cover film covering the surface of the circuit board from other parts;

[0058] S05, the lifting frame 301 is moved upward, the pressing roller 304 is reset, and the adhesive blocking film or the covering film is also moved a certain distance;

[0059] S06 , the laminated circuit board is transported away by the transport roller 101 .

[0060] More specifically, Figure 2 , Figure 7 As shown, in order to facilitate the cutting of the adhesive film or the covering film, after the circuit board is laminarized, the side of the adhesive film or the covering film should be cut a certain distance more. When the end of the adhesive film or the covering film is located directly below the horizontal section of the pressing plate 303, the part of the adhesive film or the covering film with the side cut should exceed the length of the horizontal section of the pressing plate 303, and in order to ensure that the end of the adhesive film or the covering film can smoothly contact the surface of the circuit board, a plurality of adsorption holes are evenly distributed on the bottom surface of the horizontal section of the pressing plate 303, and the part of the adhesive film or the covering film with the side cut is adsorbed through the adsorption holes to ensure that the adhesive film or the covering film between the stopper 202 and the guide roller 302 away from the stopper 202 is in a horizontal state, so as to facilitate the laminating operation.

[0061] Then S05 includes the following steps:

[0062] S051, cutting an extra length of the side edge of the resist film or the cover film along the edge of the circuit board, wherein the extra length of the cut is greater than the length of the horizontal section of the pressing plate 303;

[0063] S052, moving the lifting frame 301 upward;

[0064] S053, moving the adhesive film or the covering film so that the end of the adhesive film or the covering film is located below the pressing plate 303, and the portion of the adhesive film or the covering film separated from the side is adsorbed to the bottom surface of the pressing plate 303 through the adsorption hole;

[0065] S054, resetting the pressure roller 304.

[0066] Specifically, Figure 2-Figure 3As shown, the lower end of the stopper 202 is mounted on the top plate 203, and the two ends of the top plate 203 are penetrated on the first vertical rod 204, and the first vertical rod 204 is mounted in the U-shaped frame 205. A first spring 206 is sleeved on the first vertical rod 204, and the two ends of the first spring 206 respectively abut against the lower end of the U-shaped frame 205 and the top plate 203, and are always in a compressed state. In S01, when the circuit board abuts against the stopper 202 under the conveyance of the conveying roller 101, S02 can be continued to make the lifting frame 301 move downward, and the vertical section of the pressing plate 303 will abut against the upper end of the stopper 202. As the pressing plate 303 continues to move, Continuing to move downward will force the block 202 to move downward synchronously, and the first spring 206 will also be further compressed to avoid interference between the pressure plate 303 and the block 202 during the downward movement, until the horizontal section of the pressure plate 303 abuts against the top surface of the circuit board. After the lamination of the circuit board is completed, that is, after S04, the circuit board needs to be transferred, then S05 is performed to move the pressure plate 303 upward, and the block 202 will automatically pop out under the action of the first spring 206, which will block the movement of the circuit board. Therefore, there should be a step of moving the block 202 downward in S05 and S06.

[0067] More specifically, if Figure 2-Figure 3 As shown, in order to smoothly transfer the circuit board through the conveying roller 101 after the lamination of the circuit board is completed, a side plate 207 is provided on the outer side of the U-shaped frame 205, and a rack 208 is provided on one side of the side plate 207. The rack 208 is meshed with a driving gear 209. The driving gear 209 is installed on a transmission shaft 210. The transmission shaft 210 is rotatably installed on the support plate 100 and connected to the output end of the power equipment. The power equipment is installed on the support plate 100. A convex plate 211 is provided on the other side of the side plate 207. The convex plate 211 is sleeved on a support rod 212. The support rod 212 is installed on the support plate 100. The transmission shaft 210 is driven to rotate by the power equipment, which drives the driving gear 209 to rotate, thereby driving the rack 208 to move up and down, and the block 202 also moves up and down synchronously. When the block 202 moves downward, the blocking effect on the circuit board can be released.

[0068] Then S06 can be decomposed into the following steps:

[0069] S061, driving the transmission shaft 210 to rotate by the power device, as described above, the stopper 202 moves downward;

[0070] S062, the laminated circuit board is transported away by the transport roller 101;

[0071] S063, reverse the power device to make the transmission shaft 210 rotate in the opposite direction, so that the stopper 202 moves upward to continue to block the circuit board to be coated.

[0072] Specifically, Figure 2 , Figure 4-Figure 6 As shown, the pressing plate 303 is located between the two supporting plates 100, and a connecting plate 305 is provided at both ends. A cross bar 306 is provided on the side of the connecting plate 305. One end of the cross bar 306 is connected to the lifting frame 301. Both sides of the lifting frame 301 are provided with a supporting frame 307 that is movable in the vertical direction. The supporting frame 307 can be connected to the moving end of a vertical lifting mechanism, and the vertical lifting mechanism is installed on the supporting plate 100. The vertical lifting mechanism drives the supporting frame 307 to move up and down, and the two ends of the supporting frame 307 Two mounting plates 308 are provided on the inner side, a second vertical rod 309 is provided between the mounting plates 308, a support plate 310 is provided on the outer side of the lifting frame 301, the support plate 310 is sleeved on the second vertical rod 309, a second spring 311 is sleeved on the second vertical rod 309, and the two ends of the second spring 311 are respectively abutted against the mounting plate 308 and the support plate 310 located above, and are always in a compressed state, so that when the support frame 307 moves up and down, the lifting frame 301 is also driven to move up and down synchronously. The pressing plate 303 will be driven to move downward synchronously until the pressing plate 303 abuts against the circuit board. At this time, the pressing roller 304 will also abut against the surface of the circuit board. The existence of the second spring 311 can allow the pressing plate 303 to have room for further downward movement, thereby preventing the pressing plate 303 from moving downward too far and damaging the circuit board. After that, since the adhesive film or covering film is in a horizontal state under the action of the guide roller 302 and the pressing plate 303, the adhesive film or covering film will contact the entire top surface of the circuit board at this time, and then the pressing roller 304 will be driven to move along the length direction of the support plate 100, so as to stick the adhesive film or covering film to the top surface of the circuit board, and then the side edge of the adhesive film or covering film and the end away from the pressing plate 303 are cut so that the adhesive film or covering film covers the circuit board, and then the laminated circuit board is transported away, and the adhesive film or covering film is moved, and the excess side edge of the adhesive film or covering film is removed from the perforation 318, and the starting end of the adhesive film or covering film is located directly below the horizontal section of the pressing plate 303.

[0073] Then in S02, it can be decomposed into the following steps:

[0074] S021, driving the support frame 307 to move downward through the vertical lifting mechanism, and driving the lifting frame 301 to move downward synchronously, until the bottom surface of the horizontal section of the pressing plate 303 abuts against the surface of the resist film or the cover film against the circuit board;

[0075] S022. Continue to drive the support frame 307 downward through the vertical lifting mechanism. At this time, since the pressure plate 303 abuts against the circuit board, relative movement occurs between the lifting frame 301 and the support frame 307, and the second spring 311 is further compressed. The force of the second spring 311 will be transmitted to the pressure plate 303, so that the adhesive film or covering film under the pressure plate 303 is pressed tightly against the circuit board.

[0076] Specifically, Figure 4-Figure 6 As shown, the pressure roller 304 is detachably rotatably mounted on the rotating shaft 312, so that the pressure roller 304 can be replaced according to circuit boards of different sizes. For example, if a threaded connection is adopted, before S01 or S02, a step of replacing the pressure roller 304 should also be provided, and both ends of the rotating shaft 312 are mounted on the moving block 313, the moving block 313 is sleeved on the guide rod 314, and the guide rod 314 is mounted on the connecting plate 305. The upper end of the moving block 313 is provided with a connecting rod 315, and the connecting rod 315 is penetrated in the push plate 316, so as to ensure that the push plate 316 can drive the moving block 313 to move. At the same time, the two can be moved relative to each other in the vertical direction to ensure the normal progress of the laminating process, and the push plate 316 is connected to the moving end of the horizontal linear mechanism, and the horizontal linear mechanism is installed on the support frame 307 and arranged along its length. In S03, after the adhesive resistance film or covering film under the pressing plate 303 is covered on the circuit board, the push plate 316 is driven by the horizontal linear mechanism to move from one end of the lifting frame 301 close to the pressing plate 303 to the other end, and the pressing roller 304 is driven to move synchronously to press the adhesive resistance film or covering film on the circuit board. At the same time, S03 can be repeated many times to ensure a close fit.

[0077] Specifically, Figure 4 As shown, both ends of the lifting frame 301 are respectively provided with winding rollers 317 rotating around their own axes, the winding roller 317 is higher than the guide roller 302, and the winding roller 317 away from the pressure plate 303 is used for conveying the adhesive-blocking film or the covering film, and the other winding roller 317 is used for winding the excess side edge of the adhesive-blocking film or the covering film. When the adhesive-blocking film or the covering film needs to be moved, that is, in S053, the two winding rollers 317 can be driven to rotate synchronously.

[0078] The above are only preferred embodiments of the present invention and are not intended to limit the present invention. Obviously, those skilled in the art can make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if these modifications and variations of the present invention fall within the scope of the claims of the present invention and their equivalents, the present invention is also intended to include these modifications and variations.

Claims

1. A method for processing a step groove of a circuit board, characterized in that: The following steps are involved: S1. Applying adhesive film: Use a circuit board laminating device to cover the surface of the circuit board with a layer of adhesive film, and the size of the film should not be smaller than the circuit board; S2, one-step quick pressing: pressing the resist film and the circuit board together; S3, cutting the resist film: using laser to cut the resist film around the circuit pattern in the step groove, and the size of the circuit pattern cut by the laser is 2 mil larger than the overall size of the circuit pattern in the step groove; S4, pasting covering film: using a circuit board laminating device to cover a layer of covering film on the surface of the resist film, and the size of the covering film is the same as that of the resist film; S5, secondary fast pressing: pressing the cover film and the circuit board together; S6. Cutting the cover film: using laser to cut the resist film along the shape of the step groove, and the size of the cover film after laser cutting is 4 mil smaller than the size of the step groove; S7, tearing off the film: tearing off the adhesive blocking film and the covering film outside the step groove; The circuit board laminating devices used in S1 and S4 include: There are two support plates (100) which are symmetrically arranged, and a plurality of conveying rollers (101) are provided between the support plates (100) along their length direction for conveying circuit boards; The limiting mechanism (200) comprises two clamping plates (201) disposed between the support plates (100) and movable towards each other, and is used to limit the positions of two sides of the circuit board; a stopper (202) is disposed between the clamping plates (201) and is movable in a vertical direction, and is used to abut against one end of the circuit board; The coating mechanism (300) comprises a lifting frame (301) which is arranged above the support plate (100) and is movable in the vertical direction. Guide rollers (302) which rotate around their own axes are arranged at both ends of the lifting frame (301). The guide rollers (302) which are far away from the stopper (202) are used to convey the adhesive-blocking film or the covering film. The guide rollers (302) which are close to the stopper (202) are used to transfer the excess side edge of the adhesive-blocking film or the covering film. The stopper (202) is located between the two guide rollers (302). The adhesive-blocking film or the covering film between the guide roller (302) far away from the stopper (202) and the stopper (202) is in a horizontal state. A pressing plate (303) and a pressing roller (304) movably arranged along the length direction of the support plate (100) are provided between the pressing plate (303) and the stopper (202), and the pressing plate (303) is located between the pressing roller (304) and the stopper (202), the pressing plate (303) is in an inverted L-shape, and the lowest point of the pressing roller (304) is flush with the bottom of the horizontal section of the pressing plate (303), the pressing roller (304) is used to cover the adhesive blocking film or the covering film on the circuit board, the pressing plate (303) is used to limit one end of the circuit board and make the adhesive blocking film or the covering film contact with the circuit board, and both ends of the vertical section of the pressing plate (303) are provided with perforations (318) for passing through the excess side edges of the adhesive blocking film or the covering film.

2. The circuit board step groove processing method according to claim 1, characterized in that: The steps of laminating by using the circuit board laminating device in S1 and S4 both include: S01, transferring the circuit board to the conveying roller (101), causing the stopper (202) to abut against one end of the circuit board, and the clamping plate (201) to limit the two sides of the circuit board; S02, the lifting frame (301) moves downward, the lower end of the pressing plate (303) abuts against the upper end of the stopper (202), and the stopper (202) and the pressing plate (303) move downward synchronously, the horizontal section of the pressing plate (303) and the pressing roller (304) abut against the surface of the circuit board, the adhesive film or the covering film contacts the surface of the circuit board, and the vertical section of the pressing plate (303) abuts against the end of the circuit board; S03, driving the pressing roller (304) to move from one end of the lifting frame (301) provided with the pressing plate (303) to the other end, thereby laminating the adhesive barrier film or the covering film to the surface of the circuit board; S04, cutting the resist film or the cover film to separate the resist film or the cover film covering the surface of the circuit board from other parts; S05, the lifting frame (301) is moved upward, the pressure roller (304) is reset, and the adhesive blocking film or the covering film is also moved a certain distance; S06, conveying the laminated circuit board away via a conveying roller (101).

3. The circuit board step groove processing method according to claim 2, characterized in that: The bottom surface of the horizontal section of the pressing plate (303) is evenly distributed with a plurality of adsorption holes. S05 also includes the following steps: S051, cutting an extra length of the side edge of the resist film or the cover film along the edge of the circuit board, wherein the extra length of the cut is greater than the length of the horizontal section of the pressing plate (303); S052, moving the lifting frame (301) upwards; S053, moving the adhesive blocking film or the covering film so that the end of the adhesive blocking film or the covering film is located below the pressing plate (303), and the portion of the adhesive blocking film or the covering film separated from the side edge is adsorbed to the bottom surface of the pressing plate (303) through the adsorption hole; S054, resetting the pressure roller (304).

4. The circuit board step groove processing method according to claim 1, characterized in that: The thickness of the resist film is 27.5 um or 50 um.

5. The circuit board step groove processing method according to claim 1, characterized in that: The thickness of the covering film is 50 um-75 um.

6. The circuit board step groove processing method according to claim 1, characterized in that: The temperature of the first rapid pressing in S2 is 150℃-180℃ and the pressure is 120 kg / cm 2 -150kg / cm 2 , time is 120s-150s.

7. The circuit board step groove processing method according to claim 1, characterized in that: The temperature of the secondary rapid pressing in S5 is 140℃-150℃ and the pressure is 100 kg / cm 2 -120kg / cm 2 , time is 80s-120s.

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