Probe device

Abstract

Disclosed is a probe device in which an upper contact part and a lower contact part of a probe pin can operate independently by using a structure in which the elastic forces between the upper contact part of the probe pin in contact with a terminal of an electronic component and the lower contact part of the probe pin in contact with a terminal of a substrate do not affect each other.

Description

Technical Field

[0001] The present invention, as a probe device, more specifically, relates to a probe device that adopts a structure in which the contact forces between the upper contact portion of the probe pin that contacts the terminal of the electronic component and the lower contact portion of the probe pin that contacts the terminal of the substrate do not affect each other, so that the upper contact portion and the lower contact portion of the probe pin can work independently. Background Art

[0002] In the manufacturing process of electronic components, a probe device is used to detect the electrical characteristics of the electronic components. The probe device is a device that electrically connects the electronic component to a substrate that operates the electronic component to test the electrical characteristics of the electronic component.

[0003] One side of the probe pin of the probe device contacts the terminal of the electronic component, and the other side contacts the terminal of the substrate. However, in order to form a stable electrical contact, one side of the probe pin is pressurized so that it contacts the terminal of the electronic component and is pressed to a certain level, and the other side of the probe pin is pressurized so that it contacts the terminal of the substrate and is pressed to a certain level.

[0004] Various configurations of probe pins are being disclosed in order to improve terminal contact of the probe pins with respect to the probe device.

[0005] As an example, Korean Patent Publication No. 2152230 discloses a technology for a probe pin and a detection unit using the same. Figure 1 A probe pin disclosed in the prior art is shown.

[0006] The probe pin 10 has a first contact 11 on one side and a second contact 12 on the other side. The movable pin 20 of the probe pin 10 is composed of a first curved portion 21, a straight portion 22 and a second curved portion 23. That is, a resilient portion in a repeated zigzag form is formed at the middle end of the probe pin 10.

[0007] Looking at the operation of the probe pin 10 according to such a related art, an external force is applied to each of the first contact 11 and the second contact 12 of the probe pin 10 and pressurized while the contact forces thereof influence each other.

[0008] That is, if an external force is applied to the first contact 11 of the probe pin 10, the elastic part of the movable pin 20 is pressurized, so that the contact force of the first contact 11 is transmitted to the second contact 12. Conversely, if an external force is applied to the second contact 12 of the probe pin 10, the elastic part of the movable pin 20 is pressurized and the contact force of the second contact 12 is transmitted to the first contact 11.

[0009] Thus, there is a problem that the external forces applied to the first contacts 11 and the second contacts 12 of the probe pin 10 are added together, and thus the overall contact force applied to the probe pin 10 is further increased.

[0010] Such a contact force not only affects the probe pin 10 alone, but also causes a problem that the total contact force applied to the first contact 11 and the second contact 12 affects the electronic component and the substrate in contact with the probe pin 10 .

[0011] Meanwhile, it is necessary to apply different external forces to the first contact 11 and the second contact 12 of the probe pin 10 depending on the situation. However, the contact forces between the first contact 11 and the second contact 12 affect each other, so there is a problem that the first contact 11 and the second contact 12 cannot work independently.

[0012] In particular, the contact resistance of the first contact 11 and the contact resistance of the second contact 12 of the probe pin 10 must be reduced to enable more accurate testing of the electronic component, but the contact resistance can be controlled by adjusting the contact force applied to each contact, thereby reducing the contact resistance of the entire probe pin 10. However, there is a problem that the contact force of the first contact 11 and the contact force of the second contact 12 of the probe pin 10 affect each other, so the contact resistance of each contact cannot be easily controlled, and thus, there is a problem that it is difficult to match the overall contact resistance of the probe pin 10 to an optimal level. Summary of the invention

[0013] The present invention has been developed to solve the above-mentioned problems of the prior art and aims to disclose a technology that uses a structure in which the contact force generated by the probe pin contacting an electronic component and the contact force generated by contacting a substrate do not affect each other so that each contact point of the probe pin can operate independently.

[0014] In particular, it is necessary to solve the problem that the contact force generated by the probe pins being in contact and pressurized with the electronic component and the contact force generated by the probe pins being in contact and pressurized with the substrate are added together, thereby further increasing the pressure.

[0015] Furthermore, only by reducing the contact resistance of each contact point can more accurate testing of electronic components be performed. However, the contact forces of each contact point affect each other, so the contact resistance of each contact point cannot be more easily controlled, making it difficult to match the overall contact resistance of the probe pin to an optimal level.

[0016] Furthermore, it is necessary to solve the problem that as the contact points of the probe pins influence each other, a greater external force is transmitted to the electronic components and the substrate.

[0017] The objects of the present invention are not limited to the aforementioned ones, and other objects and advantages of the present invention not mentioned can be understood from the following description.

[0018] It may be that according to one embodiment of the probe device of the present invention, it includes: a probe pin, including an upper contact part, a lower contact part and a contact force control part connecting the upper contact part and the lower contact part; and a guide block, which is placed on the probe pin and supports the probe pin, and provides a bending space that can be deformed for the upper and lower ends of the contact force control part while supporting the contact force control part, and the guide block cuts off the transmission of contact force between the upper contact part and the lower contact part of the probe pin so that the upper contact part and the lower contact part of the probe pin can work independently, thereby controlling the contact resistance of the upper contact part and the lower contact part.

[0019] As an example, one end of the upper contact portion may be in contact with a terminal of an electronic component, and one end of the lower contact portion may be in contact with a terminal of a substrate, the contact force control portion includes a bent portion between the upper end portion and the lower end portion, the upper end portion is bent and connected to the other side of the upper contact portion to impart elastic force to the bent portion, and the lower end portion is bent and connected to the other side of the lower contact portion to impart elastic force, and the guide block includes a main body portion, which includes: an upper area, providing an upper bending space so that the upper end portion of the contact force control portion can be deformed; a lower area, providing a lower bending space so that the lower end portion of the contact force control portion can be deformed; and a supporting area, embedded in and fixing the bent portion of the contact force control portion.

[0020] Furthermore, the probe device may further include: a support block which is inserted into a side portion of the guide block supporting the contact force control portion of the probe pin and abuts against at least a portion of the outer surface of the contact force control portion to restrict movement.

[0021] Furthermore, the guide block may include: an upper slit portion, extending upward from the main body portion and having an upper slit, wherein the upper slit has an insertion space into which a portion of the upper contact portion of the probe pin is inserted to support the portion of the upper contact portion of the probe pin; and a lower slit portion, extending downward from the main body portion and having a lower slit, wherein the lower slit has an insertion space into which a portion of the lower contact portion of the probe pin is inserted to support the portion of the lower contact portion of the probe pin.

[0022] As an example, the contact force control portion of the probe pin may include: an upper end portion, bent from the upper contact portion in the width direction; a lower end portion, bent from the lower contact portion in the width direction; and a bending portion, bent in the width direction between the upper end portion and the lower end portion and connected to the upper end portion and the lower end portion, the upper slit of the upper slit portion and the lower slit of the lower slit portion being arranged with a slit space, one side of the slit space being open and having a width corresponding to the thickness dimension of the probe pin and a depth corresponding to the width dimension of the probe pin.

[0023] As an example, the contact force control portion of the probe pin may include: an upper end portion, bent from the upper contact portion in the thickness direction; a lower end portion, bent from the lower contact portion in the thickness direction; and a bending portion, bent in the thickness direction between the upper end portion and the lower end portion so as to be connected to the upper end portion and the lower end portion, and the upper slit of the upper slit portion and the lower slit of the lower slit portion are provided with a slit space, one side of the slit space is open, and has a width corresponding to the width dimension of the probe pin and a depth corresponding to the thickness dimension of the probe pin.

[0024] As an example, the guide block may include a middle slit extending from and continuing from an upper slit of the upper slit portion and a lower slit of the lower slit portion in the upper region, the lower region, and the support region, and the upper bending space and the lower bending space are provided inside the middle slit.

[0025] As an example, the upper slit portion may include a first upper slit on one side and a second upper slit on the other side that is separated from and opposite to the first upper slit by a first spacing distance, the lower slit portion may include a first lower slit on one side and a second lower slit on the other side that is separated from and opposite to the first lower slit by a second spacing distance, a plurality of probe pins may be relatively arranged on two side surfaces of the guide block, the upper contact portions of the probe pins that are opposite to each other are separated and arranged at the first spacing distance, and the lower contact portions of the probe pins that are opposite to each other are separated and arranged at the second spacing distance.

[0026] Furthermore, the lower slit portion of the guide block may control the movement amount of the end of the lower contact portion of the probe pin generated by the contact pressure with the terminal of the substrate by adjusting any one or more of the size of the insertion space for the lower slit or the size of the lower bending space for the guide block.

[0027] Furthermore, the probe device may also include: a floating plate, which is arranged above the probe pin and is provided with a guide hole corresponding to the end of the upper contact portion of the probe pin, and the movement amount of the end of the upper contact portion of the probe pin generated by the contact pressure with the terminal of the electronic component is controlled by adjusting either the size or the position of the guide hole.

[0028] According to the present invention, each contact point of the probe pin can be operated independently by using a structure in which the contact force generated when the probe pin contacts the electronic component and the contact force generated when the probe pin contacts the substrate do not affect each other.

[0029] In particular, the upper and lower contact portions of the probe pins operate independently without affecting each other in contact force, so that the degree of pressure applied by the probe device to the electronic component and the substrate can be easily and independently adjusted.

[0030] The contact forces between the upper contact portion and the lower contact portion do not affect each other, so each of the upper contact portion and the lower contact portion can work independently, thereby easily controlling the contact resistance of the upper contact portion and the lower contact portion, and adjusting the overall contact resistance of the probe pin to an optimal level to perform more accurate testing on electronic components.

[0031] The effects of the present invention are not limited to the effects described above, and a person having ordinary knowledge in the technical field to which the present invention pertains can clearly understand other effects not described from the following description. BRIEF DESCRIPTION OF THE DRAWINGS

[0032] Figure 1 A probe pin according to the prior art is shown.

[0033] Figures 2 to 4 An embodiment of a probe device according to the present invention is shown.

[0034] Figures 5 to 7 An embodiment of the probe pin assembly in the present invention is shown.

[0035] Figures 8 to 11 The operation of an embodiment of a probe device according to the present invention is shown.

[0036] Figure 12 to Figure 14 An example in which the upper contact portion and the lower contact portion are independently operated in one embodiment of the probe device according to the present invention is shown.

[0037] Fig.15 Results of testing the contact resistance according to the contact force of each contact point are shown.

[0038] Figures 16 to 18 Another embodiment of the probe pin assembly in the present invention is shown.

[0039] Fig.19 as well as Fig. 20 Still another embodiment of the probe pin assembly in the present invention is shown.

[0040] Fig.21 as well as Fig. 22 Still another embodiment is shown for a probe pin assembly according to the present invention.

[0041] Fig.23 Still another embodiment is shown for a probe pin assembly according to the present invention. DETAILED DESCRIPTION

[0042] Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings; however, the present invention is not limited or restricted by the embodiments.

[0043] In order to illustrate the present invention and the working advantages of the present invention and the objects achieved by the implementation of the present invention, preferred embodiments of the present invention will be illustrated and observed with reference to them.

[0044] First, the terms used in this application are only used to illustrate specific embodiments and are not used to limit the present invention. Unless there is a clearly different definition in the context, a singular expression may include a plural expression. In addition, in this application, the terms "including" or "having" should be understood as being used to specify the existence of features, numbers, steps, operations, constituent elements, parts or combinations recorded in the specification, and do not preclude the existence or additional possibility of one or more other features or numbers, steps, operations, constituent elements, parts or combinations.

[0045] When describing the present invention, if it is judged that a specific description related to a well-known structure or function may obscure the gist of the present invention, the detailed description will be omitted.

[0046] The present invention is a probe device for testing the electrical characteristics of electronic components. It discloses a probe device that adopts a structure in which the contact forces between the upper contact portion of the probe pin that contacts the terminal of the electronic component and the lower contact portion of the probe pin that contacts the terminal of the substrate do not affect each other, so that the upper contact portion and the lower contact portion of the probe pin can work independently.

[0047] Figures 2 to 4 An embodiment of a probe device according to the present invention is shown.

[0048] The probe device 100 may include a probe pin assembly 200 , a support block 110 , a floating plate 130 , an upper cover 140 , and the like.

[0049] The probe pin assembly 200 may be configured such that the probe pin 250 is mounted on the guide block 210 .

[0050] In this embodiment, the probe device 100 is used as an example of an electronic component for testing terminals arranged in two rows. The probe pin assembly 200 corresponds to the terminal arrangement on the left and right sides of the electronic component, so that the probe pins 250 can be installed on the left and right sides of the guide block 210.

[0051] The support block 110 is provided with support spaces 111 for inserting a part of the side surfaces of the probe pin assembly 200, and a part of the side surface of the probe pin assembly 200 is inserted into the support space 111 of the support block 110, so that the support block 110 and the probe pin assembly 200 can be fastened.

[0052] The inner wall of the support space 111 of the support block 110 may abut against the probe pin 250 of the probe pin assembly 200. The support block 110 limits movement according to the contact force of the probe pin 250, but this will be described in detail below through embodiments.

[0053] As an example, the support block 110 may be formed by a first support block 110a and a second support block 110b corresponding to the left and right sides of the probe pin assembly 200. The probe pin assembly 200 is arranged in the center and the first support block 110a and the second support block 110b are combined with each other on the left and right sides so that the support block 110 and the probe pin assembly 200 can be fastened. The first support block 110a and the second support block 110b may be provided with fastening protrusions 115 and fastening grooves 117 on their sides so as to correspond to each other and be fastened.

[0054] The upper cover 140 may be disposed above the support block 110 , and the floating plate 130 may be disposed above the probe pin assembly 200 between the upper cover 140 and the support block 110 .

[0055] The upper cover 140 may be provided with a through hole 141 into which a portion of the floating plate 130 can be inserted. The floating plate 130 is fastened to the through hole 141 of the upper cover 140 and can be lowered by an external force or raised to the height of the upper cover 140 by the elastic force of the elastic member 150 .

[0056] The guide holes 131 may be formed in the floating plate 130 corresponding to the upper contact portions of the probe pins 250. As the floating plate 130 descends, the guide holes 131 guide the upper contact portions of the probe pins 250, so that the upper contact portions of the probe pins 250 may be exposed to the outside. The guide holes 131 of the floating plate 130 may be variously changed corresponding to the number and size of the probe pins 250 of the probe pin assembly 200 and their positions.

[0057] The floating plate 130 can be lowered by the pressure of the electronic component by placing the electronic component to be tested by the probe device 100. As the floating plate 130 is lowered, the probe pins 250 of the probe pin assembly 200 can contact the terminals of the electronic component through the guide holes 131 of the floating plate 130.

[0058] The floating plate 130 can restore its position by the elastic force of the elastic member 150. One side of the elastic member 150 can be connected to the bottom of the floating plate 130, and the other side can be connected to the support block 110. An elastic member fastening portion (not shown) inserted into and fastened to one side of the elastic member 150 can be provided on the bottom of the floating plate 130, and an elastic member mounting hole 113 inserted into the other side of the elastic member 150 can be provided on the support block 110.

[0059] When the floating plate 130 places an electronic component to be tested and is pushed downward by the pressurization of the electronic component, external force is applied to the elastic member 150 , and when the electronic component is removed from the floating plate 130 , the floating plate 130 is pushed upward by the restoring force of the elastic member 150 and rises.

[0060] A stopper 135 that contacts the upper cover 140 may be provided around the outer contour of the floating plate 130. When the floating plate 130 rises due to the restoring force of the elastic member 150, the stopper 135 of the floating plate 130 contacts the lower surface of the peripheral portion of the through hole 141 of the upper cover 140, so that the rise of the floating plate 130 is restricted, thereby maintaining the rising position of the floating plate 130.

[0061] Figures 5 to 7 An embodiment of the probe pin assembly in the present invention is shown, and reference is made to the Figures 5 to 7 Let's take a closer look at the probe pin assembly 200.

[0062] The probe pin 250 may include an upper contact portion 251 , a lower contact portion 253 , and a contact force control portion 255 .

[0063] The upper contact portion 251 is vertically erected, and one end thereof can contact a terminal of an electronic component. In addition, the lower contact portion 253 is vertically erected, and one end thereof can contact a terminal of a substrate.

[0064] The contact force control portion 255 may be connected between the upper contact portion 251 and the lower contact portion 253. The contact force control portion 255 may include an upper end portion 256, a bent portion 257, and a lower end portion 258.

[0065] The upper end portion 256 of the contact force control portion 255 may extend from the other end of the upper contact portion 251 and bend in the outer direction to provide elastic force to the upper contact portion 251. For example, if the upper contact portion 251 is lowered by an external force, the upper end portion 256 of the contact force control portion 255 bends downward while providing elastic force, and if the external force applied to the upper contact portion 251 is removed, the upper end portion 256 of the contact force control portion 255 is lifted upward by a restoring force while pushing the upper contact portion 251, so that the position of the upper contact portion 251 can be restored.

[0066] Similarly, the lower end portion 258 of the contact force control portion 255 may extend from the other end of the lower contact portion 253 and bend in the outer direction to provide elastic force to the lower contact portion 253. As an example, if the lower contact portion 253 rises due to an external force, the lower end portion 258 of the contact force control portion 255 bends upward while providing elastic force, and if the external force applied to the lower contact portion 253 is removed, the lower end portion 258 of the contact force control portion 255 drops downward due to a restoring force while pushing the lower contact portion 253, so that the position of the lower contact portion 253 can be restored.

[0067] One side of the bending portion 257 of the contact force control portion 255 is connected to the upper end portion 256 and bent downward, and the other side is connected to the lower end portion 258 and bent upward, and can connect between the upper end portion 256 and the lower end portion 258 .

[0068] In the present embodiment, the probe pin 250 is in a form in which the upper end portion 256 , the bent portion 257 , and the lower end portion 258 of the contact force control portion 255 are bent in the thickness direction.

[0069] The guide block 210 for receiving the probe pin 250 may include a body 220, an upper slit 230, a lower slit 240, etc. The body 220, the upper slit 230, and the lower slit 240 may be combined into different separate structures to manufacture the guide block 210, or may be integrally formed into one block.

[0070] The main body 220 may include an upper region 221, a support region 222, a lower region 223, etc. This embodiment is an example in which the probe pins 250 are arranged in two rows facing each other. Accordingly, an upper region 221, a support region 222, and a lower region 223 may be provided on each of the left and right sides of the main body 220 of the guide block 210.

[0071] The upper region 221 of the main body 220 may provide an upper bending space 224 so that the upper end portion 256 of the contact force control portion 255 of the probe pin 250 can be deformed. As an example, as the upper contact portion 251 of the probe pin 250 is pressurized, the upper end portion 256 of the contact force control portion 255 corresponds to a shape that is bent and deformed by being pushed downward, so that a concave space can be formed in a curved form in the upper region 221 of the main body 220, and the concave space can be provided as the upper bending space 224.

[0072] Preferably, an upper curved space 224 whose depth decreases as it moves from the upper slit portion 230 toward the supporting region 222 may be provided in the upper region 221 of the main body portion 220 .

[0073] Similarly, the lower region 223 of the main body 220 can provide a lower bending space 225 so that the lower end portion 258 of the contact force control portion 255 of the probe pin 250 can be deformed. As an example, as the lower contact portion 253 of the probe pin 250 is pressurized, the lower end portion 258 of the contact force control portion 255 corresponds to the shape of bending deformation caused by being pushed upward, so that a concave space can be formed in a curved form in the lower region 223 of the main body 220, and the concave space can be provided as the lower bending space 225.

[0074] Preferably, a lower curved space 225 whose depth decreases as it moves from the lower slit portion 240 toward the supporting region 222 may be provided in the lower region 223 of the main body portion 220 .

[0075] The support area 222 of the main body 220 can fix and support the bent portion 257 of the contact force control portion 255 of the probe pin 250. As an example, the support area 222 of the main body 220 is formed with a thickness corresponding to the bent portion 257 of the contact force control portion 255 of the probe pin 250, so that the contact force control portion 255 of the probe pin 250 can be inserted and embedded in the support area 222 of the main body 220.

[0076] The upper slit portion 230 may extend upward from the middle end of the upper surface of the main body portion 220 and may be formed at a height corresponding to the size of the upper contact portion 251 of the probe pin 250. Preferably, the upper slit portion 230 may be formed at a height lower than the size of the upper contact portion 251 of the probe pin 250 so that the upper contact portion 251 of the probe pin 250 may be exposed to the outside through the guide hole 131 of the floating plate 130. Further, the height of the upper slit portion 230 may be adjusted in order to adjust the degree to which the upper contact portion 251 of the probe pin 250 moves while being pushed in one direction while contacting the terminal of the electronic component.

[0077] The lower slit portion 240 may extend downward from the middle end of the lower side of the main body 220, and the height of the lower slit portion 240 may be adjusted so that the lower contact portion 253 of the probe pin 250 can contact the terminal of the substrate. Preferably, the lower slit portion 240 may be formed at a height lower than the size of the lower contact portion 253 of the probe pin 250 so that the lower contact portion 253 of the probe pin 250 contacts the terminal of the substrate and can fully form a scribe. Further, the height of the lower slit portion 240 may be adjusted in order to adjust the degree to which the lower contact portion 253 of the probe pin 250 moves in one direction while contacting the terminal of the substrate.

[0078] Corresponding to the probe pins 250 arranged in two rows, the upper slit portion 230 may include upper slits 237 on both left and right sides for inserting and supporting a portion of the upper contact portion 251 of the probe pins 250. In addition, corresponding to the probe pins 250 arranged in two rows, the lower slit portion 240 may include lower slits 247 on both left and right sides for inserting and supporting a portion of the lower contact portion 253 of the probe pins 250.

[0079] Also, a middle slit 227 may be provided across the upper region 221 , the support region 222 , and the lower region 223 of the body portion 220 .

[0080] The upper slit 237, the middle slit 227, and the lower slit 247 may be formed as a space with one side open and connected to each other. The probe pin 250 may be inserted in the thickness direction and installed on the upper slit 237, the middle slit 227, and the lower slit 247 provided on the guide block 210. That is, in the slit of the guide block 210, the probe pin 250 may be inserted in the thickness direction and installed in a form in which the surface in the width direction is exposed.

[0081] The upper slit 237 and the lower slit 247 may be formed by a slit space having a width corresponding to the width dimension of the probe pin 250 and a depth corresponding to the thickness dimension of the probe pin 250. As an example, the insertion space may be formed by a width longer than the width dimension of the probe pin 250 corresponding to a set dimension and a depth longer than the thickness dimension of the probe pin 250 corresponding to a set dimension.

[0082] For example, the middle to lower end of the upper contact portion 251 of the probe pin 250 can be inserted into the upper slit 237 of the upper slit portion 230. The upper slit 237 can limit the bending deformation in the width direction of the upper contact portion 251 of the probe pin 250. In addition, the upper slit 237 can limit the bending deformation in the thickness direction of the upper contact portion 251 of the probe pin 250.

[0083] For example, the middle to upper end of the lower contact portion 253 of the probe pin 250 can be inserted into the lower slit 247 of the lower slit portion 240. The lower slit 247 can limit the bending deformation in the width direction of the lower contact portion 253 of the probe pin 250. In addition, the lower slit 247 can limit the bending deformation in the rear direction of the lower contact portion 253 of the probe pin 250 in the thickness direction.

[0084] Meanwhile, the contact force control part 255 of the probe pin 250 can be inserted into the middle slit 227 of the main body 220. The upper bending space 224 and the lower bending space 225 of the main body 220 described above can be arranged inside the middle slit 227. That is, the middle slit 227 arranged in the upper area 221 of the main body 220 can be formed into a concave space in the form of a curve corresponding to the shape of the upper end part 256 of the contact force control part 255 of the probe pin 250 pushed downward and bent and deformed. In addition, the middle slit 227 arranged in the lower area 223 of the main body 220 can be formed into a concave space in the form of a curve corresponding to the shape of the lower end part 258 of the contact force control part 255 of the probe pin 250 pushed upward and bent and deformed.

[0085] Also, the middle slit 227 provided in the support region 222 of the main body 220 may be adjusted in width and depth so that the bent portion 257 of the contact force control portion 255 of the probe pin 250 is inserted and fixed in a forced insertion manner.

[0086] According to the probe device of the present invention, the mutual contact force between the upper contact part and the lower contact part is cut off, so that the upper contact part and the lower contact part of the probe pin can work independently. The operation of the probe device according to the present invention will be described below through embodiments.

[0087] Figures 8 to 13 The operation of an embodiment of a probe device according to the present invention is shown.

[0088] Said Figure 8 and the Fig. 9 The operation is shown for the case where an electronic component is carried on the probe device 100 .

[0089] An electronic component P whose electrical characteristics are to be tested is placed on the floating plate 130 of the probe device 100 , and the floating plate 130 is lowered downward by an external force pressing the electronic component P.

[0090] As the floating plate 130 descends, the upper contact portion 251 of the probe pin 250 may be exposed to the outside through the guide hole 131 of the floating plate 130 while the tip of the upper contact portion 251 contacts the terminal CT of the electronic component P.

[0091] The upper contact portion 251 of the probe pin 250 is pressed by the terminal CT of the electronic component P, and an external force is applied to the upper contact portion 251 of the probe pin 250 , so that the upper contact portion 251 moves downward.

[0092] As the upper contact portion 251 of the probe pin 250 decreases in contact force due to the external force, the upper end portion 256 of the contact force control portion 255 of the probe pin 250 is bent and deformed in the upper bending space 224 provided in the upper region 221 of the main body 220 of the guide block 210. The bending and deformation of the upper end portion 256 of the contact force control portion 255 of the probe pin 250 changes in accordance with the contact force applied to the upper contact portion 251.

[0093] At the same time, the bending portion 257 of the contact force control portion 255 of the probe pin 250 is supported by the support area 222 of the main body 220 of the guide block 210, and the contact force of the upper contact portion 251 can no longer be transmitted downward due to the movement being restricted by the inner wall of the support space 111 of the support block 110. That is, the contact force of the upper contact portion 251 of the probe pin 250 is shown by the bending deformation of the upper end portion 256 of the contact force control portion 255 of the probe pin 250, and the movement of the bending portion 257 of the guide block 210 and the support block 110 is restricted, so that the contact force of the upper contact portion 251 is not transmitted to the lower contact portion 253.

[0094] Further, in the present invention, the scribe line can be adjusted by adjusting the movement amount of the upper contact portion 251 of the terminal CT of the electronic component P. In this regard, refer to the Figure 8 (c) is described below.

[0095] Said Figure 8 (c) shows an enlarged view of the Figure 8 The upper contact portion 251 of the probe pin 250 in (a) is located at position A1 and at the Figure 8 The upper contact portion 251 of the probe pin 250 in (b) is at position B1.

[0096] As the upper contact portion 251 of the probe pin 250 contacts and presses the terminal CT of the electronic component P, a scribe line is generated while pushing and moving at a certain level, thereby further improving the contact reliability between the upper contact portion 251 and the terminal CT.

[0097] Here, the size or position of the guide hole 131 provided in the floating plate 130 is adjusted to control the movement amount of the tip of the upper contact portion 251 of the probe pin 250, so that the scribing amount generated by the upper contact portion 251 contacting the terminal CT of the electronic component P can be adjusted.

[0098] For example, the movable range of the end of the upper contact portion 251 changes in proportion to the hole size of the guide hole 131, so the movement amount L1 of the end of the upper contact portion 251 can be controlled by adjusting the hole size of the guide hole 131, and the contact point can adjust the scribe line (Scribe) generated by the upper contact portion 251 contacting the terminal CT of the electronic component P. In addition, the position of the guide hole 131 is adjusted based on the vertical extension line of the upper contact portion 251 with respect to the probe pin 250, so that the scribe line (Scribe) generated by the upper contact portion 251 contacting the terminal CT of the electronic component P can also be adjusted.

[0099] The contact resistance of the upper contact portion 251 can be more easily controlled by adjusting the scribing amount of the upper contact portion 251 with which the terminal CT of the electronic component P contacts.

[0100] For example, the contact resistance of the upper contact portion 251 is controlled to a desired level so as to meet the required range of the contact resistance of the upper contact portion 251 by controlling the movement amount of the tip of the upper contact portion 251 together with the contact force adjustment for the upper contact portion 251 to adjust the scribing amount.

[0101] Said Fig.10 and the Fig.11 The operation is shown for a case where the probe device 100 is in contact with a substrate.

[0102] The probe device 100 is placed on a substrate driving an electronic component and the lower contact portion 253 of the probe pin 250 contacts the terminal ST of the substrate S. The external force applied by the substrate is transmitted to the lower contact portion 253 of the probe pin 250, so that the lower contact portion 253 of the probe pin 250 can be pressed upward.

[0103] The lower contact portion 253 of the probe pin 250 is pressed by the terminal ST of the substrate S, and an external force is applied to the lower contact portion 253 of the probe pin 250 , so that the lower contact portion 253 moves upward.

[0104] As the lower contact portion 253 of the probe pin 250 rises due to the contact force of the external force, the lower end portion 258 of the contact force control portion 255 of the probe pin 250 is bent and deformed in the lower bending space 225 provided in the lower area 223 of the main body 220 of the guide block 210. The bending deformation of the lower end portion 258 of the contact force control portion 255 of the probe pin 250 changes in accordance with the contact force applied to the lower contact portion 253.

[0105] At the same time, the bending portion 257 of the contact force control portion 255 of the probe pin 250 is supported by the support area 222 of the main body 220 of the guide block 210, and the contact force of the lower contact portion 253 can no longer be transmitted upward due to the movement being restricted by the inner wall of the support space 111 of the support block 110. That is, the contact force of the lower contact portion 253 according to the external force applied to the probe pin 250 is shown by the bending deformation of the lower end portion 258 of the contact force control portion 255 of the probe pin 250, and the movement of the bending portion 257 is restricted by the guide block 210 and the support block 110, so that the contact force of the lower contact portion 253 is not transmitted to the upper contact portion 251.

[0106] Further, in the present invention, the scribe line can be adjusted by adjusting the movement amount of the lower contact portion 253 of the terminal ST of the substrate S. In this regard, refer to the Fig.10 (c) is described below.

[0107] Said Fig.10 (c) shows an enlarged view of the Fig.10 The lower contact portion 253 of the probe pin 250 in (a) is located at position A2 and in the Fig.10 The lower contact portion 253 of the probe pin 250 in (b) is at position B2.

[0108] As the lower contact portion 253 of the probe pin 250 contacts and presses the terminal ST of the substrate S, a scribe line is generated while the probe pin 250 is pushed and moved at a certain level, thereby further improving the contact reliability between the lower contact portion 253 and the terminal ST.

[0109] Here, the size of the lower slit 247 of the lower slit portion 240 of the guide block 210 or the size of the lower bending space 225 of the guide block 210 is adjusted to control the movement amount of the end of the lower contact portion 253 of the probe pin 250, so that the amount of marking generated by the contact between the lower contact portion 253 and the terminal ST of the substrate S can be adjusted.

[0110] For example, the movable range of the end of the lower contact portion 253 can be changed in proportion to the size of the lower slit 247 of the lower slit portion 240, and the movable range of the end of the lower contact portion 253 can be changed in proportion to the degree of insertion of the lower contact portion 253 into the lower curved space 225 of the guide block 210. Therefore, in the present invention, the size of the lower slit 247 or the size of the lower curved space 225 of the guide block 210 is adjusted, so that the movement amount L2 of the end of the lower contact portion 253 can be controlled, and accordingly, the scribe generated by the contact between the lower contact portion 253 and the terminal ST of the substrate S can be adjusted.

[0111] The contact resistance of the lower contact portion 253 can be more easily controlled by adjusting the scribing amount of the lower contact portion 253 with which the terminal ST of the substrate S contacts.

[0112] Thus, in the present invention, the contact force of the upper contact portion 251 and the contact force of the lower contact portion 253 do not affect each other, so that the upper contact portion 251 and the lower contact portion 253 work independently, so that the contact force of the upper contact portion 251 and the contact force of the lower contact portion 253 can be controlled differently. In addition, the movement amount of the end of the upper contact portion 251 and the movement amount of the end of the lower contact portion 253 can be controlled, so that the degree of scribing can be controlled. In the present invention, the contact force and scribing of the upper contact portion 251 and the lower contact portion 253 can be adjusted, so that the contact resistance of each contact can be more easily controlled.

[0113] That is, the contact force and the amount of marking of the upper contact portion 251 can be adjusted while the lower contact portion 253 is in contact with the terminal of the substrate with sufficient contact force and amount of marking, thereby easily controlling the contact resistance based on the contact with the terminal of the electronic component so that the lower contact portion 253 can be electrically connected to the terminal of the substrate with the desired contact resistance.

[0114] In the present invention, in connection with the adjustment of the contact resistance, the Fig.12 To the Fig.14 An example is shown in which the upper contact portion 251 and the lower contact portion 253 of the probe pin 250 are independently operated in the probe device 100 .

[0115] The probe device 100 according to the present invention is placed on the substrate S and the lower contact portion 253 of the probe pin 250 is brought into contact with the terminal ST of the substrate S while gradually applying pressure and adjusting the contact force of the external force according to the magnitude of F1. In addition, while maintaining the contact force of the lower contact portion 253, an electronic component P is carried above the probe device 100 and the upper contact portion 251 of the probe pin 250 is brought into contact with the terminal CT of the electronic component P while gradually applying pressure and adjusting the contact force of the external force according to the magnitude of F2 in various different situations. As described above, the contact force of the contact portion of the probe device 100 is tested by adjusting the contact force of the lower contact portion 253 and the contact force of the upper contact portion 251.

[0116] In the Fig.14 In the probe device 100, T1 is a time interval during which an external force of magnitude F1 is applied to the lower contact portion 253 of the probe pin 250 to make the lower contact portion 253 work, and T2 is a time interval during which external forces of magnitude F2 of different magnitudes are applied to the upper contact portion 251 of the probe pin 250 while maintaining the contact force of the lower contact portion 253 of the probe pin 250 to make the upper contact portion 251 work. Fig.14, Force-B represents the reaction force (Reaction Force) to the lower contact portion 253 of the probe pin 250 , and Force-T represents the reaction force (Reaction Force) to the upper contact portion 251 of the probe pin 250 .

[0117] Said Fig.14 (a) shows the case where F1 and F2 are the same size, the Fig.14 (b) shows the case where F1 is larger than F2. Fig.14 (c) shows the case where F2 is larger than F1.

[0118] The probe device 100 is placed on the substrate S, and the lower contact portion 253 of the probe pin 250 is brought into contact with the terminal ST of the substrate S. The contact force on the lower contact portion 253 of the probe pin 250 increases in the T1 interval when the external force is applied to F1, but the contact force on the lower contact portion 253 of the probe pin 250 is not transmitted to the upper contact portion 251 of the probe pin 250.

[0119] Furthermore, an electronic component is carried above the probe device 100, and the upper contact portion 251 of the probe pin 250 is brought into contact with the terminal CT of the electronic component P, and the contact force on the upper contact portion 251 of the probe pin 250 increases in the T2 interval when the external force is applied to F2, but is not transmitted to the lower contact portion 253 of the probe pin 250, so that the contact force on the lower contact portion 253 of the probe pin 250 remains F1 as it is.

[0120] As stated Fig.14 As shown, according to the probe device 100 of the present invention, when the contact force of the upper contact part 251 is adjusted in various ways, the contact force of the lower contact part 253 remains unchanged and maintains this state. Therefore, the external force applied to the upper contact part 251 can be changed to match the various required situations to adjust the contact force of the upper contact.

[0121] That is, the probe device 100 according to the present invention adopts a structure in which the contact forces between the upper contact part of the probe pin that contacts the terminal of the electronic component and the lower contact part of the probe pin that contacts the terminal of the substrate do not affect each other, thereby adjusting the external force applied to the lower contact part of the probe pin and the external force applied to the upper contact part of the probe pin differently, so that the upper contact part and the lower contact part of the probe pin can work independently.

[0122] Fig.15 Results of testing the contact resistance according to the contact force of each contact point are shown.

[0123] Said Fig.15 (a) shows the contact force for the upper and lower contacts of the probe device according to the present invention, Fig.15(b) shows the application according to the Figure 1 Contact forces of upper and lower contacts of a probe pin device of the prior art.

[0124] Observe the Fig.15 (a), as described above, the probe device of the present invention imparts sufficient contact force to the lower contact and maintains a certain level of contact force, so that even if the contact force of the upper contact is gradually changed, the contact force of the lower contact does not change and remains constant.

[0125] In contrast, Fig.15 (b), after the probe device according to the prior art applies a certain level of contact force to the lower contact, as the contact force is applied to the upper contact, the contact force of the upper contact is transmitted to the lower contact, thereby increasing the contact force of the lower contact. In particular, at the start time of applying the contact force to the upper contact, the contact force of the lower contact is transmitted to the upper contact, so it can be seen that the contact force of the lower contact increases sharply during a certain period of time when the contact force of the upper contact reacts with the upper contact.

[0126] That is, in the present invention, sufficient contact force can be applied to the lower contact before applying contact force to the upper contact, so the contact resistance of each contact can be easily controlled by contact force adjustment. However, in the case of the prior art, the contact force between the upper contact and the lower contact is transmitted to each other, so there is a problem that the contact force of each contact cannot be easily adjusted to a desired level. As a result, the contact resistance according to the contact force of each contact cannot be controlled to a level that matches the conditions.

[0127] Said Fig.15 (c) is shown in the Fig.15 (a) and Fig.15 (b) is a graph showing the result of measuring the overall contact resistance of the probe pins for the upper and lower contacts, with the time point when the contact force starts to be applied to the upper contact being set as time 0.

[0128] In the initial time range when the contact force is applied to the upper contact, in the case of the prior art, the contact force of the lower contact affects the upper contact, so it is shown that the contact force of the upper contact portion increases sharply from the time when the terminal of the electronic component contacts the upper contact portion, but in the case of the present invention, the contact force of the lower contact does not affect the upper contact, so only the external force applied to the upper contact is reflected as the contact force of the upper contact. It can be seen from this that in the initial certain time range, the contact resistance of the prior art is lower than that of the present invention.

[0129] However, as described above, in the case of the prior art, the contact force of each contact point cannot be adjusted individually and therefore the overall contact resistance cannot be controlled. However, in the case of the present invention, the contact force of each contact point can be adjusted individually to control the overall contact resistance to a desired level, so the contact resistance can be further reduced to match the situation or the contact resistance can be maintained at a required level.

[0130] Thus, in the present invention, the upper and lower contact parts of the probe pin work independently and the contact forces do not affect each other, so the probe device can easily and independently design the degree of contact and pressure with the electronic components and substrates to control the contact resistance of the upper and lower contacts.

[0131] Furthermore, in the embodiment of the present invention, it is described that the support block 110 is combined on both sides of the probe pin assembly 200 and the inner wall of the support space 111 of the support block 110 abuts against the probe pin 250 to restrict its movement, but according to the situation, the support block 110 can also be omitted and the movement of the probe pin 250 can be restricted only by the probe pin assembly 200, so that the upper contact part and the lower contact part of the probe pin 250 can work independently. For example, the size of the middle slit 227 provided in the main body 220 of the guide block 210 is adjusted to embed and insert the contact force control part 255 of the probe pin 250 in a forced insertion manner, and the movement of the contact force control part 255 for the probe pin 250 is restricted by the middle slit 227, so that the upper contact part and the lower contact part of the probe pin 250 can work independently.

[0132] The probe device according to the present invention can be modified in various ways. Various modified examples of the probe device according to the present invention will be described below.

[0133] Figures 16 to 18 Another embodiment of the probe pin assembly in the present invention is shown.

[0134] In the probe pin assembly 300 , the probe pin 350 can be deformed in various ways, and accordingly the guide block 310 can also be deformed.

[0135] In this embodiment, the probe pin 350 is bent in the width direction, and the upper end portion 356 of the contact force control portion 355 is bent from the end of the upper contact portion 351 to the width direction, and the lower end portion 358 of the contact force control portion 355 is bent from the end of the lower contact portion 353 to the width direction.

[0136] Furthermore, the bent portion 357 of the contact force control portion 355 is bent in the width direction from each of the upper end portion 356 and the lower end portion 358 of the contact force control portion 355 to connect the upper end portion 356 and the lower end portion 358 .

[0137] Corresponding to the form of the probe pin 350 , the upper slit 337 , the middle slit 327 , and the lower slit 347 provided in the main body 320 , the upper slit portion 330 , and the lower slit portion 340 of the guide block 310 may also be deformed.

[0138] The probe pin 350 may be inserted in the width direction and installed in the guide block 310. To this end, the upper slit 337 of the upper slit portion 330 and the lower slit 347 of the lower slit portion 340 may be formed by a slit space having a width corresponding to the thickness dimension of the probe pin 350 and a depth corresponding to the width dimension of the probe pin 350.

[0139] In addition, the contact force control portion 355 of the probe pin 350 is inserted into the middle slit 327 of the main body 320, but an upper bending space 324 and a lower bending space 325 can be formed as corresponding recessed spaces at the middle slit 327 portion arranged in the upper area 321 of the main body 320 and the middle slit 327 portion arranged in the lower area 323 of the main body 320 so that the probe pin 350 can be bent and deformed in the width direction.

[0140] At the same time, the middle slit 327 portion of the supporting area 322 arranged in the main body 320 can be formed by a space having a width corresponding to the thickness dimension of the probe pin 350 and a depth corresponding to the width dimension of the probe pin 350 so that the bending portion 357 of the contact force control portion 355 of the probe pin 350 can be inserted and fixed in a forced insertion manner.

[0141] As described in the above-described embodiment and in the present embodiment, in the probe pin assembly of the present invention, the probe pins may be arranged and installed in the width direction, or the probe pins may be arranged and installed in the length direction.

[0142] Fig.19 as well as Fig. 20 Still another embodiment of the probe pin assembly in the present invention is shown.

[0143] The guide block 410 of the probe pin assembly 400 may be modified in various ways. This embodiment is an example in which a slit into which the probe pin 450 is inserted and installed is selectively formed in the guide block 410 .

[0144] The guide block 410 seating the probe pin 450 may include a body portion 420 , an upper slit portion 430 , a lower slit portion 440 , and the like.

[0145] The upper slit portion 430 may be provided with an upper slit 437 into which a portion of the upper contact portion of the probe pin 450 is inserted and supported, and the lower slit portion 440 may be provided with a lower slit 447 into which a portion of the lower contact portion of the probe pin 450 is inserted and supported.

[0146] However, the main body 420 may not be provided with a slit into which the probe pin 450 is inserted.

[0147] The upper region 421 of the main body 420 may provide an upper bending space 424 to allow the upper end portion 456 of the contact force control portion of the probe pin 450 to be deformed. For example, the upper bending space 424 may be formed in the entire region where the upper end portion 456 of the contact force control portion 455 of the probe pin 450 is arranged in the upper region 421 of the main body 420. Preferably, the upper bending space 424 may be provided in the upper region 421 of the main body 420 in a form in which the depth thereof gradually decreases as it moves from the upper slit portion 430 toward the support region 427.

[0148] In addition, a lower bending space 425 may be provided in the lower region 423 of the main body 420 so that the lower end portion 458 of the contact force control portion of the probe pin 450 can be deformed. For example, the lower bending space 425 may be formed in the entire area where the lower end portion 458 of the contact force control portion of the probe pin 450 is arranged in the lower region 423 of the main body 420. Preferably, the lower bending space 425 may be provided in the lower region 423 of the main body 420 in a form in which the depth thereof gradually decreases as it moves from the lower slit portion 440 toward the support region 427.

[0149] At the same time, the support area 422 of the main body 420 may not be provided with a separate slit, and the contact force control part of the probe pin 450 may be inserted and embedded on the support area 422 surface of the main body 420 by being formed with a thickness corresponding to the bending portion of the contact force control part of the probe pin 450 .

[0150] Furthermore, in response to the high-speed signal transmission of large-capacity data, the number of terminals of electronic components is increased, and the size of the electronic components is formed to be more compact and ultra-thin. For efficient terminal configuration, the terminals of the electronic components are installed in multiple columns. However, due to the narrow pitch and small size of the electronic components, it is not easy to set the terminals on the substrate corresponding to the terminals of the electronic components due to space limitations and wiring configuration structure limitations. In order to solve such problems, a space transformer has been disclosed.

[0151] Space Transformer is a technology that converts the distance between narrow terminals into wide ones and connects them.

[0152] The present invention discloses a technology for achieving a space transformer, and in connection therewith, Fig.21 as well as Fig. 22 An embodiment of a probe pin assembly according to the present invention is shown.

[0153] In this embodiment, the probe pin assembly 500 is as described above. Figure 5The embodiment of the present invention is an example of applying the structure of a space transformer, but is not limited to this. Another embodiment described above can also apply the structure of a space transformer.

[0154] Corresponding to the probe pins 550 arranged in two rows, upper slits 537a and 537b are respectively provided on the left and right sides of the upper slit portion 530 of the guide block 510, and a first spacing distance UD can be formed between the upper slits 537a and 537b on the left and right sides. In addition, lower slits 547a and 547b are respectively provided on the left and right sides of the lower slit portion 540 of the guide block 510, and a second spacing distance DD can be formed between the lower slits 547a and 547b on the left and right sides. As an example, the first upper slit 537a and the second upper slit 537b can be formed as a first spacing distance UD so as to have a spacing distance corresponding to the spacing between the terminal rows of the electronic component having two rows of terminals. In addition, the first lower slit 547a and the second lower slit 547b can be formed as a second spacing distance DD so as to have a spacing distance corresponding to the spacing between the terminal rows of the substrate. Here, the first spacing distance UD between the upper slits 537a and 537b corresponds to the narrow distance between the terminal rows of the electronic component and can be a relatively narrow distance, and the second spacing distance DD between the lower slits 547a and 547b can be separated by a sufficiently wide distance so that the substrate can be easily designed and manufactured.

[0155] The two rows of probe pins 550 are disposed opposite to each other on the guide block 510 so that the upper contact portion spacing distance and the lower contact portion spacing distance between the rows of probe pins 550 can be adjusted differently from each other.

[0156] The upper contact portion 551a of the first row of probe pins may be inserted into the first upper slit 537a of the upper slit portion 530, and the upper contact portion 551b of the second row of probe pins may be inserted into the second upper slit 537b. The upper contact portions 551a and 551b of the probe pins placed in the first upper slit 537a and the second upper slit 537b of the upper slit portion 530 may be spaced apart by a first spacing distance UD.

[0157] Alternatively, the lower contact portion 553a of the first row of probe pins may be inserted into the first lower slit 547a of the lower slit portion 540, and the lower contact portion 553b of the second row of probe pins may be inserted into the second lower slit 547b. The lower contact portions 553a and 553b of the probe pins placed in the first lower slit 547a and the second lower slit 547b of the lower slit portion 540 may be spaced apart by a second spacing distance DD.

[0158] In this way, the probe pin assembly 500 according to the present invention can expand the upper contact corresponding to the narrow interval between the terminal rows of the electronic component to the wide interval between the terminal rows of the substrate to realize the lower contact, thereby achieving a space transformer.

[0159] The probe device according to the embodiment of the present invention described above has been described as having a structure corresponding to an electronic component having terminals arranged in two rows on the left and right sides. However, the probe device according to the present invention can be variously modified according to the form of the electronic component and the terminal arrangement.

[0160] As an example, Fig.23 Still another embodiment is shown for a probe pin assembly according to the present invention.

[0161] The present embodiment shows a probe pin assembly applied to a probe device for testing an electronic component provided with terminals in four directions, front, back, left, and right.

[0162] It can be that the guide block 610 is separated from the upper front, rear, left, and right outer peripheries of the main body 620 by a certain distance and protrudes above the center and is provided with an upper slit portion 630, and the front, rear, left, and right outer peripheries of the main body 620 are separated from the rear front, rear, left, and right outer peripheries by a certain distance and protrude below the center and is provided with a lower slit portion 640.

[0163] Furthermore, slits for mounting the probe pins 650 in four directions, namely, front, rear, left, and right, may be provided in the guide block 610 , and the probe pins 650 may be mounted on the slits provided in each direction.

[0164] Such Fig.23 The embodiment of the present invention can be applied to various embodiments described above and modified. For example, the embodiment of 19 can also be applied to selectively form slits, or the embodiment of Fig.21 An embodiment of the present invention realizes a spatial transformer.

[0165] According to the present invention, each contact point of the probe pin can be operated independently by using a structure in which the contact force generated when the probe pin contacts the electronic component and the contact force generated when the probe pin contacts the substrate do not affect each other.

[0166] In particular, the upper and lower contact parts of the probe pins work independently and the contact forces do not affect each other, so the probe device can easily and independently adjust the degree of pressure applied to the electronic component and the substrate. The contact resistance can be easily controlled by the independent operation of each contact.

[0167] The above description is merely an illustrative description of the technical concept of the present invention, and a person with common knowledge in the technical field to which the present invention belongs can make various modifications and deformations within the scope of the essential characteristics of the present invention. Therefore, the embodiments recorded in the present invention are to illustrate the technical concept of the present invention, rather than to limit the technical concept of the present invention, and the technical concept of the present invention is not limited to such embodiments. The protection scope of the present invention should be interpreted according to the attached claims, and all technical concepts within the scope equivalent to them should be interpreted as included in the scope of rights of the present invention.

Claims

1. A probe device, characterized in that: include: A probe pin, comprising an upper contact portion, a lower contact portion, and a contact force control portion connecting the upper contact portion and the lower contact portion; as well as A guide block is provided to receive and support the probe pin, and supports the contact force control part while providing a bending space capable of deformation for the upper end and the lower end of the contact force control part, The guide block cuts off the transmission of contact force between the upper contact portion and the lower contact portion of the probe pin so that the upper contact portion and the lower contact portion of the probe pin work independently, thereby controlling the contact resistance of the upper contact portion and the lower contact portion.

2. The probe device according to claim 1, characterized in that One end of the upper contact portion contacts a terminal of an electronic component. One end of the lower contact portion contacts the terminal of the substrate. The contact force control portion includes a bent portion between the upper end portion and the lower end portion, the upper end portion is bent and connected to the other side of the upper contact portion to impart elastic force to the bent portion, and the lower end portion is bent and connected to the other side of the lower contact portion to impart elastic force to the bent portion. The guide block includes a main body, which includes: an upper area, which provides an upper bending space so that the upper end portion of the contact force control portion can be deformed; a lower area, which provides a lower bending space so that the lower end portion of the contact force control portion can be deformed; and a supporting area, which is embedded in and fixes the bending portion of the contact force control portion.

3. The probe device according to claim 1, characterized in that: The probe device also includes: The support block is inserted into a part of the side surface of the guide block supporting the contact force control part of the probe pin, and abuts against at least a part of the outer surface of the contact force control part to restrict the movement.

4. The probe device according to claim 2, characterized in that: The guide block comprises: an upper slit portion extending upward from the main body portion and having an upper slit having an insertion space into which a portion of the upper contact portion of the probe pin is inserted to support a portion of the upper contact portion of the probe pin; and The lower slit portion extends downwardly from the main body portion and includes a lower slit having an insertion space into which a part of the lower contact portion of the probe pin is inserted to support the part of the lower contact portion of the probe pin.

5. The probe device according to claim 4, characterized in that: The contact force control portion of the probe pin includes: an upper end portion, bent from the upper contact portion in the thickness direction; a lower end portion, bent from the lower contact portion in the thickness direction; and a bending portion, bent in the thickness direction between the upper end portion and the lower end portion and connected to the upper end portion and the lower end portion, The upper slit of the upper slit portion and the lower slit of the lower slit portion are provided with a slit space which is open on one side and has a width corresponding to the width dimension of the probe pin and a depth corresponding to the thickness dimension of the probe pin.

6. The probe device according to claim 4, characterized in that: The contact force control portion of the probe pin includes: an upper end portion bent from the upper contact portion in the width direction; a lower end portion bent from the lower contact portion in the width direction; and a bending portion bent in the width direction between the upper end portion and the lower end portion and connected to the upper end portion and the lower end portion. The upper slit of the upper slit portion and the lower slit of the lower slit portion are provided with a slit space which is open on one side and has a width corresponding to a thickness dimension of the probe pin and a depth corresponding to a width dimension of the probe pin.

7. The probe device according to claim 4, characterized in that: The guide block includes a middle slit extending from and continuing from the upper slit of the upper slit portion and the lower slit of the lower slit portion in the upper region, the lower region, and the support region, and the upper bending space and the lower bending space are provided inside the middle slit.

8. The probe device according to claim 4, characterized in that: The upper slit portion includes a first upper slit on one side surface, and includes a second upper slit on the other side surface that is spaced apart from and opposite to the first upper slit by a first spacing distance. The lower slit portion includes a first lower slit on one side surface and a second lower slit on the other side surface that is spaced apart from and opposite to the first lower slit by a second spacing distance. A plurality of the probe pins are relatively arranged on two sides of the guide block, The upper contact portions of the probe pins facing each other are spaced apart from each other by the first spacing distance, and the lower contact portions of the probe pins facing each other are spaced apart from each other by the second spacing distance.

9. The probe device according to claim 4, characterized in that: The lower slit portion of the guide block controls the movement amount of the lower contact portion tip of the probe pin generated by contact pressure with the terminal of the substrate by adjusting at least one of the size of the insertion space of the lower slit or the size of the lower bending space of the guide block.

10. The probe device according to claim 1, characterized in that: The probe device also includes: A floating plate is arranged above the probe pin and is provided with a guide hole corresponding to the end of the upper contact portion of the probe pin. The movement amount of the tip of the upper contact portion of the probe pin caused by contact pressure with the terminal of the electronic component is controlled by adjusting either the size or the position of the guide hole.

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