Machining system

Abstract

The processing system includes: an irradiation optical system capable of irradiating an energy beam for processing an object to the object; a placement device capable of placing an object on a placement surface; a first changing device capable of changing at least one of a positional relationship and an orientation relationship between the object placed on the placing device and the irradiation optical system; a light receiving device capable of receiving the energy light beam emitted from the irradiation optical system; a second changing device capable of changing the positional relationship between the light receiving device and the irradiation optical system; and a control device which, under the control of the control device, changes the position of the light receiving device from a second position, which is different from the first position, to a first position at which the light receiving device can receive the energy beam by means of a second changing device.

Description

Technical Field

[0001] The present invention relates to the technical field of, for example, processing systems capable of processing an object. Background Art

[0002] Patent Document 1 describes a processing system for processing an object by irradiating the object with laser light. In such a processing system, it is required to process the object appropriately.

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: U.S. Patent Application Publication No. 2002 / 0017509 Summary of the invention

[0006] According to a first embodiment, a processing system is provided, which comprises: an irradiation optical system capable of irradiating an energy beam for processing an object to the object; a loading device capable of loading the object on a loading surface; a first changing device capable of changing at least one of a positional relationship and a posture relationship between the object loaded on the loading device and the irradiation optical system; a light receiving device capable of receiving the energy beam emitted from the irradiation optical system; a second changing device capable of changing the positional relationship between the light receiving device and the irradiation optical system; and a control device, under the control of the control device, the light receiving device changes its position from a second position to a first position capable of receiving the energy beam through the second changing device, and the second position is different from the first position.

[0007] According to a second embodiment, a processing system is provided, comprising: an irradiation optical system, which is capable of irradiating a processing beam for processing an object onto the object and is capable of irradiating a measuring beam for measuring the object onto the object and includes at least an objective optical system; a light receiving device, which is capable of receiving the processing beam and the measuring beam emitted from the irradiation optical system; and a position changing device, which is capable of changing at least one of the irradiation position of the processing beam on the object and the irradiation position of the measuring beam on the object, wherein the control device controls the position changing device based on the light receiving result of the processing beam by the light receiving device and the light receiving result of the measuring beam by the light receiving device.

[0008] According to a third aspect, a processing system is provided, which comprises: a deflection optical system capable of deflecting an energy beam used for processing or measuring an object to change the irradiation position of the energy beam on the object; an irradiation optical system capable of irradiating the energy beam emitted from the deflection optical system to the object; a light receiving device capable of receiving the energy beam emitted from the irradiation optical system; a position changing device capable of changing the irradiation position of the energy beam on the object by changing the position or posture of the deflection optical system; and a control device for controlling the position changing device according to the light receiving result of the energy beam by the light receiving device, the light receiving device comprising: a beam passing component, which forms a plurality of passing areas through which the energy beam emitted from the irradiation optical system can pass; and a light receiving portion capable of respectively receiving the energy beams that have respectively passed through the plurality of passing areas, the deflection optical system deflects the energy beam in such a manner that the energy beam scans the plurality of passing areas in a direction along the surface of the beam passing component, and the control device controls the position changing device according to the light receiving result of the energy beam by the light receiving device.

[0009] According to a fourth embodiment, a processing system is provided, which comprises: an emission optical system, which can emit an energy beam for processing or measuring an object and includes a plurality of focusing position adjustment optical systems that can adjust the focusing position of the energy beam and have different focal lengths; a plurality of irradiation optical systems, which can irradiate the energy beam emitted from the emission optical system to the object and can be loaded and unloaded relative to the emission optical system and include at least an objective optical system; a replacement device, which can replace the irradiation optical system installed in the emission optical system; and a control device, which determines the type of the irradiation optical system installed in the emission optical system, selects one of the plurality of focusing position adjustment optical systems based on the determined type, and moves the selected one focusing position adjustment optical system so that the one focusing position adjustment optical system is located in the optical path of the energy beam.

[0010] According to the fifth embodiment, a processing system is provided, which comprises: an irradiation optical system capable of irradiating an energy beam to an object; a first changing device capable of changing at least one of a positional relationship and a posture relationship between the object and the irradiation optical system; a light receiving device capable of receiving the energy beam emitted from the irradiation optical system; a second changing device capable of changing the positional relationship between the light receiving device and the irradiation optical system; and a control device, under the control of the control device, the light receiving device changes its position from a second position to a first position capable of receiving the energy beam through the second changing device, and the second position is different from the first position.

[0011] According to a sixth aspect, a processing system is provided, comprising: an irradiation optical system capable of irradiating a first light beam onto an object and capable of irradiating a second light beam different from the first light beam onto the object; a light receiving device capable of receiving the first light beam and the second light beam emitted from the irradiation optical system; a position changing device capable of changing at least one of an irradiation position of the first light beam on the object and an irradiation position of the second light beam on the object; and a control device, the control device controlling the position changing device based on a light receiving result of the light receiving device for the first light beam and a light receiving result of the light receiving device for the second light beam.

[0012] According to the seventh aspect, a processing system is provided, which comprises: a deflection optical system capable of deflecting an energy beam to change the irradiation position of the energy beam on an object; an irradiation optical system capable of irradiating the energy beam emitted from the deflection optical system to the object; a light receiving device capable of receiving the energy beam emitted from the irradiation optical system; a position changing device capable of changing the irradiation position of the energy beam on the object by changing the position or posture of the deflection optical system; and a control device for controlling the position changing device according to the light receiving result of the energy beam by the light receiving device, the light receiving device comprising: a beam passing component forming a plurality of passing areas through which the energy beam emitted from the irradiation optical system can pass; and a light receiving portion capable of respectively receiving the energy beams that have respectively passed through the plurality of passing areas, the control device controlling the position changing device according to the light receiving result of the energy beam by the light receiving device.

[0013] According to an eighth aspect, a processing system is provided, which comprises: an emission optical system, which can emit an energy beam and includes a plurality of focusing position adjustment optical systems that can adjust the focusing position of the energy beam and have different focal lengths; a plurality of irradiation optical systems, which can irradiate the energy beam emitted from the emission optical system to the object and can be loaded and unloaded relative to the emission optical system and include at least an objective optical system; a replacement device, which can replace the irradiation optical system installed in the emission optical system; and a control device, which determines the type of the irradiation optical system installed in the emission optical system, selects one of the plurality of focusing position adjustment optical systems based on the determined type, and moves the selected one focusing position adjustment optical system so that the one focusing position adjustment optical system is located in the optical path of the energy beam.

[0014] The effects and other advantages of the present invention will become apparent from the embodiments described below. BRIEF DESCRIPTION OF THE DRAWINGS

[0015] Figure 1 This is a cross section schematically showing an example of the structure of the processing system in the first embodiment.

[0016] Figure 2 This is a block diagram showing an example of the configuration of the processing system in the first embodiment.

[0017] Figure 3 It is a cross-sectional view showing the structure of the machining head according to the first embodiment.

[0018] Figure 4 It is a perspective view showing the processing imaging area.

[0019] Figure 5 is a perspective view showing a measurement imaging area.

[0020] Figure 6 It is a cross-sectional view showing an example of the structure of a mount adapter used to mount the irradiation optical system to the emission optical system.

[0021] Figure 7 (a) to Figure 7 (c) are cross-sectional views showing the steps of attaching the irradiation optical system to the emission optical system.

[0022] Figure 8 This is a cross-sectional view conceptually showing an example of the structure of the head replacement device.

[0023] Fig. 9 (a) to Fig. 9 (g) are cross-sectional views showing an example of the irradiation optical system.

[0024] Fig.10 This is a block diagram showing an example of the configuration of a processing system in the second embodiment.

[0025] Fig.11 (a) is a cross-sectional view showing a calibration position of the optical measuring device when performing a calibration operation, Fig.11 (b) is a cross-sectional view showing a non-calibration position of the optical measurement device when no calibration operation is performed.

[0026] Fig.12 is a cross-sectional view showing the structure of the optical measuring device.

[0027] Fig.13 is a top view showing a search mark formed by a light passing area.

[0028] Fig.14 is a top view showing a light beam passing member on which a plurality of search marks are formed.

[0029] Fig.15is a top view showing a light beam passing member on which a plurality of search marks are formed.

[0030] Fig.16 It is a top view showing a plurality of search marks irradiated with processing light.

[0031] Fig.17 Displays the light receiving information output by the light receiving element.

[0032] Fig.18 It is a plan view showing a reference irradiation position of the processing light and an actual irradiation position of the processing light in the processing imaging area.

[0033] Fig.19 (a) to Fig.19 (c) shows the light receiving information output by the light receiving element.

[0034] Fig. 20 1 is a plan view showing a reference irradiation position of the measurement light and an actual irradiation position of the measurement light in the measurement shot region.

[0035] Fig.21 It is a plan view showing the actual irradiation position of the processing light and the actual irradiation position of the measurement light in the processing imaging area and the measurement imaging area.

[0036] Fig. 22 (a) to Fig. 22 (c) shows the light receiving information output by the light receiving element.

[0037] Fig.23 It is a cross-sectional view showing the structure of a processing head in a third embodiment.

[0038] Fig.24 It is a cross-sectional view showing the structure of a processing head in a fourth embodiment.

[0039] Fig.25 It is a cross-sectional view showing the structure of a processing head in a fifth embodiment.

[0040] Fig.26 It is a cross-sectional view showing the structure of a processing head in a fifth embodiment. DETAILED DESCRIPTION

[0041] Hereinafter, an embodiment of the machining system will be described with reference to the drawings. Hereinafter, an embodiment of the machining system will be described using a machining system SYS that can machine a workpiece W as an example of an object. However, the present invention is not limited to the embodiment described below.

[0042] In addition, in the following description, the XYZ vertical coordinate system defined by mutually perpendicular X-axis, Y-axis and Z-axis is used to describe the positional relationship of various structural elements constituting the processing system SYS. It should be noted that in the following description, for the convenience of description, the X-axis direction and the Y-axis direction are respectively horizontal directions (i.e., the specified directions in the horizontal plane), and the Z-axis direction is the vertical direction (i.e., the direction perpendicular to the horizontal plane, essentially the up and down direction). In addition, the rotation directions around the X-axis, Y-axis and Z-axis (in other words, the tilting directions) are respectively referred to as the θX direction, the θY direction and the θZ direction. Here, the Z-axis direction can also be used as the gravity direction. In addition, the XY plane can also be set to the horizontal direction.

[0043] (1) Processing System SYS of First Embodiment

[0044] First, the machining system SYS in the first embodiment will be described. In the following description, the machining system SYS in the first embodiment will be referred to as a "machining system SYSa".

[0045] (1-1) Overall structure of the processing system SYSa

[0046] First, refer to Figure 1 and Figure 2 The configuration of the machining system SYSa in the first embodiment will be described. Figure 1 It is a cross-sectional view schematically showing an example of the structure of the processing system SYSa in the first embodiment. Figure 2 This is a block diagram showing an example of the configuration of the machining system SYSa in the first embodiment.

[0047] like Figure 1 and Figure 2 As shown, the processing system SYSa has a processing unit 1 and a control unit 2. In addition, the processing unit 1 can also be called a processing device, and the control unit 2 can also be called a control device. At least a portion of the processing unit 1 can also be accommodated in the internal space SP of the shell 3. The internal space SP of the shell 3 can be purged by a purge gas (i.e., gas) such as nitrogen, or it can not be purged by the purge gas. The internal space SP of the shell 3 can be evacuated or not. However, the processing unit 1 may not be accommodated in the internal space SP of the shell 3. Only a local space surrounding a portion of the processing unit 1 can be purged by a purge gas, or it can be evacuated.

[0048] The processing unit 1 can process a workpiece W as a processing object (also referred to as a base material) under the control of the control unit 2. The workpiece W can be, for example, a metal, an alloy (such as duralumin, etc.), a semiconductor (such as silicon), a resin, a composite material such as CFRP (Carbon Fiber Reinforced Plastic), a coating (as an example, a coating layer applied to a substrate), glass, or an object made of any other material.

[0049] The machining unit 1 irradiates the workpiece W with machining light EL in order to machine the workpiece W. The machining light EL may be any type of light as long as it can machine the workpiece W by irradiating the workpiece W. In the first embodiment, an example in which the machining light EL is a laser is used for illustration, but the machining light EL may be a light of a different type from the laser. Furthermore, the wavelength of the machining light EL may be any wavelength as long as it can machine the workpiece W by irradiating the workpiece W. For example, the machining light EL may be visible light or invisible light (for example, at least one of infrared light, ultraviolet light, and extreme ultraviolet light). The machining light EL may also include pulsed light. Alternatively, the machining light EL may not include pulsed light. In other words, the machining light EL may also be continuous light. In addition, since light is an example of an energy beam, the machining light EL may also be referred to as a machining beam.

[0050] The processing unit 1 may also perform additional processing on the workpiece W. That is, the processing unit 1 may also perform additional processing to shape a shape on the workpiece W. The processing unit 1 may also perform removal processing on the workpiece W. That is, the processing unit 1 may also perform removal processing to remove a portion of the workpiece W. The processing unit 1 may also perform marking processing to form a desired mark on the surface of the workpiece W. The processing unit 1 may also perform shot peening processing to change the surface characteristics of the workpiece W. The processing unit 1 may also perform stripping processing to strip the surface of the workpiece W. The processing unit 1 may also perform welding processing to join one workpiece W to another workpiece W. The processing unit 1 may also perform cutting processing to cut the workpiece W. The processing unit 1 may also perform plane processing (in other words, remelting processing) to make the surface close to a plane by melting the surface of the workpiece W and solidifying the molten surface.

[0051] The machining unit 1 may also form a desired structure on the surface of the workpiece W by machining the workpiece W. However, the machining unit 1 may perform machining different from the machining for forming the desired structure on the surface of the workpiece W.

[0052] As an example of a required structure, a rib structure can be cited. The rib structure can also include a structure that can reduce the resistance of the surface of the workpiece W to the fluid (especially at least one of the friction resistance and the turbulent friction resistance). Therefore, the rib structure can also be formed on the workpiece W having a component that is arranged (in other words, located) in the fluid. In addition, the "fluid" mentioned here refers to a medium (for example, at least one of a gas and a liquid) that flows relative to the surface of the workpiece W. For example, when the surface of the workpiece W moves relative to the medium while the medium itself is stationary, the medium can also be called a fluid. In addition, the stationary state of the medium can also mean a state in which the medium does not move relative to a specified reference object (such as the ground surface).

[0053] As an example of a workpiece W having a rib structure, at least one of an aircraft, a windmill, an engine turbine, and a power generation turbine can be cited. When such a rib structure is formed on the workpiece W, the workpiece W is easy to move relative to the fluid. Therefore, the resistance that hinders the movement of the workpiece W relative to the fluid can be reduced, thereby achieving energy saving. That is, an environmentally friendly workpiece W can be manufactured. For example, when the workpiece W is a component exposed on the body surface of an aircraft (for example, at least a part of an aircraft), the resistance that hinders the movement of the aircraft is reduced, thereby bringing about fuel saving of the aircraft. For example, when the workpiece W is a windmill (for example, at least a part of a windmill), the resistance that hinders the movement (typically rotation) of the windmill is reduced, thereby leading to high efficiency of the windmill. For example, when the workpiece W is an engine turbine (for example, at least a part of an engine turbine), the resistance that hinders the movement (typically rotation) of the engine turbine is reduced, thereby leading to high efficiency or energy saving of the engine turbine. For example, when the workpiece W is a turbine for power generation (e.g., at least a portion of the turbine for power generation), the resistance that hinders the movement (typically, rotation) of the turbine for power generation is reduced, thereby leading to higher efficiency of the turbine for power generation (i.e., improved power generation efficiency). Therefore, the processing unit 1 may contribute to the goal of "13.2.2 Reduction of total greenhouse gas emissions per year" in Goal 13 of the Sustainable Development Goals (SDGs) led by the United Nations, "Take urgent action to combat climate change and its impact".

[0054] The processing unit 1 can also measure the object M under the control of the control unit 2. In order to measure the object M, the processing unit 1 irradiates the object M with the measurement light ML for measuring the object M. Specifically, the processing unit 1 irradiates the object M with the measurement light ML and detects at least a portion of the return light RL (i.e., the received light) returned from the object M irradiated with the measurement light ML, thereby measuring the object M. The light returned from the object M irradiated with the measurement light ML is the light from the object M generated by the irradiation of the measurement light ML.

[0055] The measuring light ML can be any kind of light as long as it can measure the measuring object M by irradiating the measuring object M. In the first embodiment, the example in which the measuring light ML is a laser is used for illustration. However, the measuring light ML can also be a light of a different kind from the laser. Furthermore, the wavelength of the measuring light ML can be any wavelength as long as it can measure the measuring object M by irradiating the measuring object M. For example, the measuring light ML can be visible light or invisible light (for example, at least one of infrared light, ultraviolet light, and extreme ultraviolet light). The measuring light ML can also include pulsed light (for example, pulsed light with a light emission time of less than picoseconds). Alternatively, the measuring light ML may not include pulsed light. In other words, the measuring light ML can also be continuous light. In addition, since light is an example of an energy beam, the measuring light ML can also be referred to as a measuring beam.

[0056] The processing unit 1 may also be capable of using the measurement light ML to measure the characteristics of the measurement object M. The characteristics of the measurement object M may include, for example, at least one of the position of the measurement object M, the shape of the measurement object M, the reflectivity of the measurement object M, the transmittance of the measurement object M, the temperature of the measurement object M, and the surface roughness of the measurement object M.

[0057] In the following description, an example is described in which the machining unit 1 measures at least the position of the measuring object M. The position of the measuring object M may also include the position of the surface of the measuring object M. The position of the surface of the measuring object M may also include the position of at least a portion of the surface of the measuring object M. In addition, the position of the measuring object M may also mean the position of the measuring object M relative to the machining head 13 (i.e., the relative position). That is, the position of the measuring object M may also mean the position of the measuring object M in the measurement coordinate system based on the machining head 13. In addition, as described later, the action of measuring the position of the measuring object M may also include the action of measuring the shape of the measuring object M. This is because the shape of the measuring object M can be calculated based on the position of the measuring object M.

[0058] The object M to be measured may include, for example, a workpiece W processed by the processing unit 1. The object M to be measured may include, for example, an arbitrary object placed on a workbench 15 described later. The object M to be measured may include, for example, the workbench 15. The object M to be measured may include, for example, an optical measuring device 18b used in a calibration operation described later in the second embodiment.

[0059] In order to process the workpiece W and measure the measuring object M, the processing unit 1 has a processing light source 11, a measuring light source 12, a processing head 13, a head driving system 141, a position measuring device 142, a worktable 15, a worktable driving system 161, a position measuring device 162 and a head replacement device 17.

[0060] The processing light source 11 generates processing light EL. When the processing light EL is a laser, the processing light source 11 may include a laser diode, for example. Furthermore, the processing light source 11 may be a light source capable of pulse oscillation. In this case, the processing light source 11 may generate pulse light as the processing light EL. In addition, the processing light source 11 may be a CW light source that generates CW (continuous wave).

[0061] The measuring light source 12 generates the measuring light ML. When the measuring light ML is a laser, the measuring light source 12 may include, for example, a laser diode. Furthermore, the measuring light source 12 may be a light source capable of pulse oscillation. In this case, the measuring light source 12 may generate pulse light as the processing light EL. In addition, the measuring light source 12 may be a CW (continuous wave) light source that generates CW.

[0062] The machining head 13 irradiates the machining light EL generated by the machining light source 11 onto the workpiece W, and irradiates the measuring light ML generated by the measuring light source 12 onto the measuring object M. In order to irradiate the machining light EL onto the workpiece W and irradiate the measuring light ML onto the measuring object M, the machining head 13 includes a machining optical system 131, a measuring optical system 132, a synthesizing optical system 133, a deflecting optical system 134, and an irradiating optical system 135. The machining head 13 irradiates the machining light EL onto the workpiece W via the machining optical system 131, the synthesizing optical system 133, the deflecting optical system 134, and the irradiating optical system 135. In addition, the machining head 13 irradiates the measuring light ML onto the measuring object M via the measuring optical system 132, the synthesizing optical system 133, the deflecting optical system 134, and the irradiating optical system 135. For details of the structure of the machining head 13, refer to Figure 3 This will be described in detail later.

[0063] The head drive system 141 moves the processing head 13. That is, the head drive system 141 moves the position of the processing head 13. Therefore, the head drive system 141 can also be called a moving device. The head drive system 141 can also move the processing head 13 along a moving axis in at least one direction of the X-axis direction, the Y-axis direction, and the Z-axis direction (that is, linear movement). The head drive system 141 can also move the processing head 13 along at least one of the θX direction, the θY direction, and the θZ direction on the basis of or instead of at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction. That is, the head drive system 141 can also rotate the processing head 13 around at least one of the rotation axis along the X-axis direction (that is, the A axis), the rotation axis along the Y-axis direction (that is, the B axis), and the rotation axis along the Z-axis direction (that is, the C axis) (that is, rotational movement).

[0064] When the head driving system 141 moves the processing head 13, the relative positional relationship between the processing head 13 and the worktable 15 (and the workpiece W placed on the worktable 15) changes. Figure 4 ) and the workpiece W change in relative position. That is, the processing shot area PSA moves relative to the workpiece W. The processing unit 1 may also process the workpiece W while moving the processing head 13. Specifically, the processing unit 1 may also set the processing shot area PSA at the desired position of the workpiece W by moving the processing head 13, and process the workpiece W at the desired position.

[0065] Furthermore, when the head driving system 141 moves the machining head 13, the measurement imaging area MSA (see the measurement imaging area described later) where the machining head 13 performs measurement Figure 5 ) and the measurement object M changes. That is, the measurement shooting area MSA moves relative to the measurement object M. The machining unit 1 may also measure the measurement object M while moving the machining head 13. Specifically, the machining unit 1 may also set the measurement shooting area MSA at a desired position of the measurement object M by moving the machining head 13, and measure the desired position of the measurement object M.

[0066] Furthermore, when the head driving system 141 moves the machining head 13, the positional relationship between the machining head 13 (particularly the irradiation optical system 135 of the machining head 13) and the workpiece W placed on the worktable 15 changes. For example, the positional relationship between the machining head 13 (particularly the irradiation optical system 135) and the workpiece W along at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction may also change. For example, the positional relationship between the machining head 13 (particularly the irradiation optical system 135) and the workpiece W along at least one of the θX direction, the θY direction, and the θZ direction may also change. In addition, the positional relationship between the machining head 13 (particularly the irradiation optical system 135) and the workpiece W along at least one of the θX direction, the θY direction, and the θZ direction may also be regarded as the posture relationship between the machining head 13 (particularly the irradiation optical system 135) and the workpiece W. Therefore, the head driving system 141 may also be regarded as functioning as a changing device capable of changing at least one of the positional relationship and posture relationship between the machining head 13 (particularly the irradiation optical system 135) and the workpiece W.

[0067] The position measuring device 142 is capable of measuring the position of the machining head 13. The position measuring device 142 may also include, for example, an interferometer (e.g., a laser interferometer). The position measuring device 142 may also include, for example, an encoder (as an example, at least one of a linear encoder and a rotary encoder). The position measuring device 142 may also include, for example, a potentiometer. In the case where the head driving system 141 uses a stepping motor as a driving source, the position measuring device 142 may also include, for example, a position detection device of an open-loop control method. The position detection device of the open-loop control method is a position detection device that estimates the movement amount of the machining head 13 based on the cumulative value of the number of pulses used to drive the stepping motor, thereby measuring the position of the machining head 13.

[0068] In addition, since the machining head 13 has the irradiation optical system 135, the operation of measuring the position of the machining head 13 can also be regarded as equivalent to the operation of measuring the position of the irradiation optical system 135 of the machining head 13. That is, the position measuring device 142 can also be regarded as measuring the position of the irradiation optical system 135 of the machining head 13.

[0069] The workpiece W is placed on the workbench 15. Therefore, the workbench 15 may also be referred to as a placing device. Specifically, the workpiece W is placed on a placing surface 151 which is at least a part of the upper surface of the workbench 15. The workbench 15 is capable of supporting the workpiece W placed on the workbench 15. The workbench 15 may also be capable of holding the workpiece W placed on the workbench 15. In this case, in order to hold the workpiece W, the workbench 15 may also have at least one of a mechanical chuck, an electrostatic chuck, and a vacuum adsorption chuck. Alternatively, the workpiece W may be held by a fixture for holding the workpiece W, and the workbench 15 holds the fixture holding the workpiece W. Alternatively, the workbench 15 may not hold the workpiece W placed on the workbench 15. In this case, the workpiece W may also be placed on the workbench 15 without a fixture.

[0070] The worktable drive system 161 moves the worktable 15. That is, the worktable drive system 161 moves the position of the worktable 15. Therefore, the worktable drive system 161 can also be called a moving device. The worktable drive system 161 can also move the worktable 15 along a moving axis in at least one direction of the X-axis direction, the Y-axis direction, and the Z-axis direction (that is, linear movement). The worktable drive system 161 can also move the worktable 15 along at least one of the θX direction, the θY direction, and the θZ direction on the basis of or instead of at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction. That is, the worktable drive system 161 can also rotate the worktable 15 around at least one of the rotation axis along the X-axis direction (that is, the A axis), the rotation axis along the Y-axis direction (that is, the B axis), and the rotation axis along the Z-axis direction (that is, the C axis) (that is, rotational movement).

[0071] When the table driving system 161 moves the table 15, the relative positional relationship between the processing head 13 and the table 15 (and the workpiece W placed on the table 15) changes. Figure 4 ) and the workpiece W changes in relative position. That is, the processing shooting area PSA moves relative to the workpiece W. The processing unit 1 may also process the workpiece W while moving the worktable 15. Specifically, the processing unit 1 may also set the processing shooting area PSA at the desired position of the workpiece W by moving the worktable 15, and process the workpiece W at the desired position.

[0072] In addition, when the table driving system 161 moves the table 15, the measurement shooting area MSA (see the measurement shooting area MSA described later) where the processing head 13 performs measurement Figure 5) and the measurement object M changes. That is, the measurement shooting area MSA moves relative to the measurement object M. The processing unit 1 may also measure the measurement object M while moving the workbench 15. Specifically, the processing unit 1 may also set the measurement shooting area MSA at a desired position of the measurement object M by moving the workbench 15, and measure the desired position of the measurement object M.

[0073] Furthermore, when the table driving system 161 moves the table 15, the positional relationship between the processing head 13 (particularly the irradiation optical system 135 of the processing head 13) and the workpiece W placed on the table 15 changes. For example, the positional relationship between the processing head 13 (particularly the irradiation optical system 135) and the workpiece W along at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction may also change. For example, the positional relationship between the processing head 13 (particularly the irradiation optical system 135) and the workpiece W along at least one of the θX direction, the θY direction, and the θZ direction may also change. In addition, as described above, the positional relationship between the processing head 13 (particularly the irradiation optical system 135) and the workpiece W along at least one of the θX direction, the θY direction, and the θZ direction may also be regarded as the posture relationship between the processing head 13 (particularly the irradiation optical system 135) and the workpiece W. Therefore, the table driving system 161 may also be regarded as functioning as a changing device capable of changing at least one of the positional relationship and posture relationship between the processing head 13 (particularly the irradiation optical system 135) and the workpiece W.

[0074] The position measuring device 162 is capable of measuring the position of the workbench 15. The position measuring device 162 may also include, for example, an interferometer (e.g., a laser interferometer). The position measuring device 162 may also include, for example, an encoder (as an example, at least one of a linear encoder and a rotary encoder). The position measuring device 162 may also include, for example, a potentiometer. In the case where the workbench drive system 161 uses a stepping motor as a drive source, the position measuring device 162 may also include, for example, a position detection device of an open-loop control method. The position detection device of the open-loop control method is a position detection device that estimates the movement amount of the workbench 15 based on the cumulative value of the number of pulses used to drive the stepping motor, thereby measuring the position of the workbench 15.

[0075] The head replacement device 17 is a device that can replace the irradiation optical system 135 possessed by the processing head 13. For example, the head replacement device 17 can also remove the irradiation optical system 135 installed in the processing head 13. For example, the head replacement device 17 can also install the irradiation optical system 135 in the processing head 13 that is not installed with the irradiation optical system 135. As an example, the head replacement device 17 can also remove the first irradiation optical system 135 installed in the processing head 13, and then install the second irradiation optical system 135 different from the first irradiation optical system 135 in the processing head 13. That is, the head replacement device 17 can also replace the first irradiation optical system 135 installed in the processing head 13 with the second irradiation optical system 135. Therefore, the irradiation optical system 135 can also be loaded and unloaded with respect to the processing head 13. In addition, regarding the structure of the irradiation optical system 135 that can be loaded and unloaded with respect to the processing head 13 and the structure of the head replacement device 17, refer to the following. Figures 6 to 9 Describe in detail.

[0076] The control unit 2 controls the movement of the processing unit 1. For example, the control unit 2 may also control the movement of the processing head 13 of the processing unit 1. For example, the control unit 2 may also control the movement of at least one of the processing optical system 131, the measuring optical system 132, the synthetic optical system 133, the deflection optical system 134, and the irradiation optical system 135 of the processing head 13. For example, the control unit 2 may also control the movement of the head driving system 141 of the processing unit 1 (for example, the movement of the processing head 13). For example, the control unit 2 may also control the movement of the workbench driving system 161 of the processing unit 1 (for example, the movement of the workbench 15). For example, the control unit 2 may also control the movement of the head replacement device 17 of the processing unit 1.

[0077] The control unit 2 may also control the operation of the machining unit 1 based on the measurement result of the machining unit 1 on the measurement object M. Specifically, the control unit 2 may also generate measurement data of the measurement object M (for example, data related to at least one of the position and shape of the measurement object M) based on the measurement result of the measurement object M, and control the operation of the machining unit 1 based on the generated measurement data. For example, the control unit 2 may also generate measurement data of at least a portion of the workpiece W (for example, calculate at least one of the position and shape of at least a portion of the workpiece W) based on the measurement result of the workpiece W as an example of the measurement object M, and control the operation of the machining unit 1 based on the measurement data to machine the workpiece W.

[0078] The control unit 2 may also include, for example, a computing device and a storage device. The computing device may include, for example, at least one of a CPU (Central Processing Unit) and a GPU (Graphics Processing Unit). The storage device may also include, for example, a memory. The control unit 2 functions as a device that controls the action of the processing unit 1 by executing a computer program through the computing device. The computer program is a computer program for causing the computing device to perform (i.e., execute) the action to be described later that the control unit 2 should perform. That is, the computer program is a computer program for causing the control unit 2 to function so that the processing unit 1 performs the action to be described later. The computer program executed by the computing device may be recorded in a storage device (i.e., a recording medium) possessed by the control unit 2, or may be recorded in any storage medium (e.g., a hard disk, a semiconductor memory) that is built into the control unit 2 or can be externally placed in the control unit 2. Alternatively, the computing device may also download the computer program to be executed from a device external to the control unit 2 via a network interface.

[0079] The control unit 2 may not be arranged inside the processing unit 1. For example, the control unit 2 may be arranged outside the processing unit 1 as a server or the like. In this case, the control unit 2 and the processing unit 1 may also be connected via a wired and / or wireless network (or a data bus and / or a communication line). As a wired network, for example, a network using an interface of a serial bus represented by at least one of IEEE1394, RS-232x, RS-422, RS-423, RS-485 and USB may be used. As a wired network, a network using an interface of a parallel bus may be used. As a wired network, a network conforming to an interface of Ethernet (registered trademark) represented by at least one of 10BASE-T, 100BASE-TX and 1000BASE-T may be used. As a wireless network, a network using radio waves may be used. As an example of a network using radio waves, a network conforming to IEEE802.1x (for example, at least one of wireless LAN and Bluetooth (registered trademark)) is listed. As a wireless network, a network using infrared rays may be used. As a wireless network, a network using optical communication may be used. In this case, the control unit 2 and the processing unit 1 may also be configured to be able to send and receive various information via a network. In addition, the control unit 2 may also be able to send information such as instructions or control parameters to the processing unit 1 via the network. The processing unit 1 may also have a receiving device that receives information such as commands or control parameters from the control unit 2 via the above-mentioned network. The processing unit 1 may also have a sending device that sends information such as instructions or control parameters to the control unit 2 via the above-mentioned network (that is, an output device that outputs information to the control unit 2). Alternatively, a first control device that performs a part of the processing performed by the control unit 2 may be arranged inside the processing unit 1, and on the other hand, a second control device that performs another part of the processing performed by the control unit 2 may be arranged outside the processing unit 1.

[0080] A computational model that can be constructed by machine learning by executing a computer program through a computing device may also be installed in the control unit 2. As an example of a computational model that can be constructed by machine learning, a computational model including a neural network (so-called artificial intelligence (AI)) may be cited. In this case, the learning of the computational model may include the learning of the parameters of the neural network (for example, at least one of the weights and biases). The control unit 2 may also use the computational model to control the action of the processing unit 1. That is, the action of controlling the action of the processing unit 1 may also include the action of controlling the action of the processing unit 1 using the computational model. In addition, a computational model constructed by offline machine learning using teacher data may also be installed in the control unit 2. In addition, the computational model installed in the control unit 2 may also be updated on the control unit 2 by online machine learning. Alternatively, the control unit 2 may also use a computational model of a device installed outside the control unit 2 (that is, a device provided outside the processing unit 1) to control the action of the processing unit 1 on the basis of or instead of the computational model installed in the control unit 2.

[0081] In addition, as a recording medium for recording the computer program executed by the control unit 2, at least one of CD-ROM, CD-R, CD-RW, floppy disk, MO, DVD-ROM, DVD-RAM, DVD-R, DVD+R, DVD-RW, DVD+RW and Blu-ray (registered trademark) and other optical disks, magnetic media such as magnetic tapes, optical magnets, semiconductor memories such as USB memories, and other arbitrary media capable of storing programs can also be used. The recording medium may also include a device capable of recording a computer program (for example, a general-purpose device or a dedicated device installed in a state where the computer program can be executed in the form of at least one of software and firmware). Furthermore, each process or function included in the computer program can be realized by a logic processing block realized in the control unit 2 by the control unit 2 (i.e., the computer) executing the computer program, or by hardware such as a predetermined gate array (FPGA (Field Programmable Gate Array), ASIC (Application Specific Integrated Cricuit: Application Specific Integrated Circuit)) possessed by the control unit 2, or by a mixed existence of a logic processing block and a hardware module that realizes a part of the elements of the hardware.

[0082] (1-2) Structure of the Processing Head 13

[0083] Next, refer to Figure 3 An example of the structure of the machining head 13 will be described. Figure 3It is a cross-sectional view showing an example of the structure of the machining head 13.

[0084] like Figure 3 As shown, the processing light EL generated by the processing light source 11 enters the processing head 13 via a light transmission member 111 such as an optical fiber. The processing light source 11 may be arranged outside the processing head 13. The processing light source 11 may be arranged inside the processing head 13.

[0085] As described above, the machining head 13 includes the machining optical system 131 , the measuring optical system 132 , the synthesizing optical system 133 , the deflection optical system 134 , and the irradiation optical system 135 .

[0086] The processing optical system 131 is an optical system into which the processing light EL from the processing light source 11 is incident. The processing optical system 131 is an optical system that emits the processing light EL incident on the processing optical system 131 toward the synthesis optical system 133. The processing light EL emitted from the processing optical system 131 is irradiated onto the workpiece W via the synthesis optical system 133, the deflection optical system 134, and the irradiation optical system 135.

[0087] The processing optical system 131 may include, for example, a position adjustment optical system 1311, an angle adjustment optical system 1312, and a galvanometer mirror 1313. However, the processing optical system 131 may not include at least one of the position adjustment optical system 1311, the angle adjustment optical system 1312, and the galvanometer mirror 1313.

[0088] The position adjustment optical system 1311 can adjust the emission position of the processing light EL from the processing optical system 131. For example, the position adjustment optical system 1311 may include a parallel plane plate that can be tilted relative to the traveling direction of the processing light EL, and change the emission position of the processing light EL by changing the tilt angle of the parallel plane plate.

[0089] The angle adjustment optical system 1312 can adjust the emission angle (i.e., emission direction) of the processing light EL from the processing optical system 131. The angle adjustment optical system 1312 may include, for example, a reflector that can be tilted relative to the traveling direction of the processing light EL, and the emission angle of the processing light EL can be changed by changing the tilt angle of the reflector.

[0090] The galvanometer mirror 1313 deflects the processing light EL (i.e., changes the emission angle of the processing light EL). The galvanometer mirror 1313 changes the focusing position of the processing light EL in a plane intersecting the optical axis EX of the irradiation optical system 135 (i.e., in a plane along the XY plane) by deflecting the processing light EL. Figure 3As shown, the machining head 13 irradiates the machining light EL to the workpiece W in a state where the optical axis EX intersects the surface of the workpiece W. Therefore, when the focusing position of the machining light EL in the plane intersecting the optical axis EX is changed, the irradiation position PA of the machining light EL on the surface of the workpiece W is changed (i.e., moved) in the direction along the surface of the workpiece W. That is, the irradiation position PA of the machining light EL is changed along at least one of the X-axis direction and the Y-axis direction. In this way, the galvanometer mirror 1341 can change the irradiation position PA of the machining light EL, and therefore can also be called a position changing optical system or a position changing device.

[0091] The galvanometer mirror 1313 includes an X scanning mirror 1313X and a Y scanning mirror 1313Y. The X scanning mirror 1313X and the Y scanning mirror 1313Y are respectively tilt angle variable mirrors that change the angle with respect to the optical path of the processing light EL incident on the galvanometer mirror 1313. The X scanning mirror 1313X deflects the processing light EL to change the irradiation position PA of the processing light EL on the workpiece W along the X-axis direction. In this case, the X scanning mirror 1313X may also be able to rotate or swing around the Y axis. That is, the galvanometer mirror 1313 may also be able to change the irradiation position PA of the processing light EL on the workpiece W along the X-axis direction by changing the position of the X scanning mirror 1313X in the θY direction (or the posture around the Y axis). The Y scanning mirror 1313Y deflects the processing light EL to change the irradiation position PA of the processing light EL on the workpiece W along the Y-axis direction. In this case, the Y scanning mirror 1313Y may be able to rotate or swing around the X axis. That is, the galvanometer mirror 1313 can also change the irradiation position PA of the processing light EL on the workpiece W along the Y-axis direction by changing the position of the Y scanning mirror 1313Y in the θX direction (or the posture around the X-axis).

[0092] The processing light EL emitted from the processing optical system 131 (in this case, the processing light EL emitted from the galvanometer mirror 1313) is incident on the synthesis optical system 133. The synthesis optical system 133 includes a beam splitter (for example, a polarization beam splitter) 1331. The beam splitter 1331 emits the processing light EL incident on the beam splitter 1331 toward the deflection optical system 134. Figure 3 In the example shown, the processing light EL incident on the beam splitter 1331 passes through the polarization separation surface of the beam splitter 1331 and is emitted toward the deflection optical system 134. Figure 3 In the illustrated example, the processing light EL enters the polarization separation plane of the beam splitter 1331 in a state of having a polarization direction capable of passing through the polarization separation plane (for example, a polarization direction that becomes p-polarized light with respect to the polarization separation plane).

[0093] The processing light EL emitted from the synthesis optical system 133 enters the deflection optical system 134 . The deflection optical system 134 emits the processing light EL emitted from the deflection optical system 134 toward the irradiation optical system 135 .

[0094] The deflection optical system 134 includes a galvanometer mirror 1341. The processing light EL incident on the deflection optical system 134 is incident on the galvanometer mirror 1341. The galvanometer mirror 1341 deflects the processing light EL (that is, changes the emission angle of the processing light EL). The galvanometer mirror 1341 changes the focusing position of the processing light EL in a plane intersecting the optical axis EX of the irradiation optical system 135 (that is, in a plane along the XY plane) by deflecting the processing light EL. In general, as Figure 3 As shown, the machining head 13 irradiates the machining light EL to the workpiece W in a state where the optical axis EX intersects the surface of the workpiece W. Therefore, when the focusing position of the machining light EL in the plane intersecting the optical axis EX is changed, the irradiation position PA of the machining light EL on the surface of the workpiece W is changed (i.e., moved) in the direction along the surface of the workpiece W. That is, the irradiation position PA of the machining light EL is changed along at least one of the X-axis direction and the Y-axis direction. In this way, the galvanometer mirror 1341 can change the irradiation position PA of the machining light EL, and therefore can also be called a position changing device.

[0095] The galvanometer mirror 1341 includes an X scanning mirror 1341X and a Y scanning mirror 1341Y. The X scanning mirror 1341X and the Y scanning mirror 1341Y are respectively tilt angle variable mirrors that change the angle with respect to the optical path of the processing light EL incident on the galvanometer mirror 1341. The X scanning mirror 1341X deflects the processing light EL to change the irradiation position PA of the processing light EL on the workpiece W along the X-axis direction. In this case, the X scanning mirror 1341X may also be able to rotate or swing around the Y axis. That is, the galvanometer mirror 1341 may also be able to change the irradiation position PA of the processing light EL on the workpiece W along the X-axis direction by changing the position of the X scanning mirror 1341X in the θY direction (or the posture around the Y axis). The Y scanning mirror 1341Y deflects the processing light EL to change the irradiation position PA of the processing light EL on the workpiece W along the Y-axis direction. In this case, the Y scanning mirror 1341Y may be able to rotate or swing around the X axis. That is, the galvanometer mirror 1341 can also change the irradiation position PA of the processing light EL on the workpiece W along the Y-axis direction by changing the position of the Y scanning mirror 1341Y in the θX direction (or the posture around the X-axis).

[0096] By using at least one of the galvanometer mirrors 1341 and 1313, the processing light EL can scan the processing shot area PSA determined based on the processing head 13. That is, by using at least one of the galvanometer mirrors 1341 and 1313, the irradiation position PA can be moved within the processing shot area PSA determined based on the processing head 13. Figure 4 An example of a processing shot area PSA is shown. Figure 4 As shown, the processing shot area PSA represents the area (in other words, range) processed by the processing head 13 when the positional relationship between the processing head 13 and the workpiece W is fixed (i.e., unchanged). Typically, the processing shot area PSA is set to an area that is consistent with or narrower than the scanning range of the processing light EL deflected by at least one of the galvanometer mirrors 1341 and 1313 when the positional relationship between the processing head 13 and the workpiece W is fixed. In addition, the processing shot area PSA (irradiation position PA) can be relatively moved on the surface of the workpiece W by moving the processing head 13 through the above-mentioned head driving system 141 and / or moving the worktable 15 through the worktable driving system 161. In addition, the above-mentioned scanning range of the processing light EL can also be the maximum range of the range scanned by the processing light EL.

[0097] Again in Figure 3 , the processing light EL emitted from the deflection optical system 134 is incident on the irradiation optical system 135. As described above, when at least one of the galvanometer mirror 1341 included in the deflection optical system 134 and the galvanometer mirror 1313 included in the processing optical system 131 deflects the processing light EL, the incident position of the processing light EL to the irradiation optical system 135 is changed. Therefore, it can be considered that the galvanometer mirrors 1341 and 1313 each function as a position changing device capable of changing the incident position of the processing light EL to the irradiation optical system 135 by deflecting the processing light EL.

[0098] In addition, the incident position of the processing light EL on the irradiation optical system 135 that changes due to the deflection of the processing light EL based on at least one of the galvanometer mirror 1341 of the deflection optical system 134 and the galvanometer mirror 1313 of the processing optical system 131 may be the incident position of the processing light EL that is incident on the optical component closest to the deflection optical system 134 (closest to the incident side) among the optical components constituting the irradiation optical system 135. In addition, the incident angle of the processing light EL incident on the irradiation optical system 135 (typically, the incident angle relative to the optical axis EX of the irradiation optical system 135) may be changed by the deflection of the processing light EL based on at least one of the galvanometer mirror 1341 of the deflection optical system 134 and the galvanometer mirror 1313 of the processing optical system 131.

[0099] The irradiation optical system 135 is an optical system capable of irradiating the processing light EL onto the workpiece W. In order to irradiate the processing light EL onto the workpiece W, the irradiation optical system 135 has an fθ lens 1351 capable of functioning as an objective optical system. The processing light EL emitted from the deflection optical system 134 is incident on the fθ lens 1351. The fθ lens 1351 irradiates the processing light EL emitted from the deflection optical system 134 onto the workpiece W. Specifically, the fθ lens 1351 emits the processing light EL in a direction along the optical axis EX of the irradiation optical system 135. As a result, the processing light EL emitted by the fθ lens 1351 travels in the direction along the optical axis EX and is incident on the workpiece W. In addition, the optical axis EX of the irradiation optical system 135 may also be the optical axis of the fθ lens 1351.

[0100] The fθ lens 1351 may also focus the processing light EL from the galvanometer mirror 1341 onto the workpiece W. In this case, the processing light EL emitted from the fθ lens 1351 may also be irradiated to the workpiece W without passing through other optical elements (in other words, optical components, such as lenses, etc.) having optical focal length. In this case, the fθ lens 1351 is an optical element having the final optical focal length (that is, the optical element closest to the workpiece W) among the multiple optical elements arranged on the optical path of the processing light EL, and therefore may also be referred to as the final optical element. The optical focal length of the optical element may be the reciprocal of the focal length of the optical element. In addition, in this case, the processing light EL from the galvanometer mirror 1341 may also be a parallel light beam. The irradiation optical system 135 may include an objective optical system having a projection characteristic different from that of fθ.

[0101] In addition, at least one of the X scanning mirror 1341X and the Y scanning mirror 1341Y constituting the galvanometer mirror 1341 and the X scanning mirror 1313X and the Y scanning mirror 1313Y constituting the galvanometer mirror 1313 may be arranged at the entrance pupil position and / or its conjugate position of the fθ lens 1351 as the irradiation optical system. In the case where there are multiple scanning mirrors constituting the galvanometer mirrors 1341 and 1313, a relay optical system for making the scanning mirrors optically conjugate with each other may be arranged between the scanning mirrors.

[0102] The measurement light ML generated by the measurement light source 12 is also incident on the machining head 13 via a light transmission member 121 such as an optical fiber. The measurement light source 12 may be disposed outside the machining head 13. The measurement light source 12 may be disposed inside the machining head 13.

[0103] The measuring light source 12 may include an optical comb light source. An optical comb light source is a light source capable of generating light containing frequency components arranged at equal intervals on the frequency axis (hereinafter referred to as an "optical frequency comb") as pulsed light. In this case, the measuring light source 12 emits pulsed light containing frequency components arranged at equal intervals on the frequency axis as the measuring light ML. However, the measuring light source 12 may include a light source different from the optical comb light source.

[0104] exist Figure 3 In the example shown, the processing system SYSa includes a plurality of measuring light sources 12. For example, the processing system SYSa may include a measuring light source 12#1 and a measuring light source 12#2. The plurality of measuring light sources 12 may also respectively emit a plurality of measuring lights ML that are phase-synchronized with each other and have interference. For example, the oscillation frequencies of the plurality of measuring light sources 12 may also be different. Therefore, the plurality of measuring lights ML respectively emitted by the plurality of measuring light sources 12 may also be a plurality of measuring lights ML with different pulse frequencies (for example, the number of pulse lights per unit time, the inverse of the light emission period of the pulse light). However, the processing system SYSa may include a single measuring light source 12.

[0105] The measurement light ML emitted from the measurement light source 12 enters the measurement optical system 132. The measurement optical system 132 is an optical system that emits the measurement light ML incident on the measurement optical system 132 toward the synthesis optical system 133. The measurement light ML emitted from the measurement optical system 132 is irradiated onto the measurement object M via the synthesis optical system 133, the deflection optical system 134, and the irradiation optical system 135.

[0106] The measuring optical system 132 includes, for example, a mirror 1320 , a beam splitter 1321 , a beam splitter 1322 , a detector 1323 , a beam splitter 1324 , a mirror 1325 , a detector 1326 , a mirror 1327 , and a galvanometer mirror 1328 .

[0107] The measurement light ML emitted from the measurement light source 12 enters the beam splitter 1321. Specifically, the measurement light ML emitted from the measurement light source 12#1 (hereinafter referred to as "measurement light ML#1") enters the beam splitter 1321. The measurement light ML emitted from the measurement light source 12#2 (hereinafter referred to as "measurement light ML#2") enters the beam splitter 1321 via the reflector 1320. The beam splitter 1321 emits the measurement light ML#1 and ML#2 incident on the beam splitter 1321 toward the beam splitter 1322. That is, the beam splitter 1321 emits the measurement light ML#1 and ML#2 incident on the beam splitter 1321 from different directions toward the same direction (that is, the direction in which the beam splitter 1322 is arranged).

[0108] Beam splitter 1322 reflects measurement light ML#1-1, which is a part of measurement light ML#1 incident on beam splitter 1322, toward detector 1323. Beam splitter 1322 emits measurement light ML#1-2, which is another part of measurement light ML#1 incident on beam splitter 1322, toward beam splitter 1324. Beam splitter 1322 reflects measurement light ML#2-1, which is a part of measurement light ML#2 incident on beam splitter 1322, toward detector 1323. Beam splitter 1322 emits measurement light ML#2-2, which is another part of measurement light ML#2 incident on beam splitter 1322, toward beam splitter 1324.

[0109] The measuring light ML#1-1 and ML#2-1 emitted from the beam splitter 1322 are incident on the detector 1323. The detector 1323 receives (i.e., detects) the measuring light ML#1-1 and the measuring light ML#2-1. In particular, the detector 1323 receives the interference light generated by the interference of the measuring light ML#1-1 and the measuring light ML#2-1. In addition, the action of receiving the interference light generated by the interference of the measuring light ML#1-1 and the measuring light ML#2-1 can also be regarded as equivalent to the action of receiving the measuring light ML#1-1 and the measuring light ML#2-1. The detection result of the detector 1323 is output to the control unit 2.

[0110] The measurement light ML#1-2 and ML#2-2 emitted from the beam splitter 1322 enter the beam splitter 1324. The beam splitter 1324 emits at least a portion of the measurement light ML#1-2 emitted to the beam splitter 1324 toward the reflective mirror 1325. The beam splitter 1324 emits at least a portion of the measurement light ML#2-2 emitted to the beam splitter 1324 toward the reflective mirror 1327.

[0111] The measurement light ML#1-2 emitted from the beam splitter 1324 is incident on the reflector 1325. The measurement light ML#1-2 incident on the reflector 1325 is reflected by the reflective surface (the reflective surface may also be referred to as a reference surface) of the reflector 1325. Specifically, the reflector 1325 reflects the measurement light ML#1-2 incident on the reflector 1325 toward the beam splitter 1324. That is, the reflector 1325 emits the measurement light ML#1-2 incident on the reflector 1325 as its reflected light, that is, the measurement light ML#1-3 toward the beam splitter 1324. In this case, the measurement light ML#1-3 may also be referred to as reference light. The measurement light ML#1-3 emitted from the reflector 1325 is incident on the beam splitter 1324. The beam splitter 1324 emits the measurement light ML#1-3 incident on the beam splitter 1324 toward the beam splitter 1322. The measurement light ML# 1 - 3 emitted from the beam splitter 1324 enters the beam splitter 1322 . The beam splitter 1322 emits the measurement light ML# 1 - 3 emitted from the beam splitter 1324 toward the detector 1326 .

[0112] On the other hand, the measurement light ML#2-2 emitted from the beam splitter 1324 is incident on the reflection mirror 1327. The reflection mirror 1327 reflects the measurement light ML#2-2 incident on the reflection mirror 1327 toward the galvanometer reflection mirror 1328. That is, the reflection mirror 1327 emits the measurement light ML#2-2 incident on the reflection mirror 1327 toward the galvanometer reflection mirror 1328.

[0113] The galvanometer mirror 1328 deflects the measurement light ML#2-2 (i.e., changes the emission angle of the measurement light ML#2-2). The galvanometer mirror 1328 changes the focusing position of the measurement light ML#2-2 in the plane intersecting the optical axis EX of the irradiation optical system 135 (i.e., in the plane along the XY plane) by deflecting the measurement light ML#2-2. Figure 3 As shown, the machining head 13 is aligned with the optical axis EX and the measuring object M (at Figure 3 In the example shown, the measuring light ML#2-2 is irradiated to the measuring object M in a state where the measuring light ML#2-2 intersects the surface of the workpiece W. Therefore, when the focusing position of the measuring light ML#2-2 in the plane intersecting with the optical axis EX is changed, the irradiation position MA of the measuring light ML#2-2 on the surface of the measuring object M is changed (i.e., moved) in the direction along the surface of the measuring object M. In other words, the irradiation position MA of the measuring light ML#2-2 is changed along at least one of the X-axis direction and the Y-axis direction. In this way, the galvanometer mirror 1328 can change the irradiation position MA of the measuring light ML#2-2, and therefore can also be called a position changing optical system or a position changing device.

[0114] The galvanometer mirror 1328 includes an X scanning mirror 1328X and a Y scanning mirror 1328Y. The X scanning mirror 1328X and the Y scanning mirror 1328Y are respectively tilt angle variable mirrors that change the angle of the optical path of the measurement light ML#2-2 incident on the galvanometer mirror 1328. The X scanning mirror 1328X deflects the measurement light ML#2-2 so that the irradiation position MA of the measurement light ML#2-2 on the measurement object M is changed along the X-axis direction. In this case, the X scanning mirror 1328X may also be able to rotate or swing around the Y axis. That is, the galvanometer mirror 1328 may also be able to change the irradiation position MA of the measurement light ML#2-2 on the measurement object M along the X-axis direction by changing the position of the X scanning mirror 1328X in the θY direction (or the posture around the Y axis). The Y scanning mirror 1328Y deflects the processing light EL so that the irradiation position MA of the measurement light ML#2-2 on the measurement object M is changed along the Y-axis direction. In this case, the Y scanning mirror 1328Y can rotate or swing around the X-axis. In other words, the galvanometer mirror 1328 can also change the irradiation position MA of the measurement light ML#2-2 on the measurement object M along the Y-axis direction by changing the position of the Y scanning mirror 1328Y in the θX direction (or the posture around the X-axis).

[0115] The measurement light ML#2-2 emitted from the measurement optical system 132 (in this case, the measurement light ML#2-2 emitted from the galvanometer mirror 1328) enters the synthesis optical system 133. The beam splitter 1331 of the synthesis optical system 133 emits the measurement light ML#2-2 incident on the beam splitter 1331 toward the deflection optical system 134. Figure 3 In the example shown, the measurement light ML#2-2 incident on the synthesis optical system 133 is reflected on the polarization separation surface and emitted toward the deflection optical system 134. Figure 3 In the illustrated example, the measuring light ML# 2 - 2 enters the polarization separation plane of the beam splitter 1331 in a state having a polarization direction that can be reflected by the polarization separation plane (for example, a polarization direction that becomes s-polarized light with respect to the polarization separation plane).

[0116] Here, as described above, in addition to the measurement light ML#2-2, the processing light EL is also incident on the beam splitter 1331. That is, both the measurement light ML#2-2 and the processing light EL pass through the beam splitter 1331. The beam splitter 1331 emits the processing light EL and the measurement light ML#2-2, which are incident on the beam splitter 1331 from different directions, toward the same direction (that is, toward the same deflection optical system 134). Therefore, the beam splitter 1331 substantially functions as a synthesis optical component that synthesizes the processing light EL and the measurement light ML#2-2.

[0117] In addition, when the wavelength of the processing light EL is different from the wavelength of the measuring light ML, the synthesis optical system 133 may include a dichroic mirror as a synthesis optical component instead of the beam splitter 1331. In this case, the synthesis optical system 133 can also use the dichroic mirror to synthesize the processing light EL and the measuring light ML#2-2 (that is, to synthesize the optical path of the processing light EL and the optical path of the measuring light ML#2-2).

[0118] The measuring light ML# 2 - 2 emitted from the synthesizing optical system 133 enters the deflecting optical system 134 . The deflecting optical system 134 emits the measuring light ML# 2 - 2 emitted from the deflecting optical system 134 toward the irradiating optical system 135 .

[0119] The measurement light ML#2-2 incident on the deflection optical system 134 is incident on the galvanometer mirror 1341. The galvanometer mirror 1341 deflects the measurement light ML#2-2 in the same manner as when the processing light EL is deflected. Therefore, the galvanometer mirror 1341 can change the irradiation position MA of the measurement light ML#2-2 on the surface of the measurement object M in the direction along the surface of the measurement object M. In other words, the galvanometer mirror 1341 can also change the irradiation position MA of the measurement light ML#2-2 on the measurement object M along the X-axis direction by changing the position of the X scanning mirror 1341X in the θY direction (or the posture around the Y axis). The galvanometer mirror 1341 can also change the irradiation position MA of the measurement light ML#2-2 on the measurement object M along the Y-axis direction by changing the position of the Y scanning mirror 1341Y in the θX direction (or the posture around the X axis). In this way, the galvanometer mirror 1341 can change the irradiation position MA of the measuring light ML# 2 - 2 , and therefore can also be called a position changing optical system or a position changing device.

[0120] As described above, in addition to the measurement light ML#2-2, the processing light EL is also incident on the galvanometer mirror 1341. That is, the processing light EL and the measurement light ML#2-2 synthesized by the beam splitter 1331 are incident on the galvanometer mirror 1341. Therefore, both the measurement light ML#2-2 and the processing light EL pass through the same galvanometer mirror 1341. Therefore, the galvanometer mirror 1341 can synchronously change the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML#2-2. That is, the galvanometer mirror 1341 can change the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML#2-2 in a linked manner.

[0121] On the other hand, as described above, the measuring light ML#2-2 is irradiated onto the measuring object M via the galvanometer mirror 1328, while the processing light EL is not irradiated onto the workpiece W via the galvanometer mirror 1328. Therefore, the processing system SYSa can use the galvanometer mirror 1328 to independently move the irradiation position MA of the measuring light ML#2-2 relative to the irradiation position PA of the processing light EL. That is, the processing system SYSa can use the galvanometer mirror 1328 to change the relative positional relationship between the irradiation position PA of the processing light EL and the irradiation position MA of the measuring light ML#2-2. In particular, the processing system SYSa can use the galvanometer mirror 1328 to irradiate the measuring light ML#2-2 in a direction intersecting with the irradiation direction of the processing light EL (in a direction intersecting with the irradiation direction of the processing light EL). Figure 3 In the example shown, the relative positional relationship between the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML#2-2 is changed in at least one of the X-axis direction and the Y-axis direction.

[0122] Similarly, as described above, the processing light EL is irradiated onto the measuring object M via the galvanometer mirror 1313, while the measuring light ML#2-2 is irradiated onto the workpiece W without being irradiated onto the workpiece W via the galvanometer mirror 1313. Therefore, the processing system SYSa can use the galvanometer mirror 1313 to independently move the irradiation position PA of the processing light EL relative to the irradiation position MA of the measuring light ML#2-2. In other words, the processing system SYSa can use the galvanometer mirror 1313 to change the relative positional relationship between the irradiation position PA of the processing light EL and the irradiation position MA of the measuring light ML#2-2. In particular, the processing system SYSa can use the galvanometer mirror 1328 to irradiate the processing light EL in a direction intersecting with the irradiation direction of the processing light EL (in a direction intersecting with the irradiation direction of the measuring light ML#2-2). Figure 3 In the example shown, the relative positional relationship between the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML#2-2 is changed in at least one of the X-axis direction and the Y-axis direction.

[0123] By using at least one of the galvanometer mirrors 1341 and 1328, the measurement light ML#2-2 can scan the measurement imaging area MSA determined based on the machining head 13. That is, by using at least one of the galvanometer mirrors 1341 and 1328, the irradiation position MA can be moved within the measurement imaging area MSA determined based on the machining head 13. Figure 5 FIG. 4 shows an example of measuring the shooting area MSA. Figure 5As shown, the measurement shooting area MSA represents the area (in other words, the range) measured by the processing head 13 in a state where the positional relationship between the processing head 13 and the measurement object M is fixed (i.e., unchanged). Typically, the measurement shooting area MSA is set to an area that is consistent with or narrower than the scanning range of the measurement light ML deflected by at least one of the galvanometer mirrors 1341 and 1328 in a state where the positional relationship between the processing head 13 and the measurement object M is fixed. Furthermore, by moving the processing head 13 using the head driving system 141 and / or moving the workbench 15 using the workbench driving system 161, the measurement shooting area MSA (irradiation position MA) can be relatively moved on the surface of the measurement object M. In addition, the scanning range of the measurement light ML mentioned above may also be the maximum range of the range scanned by the measurement light ML.

[0124] Again in Figure 3 , the measuring light ML#2-2 emitted from the deflecting optical system 134 is incident on the irradiating optical system 135. As described above, when at least one of the galvanometer mirror 1341 of the deflecting optical system 134 and the galvanometer mirror 1328 of the measuring optical system 132 deflects the measuring light ML#2-2, the incident position of the measuring light ML#2-2 to the irradiating optical system 135 is changed. Therefore, it can also be considered that the galvanometer mirrors 1341 and 1328 each function as a position changing device capable of changing the incident position of the measuring light ML#2-2 to the irradiating optical system 135 by deflecting the measuring light ML#2-2.

[0125] The irradiation optical system 135 is capable of irradiating the measurement light ML#2-2 onto the measurement object M (at Figure 3 In the example shown, the optical system is for a workpiece W). Specifically, the fθ lens 1351 irradiates the measurement light ML#2-2 emitted from the deflection optical system 134 to the measurement object M. Specifically, the fθ lens 1351 emits the measurement light ML#2-2 in a direction along the optical axis EX of the irradiation optical system 135. As a result, the measurement light ML#2-2 emitted by the fθ lens 1351 travels in a direction along the optical axis EX and is incident on the measurement object M.

[0126] The fθ lens 1351 may also focus the measurement light ML#2-2 emitted from the deflection optical system 134 onto the measurement object M. In this case, the measurement light ML#2-2 emitted from the fθ lens 1351 may be irradiated onto the measurement object M without passing through other optical elements (in other words, optical components, such as lenses, etc.) having optical power. In this case, the fθ lens 1351 is an optical element having the final optical power (that is, the optical element closest to the workpiece W) among the multiple optical elements arranged on the optical path of the measurement light ML#2-2, and therefore may also be referred to as the final optical element. In this case, the measurement light ML#2-2 emitted from the deflection optical system 134 and incident on the fθ lens 1351 may also be a parallel beam.

[0127] When the measurement light ML#2-2 is irradiated onto the object M to be measured, light caused by the irradiation of the measurement light ML#2-2 is generated from the object M to be measured. That is, when the measurement light ML#2-2 is irradiated onto the object M to be measured, light caused by the irradiation of the measurement light ML#2-2 is emitted from the object M to be measured. The light caused by the irradiation of the measurement light ML#2-2 (in other words, light emitted from the object M to be measured due to the irradiation of the measurement light ML#2-2) may also include at least one of the measurement light ML#2-2 reflected by the object M to be measured (i.e., reflected light), the measurement light ML#2-2 scattered by the object M to be measured (i.e., scattered light), the measurement light ML#2-2 diffracted by the object M to be measured (i.e., diffracted light), and the measurement light ML#2-2 transmitted through the object M to be measured (i.e., transmitted light).

[0128] At least a portion of the light emitted from the object M to be measured due to the irradiation of the measurement light ML#2-2 enters the irradiation optical system 135 as the return light RL. Specifically, of the light emitted from the object M to be measured due to the irradiation of the measurement light ML#2-2, the light that travels along the optical path of the measurement light ML#2-2 incident on the object M to be measured enters the irradiation optical system 135 as the return light RL. In this case, the optical path of the measurement light ML#2-2 emitted from the irradiation optical system 135 and incident on the object M to be measured and the optical path of the return light RL emitted from the object M to be measured and incident on the irradiation optical system 135 may be the same. The return light RL incident on the irradiation optical system 135 enters the deflection optical system 134 via the fθ lens 1351. The return light RL incident on the deflection optical system 134 enters the synthesis optical system 133 via the galvanometer mirror 1341. The beam splitter 1331 of the synthetic optical system 133 emits the return light RL incident on the beam splitter 1331 toward the measuring optical system 132. Figure 3 In the example shown, the return light RL incident on the beam splitter 1331 is reflected on the polarization separation surface and emitted toward the measuring optical system 132. Figure 3In the illustrated example, the return light RL is incident on the polarization separation plane of the beam splitter 1331 in a state of having a polarization direction capable of being reflected by the polarization separation plane.

[0129] The return light RL emitted from the beam splitter 1331 is incident on the galvanometer mirror 1328 of the measuring optical system 132. The galvanometer mirror 1328 emits the return light RL incident on the galvanometer mirror 1328 toward the reflector 1327. The reflector 1327 reflects the return light RL incident on the reflector 1327 toward the beam splitter 1324. The beam splitter 1324 emits at least a portion of the return light RL incident on the beam splitter 1324 toward the beam splitter 1322. The beam splitter 1322 emits at least a portion of the return light RL incident on the beam splitter 1322 toward the detector 1326.

[0130] As described above, in addition to the return light RL, the measurement light ML#1-3 is also incident on the detector 1326. That is, the return light RL toward the detector 1326 via the measurement object M and the measurement light ML#1-3 toward the detector 1326 without passing through the measurement object M are incident on the detector 1326. The detector 1326 receives (i.e., detects) the measurement light ML#1-3 and the return light RL. In particular, the detector 1326 receives the interference light generated by the interference of the measurement light ML#1-3 and the return light RL. In addition, the action of receiving the interference light generated by the interference of the measurement light ML#1-3 and the return light RL can also be regarded as equivalent to the action of receiving the measurement light ML#1-3 and the return light RL. The detection result of the detector 1326 is output to the control unit 2.

[0131] The control unit 2 obtains the detection results of the detector 1323 and the detection results of the detector 1326. The control unit 2 may also generate measurement data of the measurement object M (for example, measurement data related to at least one of the position and shape of the measurement object M) based on the detection results of the detector 1323 and the detection results of the detector 1326.

[0132] Specifically, the pulse frequency of the measurement light ML#1 is different from the pulse frequency of the measurement light ML#2, so the pulse frequency of the measurement light ML#1-1 is different from the pulse frequency of the measurement light ML#2-1. Therefore, the interference light of the measurement light ML#1-1 and the measurement light ML#2-1 becomes the interference light of the pulse light that appears synchronously with the timing when the pulse light constituting the measurement light ML#1-1 and the pulse light constituting the measurement light ML#2-1 are incident on the detector 1323 at the same time. Similarly, the pulse frequency of the measurement light ML#1-3 is different from the pulse frequency of the return light RL. Therefore, the interference light of the measurement light ML#1-3 and the return light RL becomes the interference light of the pulse light that appears synchronously with the timing when the pulse light constituting the measurement light ML#1-3 and the pulse light constituting the return light RL are incident on the detector 1326 at the same time. Here, the position (position on the time axis) of the pulse light of the interference light detected by the detector 1326 changes according to the positional relationship between the machining head 13 and the measurement object M. This is because the interference light detected by the detector 1326 is the interference light of the return light RL that is directed toward the detector 1326 via the object M to be measured and the measurement light ML#1-3 that is directed toward the detector 1326 without passing through the object M to be measured. On the other hand, the position (position on the time axis) of the pulse light of the interference light detected by the detector 1323 does not change according to the positional relationship between the machining head 13 and the object M to be measured (that is, substantially the positional relationship between the machining head 13 and the object M to be measured). Therefore, it can be said that the time difference between the pulse light of the interference light detected by the detector 1326 and the pulse light of the interference light detected by the detector 1323 indirectly indicates the positional relationship between the machining head 13 and the object M to be measured. Specifically, it can be said that the time difference between the pulse light of the interference light detected by the detector 1326 and the pulse light of the interference light detected by the detector 1323 indirectly indicates the distance between the machining head 13 and the object M to be measured in the direction along the optical path of the measurement light ML (that is, the direction along the traveling direction of the measurement light ML). Therefore, the control unit 2 can calculate the distance between the machining head 13 and the measurement object M in the direction of the optical path of the measurement light ML (for example, the Z-axis direction) based on the time difference between the pulse light of the interference light detected by the detector 1326 and the pulse light of the interference light detected by the detector 1323. In other words, the control unit 2 can calculate the position of the measurement object M in the direction of the optical path of the measurement light ML (for example, the Z-axis direction). More specifically, the control unit 2 can calculate the distance between the irradiated portion of the measurement object M irradiated with the measurement light ML#2-2 and the machining head 13. The control unit 2 can calculate the position of the irradiated portion in the direction of the optical path of the measurement light ML (for example, the Z-axis direction).Furthermore, the irradiation position of the measurement light ML#2-2 on the measurement object M is determined by the driving state of the galvanometer mirrors 1341 and 1328, and therefore, the control unit 2 can calculate the position of the irradiated portion in the direction intersecting the optical path of the measurement light ML (for example, at least one of the X-axis direction and the Y-axis direction) based on the driving state of the galvanometer mirrors 1341 and 1328. As a result, the control unit 2 can generate measurement data indicating the position of the irradiated portion in the measurement coordinate system based on the machining head 13 (for example, the position in the three-dimensional coordinate space).

[0133] The machining head 13 may also irradiate the measurement light ML#2-2 to a plurality of locations of the object M to be measured. For example, at least one of the galvanometer mirrors 1341 and 1328 may also change the irradiation position of the measurement light ML#2-2 on the object M to be measured so that the machining head 13 irradiates the measurement light ML#2-2 to a plurality of locations of the object M to be measured. For example, at least one of the machining head 13 and the worktable 15 may be moved in such a manner that the machining head 13 irradiates the measurement light ML#2-2 to a plurality of locations of the object M to be measured. When the measurement light ML#2-2 is irradiated to a plurality of locations of the object M to be measured, the control unit 2 may generate measurement data indicating the positions of the plurality of locations of the object M to be measured. As a result, the control unit 2 may generate measurement data indicating the shape of the object M to be measured based on the measurement data indicating the positions of the plurality of locations. For example, the control unit 2 may generate measurement data indicating the shape of the object M to be measured by calculating a three-dimensional shape consisting of an imaginary plane (or curved surface) connecting a plurality of locations whose positions are determined as the shape of the object M to be measured.

[0134] (1-3) Structure of the Processing Head 13 with Replaceable Irradiation Optical System 135

[0135] In the first embodiment, as described above, the irradiation optical system 135 that irradiates the workpiece W with the processing light EL and irradiates the measurement light ML with the measurement object M can be replaced. Figure 3 The structure of the processing head 13 in which the irradiation optical system 135 can be replaced will be further described.

[0136] like Figure 3 As shown, the processing optical system 131, the measuring optical system 132, the synthesizing optical system 133, and the deflection optical system 134 may also be housed in a head housing 136 of the processing head 13. On the other hand, the irradiation optical system 135 may also be housed in a head housing 137 of the processing head 13 which is different from the head housing 136. At least one of the head housings 136 and 137 may be referred to as a lens barrel.

[0137] In this case, the processing light EL and the measuring light ML are incident on the irradiation optical system 135 housed in the head housing 137 via the processing optical system 131, the measuring optical system 132, the synthesizing optical system 133, and the deflecting optical system 134 housed in the head housing 136, respectively. That is, the optical system including the processing optical system 131, the measuring optical system 132, the synthesizing optical system 133, and the deflecting optical system 134 housed in the head housing 136 emits the processing light EL and the measuring light ML toward the irradiation optical system 135. Therefore, in the following description, for convenience of description, the optical system including the processing optical system 131, the measuring optical system 132, the synthesizing optical system 133, and the deflecting optical system 134 is referred to as an emission optical system 130 that emits the processing light EL and the measuring light ML toward the irradiation optical system 135.

[0138] The head housing 137 can be mounted on the head housing 136. The head housing 137 mounted on the head housing 136 can be removed from the head housing 136. That is, the head housing 137 can be attached to and detached from the head housing 136. In this case, the irradiation optical system 135 accommodated in the head housing 137 can also be regarded as being attachable to the emission optical system 130 accommodated in the head housing 136. The irradiation optical system 135 mounted on the emission optical system 130 can also be regarded as being detachable from the emission optical system 130. That is, the irradiation optical system 135 can also be regarded as being attachable to and detachable from the emission optical system 130.

[0139] In the first embodiment, the head case 137 may be detachably mounted on the head case 136 via the mounting adapter 138. That is, the irradiation optical system 135 may be detachably mounted on the emission optical system 130 via the mounting adapter 138. However, the head case 137 may be detachably mounted on the head case 136 without using the mounting adapter 138. That is, the irradiation optical system 135 may be detachably mounted on the emission optical system 130 without using the mounting adapter 138.

[0140] An example of a mounting adapter 138 Figure 6 As shown. Figure 6 As shown, the mounting adapter 138 can also be mounted to the head housing 136. Figure 6 In the example shown, the mounting adapter 138 can also be mounted on the head shell 136 in a manner such that the upper surface of the mounting adapter 138 (specifically, the surface facing the +Z side) and the lower surface of the head shell 136 (specifically, the surface facing the -Z side) are opposite to each other.

[0141] The lower surface of the mounting adapter 138 (specifically, the surface facing the -Z side) can also be used as a mounting surface 1380 for mounting the head housing 137. In other words, the head housing 137 can also be mounted on the mounting adapter 138 in such a manner that the mounting surface 1370, which is the upper surface of the head housing 137, faces the mounting surface 1380 of the mounting adapter 138. As a result, the head housing 137 is mounted on the head housing 136 via the mounting adapter 138.

[0142] In order to mount the head housing 137 on the mounting adapter 138, at least one mounting pin 1381 may be formed on the mounting surface 1380 of the mounting adapter 138. At least one mounting pin 1382 may also be formed on the side of each mounting pin 1381. Figure 6 As shown in the enlarged view of the mounting pin 1381 on the right side of the figure, the state of each mounting pin 1382 can also be switched between a state in which each mounting pin 1382 is accommodated inside the mounting pin 1381 (as a result, each mounting pin 1382 does not protrude from the side of the mounting pin 1381) and a state in which each mounting pin 1382 is not accommodated inside the mounting pin 1381 (as a result, each mounting pin 1382 protrudes from the side of the mounting pin 1381). For example, the state of each mounting pin 1382 can be switched between a state in which each mounting pin 1382 is accommodated inside the mounting pin 1381 and a state in which each mounting pin 1382 is not accommodated inside the mounting pin 1381 using a force that moves the mounting pin 1382.

[0143] The force for moving the mounting pin 1382 may be a force applied to the mounting pin 1382 from the head housing 137. For example, in the process of mounting the head housing 137 on the mounting adapter 138, the mounting pin 1382 may come into contact with the surface of the head housing 137 (for example, the surface forming the mounting hole 1371 described later). In this case, a force for pressing the mounting pin 1382 out from the surface of the head housing 137 is applied to the mounting pin 1382. The mounting pin 1382 may be moved by the force for pressing the mounting pin 1382 out from the surface of the head housing 137. That is, the mounting pin 1382 may also be accommodated inside the mounting pin 1381 by the force for pressing the mounting pin 1382 out from the surface of the head housing 137. In addition, in this case, the curvature of at least a portion of the surface of the mounting pin 1382 may also be set to an appropriate curvature so that a force is appropriately applied to the mounting pin 1382 from the surface of the head housing 137. At least a portion of the surface of the mounting pin 1382 may also be a curved surface.

[0144] The force for moving the mounting pin 1382 may be, for example, a force caused by a gas (e.g., air). The force for moving the mounting pin 1382 may be, for example, a force caused by the pressure of a gas (e.g., air). In this case, an air compressor that supplies gas may also move the mounting pin 1382. As the gas for moving the mounting pin 1382, a purge gas may be used, or a gas different from the purge gas may be used.

[0145] In addition, Figure 6 and Figure 7 In the example shown, two mounting pins 1381 are arranged on a straight line intersecting the optical axis EX of the irradiation optical system 135. However, the number of mounting pins 1381 is not limited to two. A single mounting pin 1381 may be formed. Three or more mounting pins 1381 may be formed.

[0146] Furthermore, in order to mount the head housing 137 on the mounting adapter 138, mounting holes 1371 into which mounting pins 1381 of the mounting adapter 138 can be inserted may be formed on the mounting surface 1370 of the head housing 137. The number of mounting holes 1371 formed on the head housing 137 may be the same as the number of mounting pins 1381 formed on the mounting adapter 138. Furthermore, mounting holes 1372 into which mounting pins 1382 of the mounting adapter 138 can be inserted may be connected to the mounting holes 1371. The number of mounting holes 1372 connected to each mounting hole 1371 may be the same as the number of mounting pins 1382 formed on each mounting pin 1381.

[0147] In this case, in order to mount the head housing 137 on the mounting adapter 138, as shown in FIG. Figure 7 As shown in (a), the state of each mounting pin 1382 can also be switched to a state where each mounting pin 1382 is accommodated inside the mounting pin 1381. Figure 7 As shown in (b), the head housing 137 may be aligned with respect to the mounting adapter 138 by inserting each mounting pin 1381 into each mounting hole 1371. Figure 7 As shown in (c), the state of each mounting pin 1382 can also be switched to a state where each mounting pin 1382 is not accommodated inside the mounting pin 1381. As a result, Figure 7 As shown in (c) of FIG. 1 , the mounting pin 1382 is inserted into the mounting hole 1372 , and the head housing 137 is fixed to the mounting adapter 138 . That is, the head housing 137 is mounted to the head housing 136 . In other words, the irradiation optical system 135 is mounted to the emission optical system 130 .

[0148] On the other hand, in order to remove the head housing 137 mounted on the mounting adapter 138, as shown in FIG. Figure 7As shown in (b), the state of each mounting pin 1382 can also be switched to a state where each mounting pin 1382 is accommodated inside the mounting pin 1381. Then, as shown in Figure 7 As shown in (a), each mounting pin 1381 can also be removed from each mounting hole 1371. As a result, Figure 7 As shown in (a) of FIG. 1 , the head case 137 is removed from the mount adapter 138 . That is, the head case 137 is removed from the head case 136 . In other words, the irradiation optical system 135 is removed from the emission optical system 130 .

[0149] A groove may be formed on at least one of the mounting surface 1380 of the mounting adapter 138 and the mounting surface 1370 of the head housing 137. The groove may be evacuated after the head housing 137 is mounted on the mounting adapter 138. In this case, when the head housing 137 is properly mounted on the mounting adapter 138, since the mounting surface 1370 is properly in close contact with the mounting surface 1380, it is assumed that the air pressure of the groove is reduced to below a certain value. On the other hand, when the head housing 137 is not properly mounted on the mounting adapter 138, since the mounting surface 1370 is not properly in close contact with the mounting surface 1380, it is assumed that the air pressure of the groove is not reduced to below a certain value. Therefore, the control unit 2 may also determine whether the head housing 137 is properly mounted on the mounting adapter 138 based on the air pressure of the evacuated groove.

[0150] The force that moves the mounting pin 1382 may include a force caused by a spring (or any elastic body) in addition to the force caused by the gas described above. For example, the state of the mounting pin 1382 may also be set to a state where the mounting pin 1382 protrudes from the side of the mounting pin 1381 by the force applied to the mounting pin 1382 from the spring. In this state, the state of the mounting pin 1382 may also be switched to a state where the mounting pin 1382 is accommodated inside the mounting pin 1381 by the force caused by the gas. That is, it may also be that when the state of the air compressor device is the disconnected state, the mounting pin 1382 protrudes from the side of the mounting pin 1381, and on the other hand, when the state of the air compressor device is the connected state, the mounting pin 1382 is accommodated inside the mounting pin 1381. In this case, even if the air compressor device fails due to an unexpected situation (that is, even if the air compressor device is in the closed state), the head housing 137 will not fall off from the mounting adapter 138. Therefore, it is possible to prevent damage to the irradiation optical system 135 caused by falling. Therefore, the mounting pin 1381 and the mounting hole 1371 can function as a fall prevention mechanism that prevents the head housing 137 from falling off the mounting adapter 138. The mounting pin 1381 and the mounting hole 1371 can function as a fall prevention mechanism that prevents the head housing 137 from falling off the mounting adapter 138. However, the processing head 13 may have another fall prevention mechanism (fall prevention mechanism) in addition to the fall prevention mechanism (fall prevention mechanism) including the mounting pin 1381 and the mounting hole 1371.

[0151] In the above example, the mount adapter 138 is mounted on the head housing 136. However, the mount adapter 138 may be mounted on the head housing 137. When the irradiation optical system 135 is replaceable, as described later, a plurality of head housings 137 are selectively mounted on the head housing 136. In this case, the mount adapter 138 may be mounted on each of the plurality of head housings 137.

[0152] (1-4) Structure of the Head Replacement Device 17

[0153] Next, refer to Figure 8 The structure of the head replacement device 17 for replacing the irradiation optical system 135 will be described. Figure 8 It is a cross-sectional view conceptually showing an example of the structure of the head replacement device 17 .

[0154] like Figure 8 As shown, the head replacement device 17 includes a storage device 171 , a transport device 172 , and a housing 173 .

[0155] The storage device 171 can store the irradiation optical system 135 that can be mounted on the processing head 13. Typically, the storage device 171 can also store a plurality of irradiation optical systems 135 that can be mounted on the processing head 13. Figure 8 In the illustrated example, the storage device 171 stores N (N is a variable representing an integer greater than or equal to 2) irradiation optical systems 135 (specifically, irradiation optical systems 135 # 1 to 135 #N).

[0156] As described above, the irradiation optical system 135 is mounted on the processing head 13 (particularly, the emission optical system 130) in a state where the irradiation optical system 135 is housed in the head housing 137. Therefore, the housing device 171 may also be capable of housing the irradiation optical system 135 housed in the head housing 137. In other words, the housing device 171 may house the head housing 137 housing the irradiation optical system 135.

[0157] The storage device 171 can store a plurality of irradiation optical systems 135 having different optical characteristics. Fig. 9 (a) to Fig. 9 (g) shows an example of a plurality of irradiation optical systems 135 having different optical characteristics. Fig. 9 (a) to Fig. 9 (g) shows seven irradiation optical systems 135 having different optical characteristics.

[0158] For example, Fig. 9 (a) to Fig. 9As shown in (c), a plurality of irradiation optical systems 135 having different numerical apertures NA (Numerial Aperture) may be stored in the storage device 171. Specifically, the larger the numerical aperture NA of the irradiation optical system 135, the higher the processing accuracy and the measurement accuracy, but the working distance between the irradiation optical system 135 and the workpiece W (or the measurement object M) becomes shorter. Therefore, the larger the numerical aperture NA of the irradiation optical system 135, the higher the processing accuracy and the measurement accuracy, but the higher the possibility of the irradiation optical system 135 colliding with the workpiece W (or the measurement object M). On the other hand, the smaller the numerical aperture NA of the irradiation optical system 135, the longer the working distance between the irradiation optical system 135 and the workpiece W (or the measurement object M), but the processing accuracy and the measurement accuracy decrease. Therefore, the smaller the numerical aperture NA of the irradiation optical system 135, the lower the possibility of the irradiation optical system 135 colliding with the workpiece W (or the measurement object M), but the processing accuracy and the measurement accuracy decrease. Therefore, in the storage device 171, a plurality of irradiation optical systems 135 having different numerical apertures NA may be stored, taking into account the trade-off between the effect of improving processing accuracy and measurement accuracy (hereinafter referred to as accuracy improvement effect) and the effect of preventing collision between the irradiation optical system 135 and the workpiece W (or measurement object M) (hereinafter referred to as collision prevention effect).

[0159] In other words, a plurality of irradiation optical systems 135 having different working distances can be accommodated. Here, the working distance may be the distance along the optical axis EX from the final optical element of the irradiation optical system 135 to the focusing position of the processing light EL. The working distance may be the distance along the optical axis EX from the optical element disposed closest to the emission side among the one or more optical elements constituting the irradiation optical system 135 to the focusing position of the processing light EL. The working distance may be the distance along the direction parallel to the optical axis EX from the portion closest to the workpiece W in the head housing 137 accommodating the irradiation optical system 135 to the focusing position of the processing light EL. Here, the focusing position of the processing light EL may also be the rear focal position of the irradiation optical system 135.

[0160] As one example, the storage device 171 may store an irradiation optical system 135-1 whose numerical aperture NA is set to the first numerical aperture NA1 in order to achieve both the precision improvement effect and the collision prevention effect. As another example, the storage device 171 may store an irradiation optical system 135-2 whose numerical aperture NA is set to the second numerical aperture NA2 larger than the first numerical aperture NA1 in order to give priority to the precision improvement effect over the collision prevention effect, in addition to or in place of the irradiation optical system 135-1. As another example, the storage device 171 may store an irradiation optical system 135-3 whose numerical aperture NA is set to the third numerical aperture NA3 smaller than the first numerical aperture NA1 in order to give priority to the collision prevention effect over the precision improvement effect, in addition to or in place of at least one of the irradiation optical systems 135-1 and 135-2.

[0161] In this case, when the irradiation optical system 135-1 is installed on the processing head 13, the processing system SYSa can reduce the possibility of the irradiation optical system 135 colliding with the workpiece W (or the measurement object M), and can process the workpiece W with a first processing accuracy and measure the measurement object M with a first measurement accuracy. In addition, when the irradiation optical system 135-2 is installed on the processing head 13, the processing system SYSa can process the workpiece W with a second processing accuracy that is higher than the first processing accuracy, and can measure the measurement object M with a second measurement accuracy that is higher than the first measurement accuracy. In addition, when the irradiation optical system 135-3 is installed on the processing head 13, the processing system SYSa can further prevent the irradiation optical system 135 from colliding with the workpiece W (or the measurement object M), compared with the case where the irradiation optical system 135-1 is installed on the processing head 13. In addition, since the working distance becomes longer, as Fig. 9 As shown in (c) of FIG. 1 , the machining system SYSa can appropriately machine the workpiece W so as to form a deep hole in the workpiece W, and can appropriately measure the inside of the deep hole formed in the object M to be measured.

[0162] For example, Fig. 9 As shown in (d) of FIG. 1 , an irradiation optical system 135-4 dedicated to processing the workpiece W using the processing light EL may be stored in the storage device 171. For example, the storage device 171 may store an irradiation optical system 135-4 whose improvement in processing accuracy takes precedence over improvement in measurement accuracy. For example, the storage device 171 may store an irradiation optical system 135-4 designed only for improvement in processing accuracy without considering any improvement in measurement accuracy. In this case, when the irradiation optical system 135-4 is mounted on the processing head 13, the processing system SYSa can process the workpiece W more appropriately.

[0163] For example, Fig. 9 As shown in (e), the storage device 171 may also store an irradiation optical system 135-5 dedicated to measuring the measurement object M using the measurement light ML. For example, the storage device 171 may store an irradiation optical system 135-5 that prioritizes improvement of measurement accuracy over improvement of processing accuracy. For example, the storage device 171 may store an irradiation optical system 135-5 designed only for improvement of measurement accuracy without considering any improvement of processing accuracy. In this case, when the irradiation optical system 135-5 is mounted on the processing head 13, the processing system SYSa can measure the measurement object M more appropriately.

[0164] For example, Fig. 9 As shown in (f), the storage device 171 may store an irradiation optical system 135-6 whose dimension (so-called width) in the direction intersecting the irradiation direction of the processing light EL and the measuring light ML is limited to a certain dimension or less. Since the irradiation optical system 135-6 is stored in the head housing 137, the storage device 171 may store an irradiation optical system 135-6 whose dimension (so-called width) in the direction intersecting the irradiation direction of the processing light EL and the measuring light ML is limited to a certain dimension or less. In this case, when the irradiation optical system 135-6 is mounted on the processing head 13, the processing system SYSa can make the irradiation optical system 135-6 enter the inside of a hole having a width of a certain dimension or less formed in the workpiece W or the measurement object M. Therefore, the processing system SYSa can appropriately process the workpiece W in a manner of forming a deep hole in the workpiece W, and can appropriately measure the inside of the deep hole formed in the measurement object M.

[0165] For example, Fig. 9As shown in (g) of FIG. 1 , an irradiation optical system 135-7 capable of emitting at least one of the processing light EL and the measurement light ML in a direction intersecting the optical axis EX of the irradiation optical system 135 (for example, the optical axis of the fθ lens 1351) may be stored in the storage device 171. In this case, the irradiation optical system 135-7 may also have a reflector 1352 capable of reflecting at least one of the processing light EL and the measurement light ML emitted from the fθ lens 1351 to change the traveling direction of at least one of the processing light EL and the measurement light ML emitted from the fθ lens 1351. In addition, the reflector 1352 may also be capable of rotating around the optical axis EX of the irradiation optical system 135 (for example, the optical axis of the fθ lens 1351). When such an irradiation optical system 135-7 is mounted on the processing head 13, the processing system SYSa can irradiate the processing light EL or the measurement light ML onto the surface of the workpiece W or the measurement object M along the optical axis EX of the irradiation optical system 135.

[0166] Again in Figure 8 In the embodiment, the transport device 172 can transport the irradiation optical system 135 between the head replacement device 17 and the processing head 13. Specifically, the transport device 172 can also take out the irradiation optical system 135 stored in the storage device 171 from the storage device 171. Then, the transport device 172 can transport the irradiation optical system 135 taken out from the storage device 171 from the storage device 171 to the processing head 13. Thereafter, the transport device 172 can also attach the irradiation optical system 135 transported to the processing head 13 to the processing head 13. Furthermore, the transport device 172 can also detach the irradiation optical system 135 attached to the processing head 13 from the processing head 13. Then, the transport device 172 can also transport the irradiation optical system 135 detached from the processing head 13 from the processing head 13 to the storage device 171. Thereafter, the transport device 172 can also store the irradiation optical system 135 transported to the storage device 171 in the storage device 171.

[0167] When a plurality of irradiation optical systems 135 are stored in the storage device 171, the control unit 2 may select any one of the plurality of irradiation optical systems 135 as one irradiation optical system 135 to be mounted on the processing head 13. For example, the control unit 2 may select any one of the plurality of irradiation optical systems 135 as one irradiation optical system 135 to be mounted on the processing head 13 based on an instruction of a user of the processing system SYSa. For example, the control unit 2 may select any one of the plurality of irradiation optical systems 135 as one irradiation optical system 135 to be mounted on the processing head 13 based on a processing method performed by the processing system SYSa. For example, the control unit 2 may select any one of the plurality of irradiation optical systems 135 as one irradiation optical system 135 to be mounted on the processing head 13 based on a measurement method performed by the processing system SYSa. Then, the transport device 172 may transport the one irradiation optical system 135 selected by the control unit 2 from the storage device 171 to the processing head 13.

[0168] The transport device 172 may include a transport arm 1721 that can grasp or temporarily hold the irradiation optical system 135 in order to transport the irradiation optical system 135. In this case, the transport device 172 may transport the irradiation optical system 135 between the head replacement device 17 and the processing head 13 using the transport arm 1721.

[0169] When the transport device 172 uses the transport arm 1721 to transport the irradiation optical system 135, a magazine-type automatic tool changer (ATC: Auto Tool Changer) used in a machine tool may be used as the head replacement device 17. In this case, the storage device 171 may also be called a magazine. In other words, the magazine of the automatic tool changer may also be used as the storage device 171. In this case, the cutting tools usually stored in the magazine may not be stored in the magazine that functions as the storage device 171 for storing a plurality of irradiation optical systems 135.

[0170] Alternatively, a turret-type automatic tool changer used in a machine tool may be used as the head replacement device 17. In this case, the storage device 171 may function as a tool holder having a roller shape. In other words, the tool holder of the automatic tool changer may also be used as the storage device 171. In this case, the cutting tool that is usually stored in the tool holder may not be stored in the tool holder that functions as the storage device 171 for storing a plurality of irradiation optical systems 135. In this case, the conveying device 172 may directly rotate the tool holder used as the storage device 171 in such a way that the desired irradiation optical system 135 is located at a position closest to the conveying device 172, thereby holding or temporarily holding the irradiation optical system 135 located at a position closest to the conveying device 172. Alternatively, the tool holder used as the storage device 171 may be rotated without using the force of the conveying device 172 so that the desired irradiation optical system 135 is located at a desired position. As an example, in Figure 8 In the example shown, the tool holder used as the storage device 171 may be rotated so that the desired irradiation optical system 135 to be mounted on the processing head 13 is located closest to the +Y side. Then, the desired irradiation optical system 135 may be moved so as to fly out from the conveying port 1731 toward the +Y side, and the processing head 13 may approach the irradiation optical system 135 that has flown out from the conveying port 1731, so that the irradiation optical system 135 that has flown out from the conveying port 1731 can be mounted on the processing head 13.

[0171] When the automatic tool changer of a machine tool is used as the head replacement device 17, the machine tool can also be used to manufacture the processing system SYSa. For example, the machine tool can also be used to manufacture the processing system SYSa by installing the processing head 13 on the spindle of the machine tool. In this case, the device inside the shell of the machine tool that has been designed, developed or mass-produced can also be used as a structural element of the processing system SYSa. For example, the workbench of the machine tool can be used as the workbench 15 of the processing system SYSa. For example, the guiding mechanism of the machine tool can also be used as at least one of the head drive system 141 and the workbench drive system 161 of the processing system SYSa. Alternatively, the device inside the shell of the machine tool can be at least partially improved, and the partially improved device can be used as a structural element of the processing system SYSa. As a result, the cost of the processing system SYSa can be reduced compared to the case where the structural elements of the processing system SYSa are redesigned from the beginning.

[0172] The machining system SYS may use devices (for example, an automatic tool changer, a table, and a head guide mechanism) inside a housing of a machine tool that has already been designed, developed, or mass-produced as components of the machining system SYS.

[0173] The housing 173 accommodates at least a portion of the storage device 171 and the conveying device 172. Specifically, at least a portion of the storage device 171 and the conveying device 172 is accommodated in the storage space 1730 inside the housing 173.

[0174] The housing 173 may be provided with a transport port 1731 . In this case, the transport device 172 may transport the irradiation optical system 135 between the head replacement device 17 and the processing head 13 via the transport port 1731 .

[0175] A gas supply port 1732 may be formed in the housing 173. A purge gas (i.e., gas) such as nitrogen may be supplied to the storage space 1730 inside the housing 173 through the gas supply port 1732. That is, the processing system SYS may supply the purge gas to the storage space 1730 inside the housing 173 through the gas supply port 1732 using a gas supply device (not shown).

[0176] It is also possible to supply a purge gas to the storage space 1730 via the gas supply port 1732 so that the air pressure of the storage space 1730 is higher than the air pressure of the space outside the housing 173 (specifically, the internal space SP inside the housing 3 that stores the processing unit 1). That is, it is also possible to supply a purge gas to the storage space 1730 via the gas supply port 1732 so that the air pressure of the storage space 1730 is higher than the air pressure of the internal space SP where the workpiece W is placed on the workbench 15. In other words, it is also possible to supply a purge gas to the storage space 1730 via the gas supply port 1732 so that the air pressure of the storage space 1730 is higher than the air pressure of the internal space SP where the workpiece W is processed. As a result, the possibility of unnecessary substances generated by the processing of the workpiece W entering the storage space 1730 of the head replacement device 17 from the internal space SP where the workpiece W exists becomes lower. Therefore, the head replacement device 17 can prevent unnecessary substances from being attached to the irradiation optical system 135 stored in the storage space 1730. Furthermore, as an example of unnecessary substances, fumes generated while processing the workpiece W can be cited.

[0177] The purge gas may be supplied toward the irradiation optical system 135 accommodated in the accommodation space 1730 through the gas supply port 1732. For example, the purge gas may be supplied toward at least one of the plurality of irradiation optical systems 135 accommodated in the accommodation space 1730 through the gas supply port 1732. In this case, even when unnecessary substances are attached to the irradiation optical system 135 accommodated in the accommodation space 1730, the unnecessary substances attached to the irradiation optical system 135 can be removed by the purge gas supplied toward the irradiation optical system 135. Therefore, the head replacement device 17 can prevent unnecessary substances from being attached to the irradiation optical system 135 accommodated in the accommodation space 1730.

[0178] In addition, the purge gas may be supplied to the mounting surface 1380 of the mounting adapter 138 during at least a portion of the period during which the head case 137 is removed from the mounting adapter 138 (head case 136). In this case, it is possible to prevent unnecessary substances from being attached to the mounting surface 1380. Here, the period during which the purge gas is supplied to the mounting surface 1380 of the mounting adapter 138 may be the entire period during which the head case 137 is removed from the mounting adapter 138 (head case 136).

[0179] (1-5) Technical effects of processing system SYSa

[0180] As described above, the processing system SYSa of the first embodiment can replace the irradiation optical system 135 mounted on the processing head 13. Therefore, compared with the case where the irradiation optical system 135 mounted on the processing head 13 cannot be replaced, the processing system SYSa can use one irradiation optical system 135 that matches the processing purpose to more appropriately process the workpiece W. Furthermore, compared with the case where the irradiation optical system 135 mounted on the processing head 13 cannot be replaced, the processing system SYSa can use one irradiation optical system 135 that matches the measurement purpose to more appropriately measure the measurement object M.

[0181] (2) Machining System SYSb of Second Embodiment

[0182] Next, the machining system SYS in the second embodiment will be described. In the following description, the machining system SYS in the second embodiment will be referred to as a "machining system SYSb".

[0183] (2-1) Structure of the processing system SYSb

[0184] First, refer to Fig.10 The configuration of the machining system SYSb in the second embodiment will be described. Fig.10 It is a block diagram showing an example of the configuration of the processing system SYSb in the second embodiment. In the following description, the same reference numerals are attached to the same components as those already described, and the detailed description thereof is omitted.

[0185] like Fig.10 As shown, the machining system SYSb in the second embodiment is different from the machining system SYSa in the first embodiment in that a machining unit 1b is provided instead of the machining unit 1. Other features of the machining system SYSb may be the same as those of the machining system SYSa.

[0186] The machining unit 1b is different from the machining unit 1 in that it further includes an optical measuring device 18b, a measuring drive system 191b, and a position measuring device 192b. The other features of the machining unit 1b may be the same as those of the machining unit 1.

[0187] The light measuring device 18b is a component for the calibration operation. The calibration operation is an operation for correcting (in other words, controlling or adjusting) at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measuring light ML. The calibration operation is performed under the control of the control unit 2. That is, the processing system SYSb performs the calibration operation under the control of the control unit 2. In addition, the details of the calibration operation and the details of the light measuring device 18b will be described in detail later, but the outline thereof will be briefly described below.

[0188] In order to perform the calibration operation, the machining head 13 irradiates at least one of the machining light EL and the measuring light ML to the light measuring device 18b under the control of the control unit 2. That is, the machining head 13 emits at least one of the machining light EL and the measuring light ML toward the light measuring device 18b via the irradiation optical system 135. The light measuring device 18b measures at least one of the machining light EL and the measuring light ML irradiated to the light measuring device 18b under the control of the control unit 2. That is, the light measuring device 18b measures at least one of the machining light EL and the measuring light ML emitted from the irradiation optical system 135. Specifically, the light measuring device 18b receives at least one of the machining light EL and the measuring light ML irradiated to the light measuring device 18b. That is, the light measuring device 18b receives at least one of the machining light EL and the measuring light ML emitted from the irradiation optical system 135. Therefore, the light measuring device 18b can also be called a light receiving device. Light reception information indicating a result of light reception of at least one of the processing light EL and the measurement light ML by the light measuring device 18 b is output from the light measuring device 18 b to the control unit 2 .

[0189] The control unit 2 corrects at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measuring light ML based on the light reception information. Specifically, the control unit 2 calculates (in other words, obtains) at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measuring light ML based on the light reception information. That is, the control unit 2 obtains irradiation position information related to at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measuring light ML based on the light reception information. Thereafter, the control unit 2 corrects at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measuring light ML based on the irradiation position information.

[0190] The measurement drive system 191b moves the optical measuring device 18b under the control of the control unit 2. That is, the measurement drive system 191b moves the position of the optical measuring device 18b. Therefore, the measurement drive system 191b can also be called a moving device. The measurement drive system 191b can also move the optical measuring device 18b along a moving axis (that is, linear movement), and the moving axis is along at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction. The measurement drive system 191b can also move the optical measuring device 18b along at least one of the θX direction, the θY direction, and the θZ direction on the basis of or instead of at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction. That is, the measurement drive system 191b can also rotate (that is, rotational movement) the optical measuring device 18b around at least one of the rotation axis along the X-axis direction (that is, the A axis), the rotation axis along the Y-axis direction (that is, the B axis), and the rotation axis along the Z-axis direction (that is, the C axis).

[0191] If the measurement drive system 191b moves the light measuring device 18b, the positional relationship between the processing head 13 (particularly the irradiation optical system 135 included in the processing head 13) and the light measuring device 18b changes. For example, the positional relationship between the processing head 13 (particularly the irradiation optical system 135) and the light measuring device 18b along at least one of the X-axis direction, the Y-axis direction, and the Z-axis direction may be changed. For example, the positional relationship between the processing head 13 (particularly the irradiation optical system 135) and the light measuring device 18b along at least one of the θX direction, the θY direction, and the θZ direction may be changed. In addition, the positional relationship between the processing head 13 (particularly the irradiation optical system 135) and the light measuring device 18b along at least one of the θX direction, the θY direction, and the θZ direction may be regarded as the posture relationship between the processing head 13 (particularly the irradiation optical system 135) and the light measuring device 18b. Therefore, the measurement drive system 191b can also be regarded as functioning as a changing device capable of changing at least one of the positional relationship and the posture relationship between the machining head 13 (particularly, the irradiation optical system 135) and the optical measurement device 18b.

[0192] The measuring drive system 191b may also be used during at least a portion of a calibration period to perform a calibration action, such as Fig.11 As shown in (a), the light measuring device 18b is moved so that the light measuring device 18b is located at the calibration position CP1. The calibration position CP1 is a position where the light measuring device 18b can receive at least one of the processing light EL and the measuring light ML. On the other hand, the measurement drive system 191b may also be used during at least a portion of the processing period when the processing unit 1 processes the workpiece W, such as Fig.11As shown in (b), the light measuring device 18b is moved so that the light measuring device 18b is located at the non-calibration position CP2. The non-calibration position CP2 is a position where the light measuring device 18b cannot receive at least one of the processing light EL and the measurement light ML. Similarly, the measurement drive system 191b may move the light measuring device 18b so that the light measuring device 18b is located at the non-calibration position CP2 during at least a portion of the measurement period in which the processing unit 1 measures the measurement object M. That is, the measurement drive system 191b may move the light measuring device 18b so that the light measuring device 18b is located at the non-calibration position CP2 different from the calibration position CP1 during at least a portion of the processing period and the measurement period. That is, the measurement drive system 191b may move the light measuring device 18b between the calibration position CP1 and the non-calibration position CP2.

[0193] In this case, during the machining period, the light measuring device 18b located at the non-calibration position CP2 does not receive the machining light EL. Therefore, the machining light EL emitted toward the workpiece W for machining the workpiece W is not blocked by the light measuring device 18b. Therefore, even if the machining unit 1b has the light measuring device 18b, the machining unit 1b can properly machine the workpiece W. Similarly, during the measurement period, the light measuring device 18b located at the non-calibration position CP2 does not receive the measuring light ML. The measuring light ML emitted toward the measuring object M for measuring the measuring object M is not blocked by the light measuring device 18b. Therefore, even if the machining unit 1b has the light measuring device 18b, the machining unit 1b can properly measure the measuring object M. In addition, typically, the light intensity of the machining light EL received by the light measuring device 18b is lower than the light intensity of the machining light EL when machining the workpiece W. Since the machining light EL with high light intensity is not irradiated to the light measuring device 18b during the machining period, it is possible to prevent the light measuring device 18b from being deteriorated or damaged. On the other hand, during the calibration period, the optical measuring device 18b located at the calibration position CP1 can receive at least one of the processing light EL and the measuring light ML. That is, the machining unit 1b can irradiate at least one of the processing light EL and the measuring light ML to the optical measuring device 18b. Therefore, during the calibration period, the machining system SYSb can appropriately perform the calibration operation.

[0194] The measurement drive system 191b may also move the light measuring device 18b between the calibration position CP1 and the non-calibration position CP2 by moving the light measuring device 18b in a direction intersecting with the direction of irradiating at least one of the processing light EL and the measuring light ML. In other words, the measurement drive system 191b may also move the light measuring device 18b between the calibration position CP1 and the non-calibration position CP2 by changing the relative positional relationship between the light measuring device 18b and the processing head 13 (particularly the irradiation optical system 135) in a direction intersecting with the direction of irradiating at least one of the processing light EL and the measuring light ML. Fig.11 In the example shown in (a), the direction of irradiating at least one of the processing light EL and the measuring light ML is the Z-axis direction. Therefore, the measurement drive system 191b may also move the optical measuring device 18b in a direction intersecting the Z-axis direction. In this case, the calibration position CP1 and the non-calibration position CP2 may also be separated from each other in a direction intersecting the direction of irradiating at least one of the processing light EL and the measuring light ML.

[0195] like Fig.11 As shown in (a) of FIG. 1 , the calibration position CP1 may be a position on the optical path of at least one of the processing light EL and the measuring light ML. The calibration position CP1 may be a position where the processing head 13 (particularly the irradiation optical system 135) can irradiate at least one of the processing light EL and the measuring light ML. Fig.11 As shown in (b), the non-calibration position CP2 may be a position away from the respective optical paths of the processing light EL and the measuring light ML. The non-calibration position CP2 may be a position where the processing head 13 (particularly the irradiation optical system 135) cannot irradiate the processing light EL and the measuring light ML respectively. The non-calibration position CP2 may be a position where the processing head 13 (particularly the irradiation optical system 135) is prohibited from irradiating the processing light EL and the measuring light ML respectively. The non-calibration position CP2 may be a position outside the area that the processing unit 1b can process (for example, the above-mentioned processing shooting area PSA). The non-calibration position CP2 may be a position outside the area that the processing unit 1b can measure (for example, the above-mentioned measurement shooting area MSA).

[0196] The calibration position CP1 may be a position on the workbench 15. In this case, the light measuring device 18b located at the calibration position CP1 may be placed on the workbench 15. The workbench 15 may hold the light measuring device 18b. Alternatively, the workbench 15 may not hold the light measuring device 18b. On the other hand, the non-calibration position CP2 may be a position away from the workbench 15. In particular, the non-calibration position CP2 may be a position away from the workbench 15 in a direction intersecting with the direction of irradiating at least one of the processing light EL and the measuring light ML.

[0197] The non-calibration position CP2 may be a position in the storage device 171 of the head replacement device 17 described above. That is, the non-calibration position CP2 may be a position in the housing 173 in which the storage device 171 is stored (i.e., a position in the storage space 1730). In this case, the light measuring device 18b located at the non-calibration position CP2 may be stored in the storage device 171. The light measuring device 18b located at the non-calibration position CP2 may be stored in the storage space 1730. The light measuring device 18b located at the non-calibration position CP2 may be stored in a storage space different from the storage space 1730. On the other hand, the calibration position CP1 may be a position outside the storage device 171. That is, the calibration position CP1 may be a position outside the housing 173 (i.e., a position outside the storage space 1730).

[0198] In addition, when the head driving system 141 described above moves the processing head 13, the positional relationship between the processing head 13 (particularly the irradiation optical system 135 of the processing head 13) and the light measuring device 18b also changes. Therefore, the head driving system 141 can also be regarded as functioning as a changing device capable of changing at least one of the positional relationship and posture relationship between the processing head 13 (particularly the irradiation optical system 135) and the light measuring device 18b. In this case, the processing system SYSb can also use the head driving system 141 to move the processing head 13 in addition to or instead of using the measurement driving system 191b to move the light measuring device 18b, thereby relatively moving the light measuring device 18b between the calibration position CP1 and the non-calibration position CP2.

[0199] Refer again Fig.10 , the position measuring device 192b can measure the position of the light measuring device 18b under the control of the control unit 2. The position measuring device 192b may also include, for example, an interferometer (e.g., a laser interferometer). The position measuring device 192b may also include, for example, an encoder (as an example, at least one of a linear encoder and a rotary encoder). The position measuring device 192b may also include, for example, a potentiometer. In the case where the measurement drive system 191b uses a stepping motor as a drive source, the position measuring device 192b may also include, for example, a position detection device of an open-loop control method. The position detection device of the open-loop control method is a position detection device that measures the position of the light measuring device 18b by estimating the movement amount of the light measuring device 18b based on the accumulated value of the number of pulses used to drive the stepping motor.

[0200] (2-2) Structure of the optical measuring device 18b

[0201] Next, refer to Fig.12 The structure of the optical measuring device 18b will be described. Fig.12 2 is a cross-sectional view showing the structure of the optical measuring device 18 b .

[0202] like Fig.12 As shown, the optical measuring device 18b has a light beam passing component 181b, a light receiving element 182b, and a light receiving optical system 183b. The light beam passing component 181b is a component that forms a light passing area 184b through which at least one of the processing light EL and the measuring light ML can pass. The light receiving element 182b can receive at least one of the processing light EL and the measuring light ML that have passed through the light passing area 184b of the light beam passing component 181b. The light receiving element 182b is a sensor corresponding to the wavelength of the processing light EL and the wavelength of the measuring light ML. As an example of the light receiving element 182b, at least one of a photodetector, a CCD (Charge Coupled Device) sensor, a CMOS (Complementary Metal Oxide Semiconductor) sensor, and a sensor using an InGaAs (Indium, Gallium, Arsenic) element is listed. In the second embodiment, in particular, the light receiving element 182b may also be able to receive at least one of the processing light EL and the measuring light ML that have passed through the light passing area 184b of the light beam passing component 181b via the light receiving optical system 183b. Therefore, the light beam passing component 181b may be arranged above the light receiving optical system 183b, and the light receiving optical system 183b may be arranged above the light receiving element 182b. Alternatively, the light beam passing component 181b may be arranged between the processing head 13 and the light receiving optical system 183b, and the light receiving optical system 183b may be arranged between the light beam passing component 181b and the light receiving element 182b.

[0203] The light beam passing member 181b, the light receiving element 182b, and the light receiving optical system 183b may be arranged inside the recess 1801b (that is, the concave portion) formed in the base member 180b of the optical measuring device 18b. However, at least one of the light beam passing member 181b, the light receiving element 182b, and the light receiving optical system 183b may be arranged at an arbitrary position different from the recess 1801b.

[0204] The light beam passing component 181b includes a glass substrate 1811b and an attenuation film 1812b formed on at least a portion of the surface of the glass substrate 1811b. The attenuation film 1812b is a component that can attenuate the processing light EL and the measurement light ML incident on the attenuation film 1812b. The attenuation film 1812b may also include, for example, a chromium film or a chromium oxide film. In addition, the "attenuation of the processing light EL based on the attenuation film 1812b" in the second embodiment not only includes making the intensity of the processing light EL passing through the attenuation film 1812b lower than the intensity of the processing light EL incident on the attenuation film 1812b, but may also include blocking (i.e., shielding) the processing light EL incident on the attenuation film 1812b. Similarly, the "attenuation of the measurement light ML by the attenuation film 1812b" in the second embodiment includes not only making the intensity of the measurement light ML passing through the attenuation film 1812b smaller than the intensity of the measurement light ML incident on the attenuation film 1812b, but also may include shielding (i.e., shielding) the measurement light ML incident on the attenuation film 1812b. Therefore, when the processing light EL is incident on the attenuation film 1812b, the processing light EL attenuated by the attenuation film 1812b may be incident on the light receiving element 182b via the attenuation film 1812b, or the processing light EL may not be incident on the light receiving element 182b because it is shielded by the attenuation film 1812b. Similarly, when the measurement light ML is incident on the attenuation film 1812b, the measurement light ML attenuated by the attenuation film 1812b may be incident on the light receiving element 182b via the attenuation film 1812b, or the measurement light ML may not be incident on the light receiving element 182b because it is shielded by the attenuation film 1812b. Therefore, the attenuation film 1812b can also be called a light-shielding film.

[0205] At least one opening 1813b is formed in the attenuation film 1812b. Fig.12 In the example shown, a plurality of openings 1813b are formed in the attenuation film 1812b. The openings 1813b are through holes that penetrate the attenuation film 1812b in the Z-axis direction. Therefore, when the processing light EL is incident on the openings 1813b formed in the attenuation film 1812b, the processing light EL passes through the light beam passing member 181b via the openings 1813b. That is, the processing light EL is not attenuated or shielded by the attenuation film 1812b, but is incident on the light receiving element 182b via the openings 1813b. Similarly, when the measurement light ML is incident on the openings 1813b formed in the attenuation film 1812b, the measurement light ML passes through the light beam passing member 181b via the openings 1813b. That is, the measurement light ML is not attenuated or shielded by the attenuation film 1812b, but is incident on the light receiving element 182b via the openings 1813b.

[0206] In this way, the portion of the light beam passing member 181b where the attenuation film 1812b is not formed (i.e., the portion where the opening 1813b is formed) functions as the light passing region 184b through which the processing light EL and the measuring light ML pass respectively. Therefore, in the light beam passing member 181b, the light passing region 184b is formed through the opening 1813b. In the case where a plurality of openings 1813b are formed, a plurality of light passing regions 184b may be formed on the light beam passing member 181b through the plurality of openings 1813b.

[0207] The light passing region 184b may also have a prescribed shape in a plane along the surface of the light beam passing component 181b (typically the XY plane). That is, the opening 1813b forming the light passing region 184b may also have a prescribed shape in a plane along the surface of the light beam passing component 181b (typically the XY plane). At this time, the light passing region 184b may also form a mark (i.e., a pattern) having a prescribed shape corresponding to the shape of the light passing region 184b in a plane along the surface of the light beam passing component 181b (typically the XY plane). That is, a mark (i.e., a pattern) having a prescribed shape may also be formed on the light beam passing component 181b using the light passing region 184b formed by the opening 1813b of a prescribed shape. For example, Fig.13 As shown, a light passing area 184b forming a search mark 185b as an example of a mark may be formed in the light beam passing component 181b. The light passing area 184b forming the search mark 185b may also include two first linear light passing areas 184b-1 and one second linear light passing area 184b-2. The two first linear light passing areas 184b-1 may also extend along the first direction respectively. The two first linear light passing areas 184b-1 may also be separated along a third direction perpendicular to the first direction. A second linear light passing area 184b-2 may also be located between the two first linear light passing areas 184b-1. A second linear light passing area 184b-2 may also extend along a second direction that is inclined relative to the first direction (i.e., obliquely intersecting). That is, the light passing region 184b forming the search mark 185b may also be formed by two first linear openings 1813b-1 extending along the first direction and separated along a third direction perpendicular to the first direction, and a second linear opening 1813b-2 located between the two first linear openings 1813b-1 and extending along a second direction inclined with respect to the first direction (that is, obliquely intersecting). Fig.13In the example shown, the light passing region 184b forming the search mark 185b includes two first linear light passing regions 184b-1 extending in the Y-axis direction and separated in the X-axis direction perpendicular to the Y-axis direction, and a second linear light passing region 184b-2 extending in a direction inclined with respect to the X-axis direction (i.e., obliquely intersecting). Fig.13 In the example shown, the light-passing area 184b forming the search mark 185b is formed by two first linear openings 1813b-1 extending along the Y-axis direction and separated along the X-axis direction perpendicular to the Y-axis direction, and a second linear opening 1813b-2 extending in a direction inclined relative to the X-axis direction (i.e., obliquely crossed).

[0208] In addition, as an example of the angle between the second linear opening 1813b-2 and the X-axis, at least one of 75 degrees, 60 degrees, 45 degrees, 30 degrees and 15 degrees can be listed. The angle between the second linear opening 1813b-2 and the X-axis can also be an angle different from the angle exemplified here. Furthermore, the second linear opening 1813b-2 extending in a direction inclined (i.e., obliquely intersecting) with respect to the X-axis direction is also inclined with respect to the Y-axis direction.

[0209] As an example of the angle between the second linear opening 1813b-2 and the Y-axis, at least one of 75 degrees, 60 degrees, 45 degrees, 30 degrees and 15 degrees can be listed. The angle between the second linear opening 1813b-2 and the Y-axis can also be an angle different from the angle exemplified here. The angle between the second linear opening 1813b-2 and the Y-axis can also be the same as the angle between the second linear opening 1813b-2 and the X-axis. The angle between the second linear opening 1813b-2 and the Y-axis can be different from the angle between the second linear opening 1813b-2 and the X-axis.

[0210] The light passing region 184b forming the search mark 185b may also include two third linear light passing regions 184b-3 arranged in a direction intersecting with the direction in which the two first linear light passing regions 184b-1 are arranged. That is, the light passing region 184b may also include two linear openings 1813b-3 forming the two third linear light passing regions 184b-3. The two third linear light passing regions 184b-3 may also extend in directions intersecting with the direction in which the first linear light passing region 184b-1 extends, respectively. The two third linear light passing regions 184b-3 may also be separated in the direction in which the first linear light passing region 184b-1 extends. The second linear light passing region 184b-2 may also be located between the two third linear light passing regions 184b-3.

[0211] The length (i.e., the dimension in the length direction) of the first linear light-passing area 184b-1 forming the search mark 185b is, for example, 0.1 mm to 1.0 mm, but may also be other lengths. The width (i.e., the dimension in the short side direction) of the first linear light-passing area 184b-1 forming the search mark 185b is, for example, several μm, but may also be other widths. The width (i.e., the dimension in the short side direction) of the second linear light-passing area 184b-1 forming the search mark 185b is, for example, several μm, but may also be other widths. The dimension of the search mark 185b (e.g., the dimension of at least one of the X-axis direction and the Y-axis direction) is, for example, 0.1 mm to several mm, but may also be other dimensions. The distance between the two first linear light-passing areas 184b-1 forming the search mark 185b is, for example, 0.1 mm to several mm, but may also be other distances. The angle formed by the first linear light-passing area 184b-1 and the second linear light-passing area 184b-2 inclined relative to the first linear light-passing area 184b-1 is 10 to 20 degrees (for example, 15 degrees), but may be other angles.

[0212] A plurality of search marks 185b (or a plurality of arbitrary marks, the same below) may also be formed on the light beam passing member 181b. That is, a plurality of light passing regions 184b forming a plurality of search marks 185b (or a plurality of arbitrary marks) may also be formed on the light beam passing member 181b. For example, Fig.14 As shown, a plurality of search marks 185b distributed in a matrix can also be formed in the light beam passing component 181b. Fig.14 In the example shown, a plurality of search marks 185b are formed on the light beam passing member 181b and are regularly arranged along the X-axis direction and the Y-axis direction.

[0213] The plurality of search marks 185b may also include at least two search marks 185b where the second linear opening 1813b-2 forms different angles with the X-axis. The plurality of search marks 185b may also include at least two search marks 185b where the second linear opening 1813b-2 forms different angles with the Y-axis. The plurality of search marks 185b may also include at least two search marks 185b where the second linear opening 1813b-2 forms the same angle with the X-axis. The plurality of search marks 185b may also include at least two search marks 185b where the second linear opening 1813b-2 forms the same angle with the Y-axis.

[0214] When a plurality of (that is, two or more than three) search marks 185b are formed on the light beam passing member 181b, the processing unit 1b may sequentially irradiate the processing light EL to at least two different search marks 185b during the calibration period. Similarly, the processing unit 1b may sequentially irradiate the measuring light ML to at least two different search marks 185b during the calibration period.

[0215] The size of the mark forming area 186b where the plurality of search marks 185b are formed on the light beam passing member 181b is smaller than or equal to the size of at least one of the processing shot area PSA and the measurement shot area MSA. As a result, the processing unit 1b can sequentially irradiate the processing light EL to the plurality of search marks 185b using at least one of the galvanometer mirrors 1313 and 1341 while the positional relationship between the processing head 13 (particularly the irradiation optical system 135) and the light measuring device 18b is fixed. That is, the processing unit 1b can sequentially irradiate the processing light EL to the plurality of search marks 185b distributed in the mark forming area 186b where the irradiation position PA of the processing light EL can be set using at least one of the galvanometer mirrors 1313 and 1341 by changing the irradiation position PA of the processing light EL within the processing shot area PSA set on the light beam passing member 181b. Similarly, the machining unit 1b can sequentially irradiate the measurement light ML onto the plurality of search marks 185b using at least one of the galvanometer mirrors 1328 and 1341, while the positional relationship between the machining head 13 (particularly the irradiation optical system 135) and the optical measuring device 18b is fixed. That is, the machining unit 1b can sequentially irradiate the measurement light ML onto the plurality of search marks 185b distributed in the mark forming area 186b where the irradiation position MA of the measurement light ML can be set using at least one of the galvanometer mirrors 1328 and 1341, by changing the irradiation position MA of the measurement light ML within the measurement shot area MSA set on the light beam passing member 181b. However, the size of the mark forming area 186b where the plurality of search marks 185b are formed on the light beam passing member 181b may be larger than the size of at least one of the machining shot area PSA and the measurement shot area MSA.

[0216] In addition, the position of the optical measuring device 18b when at least one of the processing shot area PSA and the measurement shot area MSA overlaps with at least a portion of the mark forming area 186b may be referred to as a calibration position CP1. The position of the optical measuring device 18b when the processing shot area PSA and the measurement shot area MSA do not overlap with the mark forming area 186b may be referred to as a non-calibration position CP2.

[0217] When the processing unit 1b sequentially irradiates the processing light EL to at least two search marks 185b, the light receiving element 182b may receive the processing light EL that has passed through the at least two search marks 185b. Fig.15 yes Fig.14 The sectional view taken along the line AA' of FIG. 1 is a sectional view showing five search marks 185b (specifically, search marks 185b#1 to 185b#5) that are sequentially irradiated with the processing light EL by the processing unit 1b. Fig.15 As shown, the light receiving element 182b can also receive the processing light EL that passes through the search mark 185b#1, receive the processing light EL that passes through the search mark 185b#2, receive the processing light EL that passes through the search mark 185b#3, receive the processing light EL that passes through the search mark 185b#4, and receive the processing light EL that passes through the search mark 185b#5.

[0218] Although detailed description is omitted to avoid duplication, even when the machining unit 1b sequentially irradiates the at least two search marks 185b with the measurement light ML, the light receiving element 182b can also receive the measurement light ML that has passed through the at least two search marks 185b.

[0219] In this case, the light receiving optical system 183b may also change the traveling direction of the processing light EL that has passed through the at least two search marks 185b respectively, so that the processing light EL that has passed through the at least two search marks 185b formed at different positions on the light beam passing member 181b is directed toward the same light receiving element 182b. Fig.15As shown, the light receiving optical system 183b may also emit the processing light EL that has passed through the search mark 185b#1 from the first emission part RP#1 of the light receiving optical system 183b toward the light receiving element 182b. As a result, the processing light EL emitted from the first emission part RP#1 of the light receiving optical system 183b may also be incident on the light receiving element 182b through the optical path from the first emission part RP#1 toward the light receiving element 182b. In addition, the light receiving optical system 183b may also emit the processing light EL that has passed through the search mark 185b#2 from the second emission part RP#2 of the light receiving optical system 183b that is different from the first emission part RP#1 toward the light receiving element 182b. As a result, the processing light EL emitted from the second emission part RP#2 of the light receiving optical system 183b may also be incident on the light receiving element 182b through the optical path from the second emission part RP#2 toward the light receiving element 182b. In addition, the light receiving optical system 183b may emit the processing light EL having passed through the search mark 185b#3 from the first emission portion RP#1 toward the third emission portion RP#3 of the light receiving optical system 183b which is different from the second emission portion RP#2 toward the light receiving element 182b. As a result, the processing light EL emitted from the third emission portion RP#3 of the light receiving optical system 183b may also be incident on the light receiving element 182b through the optical path from the third emission portion RP#3 toward the light receiving element 182b. In addition, the light receiving optical system 183b may emit the processing light EL having passed through the search mark 185b#4 from the fourth emission portion RP#4 of the light receiving optical system 183b which is different from the first emission portion RP#1 to the third emission portion RP#3 toward the light receiving element 182b. As a result, the processing light EL emitted from the fourth emission part RP#4 of the light receiving optical system 183b can also enter the light receiving element 182b through the optical path from the fourth emission part RP#4 toward the light receiving element 182b. In addition, the light receiving optical system 183b can also emit the processing light EL that has passed through the search mark 185b#5 from the fifth emission part RP#5 of the light receiving optical system 183b that is different from the first emission part RP#1 to the fourth emission part RP#4 toward the light receiving element 182b. As a result, the processing light EL emitted from the fifth emission part RP#5 of the light receiving optical system 183b can also enter the light receiving element 182b through the optical path from the fifth emission part RP#5 toward the light receiving element 182b. As a result, the light receiving element 182b can appropriately receive the processing light EL that has passed through at least two search marks 185b via the light receiving optical system 183b. Therefore, the light measuring device 18b does not need to include at least two light receiving elements 182b for receiving the processing light EL that has passed through at least two search marks 185b, respectively. In other words, the light measuring device 18b only needs to include a single light receiving element 182b for receiving the processing light EL that has passed through at least two search marks 185b, respectively.In this case, the light receiving optical system 183b can also be regarded as a focusing optical system that focuses the processing light EL that has passed through the light beam passing member 181b on the light receiving element 182b. In this way, the light (processing light EL, measurement light ML) from a plurality of search marks 185b at different positions in space is guided to the same position on the light receiving element 182b by the light receiving optical system 183b, and is therefore not easily affected by the in-plane difference in sensitivity of the light receiving element 182b.

[0220] Although detailed description is omitted to omit repeated description, in the case where the processing unit 1b sequentially irradiates the measuring light ML to at least two search marks 185b, the light receiving optical system 183b may also change the traveling direction of the measuring light ML that has passed through at least two search marks 185b respectively, so that the measuring light ML that has passed through at least two search marks 185b formed at different positions on the light beam passing component 181b is directed toward the same light receiving element 182b.

[0221] When both the processing light EL and the measuring light ML are incident on the light receiving element 182b via the light receiving optical system 183b, the influence of chromatic aberration may occur. Therefore, the light measuring device 18b may also have an optical component for reducing the influence of chromatic aberration. As an example of an optical component for reducing the influence of chromatic aberration, an achromatic lens can be cited. As an example of an optical component for reducing the influence of chromatic aberration, a dichroic mirror can be cited. When a dichroic mirror is used, the dichroic mirror can also separate the processing light EL that has passed through the light receiving optical system 183b from the measuring light ML that has passed through the light receiving optical system 183b. The processing light EL and the measuring light ML separated by the dichroic mirror can also be received by two different light receiving elements 182b, respectively.

[0222] In addition, the light measuring device 18b may not have a single light receiving element as the light receiving element 182b. The light measuring device 18b may have any light receiving element 182b as long as it can determine one search mark 185b irradiated with the processing light EL and the measuring light ML, respectively, based on the light receiving result of the light receiving element 182b. For example, the light measuring device 18b may have a two-dimensional sensor as the light receiving element 182b. For example, the light measuring device 18b may have a two-dimensional sensor in which a plurality of light receiving elements are arranged in a matrix as the light receiving element 182b. For example, the light measuring device 18b may have a two-dimensional sensor including a light receiving surface extending in a two-dimensional shape as the light receiving element 182b.

[0223] If the workpiece W is processed by irradiation with the processing light EL, it is possible that at least a part of the light measuring device 18b is also processed (substantially destroyed) by the irradiation with the processing light EL. Therefore, the control unit 2 may control the intensity of the processing light EL (for example, the energy per unit area in the plane intersecting the traveling direction of the processing light EL) so that the intensity of the processing light EL irradiated to the light measuring device 18b (for example, the energy per unit area in the light receiving surface of the light receiving element 182b) is smaller than the intensity of the processing light EL irradiated to the workpiece W for processing the workpiece W (for example, the energy per unit area in the surface of the workpiece W). At this time, the control unit 2 may control the intensity of the processing light EL by controlling the processing light source 11 itself. Alternatively, the control unit 2 may control the intensity of the processing light EL by controlling a dimming component (not shown) disposed on the emission side of the processing light source 11. As a result, the possibility of the light measuring device 18b being destroyed by the irradiation with the processing light EL is reduced or eliminated.

[0224] (2-3) Calibration Operation Using the Optical Measuring Device 18b

[0225] Next, the calibration operation performed using the optical measuring device 18b will be described. In particular, the flow of the calibration operation will be described below.

[0226] (2-3-1) Movement of the optical measuring device 18b

[0227] First, as mentioned above Fig.11 As shown in (a), the measurement drive system 191b moves the light measuring device 18b so that the light measuring device 18b is located at the calibration position CP1 where the light measuring device 18b can receive at least one of the processing light EL and the measurement light ML. That is, the measurement drive system 191b moves the light measuring device 18b so that the position of the light measuring device 18b is changed from the non-calibration position CP2 to the calibration position CP1.

[0228] Here, in the Z-axis direction, the calibration position CP1 may be set at the surface of the workpiece W to be irradiated with the processing light EL in order to process the workpiece W, that is, the processing surface or its vicinity. For example, if it is considered that the workpiece W placed on the mounting surface 151 of the worktable 15 is processed by irradiating the processing light EL, the processing surface of the workpiece W is located above the mounting surface 151 (that is, on the +Z side). Therefore, the calibration position CP1 where the light measuring device 18b is located may also be a position above the mounting surface 151 of the worktable 15. That is, the calibration position CP1 may also be a position between the mounting surface 151 of the worktable 15 and the processing head 13 (particularly the irradiation optical system 135).

[0229] However, in the Z-axis direction, the calibration position CP1 may be the same position as the mounting surface 151 of the worktable 15. Alternatively, in the Z-axis direction, the calibration position CP1 may be a position below the mounting surface 151 of the worktable 15 (i.e., the -Z side). In this case, the machining system SYSb can also change the calibration position CP1 where the optical measuring device 18b is located in the Z-axis direction by rotating the worktable 15 around at least one of the rotation axis along the X-axis direction (i.e., the A-axis) and the rotation axis along the Y-axis direction (i.e., the B-axis). Alternatively, the machining system SYSb can change the calibration position CP1 where the optical measuring device 18b is located in the Z-axis direction by moving the worktable 15 in the Z-axis direction. Therefore, the machining system SYSb can bring the calibration position CP1 close to the machining surface of the workpiece W during at least a portion of the calibration period.

[0230] In addition, in at least one of the X-axis direction and the Y-axis direction, the calibration position CP1 may be the same position as the reference position of the worktable 15. Alternatively, the calibration position CP1 may be a position different from the reference position of the worktable 15. The reference position of the worktable 15 may also be the center position of the moving stroke of the worktable 15. When the worktable 15 rotates around the rotation axis (i.e., C-axis) along the Z-axis direction, the reference position of the worktable 15 may also be a position on the C-axis. The reference position of the worktable 15 may also be the position of the machining origin of the machining head 13.

[0231] However, when the irradiation optical system 135 emits the processing light EL by reflecting the processing light EL using a reflector, the irradiation position PA of the processing light EL emitted from the irradiation optical system 135 via at least one of the galvanometer reflectors 1313 and 1341 may vary depending on the positional relationship between the processing head 13 (particularly the irradiation optical system 135) and the workpiece W. Similarly, when the irradiation optical system 135 emits the measuring light ML by reflecting the measuring light ML using a reflector, the irradiation position MA of the measuring light ML emitted from the irradiation optical system 135 via at least one of the galvanometer reflectors 1328 and 1341 may vary depending on the positional relationship between the processing head 13 (particularly the irradiation optical system 135) and the workpiece W. In this case, the calibration position CP1 may be the same position as the reference position of the worktable 15 in at least one of the X-axis direction and the Y-axis direction. As a result, even when the irradiation position PA of the machining light EL and the irradiation position MA of the measuring light ML may vary depending on the positional relationship between the machining head 13 (particularly the irradiation optical system 135 ) and the workpiece W, the machining system SYSb can appropriately perform the calibration operation.

[0232] In addition, if Fig.11As shown in FIG. 1 , the processing system SYSb may also include a limiting member 4b that limits the light measuring device 18b so that the light measuring device 18b is located at the calibration position CP1. As an example of the limiting member 4b, a stopper that limits the movement of the light measuring device 18b by contacting the light measuring device 18b located at the calibration position CP1 can be cited. In this case, the measurement drive system 191b can appropriately move the light measuring device 18b so that the light measuring device 18b is located at the calibration position CP1.

[0233] Furthermore, the head driving system 141 moves the processing head 13 so that the processing head 13 is located at a position where the processing head 13 can irradiate the processing light EL to the light measuring device 18b located at the calibration position CP1. In this case, the control unit 2 may calculate the position of the light measuring device 18b based on the measurement result of the position measuring device 192b, and control the head driving system 141 so that the processing head 13 moves toward the position where the processing head 13 can irradiate the processing light EL to the light measuring device 18b located at the calculated position.

[0234] The light measuring device 18b may also be moved to the space below the workbench 15. The light measuring device 18b may also be arranged in the space below the workbench 15. In this case, the workbench 15 may also be moved at the timing when the processing head 13 irradiates at least one of the processing light EL and the measuring light ML to the light measuring device 18b. Specifically, the workbench 15 may also be moved from the position above the light measuring device 18b to another position. For example, the workbench 15 may also be moved from the position above the light measuring device 18b to another position by moving along at least one of the X-axis direction and the Y-axis direction. For example, the workbench 15 may also be moved from the position above the light measuring device 18b to another position by rotating around a rotation axis along at least one of the X-axis direction and the Y-axis direction. As a result, the light measuring device 18b hidden in the workbench 15 is exposed. Therefore, the processing head 13 can irradiate at least one of the processing light EL and the measuring light ML to the light measuring device 18b.

[0235] (2-3-2) Irradiation of the Processing Light EL and the Measuring Light ML on the Light Measuring Device 18b

[0236] Thereafter, the machining head 13 may irradiate the light measuring device 18b with the machining light EL under the control of the control unit 2. Specifically, the machining head 13 may irradiate the light measuring device 18b with the machining light EL.

[0237] In the second embodiment, in particular, the processing head 13 may irradiate the processing light EL to at least one search mark 185b in a state where the positional relationship between the processing head 13 (particularly the irradiation optical system 135) and the light measuring device 18b is fixed. In this case, the processing head 13 may move the irradiation position PA of the processing light EL on the light beam passing member 181b using at least one of the galvanometer mirrors 1313 and 1341, thereby irradiating the processing light EL to the desired search mark 185b. Specifically, the control unit 2 may generate a galvanometer control signal for controlling at least one of the galvanometer mirrors 1313 and 1341 to irradiate the processing light EL to the desired search mark 185b. Thereafter, the processing head 13 may control at least one of the galvanometer mirrors 1313 and 1341 based on the galvanometer control signal, thereby irradiating the processing light EL to the desired search mark 185b.

[0238] like Fig.16 As shown, the processing head 13 may also irradiate the processing light EL to the search mark 185b along the first scanning direction in which two first linear light passing regions 184b-1 and one second linear light passing region 184b-2 constituting the search mark 185b are arranged. In other words, the processing head 13 may also irradiate the processing light EL to the search mark 185b along the first scanning direction by moving the irradiation position PA of the processing light EL along the first scanning direction. Fig.16 In the example shown, the first scanning direction is the X-axis direction. Therefore, the machining head 13 may irradiate the search mark 185b with the machining light EL by moving the irradiation position PA of the machining light EL along the X-axis direction.

[0239] The processing head 13 may also irradiate the processing light EL to the search mark 185b along the second scanning direction in which two third linear light passing regions 184b-3 and one second linear light passing region 184b-2 constituting the search mark 185b are arranged. That is, the processing head 13 may also irradiate the processing light EL to the search mark 185b along the second scanning direction by moving the irradiation position PA of the processing light EL along the second scanning direction. Fig.16 In the example shown, the second scanning direction is the Y-axis direction. Therefore, the machining head 13 may irradiate the search mark 185b with the machining light EL by moving the irradiation position PA of the machining light EL along the Y-axis direction.

[0240] When the difference between the moving accuracy of the irradiation position PA in the first scanning direction and the moving accuracy of the irradiation position PA in the second scanning direction is less than the allowable amount, the processing head 13 may move the irradiation position PA along either the first or second scanning direction without moving the irradiation position PA along either the first or second scanning direction. In this case, the irradiation position information described later generated when the irradiation position PA is moved along either the first scanning direction or the second scanning direction may be used as information related to the irradiation position PA moving along the first scanning direction or as information related to the irradiation position PA moving along the second scanning direction. In addition, when the processing head 13 moves the irradiation position PA along the first scanning direction (X-axis direction), the angle between the second linear opening 1813b-2 and the Y-axis may be less than 45 degrees. When the processing head 13 moves the irradiation position PA along the second scanning direction (Y-axis direction), the angle between the second linear opening 1813b-2 and the X-axis may be less than 45 degrees.

[0241] When the difference between the moving accuracy of the irradiation position PA in the first scanning direction and the moving accuracy of the irradiation position PA in the second scanning direction exceeds the allowable amount, the processing head 13 may also move the irradiation position PA along the first and second scanning directions, respectively. In this case, the irradiation position information described later generated when the irradiation position PA is moved along the first scanning direction may be used as information related to the irradiation position PA moving along the first scanning direction, but may not be used as information related to the irradiation position PA moving along the second scanning direction. The irradiation position information described later generated when the irradiation position PA is moved along the second scanning direction may be used as information related to the irradiation position PA moving along the second scanning direction, but may not be used as information related to the irradiation position PA moving along the first scanning direction. In addition, when the difference between the moving accuracy of the irradiation position PA in the first scanning direction and the moving accuracy of the irradiation position PA in the second scanning direction is less than the allowable amount, the angle formed by the second linear opening 1813b-2 and the Y axis may be the same as the angle formed by the second linear opening 1813b-2 and the X axis. For example, the angle between the second linear opening 1813 b - 2 and the Y axis and the angle between the second linear opening 1813 b - 2 and the X axis may be 45 degrees.

[0242] In the case where at least two search marks 185b are formed with different angles between the second linear opening 1813b-2 and the X-axis as described above, even when the difference between the moving accuracy of the irradiation position PA in the first scanning direction and the moving accuracy of the irradiation position PA in the second scanning direction exceeds the allowable amount, the processing head 13 can move the irradiation position PA along either the first scanning direction or the second scanning direction without moving the irradiation position PA along either the first scanning direction or the second scanning direction. In this case, the irradiation position information described later generated when the irradiation position PA is moved along either the first scanning direction or the second scanning direction can be used as information related to the irradiation position PA moving along the first scanning direction or as information related to the irradiation position PA moving along the second scanning direction.

[0243] The control unit 2 may move the irradiation position PA along one scanning direction using at least one of the galvanometer mirrors 1313 and 1341, while moving the light measuring device 18b along the same scanning direction. The control unit 2 may move the irradiation position PA toward one moving direction using at least one of the galvanometer mirrors 1313 and 1341, while moving the light measuring device 18b toward the same moving direction. In this case, the control unit 2 may control at least one of the galvanometer mirrors 1313 and 1341 and the light measuring device 18b so that the moving speed of the irradiation position PA on the light beam passing member 181b based on at least one of the galvanometer mirrors 1313 and 1341 is faster than the moving speed of the irradiation position PA on the light beam passing member 181b based on the movement of the light measuring device 18b. As a result, the light receiving time of the light receiving element 182b that can receive the processing light EL becomes longer than when the light measuring device 18b does not move. Therefore, the SN ratio of the light receiving element 182b can be improved. For example, when the scanning mirror of at least one of the galvanometer mirrors 1313 and 1341 needs to be rotated at a relatively high speed because at least one of the galvanometer mirrors 1313 and 1341 has speed dependence, the light receiving time becomes shorter. Even in such a case, the processing system SYSb can extend the light receiving time by moving the light measuring device 18b. Therefore, the SN ratio of the light receiving element 182b can be improved.

[0244] The control unit 2 may also control the moving speed of the irradiation position PA on the light beam passing component 181b (i.e., the scanning speed of the processing light EL). For example, the control unit 2 may also set the moving speed of the irradiation position PA on the light beam passing component 181b to a first speed faster than the second speed, thereby shortening the time required for measuring the processing light EL compared to the case where the moving speed of the irradiation position PA is set to the second speed. For example, the control unit 2 may also set the moving speed of the irradiation position PA on the light beam passing component 181b to a second speed slower than the first speed, thereby improving the measurement accuracy of the processing light EL compared to the case where the moving speed of the irradiation position PA is set to the first speed.

[0245] When a plurality of search marks 185b are formed on the optical measuring device 18b as described above, the processing head 13 may sequentially irradiate the processing light EL to the plurality of search marks 185b. That is, the processing head 13 may sequentially irradiate the processing light EL to the plurality of search marks 185b along the direction in which the light beam formed with the plurality of search marks 185b passes through the surface of the component 181b. In other words, the processing head 13 may sequentially scan the plurality of search marks 185b with the processing light EL. That is, the processing head 13 may sequentially scan the plurality of search marks 185b with the processing light EL along the direction in which the light beam formed with the plurality of search marks 185b passes through the surface of the component 181b.

[0246] like Fig.16 As shown, the processing head 13 may also sequentially irradiate the processing light EL to the plurality of search marks 185b along the scanning direction. In other words, the processing head 13 may also sequentially irradiate the processing light EL to the plurality of search marks 185b along the scanning direction by moving the irradiation position PA of the processing light EL along the scanning direction. Fig.16 In the example shown, the scanning direction is the X-axis direction. Therefore, the machining head 13 may sequentially irradiate the plurality of search marks 185b with the machining light EL by moving the irradiation position PA of the machining light EL along the X-axis direction.

[0247] like Fig.16As shown, when the mark group MG including the plurality of search marks 185b arranged along the scanning direction (e.g., the X-axis direction) is formed in a plurality in a direction intersecting the scanning direction (e.g., the Y-axis direction), the processing head 13 may also repeatedly perform the action of sequentially irradiating the plurality of search marks 185b included in each mark group MG with the plurality of mark groups MG as the target. For example, the processing head 13 may sequentially irradiate the plurality of search marks 185b included in the first mark group MG#1 with the processing light EL, sequentially irradiate the plurality of search marks 185b included in the second mark group MG#2 with the processing light EL, sequentially irradiate the plurality of search marks 185b included in the third mark group MG#3 with the processing light EL, and sequentially irradiate the plurality of search marks 185b included in the fourth mark group MG#4 with the processing light EL.

[0248] When the processing light EL is irradiated to the search mark 185b, the light receiving element 182b receives the processing light EL that has passed through the light passing area 184b forming the search mark 185b. That is, the light receiving element 182b receives the processing light EL that has passed through the search mark 185b. The light receiving element 182b receives the processing light EL that has passed through the search mark 185b. As a result, the light receiving element 182b receives the processing light EL that has passed through one of the two first linear light passing areas 184b-1 constituting the search mark 185b, and then receives the processing light EL that has passed through the second linear light passing area 184b-2 constituting the search mark 185b, and then receives the processing light EL that has passed through the other of the two first linear light passing areas 184b-1 constituting the search mark 185b. Therefore, as shown in the graph representing the result of the light receiving element 182b receiving the processing light EL Fig.17 As shown, the light receiving element 182b outputs a light receiving signal including a pulse signal, as light receiving information indicating a light receiving result, wherein a pulse waveform P1 corresponding to the processing light EL that has passed through one of the two first linear light passing regions 184b-1, a pulse waveform P2 corresponding to the processing light EL that has passed through the second linear light passing region 184b-2, and a pulse waveform P3 corresponding to the processing light EL that has passed through the other of the two first linear light passing regions 184b-1 appear in sequence. When the processing light EL is sequentially irradiated onto the plurality of search marks 185b, the light receiving element 182b outputs a light receiving signal including a pulse signal in which the plurality of pulse waveforms P1 to P3 appear in sequence, as light receiving information indicating a light receiving result.

[0249] Furthermore, the machining head 13 may irradiate the light measuring device 18b with the measuring light ML in addition to or instead of irradiating the light measuring device 18b with the machining light EL under the control of the control unit 2. Specifically, the machining head 13 may irradiate the measuring light ML with at least one search mark 185b formed on the light measuring device 18b.

[0250] In the second embodiment, in particular, the processing head 13 may also irradiate the measuring light ML to at least one search mark 185b in a state where the positional relationship between the processing head 13 (particularly the irradiation optical system 135) and the optical measuring device 18b is fixed. In this case, the processing head 13 may also use at least one of the galvanometer mirrors 1328 and 1341 to move the irradiation position PA of the measuring light ML on the light beam passing member 181b, thereby irradiating the measuring light ML to the desired search mark 185b. Specifically, the control unit 2 may also generate a galvanometer control signal for controlling at least one of the galvanometer mirrors 1328 and 1341 to irradiate the measuring light ML to the desired search mark 185b. Thereafter, the processing head 13 may also control at least one of the galvanometer mirrors 1328 and 1341 based on the galvanometer control signal, thereby irradiating the measuring light ML to the desired search mark 185b.

[0251] like Fig.16 As shown, the machining head 13 may also irradiate the measurement light ML toward the search mark 185b along the first scanning direction in which two first linear light passing regions 184b-1 and one second linear light passing region 184b-2 constituting the search mark 185b are arranged. That is, the machining head 13 may also irradiate the measurement light ML toward the search mark 185b along the first scanning direction by moving the irradiation position MA of the measurement light ML along the first scanning direction. Fig.16 In the example shown, the first scanning direction is the X-axis direction. Therefore, the machining head 13 may also irradiate the measurement light ML toward the search mark 185b by moving the irradiation position MA of the measurement light ML along the first X-axis direction.

[0252] The machining head 13 may also irradiate the search mark 185b with the measuring light ML along the second scanning direction in which the two third linear light passing regions 184b-3 and the second linear light passing region 184b-2 constituting the search mark 185b are arranged. That is, the machining head 13 may also irradiate the search mark 185b with the measuring light ML along the second scanning direction by moving the irradiation position MA of the measuring light ML along the second scanning direction. Fig.16 In the example shown, the third scanning direction is the Y-axis direction. Therefore, the machining head 13 may also irradiate the measurement light ML toward the search mark 185b by moving the irradiation position MA of the measurement light ML along the Y-axis direction.

[0253] When the difference between the moving accuracy of the irradiation position MA in the first scanning direction and the moving accuracy of the irradiation position MA in the second scanning direction is less than the allowable amount, the processing head 13 may move the irradiation position MA along either the first or second scanning direction without moving the irradiation position MA along either the first or second scanning direction. In this case, the irradiation position information described later generated when the irradiation position MA is moved along either the first scanning direction or the second scanning direction may be used as information related to the irradiation position MA moving along the first scanning direction or as information related to the irradiation position MA moving along the second scanning direction. In addition, when the processing head 13 moves the irradiation position MA along the first scanning direction (X-axis direction), the angle between the second linear opening 1813b-2 and the Y-axis may be less than 45 degrees. When the processing head 13 moves the irradiation position MA along the second scanning direction (Y-axis direction), the angle between the second linear opening 1813b-2 and the X-axis may be less than 45 degrees.

[0254] When the difference between the moving accuracy of the irradiation position MA in the first scanning direction and the moving accuracy of the irradiation position MA in the second scanning direction exceeds the allowable amount, the processing head 13 may move the irradiation position MA along the first and second scanning directions, respectively. In this case, the irradiation position information generated when the irradiation position MA is moved along the first scanning direction may be used as information related to the irradiation position MA moving along the first scanning direction, but may not be used as information related to the irradiation position MA moving along the second scanning direction. The irradiation position information generated when the irradiation position MA is moved along the second scanning direction may be used as information related to the irradiation position MA moving along the second scanning direction, but may not be used as information related to the irradiation position MA moving along the first scanning direction. In addition, when the difference between the moving accuracy of the irradiation position MA in the first scanning direction and the moving accuracy of the irradiation position MA in the second scanning direction is less than the allowable amount, the angle formed by the second linear opening 1813b-2 and the Y axis may be the same as the angle formed by the second linear opening 1813b-2 and the X axis. For example, the angle between the second linear opening 1813 b - 2 and the Y axis and the angle between the second linear opening 1813 b - 2 and the X axis may be 45 degrees.

[0255] In the case where at least two search marks 185b are formed with different angles between the second linear opening 1813b-2 and the X-axis as described above, even when the difference between the moving accuracy of the irradiation position MA in the first scanning direction and the moving accuracy of the irradiation position MA in the second scanning direction exceeds the allowable amount, the processing head 13 can move the irradiation position MA along either the first scanning direction or the second scanning direction without moving the irradiation position MA along either the first scanning direction or the second scanning direction. In this case, the irradiation position information described later generated when the irradiation position MA is moved along either the first scanning direction or the second scanning direction can be used as information related to the irradiation position MA moving along the first scanning direction or as information related to the irradiation position MA moving along the second scanning direction.

[0256] The control unit 2 may move the irradiation position MA along one scanning direction using at least one of the galvanometer mirrors 1328 and 1341 while moving the light measuring device 18b along the same scanning direction. The control unit 2 may move the irradiation position MA toward one moving direction using at least one of the galvanometer mirrors 1313 and 1341 while moving the light measuring device 18b toward the same moving direction. In this case, the control unit 2 may control at least one of the galvanometer mirrors 1313 and 1341 and the light measuring device 18b so that the moving speed of the irradiation position MA on the light beam passing member 181b based on at least one of the galvanometer mirrors 1328 and 1341 is faster than the moving speed of the irradiation position MA on the light beam passing member 181b based on the movement of the light measuring device 18b. As a result, the light receiving time that the light receiving element 182b can receive the measurement light ML becomes longer than when the light measuring device 18b does not move. Therefore, the SN ratio of the light receiving element 182b can be improved. For example, when the scanning mirror of at least one of the galvanometer mirrors 1328 and 1341 needs to be rotated at a relatively high speed because at least one of the galvanometer mirrors 1328 and 1341 has speed dependence, the light receiving time becomes shorter. Even in such a case, the processing system SYSb can extend the light receiving time by moving the light measuring device 18b. Therefore, the SN ratio of the light receiving element 182b can be improved.

[0257] The control unit 2 may also control the moving speed of the irradiation position MA on the light beam passing through the component 181b (i.e., the scanning speed of the processing light EL). For example, the control unit 2 may also set the moving speed of the irradiation position MA on the light beam passing through the component 181b to a first speed faster than the second speed, thereby shortening the time required for measuring the measurement light ML compared with the case where the moving speed of the irradiation position MA is set to the second speed. For example, the control unit 2 may also set the moving speed of the irradiation position MA on the light beam passing through the component 181b to a second speed slower than the first speed, thereby improving the measurement accuracy of the measurement light ML compared with the case where the moving speed of the irradiation position MA is set to the first speed.

[0258] When a plurality of search marks 185b are formed in the optical measuring device 18b as described above, the processing head 13 may sequentially irradiate the measurement light ML to the plurality of search marks 185b. That is, the processing head 13 may sequentially irradiate the measurement light ML to the plurality of search marks 185b along the direction in which the light beam formed with the plurality of search marks 185b passes through the surface of the component 181b. In other words, the processing head 13 may sequentially scan the plurality of search marks 185b with the measurement light ML. That is, the processing head 13 may sequentially scan the plurality of search marks 185b with the measurement light ML along the direction in which the light beam formed with the plurality of search marks 185b passes through the surface of the component 181b.

[0259] like Fig.16 As shown, the machining head 13 may also sequentially irradiate the measurement light ML to the plurality of search marks 185b along the scanning direction. That is, the machining head 13 may also sequentially irradiate the measurement light ML to the plurality of search marks 185b along the scanning direction by moving the irradiation position MA of the measurement light ML along the scanning direction. Fig.16 In the example shown, the scanning direction is the X-axis direction. Therefore, the machining head 13 may sequentially irradiate the plurality of search marks 185b with the measuring light ML by moving the irradiation position MA of the measuring light ML along the X-axis direction.

[0260] like Fig.16As shown, in the case where the mark group MG including the plurality of search marks 185b arranged along the scanning direction (e.g., the X-axis direction) is formed in a plurality along the direction intersecting the scanning direction (e.g., the Y-axis direction), the machining head 13 may also repeatedly perform the action of sequentially irradiating the plurality of search marks 185b included in each mark group MG with the plurality of mark groups MG as the object. For example, the machining head 13 may sequentially irradiate the plurality of search marks 185b included in the first mark group MG#1 with the measurement light ML, sequentially irradiate the plurality of search marks 185b included in the second mark group MG#2 with the measurement light ML, sequentially irradiate the plurality of search marks 185b included in the third mark group MG#3 with the measurement light ML, and sequentially irradiate the plurality of search marks 185b included in the fourth mark group MG#4 with the measurement light ML.

[0261] When the measurement light ML is irradiated to the search mark 185b, the light receiving element 182b receives the measurement light ML that has passed through the light passing area 184b forming the search mark 185b. That is, the light receiving element 182b receives the measurement light ML that has passed through the search mark 185b. The light receiving element 182b receives the measurement light ML that has passed through the search mark 185b. As a result, the light receiving element 182b receives the measurement light ML that has passed through one of the two first linear light passing areas 184b-1 constituting the search mark 185b, then receives the measurement light ML that has passed through the second linear light passing area 184b-2 constituting the search mark 185b, and then receives the measurement light ML that has passed through the other of the two first linear light passing areas 184b-1 constituting the search mark 185b. Therefore, as shown in the graph representing the result of the light receiving element 182b receiving the measurement light ML, Fig.17 As shown, the light receiving element 182b outputs a light receiving signal including a pulse signal, as light receiving information indicating a light receiving result, wherein the pulse signal sequentially appears a pulse waveform P1 corresponding to the measuring light ML passing through one of the two first linear light passing regions 184b-1, a pulse waveform P2 corresponding to the measuring light ML passing through the second linear light passing region 184b-2, and a pulse waveform P3 corresponding to the measuring light ML passing through the other of the two first linear light passing regions 184b-1. When the measuring light ML sequentially irradiates the plurality of search marks 185b, the light receiving element 182b outputs a light receiving signal including a pulse signal sequentially appearing a plurality of pulse waveforms P1 to P3 as light receiving information indicating a light receiving result.

[0262] in addition, Fig.17 Although the horizontal axis of the graph shows an example of the light receiving timing (i.e., time) of the processing light EL and the measuring light ML, the horizontal axis of the graph can also be regarded as indicating the positions of the processing light EL and the measuring light ML. Fig.17The above description can be made on the premise that the horizontal axis of the graph shown represents the respective positions of the processing light EL and the measuring light ML.

[0263] The machining head 13 does not irradiate the machining light EL and the measuring light ML to the light measuring device 18b at the same time. In this case, the machining head 13 may not irradiate the measuring light ML to the light measuring device 18b while irradiating the machining light EL to the light measuring device 18b. The machining head 13 may not irradiate the machining light EL to the light measuring device 18b while irradiating the measuring light ML to the light measuring device 18b. In this case, even if the light measuring device 18b has a single light receiving element 182b, the light receiving element 182b can appropriately receive the machining light EL that has passed through the search mark 185b and the measuring light ML that has passed through the search mark 185b. That is, the light receiving element 182b can output the light receiving information indicating the light receiving result of the machining light EL that has passed through the search mark 185b and the light receiving information indicating the light receiving result of the measuring light ML that has passed through the search mark 185b in an output manner that can be distinguished from each other.

[0264] However, the machining head 13 may irradiate the machining light EL and the measuring light ML to the light measuring device 18b at the same time. In this case, the machining head 13 may irradiate the measuring light ML to the same search mark 185b during at least a portion of the period during which the machining light EL is irradiated to the search mark 185b. Alternatively, the machining head 13 may irradiate the measuring light ML to another search mark 185b different from the one search mark 185b during at least a portion of the period during which the machining light EL is irradiated to the one search mark 185b.

[0265] In the case where the processing head 13 irradiates the processing light EL and the measuring light ML to the light measuring device 18b at the same time, the light measuring device 18b may include a plurality of light receiving elements 182b. For example, the light measuring device 18b may include a light receiving element 182b for receiving the processing light EL that has passed through the search mark 185b and a light receiving element 182b for receiving the measuring light ML that has passed through the search mark 185b. As a result, even in the case where the processing head 13 irradiates the processing light EL and the measuring light ML to the light measuring device 18b at the same time, the light measuring device 18b can output the light receiving information indicating the light receiving result of the processing light EL that has passed through the search mark 185b and the light receiving information indicating the light receiving result of the measuring light ML that has passed through the search mark 185b in an output format that can be distinguished from each other.

[0266] When the light measuring device 18b includes a light receiving element 182b for receiving the processing light EL and a light receiving element 182b for receiving the measuring light ML, the processing head 13 may irradiate the processing light EL and the measuring light ML to the light measuring device 18b at the same time. Alternatively, the processing head 13 may not irradiate the processing light EL and the measuring light ML to the light measuring device 18b at the same time.

[0267] (2-3-3) Generation (acquisition) of irradiation position information

[0268] Then, the control unit 2 calculates (in other words, obtains) at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measuring light ML based on the light reception information output from the light receiving element 182b. In other words, the control unit 2 generates (obtains) irradiation position information related to at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measuring light ML based on the light reception information.

[0269] (2-3-3-1) First Specific Example of Irradiation Position Information

[0270] The control unit 2 may generate information related to the relative positional relationship between the reference irradiation position BPA of the processing light EL and the actual irradiation position PA of the processing light EL (hereinafter referred to as "actual irradiation position APA") as the irradiation position information. Specifically, as described above, in order to perform the calibration operation, the processing head 13 irradiates the processing light EL to the one search mark 185b based on the galvanometer control signal for controlling at least one of the galvanometer mirrors 1313 and 1341 to irradiate the processing light EL to the one search mark 185b. The reference irradiation position BPA may also be an ideal irradiation position PA of the processing light EL (in other words, a designed or targeted irradiation position PA) when the processing head 13 irradiates the processing light EL to the one search mark 185b based on the galvanometer control signal for irradiating the processing light EL to the one search mark 185b. On the other hand, the actual irradiation position APA may also be the actual irradiation position PA of the processing light EL when the processing head 13 irradiates the processing light EL to the same one search mark 185b based on the same galvanometer control signal for irradiating the processing light EL to the same one search mark 185b. The light receiving information obtained by the calibration operation includes information related to the actual irradiation position APA. Therefore, the control unit 2 can also calculate the actual irradiation position APA based on the light receiving information. On the other hand, the information related to the reference irradiation position BPA can also be information known to the control unit 2. As a result, the control unit 2 can generate irradiation position information including information related to the relative position relationship between the reference irradiation position BPA and the actual irradiation position APA based on the light receiving information and the information related to the reference irradiation position BPA.

[0271] When the processing light EL is sequentially irradiated to the plurality of search marks 185b distributed in the processing shooting area PSA through the calibration operation as described above, the control unit 2 may also generate information related to the relative positional relationship between the reference irradiation position BPA and the actual irradiation position APA at the plurality of different positions in the processing shooting area PSA as the irradiation position information. Specifically, the control unit 2 may also generate information related to the relative positional relationship between the reference irradiation position BPA and the actual irradiation position APA at the positions of the plurality of search marks 185b distributed in the processing shooting area PSA as the irradiation position information.

[0272] The information related to the reference irradiation position BPA may also be generated in advance based on the light receiving information obtained by the processing unit 1b in the initial processing state irradiating the light measuring device 18b with the processing light EL before the calibration operation is performed. Therefore, the processing system SYSb may also perform an initial operation for generating information related to the reference irradiation position BPA before the calibration operation is performed.

[0273] Specifically, first, the state of the processing unit 1b is set to the initial processing state. The initial processing state of the processing unit 1b may also be a state in which, when a galvanometer control signal for controlling the galvanometer mirrors 1313 and 1341 to irradiate the processing light EL to a position in the processing shooting area PSA is input to the galvanometer mirrors 1313 and 1341, the processing unit 1b can actually irradiate the processing light EL to a position in the processing shooting area PSA. That is, the initial processing state of the processing unit 1b may also be a state in which the ideal irradiation position PA of the processing light EL indicated by the galvanometer control signal coincides with the actual irradiation position PA of the processing light EL emitted by the processing unit 1b that operates according to the galvanometer control signal.

[0274] In this case, in order to set the state of the processing unit 1b to the initial processing state, the control unit 2 may also adjust the sensitivity (driving amount) of at least one of the galvanometer mirrors 1313 and 1341 to the galvanometer control signal. In addition, in the case where the irradiation optical system 135 can be replaced as described above, the control unit 2 may adjust the sensitivity of at least one of the galvanometer mirrors 1313 and 1341 to the galvanometer control signal for each irradiation optical system 135. For example, in the case where the first irradiation optical system 135 is installed in the processing head 13, the control unit 2 may set the sensitivity of at least one of the galvanometer mirrors 1313 and 1341 to the first sensitivity corresponding to the first irradiation optical system 135. For example, in the case where the second irradiation optical system 135 different from the first irradiation optical system 135 is installed in the processing head 13, the control unit 2 may set the sensitivity of at least one of the galvanometer mirrors 1313 and 1341 to the second sensitivity corresponding to the second irradiation optical system 135. Alternatively, even when the irradiation optical system 135 is replaceable as described above, the control unit 2 may adjust the sensitivity of at least one of the galvanometer mirrors 1313 and 1341 to the galvanometer control signal to a predetermined sensitivity common to the plurality of irradiation optical systems 135 .

[0275] At the same time, the measurement drive system 191b moves the light measuring device 18b to the calibration position CP1 under the control of the control unit 2. Furthermore, the head drive system 141 moves the processing head 13 to a position where the processing head 13 can irradiate the processing light EL to the light measuring device 18b located at the calibration position CP1 under the control of the control unit 2. In this case, the control unit 2 may also obtain initial position information related to the relative positional relationship between at least one of the processing head 13 and the workbench 15 and the light measuring device 18b. Specifically, the control unit 2 may calculate the relative positional relationship between at least one of the processing head 13 and the workbench 15 and the light measuring device 18b based on the measurement results of at least one of the position measuring devices 142 and 162 and the measurement result of the position measuring device 192b. For example, the control unit 2 may also calculate the relative positional relationship between the light measuring device 18b located at the calibration position CP1 and the processing head 13 located at a position where the processing head 13 can irradiate the processing light EL to the light measuring device 18b located at the calibration position CP1 based on the respective measurement results of the position measuring devices 142 and 192b. The control unit 2 may also calculate the relative positional relationship between the light measuring device 18b located at the calibration position CP1 and the worktable 15 based on the respective measurement results of the position measuring device 162 and the position measuring device 192b. The initial position information obtained here may also be used to move the light measuring device 18b to the calibration position CP1 in the calibration operation. The initial position information may also be used to move the processing head 13b to a position where the processing head 13 can irradiate the processing light EL to the light measuring device 18b located at the calibration position CP1 in the calibration operation. The initial position information may also be used to move the worktable 15 in the calibration operation. That is, the processing system SYSb may also perform the calibration operation based on the initial position information obtained in the initial operation.

[0276] Then, the processing unit 1b irradiates the processing light EL to the light measuring device 18b. Specifically, the processing unit 1b irradiates the processing light EL to the desired search mark 185b formed on the light measuring device 18b. As a result, light receiving information indicating the light receiving result of the processing light EL that has passed the desired search mark 185b is output from the light measuring device 18b. The light receiving information includes information related to the actual irradiation position PA of the processing light EL at the desired position where the desired search mark 185b is located in the processing shooting area PSA. As described above, in the processing unit 1b in the initial processing state, the actual irradiation position PA of the processing light EL is consistent with the ideal irradiation position PA of the processing light EL. Therefore, the light receiving information includes information related to the ideal irradiation position PA (i.e., the reference irradiation position BPA) of the processing light EL at the desired position where the desired search mark 185b is located in the processing shooting area PSA. Therefore, the control unit 2 can generate information related to the reference irradiation position BPA based on the light receiving information obtained by the initial operation. Alternatively, the control unit 2 may use the light reception information acquired in the initial operation as the information on the reference irradiation position BPA.

[0277] In the initial operation, the processing unit 1b may irradiate the processing light EL to the plurality of search marks 185b formed on the light measuring device 18b. In this case, the control unit 2 can generate information related to the ideal irradiation position PA (i.e., the reference irradiation position BPA) of the processing light EL at the plurality of positions where the plurality of search marks 185b distributed in the processing shooting area PSA are respectively located, based on the light receiving information obtained through the initial operation.

[0278] The control unit 2 may also calculate the distance between the reference irradiation position BPA and the actual irradiation position APA along the direction of the light beam passing through the surface of the component 181b (in other words, the position offset) as the relative positional relationship between the reference irradiation position BPA and the actual irradiation position APA. In particular, the control unit 2 may also calculate the distance between the reference irradiation position BPA and the actual irradiation position APA for each of the plurality of positions within the processing shooting area PSA. For example, Fig.18 The relative positional relationship between the reference irradiation position BPA and the actual irradiation position APA of each of the plurality of positions within the processing shot area PSA is shown. If the surface of the light beam passing component 181b is considered to be a surface along the XY plane, then Fig.18As shown, the control unit 2 may also calculate the distance ΔPx between the reference irradiation position BPA and the actual irradiation position APA in the X-axis direction as the relative positional relationship between the reference irradiation position BPA and the actual irradiation position APA. In particular, the control unit 2 may also calculate the distance ΔPx between each of the multiple positions within the processing shooting area PSA. Furthermore, the control unit 2 may also calculate the distance ΔPy between the reference irradiation position BPA and the actual irradiation position APA in the Y-axis direction as the relative positional relationship between the reference irradiation position BPA and the actual irradiation position APA. In particular, the control unit 2 may also calculate the distance ΔPy between each of the multiple positions within the processing shooting area PSA.

[0279] Below, refer to Fig.19 (a) to Fig.19 (b) of FIG. 1 illustrates an example of an operation for calculating the distances ΔPx and ΔPy based on the light receiving information indicating the light receiving result of the processing light EL irradiated on the desired search mark 185b. However, the control unit 2 may calculate the distances ΔPx and ΔPy by performing an operation different from the operation shown below.

[0280] Fig.19 (a) shows the light receiving information when the actual irradiation position APA is consistent with the reference irradiation position BPA (especially the pulse signal of the pulse waveforms P1 to P3 appearing in sequence). In particular, Fig.19 The figure on the upper side of (a) shows the light receiving information obtained when the processing light EL is irradiated to the desired search mark 185b in the initial operation. Fig.19 The figure below (a) shows the light receiving information obtained when the processing light EL is irradiated to the same desired search mark 185b in the calibration operation. When the actual irradiation position APA coincides with the reference irradiation position BPA, the timing of the appearance of the pulse waveforms P1 to P3 in the initial operation coincides with the timing of the appearance of the pulse waveforms P1 to P3 in the calibration operation.

[0281] Fig.19 (b) shows the light receiving information when the actual irradiation position APA and the reference irradiation position BPA are separated along the X-axis direction (particularly, the pulse signals of the pulse waveforms P1 to P3 appearing in sequence). In particular, Fig.19 The figure on the upper side of (b) shows the light receiving information obtained when the processing light EL is irradiated to the desired search mark 185b in the initial operation. Fig.19The figure below (b) shows the light receiving information obtained when the processing light EL is irradiated to the same desired search mark 185b in the calibration operation. When the actual irradiation position APA and the reference irradiation position BPA are separated along the X-axis direction, the timing of the appearance of the pulse waveforms P1 to P3 in the initial operation is respectively advanced or delayed by a time Δtx corresponding to the distance ΔPx relative to the timing of the appearance of the pulse waveforms P1 to P3 in the calibration operation.

[0282] Fig.19 (c) shows the light receiving information when the actual irradiation position APA and the reference irradiation position BPA are separated along the Y-axis direction (particularly, the pulse signals of the pulse waveforms P1 to P3 appearing in sequence). In particular, Fig.19 The figure on the upper side of (c) shows the light receiving information obtained when the processing light EL is irradiated to the desired search mark 185b in the initial operation. Fig.19 The figure below (c) shows the light receiving information obtained when the processing light EL is irradiated to the same desired search mark 185b in the calibration operation. When the actual irradiation position APA and the reference irradiation position BPA are separated along the Y-axis direction, the difference between the timing of the appearance of the pulse waveform P2 in the initial operation and the timing of the appearance of the pulse waveform P2 in the calibration operation and the difference between the timing of the appearance of the pulse waveforms P1 and P3 in the initial operation and the timing of the appearance of the pulse waveforms P1 and P3 in the calibration operation are advanced or delayed by a time Δty corresponding to the distance ΔPy.

[0283] Therefore, the control unit 2 may calculate the distance ΔPx based on the time Δtx corresponding to the difference between the timing when the pulse waveforms P1 to P3 appear in the initial operation and the timing when the pulse waveforms P1 to P3 appear in the calibration operation. The control unit 2 may calculate the distance ΔPy based on the time Δty corresponding to the difference between the timing when the pulse waveform P2 appears in the initial operation and the timing when the pulse waveform P2 appears in the calibration operation, and the difference between the timing when the pulse waveforms P1 and P3 appear in the initial operation and the timing when the pulse waveforms P1 and P3 appear in the calibration operation.

[0284] in addition, Fig.19 Although the horizontal axis of the graph shows an example of the light receiving timing (i.e., time) of the processing light EL and the measuring light ML, the horizontal axis of the graph can also be regarded as indicating the positions of the processing light EL and the measuring light ML. Fig.19 The above description can be made on the premise that the horizontal axis of the graph shown represents the respective positions of the processing light EL and the measuring light ML.

[0285] (2-3-3-2) Second Specific Example of Irradiation Position Information

[0286] The control unit 2 may generate information related to the relative positional relationship between the reference irradiation position BMA of the measuring light ML and the actual irradiation position MA of the measuring light ML (hereinafter referred to as "actual irradiation position AMA") as the irradiation position information. Specifically, as described above, in order to perform the calibration operation, the processing head 13 irradiates the measuring light ML to the one search mark 185b based on the galvanometer control signal for controlling at least one of the galvanometer mirrors 1328 and 1341 to irradiate the measuring light ML to the one search mark 185b. The reference irradiation position BMA may also be the ideal irradiation position MA of the measuring light ML (in other words, the designed or targeted irradiation position MA) when the processing head 13 irradiates the measuring light ML to the one search mark 185b based on the galvanometer control signal for irradiating the measuring light ML to the one search mark 185b. On the other hand, the actual irradiation position AMA may also be the actual irradiation position MA of the measuring light ML when the processing head 13 irradiates the measuring light ML to the same one search mark 185b based on the same galvanometer control signal for irradiating the measuring light ML to the same one search mark 185b. The light receiving information obtained by the calibration operation includes information related to the actual irradiation position AMA. Therefore, the control unit 2 can also calculate the actual irradiation position AMA based on the light receiving information. On the other hand, the information related to the reference irradiation position BMA can also be information known to the control unit 2. As a result, the control unit 2 can generate irradiation position information including information related to the relative positional relationship between the reference irradiation position BMA and the actual irradiation position AMA based on the light receiving information and the information related to the reference irradiation position BMA.

[0287] When the measurement light ML is sequentially irradiated to the plurality of search marks 185b distributed in the measurement shooting area MSA through the calibration operation as described above, the control unit 2 may also generate information related to the relative positional relationship between the reference irradiation position BMA and the actual irradiation position AMA at the plurality of different positions in the measurement shooting area MSA as the irradiation position information. Specifically, the control unit 2 may also generate information related to the relative positional relationship between the reference irradiation position BMA and the actual irradiation position AMA at the respective positions of the plurality of search marks 185b distributed in the measurement shooting area MSA as the irradiation position information.

[0288] The information related to the reference irradiation position BMA may be generated in advance based on the light receiving information obtained by irradiating the light measuring device 18b with the measurement light ML by the machining unit 1b in the initial measurement state before the calibration operation. Therefore, the machining system SYSb may perform an initial operation for generating the information related to the reference irradiation position BMA before the calibration operation.

[0289] Specifically, first, the state of the processing unit 1b is set to the initial measurement state. The initial measurement state of the processing unit 1b may also be a state in which the processing unit 1b can actually irradiate the measurement light ML to a position in the measurement shooting area MSA when the galvanometer control signal for controlling the galvanometer mirrors 1328 and 1341 to irradiate the measurement light ML to a position in the measurement shooting area MSA is input to the galvanometer mirrors 1328 and 1341. That is, the initial measurement state of the processing unit 1b may also be a state in which the ideal irradiation position MA of the measurement light ML indicated by the galvanometer control signal coincides with the actual irradiation position MA of the measurement light ML emitted by the processing unit 1b that operates based on the galvanometer control signal.

[0290] In this case, in order to set the state of the processing unit 1b to the initial measurement state, the control unit 2 may also adjust the sensitivity (driving amount) of at least one of the galvanometer mirrors 1328 and 1341 to the galvanometer control signal. In addition, in the case where the irradiation optical system 135 can be replaced as described above, the control unit 2 may adjust the sensitivity of at least one of the galvanometer mirrors 1328 and 1341 to the galvanometer control signal for each irradiation optical system 135. For example, in the case where the first irradiation optical system 135 is installed in the processing head 13, the control unit 2 may set the sensitivity of at least one of the galvanometer mirrors 1328 and 1341 to the third sensitivity corresponding to the first irradiation optical system 135. For example, in the case where the second irradiation optical system 135 different from the first irradiation optical system 135 is installed in the processing head 13, the control unit 2 may also set the sensitivity of at least one of the galvanometer mirrors 1328 and 1341 to the fourth sensitivity corresponding to the second irradiation optical system 135. Alternatively, even when the irradiation optical system 135 is replaceable as described above, the control unit 2 may adjust the sensitivity of at least one of the galvanometer mirrors 1328 and 1341 to the galvanometer control signal to a predetermined sensitivity common to the plurality of irradiation optical systems 135 .

[0291] At the same time, the measurement drive system 191b moves the light measuring device 18b to the calibration position CP1 under the control of the control unit 2. Furthermore, the head drive system 141 moves the processing head 13 to a position where the processing head 13 can irradiate the measurement light ML to the light measuring device 18b located at the calibration position CP1 under the control of the control unit 2. In this case, the control unit 2 may also obtain initial position information related to the relative positional relationship between at least one of the processing head 13 and the workbench 15 and the light measuring device 18b. Specifically, the control unit 2 may calculate the relative positional relationship between at least one of the processing head 13 and the workbench 15 and the light measuring device 18b based on the measurement result of at least one of the position measuring devices 142 and 162 and the measurement result of the position measuring device 192b. For example, the control unit 2 may also calculate the relative positional relationship between the light measuring device 18b located at the calibration position CP1 and the processing head 13 located at a position where the processing head 13 can irradiate the measurement light ML to the light measuring device 18b located at the calibration position CP1 based on the measurement results of each of the position measuring devices 142 and the position measuring device 192b. The control unit 2 may also calculate the relative positional relationship between the light measuring device 18b located at the calibration position CP1 and the workbench 15 based on the respective measurement results of the position measuring device 162 and the position measuring device 192b. The initial position information obtained here may also be used to move the light measuring device 18b to the calibration position CP1 in the calibration operation. The initial position information may also be used to move the machining head 13b to a position where the machining head 13 can irradiate the measurement light ML to the light measuring device 18b located at the calibration position CP1 in the calibration operation. The initial position information may also be used to move the workbench 15 in the calibration operation. That is, the machining system SYSb may also perform the calibration operation based on the initial position information obtained in the initial operation.

[0292] After that, the processing unit 1b irradiates the measuring light ML to the optical measuring device 18b. Specifically, the processing unit 1b irradiates the measuring light ML to the desired search mark 185b formed on the optical measuring device 18b. As a result, the optical measuring device 18b outputs light reception information indicating the light reception result of the measuring light ML that has passed the desired search mark 185b. The light reception information includes information related to the actual irradiation position MA of the measuring light ML at the desired position where the desired search mark 185b is located in the measuring shooting area MSA. As described above, in the processing unit 1b in the initial measurement state, the actual irradiation position MA of the measuring light ML coincides with the ideal irradiation position MA of the measuring light ML. Therefore, the light reception information includes information related to the ideal irradiation position MA of the measuring light ML at the desired position where the desired search mark 185b is located in the measuring shooting area MSA (that is, the reference irradiation position BMA). Therefore, the control unit 2 can generate information related to the reference irradiation position BMA based on the light reception information obtained by the initial operation. Alternatively, the control unit 2 may use the light reception information acquired in the initial operation as the information on the reference irradiation position BMA.

[0293] In the initial operation, the processing unit 1b may irradiate the measurement light ML to the plurality of search marks 185b formed on the optical measuring device 18b. In this case, the control unit 2 can generate information related to the ideal irradiation position MA (that is, the reference irradiation position BMA) of the measurement light ML at the plurality of positions where the plurality of search marks 185b distributed in the measurement shooting area MSA are respectively located based on the light receiving information obtained by the initial operation.

[0294] The control unit 2 may also calculate the distance (in other words, position offset) between the reference irradiation position BMA and the actual irradiation position AMA in the direction along the surface of the light beam passing through the component 181b as the relative positional relationship between the reference irradiation position BMA and the actual irradiation position AMA. In particular, the control unit 2 may also calculate the distance between the reference irradiation position BMA and the actual irradiation position AMA for each of the plurality of positions within the measurement shooting area MSA. For example, Fig. 20 The relative positional relationship between the reference irradiation position BMA and the actual irradiation position AMA of each of the plurality of positions in the measurement shooting area MSA is shown. When the surface of the light beam passing component 181b is considered to be a surface along the XY plane, as shown in FIG. Fig. 20As shown, the control unit 2 may also calculate the distance ΔMx between the reference irradiation position BMA and the actual irradiation position AMA in the X-axis direction as the relative positional relationship between the reference irradiation position BMA and the actual irradiation position AMA. In particular, the control unit 2 may also calculate the distance ΔMx between each of the multiple positions within the measurement shooting area MSA. Furthermore, the control unit 2 may also calculate the distance ΔMy between the reference irradiation position BMA and the actual irradiation position AMA in the Y-axis direction as the relative positional relationship between the reference irradiation position BMA and the actual irradiation position AMA. In particular, the control unit 2 may also calculate the distance ΔMy between each of the multiple positions within the measurement shooting area MSA.

[0295] The control unit 2 may also perform the same operation as the operation of calculating the distances ΔPx and ΔPy based on the light reception information indicating the light reception result of the processing light EL, thereby calculating the distances ΔMx and ΔMy based on the light reception information indicating the light reception result of the measurement light ML. That is, by replacing the phrases such as "actual irradiation position APA", "reference irradiation position BPA", "processing light EL", "distance ΔPx", and "distance ΔPy" with the phrases such as "actual irradiation position AMA", "reference irradiation position BMA", "measurement light ML", "distance ΔMx", and "distance ΔMy", the description of the example of the operation of calculating the distances ΔPx and ΔPy based on the light reception information indicating the light reception result of the processing light EL can be used as the description of the example of the operation of calculating the distances ΔMx and ΔMy based on the light reception information indicating the light reception result of the measurement light ML. Therefore, the description of the example of the operation of calculating the distances ΔMx and ΔMy based on the light reception information indicating the light reception result of the measurement light ML is omitted.

[0296] (2-3-3-3) Third Specific Example of Irradiation Position Information

[0297] In the case where the processing head 13 irradiates the processing light EL and the measuring light ML onto the same search mark 185b, the control unit 2 may also generate information related to the relative positional relationship between the actual irradiation position APA of the processing light EL and the actual irradiation position AMA of the measuring light ML as the irradiation position information. Specifically, the light reception information obtained by the processing head 13 irradiating the processing light EL onto one search mark 185b includes information related to the actual irradiation position APA of the processing light EL irradiated onto one search mark 185b. Similarly, the light reception information obtained by the processing head 13 irradiating the measuring light ML onto one search mark 185b includes information related to the actual irradiation position AMA of the measuring light ML irradiated onto one search mark 185b. Therefore, the control unit 2 can generate the irradiation position information including information related to the relative positional relationship between the actual irradiation position APA and the actual irradiation position AMA based on the light reception information.

[0298] When the processing light EL and the measuring light ML are sequentially irradiated to the plurality of search marks 185b by the calibration operation as described above, the control unit 2 may also generate information related to the relative positional relationship between the actual irradiation position APA and the actual irradiation position AMA at the plurality of different positions in at least one of the processing shooting area PSA and the measuring shooting area MSA as the irradiation position information. Specifically, the control unit 2 may also include information related to the relative positional relationship between the actual irradiation position APA and the actual irradiation position AMA at the positions of the plurality of search marks 185b distributed in at least one of the processing shooting area PSA and the measuring shooting area MSA as the irradiation position information.

[0299] The control unit 2 may also calculate the distance between the actual irradiation position APA and the actual irradiation position APA in the direction along the surface of the light beam passing through the component 181b (in other words, the position offset) as the relative positional relationship between the actual irradiation position APA and the actual irradiation position AMA. In particular, the control unit 2 may also calculate the distance between the actual irradiation position APA and the actual irradiation position AMA for each of a plurality of positions in at least one of the processing shot area PSA and the measurement shot area MSA. For example, Fig.21 The relative positional relationship between the actual irradiation position APA and the actual irradiation position AMA of each of the plurality of positions in at least one of the processing shot area PSA and the measurement shot area MSA is shown. If the surface of the light beam passing component 181b is considered to be a surface along the XY plane, then Fig.21 As shown, the control unit 2 may also calculate the distance ΔPMx between the actual irradiation position APA and the actual irradiation position AMA in the X-axis direction as the relative positional relationship between the actual irradiation position APA and the actual irradiation position AMA. In particular, the control unit 2 may calculate the respective distances ΔPMx of multiple positions in at least one of the processing shot area PSA and the measuring shot area MSA. Furthermore, the control unit 2 may also calculate the distance ΔPMy between the actual irradiation position APA and the actual irradiation position AMA in the Y-axis direction as the relative positional relationship between the actual irradiation position APA and the actual irradiation position AMA. In particular, the control unit 2 may calculate the respective distances ΔPMy of multiple positions in at least one of the processing shot area PSA and the measuring shot area MSA.

[0300] Below, refer to Fig. 22 (a) to Fig. 22 (b) will be described as an example of an operation for calculating the distances ΔPMx and ΔPMy based on the light reception information indicating the light reception results of the processing light EL and the measurement light ML irradiated onto the desired search mark 185 b .

[0301] Fig. 22(a) shows the light receiving information when the actual irradiation position APA coincides with the actual irradiation position AMA (particularly, the pulse signals in which the pulse waveforms P1 to P3 appear in sequence). Particularly, Fig. 22 The upper side of (a) shows the light receiving information obtained when the processing light EL is irradiated to the desired search mark 185b. Fig. 22 The figure below (a) shows the light receiving information obtained when the measuring light ML is irradiated to the same desired search mark 185b. When the actual irradiation position APA coincides with the actual irradiation position AMA, the timings at which the pulse waveforms P1 to P3 appear in the light receiving result of the processing light EL coincide with the timings at which the pulse waveforms P1 to P3 appear in the light receiving result of the measuring light ML.

[0302] Fig. 22 (b) shows the light receiving information when the actual irradiation position APA and the actual irradiation position AMA are separated along the X-axis direction (especially the pulse signals where the pulse waveforms P1 to P3 appear in sequence). In particular, Fig. 22 The upper side of (b) shows the light receiving information obtained when the processing light EL is irradiated to the desired search mark 185b. Fig. 22 The lower figure of (b) shows the light receiving information obtained when the measuring light ML is irradiated to the same desired search mark 185b. When the actual irradiation position APA is separated from the actual irradiation position AMA along the X-axis direction, the timing of the appearance of the pulse waveforms P1 to P3 in the light receiving result of the processing light EL is respectively advanced or delayed by the time Δtx corresponding to the distance ΔPMx relative to the timing of the appearance of the pulse waveforms P1 to P3 in the light receiving result of the measuring light ML.

[0303] Fig. 22 (c) shows the light receiving information when the actual irradiation position APA and the actual irradiation position AMA are separated along the Y-axis direction (especially the pulse signals in which the pulse waveforms P1 to P3 appear in sequence). In particular, Fig. 22 The upper side of (c) shows the light receiving information obtained when the processing light EL is irradiated to the desired search mark 185b. Fig. 22 The figure on the lower side of (c) shows the light receiving information obtained when the measuring light ML is irradiated to the same desired search mark 185b. When the actual irradiation position APA is separated from the actual irradiation position AMA along the Y-axis direction, the difference between the timing of the appearance of the pulse waveform P2 in the light receiving result of the processing light EL and the timing of the appearance of the pulse waveform P2 in the light receiving result of the measuring light ML and the difference between the timing of the appearance of the pulse waveforms P1 and P3 in the light receiving result of the processing light EL and the timing of the appearance of the pulse waveforms P1 and P3 in the light receiving result of the measuring light ML are advanced or delayed by a time Δty corresponding to the distance ΔPMy.

[0304] Therefore, the control unit 2 may calculate the distance ΔPMx based on the time Δtx corresponding to the difference between the timing when the pulse waveforms P1 to P3 appear in the light reception result of the processing light EL and the timing when the pulse waveforms P1 to P3 appear in the light reception result of the measuring light ML. The control unit 2 may calculate the distance ΔPMy based on the time Δty corresponding to the difference between the timing when the pulse waveform P2 appears in the light reception result of the processing light EL and the timing when the pulse waveform P2 appears in the light reception result of the measuring light ML, and the difference between the timing when the pulse waveforms P1 and P3 appear in the light reception result of the processing light EL and the timing when the pulse waveforms P1 and P3 appear in the light reception result of the measuring light ML.

[0305] (2-3-4) Correction of the irradiation position PA of the processing light EL and the irradiation position of the measuring light ML based on the irradiation position information just

[0306] Thereafter, the control unit 2 corrects (in other words, controls or adjusts) at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measurement light ML based on the irradiation position information.

[0307] (2-3-4-1) Based on the reference irradiation position BPA of the processing light EL and the actual irradiation position APA of the processing light EL Correction of the irradiation position PA of the processing light EL based on the irradiation position information related to the relative positional relationship

[0308] For example, in a case where the irradiation position information includes information related to the relative positional relationship between the reference irradiation position BPA of the processing light EL and the actual irradiation position APA of the processing light EL, the control unit 2 may also correct the irradiation position PA of the processing light EL based on the irradiation position information. Specifically, the control unit 2 may also control a position changing device capable of changing the irradiation position PA of the processing light EL based on the irradiation position information so that the irradiation position PA of the processing light EL becomes the desired first irradiation position. In addition, as an example of a position changing device capable of changing the irradiation position PA of the processing light EL, at least one of the galvanometer mirrors 1313 and 1341 capable of changing the irradiation position PA of the processing light EL can be cited. Therefore, the control unit 2 may also control at least one of the galvanometer mirrors 1313 and 1341 based on the irradiation position information so that the irradiation position PA of the processing light EL becomes the desired first irradiation position.

[0309] As an example, the control unit 2 may correct the irradiation position PA of the processing light EL so that the actual irradiation position APA is closer to the reference irradiation position BPA than before the irradiation position PA of the processing light EL is corrected. That is, the control unit 2 may control at least one of the galvanometer mirrors 1313 and 1341 so that the actual irradiation position APA is closer to the reference irradiation position BPA than before the irradiation position PA of the processing light EL is corrected. Specifically, the control unit 2 may correct the irradiation position PA of the processing light EL so that the actual irradiation position APA where the processing light EL is actually irradiated is closer to the reference irradiation position BPA based on the galvanometer control signal for controlling at least one of the galvanometer mirrors 1313 and 1341 so that the processing light EL is irradiated to the reference irradiation position BPA. In other words, the control unit 2 may correct the irradiation position PA of the processing light EL so that the actual irradiation position APA where the processing light EL is actually irradiated is closer to the desired position based on the galvanometer control signal for controlling at least one of the galvanometer mirrors 1313 and 1341 so that the processing light EL is irradiated to the desired position.

[0310] In this case, the control unit 2 may also correct the irradiation position PA of the processing light EL at each of the multiple positions in the processing shot area PSA based on information related to the relative positional relationship between the reference irradiation position BPA and the actual irradiation position APA at each of the multiple positions in the processing shot area PSA, so that the actual irradiation position APA at each of the multiple positions in the processing shot area PSA approaches the reference irradiation position BPA. That is, the control unit 2 may also correct the irradiation position PA of the processing light EL at a position in the processing shot area PSA based on information related to the relative positional relationship between the reference irradiation position BPA and the actual irradiation position APA at a position in the processing shot area PSA, so that the actual irradiation position APA at a position in the processing shot area PSA approaches the reference irradiation position BPA.

[0311] As another example, the control unit 2 may also correct the irradiation position PA of the processing light EL so that the actual irradiation position APA is consistent with the reference irradiation position BPA. That is, the control unit 2 may also control at least one of the galvanometer mirrors 1313 and 1341 in such a manner that the actual irradiation position APA is consistent with the reference irradiation position BPA. Specifically, the control unit 2 may also correct the irradiation position PA of the processing light EL in such a manner that the processing light EL is actually irradiated to the reference irradiation position BPA based on the galvanometer control signal for controlling at least one of the galvanometer mirrors 1313 and 1341 to irradiate the processing light EL to the reference irradiation position BPA. In other words, the control unit 2 may also correct the irradiation position PA of the processing light EL in such a manner that the processing light EL is actually irradiated to the desired position based on the galvanometer control signal for controlling at least one of the galvanometer mirrors 1313 and 1341 to irradiate the processing light EL to the desired position.

[0312] In this case, the control unit 2 may also correct the irradiation position PA of the processing light EL at each of the multiple positions in the processing shot area PSA based on information related to the relative positional relationship between the reference irradiation position BPA and the actual irradiation position APA at each of the multiple positions in the processing shot area PSA, so that the actual irradiation position APA at each of the multiple positions in the processing shot area PSA is consistent with the reference irradiation position BPA. That is, the control unit 2 may also correct the irradiation position PA of the processing light EL at a position in the processing shot area PSA based on information related to the relative positional relationship between the reference irradiation position BPA and the actual irradiation position APA at a position in the processing shot area PSA, so that the actual irradiation position APA at a position in the processing shot area PSA is consistent with the reference irradiation position BPA.

[0313] (2-3-4-2) Based on the reference irradiation position BMA of the measurement light ML and the actual irradiation position AMA of the measurement light ML Correction of the irradiation position MA of the measurement light ML for the irradiation position information related to the relative positional relationship

[0314] For example, in a case where the irradiation position information includes information related to the relative positional relationship between the reference irradiation position BMA of the measuring light ML and the actual irradiation position AMA of the measuring light ML, the control unit 2 may also correct the irradiation position MA of the measuring light ML based on the irradiation position information. Specifically, the control unit 2 may also control a position changing device capable of changing the irradiation position MA of the measuring light ML based on the irradiation position information so that the irradiation position MA of the measuring light ML becomes the desired second irradiation position. In addition, as an example of a position changing device capable of changing the irradiation position MA of the measuring light ML, at least one of the galvanometer mirrors 1328 and 1341 capable of changing the irradiation position MA of the measuring light ML may be cited. Therefore, the control unit 2 may also control at least one of the galvanometer mirrors 1328 and 1341 based on the irradiation position information so that the irradiation position MA of the measuring light ML becomes the desired second irradiation position.

[0315] As an example, the control unit 2 may also correct the irradiation position MA of the measurement light ML so that the actual irradiation position AMA is close to the reference irradiation position BMA compared to before the irradiation position MA of the measurement light ML is corrected. That is, the control unit 2 may also control at least one of the galvanometer mirrors 1328 and 1341 so that the actual irradiation position AMA is close to the reference irradiation position BMA compared to before the irradiation position MA of the measurement light ML is corrected. Specifically, the control unit 2 may also correct the irradiation position MA of the measurement light ML based on the galvanometer control signal for controlling at least one of the galvanometer mirrors 1328 and 1341 to irradiate the measurement light ML to the reference irradiation position BMA so that the actual irradiation position AMA where the measurement light ML is actually irradiated is close to the reference irradiation position BMA. In other words, the control unit 2 may also correct the irradiation position MA of the measurement light ML based on the galvanometer control signal for controlling at least one of the galvanometer mirrors 1328 and 1341 to irradiate the measurement light ML to the desired position so that the actual irradiation position AMA where the measurement light ML is actually irradiated is close to the desired position.

[0316] In this case, the control unit 2 may also correct the irradiation position MA of the measurement light ML at each of the plurality of positions in the measurement shooting area MSA based on information related to the relative positional relationship between the reference irradiation position BMA and the actual irradiation position AMA at each of the plurality of positions in the measurement shooting area MSA, so that the actual irradiation position AMA at each of the plurality of positions in the measurement shooting area MSA approaches the reference irradiation position BMA. That is, the control unit 2 may also correct the irradiation position MA of the measurement light ML at one position in the measurement shooting area MSA based on information related to the relative positional relationship between the reference irradiation position BMA and the actual irradiation position AMA at one position in the measurement shooting area MSA, so that the actual irradiation position AMA at one position in the measurement shooting area MSA approaches the reference irradiation position BMA.

[0317] As another example, the control unit 2 may also correct the irradiation position MA of the measurement light ML in such a manner that the actual irradiation position AMA is consistent with the reference irradiation position BMA. That is, the control unit 2 may also control at least one of the galvanometer mirrors 1328 and 1341 so that the actual irradiation position AMA is consistent with the reference irradiation position BMA. Specifically, the control unit 2 may also correct the irradiation position MA of the measurement light ML based on a galvanometer control signal for controlling at least one of the galvanometer mirrors 1328 and 1341 so that the measurement light ML is irradiated to the reference irradiation position BMA so that the measurement light ML is actually irradiated to the reference irradiation position BMA. In other words, the control unit 2 may also correct the irradiation position MA of the measurement light ML based on a galvanometer control signal for controlling at least one of the galvanometer mirrors 1328 and 1341 so that the measurement light ML is irradiated to the desired position so that the measurement light ML is actually irradiated to the desired position.

[0318] In this case, the control unit 2 may also correct the irradiation position PA of the measurement light ML at each of the plurality of positions in the measurement shooting area MSA based on information related to the relative positional relationship between the reference irradiation position BMA and the actual irradiation position AMA at each of the plurality of positions in the measurement shooting area MSA, so that the actual irradiation position AMA at each of the plurality of positions in the measurement shooting area MSA is consistent with the reference irradiation position BMA. That is, the control unit 2 may also correct the irradiation position MA of the measurement light ML at one position in the measurement shooting area MSA based on information related to the relative positional relationship between the reference irradiation position BMA and the actual irradiation position AMA at one position in the measurement shooting area MSA, so that the actual irradiation position AMA at one position in the measurement shooting area MSA is consistent with the reference irradiation position BMA.

[0319] (2-3-4-3) Based on the actual irradiation position APA of the processing light EL and the actual irradiation position AMA of the measuring light ML The irradiation position information about the relative positional relationship between the irradiation position PA of the processing light EL and the irradiation position MA of the measuring light ML Correction of at least one party

[0320] For example, in a case where the irradiation position information includes information related to the relative positional relationship between the actual irradiation position APA of the processing light EL and the actual irradiation position AMA of the measuring light ML, the control unit 2 may also correct at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measuring light ML based on the irradiation position information. Specifically, the control unit 2 may also control a position changing device capable of changing at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measuring light ML based on the irradiation position information so that the relative positional relationship between the irradiation position PA of the processing light EL and the irradiation position MA of the measuring light ML becomes a prescribed positional relationship. For example, the control unit 2 may also control at least one of the galvanometer mirrors 1313, 1328, and 1341 based on the irradiation position information so that the relative positional relationship between the irradiation position PA of the processing light EL and the irradiation position MA of the measuring light ML becomes a prescribed positional relationship.

[0321] As an example, the control unit 2 may correct at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measuring light ML so that the actual irradiation position APA of the processing light EL is closer to the actual irradiation position AMA of the measuring light ML than before the correction of at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measuring light ML. That is, the control unit 2 may control at least one of the galvanometer mirrors 1313, 1328, and 1341 so that the actual irradiation position APA of the processing light EL is closer to the actual irradiation position AMA of the measuring light ML than before the correction of at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measuring light ML. Specifically, the control unit 2 can also correct at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measuring light ML so that the actual irradiation position APA of the processing light EL actually irradiated based on the galvanometer control signal for controlling at least one of the galvanometer mirrors 1313 and 1341 to irradiate the processing light EL to the desired position is close to the actual irradiation position AMA of the measuring light ML actually irradiated based on the galvanometer control signal for controlling at least one of the galvanometer mirrors 1328 and 1341 to irradiate the measuring light ML to the same desired position.

[0322] In this case, the control unit 2 may also correct at least one of the irradiation position PA of the processing light EL at each of the multiple positions in the processing shot area PSA and the irradiation position MA of the measurement light ML at each of the multiple positions in the measurement shot area MSA based on information related to the relative positional relationship between the actual irradiation position APA and the actual irradiation position AMA at each of the multiple positions in the processing shot area PSA and the measurement shot area MSA, so that the actual irradiation position APA at each of the multiple positions in the processing shot area PSA and the measurement shot area MSA approaches the actual irradiation position AMA. That is, the control unit 2 may also correct at least one of the irradiation position PA of the processing light EL at one position in the processing shot area PSA and the irradiation position MA of the measurement light ML at one position in the measurement shot area MSA based on information related to the relative positional relationship between the actual irradiation position APA and the actual irradiation position AMA at one position in the processing shot area PSA and the measurement shot area MSA, so that the actual irradiation position APA at one position in the processing shot area PSA and the measurement shot area MSA approaches the actual irradiation position AMA.

[0323] As another example, the control unit 2 may correct at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measuring light ML so that the actual irradiation position APA of the processing light EL coincides with the actual irradiation position AMA of the measuring light ML. That is, the control unit 2 may control at least one of the galvanometer mirrors 1313, 1328, and 1341 so that the actual irradiation position APA of the processing light EL coincides with the actual irradiation position AMA of the measuring light ML. Specifically, the control unit 2 may correct at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measuring light ML so that the actual irradiation position APA of the processing light EL, which is actually irradiated based on the galvanometer control signal for controlling at least one of the galvanometer mirrors 1313 and 1341 to irradiate the processing light EL to a desired position, coincides with the actual irradiation position AMA of the measuring light ML, which is actually irradiated based on the galvanometer control signal for controlling at least one of the galvanometer mirrors 1328 and 1341 to irradiate the measuring light ML to the same desired position.

[0324] In this case, the control unit 2 may also correct at least one of the irradiation position PA of the processing light EL at each of the multiple positions in the processing shot area PSA and the irradiation position MA of the measurement light ML at each of the multiple positions in the measurement shot area MSA based on information related to the relative positional relationship between the actual irradiation position APA and the actual irradiation position AMA at each of the multiple positions in the processing shot area PSA and the measurement shot area MSA, so that the actual irradiation position APA at each of the multiple positions in the processing shot area PSA and the measurement shot area MSA coincides with the actual irradiation position AMA. That is, the control unit 2 may also correct at least one of the irradiation position PA of the processing light EL at one position in the processing shot area PSA and the irradiation position MA of the measurement light ML at one position in the measurement shot area MSA, based on information related to the relative positional relationship between the actual irradiation position APA and the actual irradiation position AMA at one position in the processing shot area PSA and the measurement shot area MSA, so that the actual irradiation position APA at one position in the processing shot area PSA and the measurement shot area MSA coincides with the actual irradiation position AMA.

[0325] (2-3-5) Timing of Calibration Operation

[0326] The processing system SYSb may also perform a calibration operation before starting processing of the workpiece W. The processing system SYSb may also perform a calibration operation before starting measurement of the measurement object M. The processing system SYSb may also perform a calibration operation after completing processing of the workpiece W. The processing system SYSb may also perform a calibration operation after completing measurement of the measurement object M. The processing system SYSb may also perform a calibration operation after starting processing of the workpiece W and before completing processing of the workpiece W. That is, the processing system SYSb may also perform a calibration operation during at least a portion of the processing period of processing the workpiece W. The processing system SYSb may also perform a calibration operation after starting measurement of the measurement object M and before completing measurement of the measurement object M. That is, the processing system SYSb may perform a calibration operation during at least a portion of the measurement period of measuring the measurement object M.

[0327] If the irradiation position PA of the processing light EL does not change, the necessity of performing the above calibration operation for correcting the irradiation position PA of the processing light EL is not necessarily high. On the other hand, when the irradiation position PA of the processing light EL changes, the necessity of performing the above calibration operation for correcting the irradiation position PA of the processing light EL is high. Therefore, the processing system SYSb may perform the calibration operation for correcting the irradiation position PA of the processing light EL under the assumption that the irradiation position PA of the processing light EL has changed.

[0328] As an example, the irradiation position PA of the processing light EL may change over time. For example, when the processing system SYSb starts to operate, the temperature of the optical system of the processing system SYSb (specifically, at least one of the processing optical system 131, the synthesis optical system 133, the deflection optical system 134, and the irradiation optical system 135 for irradiating the processing light EL to the workpiece W) may change over time. As a result, the irradiation position PA of the processing light EL may change due to the change in the temperature of the optical system of the processing system SYSb. Therefore, the processing system SYSb may perform a calibration operation for correcting the irradiation position PA of the processing light EL when a predetermined time or more has passed since the last calibration operation for correcting the irradiation position PA of the processing light EL was performed.

[0329] As another example, the processing system SYSb may detect the temperature of the optical system of the processing system SYSb (particularly, the optical system for irradiating the processing light EL to the measurement object M), and when the variation of the detected temperature exceeds a predetermined temperature threshold, perform a calibration operation for correcting the irradiation position PA of the processing light EL. In this case, the processing system SYSb may also include a temperature sensor for detecting the temperature of the optical system of the processing system SYSb. In the case where the irradiation optical system 135 is replaceable, the temperature sensor for detecting the temperature of the irradiation optical system 135 may be disposed in the head housing 137 that accommodates the irradiation optical system 135. In this case, the detection result of the temperature sensor may be output to the control unit 2 via a signal contact formed in the head housing 137. Specifically, the detection result of the temperature sensor may be output to the control unit 2 via an output signal line formed by a first signal contact formed in the head housing 137 and a second signal contact formed in the mounting adapter 138 and electrically contacting the first signal contact.

[0330] As another example, when the irradiation optical system 135 can be replaced, the irradiation position of the processing light EL may change as the irradiation optical system 135 is replaced. This is because the optical characteristics of the irradiation optical system 135 removed from the processing head 13 by replacing the irradiation optical system 135 (i.e., the irradiation optical system 135 before replacement) and the optical characteristics of the irradiation optical system 135 newly attached to the processing head 13 by replacing the irradiation optical system 135 (i.e., the irradiation optical system 135 after replacement) are not necessarily the same. Therefore, the processing system SYSb may also perform a calibration operation for correcting the irradiation position PA of the processing light EL when the irradiation optical system 135 is replaced.

[0331] Furthermore, in the calibration operation performed when the irradiation optical system 135 is replaced, the actual irradiation position APA of the processing light EL before the replacement of the irradiation optical system 135 may be used as the reference irradiation position BPA of the processing light EL. In this case, the control unit 2 may generate information related to the relative positional relationship between the actual irradiation position APA of the processing light EL before the replacement of the irradiation optical system 135 and the actual irradiation position APA of the processing light EL after the replacement of the irradiation optical system 135 as the irradiation position information. The control unit 2 may correct the irradiation position PA of the processing light EL so that the actual irradiation position APA of the processing light EL after the replacement of the irradiation optical system 135 approaches the actual irradiation position APA of the processing light EL before the replacement of the irradiation optical system 135. The control unit 2 may correct the irradiation position PA of the processing light EL so that the actual irradiation position APA of the processing light EL after the replacement of the irradiation optical system 135 coincides with the actual irradiation position APA of the processing light EL before the replacement of the irradiation optical system 135.

[0332] In addition, the irradiation position information related to the relative positional relationship between the reference irradiation position BPA and the actual irradiation position APA can also be regarded as equivalent to the information related to the change of the actual irradiation position APA relative to the reference irradiation position BPA. In this case, the control unit 2 can also be regarded as calculating (obtaining) the information related to the change of the irradiation position PA of the processing light EL as the irradiation position information related to the irradiation position PA of the processing light EL.

[0333] Similarly, if the irradiation position MA of the measurement light ML does not change, the necessity of performing the above-mentioned calibration operation for correcting the irradiation position MA of the measurement light ML is not necessarily high. On the other hand, when the irradiation position MA of the measurement light ML changes, the necessity of performing the above-mentioned calibration operation for correcting the irradiation position MA of the measurement light ML is high. Therefore, the machining system SYSb may perform the calibration operation for correcting the irradiation position MA of the measurement light ML assuming that the irradiation position MA of the measurement light ML changes.

[0334] As an example, the irradiation position MA of the measurement light ML may change over time. For example, when the processing system SYSb starts to operate, the temperature of the optical system (specifically, at least one of the measurement optical system 132, the synthesis optical system 133, the deflection optical system 134, and the irradiation optical system 135 for irradiating the measurement light ML to the measurement object M) of the processing system SYSb may change over time. As a result, the irradiation position MA of the measurement light ML may change due to the change in the temperature of the optical system of the processing system SYSb. Therefore, the processing system SYSb may perform a calibration operation for correcting the irradiation position MA of the measurement light ML when a predetermined time or more has passed since the last calibration operation for correcting the irradiation position MA of the measurement light ML was performed.

[0335] As another example, the processing system SYSb may detect the temperature of the optical system of the processing system SYSb (particularly, the optical system for irradiating the measurement light ML to the measurement object M), and when the variation of the detected temperature exceeds a predetermined temperature threshold, perform a calibration operation for correcting the irradiation position MA of the measurement light ML. In this case, the processing system SYSb may include a temperature sensor for detecting the temperature of the optical system of the processing system SYSb.

[0336] As another example, when the irradiation optical system 135 is replaceable, the irradiation position of the measurement light ML may change as the irradiation optical system 135 is replaced. This is because the optical characteristics of the irradiation optical system 135 removed from the machining head 13 by replacing the irradiation optical system 135 (i.e., the irradiation optical system 135 before replacement) and the optical characteristics of the irradiation optical system 135 newly installed in the machining head 13 by replacing the irradiation optical system 135 (i.e., the irradiation optical system 135 after replacement) are not necessarily the same. Therefore, the machining system SYSb may also perform a calibration operation for correcting the irradiation position MA of the measurement light ML when the irradiation optical system 135 is replaced.

[0337] Furthermore, in the calibration operation performed when the irradiation optical system 135 is replaced, the actual irradiation position AMA of the measurement light ML before the replacement of the irradiation optical system 135 may be used as the reference irradiation position BMA of the measurement light ML. In this case, the control unit 2 may generate information related to the relative positional relationship between the actual irradiation position AMA of the measurement light ML before the replacement of the irradiation optical system 135 and the actual irradiation position AMA of the measurement light ML after the replacement of the irradiation optical system 135 as the irradiation position information. Furthermore, the control unit 2 may correct the irradiation position MA of the measurement light ML in such a manner that the actual irradiation position AMA of the measurement light ML after the replacement of the irradiation optical system 135 approaches the actual irradiation position AMA of the measurement light ML before the replacement of the irradiation optical system 135. The control unit 2 may correct the irradiation position MA of the measurement light ML in such a manner that the actual irradiation position AMA of the measurement light ML after the replacement of the irradiation optical system 135 coincides with the actual irradiation position AMA of the measurement light ML before the replacement of the irradiation optical system 135.

[0338] Furthermore, the irradiation position information related to the relative positional relationship between the reference irradiation position BMA and the actual irradiation position AMA may also be considered to be equivalent to the information related to the change of the actual irradiation position AMA relative to the reference irradiation position BMA. In this case, the control unit 2 may also be considered to calculate (obtain) the information related to the change of the irradiation position MA of the measurement light ML as the irradiation position information related to the irradiation position MA of the measurement light ML.

[0339] (2-4) Technical effects of processing system SYSb

[0340] As described above, the processing system SYSb of the second embodiment can perform a calibration operation using the light measuring device 18b. That is, the processing system SYSb can calibrate at least one of the irradiation position PA of the processing light EL and the irradiation position MA of the measuring light ML. Therefore, the processing system SYSb can properly irradiate the processing light EL to an appropriate position. As a result, the processing system SYSb can properly process the workpiece W. In addition, the processing system SYSb can properly irradiate the measuring light ML to an appropriate position. As a result, the processing system SYSb can properly measure the measurement object M.

[0341] (3) Processing System SYSc of the Third Embodiment

[0342] Next, the processing system SYS in the third embodiment will be described. In addition, in the following description, the processing system SYS in the third embodiment will be referred to as "processing system SYSc". The processing system SYSc in the third embodiment is different from the processing systems SYSa in the first embodiment to the processing systems SYSb in the second embodiment described above in that a processing unit 1c is provided instead of the above-mentioned processing unit 1 or 1b. Other features of the processing system SYSc may also be the same as other features of each of the processing systems SYSa to SYSb. The processing unit 1c is different from the processing unit 1 or 1b in that a processing head 13c is provided instead of the processing head 13. Other features of the processing unit 1c may also be the same as other features of the processing unit 1 or 1b. Therefore, in the following description, reference will be made to Fig.23 The structure of the processing head 13c in the third embodiment will be described. Fig.23 It is a cross-sectional view showing the structure of a machining head 13c in the third embodiment.

[0343] like Fig.23 As shown, the machining head 13c is different from the machining head 13 in that it has a machining optical system 131c instead of the machining optical system 131. The other features of the machining head 13c may be the same as those of the machining head 13.

[0344] The processing optical system 131c is different from the processing optical system 131 in that it also has a focus control optical system 1314c. Other features of the processing optical system 131c may also be the same as other features of the processing optical system 131. The focus control optical system 1314c is an optical system that can adjust (in other words, change) the focusing position of the processing light EL. Specifically, the focus control optical system 1314c is an optical system that can adjust the focusing position of the processing light EL along the irradiation direction of the processing light EL (for example, the Z-axis direction). Therefore, the focus control optical system 1314c has a focusing lens 1315c that can change the focusing position of the processing light EL. In addition, the focusing lens 1315c can also be called a focusing position adjustment optical system.

[0345] Here, in the third embodiment, similarly to the first or second embodiment described above, the irradiation optical system 135 can be replaced. In this case, the relative positional relationship between the focusing position of the processing light EL and the focusing position of the measurement light ML may change with the replacement of the irradiation optical system 135. In particular, the relative positional relationship between the focusing position of the processing light EL and the focusing position of the measurement light ML in the irradiation direction of the processing light EL (or the irradiation direction of the measurement light ML), that is, the Z-axis direction may change with the replacement of the irradiation optical system 135. As a result, the relative positional relationship between the focusing position of the processing light EL and the focusing position of the measurement light ML may become a positional relationship different from the desired positional relationship. For example, before the irradiation optical system 135 is replaced, the relative positional relationship between the focusing position of the processing light EL and the focusing position of the measurement light ML becomes a desired positional relationship, while after the irradiation optical system 135 is replaced, the relative positional relationship between the focusing position of the processing light EL and the focusing position of the measurement light ML may become a positional relationship different from the desired positional relationship. That is, when the irradiation optical system 135 mounted on the processing head 13 is replaced from the first irradiation optical system 135 to the second irradiation optical system 135, the relative positional relationship between the light-converging positions of the processing light EL emitted from the first irradiation optical system 135 and the measurement light ML becomes a desired positional relationship, while on the other hand, the relative positional relationship between the light-converging positions of the processing light EL emitted from the second irradiation optical system 135 and the measurement light ML may become a positional relationship different from the desired positional relationship. In addition, as an example of a desired positional relationship, a positional relationship in which the light-converging position of the processing light EL and the light-converging position of the measurement light ML in the Z-axis direction coincide with each other can be cited. That is, as an example of a desired positional relationship, a positional relationship in which the light-converging position of the processing light EL and the light-converging position of the measurement light ML in the Z-axis direction are located at the same position can be cited.

[0346] When the relative positional relationship between the focusing positions of the processing light EL and the measuring light ML becomes a positional relationship different from the desired positional relationship, for example, the processing system SYSc may process the workpiece W using the processing light EL whose focusing position is located on the surface of the workpiece W, and use the measuring light ML whose focusing position is not located on the surface of the workpiece W (that is, the measuring light ML in a defocused state) to measure the workpiece W. As a result, the processing system SYSc has a technical problem that it cannot properly measure the workpiece W (or any measurement object M). As an example, the processing system SYSc has a technical problem that the measurement accuracy deteriorates. Or, for example, the processing system SYSc may process the workpiece W using the processing light EL whose focusing position is not located on the surface of the workpiece W (that is, the processing light EL in a defocused state), and use the processing light EL whose focusing position is located on the surface of the workpiece W to measure the workpiece W. As a result, the processing system SYSc has a technical problem that it cannot properly process the workpiece W. As an example, the processing system SYSc has a technical problem that the processing accuracy deteriorates.

[0347] Therefore, in the third embodiment, in order to solve such a technical problem, the focus control optical system 1314c includes a plurality of focus lenses 1315c. In particular, the focus control optical system 1314c includes a plurality of focus lenses 1315c having different focal lengths.

[0348] When the first irradiation optical system 135 among the plurality of irradiation optical systems 135 that can be mounted on the processing head 13 is mounted on the processing head 13, the first focusing lens 1315c among the plurality of focusing lenses 1315c is used as one focusing lens 1315c for actually adjusting the focusing position of the processing light EL. Therefore, when the first irradiation optical system 135 is mounted on the processing head 13, the first focusing lens 1315c is located on the optical path of the processing light EL. On the other hand, the other focusing lenses 1315c among the plurality of focusing lenses 1315c that are different from the first focusing lens 1315c are not located on the optical path of the processing light EL. That is, the other focusing lenses 1315c are retracted from the optical path of the processing light EL.

[0349] The first focusing lens 1315c may also be capable of adjusting the focusing position of the processing light EL so that the relative positional relationship between the focusing position of the processing light EL and the focusing position of the measurement light ML when the first irradiation optical system 135 is installed in the processing head 13 becomes a desired positional relationship. As described above, when the desired positional relationship is a positional relationship in which the focusing position of the processing light EL and the focusing position of the measurement light ML coincide with each other in the Z-axis direction, the first focusing lens 1315c may also be capable of adjusting the focusing position of the processing light EL so that the distance (i.e., positional offset) between the focusing position of the processing light EL and the focusing position of the measurement light ML in the Z-axis direction when the first irradiation optical system 135 is installed in the processing head 13 becomes smaller than when other focusing lenses 1315c different from the first focusing lens 1315c are located on the optical path of the processing light EL. Alternatively, the first focusing lens 1315c may also be capable of adjusting the focusing position of the processing light EL so that the focusing position of the processing light EL and the focusing position of the measurement light ML in the Z-axis direction coincide with each other when the first irradiation optical system 135 is installed in the processing head 13.

[0350] On the other hand, when the second irradiation optical system 135 different from the first irradiation optical system 135 among the plurality of irradiation optical systems 135 that can be mounted on the processing head 13 is mounted on the processing head 13, the second focusing lens 1315c different from the first focusing lens 1315c among the plurality of focusing lenses 1315c is used as one focusing lens 1315c for actually adjusting the condensing position of the processing light EL. Therefore, when the second irradiation optical system 135 is mounted on the processing head 13, the second focusing lens 1315c is located on the optical path of the processing light EL. On the other hand, the other focusing lenses 1315c different from the second focusing lens 1315c among the plurality of focusing lenses 1315c are not located on the optical path of the processing light EL. That is, the other focusing lenses 1315c are retracted from the optical path of the processing light EL.

[0351] The second focusing lens 1315c may be capable of adjusting the focusing position of the processing light EL so that the relative positional relationship between the focusing position of the processing light EL and the focusing position of the measurement light ML in the case where the second irradiation optical system 135 is installed in the processing head 13 becomes a desired positional relationship. As described above, in the case where the desired positional relationship is a positional relationship in which the focusing position of the processing light EL and the focusing position of the measurement light ML coincide with each other in the Z-axis direction, the second focusing lens 1315c may be capable of adjusting the focusing position of the processing light EL so that the distance (i.e., positional offset) between the focusing position of the processing light EL and the focusing position of the measurement light ML in the Z-axis direction becomes smaller than in the case where another focusing lens 1315c different from the second focusing lens 1315c is located on the optical path of the processing light EL. Alternatively, in the case where the second irradiation optical system 135 is installed in the processing head 13, the second focusing len...

Claims

1. A processing system comprising: an irradiation optical system capable of irradiating an energy beam for processing an object toward the object; a loading device capable of loading the object onto a loading surface; a first changing device capable of changing at least one of a positional relationship and a posture relationship between the object placed on the placing device and the irradiation optical system; a light receiving device capable of receiving the energy light beam emitted from the irradiation optical system; a second changing device capable of changing the positional relationship between the light receiving device and the irradiation optical system; as well as Control device, Under the control of the control device, the light receiving device changes its position from a second position to a first position capable of receiving the energy beam through the second changing device, and the second position is different from the first position.

2. The processing system according to claim 1, wherein: The second position is a position outside the area capable of processing by the processing system.

3. The processing system according to claim 1 or 2, wherein: The first position is a position where the energy beam can be irradiated, The second position is a position where irradiation of the energy beam is prohibited.

4. The processing system according to any one of claims 1 to 3, wherein: The second changing device can change the positional relationship between the light receiving device and the irradiation optical system in a direction intersecting with the direction in which the energy light beam is irradiated.

5. The processing system according to any one of claims 1 to 4, wherein: The processing system includes a storage device capable of storing the light receiving device. The first position is a position outside the storage device, The second position is a position in the storage device.

6. The processing system according to any one of claims 1 to 4, wherein: The irradiation optical system is a first irradiation optical system, The first irradiation optical system can be replaced with a second irradiation optical system different from the first irradiation optical system. The second changing device changes the positional relationship between the light receiving device and the irradiating optical system when the first irradiating optical system is replaced with the second irradiating optical system.

7. The processing system according to claim 5, wherein: The irradiation optical system is a first irradiation optical system, The first irradiation optical system can be replaced with a second irradiation optical system different from the first irradiation optical system. The second changing device changes the positional relationship between the light receiving device and the irradiating optical system when the first irradiating optical system is replaced with the second irradiating optical system.

8. The processing system according to claim 7, wherein: The storage device can store the first irradiation optical system and the second irradiation optical system.

9. The processing system according to claim 7 or 8, wherein: The processing system includes a replacement device capable of replacing the first irradiation optical system with the second irradiation optical system. The replacement device has a housing having a storage space, and the storage space is provided with the storage device. The housing has a gas supply port formed therein, which is capable of supplying gas to the storage space.

10. The processing system according to claim 9, wherein: The gas is supplied from the gas supply port to at least one of the first irradiation optical system and the second irradiation optical system accommodated in the accommodation device.

11. The processing system according to claim 9 or 10, wherein: The gas supplied from the gas supply port to the storage space causes the gas pressure of the storage space to be higher than the gas pressure of the space in which the object is placed.

12. The processing system according to any one of claims 9 to 11, wherein: The processing system includes an emission optical system for emitting the energy beam toward the irradiation optical system. The replacement device replaces the irradiation optical system by detaching the irradiation optical system attached to the emitting optical system from the emitting optical system.

13. The processing system according to any one of claims 1 to 12, wherein: The control device obtains information related to the irradiation position of the energy beam based on the light reception result of the light receiving device.

14. The processing system according to claim 13, wherein: The information related to the irradiation position includes information related to a change in the irradiation position of the energy beam.

15. The processing system according to any one of claims 1 to 14, wherein: The energy beam is a processing beam, The irradiation optical system is capable of irradiating a measuring beam different from the processing beam and used for measuring the object to the object. The light receiving device disposed at the first position can receive the measuring light beam emitted from the irradiation optical system.

16. The processing system according to claim 15, wherein: The control device acquires information related to the irradiation position of the measurement light beam based on the light reception result of the light receiving device.

17. The processing system according to claim 16, wherein: The information on the irradiation position of the measuring beam includes information on a change in the irradiation position of the measuring beam.

18. The processing system according to any one of claims 15 to 17, wherein: During at least a portion of a period during which the light receiving device receives the processing light beam and the measuring light beam, the light receiving device is located on an optical path of at least one of the processing light beam and the measuring light beam. During at least a portion of each of a period during which the object is processed by the processing beam and a period during which the object is measured by the measuring beam, the light receiving device is located away from optical paths of the processing beam and the measuring beam.

19. The processing system according to any one of claims 1 to 14, wherein: The processing system includes a position changing device capable of changing the incident position of the energy beam to the irradiation optical system. The control device controls the position changing device according to the light receiving result of the light receiving device.

20. The processing system according to claim 19, wherein: The position changing device includes a first position changing optical system capable of deflecting the energy beam to change the irradiation position of the energy beam on the object.

21. The processing system according to any one of claims 15 to 17, wherein: The processing system includes a position changing device capable of changing the incident position of the energy beam to the irradiation optical system. The control device controls the position changing device according to the light receiving result of the light receiving device.

22. The processing system according to claim 21, wherein: The control device controls the position changing device so that the deviation between the irradiation position of the machining beam on the object and the irradiation position of the measuring beam on the object becomes smaller than before the position changing device is controlled.

23. The processing system according to claim 21 or 22, wherein: The control device controls the position changing device so that the irradiation position of the processing light beam on the object coincides with the irradiation position of the measuring light beam on the object.

24. A processing system according to any one of claims 21 to 23, wherein: The position changing device includes a first position changing optical system capable of deflecting the energy beam to change the irradiation position of the energy beam on the object.

25. A processing system according to any one of claims 21 to 24, wherein: The position changing device includes a second position changing optical system capable of deflecting the measuring beam to change an irradiation position of the measuring beam on the object.

26. A processing system according to any one of claims 21 to 25, wherein: The light receiving device comprises: a beam passing member having a passing area through which the processing beam and the measuring beam emitted from the irradiation optical system can pass respectively; and a light receiving unit capable of receiving the processing light beam and the measuring light beam respectively passing through the passing area, The control device controls the position changing device based on a result of the light receiving portion of the light receiving device disposed at the first position receiving the processing light beam and a result of the light receiving portion receiving the measuring light beam.

27. The processing system according to claim 26, wherein: A plurality of the passing areas are provided in the light beam passing component, The light receiving unit receives the processing light beams that have respectively passed through the plurality of passing regions and receives the measuring light beams that have respectively passed through the plurality of passing regions.

28. The processing system according to claim 27, wherein: The position changing device further includes a deflecting optical system capable of deflecting the processing beam to change the irradiation position of the processing beam on the object and capable of deflecting the measuring beam to change the irradiation position of the measuring beam on the object. The deflection optical system deflects the processing beam and the measuring beam respectively in such a manner that the processing beam and the measuring beam respectively scan the plurality of passing areas. The control device controls the position changing device based on the result of the light receiving device receiving the processing beam while the processing beam scans the plurality of passing areas and the result of the light receiving device receiving the measuring beam while the measuring beam scans the plurality of passing areas.

29. The processing system according to claim 28, wherein: The plurality of passing areas respectively include: a linear first area extending in a first direction intersecting a direction in which the plurality of passing areas are arranged and capable of allowing the processing light beam and the measuring light beam to pass through respectively; and a linear second region extending in a second direction obliquely intersecting the first direction and capable of allowing the processing light beam and the measuring light beam to pass through, The control device calculates a first timing when the processing light beam passes through the first area and a second timing when the processing light beam passes through the second area according to the light receiving result of the processing light beam by the light receiving device. The control device calculates a third timing when the measuring light beam passes through the first area and a fourth timing when the measuring light beam passes through the second area according to the light receiving result of the measuring light beam by the light receiving device, The control device controls the position changing device based on at least one of a difference between the first timing and the third timing and a difference between the second timing and the fourth timing.

30. A processing system according to any one of claims 21 to 29, wherein: The position changing device can change the relative positional relationship between the irradiation position of the machining beam on the object and the irradiation position of the measuring beam on the object to a first direction intersecting with the irradiation direction of the measuring beam.

31. A processing system according to any one of claims 1 to 30, wherein: The first changing device changes at least one of a positional relationship and a posture relationship between the object and the irradiation optical system by moving the position of the mounting device.

32. A processing system according to any one of claims 1 to 31, wherein: The second changing device can change the positional relationship between the light receiving device and the irradiation optical system by moving the position of the light receiving device.

33. A processing system according to any one of claims 1 to 32, wherein: Under the control of the control device, the light receiving device is changed in position from the second position to the first position between the placement surface and the irradiation optical system by the second changing device.

34. A processing system according to any one of claims 1 to 33, wherein: The processing system includes a limiting member that is limited by the second changing device so that the light receiving device is located at a predetermined position.

35. A processing system according to any one of claims 1 to 34, wherein: The processing system includes a position measuring device that measures the position of the light receiving device changed by the second changing device.

36. The processing system of claim 35, wherein: The position measuring device is a first position measuring device, The processing system includes a second position measuring device that measures the position of the irradiation optical system.

37. A processing system according to claim 35 or 36, wherein: The control device controls the position at which the energy beam is irradiated according to the measurement result of the position measurement device.

38. A processing system according to any one of claims 35 to 37, wherein: The position measuring device includes at least one of an encoder, an interferometric measuring device, and a potentiometer.

39. A processing system according to any one of claims 1 to 38, wherein: The control device can obtain information related to the positional relationship between the mounting device and the light receiving device.

40. The processing system of claim 39, wherein: The control device controls the position at which the energy beam is irradiated based on information on the positional relationship between the mounting device and the light receiving device.

41. A processing system comprising: an irradiation optical system capable of irradiating a processing light beam for processing an object toward the object and capable of irradiating a measuring light beam for measuring the object toward the object and comprising at least an objective optical system; a light receiving device capable of receiving the processing light beam and the measuring light beam emitted from the irradiation optical system; a position changing device capable of changing at least one of an irradiation position of the processing light beam on the object and an irradiation position of the measuring light beam on the object; as well as Control device, The control device controls the position changing device according to the result of the light receiving device receiving the processing light beam and the result of the light receiving device receiving the measuring light beam.

42. The processing system according to claim 41, wherein: The control device obtains the irradiation position of the processing light beam and the irradiation position of the measuring light beam according to the light receiving result of the light receiving device. The control device controls the position changing device based on the acquired irradiation position of the processing beam and the irradiation position of the measuring beam.

43. A processing system according to claim 41 or 42, wherein: The control device controls the position changing device so that the deviation between the irradiation position of the machining beam on the object and the irradiation position of the measuring beam on the object becomes smaller than before the position changing device is controlled.

44. A processing system according to any one of claims 41 to 43, wherein: The control device controls the position changing device so that the irradiation position of the processing light beam on the object coincides with the irradiation position of the measuring light beam on the object.

45. A processing system according to any one of claims 41 to 44, wherein: The position changing device includes a first position changing optical system capable of deflecting the processing light beam to change an irradiation position of the processing light beam on the object.

46. ​​A processing system according to any one of claims 41 to 45, wherein: The position changing device includes a second position changing optical system capable of deflecting the measuring beam to change an irradiation position of the measuring beam on the object.

47. A processing system according to any one of claims 41 to 46, wherein: The light receiving device comprises: a beam passing member having a passing area through which the processing beam and the measuring beam emitted from the irradiation optical system can pass respectively; and a light receiving unit capable of receiving the processing light beam and the measuring light beam respectively passing through the passing area, The control device controls the position changing device according to the result of the light receiving unit receiving the processing light beam and the result of the light receiving unit receiving the measuring light beam.

48. The processing system of claim 47, wherein: A plurality of the passing areas are provided in the light beam passing component, The light receiving unit receives the processing light beams that have respectively passed through the plurality of passing regions and receives the measuring light beams that have respectively passed through the plurality of passing regions.

49. The processing system of claim 48, wherein: The processing system further includes a deflection optical system capable of deflecting the processing beam to change the irradiation position of the processing beam on the object and capable of deflecting the measuring beam to change the irradiation position of the measuring beam on the object. The deflection optical system deflects the processing beam and the measuring beam respectively in such a manner that the processing beam and the measuring beam respectively scan the plurality of passing areas in one direction along the surface of the beam passing the component, The control device controls the position changing device based on the result of the light receiving device receiving the processing beam while the processing beam scans the plurality of passing areas and the result of the light receiving device receiving the measuring beam while the measuring beam scans the plurality of passing areas.

50. The processing system of claim 49, wherein: The plurality of passing areas respectively include: a linear first area extending in a first direction intersecting a direction in which the plurality of passing areas are arranged and capable of allowing the processing light beam and the measuring light beam to pass through respectively; and a linear second region extending in a second direction obliquely intersecting the first direction and capable of allowing the processing light beam and the measuring light beam to pass through, The control device calculates a first timing when the processing light beam passes through the first area and a second timing when the processing light beam passes through the second area according to the light receiving result of the processing light beam by the light receiving device. The control device calculates a third timing when the measuring light beam passes through the first area and a fourth timing when the measuring light beam passes through the second area according to the light receiving result of the measuring light beam by the light receiving device, The control device controls the position changing device based on at least one of a difference between the first timing and the third timing and a difference between the second timing and the fourth timing.

51. A processing system according to any one of claims 41 to 50, wherein: The irradiation optical system is a first irradiation optical system, The first irradiation optical system can be replaced with a second irradiation optical system different from the first irradiation optical system. When the first irradiation optical system is replaced with the second irradiation optical system, the light receiving device receives the processing beam and the measuring beam emitted from the second irradiation optical system, respectively.

52. A processing system according to any one of claims 41 to 51, wherein: During at least a portion of a period during which the light receiving device receives the processing light beam and the measuring light beam, the light receiving device is located on an optical path of at least one of the processing light beam and the measuring light beam. During at least a portion of each of a period during which the object is processed by the processing beam and a period during which the object is measured by the measuring beam, the light receiving device is located away from optical paths of the processing beam and the measuring beam.

53. A processing system according to any one of claims 41 to 52, wherein: The position changing device can change the relative positional relationship between the irradiation position of the machining beam on the object and the irradiation position of the measuring beam on the object to a first direction intersecting with the irradiation direction of the measuring beam.

54. A processing system according to any one of claims 41 to 53, wherein: The position changing device can change the relative positional relationship between the irradiation position of the processing light beam on the object and the irradiation position of the measuring light beam on the object.

55. A processing system comprising: A deflection optical system capable of deflecting an energy beam used for processing or measuring an object to change an irradiation position of the energy beam on the object; an irradiation optical system capable of irradiating the energy beam emitted from the deflection optical system to the object; a light receiving device capable of receiving the energy light beam emitted from the irradiation optical system; a position changing device capable of changing the irradiation position of the energy beam on the object by changing the position or posture of the deflection optical system; as well as a control device for controlling the position changing device according to the light receiving result of the energy beam by the light receiving device, The light receiving device comprises: a beam passing member formed with a plurality of passing areas through which the energy beam emitted from the irradiation optical system can pass; and a light receiving unit capable of receiving the energy light beams respectively passing through the plurality of passing areas, The deflection optical system deflects the energy beam in such a manner that the energy beam scans the plurality of passing areas in one direction along the surface of the beam passing member, The control device controls the position changing device according to the light receiving result of the energy light beam by the light receiving device.

56. The processing system of claim 55, wherein: The light receiving unit receives the energy light beams respectively passing through the plurality of passing areas via a light receiving optical system.

57. The processing system of claim 56, wherein: The light receiving optical system emits the energy light beam that has passed through a first passing area of ​​the plurality of passing areas from a first portion of the light receiving optical system. The light receiving optical system emits the energy light beam that has passed through a second passing area different from the first passing area among the plurality of passing areas from a second portion of the light receiving optical system different from the first portion, The energy beam emitted from the first portion is incident on the light receiving portion through a first optical path from the first portion toward the light receiving portion. The energy beam emitted from the second portion enters the light receiving portion through a second optical path that runs from the first portion toward the light receiving portion and is different from the first optical path.

58. A processing system according to any one of claims 55 to 57, wherein: The light receiving device has one light receiving unit.

59. A processing system according to any one of claims 55 to 58, wherein: The plurality of passage areas are formed on the surface of the beam passing member so as to be distributed within a scanning area in which the deflection optical system can set an irradiation position of the energy beam by deflecting the energy beam.

60. A processing system according to any one of claims 55 to 59, wherein: The deflection optical system deflects the energy beam so that the energy beam scans the plurality of passing areas along the one direction in a state where the positional relationship between the light receiving device and the irradiation optical system is fixed.

61. A processing system according to any one of claims 55 to 60, wherein: The plurality of passing areas respectively include: a linear first region extending along a first direction intersecting the direction in which the plurality of passing regions are arranged and capable of allowing the energy beam to pass through; and A linear second area extends along a second direction obliquely intersecting the first direction and capable of allowing the energy beam to pass through.

62. The processing system of claim 61, wherein: The control device calculates a first timing when the energy beam passes through the first area and a second timing when the energy beam passes through the second area based on the light reception result of the energy beam by the light receiving device, and controls the position changing device based on the first timing and the second timing.

63. A processing system according to any one of claims 55 to 62, wherein: The position changing device includes a position changing optical system capable of deflecting the energy beam to change the irradiation position of the energy beam on the object.

64. A processing system according to any one of claims 55 to 63, wherein: The irradiation optical system is a first irradiation optical system, The first irradiation optical system can be replaced with a second irradiation optical system different from the first irradiation optical system. When the first irradiation optical system is replaced with the second irradiation optical system, the light receiving device receives the energy light beam emitted from the second irradiation optical system.

65. A processing system according to any one of claims 55 to 64, wherein: During at least a portion of the period when the light receiving device receives the energy beam, the light receiving device is located on an optical path of at least one side of the energy beam, and during at least a portion of the period when the object is processed or measured by the energy beam, the light receiving device is located away from the optical path of the energy beam.

66. A processing system comprising: An emission optical system capable of emitting an energy beam for processing or measuring an object and comprising a plurality of focusing position adjustment optical systems capable of adjusting a focusing position of the energy beam and having mutually different focal lengths; a plurality of irradiation optical systems capable of irradiating the energy beam emitted from the emission optical system toward the object and being attachable to and detachable from the emission optical system and including at least an objective optical system; a replacement device capable of replacing the irradiation optical system installed in the emission optical system; as well as A control device determines the type of the irradiation optical system installed in the emission optical system, selects one of a plurality of focusing position adjustment optical systems based on the determined type, and moves the selected one focusing position adjustment optical system so that the one focusing position adjustment optical system is located in the optical path of the energy beam.

67. The processing system of claim 66, wherein: When a first replacement optical system that can be used as the irradiation optical system is installed in the emission optical system as the irradiation optical system, the control device selects a first focusing position adjustment optical system among the plurality of focusing position adjustment optical systems as the one focusing position adjustment optical system, When a second replacement optical system that can be used as the irradiation optical system and is different from the first replacement optical system is installed in the emission optical system as the irradiation optical system, the control device selects a second focusing position adjustment optical system that is different from the first focusing position adjustment optical system among the multiple focusing position adjustment optical systems as the one focusing position adjustment optical system.

68. A processing system according to claim 66 or 67, wherein: The replacement device replaces the irradiation optical system by attaching one of a plurality of replacement optical systems that can be used as the irradiation optical system to the emission optical system as the irradiation optical system. The plurality of focusing position adjustment optical systems correspond one-to-one to the plurality of replacement optical systems.

69. A processing system according to any one of claims 66 to 68, wherein: The emission optical system is capable of emitting a processing beam for processing the object and a measuring beam for measuring the object as the energy beam. The control device selects one of the multiple focusing position adjustment optical systems so that the offset between the focusing position of the processing light beam and the focusing position of the measuring light beam in the direction along the optical axis of the irradiation optical system becomes smaller than that in the case where other focusing position adjustment optical systems different from the one focusing position adjustment optical system are selected.

70. A processing system according to any one of claims 66 to 69, wherein: The emission optical system is capable of emitting a processing beam for processing the object and a measuring beam for measuring the object as the energy beam. The control device selects one of a plurality of focusing position adjustment optical systems so that the focusing position of the processing beam coincides with the focusing position of the measuring beam in a direction along the optical axis of the irradiation optical system.

71. A processing system according to claim 69 or 70, wherein: The control device moves the selected one focusing position adjustment optical system so that the one focusing position adjustment optical system is located in the optical path of either the processing beam or the measuring beam.

72. A processing system comprising: an irradiation optical system capable of irradiating an energy beam toward an object; a first changing device capable of changing at least one of a positional relationship and a posture relationship between the object and the irradiation optical system; a light receiving device capable of receiving the energy light beam emitted from the irradiation optical system; a second changing device capable of changing the positional relationship between the light receiving device and the irradiation optical system; as well as Control device, Under the control of the control device, the light receiving device changes its position from a second position to a first position capable of receiving the energy beam through the second changing device, and the second position is different from the first position.

73. A processing system comprising: an irradiation optical system capable of irradiating a first light beam toward an object and capable of irradiating a second light beam different from the first light beam toward the object; a light receiving device capable of receiving the first light beam and the second light beam emitted from the irradiation optical system; a position changing device capable of changing at least one of an irradiation position of the first light beam on the object and an irradiation position of the second light beam on the object; as well as Control device, The control device controls the position changing device according to the light receiving result of the first light beam by the light receiving device and the light receiving result of the second light beam by the light receiving device.

74. A processing system comprising: A deflection optical system capable of deflecting the energy beam to change the irradiation position of the energy beam on the object; an irradiation optical system capable of irradiating the energy beam emitted from the deflection optical system to the object; a light receiving device capable of receiving the energy light beam emitted from the irradiation optical system; a position changing device capable of changing the irradiation position of the energy beam on the object by changing the position or posture of the deflection optical system; as well as a control device for controlling the position changing device according to the light receiving result of the energy beam by the light receiving device, The light receiving device comprises: a beam passing member formed with a plurality of passing areas through which the energy beam emitted from the irradiation optical system can pass; and a light receiving unit capable of receiving the energy light beams respectively passing through the plurality of passing areas, The control device controls the position changing device according to the light receiving result of the energy light beam by the light receiving device.

75. A processing system comprising: An emission optical system capable of emitting an energy beam and comprising a plurality of light-focusing position adjustment optical systems capable of adjusting the light-focusing position of the energy beam and having different focal lengths; a plurality of irradiation optical systems capable of irradiating the energy beam emitted from the emission optical system toward the object and being attachable to and detachable from the emission optical system and including at least an objective optical system; a replacement device capable of replacing the irradiation optical system installed in the emission optical system; as well as A control device determines the type of the irradiation optical system installed in the emission optical system, selects one of a plurality of focusing position adjustment optical systems based on the determined type, and moves the selected one focusing position adjustment optical system so that the one focusing position adjustment optical system is located in the optical path of the energy beam.

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